WO2015123804A1

WO2015123804A1 - Self-adhering circuit soft adhesive film and led lamp structure using soft adhesive film

Info

Publication number: WO2015123804A1
Application number: PCT/CN2014/072168
Authority: WO
Inventors: 陈鸿文
Original assignee: 陈鸿文; 张胜钧
Priority date: 2014-02-18
Filing date: 2014-02-18
Publication date: 2015-08-27

Abstract

A high heat dissipating, simple structured, and easy-to-install self-adhering circuit soft adhesive film (100), comprising an insulating adhesive layer (1001), a thin layer circuit (1003) and heat-conducting particles (1002). The soft adhesive film (100) has both insulating and heat-conducting properties, and the thin layer circuit (1003) can be installed onto a heat dissipation lamp (210) adhesively, thus simplifying the installation process of LED lamps. The self-adhesive circuit soft adhesive film (100) is applied to an LED lamp structure (200) and can improve the heat dissipation of the LED lamp structure (200) and reduce the structural complexity of the LED lamp structure (200) by being adhered to different heat dissipating lamps (210).

Description

Self-adhesive circuit soft film and LED lamp body structure using the same

Technical field

The invention belongs to the technical field of LED illumination, and relates to a self-adhesive circuit soft film and an LED lamp body structure using the same. Background technique

LEDs are a type of semiconductor diode that converts electrical energy into light energy. The LED light-emitting diode is composed of a PN junction. When a positive voltage is applied to the light-emitting diode, holes injected from the P region into the N region and electrons injected into the P region from the N region are respectively associated with the electrons and regions of the N region near the PN junction. The holes in the region recombine to produce fluorescence of spontaneous radiation. In recent years, with the continuous deepening of LED technology, the production process of ultra-high brightness LED devices has made breakthroughs. Because LED lighting technology has the characteristics of low power consumption, long life, environmental protection and energy saving, LED technology has considerable application prospects in lighting. In the environment of promoting energy conservation, the global LED lighting market has developed rapidly.

At present, the more commonly used LED mounting process has the following methods: 1. Mounting the circuit and the insulating layer on the aluminum substrate, applying the thermal grease on the back side of the aluminum substrate, and then carrying the circuit and the way through the glue connection and the screw connection. The aluminum substrate of the insulating layer is mounted on the heat sink body and the LED device is mounted on the circuit. Second, the circuit structure is formed on the glass fiber board, the heat-dissipating paste is coated on the back surface of the glass fiber substrate, and the glass fiber substrate carrying the circuit structure is mounted on the heat-dissipating lamp body by glue or screw connection, and then on the circuit layer Install the LED device on it. However, these mounting methods and the resulting LED lamp body structure have certain disadvantages. In the first method, an aluminum plate is used as a substrate, and the device is fixed during the LED on the heat dissipation lamp body. Although the aluminum substrate has a small thermal resistance, the heat generated by the operation of the LED device can be conducted to the heat dissipating lamp body. However, since aluminum is a conductive material, an additional insulating layer needs to be formed between the circuit and the aluminum substrate. Although the glass fiber substrate in the second method has excellent insulating properties, the heat of the LED cannot be conducted to the heat dissipating lamp body in time due to the large thermal resistance. It can be seen that the current LED lamp body installation process is cumbersome and needs to be dissipated. Multiple parts are mounted on the lamp body. Moreover, the structure of the lamp body is relatively complicated, and it has its own drawbacks of heat dissipation or insulation. These defects can affect the performance of the LED device, such as operational stability and longevity.

Therefore, in the LED lighting technology, a simple and compact structure is needed, which can provide an insulating environment between the circuit structure and the heat-dissipating lamp body, and has a small thermal resistance, which is favorable for the operation of the LED device. Heat is transferred to the heat sink body. In addition, the structure mounting process should be as simple as possible, and the LED device and circuit can be conveniently mounted on the heat sink body.

In addition, in the LED lighting technology, in order to match the characteristics of the LED device during operation, the lamp body structure should also have excellent heat dissipation performance, and can be adjusted according to different lighting requirements. The aesthetics of the lamp body structure is also an important consideration in LED lighting technology. Summary of the invention

The object of the present invention is to at least solve one of the above technical problems.

Therefore, the present invention provides a self-adhesive circuit soft film which is simple in structure and easy to install. The soft film of the present invention has both insulation and heat conduction properties, and the circuit structure can be attached to the heat dissipation lamp body by bonding, which simplifies the installation process of the LED lamp body.

The self-adhesive circuit soft film comprises an insulating colloid layer, a thin layer circuit and heat conductive particles. The thin layer circuit is formed by etching a metal foil and is attached to the upper surface of the insulating colloid layer. Optionally, the thin layer circuit is embedded on an upper surface of the insulating colloid layer, and an upper surface of the thin layer circuit is exposed outside the insulating colloid layer. The thermally conductive particles are doped within the insulating colloid layer. The upper surface of the thin circuit layer may also have a thin layer of insulation.

The material of the insulating colloid layer is acrylic glue, UV glue or epoxy resin, and the breakdown voltage is higher than lOkv/mm after the treatment of increasing the breakdown voltage. The thickness of the colloid layer ranges from 0.1 mm to 1 mm. The material of the heat conductive particles is at least one of aluminum nitride, silicon carbide, boron nitride, carbon tube (NCT), diamond powder or carbon powder, the thermal conductive particle size is less than 60 micrometers, and the doping volume fraction is greater than 5%. . When the thermally conductive particles are aluminum nitride powder, the thermal conductive particles have a size of 50 μm and a doped volume fraction of 20%.

Another aspect of the present invention also provides a high heat dissipation LED lamp body structure. The lamp body structure includes: a heat dissipation lamp body, the heat dissipation lamp body has a tubular heat dissipation channel and a mounting surface, and the mounting surface has a first a surface and a second surface, the second surface of the mounting surface facing the heat dissipation channel; a self-adhesive circuit soft film, the self-adhesive circuit soft film is mounted on the first surface or the second surface of the mounting surface; the axis of the heat dissipation channel and the plane of the self-adhesive circuit soft film The angle is 0 to 90 degrees. The lamp body structure further includes an LED device formed on the self-adhesive circuit soft film.

In particular, the mounting surface may be a flat plate, and the heat dissipating passage may have a square cross section, a rectangular shape, a circular shape, and an elliptical shape. When the self-adhesive circuit soft film is mounted on the first surface of the mounting surface, the second surface of the mounting surface may be a matte surface having a fine uneven shape and a porous structure. The material of the heat dissipating lamp body is one of copper, aluminum, ceramic or plastic. When the self-adhesive circuit soft film is mounted on the second surface of the mounting surface, the heat dissipating lamp body is made of glass or transparent plastic.

The present invention also provides an LED lamp body structure without a heat dissipation channel, the lamp body structure comprising: a mounting plate having a first surface and a second surface; the self-adhesive circuit soft film of the present invention, A self-adhesive circuit soft film is attached to the first surface of the mounting board; the lamp body structure further includes an LED device formed on the self-adhesive circuit soft film. The mounting plate may be in the shape of a flat plate or a reflective cup. The mounting plate may be bent toward the first surface or may be bent toward the second surface. The second surface of the mounting plate is a matte surface having a fine concavo-convex, porous structure, and the material may be one of copper, aluminum, ceramic or plastic.

The self-adhesive circuit soft film proposed by the present invention and the LED lamp body structure having the soft film can make the LED lamp body have good heat dissipation and insulation properties, and simplify the structure and installation process of the LED. DRAWINGS

The above and/or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the appended claims. among them:

1 is a schematic structural view of a self-adhesive circuit soft film according to a first embodiment of the present invention; FIG. 2 is a schematic structural view of a self-adhesive circuit soft film according to a first embodiment of the present invention; A schematic cross-sectional view of an LED lamp body structure;

4 is a perspective view showing the structure of an LED lamp body according to a second embodiment of the present invention, the self-adhesive circuit soft film is mounted on the first surface of the mounting surface; 5 is a perspective view showing the structure of an LED lamp body according to a second embodiment of the present invention, the self-adhesive circuit soft film is mounted on the second surface of the mounting surface;

6 is a schematic structural view of the mounting plate as a flat plate in the third embodiment of the present invention; FIG. 7 is a schematic view showing the mounting plate in the third embodiment in the direction of the first surface;

Fig. 8 is a schematic view showing the mounting plate of the third embodiment in the direction of the second surface in the third embodiment of the present invention. detailed description

The embodiments of the present invention are described in detail below, and the examples of the embodiments are illustrated in the drawings, wherein the same or similar reference numerals are used to refer to the same or similar components or components having the same or similar functions. The embodiments described below with reference to the drawings are intended to be illustrative only and not to be construed as limiting.

Embodiment 1

The present invention provides a self-adhesive circuit soft film 100. As shown in (1), the soft film 100 of the present invention comprises an insulating colloid layer 1001, thermally conductive particles 1002 doped inside the insulating colloid layer 1001, and mounting. A thin layer circuit 1003 on the upper surface of the insulating colloid layer 1001.

Wherein, the insulating colloid layer is a colloidal material such as acrylic glue, UV glue or epoxy resin. First, the insulating colloid layer 1001 provides an insulating environment to prevent current from leaking out of the thin layer circuit. Preferably, in order to achieve a better insulating effect, the insulating colloid layer 1001 is subjected to a treatment for increasing the breakdown voltage, which has a breakdown voltage higher than 10 kV/mm. In addition, if the thickness of the insulating colloid layer 1001 is too thick, the heat dissipation capability thereof is lowered, and the thickness increase affects the mounting and mechanical stability of the LED device. On the other hand, if the thickness of the insulating colloid layer 1001 is too thin, although the heat dissipation capability is strong, the insulation property is lowered, and the stability of the thin layer circuit 1003 is affected. Therefore, in order to ensure good thermal performance and insulation properties of the soft film 100, the thickness of the insulating colloid layer 1001 should be in the range of 0.1 mm to 1 mm. For example, 0.2 mm, 0.4 mm or 0.6 mm. Second, the insulating colloid layer 1001 has good thermal conductivity. In order to reduce the thermal resistance of the soft film 100, the insulating colloid layer 1001 is doped with the heat conductive particles 1002. The material of the heat conductive particles 1002 is one or a mixture of aluminum nitride, silicon carbide, boron nitride, carbon tube (NCT), diamond powder, carbon powder, and the thermal conductive particle size is less than 60. Micron, doping volume fraction greater than 5%. The thermally conductive particle powder is doped in a colloidal solvent. Alternatively, the thermally conductive particles 1002 are aluminum nitride powder. For better thermal conductivity, the particle size is 50 microns and the doping volume fraction is 20%. Third, the insulating colloid layer 1001 has a function of adhesive bonding, can provide support for the thin layer circuit 1003 and enables the thin layer circuit 1003 and the LED device to be conveniently mounted at desired positions.

The material of the thin layer circuit 1003 is a metal foil, preferably a copper foil. The metal foil is etched in advance to form a desired thin layer circuit 1003, and then the thin layer circuit 1003 is placed on the upper surface of the insulating colloid layer 1001.

Optionally, the thin layer circuit 1003 is embedded on the insulating colloid layer 1001, and the upper surface thereof is exposed outside the insulating colloid layer 1001, as shown in (2). This design enhances the thermal performance of the soft film 100 and conducts heat from the LED device to air or other locations.

Specifically, on the thin layer circuit 1003, a thin insulating layer 1004 may be formed as shown in Fig. (2). The insulating thin layer 1004 can expose the position on the thin layer circuit 1003 where the LED device or the electronic device needs to be mounted, and the position on the thin layer circuit 1003 where the device is not required to be mounted is covered by the insulating thin layer 1004. This structure can protect the thin layer circuit 1003 and can help the technician know where to install the electronic device in the thin layer circuit 1003 to facilitate installation or maintenance of the electronic device.

The self-adhesive circuit soft film provided by the invention has good insulation and thermal conductivity. It is able to quickly transfer heat generated by the operation of the electronic device to other areas. In addition, the self-adhesive circuit soft film has a simple structure, and the circuit is mounted at a predetermined position by bonding, which reduces the difficulty of the circuit mounting process. Compared with the conventional process, the self-adhesive circuit film of the present invention does not need to mount the circuit and the LED device on the substrate, and then applies the thermal grease, and then is mounted by screwing or gluing. Embodiment 2

In order to enhance the heat dissipation capability of the LED lamp body, the present invention provides a high thermal conductivity LED lamp body 200, as shown in Figure (3). The self-adhesive circuit soft gel 100 described in the first embodiment is included.

The lamp body structure 200 includes a heat dissipating lamp body 210 having a heat dissipation channel 211 and The mounting surface 201 has a first surface 2011 and a second surface 2012. The second surface 2012 of the mounting surface 201 faces the heat dissipation channel 211. The self-adhesive circuit soft film 100 is mounted on the first surface 2011 or the second surface 2012 of the mounting surface 201, and the LED device 212 is formed according to the distribution characteristics of the thin layer circuit 1003 on the soft film 100. The heat dissipation passage 211 has an axis 213 as shown in (4).

When the self-adhesive circuit soft film 100 is mounted on the first surface 2011 of the mounting surface 201, the second surface 2012 of the mounting surface 201 may have a fine uneven shape and a porous structure. A matte surface (not shown). This surface facilitates the release of heat from the device. The material of the heat dissipating lamp body 210 may be one of copper, aluminum, ceramic or plastic.

When the self-adhesive circuit soft film 100 is mounted on the second surface 2012 of the mounting surface 201, as shown in (5), since the LED device 212 is inside the heat dissipation channel 211, in order to improve illumination, To obtain an aesthetic effect, the material of the heat dissipating lamp body 210 should be a transparent material and also have an insulating function. Optionally, the material of the heat dissipation lamp body is glass or transparent plastic.

In particular, the mounting surface 201 may be a flat plate for the purpose of conveniently mounting the soft film 100 and forming the LED device 212.

In order to improve the heat dissipation condition of the lamp body structure 200 or to make the lamp body more beautiful, the cross section of the heat dissipation channel 211 may be square, rectangular, circular, elliptical or other various shapes, and the cross section is (4). The rectangular structure, Fig. (5) is a structure with a circular cross section. The structure that does not deviate from the design concept of the heat dissipation channel of the present invention should be within the variation of the embodiment.

In particular, the LED lamp body structure of the present invention can be used in various applications, such as street lamps, indoor lighting, and the like. In order to ensure better heat dissipation performance and convenient installation, the angle between the direction of the heat dissipation channel 211 and the plane of the self-adhesive circuit soft film 100 is not limited to the case in this embodiment. The angle between the axis 213 of the heat dissipation passage 211 and the plane of the self-adhesive circuit soft film 100 ranges from 0 to 90 degrees.

The LED lamp body of the present invention has a compact structure, and the self-adhesive circuit soft film 100 of the first embodiment can be mounted on the mounting surface 201 to complete the circuit mounting. The LED device 212 and the heat-dissipating lamp body 210 are only connected by a high-thermal self-adhesive circuit soft film 100. The present invention can directly transfer heat from the LED device 212 to the heat-dissipating lamp with respect to the substrate and the thermal grease used in the conventional process. Body 210. In addition, the heat dissipation lamp body 210 of the embodiment further has a heat dissipation channel 211, which can Increasing the air flow quickly releases the heat generated by the LED device 212. Embodiment 3

The present invention also provides an LED lamp body structure 300 having no heat dissipation channels. The self-adhesive circuit soft film of the first embodiment is included.

The lamp body structure includes a mounting plate 301 having a first surface 3011 and a second surface 3012. A self-adhesive circuit soft film 100 is attached to the first surface 3011 of the mounting board. According to the distribution characteristics of the thin layer circuit on the soft film 100, an LED device 3001 is formed. The material of the mounting plate 301 may be one of copper, aluminum, ceramic or plastic.

The mounting plate 301 may be a flat plate as shown in (6), or the mounting plate 301 may be in the shape of a reflecting cup, as shown in (7) and (8).

When the mounting board 301 has a reflecting cup shape structure, the mounting board 301 is bent toward the first surface 3011, and the light emitted from the LED device 3001 distributed on the first surface 3011 can be concentrated as shown in Fig. (7). The mounting board 301 is bent toward the second surface, and the light emitted from the LED device 3001 distributed on the first surface 3011 can be radiated to the periphery, as shown in Fig. (8). Mounting plates 301 having different bending directions and degrees can be produced according to different lighting needs.

In particular, in order to enhance the heat dissipation performance of the device, the second surface 3012 of the mounting board 301 may be a matte surface (not shown) having a fine concavo-convex, porous structure, which facilitates the release of the device. Heat. The scope of the present invention is not limited to the specific embodiments described in the specification, although the invention has shown and described The various modifications, changes, substitutions and variations of the embodiments are intended to be included within the scope of the invention.

Claims

claims

1. A self-adhesive circuit soft adhesive film, the adhesive film includes:

Insulating colloid layer;

A thin-layer circuit adhered to the upper surface of the insulating colloid layer. The thin-layer circuit is formed by etching metal foil and is attached to the upper surface of the insulating colloid layer;

Thermal conductive particles are doped in the insulating colloid layer.

2. The adhesive film according to claim 1, characterized in that the upper surface of the thin-layer circuit has a thin insulating layer.

3. The adhesive film according to claim 1, characterized in that the material of the insulating colloid layer is acrylic glue, UV glue or epoxy resin.

4. The adhesive film according to claim 1, wherein the thin-layer circuit is embedded in the upper surface of the insulating colloid layer, and the upper surface of the thin-layer circuit is exposed outside the insulating colloid layer.

5. The adhesive film according to claim 1, characterized in that the material of the thermally conductive particles is at least one of aluminum nitride, silicon carbide, boron nitride, carbon tube (NCT), diamond powder or carbon powder.

6. The adhesive film according to claim 1, characterized in that the size of the thermally conductive particles is less than 60 microns, and the doping volume fraction is greater than 5%.

7. The adhesive film according to claim 1, characterized in that the thermally conductive particles are aluminum nitride, the particle size is 50 microns, and the doping volume fraction is 20%.

8. The adhesive film according to claim 1, wherein the thickness of the insulating colloid layer ranges from 0.1 mm to 1 mm.

9. The adhesive film according to claim 1, characterized in that the insulating colloid layer has been treated to increase the breakdown voltage, and its breakdown voltage is greater than 10kv/mm.

10. A high heat dissipation LED lamp body structure, the lamp body structure includes:

Heat dissipation lamp body, the heat dissipation lamp body has a heat dissipation channel and a mounting surface, the mounting surface has a first surface and a second surface, and the second surface of the mounting surface faces the heat dissipation channel.

The self-adhesive circuit soft adhesive film according to claims 1-9, the self-adhesive circuit soft adhesive film is mounted on the first surface or the second surface of the mounting surface;

11. The LED lamp body structure according to claim 10, wherein the angle between the axis of the heat dissipation channel and the plane where the self-adhesive circuit soft film is located is 0 to 90 degrees.

12. The LED lamp body structure according to claim 10, wherein the mounting surface is

13. The LED lamp body structure according to claim 10, wherein the cross-section of the heat dissipation channel is square, rectangular, circular, or oval.

14. The LED lamp body structure according to claim 10, when the self-adhesive circuit soft adhesive film is mounted on the first surface of the mounting surface, it is characterized in that the material of the heat dissipation lamp body is copper or aluminum. , ceramic or plastic one.

15. The LED lamp body structure according to claim 10, when the self-adhesive circuit soft adhesive film is mounted on the second surface of the mounting surface, it is characterized in that the material of the heat dissipation lamp body is glass or transparent. plastic.

16. The LED lamp body structure according to claim 10, when the self-adhesive circuit soft adhesive film is mounted on the first surface of the mounting surface, it is characterized in that the second surface of the mounting surface has a A matte surface with fine uneven and pore-like structures.

17. An LED lamp body structure without heat dissipation channels. The lamp body structure includes:

The mounting board has a first surface and a second surface;

The self-adhesive circuit soft film according to claims 1-9, the self-adhesive circuit soft film is mounted on the first surface of the mounting board;

LED devices formed on the self-adhesive circuit soft adhesive film.

18. The LED lamp body structure according to claim 17, wherein the mounting board is

19. The LED lamp body structure according to claim 17, wherein the mounting plate is in the shape of a reflective cup, and the mounting plate is bent toward the first surface, or the mounting plate is bent toward the second surface. The direction is curved.

20. The LED lamp body structure according to claim 17, characterized in that the material of the mounting board is one of copper, aluminum, ceramics or plastic.

21. The LED lamp body structure according to claim 17, wherein the second surface of the mounting board is a non-smooth surface with fine uneven and pore-like structures.