WO2015090901A1

WO2015090901A1 - Electronic component and production method for producing an electronic component

Info

Publication number: WO2015090901A1
Application number: PCT/EP2014/075883
Authority: WO
Inventors: Ricardo Ehrenpfordt; Frederik GOLKS
Original assignee: Robert Bosch Gmbh
Priority date: 2013-12-19
Filing date: 2014-11-28
Publication date: 2015-06-25
Also published as: DE102013226646A1; EP3084874A1; CN105814729A

Abstract

The invention relates to an electronic component (600) for carrying at least one electrical circuit and for storing electrical energy. The electronic component (600) comprises a first plate-shaped, more particularly film-like, electrode (606) and a second plate-shaped, more particularly film-like, electrode (608); an oxidizing agent (802) and a reducing agent (800), and a first carrier layer (602) and a second carrier layer (604), wherein the first carrier layer (602), the first plate-shaped electrode (606), the second plate-shaped electrode (608) and the second carrier layer (604) are arranged one above another in a plane-parallel manner forming a stack, and wherein a first main side (616) of the first electrode (606) is coated with the oxidizing agent or the reducing agent and/or a first main side (618) of the second electrode (608) is coated with the oxidizing agent if the first electrode (606) is coated with the reducing agent, or is coated with the reducing agent if the first electrode (606) is coated with the oxidizing agent, wherein the first main side (616) of the first electrode (606) faces the first main side (618) of the second electrode (608).

Description

Description title

Electronic component and manufacturing method for producing an electronic component

State of the art

The present invention relates to an electronic component for supporting at least one electrical circuit and for storing electrical energy and to a manufacturing method for producing such an electronic component.

Energy storage wins with the progressive equipment

Mobile devices, the development of EMobility and the application of

energy self-sufficient systems more and more important. At the same time, size and cost reduction are increasingly becoming the focus of attention.

Energy-autonomous systems, for example as a signal generator consisting of sensor and actuator elements, electronics, energy storage and wireless

Communications are often discussed in sizes similar to that of SD or smart cards. The storage of energy takes place mostly on a chemical basis in the form of primary cells or batteries or secondary cells or

Accumulators and is delivered as electrical energy to corresponding components. The transformation of the energy forms by the galvanic system is carried out based on a redox reaction.

The patent US 7,624,499 B2 describes the introduction of a molded and gehausten battery in a flexible substrate by mounting the sealed battery between insulating layers and contacting the

Battery terminals.

Disclosure of the invention Against this background, with the approach presented here, an electronic component for carrying at least one electrical circuit and for storing electrical energy and a manufacturing method for producing an electronic component for carrying at least one electrical

Circuit and for storing electrical energy presented in accordance with the main claims. Advantageous embodiments emerge from the respective subclaims and the following description. An electronic component can be replaced by a suitable one

Materials for producing a galvanic cell - z. B. in the form of a thin-film battery - and the application of a special construction and

Connection technology can be used both for storing electrical energy and for carrying at least one electrical circuit.

An optimized method is proposed, which can simplify and reduce the realization of a thin-film battery by using commercially available materials of lithium-ion technology, in particular electrode tapes, separators and electrolytes. Along with this is an optimized design of the galvanic cell or thin-film battery

proposed.

The concept proposed here describes an advantageous realization of an electronic component or a thin-film battery by a direct use of materials, in particular of electrode films,

Separators and electrolytes, as used in lithium-ion battery technology, while simplifying the construction geometry by u. A. can be dispensed with an elaborately manufactured cavity. An electronic component designed in accordance with this concept can be used as a carrier of electrical circuits and other components and at the same time for

Storage of electrical energy as chemical energy bound to be used in chemical redox reactions.

An essential part of the approach proposed here is the

Concept advantage, the electrodes required for the functionality of the thin-film battery including u. U. applied active materials and the separator detached from the component in an independent process step to produce and optimize externally. This includes in particular the possibility of commercially available materials of lithium-ion technology,

For example, sheet-like electrodes, so-called electrode films,

To use separators and matched electrolytes in the thin-film cell and thus to position the know-how as the key of innovative battery technology with the manufacturer of battery materials and not with the PCB manufacturer. A simplification and reduction of the component result from an optimized design, eg. B. can be dispensed with by introducing the paste-like electrode materials in cavities. Furthermore, process steps can be optimized, for example by the application of plane-parallel layers, the creation of space for fluidic and electrical vias by staggered structures and possibly the use of optimized materials such as foil-like composite materials and foil-like electrodes with battery-typical coatings.

A thin-layer cell manufactured in accordance with the concept presented here is characterized by a small size which promotes the compactness of an overall system, a high packing or functional density at the same time

Provision of high capacity.

An electronic component for carrying at least one electrical circuit and for storing electrical energy has the following features: a first plate-shaped, in particular foil-like, electrode and a second plate-shaped, in particular foil-like, electrode; an oxidizing agent and a reducing agent; and a first carrier layer and a second carrier layer, wherein the first

Carrier layer, the first plate-shaped electrode, the second plate-shaped electrode and the second carrier layer stacking are arranged plane-parallel one above the other, and wherein a first main side of the first electrode with the oxidizing agent or the reducing agent is coated and / or a first main side of the second electrode with the oxidant is coated when the first electrode is coated with the reducing agent or coated with the reducing agent, when the first electrode is coated with the oxidizing agent, wherein the first main side of the first electrode of the first main side of the second electrode facing.

The electronic component can have a very compact design and find application especially in microsystems. In particular, the electronic component may be an electrochemical store which, in the finished state, has a rigid z. Rectangular plate shape to be suitable for supporting one or more electrical circuits. The electronic component can fulfill the functions of a battery, a rechargeable battery or a capacitor. The first and the second

Carrier layer may form an upper and a lower side of the stacked electronic component. In this case, the first

Carrier layer, the top and the second carrier layer, the bottom or vice versa, the first carrier layer, the bottom and the second carrier layer form the top of the stapeiförmigen device. The electronic

Component may have above or below the first carrier layer and / or above or below the second carrier layer any plurality of further carrier layers. The first and the second carrier layer may consist of a robust and / or non-deformable plastic material and be plate-shaped. The substrate plates can be formed large enough to the remaining between them

To protect suitable elements of the electronic component and to be sufficiently strong for receiving the at least one electrical circuit. The two carrier layers can each have a rectangular shape. The first and the second plate-shaped electrode may be formed as a foil, that is, with a low thickness and flexible. The two plate-shaped electrodes may each have a rectangular shape. For a functional capability of the electronic component as a galvanic cell or as a redox flow cell, the oxidizing agent and the reducing agent can ensure a chemical reaction for generating or storing electrical energy in the electronic component. By means of the coating of the one plate-shaped electrode with the oxidizing agent, the electrode can be designed to receive electrons of an electrolyte. Accordingly, the other plate-shaped electrode by means of the coating with the reducing agent for Dispensing electrons of an electrolyte are designed. The first

Carrier layer, the first plate-shaped electrode, the separator layer, the second plate-shaped electrode and the second carrier layer may be arranged in the order mentioned forming the stack plane-parallel one above the other, that the stack has a z. B. rectangular plate shape by the carrier layers, the plate-shaped electrodes and the

Separator layer each form a rectangular shape and all edges or corners of the rectangles are arranged congruent. In particular, the carrier layers, the plate-shaped electrodes and the separator layer can each have a uniform thickness of the same, ie be free from recesses and cavities.

According to one embodiment, the electronic component may be a

Separator layer, which is arranged for spatially and electrically separating the first plate-shaped electrode from the second plate-shaped electrode between the first plate-shaped electrode and the second plate-shaped electrode. The separator layer may have a porous structure, which is advantageously suitable for a functional capability of the electronic component as a galvanic cell or as a redox flow cell for a passage of ions of an electrolyte between the first and the second electrode.

Furthermore, a second main side of the first electrode lying opposite the first main side may be fastened to the first carrier layer by means of an adhesive and / or a second main side of the second electrode lying opposite the first main side can be attached to the second by means of the adhesive

Carrier layer attached. With this embodiment, a correct and thus energy-efficient placement of the electrodes in the stack can be ensured in a simple and fast manner.

Also, the electronic component may further at least one

Have thermosets having connecting layer. The at least one connection layer may be between the first electrode and the second electrode and in particular between the first electrode and the first electrode

Separator layer are arranged plane-parallel to the stack and formed to connect the stack forming elements firmly together. With the Using the at least one connecting layer, all the cell components of the stack can be connected in a single process step with little time to a one-piece component. Further, with the support of the thermosetting material additive readily a rigid and thus highly robust final condition of the finished electronic component can be realized, with which the electronic component can be particularly suitable for carrying sensitive electrical and electronic components in terms of a circuit board.

According to a further embodiment, the connection layer may have an opening for forming a channel between the first electrode and the second electrode, in particular between the first electrode and the second electrode

Separator layer having. Thus, a possibility can be created in a simple manner to contact an electrolyte introduced into the stack with both electrodes and thus to introduce the functionality of a galvanic cell into the stack-shaped arrangement.

Furthermore, the electronic component may comprise a further compound layer comprising the thermosets. The further connection layer may be arranged adjacent to the connection layer and have a further opening. With this embodiment, an advantageous

Thickening and thus increase the stability of the cell network can be realized.

In particular, the electronic component may have at least one filling opening. The filling opening may extend from an outer side of the first carrier layer facing away from the stack to the second electrode. Alternatively or additionally, the filling opening may extend from an outer side of the second carrier layer facing away from the stack to the first electrode. The filling opening may be designed to allow a fluidic electrolyte to be introduced into the stack, in particular into the channel between the first electrode and the second electrode, in particular between the first electrode and the separator layer. The electrolyte can be present in liquid or gel form for filling through the filling opening. This embodiment has the advantage that the electrolyte only at the end or after an end of a manufacturing process for producing the electronic component to supply this. So can the

Manufacturing process faster, cheaper and less risky. According to a particular embodiment, the first electrode and the second electrode may differ in their dimensions. Alternatively or additionally, the first electrode and the second electrode may be arranged laterally offset from each other. In both cases, such a lateral

Projection of the first electrode with respect to the second electrode or the second electrode with respect to the first electrode form. It can the

Fill opening be positioned in a portion of the stack, which is located in the region of the lateral projection. This embodiment can facilitate the filling of the electrolyte into the cell stack, since in this case the electrolyte can be supplied by the shortest route to the cavity formed through the opening in the connection layer or to the channel between the electrodes.

In addition, the electronic component in the portion of the stack, which is located in the region of the supernatant, further an electric

Through contact for electrical contacting of the first electrode or the second electrode. The electrical via may be configured to extend from the outside of the first carrier layer to the first

Electrode or the second electrode to extend. So the second one

Electrode can be easily contacted without the risk of a short circuit.

A manufacturing method for producing an electronic component for carrying at least one electrical circuit and for storing electrical energy comprises the following steps: providing a first carrier layer and a second carrier layer, a first plate-shaped electrode with a coating of one

Oxidizing agent a reducing agent and a second plate-shaped electrode with a coating of the oxidizing agent or

Reducing agent; ; and Plane-parallel arranging for forming a stack of the first carrier layer, the first plate-shaped electrode, the second plate-shaped electrode and the second carrier layer.

The manufacturing method can be used to produce an electronic

Component can be used according to one of the preceding embodiments. The manufacturing method is suitable for use in a wholly or partially automated production line for the efficient production of a large number of the electronic components according to the invention.

The approach presented here will be described below with reference to the attached

Illustrated drawings by way of example. Show it:

Fig. 1-3 examples of chemical energy storage in small sizes;

4 shows a cross section through a single-layer printed circuit board according to the prior art.

5 shows a cross section through a multilayer printed circuit board according to the prior art.

6 is a perspective view of a structure of an electronic component according to an embodiment of the present invention;

FIG. 7 is a perspective view of the electronic component of FIG. 6 after completion, according to an embodiment of the present invention; FIG.

8 shows a cross section through the electronic component from FIG. 6 before filling in an electrolyte, according to an exemplary embodiment of the present invention;

9 shows a cross section through the electronic component from FIG. 6 after an electrolyte has been introduced, according to an exemplary embodiment of the present invention; 10 shows a cross section through the electronic component from FIG. 6 with a through contact, according to an embodiment of the present invention; and

1 1 is a flowchart of a manufacturing method for manufacturing an electronic component, according to an embodiment of the present invention.

In the following description of preferred embodiments of the present invention are for the in the various figures

represented and similar elements acting the same or similar

Reference numeral used, wherein a repeated description of these elements is omitted.

In the following figures, the inventive cell design and a corresponding AVT process for the circuit carrier proposed herein with chemical energy storage are explained vividly.

Figures 1 to 3 show examples of chemical energy storage in small

Sizes that are used today in many devices, especially the Comsumer- electronics.

Fig. 1 shows an exemplary real-time clock board according to the prior art.

Fig. 2 shows an exemplary control unit according to the prior art.

In consumer electronics, z. In mobile devices, are present

Accumulators of lithium-ion technology u. A. most widely used because of their high energy density and longevity. In modern

Smartphones - including the contact strip for contacting the battery - usually occupy more than 30% of the total volume of the device. For small system sizes are often - as shown in Figures 1 and 2 - button cells in primary or secondary version application, whose

Dimensions depending on capacity usually between 5 and 20 mm

Diameter and 2 and 5.4 mm thickness vary. Fig. 3 shows an exemplary thin-film battery according to the prior art. To further reduce the size of the chemical energy storage, especially for applications in microsystems, there are activities for the realization of thin-film batteries. The battery layers - electrodes, separator, electrolyte - have typical thicknesses of a few hundred micrometers and can u. A. be applied directly to MEMS or electronic chips.

4 shows an exemplary cross-sectional representation

schematic structure of a two-layer circuit board 400 with two metal layers according to the prior art as a circuit carrier. Circuit carriers in the form of the printed circuit board or the PCB 400 (PCB = Printed Circuit Board) are often used as a substrate for the construction and connection technology of sensor and

Actuator systems and electronics are used. As shown in FIG. 4, a printed circuit board core 402 formed from a thermoset is at least partially coated with a solder resist or insulating varnish 404. At locations free of the insulating varnish 404, metal layers form on the core 402

Connection pads 406 on the PCB upper and lower side as well as electrical

Through contacts 408 of the circuit substrate 400. The vias 408 may be metallized border or filled.

FIG. 5 shows, by way of another cross-sectional illustration, an exemplary schematic structure of a multilayer printed circuit board 500 according to the prior art

Technology as a circuit carrier. The printed circuit board 500 has a plurality of superposed thermoset layers 402 with metal layers which are laminated by means of pre-impregnated fibers, so-called prepregs 502, arranged between them. The thermoset layers or epoxy resin 402 are traversed by glass fibers -. B. in the form of epoxy resin impregnated

Glasfasermatten - and serve above all the PCB stability and as a carrier of the conductor tracks and the vias 408th The on the

Epoxidharzlagen 402 arranged metal layers are used to create rewiring and connection pads 406 and the vias or

Hohlvias 408, which may be border metallized or filled or filled with metal. In the presses for the layers 402 used Prepregs 502 is an unhardened thermoset

Plastic matrix that cures when pressed.

Based on the illustration in FIGS. 4 and 5, standard thicknesses for the epoxy resin cores 402 are 50 to 710 μm. Typical prepreg thicknesses are 50 to 180 μηη. The lateral size of the circuit boards 400, 500 is usually determined by the circuit and assembly image on the surface, without - except for the vias 408 - within the circuit board 400, 500 a high

Integration density is necessary.

FIG. 6 schematically shows a construction of an electronic component 600 according to a perspective illustration

Embodiment of the present invention. The illustration in FIG. 6 shows well the stacked structure of the electronic component 600, by the individual components or layers of the component 600, which in the finished

State of the device 600 directly to each other, here

are shown exploded. The electronic component 600 serves as a circuit carrier and is in the form of a thin-film battery or a thin-film battery. In the embodiment shown in FIG. 6, the electronic component 600 comprises a first carrier layer 602, a second carrier layer 604, a first plate-shaped electrode 606, a second plate-shaped electrode 608, a separator layer 610 and four thermoset bonding layers 612. According to alternative embodiments the electronic component 600 also have only one connection layer 612 or more than four connection layers 612.

As shown in FIG. 6, the carrier layers 602, 604 form the outer sides of the electronic component 600 or, in the exemplary embodiment shown in the illustration, form the first carrier layer 602

The first and the second plate-shaped electrode 606 and the second plate-shaped electrode 608 are designed as electrode tapes or foil electrodes, thus characterized by a very small thickness or strength. Both the first electrode 606 and the second electrode 608 have one

Contact or a connection pad 614 for connecting other components. In the embodiment of the thin-film cell 600 shown in FIG. 6, the first electrode 606 fulfills the function of the cathode and is located at one of the

Connecting layers 612 facing first main side 616 coated with a reducing agent. The second electrode 608 satisfies the

Function of the anode and is coated on its also the connecting layers 612 facing the first main side 618 with an oxidizing agent. In an alternative embodiment, the functions and corresponding coatings are distributed inversely to the electrodes 606, 608.

By means of an adhesive 620 which is likewise present in layer form, the first electrode 606 with a second main side 622 opposite the first main side 616 is fixed to an inner side of the first carrier layer 602 facing the cell stack and the second electrode 608 to a second main side opposite the first main side 618 624 at a the

Cell stack facing inside of the second carrier layer 604 fixed. The separator layer or separator 610 is disposed adjacent to the second electrode 608 in the cell stack and configured to spatially and electrically separate the electrodes 606, 608 with their active materials. For facilitating ion transport of an electrolyte, US Pat

Separator layer 610 for showing cavities between the

Active materials on a porous structure. So is the separator 610

for example, from a microporous plastic or a nonwoven

Fiberglass or polyethylene formed according to lithium-ion technology.

The four connecting layers 612 disposed between the first electrode 606 and the separator 610 in the cell stack of the thin-film battery 600 each have an opening 626 for forming a channel for guiding a channel

Electrolytes between the first electrode 606 and the second electrode 608 on.

As shown in FIG. 6, all the components 602, 604, 606, 608, 610, 612, 620 of the cell stack of the embodiment of the electronic component 600 shown here are implemented in thin layers or plates. All layers or plates have a rectangular shape, in which case the

Electrodes 606, 608 and separator layer 610 over the others Components have smaller dimensions both in length and in width. Also, the openings 626 of the thermoset

Bonding layers 612 are rectangular in shape and approximately equal in size to those of the electrodes 606, 608 and the separator 610. The openings 626 are placed in the bonding layers 612 so as to form a channel between the electrodes 606, 608 upon completion of the electronic device 600 form. According to embodiments of the electronic component 600, the openings 626 may have different geometric shapes or positions in the respective connection layer 612 or different sizes to give the channel a specified shape.

The illustration in FIG. 6 clearly shows that all the components 602, 604, 606, 608, 610, 612, 620 of the PCB thin-film battery stack 600 are arranged plane-parallel to each other. The plane parallelism refers to a marked by a double arrow in the illustration

Main extension plane 628 along major sides of components 602, 604, 606, 608, 610, 612, 620. The major sides are opposite sides of the cell components 602, 604, 606, 608, 610, 612, 620 having a larger extent than the remaining pages.

As already explained, the cell concept proposed here and the geometry resulting therefrom comprise at least the first and second layer-wise arranged substrate planes 602, 604, between which the at least two layered electrode foils 606, 608 are located (eg copper and copper)

Aluminum). The electrode films can z. B. made of copper or aluminum and are provided with a battery-typical electrode composite for the anode 608 and the cathode 606, the u. A. can be performed as a film, deposited, grown, printed or scrubbed layer over the entire surface, porous, or sponge-like. At least one of the material components per electrode 606, 608 can function both as an oxidizing agent and as a reducing agent and thus absorb or release ions or electrons. For example, the positive electrode 608 is aluminum with a lithium-containing transition metal oxide, e.g. B.

Lithium cobalt oxide, as a coating. The negative electrode 606 is made of, for example, copper provided with a graphite coating. Aluminum and copper act as Elektronenableiter or

Electron collector. The layered electron-conducting electrodes 606, 608 including the applied active materials at least partially cover the inner surfaces of the carrier layers 602, 604 and are in the embodiment shown in FIG. 6 at the back 622, 624 with the adhesive layers

620, z. As an epoxy adhesive, fixed. The fixation is realized in any case so that the active materials are layered opposite each other.

According to embodiments, the printed circuit boards or carrier layers 602, 604 are made of a glass-fiber-reinforced epoxy plastic. To isolate the chemical cell 600 to the outside, further metallization layers can be introduced parallel or substantially perpendicular to the electrodes 606, 608 in such a way that they close off or seal the cell 600 almost completely to the surrounding atmosphere, above all against moisture.

Fig. 7 shows in a perspective view of the embodiment of the electronic component 600 of FIG. 6 after the pressing. The now one-piece stack or stack of the thin-film cell 600 shown in the illustration consists of the substrate plates 602, 604 and the cell components arranged between the substrate plates 602, 604 shown in FIG. 6 and was used in a lamination or pressing step of a method for

Production of the electronic component 600 by means of the prepreg or

Epoxy layers 612 glued. In this case, the prepreg connection layers 612 are placed around the cell arrangement in such a way that, apart from the channel mentioned in the explanation for FIG. 6, no further cavities are formed.

The finished thin-film cell 600 has a uniform, flat

Cuboid shape. Laterally are the two connection pads 614 for contacting the thin-film cell 600 with other components, eg. B. another thin-film cell before. In a further process step of the

The manufacturing process was the stack through the first carrier layer 602 with two filling openings 700 for filling a liquid or gel

Electrolyte provided in the cell 600. This will be discussed in more detail with reference to the following figures 8 and 9. FIG. 8 is a cross-sectional view of a portion of the embodiment of the compressed thin-film cell 600 shown in perspective in FIG. 7. In the illustration, the electronic component or the

Thin-film cell 600 before filling an electrolyte by the

Fill openings 700, one of which is shown here, shown.

The embodiment of the electronic component 600 shown in FIG. 8 has the peculiarity that the first electrode 606 has a smaller one

Dimensions designed as the second electrode 608 and not centered, but is arranged laterally in the cell stack. Thus, the first electrode 606 extends along the direction of extent only through a portion of the thin-film cell 600. The illustration also shows that the filling opening 400 is disposed in a portion of the cell stack into which the first electrode 606 does not extend. Thus, the first electrode 606 is not contacted by the filler opening 700.

Furthermore, the illustration in FIG. 8 shows the coating of the first electrode or

Cathode 606 with a reducing agent 800 and the coating of the second electrode or anode 608 with an oxidizing agent 802.

It can be seen from FIG. 8 that the filling opening 700 extends from above from an outer side of the first carrier layer 602 through the first carrier layer 602, the compressed connecting layer 612, the separator layer 610 and the

Oxidant layer 802 extends to the second electrode 608. In the embodiment of the electronic component 600 shown in FIG. 8, the filling opening 700 extends in a straight line and with a constant shape

Diameter transverse to the extension direction 628 of the cell stack. The above-mentioned channel for guiding an electrolyte formed by the openings in the connecting layer 612 is part of the filling opening 700.

According to embodiments of the electronic component 600, the at least one filling opening 700 extends in the form of a passage opening from the

Outer surface of the circuit substrate 600 through at least one substrate level, ie electrode film 606 and electrode active material 800, and the separator 610 to the opposite substrate level. In the case of the use of a copper arrester foil, this can advantageously be used directly as a drill stop in the context of a laser drilling method. The passage 700 allows the filling of a liquid or gel electrolyte after completed production of the circuit board 600 and / or even after further placement and soldering processes.

FIG. 9 shows, by way of another cross-sectional illustration, the section of the embodiment of the compressed view shown in perspective in FIG. 7

Thin-film cell 600 after a process step of filling the stack with an electrolyte 900.

The illustration in FIG. 9 shows that as a result of the process step of FIG

Filling the cavities or cavities of the stack, which according to a

Embodiment of the invention at least partially by a spatial

Expansion of the porous separator 610, at least partially so filled with the electrolyte 900 as an ion-conducting material that an ion exchange between the electrodes 606, 608 is made possible, wherein the ion transport via the ion conductor takes place. After filling the electrolyte

900, the fill opening 700 was sealed by applying a cover layer 902 to prevent later leakage of the electrolyte 900.

According to embodiments, with at least one other

Through hole 700, the filling with the electrolyte 900, for example, under vacuum, can be improved. As shown in FIGS. 8 and 9, according to exemplary embodiments, at least one of the two electrode foils, which extend the electrode foil 608 laterally at least in a partial area of the stack, projects beyond the other electrode foil, in this case the electrode foil 606. In this projecting area, the at least an opening 700 for the

Filling with the electrolyte 900 or according to further embodiments, electrical vias for contacting the projecting electrode 608 provided. This will be discussed in more detail with reference to FIG. The printed circuit board layers 602, 604 are designed as largely plane-parallel layers without further deepened structuring. The foil-like ones

Electrodes 606, 608 are largely flat on the printed circuit board layers 602, 604. The area between the circuit board layers 602, 604 that is not occupied by the sheet-like electrodes 606, 608, their coatings 800, 802 or the separator 610 is filled by the prepreg or epoxy material 612 used in the manufacture of the cell 600 in FIG a thermal process was pressed under mechanical pressure so that it mechanically bonds the stack together.

10 shows by way of another cross-sectional illustration a section of a further exemplary embodiment of the thin-film cell 600. The cross-section shows the electronic component with the through opening or filling opening 700 and the further feature of a through-connection 1000. In the embodiment of the thin-film cell shown in FIG 600, the via 1000 is provided, like the fill opening 700, in the portion of the stack that is free of the first electrode 606. The electric

Through-contact 1000 extends from the outside of the first carrier layer 602 to the second electrode 608 and also extends in a straight line and with a constant diameter transverse to the extension direction 628 of the cell stack. According to embodiments, the thin-film cell 600 is equipped with a plurality of electrical contacts 1000.

According to one embodiment of the invention, the electrical contact 1000 consists of the electrode foil 608 itself, which is indeed made of aluminum or copper. According to embodiments, the through contact 1000 leads without further contact or composite sites as a continuous metallization to further electrodes within the circuit substrate 600, to the Anschlußpadflächen shown in Fig. 4 on the outer surfaces or to the other

Interconnections within the circuit carrier 600. The others

Interconnections can then be the contacting of other cells, electronic circuits, such as DC / DC circuits, the contacting of

Sensors, especially MEMS sensors, energy harvesters and the

Contacting to the outside, z. B. of solder contacts serve.

Fig. 1 1 shows a flowchart of an embodiment of a

Manufacturing method 1 100 of an electronic component, for example, an embodiment of the thin-film cell shown in the preceding Figures 1 to 10. In a step 1 102, at least a first carrier layer, a second carrier layer, a first plate-shaped electrode coated with an oxidizing agent or reducing agent, a second plate-shaped coated with an oxidizing agent or reducing agent

Electrode and a Separatorschicht for spatial and electrical separation of the first electrode from the second electrode, and further connecting layers for connecting the cell components. In a step 1 104, all components are arranged in a stape-shaped plane-parallel. In a step 1 106, the plane-parallel stacking components are pressed together to form the one-piece thin-layer cell by means of the connecting layers. In a step 1,108, filling holes are provided from an outside of the cell for filling an electrolyte into the cell. In a step 1 1 10, an electrolyte is filled through the filling openings and then with a

Covering layer sealed.

The approach presented here can be used above all in energy-self-sufficient systems in the automotive or consumer sector and can be detected on the product by making a cut or by opening the circuit carrier.

The embodiments described and shown in the figures are chosen only by way of example. Different embodiments may be combined together or in relation to individual features. Also, an embodiment can be supplemented by features of another embodiment.

Furthermore, the method steps presented here can be repeated as well as executed in a sequence other than that described.

If an exemplary embodiment comprises a "and / or" link between a first feature and a second feature, then this is to be read so that the embodiment according to one embodiment, both the first feature and the second feature and according to another embodiment either only first feature or only the second feature.

Claims

claims

1 . An electronic component (600) for carrying at least one electrical circuit and for storing electrical energy, the electronic component (600) having the following features: a first plate-shaped, in particular foil-like, electrode (606) and a second plate-shaped, in particular foil-like, electrode ( 608); an oxidizer (802) and a reducing agent (800); and a first carrier layer (602) and a second carrier layer (604), wherein the first carrier layer (602), the first plate-shaped electrode (606), the second plate-shaped electrode (608) and the second carrier layer (604) form a stack plane-parallel are arranged one above the other, and wherein a first main side (616) of the first electrode (606) with the

Oxidant (802) or the reducing agent (800) is coated and / or a first main side (618) of the second electrode (608) with the oxidizing agent (802) is coated when the first electrode (606) coated with the reducing agent (800) or coated with the reducing agent (800) when the first electrode (606) is coated with the

Oxidant (802), wherein the first major side (616) of the first electrode (606) faces the first major side (618) of the second electrode (608).

2. Electronic component (600) according to claim 1, characterized

in that the electronic component is a

Separator layer (610) arranged for spatially and electrically separating the first plate-shaped electrode (606) from the second plate-shaped electrode (608) between the first plate-shaped electrode (606) and the second plate-shaped electrode (608). The electronic component (600) according to one of the preceding claims, characterized in that a second main side (622) of the first electrode (606) facing the first main side (616) is attached to the first carrier layer (602) by means of an adhesive (620) and or one of the first main side (618) opposite the second main side (624) of the second electrode (608) by means of the adhesive (620) on the second support layer (604) is attached.

Electronic component (600) according to one of the preceding claims, characterized in that the electronic component (600) further comprises at least one thermoset having

Connecting layer (612), which between the first electrode (606) and the second electrode (608), in particular between the first

Electrode (606) and the separator layer (610), arranged plane-parallel to the stack and is formed to fix the stack forming elements.

Electronic component (600) according to claim 4, characterized

characterized in that the connecting layer (612) has an opening (626) for forming a channel between the first electrode (606) and the second electrode (608), in particular between the first electrode (606) and the separator layer (610).

An electronic component (600) according to claim 4 or 5, characterized in that the electronic component (600) further comprises another compound layer (612) comprising the thermosets, wherein the further interconnection layer (612) adjacent to

Connecting layer (612) is arranged and has a further opening (626).

Electronic component (600) according to one of the preceding claims, characterized in that the electronic component (600) has at least one filling opening (700), which faces away from the stack outside of the first carrier layer (602) to the second electrode (608 ) and / or away from one of the stack Outside of the second carrier layer (604) extends to the first electrode (606) and is adapted to a filling of a fluid electrolyte (900) in the stack, in particular in the channel between the first

Electrode (606) and the second electrode (608), in particular between the first electrode (606) and the separator layer (610) to allow.

Electronic component (600) according to claim 7, characterized

characterized in that the first electrode (606) and the second

The electrodes (608) differ in their dimensions or are arranged laterally offset from each other, wherein the first electrode (606) forms a lateral projection with respect to the second electrode (608) or the second electrode (608) forms the lateral projection with respect to the first electrode (606). forms, and wherein the filling opening (700) is positioned in a portion of the stack, which is located in the region of the lateral projection.

Electronic component (600) according to claim 8, characterized

characterized in that the electronic component (600) in the

A portion of the stack located in the region of the supernatant, further comprising an electrical contact (1000) for electrically contacting the first electrode (606) or the second electrode (608), wherein the electrical through-contact (1000) is formed to the outside of the first carrier layer (602) to the first electrode (606) or to the second electrode (608) to extend.

0. Manufacturing process (1 100) for producing an electronic

A device (600) for carrying at least one electrical circuit and for storing electrical energy, the manufacturing method (1100) comprising the following steps:

Providing (1 102) a first carrier layer (602) and a second carrier layer (604), a first plate-shaped electrode (606) with a coating of an oxidant (802) or a reducing agent (800) and a second plate-shaped electrode (608) one

Coating of the oxidizing agent (802) or the reducing agent (800); and Plan-parallel positioning (1104) for forming a stack of the first carrier layer (602), the first plate-shaped electrode (606), the second plate-shaped electrode (608) and the second carrier layer (604).