WO2015142063A1 - Led lighting device - Google Patents

Led lighting device Download PDF

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Publication number
WO2015142063A1
WO2015142063A1 PCT/KR2015/002644 KR2015002644W WO2015142063A1 WO 2015142063 A1 WO2015142063 A1 WO 2015142063A1 KR 2015002644 W KR2015002644 W KR 2015002644W WO 2015142063 A1 WO2015142063 A1 WO 2015142063A1
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WO
WIPO (PCT)
Prior art keywords
metal plate
led
led element
led lighting
metal
Prior art date
Application number
PCT/KR2015/002644
Other languages
French (fr)
Korean (ko)
Inventor
김영완
Original Assignee
김영완
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020140192669A external-priority patent/KR20150108734A/en
Application filed by 김영완 filed Critical 김영완
Priority to JP2017500779A priority Critical patent/JP2017510964A/en
Publication of WO2015142063A1 publication Critical patent/WO2015142063A1/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/19Attachment of light sources or lamp holders
    • F21S41/192Details of lamp holders, terminals or connectors
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141Light emitting diodes [LED]
    • F21S41/147Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device
    • F21S41/148Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device the main emission direction of the LED being perpendicular to the optical axis
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141Light emitting diodes [LED]
    • F21S41/151Light emitting diodes [LED] arranged in one or more lines

Definitions

  • the present invention relates to an LED lighting device, and more particularly, to an LED lighting device for lighting using the LED element.
  • the lighting device is widely used as a lighting means such as indoor or outdoor lighting, a traffic light, a warning light.
  • a filament that emits light while being heated to a high temperature is used when a current is supplied, and in recent years, a lighting device using an LED (LED) that consumes less power, has excellent light brightness, and has a long lifespan is attracting attention. I am getting it.
  • LED LED
  • the LED has a low light diffusion property due to the strong straightness of the light, and the side roughness is insufficient in the present situation is insufficient to replace the conventional lighting device using the filament.
  • FIG. 1 and 2 show a conventional luminaire 1 having a bulb-shaped bulb 10 in an automobile, as shown, the conventional luminaire 1 functions like a headlamp or a fog lamp. It has a reflective member 20 optimized for.
  • the reflecting member 20 is a socket whose reflecting surface is coupled to the light emitting portion 11 of the bulb-shaped bulb 10, ie the position of the filament, for example in the luminaire 1, to the motor vehicle shown in FIG. 2. It is generally designed to correspond to the distance l from (12).
  • An object of the present invention is to provide an LED lighting device that can have a similar lighting effect without a separate structural change in the conventional lighting equipment.
  • Another object of the present invention is to provide an LED lighting device that can replace the existing bulb-type bulbs without additional structural changes in the existing lighting assembly, such as headlights, fog lights of automobiles using bulb bulbs.
  • Still another object of the present invention is to provide an LED lighting device that can have a similar lighting effect to a bulb-type bulb in a conventional lighting installation having a reflector etc. optimized for a bulb-type bulb.
  • the present invention has been made to achieve the object of the present invention as described above, the present invention comprises at least one metal plate; At least one LED element provided on the surface of the metal plate, the LED element, discloses an LED lighting device, characterized in that any one of the first electrode and the second electrode is coupled to the metal plate and the metal plate. .
  • the invention also provides a metal plate; At least one LED element installed on the surface of the metal plate, and the LED element, the heat slug only discloses an LED lighting device, characterized in that coupled to the metal plate and the metal plate.
  • the present invention also includes a socket portion 230 for coupling with the structure to be installed LED lighting device;
  • a pair of first metal plates 110-5 having one end coupled to the socket portion 230 and having first LED elements 120a respectively installed on opposite surfaces of the surfaces facing each other; Between the pair of first metal plates 110-5 parallel to the pair of first metal plates 110-5, one end of which is coupled to the socket part 230, and is opposite to each other.
  • a pair of second metal plates 110-6 each having a second LED element 120b disposed on an opposite side thereof; Parallel to the pair of second metal plates 110-6 between the pair of second metal plates 110-6, one end of which is coupled to the socket portion 230, and the second metal At least one third metal plate (110-6) having a bent surface portion (113) bent to be perpendicular to the plate (110-6) and having a third LED element (120c) installed at the bent surface portion (113);
  • an LED lighting apparatus comprising a spacing member 280 to which the other ends of the first to third metal plates are coupled to maintain the spacing between the first to third metal plates.
  • the first to third LED elements 120a, 120b, and 120c may be coupled to each of the first to third metal plates so that only one of the first and second electrodes may be thermally conductive.
  • the first metal plate 110-5 has a cutout portion 310 formed therein so that the second LED element 120b installed on the second metal plate 110-6 positioned inside may be exposed to the outside. Can be.
  • the first LED element 120a and the second LED element 120b may be provided with different distances from the socket part 280.
  • the LED lighting device is installed in a vehicle headlight in place of a light bulb having two filaments so as to enable uplight and downlight by one light bulb, and the first LED element 120a and the second LED element 120b.
  • One of which may be located at the position of the filament corresponding to the high beam, the other may be located at the position of the filament corresponding to the downlight.
  • the first to third metal plates may not be thermally conductive as the remaining electrodes such that only one of the first and second electrodes of each of the first to third LED elements 120a, 120b, and 120c may be thermally conductive.
  • Contact preventing means for preventing the contact may be formed at a position corresponding to the non-contact electrode.
  • the contact preventing means may be a through hole or a cutout formed in each of the first to third metal plates.
  • a power connection line for connection with a terminal of another LED element or a power supply line may be connected through the through hole or cutout.
  • the contact preventing means may be an insulating member formed on each of the first to third metal plates.
  • the socket portion is detachably coupled to the structure and the body made of a non-conductive material;
  • a terminal connection part installed on the main body for electrical connection with a connection terminal installed on the structure; It may include a device power supply for electrically connecting the LED element and the terminal connecting portion.
  • the device power supply part includes a plurality of terminal parts electrically connected to the terminal connection part, a support substrate part coupled to the main body to support the metal plate, and at least one wire connecting the LED element and the terminal part. can do.
  • the LED lighting apparatus has an advantage that the structure is simple and efficient heat dissipation by having a structure that radiates heat generated by the LED element by transferring the metal plate by installing the LED element on at least one metal plate. .
  • the LED lighting device according to the present invention is composed of a pair of metal plates, each LED element is coupled to the outer surface of the opposite surface facing each other to have a light irradiation effect similar to the bulb-type bulb bulb is used
  • the LED lighting device By replacing the bulb-type bulb in the existing lighting device has the advantage that can maximize the utilization of the LED lighting device.
  • the existing lighting system using a bulb-type bulb is characterized in that the reflection shade is provided with a reflection shade is optimized in response to the light emitting portion of the bulb-type bulb, in particular bulb-type bulb, LED lighting apparatus according to the present invention, one or more It is composed by installing LED elements on the metal plate.
  • LED elements By placing the LED element at the position corresponding to the light emitting part of the existing bulb type bulb, it has a light irradiation effect similar to the bulb type bulb, so that the bulb type bulb is used.
  • By replacing the bulb bulb in the lighting device there is an advantage that can maximize the utilization of the LED lighting device.
  • the LED lighting apparatus according to the present invention has the advantages, such as when used in the headlights, fog lights, direction indicators for automobiles.
  • LED lighting device has different lighting characteristics from bulb-type bulbs.
  • LED lighting devices when used as lighting fixtures requiring special lighting effects such as headlights, fog lamps, direction indicator lamps, etc. There is a problem in that the design of the reflector must be changed.
  • the LED lighting device according to the present invention has a light irradiation effect similar to that of a bulb-type bulb by being positioned at a position corresponding to the light emitting portion of the existing bulb-type bulb, and bulb-type bulb in the existing lighting device using a bulb-type bulb By replacing the has the advantage that can maximize the utilization of the LED lighting device.
  • various lighting effects for example, having two filaments with different positions, that is, the position of the light source, can correspond to the position of each light source in the existing lighting device that can simultaneously realize the high and the low light by a bulb bulb.
  • Positioning the LED element has the advantage of maximizing the utilization of the LED lighting device by replacing the bulb-type bulb in the existing lighting device that the bulb-type bulb is used.
  • FIG. 1 is a conceptual view showing a headlamp for a vehicle as a conventional lighting device having a bulb-shaped bulb.
  • FIG. 2 is a side view illustrating an example of a bulb bulb used in the headlight of the automobile of FIG. 1.
  • Figure 3a is a perspective view showing the LED lighting apparatus according to the first embodiment of the present invention.
  • 3B is an exploded view showing a part of the LED lighting apparatus of FIG. 1.
  • FIG. 4A is a side view of the LED lighting device of FIG. 3A.
  • FIG. 4B is a plan view of the LED lighting apparatus of FIG. 3A.
  • FIG. 5 is a cross-sectional view taken along the line VV in FIG. 3A.
  • FIG. 6 is a cross-sectional view in the V-V direction showing a modification of FIG. 5.
  • FIG. 7 is a side view showing an LED lighting apparatus according to a second embodiment of the present invention.
  • FIG. 8 is a plan view of the LED lighting apparatus of FIG.
  • FIG. 9 is a side view showing an LED lighting apparatus according to a third embodiment of the present invention.
  • FIG. 10 is a plan view of the LED lighting apparatus of FIG.
  • FIG. 11 is a perspective view showing an LED lighting apparatus according to a fourth embodiment of the present invention.
  • FIG. 12 is an exploded perspective view showing the LED lighting device of FIG.
  • FIG. 13A is a plan view of the LED lighting apparatus of FIG. 11, and FIG. 13B is a side view of the LED lighting apparatus of FIG. 11.
  • FIG. 14 is a conceptual diagram illustrating an example of an equivalent circuit diagram of the LED lighting apparatus of FIG. 11.
  • FIG. 15 is a conceptual diagram illustrating an example in which the LED lighting device of FIG. 11 is installed in a conventional lighting device in which a bulb-type bulb is installed.
  • FIG. 16 is a perspective view illustrating an LED lighting apparatus according to a fifth embodiment of the present invention, in which a light blocking unit is additionally installed in the configuration of the fourth embodiment.
  • FIG. 17A is a plan view of the LED lighting apparatus of FIG. 16, and FIG. 17B is a side view of the LED lighting apparatus of FIG. 16.
  • FIG. 18 is a perspective view showing an LED lighting apparatus according to a sixth embodiment of the present invention.
  • 19 is a plan view of the LED lighting apparatus of FIG.
  • FIG. 20 is an exploded view of the LED lighting device of FIG. 18.
  • FIG. 21A is a plan view illustrating a first metal plate and a covering metal plate of the LED lighting apparatus of FIG. 18.
  • FIG. 21A is a plan view illustrating a first metal plate and a covering metal plate of the LED lighting apparatus of FIG. 18.
  • FIG. 21B is a plan view illustrating a second metal plate and a covering metal plate of the LED lighting apparatus of FIG. 18.
  • FIG. 21B is a plan view illustrating a second metal plate and a covering metal plate of the LED lighting apparatus of FIG. 18.
  • FIG. 21C is a plan view of an intermediate metal plate of the LED lighting apparatus of FIG. 18.
  • FIG. 21C is a plan view of an intermediate metal plate of the LED lighting apparatus of FIG. 18.
  • FIG. 22 is a perspective view showing the LED lighting apparatus according to the seventh embodiment of the present invention.
  • FIG. 23 is a plan view of the LED lighting apparatus of FIG.
  • FIG. 24 is an exploded view of the LED lighting device of FIG. 22.
  • FIG. 25A is a plan view illustrating a first metal plate and a heat radiation metal plate of the LED lighting apparatus of FIG. 22.
  • FIG. 25B is a plan view illustrating a second metal plate and a heat radiation metal plate of the LED lighting apparatus of FIG. 22.
  • FIG. 25C is a plan view of an intermediate metal plate of the LED lighting apparatus of FIG. 22.
  • 26 is a perspective view showing the LED lighting apparatus according to the eighth embodiment of the present invention.
  • FIG. 27 is a perspective view of the LED lighting device of FIG. 26, seen from another direction.
  • FIG. 27 is a perspective view of the LED lighting device of FIG. 26, seen from another direction.
  • FIG. 28 is an exploded perspective view of the LED lighting device of FIG. 26.
  • 27A to 27B are side views showing the first metal plate, the second metal plate and the intermediate metal plate of the LED lighting apparatus of FIG. 26, respectively.
  • FIG. 30 is a side view of the LED lighting device of FIG. 26.
  • FIG. 31 is a plan view of the LED lighting apparatus of FIG.
  • FIG 33 is a plan view showing a modification of the LED lighting apparatus according to the eighth embodiment of the present invention.
  • FIG. 34 is a front view of the LED lighting device of FIG.
  • 35 is a plan view illustrating a substrate of the LED lighting apparatus of FIG. 33.
  • 36A to 36D are plan views illustrating a part of a manufacturing method of the LED lighting apparatus according to the present invention.
  • FIG. 37 is a sectional view showing the LED lighting apparatus according to the ninth embodiment of the present invention.
  • FIG. 38 is a perspective view showing the structure of a metal member in the LED lighting device of FIG.
  • FIG. 39 is a plan view illustrating a metal plate for manufacturing the metal member of FIG. 38.
  • FIG. 40 is a cross-sectional view in the A-A direction of the metal member of FIG. 2.
  • 41 is a perspective view of the LED lighting apparatus according to the tenth embodiment of the present invention.
  • FIG. 42 is a plan view illustrating a metal plate for manufacturing the metal member of FIG. 41.
  • FIG 43 is a bottom view showing the LED lighting apparatus according to the eleventh embodiment of the present invention.
  • FIG. 44 is a cross-sectional view taken along the B-B direction in FIG. 43.
  • 45 is a bottom view showing the LED lighting apparatus according to the twelfth embodiment of the present invention.
  • FIG. 46 is a cross-sectional view taken along the C-C direction in FIG. 44.
  • LED lighting device as shown in Figure 3a to Figure 46, one or more metal plate 110; It includes at least one LED element 120 installed on the surface of the metal plate (110).
  • the metal plate 110 has a plate shape so that the LED element 120 can be installed and supported, and any material as long as it has a high thermal conductivity such as aluminum, aluminum alloy, copper, copper alloy, and SUS to facilitate heat dissipation. It is possible.
  • the metal plate 110 is more preferably copper or a copper alloy in consideration of workability, thermal conductivity, and conductivity.
  • the thickness of the metal plate 110 is preferably minimized if possible without structural rigidity and manufacturing limitations.
  • the thickness of the metal plate 110 is preferably 0.01 mm to 0.5 mm, more preferably 0.1 mm to 0.4 mm.
  • the thickness of the metal plate 110 is not limited to the above numerical value, of course, may have a variety of thickness depending on the design needs.
  • the metal plate 110 may be coated with a material having a high reflectance such as silver in order to increase a reflection effect of light irradiated from the LED device 120 on the surface thereof.
  • the metal plate 110 may be coated with an insulating material to impart insulating properties to at least a portion of its surface.
  • the metal plate 110 nickel may be plated on the surface.
  • the heat dissipation of the heat of the metal plate 110 by nickel plating may be prevented and may be used without nickel plating.
  • the metal plate 110 is preferably coated in black with a material such as black epoxy paint to maximize the heat dissipation effect.
  • a part of the LED element 120 may not be coated for bonding, soldering, or the like.
  • the metal plate 110 may be attached or printed with a wire for power connection to the LED device 120.
  • the metal plate 110, a circuit may be formed in a pattern.
  • the metal plate 110 may be coupled to a board, such as FPCB on which the LED element 120 may be installed.
  • the metal plate 110 may be printed with a synthetic resin material for preventing the solder from escaping to a region other than the solder region for the manufacturing process, that is, for bonding with the LED element 120.
  • the metal plate 110 may have various shapes in consideration of the heat radiating effect of the LED device 120 and the light irradiation effect of the LED device 120.
  • the metal plate 110 may have a flat plate shape and may have, for example, a planar shape similar to a bulb.
  • the metal plate 110 as shown in Figures 7 to 10, the mounting surface portion 112 is installed with the LED element 120, the bending surface portion 113 is bent and extended with the mounting surface portion 112 It may be composed of a bending metal plate (110-1) comprising.
  • the bent metal plate 110-1 includes a plurality of metal plates 110 and bent surface portions 113 coupled to the supporting structure such as the socket portion 230 to maximize the light irradiation effect of the LED device 120. And characterized in that it comprises an installation surface portion 112 formed integrally with.
  • the mounting surface portion 112 is a portion for determining the light irradiation direction of the LED element 120 is formed so that the normal line of the surface on which the LED element 120 is installed is parallel to the light irradiation direction of the LED element 120.
  • the bent surface portion 113 is formed integrally with the installation surface portion 112 to support the structure such as the socket portion 230 in parallel (most preferably), vertically, and inclined with the adjacent metal plate 110.
  • Various configurations are possible as the combined configuration.
  • the metal plate 110 is preferably composed of a plurality, when a plurality of the plurality of metal plates 110, at least a portion of the surface on which the LED element 120 is installed is parallel or perpendicular to each other Or, it may be installed to make an inclination.
  • heat is transmitted in the presence of an insulation layer for insulation between the printed circuit board and the metal layer (aluminum), specifically, an LED element 120, solder, copper wiring, an adhesive layer, an insulation layer, an adhesive layer, and an aluminum metal layer.
  • the LED element 120 is an LED element that emits light by supplying DC power, and includes a white LED element that emits white light, a yellow LED element that emits yellow light, a blue LED element, a red LED element, and a green LED element.
  • Various LED elements such as a tricolor LED chip in which a blue LED element, a red LED element, and a green LED element "are formed as one chip may be used.
  • the LED device 120 a chip containing one LED semiconductor device is preferable.
  • the LED device 120 may include a first electrode 121 and a second electrode 122 which are + and ⁇ terminals.
  • the LED element 120 includes a heat slug 124 for heat dissipation in addition to the first electrode 121 and the second electrode 122, which are + and ⁇ terminals. It may further comprise.
  • the heat slug 124 is configured to dissipate heat generated from the LED element and may be integrally formed with the first electrode 121 and the second electrode 122 according to the structure thereof.
  • FIG. 5 is a structure for illustrating the first electrode 121, the second electrode 122, and the heat slug 124 in the LED device 120, which may be different from the structure of the actual LED device. Of course.
  • the LED device 120 is coupled to the metal plate 110 such that only one of the first electrode 121 and the second electrode 122 can be thermally conductive with the metal plate 110 when the metal plate 110 is coupled with the metal plate 110. Can be.
  • the LED element 120 further includes a heat slug 124
  • only the heat slug 124 may be coupled to the metal plate 110 to allow thermal conductivity with the metal plate 110.
  • the LED device 120 may be directly coupled to the metal plate 110 as shown in FIGS. 3A to 5.
  • the metal plate 110 only one of the first electrode 121 and the second electrode 122 of the LED element 120 needs to be energized with the metal plate 110.
  • the electrode that is not energized with the metal plate 110 is made of metal.
  • the plate 110 is installed to be electrically insulated.
  • the metal plate 110 corresponds to a non-contact electrode in which the other electrode is not thermally conductive so that only one of the first electrode 121 and the second electrode 122 of the LED device 120 is capable of thermal conduction.
  • Contact preventing means 111 may be formed to prevent the contact at the position.
  • the contact preventing means 111 may be formed as a through-hole formed in the metal plate 110, or as shown in Figs.
  • the non-contact electrode as shown in Figure 5, the connection portion of the other LED element or the power supply line 250 for the connection with the power supply line, through-holes, or a portion formed in (7 and 9) Through the incision).
  • the power connection line 250 may be utilized to maintain the gap between the metal plates 110 arranged in parallel by being connected to each LED element 110 in the first embodiment to be described later.
  • the distance between the metal plates 110 arranged in parallel may be maintained by the gap maintaining member 280 described later.
  • the LED element 120 installed in the adjacent metal plate 110 when connected to the LED element 120 installed in the adjacent metal plate 110 instead of the power connection line 250, the LED element 120 installed in the adjacent metal plate 110 by a piece of the metal plate 110 of the same material. ) May be electrically connected.
  • the contact preventing means 111 may be composed of an insulating member 111 formed on the metal plate 110.
  • the insulating member may be configured in various ways such as an insulating material coated on the surface of the metal plate 110, an attached insulating tape, and the like for electrical insulation between the LED element 120 and the metal plate 110.
  • the heat slug 124 electrically insulated from the first electrode 121 and the second electrode 122 is coupled to the metal plate 110 to allow thermal conductivity with the metal plate 110.
  • the LED device 120 is installed so that the first electrode 121 and the second electrode 122 are electrically insulated from the metal plate 110.
  • the LED device 120 may be mounted on a printed circuit board (not shown) coupled to the metal plate 110, instead of being directly coupled to the metal plate 110.
  • a printed circuit board similarly to the case in which the LED device 120 is directly coupled to the metal plate 110, any one of the first electrode 121 and the second electrode 122 is thermally conductive with the metal plate 110. It may be coupled to the metal plate 110 to enable.
  • the LED element 120 a reflector may be installed around the periphery to improve the divergence angle and illumination of light.
  • the LED lighting apparatus has a basic structure of a metal plate 110 to which the LED element 120 and the LED element 120 are coupled, and the metal plates 110 are arranged in parallel to each other,
  • the lighting apparatus having various lighting effects may be configured by various arrangement combinations such that some are arranged inclined to each other.
  • a lighting effect such as a bulb-type bulb, in particular bulb type
  • a lighting fixture such as headlights, fog lights and turn signals for automobiles using bulbs.
  • an LED lighting apparatus such as a headlamp, a fog lamp, a turn signal for automobiles.
  • the LED lighting apparatus according to the first embodiment of the present invention, as shown in Figure 3a to 5, and has a basic structure of the metal plate 110 to which the LED element 120 and the LED element 120 is coupled
  • the metal plate 110 may be configured to include a first metal plate and a second metal plate on which one or more of the LED elements 120 are disposed on opposite surfaces of the metal plates 110 disposed in parallel to each other and facing each other.
  • One end of the pair of metal plates 110 may be coupled to a structure in which an LED lighting device is installed, that is, a socket 230 for coupling with a vehicle lighting fixture.
  • the metal plate 110 may be coupled by various methods such as being fixedly coupled to the socket 230 or detachably coupled thereto.
  • the socket portion 230 may be configured in various ways depending on the structure of the LED lighting device is installed, that is, the coupling aspect with the structure to be installed as a configuration for coupling with the automotive lighting fixture.
  • the socket portion 230, the body 231 is detachably coupled to the structure;
  • a terminal connector 240 installed at the body 231 for electrical connection with a connection terminal (not shown) installed in the structure;
  • the device 120 may include an element power supply unit 260 electrically connected to the LED element 120 and the terminal connection unit 240.
  • the main body 231 may be composed of one or more members as a component for stably coupling the LED lighting device to the structure, and various configurations such as an insulating material or a combination of a metal and an insulating material are possible.
  • the terminal connection part 240 is installed in the main body 231 and is configured for electrical connection with a connection terminal (not shown) installed in the structure.
  • a connection terminal not shown
  • the main body 231 It can be configured integrally.
  • the device power supply unit 260 is configured to electrically connect the LED element 120 and the terminal connection unit 240, and according to the connection structure between the terminal connection unit 240 and the LED element 120, a substrate, an electric wire, a conductive member, or the like. Various combinations are possible.
  • the device power supply unit 260 may be coupled to the metal plate 110 to support the metal plate 110 and to be coupled to the terminal connection unit 240. 261, and a connection portion 262 for supplying power to the LED device 120.
  • the metal plate 110 may be electrically connected to any one of the first electrode and the second electrode of the LED device 120.
  • the substrate 261 is supported by the metal plate 110 and coupled with the terminal connection unit 240.
  • Various configurations are possible and an insertion hole into which at least one protrusion 119 of the metal plate 110 is inserted ( 261a) is formed, and a circuit pattern for conducting electricity between the terminal connector 240 and the LED element 120 is formed.
  • the substrate 261 may form part or the entirety of the main body 231 forming the socket part 230.
  • connection portion 262 is a portion for supplying power to the LED element 120, as shown in Figures 4a and 4b, the solder portion, as shown in Figures 7 to 10, various configurations such as wires This is possible.
  • a plurality of terminal units 265 electrically connected to the terminal connection unit 240 are formed and coupled to the main body 231.
  • the substrate 261 supporting the metal plate 110 may include one or more wires 263 connecting the LED element 120 and the terminal unit 265 to each other.
  • the electric wire 263 may be any electric conductive member such as a copper wire or an iron wire, in addition to a used electric wire in which copper wires are installed in a synthetic resin.
  • the wire 263 is more preferably copper, copper alloy material for heat dissipation in itself, and more preferably formed without coating of an insulating material on the outer surface.
  • a gap maintaining member 280 may be additionally installed to maintain the gap between the gaps 110.
  • the gap maintaining member 280 is a configuration for maintaining a stable gap between the pair of metal plates 110, the through hole 281 into which the metal plate 110 can be inserted as an insulating member, such as a synthetic resin, PCB.
  • the formed metal plate 110 may be inserted and fixedly coupled to the pair of metal plates 110.
  • the pair of metal plates 110 if coated with a material such as epoxy paint is electrically insulated bar may be installed to be interviewed with each other.
  • the arrangement and position of the LED element 120 may vary depending on the characteristics of the bulb-shaped bulb of the luminaire to be replaced.
  • the LED lighting apparatus is installed in any one of the headlight, fog light, direction indicator and tail light of the vehicle is installed bulb-shaped bulb, the LED element 120 is shown in Figure 4a As shown, when the bulb-type bulb is installed in the vehicle can be coupled to the metal plate 110 to be located at a position corresponding to the position of the light emitting portion, that is, the filament of the bulb-type bulb.
  • the LED element 120 in order to correspond to the distance l from the socket portion 12 to the light emitting portion 11 in the bulb bulb, the LED element 120, the distance (l) from the socket portion 230 in the metal plate 110 It can be installed to have.
  • the LED lighting device when installed in any one of the headlight, fog light, direction indicator light and taillight of the vehicle in which the bulb-type bulb is installed, according to the light emitting structure, the light emission characteristics of the lighting fixture to be installed It is necessary to increase the light emission characteristics or to increase the light emission characteristics in the front direction.
  • the mounting surface portion 112 is provided with the LED element 120 ) And one or more bent metal plates 110-1 including the bent surface portion 113 that is bent and extended with the installation surface portion 112.
  • the installation surface portion 112 may include one or more first bent metal plate perpendicular to the longitudinal direction, that is, the light emitting surface of the LED element 120 toward the side.
  • the light emitting surface of the LED device 120 may include one or more second bent metal plates facing forward.
  • the equivalent circuits may be configured with various equivalent circuits such as a series, parallel, series-parallel combination based on each LED element 120.
  • the metal plate 110 may be energized with a portion of an equivalent circuit, that is, any one of the first electrode and the second electrode of the LED element 120.
  • the LED lighting apparatus it is possible to implement a variety of lighting effects by providing a plurality of metal plates installed with LED elements and by changing the relative position of the LED elements installed on each metal plate.
  • the LED lighting apparatus according to the fourth embodiment will be described with reference to FIGS. 11 to 15.
  • the LED lighting apparatus according to the fourth embodiment is different in some configurations such as the arrangement of the metal plate, and the same or similar components as those in the first to third embodiments described above will be omitted for convenience.
  • the socket portion 230 for coupling with the structure to be installed LED lighting device;
  • a pair of first metal plates 110-5 one end of which is coupled to the socket part 230 and each of which has a first LED element 120a disposed on opposite surfaces of the surfaces facing each other;
  • a pair of second metal plates 110-6 each having a second LED element 120b installed thereon; In parallel with the pair of second metal plates 110-6 between the pair of second metal plates 110-6, one end thereof is coupled to the socket part 230, and the second metal plate 110-6 is parallel to the pair of second metal plates 110-6.
  • At least one third metal plate 110-6 having a bent surface portion 113 bent to be perpendicular to 6) and having a third LED element 120c installed at the bent surface portion 113;
  • a spacing member 280 to which the other ends of the first to third metal plates are coupled to maintain the spacing between the first to third metal plates.
  • the first LED element 120a and the second LED element 120b are preferably provided with different distances from the socket 280 so as to be positioned at positions corresponding to the two light sources.
  • first metal plate 110-5 has a cutout portion 310 formed therein so that the second LED element 120b installed on the second metal plate 110-6 positioned therein can be exposed to the outside. Can be.
  • the LED lighting device may be installed in the headlights of the automobile in place of the bulb having two filaments to enable the upper and lower lights by one bulb.
  • any one of the first LED element 120a and the second LED element 120b may be located at the position of the filament corresponding to the uplight, and the other may be located at the position of the filament corresponding to the downlight.
  • the vehicle headlight having a structure that can be up and down by one LED lighting device, includes a reflective member of a suitable structure to enable the down and up lights by one LED lighting device.
  • the socket part 230 may include a first terminal 237 and a first terminal 237 which connects any one of the first LED element 120a and the second LED element 120b and the third LED element 120c in series or in parallel.
  • a third terminal 239 installed in the socket 230 to connect the second terminal 238 and the other of the first LED element 120a and the second LED element 120b in series may be further installed. Can be.
  • the first LED element (120a) and the first Independent on / off of each of the 2 LED elements 120b is possible.
  • any one of the first LED element 120a and the second LED element 120b, for example, the second LED element 120b and the third LED element 120c corresponds to a downward direction and the first LED element 120a
  • the second LED element 120b for example, the first LED element 120a may correspond to an uplight to enable various lighting effects such that the uplight may be turned on or off according to independent on / off.
  • the reflecting member is divided up and down, and the upper side functions as a reflecting member for the role of the lower light and the lower side as a reflecting member for the role of the high light. Function.
  • the third LED element 120c has a structure in which the generated light is directed upward, and faces the downlight region, but the second LED element 120b is an uplight region when the light functions downward toward the downlight region and the uplight region according to the emission angle of the device. There is a problem that some light is exposed.
  • the LED lighting apparatus as shown in Figure 16 to 17b, the element corresponding to the down light of the first LED element 120a and the second LED element 120b, for example
  • the second LED device 120b may further include a light blocking member 390 for preventing the light from being irradiated to the upper light region.
  • the light blocking member 390 is one of the first LED element 120a and the second LED element 120b that the light corresponding to the downlight, for example, the light of the second LED element 120b is irradiated to the upper light region.
  • Various configurations are possible as the configuration for preventing.
  • the light blocking member 390 is a light of the first LED element 120a and the second LED element 120b corresponding to the downlight, for example, the light of the second LED element 120b is irradiated to the upper light area. It is formed to a size that can prevent it.
  • the light blocking member 390 is preferably installed on the metal plate (110-5) located at the outermost.
  • the light blocking member 390 is installed at the outermost metal plate 110-5, and the outermost metal plate 110-5 is disposed.
  • a portion of the plate-like plate member may be formed at an angle, for example, 90 °, in a structure integrated in the plate member.
  • the surface facing the second LED element 120b is preferably matte, it is preferably painted in black.
  • the first to third LED elements 120a, 120b, 120c, the first electrode and the Only one of the two electrodes may be coupled to each of the first to third metal plates to enable thermal conductivity.
  • the first to third metal plates may have thermal conductivity of only one of the first electrode and the second electrode of each of the first to third LED elements 120a, 120b, and 120c, respectively.
  • the contact preventing means for preventing the contact may be formed at a position corresponding to the non-contact electrode that is not made the heat conduction, the remaining electrode.
  • the contact preventing means may be a through hole or a cutout formed in each of the first to third metal plates.
  • the non-contact electrode may be connected to a terminal of another LED element or a power supply line for connection with a power supply line through the through hole or cutout.
  • the contact preventing means may be an insulating member formed on each of the first to third metal plates.
  • each LED element can not be positioned at the optimum position of the pre-designed reflection shade while the gap between the metal plate on which the LED element is installed is increased.
  • the LED element positioned at the outermost side with respect to the metal plate positioned at the center may not be positioned at an optimal position of the predesigned reflection shade.
  • the metal plate 110 to which the LED element 120 and the LED element 120 is coupled
  • the metal plate 110 includes a first metal plate and a second metal plate disposed in parallel with each other and one or more LED elements 120 are installed on opposite sides of the surfaces facing each other.
  • the LED lighting apparatus according to the sixth embodiment of the present invention, a pair provided at intervals with each of the first metal plate and the second metal plate so that the LED element 120 is exposed from the surface side where the LED element 120 is installed Cover metal plate 910 of the.
  • each of the pair of covered metal plates 910 includes a first metal plate and a second metal plate such that the LED elements 120 are exposed from the surface on which the LED elements 120 are installed.
  • Various configurations are possible as the configuration is installed at intervals.
  • the pair of covered metal plates 910 may be formed with an opening 911 such that the LED device 120 is exposed from the surface on which the LED device 120 is installed.
  • the opening 911 is formed in the cover metal plate 910 so that the LED element 120 is exposed from the surface on which the LED element 120 is installed.
  • the pair of covered metal plates 910 are connected to the front and rear ends of the first metal plate and the second metal plate and are generated in the LED device 120 installed at each of the first metal plate and the second metal plate. Will release heat.
  • an incision line 913 is formed near the boundary between the cover metal plate 910 and the first metal plate, and the boundary between the cover metal plate 910 and the second metal plate to bond the substrate 261.
  • the protrusion 119 may be further formed.
  • the substrate 261 is formed with one or more through holes into which the protrusion 119 may be inserted.
  • the protrusions 119 naturally form when bent at each other at the boundary between the covering metal plate 910 and the first metal plate, and at the boundary between the covering metal plate 910 and the second metal plate.
  • the pair of covered metal plates 910 may have protrusions 914 formed at opposite sides of the first metal plate and the second metal plate to be coupled to the space keeping member 280.
  • each of the first metal plate and the second metal plate may have a protrusion 915 for coupling with the spacer 280.
  • the pair of covered metal plates 910 may be integrated with the first metal plate and the second metal plate to more efficiently discharge heat generated from the LED device 120 to increase light emission characteristics of the LED device. .
  • the insertion opening 972 may be formed.
  • the first metal plate and the second metal plate on which the LED elements 120 are installed face each other, and heat generated from each of the LED elements 120 is transferred to each other, and thus, a heating effect needs to be prevented.
  • an intermediate metal plate 930 installed in parallel with the first metal plate and the second metal plate may be additionally installed between the first metal plate and the second metal plate.
  • the intermediate metal plate 930 is installed between the first metal plate and the second metal plate to block heat transfer from each other, and preferably has the same material as the first metal plate and the second metal plate. .
  • the intermediate metal plate 930 may have a cutout portion 931 in which portions of the intermediate metal plate 930 are cut in correspondence with portions where the LED elements are installed in the first metal plate and the second metal plate.
  • the intermediate metal plate 930 may be formed with one or more protrusions 939 to be inserted and fixed in the through hole formed in the substrate 261.
  • first metal plate and the second metal plate, the covered metal plate 910 and the intermediate metal plate 930 it is to be coated in black with a material such as black epoxy paint to maximize the heat dissipation effect desirable.
  • the LED lighting device having the structure as described above, when the heat dissipation is not smooth, the lighting effect of the LED element 120 is reduced, the fan 940 may be additionally installed to increase the lighting effect.
  • the fan 940 is preferably installed in a direction perpendicular to the plane of the metal plate 110 to generate air flow to cool the LED element 120.
  • the metal plate 110 that is, the first metal plate, the second metal plate, the covered metal plate 910, and the intermediate metal plate 930 may include openings 921, 922, and 923 for installing the fan 940. Can be formed.
  • the openings 921, 922, and 923 are formed for the installation of the fan 940 and may have various shapes such as a hole shape or an opening groove shape.
  • the fan 940 is installed at the front or rear of the LED element 120 in the longitudinal direction connecting the front and rear ends of the metal plate 110, or as shown in Figure 18 to 20, 120 may be installed on the lower side.
  • the LED device 120 is minimized by minimizing a gap between the metal plate 110 having the LED device 120, that is, the first metal plate and the second metal plate. ) Can be positioned at the optimum position of the predesigned reflector.
  • the metal plate 110 to which the LED element 120 and the LED element 120 is coupled includes a first metal plate and a second metal plate disposed in parallel with each other and one or more LED elements 120 are installed on opposite sides of the surfaces facing each other.
  • the LED lighting apparatus according to the seventh embodiment of the present invention is formed integrally with each of the first metal plate and the second metal plate on the side where the LED element 120 is installed and a pair of bent in a 'V' shape.
  • the pair of heat-dissipating metal plate 950 is, as shown in Figure 25a and 25c, is provided with a spaced apart from each of the first metal plate and the second metal plate on the surface side on which the LED element 120 is installed Various configurations are possible.
  • the pair of heat-dissipating metal plate 950 is preferably formed short so as not to interfere with the illumination of the LED element 120 on the side of the LED element 120 is installed.
  • the heat dissipation metal plate 950 is formed integrally with the first metal plate and the second metal plate to which the LED device 120 is coupled, so as to increase the heat dissipation effect, the first metal plate and the second metal plate as necessary.
  • Various modifications are possible, such as being in close contact with or forming a long length.
  • the pair of heat-dissipating metal plate 950 is generated in the LED element 120 installed on each of the first metal plate and the second metal plate by being integrally connected to the front or rear ends of the first metal plate and the second metal plate. Will release heat.
  • an incision line 953 is formed near the boundary between the heat-dissipating metal plate 950 and the first metal plate, and the boundary between the heat-dissipating metal plate 950 and the second metal plate to bond the substrate 261.
  • the protrusion 119 may be further formed.
  • the protrusion 119 is naturally formed when bent to each other at the boundary between the heat dissipation metal plate 950 and the first metal plate, and the boundary between the heat dissipation metal plate 950 and the second metal plate.
  • the protrusion 119 may be inserted into and fixed to the substrate 261 that supports the metal plate 110 and is coupled to the terminal connector 240.
  • cut line 953 and one protrusion 119 may be formed, but as shown in FIGS. 22 to 25C, two cut lines 953 and the protrusion 119 may be more stably supported and fixed to the substrate 261.
  • the pair of heat-dissipating metal plates 950 may be integrally connected with the first metal plate and the second metal plate to more efficiently discharge heat generated from the LED device 120 to increase light emission characteristics of the LED device. .
  • the first metal plate and the second metal plate on which the LED elements 120 are installed face each other, and heat generated from each of the LED elements 120 is transferred to each other, and thus a heating effect needs to be prevented.
  • an intermediate metal plate 930 installed in parallel with the first metal plate and the second metal plate may be additionally installed between the first metal plate and the second metal plate.
  • the intermediate metal plate 930 is installed between the first metal plate and the second metal plate to block heat transfer from each other, and preferably has the same material as the first metal plate and the second metal plate. .
  • the intermediate metal plate 930 may have a cutout portion 931 in which portions of the intermediate metal plate 930 are cut in correspondence with portions where the LED elements are installed in the first metal plate and the second metal plate.
  • the first metal plate and the second metal plate, the heat-dissipating metal plate 950 and the intermediate metal plate 930 are coated in black with a material such as black epoxy paint to maximize the heat dissipation effect. desirable.
  • the LED lighting device having the structure as described above, when the heat dissipation is not smooth, the lighting effect of the LED element 120 is reduced, the fan 940 may be additionally installed to increase the lighting effect.
  • the fan 940 is preferably installed in a direction perpendicular to the plane of the metal plate 110 to generate air flow to cool the LED element 120.
  • the metal plate 110 that is, the first metal plate, the second metal plate, the heat-dissipating metal plate 950, and the intermediate metal plate 930 are openings 921, 922, and 923 for installing the fan 940. Can be formed.
  • the openings 921, 922, and 923 are formed for the installation of the fan 940 and may have various shapes such as a hole shape or an opening groove shape.
  • the fan 940 is installed at the front or rear of the LED element 120 in the longitudinal direction connecting the front and rear ends of the metal plate 110, or as shown in Figs. 22 to 25C, 120 may be installed on the lower side.
  • the seventh embodiment of the present invention shows an example in which two LED elements 120 are installed, the number and location of the installation may be variously set according to the characteristics of the reflection shade used.
  • the electrode which is not coupled to the metal plate 110 among the electrodes of the LED element 120 is an auxiliary member that is separated from the metal plate 110 after the attachment of the LED element 120 in the manufacturing process of the metal plate 110 to be described later
  • the power supply line (not shown) connected to the 960 and the auxiliary member 960 is connected to the terminal connector 240 or the terminal connector 240 through the substrate 261.
  • the LED device 120 is minimized by minimizing a gap between the metal plate 110 on which the LED device 120 is installed, that is, the first metal plate and the second metal plate. ) Can be positioned at the optimum position of the predesigned reflector.
  • the LED lighting apparatus according to the seventh embodiment may be installed in the headlight of the automobile in place of the bulb having two filaments to enable the up and down light by one bulb.
  • the LED lighting apparatus is installed in a vehicle headlight instead of a light bulb having two filaments so as to enable up and down light by one light bulb, and the first LED element 120a and the One of the second LED elements 120b may be positioned at the position of the filament corresponding to the uplight, and the other may be positioned at the position of the filament corresponding to the downlight.
  • each of the first LED plate and the second metal plate is provided with two LED elements of the first LED element 120a and the second LED element 120b.
  • the first LED element 120a and the second LED element 120b are installed in the first metal plate and the second metal plate, respectively, at different distances from the socket part 230 so as to be positioned at positions corresponding to the two light sources. This is preferred.
  • any one of the first LED element 120a and the second LED element 120b may be located at the position of the filament corresponding to the uplight, and the other may be positioned at the position of the filament corresponding to the downlight.
  • the vehicle headlight having a structure that can be up and down by one LED lighting device may include a light blocking member or a reflective member of a suitable structure to enable the down and up lights by one LED lighting device.
  • the LED device 120 and the LED device 120 are combined with the metal plate 110.
  • the metal plate 110 is arranged in parallel with each other, the first metal plate (110-a) and the second metal is provided with at least one LED element 120 on the opposite side of the surface facing each other Plate 110-b.
  • the LED lighting apparatus is formed integrally with each of the first metal plate 110-a and the second metal plate 110-b on the side where the LED element 120 is installed. It includes a pair of heat-radiating metal plates 950 bent in the U 'shape.
  • the first metal plate 110-a and the second metal plate 110-b have a structure similar to that of the metal plates of the first to seventh embodiments described above.
  • the LED element 120 may be provided in one or more on the outer side.
  • Each of the first metal plate 110-a and the second metal plate 110-b includes an LED element 120 to block light to prevent the light emitted from the LED element 120 from being directed downward or upward.
  • the light blocking portions 975 and 976 installed at either one of the upper side and the lower side of) may be combined.
  • the light blocking portions 975 and 976 are installed on either one of the upper and lower portions of the LED element 120 to be blocked to prevent the light emitted from the LED element 120 from being directed downward or upward.
  • Various configurations are possible with the configuration.
  • the light blocking portions 975 and 976 may be integrally formed at the time of forming the first metal plate 110-a and the second metal plate 110-b for the convenience of manufacture thereof. To increase, it can be bent at an appropriate angle such as 90 °.
  • the light blocking portions 975 and 976 may be combined with an adhesive or the like as a separate member instead of being formed integrally with the first metal plate 110-a and the second metal plate 110-b. .
  • the light blocking parts 975 and 976 may not be coated with a black paint or a material having a high reflectance in consideration of a reflection effect in addition to the light blocking effect.
  • the light blocking portions 975 and 976 may be formed with a plurality of through holes to bend easily when integrally formed with the first metal plate 110-a and the second metal plate 110-b. .
  • the light blocking unit 975 is provided only for at least some of the LED devices 120b. 976 may be installed.
  • Light blocking portions 975 and 976 may be provided only for the 120b.
  • the pair of heat-dissipating metal plates 950 may include a first metal plate 110-a and a second metal plate 110-b on a surface where the LED element 120 is installed.
  • a variety of configurations are possible as the components are installed at intervals from each other.
  • the pair of heat-dissipating metal plate 950 is preferably formed short so as not to interfere with the illumination of the LED element 120 on the side of the LED element 120 is installed.
  • the pair of heat-dissipating metal plate 950 is connected to the front end or the rear end of the first metal plate 110-a and the second metal plate 110-b by being integrally connected to the first metal plate 110-a. And heat generated from the LED elements 120 installed on the second metal plates 110-b, respectively.
  • an incision line 953 is formed near the boundary between the heat dissipating metal plate 950 and the first metal plate 110-a and the boundary between the heat dissipating metal plate 950 and the second metal plate 110-b.
  • One or more protrusions 119 may be further formed to be inserted into the substrate 261.
  • the protrusions 119 may be bent at each other at the boundary between the heat dissipating metal plate 950 and the first metal plate 110-a, and at the boundary between the heat dissipating metal plate 950 and the second metal plate 110-b. When it is formed naturally.
  • the protrusion 119 may be inserted into and fixed to the substrate 261 that supports the metal plate 110 and is coupled to the terminal connector 240.
  • the protrusion 119 may be used as a connection terminal connected to the power connection line 250 to supply power to the LED element 120.
  • one or more incision lines 953 and protrusions 119 may be formed.
  • the pair of heat dissipation metal plates 950 are connected to the first metal plate 110-a and the second metal plate 110-b, respectively, so that the heat generated from the LED element 120 may be more efficiently. By emitting the light emitting characteristics of the LED device can be improved.
  • a surface contact portion 958 may be formed in two places to be in surface contact with the substrate 261.
  • the surface contact portion 958 is a portion in which each of the pair of heat-dissipating metal plates 950 is integrally connected to the first metal plate 110-a and the second metal plate 110-b. Surface contact with the first metal plate 110-a and the second metal plate 110-b may be stably coupled to the substrate 261.
  • the surface contact portion 958 may have a screw hole 957 formed therein so that a screw (not shown) may penetrate and be screwed to at least one of the substrate 261 and the socket 260.
  • the first metal plate 110-a and the second metal plate 110-b are installed at a predetermined angle based on at least one of the substrate 261 and the socket 260.
  • the LED element 120 may be positioned in a predesigned position.
  • the pair of heat dissipating metal plates 950 may be installed at intervals from each of the first metal plate 110-a and the second metal plate 110-b, but the ends thereof may be disposed at the first metal plate ( It may be bent or touched close to the surface of the 110-a) and the second metal plate (110-b).
  • the first metal plate 110-a and the second metal plate 110-b provided with the LED elements 120 face each other, so that the heat generated from each of the LED elements 120 is transferred to each other, thereby providing a heating effect. It is necessary to prevent this.
  • an intermediate metal plate installed in parallel with the first metal plate 110-a and the second metal plate 110-b between the first metal plate 110-a and the second metal plate 110-b. 930 may be further installed.
  • the intermediate metal plate 930 is installed between the first metal plate 110-a and the second metal plate 110-b to block the transfer of heat to each other. It is preferable to have the same material as a) and the second metal plate 110-b.
  • the intermediate metal plate 930 corresponds to a portion in which the LED elements 120 are installed in the first metal plate 110-a and the second metal plate 110-b, and a portion thereof is partially cut out 931. Can be formed.
  • the cutout 931 may have the same outline as the outline of at least some of the portions in which the LED elements 120 are installed among the first metal plate 110-a and the second metal plate 110-b. Can be formed.
  • the intermediate metal plate 930 may include an inner surface of the first metal plate 110-a and the second metal plate 110-b so that the LED element 120 may be positioned at an optimal position of the predesigned reflection shade. It is preferable to be in close contact with.
  • the intermediate metal plate 930 may be adhered by an adhesive material having high heat resistance when in close contact with inner surfaces of the first metal plate 110-a and the second metal plate 110-b.
  • the intermediate metal plate 930 is formed in the through hole 261b formed in the substrate 261 in close contact with the inner surfaces of the first metal plate 110-a and the second metal plate 110-b.
  • the protrusion 939 to be inserted is formed.
  • the protruding portion 939 is inserted into the through hole 261b formed in the substrate 261, so that the protrusion 939 is in close contact with the inner surfaces of the first metal plate 110-a and the second metal plate 110-b.
  • the 930 may be stably supported by the substrate 261.
  • the through hole 261b is preferably formed in a slot shape so that the protrusion 939 having a plate shape can be inserted therein.
  • first metal plate 110-a and the second metal plate 110-b, the heat dissipating metal plate 950, and the intermediate metal plate 930 may be formed of a black epoxy paint to maximize heat dissipation effect. It is preferable to coat black with the same material.
  • the effect was found to be much higher.
  • first metal plate 110-a, the second metal plate 110-b, and the intermediate metal plate 930 block light in order to block light toward the front side from the opposite end coupled to the substrate 261.
  • Member 973 may be further coupled.
  • the light blocking member 973 may be used in various ways, such as to block the light of the LED device 120 from being directly irradiated to the front.
  • the substrate 261 is similar in construction to those of the first to seventh embodiments.
  • the substrate 261 may have a structure that may be coupled to the socket 230, and one or more screw holes 261e may be formed to be coupled to the socket 230.
  • the substrate 261 may have a through hole 261b into which the protrusion 939 of the intermediate metal plate 930 is inserted.
  • the substrate 261 may be formed with one or more screw holes 261c that are screwed with screws passing through the screw holes 957 formed in the surface contact portion 958.
  • the substrate 261 may include an insertion hole 261a into which the protrusion 119 described above is inserted.
  • the insertion hole 261a may have any structure as long as the protrusion 119 is inserted into the protrusion 119 formed in the surface contact portion 958.
  • the protrusion 119 may be connected to the power connection line 250 and used as a connection terminal for supplying power to the LED element 120.
  • the protrusion 119 may be inserted into the insertion hole 261a and then fixed and soldered with the power connection line 250.
  • the LED lighting device having the structure as described above, when the heat dissipation is not smooth, the lighting effect of the LED element 120 is reduced, a fan (not shown) may be additionally installed to increase the lighting effect.
  • the fan is preferably installed in a direction perpendicular to the plane of the metal plate 110 to generate air flow to cool the LED element 120.
  • the metal plate 110 that is, the first metal plate 110-a, the second metal plate 110-b, the heat dissipating metal plate 950, and the intermediate metal plate 930 are openings for installing a fan. (Not shown) may be formed.
  • the opening is formed for the installation of the fan and may have various shapes such as a hole shape or an opening groove shape.
  • the fan is installed in the front or rear of the LED element 120 in the longitudinal direction connecting the front and rear ends of the metal plate (110-a, 110-b), or as shown in Figure 26 to 29c, It may be installed on the lower side of the LED element 120.
  • the installation number and position can be variously set according to the characteristics of the reflection shade used.
  • the electrodes that are not coupled to the metal plates 110-a and 110-b of the electrodes of the LED device 120 may be formed in the process of manufacturing the metal plates 110-a and 110-b to be described later.
  • a power supply line (not shown) connected to the auxiliary member 960 and the auxiliary member 960 separated from the metal plates 110-a and 110-b. It may be connected to the terminal connector 240.
  • the auxiliary member 960 as shown in Figs. 26, 27 and 32, is utilized only for the electrical connection of the LED element 120, as described above, the protrusion formed on the surface contact portion 958 ( The power connection line 250 is connected to the 119 may be utilized as a connection terminal for supplying power to the LED element 120.
  • auxiliary member 960 coupled to the first metal plate is electrically connected to the auxiliary member 960 and the solder 938 coupled to the second metal plate, as shown in FIGS. 26 and 27.
  • LED devices 120 installed on the first metal plate and the second metal plate may be connected in series.
  • auxiliary member 960 may be formed with a plurality of through holes 968 to increase the heat dissipation effect.
  • the LED device 120 by minimizing the distance between the metal plate 110, that is, the first metal plate and the second metal plate on which the LED element 120 is installed. ) Can be positioned at the optimum position of the predesigned reflector.
  • the LED lighting apparatus according to the eighth embodiment may be installed in the vehicle headlights in place of the bulb having two filaments to enable the up and down lights by one bulb.
  • the LED lighting apparatus is installed in the vehicle headlamp instead of the bulb having two filaments to enable the uplight and the downlight by one light bulb, the first LED element (120a) and the first One of the two LED elements 120b may be located at the position of the filament corresponding to the uplight, and the other may be located at the position of the filament corresponding to the downlight.
  • two LED elements that is, the first LED element 120a and the second LED element 120b are installed in each of the first metal plate 110-a and the second metal plate 110-b.
  • first LED element 120a and the second LED element 120b may have different distances from the socket 230 so that the first LED element 120a and the second LED element 120b are located at positions corresponding to the two light sources.
  • the two LED elements 120b are provided.
  • any one of the first LED element 120a and the second LED element 120b may be located at the position of the filament corresponding to the uplight, and the other may be positioned at the position of the filament corresponding to the downlight.
  • the vehicle headlight having a structure that can be up and down by one LED lighting device may include a light blocking unit (975, 976) of the appropriate structure to enable the down and up lights by one LED lighting device. have.
  • the light blocking portions 975 and 976 have the configuration as described above, and are installed directly below the LED element 120b to block light to prevent the light emitted from the LED element 120b from being directed downward. Various configurations are possible with the configuration.
  • the light blocking parts 975 and 976 may further include vertical extension parts 975a and 976b extending vertically to prevent light from being exposed to the side of the LED device 120b.
  • the vertical extension parts 975a and 976b may be separately installed in a 'b' shape in a configuration extending upward from the light blocking parts 975 and 976 provided directly below the LED element 120b, or may be separately provided with a light blocking part ( 975, 976) and various configurations are possible.
  • the vertical extension parts 975a and 976b extend upward between the first LED element 120a and the second LED element 120b.
  • the light emitting region of the halogen bulb which is the light source together with the structure of the reflector is designed to be formed further downward when viewed from the front of the vehicle.
  • the substrate 261 when viewed from the front of the vehicle in the state of being mounted on the automobile
  • the metal plate 110 coupled to the metal plate 110 that is, the first metal plate 110-a, the second metal plate 110-b, and the intermediate metal plate 930 have a predetermined angle ⁇ in the clockwise direction thereof. It is preferable to be installed to have.
  • the LED device 120 installed on the metal plate 110 when the LED device 120 installed on the metal plate 110 is viewed from the front of the vehicle when the LED device 120 is mounted on the car, the LED device 120 is the metal plate 110, that is, the first metal plate 110-a. ) And the installation angle of the surface of the second metal plate 110-b is preferably installed to have a predetermined angle ⁇ in the clockwise direction than the horizontal line.
  • the metal plate 110 which is coupled to the substrate 261 when viewed from the front of the vehicle in the state of being mounted on the vehicle, the surface of the constant angle ( ⁇ ) in the clockwise direction, preferably 5 ° ⁇ 10 °, 8 It is more preferable that it is °.
  • the substrate 261 includes a metal plate 110 in which a through hole 261b into which the metal plate 110, in particular, the intermediate metal plate 930 is inserted, is coupled to the substrate 261.
  • a metal plate 110 in which a through hole 261b into which the metal plate 110, in particular, the intermediate metal plate 930 is inserted, is coupled to the substrate 261.
  • the screw holes 261e formed in the substrate 261 and for coupling with the socket 260 are formed in a horizontal direction in pairs.
  • the insertion hole 261a and the screw hole 261c related to the installation state of the metal plate 110 have a metal plate 110 coupled to the substrate 261 similar to the through hole 261b. It is preferably formed as a slot rotated in a clockwise direction at an angle ⁇ , preferably 5 ° to 10 °, more preferably 8 °.
  • the metal plate used in the LED lighting apparatus according to the first to eighth embodiments of the present invention may be manufactured by the following method.
  • a metal sheet 0 made of copper or copper alloy is prepared.
  • an anti-etching film is formed on the metal sheet 0 to form a plurality of metal plates or a plurality of metal plates 110, 910, and 930.
  • the anti-etching film prevents the metal plates 110, 910, and 930 from being completely separated by etching in a subsequent etching process by forming the plurality of bridges 961.
  • the metal plates 110, 910, 930 can be separated separately during subsequent processing.
  • a portion of the electrode of the LED element 120 coupled to the metal plates 110, 910, and 930 corresponds to a portion corresponding to the non-contact electrode not coupled to the metal plate, and corresponds to the auxiliary member 960 separated from the metal plate. It is preferable that the etching prevention film is also coated.
  • the soldering member is attached in the soldering member attaching process described later, and then coupled to the metal plate of the LED elements through the LED element bonding process, that is, energization.
  • Non-contact electrodes can be combined.
  • the auxiliary member 960 is not completely separated by an etching process and is maintained in a state of being connected to the metal plate 110 by at least one bridge 961.
  • connection line 250 is easily connected (see FIGS. 5 and 18).
  • the portions where the anti-etching film is not formed are corroded to form metal plates 110, 910, and 930 to be used.
  • the metal sheet 0 may be coated with silver, nickel, or the like after removal of the protective film.
  • plating with nickel is most preferable.
  • the heat dissipation of the heat of the metal plate 110 by nickel plating may be prevented and may be used without nickel plating.
  • the metal plate 110 is preferably coated in black with a material such as black epoxy paint to maximize the heat dissipation effect.
  • the metal sheet 0 which has undergone the etching process and the plating process may be soldered only to a position where the LED element 120 is to be bonded, that is, a certain region (the region shown in black in FIG. 24).
  • a partition line may be printed which partitions the solder joint area (the area marked in black in FIG. 24) so that it can be printed.
  • the metal sheet (0) through the etching process, plating process, the soldering member is attached to the position where the LED element is coupled so that the LED element 120 can be coupled.
  • the method of attaching the soldering member is a method in which a laser is used as a factory, an opening is formed only at the position where the LED element 120 is to be coupled, and a soldering member mixture in which a soldering member such as solder is mixed with a binder in a powder form through the opening is made of metal. It can be attached on the sheet.
  • the LED device 120 is coupled. At this time, it is preferable that the soldering member is attached and the LED element 120 is coupled in an oven to form a heated environment so that the LED element 120 can be coupled to the metal sheet 0 by melting the soldering member.
  • the LED element 120 is firmly coupled to the metal sheet by cooling.
  • each LED element 120 is assembled using a jig or the like so that it can be located at an appropriate position.
  • edges of the individual metal plates 110, 910, and 930 formed in the metal sheet 0 are formed as holes, cutouts, or the like, particularly at the edges at which the LED elements are coupled.
  • the lighting apparatus may be configured by a plurality of metal plates formed through an etching process on the metal sheet 0 as described above.
  • each metal plate may be configured according to a predesigned structure in a state in which the plurality of metal plates are not separated. By folding the connection portion of the plate there is an advantage that can be manufactured LED lighting device of various shapes.
  • the LED lighting apparatus according to the first to eighth embodiments of the present invention has been described with reference to embodiments used in automobiles, the LED lighting apparatus may be applied to other lighting apparatuses such as incandescent lamps.
  • the LED lighting apparatuses according to the first to eighth embodiments of the present invention may be used for general lighting devices instead of being used for automobiles.
  • the structure in which the LED element is installed on the metal plate as a basic structure can be variously modified as a lighting device.
  • the planar metal plate 610 is bent to form a polyhedral structure each It includes a metal member 600 is provided with at least one LED element 120 on the surface.
  • the polyhedron constituting the metal member 600 may have various shapes such as a rectangular parallelepiped having one surface open as shown in FIG. 37 and a hexahedron having one surface opened as shown in FIG. 42.
  • the metal member 600 is installed on the main body 2 and the planar metal plate 610 is bent to form a polyhedral structure, and one or more LED elements 120 are installed on each surface.
  • the metal plate 610 has a structure similar to that of the first embodiment, but the first electrode 121 and the second electrode 122 of the LED element 120 at a predetermined position in consideration of forming a polyhedron in a bent state.
  • the contact preventing means for preventing the contact may be formed at a position corresponding to the non-contact electrode that is not made of the other electrode, the heat conduction so that only one of the heat conduction.
  • the contact preventing means may be a through hole 611 formed in the metal plate 610, or may be composed of a cutout.
  • the non-contact electrode similar to the configuration as shown in Figure 5, the power connection line 650 for connecting to the terminal of the other LED element or the power supply line may be connected through the through hole.
  • the auxiliary member 960 separated from the metal plate 610 may be used to be connected to the power connection line 650 to form the through hole 611 as the contact preventing means. The connection can be facilitated.
  • a cutout portion 619 is partially formed at the boundary line bent to form a polyhedron.
  • the cutout 619 When the cutout 619 is bent to form a polyhedron, the cutout is maintained as it is to protrude outward, thereby maximizing a heat dissipation effect when the LED device 120 emits light.
  • the metal plate 610 may be further formed with a protrusion 618 inserted into the substrate 651 to fix one end.
  • a converter circuit (not shown) for converting AC into direct current, a stable circuit (not shown) for stabilizing voltage, and the like may be installed.
  • the fan 940 described in the sixth embodiment may also be installed.
  • LED lighting device having the structure as described above has the advantage that can be used to significantly increase its use, such as being used in place of incandescent lamps in the conventional lighting device in which incandescent lamps are used.
  • the LED lighting apparatus according to the ninth and tenth embodiments of the present invention may have various structures and shapes according to the use of the lighting apparatus.
  • the LED lighting apparatus according to the ninth embodiment of the present invention may have a structure similar to the conventional incandescent lamp structure.
  • the LED lighting apparatus may have a structure similar to the conventional fluorescent lamp structure.
  • the LED lighting device 120 has been described as an example including one metal plate 610 installed to face downward, but the LED device 120 is described below.
  • the metal plate 610 installed to face may be installed in pairs.
  • the substrate 651 on which one end of the metal plate 610 is fixed is coupled to the socket 670 for connection with an external power source. ) May be included.
  • the socket portion 670 is configured to be connected to an external power source to supply power to the LED device 120 is possible in a variety of structures according to the power connection structure.
  • the LED lighting apparatus according to the ninth embodiment of the present invention further includes a cover member 652 made of a transparent or translucent material to diffuse the light emitted from the LED element 120 or to protect the metal plate 610. can do.
  • the cover member 652 may have any structure as long as the cover member 652 has a transparent or translucent material to diffuse the light emitted from the LED element 120 or to protect the metal plate 610.
  • cover member 652 a plurality of openings (not shown) may be formed to increase the cooling efficiency.
  • the LED lighting device having the above configuration has the advantage of maximizing the utilization effect of the existing lighting system by having a structure as close as possible to the conventional incandescent light structure.
  • the light emitted in a form similar to incandescent lamps can be maximized by using the optimized reflector when the incandescent lamps are installed, the lighting effect can be maximized when using the same amount of LED elements.
  • the metal plate 610 may be supported and installed in the cover member 652 without bending.
  • the LED lighting apparatus according to the eleventh embodiment and the twelfth embodiment of the present invention, the socket portion 670 for the connection to the external power source, the cover member coupled to the socket portion 670 and the inner space is formed ( 652 and a plurality of metal members 610 supported by the cover member 652 and installed in the inner space.
  • the LED lighting apparatus according to the eleventh and twelfth embodiments of the present invention may have a tubular structure such as a conventional fluorescent lamp structure.
  • the socket portion 670 may be configured in various ways as a configuration for connection with an external power source.
  • the cover member 652 may be configured in a variety of configurations of a transparent or translucent material to diffuse the light emitted from the LED element 120 or to protect the metal plate 610.
  • the cover member 652 may be utilized as a support member of the metal plate 610 while protecting the metal plate 610.
  • the cover member 652 may include an insertion part 353 into which a part of the edge of the metal plate 610 is inserted to support the metal plate 610.
  • the inserting portion 353 may have any structure as long as a portion of the edge of the metal plate 610 is inserted to support the metal plate 610.
  • the cover member 652 may have various structures according to the structure of the LED lighting device, preferably having a tubular structure, and the LED lighting device may have a structure similar to the fluorescent lamp structure.
  • the LED lighting apparatus has been described as an example including a metal plate 610 installed so that the LED element 120 is directed downward as a straight structure, LED element 120 ) May be installed in pairs of metal plates 610 installed to face downward.
  • the socket 670 may be installed at both ends in addition to the straight pipe shape.
  • the cover member 652 may have any structure as long as the cover member 652 has a transparent or translucent material to diffuse the light emitted from the LED element 120 or to protect the metal plate 610.
  • cover member 652 a plurality of openings 654 may be formed to increase the cooling efficiency.
  • the metal plate 610 is similar in configuration except that the metal plate 610 is not bent.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

The present invention relates to an LED lighting device and, more specifically, to an LED lighting device for lighting using an LED element. Disclosed is an LED lighting device comprising: at least one metal plate; and at least one LED element installed on the surface of the metal plate. In the LED element, only one of a first electrode and a second electrode is coupled to the metal plate and the metal plate.

Description

엘이디조명장치LED lighting device
본 발명은 엘이디조명장치에 관한 것으로서, 보다 상세하게는 엘이디소자를 이용하여 조명하는 엘이디조명장치에 관한 것이다.The present invention relates to an LED lighting device, and more particularly, to an LED lighting device for lighting using the LED element.
일반적으로 조명장치는 실내 또는 실외를 조명하거나 교통 신호등, 경고등 등의 알림수단 등으로 널리 사용되고 있다.In general, the lighting device is widely used as a lighting means such as indoor or outdoor lighting, a traffic light, a warning light.
주로 조명장치로서 전류를 공급받으면 고온으로 가열되면서 빛을 발산하는 필라멘트가 이용되고 있으며, 근래에는 소비전력이 적고, 빛의 밝기가 우수하며, 수명이 긴 엘이디(LED)를 이용한 조명장치가 주목을 받고 있다.As a lighting device, a filament that emits light while being heated to a high temperature is used when a current is supplied, and in recent years, a lighting device using an LED (LED) that consumes less power, has excellent light brightness, and has a long lifespan is attracting attention. I am getting it.
그러나, 엘이디는 빛의 직진성이 강하여 빛의 확산 특성이 낮고, 측면 조도가 약하기 때문에 현 실정에서는 기존의 필라멘트를 이용한 조명장치를 대체하기에는 미흡하다.However, the LED has a low light diffusion property due to the strong straightness of the light, and the side roughness is insufficient in the present situation is insufficient to replace the conventional lighting device using the filament.
도 1 및 도 2는, 자동차에 벌브형 전구(10)를 가지는 종래의 조명기구(1)를 도시한 도면으로서, 도시된 바와 같이, 종래의 조명기구(1)는 전조등, 안개등과 같이 기능구현에 최적화된 반사부재(20)를 가진다.1 and 2 show a conventional luminaire 1 having a bulb-shaped bulb 10 in an automobile, as shown, the conventional luminaire 1 functions like a headlamp or a fog lamp. It has a reflective member 20 optimized for.
특히 상기 반사부재(20)는, 그 반사면이 도 2에 도시된 자동차에 벌브형 전구(10)의 발광부분(11), 즉 필라멘트의 위치, 예를 들면 조명기구(1) 내에 결합되는 소켓(12)으로부터의 거리(l)에 대응되어 최적화되어 설계됨이 일반적이다.In particular, the reflecting member 20 is a socket whose reflecting surface is coupled to the light emitting portion 11 of the bulb-shaped bulb 10, ie the position of the filament, for example in the luminaire 1, to the motor vehicle shown in FIG. 2. It is generally designed to correspond to the distance l from (12).
그런데 위와 같은 구조를 가지는 종래의 조명기구(1)에서 엘이디 조명기구로 대체하고자 하는 경우 거의 전방향으로 조사되는 종래의 벌브형 전구(10)와는 달리 일방향으로 진진성을 가지는 엘이디의 광특성으로 인하여 종래의 조명기구(1)에서 반사부재(20)의 재활용이 불가능하며 별도로 설계된 반사부재를 필요로 한다.By the way, unlike the conventional bulb-type bulb 10 that is irradiated in almost all directions when the conventional lighting fixture (1) having the above structure to replace the LED luminaire due to the optical characteristics of the LED having a progressive in one direction In the conventional lighting device 1, the recycling of the reflective member 20 is impossible and requires a separately designed reflective member.
이에 벌브형 전구를 구비한 종래의 조명기구를 엘이디 조명기구로 교체하는 경우 반사부재의 재설계 등 교체비용이 높아 엘이디 조명기구의 활용효과 및 확산의 장애요인으로 작용하는 문제점이 있다.In the case of replacing the conventional lighting fixture having a bulb-type bulb with the LED lighting fixture, there is a problem in that the replacement cost, such as the redesign of the reflective member is high, thereby acting as an obstacle to the utilization effect and diffusion of the LED lighting fixture.
본 발명의 목적은, 종래의 조명설비에서 별도의 구조 변경없이 유사한 조명효과를 가질 수 있는 엘이디조명장치를 제공하는 데 있다.An object of the present invention is to provide an LED lighting device that can have a similar lighting effect without a separate structural change in the conventional lighting equipment.
본 발명의 다른 목적은, 벌브형 전구를 사용하는 자동차의 전조등, 안개등과 같이 기존의 조명조립체에서 별도의 구조 변경없이 기존 벌브형 전구를 대체할 수 있는 엘이디조명장치를 제공하는 데 있다.Another object of the present invention is to provide an LED lighting device that can replace the existing bulb-type bulbs without additional structural changes in the existing lighting assembly, such as headlights, fog lights of automobiles using bulb bulbs.
본 발명의 또 다른 목적은, 벌브형 전구에 최적화된 반사갓 등을 구비한 종래의 조명설비에서 별도의 구조 변경없이 벌브형 전구와 유사한 조명효과를 가질 수 있는 엘이디조명장치를 제공하는 데 있다.Still another object of the present invention is to provide an LED lighting device that can have a similar lighting effect to a bulb-type bulb in a conventional lighting installation having a reflector etc. optimized for a bulb-type bulb.
본 발명의 또 다른 목적은, 벌브형 전구에서 2개 이상의 광원에 의하여 최적화된 반사갓 등을 구비한 종래의 조명설비, 특히 자동차 조명장치에서 벌브형 전구에 의하여 위치되는 광원에 대응되어 엘이디소자들을 위치시킴으로써 별도의 구조 변경없이 벌브형 전구와 유사한 조명효과를 가질 수 있는 엘이디조명장치를 제공하는 데 있다.It is still another object of the present invention to position LED elements corresponding to a light source positioned by a bulb-type bulb in a conventional lighting fixture having a reflector or the like optimized by two or more light sources in a bulb-type bulb. It is to provide an LED lighting device that can have a similar lighting effect to the bulb-type bulb without a separate structural change.
본 발명은 상기와 같은 본 발명의 목적을 달성하기 위하여 창출된 것으로서, 본 발명은 하나 이상의 금속플레이트와; 상기 금속플레이트의 표면에 설치된 하나 이상의 엘이디소자를 포함하며, 상기 엘이디소자는, 제1전극 및 제2전극 중 어느 하나만 상기 금속플레이트와 상기 금속플레이트에 결합된 것을 특징으로 하는 엘이디조명장치를 개시한다.The present invention has been made to achieve the object of the present invention as described above, the present invention comprises at least one metal plate; At least one LED element provided on the surface of the metal plate, the LED element, discloses an LED lighting device, characterized in that any one of the first electrode and the second electrode is coupled to the metal plate and the metal plate. .
본 발명은 또한 금속플레이트와; 상기 금속플레이트의 표면에 설치된 하나 이상의 엘이디소자를 포함하며, 상기 엘이디소자는, 히트슬러그만 상기 금속플레이트와 상기 금속플레이트에 결합된 것을 특징으로 하는 엘이디조명장치를 개시한다.The invention also provides a metal plate; At least one LED element installed on the surface of the metal plate, and the LED element, the heat slug only discloses an LED lighting device, characterized in that coupled to the metal plate and the metal plate.
본 발명은 또한 엘이디조명장치가 설치될 구조물과의 결합을 위한 소켓부(230)와; 일단이 상기 소켓부(230)에 결합되며 서로 대향되는 표면의 반대면에 제1엘이디소자(120a)가 각각 설치된 한 쌍의 제1금속플레이트(110-5)들과; 상기 한 쌍의 제1금속플레이트(110-5)들 사이에서 상기 한 쌍의 제1금속플레이트(110-5)들과 평행을 이루며 일단이 상기 소켓부(230)에 결합되며 서로 대향되는 표면의 반대면에 제2엘이디소자(120b)가 각각 설치된 한 쌍의 제2금속플레이트(110-6)들과; 상기 한 쌍의 제2금속플레이트(110-6)들 사이에서 상기 한 쌍의 제2금속플레이트(110-6)들과 평행을 이루며 일단이 상기 소켓부(230)에 결합되고, 상기 제2금속플레이트(110-6)과 수직을 이루도록 절곡된 절곡면부(113)을 가지며, 상기 절곡면부(113)에 제3엘이디소자(120c)가 설치된 하나 이상의 제3금속플레이트(110-6)와; 상기 제1 내지 제3금속플레이트들 간의 간격을 유지하도록 상기 제1 내지 제3금속플레이트들의 타단들이 결합되는 간격유지부재(280)를 포함하는 것을 특징으로 하는 엘이디조명장치를 개시한다.The present invention also includes a socket portion 230 for coupling with the structure to be installed LED lighting device; A pair of first metal plates 110-5 having one end coupled to the socket portion 230 and having first LED elements 120a respectively installed on opposite surfaces of the surfaces facing each other; Between the pair of first metal plates 110-5 parallel to the pair of first metal plates 110-5, one end of which is coupled to the socket part 230, and is opposite to each other. A pair of second metal plates 110-6 each having a second LED element 120b disposed on an opposite side thereof; Parallel to the pair of second metal plates 110-6 between the pair of second metal plates 110-6, one end of which is coupled to the socket portion 230, and the second metal At least one third metal plate (110-6) having a bent surface portion (113) bent to be perpendicular to the plate (110-6) and having a third LED element (120c) installed at the bent surface portion (113); Disclosed is an LED lighting apparatus comprising a spacing member 280 to which the other ends of the first to third metal plates are coupled to maintain the spacing between the first to third metal plates.
상기 제1 내지 제3엘이디소자(120a, 120b, 120c)는, 제1전극 및 제2전극 중 어느 하나만 상기 제1 내지 제3금속플레이트들 각각과 열전도가 가능하도록 결합될 수 있다.The first to third LED elements 120a, 120b, and 120c may be coupled to each of the first to third metal plates so that only one of the first and second electrodes may be thermally conductive.
상기 제1금속플레이트(110-5)는 내측에 위치된 상기 제2금속플레이트(110-6)에 설치된 제2엘이디소자(120b)가 외측으로 노출될 수 있도록 절개된 절개부(310)가 형성될 수 있다.The first metal plate 110-5 has a cutout portion 310 formed therein so that the second LED element 120b installed on the second metal plate 110-6 positioned inside may be exposed to the outside. Can be.
상기 제1엘이디소자(120a) 및 상기 제2엘이디소자(120b)는, 상기 소켓부(280)에 대한 거리가 다르게 설치될 수 있다.The first LED element 120a and the second LED element 120b may be provided with different distances from the socket part 280.
상기 엘이디조명장치는, 하나의 전구에 의하여 상향등 및 하향등이 가능하도록 2개의 필라멘트를 가지는 전구를 대신하여 자동차 전조등에 설치되며, 상기 제1엘이디소자(120a) 및 상기 제2엘이디소자(120b) 중 어느 하나는 상향등에 대응되는 필라멘트의 위치에 위치되며, 다른 하나는 하향등에 대응되는 필라멘트의 위치에 위치될 수 있다.The LED lighting device is installed in a vehicle headlight in place of a light bulb having two filaments so as to enable uplight and downlight by one light bulb, and the first LED element 120a and the second LED element 120b. One of which may be located at the position of the filament corresponding to the high beam, the other may be located at the position of the filament corresponding to the downlight.
상기 소켓부(230)에 설치되어 상기 제1엘이디소자(120a) 및 상기 제2엘이디소자(120b) 중 어느 하나 및 상기 제3엘이디소자(120c)를 직렬 또는 병렬로 연결하는 제1단자(237) 및 제2단자(238)와; 상기 소켓부(230)에 설치되어 상기 제2단자(238)와, 상기 제1엘이디소자(120a) 및 상기 제2엘이디소자(120b) 중 나머지 하나를 직렬로 연결하는 제3단자(239)를 추가로 포함하여, 상기 제2단자(238)를 공유함과 아울러 상기 제1단자(237) 및 제3단자(239) 중 적어도 어느 하나에 전원을 연결될 수 있다.A first terminal 237 installed in the socket 230 to connect any one of the first LED element 120a and the second LED element 120b and the third LED element 120c in series or in parallel; ) And the second terminal 238; A third terminal 239 installed in the socket 230 to connect the second terminal 238 to the other of the first LED element 120a and the second LED element 120b in series; In addition, the second terminal 238 may be shared and a power may be connected to at least one of the first terminal 237 and the third terminal 239.
상기 제1 내지 제3금속플레이트들은, 각각 상기 제1 내지 제3엘이디소자(120a, 120b, 120c) 각각의 제1전극 및 제2전극 중 어느 하나만 열전도가 가능하도록 나머지 전극인 열전도가 이루어지지 않는 비접촉전극에 대응되는 위치에 그 접촉을 방지하기 위한 접촉방지수단이 형성될 수 있다.The first to third metal plates may not be thermally conductive as the remaining electrodes such that only one of the first and second electrodes of each of the first to third LED elements 120a, 120b, and 120c may be thermally conductive. Contact preventing means for preventing the contact may be formed at a position corresponding to the non-contact electrode.
상기 접촉방지수단은, 상기 제1 내지 제3금속플레이트들 각각에 형성된 관통공 또는 절개부일 수 있다.The contact preventing means may be a through hole or a cutout formed in each of the first to third metal plates.
상기 비접촉전극은, 다른 엘이디소자의 단자와의 연결 또는 전원공급선과 연결을 위한 전원연결선이 상기 관통공 또는 절개부를 통하여 연결될 수 있다.In the non-contact electrode, a power connection line for connection with a terminal of another LED element or a power supply line may be connected through the through hole or cutout.
상기 접촉방지수단은, 상기 제1 내지 제3금속플레이트들 각각에 형성된 절연부재일 수 있다.The contact preventing means may be an insulating member formed on each of the first to third metal plates.
상기 소켓부는, 상기 구조물에 탈착가능하게 결합되며 비전도성 물질로 이루어진 본체와; 상기 본체에 설치되어 상기 구조물에 설치된 연결단자와의 전기적 연결을 위한 단자연결부와; 상기 엘이디소자와 상기 단자연결부와 전기적으로 연결시키는 소자전원공급부를 포함할 수 있다.The socket portion is detachably coupled to the structure and the body made of a non-conductive material; A terminal connection part installed on the main body for electrical connection with a connection terminal installed on the structure; It may include a device power supply for electrically connecting the LED element and the terminal connecting portion.
상기 소자전원공급부는, 상기 단자연결부와 전기적으로 연결된 복수의 단자부가 형성되고, 상기 본체와 결합되어 상기 금속플레이트를 지지하는 지지기판부와, 상기 엘이디소자 및 상기 단자부를 연결하는 하나 이상의 전선을 포함할 수 있다.The device power supply part includes a plurality of terminal parts electrically connected to the terminal connection part, a support substrate part coupled to the main body to support the metal plate, and at least one wire connecting the LED element and the terminal part. can do.
본 발명에 따른 엘이디조명장치는, 하나 이상의 금속플레이트에 엘이디소자를 설치함으로써 엘이디소자에서 발생된 열을 금속플레이트를 전달하여 방열하는 구조를 가짐으로써 구조가 간단하면서 효율적으로 방열할 수 있는 이점이 있다.The LED lighting apparatus according to the present invention has an advantage that the structure is simple and efficient heat dissipation by having a structure that radiates heat generated by the LED element by transferring the metal plate by installing the LED element on at least one metal plate. .
또한 본 발명에 따른 엘이디조명장치는, 서로 마주보는 면의 반대면인 외면에 각각 엘이디소자가 결합된 한 쌍의 금속플레이트로 구성됨으로써 벌브형 전구와 유사한 광조사효과를 가짐으로써 벌브형 전구가 사용되는 기존의 조명장치에서 벌브형 전구를 대체함으로써 엘이디조명장치의 활용도를 극대화할 수 있는 이점이 있다.In addition, the LED lighting device according to the present invention is composed of a pair of metal plates, each LED element is coupled to the outer surface of the opposite surface facing each other to have a light irradiation effect similar to the bulb-type bulb bulb is used By replacing the bulb-type bulb in the existing lighting device has the advantage that can maximize the utilization of the LED lighting device.
특히 벌브형 전구를 사용하는 기존 조명시설에는 반사갓을 구비함을 특징으로 하는데 이때 반사갓은 벌브형 전구 특히 벌브형 전구의 발광부분에 대응하여 최적화되는바, 본 발명에 따른 엘이디조명장치는, 하나 이상의 금속플레이트에 엘이디소자를 설치하여 구성되는바 엘이디소자의 위치를 기존의 벌브형 전구의 발광부분에 대응되는 위치에 위치시킴으로써 벌브형 전구와 유사한 광조사효과를 가짐으로써 벌브형 전구가 사용되는 기존의 조명장치에서 벌브형 전구를 대체함으로써 엘이디조명장치의 활용도를 극대화할 수 있는 이점이 있다.In particular, the existing lighting system using a bulb-type bulb is characterized in that the reflection shade is provided with a reflection shade is optimized in response to the light emitting portion of the bulb-type bulb, in particular bulb-type bulb, LED lighting apparatus according to the present invention, one or more It is composed by installing LED elements on the metal plate. By placing the LED element at the position corresponding to the light emitting part of the existing bulb type bulb, it has a light irradiation effect similar to the bulb type bulb, so that the bulb type bulb is used. By replacing the bulb bulb in the lighting device there is an advantage that can maximize the utilization of the LED lighting device.
구체적인 예로서, 본 발명에 따른 엘이디조명장치는, 자동차용 전조등, 안개등, 방향지시등 등에 사용되는 경우 다름과 같은 이점이 있다.As a specific example, the LED lighting apparatus according to the present invention has the advantages, such as when used in the headlights, fog lights, direction indicators for automobiles.
먼저 엘이디조명장치는 벌브형 전구와는 다른 조명 특성이 있는바, 자동차용 전조등, 안개등, 방향지시등과 같이 특수한 조명효과를 요구하는 조명기구로 사용되는 경우 종래에는 벌브형 전구를 구비하는 조명기구 중 반사갓의 설계를 변경하여야하는 문제점이 있다.First of all, LED lighting device has different lighting characteristics from bulb-type bulbs.In the case of LED lighting devices, when used as lighting fixtures requiring special lighting effects such as headlights, fog lamps, direction indicator lamps, etc. There is a problem in that the design of the reflector must be changed.
그런데 본 발명에 따른 엘이디조명장치는, 기존의 벌브형 전구의 발광부분에 대응되는 위치에 위치시킴으로써 벌브형 전구와 유사한 광조사효과를 가짐으로써 벌브형 전구가 사용되는 기존의 조명장치에서 벌브형 전구를 대체함으로써 엘이디조명장치의 활용도를 극대화할 수 있는 이점이 있다.However, the LED lighting device according to the present invention has a light irradiation effect similar to that of a bulb-type bulb by being positioned at a position corresponding to the light emitting portion of the existing bulb-type bulb, and bulb-type bulb in the existing lighting device using a bulb-type bulb By replacing the has the advantage that can maximize the utilization of the LED lighting device.
더 나아가 다양한 조명효과, 예를 들면 위치, 즉 광원의 위치가 다른 2개의 필라멘트를 구비하여 하나의 벌브형 전구에 의하여 상향등 및 하향등 동시 구현이 가능한 기존의 조명장치에서 각 광원의 위치에 대응하여 엘이디소자를 위치시킴으로써 벌브형 전구가 사용되는 기존의 조명장치에서 벌브형 전구를 대체함으로써 엘이디조명장치의 활용도를 극대화할 수 있는 이점이 있다.Furthermore, various lighting effects, for example, having two filaments with different positions, that is, the position of the light source, can correspond to the position of each light source in the existing lighting device that can simultaneously realize the high and the low light by a bulb bulb. Positioning the LED element has the advantage of maximizing the utilization of the LED lighting device by replacing the bulb-type bulb in the existing lighting device that the bulb-type bulb is used.
도 1은, 벌브형 전구를 가지는 종래의 조명기구로서, 구체적으로 자동차용 전조등을 보여주는 개념도이다.1 is a conceptual view showing a headlamp for a vehicle as a conventional lighting device having a bulb-shaped bulb.
도 2는, 도 1의 자동차용 전조등에 사용되는 벌브형 전구의 일예를 보여주는 측면도이다.FIG. 2 is a side view illustrating an example of a bulb bulb used in the headlight of the automobile of FIG. 1.
도 3a는, 본 발명의 제1실시예에 따른 엘이디조명장치를 보여주는 사시도이다. Figure 3a is a perspective view showing the LED lighting apparatus according to the first embodiment of the present invention.
도 3b는, 도 1의 엘이디조명장치의 일부를 보여주는 분해도이다.3B is an exploded view showing a part of the LED lighting apparatus of FIG. 1.
도 4a는, 도 3a의 엘이디조명장치의 측면도이다.4A is a side view of the LED lighting device of FIG. 3A.
도 4b는, 도 3a의 엘이디조명장치의 평면도이다.4B is a plan view of the LED lighting apparatus of FIG. 3A.
도 5는, 도 3a에서 Ⅴ-Ⅴ방향의 단면도이다.FIG. 5 is a cross-sectional view taken along the line VV in FIG. 3A.
도 6은, 도 5의 변형례를 보여주는 Ⅴ-Ⅴ방향의 단면도이다.FIG. 6 is a cross-sectional view in the V-V direction showing a modification of FIG. 5.
도 7은, 본 발명의 제2실시예에 따른 엘이디조명장치를 보여주는 측면도이다.7 is a side view showing an LED lighting apparatus according to a second embodiment of the present invention.
도 8은, 도 7의 엘이디조명장치의 평면도이다.8 is a plan view of the LED lighting apparatus of FIG.
도 9는, 본 발명의 제3실시예에 따른 엘이디조명장치를 보여주는 측면도이다.9 is a side view showing an LED lighting apparatus according to a third embodiment of the present invention.
도 10은, 도 9의 엘이디조명장치의 평면도이다.10 is a plan view of the LED lighting apparatus of FIG.
도 11은, 본 발명의 제4실시예에 따른 엘이디조명장치를 보여주는 사시도이다.11 is a perspective view showing an LED lighting apparatus according to a fourth embodiment of the present invention.
도 12는, 도 11의 엘이디조명장치를 보여주는 분해사시도이다.12 is an exploded perspective view showing the LED lighting device of FIG.
도 13a는, 도 11의 엘이디조명장치의 평면도, 도 13b는, 도 11의 엘이디조명장치의 측면도이다.FIG. 13A is a plan view of the LED lighting apparatus of FIG. 11, and FIG. 13B is a side view of the LED lighting apparatus of FIG. 11.
도 14는, 도 11의 엘이디조명장치의 등가회로도의 일예를 보여주는 개념도이다.14 is a conceptual diagram illustrating an example of an equivalent circuit diagram of the LED lighting apparatus of FIG. 11.
도 15는, 벌브형 전구가 설치되는 종래의 조명기구에 도 11의 엘이디조명장치가 설치된 예를 보여주는 개념도이다.15 is a conceptual diagram illustrating an example in which the LED lighting device of FIG. 11 is installed in a conventional lighting device in which a bulb-type bulb is installed.
도 16은 본 발명의 제5실시예에 따른 엘이디조명장치로서, 제4실시예의 구성에서 광차단부가 추가로 설치된 예를 보여주는 사시도이다.FIG. 16 is a perspective view illustrating an LED lighting apparatus according to a fifth embodiment of the present invention, in which a light blocking unit is additionally installed in the configuration of the fourth embodiment.
도 17a는, 도 16의 엘이디조명장치의 평면도, 도 17b는, 도 16의 엘이디조명장치의 측면도이다.17A is a plan view of the LED lighting apparatus of FIG. 16, and FIG. 17B is a side view of the LED lighting apparatus of FIG. 16.
도 18은, 본 발명의 제6실시예에 따른 엘이디조명장치를 보여주는 사시도이다.18 is a perspective view showing an LED lighting apparatus according to a sixth embodiment of the present invention.
도 19는, 도 18의 엘이디조명장치의 평면도이다.19 is a plan view of the LED lighting apparatus of FIG.
도 20은, 도 18의 엘이디조명장치의 분해도이다.20 is an exploded view of the LED lighting device of FIG. 18.
도 21a는, 도 18의 엘이디조명장치 중 제1금속플레이트 및 복개금속플레이트를 보여주는 평면도이다.FIG. 21A is a plan view illustrating a first metal plate and a covering metal plate of the LED lighting apparatus of FIG. 18. FIG.
도 21b는, 도 18의 엘이디조명장치 중 제2금속플레이트 및 복개금속플레이트를 보여주는 평면도이다.FIG. 21B is a plan view illustrating a second metal plate and a covering metal plate of the LED lighting apparatus of FIG. 18. FIG.
도 21c는, 도 18의 엘이디조명장치 중 중간금속플레이트의 평면도이다.FIG. 21C is a plan view of an intermediate metal plate of the LED lighting apparatus of FIG. 18. FIG.
도 22는, 본 발명의 제7실시예에 따른 엘이디조명장치를 보여주는 사시도이다.22 is a perspective view showing the LED lighting apparatus according to the seventh embodiment of the present invention.
도 23은, 도 22의 엘이디조명장치의 평면도이다.FIG. 23 is a plan view of the LED lighting apparatus of FIG.
도 24는, 도 22의 엘이디조명장치의 분해도이다.24 is an exploded view of the LED lighting device of FIG. 22.
도 25a는, 도 22의 엘이디조명장치 중 제1금속플레이트 및 방열금속플레이트를 보여주는 평면도이다.FIG. 25A is a plan view illustrating a first metal plate and a heat radiation metal plate of the LED lighting apparatus of FIG. 22.
도 25b는, 도 22의 엘이디조명장치 중 제2금속플레이트 및 방열금속플레이트를 보여주는 평면도이다.FIG. 25B is a plan view illustrating a second metal plate and a heat radiation metal plate of the LED lighting apparatus of FIG. 22.
도 25c는, 도 22의 엘이디조명장치 중 중간금속플레이트의 평면도이다.FIG. 25C is a plan view of an intermediate metal plate of the LED lighting apparatus of FIG. 22.
도 26는, 본 발명의 제8실시예에 따른 엘이디조명장치를 보여주는 사시도이다.26 is a perspective view showing the LED lighting apparatus according to the eighth embodiment of the present invention.
도 27은, 도 26의 엘이디조명장치의 다른 방향에서 본 사시도이다.FIG. 27 is a perspective view of the LED lighting device of FIG. 26, seen from another direction. FIG.
도 28은, 도 26의 엘이디조명장치의 분해 사시도이다.FIG. 28 is an exploded perspective view of the LED lighting device of FIG. 26.
도 27a 내지 도 27b는, 각각 도 26의 엘이디조명장치의 제1금속플레이트, 제2금속플레이트 및 중간금속플레이트를 보여주는 측면도들이다.27A to 27B are side views showing the first metal plate, the second metal plate and the intermediate metal plate of the LED lighting apparatus of FIG. 26, respectively.
도 30는, 도 26의 엘이디조명장치의 측면도이다.30 is a side view of the LED lighting device of FIG. 26.
도 31은, 도 26의 엘이디조명장치의 평면도이다.FIG. 31 is a plan view of the LED lighting apparatus of FIG.
도 32은, 도 26의 엘이디조명장치의 등가회로도이다.32 is an equivalent circuit diagram of the LED lighting device of FIG.
도 33는, 본 발명의 제8실시예의 엘이디조명장치의 변형예를 보여주는 평면도이다.33 is a plan view showing a modification of the LED lighting apparatus according to the eighth embodiment of the present invention.
도 34은, 도 33의 엘이디조명장치의 정면도이다.34 is a front view of the LED lighting device of FIG.
도 35는, 도 33의 엘이디조명장치의 기판을 보여주는 평면도이다.35 is a plan view illustrating a substrate of the LED lighting apparatus of FIG. 33.
도 36a 내지 도 36d는, 본 발명에 따른 엘이디조명장치의 제조방법의 일부를 보여주는 평면도들이다.36A to 36D are plan views illustrating a part of a manufacturing method of the LED lighting apparatus according to the present invention.
도 37은, 본 발명의 제9실시예에 따른 엘이디조명장치를 보여주는 단면도이다.37 is a sectional view showing the LED lighting apparatus according to the ninth embodiment of the present invention.
도 38은, 도 37의 엘이디조명장치에서 금속부재의 구성을 보여주는 사시도이다.38 is a perspective view showing the structure of a metal member in the LED lighting device of FIG.
도 39는, 도 38의 금속부재의 제조를 위한 금속플레이트를 보여주는 평면도이다.FIG. 39 is a plan view illustrating a metal plate for manufacturing the metal member of FIG. 38.
도 40은, 도 2의 금속부재의 A-A방향의 단면도이다.40 is a cross-sectional view in the A-A direction of the metal member of FIG. 2.
도 41은, 본 발명의 제10실시예에 따른 엘이디조명장치의 사시도이다.41 is a perspective view of the LED lighting apparatus according to the tenth embodiment of the present invention.
도 42은, 도 41의 금속부재의 제조를 위한 금속플레이트를 보여주는 평면도이다.FIG. 42 is a plan view illustrating a metal plate for manufacturing the metal member of FIG. 41.
도 43는, 본 발명의 제11실시예에 따른 엘이디조명장치를 보여주는 저면도이다.43 is a bottom view showing the LED lighting apparatus according to the eleventh embodiment of the present invention.
도 44은, 도 43에서 B-B방향의 단면도이다.FIG. 44 is a cross-sectional view taken along the B-B direction in FIG. 43.
도 45은, 본 발명의 제12실시예에 따른 엘이디조명장치를 보여주는 저면도이다.45 is a bottom view showing the LED lighting apparatus according to the twelfth embodiment of the present invention.
도 46는, 도 44에서 C-C방향의 단면도이다.FIG. 46 is a cross-sectional view taken along the C-C direction in FIG. 44.
이하 본 발명에 따른 엘이디조명장치에 관하여 첨부된 도면을 참조하여 상세히 설명하면 다음과 같다.Hereinafter, the LED lighting apparatus according to the present invention will be described in detail with reference to the accompanying drawings.
본 발명에 따른 엘이디조명장치는, 도 3a 내지 도 46에 도시된 바와 같이, 하나 이상의 금속플레이트(110)와; 금속플레이트(110)의 표면에 설치된 하나 이상의 엘이디소자(120)를 포함한다.LED lighting device according to the present invention, as shown in Figure 3a to Figure 46, one or more metal plate 110; It includes at least one LED element 120 installed on the surface of the metal plate (110).
상기 금속플레이트(110)는, 엘이디소자(120)가 설치되고 지지될 수 있도록 플레이트 형상을 가지며 열방출이 용이하도록 알루미늄, 알루미늄합금, 구리, 구리합금, SUS 등 열전도성이 높을 재질이면 어떠한 재질도 가능하다.The metal plate 110 has a plate shape so that the LED element 120 can be installed and supported, and any material as long as it has a high thermal conductivity such as aluminum, aluminum alloy, copper, copper alloy, and SUS to facilitate heat dissipation. It is possible.
특히 상기 금속플레이트(110)는, 가공성, 열전도성, 도전성을 고려하여 구리 또는 구리합금이 보다 바람직하다.In particular, the metal plate 110 is more preferably copper or a copper alloy in consideration of workability, thermal conductivity, and conductivity.
또한 상기 금속플레이트(110)의 두께는, 구조적 강성 및 제조상의 한계가 없다면 가능하면 최소화되는 것이 바람직하다.In addition, the thickness of the metal plate 110 is preferably minimized if possible without structural rigidity and manufacturing limitations.
특히 상기 금속플레이트(110)의 두께는, 0.01㎜~0.5㎜인 것이 바람직하며, 0.1㎜~0.4㎜인 것이 더욱 바람직하다. 다만, 상기 금속플레이트(110)의 두께는, 위 수치에 한정되는 것은 아니며 설계상 필요에 따라서 다양한 두께를 가질 수 있음은 물론이다. In particular, the thickness of the metal plate 110 is preferably 0.01 mm to 0.5 mm, more preferably 0.1 mm to 0.4 mm. However, the thickness of the metal plate 110 is not limited to the above numerical value, of course, may have a variety of thickness depending on the design needs.
그리고 상기 금속플레이트(110)는, 그 표면에 엘이디소자(120) 등에서 조사되는 광의 반사효과를 높이기 위하여 은과 같이 반사율이 높은 물질이 코팅될 수 있다.In addition, the metal plate 110 may be coated with a material having a high reflectance such as silver in order to increase a reflection effect of light irradiated from the LED device 120 on the surface thereof.
또한 상기 금속플레이트(110)는, 그 표면의 적어도 일부에 절연특성을 부여하기 위하여 절연물질이 코팅될 수 있다.In addition, the metal plate 110 may be coated with an insulating material to impart insulating properties to at least a portion of its surface.
또한 상기 금속플레이트(110)는, 그 표면에 니켈이 도금될 수 있다. 단, 니켈 도금에 의하여 금속플레이트(110)의 열이 방열되는 것이 방해될 수 있는바 니켈 도금없이 사용될 수 있다.In addition, the metal plate 110, nickel may be plated on the surface. However, the heat dissipation of the heat of the metal plate 110 by nickel plating may be prevented and may be used without nickel plating.
또한 상기 금속플레이트(110)는, 열방출 효과를 극대화하기 위하여 검은색의 에폭시도료와 같은 물질 등으로 검은색으로 코팅되는 것이 바람직하다.In addition, the metal plate 110 is preferably coated in black with a material such as black epoxy paint to maximize the heat dissipation effect.
이때 상기 엘이디소자(120)와의 결합, 땜납 등을 위하여 일부는 코팅되지 않을 수도 있다.In this case, a part of the LED element 120 may not be coated for bonding, soldering, or the like.
또한 상기 금속플레이트(110)는, 엘이디소자(120)에 대한 전원연결을 위한 배선이 부착되거나, 프린팅될 수 있다.In addition, the metal plate 110 may be attached or printed with a wire for power connection to the LED device 120.
또한 상기 금속플레이트(110)는, 회로가 패턴으로 형성될 수 있다.In addition, the metal plate 110, a circuit may be formed in a pattern.
또한 상기 금속플레이트(110)는, 엘이디소자(120)가 설치될 수 있는 FPCB 등과 같은 보드가 결합될 수 있다.In addition, the metal plate 110 may be coupled to a board, such as FPCB on which the LED element 120 may be installed.
또한 상기 금속플레이트(110)는, 제조과정, 즉 엘이디소자(120)와의 결합 등을 위하여 땜납이 땜납영역 이외의 영역으로 벗어나는 것을 방지하기 위한 합성수지물질이 인쇄될 수 있다.In addition, the metal plate 110 may be printed with a synthetic resin material for preventing the solder from escaping to a region other than the solder region for the manufacturing process, that is, for bonding with the LED element 120.
한편 상기 금속플레이트(110)는, 엘이디소자(120)의 열방출효과, 복수개로 구성된 경우 엘이디소자(120)의 광조사효과 등을 고려하여 다양한 형상을 가질 수 있다.Meanwhile, the metal plate 110 may have various shapes in consideration of the heat radiating effect of the LED device 120 and the light irradiation effect of the LED device 120.
구체적으로 상기 금속플레이트(110)는, 도 3a 및 도 3b에 도시된 바와 같이, 평판 형상을 가지며 예로서 벌브와 유사한 평면형상을 가질 수 있다.Specifically, as shown in FIGS. 3A and 3B, the metal plate 110 may have a flat plate shape and may have, for example, a planar shape similar to a bulb.
또한 상기 금속플레이트(110)는, 도 7 내지 도 10에 도시된 바와 같이, 엘이디소자(120)가 설치된 설치면부(112)와, 설치면부(112)와 절곡되어 연장되는 절곡면부(113)를 포함하는 절곡금속플레이트(110-1)로 구성될 수 있다.In addition, the metal plate 110, as shown in Figures 7 to 10, the mounting surface portion 112 is installed with the LED element 120, the bending surface portion 113 is bent and extended with the mounting surface portion 112 It may be composed of a bending metal plate (110-1) comprising.
상기 절곡금속플레이트(110-1)는 금속플레이트(110)가 복수개로 구성되고 엘이디소자(120)의 광조사효과를 극대화하기 위하여 소켓부(230)와 같이 지지구조물에 결합되는 절곡면부(113)와 일체로 형성되는 설치면부(112)를 포함함을 특징으로 한다.The bent metal plate 110-1 includes a plurality of metal plates 110 and bent surface portions 113 coupled to the supporting structure such as the socket portion 230 to maximize the light irradiation effect of the LED device 120. And characterized in that it comprises an installation surface portion 112 formed integrally with.
이때 상기 설치면부(112)는, 엘이디소자(120)의 광조사방향을 결정하는 부분으로서 엘이디소자(120)가 설치된 면의 법선이 엘이디소자(120)의 광조사방향과 평행하도록 형성된다.At this time, the mounting surface portion 112 is a portion for determining the light irradiation direction of the LED element 120 is formed so that the normal line of the surface on which the LED element 120 is installed is parallel to the light irradiation direction of the LED element 120.
그리고 상기 절곡면부(113)는 설치면부(112)와 일체로 이루어 지지하는 부분으로서 인접하는 금속플레이트(110)와 평행(가장 바람직), 수직, 경사를 이루어 소켓부(230)와 같이 지지구조물에 결합되는 구성으로서 다양한 구성이 가능한다.The bent surface portion 113 is formed integrally with the installation surface portion 112 to support the structure such as the socket portion 230 in parallel (most preferably), vertically, and inclined with the adjacent metal plate 110. Various configurations are possible as the combined configuration.
한편 상기 금속플레이트(110)는, 복수개로 구성됨이 바람직하며, 복수개로 구성된 경우 복수의 금속플레이트(110)들은, 적어도 일부가 엘이디소자(120)가 설치된 면이 서로 평행을 이루거나, 수직을 이루거나, 경사를 이루도록 설치될 수 있다.On the other hand, the metal plate 110 is preferably composed of a plurality, when a plurality of the plurality of metal plates 110, at least a portion of the surface on which the LED element 120 is installed is parallel or perpendicular to each other Or, it may be installed to make an inclination.
상기와 같은 금속플레이트(110)는, 1) 엘이디소자(120)를 직접적으로 견고하게 지지-참고로 FPCB의 경우 그 자체로 엘이디소자(120)에 대한 지지가 불가하며, 열전도율이 낮은 합성수지재 재질을 가져 열방출효과가 현저히 낮다. 그리고 메탈 PCB인 경우 인쇄회로기판과 금속층(알루미늄)과의 절연을 위한 절연층의 존재, 구체적으로 엘이디소자(120), 땜납, 구리배선, 접착층, 절연층, 접착층 및 알루미늄 금속층 순으로 열이 전달되고 열방출시 병목현상이 있어 열방출효과가 낮으며, 전체적으로 두꺼운 문제점이 있음-하는 역할의 수행이 가능하며, 2) 엘이디소자(120)의 제1단자(121) 및 제2단자(122) 중 어느 하나와 직접 연결됨으로써 엘이디소자(120)에 대한 전원공급을 위한 전기전도체 역할의 수행이 가능하며, 3) 엘이디소자(120)로부터 열을 전달받아 방열하는 방열부재 역할, 특히 엘이디소자(120)의 제1단자(121), 제2단자(122), 히트슬러그(124) 중 적어도 어느 하나와 납땜 등에 의하여 연결됨으로써 열방출이 효과적으로 이루어질 수 있으며, 4) 간단한 구조임에도 불구하고 벌브형 전구의 발광부분(필라멘트)에 최적 위치에 위치시켜 기존 반사갓을 활용한 활용효과를 높일 수 있다.The metal plate 110 as described above, 1) the LED element 120 directly and firmly supported-for reference FPCB itself is not possible to support the LED element 120 itself, low thermal conductivity synthetic resin material It has a low heat dissipation effect. In the case of a metal PCB, heat is transmitted in the presence of an insulation layer for insulation between the printed circuit board and the metal layer (aluminum), specifically, an LED element 120, solder, copper wiring, an adhesive layer, an insulation layer, an adhesive layer, and an aluminum metal layer. And heat release effect is low, there is a bottleneck phenomenon during heat dissipation, there is a thick problem as a whole-can perform the role, 2) of the first terminal 121 and the second terminal 122 of the LED element 120 It is possible to perform the role of the electrical conductor for supplying power to the LED element 120 by being directly connected to any one, 3) the role of heat dissipation member that receives heat from the LED element 120, in particular the LED element 120 By at least one of the first terminal 121, the second terminal 122, the heat slug 124 of the heat dissipation can be effectively made by soldering, etc. 4) Bulb-type bulb despite the simple structure Was placed at the optimum position on the light-emitting portion (the filament) can increase the utilization effect utilizing the existing reflector.
상기 엘이디소자(120)는, DC전원의 공급에 의하여 발광하는 엘이디소자로서, 백색광을 발광하는 백색엘이디소자, 황색광을 발광하는 황색엘이디소자, 청색엘이디소자, 적색엘이디소자, 녹색엘이디소자, "청색엘이디소자, 적색엘이디소자 및 녹색엘이디소자"가 하나의 칩으로 형성된 삼색 엘이디칩 등 다양한 엘이디소자가 사용될 수 있다.The LED element 120 is an LED element that emits light by supplying DC power, and includes a white LED element that emits white light, a yellow LED element that emits yellow light, a blue LED element, a red LED element, and a green LED element. Various LED elements such as a tricolor LED chip in which a blue LED element, a red LED element, and a green LED element "are formed as one chip may be used.
또한 상기 엘이디소자(120)는, 하나의 엘이디반도체소자를 포함하는 칩이 바람직하다.In addition, the LED device 120, a chip containing one LED semiconductor device is preferable.
일예로서, 상기 엘이디소자(120)는, 도 5에 도시된 바와 같이, +단자 및 -단자인 제1전극(121) 및 제2전극(122)를 포함할 수 있다.For example, as shown in FIG. 5, the LED device 120 may include a first electrode 121 and a second electrode 122 which are + and − terminals.
또한 상기 엘이디소자(120)는, 도 5에 도시된 바와 같이, +단자 및 -단자인 제1전극(121) 및 제2전극(122)이외에 열방출을 위한 히트슬러그(124, heat slug)를 추가로 포함할 수 있다.In addition, as shown in FIG. 5, the LED element 120 includes a heat slug 124 for heat dissipation in addition to the first electrode 121 and the second electrode 122, which are + and − terminals. It may further comprise.
상기 히트슬러그(124)는, 엘이디소자에서 발생되는 열을 방출하기 위하여 설치된 구성으로서 그 구조에 따라서 제1전극(121) 및 제2전극(122)와 일체로 구성될 수 있다.The heat slug 124 is configured to dissipate heat generated from the LED element and may be integrally formed with the first electrode 121 and the second electrode 122 according to the structure thereof.
참고로 도 5는 엘이디소자(120)에서 제1전극(121), 제2전극(122) 및 히트슬러그(124, heat slug)를 도시하기 위한 구조로서 실제 엘이디소자의 구조와는 차이가 있을 수 있음은 물론이다.For reference, FIG. 5 is a structure for illustrating the first electrode 121, the second electrode 122, and the heat slug 124 in the LED device 120, which may be different from the structure of the actual LED device. Of course.
한편 상기 엘이디소자(120)는, 금속플레이트(110)와의 결합시 제1전극(121) 및 제2전극(122) 중 어느 하나만 금속플레이트(110)와 열전도가 가능하도록 금속플레이트(110)와 결합될 수 있다.Meanwhile, the LED device 120 is coupled to the metal plate 110 such that only one of the first electrode 121 and the second electrode 122 can be thermally conductive with the metal plate 110 when the metal plate 110 is coupled with the metal plate 110. Can be.
또한 상기 엘이디소자(120)는, 히트슬러그(124)를 추가로 포함하는 경우, 히트슬러그(124)만 금속플레이트(110)와 열전도가 가능하도록 금속플레이트(110)에 결합될 수 있다.In addition, when the LED element 120 further includes a heat slug 124, only the heat slug 124 may be coupled to the metal plate 110 to allow thermal conductivity with the metal plate 110.
이때 상기 엘이디소자(120)는, 도 3a 내지 도 5에 도시된 바와 같이, 금속플레이트(110)에 직접 결합될 수 있다.In this case, the LED device 120 may be directly coupled to the metal plate 110 as shown in FIGS. 3A to 5.
이 경우, 상기 엘이디소자(120)의 제1전극(121) 및 제2전극(122) 중 어느 하나만 금속플레이트(110)와 통전될 필요가 있는바 금속플레이트(110)와 통전되지 않는 전극은 금속플레이트(110)에 전기적으로 절연되도록 설치된다.In this case, only one of the first electrode 121 and the second electrode 122 of the LED element 120 needs to be energized with the metal plate 110. The electrode that is not energized with the metal plate 110 is made of metal. The plate 110 is installed to be electrically insulated.
구체적으로, 상기 금속플레이트(110)는, 엘이디소자(120)의 제1전극(121) 및 제2전극(122) 중 어느 하나만 열전도가 가능하도록 나머지 전극인 열전도가 이루어지지 않는 비접촉전극에 대응되는 위치에 그 접촉을 방지하기 위한 접촉방지수단(111)이 형성될 수 있다.In detail, the metal plate 110 corresponds to a non-contact electrode in which the other electrode is not thermally conductive so that only one of the first electrode 121 and the second electrode 122 of the LED device 120 is capable of thermal conduction. Contact preventing means 111 may be formed to prevent the contact at the position.
그리고 상기 접촉방지수단(111)은, 도 5에 도시된 바와 같이, 금속플레이트(110)에 형성된 관통공으로, 또는 도 7 및 도 9에 도시된 바와 같이 절개부로 구성될 수 있다.And the contact preventing means 111, as shown in Figure 5, may be formed as a through-hole formed in the metal plate 110, or as shown in Figs.
이때 상기 비접촉전극은, 도 5에 도시된 바와 같이, 다른 엘이디소자의 단자와의 연결 또는 전원공급선과 연결을 위한 전원연결선(250)이 관통공, 또는 절개된 부분(도 7 및 도 9에 형성된 절개부)을 통하여 연결될 수 있다.At this time, the non-contact electrode, as shown in Figure 5, the connection portion of the other LED element or the power supply line 250 for the connection with the power supply line, through-holes, or a portion formed in (7 and 9) Through the incision).
상기 전원연결선(250)은, 후술하는 제1실시예에서 각 엘이디소자(110)와 연결됨으로써 평행하게 배치된 금속플레이트(110) 사이의 간격을 유지시키는데 활용될 수 있다. 여기서 상기 평행하게 배치된 금속플레이트(110)들 사이의 간격은 후술하는 간격유지부재(280)에 의하여 유지될 수 있음은 물론이다.The power connection line 250 may be utilized to maintain the gap between the metal plates 110 arranged in parallel by being connected to each LED element 110 in the first embodiment to be described later. Here, the distance between the metal plates 110 arranged in parallel may be maintained by the gap maintaining member 280 described later.
한편 상기 전원연결선(250) 대신에 인접한 금속플레이트(110)에 설치된 엘이디소자(120)와 연결되는 경우, 동일한 재질의 금속플레이트(110) 조각에 의하여 인접한 금속플레이트(110)에 설치된 엘이디소자(120)와 전기적으로 연결될 수도 있다.Meanwhile, when connected to the LED element 120 installed in the adjacent metal plate 110 instead of the power connection line 250, the LED element 120 installed in the adjacent metal plate 110 by a piece of the metal plate 110 of the same material. ) May be electrically connected.
또한 상기 접촉방지수단(111)은, 다른 예로서, 도 6에 도시된 바와 같이, 금속플레이트(110)에 형성된 절연부재(111)로 구성될 수 있다.In addition, the contact preventing means 111, as another example, as shown in Figure 6, may be composed of an insulating member 111 formed on the metal plate 110.
상기 절연부재는, 엘이디소자(120) 및 금속플레이트(110) 간의 전기적 절연을 위한 구성으로서 금속플레이트(110) 표면 상에 코팅된 절연물질, 부착된 절연테이프 등 다양하게 구성될 수 있다.The insulating member may be configured in various ways such as an insulating material coated on the surface of the metal plate 110, an attached insulating tape, and the like for electrical insulation between the LED element 120 and the metal plate 110.
한편 도 5의 예와는 달리 제1전극(121) 및 제2전극(122)와 전기적으로 절연된 히트슬러그(124)만 금속플레이트(110)와 열전도가 가능하도록 금속플레이트(110)에 결합된 경우, 엘이디소자(120)는 제1전극(121) 및 제2전극(122)는 금속플레이트(110)에 전기적으로 절연되도록 설치된다.Meanwhile, unlike the example of FIG. 5, only the heat slug 124 electrically insulated from the first electrode 121 and the second electrode 122 is coupled to the metal plate 110 to allow thermal conductivity with the metal plate 110. In this case, the LED device 120 is installed so that the first electrode 121 and the second electrode 122 are electrically insulated from the metal plate 110.
또한 도 5의 예와는 달리 상기 엘이디소자(120)는, 금속플레이트(110)에 직접 결합되는 대신에, 금속플레이트(110)에 결합되는 인쇄회로기판(미도시)에 장착될 수 있으며, 이 경우 인쇄회로기판은 엘이디소자(120)가 금속플레이트(110)에 직접 결합된 경우와 유사하게, 제1전극(121) 및 제2전극(122) 중 어느 하나가 금속플레이트(110)와 열전도가 가능하도록 금속플레이트(110)에 결합될 수 있다.In addition, unlike the example of FIG. 5, the LED device 120 may be mounted on a printed circuit board (not shown) coupled to the metal plate 110, instead of being directly coupled to the metal plate 110. In the case of the printed circuit board, similarly to the case in which the LED device 120 is directly coupled to the metal plate 110, any one of the first electrode 121 and the second electrode 122 is thermally conductive with the metal plate 110. It may be coupled to the metal plate 110 to enable.
한편 상기 엘이디소자(120)는, 광의 발산각도, 조도의 향상을 위하여 리플렉터가 그 주변으로 설치될 수도 있다.On the other hand, the LED element 120, a reflector may be installed around the periphery to improve the divergence angle and illumination of light.
한편 본 발명에 따른 엘이디조명장치는, 엘이디소자(120) 및 엘이디소자(120)가 결합된 금속플레이트(110)를 기본구조로 하며, 복수개로 구성됨으로써 금속플레이트(110)가 서로 평행하게 배치되거나, 일부가 서로 경사를 이루어 배치되는 등 여러 가지 배치 조합에 의하여 다양한 조명효과를 가지는 조명기구를 구성할 수 있다.Meanwhile, the LED lighting apparatus according to the present invention has a basic structure of a metal plate 110 to which the LED element 120 and the LED element 120 are coupled, and the metal plates 110 are arranged in parallel to each other, For example, the lighting apparatus having various lighting effects may be configured by various arrangement combinations such that some are arranged inclined to each other.
특히 본 발명에 따른 엘이디소자(120) 및 엘이디소자(120)가 결합된 금속플레이트(110)의 기본구조를 복수개로 구성하여 벌브형 전구와 같은 조명효과를 가지도록 구성될 수 있으며, 특히 벌브형 전구를 사용하는 자동차용 전조등, 안개등, 방향지시등과 같은 조명기구에 벌브형 전구를 대체함으로써 엘이디조명장치의 활용효과를 극대화할 수 있다.In particular, by configuring a plurality of the basic structure of the LED element 120 and the metal plate 110 coupled to the LED element 120 according to the present invention can be configured to have a lighting effect such as a bulb-type bulb, in particular bulb type It is possible to maximize the utilization effect of LED lighting device by replacing bulb type bulbs with lighting fixtures such as headlights, fog lights and turn signals for automobiles using bulbs.
이하 본 발명에 따른 엘이디조명장치가 자동차용 전조등, 안개등, 방향지시등과 같은 조명기구에 사용되는 것을 예를 들어 설명한다.Hereinafter, an LED lighting apparatus according to the present invention will be described by using an luminaire such as a headlamp, a fog lamp, a turn signal for automobiles.
본 발명의 제1실시예에 따른 엘이디조명장치는, 도 3a 내지 도 5에 도시된 바와 같이, 엘이디소자(120) 및 엘이디소자(120)가 결합된 금속플레이트(110)의 기본구조로 하는 한편, 금속플레이트(110)는, 서로 평행하게 배치되며 서로 마주보는 면의 반대면에 하나 이상의 상기 엘이디소자(120)가 설치된 제1금속플레이트 및 제2금속플레이트를 포함하여 구성될 수 있다.The LED lighting apparatus according to the first embodiment of the present invention, as shown in Figure 3a to 5, and has a basic structure of the metal plate 110 to which the LED element 120 and the LED element 120 is coupled The metal plate 110 may be configured to include a first metal plate and a second metal plate on which one or more of the LED elements 120 are disposed on opposite surfaces of the metal plates 110 disposed in parallel to each other and facing each other.
그리고 상기 한 쌍의 금속플레이트(110)의 일단에는 엘이디조명장치가 설치될 구조물, 즉 자동차용 조명기구와의 결합을 위한 소켓부(230)가 결합될 수 있다.One end of the pair of metal plates 110 may be coupled to a structure in which an LED lighting device is installed, that is, a socket 230 for coupling with a vehicle lighting fixture.
여기서 상기 금속플레이트(110)는, 소켓부(230)와 고정결합되거나 탈착가능하게 결합되는 등 다양한 방식에 의하여 결합될 수 있다.Here, the metal plate 110 may be coupled by various methods such as being fixedly coupled to the socket 230 or detachably coupled thereto.
상기 소켓부(230)는, 엘이디조명장치가 설치될 구조물, 즉 자동차용 조명기구와의 결합을 위한 구성으로서 설치될 구조물과의 결합태양에 따라서 다양한 구성이 가능하다.The socket portion 230 may be configured in various ways depending on the structure of the LED lighting device is installed, that is, the coupling aspect with the structure to be installed as a configuration for coupling with the automotive lighting fixture.
일예로서, 상기 소켓부(230)는, 구조물에 탈착가능하게 결합되는 본체(231)와; 본체(231)에 설치되어 구조물에 설치된 연결단자(미도시)와의 전기적 연결을 위한 단자연결부(240)와; 엘이디소자(120)와 단자연결부(240)와 전기적으로 연결시키는 소자전원공급부(260)를 포함할 수 있다.As an example, the socket portion 230, the body 231 is detachably coupled to the structure; A terminal connector 240 installed at the body 231 for electrical connection with a connection terminal (not shown) installed in the structure; The device 120 may include an element power supply unit 260 electrically connected to the LED element 120 and the terminal connection unit 240.
상기 본체(231)는, 엘이디조명장치를 구조물에 안정적으로 결합시키기 위한 구성으로서 하나 이상의 부재로 구성될 수 있으며, 절연물질 또는 금속 및 절연물질의 조합 등 다양한 구성이 가능하다.The main body 231 may be composed of one or more members as a component for stably coupling the LED lighting device to the structure, and various configurations such as an insulating material or a combination of a metal and an insulating material are possible.
상기 단자연결부(240)는, 본체(231)에 설치되어 구조물에 설치된 연결단자(미도시)와의 전기적 연결을 위한 구성으로서 단자연결방식에 따라서 다양한 구성이 가능하며 경우에 따라서는 본체(231)와 일체로 구성될 수 있다.The terminal connection part 240 is installed in the main body 231 and is configured for electrical connection with a connection terminal (not shown) installed in the structure. Various configurations are possible according to the terminal connection method, and in some cases, the main body 231 It can be configured integrally.
상기 소자전원공급부(260)는, 엘이디소자(120)와 단자연결부(240)와 전기적으로 연결시키는 구성으로서 단자연결부(240) 및 엘이디소자(120)와의 연결구조에 따라서 기판, 전선, 전도성부재 등 다양한 조합에 의한 구성이 가능하다.The device power supply unit 260 is configured to electrically connect the LED element 120 and the terminal connection unit 240, and according to the connection structure between the terminal connection unit 240 and the LED element 120, a substrate, an electric wire, a conductive member, or the like. Various combinations are possible.
예로서, 상기 소자전원공급부(260)는, 도 4a 및 도 4b에 도시된 바와 같이, 금속플레이트(110)와 결합되어 금속플레이트(110)를 지지하는 한편 단자연결부(240)와 결합되는 기판(261)과, 엘이디소자(120)에 전원을 공급하는 연결부분(262)를 포함하여 구성될 수 있다.For example, as shown in FIGS. 4A and 4B, the device power supply unit 260 may be coupled to the metal plate 110 to support the metal plate 110 and to be coupled to the terminal connection unit 240. 261, and a connection portion 262 for supplying power to the LED device 120.
여기서 금속플레이트(110)는, 엘이디소자(120)의 제1전극 및 제2전극 중 어느 하나와 전기적으로 연결될 수 있다.The metal plate 110 may be electrically connected to any one of the first electrode and the second electrode of the LED device 120.
상기 기판(261)은, 금속플레이트(110)를 지지하는 한편 단자연결부(240)와 결합되는 구성으로서 다양한 구성이 가능하며 금속플레이트(110) 중 적어도 하나의 돌출부(119)가 삽입되는 삽입공(261a)이 형성되고 단자연결부(240)와 엘이디소자(120)와의 통전을 위한 회로패턴이 형성되는 등 다양한 구성이 가능하다.The substrate 261 is supported by the metal plate 110 and coupled with the terminal connection unit 240. Various configurations are possible and an insertion hole into which at least one protrusion 119 of the metal plate 110 is inserted ( 261a) is formed, and a circuit pattern for conducting electricity between the terminal connector 240 and the LED element 120 is formed.
그리고 상기 기판(261)은, 소켓부(230)를 이루는 본체(231)의 일부 또는 전체를 구성할 수도 있다.In addition, the substrate 261 may form part or the entirety of the main body 231 forming the socket part 230.
상기 연결부분(262)은, 엘이디소자(120)에 전원을 공급하는 부분으로서, 도 4a 및 도 4b에 도시된 바와 같이, 땜납부분, 도 7 내지 도 10에 도시된 바와 같이, 전선 등 다양한 구성이 가능하다.The connection portion 262 is a portion for supplying power to the LED element 120, as shown in Figures 4a and 4b, the solder portion, as shown in Figures 7 to 10, various configurations such as wires This is possible.
한편 상기 소자전원공급부(260)의 다른 구성으로서, 도 7 내지 도 10에 도시된 바와 같이, 단자연결부(240)와 전기적으로 연결된 복수의 단자부(265)가 형성되고, 본체(231)와 결합되어 금속플레이트(110)를 지지하는 기판(261)과, 엘이디소자(120) 및 단자부(265)를 연결하는 하나 이상의 전선(263)을 포함할 수 있다.Meanwhile, as another configuration of the device power supply unit 260, as illustrated in FIGS. 7 to 10, a plurality of terminal units 265 electrically connected to the terminal connection unit 240 are formed and coupled to the main body 231. The substrate 261 supporting the metal plate 110 may include one or more wires 263 connecting the LED element 120 and the terminal unit 265 to each other.
여기서 상기 전선(263)은, 합성수지 내에 구리선들이 설치된 사용전선 이외에, 동선, 철선 등 전기전도성 부재이면 모두가 가능하다.Here, the electric wire 263 may be any electric conductive member such as a copper wire or an iron wire, in addition to a used electric wire in which copper wires are installed in a synthetic resin.
특히 상기 전선(263)은, 그 자체에서의 열방출을 위하여 구리, 구리합금 재질이 보다 바람직하며 외면에 절연재질의 코팅없이 형성됨이 보다 바람직하다.In particular, the wire 263 is more preferably copper, copper alloy material for heat dissipation in itself, and more preferably formed without coating of an insulating material on the outer surface.
한편 상기 한 쌍의 금속플레이트(110)의 일단에는 엘이디조명장치가 설치될 구조물, 즉 자동차용 조명기구와의 결합을 위한 소켓부(230)가 결합될 때, 그 타단에는 한 쌍의 금속플레이트(110) 사이의 간격을 안정적을 유지할 수 있도록 하는 간격유지부재(280)가 추가로 설치될 수 있다.Meanwhile, when one structure of the LED lighting device is installed at one end of the pair of metal plates 110, that is, when the socket part 230 for coupling with a vehicle lighting fixture is coupled, the other end of the pair of metal plates ( A gap maintaining member 280 may be additionally installed to maintain the gap between the gaps 110.
상기 간격유지부재(280)는, 한 쌍의 금속플레이트(110) 사이의 간격을 안정적을 유지하는 구성으로서 합성수지, PCB와 같은 절연부재로서 금속플레이트(110)가 삽입될 수 있는 관통공(281)이 형성되어 금속플레이트(110)가 삽입됨으로써 한 쌍의 금속플레이트(110)와 고정결합될 수 있다.The gap maintaining member 280 is a configuration for maintaining a stable gap between the pair of metal plates 110, the through hole 281 into which the metal plate 110 can be inserted as an insulating member, such as a synthetic resin, PCB. The formed metal plate 110 may be inserted and fixedly coupled to the pair of metal plates 110.
한편 상기 한 쌍의 금속플레이트(110)는, 에폭시 도료와 같은 물질 등으로 코팅된 경우 전기적으로 절연되는바 서로 면접하여 설치될 수도 있음은 물론이다.On the other hand, the pair of metal plates 110, if coated with a material such as epoxy paint is electrically insulated bar may be installed to be interviewed with each other.
한편 본 발명의 제1실시예에 따른 엘이디조명장치에 있어서, 엘이디소자(120)의 배치 및 위치는, 대체될 조명기구의 벌브형 전구의 특성에 따라 달라질 수 있다.On the other hand, in the LED lighting apparatus according to the first embodiment of the present invention, the arrangement and position of the LED element 120 may vary depending on the characteristics of the bulb-shaped bulb of the luminaire to be replaced.
구체적으로, 본 발명의 제1실시예에 따른 엘이디조명장치는, 벌브형 전구가 설치되는 자동차의 전조등, 안개등, 방향지시등 및 후미등 중 어느 하나에 설치되며, 엘이디소자(120)는, 도 4a에 도시된 바와 같이, 벌브형 전구가 자동차에 설치되었을 때 벌브형 전구의 발광부분, 즉 필라멘트의 위치에 대응되는 위치에 위치되도록 금속플레이트(110)에 결합될 수 있다.Specifically, the LED lighting apparatus according to the first embodiment of the present invention, is installed in any one of the headlight, fog light, direction indicator and tail light of the vehicle is installed bulb-shaped bulb, the LED element 120 is shown in Figure 4a As shown, when the bulb-type bulb is installed in the vehicle can be coupled to the metal plate 110 to be located at a position corresponding to the position of the light emitting portion, that is, the filament of the bulb-type bulb.
구체적으로 벌브형 전구에서 소켓부(12)로부터 발광부분(11)까지의 거리(l)에 대응되도록, 엘이디소자(120)는, 금속플레이트(110)에서 소켓부(230)로부터 거리(l)을 가지도록 설치될 수 있다.Specifically, in order to correspond to the distance l from the socket portion 12 to the light emitting portion 11 in the bulb bulb, the LED element 120, the distance (l) from the socket portion 230 in the metal plate 110 It can be installed to have.
한편, 본 발명에 따른 엘이디조명장치는, 벌브형 전구가 설치되는 자동차의 전조등, 안개등, 방향지시등 및 후미등 중 어느 하나에 설치될 때, 설치될 조명기구의 발광구조, 발광특성 등에 따라서 측면방향의 발광특성을 높이거나 전면 방향의 발광특성을 높일 필요가 있다.On the other hand, the LED lighting device according to the present invention, when installed in any one of the headlight, fog light, direction indicator light and taillight of the vehicle in which the bulb-type bulb is installed, according to the light emitting structure, the light emission characteristics of the lighting fixture to be installed It is necessary to increase the light emission characteristics or to increase the light emission characteristics in the front direction.
이에 본 발명의 제2실시예 및 제3실시예에 따른 엘이디조명장치는, 제1실시예의 구성에 더하여, 도 7 내지 도 10에 도시된 바와 같이, 엘이디소자(120)가 설치된 설치면부(112)와, 설치면부(112)와 절곡되어 연장되는 절곡면부(113)를 포함하는 하나 이상의 절곡금속플레이트(110-1)를 포함할 수 있다.Accordingly, the LED lighting apparatus according to the second and third embodiments of the present invention, in addition to the configuration of the first embodiment, as shown in Figure 7 to Figure 10, the mounting surface portion 112 is provided with the LED element 120 ) And one or more bent metal plates 110-1 including the bent surface portion 113 that is bent and extended with the installation surface portion 112.
이때 제2실시예로서, 상기 소켓부(230)와의 결합방향을 길이방향으로 할 때, 절곡금속플레이트(110-1)는, 도 7 및 도 8에 도시된 바와 같이, 그 설치면부(112)의 법선이 길이방향과 수직을 이루는, 즉 엘이디소자(120)의 발광면이 측면을 향하는, 하나 이상의 제1절곡금속플레이트를 포함할 수 있다.At this time, as the second embodiment, when the coupling direction with the socket portion 230 in the longitudinal direction, the bent metal plate 110-1, as shown in Figs. 7 and 8, the installation surface portion 112 It may include one or more first bent metal plate perpendicular to the longitudinal direction, that is, the light emitting surface of the LED element 120 toward the side.
또한 제3실시예로서, 상기 소켓부(230)와의 결합방향을 길이방향으로 할 때, 절곡금속플레이트(110-1)는, 그 설치면부(112)의 법선이 길이방향과 평행을 이루는, 즉 엘이디소자(120)의 발광면이 전방을 향하는, 하나 이상의 제2절곡금속플레이트를 포함할 수 있다.Further, as a third embodiment, when the engagement direction with the socket portion 230 in the longitudinal direction, the bent metal plate 110-1, the normal of the mounting surface portion 112 is parallel to the longitudinal direction, that is, The light emitting surface of the LED device 120 may include one or more second bent metal plates facing forward.
한편 상기 금속플레이트(110) 및 엘이디소자(120)는 복수로 구성될 때 그 등가회로는 각 엘이디소자(120)를 기준으로 직렬, 병렬, 직병렬 조합 등 다양한 등가회로의 구성이 가능하다.Meanwhile, when the metal plate 110 and the LED elements 120 are configured in plural, the equivalent circuits may be configured with various equivalent circuits such as a series, parallel, series-parallel combination based on each LED element 120.
여기서 상기 금속플레이트(110)는, 등가회로의 일부분 즉, 엘이디소자(120)의 제1전극 및 제2전극 중 어느 하나의 전극과 통전될 수 있다.Here, the metal plate 110 may be energized with a portion of an equivalent circuit, that is, any one of the first electrode and the second electrode of the LED element 120.
한편 본 발명에 따른 엘이디조명장치는, 엘이디소자가 설치된 금속플레이트를 복수개로 구비하고 각 금속플레이트에 설치된 엘이디소자의 상대위치를 변화시켜 다양한 조명효과를 구현할 수 있다.On the other hand, the LED lighting apparatus according to the present invention, it is possible to implement a variety of lighting effects by providing a plurality of metal plates installed with LED elements and by changing the relative position of the LED elements installed on each metal plate.
이하 제4실시예에 따른 엘이디조명장치에 관하여 도 11 내지 도 15를 참조하여 설명하다. 여기서 제4실시예에 따른 엘이디조명장치는 금속플레이트의 배치 등 일부 구성에서 차이가 있으며 앞서 설명한 제1 내지 제3실시예에서의 구성과 동일하거나 유사한 구성은 편의상 그 설명을 생략한다.Hereinafter, the LED lighting apparatus according to the fourth embodiment will be described with reference to FIGS. 11 to 15. Here, the LED lighting apparatus according to the fourth embodiment is different in some configurations such as the arrangement of the metal plate, and the same or similar components as those in the first to third embodiments described above will be omitted for convenience.
본 발명의 제4실시예에 따른 엘이디조명장치는, 도 11 내지 도 15에 도시된 바와 같이, 엘이디조명장치가 설치될 구조물과의 결합을 위한 소켓부(230)와; 일단이 소켓부(230)에 결합되며 서로 대향되는 표면의 반대면에 제1엘이디소자(120a)가 각각 설치된 한 쌍의 제1금속플레이트(110-5)들과; 한 쌍의 제1금속플레이트(110-5)들 사이에서 한 쌍의 제1금속플레이트(110-5)들과 평행을 이루며 일단이 소켓부(230)에 결합되며 서로 대향되는 표면의 반대면에 제2엘이디소자(120b)가 각각 설치된 한 쌍의 제2금속플레이트(110-6)들과; 한 쌍의 제2금속플레이트(110-6)들 사이에서 한 쌍의 제2금속플레이트(110-6)들과 평행을 이루며 일단이 소켓부(230)에 결합되고, 제2금속플레이트(110-6)과 수직을 이루도록 절곡된 절곡면부(113)을 가지며, 절곡면부(113)에 제3엘이디소자(120c)가 설치된 하나 이상의 제3금속플레이트(110-6)와; 제1 내지 제3금속플레이트들 간의 간격을 유지하도록 제1 내지 제3금속플레이트들의 타단들이 결합되는 간격유지부재(280)를 포함한다.LED lighting device according to a fourth embodiment of the present invention, as shown in Figure 11 to 15, the socket portion 230 for coupling with the structure to be installed LED lighting device; A pair of first metal plates 110-5, one end of which is coupled to the socket part 230 and each of which has a first LED element 120a disposed on opposite surfaces of the surfaces facing each other; Between the pair of first metal plates 110-5 parallel to the pair of first metal plates 110-5, one end of which is coupled to the socket portion 230 and on the opposite surface of the surface facing each other. A pair of second metal plates 110-6 each having a second LED element 120b installed thereon; In parallel with the pair of second metal plates 110-6 between the pair of second metal plates 110-6, one end thereof is coupled to the socket part 230, and the second metal plate 110-6 is parallel to the pair of second metal plates 110-6. At least one third metal plate 110-6 having a bent surface portion 113 bent to be perpendicular to 6) and having a third LED element 120c installed at the bent surface portion 113; And a spacing member 280 to which the other ends of the first to third metal plates are coupled to maintain the spacing between the first to third metal plates.
상기 제1엘이디소자(120a) 및 제2엘이디소자(120b)는, 2개의 광원에 대응되는 위치에 위치되도록 소켓부(280)에 대한 거리가 다르게 설치됨이 바람직하다.The first LED element 120a and the second LED element 120b are preferably provided with different distances from the socket 280 so as to be positioned at positions corresponding to the two light sources.
그리고 상기 제1금속플레이트(110-5)는 내측에 위치된 제2금속플레이트(110-6)에 설치된 제2엘이디소자(120b)가 외측으로 노출될 수 있도록 절개된 절개부(310)가 형성될 수 있다.In addition, the first metal plate 110-5 has a cutout portion 310 formed therein so that the second LED element 120b installed on the second metal plate 110-6 positioned therein can be exposed to the outside. Can be.
또한 상기 엘이디조명장치는, 하나의 전구에 의하여 상향등 및 하향등이 가능하도록 2개의 필라멘트를 가지는 전구를 대신하여 자동차 전조등에 설치될 수 있다.In addition, the LED lighting device may be installed in the headlights of the automobile in place of the bulb having two filaments to enable the upper and lower lights by one bulb.
이때 제1엘이디소자(120a) 및 제2엘이디소자(120b) 중 어느 하나는 상향등에 대응되는 필라멘트의 위치에 위치되며, 다른 하나는 하향등에 대응되는 필라멘트의 위치에 위치될 수 있다.At this time, any one of the first LED element 120a and the second LED element 120b may be located at the position of the filament corresponding to the uplight, and the other may be located at the position of the filament corresponding to the downlight.
또한 하나의 엘이디조명장치에 의하여 상향등 및 하향등이 가능한 구조를 가지는 자동차 전조등은, 하나의 엘이디조명장치에 의한 하향등 및 상향등이 가능하도록 적절한 구조의 반사부재를 포함한다.In addition, the vehicle headlight having a structure that can be up and down by one LED lighting device, includes a reflective member of a suitable structure to enable the down and up lights by one LED lighting device.
그리고 상기 소켓부(230)는, 제1엘이디소자(120a) 및 제2엘이디소자(120b) 중 어느 하나 및 제3엘이디소자(120c)를 직렬 또는 병렬로 연결하는 제1단자(237) 및 제2단자(238)와; 소켓부(230)에 설치되어 제2단자(238)와, 제1엘이디소자(120a) 및 제2엘이디소자(120b) 중 나머지 하나를 직렬로 연결하는 제3단자(239)를 추가로 설치될 수 있다. In addition, the socket part 230 may include a first terminal 237 and a first terminal 237 which connects any one of the first LED element 120a and the second LED element 120b and the third LED element 120c in series or in parallel. Two terminals 238; A third terminal 239 installed in the socket 230 to connect the second terminal 238 and the other of the first LED element 120a and the second LED element 120b in series may be further installed. Can be.
상기와 같은 구성에 의하여 상기 제2단자(238)를 공유함과 아울러 상기 제1단자(237) 및 제3단자(239) 중 적어도 어느 하나에 전원을 연결됨으로써 제1엘이디소자(120a) 및 제2엘이디소자(120b) 각각의 독립적인 온오프가 가능하게 된다.By sharing the second terminal 238 and the power connected to at least one of the first terminal 237 and the third terminal 239 by the configuration as described above, the first LED element (120a) and the first Independent on / off of each of the 2 LED elements 120b is possible.
이에 제1엘이디소자(120a) 및 제2엘이디소자(120b) 중 어느 하나, 예를 들면 제2엘이디소자(120b)와 제3엘이디소자(120c)를 하향등에 대응시키고, 제1엘이디소자(120a) 및 제2엘이디소자(120b) 중 나머지 하나, 예를 들면 제1엘이디소자(120a)를 상향등에 대응시킴으로써 독립적인 온오프에 따라서 상향등의 온오프가 가능하는 등 다양한 조명효과가 가능하다.Accordingly, any one of the first LED element 120a and the second LED element 120b, for example, the second LED element 120b and the third LED element 120c corresponds to a downward direction and the first LED element 120a ) And the second LED element 120b, for example, the first LED element 120a may correspond to an uplight to enable various lighting effects such that the uplight may be turned on or off according to independent on / off.
한편 하나의 엘이디조명장치에 의하여 상향등 및 하향등 기능이 가능한 자동차의 전조등의 경우 반사부재가 상하로 구획되어 상측은 하향등의 역할을 위한 반사부재로 기능하고 하측은 상향등의 역할을 위한 반사부재로 기능한다.On the other hand, in the case of headlights of automobiles capable of functioning high and low light by one LED lighting device, the reflecting member is divided up and down, and the upper side functions as a reflecting member for the role of the lower light and the lower side as a reflecting member for the role of the high light. Function.
그런데, 제1엘이디소자(120a) 및 제2엘이디소자(120b) 중 어느 하나, 예를 들면 제2엘이디소자(120b)와 제3엘이디소자(120c)를 하향등에 대응될 때, 제3엘이디소자(120c)는 발생되는 광이 상측을 향하는 구조를 가져 하향등영역을 향하나 제2엘이디소자(120b)는 소자의 방사각에 따라서 광이 하향등영역 및 상향등영역으로 향하여 하향등 기능시 상향등영역으로 일부 빛이 노출되는 문제점이 있다.However, when one of the first LED element 120a and the second LED element 120b corresponds to the downward direction of the second LED element 120b and the third LED element 120c, for example, the third LED element 120c has a structure in which the generated light is directed upward, and faces the downlight region, but the second LED element 120b is an uplight region when the light functions downward toward the downlight region and the uplight region according to the emission angle of the device. There is a problem that some light is exposed.
이에 본 발명의 제5실시예에 따른 엘이디조명장치는, 도 16 내지 도 17b에 도시된 바와 같이, 제1엘이디소자(120a) 및 제2엘이디소자(120b) 중 하향등에 대응되는 소자, 예를 들면 제2엘이디소자(120b)의 광이 상향등영역으로 조사되는 것을 방지하기 위한 광차단부재(390)를 추가로 포함할 수 있다.Therefore, the LED lighting apparatus according to the fifth embodiment of the present invention, as shown in Figure 16 to 17b, the element corresponding to the down light of the first LED element 120a and the second LED element 120b, for example For example, the second LED device 120b may further include a light blocking member 390 for preventing the light from being irradiated to the upper light region.
상기 광차단부재(390)는, 제1엘이디소자(120a) 및 제2엘이디소자(120b) 중 하향등에 대응되는 소자, 예를 들면 제2엘이디소자(120b)의 광이 상향등영역으로 조사되는 것을 방지하기 위한 구성으로서 다양한 구성이 가능하다.The light blocking member 390 is one of the first LED element 120a and the second LED element 120b that the light corresponding to the downlight, for example, the light of the second LED element 120b is irradiated to the upper light region. Various configurations are possible as the configuration for preventing.
여기서 상기 광차단부재(390)는, 제1엘이디소자(120a) 및 제2엘이디소자(120b) 중 하향등에 대응되는 소자, 예를 들면 제2엘이디소자(120b)의 광이 상향등영역으로 조사되는 것을 방지할 수 있는 크기로 형성된다.Here, the light blocking member 390 is a light of the first LED element 120a and the second LED element 120b corresponding to the downlight, for example, the light of the second LED element 120b is irradiated to the upper light area. It is formed to a size that can prevent it.
또한 상기 광차단부재(390)는, 도 16 내지 도 17b에 도시된 바와 같이, 가장 최외곽에 위치된 금속플레이트(110-5)에 설치됨이 바람직하다.In addition, the light blocking member 390, as shown in Figures 16 to 17b, is preferably installed on the metal plate (110-5) located at the outermost.
또한 상기 광차단부재(390)는, 도 16 내지 도 17b에 도시된 바와 같이, 가장 최외곽에 위치된 금속플레이트(110-5)에 설치됨에 있어서 최외곽에 위치된 금속플레이트(110-5)에 일체화된 구조에서 판상의 플레이트부재에서 일부분이 일정각도, 예를 들면 90° 휘어져 형성될 수 있다.In addition, as shown in FIGS. 16 to 17B, the light blocking member 390 is installed at the outermost metal plate 110-5, and the outermost metal plate 110-5 is disposed. A portion of the plate-like plate member may be formed at an angle, for example, 90 °, in a structure integrated in the plate member.
또한 상기 광차단부재(390)는, 광반사를 최소화하기 위하여 제2엘이디소자(120b)를 향하는 면은 무광처리되는 것이 바람직하며, 흑색으로 도색되는 것이 바람직하다.In addition, the light blocking member 390, in order to minimize the light reflection, the surface facing the second LED element 120b is preferably matte, it is preferably painted in black.
한편 제4실시예 및 제5실시예에 따른 엘이디조명장치는, 제1 내지 제3실시예에서와 같이, 상기 제1 내지 제3엘이디소자(120a, 120b, 120c)는, 제1전극 및 제2전극 중 어느 하나만 제1 내지 제3금속플레이트들 각각과 열전도가 가능하도록 결합될 수 있다.On the other hand, in the LED lighting apparatus according to the fourth embodiment and the fifth embodiment, as in the first to third embodiments, the first to third LED elements 120a, 120b, 120c, the first electrode and the Only one of the two electrodes may be coupled to each of the first to third metal plates to enable thermal conductivity.
또한 제1 내지 제3실시예에서와 같이, 상기 제1 내지 제3금속플레이트들은, 각각 제1 내지 제3엘이디소자(120a, 120b, 120c) 각각의 제1전극 및 제2전극 중 어느 하나만 열전도가 가능하도록 나머지 전극인 열전도가 이루어지지 않는 비접촉전극에 대응되는 위치에 그 접촉을 방지하기 위한 접촉방지수단이 형성될 수 있다.In addition, as in the first to third embodiments, the first to third metal plates may have thermal conductivity of only one of the first electrode and the second electrode of each of the first to third LED elements 120a, 120b, and 120c, respectively. The contact preventing means for preventing the contact may be formed at a position corresponding to the non-contact electrode that is not made the heat conduction, the remaining electrode.
그리고 상기 접촉방지수단은, 제1 내지 제3금속플레이트들 각각에 형성된 관통공 또는 절개부일 수 있다.The contact preventing means may be a through hole or a cutout formed in each of the first to third metal plates.
그리고 상기 비접촉전극은, 다른 엘이디소자의 단자와의 연결 또는 전원공급선과 연결을 위한 전원연결선이 상기 관통공 또는 절개부를 통하여 연결될 수 있다.The non-contact electrode may be connected to a terminal of another LED element or a power supply line for connection with a power supply line through the through hole or cutout.
그리고 상기 접촉방지수단은, 상기 제1 내지 제3금속플레이트들 각각에 형성된 절연부재일 수 있다.The contact preventing means may be an insulating member formed on each of the first to third metal plates.
한편 제1실시예 내지 제5실시예에 따른 엘이디조명장치는, 엘이디소자가 설치된 금속플레이트들 사이의 간격이 커지면서 각 엘이디소자가 미리 설계된 반사갓의 최적의 위치에 위치될 수 없는 문제점이 있다.On the other hand, the LED lighting apparatus according to the first to the fifth embodiment, there is a problem that each LED element can not be positioned at the optimum position of the pre-designed reflection shade while the gap between the metal plate on which the LED element is installed is increased.
특히 제2실시예에 내지 제5실시예의 경우 중심에 위치된 금속플레이트를 기준으로 가장 외측에 위치된 엘이디소자는 미리 설계된 반사갓의 최적의 위치에 위치될 수 없는 문제점이 있다.In particular, in the second to fifth embodiments, the LED element positioned at the outermost side with respect to the metal plate positioned at the center may not be positioned at an optimal position of the predesigned reflection shade.
이하 본 발명의 제6실시예에 따른 엘이디조명장치의 설명에 있어서, 제1실시예와 다른 구성들에 대해서만 설명하고 제1실시예와 동일하거나 유사한 구성들에 대해서는 설명의 편의상 생략한다.In the following description of the LED lighting apparatus according to the sixth embodiment of the present invention, only the components different from the first embodiment will be described, and the same or similar components as those of the first embodiment will be omitted for convenience of description.
본 발명의 제6실시예에 따른 엘이디조명장치는, 도 18 내지 도 21c에 도시된 바와 같이, 제1실시예의 변형으로서, 엘이디소자(120) 및 엘이디소자(120)가 결합된 금속플레이트(110)의 기본구조로 하는 한편, 금속플레이트(110)는, 서로 평행하게 배치되며 서로 마주보는 면의 반대면에 하나 이상의 엘이디소자(120)가 설치된 제1금속플레이트 및 제2금속플레이트를 포함한다.The LED lighting apparatus according to the sixth embodiment of the present invention, as shown in Figure 18 to Figure 21c, as a modification of the first embodiment, the metal plate 110 to which the LED element 120 and the LED element 120 is coupled On the other hand, the metal plate 110 includes a first metal plate and a second metal plate disposed in parallel with each other and one or more LED elements 120 are installed on opposite sides of the surfaces facing each other.
그리고 본 발명의 제6실시예에 따른 엘이디조명장치는, 엘이디소자(120)가 설치된 면 쪽에서 엘이디소자(120)가 노출되도록 제1금속플레이트 및 제2금속플레이트 각각과 간격을 두고 설치되는 한 쌍의 복개금속플레이트(910)들을 포함한다.And the LED lighting apparatus according to the sixth embodiment of the present invention, a pair provided at intervals with each of the first metal plate and the second metal plate so that the LED element 120 is exposed from the surface side where the LED element 120 is installed Cover metal plate 910 of the.
상기 한 쌍의 복개금속플레이트(910)는, 도 21a 및 도 21c에 도시된 바와 같이, 엘이디소자(120)가 설치된 면 쪽에서 엘이디소자(120)가 노출되도록 제1금속플레이트 및 제2금속플레이트 각각과 간격을 두고 설치되는 구성으로서 다양한 구성이 가능하다.As illustrated in FIGS. 21A and 21C, each of the pair of covered metal plates 910 includes a first metal plate and a second metal plate such that the LED elements 120 are exposed from the surface on which the LED elements 120 are installed. Various configurations are possible as the configuration is installed at intervals.
특히 상기 한 쌍의 복개금속플레이트(910)는, 엘이디소자(120)가 설치된 면 쪽에서 엘이디소자(120)가 노출되도록 개구부(911)가 형성될 수 있다.In particular, the pair of covered metal plates 910 may be formed with an opening 911 such that the LED device 120 is exposed from the surface on which the LED device 120 is installed.
상기 개구부(911)는, 엘이디소자(120)가 설치된 면 쪽에서 엘이디소자(120)가 노출되도록 복개금속플레이트(910)에 형성되는 구성으로 홀형태 이외에 절개홈으로 형성되는 등 다양한 구조가 가능하다.The opening 911 is formed in the cover metal plate 910 so that the LED element 120 is exposed from the surface on which the LED element 120 is installed.
한편 상기 한 쌍의 복개금속플레이트(910)는, 제1금속플레이트 및 제2금속플레이트의 전단 또는 후단에 일체로 연결됨으로써 제1금속플레이트 및 제2금속플레이트 각각에 설치된 엘이디소자(120)에서 발생되는 열을 방출하게 된다.Meanwhile, the pair of covered metal plates 910 are connected to the front and rear ends of the first metal plate and the second metal plate and are generated in the LED device 120 installed at each of the first metal plate and the second metal plate. Will release heat.
이때 상기 복개금속플레이트(910) 및 제1금속플레이트 사이의 경계, 복개금속플레이트(910) 및 제2금속플레이트 사이의 경계 부근에 절개선(913)이 형성되어 기판(261)과의 결합을 위한 돌출부(119)가 추가로 형성될 수 있다.In this case, an incision line 913 is formed near the boundary between the cover metal plate 910 and the first metal plate, and the boundary between the cover metal plate 910 and the second metal plate to bond the substrate 261. The protrusion 119 may be further formed.
여기서 상기 기판(261)은, 돌출부(119)가 삽입될 수 있는 하나 이상의 관통공이 형성된다.Here, the substrate 261 is formed with one or more through holes into which the protrusion 119 may be inserted.
상기 돌출부(119)는, 복개금속플레이트(910) 및 제1금속플레이트 사이의 경계, 복개금속플레이트(910) 및 제2금속플레이트 사이의 경계에서 서로 굽어질 때 자연스럽게 형성된다.The protrusions 119 naturally form when bent at each other at the boundary between the covering metal plate 910 and the first metal plate, and at the boundary between the covering metal plate 910 and the second metal plate.
한편 상기 한 쌍의 복개금속플레이트(910)는, 제1금속플레이트 및 제2금속플레이트와 연결된 부분의 반대쪽에는 간격유지부재(280)와의 결합을 위한 돌출부(914)가 형성될 수 있다. 여기서 상기 제1금속플레이트 및 제2금속플레이트 각각에도 간격유지부재(280)와의 결합을 위한 돌출부(915)가 형성될 수 있다.Meanwhile, the pair of covered metal plates 910 may have protrusions 914 formed at opposite sides of the first metal plate and the second metal plate to be coupled to the space keeping member 280. In this case, each of the first metal plate and the second metal plate may have a protrusion 915 for coupling with the spacer 280.
상기 한 쌍의 복개금속플레이트(910)는, 제1금속플레이트 및 제2금속플레이트와 일체로 연결됨으로써 엘이디소자(120)에서 발생되는 열을 보다 효율적으로 방출하여 엘이디소자의 발광특성을 높일 수 있다.The pair of covered metal plates 910 may be integrated with the first metal plate and the second metal plate to more efficiently discharge heat generated from the LED device 120 to increase light emission characteristics of the LED device. .
또한 상기 한 쌍의 복개금속플레이트(910)는, 제1금속플레이트 및 제2금속플레이트와의 간격유지를 위하여 제1금속플레이트 및 제2금속플레이트에서 굽어져 돌출되는 간격유지부(971)의 끝단이 삽입되는 개구부(972)가 형성될 수 있다.In addition, the pair of covered metal plates 910, the end of the gap holding portion (971) protruding bent from the first metal plate and the second metal plate in order to maintain the gap between the first metal plate and the second metal plate. The insertion opening 972 may be formed.
한편 엘이디소자(120)가 설치된 제1금속플레이트 및 제2금속플레이트는, 서로 마주보고 있서 각 엘이디소자(120)에서 발생되는 열이 서로 전달받아 가열효과가 있는바 이를 방지할 필요가 있다.Meanwhile, the first metal plate and the second metal plate on which the LED elements 120 are installed face each other, and heat generated from each of the LED elements 120 is transferred to each other, and thus, a heating effect needs to be prevented.
따라서 상기 제1금속플레이트 및 제2금속플레이트 사이에는 제1금속플레이트 및 제2금속플레이트와 평행하게 설치되는 중간금속플레이트(930)가 추가로 설치될 수 있다.Therefore, an intermediate metal plate 930 installed in parallel with the first metal plate and the second metal plate may be additionally installed between the first metal plate and the second metal plate.
상기 중간금속플레이트(930)는, 제1금속플레이트 및 제2금속플레이트 사이에 설치되어 서로 열이 전달되는 것을 차단하기 위한 부재로서 제1금속플레이트 및 제2금속플레이트와 동일한 재질을 가짐이 바람직하다.The intermediate metal plate 930 is installed between the first metal plate and the second metal plate to block heat transfer from each other, and preferably has the same material as the first metal plate and the second metal plate. .
한편 상기 중간금속플레이트(930)는, 제1금속플레이트 및 제2금속플레이트에서 엘이디소자가 설치된 부분에 대응되어 일부가 절개된 절개부(931)가 형성될 수 있다.Meanwhile, the intermediate metal plate 930 may have a cutout portion 931 in which portions of the intermediate metal plate 930 are cut in correspondence with portions where the LED elements are installed in the first metal plate and the second metal plate.
또한 상기 중간금속플레이트(930)는, 기판(261)에 형성된 관통공에 삽입되어 고정될 수 있도록 하나 이상의 돌출부(939)가 형성될 수 있다.In addition, the intermediate metal plate 930 may be formed with one or more protrusions 939 to be inserted and fixed in the through hole formed in the substrate 261.
또한 상기 제1금속플레이트 및 제2금속플레이트, 복개금속플레이트(910) 및 중간금속플레이트(930)는, 열방출 효과를 극대화하기 위하여 검은색의 에폭시도료와 같은 물질 등으로 검은색으로 코팅되는 것이 바람직하다.In addition, the first metal plate and the second metal plate, the covered metal plate 910 and the intermediate metal plate 930, it is to be coated in black with a material such as black epoxy paint to maximize the heat dissipation effect desirable.
특히 상기 제1금속플레이트, 제2금속플레이트, 복개금속플레이트(910) 및 중간금속플레이트(930)는, 검은색의 에폭시도료를 코팅하여 실험한 결과 열방출효과가 훨씬 높음을 확인하였다.In particular, the first metal plate, the second metal plate, the covered metal plate 910 and the intermediate metal plate 930, a black epoxy coating coating experiments as a result was confirmed that the heat dissipation effect is much higher.
여기서 금속플레이트의 표면에 검은색으로 코팅되는 사항은 제1실시예 내지 제8실시예에도 적용됨은 물론이다.Herein, the matter coated in black on the surface of the metal plate is applied to the first to eighth embodiments, of course.
한편 상기와 같은 구조를 가지는 엘이디조명장치는, 열방출이 원활하지 못한 경우 엘이디소자(120)의 조명효과가 저하되는바 조명효과를 높이기 위하여 팬(940)이 추가로 설치될 수 있다.On the other hand, the LED lighting device having the structure as described above, when the heat dissipation is not smooth, the lighting effect of the LED element 120 is reduced, the fan 940 may be additionally installed to increase the lighting effect.
상기 팬(940)은, 공기유동을 발생시켜 엘이디소자(120)를 냉각하기 위한 구성으로 금속플레이트(110)의 평면과 수직방향으로 설치됨이 바람직하다.The fan 940 is preferably installed in a direction perpendicular to the plane of the metal plate 110 to generate air flow to cool the LED element 120.
이때 상기 금속플레이트(110), 즉 제1금속플레이트, 제2금속플레이트, 복개금속플레이트(910) 및 중간금속플레이트(930)는, 팬(940)의 설치를 위한 개구부(921, 922, 923)들이 형성될 수 있다.In this case, the metal plate 110, that is, the first metal plate, the second metal plate, the covered metal plate 910, and the intermediate metal plate 930 may include openings 921, 922, and 923 for installing the fan 940. Can be formed.
상기 개구부(921, 922, 923)는, 팬(940)의 설치를 위하여 형성되며 홀형태 또는 개구홈형태 등 다양한 형상을 가질 수 있다.The openings 921, 922, and 923 are formed for the installation of the fan 940 and may have various shapes such as a hole shape or an opening groove shape.
또한 상기 팬(940)은, 금속플레이트(110)의 전단 및 후단을 연결하는 길이방향으로 엘이디소자(120)의 전방 또는 후방에 설치되거나, 도 18 내지 도 20에 도시된 바와 같이, 엘이디소자(120)의 하측에 설치될 수 있다.In addition, the fan 940 is installed at the front or rear of the LED element 120 in the longitudinal direction connecting the front and rear ends of the metal plate 110, or as shown in Figure 18 to 20, 120 may be installed on the lower side.
상기와 같은 구성을 가지는 제6실시예에 따른 엘이디조명장치는, 엘이디소자(120)가 설치된 금속플레이트(110), 즉 제1금속플레이트 및 제2금속플레이트 사이의 간격을 최소화하여 엘이디소자(120)가 미리 설계된 반사갓의 최적의 위치에 위치시킬 수 있게 된다.In the LED lighting apparatus according to the sixth exemplary embodiment having the above configuration, the LED device 120 is minimized by minimizing a gap between the metal plate 110 having the LED device 120, that is, the first metal plate and the second metal plate. ) Can be positioned at the optimum position of the predesigned reflector.
이하 본 발명의 제7실시예에 따른 엘이디조명장치의 설명에 있어서, 제1실시예와 다른 구성들에 대해서만 설명하고 제1 및 제6실시예, 특히 제6실시예와 동일하거나 유사한 구성들에 대해서는 설명의 편의상 생략한다.In the following description of the LED lighting apparatus according to the seventh embodiment of the present invention, only the components different from the first embodiment will be described, and the same or similar components as those of the first and sixth embodiments, in particular the sixth embodiment The description is omitted for convenience of description.
본 발명의 제7실시예에 따른 엘이디조명장치는, 도 22 내지 도 25c에 도시된 바와 같이, 제6실시예의 변형으로서, 엘이디소자(120) 및 엘이디소자(120)가 결합된 금속플레이트(110)의 기본구조로 하는 한편, 금속플레이트(110)는, 서로 평행하게 배치되며 서로 마주보는 면의 반대면에 하나 이상의 엘이디소자(120)가 설치된 제1금속플레이트 및 제2금속플레이트를 포함한다.The LED lighting apparatus according to the seventh embodiment of the present invention, as shown in Figures 22 to 25C, as a modification of the sixth embodiment, the metal plate 110 to which the LED element 120 and the LED element 120 is coupled On the other hand, the metal plate 110 includes a first metal plate and a second metal plate disposed in parallel with each other and one or more LED elements 120 are installed on opposite sides of the surfaces facing each other.
그리고 본 발명의 제7실시예에 따른 엘이디조명장치는, 엘이디소자(120)가 설치된 면 쪽에서 제1금속플레이트 및 제2금속플레이트 각각과 일체로 형성되며 'V'자 형태로 굽어진 한 쌍의 방열금속플레이트(950)들을 포함한다.In addition, the LED lighting apparatus according to the seventh embodiment of the present invention is formed integrally with each of the first metal plate and the second metal plate on the side where the LED element 120 is installed and a pair of bent in a 'V' shape. Heat-dissipating metal plates 950.
상기 한 쌍의 방열금속플레이트(950)는, 도 25a 및 도 25c에 도시된 바와 같이, 엘이디소자(120)가 설치된 면 쪽에서 제1금속플레이트 및 제2금속플레이트 각각과 간격을 두고 설치되는 구성으로서 다양한 구성이 가능하다.The pair of heat-dissipating metal plate 950 is, as shown in Figure 25a and 25c, is provided with a spaced apart from each of the first metal plate and the second metal plate on the surface side on which the LED element 120 is installed Various configurations are possible.
특히 상기 한 쌍의 방열금속플레이트(950)는, 엘이디소자(120)가 설치된 면 쪽에서 엘이디소자(120)의 조명을 방해하지 않도록 짧게 형성됨이 바람직하다. In particular, the pair of heat-dissipating metal plate 950 is preferably formed short so as not to interfere with the illumination of the LED element 120 on the side of the LED element 120 is installed.
여기서 상기 방열금속플레이트(950)는 엘이디소자(120)가 결합된 제1금속플레이트 및 제2금속플레이트와 일체로 형성됨으로써 방열효과를 높이기 위한 구성으로 필요에 따라서 제1금속플레이트 및 제2금속플레이트와 밀착되거나 길이가 길게 형성되는 등 다양한 변형이 가능하다.Here, the heat dissipation metal plate 950 is formed integrally with the first metal plate and the second metal plate to which the LED device 120 is coupled, so as to increase the heat dissipation effect, the first metal plate and the second metal plate as necessary. Various modifications are possible, such as being in close contact with or forming a long length.
한편 상기 한 쌍의 방열금속플레이트(950)는, 제1금속플레이트 및 제2금속플레이트의 전단 또는 후단에 일체로 연결됨으로써 제1금속플레이트 및 제2금속플레이트 각각에 설치된 엘이디소자(120)에서 발생되는 열을 방출하게 된다.On the other hand, the pair of heat-dissipating metal plate 950 is generated in the LED element 120 installed on each of the first metal plate and the second metal plate by being integrally connected to the front or rear ends of the first metal plate and the second metal plate. Will release heat.
이때 상기 방열금속플레이트(950) 및 제1금속플레이트 사이의 경계, 방열금속플레이트(950) 및 제2금속플레이트 사이의 경계 부근에 절개선(953)이 형성되어 기판(261)과의 결합을 위한 돌출부(119)가 추가로 형성될 수 있다.In this case, an incision line 953 is formed near the boundary between the heat-dissipating metal plate 950 and the first metal plate, and the boundary between the heat-dissipating metal plate 950 and the second metal plate to bond the substrate 261. The protrusion 119 may be further formed.
상기 돌출부(119)는, 방열금속플레이트(950) 및 제1금속플레이트 사이의 경계, 방열금속플레이트(950) 및 제2금속플레이트 사이의 경계에서 서로 굽어질 때 자연스럽게 형성된다.The protrusion 119 is naturally formed when bent to each other at the boundary between the heat dissipation metal plate 950 and the first metal plate, and the boundary between the heat dissipation metal plate 950 and the second metal plate.
상기 돌출부(119)는, 금속플레이트(110)를 지지하는 한편 단자연결부(240)와 결합되는 기판(261)에 삽입되어 고정될 수 있다.The protrusion 119 may be inserted into and fixed to the substrate 261 that supports the metal plate 110 and is coupled to the terminal connector 240.
한편 상기 절개선(953) 및 돌출부(119)는, 하나만 형성될 수 있으나, 도 22 내지 도 25c에 도시된 바와 같이, 2개로 형성되어 기판(261) 등에 보다 안정적으로 지지고정될 수 있다.Meanwhile, only one cut line 953 and one protrusion 119 may be formed, but as shown in FIGS. 22 to 25C, two cut lines 953 and the protrusion 119 may be more stably supported and fixed to the substrate 261.
상기 한 쌍의 방열금속플레이트(950)는, 제1금속플레이트 및 제2금속플레이트와 일체로 연결됨으로써 엘이디소자(120)에서 발생되는 열을 보다 효율적으로 방출하여 엘이디소자의 발광특성을 높일 수 있다.The pair of heat-dissipating metal plates 950 may be integrally connected with the first metal plate and the second metal plate to more efficiently discharge heat generated from the LED device 120 to increase light emission characteristics of the LED device. .
한편 엘이디소자(120)가 설치된 제1금속플레이트 및 제2금속플레이트는, 서로 마주보고 있어 각 엘이디소자(120)에서 발생되는 열이 서로 전달받아 가열효과가 있는바 이를 방지할 필요가 있다.Meanwhile, the first metal plate and the second metal plate on which the LED elements 120 are installed face each other, and heat generated from each of the LED elements 120 is transferred to each other, and thus a heating effect needs to be prevented.
따라서 상기 제1금속플레이트 및 제2금속플레이트 사이에는 제1금속플레이트 및 제2금속플레이트와 평행하게 설치되는 중간금속플레이트(930)가 추가로 설치될 수 있다.Therefore, an intermediate metal plate 930 installed in parallel with the first metal plate and the second metal plate may be additionally installed between the first metal plate and the second metal plate.
상기 중간금속플레이트(930)는, 제1금속플레이트 및 제2금속플레이트 사이에 설치되어 서로 열이 전달되는 것을 차단하기 위한 부재로서 제1금속플레이트 및 제2금속플레이트와 동일한 재질을 가짐이 바람직하다.The intermediate metal plate 930 is installed between the first metal plate and the second metal plate to block heat transfer from each other, and preferably has the same material as the first metal plate and the second metal plate. .
한편 상기 중간금속플레이트(930)는, 제1금속플레이트 및 제2금속플레이트에서 엘이디소자가 설치된 부분에 대응되어 일부가 절개된 절개부(931)가 형성될 수 있다.Meanwhile, the intermediate metal plate 930 may have a cutout portion 931 in which portions of the intermediate metal plate 930 are cut in correspondence with portions where the LED elements are installed in the first metal plate and the second metal plate.
그리고 상기 제1금속플레이트 및 제2금속플레이트, 방열금속플레이트(950) 및 중간금속플레이트(930)는, 열방출 효과를 극대화하기 위하여 검은색의 에폭시도료와 같은 물질 등으로 검은색으로 코팅되는 것이 바람직하다.The first metal plate and the second metal plate, the heat-dissipating metal plate 950 and the intermediate metal plate 930 are coated in black with a material such as black epoxy paint to maximize the heat dissipation effect. desirable.
특히 상기 제1금속플레이트, 제2금속플레이트, 방열금속플레이트(950) 및 중간금속플레이트(930)는, 검은색의 에폭시도료를 코팅하여 실험한 결과 열방출효과가 훨씬 높음을 확인하였다.In particular, the first metal plate, the second metal plate, the heat-dissipating metal plate 950 and the intermediate metal plate 930, the coating of black epoxy paints, the experiment was confirmed that the heat dissipation effect is much higher.
여기서 금속플레이트의 표면에 검은색으로 코팅되는 사항은 제1실시예 내지 제8실시예에도 적용됨은 물론이다.Herein, the matter coated in black on the surface of the metal plate is applied to the first to eighth embodiments, of course.
한편 상기와 같은 구조를 가지는 엘이디조명장치는, 열방출이 원활하지 못한 경우 엘이디소자(120)의 조명효과가 저하되는바 조명효과를 높이기 위하여 팬(940)이 추가로 설치될 수 있다.On the other hand, the LED lighting device having the structure as described above, when the heat dissipation is not smooth, the lighting effect of the LED element 120 is reduced, the fan 940 may be additionally installed to increase the lighting effect.
상기 팬(940)은, 공기유동을 발생시켜 엘이디소자(120)를 냉각하기 위한 구성으로 금속플레이트(110)의 평면과 수직방향으로 설치됨이 바람직하다.The fan 940 is preferably installed in a direction perpendicular to the plane of the metal plate 110 to generate air flow to cool the LED element 120.
이때 상기 금속플레이트(110), 즉 제1금속플레이트, 제2금속플레이트, 방열금속플레이트(950) 및 중간금속플레이트(930)는, 팬(940)의 설치를 위한 개구부(921, 922, 923)들이 형성될 수 있다.In this case, the metal plate 110, that is, the first metal plate, the second metal plate, the heat-dissipating metal plate 950, and the intermediate metal plate 930 are openings 921, 922, and 923 for installing the fan 940. Can be formed.
상기 개구부(921, 922, 923)는, 팬(940)의 설치를 위하여 형성되며 홀형태 또는 개구홈 형태 등 다양한 형상을 가질 수 있다.The openings 921, 922, and 923 are formed for the installation of the fan 940 and may have various shapes such as a hole shape or an opening groove shape.
또한 상기 팬(940)은, 금속플레이트(110)의 전단 및 후단을 연결하는 길이방향으로 엘이디소자(120)의 전방 또는 후방에 설치되거나, 도 22 내지 도 25c에 도시된 바와 같이, 엘이디소자(120)의 하측에 설치될 수 있다.In addition, the fan 940 is installed at the front or rear of the LED element 120 in the longitudinal direction connecting the front and rear ends of the metal plate 110, or as shown in Figs. 22 to 25C, 120 may be installed on the lower side.
한편, 본 발명의 제7실시예의 경우, 엘이디소자(120)가 2개 설치된 예를 도시한 것으로서, 사용되는 반사갓의 특성에 맞춰 그 설치숫자 및 위치는 다양하게 설정될 수 있다.On the other hand, in the seventh embodiment of the present invention, it shows an example in which two LED elements 120 are installed, the number and location of the installation may be variously set according to the characteristics of the reflection shade used.
또한 상기 엘이디소자(120)의 전극 중 금속플레이트(110)에 결합되지 않은 전극은 후술하는 금속플레이트(110)의 제조과정에서 엘이디소자(120)의 부착 후 금속플레이트(110)로부터 분리되는 보조부재(960) 및 보조부재(960)에 연결된 전원연결선(미도시)에 의하여 단자연결부(240)에 또는 기판(261)을 통하여 단자연결부(240)에 연결된다.In addition, the electrode which is not coupled to the metal plate 110 among the electrodes of the LED element 120 is an auxiliary member that is separated from the metal plate 110 after the attachment of the LED element 120 in the manufacturing process of the metal plate 110 to be described later The power supply line (not shown) connected to the 960 and the auxiliary member 960 is connected to the terminal connector 240 or the terminal connector 240 through the substrate 261.
상기와 같은 구성을 가지는 제7실시예에 따른 엘이디조명장치는, 엘이디소자(120)가 설치된 금속플레이트(110), 즉 제1금속플레이트 및 제2금속플레이트 사이의 간격을 최소화하여 엘이디소자(120)가 미리 설계된 반사갓의 최적의 위치에 위치시킬 수 있게 된다.In the LED lighting apparatus according to the seventh exemplary embodiment having the above configuration, the LED device 120 is minimized by minimizing a gap between the metal plate 110 on which the LED device 120 is installed, that is, the first metal plate and the second metal plate. ) Can be positioned at the optimum position of the predesigned reflector.
특히 제7실시예에 따른 엘이디조명장치는, 하나의 전구에 의하여 상향등 및 하향등이 가능하도록 2개의 필라멘트를 가지는 전구를 대신하여 자동차 전조등에 설치될 수 있다.In particular, the LED lighting apparatus according to the seventh embodiment may be installed in the headlight of the automobile in place of the bulb having two filaments to enable the up and down light by one bulb.
즉, 제7실시예에 따른 엘이디조명장치는, 하나의 전구에 의하여 상향등 및 하향등이 가능하도록 2개의 필라멘트를 가지는 전구를 대신하여 자동차 전조등에 설치되며, 상기 제1엘이디소자(120a) 및 상기 제2엘이디소자(120b) 중 어느 하나는 상향등에 대응되는 필라멘트의 위치에 위치되며, 다른 하나는 하향등에 대응되는 필라멘트의 위치에 위치될 수 있다. 이때 상기 제1금속플레이트 및 제2금속플레이트 각각에는 제1엘이디소자(120a) 및 상기 제2엘이디소자(120b) 2개의 엘이디소자가 설치된다.That is, the LED lighting apparatus according to the seventh embodiment is installed in a vehicle headlight instead of a light bulb having two filaments so as to enable up and down light by one light bulb, and the first LED element 120a and the One of the second LED elements 120b may be positioned at the position of the filament corresponding to the uplight, and the other may be positioned at the position of the filament corresponding to the downlight. At this time, each of the first LED plate and the second metal plate is provided with two LED elements of the first LED element 120a and the second LED element 120b.
상기 제1엘이디소자(120a) 및 제2엘이디소자(120b)는, 2개의 광원에 대응되는 위치에 위치되도록 소켓부(230)에 대한 거리가 다르게 제1금속플레이트 및 제2금속플레이트 각각에서 설치됨이 바람직하다.The first LED element 120a and the second LED element 120b are installed in the first metal plate and the second metal plate, respectively, at different distances from the socket part 230 so as to be positioned at positions corresponding to the two light sources. This is preferred.
즉, 상기 제1엘이디소자(120a) 및 제2엘이디소자(120b) 중 어느 하나는 상향등에 대응되는 필라멘트의 위치에 위치되며, 다른 하나는 하향등에 대응되는 필라멘트의 위치에 위치될 수 있다.That is, any one of the first LED element 120a and the second LED element 120b may be located at the position of the filament corresponding to the uplight, and the other may be positioned at the position of the filament corresponding to the downlight.
또한 하나의 엘이디조명장치에 의하여 상향등 및 하향등이 가능한 구조를 가지는 자동차 전조등은, 하나의 엘이디조명장치에 의한 하향등 및 상향등이 가능하도록 적절한 구조의 광차단부재 또는 반사부재를 포함할 수 있다.In addition, the vehicle headlight having a structure that can be up and down by one LED lighting device, may include a light blocking member or a reflective member of a suitable structure to enable the down and up lights by one LED lighting device.
이하 본 발명의 제8실시예에 따른 엘이디조명장치의 설명에 있어서, 제1실시예와 다른 구성들에 대해서만 설명하고 제1실시예 내지 제7실시예, 특히 제7실시예와 동일하거나 유사한 구성들에 대해서는 설명의 편의상 생략한다.In the following description of the LED lighting apparatus according to the eighth embodiment of the present invention, only the components different from the first embodiment will be described, and the same or similar configuration as the first to seventh embodiments, in particular the seventh embodiment These are omitted for convenience of explanation.
본 발명의 제8실시예에 따른 엘이디조명장치는, 도 26 내지 도 32에 도시된 바와 같이, 제7실시예의 변형으로서, 엘이디소자(120) 및 엘이디소자(120)가 결합된 금속플레이트(110)의 기본구조로 하는 한편, 금속플레이트(110)는, 서로 평행하게 배치되며 서로 마주보는 면의 반대면에 하나 이상의 엘이디소자(120)가 설치된 제1금속플레이트(110-a) 및 제2금속플레이트(110-b)를 포함한다.In the LED lighting apparatus according to the eighth embodiment of the present invention, as shown in FIGS. 26 to 32, as a modification of the seventh embodiment, the LED device 120 and the LED device 120 are combined with the metal plate 110. On the other hand, the metal plate 110 is arranged in parallel with each other, the first metal plate (110-a) and the second metal is provided with at least one LED element 120 on the opposite side of the surface facing each other Plate 110-b.
그리고 본 발명의 제8실시예에 따른 엘이디조명장치는, 엘이디소자(120)가 설치된 면 쪽에서 제1금속플레이트(110-a) 및 제2금속플레이트(110-b) 각각과 일체로 형성되며 'U'자 형태로 굽어진 한 쌍의 방열금속플레이트(950)들을 포함한다.In addition, the LED lighting apparatus according to the eighth embodiment of the present invention is formed integrally with each of the first metal plate 110-a and the second metal plate 110-b on the side where the LED element 120 is installed. It includes a pair of heat-radiating metal plates 950 bent in the U 'shape.
상기 제1금속플레이트(110-a) 및 제2금속플레이트(110-b)는, 앞서 설명한 제1실시예 내지 제7실시예의 금속플레이트와 유사한 구성으로서, 서로 마주보는 면을 내측면으로 하고 그 반대면을 외측면으로 할 때, 엘이디소자(120)는, 외측면에 하나 이상으로 설치될 수 있다.The first metal plate 110-a and the second metal plate 110-b have a structure similar to that of the metal plates of the first to seventh embodiments described above. When the opposite side is the outer side, the LED element 120 may be provided in one or more on the outer side.
그리고 제1금속플레이트(110-a) 및 제2금속플레이트(110-b) 각각은, 엘이디소자(120)에서 발광되는 빛을 하측 또는 상측으로 향하는 것을 방지하기 위하여 광이 차단될 엘이디소자(120)의 직상방 및 직하방 중 어느 한쪽에 설치되는 광차단부(975, 976)가 결합될 수 있다.Each of the first metal plate 110-a and the second metal plate 110-b includes an LED element 120 to block light to prevent the light emitted from the LED element 120 from being directed downward or upward. The light blocking portions 975 and 976 installed at either one of the upper side and the lower side of) may be combined.
상기 광차단부(975, 976)는, 엘이디소자(120)에서 발광되는 빛을 하측 또는 상측으로 향하는 것을 방지하기 위하여 광이 차단될 엘이디소자(120)의 직상방 및 직하방 중 어느 한쪽에 설치되는 구성으로 다양한 구성이 가능하다.The light blocking portions 975 and 976 are installed on either one of the upper and lower portions of the LED element 120 to be blocked to prevent the light emitted from the LED element 120 from being directed downward or upward. Various configurations are possible with the configuration.
특히 상기 광차단부(975, 976)는, 그 제조의 편의를 위하여 제1금속플레이트(110-a) 및 제2금속플레이트(110-b)의 형성시 일체로 형성될 수 있으며 그 차단효과를 높이기 위하여, 90°등 적절한 각도로 굽혀질 수 있다.In particular, the light blocking portions 975 and 976 may be integrally formed at the time of forming the first metal plate 110-a and the second metal plate 110-b for the convenience of manufacture thereof. To increase, it can be bent at an appropriate angle such as 90 °.
여기서 상기 광차단부(975, 976)는, 제1금속플레이트(110-a) 및 제2금속플레이트(110-b)와 일체로 형성되는 대신 별도부재로서 접착제 등에 의하여 결합될 수 있음은 물론이다. Here, the light blocking portions 975 and 976 may be combined with an adhesive or the like as a separate member instead of being formed integrally with the first metal plate 110-a and the second metal plate 110-b. .
또한 상기 광차단부(975, 976)는, 광차단효과에 더하여 반사효과를 고려하여 검은색 도료가 코팅되지 않거나, 반사율이 높은 재질의 물질이 코팅 또는 결합될 수 있다.In addition, the light blocking parts 975 and 976 may not be coated with a black paint or a material having a high reflectance in consideration of a reflection effect in addition to the light blocking effect.
또한 상기 광차단부(975, 976)는, 제1금속플레이트(110-a) 및 제2금속플레이트(110-b)와 일체로 형성될 때 굽힘이 용이하도록 다수개의 관통공들이 형성될 수 있다.In addition, the light blocking portions 975 and 976 may be formed with a plurality of through holes to bend easily when integrally formed with the first metal plate 110-a and the second metal plate 110-b. .
한편 상기 제1금속플레이트(110-a) 및 제2금속플레이트(110-b)에 엘이디소자(120)가 2개 이상으로 설치된 경우, 적어도 일부의 엘이디소자(120b)에 대해서만 광차단부(975, 976)가 설치될 수 있다.Meanwhile, when two or more LED devices 120 are installed on the first metal plate 110-a and the second metal plate 110-b, the light blocking unit 975 is provided only for at least some of the LED devices 120b. 976 may be installed.
특히 상기 제1금속플레이트(110-a) 및 제2금속플레이트(110-b)에 엘이디소자(120)가 2개가 설치된 경우, 하나, 예를 들면, 소켓부(230)로부터 먼 쪽의 엘이디소자(120b)에 대해서만 광차단부(975, 976)가 설치될 수 있다.In particular, when two LED elements 120 are installed in the first metal plate 110-a and the second metal plate 110-b, one LED element, for example, is located far from the socket portion 230. Light blocking portions 975 and 976 may be provided only for the 120b.
상기 한 쌍의 방열금속플레이트(950)는, 도 29a 및 도 29c에 도시된 바와 같이, 엘이디소자(120)가 설치된 면 쪽에서 제1금속플레이트(110-a) 및 제2금속플레이트(110-b) 각각과 간격을 두고 설치되는 구성으로서 다양한 구성이 가능하다.As shown in FIGS. 29A and 29C, the pair of heat-dissipating metal plates 950 may include a first metal plate 110-a and a second metal plate 110-b on a surface where the LED element 120 is installed. A variety of configurations are possible as the components are installed at intervals from each other.
특히 상기 한 쌍의 방열금속플레이트(950)는, 엘이디소자(120)가 설치된 면 쪽에서 엘이디소자(120)의 조명을 방해하지 않도록 짧게 형성됨이 바람직하다. In particular, the pair of heat-dissipating metal plate 950 is preferably formed short so as not to interfere with the illumination of the LED element 120 on the side of the LED element 120 is installed.
한편 상기 한 쌍의 방열금속플레이트(950)는, 제1금속플레이트(110-a) 및 제2금속플레이트(110-b)의 전단 또는 후단에 일체로 연결됨으로써 제1금속플레이트(110-a) 및 제2금속플레이트(110-b) 각각에 설치된 엘이디소자(120)에서 발생되는 열을 방출하게 된다.On the other hand, the pair of heat-dissipating metal plate 950 is connected to the front end or the rear end of the first metal plate 110-a and the second metal plate 110-b by being integrally connected to the first metal plate 110-a. And heat generated from the LED elements 120 installed on the second metal plates 110-b, respectively.
이때 상기 방열금속플레이트(950) 및 제1금속플레이트(110-a) 사이의 경계, 방열금속플레이트(950) 및 제2금속플레이트(110-b) 사이의 경계 부근에 절개선(953)이 형성되어 기판(261)에 삽입되는 하나 이상의 돌출부(119)가 추가로 형성될 수 있다.In this case, an incision line 953 is formed near the boundary between the heat dissipating metal plate 950 and the first metal plate 110-a and the boundary between the heat dissipating metal plate 950 and the second metal plate 110-b. One or more protrusions 119 may be further formed to be inserted into the substrate 261.
상기 돌출부(119)는, 방열금속플레이트(950) 및 제1금속플레이트(110-a) 사이의 경계, 방열금속플레이트(950) 및 제2금속플레이트(110-b) 사이의 경계에서 서로 굽어질 때 자연스럽게 형성된다.The protrusions 119 may be bent at each other at the boundary between the heat dissipating metal plate 950 and the first metal plate 110-a, and at the boundary between the heat dissipating metal plate 950 and the second metal plate 110-b. When it is formed naturally.
상기 돌출부(119)는, 금속플레이트(110)를 지지하는 한편 단자연결부(240)와 결합되는 기판(261)에 삽입되어 고정될 수 있다.The protrusion 119 may be inserted into and fixed to the substrate 261 that supports the metal plate 110 and is coupled to the terminal connector 240.
특히 상기 돌출부(119)는, 전원연결선(250)에 연결되어 엘이디소자(120)에 전원을 공급하는 연결단자로서 활용될 수 있다.In particular, the protrusion 119 may be used as a connection terminal connected to the power connection line 250 to supply power to the LED element 120.
한편 상기 절개선(953) 및 돌출부(119)는, 하나 이상 즉, 2개 이상으로 형성될 수 있다.Meanwhile, one or more incision lines 953 and protrusions 119 may be formed.
상기 한 쌍의 방열금속플레이트(950)는, 각각 제1금속플레이트(110-a) 및 제2금속플레이트(110-b)와 일체로 연결됨으로써 엘이디소자(120)에서 발생되는 열을 보다 효율적으로 방출하여 엘이디소자의 발광특성을 높일 수 있다.The pair of heat dissipation metal plates 950 are connected to the first metal plate 110-a and the second metal plate 110-b, respectively, so that the heat generated from the LED element 120 may be more efficiently. By emitting the light emitting characteristics of the LED device can be improved.
한편 상기 한 쌍의 방열금속플레이트(950)는, 각각 제1금속플레이트(110-a) 및 제2금속플레이트(110-b)와 일체로 연결됨에 있어서, 도 26, 도 28, 도 29a 내지 도 29c에 도시된 바와 같이, 두 군데에서 굽어져 기판(261)과 면접촉되는 면접촉부분(958)이 형성될 수 있다.Meanwhile, the pair of heat-dissipating metal plates 950 are connected to the first metal plate 110-a and the second metal plate 110-b, respectively, in FIGS. 26, 28, and 29a to 29a. As shown in 29c, a surface contact portion 958 may be formed in two places to be in surface contact with the substrate 261.
상기 면접촉부분(958)은, 한 쌍의 방열금속플레이트(950) 각각이 제1금속플레이트(110-a) 및 제2금속플레이트(110-b)와 일체로 연결되는 부분으로서 기판(261)과 면접촉됨으로써 제1금속플레이트(110-a) 및 제2금속플레이트(110-b)가 기판(261)에 안정적으로 결합될 수 있다.The surface contact portion 958 is a portion in which each of the pair of heat-dissipating metal plates 950 is integrally connected to the first metal plate 110-a and the second metal plate 110-b. Surface contact with the first metal plate 110-a and the second metal plate 110-b may be stably coupled to the substrate 261.
특히 상기 면접촉부분(958)은, 나사공(957)이 형성되어 나사(미도시)가 관통되어 기판(261) 및 소켓(260) 중 적어도 어느 하나에 나사결합될 수 있다.In particular, the surface contact portion 958 may have a screw hole 957 formed therein so that a screw (not shown) may penetrate and be screwed to at least one of the substrate 261 and the socket 260.
상기와 같은 나사결합에 의하여, 제1금속플레이트(110-a) 및 제2금속플레이트(110-b)가 기판(261) 및 소켓(260) 중 적어도 어느 하나를 기준으로 미리 설계된 각도로 설치됨으로써 엘이디소자(120)가 미리 설계된 위치에 위치될 수 있도록 한다.By the screw coupling as described above, the first metal plate 110-a and the second metal plate 110-b are installed at a predetermined angle based on at least one of the substrate 261 and the socket 260. The LED element 120 may be positioned in a predesigned position.
한편 상기 한 쌍의 방열금속플레이트(950)는, 제1금속플레이트(110-a) 및 제2금속플레이트(110-b) 각각과 간격을 두고 설치됨이 바람직하나, 그 끝단이 제1금속플레이트(110-a) 및 제2금속플레이트(110-b)의 표면에 가깝게 굽어지거나 닿아도 무방하다.Meanwhile, the pair of heat dissipating metal plates 950 may be installed at intervals from each of the first metal plate 110-a and the second metal plate 110-b, but the ends thereof may be disposed at the first metal plate ( It may be bent or touched close to the surface of the 110-a) and the second metal plate (110-b).
한편 엘이디소자(120)가 설치된 제1금속플레이트(110-a) 및 제2금속플레이트(110-b)는, 서로 마주보고 있어 각 엘이디소자(120)에서 발생되는 열이 서로 전달받아 가열효과가 있는바 이를 방지할 필요가 있다.On the other hand, the first metal plate 110-a and the second metal plate 110-b provided with the LED elements 120 face each other, so that the heat generated from each of the LED elements 120 is transferred to each other, thereby providing a heating effect. It is necessary to prevent this.
따라서 상기 제1금속플레이트(110-a) 및 제2금속플레이트(110-b) 사이에는 제1금속플레이트(110-a) 및 제2금속플레이트(110-b)와 평행하게 설치되는 중간금속플레이트(930)가 추가로 설치될 수 있다.Therefore, an intermediate metal plate installed in parallel with the first metal plate 110-a and the second metal plate 110-b between the first metal plate 110-a and the second metal plate 110-b. 930 may be further installed.
상기 중간금속플레이트(930)는, 제1금속플레이트(110-a) 및 제2금속플레이트(110-b) 사이에 설치되어 서로 열이 전달되는 것을 차단하기 위한 부재로서 제1금속플레이트(110-a) 및 제2금속플레이트(110-b)와 동일한 재질을 가짐이 바람직하다.The intermediate metal plate 930 is installed between the first metal plate 110-a and the second metal plate 110-b to block the transfer of heat to each other. It is preferable to have the same material as a) and the second metal plate 110-b.
한편 상기 중간금속플레이트(930)는, 제1금속플레이트(110-a) 및 제2금속플레이트(110-b)에서 엘이디소자(120)가 설치된 부분에 대응되어 일부가 절개된 절개부(931)가 형성될 수 있다.Meanwhile, the intermediate metal plate 930 corresponds to a portion in which the LED elements 120 are installed in the first metal plate 110-a and the second metal plate 110-b, and a portion thereof is partially cut out 931. Can be formed.
구체적으로, 상기 절개부(931)는, 제1금속플레이트(110-a) 및 제2금속플레이트(110-b) 중 엘이디소자(120)가 설치된 부분 중 적어도 일부의 외곽선과 동일한 외곽선을 가지도록 형성될 수 있다.Specifically, the cutout 931 may have the same outline as the outline of at least some of the portions in which the LED elements 120 are installed among the first metal plate 110-a and the second metal plate 110-b. Can be formed.
또한 상기 중간금속플레이트(930)는, 엘이디소자(120)가 미리 설계된 반사갓의 최적의 위치에 위치될 수 있도록 제1금속플레이트(110-a) 및 제2금속플레이트(110-b)의 내측면과 밀착됨이 바람직하다.In addition, the intermediate metal plate 930 may include an inner surface of the first metal plate 110-a and the second metal plate 110-b so that the LED element 120 may be positioned at an optimal position of the predesigned reflection shade. It is preferable to be in close contact with.
또한 상기 중간금속플레이트(930)는, 제1금속플레이트(110-a) 및 제2금속플레이트(110-b)의 내측면과의 밀착결합시 내열성이 높은 접착물질에 의하여 접착될 수 있다.In addition, the intermediate metal plate 930 may be adhered by an adhesive material having high heat resistance when in close contact with inner surfaces of the first metal plate 110-a and the second metal plate 110-b.
또한 상기 중간금속플레이트(930)는, 제1금속플레이트(110-a) 및 제2금속플레이트(110-b)의 내측면과 밀착결합된 상태에서 기판(261)에 형성된 관통공(261b)에 삽입되는 돌출부(939)가 형성됨이 바람직하다.In addition, the intermediate metal plate 930 is formed in the through hole 261b formed in the substrate 261 in close contact with the inner surfaces of the first metal plate 110-a and the second metal plate 110-b. Preferably, the protrusion 939 to be inserted is formed.
상기 돌출부(939)는, 기판(261)에 형성된 관통공(261b)에 삽입됨으로써 제1금속플레이트(110-a) 및 제2금속플레이트(110-b)의 내측면과 밀착결합된 중간금속플레이트(930)가 기판(261)에 안정적으로 지지될 수 있도록 한다.The protruding portion 939 is inserted into the through hole 261b formed in the substrate 261, so that the protrusion 939 is in close contact with the inner surfaces of the first metal plate 110-a and the second metal plate 110-b. The 930 may be stably supported by the substrate 261.
그리고 상기 관통공(261b)은, 플레이트 형상의 돌출부(939)가 삽입될 수 있도록 슬롯형상으로 형성됨이 바람직하다.In addition, the through hole 261b is preferably formed in a slot shape so that the protrusion 939 having a plate shape can be inserted therein.
한편 상기 제1금속플레이트(110-a) 및 제2금속플레이트(110-b), 방열금속플레이트(950) 및 중간금속플레이트(930)는, 열방출 효과를 극대화하기 위하여 검은색의 에폭시도료와 같은 물질 등으로 검은색으로 코팅되는 것이 바람직하다.Meanwhile, the first metal plate 110-a and the second metal plate 110-b, the heat dissipating metal plate 950, and the intermediate metal plate 930 may be formed of a black epoxy paint to maximize heat dissipation effect. It is preferable to coat black with the same material.
특히 상기 제1금속플레이트(110-a), 제2금속플레이트(110-b), 방열금속플레이트(950) 및 중간금속플레이트(930)는, 검은색의 에폭시도료를 코팅하여 실험한 결과 열방출효과가 훨씬 높음을 확인하였다.In particular, the first metal plate (110-a), the second metal plate (110-b), the heat-dissipating metal plate (950) and the intermediate metal plate (930), the heat dissipation as a result of experiments by coating a black epoxy paint The effect was found to be much higher.
여기서 금속플레이트의 표면에 검은색으로 코팅되는 사항은 제1실시예 내지 제8실시예에도 적용됨은 물론이다.Herein, the matter coated in black on the surface of the metal plate is applied to the first to eighth embodiments, of course.
한편 상기 제1금속플레이트(110-a), 제2금속플레이트(110-b) 및 중간금속플레이트(930)는, 기판(261)과 결합되는 반대쪽 끝단에서 전방쪽으로의 광을 차단하기 위하여 광차단부재(973)이 추가로 결합될 수 있다.Meanwhile, the first metal plate 110-a, the second metal plate 110-b, and the intermediate metal plate 930 block light in order to block light toward the front side from the opposite end coupled to the substrate 261. Member 973 may be further coupled.
상기 광차단부재(973)은, 엘이디소자(120)의 광이 전방으로 직접 조사되는 것을 차단하는 등 다양하게 활용될 수 있다.The light blocking member 973 may be used in various ways, such as to block the light of the LED device 120 from being directly irradiated to the front.
상기 기판(261)은, 제1실시예 내지 제7실시예의 구성과 유사하다.The substrate 261 is similar in construction to those of the first to seventh embodiments.
구체적으로, 상기 기판(261)은, 소켓(230)에 결합될 수 있는 구조를 가지며, 소켓(230)과의 결합을 위한 하나 이상의 나사공(261e)이 형성될 수 있다.In detail, the substrate 261 may have a structure that may be coupled to the socket 230, and one or more screw holes 261e may be formed to be coupled to the socket 230.
또한, 상기 기판(261)은, 중간금속플레이트(930)의 돌출부(939)가 삽입되는 관통공(261b)이 형성될 수 있다.In addition, the substrate 261 may have a through hole 261b into which the protrusion 939 of the intermediate metal plate 930 is inserted.
또한 상기 기판(261)은, 면접촉부분(958)에 형성된 나사공(957)을 관통하는 나사와 나사결합되는 하나 이상의 나사공(261c)이 형성될 수 있다.In addition, the substrate 261 may be formed with one or more screw holes 261c that are screwed with screws passing through the screw holes 957 formed in the surface contact portion 958.
또한 상기 기판(261)은, 앞서 설명한 돌출부(119)가 삽입되는 삽입공(261a)이 형성될 수 있다.In addition, the substrate 261 may include an insertion hole 261a into which the protrusion 119 described above is inserted.
상기 삽입공(261a)은, 면접촉부분(958)에 형성된 돌출부(119)가 삽입되는 구성으로 돌출부(119)가 삽입될 수 있는 구조이면 어떠한 구조도 가능하다.The insertion hole 261a may have any structure as long as the protrusion 119 is inserted into the protrusion 119 formed in the surface contact portion 958.
아울러, 상기 돌출부(119)가 삽입공(261a)에 삽입된 후, 전원연결선(250)에 연결되어 엘이디소자(120)에 전원을 공급하는 연결단자로서 활용될 수 있다.In addition, after the protrusion 119 is inserted into the insertion hole 261a, the protrusion 119 may be connected to the power connection line 250 and used as a connection terminal for supplying power to the LED element 120.
이때 상기 돌출부(119)는, 삽입공(261a)에 삽입된 후, 전원연결선(250)와 납땜되어 고정될 수 있다.In this case, the protrusion 119 may be inserted into the insertion hole 261a and then fixed and soldered with the power connection line 250.
한편 상기와 같은 구조를 가지는 엘이디조명장치는, 열방출이 원활하지 못한 경우 엘이디소자(120)의 조명효과가 저하되는바 조명효과를 높이기 위하여 팬(미도시)이 추가로 설치될 수 있다.On the other hand, the LED lighting device having the structure as described above, when the heat dissipation is not smooth, the lighting effect of the LED element 120 is reduced, a fan (not shown) may be additionally installed to increase the lighting effect.
상기 팬은, 공기유동을 발생시켜 엘이디소자(120)를 냉각하기 위한 구성으로 금속플레이트(110)의 평면과 수직방향으로 설치됨이 바람직하다.The fan is preferably installed in a direction perpendicular to the plane of the metal plate 110 to generate air flow to cool the LED element 120.
이때 상기 금속플레이트(110), 즉 제1금속플레이트(110-a), 제2금속플레이트(110-b), 방열금속플레이트(950) 및 중간금속플레이트(930)는, 팬의 설치를 위한 개구부(미도시)들이 형성될 수 있다.In this case, the metal plate 110, that is, the first metal plate 110-a, the second metal plate 110-b, the heat dissipating metal plate 950, and the intermediate metal plate 930 are openings for installing a fan. (Not shown) may be formed.
상기 개구부는, 팬의 설치를 위하여 형성되며 홀형태 또는 개구홈 형태 등 다양한 형상을 가질 수 있다.The opening is formed for the installation of the fan and may have various shapes such as a hole shape or an opening groove shape.
또한 상기 팬은, 금속플레이트(110-a, 110-b)의 전단 및 후단을 연결하는 길이방향으로 엘이디소자(120)의 전방 또는 후방에 설치되거나, 도 26 내지 도 29c에 도시된 바와 같이, 엘이디소자(120)의 하측에 설치될 수 있다.In addition, the fan is installed in the front or rear of the LED element 120 in the longitudinal direction connecting the front and rear ends of the metal plate (110-a, 110-b), or as shown in Figure 26 to 29c, It may be installed on the lower side of the LED element 120.
한편, 본 발명의 제8실시예의 경우, 엘이디소자(120)가 2개 설치된 예를 도시한 것으로서, 사용되는 반사갓의 특성에 맞춰 그 설치숫자 및 위치는 다양하게 설정될 수 있다.On the other hand, in the eighth embodiment of the present invention, it shows an example in which two LED elements 120 are installed, the installation number and position can be variously set according to the characteristics of the reflection shade used.
또한 상기 엘이디소자(120)의 전극 중 금속플레이트(110-a, 110-b)에 결합되지 않은 전극은 후술하는 금속플레이트(110-a, 110-b)의 제조과정에서 엘이디소자(120)의 부착 후 금속플레이트(110-a, 110-b)로부터 분리되는 보조부재(960) 및 보조부재(960)에 연결된 전원연결선(미도시)에 의하여 단자연결부(240)에 또는 기판(261)을 통하여 단자연결부(240)에 연결될 수 있다.In addition, the electrodes that are not coupled to the metal plates 110-a and 110-b of the electrodes of the LED device 120 may be formed in the process of manufacturing the metal plates 110-a and 110-b to be described later. After attaching to the terminal member 240 or through the substrate 261 by a power supply line (not shown) connected to the auxiliary member 960 and the auxiliary member 960 separated from the metal plates 110-a and 110-b. It may be connected to the terminal connector 240.
여기서 상기 보조부재(960)은, 도 26, 도 27 및 도 32에 도시된 바와 같이, 엘이디소자(120)의 전기적 연결에만 활용되며, 앞서 설명한 바와 같이, 면접촉부분(958)에 형성된 돌출부(119)에 전원연결선(250)이 연결되어 엘이디소자(120)에 전원을 공급하는 연결단자로서 활용될 수 있다.Here, the auxiliary member 960, as shown in Figs. 26, 27 and 32, is utilized only for the electrical connection of the LED element 120, as described above, the protrusion formed on the surface contact portion 958 ( The power connection line 250 is connected to the 119 may be utilized as a connection terminal for supplying power to the LED element 120.
특히 상기 제1금속플레이트에 결합된 보조부재(960)는, 도 26 및 도 27에 도시된 바와 같이, 제2금속플레이트에 결합된 보조부재(960)와 땜납(938) 등에 의하여 전기적으로 연결됨으로써 제1금속플레이트 및 제2금속플레이트에 각각 설치된 엘이디소자(120)들을 직렬로 연결시킬 수 있다.In particular, the auxiliary member 960 coupled to the first metal plate is electrically connected to the auxiliary member 960 and the solder 938 coupled to the second metal plate, as shown in FIGS. 26 and 27. LED devices 120 installed on the first metal plate and the second metal plate may be connected in series.
그리고 상기 보조부재(960)는, 방열효과를 높이기 위하여 다수의 관통공(968)들이 형성될 수 있다.In addition, the auxiliary member 960 may be formed with a plurality of through holes 968 to increase the heat dissipation effect.
상기와 같은 구성을 가지는 제8실시예에 따른 엘이디조명장치는, 엘이디소자(120)가 설치된 금속플레이트(110), 즉 제1금속플레이트 및 제2금속플레이트 사이의 간격을 최소화하여 엘이디소자(120)가 미리 설계된 반사갓의 최적의 위치에 위치시킬 수 있게 된다.In the LED lighting apparatus according to the eighth embodiment having the configuration as described above, the LED device 120 by minimizing the distance between the metal plate 110, that is, the first metal plate and the second metal plate on which the LED element 120 is installed. ) Can be positioned at the optimum position of the predesigned reflector.
특히 제8실시예에 따른 엘이디조명장치는, 제7실시예에서와 유사하게, 하나의 전구에 의하여 상향등 및 하향등이 가능하도록 2개의 필라멘트를 가지는 전구를 대신하여 자동차 전조등에 설치될 수 있다.In particular, the LED lighting apparatus according to the eighth embodiment, similar to the seventh embodiment, may be installed in the vehicle headlights in place of the bulb having two filaments to enable the up and down lights by one bulb.
즉, 제8실시예에 따른 엘이디조명장치는, 하나의 전구에 의하여 상향등 및 하향등이 가능하도록 2개의 필라멘트를 가지는 전구를 대신하여 자동차 전조등에 설치되며, 제1엘이디소자(120a) 및 상기 제2엘이디소자(120b) 중 어느 하나는 상향등에 대응되는 필라멘트의 위치에 위치되며, 다른 하나는 하향등에 대응되는 필라멘트의 위치에 위치될 수 있다. 이때 상기 제1금속플레이트(110-a) 및 제2금속플레이트(110-b) 각각에는, 2개의 엘이디소자, 즉 제1엘이디소자(120a) 및 상기 제2엘이디소자(120b)가 설치된다.That is, the LED lighting apparatus according to the eighth embodiment is installed in the vehicle headlamp instead of the bulb having two filaments to enable the uplight and the downlight by one light bulb, the first LED element (120a) and the first One of the two LED elements 120b may be located at the position of the filament corresponding to the uplight, and the other may be located at the position of the filament corresponding to the downlight. In this case, two LED elements, that is, the first LED element 120a and the second LED element 120b are installed in each of the first metal plate 110-a and the second metal plate 110-b.
그리고, 상기 제1엘이디소자(120a) 및 제2엘이디소자(120b)는, 2개의 광원에 대응되는 위치에 위치되도록 소켓부(230)에 대한 거리가 다르게 제1엘이디소자(120a) 및 상기 제2엘이디소자(120b) 각각에 설치됨이 바람직하다.In addition, the first LED element 120a and the second LED element 120b may have different distances from the socket 230 so that the first LED element 120a and the second LED element 120b are located at positions corresponding to the two light sources. Preferably, the two LED elements 120b are provided.
즉, 상기 제1엘이디소자(120a) 및 제2엘이디소자(120b) 중 어느 하나는 상향등에 대응되는 필라멘트의 위치에 위치되며, 다른 하나는 하향등에 대응되는 필라멘트의 위치에 위치될 수 있다.That is, any one of the first LED element 120a and the second LED element 120b may be located at the position of the filament corresponding to the uplight, and the other may be positioned at the position of the filament corresponding to the downlight.
또한 하나의 엘이디조명장치에 의하여 상향등 및 하향등이 가능한 구조를 가지는 자동차 전조등은, 하나의 엘이디조명장치에 의한 하향등 및 상향등이 가능하도록 적절한 구조의 광차단부(975, 976)를 포함할 수 있다.In addition, the vehicle headlight having a structure that can be up and down by one LED lighting device, may include a light blocking unit (975, 976) of the appropriate structure to enable the down and up lights by one LED lighting device. have.
상기 광차단부(975, 976)는, 앞서 설명한 바와 같은 구성을 가지며, 엘이디소자(120b)에서 발광되는 빛을 하측으로 향하는 것을 방지하기 위하여 광이 차단될 엘이디소자(120b)의 직하방에 설치되는 구성으로 다양한 구성이 가능하다.The light blocking portions 975 and 976 have the configuration as described above, and are installed directly below the LED element 120b to block light to prevent the light emitted from the LED element 120b from being directed downward. Various configurations are possible with the configuration.
특히 상기 광차단부(975, 976)는, 엘이디소자(120b)의 측방으로 광이 노출되는 것을 방지하기 위하여 수직으로 연장된 수직연장부(975a, 976b)가 추가로 형성됨이 바람직하다.In particular, the light blocking parts 975 and 976 may further include vertical extension parts 975a and 976b extending vertically to prevent light from being exposed to the side of the LED device 120b.
상기 수직연장부(975a, 976b)는, 엘이디소자(120b)의 직하방에 설치된 광차단부(975, 976)로부터 상측으로 연장된 구성으로 'ㄴ'자 구조로 별도로 설치되거나, 광차단부(975, 976)와 일체로 형성되는 등 다양한 구성이 가능하다.The vertical extension parts 975a and 976b may be separately installed in a 'b' shape in a configuration extending upward from the light blocking parts 975 and 976 provided directly below the LED element 120b, or may be separately provided with a light blocking part ( 975, 976) and various configurations are possible.
특히 상기 수직연장부(975a, 976b)는, 제1엘이디소자(120a) 및 제2엘이디소자(120b) 사이에서 상측으로 연장된다.In particular, the vertical extension parts 975a and 976b extend upward between the first LED element 120a and the second LED element 120b.
한편, 자동차의 전조등의 경우 반사갓의 구조와 함께 광원인 할로겐 전구의 발광영역이 자동차의 전방에서 보았을 때 우측이 더 아래쪽으로 더 형성되도록 설계되어 있다.On the other hand, in the case of the headlights of the automobile, the light emitting region of the halogen bulb which is the light source together with the structure of the reflector is designed to be formed further downward when viewed from the front of the vehicle.
이에 본 발명에 따른 엘이디조명장치가 자동차의 전조등에 설치되는 경우 위와 같은 특성을 반영하기 위하여, 도 33 내지 도 35에 도시된 바와 같이, 자동차에 장착된 상태에서 자동차의 전방에서 보았을 때 기판(261)에 결합되는 금속플레이트(110), 즉 제1금속플레이트(110-a) 및 제2금속플레이트(110-b), 중간금속플레이트(930)가 그 표면이 시계방향으로 일정각도(θ)를 가지도록 설치되는 것이 바람직하다.Accordingly, in order to reflect the above characteristics when the LED lighting apparatus according to the present invention is installed in the headlight of the vehicle, as shown in FIGS. 33 to 35, the substrate 261 when viewed from the front of the vehicle in the state of being mounted on the automobile The metal plate 110 coupled to the metal plate 110, that is, the first metal plate 110-a, the second metal plate 110-b, and the intermediate metal plate 930 have a predetermined angle θ in the clockwise direction thereof. It is preferable to be installed to have.
다시 말하면, 상기 금속플레이트(110)에 설치된 엘이디소자(120)가 자동차에 장착된 상태에서 자동차의 전방에서 보았을 때 엘이디소자(120)가 금속플레이트(110), 즉 제1금속플레이트(110-a) 및 제2금속플레이트(110-b)의 표면에 대한 설치각도가 수평선보다 시계방향으로 일정각도(θ)를 가지도록 설치됨이 바람직하다.In other words, when the LED device 120 installed on the metal plate 110 is viewed from the front of the vehicle when the LED device 120 is mounted on the car, the LED device 120 is the metal plate 110, that is, the first metal plate 110-a. ) And the installation angle of the surface of the second metal plate 110-b is preferably installed to have a predetermined angle θ in the clockwise direction than the horizontal line.
한편, 자동차에 장착된 상태에서 자동차의 전방에서 보았을 때 기판(261)에 결합되는 금속플레이트(110)가 그 표면이 시계방향으로 일정각도(θ)는, 5°~10°가 바람직하며, 8°인 것이 보다 바람직하다.On the other hand, the metal plate 110, which is coupled to the substrate 261 when viewed from the front of the vehicle in the state of being mounted on the vehicle, the surface of the constant angle (θ) in the clockwise direction, preferably 5 ° ~ 10 °, 8 It is more preferable that it is °.
여기서 상기 기판(261)은, 소켓(260)과 결합된 상태에서 금속플레이트(110), 특히 중간금속플레이트(930)가 삽입되는 관통공(261b)이 기판(261)에 결합되는 금속플레이트(110)가 그 표면이 시계방향으로 일정각도(θ), 바람직하게는 5°~10°, 보다 바람직하게는 8°로 회전된 슬롯으로 형성됨이 바람직하다.Herein, the substrate 261 includes a metal plate 110 in which a through hole 261b into which the metal plate 110, in particular, the intermediate metal plate 930 is inserted, is coupled to the substrate 261. ) Is preferably formed of a slot whose surface is rotated in a clockwise direction at an angle θ, preferably 5 ° to 10 °, more preferably 8 °.
또한 상기 기판(261)에 형성되어 소켓(260)과의 결합을 위한 나사공(261e)은 한 쌍으로 수평방향으로 형성된다.In addition, the screw holes 261e formed in the substrate 261 and for coupling with the socket 260 are formed in a horizontal direction in pairs.
그리고, 상기 금속플레이트(110)의 설치상태와 관련된, 삽입공(261a), 나사공(261c)은 관통공(261b)과 유사하게 기판(261)에 결합되는 금속플레이트(110)가 그 표면이 시계방향으로 일정각도(θ), 바람직하게는 5°~10°, 보다 바람직하게는 8°로 회전된 슬롯으로 형성됨이 바람직하다.In addition, the insertion hole 261a and the screw hole 261c related to the installation state of the metal plate 110 have a metal plate 110 coupled to the substrate 261 similar to the through hole 261b. It is preferably formed as a slot rotated in a clockwise direction at an angle θ, preferably 5 ° to 10 °, more preferably 8 °.
한편 본 발명의 제1실시예 내지 제8실시예에 따른 엘이디조명장치에 사용되는 금속플레이트는, 다음과 같은 방법에 의하여 제조될 수 있다.Meanwhile, the metal plate used in the LED lighting apparatus according to the first to eighth embodiments of the present invention may be manufactured by the following method.
이하 본 발명에 따른 엘이디조명장치의 제조방법에 관하여 제6실시예에 따른 엘이디조명장치를 예를 들어 설명한다.Hereinafter, the LED lighting apparatus according to the sixth embodiment will be described with reference to the manufacturing method of the LED lighting apparatus according to the present invention.
도 36a에 도시된 바와 같이, 구리 또는 구리합금 재질의 금속시트(0)가 준비된다.As shown in Fig. 36A, a metal sheet 0 made of copper or copper alloy is prepared.
그리고 도 36b에 도시된 바와 같이, 금속시트(0)에 사용될 금속플레이트(110, 910, 930)의 형상으로 형성될 수 있도록 금속플레이트(110, 910, 930)의 형상의 가장자리 부분을 남기고 상면 및 저면에 에칭방지막을 형성한다.And as shown in Figure 36b, the upper surface and leaving the edge portion of the shape of the metal plate (110, 910, 930) to be formed in the shape of the metal plate (110, 910, 930) to be used for the metal sheet (0) An anti-etching film is formed on the bottom surface.
이때 대량생산을 고려하여 금속시트(0) 상에는 한 종류의 복수의 금속플레이트들, 또는 복수의 종류의 금속플레이트(110, 910, 930)들의 형성이 가능하도록 에칭방지막이 형성된다.At this time, in consideration of mass production, an anti-etching film is formed on the metal sheet 0 to form a plurality of metal plates or a plurality of metal plates 110, 910, and 930.
이때 에칭방지막은 복수의 브리지(961)들의 형성에 의하여 후속되는 에칭 공정에서 에칭에 의하여 금속플레이트(110, 910, 930)들이 완전히 분리되지 않도록 한다.At this time, the anti-etching film prevents the metal plates 110, 910, and 930 from being completely separated by etching in a subsequent etching process by forming the plurality of bridges 961.
여기서 금속플레이트(110, 910, 930)는 후속되는 공정 중에 개별로 분리될 수 있다.The metal plates 110, 910, 930 can be separated separately during subsequent processing.
또한 금속플레이트(110, 910, 930)에 결합되는 엘이디소자(120)의 전극 중 금속플레이트와 결합되지 않은 비접촉전극에 대응되는 부분에 대응되는 한편 금속플레이트와는 분리되는 보조부재(960)에 대응되는 부분도 에칭방지막이 코팅됨이 바람직하다.In addition, a portion of the electrode of the LED element 120 coupled to the metal plates 110, 910, and 930 corresponds to a portion corresponding to the non-contact electrode not coupled to the metal plate, and corresponds to the auxiliary member 960 separated from the metal plate. It is preferable that the etching prevention film is also coated.
상기 보조부재(960)는 금속시트 상에 금속플레이트(110)와 함께 형성되는 경우 후술하는 솔더링부재 부착공정에서 솔더링부재가 부착된 후 엘이디소자 결합공정을 통하여 엘이디소자 중 금속플레이트와 결합, 즉 통전되지 않은 비접촉전극이 결합될 수 있다.When the auxiliary member 960 is formed together with the metal plate 110 on the metal sheet, the soldering member is attached in the soldering member attaching process described later, and then coupled to the metal plate of the LED elements through the LED element bonding process, that is, energization. Non-contact electrodes can be combined.
여기서 상기 보조부재(960)는 에칭공정에 의하여 완전히 분리되지 않고 하나 이상의 브리지(961)에 의하여 금속플레이트(110)와 연결된 상태를 유지한다.In this case, the auxiliary member 960 is not completely separated by an etching process and is maintained in a state of being connected to the metal plate 110 by at least one bridge 961.
상기와 같이 비접촉전극이 솔더링부재에 의하여 보조부재(960)에 결합되면 금속플레이트의 분리 후 엘이디조명장치의 제조를 위하여 조립시 앞서 설명한 다른 엘이디소자의 단자와의 연결 또는 전원공급선과 연결을 위한 전원연결선(250)의 연결이 용이한 이점이 있다(도 5, 도 18 참조)When the non-contact electrode is coupled to the auxiliary member 960 by the soldering member as described above, when the metal plate is separated and then assembled for the manufacture of the LED lighting device, the power supply for the connection with the terminals of the other LED elements described above or the power supply line There is an advantage in that the connection line 250 is easily connected (see FIGS. 5 and 18).
상기 금속시트(0)의 상면 및 저면에 에칭방지막을 형성한 후 산과 같은 에칭액에 담궈 에칭방지막이 형성되지 않은 부분이 부식됨으로써 사용될 금속플레이트(110, 910, 930)가 형성된다.After forming the anti-etching film on the top and bottom of the metal sheet (0) and then immersed in an etchant such as acid, the portions where the anti-etching film is not formed are corroded to form metal plates 110, 910, and 930 to be used.
에칭 공정을 거친 금속시트(0)는 보호막의 제거 후 은, 니켈 등으로 코팅될 수 있다. 특히 니켈에 의하여 도금되는 것이 가장 바람직하다. 단, 니켈 도금에 의하여 금속플레이트(110)의 열이 방열되는 것이 방해될 수 있는바 니켈 도금없이 사용될 수 있다.After the etching process, the metal sheet 0 may be coated with silver, nickel, or the like after removal of the protective film. In particular, plating with nickel is most preferable. However, the heat dissipation of the heat of the metal plate 110 by nickel plating may be prevented and may be used without nickel plating.
또한 상기 금속플레이트(110)는, 열방출 효과를 극대화하기 위하여 검은색의 에폭시도료와 같은 물질 등으로 검은색으로 코팅되는 것이 바람직하다.In addition, the metal plate 110 is preferably coated in black with a material such as black epoxy paint to maximize the heat dissipation effect.
에칭 공정, 도금 공정을 거친 금속시트(0)는, 도 36c에 도시된 바와 같이, 엘이디소자(120)가 결합될 위치, 즉 일정영역(도 24에서 검은 색으로 표시된 영역)에만 땜남이 결합될 수 있도록 땜납결합영역(도 24에서 검은 색으로 표시된 영역)을 구획하는 구획선이 인쇄될 수 있다.As shown in FIG. 36C, the metal sheet 0 which has undergone the etching process and the plating process may be soldered only to a position where the LED element 120 is to be bonded, that is, a certain region (the region shown in black in FIG. 24). A partition line may be printed which partitions the solder joint area (the area marked in black in FIG. 24) so that it can be printed.
한편 에칭 공정, 도금 공정을 거친 금속시트(0)는, 엘이디소자(120)가 결합될 수 있도록 엘이디소자가 결합될 위치에 솔더링부재가 부착된다.On the other hand, the metal sheet (0) through the etching process, plating process, the soldering member is attached to the position where the LED element is coupled so that the LED element 120 can be coupled.
여기서 솔더링부재의 부착방법은, 레이저가공장치를 이용한 방법, 엘이디소자(120)가 결합될 위치에만 개구가 형성되고 개구를 통하여 땜납과 같은 솔더링부재가 분말형태로 바인더와 혼합된 솔더링부재혼합물이 금속시트 상에 부착될 수 있다.Here, the method of attaching the soldering member is a method in which a laser is used as a factory, an opening is formed only at the position where the LED element 120 is to be coupled, and a soldering member mixture in which a soldering member such as solder is mixed with a binder in a powder form through the opening is made of metal. It can be attached on the sheet.
한편 도 36d에 도시된 바와 같이, 금속시트(0) 상에 솔더링부재가 부착된 후 엘이디소자(120)가 결합된다. 이때 솔더링부재의 용융에 의하여 금속시트(0) 상에 엘이디소자(120)가 결합될 수 있도록 가열된 환경을 형성하는 오븐 내에서 솔더링부재 부착 및 엘이디소자(120)의 결합이 이루어지는 것이 바람직하다.Meanwhile, as shown in FIG. 36D, after the soldering member is attached to the metal sheet 0, the LED device 120 is coupled. At this time, it is preferable that the soldering member is attached and the LED element 120 is coupled in an oven to form a heated environment so that the LED element 120 can be coupled to the metal sheet 0 by melting the soldering member.
또한 오븐 내에서 솔더링부재 부착 및 엘이디소자(120)의 결합이 이루진 후 오븐 외부로 배출되어 냉각에 의하여 금속시트 상에 엘이디소자(120)가 견고하게 결합된다.In addition, after the attachment of the soldering member and the combination of the LED element 120 in the oven is discharged to the outside of the oven, the LED element 120 is firmly coupled to the metal sheet by cooling.
한편 금속시트(0) 상에 엘이디소자(120)가 결합된 후 브리지(961)를 절단함으로써 개별 금속플레이트(110, 910, 930)로 분리되어 앞서 설명한 바와 같은 구조로 조립된다.On the other hand, after the LED element 120 is coupled to the metal sheet (0) by cutting the bridge (961) is separated into individual metal plates (110, 910, 930) and assembled in the structure described above.
이때 각 엘이디소자(120)가 적절한 위치에 위치될 수 있도록 지그 등을 사용하여 조립된다.At this time, each LED element 120 is assembled using a jig or the like so that it can be located at an appropriate position.
한편, 금속시트에서 개별 금속플레이트의 형성시 에칭 공정에 의한 경우에 대해서만 설명하였으나 레이저 가공, 프레스 가공 등 다양한 방법에 의하여 이루어질 수 있음은 물론이다.On the other hand, only the case by the etching process when forming the individual metal plate in the metal sheet has been described, but can be made by a variety of methods, such as laser processing, press working.
또한 금속시트(0)에서 개별 금속플레이트(110, 910, 930)의 형성시 금속플레이트의 주변에는 엘이디소자(120)에서 발생되는 열의 방출을 극대화하기 위하여 그 주면으로 홀, 절개홈 등이 형성됨이 바람직하다.In addition, when the individual metal plates 110, 910, and 930 are formed in the metal sheet 0, holes, cutouts, etc. are formed on the main surface of the metal plates to maximize heat emission from the LED element 120. desirable.
특히 금속시트(0)에서 형성된 개별 금속플레이트(110, 910, 930)의 가장자리, 특히 엘이디소자가 결합된 부분에서의 가장자리에 홀, 절개홈 등으로 형성됨이 보다 바람직하다.In particular, it is more preferable that the edges of the individual metal plates 110, 910, and 930 formed in the metal sheet 0 are formed as holes, cutouts, or the like, particularly at the edges at which the LED elements are coupled.
한편 상기와 같이 금속시트(0) 상에 에칭공정을 통하여 형성된 복수의 금속플레이트들에 의하여 조명장치가 구성될 수 있으며, 이때 복수의 금속플레이트들을 별도로 분리하지 않은 상태에서 미리 설계된 구조에 따라 각 금속플레이트들의 연결부분을 꺾어 다양한 형상의 엘이디조명장치의 제조가 가능한 이점이 있다.Meanwhile, the lighting apparatus may be configured by a plurality of metal plates formed through an etching process on the metal sheet 0 as described above. In this case, each metal plate may be configured according to a predesigned structure in a state in which the plurality of metal plates are not separated. By folding the connection portion of the plate there is an advantage that can be manufactured LED lighting device of various shapes.
한편 본 발명의 제1실시예 내지 제8실시예에 따른 엘이디조명장치는, 자동차에 사용되는 실시예를 들어 설명하였으나 백열등과 같은 다른 조명장치에도 적용될 수 있음은 물론이다.Meanwhile, although the LED lighting apparatus according to the first to eighth embodiments of the present invention has been described with reference to embodiments used in automobiles, the LED lighting apparatus may be applied to other lighting apparatuses such as incandescent lamps.
즉, 본 발명의 제1 내지 제8실시예에 따른 엘이디조명장치는, 자동차에 사용되는 대신 일반 조명장치에 사용될 수도 있다.That is, the LED lighting apparatuses according to the first to eighth embodiments of the present invention may be used for general lighting devices instead of being used for automobiles.
또한 도 5 및 도 6에 도시된 바와 같이, 금속플레이트 상에 엘이디소자가 설치된 구조는 기본구조로 하여 조명장치로서 다양한 변형이 가능하다.In addition, as shown in Figures 5 and 6, the structure in which the LED element is installed on the metal plate as a basic structure can be variously modified as a lighting device.
일예로서, 본 발명의 제9실시예 내지 및 제10실시예에 따른 엘이디조명장치는, 도 37 내지 도 40에 도시된 바와 같이, 평면 형상의 금속플레이트(610)가 구부러져 다면체 구조를 형성하며 각 면에 하나 이상의 엘이디소자(120)가 설치되는 금속부재(600)를 포함한다.As an example, in the LED lighting apparatus according to the ninth to tenth embodiment of the present invention, as shown in Figure 37 to 40, the planar metal plate 610 is bent to form a polyhedral structure each It includes a metal member 600 is provided with at least one LED element 120 on the surface.
여기서 금속부재(600)를 이루는 다면체는, 도 37에 도시된 바와 같이, 일면이 개방된 직육면체, 도 42에 도시된 바와 같이, 일면이 개방된 6면체 등 다양한 형상을 가질 수 있다.Here, the polyhedron constituting the metal member 600 may have various shapes such as a rectangular parallelepiped having one surface open as shown in FIG. 37 and a hexahedron having one surface opened as shown in FIG. 42.
상기 금속부재(600)는, 본체(2)에 설치되며 평면 형상의 금속플레이트(610)가 구부러져 다면체 구조를 형성하며 각 면에 하나 이상의 엘이디소자(120)가 설치된다.The metal member 600 is installed on the main body 2 and the planar metal plate 610 is bent to form a polyhedral structure, and one or more LED elements 120 are installed on each surface.
상기 금속플레이트(610)는, 제1실시예와 유사한 구조를 가지며 다만 굽어진 상태로 다면체를 이룸을 고려하여 미리 설정된 위치에서 엘이디소자(120)의 제1전극(121) 및 제2전극(122) 중 어느 하나만 열전도가 가능하도록 나머지 전극인 열전도가 이루어지지 않는 비접촉전극에 대응되는 위치에 그 접촉을 방지하기 위한 접촉방지수단이 형성될 수 있다.The metal plate 610 has a structure similar to that of the first embodiment, but the first electrode 121 and the second electrode 122 of the LED element 120 at a predetermined position in consideration of forming a polyhedron in a bent state. The contact preventing means for preventing the contact may be formed at a position corresponding to the non-contact electrode that is not made of the other electrode, the heat conduction so that only one of the heat conduction.
그리고 상기 접촉방지수단은, 도 38 내지 도 44에 도시된 바와 같이, 금속플레이트(610)에 형성된 관통공(611)으로, 또는 절개부로 구성될 수 있다.And the contact preventing means, as shown in Figures 38 to 44, may be a through hole 611 formed in the metal plate 610, or may be composed of a cutout.
이때 상기 비접촉전극은, 도 5에 도시된 바와 같은 구성과 유사하게, 다른 엘이디소자의 단자와의 연결 또는 전원공급선과 연결을 위한 전원연결선(650)이 관통공을 통하여 연결될 수 있다.At this time, the non-contact electrode, similar to the configuration as shown in Figure 5, the power connection line 650 for connecting to the terminal of the other LED element or the power supply line may be connected through the through hole.
그리고 상기 접촉방지수단인 관통공(611)의 형성시 앞서 설명한 바와 같이, 금속플레이트(610)로부터 분리되는 보조부재(960)는, 전원연결선(650)과 연결되는데 활용됨으로써 전원연결선(650)의 연결을 용이하게 할 수 있다.As described above, the auxiliary member 960 separated from the metal plate 610 may be used to be connected to the power connection line 650 to form the through hole 611 as the contact preventing means. The connection can be facilitated.
또한 상기 금속플레이트(610)는, 다면체 형성을 위하여 굽어지는 경계선에서 일부가 적재된 절개부(619)가 형성됨이 바람직하다.In addition, the metal plate 610, it is preferable that a cutout portion 619 is partially formed at the boundary line bent to form a polyhedron.
상기 절개부(619)는 다면체 형성을 위하여 굽어질 때 절개부는 그대로 유지되어 외측으로 돌출됨으로써 엘이디소자(120)가 발광할 때 방열효과를 극대화할 수 있게 된다.When the cutout 619 is bent to form a polyhedron, the cutout is maintained as it is to protrude outward, thereby maximizing a heat dissipation effect when the LED device 120 emits light.
또한 상기 금속플레이트(610)는, 일단을 고정할 수 있도록 기판(651)에 삽입되는 돌출부(618)이 추가로 형성될 수 있다.In addition, the metal plate 610 may be further formed with a protrusion 618 inserted into the substrate 651 to fix one end.
한편 본 발명의 제9실시예 및 제10실시예에 따른 엘이디조명장치는, 교류를 직류로 전환하는 컨버터회로(미도시), 전압을 안정화하는 안정회로(미도시) 등이 설치될 수 있다.Meanwhile, in the LED lighting apparatus according to the ninth and tenth embodiments of the present invention, a converter circuit (not shown) for converting AC into direct current, a stable circuit (not shown) for stabilizing voltage, and the like may be installed.
또한 본 발명의 제9실시예 및 제10실시예에 따른 엘이디조명장치는, 제6실시예에서 설명한 팬(940)도 설치될 수 있음은 물론이다.In addition, in the LED lighting apparatuses according to the ninth and tenth embodiments of the present invention, the fan 940 described in the sixth embodiment may also be installed.
상기와 같은 구조를 가지는 본 발명에 따른 엘이디조명장치는, 백열등이 사용되는 종래의 조명장치에서 백열등을 대신하여 사용되는 등 그 사용용도를 현저히 높일 수 있는 이점이 있다.LED lighting device according to the present invention having the structure as described above has the advantage that can be used to significantly increase its use, such as being used in place of incandescent lamps in the conventional lighting device in which incandescent lamps are used.
한편 본 발명의 제9실시예 및 제10실시예에 따른 엘이디조명장치는, 조명장치의 용도에 따라서 다양한 구조 및 형상을 가질 수 있다.Meanwhile, the LED lighting apparatus according to the ninth and tenth embodiments of the present invention may have various structures and shapes according to the use of the lighting apparatus.
구체적으로서, 본 발명의 제9실시예에 따른 엘이디조명장치는, 종래의 백열등구조와 유사한 구조를 가질 수 있다.Specifically, the LED lighting apparatus according to the ninth embodiment of the present invention may have a structure similar to the conventional incandescent lamp structure.
또한 본 발명의 제10실시예에 따른 엘이디조명장치는, 종래의 형광등구조와 유사한 구조를 가질 수 있다.In addition, the LED lighting apparatus according to the tenth embodiment of the present invention, may have a structure similar to the conventional fluorescent lamp structure.
여기서 상기 엘이디조명장치가 형광등구조와 유사한 구조를 가지는 경우, 엘이디소자(120)가 하측을 향하도록 설치된 하나의 금속플레이트(610)를 포함하는 예를 들어 설명하였으나, 엘이디소자(120)가 하측을 향하도록 설치된 금속플레이트(610)가 쌍을 이루어 설치될 수도 있음은 물론이다.Here, when the LED lighting device has a structure similar to that of a fluorescent lamp, the LED device 120 has been described as an example including one metal plate 610 installed to face downward, but the LED device 120 is described below. Of course, the metal plate 610 installed to face may be installed in pairs.
또한 한편 본 발명의 제9실시예 및 제10실시예에 따른 엘이디조명장치는, 도록 금속플레이트(610)의 일단이 고정되는 기판(651)이 결합되어 외부 전원과의 연결을 위한 소켓부(670)를 포함할 수 있다.In the meantime, in the LED lighting apparatus according to the ninth and tenth embodiments of the present invention, the substrate 651 on which one end of the metal plate 610 is fixed is coupled to the socket 670 for connection with an external power source. ) May be included.
상기 소켓부(670)는, 엘이디소자(120)에 전원을 공급하도록 외부전원과 연결되는 구성으로 전원연결구조에 따라서 다양한 구조가 가능하다.The socket portion 670 is configured to be connected to an external power source to supply power to the LED device 120 is possible in a variety of structures according to the power connection structure.
또한 본 발명의 제9실시예에 따른 엘이디조명장치는, 엘이디소자(120)에서 발광되는 빛을 확산시키거나 금속플레이트(610)을 보호하도록 투명 또는 반투명 재질의 커버부재(652)를 추가로 포함할 수 있다.In addition, the LED lighting apparatus according to the ninth embodiment of the present invention further includes a cover member 652 made of a transparent or translucent material to diffuse the light emitted from the LED element 120 or to protect the metal plate 610. can do.
상기 커버부재(652)는, 엘이디소자(120)에서 발광되는 빛을 확산시키거나 금속플레이트(610)을 보호하도록 투명 또는 반투명 재질을 가지면 어떠한 구성도 가능하다.The cover member 652 may have any structure as long as the cover member 652 has a transparent or translucent material to diffuse the light emitted from the LED element 120 or to protect the metal plate 610.
또한 상기 커버부재(652)는, 냉각효율을 높이기 위하여 복수의 개구부(미도시)들이 형성될 수 있다.In addition, the cover member 652, a plurality of openings (not shown) may be formed to increase the cooling efficiency.
상기와 구성을 가지는 엘이디조명장치는, 종래의 백열등 구조와 최대한 근접된 구조를 가짐으로써 기존 조명시설의 활용효과를 극대화할 수 있는 이점이 있다.The LED lighting device having the above configuration has the advantage of maximizing the utilization effect of the existing lighting system by having a structure as close as possible to the conventional incandescent light structure.
즉, 본 발명에 따른 엘이디조명장치는, 백열등과 유사한 형태로 발광됨에 따라서 백열등이 설치될 때에 최적화된 반사갓을 최대한 활용함으로써 동일수량의 엘이디소자들을 사용할 때 대비하여 조명효과가 극대화될 수 있게 된다.That is, according to the LED lighting device according to the present invention, the light emitted in a form similar to incandescent lamps can be maximized by using the optimized reflector when the incandescent lamps are installed, the lighting effect can be maximized when using the same amount of LED elements.
한편, 본 발명에 따른 엘이디조명장치는, 제9실시예 및 제10실시예와는 달리, 금속플레이트(610)가 굽혀지지 않고 커버부재(652) 내에 지지되어 설치될 수 있다.On the other hand, the LED lighting device according to the present invention, unlike the ninth and tenth embodiment, the metal plate 610 may be supported and installed in the cover member 652 without bending.
즉, 본 발명의 제11실시예 및 제12실시예에 따른 엘이디조명장치는, 외부 전원과의 연결을 위한 소켓부(670)와, 소켓부(670)에 결합되며 내부공간이 형성된 커버부재(652)와, 커버부재(652)에 지지되어 내부공간에 설치되는 복수의 금속부재(610)을 포함한다.That is, the LED lighting apparatus according to the eleventh embodiment and the twelfth embodiment of the present invention, the socket portion 670 for the connection to the external power source, the cover member coupled to the socket portion 670 and the inner space is formed ( 652 and a plurality of metal members 610 supported by the cover member 652 and installed in the inner space.
여기서 본 발명의 제11실시예 및 제12실시예에 따른 엘이디조명장치는, 종래의 형광등구조 등 관형구조를 가질 수 있다.Here, the LED lighting apparatus according to the eleventh and twelfth embodiments of the present invention may have a tubular structure such as a conventional fluorescent lamp structure.
상기 소켓부(670)는, 외부 전원과의 연결을 위한 구성으로서 다양한 구성이 가능하다.The socket portion 670 may be configured in various ways as a configuration for connection with an external power source.
상기 커버부재(652)는, 엘이디소자(120)에서 발광되는 빛을 확산시키거나 금속플레이트(610)을 보호하도록 투명 또는 반투명 재질의 구성으로 다양한 구성이 가능하다.The cover member 652 may be configured in a variety of configurations of a transparent or translucent material to diffuse the light emitted from the LED element 120 or to protect the metal plate 610.
그리고 상기 커버부재(652)는, 금속플레이트(610)의 보호와 동시에 금속플레이트(610)의 지지부재로도 활용이 가능하다.The cover member 652 may be utilized as a support member of the metal plate 610 while protecting the metal plate 610.
구체적으로 상기 커버부재(652)는, 금속플레이트(610)의 가장자리 일부가 삽입되는 삽입부(353)가 형성되어 금속플레이트(610)를 지지할 수 있다.In detail, the cover member 652 may include an insertion part 353 into which a part of the edge of the metal plate 610 is inserted to support the metal plate 610.
상기 삽입부(353)는, 금속플레이트(610)의 가장자리 일부가 삽입되어 금속플레이트(610)를 지지할 수 있는 구성이면 어떠한 구조도 가능하다.The inserting portion 353 may have any structure as long as a portion of the edge of the metal plate 610 is inserted to support the metal plate 610.
한편 상기 커버부재(652)는, 엘이디조명장치의 구조에 따라서 다양한 구조를 가질 수 있으며, 관형구조를 가짐이 바람직하며, 엘이디조명장치가 형광등구조와 유사한 구조를 가질 수 있다.Meanwhile, the cover member 652 may have various structures according to the structure of the LED lighting device, preferably having a tubular structure, and the LED lighting device may have a structure similar to the fluorescent lamp structure.
이때 본 발명의 제11실시예에 따른 엘이디조명장치는, 직관형구조로서 엘이디소자(120)가 하측을 향하도록 설치된 하나의 금속플레이트(610)를 포함하는 예를 들어 설명하였으나, 엘이디소자(120)가 하측을 향하도록 설치된 금속플레이트(610)가 쌍을 이루어 설치될 수도 있음은 물론이다.At this time, the LED lighting apparatus according to the eleventh embodiment of the present invention has been described as an example including a metal plate 610 installed so that the LED element 120 is directed downward as a straight structure, LED element 120 ) May be installed in pairs of metal plates 610 installed to face downward.
그리고 상기 엘이디조명장치가 형광등과 유사한 구조를 가지는 경우 직관형의 형상에 더하여 양단에 소켓부(670)가 설치될 수 있다.In addition, when the LED lighting device has a structure similar to a fluorescent lamp, the socket 670 may be installed at both ends in addition to the straight pipe shape.
상기 커버부재(652)는, 엘이디소자(120)에서 발광되는 빛을 확산시키거나 금속플레이트(610)을 보호하도록 투명 또는 반투명 재질을 가지면 어떠한 구성도 가능하다.The cover member 652 may have any structure as long as the cover member 652 has a transparent or translucent material to diffuse the light emitted from the LED element 120 or to protect the metal plate 610.
또한 상기 커버부재(652)는, 냉각효율을 높이기 위하여 복수의 개구부(654)들이 형성될 수 있다.In addition, the cover member 652, a plurality of openings 654 may be formed to increase the cooling efficiency.
상기 금속플레이트(610)는, 제9실시예 및 제11실시예와는 달리 굽어지지 않는 구조를 가지는 것 이외에는 그 구성이 유사한바 자세한 설명은 생략한다.Unlike the ninth and eleventh embodiments, the metal plate 610 is similar in configuration except that the metal plate 610 is not bent.
이상은 본 발명에 의해 구현될 수 있는 바람직한 실시예의 일부에 관하여 설명한 것에 불과하므로, 주지된 바와 같이 본 발명의 범위는 위의 실시예에 한정되어 해석되어서는 안 될 것이며, 위에서 설명된 본 발명의 기술적 사상과 그 근본을 함께하는 기술적 사상은 모두 본 발명의 범위에 포함된다고 할 것이다.Since the above has been described only with respect to some of the preferred embodiments that can be implemented by the present invention, the scope of the present invention, as is well known, should not be construed as limited to the above embodiments, the present invention described above It will be said that both the technical idea and the technical idea which together with the base are included in the scope of the present invention.

Claims (5)

  1. 하나 이상의 금속플레이트와; 상기 금속플레이트의 표면에 설치된 하나 이상의 엘이디소자를 포함하며,One or more metal plates; At least one LED element installed on the surface of the metal plate,
    상기 엘이디소자는, 제1전극 및 제2전극 중 어느 하나만 상기 금속플레이트와 상기 금속플레이트에 결합된 것을 특징으로 하는 엘이디조명장치.The LED device, the LED lighting device, characterized in that any one of the first electrode and the second electrode is coupled to the metal plate and the metal plate.
  2. 청구항 1에 있어서,The method according to claim 1,
    상기 엘이디소자는, 상기 금속플레이트에 결합되는 인쇄회로기판에 장착되며, The LED element is mounted on a printed circuit board coupled to the metal plate,
    상기 인쇄회로기판은 제1전극 및 제2전극 중 어느 하나가 상기 금속플레이트와 상기 금속플레이트에 결합된 것을 특징으로 하는 엘이디조명장치.The printed circuit board of the LED lighting device, characterized in that any one of the first electrode and the second electrode is coupled to the metal plate and the metal plate.
  3. 청구항 1에 있어서,The method according to claim 1,
    상기 금속플레이트의 일단에는 엘이디조명장치가 설치될 구조물과의 결합을 위한 소켓부가 결합된 것을 특징으로 하는 엘이디조명장치.One end of the metal plate LED lighting device, characterized in that the socket portion for coupling with the structure to be installed LED lighting device is coupled.
  4. 청구항 1 내지 청구항 3 중 어느 하나의 항에 있어서,The method according to any one of claims 1 to 3,
    상기 금속플레이트는, 적어도 일부가 상기 엘이디소자가 설치된 면이 서로 경사를 이루도록 설치된 복수의 금속플레이트들을 포함하는 것을 특징으로 하는 엘이디조명장치.The metal plate, LED lighting device, characterized in that at least a part comprises a plurality of metal plates installed so that the surface on which the LED element is installed to be inclined with each other.
  5. 엘이디조명장치가 설치될 구조물과의 결합을 위한 소켓부와;A socket part for coupling with the structure in which the LED lighting device is installed;
    일단이 상기 소켓부에 결합되며 서로 대향되는 표면의 반대면에 제1엘이디소자가 각각 설치된 한 쌍의 제1금속플레이트들과;A pair of first metal plates, one end of which is coupled to the socket part and each of which has first LED elements disposed on opposite surfaces of the surfaces facing each other;
    상기 한 쌍의 제1금속플레이트들 사이에서 상기 한 쌍의 제1금속플레이트들과 평행을 이루며 일단이 상기 소켓부에 결합되며 서로 대향되는 표면의 반대면에 제2엘이디소자가 각각 설치된 한 쌍의 제2금속플레이트들과;A pair of pairs of first LED plates parallel to the pair of first metal plates between the pair of first metal plates, one end of which is coupled to the socket portion, and a second LED element is installed on an opposite surface of the surface opposite to each other; Second metal plates;
    상기 한 쌍의 제2금속플레이트들 사이에서 상기 한 쌍의 제2금속플레이트들과 평행을 이루며 일단이 상기 소켓부에 결합되고, 상기 제2금속플레이트과 수직을 이루도록 절곡된 절곡면부을 가지며, 상기 절곡면부에 제3엘이디소자가 설치된 하나 이상의 제3금속플레이트와;The bent surface portion parallel to the pair of second metal plates between the pair of second metal plates and having one end coupled to the socket portion and bent to be perpendicular to the second metal plate; At least one third metal plate provided with a third LED element;
    상기 제1 내지 제3금속플레이트들 간의 간격을 유지하도록 상기 제1 내지 제3금속플레이트들의 타단들이 결합되는 간격유지부재를 포함하는 것을 특징으로 하는 엘이디조명장치.LED lighting device, characterized in that it comprises a spacing member to which the other ends of the first to third metal plates are coupled to maintain the gap between the first to third metal plates.
PCT/KR2015/002644 2014-03-18 2015-03-18 Led lighting device WO2015142063A1 (en)

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KR10-2014-0031870 2014-03-18
KR20140031870 2014-03-18
KR20140043611 2014-04-11
KR10-2014-0043611 2014-04-11
KR10-2014-0192669 2014-12-29
KR1020140192669A KR20150108734A (en) 2014-03-18 2014-12-29 LED lighting apparatus
KR10-2015-0007483 2015-01-15
KR1020150007483A KR20150108738A (en) 2014-03-18 2015-01-15 LED lighting apparatus

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Citations (5)

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Publication number Priority date Publication date Assignee Title
JP2000236111A (en) * 1999-02-15 2000-08-29 Matsushita Electric Works Ltd Light source equipment
JP3135971U (en) * 2007-05-23 2007-10-04 億光電子工業股▲ふん▼有限公司 LED backlight module
CN102661501A (en) * 2012-04-18 2012-09-12 广东伟锋光电科技有限公司 Light emitting diode (LED) lamp bulb with integrated heat radiating structure
CN202484906U (en) * 2011-12-31 2012-10-10 东莞安尚崇光科技有限公司 Welding-free conductive connection structure for LED (Light-Emitting Diode) aluminum substrate and driving power source
CN202791411U (en) * 2012-06-29 2013-03-13 广东奥其斯科技有限公司 Multidirectional irradiating light-emitting diode (LED) lamp tube

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000236111A (en) * 1999-02-15 2000-08-29 Matsushita Electric Works Ltd Light source equipment
JP3135971U (en) * 2007-05-23 2007-10-04 億光電子工業股▲ふん▼有限公司 LED backlight module
CN202484906U (en) * 2011-12-31 2012-10-10 东莞安尚崇光科技有限公司 Welding-free conductive connection structure for LED (Light-Emitting Diode) aluminum substrate and driving power source
CN102661501A (en) * 2012-04-18 2012-09-12 广东伟锋光电科技有限公司 Light emitting diode (LED) lamp bulb with integrated heat radiating structure
CN202791411U (en) * 2012-06-29 2013-03-13 广东奥其斯科技有限公司 Multidirectional irradiating light-emitting diode (LED) lamp tube

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