Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
  • H05K1/0203—Cooling of mounted components
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  • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
  • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
  • H01L24/19—Manufacturing methods of high density interconnect preforms
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  • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
  • H01L24/20—Structure, shape, material or disposition of high density interconnect preforms
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/03—Use of materials for the substrate
  • H05K1/0313—Organic insulating material
  • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
  • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/18—Printed circuits structurally associated with non-printed electric components
  • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
  • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
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  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/02—Bonding areas; Manufacturing methods related thereto
  • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
  • H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
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  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
  • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
  • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
  • H01L2224/241—Disposition
  • H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
  • H01L2224/24221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
  • H01L2224/24245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
  • H01L2224/24246—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic the HDI interconnect connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the item being planar
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  • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
  • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
  • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
  • H01L2224/321—Disposition
  • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
  • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
  • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/481—Disposition
  • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
  • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
  • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
  • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
• • H—ELECTRICITY
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  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/481—Disposition
  • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
  • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
  • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
  • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
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  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/484—Connecting portions
  • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
  • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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  • H01—ELECTRIC ELEMENTS
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  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
  • H01L2224/732—Location after the connecting process
  • H01L2224/73251—Location after the connecting process on different surfaces
  • H01L2224/73267—Layer and HDI connectors
• • H—ELECTRICITY
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  • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
  • H01L2224/92—Specific sequence of method steps
  • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
  • H01L2224/9222—Sequential connecting processes
  • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
  • H01L2224/92244—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a build-up interconnect
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  • H01L2924/11—Device type
  • H01L2924/13—Discrete devices, e.g. 3 terminal devices
  • H01L2924/1304—Transistor
  • H01L2924/1305—Bipolar Junction Transistor [BJT]
  • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
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  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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  • H01L2924/10—Details of semiconductor or other solid state devices to be connected
  • H01L2924/11—Device type
  • H01L2924/13—Discrete devices, e.g. 3 terminal devices
  • H01L2924/1304—Transistor
  • H01L2924/1306—Field-effect transistor [FET]
  • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
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  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
  • H01L2924/151—Die mounting substrate
  • H01L2924/153—Connection portion
  • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
  • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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  • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
  • H01L2924/181—Encapsulation
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  • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
  • H01L2924/191—Disposition
  • H01L2924/19101—Disposition of discrete passive components
  • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
  • H05K1/0203—Cooling of mounted components
  • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0213—Electrical arrangements not otherwise provided for
  • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
  • H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/03—Use of materials for the substrate
  • H05K1/0313—Organic insulating material
  • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
  • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/18—Printed circuits structurally associated with non-printed electric components
  • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
  • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
  • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
  • H05K2201/0203—Fillers and particles
  • H05K2201/0206—Materials
  • H05K2201/0209—Inorganic, non-metallic particles
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  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/09—Shape and layout
  • H05K2201/09209—Shape and layout details of conductors
  • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
  • H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors

Definitions

• the invention relates to a power module having at least one power component in a printed circuit board according to the preamble of claim 1 and to a base printed circuit board having such a power module according to the preamble of claim 8.
• Automotive technology components such as transmission, engine or brake systems are increasingly electronically controlled.
• mechatronic controls also referred to as on-site electronics, which can be generated by integration of control electronics and associated electronic components such as sensors or valves in the transmission, the engine or the brake system. That is, the control electronics and the associated electronic components are not housed in a separate protected electronics room outside the transmission, engine or brake system.
• control unit in the gearbox makes high demands on its thermal and mechanical loading capacity.
• the functionality has to be guaranteed over a wide temperature range (about -40 ° C up to 200 ° C) as well as for mechanical vibrations (up to about 40g).
• control unit is at least partially attacked by aggressive media Gearbox oil and transmission oil vapor is surrounded, it must also have a very high degree of seal against these media.
• the control unit usually a circuit carrier, for. B. includes a printed circuit board and located thereon active and passive electronic components.
• the circuit boards are made of fiber-reinforced plastic or ceramic.
• the components are mounted on the surface of the printed circuit board in the same orientation as the "surface-mounted” technology, ie the connecting legs of the components, also called pins, are picked up and the pad surfaces of the printed conductor structure, which are provided with solder paste or electrically conductive adhesive, are aligned soldered or fixed in a reflow soldering process or similar curing process, the pins on the underside of the component housing are thus just connected to the conductor track structure of the printed circuit board.
• the connecting legs of the components also called pins
• This arrangement of the components on the circuit board has in particular ⁇ special for use in transmission controls the disadvantage that the components can come into direct or indirect contact with the transmission oil. Due to the aggressive components contained in the gear oil possibly, in particular sulfur ⁇ shares in different concentrations and different states of matter, the functionalities of respective component can be adversely affected, which in individual cases can also lead to failure of the respective component.
• the invention has for its object to admit a power module with at least one power component in a circuit board ⁇ , which provides improved protection against environmental influences, especially aggressive oils and
• the power module according to the invention comprises at least one power component and a printed circuit board.
• the printed circuit board has at least one upper copper layer and one lower copper layer. Between the two copper layers, an electrically insulating circuit board base material is arranged, which is designed in particular as a resin-impregnated glass fiber base fabric, a so-called prepreg material.
• the power device is completely enclosed between the top copper layer and the bottom copper layer with the circuit board base material.
• the power component is thereby protected against environmental influences, in particular against aggressive oils.
• heatsink ambient ⁇ environment
• a power component for example a transistor
• unhoused power components are used, as these design-based produce less heat and have a smaller footprint than packaged components with the same performance.
• Two transistors in a power module can be connected in particular as a half bridge.
• a power component can be electrically conductively connected to the upper copper layer and the lower copper layer by means of at least one plated-through hole or an electrically conductive connecting layer.
• a power component prefferably be connected to one or both copper layers only by means of a through-connection or only by means of an electrically conductive connection layer.
• An electrically conductive connection layer can be realized for example by a conductive adhesive or solder.
• the lower copper layer of the printed circuit board is in particular a copper sheet, a so-called Kupferleadframe, or a copper laminate film, wherein the circuit board can also be designed as a compact multilayer printed circuit board.
• a Leis ⁇ processing module advantageously arranged in a cavity of the Basislei ⁇ terplatte and with the base printed circuit board by means of soldering, welding, gluing or by means of electrical Ankontak- tierungen electrically conductively connected in the form of microvias.
• Microvia Vertical Interconnect Access refers to a vertical plated through hole with a diameter smaller than 150 ⁇ m.
• At least one additional electrical component is arranged in the immediate vicinity of a power component and electrically conductively connected to this power component.
• the additional electrical member is in particular disposed either on a surface of the base board, in the base board or in Leis ⁇ processing module itself.
• the additional component may be, for example, a passive component, such as an interference suppression capacitor.
• the base circuit board can be used as a circuit board of a vehicle transmission control.
• Fig. 1 is a housed component on a circuit board in
• Fig. 2 is an unpackaged component on a circuit board according to prior art
• Fig. 3 shows an inventive power module with two Leis ⁇ processing components
• FIG. 4 shows a power module according to the invention for connection to a base circuit board
• FIG. 6 shows a base circuit board with integrated power module and a suppression component on the surface of the base plate
• FIG. 7 shows a base circuit board with integrated power module and a suppression component in the power module.
• power components such as power transistors, in particular MOSFETs, IGBTs, etc.
• the power components can be housed or inexhaustible, with unhoused components producing less heat than packaged components of equal power.
• Fig. 1 shows a clad component 4 on a printed circuit board in SMD technology according to the prior art.
• a component 4 with casing 9 is equipped, for example, for the appli ⁇ case of use in a transmission control in particular by the "surface-mounted" technology on the surface 2 of a single-layer here printed circuit board, wherein the circuit board includes a top copper layer 2 and a lower copper layer 3 and electrically insulating printed circuit board base material 1 is arranged between the two copper layers 2, 3.
• the corresponding pad surfaces on the printed circuit board are provided with soldering paste 5 as the bonding layer on which the component 4 is aligned with the connecting legs 7 and mounted in a subsequent curing process (eg Reflow soldering process, etc.).
• FIG. 2 shows an unhoused component 4, for example a transistor, on a single-layer printed circuit board 1, 2, 3 according to the prior art.
• the unhoused component 4 also called “bare-die”, is usually glued or soldered to the printed circuit board 12.
• the electrically conductive connection between the terminal pad 6 on the component 4 and the upper copper layer 2 of the printed circuit board is here produced by means of a bonding wire 8 (compare "chip & wire” technique).
• This "surface-mounted” technology has the disadvantage in particular in at ⁇ application in transmission controls that may occur as transmission oil to direct or indirect contact of the electrical components 4 with ambient media.
• transmission oil to direct or indirect contact of the electrical components 4 with ambient media.
• the aggressive components in the gear oil can lead to corrosion of Components 4 themselves, but also the leads such as the bonding wires 8 come. This can lead to failure of the components 4 and thus the entire transmission control.
• the power module here comprises two power components 4, which are integrated in a printed circuit board. However, only one or even more than two power components 4 could be used. In this case, the embedding of "bare-dies" is preferred because of their smaller construction height compared to housed components.
• the circuit board base material 1 is, in particular, a resin impregnated fiberglass base fabric, a so-called prepreg material and the lower copper layer 3 are completely enclosed with printed circuit board base material 1 and thereby protected from potentially damaging surrounding media, thus ensuring a reliable function of the power components 4 and thus of the power module 12.
• the thickness is upper and lower Copper layer 2, 3 each in the range of up to 105 ym.
• the copper layers 2, 3 may be thicker than conventional circuit boards of this type, the thickness normally being ⁇ 70 ym.
• the prepreg material 1 is designed as a thermal prepreg material filled with additives having a thermal conductivity greater than 0.5 W / mK.
• both the height of the printed circuit board can be reduced by the height of the components 4 and the bonding wires 8 and the printed circuit board overall surface around the surface of the contacts such as terminal pads.
• a power component 4 is electrically conductively connected to the lower copper layer 3 by means of through contacts 12, for example microvias, with the upper copper layer 2 and by means of an electrically conductive connection layer 5, for example a thermal adhesive.
• the two types of connection 12 and 5 to the copper layers 2, 3 could also be reversed.
• a power component 4 is connected to the copper layers 2, 3 only via plated-through holes 12 or only via connecting layers 5.
• the copper layers 2, 3 themselves are usually electrically conductively connected to each other by means of plated-through holes 12.
• FIG. 4 shows a power module as in FIG. 3, wherein a power component 4 only has plated-through holes 12
• FIG. 5 shows a base circuit board 11 with conductor tracks 14, wherein a power module, as disclosed in FIGS. 3 and 4, is integrated in a not explicitly highlighted recess or cavity of the base circuit board 11.
• the base-conductor plate 11 is designed here as a multi-layer printed circuit board, but it could also be single-layer.
• the power module with the exambau ⁇ share 4 is completely enclosed with insulating material of the base circuit board 11 and thus additionally protected from environmental influences.
• the power module is electrically conductively connected to the conductor tracks 14 of the base circuit board 11 by means of plated-through holes 12. This connection could also be by means of a
• Cohesive connection such as soldering, welding or gluing can be realized.
• the additional component 13 may, for example, be a passive component, in particular an interference suppression capacitor, which is arranged in the immediate vicinity of a power component 4.
• FIG. 7 shows a base circuit board 11 as in FIG. 6, wherein the additional electrical component 13 is arranged in the power module in the immediate vicinity of a power component 4.
• the additional electrical component 13 could also be arranged in the insulating layer of the base circuit board 11 outside the power module in the immediate vicinity of a power component 4.

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• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Computer Hardware Design (AREA)
• Power Engineering (AREA)
• Manufacturing & Machinery (AREA)
• Structure Of Printed Boards (AREA)
• Production Of Multi-Layered Print Wiring Board (AREA)

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Publications (1)

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Citations (6)

• 2014
  • 2014-09-11 DE DE102014218240.9A patent/DE102014218240A1/de not_active Withdrawn
• 2015
  • 2015-02-19 WO PCT/EP2015/053542 patent/WO2015135734A1/de active Application Filing

Patent Citations (6)

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