WO2015105337A1 - Nouveau dérivé trisilyl amine, procédé pour le préparer et couche mince contenant du silicium l'utilisant - Google Patents

Nouveau dérivé trisilyl amine, procédé pour le préparer et couche mince contenant du silicium l'utilisant Download PDF

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Publication number
WO2015105337A1
WO2015105337A1 PCT/KR2015/000168 KR2015000168W WO2015105337A1 WO 2015105337 A1 WO2015105337 A1 WO 2015105337A1 KR 2015000168 W KR2015000168 W KR 2015000168W WO 2015105337 A1 WO2015105337 A1 WO 2015105337A1
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WIPO (PCT)
Prior art keywords
thin film
chemical formula
amine derivative
silicon
trisilyl amine
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PCT/KR2015/000168
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English (en)
Inventor
Se Jin Jang
Sang-Do Lee
Jong Hyun Kim
Sung Gi Kim
Do Yeon Kim
Byeong-Il Yang
Jang Hyeon Seok
Sang Ick Lee
Myong Woon Kim
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Dnf Co.,Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority claimed from KR1020140193165A external-priority patent/KR101720017B1/ko
Application filed by Dnf Co.,Ltd. filed Critical Dnf Co.,Ltd.
Priority to JP2016545307A priority Critical patent/JP6253789B2/ja
Priority to CN201580009063.6A priority patent/CN106029680B/zh
Priority to US15/110,692 priority patent/US10202407B2/en
Publication of WO2015105337A1 publication Critical patent/WO2015105337A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/10—Compounds having one or more C—Si linkages containing nitrogen having a Si-N linkage
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/34—Nitrides
    • C23C16/345—Silicon nitride
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40—Oxides
    • C23C16/401—Oxides containing silicon
    • C23C16/402—Silicon dioxide
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45523—Pulsed gas flow or change of composition over time
    • C23C16/45525—Atomic layer deposition [ALD]
    • C23C16/45527—Atomic layer deposition [ALD] characterized by the ALD cycle, e.g. different flows or temperatures during half-reactions, unusual pulsing sequence, use of precursor mixtures or auxiliary reactants or activations
    • C23C16/45536—Use of plasma, radiation or electromagnetic fields
    • C23C16/45542—Plasma being used non-continuously during the ALD reactions

Definitions

  • the present invention relates to a novel trisilyl amine derivative, a method for preparing the same, and a silicon-containing thin film using the same, and more particularly, to a novel trisilyl amine derivative having thermal stability and high volatility and being present in a liquid state at room temperature and under a pressure where handling is possible, a method for preparing the same, and a silicon-containing thin film using the same.
  • a silicon-containing thin film is manufactured in various shapes, such as a silicon film, a silicon oxide film, a silicon nitride film, a silicon carbonitride film, a silicon oxynitride film, and the like, by various deposition processes in a semiconductor field, and is variously applied to many fields.
  • the silicon oxide film and the silicon nitride film may function as an insulating film, a diffusion prevention film, a hard mask, an etching stop layer, a seed layer, a spacer, trench isolation, intermetallic dielectric material and a protective layer in manufacturing a device, due to significantly excellent block property and oxidation resistance.
  • TFT thin film transistor
  • MOCVD metal organic chemical vapor deposition
  • ALD atomic layer deposition
  • LPCVD low pressure chemical vapor deposition
  • PECVD plasma enhanced chemical vapor deposition
  • PEALD plasma enhanced atomic layer deposition
  • Representative examples of a precursor used in forming a silicon-containing thin film as described in Korean Patent Laid-Open Publication No. KR 2007-0055898 include silanes, silane chlorides, amino silanes and alkoxysilanes, and more specifically, silane chlorides such as dichlorosilane (SiH 2 Cl 2 ) and hexachlorodisilane (Cl 3 SiSiCl 3 ) and trisilylamine (N(SiH 3 ) 3 ), bis-diethylaminosilane (H 2 Si(N(CH 2 CH 3 ) 2 ) 2 ) and di-isopropylaminosilane (H 3 SiN(i-C 3 H 7 ) 2 ), and the like, which are used in a mass production of a semiconductor and a display.
  • silane chlorides such as dichlorosilane (SiH 2 Cl 2 ) and hexachlorodisilane (Cl 3 SiSiCl 3 ) and
  • An object of the present invention is to provide a novel trisilyl amine derivative.
  • Another object of the present invention is to provide a novel trisilyl amine derivative which is a precursor compound for thin film deposition.
  • Another object of the present invention is to provide a method for preparing a trisilyl amine derivative.
  • another object of the present invention is to provide a composition for depositing a silicon-containing thin film, which includes the trisilyl amine derivative of the present invention, a method for manufacturing a silicon-containing thin film, and the silicon-containing thin film manufactured by using the trisilyl amine derivative of the present invention.
  • the present invention provides a novel trisilyl amine derivative capable of forming a silicon thin film having excellent cohesion, high deposition rate, and excellent physical and electrical properties even at a low temperature.
  • the novel trisilyl amine derivative of the present invention is represented by the following Chemical Formula 1:
  • R 1 and R 2 are each independently hydrogen, halogen, or (C1-C3)alkyl.
  • the trisilyl amine derivative represented by Chemical Formula 1 of the present invention is present in a liquid-state at room temperature and under atmospheric pressure, and has superior volatility and excellent reactivity, thereby allowing a thin film to be easily formed.
  • the reason is because when both of R 1 and R 2 are methyl in Chemical Formula 1, the trisilyl amine derivative is present in a liquid state at room temperature and under atmospheric pressure, but still has low reactivity. Meanwhile, the trisilyl amine derivative of the present invention, excluding a case in which both of R 1 and R 2 are methyl, is a liquid state compound having superior volatility and excellent reactivity, thereby allowing a thin film to be easily formed.
  • the trisilyl amine derivative of the present invention has high thermal stability and low activation energy to thereby have excellent reactivity, and does not generate non-volatile by-product, thereby allowing a silicon-containing thin film having high purity to be easily formed.
  • R 1 and R 2 are each independently hydrogen, halogen, or methyl, provided that a case in which both of R 1 and R 2 are methyl is excluded.
  • the Chemical Formula 1 according to an exemplary embodiment of the present invention may be selected from the following compounds, but the present invention is not limited thereto:
  • trisilyl amine derivative represented by Chemical Formula 1 of the present invention may be preferably used as a precursor compound for depositing a silicon-containing thin film.
  • the present invention provides a method for preparing a trisilyl amine derivative represented by Chemical Formula 1, the method including: preparing the trisilyl amine derivative represented by the following Chemical Formula 1 by reacting a compound represented by the following Chemical Formula 3 with a compound represented by the following Chemical Formula 4 in the presence of a base represented by the following Chemical Formula 2 or (C1-C7)alkyllithium:
  • R 1 and R 2 are each independently hydrogen, halogen, or (C1-C3)alkyl
  • R 3 to R 5 are each independently (C1-C7)alkyl
  • X 1 is halogen
  • (C1-C7)alkyllithium is a compound where lithium is bonded to (C1-C7)alkyl, for example, methyllithium, tert-butyllithium, n-butyllithium, and the like, and preferably, n-butyllithium.
  • the present invention provides a method for preparing a trisilyl amine derivative represented by the following Chemical Formula 1, the method including: preparing the trisilyl amine derivative represented by the following Chemical Formula 1 by reacting a metal hydride with a compound represented by the following Chemical Formula 5:
  • R 1 and R 2 are each independently hydrogen, halogen, or (C1-C3)alkyl
  • X 2 or X 3 is each independently hydrogen or halogen.
  • a metal in the metal hydride according to an exemplary embodiment of the present invention may be an alkali metal or an alkali earth metal, and preferably, lithium.
  • Solvents used in the preparation method of the present invention are not limited if they are not reacted with the starting material among general organic solvents, for example, may be at least one selected from the group consisting of normalhexane (n-hexane), cyclohexane, normalpentane (n-pentane), diethyl ether, toluene, tetrahydrofuran (THF), dichloromethane (DCM), and trichloromethane (chloroform).
  • n-hexane normalhexane
  • cyclohexane normalpentane
  • diethyl ether diethyl ether
  • toluene toluene
  • THF tetrahydrofuran
  • DCM dichloromethane
  • chloroform trichloromethane
  • a reaction temperature in the preparation method of the present invention is not limited if the temperature is used in a general organic synthesis; however, it may be varied depending on an amount of the reaction time, the reaction material, and the starting material, wherein the reaction needs to be finished after confirming that the starting material is completely consumed by NMR, GC, and the like.
  • the solvent may be removed by filtration, followed by simple distillation under reduced pressure, and then a desired material may be separated and refined by general methods such as fractional distillation, distillation under reduced pressure, and the like.
  • the present invention provides a composition for depositing a silicon-containing thin film, including the trisilyl amine derivative as described above, and a method for manufacturing a silicon-containing thin film manufactured by using the trisilyl amine derivative as described above.
  • composition for depositing a silicon-containing thin film of the present invention may contain the trisilyl amine derivative as a precursor for thin film deposition, and the trisilyl amine derivative in the composition for depositing a silicon-containing thin film may have a content within the range which is recognizable by a person skilled in the art in consideration of film forming conditions, or thickness, properties, and the like, of the thin film.
  • the present invention provides a silicon-containing thin film manufactured by using the trisilyl amine derivative as described above.
  • the silicon-containing thin film of the present invention may be manufactured by general methods, for example, metal organic chemical vapor deposition (MOCVD), atomic layer deposition (ALD), low pressure chemical vapor deposition (LPCVD), plasma enhanced chemical vapor deposition (PECVD), plasma enhanced atomic layer deposition (PEALD), and the like.
  • MOCVD metal organic chemical vapor deposition
  • ALD atomic layer deposition
  • LPCVD low pressure chemical vapor deposition
  • PECVD plasma enhanced chemical vapor deposition
  • PEALD plasma enhanced atomic layer deposition
  • the trisilyl amine derivative of the present invention has low activation energy and high reactivity, and minimizes generation of non-volatile by-product, such that the silicon-containing thin film manufactured by using the trisilyl amine derivative of the present invention as a precursor may have high purity and excellent physical and electrical properties.
  • the trisilyl amine derivative of the present invention has excellent thermal stability and high reactivity, such that the silicon-containing thin film manufactured by using the trisilyl amine derivative as a precursor may have high purity and significantly excellent physical and electrical properties.
  • the trisilyl amine derivative of the present invention may have high content of silicon and be present in a liquid state at room temperature and under atmospheric pressure to thereby be easily stored and handled, and may have high volatility and high reactivity to be rapidly and easily deposited, and it is possible to deposit a thin film having excellent cohesion and superior step coverage.
  • the silicon-containing thin film manufactured by using the trisilyl amine derivative of the present invention as a precursor may have high purity and significantly excellent physical and electrical properties.
  • FIG. 1 shows a result obtained by thermogravimetric analysis of a trisilyl amine derivative prepared by Example 3.
  • FIG. 2 shows a result obtained by thermogravimetric analysis of a trisilyl amine derivative prepared by Example 4.
  • FIG. 3 shows a result obtained by vapor pressure measurement of the trisilyl amine derivative prepared by Example 4.
  • FIG. 4 shows a method for depositing a silicon-containing thin film practiced by Example 4.
  • FIG. 5 shows a result obtained by analyzing a film thickness of a silicon-containing thin film manufactured by Example 5, using an Ellipsometer(horizontal:wave number(cm -1 )).
  • FIG. 6 shows a result obtained by infrared spectroscopic analysis of the deposited silicon-containing thin film manufactured by Example 5.
  • FIG. 7 shows a method for depositing a silicon-containing thin film practiced by Example 6.
  • FIG. 8 shows a result obtained by infrared spectroscopic analysis of the silicon-containing thin film practiced by Example 6.
  • Example 5 Deposition of silicon oxide film by Plasma Enhanced Atomic Layer Deposition (PEALD) using trisilyl amine derivative
  • FIG. 4 and Table 1 specifically show a method for depositing the silicon oxide thin film.
  • Table 1 Deposition Condition of Silicon Oxide Thin film Precursor Bis-dimethylsilyl silyl amine Tris-dimethylsilyl amine Heating Temperature (°C) of Precursor 5 35 Substrate Temperature (°C) 100 100 Kind of Substrate Si wafer Si wafer Injection Time (sec) of Precursor 3 3 Purge Flow Amount (sccm) 1100 1100 Time (sec) 20 20 400W Oxygen Plasma Flow Amount (sccm) of Oxygen/Argon 300/100 300/100 Time (sec) 10 10 Purge Flow Amount (sccm) 1100 1100 Time (sec) 15 15 Frequency of Deposition Cycle 50 50
  • FIG. 5 shows a thickness of the film by Ellipsometer analysis. It was confirmed that a thickness of the thin film deposited by using the bis-dimethylsilyl silyl amine compound was 50.5 ⁇ and a thickness of the thin film deposited by using the tris-dimethylsilyl amine compound was 65.8 ⁇ It is determined that these thin films are capable of being effectively used throughout all silicon oxide thin film application fields requiring a high deposition rate.
  • FIG. 6 shows infrared spectroscopic analysis of the deposited film. It was shown that all of the thin films were formed as silicon oxide thin films, and peak of impurities such as C-H, Si-OH was not observed.
  • the novel trisilyl amine derivative prepared by the present invention has high utilization value in forming a high purity silicon oxide thin film having a high deposition rate by plasma enhanced atomic layer deposition (PEALD).
  • PEALD plasma enhanced atomic layer deposition
  • FIG. 4 and Table 2 specifically show a method for depositing the silicon oxide thin film.
  • the thin films had a thickness ranging from 21 to 35.5 ⁇ which showed a low deposition rate as compared to the trisilyl amine derivatives of Examples 3 and 4, and all thin films were formed as the silicon oxide film.
  • Example 6 Deposition of silicon nitride film by Plasma Enhanced Atomic Layer Deposition (PEALD) using trisilyl amine derivative
  • Example 3 Film forming evaluation was conducted by using the trisilyl amine derivative of Example 3 according to the present invention as a composition for forming a silicon nitride film in a general plasma enhanced atomic layer deposition (PEALD) apparatus using the known PEALD method. Silicon substrate was used a substrate, nitrogen together with plasma was used as a reaction gas, and the same nitrogen gas was used for purging.
  • FIG. 7 and Table 3 specifically show a method for depositing the silicon nitride thin film.
  • a thickness of the deposited thin film was measured by an Ellipsometer, and formation of SiN thin film and components of the thin film were analyzed by an infrared spectrophotometer and an auger electron spectrometer. In 500 cycles on a flat panel wafer, a thickness of the thin film was 130.1 ⁇
  • etch rate of the deposited thin film was confirmed by using buffered oxide etchant (BOE) solution (300: 1).
  • BOE buffered oxide etchant
  • the deposited silicon nitride thin film was etched at a rate of 0.04 ⁇ /sec, and a silicon oxide thin film(thermal oxide) deposited by a pyrolysis deposition method at 1000°C as a comparative sample was etched at a rate of 0.34 ⁇ /sec, and a silicon nitride thin film deposited by low pressure chemical vapor deposition (LPCVD) at 770°C using dichloro silane was etched at a rate of 0.02 ⁇ /sec.
  • LPCVD low pressure chemical vapor deposition
  • the novel trisilyl amine derivative prepared by the present invention has high utilization value in forming a high purity silicon nitride thin film having a high deposition rate and excellent etch resistance by plasma enhanced atomic layer deposition (PEALD).
  • PEALD plasma enhanced atomic layer deposition

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Abstract

L'invention porte sur un nouveau dérivé trisilyl amine, un procédé pour le préparer, et une couche mince contenant du silicium l'utilisant, le dérivé trisilyl amine, qui est un composé présentant stabilité thermique, volatilité élevée, et haute réactivité et étant présent en un état liquide à la température ambiante et sous pression où la manipulation est possible, peuvent former une couche mince contenant du silicium de haute pureté ayant d'excellentes propriétés physiques et électriques grâce à divers procédés de dépôt.
PCT/KR2015/000168 2014-01-08 2015-01-08 Nouveau dérivé trisilyl amine, procédé pour le préparer et couche mince contenant du silicium l'utilisant WO2015105337A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2016545307A JP6253789B2 (ja) 2014-01-08 2015-01-08 新規なトリシリルアミン誘導体およびその製造方法、並びにそれを用いたシリコン含有薄膜
CN201580009063.6A CN106029680B (zh) 2014-01-08 2015-01-08 新三甲硅烷基胺衍生物、其制备方法以及使用其的含硅薄膜
US15/110,692 US10202407B2 (en) 2014-01-08 2015-01-08 Trisilyl amine derivative, method for preparing the same and silicon-containing thin film using the same

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KR10-2014-0002538 2014-01-08
KR20140002538 2014-01-08
KR10-2014-0193165 2014-12-30
KR1020140193165A KR101720017B1 (ko) 2014-01-08 2014-12-30 신규한 트리실릴아민 유도체, 이의 제조방법 및 이를 이용한 실리콘 함유 박막

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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3388440A1 (fr) 2017-02-08 2018-10-17 Versum Materials US, LLC Oligosiloxanes linéaires et cycliques à fonction organoamino pour le dépôt de films contenant du silicium
US10403494B2 (en) 2015-03-30 2019-09-03 L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude Si-containing film forming precursors and methods of using the same
EP3553204A2 (fr) 2018-04-11 2019-10-16 Versum Materials US, LLC Oligosiloxanes cycliques à fonction organoamino pour le dépôt de films contenant du silicium
US10464953B2 (en) 2016-10-14 2019-11-05 Versum Materials Us, Llc Carbon bridged aminosilane compounds for high growth rate silicon-containing films
US10501484B2 (en) 2013-09-27 2019-12-10 L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude Amine substituted trisilylamine and tridisilylamine compounds and synthesis methods thereof
US11124876B2 (en) 2015-03-30 2021-09-21 L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude Si-containing film forming precursors and methods of using the same
WO2021201910A1 (fr) 2020-04-02 2021-10-07 Versum Materials Us, Llc Oligosiloxanes cycliques à fonction organoamino pour le dépôt de films contenant du silicium
US11177127B2 (en) 2017-05-24 2021-11-16 Versum Materials Us, Llc Functionalized cyclosilazanes as precursors for high growth rate silicon-containing films
US11591692B2 (en) 2017-02-08 2023-02-28 Versum Materials Us, Llc Organoamino-polysiloxanes for deposition of silicon-containing films
US11912730B2 (en) 2019-04-05 2024-02-27 Versum Materials Us, Llc Organoamino-functionalized cyclic oligosiloxanes for deposition of silicon-containing films

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CLEMENS ZAPILKO ET AL.: "Advanced Surface Functionalization of Periodic Mesoporous Silica: Kinetic Control by Trisilazane Reagents", J. AM. CHEM. SOC., vol. 128, 2006, pages 16266 - 16276 *
JAN SCHNEIDER ET AL.: "You have full text access to this contentReaktionen von Lithiumhydridosilylamiden RR' (H)Si-N(Li)R'' mit Chlortrimethylsilan in Tetrahydrofuran und unpolaren Lsungsmitteln: N-Silylierung und/oder Cyclosisilazanbildung", Z. ANORG. ALLG. CHEM., vol. 627, 2001, pages 2680 - 2692 *
JOSEF POLA ET AL.: "UV laser deposition of nanostructured Si/C/O/N/H from disilazane precursors and evolution to silicon oxycarbonitride", APPL. ORGANOMETAL. CHEM., vol. 20, 2006, pages 648 - 655 *

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10501484B2 (en) 2013-09-27 2019-12-10 L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude Amine substituted trisilylamine and tridisilylamine compounds and synthesis methods thereof
US11124876B2 (en) 2015-03-30 2021-09-21 L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude Si-containing film forming precursors and methods of using the same
US10403494B2 (en) 2015-03-30 2019-09-03 L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude Si-containing film forming precursors and methods of using the same
US11820654B2 (en) 2015-03-30 2023-11-21 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Si-containing film forming precursors and methods of using the same
US11699584B2 (en) 2015-03-30 2023-07-11 L'Air Liquide, Société Anonyme pour l'Edute ed l'Exploitation des Procédés Georges Claude Si-containing film forming precursors and methods of using the same
US10464953B2 (en) 2016-10-14 2019-11-05 Versum Materials Us, Llc Carbon bridged aminosilane compounds for high growth rate silicon-containing films
US10822458B2 (en) 2017-02-08 2020-11-03 Versum Materials Us, Llc Organoamino-functionalized linear and cyclic oligosiloxanes for deposition of silicon-containing films
US11591692B2 (en) 2017-02-08 2023-02-28 Versum Materials Us, Llc Organoamino-polysiloxanes for deposition of silicon-containing films
EP3388440A1 (fr) 2017-02-08 2018-10-17 Versum Materials US, LLC Oligosiloxanes linéaires et cycliques à fonction organoamino pour le dépôt de films contenant du silicium
US11177127B2 (en) 2017-05-24 2021-11-16 Versum Materials Us, Llc Functionalized cyclosilazanes as precursors for high growth rate silicon-containing films
EP4223903A1 (fr) 2018-04-11 2023-08-09 Versum Materials US, LLC Oligosiloxanes cycliques organoaminofonctionnalises pour depot de films contenant du silicium
EP3553204A2 (fr) 2018-04-11 2019-10-16 Versum Materials US, LLC Oligosiloxanes cycliques à fonction organoamino pour le dépôt de films contenant du silicium
US11912730B2 (en) 2019-04-05 2024-02-27 Versum Materials Us, Llc Organoamino-functionalized cyclic oligosiloxanes for deposition of silicon-containing films
WO2021201910A1 (fr) 2020-04-02 2021-10-07 Versum Materials Us, Llc Oligosiloxanes cycliques à fonction organoamino pour le dépôt de films contenant du silicium

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