WO2015130091A1

WO2015130091A1 - Wired rubber contact and manufacturing method therefor

Info

Publication number: WO2015130091A1
Application number: PCT/KR2015/001847
Authority: WO
Inventors: 김형익
Original assignee: 주식회사 화우로; 김형익
Priority date: 2014-02-28
Filing date: 2015-02-26
Publication date: 2015-09-03
Also published as: CN106030916B; CN106030916A

Abstract

A wired rubber contact comprises a lower film, an upper film, a plurality of conductive wires, a rubber layer, and a film guide. The lower film includes a plurality of lower electrode parts formed in openings. The upper film is disposed such that the edge thereof is located inward from the border between the central region and the peripheral region of the lower film. The plurality of conductive wires are disposed between the lower and upper films and connect the lower electrode parts and upper electrode parts. The rubber layer contains resilient material, has an edge protruding further outward than the edge of the upper film, and maintains the distance between the lower and upper films to be constant. The film guide is disposed on the peripheral region of the lower film along the side surface of the rubber layer, is integrally formed with the lower film, and is thicker than the lower film.

Description

WIRED RUBBER CONTACTS AND MANUFACTURING METHOD THEREOF

The present invention relates to a wired rubber contact and a method of manufacturing the same, and more particularly, to a wired rubber contact and a method of manufacturing the improved life and reliability.

In the semiconductor manufacturing process, the inspection process is very important as it is directly related to the reliability of the product on the market. Semiconductors require intermediate inspections not only after the packaging phase but also before it.

To examine the electrical properties of the semiconductor before or after packaging, electricity must be applied to the pads of the semiconductor. Since it is almost impossible to directly apply electricity to a pad of a semiconductor having a highly integrated circuit, a pad having anisotropic characteristics is disposed between the semiconductor and the test stage. The electricity applied to the test stage is passed through the anisotropic pad to the semiconductor to perform the test.

Conventional anisotropic pads have a structure in which insulating silicone rubber is disposed between electrodes and upper and lower electrodes are cured of a silicone resin in which conductive particles are dispersed well, so that the electrodes are electrically energized above and below the electrodes.

This is because the dispersed state of each electrode is different, the reliability of the product is not uniform for each product, and if the electrode is pressed more than 30%, the conductive particles torn the silicon little by little it causes the quality and life of the product shortened.

In addition, as the height of the silicon increases, the quality is significantly reduced. On the contrary, if the pitch of the electrode is reduced, there is a problem that the lifetime of the product is reduced and the electrical characteristics are also reduced.

As another anisotropic pad technology, the technology of injecting electric wire into silicone rubber has been studied. However, when the wires are embedded in the silicone rubber, the wires and pads are embedded in the silicone rubber during the test is repeated.

An object of the present invention for solving the above problems is to provide a wired rubber contact with increased life and improved reliability.

Another object of the present invention is to provide a method of manufacturing the wired rubber contact.

In order to achieve the above object of the present invention, the wired rubber contact includes a lower film, an upper film, a plurality of conductive wires, a rubber layer, and a film guide. The lower film includes a central region in which a plurality of openings are formed and a peripheral region surrounding the central region, and includes a plurality of lower electrode portions formed in the openings. The upper film includes a plurality of openings and a plurality of upper electrode portions formed in the openings, and an edge thereof is disposed inward of a boundary between the central area and the peripheral area of the lower film. The plurality of conductive wires are disposed between the lower film and the upper film and connect between the lower electrode portions and the upper electrode portions. The rubber layer includes an elastic material and is disposed in the central region of the lower film, and an edge protrudes outward from an edge of the upper film, and fills the conductive wires and between the lower film and the upper film. Keep the distance constant. The film guide may include a film guide disposed on the peripheral area of the lower film along the side surface of the rubber layer, integrally formed with the lower film, and having a thickness thicker than that of the lower film.

In one embodiment, the upper film and the lower film may be formed integrally with the rubber layer.

In the method of manufacturing a wired rubber contact for achieving the above object of the present invention, first penetrating each of the openings in the lower film including a central region formed with a plurality of openings and a peripheral region surrounding the central region; A lower electrode part is formed. Subsequently, a support plate for preventing the flow of the lower film on the peripheral area and opening the center to expose the center area is attached. Thereafter, conductive wires arranged in a vertical direction on the lower electrode portion are coupled. Subsequently, a mold surrounding the central area is formed on the support plate. Subsequently, a raw upper film including a plurality of openings and a plurality of upper electrode portions formed in the openings is disposed on the conductive wire and the mold, and an upper end of the conductive wire is coupled to the upper electrode portions. Thereafter, a rubber layer is formed in an inner space defined by the lower film, the mold, and the raw upper film. Subsequently, the raw upper film is cut along a cutting line disposed inward from a boundary between the central area and the peripheral area of the lower film to form an upper film having an edge disposed inward of an edge of the rubber layer. . Next, the mold and the support plate are removed. Thereafter, a film guide is attached onto the peripheral area of the lower film.

In an embodiment, the attaching the film guide may include forming the film guide integrally with the lower film.

In order to achieve the above object of the present invention, the wired rubber contact includes a lower film, an upper film, a plurality of conductive wires, a rubber layer, a film guide, and a coupling member. The lower film includes a plurality of openings and a plurality of lower electrode portions formed in the openings. The upper film includes a plurality of openings and a plurality of upper electrode portions formed in the openings and facing the lower electrode portions. The conductive wires are disposed between the lower film and the upper film and connect between the lower electrode portions and the upper electrode portions, and the length of the conductive wires is longer than a separation distance between the lower film and the upper film. The rubber layer includes an elastic material and is disposed between the lower film and the upper film to fill the conductive wires and to maintain a constant distance between the lower film and the upper film. The film guide is disposed to surround side surfaces of the rubber layer and the lower film and has a thickness thicker than that of the lower film. The adhesive member includes an elastic adhesive and is attached to a side surface of the rubber layer and an upper surface of the film guide to bond the rubber layer and the film guide.

In one embodiment, the coupling member may include an adhesive member or a coupling jig.

In the method for manufacturing a wired rubber contact to achieve the above object of the present invention, a plurality of lower electrodes formed in the openings and including a central region formed with a plurality of openings and a peripheral region surrounding the central region; A raw bottom film including parts and a raw top film including a plurality of openings and a plurality of upper electrode parts formed in the openings are arranged side by side. Subsequently, the lower electrode portion and the upper electrode portion are connected with a conductive wire. Thereafter, a silicon rubber is injected and cured between the raw upper film and the raw lower film. Subsequently, the raw upper film, the cured silicon rubber and the raw lower film are cut along the boundary between the central area and the peripheral area to form an upper film, a rubber layer and a lower film. Subsequently, the adhesive tape is attached to cover the entire lower surface of the film guide having a central opening having the same or larger size as the central region. Thereafter, the lower surface of the lower film is attached to the adhesive tape exposed through the central opening. Subsequently, the rubber layer is bonded to the film guide. Next, the adhesive tape is removed.

In an embodiment, the connecting of the lower electrode part and the upper electrode part with a conductive wire may include: forming the lower film and the upper part along two conveyors disposed to face each other such that an upper separation distance is greater than a lower separation distance. Moving the film; And sequentially connecting the lower electrode portion and the upper electrode portion with the conductive wires as the lower film and the upper film are moved.

In one embodiment, the lower electrode portion fills the opening of the raw lower film, the upper electrode portion is formed along the edge of the opening of the upper upper film to form a through hole in the center, the lower electrode portion and the upper The connecting of the electrode unit with the conductive wire may include: arranging the source upper film and the source lower film such that the lower electrode part is exposed through the through hole of the upper electrode part; Connecting one end of the conductive wire to an upper surface of the lower electrode portion and connecting the other end of the conductive wire to an upper surface or an inner surface of the upper electrode portion; And disposing the conductive wire between the raw upper film and the original lower film by separating the distance between the original upper film and the original lower film.

In an embodiment, the connecting of the lower electrode portion and the upper electrode portion with a conductive wire may further include filling the through hole by soldering the upper electrode portion.

According to the present invention as described above to solve this problem, the lower electrode portion and the upper electrode portion of the conductive member is firmly coupled to the lower film and the upper film is embedded in the rubber layer or the lower electrode portion or the upper electrode portion Defects are prevented.

In addition, the peripheral area corresponding to the edge of the lower film extends to the outside of the rubber layer and the film guide is combined with the lower film in the peripheral area, so that the wired rubber contact can be easily disposed or fixed on the stage. Furthermore, the film guide is disposed adjacent to the rubber layer to disperse the external force, thereby preventing the external force from concentrating on the boundary between the lower film and the rubber layer. Therefore, the lower film is prevented from peeling off from the rubber layer.

In addition, a gap is formed between the edge of the upper film and the edge of the center region of the lower film, thereby preventing the upper film from being peeled from the rubber layer by external force, thereby making the electrical connection of the conducting member stable.

Moreover, the upper film and the lower film cover the upper and lower surfaces of the rubber layer to protect the rubber layer and the conducting member from external contaminants such as dust and moisture.

In addition, the lower surface of the lower film is attached to the adhesive tape by pressing the upper film, but the lower electrode portion is disposed below the lower surface of the film guide. When the lower portion of the lower electrode portion is disposed below the lower surface of the film guide, the lower electrode portion can easily contact the electrode pad of the stage after the adhesive tape is removed.

Moreover, the elastic member and the film guide cover the side of the rubber layer, the lower film and the upper film to prevent the lower film or the upper film from being peeled from the rubber layer from external impact.

In addition, the adhesive member has elasticity to prevent external shock from being transmitted to the energizing member.

Moreover, the conductive wire can be continuously attached through the conveyor, so that the manufacturing time is shortened.

In addition, the length of the conductive wire is longer than the distance between the raw lower film and the upper upper film and the distance between the lower film and the upper film, thereby preventing the conductive wire from being broken by external impact during the manufacturing process.

Moreover, the process time is shortened by interposing the conductive wire and the mold between the raw top film and the raw bottom film in a continuous process.

In addition, the rubber layer is formed only in the inner space formed using the mold, so that the process of cutting the cured silicon rubber is omitted, thereby reducing defects in the cutting process.

Moreover, the upper electrode portion and the lower electrode portion have different structures, and thus it is possible to combine a plurality of conductive wires at the same time with the upper electrode portion and the lower electrode portion.

Therefore, the service life is extended and the reliability is improved.

1 is a plan view illustrating a wired rubber contact according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view taken along line II ′ of FIG. 1.

3 is a cross-sectional view illustrating a state in which the rubber contact illustrated in FIG. 1 is disposed between a semiconductor chip and a stage.

4, 6, 7, 9, 11, 12, 14, 15 to 17 are cross-sectional views illustrating a method of manufacturing the wired rubber contact shown in FIG. 1.

5, 8, 10, and 13 are plan views illustrating a method of manufacturing the wired rubber contact shown in FIG. 1.

18 is a cross-sectional view illustrating a method of manufacturing a wired rubber contact according to an embodiment of the present invention.

19 and 20 are enlarged cross-sectional views of portions 'A' and 'B' of FIG. 18.

21, 22, 24, 26, 28, 30, and 31 are cross-sectional views illustrating a method of manufacturing the wired rubber contact shown in FIG. 18.

23, 25, 27 and 29 are plan views illustrating a method of manufacturing the wired rubber contact illustrated in FIG. 18.

32 is a cross-sectional view illustrating a method of manufacturing a wired rubber contact according to an embodiment of the present invention.

33 is an enlarged cross-sectional view of a portion 'C' of FIG. 32.

34 to 37 are cross-sectional views illustrating a method of manufacturing the wired rubber contact shown in FIG. 32.

38 and 39 are cross-sectional views illustrating a method of manufacturing a wired rubber contact according to an embodiment of the present invention.

With respect to the embodiments of the present invention disclosed in the text, specific structural to functional descriptions are merely illustrated for the purpose of describing embodiments of the present invention, embodiments of the present invention may be implemented in various forms and It should not be construed as limited to the embodiments described in.

As the present invention allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in the text. However, this is not intended to limit the present invention to a specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. In describing the drawings, similar reference numerals are used for the components.

Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.

When a component is referred to as being "connected" or "connected" to another component, it may be directly connected to or connected to that other component, but it may be understood that other components may be present in between. Should be. On the other hand, when a component is said to be "directly connected" or "directly connected" to another component, it should be understood that there is no other component in between. Other expressions describing the relationship between components, such as "between" and "immediately between," or "neighboring to," and "directly neighboring to" should be interpreted as well.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "having" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof that is described, and that one or more other features or numbers are present. It should be understood that it does not exclude in advance the possibility of the presence or addition of steps, actions, components, parts or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

Hereinafter, with reference to the accompanying drawings, it will be described a preferred embodiment of the present invention. The same reference numerals are used for the same elements in the drawings, and duplicate descriptions of the same elements are omitted.

1 is a plan view illustrating a wired rubber contact according to an exemplary embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along the line II ′ of FIG. 1.

1 and 2, the wired rubber contact includes a film assembly 100, a rubber layer 150, an upper film 200, and an energizing member 300.

The film assembly 100 includes a lower film 110 and a film guide 120.

The lower film 110 includes a thin synthetic resin film. For example, the lower film 110 may have a thickness of 100 μm to 250 μm. In this embodiment, the lower film 110 may include a synthetic resin such as polyimide, polyvinyl, polypropylene, polycarbonate, FR4, PVC, and the like.

The lower film 110 includes a central area CA and a peripheral area PA surrounding the central area CA. The lower film 110 includes a plurality of openings disposed in the central area CA, and the lower electrode portions 310 are disposed through the lower film 110 in each opening. That is, the upper portion of each lower electrode portion 310 protrudes upward from the upper surface of the lower film 110, and the lower portion of each lower electrode portion 310 protrudes downward from the lower surface of the lower film 110.

The film guide 120 has a flat shape and is integrally formed on the lower film 110 to guide the lower film 110 to have a flat shape. The film guide 120 is disposed in the peripheral area PA of the lower film 110. In this embodiment, the film guide 120 may include a synthetic resin such as polyimide, polyvinyl, polypropylene, polycarbonate, FR4, PVC. For example, the film guide 120 may have a thickness of 500 μm to 1 mm.

The upper film 200 includes a thin synthetic resin film. For example, the upper film 200 may have a thickness of 100 μm to 250 μm. In this embodiment, the upper film 200 may include a synthetic resin, such as polyimide, polyvinyl, polypropylene, polycarbonate, FR4, PVC. For example, the upper film 200 may include the same material as the lower film 110.

The upper film 200 is disposed on the lower film 110 so as to face each other, and corresponds to the central area CA of the lower film 110.

The upper film 200 includes a plurality of openings corresponding to the openings of the lower film 110, and upper electrodes 320 are disposed through the upper film 200 in each opening. That is, the upper portion of each upper electrode portion 320 protrudes upward from the upper surface of the upper film 200, and the lower portion of each upper electrode portion 320 protrudes downward from the lower surface of the upper film 200.

The rubber layer 150 is disposed between the central area CA of the lower film 110 and the upper film 200 to maintain a constant distance between the lower film 110 and the upper film 200.

The rubber layer 150 may include an elastic material, for example, silicone resin, synthetic rubber, or the like. When an external force is applied on the upper film 200, the rubber layer 150 contracts to resist the external force. In addition, even when the semiconductor chip (20 of FIG. 3) having an irregular shape is disposed on the upper film 200, stable electrical coupling is possible by contraction of the rubber layer 150. In another embodiment, the rubber layer 150 may be omitted because the conductive wire 330 itself has sufficient rigidity and elasticity.

In this embodiment, a gap g is formed between the edge of the upper film 200 and the edge of the central area CA of the lower film 110. An edge of the rubber layer 150 protrudes from the edge of the upper film 200 by the gap g through the gap g. When the edge of the rubber layer 150 does not protrude more than the edge of the upper film 200, the edge of the upper film 200 may be disposed at the corner of the rubber layer 150 or protrude more than the rubber layer 150. When the edge of the upper film 200 is disposed at the corner of the rubber layer 150 or protrudes from the rubber layer 150, the upper film 200 may be peeled off from the rubber layer 150 by external force. When the upper film 200 is peeled off and lifted from the rubber layer 150, an impact is applied to the upper electrode part 320 so that the connection of the upper electrode part 320 becomes poor or a conductive wire connected to the upper electrode part 320. 330 may be broken. However, as in the present embodiment, when the edge of the rubber layer 150 protrudes from the edge of the upper film 200 by a gap g, the phenomenon in which the upper film 200 is peeled from the rubber layer 150 is prevented. Electrical connection of the energizing member 300 is stabilized.

The energizing member 300 includes a lower electrode 310, an upper electrode 320 and a conductive wire 330.

The lower electrode 310 is formed through each opening of the lower film 110. In the present embodiment, the lower electrode 310 may be formed using soldering. For example, the lower electrode part 310 may be formed by soldering a liquid solder paste to a screen-printed film (for example, a blind via type film) using heat or a laser. Soldering may include tin, lead, gold, silver alloys, copper, aluminum, nickel, rhodium, alloys thereof, and the like. For example, the width of the upper and lower portions of the lower electrode portion 310 is greater than the diameter of each opening of the lower film 110 so that the lower electrode portion 310 may be firmly coupled to the lower film 110.

The upper electrode part 320 is formed through each opening of the upper film 200. In the present embodiment, the upper electrode 320 may be formed using soldering. For example, the upper electrode part 320 may be formed by soldering a liquid solder paste to a screen-printed film (for example, a blind via type film) using heat or a laser. Soldering may include tin, lead, gold, silver alloys, copper, aluminum, nickel, rhodium, alloys thereof, and the like. For example, the width of the upper and lower portions of the upper electrode portion 320 is greater than the diameter of each opening of the upper film 200 so that the upper electrode portion 320 may be firmly coupled to the upper film 200.

The conductive wire 330 penetrates the rubber layer 150 to electrically connect the lower electrode 310 and the upper electrode 320. For example, the conductive wire 330 may include tin, lead, gold, silver alloy, copper, aluminum, nickel, rhodium, alloys thereof, and the like. In another embodiment, the conductive wire 330 may include an inner conductive layer (not shown) and an outer elastic layer (not shown) coating the inner conductive layer (not shown). For example, the inner conductive layer (not shown) may include a gold conductor, and the outer elastic layer (not shown) may include a nickel layer plated on the surface of the inner conductive layer (not shown).

1 to 3, the semiconductor chip 20 is disposed on the upper film 200. The electrode pads 21 of the semiconductor chip 20 are in contact with the upper electrode portion 320 exposed on the upper film 200.

The stage 30 is disposed below the film assembly 100. For example, the stage 30 may be a stage for inspecting the semiconductor chip 20. The lower electrode portion 310 exposed to the lower portion of the lower film 110 contacts the electrode pads 31 of the stage 30.

4, 6, 7, 9, 11, 12, 14, 15 to 17 are cross-sectional views illustrating a method of manufacturing the wired rubber contact shown in FIG. 1, and FIGS. 5, 8, 10 and 13 are wired shown in FIG. It is a top view which shows the manufacturing method of a rubber contact.

4 is a cross-sectional view illustrating a step of forming lower electrode parts on a lower film.

Referring to FIG. 4, first, openings are formed in the central region (CA of FIG. 2) of the lower film 110. Subsequently, solder paste is printed in the openings of the lower film 110. Thereafter, the printed solder paste is irradiated with heat or laser to form the lower electrode part 310.

FIG. 5 is a plan view illustrating a step of arranging the support plate on the lower film illustrated in FIG. 4, and FIG. 6 is a cross-sectional view of the II-II ′ line of FIG. 5.

5 and 6, the support plate 130 is attached to the peripheral area (PA of FIG. 2) of the lower film 110 on which the lower electrode part 310 is formed. The support plate 130 is opened at the center thereof to expose the central area (CA of FIG. 2) of the lower film 110.

7 is a cross-sectional view illustrating a step of forming a conductive wire on the lower electrode illustrated in FIGS. 5 and 6.

Referring to FIG. 7, the conductive wire 330 is soldered onto the lower electrode 310. For example, after the end of the conductive wire 330 is inserted into the lower film 110 on which the solder paste is printed, the lower electrode portion 310 and the conductive wire 330 are irradiated with heat or a laser beam. Can be formed.

FIG. 8 is a plan view illustrating a step of forming a mold on the support plate illustrated in FIG. 7, and FIG. 9 is a cross-sectional view of the III-III ′ line of FIG. 8.

8 and 9, the mold 140 surrounding the central region (CA of FIG. 2) is formed on the support plate 130. For example, the mold 140 may be disposed in a peripheral region (PA of FIG. 2) adjacent to the central region (CA of FIG. 2) to surround the central region (CA of FIG. 2).

In another embodiment, a portion of the mold 140 may be opened to form an inlet (not shown) of a silicon rubber (not shown).

FIG. 10 is a plan view illustrating a process of disposing a raw top film on a mold illustrated in FIGS. 8 and 9, and FIG. 11 is a cross-sectional view of the IV-IV ′ line of FIG. 10.

10 and 11, the raw upper film 201 is then disposed on the mold 140, and the conductive wire 330 is connected to the upper electrode part 320.

For example, a plurality of openings are formed in the central region of the raw upper film 201, and a solder paste is printed in each opening. Thereafter, the raw upper film 201 is disposed on the mold 140 to insert the upper portion of the conductive wire 330 into the solder paste. Subsequently, the solder paste is irradiated with heat or laser to form the upper electrode part 320 soldered to the conductive wire 330.

The raw upper film 201, the lower film 110, the mold 140, and the support plate 130 define an inner space 151, and the conductive wire 330 is disposed in the inner space 151.

FIG. 12 is a cross-sectional view illustrating a step of forming a rubber layer in an internal space illustrated in FIGS. 10 and 11.

10 to 12, the rubber layer 150 is formed by injecting and curing the silicon rubber into the internal space 151. For example, an opening (not shown) for injecting the silicon rubber into the inner space 151 is formed, and the silicon rubber is opened through the opening (not shown) while keeping the inner space 151 in a vacuum state. It can also be injected.

Thereafter, the rubber layer 150 is formed by curing the silicon rubber injected into the internal space 151. For example, the rubber layer 150 may be formed by heating the silicon rubber.

FIG. 13 is a plan view illustrating a process of forming a top film by removing a portion of the original upper film shown in FIG. 12, and FIG. 14 is a cross-sectional view taken along the line VV ′ of FIG. 13.

12 to 14, a portion of the raw upper film 201 is cut to generate the upper film 200. In this embodiment, the cutting line of the raw upper film 201 is disposed on the rubber layer 150. That is, the cutting line of the raw upper film 201 forms a gap g toward the center region (CA of FIG. 2) based on a boundary between the center region (CA of FIG. 2) and the peripheral region (PA of FIG. 2). Is arranged to. The edge of the upper film 200 and the edge of the rubber layer 150 are spaced apart by a gap g.

FIG. 15 is a cross-sectional view illustrating a step of removing a mold illustrated in FIGS. 13 and 14.

13 to 15, the mold 140 surrounding the rubber layer 150 is then removed. When the mold 140 is removed, the edge of the rubber layer 150 is exposed to the outside so that the pressure applied to the upper portion of the rubber layer 150 may be transmitted to the side.

FIG. 16 is a cross-sectional view illustrating a step of removing the support plate illustrated in FIG. 15.

15 and 16, the support plate 130 disposed on the lower film 110 is removed afterwards. When the support plate 130 is removed, the upper surface of the lower film 110 is exposed. In another embodiment, the film guide (120 of FIG. 17) may be omitted without removing the support plate 130, so that the support plate 130 may serve as the film guide (120 of FIG. 17).

17 is a cross-sectional view showing a step of attaching a film guide on the lower film shown in FIG.

Referring to FIG. 17, the film guide 120 is continuously attached to the peripheral area (PA of FIG. 2) of the lower film 110. In the present embodiment, the film guide 120 is opened at the center, and the rubber layer 150 and the upper film 200 are exposed through the opened center of the film guide 120.

According to the present embodiment as described above, the lower electrode portion 310 and the upper electrode portion 320 of the conductive member 300 is firmly coupled to the lower film 110 and the upper film 200, the lower electrode portion 310 ) Or a defect in which the upper electrode portion 320 is embedded in the rubber layer 150 is prevented.

In addition, the peripheral area PA corresponding to the edge of the lower film 110 extends to the outside of the rubber layer 150 and the film guide 120 is coupled to the lower film 110 in the peripheral area PA, thereby wired. The rubber contact can be easily placed or secured on the stage (30 in FIG. 3). Furthermore, the film guide 120 is disposed adjacent to the rubber layer 150 to disperse the external force to prevent the external force from concentrating on the boundary between the lower film 110 and the rubber layer 150. Therefore, the lower film 110 is prevented from peeling off from the rubber layer 150.

In addition, a gap g is formed between the edge of the upper film 200 and the edge of the center area CA of the lower film 110, so that the upper film 200 is peeled from the rubber layer 150 by an external force. The electrical connection of the energization member 300 is stabilized by preventing the phenomenon.

18 is a cross-sectional view illustrating a method of manufacturing a wired rubber contact according to an embodiment of the present invention, and FIGS. 19 and 20 are enlarged cross-sectional views of portions 'A' and 'B' of FIG. 18.

18 to 20, two opposing

conveyors

501, 502 are first placed in order to make wired rubber contacts. The separation distance at the top of the two

conveyors

501, 502 is greater than the separation distance at the bottom. In this embodiment, the upper portions of the

conveyors

501 and 502 are arranged in the planar direction, and the lower portions are arranged side by side in the vertical direction.

The original lower film 1101 and the original upper film 1201 move from the top to the bottom of the

conveyors

501 and 502, respectively. Each of the original lower film 1101 and the original upper film 1201 includes a plurality of openings, and a lower electrode portion 310 and an upper electrode portion 320 are disposed in each opening. In another embodiment, a liquid solder paste may be disposed in each of the openings of the raw bottom film 1101 and the raw top film 1201 by screen printing.

The conductive wire 1330 connecting the lower electrode 310 and the upper electrode 320 is disposed at a portion where the distance between the

conveyors

501 and 502 becomes narrow. For example, one end of the conductive wire 1330 is inserted into the liquid solder paste of the raw lower film 1101 and the other end is inserted into the liquid solder paste of the raw upper film 1201, and then heat or laser is applied to the liquid solder paste. You can investigate. When the liquid solder paste is irradiated with heat or a laser, the lower electrode 310 and the upper electrode 320, which are connected through the conductive wire 1330, are formed.

In the present embodiment, the length of the conductive wire 1330 is longer than the distance between the original lower film 1101 and the original upper film 1201, thereby preventing the conductive wire 1330 from being broken during the manufacturing process.

As the lower raw film 1101 and the upper raw film 1201 move along the

conveyors

501 and 502, the conductive wire 1330 is sequentially disposed between the lower electrode 310 and the upper electrode 320. Connected.

21, 22, 24, 26, 28, 30, and 31 are cross-sectional views illustrating a method of manufacturing the wired rubber contact shown in FIG. 18, and FIGS. 23, 25, 27, and 29 are manufactured in the wired rubber contact shown in FIG. Are plan views illustrating the method.

FIG. 21 is a cross-sectional view illustrating a conductive member manufactured through the process of FIGS. 18 to 20.

Referring to FIG. 21, the energizing member 1300 connects the lower electrode 310 and the upper electrode 320. The lower electrode 310 is disposed through the openings of the original lower film 1101, and the upper electrode 320 is disposed through the openings of the original upper film 1201. In the present embodiment, the energizing member 1300 is disposed only in the center region of the original lower film 1101 and the original upper film 1201.

FIG. 22 is a cross-sectional view illustrating a step of filling a silicon rubber between the raw bottom film and the raw top film shown in FIG. 21.

Referring to FIG. 22, a silicon rubber is filled between the raw bottom film 1101 and the raw top film 1201. In the present embodiment, the silicon rubber is disposed not only in the central region in which the energizing member 1300 is disposed, but also in the peripheral region surrounding the central region in which the energizing member 1300 is not disposed. The filled silicone rubber is then cured.

FIG. 23 is a plan view illustrating a process of forming a lower film, an upper film, and a rubber layer by cutting a portion of the raw lower film, the upper upper film, and the cured silicon rubber shown in FIG. 22, and FIG. 24 is shown in FIG. 23. Sectional view of the VI-VI 'line.

Referring to FIGS. 22 to 24, the raw lower film 1101 is cured along the boundary between the central area CA in which the conducting member 300 is disposed and the peripheral area PA in which the conducting member 300 is not disposed. The silicon rubber 1151 and the raw upper film 1201 are cut to form the lower film 1102, the rubber layer 1150, and the upper film 1200.

FIG. 25 is a cross-sectional view illustrating a step of attaching an adhesive tape to a film guide, and FIG. 26 is a cross-sectional view of the VII-VII ′ line of FIG. 25.

25 and 26, the adhesive tape 1123 is attached to the lower surface of the film guide 1120. The film guide 1120 includes a central opening 1108 in which the lower film 1102 and the rubber layer 1150 are accommodated, and a fixing hole 1107 for fixing to the stage (30 of FIG. 3). The adhesive tape 1123 is easily attached and detached, and the lower surface of the film guide 1120 is attached to the upper surface coated with the adhesive material.

The central portion of the adhesive tape 1123 is exposed through the central opening 1108 of the film guide 1120.

FIG. 27 is a plan view illustrating a step of attaching the lower film shown in FIGS. 23 and 24 to the adhesive tape shown in FIGS. 25 and 26, and FIG. 28 is a cross-sectional view taken along the line VIII-VIII ′ of FIG. 27.

23 to 28, the lower surface of the lower film 1102 is attached to the upper surface of the adhesive tape 1123 exposed through the central opening 1108 of the film guide 1120. In this embodiment, the upper film 1200 is pressed so that the lower surface of the lower film 1102 is attached to the adhesive tape 1123, but the lower portion of the lower electrode 310 is lower than the lower surface of the film guide 1120. Place it. When the lower portion of the lower electrode 310 is disposed below the lower surface of the film guide 1120, after the adhesive tape 1123 is removed, the lower electrode 310 is disposed on the electrode pad of the stage (30 of FIG. 3). 3, 31) can be easily contacted.

FIG. 29 is a plan view illustrating the step of attaching the rubber layers illustrated in FIGS. 27 and 28 to the film guide, and FIG. 30 is a cross-sectional view of the line IX-IX ′ illustrated in FIG. 29.

29 and 30, an elastic adhesive is applied along the boundary of the rubber layer 1150 and the film guide 1120. For example, the elastic adhesive may comprise a silicone resin. In the present embodiment, when the silicone resin is applied to a portion of the side of the rubber layer 1150 and the upper surface of the film guide 1120 adjacent to the rubber layer 1150, the applied silicone resin is the side of the rubber layer 1150 and the film Coating part of the top of the guide.

Subsequently, an adhesive member 1160 is formed to cure the coated silicone resin to bond the rubber layer 1150 and the film guide 1120. In this embodiment, the adhesive member 1160 covers not only the side of the rubber layer 1150 but also the side of the upper film 1200 to prevent the edge of the upper film 1200 from being peeled from the rubber layer 1150. In another embodiment, the upper film 1200 and the rubber layer 1150 may be bonded using a joining jig (not shown) instead of the adhesive member 1160.

FIG. 31 is a cross-sectional view illustrating a step of removing the adhesive tape shown in FIGS. 29 and 30.

29 to 31, the adhesive tape 1123 is removed from the lower surface of the lower substrate 1102 and the lower surface of the film guide 1120. This completes the wired rubber contact.

According to the present embodiment as described above, the elastic member 1160 and the film guide 1120 cover the sides of the rubber layer 1150, the lower film 1102 and the upper film 1200 to prevent the lower film ( 1102 or upper film 1200 is prevented from peeling off from rubber layer 1150.

In addition, the adhesive member 1160 has elasticity to prevent the external shock from being transmitted to the energizing member 1300.

Furthermore, the conductive wires 1330 can be continuously attached through the

conveyors

501 and 502, thereby shortening the manufacturing time.

In addition, the length of the conductive wire 1330 is longer than the distance between the original lower film 1101 and the original upper film 1201 and the distance between the lower film 1102 and the upper film 1200, and thus the external impact during the manufacturing process. This prevents the conductive wire 1330 from breaking.

32 is a cross-sectional view illustrating a method of manufacturing a wired rubber contact according to an embodiment of the present invention, and FIG. 33 is an enlarged cross-sectional view of a portion 'C' of FIG. 32. In the present embodiment, the rest of the components except for the mold is the same as the embodiment shown in Figs. 18 to 31, and overlapping description of the same components will be omitted.

32 and 33, in order to manufacture the wired rubber contact, two opposing

conveyors

501, 502 are first placed.

conveyors

501 and 502, respectively. The primitive mold 1141 is dripped on the upper raw film 1201. In this embodiment, the raw mold 1141 comprises uncured synthetic resin and is applied as if surrounding the periphery of the raw top film 1201. In another embodiment, the raw mold 1141 may be dropped on the raw bottom film 1101, or may be dropped together on the raw top film 1201 and the raw bottom film 1101 together. For example, the raw mold may include a photoresist.

In the process of moving the original lower film 1101 and the original upper film 1201, the raw mold 1141 dropped on the original upper film 1201 is contacted and attached to the original lower film 1101.

conveyors

501 and 502 becomes narrow.

FIG. 34 is a cross-sectional view illustrating the energizing member manufactured through the process of FIGS. 32 and 33.

32 to 34, the energizing member 1300 connects the lower electrode 310 and the upper electrode 320, and only within the central region of the raw lower film 1101 and the raw upper film 1201. Is placed. The primitive mold 1141 is disposed in the peripheral region of the primitive lower film 1101 and the primitive upper film 1201 to surround the energizing member 1300.

The primitive mold 1141 is then cured to form a mold 1140. The inner space 151 is defined by the original lower film 1101, the original upper film 1201, and the mold 1140.

35 is a cross-sectional view illustrating a step of filling a silicon rubber in the internal space shown in FIG. 34.

34 and 35, the silicon rubber is filled in the internal space 151 defined by the original lower film 1101, the original upper film 1201, and the mold 1140. In this embodiment, the silicon rubber is disposed only in the central region where the energizing member 1300 is disposed. The filled silicone rubber is then cured.

FIG. 36 is a cross-sectional view illustrating a process of cutting a portion of a raw upper film shown in FIG. 35 and removing a mold;

Referring to FIGS. 35 and 36, the raw upper film 1101 is cut along the boundary between the central area CA in which the conducting member 1300 is disposed and the peripheral area PA in which the conducting member 1300 is not disposed. The upper film 1200 is formed. In this embodiment, the cutting line of the raw upper film 1201 is the same as the edge of the mold 1150. In another embodiment, a cutting line of the raw top film 1201 may be disposed on the top surface of the mold 1150 to form a gap (g of FIG. 2).

Thereafter, the mold 1140 is removed to expose the top surface of the raw bottom film 1101 and the side surface of the rubber layer 1150. For example, the mold 1140 can be removed using a solvent such as a developing solution.

FIG. 37 is a cross-sectional view illustrating a step of attaching a film guide to an upper surface of the original lower film 1101 shown in FIG. 36.

Referring to FIG. 37, the film guide 1120 is attached to an upper surface of the original lower film 1101. The upper film 1200, the upper electrode part 320, and the rubber layer 1150 are exposed through the central opening of the film guide 1120.

According to the present embodiment as described above, the process time is shortened by interposing the conductive wire 1330 and the mold 1140 between the original upper film 1201 and the original lower film 1101 in a continuous process.

In addition, the rubber layer 1150 is formed only in the internal space 151 formed by using the mold 1140, thereby cutting the cured silicon rubber (1151 of FIG. 22), thereby reducing defects in the cutting process. do.

38 and 39 are cross-sectional views illustrating a method of manufacturing a wired rubber contact according to an embodiment of the present invention. In the present embodiment, the remaining components except for the conducting member are the same as the embodiments shown in Figs. 1 to 37, so that duplicate description of the same components is omitted.

Referring to FIG. 38, a raw bottom film 2101 and a raw top film 2201 having a plurality of openings formed in a central area are prepared.

Subsequently, a lower electrode part 2310 is formed to fill each opening of the raw bottom film 2101, and an upper electrode part 2320 is formed around each opening of the raw top film 2201. In the present embodiment, the lower electrode portion 2310 fills each opening of the original lower film 2101, but the upper electrode portion 2320 has a through hole in the center without filling each opening of the raw upper film 2201. Keep it. That is, the upper electrode part 2320 is formed along the edge of each opening of the original upper film 2201.

Thereafter, the source upper film 2201 and the source lower film 2101 are arranged such that the lower electrode part 2310 is exposed through the through hole of the upper electrode part 2320.

Subsequently, the conductive wires 2330 are coupled to the lower electrode portion 2310 and the upper electrode portion 2320. In this embodiment, one end of the conductive wire 2330 is connected to the upper surface of the lower electrode portion 2310 and the other end is connected to the upper or inner surface of the upper electrode portion 2320. For example, the conductive wire 2330 may be bonded to the lower electrode portion 2310 and the upper electrode portion 2320 using soldering.

Subsequently, the distance between the upper upper film 2201 and the lower lower film 2101 is spaced apart so that the conductive wire 2330 is disposed between the upper upper film 2201 and the lower lower film 2101. In this case, a soldering process of filling the through hole of the upper electrode part 2320 may be added.

Thereafter, the silicon rubber is filled and cured between the raw upper film 2201 and the raw lower film 2101.

Subsequently, the raw top film 2201 and / or cured silicon rubber (not shown) are cut to form a top film (not shown) and a rubber layer (not shown).

Next, a film guide (not shown) is disposed along the side of the rubber layer (not shown).

According to the present exemplary embodiment as described above, the upper electrode portion 2320 and the lower electrode portion 2310 have different structures, so that a plurality of conductive wires 2330 are simultaneously connected to the upper electrode portion 2320 and the lower electrode portion 2310. It is possible to combine

In the above embodiments, a structure including a rubber layer is disclosed. In another embodiment, the rubber layer may be omitted and the wired rubber contact may be implemented using the elasticity of the conductive wire itself.

In the above embodiments, the raw top film and the raw bottom film can be used interchangeably with the terms top film and bottom film, respectively.

According to the embodiments of the present invention as described above, the lower electrode portion and the upper electrode portion of the energizing member is firmly coupled to the lower film and the upper film to prevent the failure of the lower electrode portion or the upper electrode portion embedded in the rubber layer.

Therefore, the service life is extended and the reliability is improved.

The present invention has industrial applicability applied to test equipment of semiconductors, connecting members between circuit components, and the like. In the above-described embodiment, a wired rubber contact connecting a semiconductor chip and an inspection stage is disclosed, but any person having ordinary knowledge and experience in the art may see wherever conventional anisotropic conductive films are used. It will be appreciated that the inventive concept may be applied.

As described above, the present invention has been described with reference to a preferred embodiment of the present invention, but those skilled in the art may vary the present invention without departing from the spirit and scope of the present invention as set forth in the claims below. It will be understood that modifications and changes can be made.

Claims

A lower film including a central region in which a plurality of openings are formed and a peripheral region surrounding the central region, and including a plurality of lower electrode portions formed in the openings;

An upper film including a plurality of openings and a plurality of upper electrode portions formed in the openings, the upper film having an edge disposed inside the boundary between the central area and the peripheral area of the lower film;

A plurality of conductive wires disposed between the lower film and the upper film and connecting the lower electrode portions and the upper electrode portions;

An elastic material, disposed in the central region of the lower film, an edge protruding outward from an edge of the upper film, embedding the conductive wires, and maintaining a distance between the lower film and the upper film; Rubber layer to keep it; And

And a film guide disposed on the peripheral area of the lower film along the side of the rubber layer and integrally formed with the lower film, the film guide having a thickness greater than that of the lower film.
The wired rubber contact as claimed in claim 1, wherein the upper film and the lower film are integrally formed with the rubber layer.
Forming a lower electrode portion penetrating the openings in a lower film including a central region in which a plurality of openings are formed and a peripheral region surrounding the central region;

Attaching a support plate preventing the flow of the lower film on the peripheral area and opening the center to expose the central area;

Coupling conductive wires arranged in a vertical direction on the lower electrode portion;

Forming a mold surrounding the central region on the support plate;

Disposing a raw upper film including a plurality of openings and a plurality of upper electrode portions formed in the openings on the conductive wire and the mold, and coupling an upper end of the conductive wire to the upper electrode portions;

Forming a rubber layer in an inner space defined by the lower film, the mold and the raw upper film;

Cutting the raw upper film along a cutting line disposed inward from a boundary between the central area and the peripheral area of the lower film to form an upper film having an edge disposed inward of an edge of the rubber layer;

Removing the mold and the support plate; And

And attaching a film guide on the peripheral area of the lower film.
The method of claim 3, wherein attaching the film guide comprises forming the film guide integrally with the lower film.
A lower film including a plurality of openings and a plurality of lower electrode portions formed in the openings;

An upper film including a plurality of openings and a plurality of upper electrode portions formed in the openings and facing the lower electrode portions;

A plurality of conductive wires disposed between the lower film and the upper film and connecting the lower electrode portions and the upper electrode portions, and having a length greater than a separation distance between the lower film and the upper film;

A rubber layer comprising an elastic material and disposed between the lower film and the upper film to fill the conductive wires and to maintain a constant distance between the lower film and the upper film;

A film guide disposed to surround side surfaces of the rubber layer and the lower film and having a thickness thicker than that of the lower film; And

A wired rubber contact comprising an elastic adhesive and attached to a side of the rubber layer and an upper surface of the film guide to couple the rubber layer to the film guide.
6. The wired rubber contact as claimed in claim 5, wherein the coupling member comprises an adhesive member or a coupling jig.
A raw bottom film comprising a central region in which a plurality of openings are formed and a peripheral region surrounding the central region, and including a plurality of lower electrode portions formed in the openings, a plurality of openings and a plurality of openings formed in the openings. Arranging the original upper film including the upper electrode parts side by side;

Connecting the lower electrode portion and the upper electrode portion with a conductive wire;

Injecting and curing a silicone rubber between the raw upper film and the raw lower film;

Cutting the raw upper film, the cured silicon rubber and the raw lower film along a boundary between the central area and the peripheral area to form an upper film, a rubber layer and a lower film;

Attaching an adhesive tape to cover the entire lower surface of the film guide having a central opening having a size equal to or larger than that of the central region;

Attaching a lower surface of the lower film to the adhesive tape exposed through the central opening;

Bonding the rubber layer and the film guide to each other; And

Method of manufacturing a wired rubber contact comprising the step of removing the adhesive tape.
The method of claim 7, wherein the connecting of the lower electrode portion and the upper electrode portion with a conductive wire,

Moving the lower film and the upper film along two conveyors disposed to face each other such that an upper separation distance is greater than a lower separation distance; And

And sequentially connecting the lower electrode portion and the upper electrode portion with the conductive wires as the lower film and the upper film are moved.
The method of claim 7, wherein the lower electrode portion fills the opening of the raw lower film, and the upper electrode portion is formed along an edge of the opening of the raw upper film to form a through hole in the center thereof.

Connecting the lower electrode portion and the upper electrode portion with a conductive wire,

Arranging the source upper film and the source lower film such that the lower electrode part is exposed through the through hole of the upper electrode part;

Connecting one end of the conductive wire to an upper surface of the lower electrode portion and connecting the other end of the conductive wire to an upper surface or an inner surface of the upper electrode portion; And

And disposing the conductive wire between the raw upper film and the raw lower film by separating the distance between the upper raw film and the lower raw film.
The method of claim 9, wherein the connecting of the lower electrode part and the upper electrode part with a conductive wire further comprises soldering the upper electrode part to fill the through hole. .