WO2015121994A1

WO2015121994A1 - Electronic-apparatus cooling device and case for cooling

Info

Publication number: WO2015121994A1
Application number: PCT/JP2014/053563
Authority: WO
Inventors: 陽子國眼; 繁裕椿; 佐々木　重幸
Original assignee: 株式会社日立製作所
Priority date: 2014-02-14
Filing date: 2014-02-14
Publication date: 2015-08-20

Abstract

An electronic-apparatus cooling device (R), having a compressor (9), a condenser (10), a decompression means (11), and an evaporator (12) that constitute a refrigeration cycle for cooling an electronic apparatus (8) and are connected by pipes (h) having refrigerant flowing therethrough, comprises: a heat dissipation chamber (7) arranged in an upper section and having the condenser (10) provided therein; a housing chamber (5) arranged in a middle section and having provided therein the electronic apparatus (8), the evaporator (12) for cooling the electronic apparatus (8), and a blower means (14) that blows air that cools the electronic apparatus (8) on to the heat evaporator (12); and a machinery chamber (6) arranged in a lower section and having the compressor (9) and the decompression means (11) provided therein. The heat dissipation chamber (7), the housing chamber (5), and the machinery chamber (6) are arranged across three levels in the vertical direction, in order from top to bottom.

Description

Electronic device cooling device and cooling housing

The present invention relates to an electronic device cooling device and a cooling housing.

Conventionally, a server is placed in a dedicated room and is operated while being cooled by an air conditioner installed in the room.
This is because an apparatus equipped with an electronic device such as an integrated circuit needs to be cooled because operation may become unstable and malfunction may occur when the temperature of the electronic device rises due to heat generation. Here, when the air in the apparatus is cooled below the dew point temperature by cooling, drain water is generated, and the water adheres to the electronic device, which may damage the electronic device.

There is a cooling device described in Patent Document 1 as a conventional technique for preventing condensation in an apparatus equipped with such an electronic device.

In Patent Document 1, “a storage chamber for storing a heating element and a cooling unit in which a refrigerant circuit is configured by a compressor, a condenser, an expansion valve, an evaporator, and the like are provided. A cooling device that cools the heating element by circulating to the storage chamber, and includes a control device that controls the valve opening of the expansion valve and controls the operation of the compressor based on the air temperature in the storage chamber. The control device performs an evaporation temperature control operation for controlling the valve opening degree of the expansion valve based on the evaporation temperature of the refrigerant in the evaporator so that the evaporation temperature becomes a predetermined condensation avoidance temperature capable of avoiding condensation on the heating element. When the degree of superheat of the refrigerant in the evaporator falls below a predetermined liquid return risk value, expansion is performed based on the degree of refrigerant superheat in the evaporator so that the degree of superheat becomes a predetermined liquid return avoidance value. The valve opening of the valve Cooling system ", wherein a switch to Gosuru superheat control operation is disclosed (see the claims).

Patent Document 1 describes that “the refrigerant is stored in the evaporator 16 from the cooling chamber 15 in which the evaporator 16 is disposed by maintaining the evaporation temperature of the refrigerant at a temperature higher than a predetermined dew condensation avoiding temperature. It is possible to cool the server 2 while effectively avoiding the inconvenience that dew condensation occurs in the server 2 or the like as a heating element in the storage chamber 4 due to a marked decrease in the temperature of the cool air discharged into the chamber 4. Is possible "(paragraph 0048).
Moreover, in patent document 1, the refrigerating cycle which supplies cold air to the storage chamber in which a server is mounted is arrange | positioned at the lower part of the housing | casing of a cooling device.

On the other hand, a refrigeration cycle and a machine room are provided in the upper part of the storage room in which the server is placed, and a cooling device with improved maintainability that can replace the refrigeration cycle and the machine room as a package is disclosed.

Japanese Patent No. 4660427 (Claim 1, paragraph 0048, etc.)

By the way, the heat generation amount of the electronic device cooling device varies depending on the operating conditions such as calculation processing. Since the amount of fluctuation increases as more electronic devices are mounted, it is important for a user who wants to store more servers in the electronic device cooling device to cool the fluctuating heating element to a uniform temperature without unevenness. .

Therefore, when trying to cool the entire storage chamber with a cooler arranged at the lower part of the apparatus as in Patent Document 1, in order to bring the upper air to a desired temperature, the lower air is further cooler than the upper part. There is a need to. Therefore, temperature distribution may occur in the storage room.

In addition, in Patent Document 1, the expansion valve is controlled so that the evaporator inlet temperature becomes the dew condensation avoidance temperature. However, a specific method for determining the dew condensation avoidance temperature of the air in the storage having different dew points depending on the humidity is as follows. No disclosure is made, and furthermore, the temperature at which condensation is avoided cannot be determined when temperature distribution occurs in the storage chamber.

In addition, the air in the storage room before the start of cooling may have a large amount of moisture when the surroundings of the apparatus are installed in a high temperature / high humidity environment. In this case, condensation may occur in the heat exchanger due to cooling, and moisture due to condensation may be scattered to the electronic device, causing a problem.
On the other hand, the cooling device provided with the refrigeration cycle and the machine room in the upper part of the storage room is separated from the evaporator (cooler) and the server placed below the refrigeration cycle and the machine room, so that the server is at an appropriate temperature, for example, In order to cool to 25 ° C., it is necessary to send cooling air at a lower temperature, for example, 15 ° C. Therefore, thermal efficiency is bad.
Further, in this configuration, since the refrigeration cycle and the machine room are packaged, there is a problem that it is difficult to take an air passage and a heat transfer section for cooling the air.
In addition, since the refrigeration cycle and the machine room are arranged at the upper part, the center of gravity of the cooling device is located on the upper side, and the structure is unstable in terms of stability when the device is installed.

The present invention has been made to solve the above-mentioned conventional technical problems, and an object thereof is to provide an electronic device cooling device and a cooling housing having high cooling performance, maintainability, and high installation stability.

The electronic device cooling apparatus according to claim 1 is configured such that a compressor, a condenser, a decompression unit, and an evaporator constituting a refrigeration cycle for cooling an electronic device are connected by a pipe through which a refrigerant flows, arranged in an upper stage, and condensed. A heat dissipating chamber in which a vacuum vessel is provided, a storage provided in a middle stage, provided with the electronic device, the evaporator for cooling the electronic device, and a blowing means for sending air for cooling the electronic device to the evaporator A chamber and a machine room disposed in the lower stage and provided with the compressor and the pressure reducing means, wherein the heat radiating chamber, the storage chamber, and the machine room are sequentially directed from the upper part to the lower part in the vertical direction. Are arranged in three stages.

The electronic device cooling device according to claim 9 is arranged in the upper stage, the heat radiating chamber provided with the heat radiating part, the storage room provided in the middle stage, provided with the cooling target and the cooling part for cooling the cooling target, and arranged in the lower stage. And a machine room in which machinery is provided.

The cooling housing according to claim 13 is disposed in an upper stage and a heat radiation chamber in a space in which a heat radiation part is provided, and a space storage room in a middle stage in which a cooling target and a cooling part for cooling the cooling target are provided. , And a machine room in a space where machinery is provided.

According to the present invention, it is possible to realize an electronic device cooling device and a cooling housing that have high cooling performance, maintainability, and high installation stability.

The perspective view which shows the structure of the electronic device cooling device of Embodiment 1 of this invention. Sectional drawing which looked at the electronic device cooling device at the time of the cooling operation which closed the front side door and the back side door of FIG. The perspective view which looked at the state which opened the rear side door of the electronic device cooling device from diagonally upward. The perspective view which shows the structure of the electronic device cooling device of the modification 1 of Embodiment 1 of this invention. Sectional drawing seen from the left side toward the front at the time of the cooling operation which closed the front side door and the back side door of the electronic device cooling device of the modification 1. FIG. Sectional drawing which looked at the electronic device cooling device at the time of the cooling operation of the modification 2 from the front. Sectional drawing which looked at the state at the time of the cooling operation which closed the front side door and the back side door of the electronic device cooling device of Embodiment 2 of this invention toward the front from the left side. The perspective view which shows the structure of the electronic device cooling device of Embodiment 3 of this invention. Sectional drawing which looked at the state at the time of the cooling operation which closed the front side door and the back side door of the electronic device cooling device of Embodiment 3 from upper direction.

Hereinafter, the electronic device cooling apparatus according to the embodiment of the present invention will be described in detail. In the following description, an example in which a server is housed and cooled as an electronic device will be described. However, an electronic device other than the server may be used as long as the electronic device generates heat by operation.

<< Embodiment 1 >>
FIG. 1 is a perspective view showing the configuration of the electronic device cooling apparatus according to the first embodiment of the present invention, in which the front door and the rear door are open. FIG. 2 is a cross-sectional view of the electronic device cooling apparatus during the cooling operation in which the front door and the rear door of FIG. 1 are closed as viewed from the left side from the front. The arrow a1 in FIG. 2 indicates the flow of air circulating in the storage chamber 5, and the arrow a2 indicates the flow of air passing through the heat dissipation chamber 7.

The electronic device cooling apparatus R of Embodiment 1 is an apparatus for cooling the server 8 that generates heat during operation to a desired temperature.
Therefore, the electronic device cooling apparatus R includes the following refrigeration cycle for cooling the server 8.

The refrigeration cycle includes a compressor 9 that compresses the refrigerant flowing through the pipe h to a high temperature and a high pressure, and a condenser that condenses the refrigerant discharged from the compressor 9 and exchanges heat with indoor air to release heat of condensation. 10, an expansion valve 11 serving as a decompression unit that decompresses the refrigerant from the condenser 10, and an evaporator 12 that absorbs heat from the server 8 and cools the cooling air (air) that has become high temperature by evaporating the refrigerant. Yes.

<Divided structure of electronic device cooling device R>
The electronic device cooling apparatus R includes a storage chamber 5 that is disposed in the middle stage and houses the server 8, the evaporator 12, and the like, a heat radiating chamber 7 that is disposed in the upper stage and houses the condenser 10, and a compressor 9 that is disposed in the lower stage and expands. It is divided into a machine room 6 in which the valve 11 and the like are housed, and is configured in three parts in the vertical direction.
The storage chamber 5 is sealed from another chamber so that heat does not enter and exit in order to cool the server 8 to a desired temperature.

On the back side of the electronic device cooling device R, the compressor 9 in the machine room 6, the condenser 10 in the heat radiation chamber 7, the expansion valve 11 in the machine room 6, and the evaporator 12 in the storage room 5 are sequentially connected by a refrigerant pipe h. The refrigeration cycle is formed.

The flow of the refrigerant will be described.
The refrigerant that has been pressurized by the compressor 9 to become a high-temperature and high-pressure gas is sent to the condenser 10. The refrigerant sent to the condenser 10 dissipates heat to the outside air in the process of passing through the condenser 10, and changes in phase from a gas to a two-phase state and to a liquid. Thereafter, the refrigerant passes through the expansion valve 11 and is depressurized to be in a low-pressure two-phase state. The refrigerant that has become a low-pressure two-phase state then absorbs heat from the air in the storage chamber 5 in the process of passing through the evaporator 12, and again changes from the two-phase state to a gas and is returned to the compressor 9. .

<Case k>
A casing k that forms the outer shell of the electronic device cooling device R includes a box-shaped cabinet 1, a front door 2, a rear door 3, and the like.
As described above, the casing k of the electronic device cooling device R is divided into the heat radiation chamber 7, the storage chamber 5, and the machine chamber 6.

<Heat radiation chamber 7>
A condenser 10 and a condenser fan 13 are arranged in the upper heat radiation chamber 7. Specifically, a condenser fan 13 is provided in the vicinity of the ceiling surface that forms the uppermost surface of the heat radiation chamber 7 of the cabinet 1. The condenser fan 13 allows outside air (indoor air) to flow from

openings

16 a and 16 b provided at the top of the front door 2 and the back door 3, and heat is exchanged between the outside air and the condenser 10. The release of 10 heat to the outside air is promoted.

<Machine room 6>
A compressor 9 and an expansion valve 11 are arranged in the lower machine chamber 6.
The compressor 9 is a variable capacity compressor capable of capacity control. As such a compressor, a piston type, a rotary type, a scroll type, a screw type, or a centrifugal type can be adopted. Specifically, the compressor 9 is a scroll type compressor, capacity control is possible by inverter control, and the rotational speed is variable from low speed to high speed.
The expansion valve 11 may be a small-diameter tube, and other than the expansion valve 11 may be used as long as the pressure reducing means.

<Storage room 5>
In the middle storage chamber 5, upper and

lower ducts

4 a and 4 b are provided at the ceiling (top) and the bottom, respectively, to form an air passage for cooling the server 8.
A server 8 is mounted as an electronic device in a space between the upper duct 4a and the lower duct 4b. Although FIG. 2 shows a case where a plurality of servers 8 are stacked and arranged, a single server 8 may be arranged in a part of the storage room 5. Each server 8 is provided with a blower 15, and the heat generating components inside the server 8 are cooled by circulating the air that is cooled by the evaporator 12 and circulated in the storage chamber 5.

In a space facing the storage chamber 5 of the rear rear door 3, an evaporator 12 that cools air (cooling air) heated by the heat of the server 8, and the heated air passes through the evaporator 12. A door fan 14 for suction is incorporated. The evaporator 12 circulates in the storage chamber 5 and cools the air heated by the server 8 by heat exchange.

During the cooling operation in which the front door 2 and the rear door 3 are closed in the middle storage chamber 5, the upper and

lower ducts

4 a and 4 b are provided in the flow path 2 r passing through the front door 2 and the rear door 3. And a flow path 3r passing through the back side door 3 is connected to form an air path.
Here, a baffle plate that expands the area of air contact with at least some of the air passages of the upper and

lower ducts

4a and 4b, the flow path 2r of the front door 2, and the flow path 3r of the rear door 3. It is preferable to provide a member that promotes condensation. Alternatively, it is more preferable to configure a part of the air passages to be cooled with water or the like because condensation on the air passages is promoted and moisture adhesion to the server 8 is further suppressed.

On the other hand,

openings

16a and 16b (see FIG. 1) are provided at locations facing the heat radiation chamber 7 and the machine room 6 of the front side door 2 and the back side door 3, respectively. Through the

openings

16a and 16b, the air that has absorbed the heat of the condenser 10 in the heat radiating chamber 7 and the air that has absorbed the heat of the compressor 9 in the machine chamber 6 can be circulated with ambient air (indoor air). ing.

<Sensor>
As shown in FIG. 2, the electronic device cooling device R detects an outside air temperature sensor 202 that detects the temperature of the outside air as a sensor that detects the air temperature, and detects an inlet temperature of the air that cools the server 8 to the server 8. The storage room temperature sensor 201 is provided. As sensors for detecting the refrigerant temperature of the refrigeration cycle, a sensor 203 for detecting the evaporator (12) inlet temperature and a sensor 204 for detecting the compressor suction temperature are provided.

And the electronic device cooling device R adjusts the rotational speed (number of rotations) of the compressor 9, the condenser fan 13, and the door fan 14 and the opening degree of the expansion valve 11 based on the temperatures detected by the above-described sensors. A control device (not shown) is provided.
The control device is composed of a microcomputer, a peripheral circuit, and the like, and temperature data detected by each of the temperature sensors described above is input to the control device, and control is performed. Note that at least a part of the microcomputer of the control device may be configured by a circuit as long as predetermined control is performed.

FIG. 3 is a perspective view of the state where the rear door of the electronic device cooling apparatus is opened as viewed obliquely from above.
The pipe h1a that is part of the pipe h1 that connects the evaporator 12 and the expansion valve 11 and the pipe h2a that is part of the pipe h2 that connects the evaporator 12 and the compressor 9 are shown in FIG. Since opening and closing is performed, a flexible tube is used. Thus, even when the rear door 3 is opened, the electronic device cooling device R can be continuously operated, and there is no inconvenience that the operation of the device (R) is stopped at every maintenance.

Since the pipes h1a and h2a which are flexible pipes need to withstand the oil, pressure, temperature and the like of the refrigerant, flexible pipes having oil resistance, pressure resistance and temperature resistance are used. For example, a flexible tube having a bellows structure made of stainless steel (SUS) is used, but other flexible tubes may be used as long as they have oil resistance, pressure resistance, and temperature resistance.

The bottom plate of the evaporator 12 is provided with a drain pan (not shown) that receives condensed water that is condensed by water contained in the air that has cooled the server 8 in the evaporator 12. The dew condensation water received by the drain pan is guided to a water storage tank (not shown) disposed in the machine room 6.

<Side doors ka, kb>
As shown in FIG. 3, the side door ka on one side has a two-part configuration of a first side door ka1 that opens and closes the machine room 6 and a second side door ka2 that opens and closes the heat radiating chamber 7 and the storage chamber 5. Has been.

The first side door ka <b> 1 is opened and closed during maintenance of machinery such as the compressor 9 and the expansion valve 11 in the machine room 6.
The second side door ka2 is opened and closed when the server 8 is installed when the electronic apparatus cooling device R is installed, or when the server 8 is rearranged later.

When the side door ka is divided into a first side door ka1 that opens and closes the machine room 6 and a second side door ka2 that opens and closes the heat radiating chamber 7 and the storage room 5, maintenance of the equipment in the machine room 6 is performed. For example, only the first side door ka1 needs to be opened, and the second side door ka2 can be kept closed, so that the storage chamber 5 does not have to be opened. Thereby, the temperature change in the storage chamber 5 is suppressed, and the stable cooling performance of the electronic device cooling device R is obtained.

In some cases, the side door ka opens, opens and closes the first side door (first door) that opens and closes the machine room 6, the second side door (second door) that opens and closes the storage room 5, and the heat dissipation chamber 7. It is good also as a 3 division structure with the 3rd side door (3rd door) to do.
If the side door ka has a three-part structure, it is not necessary to keep the second side door closed and open the storage chamber 5 for maintenance of the heat radiating chamber 7 in addition to the machine room 6. Opportunities to open can be reduced.
The side door kb on the other side can also be configured in the same manner as the side door ka on the one side described above.

Note that either one of the side door ka on one side or the side door kb on the other side may have an opening / closing structure, and the other may not have an opening / closing structure. Further, depending on the frequency of access from the side of the electronic device cooling device R, one of the side door ka on one side or the side door kb on the other side may be divided into two parts and the other may be divided into three parts. In this way, the above-described configuration can be arbitrarily selected as the open / close structure of the one side door ka or the other side door kb forming the side plate.

<Circulating air for cooling the server 8>
Next, the flow of air circulating to cool the server 8 in the storage chamber 5 of the electronic device cooling device R will be described.
As shown by an arrow a <b> 1 in FIG. 2, the air around the server 8 is taken into the server by a blower 15 built in the server 8 and becomes high temperature due to exhaust heat from the server 8. The air after passing through the server 8 is sucked by the door fan 14 built in the rear door 3 and passes through the evaporator 12 in front of the door fan 14 to be cooled, and passes through the upper duct 4a and the lower duct 4b. Then, it is sent to the flow path 2r of the front side door 2.

That is, the air cooled by the evaporator 12 flows through the upper and

lower ducts

4 a and 4 b through the flow path 2 r of the front door 2 and is warmed by cooling the server 8. The warmed air is cooled by the evaporator 12, moves to the flow path 2 r of the front door 2 through the upper and

lower ducts

4 a and 4 b, and returns to the windward side of the server 8 again.

As described above, the air cooled by the evaporator 12 passes through the upper and

lower ducts

4a and 4b, the flow path 2r of the front side door 2, and the server 8, and returns to the evaporator 12, whereby the server 8 The temperature is controlled to be a desired temperature (cooled).

According to the said structure, the electronic device cooling device R is divided | segmented into the three-layer structure of the thermal radiation chamber 7, the storage chamber 5, and the machine room 6 from the top to the bottom.
By providing the evaporator 12 on the back side door 3 of the storage chamber 5, the air heated by the server 8 can be sufficiently cooled with a wide heat transfer area. Therefore, the air that cools the server 8 can be sufficiently cooled, and the distribution of the inlet temperature of the server 8 can be improved.

In addition, the air after passing through the server 8 is cooled by the evaporator 12 disposed in the rear side door 3 immediately downstream of the server 8, and the cooled air is sent to the upper and

lower ducts

4 a and 4 b and the front side door 2. Since the flow path 2r is passed, the flow path of the air after cooling in the evaporator 12 is long. Therefore, dew condensation can be performed in a long channel, and the jump of drain water to the server 8 can be suppressed. Therefore, it is possible to suppress the failure of the server 8 due to condensed water as much as possible.

Moreover, it can suppress that a heat | fever spreads around the electronic device cooling device R by arrange | positioning the thermal radiation chamber 7 in the upper stage. Therefore, it is possible to avoid discomfort caused by heat to the user around the electronic device cooling apparatus R.
Further, by placing the compressor 9 or the like, which is an operating part of the refrigeration cycle, in the machine room 6 and arranging it in the lower stage, it is only necessary to access the machine room 6 at the time of maintenance, so that maintainability can be improved.

Also, by placing the machine room 6 containing the heavy load such as the compressor 9 in the lower stage, the center of gravity of the electronic device cooling device R can be lowered, the stability at the time of installation is improved, and the electronic device cooling device R falls down. Can be suppressed.
Furthermore, since the side doors ka and kb are divided into the storage room 5 and the machine room 6, during the maintenance of the equipment in the machine room 6, the outside air does not enter the inside of the storage room 5 where the server 8 is installed and cooling continues. it can. Therefore, the maintainability can be improved and the cooling performance in the storage chamber 5 in which the server 8 is present is not deteriorated.

From the above, it is possible to realize the electronic device cooling device R and the cooling housing (k) with high cooling performance, maintainability, and high installation stability.

<Modification 1>
FIG. 4 is a perspective view showing the configuration of the electronic device cooling apparatus of Modification 1 of Embodiment 1 of the present invention, and shows a state in which the front side door and the rear side door are opened. FIG. 5 is a cross-sectional view seen from the left side when viewed from the front during a cooling operation in which the front door and the rear door of the electronic device cooling device of Modification 1 are closed.

Unlike the electronic device cooling device R of the first embodiment, the electronic device cooling device R1 of Modification 1 is configured such that the evaporator 12 in the storage chamber 5 is disposed on the front door 2.
Since the configuration other than this is the same as that of the electronic device cooling apparatus R of the first embodiment, detailed description thereof is omitted.
Each configuration described in the first embodiment can be similarly applied to the electronic device cooling apparatus R1 of the first modification.

According to the first modification example, as shown in FIG. 5, the evaporator 12 for cooling the air that absorbs the heat of the server 8 is arranged immediately before the server 8. 12 can be directly controlled, and the server 8 can be effectively cooled.

<Modification 2>
FIG. 6 is a cross-sectional view of the electronic device cooling apparatus during the cooling operation of Modification 2 as viewed from the front.
Unlike the electronic device cooling device R of the first embodiment, the electronic device cooling device R2 of Modification 2 arranges the evaporator 12 of the storage chamber 5 at a location ka2 facing the storage chamber 5 of the side plate ka on one side. It is a configuration. Other configurations of the modified example 2 are the same as those of the first embodiment.

In the electronic device cooling apparatus R2 of Modification 2, the upper duct 4c in the storage chamber 5 and the lower duct 4d in the storage chamber 5 are arranged in a direction toward the side of the electronic apparatus cooling device R2.
A flow path r11 in which the evaporator 12 and the door fan 14 are installed is formed at a location ka2 facing the storage chamber 5 of the side plate ka on one side. The flow path r11 communicates with the upper and

lower ducts

4c and 4d in the storage chamber 5.

Further, a flow path r12 is formed at a location kb2 facing the storage chamber 5 of the other side plate kb. The flow path r12 communicates with the upper and

lower ducts

4c and 4d in the storage chamber 5.
With this configuration, the pipe h following the evaporator 12 can be a straight pipe without using a flexible pipe.

A flow path r11 is formed at a location ka2 facing the storage chamber 5 of the side plate ka on one side, and an evaporator 12 and a door fan 14 are installed at a location kb2 facing the storage chamber 5 of the side plate kb on the other side. It may be configured such that a flow path r12 in which is installed is formed. In this case as well, a straight pipe can be used for the pipe h part following the evaporator 12 without using a flexible pipe.

Alternatively, a portion of the one side plate ka facing the machine room 6 is a first side door ka1 and a portion facing the storage chamber 5 is a second side door ka2. In addition, a portion of the other side plate kb facing the machine chamber 6 is a first side door kb1, and a portion facing the storage chamber 5 is a second side door kb2.

The evaporator 12 and the door fan 14 are installed in the second side door ka2 on one side, and a flow path r11 is formed. Moreover, it is good also as a structure by which the flow path r12 is formed in the 2nd side door kb2 of the other side.

In this case, as in the first embodiment, a flexible pipe is used for a part of the pipe h connected to the evaporator 12 of the second side door ka2.
The evaporator 12 and the door fan 14 may be installed in the second side door kb2 on the other side instead of the second side door ka2 on the one side.

<< Embodiment 2 >>
FIG. 7: is sectional drawing which looked at the state at the time of the cooling operation which closed the front side door and the back side door of the electronic device cooling device of Embodiment 2 of this invention from the left side toward the front. The arrow a1 in FIG. 7 indicates the flow of air circulating in the storage chamber 5, and the white arrow indicates the flow of air passing through the heat dissipation chamber 7.

Unlike the first embodiment, the electronic device cooling apparatus 2R according to the second embodiment has two refrigeration cycles, a first refrigeration cycle and a second refrigeration cycle, the first refrigeration cycle is disposed on the front side, and the second refrigeration cycle is disposed on the rear side. A refrigeration cycle is arranged. Other configurations are the same as those of the electronic device cooling apparatus R of the first embodiment.

Similarly to the electronic device cooling apparatus R of the first embodiment, the electronic device cooling apparatus 2R of the second embodiment includes a storage chamber 5 in which the server 8, the first and

second evaporators

12a and 12b, etc. are stored and arranged in the middle stage. The first and

second compressors

9a and 9b, the first and

second expansion valves

11a and 11b, and the like. Is divided into a machine room 6 which is stored and arranged in the lower stage, and is divided into three in the vertical direction.

In the electronic device cooling device 2 </ b> R, the first door fan 14 a and the first evaporator 12 a are installed in the flow path 2 r of the front door 2 of the storage chamber 5, and the flow path 3 r of the rear door 3 of the storage chamber 5. In addition, a second evaporator 12b and a second door fan 14b are installed.

In the upper radiating chamber 7, a first condenser 10a and a first condenser fan 13a are arranged on the front side, and a second condenser 10b and a second condenser fan are arranged on the rear side. 13a is arranged.

In the lower machine room 6, a first compressor 9a and a first expansion valve 11a are disposed on the front side, and a second compressor 9b and a second expansion valve 11b are disposed on the back side. Is arranged.

As described above, as the first refrigeration cycle, on the front side of the electronic device cooling device 2R, the first compressor 9a in the machine chamber 6, the first condenser 10a in the heat radiating chamber 7, and the first expansion of the machine chamber 6 are performed. The valve 11a and the first evaporator 12a of the storage chamber 5 are sequentially connected by a refrigerant pipe ha.

As the second refrigeration cycle, on the back side of the electronic device cooling device 2R, the second compressor 9b in the machine chamber 6, the second condenser 10b in the heat radiating chamber 7, the second expansion valve 11b in the machine chamber 6, and storage The second evaporator 12b of the chamber 5 is sequentially connected by the refrigerant pipe hb.

<Sensor>
The electronic device cooling device 2R includes an outside air temperature sensor 202 that detects the temperature of the outside air as a sensor that detects the air temperature, and a storage room temperature sensor that detects the intake air temperature of the air for cooling the server 8 into the server 8. 201.

Further, as a sensor for detecting the refrigerant temperature of the first refrigeration cycle, a first sensor 203a for detecting the inlet temperature of the first evaporator (12a), a first compressor (9a) for detecting the suction temperature. Each of the sensors 204a is provided.

As sensors for detecting the refrigerant temperature of the second refrigeration cycle, the second sensor 203b for detecting the inlet temperature of the second evaporator (12b), the second sensor for detecting the suction temperature of the second compressor (9b), and the second sensor. 204b are provided.

The electronic device cooling device 2R is based on the temperatures detected by the sensors described above, and the first and

second compressors

9a and 9b, the first and

second condenser fans

13a and 13b, and the first and second compressors. A control device (not shown) is provided for adjusting the rotational speed (number of rotations) of the

door fans

14a and 14b and the opening degrees of the first and

second expansion valves

11a and 11b.

<Circulating air for cooling the server 8>
In the electronic device cooling apparatus 2R, the air sucked from the upper duct 4a and the lower duct 4b by the first door fan 14a is cooled by the first evaporator 12a, sent to the server 8, and the server 8 Cooling. The air after cooling the server 8 is sucked into the second door fan 14b, cooled by the second evaporator 12b, and sent to the upper duct 4a and the lower duct 4b.

The air in the upper duct 4 a and the air in the lower duct 4 b are sucked by the first door fan 14 a, cooled by the first evaporator 12 a, and sent to the server 8.
Thus, the air that cools the server 8 includes the first door fan 14a, the first evaporator 12a, the server 8, the second evaporator 12b, the second door fan 14b, the upper and

lower ducts

4a, 4b, The server 8 is cooled by circulating to the first door fan 14a.

According to the electronic device cooling device 2R described above, the refrigeration cycle for cooling the server 8 has two systems, ie, the first refrigeration cycle and the second refrigeration cycle, so that redundancy in the event of a failure of any refrigeration cycle is achieved. Can be secured. For example, when the first refrigeration cycle fails, the server 8 can be cooled by operating the second refrigeration cycle, and when the second refrigeration cycle fails, the server 8 can be cooled by operating the first refrigeration cycle.

Moreover, energy-saving property can be improved by cooling in two steps, a 1st freezing cycle and a 2nd freezing cycle. For example, when the inlet temperature of the server 8 is 25 ° C., the second evaporator 12b on the back side cools the air circulating in the storage chamber 5 from, for example, 35 ° C. to 30 ° C. What is necessary is just to cool the air which circulates in the storage chamber 5 from 30 degreeC to 25 degreeC with the evaporator 12a.
Alternatively, control can be performed so that the total power consumption of the first and

second compressors

9a and 9b is reduced.

The first refrigeration cycle and the second refrigeration cycle may be arranged on the left and right sides of the electronic device cooling device 2R instead of before and after the electronic device cooling device 2R.
In this case, if the side door is not opened, the pipes ha and hb connected to the first evaporator 12a and the second evaporator 12b arranged on the side door are not used as flexible pipes, but straight pipes are used. Can be used. Thereby, the reliability of the electronic device cooling device 2R can be improved by reducing the cost and improving the reliability of the straight pipes ha and hb.
In the second embodiment, the case where there are two refrigeration cycles is exemplified, but when the apparatus (R) is large, three or more refrigeration cycles may be provided.

<< Embodiment 3 >>
FIG. 8 is a perspective view showing the configuration of the electronic device cooling apparatus according to the third embodiment of the present invention, and shows a state where the front door is opened. FIG. 9 is a cross-sectional view of the state of the cooling operation in which the front door and the rear door of the electronic device cooling apparatus according to the third embodiment are closed as seen from above. 8 and 9 indicate the flow of air circulating in the storage chamber 5, and the solid arrow b2 in FIG. 8 indicates the flow of air passing through the heat dissipation chamber 7.

Unlike the electronic device cooling device R of the first embodiment, the electronic device cooling device 3R of the third embodiment horizontally moves the air that cools the server 8 in the storage chamber 5 (see the broken arrow b1 in FIGS. 8 and 9). It is configured to circulate. Other configurations of the electronic device cooling apparatus 3R of the third embodiment are the same as those of the electronic apparatus cooling device R of the first embodiment.

Similarly to the first embodiment, the electronic device cooling device 3R according to the third embodiment is disposed in the middle stage, the storage chamber 35 in which the server 8, the evaporator 32, and the like are stored, and the upper stage, in which the condenser 10 and the like are stored. The heat radiating chamber 7 is divided into a lower chamber and a machine chamber 6 in which a compressor 9, an expansion valve 11 and the like are accommodated, and is divided into three parts in the vertical direction.

The heat radiation chamber 7 and the machine room 6 of the electronic device cooling device 3R have the same configuration as the electronic device cooling device R of the first embodiment. In other words, the upper radiating chamber 7 is provided with a condenser 10 constituting a refrigeration cycle and a condenser fan 13 for sucking outside air and radiating the heat of the condenser 10.
A compressor 9 and an expansion valve 11 are arranged in the lower machine chamber 6.

As shown in FIG. 9, in the storage chamber 35 in which the server 8 is stored, an evaporator 32 and a door fan 34 are installed on the side plate kd1 so that air for cooling the server 8 circulates in the horizontal direction. ing.

Thus, the compressor 9 in the machine chamber 6, the condenser 10 in the heat radiating chamber 7, the expansion valve 11 in the machine chamber 6, and the evaporator 32 in the storage chamber 35 are sequentially connected by the refrigerant pipe h3 to form a refrigeration cycle.
In the electronic device cooling device 3R, since the air for cooling the server 8 circulates in the horizontal direction, upper and lower ducts provided above and below the server 8 in the storage chamber 5 of the electronic device cooling device R of the first embodiment. 4a and 4b (see FIGS. 1 and 2) need not be provided.

According to the electronic device cooling apparatus 3R of the third embodiment, the evaporator 32 is arranged on the side plate kd1, and therefore the evaporator 32 installed on the condenser 10 in the heat radiating chamber 7 and the side plate kd1 in the storage chamber 5. Further, the door fan 34, the compressor 9 and the expansion valve 11 in the machine room 6, and the refrigerant pipe h3 can be provided as one replaceable part P having a U-shape when viewed from the front or the rear.

Therefore, in the event of a failure, the U-shaped part P can be replaced with an alternative, improving the maintainability. In this way, by adopting a configuration in which the refrigeration cycle is replaced as the U-shaped part P, the operation of removing the refrigerant from the refrigerant pipe h3, evacuating, and refilling the refrigerant, which has been performed in the conventional maintenance work, is unnecessary. Thus, the maintenance work becomes extremely easy. Moreover, the operation stop by the maintenance of the electronic device cooling device 3R can be completed in a short time.

Further, since there is no evaporator on the front side door 2 and the back side door 3 and the evaporator 32 is disposed on the side plate kd1, the evaporator 32 can be connected by a straight refrigerant pipe h3, and the front and rear side doors 2, The flexible tube for opening and closing 3 becomes unnecessary.
Furthermore, since no duct is provided above and below the server 8, a large space can be provided for the server 8 in the vertical direction. Therefore, the server 8 can be expanded (stacked) in the vertical direction.

As in FIG. 7, the refrigeration cycle includes two refrigeration cycles, a first refrigeration cycle and a second refrigeration cycle, and the first evaporator 32 a and the second refrigeration cycle are indicated by two-dot chain lines in FIG. 9. The evaporator 32b may be installed in the storage chamber 5.

<< Other Embodiments >>
1. In the embodiment, the case where the server 8 is stored as the electronic device stored in the storage chamber 5 has been described as an example. However, in the storage chamber 5, only the CPU, only the storage, only the network device, or any of these It is good also as storing, combining these.
In other words, any device that is an electronic device can be stored in the storage chamber 5 as a cooling target.

2. In the embodiment, the front door 2 and the rear door 3 are not divided, but at least one of the front door 2 and the rear door 3 opens and closes the machine room 6. It is good also as a 2 division structure by the door and the door which opens and closes the storage chamber 5 and the thermal radiation chamber 7. FIG. Thereby, when maintaining the apparatus in the machine room 6, it is not necessary to open the storage room 5, and the cooling performance in the storage room 5 is not affected.

Alternatively, at least one of the front door 2 and the rear door 3 is divided into three parts: a door that opens and closes the machine room 6, a door that opens and closes the storage room 5, and a door that opens and closes the heat dissipation room 7. It is good also as a structure. Thereby, when the equipment in the machine room 6 or the equipment in the heat radiation chamber 7 is maintained, it is not necessary to open the storage room 5 and the cooling performance in the storage room 5 is not affected.

3. In the above-described embodiment and modifications, the electronic device cooling device R (R1, R2, 2R, 3R) has been described. However, a machine that houses a space for a heat radiation chamber in an upper stage, a space for a cooling storage room in a middle stage, and machinery in a lower stage. It is also possible to provide a cooling housing in which the space of the room is arranged.
For example, a cooling housing is arranged in a space where a heat radiating chamber is provided in the upper stage and provided with a heat radiating part, a space storage room provided in the middle stage and provided with a cooling target and a cooling part for cooling the cooling target, and a lower stage. And a machine room in a space where the machinery is provided.
Thereby, it is possible to provide a cooling housing that is excellent in thermal characteristics and maintainability.

As described above, the electronic apparatus cooling device R (R1, R2, 2R, 3R) having high cooling performance, maintainability, and high installation stability can be realized by the configuration described above.

Note that the present invention is not limited to the above-described embodiments and modifications, and includes various embodiments. For example, the above-described embodiments and modification examples are merely illustrative of the present invention, and are not necessarily limited to those having all the configurations described. For example, a part of the configuration described may be included.

Moreover, it is possible to replace a part of a certain embodiment or modification with the configuration of another embodiment or modification, and the configuration of another embodiment or modification may be replaced with the configuration of a certain embodiment or modification. It is also possible to add. Moreover, it is also possible to add, delete, and replace other configurations for a part of the configurations of each embodiment and modification.

2 Front door (front door)
3 Rear door (rear door)
4a Duct (first duct)
4b Duct (second duct)
5 Storage room 6 Machine room 7 Heat dissipation room 8 Server (electronic equipment, cooling target)
9 Compressor (machinery)
9b Second compressor 10 Condenser (heat radiation part)
10a 1st condenser 10b 2nd condenser 11 Expansion valve (pressure reduction means, machinery)
11a First expansion valve (first decompression means)
11b Second expansion valve (second decompression means)
12 Evaporator (cooling part)
12a 1st evaporator 12b 2nd evaporator 13 Fan for condenser (heat radiation part)
14 Fan (Blower, cooling unit)
14a First door fan (first blowing means)
14b Second door fan (second blowing means)
h Piping h1, h2 Piping (Piping connected to the evaporator)
h1a, h2a piping (flexible piping)
ha Refrigerant piping (first piping)
hb Refrigerant piping (second piping)
k Enclosure (Cooling enclosure)
ka Side door (side plate)
ka1 first side door (first door)
ka2 Second side door (second door)
R, R2, R3, 2R, 3R Electronic equipment cooling device

Claims

A compressor, a condenser, a decompression unit, and an evaporator constituting a refrigeration cycle for cooling an electronic device are connected by a pipe through which a refrigerant flows,
A heat dissipating chamber disposed in the upper stage and provided with a condenser;
A storage chamber provided in a middle stage, provided with the electronic device, the evaporator for cooling the electronic device, and air blowing means for sending air for cooling the electronic device to the evaporator;
A machine room that is disposed in a lower stage and provided with the compressor and the pressure reducing means;
The heat dissipation chamber, the storage chamber, and the machine room are arranged in three stages from the upper part to the lower part in the vertical direction in order, respectively.
The electronic device cooling device according to claim 1,
The side plate that forms the outer shell of the electronic device cooling device,
A first door that opens and closes the machine room; a second door that opens and closes the storage room and the heat dissipation chamber; a second door that opens and closes the storage room; and a third door that opens and closes the heat dissipation chamber. Electronic equipment cooling device.
The electronic device cooling device according to claim 1,
The evaporator is installed in either a rear door that opens and closes a rear portion of the electronic device cooling device or a front door that opens and closes a front portion of the electronic device cooling device. .
The electronic device cooling device according to claim 1,
The evaporator is installed in either the rear door that opens and closes the rear part of the electronic device cooling device or the front door that opens and closes the front part of the electronic device cooling device,
A part of piping connected to the evaporator is constituted by flexible piping.
The electronic device cooling device according to claim 1,
A first duct disposed above the electronic device in the storage room;
A second duct disposed below the electronic device in the storage room,
Air for cooling the electronic device flows through the first duct and the second duct and circulates in the storage chamber.
The electronic device cooling device according to claim 1,
The evaporator is fixed to a side portion in the storage chamber,
Air for cooling the electronic device circulates in the storage chamber in the horizontal direction,
The refrigeration cycle including the pipe can be integrally removed or installed integrally.
The electronic device cooling device according to claim 1,
The refrigeration cycle has a first refrigeration cycle and a second refrigeration cycle,
The first compressor, the first condenser, the first pressure reducing means, and the first evaporator constituting the first refrigeration cycle are connected by a first pipe through which a refrigerant flows,
A second compressor, a second condenser, a second decompression means, and a second evaporator constituting the second refrigeration cycle are connected by a second pipe through which the refrigerant flows;
The heat dissipation chamber is provided with the first condenser and the second condenser,
The storage chamber is configured to supply the first evaporator and the second evaporator for cooling the electronic device, and air for cooling the electronic device to the first evaporator and the second evaporator. A first air blowing means and a second air blowing means to be sent respectively,
The electronic device cooling apparatus, wherein the machine room is provided with the first compressor and the first pressure reducing means, and the second compressor and the second pressure reducing means.
In the electronic device cooling device according to claim 8,
The first evaporator and the second evaporator are fixed to side portions in the storage chamber,
Air for cooling the electronic device circulates in the storage chamber in the horizontal direction,
The first refrigeration cycle including the first pipe can be removed or installed integrally.
The electronic device cooling apparatus, wherein the second refrigeration cycle including the second pipe can be removed or installed integrally.
A heat dissipating chamber disposed in the upper stage and provided with a heat dissipating part;
A storage chamber that is disposed in the middle stage and is provided with a cooling target and a cooling unit that cools the cooling target;
An electronic device cooling apparatus comprising: a machine room disposed at a lower stage and provided with machinery.
In the electronic device cooling device according to claim 9,
The cooling unit is installed on a door of the storage room,
The pipe connected to the cooling unit is configured by a flexible pipe.
In the electronic device cooling device according to claim 9,
A first duct disposed at an upper portion in the storage chamber;
A second duct disposed at a lower portion in the storage chamber,
Air for cooling the electronic device flows through the first duct and the second duct and circulates in the storage chamber.
In the electronic device cooling device according to claim 9,
The cooling part is fixed to a side part in the storage chamber,
The air that cools the object to be cooled circulates in the storage chamber in the horizontal direction,
The heat dissipating part, the cooling part, and the machinery can be removed integrally or installed integrally.
A heat dissipating chamber disposed in the upper stage and having a space in which a heat dissipating part is provided;
A storage chamber having a space arranged in a middle stage and provided with a cooling target and a cooling unit for cooling the cooling target;
And a machine room having a space in which machinery is provided.