WO2015122338A1

WO2015122338A1 - Wiping device for bonded substrate and production method for bonded substrate

Info

Publication number: WO2015122338A1
Application number: PCT/JP2015/053186
Authority: WO
Inventors: 勝寛山口; 幸則増田; 信宏中田; 知樹高原
Original assignee: シャープ株式会社
Priority date: 2014-02-12
Filing date: 2015-02-05
Publication date: 2015-08-20

Abstract

A wiping device (40) is provided with: a wiping unit (42) that wipes exposed terminal sections (22-24) in a liquid crystal panel (11) that is made by bonding a color filter substrate (11a) provided with a color filter (11h) to an array substrate (11b) provided with the terminal sections (22-24), which receive a signal input from outside, and a TFT (17) that is driven on the basis of the signal that is input from the terminal sections (22-24), said bonding being performed such that the terminal sections (22-24) are exposed; and a movable unit (43) that displaces the wiping unit (42) relative to the array substrate (11) in the direction in which an end section (11aEP) among the outer peripheral end sections of the color filter substrate (11a) extends on the terminal sections (22-24) side by causing at least one of the liquid crystal panel (11) and the wiping unit (42) to move.

Description

Bonded substrate wiping device and method for manufacturing bonded substrate

The present invention relates to a bonded substrate wiping device and a method for manufacturing a bonded substrate.

Display devices equipped with a display panel such as a liquid crystal panel are used for portable electronic devices such as mobile phones, smartphones, and notebook computers. Such a display device includes a display panel having a display unit for displaying an image, and a semiconductor that drives the display panel by supplying an output signal generated by processing an input signal supplied from a signal supply source to the display unit. With a chip. As described above, in a display device that is generally classified into small and medium size, as a semiconductor chip mounting method, a COG (Chip On Glass) mounting technique in which a semiconductor chip is directly mounted in an area outside the display portion of the display panel. Is preferably used. In addition, what was described in following patent document 1 is known as an example of the manufacturing apparatus of this kind of display apparatus.

JP-A-9-265105

(Problems to be solved by the invention)
In the above-mentioned Patent Document 1, in a liquid crystal panel terminal cleaning device that cleans the terminal surface of the liquid crystal panel, the tape-like cleaning cloth is fed so as to be able to travel in a plane perpendicular to the relative movement direction of the liquid crystal panel. What has the cleaning part to be described is described. According to the liquid crystal panel terminal cleaning device described in Patent Document 1, the terminal surface of the liquid crystal panel can be cleaned accurately and stably.

However, in recent years, there are concerns that the following problems will occur due to the progress of narrowing the frame of liquid crystal panels. That is, as the narrowing of the frame of the liquid crystal panel proceeds, the terminal surface formation region in the liquid crystal panel becomes narrower. If the terminal surface is cleaned while being fed in a plane perpendicular to the relative movement direction, there is a risk of failing to clean the inner part of the terminal surface in the feed direction of the tape-shaped cleaning cloth. It was. For this reason, the cleaning of the terminal surface becomes insufficient, which may hinder the mounting of the mounting component.

The present invention has been completed based on the above-described circumstances, and an object thereof is to suitably process a bonded substrate having a narrow frame.

(Means for solving the problem)
The bonded substrate wiping device of the present invention is a semiconductor device driven by a color filter substrate provided with a color filter based on a signal input from a terminal portion that receives an external signal input and the terminal portion. In the bonded substrate formed by bonding the terminal portion to the array substrate provided with the wiping unit, the wiping unit for wiping the exposed terminal portion, the bonded substrate and the wiping device By moving at least one of the parts, the wiping part can be displaced relative to the array substrate in the extending direction of the end part on the terminal part side of the outer peripheral end part of the color filter substrate. A section.

According to this configuration, the color filter substrate provided with the color filter is applied to the array substrate provided with the terminal unit that receives the signal input from the outside and the semiconductor device that is driven based on the signal input from the terminal unit. On the other hand, when the exposed terminal portion is wiped by the wiping unit in the bonded substrate formed by bonding the terminal portion in an exposed form, at least either the bonded substrate or the wiping unit is moved by the movable portion. Move one of them. At this time, the movable unit moves at least one of the bonded substrate and the wiping unit, so that the extending direction of the end portion on the terminal portion side of the outer peripheral end portion of the color filter substrate is relative to the array substrate. Since the wiping part is relatively displaced, the terminal part even if only a small distance is secured between the terminal part side end part of the outer peripheral end part of the color filter substrate and the terminal part. Among them, it is difficult for unwiping to occur in the portion close to the color filter substrate, and thus the terminal portion can be appropriately wiped. Thereby, a bonded substrate having a narrow frame can be suitably processed.

As an embodiment of the bonded substrate wiping apparatus of the present invention, the following configuration is preferable.
(1) The wiping portion extends in parallel with the extending direction of the end portion of the color filter substrate, and a portion of the wiping portion is in contact with the terminal portion exposed on the bonded substrate. And at least a wiping material pressing portion that sandwiches the wiping material between the material and the array substrate of the bonded substrate and presses the wiping material toward the array substrate. In this way, the wiping material is in a state where a part of the wiping material extending in parallel with the extending direction of the end of the color filter substrate is in contact with the terminal portion exposed in the bonded substrate. Since it is pressed by the pressing portion, an appropriate load is applied to the terminal portion, and thus the terminal portion can be more suitably wiped.

(2) When the wiping material pressing portion is at least a portion facing the end portion of the color filter substrate away from the terminal portion in the overlapping direction of the array substrate and the color filter substrate, the color filter substrate In the direction from the end portion toward the terminal portion, an inclination is formed so as to be away from the color filter substrate. In this way, for example, even when burrs (protrusions) have occurred at the end of the color filter substrate on the terminal portion side, the portion of the wiping material pressing portion that faces the end of the color filter substrate is As the direction of the overlap between the array substrate and the color filter substrate is away from the terminal portion, the wiping material presser is formed so as to be away from the color filter substrate in the direction from the end of the color filter substrate toward the terminal portion. The part is difficult to interfere with the burr. If the portion of the wiping material pressing portion that faces the end of the color filter substrate is formed straight in the overlapping direction of the array substrate and the color filter substrate, the wiping material pressing portion against the burr If it is going to avoid interference, it will become easy to leave unwiping in the part near a color filter substrate among terminal parts. Compared to this, according to the above-described configuration, it is possible to make it difficult to leave a wiping residue in a portion of the terminal portion close to the color filter substrate while avoiding interference of the wiping material pressing portion with respect to the burr.

(3) The wiping material pressing portion causes the wiping material to make point contact with respect to the extending direction of the end portion of the color filter substrate with respect to the array substrate of the bonded substrate, and the color filter. A line contact is formed in the direction from the end of the substrate toward the terminal. If it does in this way, compared with the case where a wiping material pressing part is formed so that a wiping material may be in surface contact with an array substrate of a bonded substrate, a terminal portion from the end of the color filter substrate. Since the wiping material can be more uniformly contacted with the array substrate in the direction toward the terminal, the terminal portion can be wiped more appropriately.

(4) At least a pair of the wiping material pressing portion is arranged in a manner to be sandwiched in the extending direction of the end portion of the color filter substrate, and from the end portion of the color filter substrate to the terminal portion. A wiping material positioning part for positioning the wiping material in the direction is provided. If it does in this way, the wiping material will be the edge of a color filter board | substrate by the wiping material positioning part arrange | positioned at least one pair in the form of inserting | pinching about the extending direction of the edge part of a color filter board | substrate with respect to the wiping material holding | suppressing part. Since the positioning is performed in the direction from the portion toward the terminal portion, the wiping material is less likely to be displaced. This makes it less likely that unwiping remains in the portion of the terminal portion close to the color filter substrate, and the wiping material is less likely to interfere with the end portion of the color filter substrate, so that the terminal portion is wiped more appropriately. Can do.

(5) It has a wiping material delivery part that feeds out the wiping material, and a wiping material take-up part that winds up the wiping material, and at least a pair of the wiping material positioning parts are rotatable. A shaft portion that is pivotally supported and is in contact with the surface of the wiping material, and a pair of flange portions that are formed so as to protrude from both ends of the shaft portion and can contact the edge of the wiping material. And the wiping material positioning part arranged on the wiping material delivery part side with respect to the wiping material pressing part is a direction from the terminal part toward the end of the color filter substrate. Is formed such that the shaft portion becomes thicker from the terminal portion side toward the end portion side. In this way, the wiping material can be wound by the wiping material take-up portion and sent out by the wiping material feed-out portion by rotating the shaft portion of the wiping material positioning portion with which the surface contacts. It will be smooth. At this time, the surface of the wiping material comes into contact with the shaft portion of the wiping material positioning portion, so that the occurrence of slack is suppressed, and the end edge is in contact with one of the pair of flange portions. . And the wiping material positioning part distribute | arranged to the wiping material delivery part side with respect to the wiping material holding | suppressing part approaches the edge part side from the terminal part side about the direction which goes to the said edge part of a color filter board | substrate from a terminal part. Therefore, the wiping material in contact with the shaft part is wiped from the wiping material positioning part arranged on the wiping material delivery part side with respect to the wiping material holding part. As it approaches the pressing part, it is tilted to approach the end of the color filter substrate. Thereby, even when a clearance is generated between the edge of the wiping material and the flange portion, the wiping material is hardly arranged away from the end portion of the color filter substrate due to the clearance. Therefore, even if the frame is further narrowed and the distance between the end portion of the color filter substrate and the terminal portion is further reduced, it is difficult for the remaining portion of the terminal portion to be wiped away from the color filter substrate. Thus, the terminal portion can be more suitably cleaned.

(6) The wiping material positioning part disposed on the wiping material winding part side with respect to the wiping material pressing part is the terminal in a direction from the terminal part toward the end of the color filter substrate. The shaft portion is formed so as to become thicker as it approaches the end portion side from the portion side. In this way, the wiping material is moved from the wiping material holding part toward the wiping material positioning part arranged on the wiping material winding part side with respect to the wiping material holding part, as the color filter substrate. Tilt to approach the end. That is, the wiping material is arranged on the wiping material take-up unit side with respect to the wiping material holding unit from the wiping material positioning unit arranged on the wiping material feeding unit side with respect to the wiping material holding unit. As the wiping material positioning portion is approached, the wiping material positioning portion is consistently inclined to approach the end portion of the color filter substrate. Thereby, it becomes difficult to produce a twist in the wiping material.

(7) The wiping material pressing portion is provided with an opening that opens toward the wiping material and is covered with the wiping material, and a decompression unit that decompresses the opening, and the opening. A pressure detection unit for detecting the air pressure in the unit. In this way, if the wiping material is in the normal position, the opening of the wiping material pressing part is covered with the wiping material, but if the wiping material is displaced from the normal position, Since a part of the wiping material is not covered with the wiping material, the air pressure in the opening when the wiping material is in the normal position and when the wiping material is decompressed by the decompression unit is different. Therefore, it is possible to easily detect whether or not the wiping material is in the normal position by decompressing the opening by the decompression unit and detecting the air pressure in the opening by the pressure detection unit. Thereby, since the situation of continuing processing a bonded substrate in the state where a wiping material is not in a regular position is avoided, a bonded substrate can be processed more suitably.

(8) A pair of the wiping material pressing portions are disposed at positions where the opening portions are offset from one end side and the other end side in a direction from the end portion to the terminal portion of the color filter substrate. ing. In this way, when the wiping material is misaligned in the direction from the end of the color filter substrate toward the terminal, the misalignment of the wiping material is easily detected even if the misalignment is small. can do.

(9) A substrate holder that is disposed on the opposite side of the wiping unit with respect to the bonded substrate and holds a substrate main portion that is a portion of the array substrate to which the color filter substrate is bonded. A part. If it does in this way, the state which held the substrate principal part which is the portion where the color filter substrate of the array substrate was bonded together by the substrate holding part arranged on the opposite side to the wiping part with respect to the bonded substrate Thus, the terminal portion can be more suitably wiped by the wiping portion disposed on the opposite side of the bonded substrate from the substrate holding portion.

(10) A portion of the array substrate excluding the main part of the substrate and the terminal part formed on the opposite side of the wiping part with respect to the bonded substrate. The terminal formation part support part which supports a certain terminal formation part is provided. In this way, the main part of the array substrate of the bonded substrate is held by the substrate holding part, and the terminal forming part that is the part of the array substrate where the terminal part is formed is supported by the terminal forming part. By supporting by a part, a terminal part can be more suitably wiped by the wiping part distribute | arranged to the opposite side to the terminal formation part support part with respect to the bonding board | substrate. In addition, since the terminal forming portion support portion is provided separately from the substrate holding portion, even if a step is generated between the substrate main portion and the terminal forming portion in the array substrate, the substrate main portion and the terminal forming portion Can be appropriately held or supported.

Next, in order to solve the above-described problem, a method for manufacturing a bonded substrate board according to the present invention includes: a color filter substrate provided with a color filter; a terminal unit that receives a signal input from a mounting component; and an input from the terminal unit In the bonded substrate formed by bonding the terminal portion to the array substrate provided with the semiconductor device driven based on the received signal, the exposed terminal portion is wiped by the wiping portion. In cleaning, by moving at least one of the bonded substrate and the wiping unit by a movable unit, the extending direction of the end on the terminal unit side of the outer peripheral end of the color filter substrate A wiping process in which the wiping unit is displaced relative to the array substrate, and the mounting component is mounted on the array substrate in the bonded substrate, Comprising a mounting step of connecting the terminal portion to the mounting part, the.

In this way, in the wiping process, the color filter substrate provided with the color filter is provided with a terminal unit that receives a signal input from the outside, and a semiconductor device that is driven based on a signal input from the terminal unit. The terminal portion exposed on the bonded substrate by moving at least one of the bonded substrate and the wiping portion bonded to the array substrate with the terminal portion exposed by the movable portion. Wipe off with the wiping section. At this time, the movable unit moves at least one of the bonded substrate and the wiping unit, so that the extending direction of the end portion on the terminal portion side of the outer peripheral end portion of the color filter substrate is relative to the array substrate. Since the wiping part is relatively displaced, the terminal part even if only a small distance is secured between the terminal part side end part of the outer peripheral end part of the color filter substrate and the terminal part. Among them, it is difficult for unwiping to occur in the portion close to the color filter substrate, and thus the terminal portion can be appropriately wiped. As a result, the bonded substrate that has been narrowed in the wiping process can be suitably processed, so that the terminal portion can be satisfactorily mounted on the mounting component mounted on the array substrate in the bonded substrate in the subsequent mounting process. Can be connected.

(The invention's effect)
According to the present invention, a bonded substrate having a narrow frame can be suitably processed.

1 is a schematic plan view showing a connection configuration of a liquid crystal panel, a flexible substrate, and a control circuit board on which a driver according to Embodiment 1 of the present invention is mounted. Schematic cross-sectional view showing a cross-sectional configuration along the long side direction of the liquid crystal display device Schematic sectional view showing the sectional structure of the liquid crystal panel The enlarged plan view which shows the mounting area of the driver and flexible substrate in the array substrate which comprises a liquid crystal panel AA line sectional view of FIG. BB sectional view of FIG. The perspective view which represents roughly the structure of the wiping apparatus for wiping each terminal part of an array board | substrate. Side view of the wiping device in the initial stage of wiping each terminal part of the array substrate Cross section viewed from the front of the wiping device Sectional drawing which expanded the wiping site | part of FIG. Side view of the wiping device that is the final stage of wiping each terminal part of the array substrate Sectional drawing which shows the structure of the pressing head part and inclined part which concern on Embodiment 2 of this invention. Sectional drawing which shows the structure of a press head part and an inclined part when a burr | flash generate | occur | produces in the edge part of a color filter substrate Sectional drawing which shows the wiping apparatus provided with the terminal formation part support part which concerns on Embodiment 3 of this invention. Side view of the wiping apparatus provided with the wiping material positioning part which concerns on Embodiment 4 of this invention. Perspective view of wiper positioning part The top view of the wiping apparatus provided with the wiping material positioning part which concerns on Embodiment 5 of this invention. Sectional drawing which shows wiping material positioning part and wiping material Sectional drawing which shows the pressing head part and wiping material which concern on Embodiment 6 of this invention. The block diagram showing the structure for determining whether the position of the wiping material is normal or abnormal Sectional drawing which shows the state which the wiping material shifted The perspective view which shows the wiping apparatus provided with the pressing head part which concerns on Embodiment 7 of this invention. Side view showing the structure of the holding head The perspective view which shows the wiping apparatus provided with the movable part which concerns on Embodiment 8 of this invention. Side view of the wiping device in the initial stage of wiping each terminal part of the array substrate Side view of the wiping device that is the final stage of wiping each terminal part of the array substrate

<Embodiment 1>
A first embodiment of the present invention will be described with reference to FIGS. In this embodiment, the manufacturing method of the liquid crystal panel (bonding substrate) 11 which comprises the liquid crystal display device 10, and the wiping apparatus 40 used for the manufacture are illustrated. In addition, a part of each drawing shows an X axis, a Y axis, and a Z axis, and each axis direction is drawn to be a direction shown in each drawing. 2 and 3, the upper side of the figure is the front side and the lower side of the figure is the back side.

As shown in FIGS. 1 and 2, the liquid crystal display device 10 includes a liquid crystal panel 11, a driver (mounted component) 21 that is mounted on the liquid crystal panel 11 and drives the liquid crystal panel 11, and various input signals to the driver 21. A control circuit board (external signal supply source) 12 for supplying the liquid crystal from the outside, a flexible board (mounting component) 13 for electrically connecting the liquid crystal panel 11 and the external control circuit board 12, and light to the liquid crystal panel 11 And a backlight device (illumination device) 14 which is an external light source to be supplied. The liquid crystal display device 10 also includes a pair of front and back

exterior members

15 and 16 for housing and holding the liquid crystal panel 11 and the backlight device 14 assembled to each other. An opening 15a for visually recognizing an image displayed on the liquid crystal panel 11 is formed. The liquid crystal display device 10 according to the present embodiment includes a portable information terminal (including an electronic book and a PDA), a mobile phone (including a smartphone), a notebook computer (including a tablet notebook computer), a digital photo frame, It is used for various electronic devices (not shown) such as portable game machines and electronic ink paper. For this reason, the screen size of the liquid crystal panel 11 constituting the liquid crystal display device 10 is set to about several inches to several tens of inches, and is generally classified into a small size and a small size.

First, the backlight device 14 will be briefly described. As shown in FIG. 2, the backlight device 14 includes a chassis 14a having a substantially box shape that opens toward the front side (the liquid crystal panel 11 side), and a light source (not shown) disposed in the chassis 14a (for example, a cold cathode tube, LED, organic EL, etc.) and an optical member (not shown) arranged so as to cover the opening of the chassis 14a. The optical member has a function of converting light emitted from the light source into a planar shape.

Next, the liquid crystal panel 11 will be described. As shown in FIG. 1, the liquid crystal panel 11 has a vertically long rectangular shape (rectangular shape) as a whole, and an image is located at a position offset toward one end side (upper side in FIG. 1) in the long side direction. Display area (active area) AA is arranged, and the driver 21 and the flexible substrate 13 are respectively attached to the other end side in the long side direction (the lower side shown in FIG. 1). Yes. In the liquid crystal panel 11, an area outside the display area AA is a non-display area (non-active area) NAA in which no image is displayed, and a part of the non-display area NAA is a mounting area for the driver 21 and the flexible substrate 13. Yes. The short side direction in the liquid crystal panel 11 coincides with the X-axis direction of each drawing, and the long side direction coincides with the Y-axis direction of each drawing. In FIG. 1, a one-dot chain line that is slightly smaller than the color filter substrate 11a represents the outer shape of the display area AA, and an area outside the one-dot chain line is a non-display area NAA.

As shown in FIG. 3, the liquid crystal panel 11 is interposed between a pair of transparent (excellent light-transmitting)

substrates

11a and 11b and both the

substrates

11a and 11b, and its optical characteristics change as an electric field is applied. A liquid crystal layer 11c containing liquid crystal molecules as a substance, and both

substrates

11a and 11b are bonded together by a sealing agent (not shown) while maintaining a cell gap corresponding to the thickness of the liquid crystal layer 11c. Both the

substrates

11a and 11b each include a glass substrate (substrate) GS made of alkali-free glass, quartz glass, or the like, and a plurality of films are laminated on each glass substrate GS by a known photolithography method or the like. It is said. Of the two

substrates

11a and 11b, the front side (front side) is a color filter substrate (counter substrate, counter substrate) 11a, and the back side (back side) is an array substrate (mounting substrate, element substrate, active matrix substrate) 11b. . Among them, the color filter substrate 11a has a short side dimension substantially equal to the array substrate 11b as shown in FIGS. 1 and 2, but the long side dimension is smaller than the array substrate 11b. It is bonded to the substrate 11b with one end (upper side shown in FIG. 1) in the long side direction aligned. Accordingly, the other end (lower side shown in FIG. 1) of the array substrate 11b in the long side direction is such that the color filter substrate 11a does not overlap over a predetermined range, and both the front and back plate surfaces are exposed to the outside. Here, a mounting area (formation area of each terminal portion 22 to 24) of a driver 21 and a flexible substrate 13 described later is secured. In other words, the array substrate 11b is colored in such a manner that the terminal portions 22 to 24 that face the plate surface on which the driver 21 and the flexible substrate 13 are mounted and are connected to the driver 21 and the flexible substrate 13 are exposed. A filter substrate 11 is bonded. Of the glass substrate GS constituting the array substrate 11b, the portion where the color filter substrate 11a and the polarizing plate 11g are bonded together is the main substrate portion GSm, whereas the color filter substrate 11a and the polarizing plate 11g are non-overlapping. A portion where the terminal portions 22 to 24 are formed is defined as a terminal forming portion GSt. The width dimension of the terminal forming portion GSt is, for example, about 2 mm to 3 mm. Note that

alignment films

11d and 11e for aligning liquid crystal molecules contained in the liquid crystal layer 11c are formed on the inner surfaces of both the

substrates

11a and 11b, respectively. Further,

polarizing plates

11f and 11g are attached to the outer surface sides of both the

substrates

11a and 11b, respectively.

Subsequently, a configuration existing in the display area AA in the array substrate 11b and the color filter substrate 11a will be briefly described. On the inner surface side of the array substrate 11b (the liquid crystal layer 11c side, the surface facing the color filter substrate 11a), as shown in FIG. 3, there are a large number of TFTs (semiconductor devices) 17 and pixel electrodes 18 that are switching elements. The TFTs 17 and the pixel electrodes 18 are provided side by side in a matrix, and are arranged around the TFTs 17 and the pixel electrodes 18 so as to surround a gate wiring and a source wiring (both not shown). In other words, the TFT 17 and the pixel electrode 18 are arranged in parallel in a matrix form at the intersection of the gate wiring and the source wiring forming a lattice shape. The gate wiring and the source wiring are connected to the gate electrode and the source electrode of the TFT 17, respectively, and the pixel electrode 18 is connected to the drain electrode of the TFT 17. The pixel electrode 18 has a vertically long rectangular shape (rectangular shape) when seen in a plan view, and is made of a transparent electrode material such as ITO (IndiumInTin Oxide) or ZnO (Zinc Oxide). The array substrate 11b can be provided with a capacitor wiring (not shown) that is parallel to the gate wiring and that crosses the pixel electrode 18.

On the other hand, on the color filter substrate 11a, as shown in FIG. 3, colored portions such as R (red), G (green), and B (blue) are seen in plan view with the pixel electrodes 18 on the array substrate 11b side. A large number of color filters 11h arranged in parallel in a matrix are provided. Between each colored portion constituting the color filter 11h, a substantially lattice-shaped light shielding layer (black matrix) 11i for preventing color mixture is formed. The light shielding layer 11i is arranged so as to overlap the above-described gate wiring and source wiring in a plan view. A solid counter electrode 11j facing the pixel electrode 18 on the array substrate 11b side is provided on the surface of the color filter 11h and the light shielding layer 11i. In the liquid crystal panel 11, one display pixel which is a display unit by a set of three colored portions of R (red), G (green), and B (blue) and three pixel electrodes 18 facing them. Is configured. The display pixel includes a red pixel having an R colored portion, a green pixel having a G colored portion, and a blue pixel having a B colored portion. The pixels of each color constitute a pixel group by being repeatedly arranged along the row direction (X-axis direction) on the plate surface of the liquid crystal panel 11, and this pixel group constitutes the column direction (Y-axis direction). Many are arranged side by side.

Next, members connected to the liquid crystal panel 11 will be described. As shown in FIGS. 1 and 2, the control circuit board 12 is attached to the back surface of the chassis 14a (the outer surface opposite to the liquid crystal panel 11 side) of the backlight device 14 with screws or the like. The control circuit board 12 is mounted with electronic components for supplying various input signals to the driver 21 on a board made of paper phenol or glass epoxy resin, and wiring (conductive path) of a predetermined pattern (not shown) is provided. Routed formation. One end (one end side) of the flexible substrate 13 is electrically and mechanically connected to the control circuit board 12 via an ACF (Anisotropic Conductive Film) (not shown).

As shown in FIG. 2, the flexible substrate (FPC substrate) 13 includes a base material made of a synthetic resin material (for example, polyimide resin) having insulating properties and flexibility, and a large number of wirings are provided on the base material. It has a pattern (not shown), and one end in the length direction is connected to the control circuit board 12 arranged on the back side of the chassis 14a as described above, while the other end Since the portion (the other end side) is connected to the array substrate 11 b in the liquid crystal panel 11, the liquid crystal display device 10 is bent in a folded shape so that the cross-sectional shape is substantially U-shaped. At both ends of the flexible substrate 13 in the length direction, the wiring pattern is exposed to the outside to form terminal portions (not shown), and these terminal portions are respectively connected to the control circuit board 12 and the liquid crystal panel 11. Are electrically connected to each other. Thereby, an input signal supplied from the control circuit board 12 side can be transmitted to the liquid crystal panel 11 side.

As shown in FIG. 1, the driver 21 is composed of an LSI chip having a drive circuit therein, and operates based on a signal supplied from a control circuit board 12 that is a signal supply source. An input signal supplied from the control circuit board 12 is processed to generate an output signal, and the output signal is output toward the display area AA of the liquid crystal panel 11. The LSI chip constituting the driver 21 is formed by forming wirings and elements on a silicon wafer containing silicon with high purity. The driver 21 has a horizontally long shape when viewed from above, that is, has a long shape along the short side of the liquid crystal panel 11. The driver 21 is directly mounted on the non-display area NAA of the array substrate 11b in the liquid crystal panel 11, that is, COG (Chip On On Glass). The long side direction (longitudinal direction) of the driver 21 coincides with the X-axis direction (short side direction of the liquid crystal panel 11), and the short side direction (direction orthogonal to the longitudinal direction) is the Y-axis direction (of the liquid crystal panel 11). (Long side direction).

Next, the connection structure of the flexible substrate 13 and the driver 21 to the non-display area NAA of the array substrate 11b will be described. As shown in FIG. 1, the ends of the driver 21 and the flexible substrate 13 are attached to non-overlapping portions (mounting regions) that do not overlap the color filter substrate 11a in the non-display area NAA of the array substrate 11b. The end of the flexible substrate 13 is arranged at the end of the array substrate 11b along the short side direction, whereas the driver 21 is arranged on the array substrate 11b so as to be closer to the display area AA than the flexible substrate 13. Has been. In other words, the driver 21 is disposed at a position sandwiched between the display area AA and the flexible substrate 13 in the non-display area NAA of the array substrate 11b, whereas the flexible substrate 13 has an end ( A mounting portion for the liquid crystal panel 11) is disposed on the side opposite to the display area AA side (the end side of the array substrate 11 b) with respect to the driver 21. The flexible substrate 13 has an end attached to the central portion of the end on the short side of the array substrate 11b, and the attached end is an end on the short side of the array substrate 11b (short side direction, (X-axis direction). The dimension of the end portion of the flexible substrate 13 attached to the array substrate 11b is smaller than the long side dimension of the array substrate 11b. On the other hand, the driver 21 is mounted on the central portion of the non-display area NAA in the short side direction of the array substrate 11b in a posture in which the long side direction coincides with the short side direction (X-axis direction) of the array substrate 11b. .

As shown in FIG. 4, an external connection terminal portion (terminal portion) 22 that receives an input signal from the flexible substrate 13 side is formed in the mounting area of the flexible substrate 13 on the array substrate 11b. On the other hand, in the mounting area of the driver 21 on the array substrate 11b, a panel side input terminal part (terminal part, board side input terminal part) 23 for supplying an input signal to the driver 21 and an output from the driver 21 are provided. A panel-side output terminal portion (terminal portion, substrate-side output terminal portion) 24 that receives the supply of signals is provided. Further, the external connection terminal portion 22 and the panel side input terminal portion 23 are formed so as to cross between the mounting area of the flexible substrate 13 and the mounting area of the driver 21 in the non-display area NAA of the array substrate 11b. Are electrically connected by relay wiring (not shown). On the other hand, the driver 21 is electrically connected to the driver side input terminal portion (mounting component side input terminal portion) 25 electrically connected to the panel side input terminal portion 23 and the panel side output terminal portion 24. The driver side output terminal portion (mounting component side output terminal portion) 26 is provided. In FIG. 4, the flexible substrate 13 and the driver 21 are illustrated by a two-dot chain line. In FIG. 4, the alternate long and short dash line represents the outer shape of the display area AA, and the area outside the alternate long and short dash line is the non-display area NAA.

As shown in FIG. 5, the panel-side input terminal portion 23 and the panel-side output terminal portion 24 are made of a transparent electrode material such as ITO or ZnO whose surface of the thin film made of the same metal material as the gate wiring or source wiring is the same as the pixel electrode Become covered by. Therefore, the panel side input terminal portion 23 and the panel side output terminal portion 24 are formed by a known photolithography method when patterning the gate wiring, the source wiring, or the pixel electrode 18 in the manufacturing process of the liquid crystal panel 11 (array substrate 11b). At the same time, it is patterned on the array substrate 11b. An anisotropic conductive film (ACF) 27 is disposed on the panel-side input terminal portion 23 and the panel-side output terminal portion 24, and conductive particles 27 a included in the anisotropic conductive film 27. The driver side input terminal portion 25 of the driver 21 is electrically connected to the panel side input terminal portion 23, and the driver side output terminal portion 26 is electrically connected to the panel side output terminal portion 24, respectively. The anisotropic conductive film 27 is composed of a large number of conductive particles 27a made of a metal material and a thermosetting resin 27b in which a large number of conductive particles 27a are dispersed and blended. Although illustration is omitted, the external connection terminal portion 22 has the same cross-sectional structure as the panel side input terminal portion 23 and the panel side output terminal portion 24 described above, and is flexible via an anisotropic conductive film. The terminal portion of the substrate 13 is electrically connected.

As shown in FIGS. 4 and 5, the panel-side input terminal portion 23 and the panel-side output terminal portion 24 are arranged on the array substrate 11 b so as to overlap with the driver 21 in a plan view, that is, in the mounting region of the driver 21. ing. The panel-side input terminal portion 23 and the panel-side output terminal portion 24 are arranged side by side along the Y-axis direction (the alignment direction of the driver 21 and the display area AA (flexible substrate 13)) with a predetermined interval therebetween. Has been. Among these, the panel side input terminal portion 23 is arranged on the flexible substrate 13 side (the opposite side to the display area AA side) in the mounting area of the driver 21 on the array substrate 11b, whereas the panel side output terminal The part 24 is arranged on the display area AA side (the side opposite to the flexible substrate 13 side). The panel-side output terminal portion 24 is disposed closest to the color filter substrate 11a among the terminal portions 22 to 24, and the distance from the end portion 11aEP of the color filter substrate 11a is, for example, about 0.3 mm. It is very narrow. As shown in FIG. 6, the panel-side input terminal portion 23 and the panel-side output terminal portion 24 are spaced apart from each other at predetermined intervals along the X-axis direction, that is, the long side direction (longitudinal direction) of the driver 21. Are arranged in a straight line. 6 representatively illustrates the cross-sectional configuration of the

input terminal portions

23 and 25, the cross-sectional configuration of the

output terminal portions

24 and 26 is the same as this.

As shown in FIG. 5, the driver-side input terminal portion 25 and the driver-side output terminal portion 26 are made of a metal material having excellent conductivity such as gold and protrude from the bottom surface of the driver 21 (the surface facing the array substrate 11b). It has a bump shape (projection shape). The driver side input terminal unit 25 and the driver side output terminal unit 26 are respectively connected to a processing circuit included in the driver 21, and an input signal input from the driver side input terminal unit 25 is processed by the processing circuit. Thereafter, it is possible to output to the driver side output terminal portion 26. As shown in FIG. 6, the driver side input terminal portion 25 and the driver side output terminal portion 26 are arranged in the X-axis direction, that is, in the long side direction of the driver 21, similarly to the panel side input terminal portion 23 and the panel side output terminal portion 24. A large number of them are arranged in a straight line at predetermined intervals.

As described above, the external connection terminal portion 22, the panel side input terminal portion 23, and the panel side output terminal portion 24 are formed in the mounting area of the flexible substrate 13 and the driver 21 on the array substrate 11b. The area of the array substrate 11b where the external connection terminal portion 22, the panel-side input terminal portion 23, and the panel-side output terminal portion 24 are formed before the flexible substrate 13 and the driver 21 are mounted in the manufacturing process of the liquid crystal panel 11. At this stage, it is wiped by the wiping device 40.

Incidentally, in recent years, there is a concern that the following problems will occur due to the progress of narrowing the frame of the liquid crystal panel 11. That is, as the frame of the liquid crystal panel 11 becomes narrower, the mounting area of the flexible substrate 13 and the driver 21 on the array substrate 11b constituting the liquid crystal panel 11, in other words, the external connection terminal portion 22, the panel side input terminal portion 23, and the panel The formation area of the side output terminal portion 24 is narrowed. Here, conventionally, the terminal surface is cleaned while the tape-shaped cleaning cloth is fed and run in a plane perpendicular to the relative movement direction of the liquid crystal panel 11. When the formation area of the terminal surface is narrowed along with the frame, there is a risk of failing to clean the back side portion of the terminal surface in the feeding direction of the tape-shaped cleaning cloth. For this reason, the cleaning of the terminal surface becomes insufficient, which may hinder the mounting of the mounting component.

Therefore, in the present embodiment, in the manufacturing process of the liquid crystal panel 11, the external connection terminal portion 22, the panel side input terminal portion 23, and the panel side of the array substrate 11b are mounted before the flexible substrate 13 and the driver 21 are mounted. The wiping device 40 for wiping the formation region of the output terminal portion 24 has the following configuration. That is, as shown in FIG. 7, the wiping device 40 includes a substrate holding portion 41 that holds the substrate main portion GSm in the glass substrate GS that constitutes the array substrate 11b, and at least the external connection terminal portion 22 of the array substrate 11b. By moving the panel-side input terminal portion 23 and the panel-side output terminal portion 24, the wiping portion 42, the substrate holding portion 41 and the array substrate 11b held therein, the outer peripheral edge of the color filter substrate 11a And at least a movable portion 43 that displaces the wiping portion 42 relative to the array substrate 11b in the X-axis direction, which is the extending direction of the end portions 11aEP on the terminal portions 22 to 24 side.

When the wiping device 40 having such a configuration is used, when wiping at least each of the terminal portions 22 to 24 of the array substrate 11b with the wiping portion 42, the movable portion 43 causes the substrate holding portion 41 and the substrate holding portion 41 to be placed there. The held array substrate 11b is moved. At this time, the movable portion 43 moves the substrate holding portion 41 and the array substrate 11b held therein, thereby extending the end portions 11aEP on the terminal portions 22 to 24 side of the outer peripheral end portions of the color filter substrate 11a. Since the wiping portion 42 is displaced relative to the array substrate 11b in the present direction, the end portions 11aEP on the terminal portions 22 to 24 side of the outer peripheral end portions of the color filter substrate 11a and the terminal portions 22 are arranged. Even if only a small space is secured between the panel side output terminal portion 24 and the panel side output terminal portion 24 closest to the end portion 11aEP, the portion near the color filter substrate 11a in the panel side output terminal portion 24 is wiped. It is difficult to leave a residue, so that the terminal portions 22 to 24, particularly the panel-side output terminal portion 24, can be appropriately wiped off. As a result, the narrowed array substrate 11b can be processed appropriately. Hereinafter, each component of the wiping device 40 will be described in detail.

As shown in FIG. 7 to FIG. 9, the substrate holding part 41 is vacuum-adsorbed while supporting the substrate main part GSm of the glass substrate GS constituting the array substrate 11b of the liquid crystal panel 11 from the back side, thereby providing a glass substrate. The GS can be held. The substrate main part GSm held by the substrate holding part 41 is the majority of the glass substrate GS constituting the array substrate 11b, excluding the terminal forming part GSt where the terminal parts 22 to 24 are formed. is there. The main substrate portion GSm is a portion of the array substrate 11b that overlaps the color filter substrate 11a and the

polarizing plates

11f and 11g. Accordingly, the terminal holding portion GSt (the portion of the array substrate 11b that is not overlapped with the color filter substrate 11a and the

polarizing plates

11f and 11g) is not held by the substrate holding portion 41. The size of the substrate holding portion 41 in a plan view is sufficiently larger than the main substrate portion GSm of the glass substrate GS constituting the array substrate 11b, thereby holding the main substrate portion GSm over the entire area. Is possible. In addition, the substrate holding unit 41 does not directly vacuum-suck the glass substrate GS constituting the array substrate 11b, but indirectly sucks the glass substrate GS by directly vacuum-sucking the polarizing plate 11g attached to the array substrate 11b. Is holding. In FIGS. 7 to 9 and 11, the

polarizing plates

11f and 11g are not shown.

As shown in FIGS. 7 to 9, the wiping unit 42 is on the front side with respect to the liquid crystal panel 11 held by the substrate holding unit 41, that is, in the Z-axis direction (the overlapping direction of the array substrate 11b and the color filter substrate 11a). The liquid crystal panel 11 is interposed between the substrate holding portion 41 and the substrate holding portion 41. The wiping portion 42 includes a wiping material 44 extending along the extending direction of the end portions 11aEP on the terminal portions 22 to 24 side of the end portions on the short side of the color filter substrate 11a, that is, the X-axis direction. The wiping material 44 includes at least a wiping material pressing portion 45 that sandwiches a part of the wiping material 44 with the array substrate 11b and presses the wiping material 44 toward the array substrate 11b. The wiping material 44 is made of a non-woven fabric or the like and has a belt shape extending along the X-axis direction. It is wound around. The wiping material delivery part 46 and the wiping material take-up part 47 are pivotally supported so as to be rotatable with respect to a device wall (not shown), and the wiping material delivery part 46 is the wiping material delivery part 46. Of these, the portion that has not yet been wiped (unwiped portion) is sent out toward the wiping material pressing portion 45, whereas the wiping material winding portion 47 is the portion of the wiping material 44 that has been wiped. It is possible to wind up the (wiped part). The dimension of the wiping material 44 in the width direction (Y-axis direction, the direction from the end portion 11aEP of the color filter substrate 11a to the terminal portions 22 to 24) is substantially constant over the entire length. As shown in FIG. 10, the width dimension of the terminal forming portion GSt of the glass substrate GS constituting the array substrate 11b is approximately the same (specifically, slightly smaller). Further, the wiping material 44 has a thickness of about 0.3 mm. The wiping material delivery part 46 and the wiping material take-up part 47 are arranged so that the wiping material pressing part 45 is sandwiched between them in the X-axis direction. The wiping material take-up portion 47 is wiped forward of the wiping material 44 in the feeding direction of the wiping material 44 with respect to the wiping material pressing portion 45 (left side shown in FIG. 8). The purification material delivery part 46 is each arrange | positioned.

As shown in FIGS. 7 to 9, the wiping material pressing portion 45 is attached with a pressing head portion 48 that contacts the wiping material 44, a head storage portion 49 that stores the pressing head portion 48, and the head storage portion 49. And a wiping base 50 fixed to a device wall (not shown). The holding head portion 48 is made of a synthetic resin material (for example, polytetrafluoroethylene resin (Teflon (registered trademark) or the like), polyacetal resin (Duracon (registered trademark) or the like), polyether ether ketone, or the like). The pressing head portion 48 has a substantially cylindrical shape (substantially disk shape), and a circular outer peripheral surface is a surface in contact with the wiping material 44, that is, a pressing surface 48 a for the wiping material 44. The pressing surface 48a is in point contact with the wiping material 44 in the X-axis direction, but is in line contact in the Y-axis direction. Further, the pressing head portion 48 has the same thickness dimension as the width dimension of the terminal forming portion GSt of the array substrate 11b, specifically, about 2 mm to 3 mm (about 10 mm at the maximum). The head accommodating portion 49 opens toward the liquid crystal panel 11 in the Z-axis direction, and the holding head portion 48 is accommodated in a removable manner through the opening. The head accommodating portion 49 is attached to the wiping base portion 50 in a form that can be raised and lowered in the Z-axis direction.

As shown in FIGS. 7 to 9, the movable portion 43 is disposed on the back side with respect to the substrate holding portion 41, that is, on the side opposite to the liquid crystal panel 11 side in the Z-axis direction. The movable portion 43 supports the substrate holding portion 41 from the back side, moves the substrate holding portion 41 in the Y-axis direction, and is on the plate surface (XY plane) of the liquid crystal panel 11 with respect to the slide support portion 52 described below. A first movable support portion 51 that is pivotally supported along the first movable support portion 51, and a shape that supports the first movable support portion 51 from the back side and is slidable along the X-axis direction by a second movable support portion 53 described below. And a second movable support portion 53 that moves the support portion 52 in the X-axis direction while supporting the support portion 52 from the back side. The first movable support portion 51 has a disk shape, and supports most of the center side of the substrate holding portion 41 that is laminated on the front side. The first movable support portion 51 is provided with a movable mechanism (not shown) for moving the substrate holding portion 41 along the Y-axis direction. The slide support portion 52 has a square plate shape, and supports the first movable support portion 51 that is stacked on the front side thereof over the entire area. The slide support 52 is provided with a rotation mechanism (not shown) for rotating the first movable support 51 along the XY plane. The second movable support portion 53 has a horizontally long rectangular plate shape, and supports the slide support portion 52 that is stacked on the front side thereof over the entire area. On the support surface of the slide support portion 52 in the second movable support portion 53, a pair of rail portions 53 a extending along the X-axis direction that is the long side direction of the second movable support portion 53 are spaced apart from each other by a predetermined interval. The slide support portion 52 is slidable along the rail portion 53a. The slide support 52 and the second movable support 53 are provided with a movable mechanism such as an LM guide (registered trademark) or a rack and pinion (not shown).

Next, a method for manufacturing a liquid crystal panel using the wiping device 40 having the above configuration will be described. The manufacturing method of the liquid crystal panel 11 includes various metal films, insulating films, and the like formed by laminating various metal films and insulating films on the inner plate surfaces of the glass substrates GS forming the color filter substrate 11a and the array substrate 11b by a known photolithography method. A structure forming step for forming the respective structures, a substrate bonding step for bonding the glass substrate GS forming the color filter substrate 11a and the glass substrate GS forming the array substrate 11b, and a plate surface outside each glass substrate GS A polarizing plate pasting step of pasting each

polarizing plate

11f, 11g on the substrate, a wiping step of wiping each of the terminal portions 22 to 24 arranged on the terminal forming portion GSt of the array substrate 11b, and a terminal forming portion of the array substrate 11b A mounting step of mounting the flexible substrate 13 and the driver 21 on GSt. Below, a wiping process is demonstrated in detail among said each process.

In the wiping process, first, the liquid crystal panel 11 is carried into the wiping device 40, the liquid crystal panel 11 is placed on the internal substrate holding portion 41, and then the liquid crystal panel 11 is vacuum-adsorbed by the substrate holding portion 41. . The substrate holding part 41 holding the liquid crystal panel 11 is moved in the Y-axis direction with respect to the first movable support part 51, so that the terminal forming part GSt of the array substrate 11b is pressed against the wiping material 44 and the wiping material pressing member. The Y-axis direction can be aligned with the portion 45 (pressing head portion 48) (see FIG. 7). At this time, the 1st movable support part 51 rotates with respect to the slide support part 52 with the board | substrate holding | maintenance part 41, The wiping material 44 and the wiping material holding | suppressing part 45 ( It can be aligned with respect to the pressing head 48) in the rotational direction along the XY plane (see FIG. 7). On the other hand, the pressing head portion 48 and the wiping material 44 are moved along the Z axis with respect to the liquid crystal panel 11 by raising and lowering the head accommodating portion 49 constituting the wiping material pressing portion 45 with respect to the wiping base portion 50 in the Z axis direction. Align with the direction. After the terminal forming portion GSt, the pressing head portion 48, and the wiping material 44 are aligned in this way, the slide support portion 52 is subsequently moved with respect to the second movable support portion 53 in the X-axis direction. 8 and 9, a portion of the wiping material 44 that contacts the pressing head portion 48 from one end side (the right end side shown in FIG. 8) in the X-axis direction with respect to the terminal forming portion GSt. Make contact. When the wiping material 44 comes into contact with the terminal forming portion GSt, the wiping material 44 is pressed to the terminal forming portion GSt side by the pressing head portion 48 as shown in FIG. When the terminal forming portion GSt is displaced relative to the wiping material 44 and the pressing head portion 48 in accordance with the slide, the terminal portions 22 to 24 on the terminal forming portion GSt are collectively moved by the wiping material 44. Wiped.

Here, the terminal forming portion GSt of the array substrate 11b, the wiping material 44 and the pressing head portion 48 are arranged in the X-axis direction, that is, the extending direction of the end portions 11aEP on the side of the terminal portions 22 to 24 in the color filter substrate 11a. Since the wiping by the wiping material 44 is performed along the relative displacement along the edge of the color filter substrate 11a, the end portion 11aEP of the color filter substrate 11a and the panel-side output terminal portion 24 nearest to the end portion 11aEP. Even if the gap is as small as about 0.3 mm, it is difficult for unwiping to occur in the portion of the panel-side output terminal portion 24 close to the color filter substrate 11a. As a result, the terminal portions 22 to 24 can be wiped throughout the entire area. Accordingly, the terminal forming part GSt of the narrowed liquid crystal panel 11 can be suitably wiped.

As the slide of the slide support portion 52 advances and the portion pressed by the pressing head portion 48 of the wiping material 44 is the other end in the X-axis direction with respect to the terminal forming portion GSt, as shown in FIG. When reaching the side (left end side shown in FIG. 8), the wiping process of each of the terminal portions 22 to 24 is completed. Thereafter, the vacuum suction state by the substrate holding portion 41 with respect to the liquid crystal panel 11 that has been processed is released, and the liquid crystal panel 11 is carried out of the wiping device 40. And if the slide support part 52 is returned to the position before performing a wiping process along an X-axis direction, the liquid crystal panel 11 processed next will be carried in in the wiping apparatus 40, and will be mounted on the board | substrate holding | maintenance part 41 To do. During this time, the wiping material feeding part 46 and the wiping material winding part 47 are rotated in the same direction, so that the wiping material 44 is slid along the extending direction with respect to the pressing head part 48. As a result, the used part of the wiping material 44 can be moved to the wiping material take-up part 47 side, and the unused part can be arranged directly below the pressing head part 48, so that the liquid crystal panel to be processed next. 11, the terminal portions 22 to 24 of the array substrate 11b can be wiped by unused portions of the wiping material 44.

As described above, the wiping device 40 for the liquid crystal panel (bonded substrate) 11 of the present embodiment uses the color filter substrate 11a provided with the color filter 11h to the terminal portions 22 to 24 for receiving external signal inputs, And a liquid crystal panel that is bonded to the array substrate 11b provided with a TFT (semiconductor device) 17 that is driven based on signals input from the terminal portions 22 to 24 with the terminal portions 22 to 24 exposed. By moving at least one of the wiping unit 42 for wiping the exposed terminal portions 22 to 24 and the liquid crystal panel 11 and the wiping unit 42 in the (bonded substrate) 11, the color filter substrate 11 a is moved. Of the outer peripheral end of the movable portion 4 that displaces the wiping portion 42 relative to the array substrate 11b in the extending direction of the end portion 11aEP on the terminal portion 22-24 side. And, equipped with a.

In this way, the color filter substrate 11a provided with the color filter 11h is connected to the terminal portions 22 to 24 that receive signal input from the outside, and the TFT 17 that is driven based on the signals input from the terminal portions 22 to 24. When the exposed terminal portions 22 to 24 are wiped by the wiping unit 42 in the liquid crystal panel 11 which is bonded to the array substrate 11b provided with the terminal portions 22 to 24 exposed. The movable unit 43 moves at least one of the liquid crystal panel 11 and the wiping unit 42. At this time, the movable portion 43 moves at least one of the liquid crystal panel 11 and the wiping portion 42, thereby extending the end portion 11aEP on the terminal portions 22 to 24 side of the outer peripheral end portion of the color filter substrate 11a. Since the wiping portion 42 is displaced relative to the array substrate 11b in the present direction, the end portion 11aEP on the terminal portion 22-24 side and the terminal portions 22-24 of the outer peripheral end portion of the color filter substrate 11a Even when only a small interval is ensured, it is difficult for the remaining portions of the terminal portions 22 to 24 to be close to the color filter substrate 11a to be left, so that the terminal portions 22 to 24 can be appropriately cleaned. Can do. Thereby, the narrowed liquid crystal panel 11 can be processed appropriately.

The wiping portion 42 extends in parallel with the extending direction of the end portion 11aEP of the color filter substrate 11a, and a part of the wiping portion 42 contacts the terminal portions 22 to 24 exposed in the liquid crystal panel 11. 44 and the array substrate 11b of the liquid crystal panel 11 and at least a wiping material pressing portion 45 that holds the wiping material 44 toward the array substrate 11b while sandwiching the wiping material 44 therebetween. In this way, a part of the wiping material 44 extending in parallel with the extending direction of the end portion 11aEP of the color filter substrate 11a is in contact with the terminal portions 22 to 24 exposed in the liquid crystal panel 11. In this state, since it is pressed by the wiping material pressing portion 45, an appropriate load is applied to the terminal portions 22 to 24, so that the terminal portions 22 to 24 can be wiped more suitably.

Further, the wiping material pressing portion 45 makes the wiping material 44 point-contact with the array substrate 11b of the liquid crystal panel 11 in the extending direction of the end portion 11aEP of the color filter substrate 11a and the end of the color filter substrate 11a. Line contact is made in the direction from the portion 11aEP toward the terminal portions 22 to 24. If it does in this way, compared with the case where the wiping material holding | suppressing part is formed so that the wiping material 44 may be surface-contacted with the array board | substrate 11b of the liquid crystal panel 11, the said edge part of the color filter board | substrate 11a is assumed. Since the wiping material 44 can be more easily brought into contact with the array substrate 11b in the direction from 11aEP toward the terminal portions 22 to 24, the terminal portions 22 to 24 can be wiped more appropriately.

In addition, the substrate holding portion 41 that is disposed on the opposite side of the wiping portion 42 with respect to the liquid crystal panel 11 and holds the main portion of the substrate, which is the portion of the array substrate 11b to which the color filter substrate 11a is bonded. Is provided. If it does in this way, the substrate main part which is the part by which the color filter board | substrate 11a of the array board | substrates 11b was bonded together by the board | substrate holding | maintenance part 41 distribute | arranged with respect to the liquid crystal panel 11 on the opposite side to the wiping part 42. In a state in which the terminal portions 22 to 24 are held, the terminal portions 22 to 24 can be more suitably wiped by the wiping portion 42 disposed on the opposite side of the substrate holding portion 41 with respect to the liquid crystal panel 11.

Further, in the method for manufacturing the liquid crystal panel 11 according to the present embodiment, the color filter substrate 11a provided with the color filter 11h is connected to the terminal portions 22 to 24 that receive signal inputs from the flexible substrate 13 and the driver 21 (mounting parts), In the liquid crystal panel 11 formed by bonding the terminal portions 22 to 24 to the array substrate 11b provided with the TFT 17 driven based on the signals input from the terminal portions 22 to 24, the exposed portions are exposed. When the terminal portions 22 to 24 are wiped by the wiping portion 42, at least one of the liquid crystal panel 11 and the wiping portion 42 is moved by the movable portion 43, so that the outer peripheral end portion of the color filter substrate 11 a is moved. Among them, the wiping portion 42 is relatively displaced with respect to the array substrate 11b in the extending direction of the end portion 11aEP on the terminal portions 22 to 24 side. Comprising a wiping step was so that, by mounting the flexible substrate 13 and the driver 21 on the array substrate 11b of the liquid crystal panel 11, a mounting step of connecting the terminal portions 22-24 to the flexible substrate 13 and the driver 21.

In this way, in the wiping process, the color filter substrate 11a provided with the color filter 11h is applied to the terminal portions 22 to 24 that receive signal input from the outside and the signals input from the terminal portions 22 to 24. The movable portion 43 can move at least one of the liquid crystal panel 11 and the wiping portion 42 which are bonded together with the terminal portions 22 to 24 exposed to the array substrate 11b provided with the TFT 17 to be driven. As a result, the terminal portions 22 to 24 exposed in the liquid crystal panel 11 are wiped by the wiping portion 42. At this time, the movable portion 43 moves at least one of the liquid crystal panel 11 and the wiping portion 42, thereby extending the end portion 11aEP on the terminal portions 22 to 24 side of the outer peripheral end portion of the color filter substrate 11a. Since the wiping portion 42 is displaced relative to the array substrate 11b in the present direction, the end portion 11aEP on the terminal portion 22-24 side and the terminal portions 22-24 of the outer peripheral end portion of the color filter substrate 11a Even when only a small interval is ensured, it is difficult for the remaining portions of the terminal portions 22 to 24 to be close to the color filter substrate 11a to be left, so that the terminal portions 22 to 24 can be appropriately cleaned. Can do. Thereby, since the liquid crystal panel 11 narrowed in the wiping process can be suitably processed, the flexible substrate 13 and the driver 21 mounted on the array substrate 11b in the liquid crystal panel 11 in the subsequent mounting process. The terminal portions 22 to 24 can be connected well.

<Embodiment 2>
A second embodiment of the present invention will be described with reference to FIG. In this Embodiment 2, the wiping apparatus 140 which changed the shape of the pressing head part 148 which comprises the wiping material pressing part 145 is shown. In addition, the overlapping description about the same structure, operation | movement, and effect as above-mentioned Embodiment 1 is abbreviate | omitted.

As shown in FIG. 12, the pressing head portion 148 constituting the wiping material pressing portion 145 provided in the wiping device 140 according to the present embodiment is formed so that the cross-sectional shape of the tip portion in contact with the wiping material 144 is inclined. Has been. Specifically, the tip of the pressing head 148 and the portion of the liquid crystal panel 111 that faces the end 111aEP of the color filter substrate 111a is in the Z-axis direction (the overlapping direction of the color filter substrate 111a and the array substrate 111b). When moving away from the terminal forming portion GSt (each terminal portion) in the array substrate 111b, the color filter in the Y-axis direction (direction from the end portion 111aEP of the color filter substrate 111a toward each terminal portion (not shown in the present embodiment)). It can be said that it is inclined so as to move away from the substrate 111a and has an inclined portion 54. In other words, when the portion of the holding head portion 148 facing the end portion 111aEP of the color filter substrate 111a approaches the terminal formation portion GSt (each terminal portion) on the array substrate 111b in the Z-axis direction, the color in the Y-axis direction It is inclined so as to approach the filter substrate 111a. In other words, the portion of the pressing head portion 148 facing the end portion 111aEP of the color filter substrate 111a gradually and gradually increases in dimension (width dimension) in the Y-axis direction as it approaches the terminal forming portion GSt in the Z-axis direction. On the other hand, when the distance from the terminal forming portion GSt is increased in the Z-axis direction, the dimension in the Y-axis direction is continuously decreased. Therefore, the distance between the inclined portion 54 formed at the tip end portion of the pressing head portion 148 and the end portion 111aEP of the color filter substrate 111a becomes wider as it approaches the terminal forming portion GSt in the Z-axis direction. In the Z-axis direction, the distance from the terminal forming portion GSt becomes narrower.

Here, in the manufacturing process of the liquid crystal panel 111, each glass substrate GS constituting the color filter substrate 111a and the array substrate 111b may be formed by dividing a large mother glass. There is a possibility that a projection called a burr is generated at the end of the substrate GS along with the division of the mother glass. If such burrs are generated at the end 111aEP on the terminal forming portion GSt (each terminal portion) side of the color filter substrate 111a, the burrs become an obstacle when wiping each terminal portion of the terminal forming portion GSt. there is a possibility. In that respect, the pressing head portion 148 according to the present embodiment has a continuous dimension in the Y-axis direction when the portion facing the end portion 111aEP of the color filter substrate 111a moves away from the terminal forming portion GSt in the Z-axis direction. Since it is formed so as to gradually decrease, the burr BU generated at the end 111aEP of the color filter substrate 111a is unlikely to interfere with the pressing head 148, as shown in FIG. If the portion of the pressing head portion that faces the end portion 111aEP of the color filter substrate 111a is formed straight in the Z-axis direction, when trying to avoid interference of the pressing head portion with respect to the burr BU, Wiping residue is likely to occur in a portion of the terminal portion close to the color filter substrate 111a. Compared to this, according to the above-described configuration, it is possible to make it difficult to leave a wiping residue in a portion of each terminal portion close to the color filter substrate 111a while avoiding interference of the pressing head portion 148 with respect to the burr BU. In FIG. 12, the shape of the end portion 111aEP of the color filter substrate 111a when no burr BU is generated is indicated by a one-dot chain line.

As described above, according to this embodiment, the wiping material pressing portion 145 has at least a portion facing the end portion 111aEP of the color filter substrate 111a in the terminal portion in the overlapping direction of the array substrate 111b and the color filter substrate 111a. When moving away from the color filter substrate 111a, the color filter substrate 111a is inclined so as to move away from the color filter substrate 111a in the direction from the end 111aEP to the terminal portion. In this case, for example, even when a burr (protrusion) BU is generated at the end 111aEP on the terminal side of the color filter substrate 111a, the end 111aEP of the color filter substrate 111a in the wiping material pressing portion 145 is formed. When the portion facing to the terminal portion is away from the terminal portion in the overlapping direction of the array substrate 111b and the color filter substrate 111a, the inclined portion is inclined away from the color filter substrate 111a in the direction from the end portion 111aEP to the terminal portion of the color filter substrate 111a. Therefore, the wiping material pressing portion 145 is unlikely to interfere with the burr BU. If the portion of the wiping material pressing portion 145 facing the end 111aEP of the color filter substrate 111a is formed straight in the overlapping direction of the array substrate 111b and the color filter substrate 111a, If it is going to avoid the interference of the wiping material holding | suppressing part 145, it will become easy to produce wiping residue in the part near the color filter board | substrate 111a among terminal parts. Compared with this, according to the above-described configuration, it is possible to make it difficult to leave a wiping residue in the portion of the terminal portion close to the color filter substrate 111a while avoiding interference of the wiping material pressing portion 145 with respect to the burr BU.

<Embodiment 3>
Embodiment 3 of the present invention will be described with reference to FIG. In this Embodiment 3, the wiping apparatus 240 provided with the terminal formation part support part 55 which supports the terminal formation part GSt of the array substrate 211b is shown. In addition, the overlapping description about the same structure, operation | movement, and effect as above-mentioned Embodiment 1 is abbreviate | omitted.

As shown in FIG. 14, the wiping device 240 according to the present embodiment includes a terminal in addition to the substrate holding part 241 that holds the substrate main part GSm among the glass substrates GS that constitute the array substrate 211 b of the liquid crystal panel 211. A terminal forming portion support portion 55 that supports the forming portion GSt from the back side, that is, the same side as the substrate holding portion 241 is provided. The terminal formation part support part 55 consists of metal materials (for example, stainless steel etc.), and the support surface which contact | connects the terminal formation part GSt has high flatness. Further, the support surface of the terminal forming portion support portion 55 is relative to the holding surface in contact with the substrate main portion GSm in the substrate holding portion 241 with a step (gap) corresponding to the thickness of the polarizing plate 211g in the Z-axis direction. Is arranged on the front side. The terminal formation part support part 55 is distribute | arranged with respect to the terminal formation part GSt on the opposite side to the wiping part 242 (wiping material 244 and the pressing head part 248) side. Accordingly, the terminal forming portion support portion 55 that supports the terminal forming portion GSt can receive a pressing force acting on the terminal forming portion GSt from the pressing head portion 248. Thereby, each terminal part (illustration is abbreviate | omitted in this embodiment) can be wiped more suitably by the wiping part 242. Note that the terminal forming portion support portion 55 is moved along the X-axis direction in synchronization with the substrate holding portion 241 by a movable portion (not shown in the present embodiment).

As described above, according to the present embodiment, the liquid crystal panel 211 is disposed on the opposite side of the wiping unit 242 and is a portion of the array substrate 211b excluding the substrate main part GSm and having terminals. The terminal formation part support part 55 which supports the terminal formation part GSt which is a part in which the part was formed is provided. In this way, the substrate main part GSm in the array substrate 211b of the liquid crystal panel 211 is held by the substrate holding part 241, and then the terminal forming part GSt that is a part in which the terminal part in the array substrate 211b is formed. Is supported by the terminal forming portion support portion 55, the terminal portion can be more suitably wiped by the wiping portion 242 disposed on the opposite side of the liquid crystal panel 211 from the terminal forming portion support portion 55. . Further, since the terminal forming portion support portion 55 is provided separately from the substrate holding portion 241, even if a step is generated between the substrate main portion GSm and the terminal forming portion GSt in the array substrate 211b, the substrate main portion. The GSm and the terminal forming portion GSt can be appropriately held or supported.

<Embodiment 4>
A fourth embodiment of the present invention will be described with reference to FIG. 15 or FIG. In this Embodiment 4, the wiping apparatus 340 provided with the wiping material positioning part 56 for positioning the wiping material 344 is shown. In addition, the overlapping description about the same structure, operation | movement, and effect as above-mentioned Embodiment 1 is abbreviate | omitted.

As shown in FIG. 15, the wiping device 340 according to the present embodiment is disposed in a pair so as to be sandwiched back and forth in the X-axis direction with respect to the pressing head portion 348 constituting the wiping material pressing portion 345. A wiping material positioning part 56 for positioning the cleaning material 344 in the Y-axis direction is provided. Specifically, the pair of wiping material positioning parts 56 are arranged on the wiping material delivery part 346 side with respect to the pressing head part 348 and the wiping material take-up part 347 side with respect to the pressing head part 348. Accordingly, the portion of the wiping material 344 that is pressed by the pressing head portion 348 and wipes each terminal portion (not shown in the present embodiment) is the Y-axis. It is considered that it is difficult to shift in the direction. As a result, wiping residue is less likely to occur in the portion close to the color filter substrate 311a in each terminal portion, and the wiping material 344 is less likely to interfere with the end portion of the color filter substrate 311a. Can be wiped. The entire wiping material positioning portion 56 is made of a synthetic resin material (for example, polytetrafluoroethylene resin (such as Teflon (registered trademark)), polyacetal resin (such as Duracon (registered trademark)), or polyether ether ketone). As shown in FIG. 16, it is composed of a cylindrical shaft portion 56a extending along the Y-axis direction, and a pair of flange portions 56b formed so as to protrude at both ends of the shaft portion 56a. The shaft is pivotally supported with respect to the purification base 350. When the surface of the wiping material 344 is in contact with the shaft portion 56a, winding by the wiping material winding unit 347 and feeding by the wiping material feeding unit 346 become smooth, and the wiping material 344 The slack is less likely to occur. The shaft portion 56a has a constant thickness (diameter dimension) over the entire length. The edge of the wiping material 344 along the extending direction (X-axis direction) is in contact with one of the pair of flange portions 56b, so that the wiping material 344 is displaced in the width direction (Y-axis direction). It is possible to regulate. The distance between the inner surfaces of the pair of flanges 56b is larger than the width dimension of the wiping material 344, and is, for example, about 10 mm.

As described above, according to the present embodiment, at least a pair of the wiping material pressing portion 345 is sandwiched in the extending direction of the end portion of the color filter substrate 311a and the end portion of the color filter substrate 311a is disposed. The wiping material positioning part 56 which positions the wiping material 344 about the direction which goes to a terminal part is provided. In this way, the wiping material 344 is colored by the wiping material positioning portions 56 arranged at least in a pair so as to be sandwiched in the extending direction of the end portion of the color filter substrate 311a with respect to the wiping material pressing portion 345. Since the positioning is performed in the direction from the end portion of the filter substrate 311a toward the terminal portion, the wiping material 344 is less likely to be displaced. As a result, it is less likely that unwiping remains in the portion near the color filter substrate 311a in the terminal portion, and the wiping material 344 is less likely to interfere with the end portion of the color filter substrate 311a, so that the terminal portion is wiped more appropriately. Can be purified.

<Embodiment 5>
A fifth embodiment of the present invention will be described with reference to FIG. 17 or FIG. In this Embodiment 5, what changed the shape of the wiping material positioning part 456 from above-mentioned Embodiment 4 is shown. In addition, the overlapping description about the same structure, an effect | action, and effect as above-mentioned Embodiment 4 is abbreviate | omitted.

As shown in FIGS. 17 and 18, the wiping material positioning part 456 according to the present embodiment is a position where the thickness (diameter dimension) of the shaft part 456 a is in the axial direction (Y-axis direction), that is, a pair of flanges. It is formed so as to change depending on the position with respect to the portion 456b. Specifically, out of the pair of wiping material positioning portions 456, the wiping material feeding portion side (not shown) on the pressing head portion 448 constituting the wiping material pressing portion 445 in the X-axis direction (the upper side shown in FIG. 16). The first wiping material positioning part 456A arranged in the shaft 456aA becomes thicker as it approaches the end part 411aEP of the color filter substrate 411a from the side of each terminal part (not shown in the present embodiment) in the Y-axis direction. It is formed to become. That is, the shaft portion 456aA constituting the first wiping material positioning portion 456A on the wiping material delivery portion side has a diameter that increases gradually from the terminal portion side to the end portion 411aEP side in the Y-axis direction. On the contrary, it is formed so as to decrease gradually from the end portion 411aEP side toward each terminal portion side. The inclination angle formed by the outer peripheral surface of the shaft portion 456aA with respect to the Y-axis direction is, for example, in the range of 3 ° to 15 °. According to such a configuration, the wiping material 444 in contact with the shaft portion 456a of the first wiping material positioning portion 456A approaches the pressing head portion 448 from the first wiping material positioning portion 456A. It is inclined to approach the end 411aEP. Thereby, even when a clearance is generated between the edge of the wiping material 444 and the flange portion 456bA, the wiping material 444 moves away from the end portion 411aEP of the color filter substrate 411a due to the clearance. It becomes difficult to become arrangement. Therefore, even when the frame is further narrowed and the distance between the end portion 411aEP of the color filter substrate 411a and each terminal portion (not shown) is further reduced, the color filter substrate 411a among the terminal portions is formed. It becomes difficult to leave a wiping residue in a nearby portion, and thus each terminal portion can be more suitably cleaned.

Of the pair of wiping material positioning portions 456, the second wiping material disposed on the wiping material take-up portion side (the lower side shown in FIG. 16) not shown with respect to the pressing head portion 448 in the X-axis direction. The positioning portion 456B is formed such that the shaft portion 456aB becomes thicker as it approaches the end portion 411aEP of the color filter substrate 411a from each terminal portion side in the Y-axis direction. That is, the shaft portion 456aB constituting the second wiping material positioning portion 456B on the wiping material take-up portion side has a diameter that is gradually and gradually increased from each terminal portion side to the end portion 411aEP side in the Y-axis direction. On the contrary, it is formed so as to continuously decrease gradually from the end portion 411aEP side toward each terminal portion side. The inclination angle formed by the outer peripheral surface of the shaft portion 456aB with respect to the Y-axis direction is, for example, in the range of 3 ° to 15 °, and is preferably the same as the inclination angle of the shaft portion 456aA. According to such a configuration, the wiping material 444 in contact with the shaft portion 456aB of the second wiping material positioning portion 456B approaches the second wiping material positioning portion 456B from the pressing head portion 448, so that the color filter substrate 411a It is inclined to approach the end 411aEP. That is, the wiping material 444 is inclined so as to approach the end portion 411aEP of the color filter substrate 411a consistently as the wiping material positioning portion 456A approaches the second wiping material positioning portion 456B. This makes it difficult for the wiping material 444 to be twisted.

As described above, according to the present embodiment, the wiping material delivery unit that feeds the wiping material 444 and the wiping material winding unit that winds the wiping material 444 are provided, and at least a pair of wiping materials are provided. The material positioning portion 456 is rotatably supported and is formed so as to protrude from both ends of the shaft portion 456a and a shaft portion 456a that is in contact with the surface of the wiping material 444. A first wiping material positioning portion (wiping material positioning portion) disposed on the wiping material feeding portion side with respect to the wiping material pressing portion 445 ) 456A is formed so that the shaft portion 456aA becomes thicker from the terminal portion side toward the end portion 411aEP side in the direction from the terminal portion toward the end portion 411aEP of the color filter substrate 411a. In this way, the wiping material 444 is wound by the wiping material take-up portion and the wiping material delivery portion by rotating the shaft portion 456a of the wiping material positioning portion 456 with which the surface contacts. Smoothing out by means of. At this time, the surface of the wiping material 444 is in contact with the shaft portion 456a of the wiping material positioning portion 456, so that the occurrence of slack is suppressed and the end edge is in contact with one of the pair of flange portions 456b. Positioning is achieved. And the 1st wiping material positioning part 456A distribute | arranged to the wiping material delivery part side with respect to the wiping material holding | suppressing part 445 is from the terminal part side about the direction which goes to the edge part 411aEP of the color filter board | substrate 411a. Since the shaft portion 456aA is formed to become thicker as it approaches the end portion 411aEP side, the wiping material 444 in contact with the shaft portion 456aA is arranged on the wiping material delivery portion side with respect to the wiping material pressing portion 445. As the first wiping material positioning portion 456A approaches the wiping material pressing portion 445, the first wiping material positioning portion 456A is inclined to approach the end portion 411aEP of the color filter substrate 411a. Thereby, even when a clearance is generated between the edge of the wiping material 444 and the flange portion 456b, the wiping material 444 moves away from the end portion 411aEP of the color filter substrate 411a due to the clearance. It becomes difficult to become arrangement. Accordingly, even when the frame is further narrowed and the distance between the end portion 411aEP of the color filter substrate 411a and the terminal portion is further reduced, the remaining portion of the terminal portion near the color filter substrate 411a is not wiped off. Therefore, the terminal portion can be wiped more suitably.

Moreover, the 2nd wiping material positioning part (wiping material positioning part) 456B distribute | arranged to the wiping material winding part side with respect to the wiping material holding | suppressing part 445 is the edge part 411aEP of the color filter board | substrate 411a from a terminal part. The shaft portion 456aB is formed so as to become thicker from the terminal portion side toward the end portion 411aEP side in the direction toward the end. If it does in this way, the wiping material 444 will approach the 2nd wiping material positioning part 456B distribute | arranged to the wiping material winding part side with respect to the wiping material holding | suppressing part 445 from the wiping material holding | suppressing part 445. Accordingly, the color filter substrate 411a is inclined so as to approach the end portion 411aEP. That is, the wiping material 444 is wound around the wiping material pressing portion 445 from the first wiping material positioning portion 456A arranged on the wiping material feeding portion side with respect to the wiping material pressing portion 445. As the second wiping material positioning part 456B arranged on the take-up part side is approached, the end part 411aEP of the color filter substrate 411a is consistently tilted. This makes it difficult for the wiping material 444 to be twisted.

<Embodiment 6>
A sixth embodiment of the present invention will be described with reference to FIGS. In this Embodiment 6, the wiping apparatus 540 provided with the function which detects the position shift of the wiping material 544 is shown. In addition, the overlapping description about the same structure, operation | movement, and effect as above-mentioned Embodiment 1 is abbreviate | omitted.

As shown in FIG. 19, an opening 57 that opens toward the wiping material 544 is formed in the pressing head portion 548 that constitutes the wiping material pressing portion 545 provided in the wiping device 540 according to the present embodiment. Has been. A pair of openings 57 are arranged in the vicinity of both end portions in the Y-axis direction of the pressing head portion 548. Each opening 57 is covered (closed) by the wiping material 544 when the wiping material 544 is in the normal position in the width direction (Y-axis direction), but the wiping material 544 is When the position is shifted from the normal position in the width direction, it is partially covered by the wiping material 544, and the portion not covered is communicated to the outside without passing through the wiping material 544 ( (See FIG. 21). Then, as shown in FIG. 20, the wiping device 540 is detected by a decompression unit 58 that depressurizes the opening 57, a pressure detection unit 59 that detects air pressure in the opening 57, and a pressure detection unit 59. And a determination unit 60 for determining whether the air pressure is a normal value or an abnormal value. The decompression unit 58 includes a vacuum pump, and always decompresses the opening 57 while the wiping device 540 is operating. The pressure detection unit 59 includes a pressure sensor, and always detects the air pressure in the opening 57 while the wiping device 540 is operating. The determination unit 60 includes a CPU or the like, and compares the value of the air pressure detected by the pressure detection unit 59 with a predetermined reference value (reference numerical value range) stored in a memory or the like, and is normal if it matches the reference value. If it does not match the reference value, it is determined as abnormal. This reference value matches the air pressure when the opening 57 is covered with the wiping material 544 over the entire area. The determination unit 60 continues the operation (wiping process) of the wiping device 540 when determined to be normal, and stops the operation of the wiping device 540 when determined to be abnormal.

If the wiping material 544 is disposed at the normal position in the width direction while the wiping device 540 is operating, each opening 57 is covered with the wiping material 544 over the entire area as shown in FIG. Therefore, the air pressure in each opening 57 detected by the pressure detector 59 matches the reference value. Therefore, the determination part 60 determines with it being normal, and makes the wiping apparatus 540 continue operation. On the other hand, if the wiping material 544 is misaligned in the width direction, either one or both of the pair of openings 57 is only partially covered by the wiping material 544, as shown in FIG. The portion not covered communicates directly with the outside without passing through the wiping material 544. For this reason, the air pressure in the opening 57 that is only partially covered by the wiping material 544 does not match the reference value. Therefore, the determination unit 60 determines that there is an abnormality and stops the operation of the wiping device 540. When the operation of the wiping device 540 is stopped, the operator cleans the wiping material 544 to the normal position, and then restarts the wiping device 540. Accordingly, a situation in which the liquid crystal panel 511 is continuously processed in a state where the wiping material 544 is not in the normal position is avoided, so that the liquid crystal panel 511 can be more suitably processed.

As described above, according to the present embodiment, the wiping material pressing portion 545 is provided with the opening 57 that opens toward the wiping material 544 and is covered by the wiping material 544. The pressure reduction part 58 which pressure-reduces 57 and the pressure detection part 59 which detects the air pressure in the opening part 57 are provided. In this way, if the wiping material 544 is in the normal position, the opening 57 of the wiping material pressing portion 545 is covered with the wiping material 544, but the wiping material 544 is displaced from the normal position. Since a part of the opening 57 is not covered with the wiping material 544, when the wiping material 544 is in the normal position and when it is not, the inside of the opening 57 in the state where the pressure is reduced by the pressure reducing unit 58 The air pressure is different. Therefore, it is possible to easily detect whether or not the wiping material 44 is in the normal position by decompressing the opening 57 by the decompression unit 58 and detecting the air pressure in the opening 57 by the pressure detection unit 59. . Thereby, since the situation where it continues processing the liquid crystal panel 511 in the state where the wiping material 44 is not in a regular position is avoided, the liquid crystal panel 511 can be processed more suitably.

Further, a pair of wiping material pressing portions 545 are disposed at positions where the opening portions 57 are offset from one end side and the other end side in the direction from the end portion 511aEP of the color filter substrate 511a to the terminal portion. . In this way, when the wiping material 544 is displaced in the direction from the end portion 511aEP to the terminal portion of the color filter substrate 511a, the positional displacement of the wiping material 544 is small even if the displacement amount is slight. Can be easily detected.

<Embodiment 7>
A seventh embodiment of the present invention will be described with reference to FIGS. In this Embodiment 7, the wiping apparatus 640 which changed the shape of the pressing head part 648 which comprises the wiping material pressing part 645 is shown. In addition, the overlapping description about the same structure, operation | movement, and effect as above-mentioned Embodiment 1 is abbreviate | omitted.

As shown in FIGS. 22 and 23, the pressing head portion 648 constituting the wiping material pressing portion 645 provided in the wiping device 640 according to the present embodiment forms a block shape as a whole, and the wiping material 644. Surface contact. The pressing head portion 648 has a planar shape in which the pressing surface 648a facing the wiping material 644 side is parallel to the plate surface of the array substrate 611b of the liquid crystal panel 611, and between the terminal forming portion GSt of the array substrate 611b. It is in surface contact with the wiping material 644 to be sandwiched. Moreover, about the both corner | angular parts by the side of the wiping material 644 in the pressing head part 648, the sending-out operation | movement and winding-up operation | movement of the wiping material 644 are smoothed by rounding in circular arc shape. By pressing the wiping material 644 toward the terminal forming portion GSt with the holding head portion 648 having such a configuration, each terminal portion (not shown) can be wiped appropriately.

<Embodiment 8>
An eighth embodiment of the present invention will be described with reference to FIGS. In this Embodiment 8, the wiping apparatus 740 which changed the structure of the movable part 743 is shown. In addition, the overlapping description about the same structure, operation | movement, and effect as above-mentioned Embodiment 1 is abbreviate | omitted.

As shown in FIG. 24, the movable portion 743 provided in the wiping device 740 according to the present embodiment moves the wiping material pressing portion 745 constituting the wiping portion 742, so that the end portion of the color filter substrate 711a. The wiping unit 742 is displaced relative to the array substrate 711b in the X-axis direction, which is the extending direction of 711aEP. Specifically, the movable portion 743 is arranged on the front side with respect to the liquid crystal panel 711, that is, on the wiping portion 742 side (the side opposite to the substrate holding portion 741 side) in the Z-axis direction. The movable portion 743 includes a movable support portion 61 that supports the wiping base portion 750 constituting the wiping material pressing portion 745 from the side opposite to the head accommodating portion 749 side and moves the wiping base portion 750 in the X-axis direction. The movable support portion 61 includes a pair of rail portions 61a fixed to a device wall portion (not shown). The pair of rail portions 61a extend along the X-axis direction and are arranged at a predetermined interval. The wiping base 750, the head accommodating portion 749, and the pressing head portion 748 are disposed along the rail portion 61a. Are both slidable. The wiping base 750 and the movable portion 743 are provided with a movable mechanism such as an LM guide (registered trademark) or a rack and pinion, although not shown. Although not shown, the substrate holding portion 741 is supported in the Y-axis direction by being supported by the first movable support portion and the slide support portion similar to those of the first embodiment described above, and also on the XY plane. It can be turned along.

In the wiping process, the wiping base portion 750, the head accommodating portion 749, and the pressing head portion 748 that constitute the wiping material pressing portion 745 are moved by the movable support portion 61 that constitutes the movable portion 743, thereby being shown in FIG. As described above, a portion of the wiping material 744 in contact with the pressing head portion 748 from one end side in the X-axis direction with respect to the terminal forming portion GSt in the array substrate 711b of the liquid crystal panel 711 vacuum-adsorbed by the substrate holding portion 741. Contact. When the wiping material 744 contacts the terminal forming portion GSt, the wiping material 744 is pressed to the terminal forming portion GSt side by the pressing head portion 748, and in that state, the wiping base portion 750 along the rail portion 61a. The head accommodating portion 749 and the pressing head portion 748 are slid toward the other end side in the X-axis direction of the terminal forming portion GSt, so that each terminal portion (on the terminal forming portion GSt (see FIG. 26)). In the present embodiment, illustration is omitted), but the wiping material 744 is collectively wiped.

<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.
(1) In the above-described embodiments, the pressing head portion is made of a synthetic resin. However, the pressing head portion can be made of metal.

(2) In addition to the above-described embodiments, the specific shape of the pressing head can be changed as appropriate. For example, the pressing head portion can be formed into an elliptical columnar shape or a substantially block shape in which a cross-sectional shape cut along the Y-axis direction is a trapezoidal shape.

(3) In each above-mentioned embodiment, although the wiping apparatus which wipes only the board surface in which each terminal part was formed among array substrates was illustrated, the board surface in which each terminal part was formed among array substrates was used. In addition to the wiping unit for wiping, the present invention is also applicable to a wiping device having a wiping unit for wiping the plate surface opposite to the plate surface on which each terminal portion is formed in the array substrate. It is. The pair of wiping units disposed with the array substrate interposed therebetween may be configured to be symmetrical to each other.

(4) In each of the above-described embodiments, the wiping device for wiping the terminal forming portion of the glass substrate that constitutes the array substrate in a form that cuts across almost the entire region has been shown. The present invention can also be applied to such a wiping device.

(5) In the above-described third embodiment, the terminal forming portion supporting portion is made of metal, but the terminal forming portion supporting portion can be made of synthetic resin.

(6) In the above-described Embodiments 4 and 5, the wiping device provided with a pair of wiping material positioning parts is shown, but the present invention is also applied to a wiping device provided with three or more wiping material positioning parts. Applicable.

(7) In the above-described sixth embodiment, the case where the worker corrects the position of the wiping material when it is determined to be abnormal by the determination unit is shown. For example, the position of the wiping material is indicated on the wiping device. A wiping material correction mechanism that automatically corrects the wiping material may be automatically corrected by the wiping material correction mechanism when the determination unit determines that there is an abnormality.

(8) In addition to the above-described sixth embodiment, the arrangement and the number of openings in the pressing head can be changed as appropriate.

(9) In each of the above embodiments, the anisotropic conductive film containing a thermosetting resin is exemplified, but an ultraviolet curable resin cured by ultraviolet rays, a visible light curable resin cured by visible light, or the like. It is also possible to use an anisotropic conductive film containing a photocurable resin.

(10) Besides the above-described embodiments, the number and arrangement of drivers mounted on the liquid crystal panel can be changed as appropriate. Similarly, the number and arrangement of flexible substrates connected to the liquid crystal panel can be changed as appropriate.

(11) In each of the above-described embodiments, the wiping device for wiping the liquid crystal panel having the configuration in which the driver is directly mounted on the array substrate and the manufacturing method using the wiping device are illustrated. However, the driver is a film-like flexible substrate. The present invention can also be applied to a wiping apparatus for wiping a liquid crystal panel configured to mount an end of a flexible board mounted on the array board on the array board and a manufacturing method using the same. It is.

(12) In each of the above-described embodiments, the wiping device for wiping the liquid crystal panel provided in the transmissive liquid crystal display device including the backlight device that is an external light source and the manufacturing method using the same are exemplified. The present invention is also applicable to a wiping device for wiping a liquid crystal panel provided in a reflective liquid crystal display device that performs display using external light, and a manufacturing method using the same.

(15) In each of the embodiments described above, a TFT is used as a semiconductor device of a liquid crystal panel. However, a wiping device that wipes a liquid crystal panel using a semiconductor device other than a TFT (for example, a thin film diode (TFD)) and the same The present invention can also be applied to a manufacturing method using a liquid crystal, and besides a liquid crystal panel for color display, it can also be applied to a wiping apparatus for cleaning a liquid crystal panel for black and white display and a manufacturing method using the same. It is.

11, 111, 211, 511, 611, 711 ... liquid crystal panel (bonded substrate), 11a, 111a, 311a, 411a, 511a ... color filter substrate, 11aEP, 111aEP, 411aEP, 511aEP ...

end

11b, 111b, 211b, 611b, 711b ... array substrate, 11h ... color filter, 13 ... flexible substrate (mounting component), 17 ... TFT (semiconductor device), 21 ... driver ( Mounting parts), 22 ... External connection terminal portion (terminal portion), 23 ... Panel side input terminal portion (terminal portion), 24 ... Panel side output terminal portion (terminal portion), 40, 140, 240 , 340, 540, 640, 740 ... wiping device, 41, 241, 741 ... substrate holding part, 42, 242, 742 ... wiping part, 43, 743 ... movable part, 44, 144, 244, 344 44, 544, 644, 744 ... wiping material, 45, 145, 345, 445, 545, 645, 745 ... wiping material pressing part, 46, 346 ... wiping material feeding part, 47, 347 ... wiping material winding part, 54 ... inclined part (part facing the edge part of the color filter substrate), 55 ... terminal forming part supporting part, 56, 456 ... wiping material Positioning part, 56a, 456a, 456aA, 456aB ... shaft part, 56b, 456b, 456bA, 456bB ... flange part, 57 ... opening part, 58 ... pressure reducing part, 59 ... pressure detecting part 456A ... first wiper positioning part, 456B ... second wiper positioning part, BU ... burr, GSm ... substrate main part, GSt ... terminal forming part

Claims

The terminal unit with respect to the array substrate including a terminal unit that receives a signal input from the outside and a semiconductor device that is driven based on a signal input from the terminal unit. In a bonded substrate formed by bonding in an exposed form, a wiping unit that wipes the exposed terminal portion;
By moving at least one of the bonded substrate and the wiping portion, the extension direction of the end portion on the terminal portion side of the outer peripheral end portion of the color filter substrate with respect to the array substrate A bonded substrate wiping device comprising: a movable portion that relatively displaces the wiping portion.
The wiping portion extends in a form parallel to the extending direction of the end portion of the color filter substrate, and a portion of the wiping portion is in contact with the terminal portion exposed in the bonded substrate; and The bonded substrate according to claim 1, further comprising at least a wiping material pressing portion that sandwiches the wiping material between the bonded substrate and the array substrate and presses the wiping material toward the array substrate. Wiping device.
The wiping material pressing portion is configured such that at least a portion facing the end portion of the color filter substrate moves away from the terminal portion in the overlapping direction of the array substrate and the color filter substrate. The wiping device for a bonded substrate according to claim 2, wherein the wiping device is formed in an inclined shape so as to move away from the color filter substrate in a direction from a portion toward the terminal portion.
The wiping material pressing portion causes the wiping material to make point contact with respect to the extending direction of the end portion of the color filter substrate with respect to the array substrate of the bonded substrate, and the color filter substrate. The wiping apparatus for a bonded substrate according to claim 2 or 3, wherein the wiping device is formed so as to be in line contact in a direction from an end portion toward the terminal portion.
At least a pair of the wiping material pressing portion is sandwiched in the extending direction of the end portion of the color filter substrate, and the direction from the end portion of the color filter substrate toward the terminal portion is described above. The wiping apparatus for bonded substrates according to any one of claims 2 to 4, further comprising a wiping material positioning portion for positioning the wiping material.
A wiping material delivery part for feeding out the wiping material, and a wiping material take-up part for winding up the wiping material,
At least a pair of the wiping material positioning portions are rotatably supported and formed so as to protrude from the shaft portion contacting the surface of the wiping material and both end sides of the shaft portion. A pair of flange portions capable of contacting the edge of the material,
The wiping material positioning part arranged on the wiping material feeding part side with respect to the wiping material pressing part is from the terminal part side in the direction from the terminal part toward the end part of the color filter substrate. The bonded substrate wiping apparatus according to claim 5, wherein the shaft portion is formed so as to become thicker as it approaches the end side.
The wiping material positioning part arranged on the wiping material take-up part side with respect to the wiping material pressing part is from the terminal part side in the direction from the terminal part toward the end part of the color filter substrate. The bonded substrate wiping apparatus according to claim 6, wherein the shaft portion is formed so as to become thicker as the end portion is approached.
The wiping material pressing part is provided with an opening that opens toward the wiping material side and is covered by the wiping material,
The wiping device for a bonded substrate according to any one of claims 2 to 7, further comprising: a decompression unit that decompresses the opening, and a pressure detection unit that detects an air pressure in the opening.
A pair of the wiping material pressing portions are disposed at positions where the opening portions are offset from one end side and the other end side in a direction from the end portion of the color filter substrate toward the terminal portion. Item 9. A bonded substrate wiping device according to Item 8.
A substrate holding part that is disposed on the opposite side of the wiping part with respect to the bonded substrate and holds a main part of the substrate that is a part of the array substrate to which the color filter substrate is bonded. The wiping apparatus for a bonded substrate board according to any one of claims 1 to 9.
The terminal formation which is a part except the said board | substrate main part among the said array substrates, and is the part in which the said terminal part was formed while being arrange | positioned on the opposite side to the said wiping part with respect to the said bonded substrate The wiping apparatus for a bonded substrate board according to claim 10, further comprising a terminal forming portion supporting portion that supports the portion.
The terminals of the color filter substrate provided with the color filter with respect to the array substrate provided with a terminal portion that receives a signal input from a mounting component and a semiconductor device that is driven based on a signal input from the terminal portion. In the bonded substrate formed by bonding the exposed portions, the exposed terminal portion is wiped by the wiping portion, and at least one of the bonded substrate and the wiping portion is moved by the movable portion. A wiping step in which the wiping portion is relatively displaced with respect to the array substrate with respect to the extending direction of the end portion on the terminal portion side of the outer peripheral end portion of the color filter substrate,
A mounting step of mounting the mounting component on the array substrate in the bonded substrate and connecting the terminal portion to the mounting component.