WO2015076637A1 - Apparatus, system, and method for manufacturing touch panel - Google Patents

Apparatus, system, and method for manufacturing touch panel Download PDF

Info

Publication number
WO2015076637A1
WO2015076637A1 PCT/KR2014/011338 KR2014011338W WO2015076637A1 WO 2015076637 A1 WO2015076637 A1 WO 2015076637A1 KR 2014011338 W KR2014011338 W KR 2014011338W WO 2015076637 A1 WO2015076637 A1 WO 2015076637A1
Authority
WO
WIPO (PCT)
Prior art keywords
electrode
touch panel
line
display area
gas
Prior art date
Application number
PCT/KR2014/011338
Other languages
French (fr)
Korean (ko)
Inventor
김영기
박창균
김선명
민경인
박일흥
Original Assignee
주성엔지니어링(주)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주성엔지니어링(주) filed Critical 주성엔지니어링(주)
Publication of WO2015076637A1 publication Critical patent/WO2015076637A1/en

Links

Images

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Definitions

  • the present invention relates to a method for manufacturing a touch panel, and more particularly, to an apparatus, a system, and a method for manufacturing a touch panel attached to a plane of a panel constituting a display device.
  • Flat panel displays are used in various types of electronic products, including mobile phones, tablet PCs, and notebook computers.
  • the flat panel display device includes a liquid crystal display (LCD), a plasma display device (PDP), an organic light emitting display device (OLED), and more recently, an electrophoretic display.
  • LCD liquid crystal display
  • PDP plasma display device
  • OLED organic light emitting display
  • electrophoretic display an electrophoretic display.
  • EPD ELECTROPHORETIC DISPLAY
  • liquid crystal display devices are most widely commercialized due to the advantages of mass production technology, ease of driving means, and high quality.
  • organic light emitting display devices have attracted attention as next generation display devices because they have a high response speed of 1 ms or less and low power consumption.
  • a touch panel that allows a user to directly input information using a finger or a pen has been used as an input device of the display device as described above, replacing a conventional input device such as a mouse or a keyboard.
  • the add-on type touch panel refers to a touch panel which is manufactured independently of the panel and then attached to the plane of the panel.
  • elements constituting the touch panel are formed inside the panel.
  • FIG. 1 is an exemplary view schematically showing a cross section of a conventional add-on type touch panel.
  • FIG. 1 is an exemplary view schematically showing a light blocking layer formed on a non-display area of the touch panel and a line formed on the light blocking layer.
  • the add-on type touch panel is attached to the top of the panel displaying the image in the display device as described above.
  • an X-axis electrode sensor pattern (hereinafter, simply referred to as a 'driving electrode') and an Y-axis electrode sensor pattern using indium tin oxide (ITO) (transparent electrode) are used.
  • ITO indium tin oxide
  • the ITO forming the touch panel may be formed on a glass substrate or a film (hereinafter, simply referred to as the substrate 11).
  • the driving electrode and the receiving electrode are spaced apart using an insulator so that the driving electrode and the receiving electrode are not electrically connected to each other.
  • the line passing through the top or bottom surface of the insulator is called an electrode bridge.
  • the electrode bridge electrically connects the driving electrode portions separated from each other, or electrically connects the receiving electrode portions separated from each other.
  • a driving electrode line or a receiving electrode line connected to the driving electrode or the receiving electrode is formed in the non-display area N of the touch panel.
  • a conventional touch panel will be described by taking the case where the line 14 shown in FIG. 1 is a receiving electrode line.
  • the light blocking layer 12 is formed in the non-display area N to prevent light leakage, and the receiving electrode line 14 is formed on the light blocking layer 12.
  • a line for electrically connecting the receiving electrode 13 formed in the display area M and the receiving electrode line 14 formed in the non-display area N may include a receiving line bridge ( It is called 15).
  • a line for electrically connecting the driving electrode formed in the display area M and the driving electrode line formed in the non-display area N is referred to as a driving line bridge.
  • a driving electrode bridge for electrically connecting the driving electrode parts of the driving electrode formed in the display area M, and electrically receiving the receiving electrode parts of the receiving electrode formed in the display area M;
  • the receiving line bridges 15 connecting the receiving electrode to the receiving electrode line formed in the non-display area N are collectively referred to as a bridge.
  • the electrode bridge and the line bridge are simultaneously formed on the substrate 11 through the same process.
  • the conventional touch panel having the structure as described above has the following problems.
  • ITO formed on a substrate by a physical vapor deposition (PVD) method has poor step coverage, and the electrode bridge, the driving electrode, and the receiving electrode 13 formed of the ITO.
  • the thickness of is 300nm
  • the thickness (B) of the light shielding layer 12 is formed to be 20 ⁇ m or more about 70 times thicker than the electrode bridge.
  • the line bridge 15 is formed by the light blocking layer 12. Since it is formed along the side of, the stable implementation of the line bridge 15 is difficult. Therefore, a disconnection region C may be generated in the line bridge 15 formed along the side surface of the light blocking layer 12.
  • the accuracy of exposure using masking is inferior, and disconnection is likely to occur in the line bridge 15.
  • the etching solution and the light blocking layer may react in the etching process of the ITO for forming the line bridge 15, so that the quality of the line bridge 15 may be degraded.
  • the gas generated on the surface of the light shielding layer may interfere with the formation of the line bridge 15, in this case, to implement the line bridge 15 of even quality It can be difficult to do.
  • a phenomenon in which the light blocking layer is oxidized may occur during a high temperature sputtering process, and this phenomenon may also reduce the quality of the line bridge 15 formed of the ITO.
  • the productivity of the touch panel is only about 20%.
  • the present invention has been proposed to solve the above problems, and to provide a touch panel manufacturing apparatus, a system and a method for forming a bridge by using a transparent transparent oxide as a technical problem.
  • a method of manufacturing a touch panel comprising: forming electrode portions in a display area of a substrate; Forming a light blocking layer on a non-display area of the substrate; Forming an electrode line on the light blocking layer; And forming a line bridge connecting the electrode part and the electrode line by using a conductive transparent oxide.
  • the chamber having a reaction space;
  • a gas injector for injecting a metal raw material and a reactive gas into the fabrication substrate to form a transparent transparent oxide on the fabrication substrate to form a conductive transparent oxide for forming the line bridge connecting the electrode portion and the electrode line.
  • the chamber having a reaction space; Electrode portions formed in the display area, a light blocking layer formed on the non-display area formed outside the display area, an electrode line formed on the light blocking layer, and an electrode formed by an organic metal chemical vapor deposition (MOCVD) method
  • MOCVD organic metal chemical vapor deposition
  • a touch panel manufacturing system including: electrode portions formed in a display area, a light blocking layer formed in a non-display area formed outside the display area, and formed on the light blocking layer.
  • the step coverage of the bridge can be improved, the manufacturing cost of the touch panel can be reduced.
  • the sheet resistance of the bridge formed of a conductive transparent oxide can be reduced, and the transmittance of the bridge can be improved.
  • FIG. 1 is an exemplary view schematically showing a cross section of a conventional add-on type touch panel.
  • FIG. 2 is an exemplary view schematically showing a touch panel manufactured using the touch panel manufacturing method according to the present invention.
  • FIG. 3 is an exemplary view showing in detail the touch panel shown in FIG.
  • FIG. 4 is an exemplary view showing a cross section of the touch panel shown in FIG. 3 in the X-X 'direction.
  • 5a to 5f are exemplary views sequentially illustrating a method of manufacturing a touch panel according to the present invention.
  • FIG. 6 is an exemplary view showing a configuration of a touch panel manufacturing system according to the present invention.
  • FIG. 7 is an exemplary view showing a first touch panel manufacturing apparatus shown in FIG.
  • FIG. 8 is an exemplary view showing a second touch panel manufacturing apparatus shown in FIG.
  • FIG. 2 is an exemplary view schematically showing a touch panel manufactured using the touch panel manufacturing method according to the present invention.
  • the touch panel may be driven by a resistive method or a capacitive method, and the capacitive method may be further classified into a self cap method and a mutual method.
  • the present invention can be used both in the manufacture of a self-cap touch panel and a mutual touch panel, but for the sake of convenience of explanation, the present invention will be described with an example of a mutual touch panel.
  • the mutual touch panel is composed of driving electrodes and receiving electrodes, and whether touch is performed by using sensing signals received from the receiving electrodes by driving pulses sequentially supplied to the driving electrodes. Detect.
  • the touch panel may be used to display an image in various types of display devices such as a liquid crystal display (LCD), an organic light emitting display (OLED), a plasma display display (PDP), and an electrophoretic display (EPD).
  • LCD liquid crystal display
  • OLED organic light emitting display
  • PDP plasma display display
  • EPD electrophoretic display
  • an add-on type there are an add-on type, an in-cell type, a hybrid in-cell type, an on-cell type, and the like.
  • the present invention can be applied to all of the various types of touch panel as described above, hereinafter, for convenience of description, a touch panel manufacturing method according to the present invention will be described using an add-on type touch panel as an example.
  • the add-on type touch panel means a touch panel which is manufactured independently of the panel and then attached to the plane of the panel.
  • the touch panel 100 manufactured as shown in FIG. 2 manufactured using the touch panel manufacturing method according to the present invention is manufactured as an add-on type by using a mutual method, and detects whether a user touches the touch panel. It performs the function.
  • the touch panel 100 includes a display area 110 corresponding to an area where an image is displayed on the panel and a non-display area 160 corresponding to an area where no image is displayed on the panel.
  • driving electrodes 130 and receiving electrodes 120 capable of sensing a touch are formed, and light output from the panel passes through the display area 110.
  • the non-display area 160 is an area covered by the case of the display device and is also referred to as a bezel. As described above, no image is displayed in the non-display area 160, and therefore, light must not leak into the non-display area 160. In order to prevent light from leaking out, a light blocking layer is formed in the non-display area 160.
  • the add-on type touch panel 100 is formed on a transparent glass substrate and then bonded to the panel, so that the light output through the panel can pass.
  • the light blocking layer is formed in the non-display area 160 to block the light.
  • a plurality of receiving electrodes RX 120 are formed in one direction, for example, the horizontal direction of FIG. 2, and the other direction, for example. 2, a plurality of driving electrodes TXs 130 are formed in the vertical direction of FIG. 2.
  • the present invention will be described with an example of a touch panel in which five receiving electrodes 120 and four driving electrodes 130 are formed.
  • the number of the receiving electrodes 120 and the driving electrodes 130 may be variously changed according to the size of the touch panel.
  • the five receiving electrodes 120 are provided in the non-display area 160 of the non-display area 160, for example, the non-display area formed on the left side of the touch panel 100 illustrated in FIG. 2, the five receiving electrodes 120 are provided. Five receiving electrode lines 140 are connected to each other.
  • the four driving electrodes 130 are formed in the non-display area 160b of the non-display area 160, for example, the non-display area formed below the touch panel 100 illustrated in FIG. 2.
  • Four driving electrode lines 150 are formed to be connected to each other, and five receiving electrode lines 140 extend in the second non-display area 160b.
  • a flexible touch panel IC 300 is mounted on each of the ends of the five receiving electrode lines 140 and the four driving electrode lines 150 formed in the second non-display area 160b.
  • a pad 170 is formed to be electrically connected to the flexible printed circuit board (FPCB) 200.
  • the pads 170 formed on the second non-display area 160b and the flexible printed circuit board 200 are electrically connected to each other.
  • the touch panel 100 is bonded to the panel.
  • the touch driver IC 300 includes a receiver 310 and a driver 320.
  • the driving unit 320 performs a function of sequentially supplying driving pulses to the driving electrodes 130.
  • the receiver 310 performs a function of determining whether a touch is generated in the touch panel 100 using the detection signals induced by the driving pulse and received through the receiving electrodes 120. A detailed configuration of the touch panel 100 will be described with reference to FIG. 3.
  • the driving electrodes and the receiving electrodes are collectively referred to as touch electrodes. Accordingly, the touch electrode may be the driving electrode or the receiving electrode.
  • the receiving electrode and the driving electrode may be defined as a first touch electrode and a second touch electrode.
  • the first touch electrode may be a receiving electrode
  • the second touch electrode may be a driving electrode
  • the first touch electrode may be a driving electrode
  • the second touch electrode may be a receiving electrode.
  • the present invention will be described with an example in which the receiving electrode 120 is the first touch electrode and the driving electrode 130 is the second touch electrode.
  • the receiving electrode line 140 and the driving electrode line 150 are collectively called an electrode line. Accordingly, the electrode line may be the receiving electrode line 140 or the driving electrode line 150.
  • the receiving electrode parts 131 forming the receiving electrode 120 as the first touch electrode are called first electrode parts, and the driving electrode part 131 forming the driving electrode 130 as the second touch electrode. ) Are referred to as second electrode portions, and the driving electrode connection portions 132 are referred to as second connection portions.
  • the bridge means at least one of the line bridge and the electrode bridge
  • the line bridge means at least one of the receiving line bridge 140 and the driving line bridge 150.
  • the electrode bridge means at least one of the receiving electrode bridge 121 and the driving electrode bridge.
  • the electrode line means the receiving electrode line or the driving electrode line.
  • the receiving electrode line 140 is the first electrode line
  • the driving electrode line 150 becomes the second electrode line.
  • FIG. 3 is an exemplary view showing the touch panel shown in FIG. 2 in detail
  • FIG. 4 is an exemplary view showing a cross section of the touch panel shown in FIG. F shown in FIG. 4 means the F region shown in FIG. 3, and G shown in FIG. 4 means the G region shown in FIG.
  • the display area 110 of the touch panel 100 As shown in the description and FIG. 3, five receiving electrodes 120 and four driving electrodes 130 are formed.
  • the receiving electrode lines 140 are formed in the first non-display area 160a, and the driving electrode lines 150 and the receiving electrode lines 140 are formed in the second non-display area 160b.
  • the pads 170 are formed.
  • reception electrodes 120 and the driving electrodes 130 formed in the display area 110 are described as follows.
  • the receiving electrode 120 formed in the horizontal direction of the touch panel 100 and the driving electrode 130 formed in the vertical direction of the touch panel 100 should not be electrically connected to each other.
  • the driving electrode 130 and the receiving electrode 120 are spaced apart from each other by using an insulator.
  • the receiving electrode 120 in the region where the receiving electrode 120 and the driving electrode 130 intersect, the receiving electrode 120 to prevent the receiving electrode 120 and the driving electrode 130 from being electrically connected.
  • an electrode bridge may be formed on one of the driving electrodes 130.
  • the electrode bridge may be formed on the receiving electrode 120, and such an electrode bridge is called a receiving electrode bridge.
  • the electrode bridge may be formed on the driving electrode 130, and the electrode bridge is referred to as a driving electrode bridge.
  • each of the receiving electrodes 120 may include five receiving electrode parts 121 and four receiving electrode bridges 122. Include. That is, one receiving electrode 120 is formed of five receiving electrode parts 121, and the five receiving electrode parts 121 are electrically connected by four receiving electrode bridges 122. have.
  • Each of the driving electrodes 130 includes six driving electrode parts 131 and five driving electrode connecting parts 132 electrically connecting the driving electrode parts 131 at the intersection area.
  • the receiving electrode parts 121, the driving electrode parts 131, and the driving electrode connecting parts 132 are formed on the same layer as illustrated in FIG. 4, and the receiving electrode bridge 122 is disposed on the same layer. ) Are spaced apart from each other with the receiving electrode parts 121, the driving electrode parts 131, the driving electrode connecting parts 132, and the insulating layer 191 interposed therebetween.
  • the receiving electrode parts 121, the driving electrode parts 131, and the driving electrode connecting parts 132 may be formed of indium tin oxide (ITO) (hereinafter, simply referred to as “ITO”). Alternatively, it may be formed of a zinc (Zn) -based oxide such as zinc oxide (ZnO) (hereinafter, simply referred to as 'ZnO').
  • ITO indium tin oxide
  • ZnO zinc oxide
  • the receiving electrode parts 121, the driving electrode parts 131, and the driving electrode connecting parts 132 are formed of Zno, the receiving electrode parts 121 and the driving electrode part 131 are formed.
  • the driving electrode connectors 132 may be formed by depositing the ZnO using a metal organic chemical vapor deposition (MOCVD) method (hereinafter, simply referred to as a 'MOCVD method'). Can be.
  • MOCVD metal organic chemical vapor deposition
  • the receiving electrode parts 121, the driving electrode parts 131, and the driving electrode connecting parts 132 are formed on the ZnO film by injecting hydrogen into the ZnO film deposited by the MOCVD method. (Carbon) is formed through the removal of carbon components to remove the components.
  • the electrode bridge 122 is formed of ZnO. That is, the electrode bridge 122 is formed through a carbon component removal process of removing oxygen and carbon components formed on the ZnO film by spraying hydrogen on the ZnO film deposited by the MOCVD method.
  • the receiving electrode lines 140, the driving electrode lines 150, and the pads 170 formed in the first non-display area 160a and the second non-display area 160b are described. Is as follows.
  • a light shielding layer 161 is applied to the first non-display area 160a and the second non-display area 160b to block light transmission as described above and illustrated in FIG. 4.
  • the thickness of the light blocking layer 161 is approximately 20 ⁇ m or more.
  • the light blocking layer 161 may be compared with the receiving electrode part 121. It is 70 times thicker.
  • Receiving electrode lines 140 connected to the receiving electrodes 120 are formed on an upper end of the light blocking layer 161 formed in the first non-display area 160a, and the second non-display
  • the pad 170 connected to the driving electrode line 150 and the driving electrode line 150 connected to the driving electrode 130 is formed at an upper end of the light blocking layer 161 formed in the region 160a. ) Is formed.
  • the receiving electrode line 140 is electrically connected to the receiving electrode 121 and the receiving line bridge 181 forming the receiving electrode 120 corresponding to the receiving electrode line 140. It is.
  • a protective film 192 is coated on the receiving electrode line 140 and the receiving electrode part 121, and a protective film corresponding to the receiving electrode line 140 and the receiving electrode part 121.
  • Contact holes are formed at 192.
  • the receiving line bridge 181 is electrically connected to the receiving electrode line 140 and the receiving electrode unit 121 through the contact hole, so that the receiving electrode line 140 and the receiving electrode unit 121 are connected to each other. Can be electrically connected.
  • the driving electrode line 150 is electrically connected to the driving electrode part 131 forming the driving electrode 130 corresponding to the driving electrode line 150 through the driving line bridge 182.
  • the passivation layer 192 is coated on top of the driving electrode line 150 and the driving electrode part 131, and corresponds to the driving electrode line 150 and the driving electrode part 131.
  • Contact holes are formed in the passivation layer 192.
  • the driving line bridge 182 is electrically connected to the driving electrode line 150 and the driving electrode part 131 through the contact hole, thereby driving the driving electrode line 150 and the driving electrode part 131. Can be electrically connected.
  • the pad 170 may be formed at an end of the driving line bridge 182.
  • the receiving line bridge 181 and the driving line bridge 182 are collectively referred to as line bridges 181 and 182. That is, in the following description, the line bridge may mean the receiving line bridge 181 or the driving line bridge 182. In this case, when the receiving line bridge 181 is the first line bridge, the driving line bridge may be the second line bridge, or vice versa.
  • the line bridges 181 and 182 are formed on the same layer as the electrode bridge 122, as shown in FIG. 4.
  • the line bridges 181 and 182 like the electrode bridges 122, inject hydrogen into a ZnO film deposited by the MOCVD method to form oxygen and carbon components formed in the ZnO film. It is formed through a carbon component removal process to remove the.
  • the receiving line bridge 181, the driving line bridge 182, and the electrode bridge 122 are collectively referred to as a bridge. That is, the bridge may be the line bridge or the electrode bridge.
  • the line bridge may be the receiving line bridge 181 or may be the driving line bridge 182.
  • the electrode bridge may be the receiving electrode bridge or the driving electrode bridge.
  • 5A to 5F are exemplary views sequentially illustrating a method of manufacturing a touch panel according to the present invention.
  • 6 is an exemplary view showing a configuration of a touch panel manufacturing system according to the present invention.
  • FIG. 7 is an exemplary view illustrating a first touch panel manufacturing apparatus shown in FIG. 6.
  • FIG. 8 is an exemplary view illustrating a second touch panel manufacturing apparatus shown in FIG. 6.
  • the touch panel manufacturing method described below is described as an example of the touch panel manufacturing method according to the present invention. Therefore, the manufacturing method of the touch panel according to the present invention may be changed in various forms according to the structure of the touch panel.
  • the receiving electrode parts 121, the driving electrode parts 131, and the driving electrode connecting parts 132 are formed on the substrate 110.
  • the receiving electrode parts 121, the driving electrode parts 131, and the driving electrode connecting parts 132 have a thickness of about 300 nm.
  • the substrate 110 may be a transparent glass substrate, a transparent plastic substrate, or a transparent synthetic resin film.
  • the plastic substrate or the synthetic resin film may be made of any one material of polyimide (PI), polycarbonate (PC), polynorborneen (PNB), polyethyleneterephthalate (PET), polyethylenapthanate (PEN), and polyethersulfone (PES).
  • PI polyimide
  • PC polycarbonate
  • PNB polynorborneen
  • PET polyethyleneterephthalate
  • PEN polyethylenapthanate
  • PES polyethersulfone
  • the receiving electrode parts 121, the driving electrode parts 131, and the driving electrode connecting parts 132 may be formed of ITO.
  • the ITO may be formed on the substrate 111 by a physical vapor deposition (PVD) method (hereinafter, simply referred to as a 'PVD method').
  • PVD physical vapor deposition
  • the PVD method includes sputtering, e-beam evaporation, thermal evaporation, laser molecular beam deposition (L-MBE) and pulsed laser deposition (PLD).
  • the receiving electrode parts 121, the driving electrode parts 131, and the driving electrode connecting parts 132 may be formed on the substrate 111 by the sputtering.
  • the receiving electrode parts 121, the driving electrode parts 131, and the driving electrode connecting parts 132 may be formed of a conductive transparent oxide, for example, a Zn-based oxide such as ZnO.
  • the receiving electrode parts 121, the driving electrode parts 131, and the driving electrode connecting parts 132 may be formed by depositing using the MOCVD method.
  • the receiving electrode parts 121, the driving electrode parts 131, and the driving electrode connecting parts 132 inject hydrogen into a ZnO film deposited by a MOCVD method, thereby forming oxygen formed in the ZnO film. And it may be formed through a carbon component removal process for removing the carbon component (Carbon).
  • a light blocking layer 161 is formed in the non-display area 160.
  • the thickness of the light shielding layer 161 is formed to be approximately 20 ⁇ m or more.
  • the light blocking layer 161 is formed to be at least 70 times thicker than the thicknesses of the receiving electrode parts 121, the driving electrode parts 131, and the driving electrode connecting parts 132.
  • the receiving electrode lines 140 and the driving electrode lines 150 are formed on the light blocking layer 161.
  • five receiving electrode lines 140 are formed in the first non-display area 160a.
  • the receiving electrode lines extend in the second non-display area 160b and four driving electrode lines 150 are formed.
  • the receiving electrode lines 140 and the driving electrode lines 150 are formed on the light blocking layer 161 formed in the non-display area 160, through which light is not transmitted, so that the ITO Or need not be formed of a transparent material such as ZnO. Accordingly, the receiving electrode lines 140 and the driving electrode lines 150 may be formed of various kinds of opaque metal materials having excellent conductivity.
  • the insulating film 191 is applied to the entire surface including the ().
  • the insulating layer 191 may be formed of an insulating material such as PAC or PAS.
  • a plurality of contact holes are formed in the insulating layer 191 using a mask.
  • two contact holes are formed at positions corresponding to each of the receiving electrode parts 121 of the insulating film 191, and the receiving electrode lines 140 and the driving electrode line 150 are formed.
  • One contact hole is formed at a position corresponding to each of the ones, and one contact hole is formed at a position corresponding to the driving electrode portions 131 adjacent to the light blocking layer among the driving electrode portions 131.
  • the contact holes may be formed by a photomask process.
  • the receiving electrode bridge 122, the receiving electrode line 140, and the receiving electrode 121 which connect the two receiving electrode parts 121 spaced apart from each other through the contact holes.
  • the receiving electrode bridge 122, the receiving line bridge 181, and the driving line bridge 182 are formed on the insulating layer 191 through two processes.
  • the first process is performed in the first touch panel manufacturing apparatus 620 as shown in FIGS. 6 and 7.
  • the first touch panel manufacturing apparatus 620 is for forming the bridges 181, 182, and 122 formed in a fine pattern, and a chemical vapor deposition (CVD) method using a metal organic precursor. (Hereinafter, simply referred to as 'CVD method'). That is, the first touch panel manufacturing apparatus 620 uses the CVD method to deposit conductive transparent oxides, for example, Zn-based oxides such as ZnO to form the bridges.
  • conductive transparent oxides for example, Zn-based oxides such as ZnO
  • the present invention will be described by taking the case where the conductive transparent oxide is zinc oxide (ZnO) as an example.
  • the electrode parts may also be formed of the zinc oxide.
  • the first touch panel manufacturing apparatus 620 includes a chamber 621, a substrate support 622, and gas injectors 626 and 623, as shown in FIG. 7.
  • the gas injection unit includes a gas injection unit 623 and a gas supply unit 626, and the gas supply unit 626 includes a first gas supplier 624 and a second gas supplier 625.
  • the first touch panel manufacturing apparatus 620 may be configured in various forms in addition to the form shown in FIG.
  • the substrate 111 may have a first touch panel as illustrated in FIG. 7. It flows into the chamber 621 of the manufacturing apparatus 620 and is placed on the substrate support 622.
  • the metal raw material (Zn-based metal precursor) and the reaction gas are injected onto the substrate 111 through the gas injection unit 623, and thus the bridges 181, 182, and 122 are formed.
  • the second process is performed in the second touch panel manufacturing apparatus 630 as shown in FIG. 8.
  • the second touch panel manufacturing apparatus 630 is ionized with hydrogen (H 2 ) by using a plasma chemical vapor deposition (PECVD) method (hereinafter, simply referred to as 'PECDV').
  • PECVD plasma chemical vapor deposition
  • the hydrogen ions are injected onto the substrate including the bridges 122, 181, and 182 formed using the ZnO.
  • O-H bonding is formed on the surface of the ZnO film by the hydrogen ions, thereby improving sheet resistance of the ZnO film. That is, the oxygen resistance is removed by the carbon component removal process performed by the second touch panel manufacturing apparatus 630, thereby improving the sheet resistance of the ZnO film (bridge).
  • CxHx groups are generated on the surface of the ZnO film.
  • the CxHx group combines with the hydrogen ions to form a substance such as CH 4 during the carbon component removal process.
  • the permeability of the bridges 122, 181, and 182 may be improved. That is, the transmittance of the ZnO film (bridge) may be improved by the carbon component removing process performed by the carbon component removing apparatus 630.
  • the sheet resistance of the ZnO film (bridge) can be improved, and the permeability of the ZnO film can be improved.
  • the substrate 111 on which the bridges 122, 181, and 182 (ZnO) are formed is introduced into the second touch panel manufacturing apparatus 630.
  • the second touch panel manufacturing apparatus 630 ionizes various kinds of gases in which hydrogen (H 2 ) is mixed and introduces the gas into the substrate 111.
  • a passivation layer 192 is formed on an entire surface of the substrate 111 including the bridges 122, 181, and 182.
  • the passivation layer 192 is formed such that an end of the driving line bridge 182 is exposed to the outside.
  • the portion exposed to the outside without being covered by the passivation layer 192 becomes the pad 170.
  • the flexible printed circuit board (FPCB) 200 on which the touch driver IC 300 is mounted is electrically connected to the pad 170.
  • the touch panel 100 to which the flexible printed circuit board 200 is connected is attached to the top of the panel by an adhesive such as OCR (Optically Clear Resin) or an adhesive tape such as OCA (Optically Clear Adhesive).
  • an adhesive such as OCR (Optically Clear Resin) or an adhesive tape such as OCA (Optically Clear Adhesive).
  • OCR Optically Clear Resin
  • OCA Optically Clear Adhesive
  • the electrode parts 121 and 131 in the display area 110 of the substrate and forming the light blocking layer 161 in the non-display areas 160a and 160b of the substrate.
  • the conductive transparent oxide may be zinc oxide (ZnO), and in addition, may be various kinds of Zn-based oxide.
  • the line bridges 181 and 182 may be formed using an organometallic chemical vapor deposition (MOCVD) method.
  • the method for manufacturing a touch panel according to the present invention may further include removing a carbon component generated during the formation of the line bridges 181 and 182 by reacting a gas to the surface of the line bridge.
  • the carbon component may be removed by using a plasma chemical vapor deposition (PECVD) method using hydrogen gas.
  • PECVD plasma chemical vapor deposition
  • the electrode parts 121 and 131 form the first touch electrode 120 and are electrically separated from each other and the first electrode parts 121 that are electrically separated from each other.
  • second electrode parts 131 connected to form the second touch electrode 130, and between the first electrode parts 121 through the same process as that of forming the line bridge 122. Electrode bridges 122 that connect electrically may be formed.
  • the electrode parts 121 and 131 may also be formed using the transparent transparent oxide.
  • the touch panel manufacturing system 600 includes the first touch panel manufacturing apparatus 620 and the second touch panel manufacturing apparatus 630.
  • the first touch panel manufacturing apparatus 620 includes a chamber 621 having a reaction space, electrode portions formed in a display area, and a non-display formed outside the display area.
  • a line supporting the manufacturing substrate 100a including a light blocking layer formed in an area and an electrode line formed on the light blocking layer, and a substrate supporting part 622 disposed in the chamber, and a line connecting the electrode part and the electrode line.
  • a gas injector 623 for injecting a metal raw material and a reactive gas into the fabrication substrate to form conductive transparent oxide (ZnO) on the fabrication substrate to form a bridge.
  • the manufacturing substrate 100a refers to a substrate that has been subjected to the processes of FIGS. 5A to 5D.
  • 5A to 5D described above are performed through a sputtering apparatus for depositing the ITO, an apparatus for forming the insulating layer 191, and apparatuses for forming the contact holes in the insulating layer 191.
  • a sputtering apparatus for depositing the ITO an apparatus for forming the insulating layer 191
  • the gas injection unit includes a gas injection unit 623 and a gas supply unit 626, and the gas supply unit 626 includes a first gas supplier 624 and a second gas supplier 625.
  • the gas supply unit 626 of the gas injection unit may inject a Zn-based metal precursor with the metal raw material and inject an oxygen-containing gas with the reaction gas.
  • the first gas supplier 624 may supply the metal raw material to the gas injection unit 623
  • the second gas supplier 625 may supply the reaction gas to the gas injection unit 623.
  • the gas injector together with the line bridge, serves to inject the metal raw material and the reaction gas to the manufacturing substrate to form electrode bridges electrically connecting the second electrode portions.
  • the first touch panel manufacturing apparatus 620 performs a function of forming the line bridge on the manufacturing substrate by using an organic metal chemical vapor deposition (MOCVD) method. Accordingly, the first touch panel manufacturing apparatus 620 basically includes components included in the apparatuses for performing the organometallic chemical vapor deposition method.
  • MOCVD organic metal chemical vapor deposition
  • the second touch panel manufacturing apparatus 630 includes a chamber 631 having a reaction space, electrode portions formed in the display area, and a non-display formed outside the display area.
  • a manufacturing substrate 100b including a light blocking layer formed in an area, an electrode line formed on the light blocking layer, and a line bridge formed by an organic metal chemical vapor deposition (MOCVD) method to connect the electrode part and the electrode line;
  • a plasma generator for supporting the susceptor 632 disposed in the chamber and the process gas supplied from the gas supply unit 634 by ionizing the plasma by a plasma discharge, and spraying the ionized process gas onto the manufacturing substrate. 633).
  • the plasma generator 633 is electrically connected to an RF (Radio Frequency) power source 635.
  • the manufacturing substrate 100b refers to a substrate that has passed through the first touch panel manufacturing apparatus 620. Therefore, the line bridge 122 is formed on the manufacturing substrate 100b introduced into the second touch panel manufacturing apparatus 620.
  • the process gas may be hydrogen (H 2 ) gas.
  • H 2 hydrogen
  • the ionized process gas is combined with oxygen (O) of a transparent oxide having conductivity to form the line bridge.
  • O oxygen
  • the sheet resistance of the ZnO film can be improved.
  • the ionized process gas is generated during the line bridge formation process and combined with the carbon component formed on the manufacturing substrate.
  • CxHx groups generated on the surface of the ZnO film are combined with the hydrogen ions to form a material such as CH 4.
  • the carbon component may be removed from the ZnO layer to improve the permeability of the bridges 122, 181, and 182.
  • the second touch panel manufacturing apparatus 630 may improve surface resistance and transmittance of the bridge formed of ZnO by treating the substrate by using a plasma chemical vapor deposition (PECVD) method. Accordingly, the second touch panel manufacturing apparatus 630 basically includes components included in devices for performing the plasma chemical vapor deposition method.
  • PECVD plasma chemical vapor deposition
  • the present invention relates to the manufacture of touch panels, in particular, forming bridges 122, 181, and 182 using ZnO, and performing carbon removal processes on the bridges, thereby providing electrical characteristics (resistance or conductivity) of the bridges. ) And optical properties (transmittance).
  • a bridge forming the receiving electrodes and the driving electrodes of the touch panel may be formed using ZnO instead of ITO, and the entirety of the receiving electrodes and the driving electrodes may be formed using the ZnO.
  • the ZnO film (bridge) may be manufactured through the first touch panel manufacturing apparatus 620 using MOCVD, the step coverage of the bridge is improved, thereby improving mass productivity of the touch panel. Can be.
  • ZnO which is cheaper than ITO is used, manufacturing cost of a touch panel may be reduced. According to simulation and experiment results, when the bridge, in particular, the line bridges 181 and 182 and the light shielding layer 161, the step coverage (improved step coverage) can be improved to ensure mass productivity of 90% or more. .
  • the sheet resistance of the bridge can be reduced, the transmittance can be improved.
  • battery consumption may be reduced when driving the display device on which the touch panel is mounted.
  • Simulation and experimental results show that the sheet resistance of the ZnO is reduced by 40-50% by the carbon removal process.
  • the process of improving the characteristics of the ZnO film is performed by the carbon removing process of injecting hydrogen ions into the ZnO film, but annealing the substrate on which the ZnO film is formed at a high temperature.
  • the properties of the ZnO film may be improved.

Abstract

The present invention relates to an apparatus, system, and method for manufacturing a touch panel and, particularly, relates to the technical matter of providing an apparatus, system, and method for manufacturing a touch panel which form a bridge by using a transparent oxide having conductivity. To this end, the method for manufacturing a touch panel according to the present invention comprises the steps of: forming electrode portions on displaying regions of a substrate; forming a light blocking layer on non-displaying regions of the substrate; forming electrode lines on the light blocking layer; and forming a line bridge connecting the electrode portions with the electrode lines by using a transparent oxide having conductivity.

Description

터치패널 제조 장치, 시스템 및 방법Touch panel manufacturing apparatus, system and method
본 발명은 터치패널 제조 방법에 관한 것으로서, 특히, 표시장치를 구성하는 패널의 평면에 부착되는 터치패널을 제조하는 장치, 시스템 및 방법에 관한 것이다. The present invention relates to a method for manufacturing a touch panel, and more particularly, to an apparatus, a system, and a method for manufacturing a touch panel attached to a plane of a panel constituting a display device.
휴대전화, 테블릿PC, 노트북 등을 포함한 다양한 종류의 전자제품에는 평판표시장치(FPD : Flat Panel Display)가 이용되고 있다. 평판표시장치에는, 액정표시장치(LCD : Liquid Crystal Display), 플라즈마 디스플레이 표시장치(PDP : Plasma Display Device), 유기발광표시장치(OLED : Organic Light Emitting Display Device) 등이 있으며, 최근에는 전기영동표시장치(EPD : ELECTROPHORETIC DISPLAY)도 널리 이용되고 있다. Flat panel displays (FPDs) are used in various types of electronic products, including mobile phones, tablet PCs, and notebook computers. The flat panel display device includes a liquid crystal display (LCD), a plasma display device (PDP), an organic light emitting display device (OLED), and more recently, an electrophoretic display. Devices (EPD: ELECTROPHORETIC DISPLAY) are also widely used.
평판표시장치(이하, 간단히 '표시장치'라 함)들 중에서, 액정표시장치는 양산화 기술, 구동 수단의 용이성, 고화질의 구현이라는 장점으로 인하여 현재 가장 널리 상용화되고 있다. Among flat panel display devices (hereinafter, simply referred to as 'display devices'), liquid crystal display devices are most widely commercialized due to the advantages of mass production technology, ease of driving means, and high quality.
표시장치들 중에서, 유기발광표시장치(Organic Light Emitting Display Device)는, 1ms 이하의 고속의 응답속도를 가지며, 소비 전력이 낮기 때문에, 차세대 표시장치로 주목받고 있다.Among the display devices, organic light emitting display devices have attracted attention as next generation display devices because they have a high response speed of 1 ms or less and low power consumption.
최근 들어, 상기한 바와 같은 표시장치의 입력 장치로서 종래에 적용되었던 마우스나 키보드 등의 입력 장치를 대체하여, 사용자가 손가락이나 펜을 이용하여 직접 정보를 입력할 수 있는 터치패널이 이용되고 있다. Recently, a touch panel that allows a user to directly input information using a finger or a pen has been used as an input device of the display device as described above, replacing a conventional input device such as a mouse or a keyboard.
표시장치에서 영상을 표시하는 패널에, 상기 터치패널을 구성하는 방법으로는, 애드 온(Add-on) 타입 및 인 셀 타입(In-Cell Type) 등이 있다.As a method of configuring the touch panel on a panel displaying an image in a display device, there are an add-on type and an in-cell type.
이 중 애드 온 타입 터치패널은, 상기 패널과 독립적으로 제조된 후, 상기 패널의 평면에 부착되는 터치패널을 말한다. 또한, 상기 인 셀 타입 터치패널에서는, 상기 터치패널을 구성하는 요소들이 상기 패널 내부에 형성된다.Among these, the add-on type touch panel refers to a touch panel which is manufactured independently of the panel and then attached to the plane of the panel. In the in-cell type touch panel, elements constituting the touch panel are formed inside the panel.
도 1은 종래의 애드 온 타입 터치패널의 단면을 개략적으로 나타낸 예시도로서, 특히, 상기 터치패널의 비표시영역에 형성된 차광층과, 상기 차광층에 형성된 라인을 개략적으로 나타낸 예시도이다. FIG. 1 is an exemplary view schematically showing a cross section of a conventional add-on type touch panel. In particular, FIG. 1 is an exemplary view schematically showing a light blocking layer formed on a non-display area of the touch panel and a line formed on the light blocking layer.
애드 온 타입 터치패널은, 상기한 바와 같이, 표시장치에서 영상을 표시하는 패널의 위에 부착된다.The add-on type touch panel is attached to the top of the panel displaying the image in the display device as described above.
첫째, 상기 터치패널의 표시영역(M)에는, ITO(Indium Tin Oxide)(투명전극)를 이용하여 X축 전극 센서 패턴(이하, 간단히 '구동전극'이라 함)과, Y축 전극 센서 패턴(이하, 간단히 '수신전극'이라 함)이 형성되어 있다. 상기 터치패널을 형성하는 상기 ITO는, 유리기판(Glass) 또는 필름 등(이하, 간단히 '기판(11)'이라 함)에 형성될 수 있다. First, in the display area M of the touch panel, an X-axis electrode sensor pattern (hereinafter, simply referred to as a 'driving electrode') and an Y-axis electrode sensor pattern using indium tin oxide (ITO) (transparent electrode) are used. Hereinafter, simply referred to as a 'receiving electrode'. The ITO forming the touch panel may be formed on a glass substrate or a film (hereinafter, simply referred to as the substrate 11).
상기 터치패널에서, 상기 구동전극과 상기 수신전극이 서로 전기적으로 연결되지 않도록, 절연체를 이용하여 상기 구동전극과 상기 수신전극이 이격되어 있다. 이 경우, 상기 절연체의 상단면 또는 하단면을 지나가는 라인은, 전극브릿지(Bridge)라 한다. 상기 전극브릿지(Bridge)는 서로 분리되어 있는 구동전극부들을 전기적으로 연결시키거나, 또는 서로 분리되어 있는 수신전극부들을 전기적으로 연결시키는 기능을 수행한다. In the touch panel, the driving electrode and the receiving electrode are spaced apart using an insulator so that the driving electrode and the receiving electrode are not electrically connected to each other. In this case, the line passing through the top or bottom surface of the insulator is called an electrode bridge. The electrode bridge electrically connects the driving electrode portions separated from each other, or electrically connects the receiving electrode portions separated from each other.
둘째, 상기 터치패널의 비표시영역(N)에는, 도 1에 도시된 바와 같이, 상기 구동전극 또는 수신전극과 연결되어 있는 구동전극라인 또는 수신전극라인이 형성되어 있다. 이하에서는, 도 1에 도시된 라인(14)이 수신전극라인인 경우를 일예로 하여 종래의 터치패널이 설명된다. Second, as shown in FIG. 1, a driving electrode line or a receiving electrode line connected to the driving electrode or the receiving electrode is formed in the non-display area N of the touch panel. Hereinafter, a conventional touch panel will be described by taking the case where the line 14 shown in FIG. 1 is a receiving electrode line.
상기 비표시영역(N)에는 빛샘 방지를 위해, 차광층(12)이 형성되어 있으며, 상기 수신전극라인(14)은 상기 차광층(12)에 형성된다.The light blocking layer 12 is formed in the non-display area N to prevent light leakage, and the receiving electrode line 14 is formed on the light blocking layer 12.
이 경우, 상기 표시영역(M)에 형성되어 있는 상기 수신전극(13)과 상기 비표시영역(N)에 형성되어 있는 상기 수신전극라인(14)을 전기적으로 연결시키기 위한 라인은 수신라인브릿지(15)라 한다. 또한, 상기 표시영역(M)에 형성되어 있는 상기 구동전극과 상기 비표시영역(N)에 형성되어 있는 상기 구동전극라인을 전기적으로 연결시키기 위한 라인은 구동라인브릿지라 한다.In this case, a line for electrically connecting the receiving electrode 13 formed in the display area M and the receiving electrode line 14 formed in the non-display area N may include a receiving line bridge ( It is called 15). In addition, a line for electrically connecting the driving electrode formed in the display area M and the driving electrode line formed in the non-display area N is referred to as a driving line bridge.
상기 표시영역(M)에 형성되어 있는 상기 구동전극을 구성하는 구동전극부들을 전기적으로 연결시키는 구동전극브릿지, 상기 표시영역(M)에 형성되어 있는 상기 수신전극을 구성하는 수신전극부들을 전기적으로 연결시키는 수신전극브릿지, 상기 표시영역(M)에 형성되어 있는 상기 구동전극을 상기 비표시영역(N)에 형성되어 있는 상기 구동전극라인과 연결시키는 구동라인브릿지 및 상기 표시영역(M)에 형성되어 있는 상기 수신전극을 상기 비표시영역(N)에 형성되어 있는 상기 수신전극라인과 연결시키는 수신라인브릿지(15)들을 총칭하여, 브릿지라 한다. A driving electrode bridge for electrically connecting the driving electrode parts of the driving electrode formed in the display area M, and electrically receiving the receiving electrode parts of the receiving electrode formed in the display area M; A receiving electrode bridge to be connected, and a driving line bridge to connect the driving electrode formed in the display area M to the driving electrode line formed in the non-display area N and the display area M. The receiving line bridges 15 connecting the receiving electrode to the receiving electrode line formed in the non-display area N are collectively referred to as a bridge.
일반적으로 상기 전극브릿지 및 상기 라인브릿지는, 동일한 공정을 통해, 상기 기판(11)에 동시에 형성된다. Generally, the electrode bridge and the line bridge are simultaneously formed on the substrate 11 through the same process.
상기한 바와 같은 구조로 구성되어 있는 종래의 터치패널은 다음과 같은 문제점을 가지고 있다. The conventional touch panel having the structure as described above has the following problems.
일반적으로 물리 기상 증착(physical vapor deposition, PVD) 방법에 의해 기판에 형성되는 ITO는 스텝 커버리지(step coverage)가 좋지 않고, 상기 ITO로 형성되는 상기 전극브릿지, 상기 구동전극 및 상기 수신전극(13)의 두께는 300㎚이며, 상기 차광층(12)의 두께(B)는 상기 전극브릿지 보다 70배 정도 두꺼운 20㎛ 이상으로 형성된다. In general, ITO formed on a substrate by a physical vapor deposition (PVD) method has poor step coverage, and the electrode bridge, the driving electrode, and the receiving electrode 13 formed of the ITO. The thickness of is 300nm, the thickness (B) of the light shielding layer 12 is formed to be 20㎛ or more about 70 times thicker than the electrode bridge.
따라서, 종래의 터치패널 제조를 위해, 상기 ITO를 이용하여, 상기 라인브릿지(15)를 형성하는 경우, 상기 라인브릿지(15)와 상기 차광층(12) 위에 형성되어 있는 상기 전극라인(14)이 전기적으로 잘 연결되지 않는다. Therefore, in the conventional touch panel manufacturing, when the line bridge 15 is formed by using the ITO, the electrode line 14 formed on the line bridge 15 and the light shielding layer 12. This is not electrically connected well.
부연하여 설명하면, 상기 라인브릿지(15) 형성을 위해, PVD 공법에 의해 상기 ITO가 스퍼터링(Sputtering)될 때, 도 1에 도시된 바와 같이, 상기 라인브릿지(15)가 상기 차광층(12)의 옆면을 타고 형성되기 때문에, 상기 라인브릿지(15)의 안정적 구현이 어렵다. 따라서, 상기 차광층(12)의 옆면을 따라 형성되는 상기 라인브릿지(15)에 단선영역(C)이 발생될 수 있다. In detail, when the ITO is sputtered by the PVD method to form the line bridge 15, as shown in FIG. 1, the line bridge 15 is formed by the light blocking layer 12. Since it is formed along the side of, the stable implementation of the line bridge 15 is difficult. Therefore, a disconnection region C may be generated in the line bridge 15 formed along the side surface of the light blocking layer 12.
특히, 상기 차광층(12)과 상기 기판(11)의 단차로 인해, 마스킹을 이용한 노광의 정밀도가 떨어져, 상기 라인브릿지(15)에서 단선이 발생될 가능성이 높다. In particular, due to the step difference between the light shielding layer 12 and the substrate 11, the accuracy of exposure using masking is inferior, and disconnection is likely to occur in the line bridge 15.
또한, 상기 라인브릿지(15) 형성을 위한 상기 ITO의 에칭 공정에서 에칭용액과 상기 차광층이 반응하여, 상기 라인브릿지(15)의 품질이 저하될 수 있다. 또한, 상기 ITO를 이용한 고온의 스퍼터링 공정시, 상기 차광층 표면에서 발생된 가스가, 상기 라인브릿지(15)의 형성을 방해할 수 있으며, 이 경우, 고른 품질의 상기 라인브릿지(15)를 구현하는 것이 어려워질 수 있다. 또한, 고온의 스퍼터링 공정시, 상기 차광층이 산화하는 현상이 발생될 수 있으며, 이러한 현상 역시, 상기 ITO로 형성되는 상기 라인브릿지(15)의 품질을 저하시킬 수 있다. In addition, the etching solution and the light blocking layer may react in the etching process of the ITO for forming the line bridge 15, so that the quality of the line bridge 15 may be degraded. In addition, during the high-temperature sputtering process using the ITO, the gas generated on the surface of the light shielding layer may interfere with the formation of the line bridge 15, in this case, to implement the line bridge 15 of even quality It can be difficult to do. In addition, a phenomenon in which the light blocking layer is oxidized may occur during a high temperature sputtering process, and this phenomenon may also reduce the quality of the line bridge 15 formed of the ITO.
상기한 바와 같은 원인에 의해, 종래의 터치패널의 불량률이 증가되고 있으며, 이에 따라, 상기 터치패널의 생산단가 역시 증가되고 있다. Due to the above causes, the defective rate of the conventional touch panel is increasing, and accordingly, the production cost of the touch panel is also increasing.
특히, 화이트 베젤(white bezel)을 사용하는 핸드폰에 적용되는 터치패널에 형성되는 상기 차광층의 두께는, 60㎛ 이상으로 높게 형성되기 때문에, 터치패널의 생산성이 20% 정도에 불과하다.In particular, since the thickness of the light shielding layer formed on the touch panel applied to the mobile phone using a white bezel is formed to be 60 μm or more, the productivity of the touch panel is only about 20%.
본 발명은 상술한 문제점을 해결하기 위해 제안된 것으로서, 전도성을 가진 투명한 산화물을 이용하여 브릿지를 형성하는, 터치패널 제조 장치, 시스템 및 방법을 제공하는 것을 기술적 과제로 한다.The present invention has been proposed to solve the above problems, and to provide a touch panel manufacturing apparatus, a system and a method for forming a bridge by using a transparent transparent oxide as a technical problem.
상술한 기술적 과제를 달성하기 위한 본 발명에 따른 터치패널 제조 방법은, 기판의 표시영역에 전극부들을 형성하는 단계; 상기 기판의 비표시영역에 차광층을 형성하는 단계; 상기 차광층 상에 전극라인을 형성하는 단계; 및 전도성을 가진 투명한 산화물을 이용하여, 상기 전극부와 상기 전극라인을 연결하는 라인브릿지를 형성하는 단계를 포함한다. According to an aspect of the present invention, there is provided a method of manufacturing a touch panel, the method comprising: forming electrode portions in a display area of a substrate; Forming a light blocking layer on a non-display area of the substrate; Forming an electrode line on the light blocking layer; And forming a line bridge connecting the electrode part and the electrode line by using a conductive transparent oxide.
상술한 기술적 과제를 달성하기 위한 본 발명에 따른 터치패널 제조 장치는, 반응 공간을 갖는 챔버; 표시영역에 형성되어 있는 전극부들, 상기 표시영역의 외곽에 형성되는 비표시영역에 형성된 차광층과, 상기 차광층 상에 형성된 전극라인을 포함하는 제조기판을 지지하며, 상기 챔버 내부에 배치되는 기판 지지부; 상기 전극부와 상기 전극라인을 연결하는 라인브릿지를 형성하기 위한, 전도성을 가진 투명한 산화물을, 상기 제조기판 상에 형성하기 위해, 금속 원료 물질과 반응 가스를 상기 제조기판으로 분사시키는 가스 분사부를 포함한다.Touch panel manufacturing apparatus according to the present invention for achieving the above technical problem, the chamber having a reaction space; A substrate supporting a manufacturing substrate including electrode parts formed in the display area, a light blocking layer formed on a non-display area formed outside the display area, and an electrode line formed on the light blocking layer, Support; And a gas injector for injecting a metal raw material and a reactive gas into the fabrication substrate to form a transparent transparent oxide on the fabrication substrate to form a conductive transparent oxide for forming the line bridge connecting the electrode portion and the electrode line. do.
상술한 기술적 과제를 달성하기 위한 본 발명에 따른 또 다른 터치패널 제조 장치는, 반응 공간을 갖는 챔버; 표시영역에 형성되어 있는 전극부들, 상기 표시영역의 외곽에 형성되는 비표시영역에 형성된 차광층, 상기 차광층 상에 형성된 전극라인과, 유기 금속 화학 기상 증착(MOCVD) 방법에 의해 형성되어 상기 전극부와 상기 전극라인을 연결하는 라인브릿지를 포함하는 제조기판을 지지하며, 상기 챔버 내부에 배치되는 서셉터; 및 가스 공급부에서 공급되는 공정 가스를 플라즈마 방전에 의해 이온화시켜, 이온화된 공정 가스를 상기 제조기판 상에 분사시키는 플라즈마 생성부를 포함한다.Another touch panel manufacturing apparatus according to the present invention for achieving the above technical problem, the chamber having a reaction space; Electrode portions formed in the display area, a light blocking layer formed on the non-display area formed outside the display area, an electrode line formed on the light blocking layer, and an electrode formed by an organic metal chemical vapor deposition (MOCVD) method A susceptor supporting a manufacturing substrate including a line bridge connecting a part and the electrode line to the inside of the chamber; And a plasma generating unit which ionizes the process gas supplied from the gas supply unit by plasma discharge and injects the ionized process gas onto the manufacturing substrate.
상술한 기술적 과제를 달성하기 위한 본 발명에 따른 터치패널 제조 시스템은, 표시영역에 형성되어 있는 전극부들, 상기 표시영역의 외곽에 형성되는 비표시영역에 형성된 차광층과, 상기 차광층 상에 형성된 전극라인을 포함하는 제조기판 상에, 상기 전극부와 상기 전극라인을 연결하는 라인브릿지로 이용될 전도성을 가진 투명한 산화물을 형성하기 위해, 금속 원료 물질과 반응 가스를 상기 제조기판으로 분사시키는 제1터치패널 제조 장치; 및 가스 공급부에서 공급되는 공정 가스를 플라즈마 방전에 의해 이온화시켜, 이온화된 공정 가스를, 상기 제1터치패널 제조장치로부터 배출된 상기 제조기판 상에 분사시키는 제2터치패널 제조 장치를 포함한다.According to an aspect of the present invention, there is provided a touch panel manufacturing system including: electrode portions formed in a display area, a light blocking layer formed in a non-display area formed outside the display area, and formed on the light blocking layer. A first material for injecting a metal raw material and a reactive gas to the manufacturing substrate to form a transparent oxide having a conductivity to be used as a line bridge connecting the electrode portion and the electrode line on the manufacturing substrate including an electrode line. Touch panel manufacturing apparatus; And a second touch panel manufacturing apparatus which ionizes the process gas supplied from the gas supply unit by plasma discharge, and injects the ionized process gas onto the manufacturing substrate discharged from the first touch panel manufacturing apparatus.
본 발명에 의하면, 전도성을 가진 투명한 산화물을 이용하여 브릿지가 형성됨으로써, 상기 브릿지의 스텝 커버리지가 개선될 수 있으며, 터치패널의 제조 비용이 절감될 수 있다.According to the present invention, by forming a bridge using a conductive transparent oxide, the step coverage of the bridge can be improved, the manufacturing cost of the touch panel can be reduced.
또한, 본 발명에 의하면, 상기 브릿지가 형성된 기판을 수소 이온으로 처리함으로써, 전도성을 가진 투명한 산화물로 형성된 상기 브릿지의 면저항이 감소될 수 있으며, 상기 브릿지의 투과율이 개선될 수 있다. Further, according to the present invention, by treating the substrate on which the bridge is formed with hydrogen ions, the sheet resistance of the bridge formed of a conductive transparent oxide can be reduced, and the transmittance of the bridge can be improved.
도 1은 종래의 애드 온 타입 터치패널의 단면을 개략적으로 나타낸 예시도.1 is an exemplary view schematically showing a cross section of a conventional add-on type touch panel.
도 2는 본 발명에 따른 터치패널 제조 방법을 이용하여 제조된 터치패널을 개략적으로 나타낸 예시도. 2 is an exemplary view schematically showing a touch panel manufactured using the touch panel manufacturing method according to the present invention.
도 3은 도 2에 도시된 터치패널을 상세히 나타낸 예시도.3 is an exemplary view showing in detail the touch panel shown in FIG.
도 4는 도 3에 도시된 터치패널을 X-X'방향으로 절단시킨 단면을 나타낸 예시도. 4 is an exemplary view showing a cross section of the touch panel shown in FIG. 3 in the X-X 'direction.
도 5a 내지 도 5f는 본 발명에 따른 터치패널 제조 방법을 순차적으로 나타낸 예시도.5a to 5f are exemplary views sequentially illustrating a method of manufacturing a touch panel according to the present invention.
도 6은 본 발명에 따른 터치패널 제조 시스템의 구성을 나타낸 예시도. 6 is an exemplary view showing a configuration of a touch panel manufacturing system according to the present invention.
도 7은 도 6에 도시된 제1터치패널 제조 장치를 나타낸 예시도.7 is an exemplary view showing a first touch panel manufacturing apparatus shown in FIG.
도 8은 도 6에 도시된 제2터치패널 제조 장치를 나타낸 예시도.8 is an exemplary view showing a second touch panel manufacturing apparatus shown in FIG.
이하, 첨부된 도면을 참조하여 본 발명의 실시 예에 대해 상세히 설명한다.Hereinafter, with reference to the accompanying drawings will be described in detail an embodiment of the present invention.
도 2는 본 발명에 따른 터치패널 제조 방법을 이용하여 제조된 터치패널을 개략적으로 나타낸 예시도이다. 2 is an exemplary view schematically showing a touch panel manufactured using the touch panel manufacturing method according to the present invention.
터치패널을 구동하는 방법은, 저항 방식과 정전용량 방식이 있으며, 상기 정전용량 방식은 다시 셀프캡(Self Cap) 방식과 뮤추얼(Mutual) 방식으로 구분될 수 있다. 본 발명은 셀프캡 방식의 터치패널 및 뮤추얼 방식의 터치패널의 제조에 모두 이용될 수 있으나, 이하에서는, 설명의 편의상, 뮤추얼 방식의 터치패널을 일예로 하여 본 발명이 설명된다. 여기서, 뮤추얼 방식의 터치패널은, 구동전극들과 수신전극들로 구성되며, 상기 구동전극들로 순차적으로 공급된 구동펄스에 의해, 상기 수신전극들로부터 수신되는 감지신호들을 이용하여, 터치여부를 감지하는 기능을 수행한다. The touch panel may be driven by a resistive method or a capacitive method, and the capacitive method may be further classified into a self cap method and a mutual method. The present invention can be used both in the manufacture of a self-cap touch panel and a mutual touch panel, but for the sake of convenience of explanation, the present invention will be described with an example of a mutual touch panel. Here, the mutual touch panel is composed of driving electrodes and receiving electrodes, and whether touch is performed by using sensing signals received from the receiving electrodes by driving pulses sequentially supplied to the driving electrodes. Detect.
또한, 액정표시장치(LCD), 유기발광표시장치(OLED), 플라즈마 디스플레이 표시장치(PDP) 및 전기영동표시장치(EPD)와 같은 다양한 종류의 표시장치에서 영상을 표시하는 패널에, 상기 터치패널을 구성하는 방법으로는, 애드 온(Add-on) 타입, 인 셀 타입(In-Cell Type), 하이브리드 인 셀 타입 및 온 셀 타입(On-Cell Type) 등이 있다. 본 발명은 상기한 바와 같은 다양한 타입의 터치패널에 모두 적용될 수 있으나, 이하에서는, 설명의 편의상 애드 온(Add-on) 타입의 터치패널을 일예로 하여 본 발명에 따른 터치패널 제조 방법이 설명된다. 여기서, 애드 온 타입의 터치패널이란, 상기 패널과 독립적으로 제조된 후, 상기 패널의 평면에 부착되어 이용되는 터치패널을 의미한다.In addition, the touch panel may be used to display an image in various types of display devices such as a liquid crystal display (LCD), an organic light emitting display (OLED), a plasma display display (PDP), and an electrophoretic display (EPD). As a method of configuring the PDU, there are an add-on type, an in-cell type, a hybrid in-cell type, an on-cell type, and the like. The present invention can be applied to all of the various types of touch panel as described above, hereinafter, for convenience of description, a touch panel manufacturing method according to the present invention will be described using an add-on type touch panel as an example. . Here, the add-on type touch panel means a touch panel which is manufactured independently of the panel and then attached to the plane of the panel.
즉, 본 발명에 따른 터치패널 제조 방법을 이용하여 제조된, 도 2에 도시된 바와 같은 터치패널(100)은, 뮤추얼 방식을 이용하여, 애드 온 타입으로 제조된 것으로서, 사용자의 터치여부를 감지하는 기능을 수행한다.That is, the touch panel 100 manufactured as shown in FIG. 2 manufactured using the touch panel manufacturing method according to the present invention is manufactured as an add-on type by using a mutual method, and detects whether a user touches the touch panel. It performs the function.
상기 터치패널(100)은, 상기 패널에서 영상이 표시되는 영역에 대응되는 표시영역(110) 및 상기 패널에서 영상이 표시되지 않는 영역에 대응되는 비표시영역(160)을 포함한다.The touch panel 100 includes a display area 110 corresponding to an area where an image is displayed on the panel and a non-display area 160 corresponding to an area where no image is displayed on the panel.
상기 표시영역(110)에는 터치를 감지할 수 있는 구동전극(130)들 및 수신전극(120)들이 형성되어 있으며, 상기 패널로부터 출력된 빛은 상기 표시영역(110)을 통과한다.In the display area 110, driving electrodes 130 and receiving electrodes 120 capable of sensing a touch are formed, and light output from the panel passes through the display area 110.
상기 비표시영역(160)은 표시장치의 케이스에 의해 커버되는 영역으로서, 베젤(Bezell)이라고도 한다. 상기 비표시영역(160)으로는 상기한 바와 같이 영상이 표시되지 않으며, 따라서, 상기 비표시영역(160)으로는 빛이 새어나가서는 안된다. 빛이 새어나가는 것을 방지하기 위해, 상기 비표시영역(160)에는 차광층이 형성된다. The non-display area 160 is an area covered by the case of the display device and is also referred to as a bezel. As described above, no image is displayed in the non-display area 160, and therefore, light must not leak into the non-display area 160. In order to prevent light from leaking out, a light blocking layer is formed in the non-display area 160.
예를 들어, 상기 애드 온 타입의 터치패널(100)은, 투명한 유리기판 등에 형성된 후 상기 패널에 합착되기 때문에, 상기 패널을 통해 출력된 빛을 통과시킬 수 있다. 그러나, 상기 비표시영역(160)에서는 상기 패널을 통해 출력된 빛이 통과되어서는 안되기 때문에, 상기 비표시영역(160)에는 상기 차광층이 형성되어, 빛을 차단시킨다. For example, the add-on type touch panel 100 is formed on a transparent glass substrate and then bonded to the panel, so that the light output through the panel can pass. However, since the light output through the panel should not pass through the non-display area 160, the light blocking layer is formed in the non-display area 160 to block the light.
상기 터치패널(100)의 상기 표시영역(110)에서, 일측 방향, 예를 들어, 도 2의 가로 방향으로는 복수의 수신전극(RX)(120)들이 형성되어 있으며, 타측 방향, 예를 들어, 도 2의 세로 방향으로는 복수의 구동전극(TX)(130)들이 형성되어 있다. 이하에서는 설명의 편의상, 다섯 개의 수신전극(120)들 및 네 개의 구동전극(130)들이 형성되어 있는 터치패널을 일예로 하여 본 발명이 설명된다. 그러나, 상기 수신전극(120)들 및 상기 구동전극(130)들의 갯수는, 상기 터치패널의 크기 등에 따라 다양하게 변경될 수 있다. In the display area 110 of the touch panel 100, a plurality of receiving electrodes RX 120 are formed in one direction, for example, the horizontal direction of FIG. 2, and the other direction, for example. 2, a plurality of driving electrodes TXs 130 are formed in the vertical direction of FIG. 2. Hereinafter, for convenience of description, the present invention will be described with an example of a touch panel in which five receiving electrodes 120 and four driving electrodes 130 are formed. However, the number of the receiving electrodes 120 and the driving electrodes 130 may be variously changed according to the size of the touch panel.
상기 비표시영역(160) 중 제1비표시영역(160a), 예를 들어, 도 2에 도시된 터치패널(100)의 좌측에 형성되어 있는 비표시영역에는, 상기 다섯 개의 수신전극(120)들과 연결되어 있는 다섯 개의 수신전극라인(140)들이 형성되어 있다. 상기 비표시영역(160) 중 제2비표시영역(160b), 예를 들어, 도 2에 도시된 터치패널(100)의 하측에 형성되어 있는 비표시영역에는, 상기 네 개의 구동전극(130)들과 연결되어 있는 네 개의 구동전극라인(150)들이 형성되어 있으며, 상기 제2비표시영역(160b)에는 다섯 개의 상기 수신전극라인(140)들이 연장되어 있다. In the non-display area 160 of the non-display area 160, for example, the non-display area formed on the left side of the touch panel 100 illustrated in FIG. 2, the five receiving electrodes 120 are provided. Five receiving electrode lines 140 are connected to each other. The four driving electrodes 130 are formed in the non-display area 160b of the non-display area 160, for example, the non-display area formed below the touch panel 100 illustrated in FIG. 2. Four driving electrode lines 150 are formed to be connected to each other, and five receiving electrode lines 140 extend in the second non-display area 160b.
상기 제2비표시영역(160b)에 형성되어 있는 다섯 개의 상기 수신전극라인(140)들과 네 개의 상기 구동전극라인(150)들의 끝단들 각각에는, 터치 드라이버 IC(300)가 장착되어 있는 플렉서블 인쇄회로기판(FPCB : Flexible Printed Circuit Board)(200)과 전기적으로 연결되는 패드(170)가 형성되어 있다. On each of the ends of the five receiving electrode lines 140 and the four driving electrode lines 150 formed in the second non-display area 160b, a flexible touch panel IC 300 is mounted. A pad 170 is formed to be electrically connected to the flexible printed circuit board (FPCB) 200.
예를 들어, 상기 터치패널(100)이 제조되면, 상기 제2비표시영역(160b)에 형성되어 있는 상기 패드(170)들과, 상기 플렉서블 인쇄회로기판(200)이 전기적으로 연결되며, 상기 터치패널(100)은 상기 패널과 합착된다.For example, when the touch panel 100 is manufactured, the pads 170 formed on the second non-display area 160b and the flexible printed circuit board 200 are electrically connected to each other. The touch panel 100 is bonded to the panel.
상기 터치 드라이버 IC(300)는, 수신부(310)와 구동부(320)를 포함한다. 상기 구동부(320)는 상기 구동전극(130)들에 순차적으로 구동펄스를 공급하는 기능을 수행한다. 상기 수신부(310)는, 상기 구동펄스에 의해 유도되어 상기 수신전극(120)들을 통해 수신되는 감지신호들을 이용하여 상기 터치패널(100)에서의 터치발생여부를 판단하는 기능을 수행한다. 상기 터치패널(100)의 세부 구성은, 도 3을 참조하여 설명된다.The touch driver IC 300 includes a receiver 310 and a driver 320. The driving unit 320 performs a function of sequentially supplying driving pulses to the driving electrodes 130. The receiver 310 performs a function of determining whether a touch is generated in the touch panel 100 using the detection signals induced by the driving pulse and received through the receiving electrodes 120. A detailed configuration of the touch panel 100 will be described with reference to FIG. 3.
상기에서 설명된 용어들 및 이하에서 설명될 용어들을 정의하면 다음과 같다.The terms described above and terms to be described below are defined as follows.
첫째, 상기 구동전극들과 수신전극들을 총칭하여 터치전극이라 한다. 따라서, 상기 터치전극은 상기 구동전극이 될 수도 있으며, 상기 수신전극이 될 수도 있다. First, the driving electrodes and the receiving electrodes are collectively referred to as touch electrodes. Accordingly, the touch electrode may be the driving electrode or the receiving electrode.
둘째, 상기 수신전극과 상기 구동전극의 구분이 필요한 경우, 상기 수신전극과 상기 구동전극은, 제1터치전극과 제2터치전극으로 정의될 수 있다. 이 경우, 상기 제1터치전극이 수신전극이되고, 상기 제2터치전극이 구동전극이 될 수 있으며, 상기 제1터치전극이 구동전극이되고, 상기 제2터치전극이 수신전극이 될 수도 있다. 이하에서는, 설명의 편의상, 상기 수신전극(120)이 제1터치전극이며, 상기 구동전극(130)이 제2터치전극인 경우를 일예로 하여 본 발명이 설명된다. Second, when it is necessary to distinguish between the receiving electrode and the driving electrode, the receiving electrode and the driving electrode may be defined as a first touch electrode and a second touch electrode. In this case, the first touch electrode may be a receiving electrode, the second touch electrode may be a driving electrode, the first touch electrode may be a driving electrode, and the second touch electrode may be a receiving electrode. . Hereinafter, for convenience of description, the present invention will be described with an example in which the receiving electrode 120 is the first touch electrode and the driving electrode 130 is the second touch electrode.
셋째, 상기 수신전극라인(140)과 상기 구동전극라인(150)을 총칭하여 전극라인이라 한다. 따라서, 상기 전극라인은 상기 수신전극라인(140)이 될 수도 있으며, 상기 구동전극라인(150)이 될 수도 있다. Third, the receiving electrode line 140 and the driving electrode line 150 are collectively called an electrode line. Accordingly, the electrode line may be the receiving electrode line 140 or the driving electrode line 150.
넷째, 제1터치전극인 상기 수신전극(120)을 형성하는 수신전극부(131)들은 제1전극부들이라 하며, 제2터치전극인 상기 구동전극(130)을 형성하는 상기 구동전극부(131)들은 제2전극부들이라 하며, 상기 구동전극부 연결부(132)들은 제2연결부들이라 한다. Fourth, the receiving electrode parts 131 forming the receiving electrode 120 as the first touch electrode are called first electrode parts, and the driving electrode part 131 forming the driving electrode 130 as the second touch electrode. ) Are referred to as second electrode portions, and the driving electrode connection portions 132 are referred to as second connection portions.
다섯째, 상기 브릿지는, 상기 라인브릿지 또는 상기 전극브릿지 중 적어도 어느 하나를 의미하고, 상기 라인브릿지는, 상기 수신라인브릿지(140)와 상기 구동라인브릿지(150) 중 적어도 어느 하나를 의미하며, 상기 전극브릿지는, 상기 수신전극브릿지(121) 또는 상기 구동전극브릿지 중 적어도 어느 하나를 의미한다. Fifth, the bridge means at least one of the line bridge and the electrode bridge, and the line bridge means at least one of the receiving line bridge 140 and the driving line bridge 150. The electrode bridge means at least one of the receiving electrode bridge 121 and the driving electrode bridge.
여섯째, 상기 전극라인은 상기 수신전극라인 또는 상기 구동전극라인을 의미하며, 상기 수신전극라인(140)이 제1전극라인인 경우, 상기 구동전극라인(150)은 제2전극라인이 된다. Sixth, the electrode line means the receiving electrode line or the driving electrode line. When the receiving electrode line 140 is the first electrode line, the driving electrode line 150 becomes the second electrode line.
도 3은 도 2에 도시된 터치패널을 상세히 나타낸 예시도이며, 도 4는 도 3에 도시된 터치패널을 X-X'방향으로 절단시킨 단면을 나타낸 예시도이다. 도 4에 도시된 F는 도 3에 도시된 F영역을 의미하며, 도 4에 도시된 G는 도 3에 도시된 G영역을 의미한다. FIG. 3 is an exemplary view showing the touch panel shown in FIG. 2 in detail, and FIG. 4 is an exemplary view showing a cross section of the touch panel shown in FIG. F shown in FIG. 4 means the F region shown in FIG. 3, and G shown in FIG. 4 means the G region shown in FIG.
상기 터치패널(100)의 상기 표시영역(110)에는, 상기 설명 및 도 3에 도시된 바와 같이, 다섯 개의 상기 수신전극(120)들 및 네 개의 상기 구동전극(130)들이 형성되어 있고, 상기 제1비표시영역(160a)에는 상기 수신전극라인(140)들이 형성되어 있으며, 상기 제2비표시영역(160b)에는 상기 구동전극라인(150)들과, 상기 수신전극라인(140)들과, 상기 패드(170)들이 형성되어 있다. In the display area 110 of the touch panel 100, as shown in the description and FIG. 3, five receiving electrodes 120 and four driving electrodes 130 are formed. The receiving electrode lines 140 are formed in the first non-display area 160a, and the driving electrode lines 150 and the receiving electrode lines 140 are formed in the second non-display area 160b. The pads 170 are formed.
첫째, 상기 표시영역(110)에 형성되어 있는 상기 수신전극(120)들 및 상기 구동전극(130)들을 설명하면 다음과 같다.First, the reception electrodes 120 and the driving electrodes 130 formed in the display area 110 are described as follows.
상기 터치패널(100)의 가로 방향으로 형성되어 있는 상기 수신전극(120)과 상기 터치패널(100)의 세로 방향으로 형성되어 있는 상기 구동전극(130)은 서로 전기적으로 연결되어서는 안된다. The receiving electrode 120 formed in the horizontal direction of the touch panel 100 and the driving electrode 130 formed in the vertical direction of the touch panel 100 should not be electrically connected to each other.
따라서, 절연체를 이용하여 상기 구동전극(130)과 상기 수신전극(120)은 이격되어 있다. 이 경우, 상기 수신전극(120)과 상기 구동전극(130)이 교차되는 영역에서, 상기 수신전극(120)과 상기 구동전극(130)이 전기적으로 연결되지 않도록 하기 위해, 상기 수신전극(120) 또는 상기 구동전극(130) 중 어느 하나에는 전극브릿지가 형성된다. Therefore, the driving electrode 130 and the receiving electrode 120 are spaced apart from each other by using an insulator. In this case, in the region where the receiving electrode 120 and the driving electrode 130 intersect, the receiving electrode 120 to prevent the receiving electrode 120 and the driving electrode 130 from being electrically connected. Alternatively, an electrode bridge may be formed on one of the driving electrodes 130.
즉, 상기 전극브릿지는, 상기 수신전극(120)에 형성될 수도 있으며, 이러한 전극브릿지는 수신전극브릿지라 한다. 또한, 상기 전극브릿지는 상기 구동전극(130)에 형성될 수도 있으며, 이러한 전극브릿지는 구동전극브릿지라 한다. That is, the electrode bridge may be formed on the receiving electrode 120, and such an electrode bridge is called a receiving electrode bridge. In addition, the electrode bridge may be formed on the driving electrode 130, and the electrode bridge is referred to as a driving electrode bridge.
이하에서는, 설명의 편의를 위하여, 도 4에 도시된 바와 같이, 상기 수신전극(120)에 상기 수신전극브릿지(122)가 형성되어 있는 터치패널을 일예로 하여 본 발명이 설명된다. Hereinafter, for convenience of description, the present invention will be described by using a touch panel in which the receiving electrode bridge 122 is formed on the receiving electrode 120 as shown in FIG. 4.
상기 수신전극(120)에 상기 수신전극브릿지(122)가 형성되어 있는 경우, 상기 수신전극(120)들 각각은, 다섯 개의 수신전극부(121)들과, 네 개의 수신전극브릿지(122)들을 포함한다. 즉, 하나의 상기 수신전극(120)은 다섯 개의 수신전극부(121)들로 형성되어 있으며, 상기 다섯 개의 수신전극부(121)들은 네 개의 상기 수신전극브릿지(122)에 의해 전기적으로 연결되어 있다. When the receiving electrode bridge 122 is formed on the receiving electrode 120, each of the receiving electrodes 120 may include five receiving electrode parts 121 and four receiving electrode bridges 122. Include. That is, one receiving electrode 120 is formed of five receiving electrode parts 121, and the five receiving electrode parts 121 are electrically connected by four receiving electrode bridges 122. have.
상기 구동전극(130)들 각각은, 여섯 개의 구동전극부(131)들과 상기 교차영역에서 상기 구동전극부(131)들을 전기적으로 연결시키는 다섯 개의 구동전극 연결부(132)들을 포함한다. Each of the driving electrodes 130 includes six driving electrode parts 131 and five driving electrode connecting parts 132 electrically connecting the driving electrode parts 131 at the intersection area.
여기서, 상기 수신전극부(121)들, 상기 구동전극부(131)들 및 상기 구동전극 연결부(132)들은, 도 4에 도시된 바와 같이, 동일층에 형성되어 있으며, 상기 수신전극브릿지(122)는, 상기 수신전극부(121)들, 상기 구동전극부(131)들 및 상기 구동전극 연결부(132)들과 절연막(191)을 사이에 두고 서로 이격되어 있다. Here, the receiving electrode parts 121, the driving electrode parts 131, and the driving electrode connecting parts 132 are formed on the same layer as illustrated in FIG. 4, and the receiving electrode bridge 122 is disposed on the same layer. ) Are spaced apart from each other with the receiving electrode parts 121, the driving electrode parts 131, the driving electrode connecting parts 132, and the insulating layer 191 interposed therebetween.
상기 수신전극부(121)들, 상기 구동전극부(131)들 및 상기 구동전극 연결부(132)들은, 인듐주석산화물(ITO : Indium Tin Oxide)(이하, 간단히 'ITO'라 함)로 형성될 수 있으며, 또는 산화아연(ZnO : Zinc oxide)(이하, 간단히 'ZnO'이라 함)과 같은 아연(Zn)계 산화물로 형성될 수도 있다. The receiving electrode parts 121, the driving electrode parts 131, and the driving electrode connecting parts 132 may be formed of indium tin oxide (ITO) (hereinafter, simply referred to as “ITO”). Alternatively, it may be formed of a zinc (Zn) -based oxide such as zinc oxide (ZnO) (hereinafter, simply referred to as 'ZnO').
여기서, 상기 수신전극부(121)들, 상기 구동전극부(131)들 및 상기 구동전극 연결부(132)들이, 상기 Zno으로 형성된 경우, 상기 수신전극부(121)들, 상기 구동전극부(131)들 및 상기 구동전극 연결부(132)들은, 상기 ZnO를 유기 금속 화학 기상 증착(MOCVD : Metal Organic Chemical Vapor Deposition) 방법(이하, 간단히 'MOCVD 방법'라 함)을 이용하여 증착시키는 것에 의해 형성될 수 있다.Here, when the receiving electrode parts 121, the driving electrode parts 131, and the driving electrode connecting parts 132 are formed of Zno, the receiving electrode parts 121 and the driving electrode part 131 are formed. ) And the driving electrode connectors 132 may be formed by depositing the ZnO using a metal organic chemical vapor deposition (MOCVD) method (hereinafter, simply referred to as a 'MOCVD method'). Can be.
특히, 상기 수신전극부(121)들, 상기 구동전극부(131)들 및 상기 구동전극 연결부(132)들은, MOCVD 방법에 의해 증착된 ZnO 막에 수소를 분사시켜, 상기 ZnO 막에 형성되는 탄소(Carbon) 성분을 제거하는 카본 성분 제거 과정을 통해 형성된다.In particular, the receiving electrode parts 121, the driving electrode parts 131, and the driving electrode connecting parts 132 are formed on the ZnO film by injecting hydrogen into the ZnO film deposited by the MOCVD method. (Carbon) is formed through the removal of carbon components to remove the components.
상기 전극브릿지(122)는, 상기 ZnO으로 형성된다. 즉, 상기 전극브릿지(122)는, 상기 MOCVD 방법에 의해 증착된 ZnO 막에 수소를 분사시켜, 상기 ZnO 막에 형성되는 산소와 탄소(Carbon) 성분을 제거하는 카본 성분 제거 과정을 통해 형성된다.The electrode bridge 122 is formed of ZnO. That is, the electrode bridge 122 is formed through a carbon component removal process of removing oxygen and carbon components formed on the ZnO film by spraying hydrogen on the ZnO film deposited by the MOCVD method.
둘째, 상기 제1비표시영역(160a)과 상기 제2비표시영역(160b)에 형성되어 있는 상기 수신전극라인(140)들, 상기 구동전극라인(150)들 및 상기 패드(170)들을 설명하면 다음과 같다.Second, the receiving electrode lines 140, the driving electrode lines 150, and the pads 170 formed in the first non-display area 160a and the second non-display area 160b are described. Is as follows.
상기 제1비표시영역(160a) 및 상기 제2비표시영역(160b)에는, 상기 설명 및 도 4에 도시된 바와 같이, 빛의 투과를 차단하기 위한 차광층(161)이 도포되어 있다. 상기 차광층(161)의 두께는 대략 20㎛ 이상이다. 상기 수신전극부(121)들, 상기 구동전극부(131) 및 상기 구동전극 연결부(132)들의 두께가 대략 300㎚라고 할 때, 상기 차광층(161)은 상기 수신전극부(121) 등에 비해 70배 정도 두껍게 형성된다.A light shielding layer 161 is applied to the first non-display area 160a and the second non-display area 160b to block light transmission as described above and illustrated in FIG. 4. The thickness of the light blocking layer 161 is approximately 20 μm or more. When the thickness of the receiving electrode parts 121, the driving electrode part 131, and the driving electrode connecting part 132 is about 300 nm, the light blocking layer 161 may be compared with the receiving electrode part 121. It is 70 times thicker.
상기 제1비표시영역(160a)에 형성되는 상기 차광층(161)의 상단에는, 상기 수신전극(120)들과 연결되어 있는 상기 수신전극라인(140)들이 형성되어 있으며, 상기 제2비표시영역(160a)에 형성되어 있는 상기 차광층(161)의 상단에는, 상기 구동전극(130)과 연결되어 있는 상기 구동전극라인(150) 및 상기 구동전극라인(150)과 연결되어 있는 패드(170)가 형성되어 있다. Receiving electrode lines 140 connected to the receiving electrodes 120 are formed on an upper end of the light blocking layer 161 formed in the first non-display area 160a, and the second non-display The pad 170 connected to the driving electrode line 150 and the driving electrode line 150 connected to the driving electrode 130 is formed at an upper end of the light blocking layer 161 formed in the region 160a. ) Is formed.
여기서, 상기 수신전극라인(140)은, 상기 수신전극라인(140)과 대응되는 수신전극(120)을 형성하는 상기 수신전극부(121)와, 상기 수신라인브릿지(181)를 통해 전기적으로 연결되어 있다. Here, the receiving electrode line 140 is electrically connected to the receiving electrode 121 and the receiving line bridge 181 forming the receiving electrode 120 corresponding to the receiving electrode line 140. It is.
예를 들어, 상기 수신전극라인(140)과 상기 수신전극부(121)의 상단에는 보호막(192)이 도포되어 있고, 상기 수신전극라인(140)과 상기 수신전극부(121)에 대응되는 보호막(192)에는 컨택홀들이 형성되어 있다. 상기 컨택홀을 통해 상기 수신라인브릿지(181)가 상기 수신전극라인(140) 및 상기 수신전극부(121)에 전기적으로 연결됨으로써, 상기 수신전극라인(140)과 상기 수신전극부(121)가 전기적으로 연결될 수 있다. For example, a protective film 192 is coated on the receiving electrode line 140 and the receiving electrode part 121, and a protective film corresponding to the receiving electrode line 140 and the receiving electrode part 121. Contact holes are formed at 192. The receiving line bridge 181 is electrically connected to the receiving electrode line 140 and the receiving electrode unit 121 through the contact hole, so that the receiving electrode line 140 and the receiving electrode unit 121 are connected to each other. Can be electrically connected.
상기 구동전극라인(150)은, 상기 구동전극라인(150)과 대응되는 구동전극(130)을 형성하는 상기 구동전극부(131)와, 상기 구동라인브릿지(182)를 통해 전기적으로 연결되어 있다. 예를 들어, 상기 구동전극라인(150)과 상기 구동전극부(131)의 상단에는 상기 보호막(192)이 도포되어 있고, 상기 구동전극라인(150)과 상기 구동전극부(131)에 대응되는 보호막(192)에는 컨택홀들이 형성되어 있다. 상기 컨택홀을 통해 상기 구동라인브릿지(182)가 상기 구동전극라인(150) 및 상기 구동전극부(131)에 전기적으로 연결됨으로써, 상기 구동전극라인(150)과 상기 구동전극부(131)가 전기적으로 연결될 수 있다. The driving electrode line 150 is electrically connected to the driving electrode part 131 forming the driving electrode 130 corresponding to the driving electrode line 150 through the driving line bridge 182. . For example, the passivation layer 192 is coated on top of the driving electrode line 150 and the driving electrode part 131, and corresponds to the driving electrode line 150 and the driving electrode part 131. Contact holes are formed in the passivation layer 192. The driving line bridge 182 is electrically connected to the driving electrode line 150 and the driving electrode part 131 through the contact hole, thereby driving the driving electrode line 150 and the driving electrode part 131. Can be electrically connected.
상기 패드(170)는 상기 구동라인브릿지(182)의 끝단에 형성될 수 있다. The pad 170 may be formed at an end of the driving line bridge 182.
상기 수신라인브릿지(181) 및 상기 구동라인브릿지(182)를 총칭하여 라인브릿지(181, 182)라 한다. 즉, 이하의 설명 중, 라인브릿지는 상기 수신라인브릿지(181)를 의미할 수도 있고, 또는 상기 구동라인브릿지(182)를 의미할 수도 있다. 이 경우, 상기 수신라인브릿지(181)가 제1라인브릿지인 경우, 상기 구동라인브릿지는 제2라인브릿지가 될 수 있으며, 그 반대가 될 수도 있다. The receiving line bridge 181 and the driving line bridge 182 are collectively referred to as line bridges 181 and 182. That is, in the following description, the line bridge may mean the receiving line bridge 181 or the driving line bridge 182. In this case, when the receiving line bridge 181 is the first line bridge, the driving line bridge may be the second line bridge, or vice versa.
상기 라인브릿지(181, 182)는, 도 4에 도시된 바와 같이, 상기 전극브릿지(122)와 동일한 층에 형성된다. The line bridges 181 and 182 are formed on the same layer as the electrode bridge 122, as shown in FIG. 4.
따라서, 상기 라인브릿지(181, 182)는, 상기 전극브릿지(122)와 동일하게, 상기 MOCVD 방법에 의해 증착된 ZnO 막에 수소를 분사시켜, 상기 ZnO 막에 형성되는 산소 및 탄소(Carbon) 성분을 제거하는 카본 성분 제거 과정을 통해 형성된다.Accordingly, the line bridges 181 and 182, like the electrode bridges 122, inject hydrogen into a ZnO film deposited by the MOCVD method to form oxygen and carbon components formed in the ZnO film. It is formed through a carbon component removal process to remove the.
또한, 상기 수신라인브릿지(181) 및 상기 구동라인브릿지(182)와 상기 전극브릿지(122)를 총칭하여 브릿지라 한다. 즉, 상기 브릿지는, 상기 라인브릿지일 수도 있으며, 상기 전극브릿지일 수도 있다. 또한, 상기 라인브릿지는, 상기 수신라인브릿지(181)일 수도 있으며, 상기 구동라인브릿지(182)일 수도 있다. 또한, 상기 전극브릿지는, 상기 수신전극브릿지일 수도 있으며, 상기 구동전극브릿지일 수도 있다. In addition, the receiving line bridge 181, the driving line bridge 182, and the electrode bridge 122 are collectively referred to as a bridge. That is, the bridge may be the line bridge or the electrode bridge. In addition, the line bridge may be the receiving line bridge 181 or may be the driving line bridge 182. The electrode bridge may be the receiving electrode bridge or the driving electrode bridge.
이하에서는, 도 5a 내지 도 5f 및 도 6 내지 도 8을 참조하여 상기 패널(100)을 제조하는 방법이 상세히 설명된다.Hereinafter, a method of manufacturing the panel 100 will be described in detail with reference to FIGS. 5A to 5F and 6 to 8.
도 5a 내지 도 5f는 본 발명에 따른 터치패널 제조 방법을 순차적으로 나타낸 예시도이다. 도 6은 본 발명에 따른 터치패널 제조 시스템의 구성을 나타낸 예시도이다. 도 7은 도 6에 도시된 제1터치패널 제조 장치를 나타낸 예시도이다. 도 8은 도 6에 도시된 제2터치패널 제조 장치를 나타낸 예시도이다. 5A to 5F are exemplary views sequentially illustrating a method of manufacturing a touch panel according to the present invention. 6 is an exemplary view showing a configuration of a touch panel manufacturing system according to the present invention. FIG. 7 is an exemplary view illustrating a first touch panel manufacturing apparatus shown in FIG. 6. FIG. 8 is an exemplary view illustrating a second touch panel manufacturing apparatus shown in FIG. 6.
이하에서 설명되는 터치패널 제조 방법은, 본 발명에 따른 터치패널 제조 방법의 일예로서 설명되는 것이다. 따라서, 본 발명에 따른 터치패널 제조 방법은, 터치패널의 구조에 따라 다양한 형태로 변경될 수 있다. The touch panel manufacturing method described below is described as an example of the touch panel manufacturing method according to the present invention. Therefore, the manufacturing method of the touch panel according to the present invention may be changed in various forms according to the structure of the touch panel.
우선, 도 5a를 참조하면, 기판(110) 상에, 상기 수신전극부(121)들, 상기 구동전극부(131)들, 상기 구동전극 연결부(132)들이 형성된다. First, referring to FIG. 5A, the receiving electrode parts 121, the driving electrode parts 131, and the driving electrode connecting parts 132 are formed on the substrate 110.
상기 수신전극부(121)들, 상기 구동전극부(131)들, 상기 구동전극 연결부(132)들의 두께는 대략 300㎚ 정도로 형성된다. The receiving electrode parts 121, the driving electrode parts 131, and the driving electrode connecting parts 132 have a thickness of about 300 nm.
상기 기판(110)은, 투명한 유리기판(Glass) 또는 투명한 플라스틱기판 또는 투명한 합성수지필름이 될 수 있다. The substrate 110 may be a transparent glass substrate, a transparent plastic substrate, or a transparent synthetic resin film.
상기 플라스틱기판 또는 상기 합성수지필름은, PI(polyimide), PC(polycarbonate), PNB(polynorborneen), PET(polyethyleneterephthalate), PEN(polyethylenapthanate) 및 PES(polyethersulfone) 중에서 어느 하나의 재질로 이루어질 수 있다. The plastic substrate or the synthetic resin film may be made of any one material of polyimide (PI), polycarbonate (PC), polynorborneen (PNB), polyethyleneterephthalate (PET), polyethylenapthanate (PEN), and polyethersulfone (PES).
상기 수신전극부(121)들, 상기 구동전극부(131)들 및 상기 구동전극 연결부(132)들은, ITO로 형성될 수 있다. The receiving electrode parts 121, the driving electrode parts 131, and the driving electrode connecting parts 132 may be formed of ITO.
이 경우, 상기 ITO는, 물리 기상 증착(PVD: Physical Vapor Deposition) 방법(이하, 간단히 'PVD 방법'이라 함)에 의해 상기 기판(111)에 형성될 수 있다. In this case, the ITO may be formed on the substrate 111 by a physical vapor deposition (PVD) method (hereinafter, simply referred to as a 'PVD method').
상기 PVD 방법에는, 스퍼터링(Sputtering), 전자빔증착법(E-beam evaporation), 열증착법(Thermal evaporation), 레이저분자빔증착법(L-MBE, Laser Molecular Beam Epitaxy), 펄스레이저증착법 (PLD, Pulsed Laser Deposition) 등이 있으며, 특히, 상기 수신전극부(121)들, 상기 구동전극부(131)들 및 상기 구동전극 연결부(132)들은, 상기 스퍼터링에 의해 상기 기판(111)에 형성될 수 있다. The PVD method includes sputtering, e-beam evaporation, thermal evaporation, laser molecular beam deposition (L-MBE) and pulsed laser deposition (PLD). In particular, the receiving electrode parts 121, the driving electrode parts 131, and the driving electrode connecting parts 132 may be formed on the substrate 111 by the sputtering.
또한, 수신전극부(121)들, 상기 구동전극부(131)들 및 상기 구동전극 연결부(132)들은, 전도성을 가진 투명한 산화물, 예를 들어, ZnO와 같은 Zn계 산화물로 형성될 수도 있다. 이 경우, 상기 수신전극부(121)들, 상기 구동전극부(131)들 및 상기 구동전극 연결부(132)들은, 상기 MOCVD 방법을 이용하여 증착시키는 것에 의해 형성될 수 있다. In addition, the receiving electrode parts 121, the driving electrode parts 131, and the driving electrode connecting parts 132 may be formed of a conductive transparent oxide, for example, a Zn-based oxide such as ZnO. In this case, the receiving electrode parts 121, the driving electrode parts 131, and the driving electrode connecting parts 132 may be formed by depositing using the MOCVD method.
특히, 상기 수신전극부(121)들, 상기 구동전극부(131)들 및 상기 구동전극 연결부(132)들은, MOCVD 방법에 의해 증착된 ZnO 막에 수소를 분사시켜, 상기 ZnO 막에 형성되는 산소 및 탄소(Carbon) 성분을 제거하는 카본 성분 제거 과정을 통해 형성될 수 있다. In particular, the receiving electrode parts 121, the driving electrode parts 131, and the driving electrode connecting parts 132 inject hydrogen into a ZnO film deposited by a MOCVD method, thereby forming oxygen formed in the ZnO film. And it may be formed through a carbon component removal process for removing the carbon component (Carbon).
상기 MOCVD 방법 및 상기 카본 성분 제거 과정은, 이하에서, 상기 브릿지들(181, 182, 122)을 형성하는 과정에서 상세히 설명된다. The MOCVD method and the carbon component removal process are described below in detail in the process of forming the bridges 181, 182, and 122.
다음, 도 5b를 참조하면, 상기 비표시영역(160)에 차광층(161)이 형성된다. 상기 차광층(161)의 두께는, 대략 20㎛ 이상으로 형성된다. 상기 차광층(161)의 두께는, 상기 수신전극부(121)들, 상기 구동전극부(131)들 및 상기 구동전극 연결부(132)들의 두께 보다 70배 이상 두껍게 형성된다. Next, referring to FIG. 5B, a light blocking layer 161 is formed in the non-display area 160. The thickness of the light shielding layer 161 is formed to be approximately 20 μm or more. The light blocking layer 161 is formed to be at least 70 times thicker than the thicknesses of the receiving electrode parts 121, the driving electrode parts 131, and the driving electrode connecting parts 132.
다음, 도 5c를 참조하면, 상기 차광층(161)의 상단에 상기 수신전극라인(140)들 및 상기 구동전극라인들(150)이 형성된다.Next, referring to FIG. 5C, the receiving electrode lines 140 and the driving electrode lines 150 are formed on the light blocking layer 161.
예를 들어, 상기 제1비표시영역(160a)에는 다섯 개의 상기 수신전극라인(140)들이 형성된다. 상기 제2비표시영역(160b)에는 상기 수신전극라인들이 연장되어 형성되어 있으며, 네 개의 상기 구동전극라인(150)들이 형성되어 있다.For example, five receiving electrode lines 140 are formed in the first non-display area 160a. The receiving electrode lines extend in the second non-display area 160b and four driving electrode lines 150 are formed.
상기 수신전극라인(140)들 및 상기 구동전극라인(150)들은, 빛이 투과되지 않는, 상기 비표시영역(160)에 형성되어 있는 상기 차광층(161) 상단에 형성되어 있기 때문에, 상기 ITO 또는 ZnO와 같이 투명한 물질로 형성될 필요가 없다. 따라서, 상기 수신전극라인(140)들 및 상기 구동전극라인(150)들은, 전도성이 우수한 다양한 종류의 불투명한 금속물질들로 형성될 수 있다. The receiving electrode lines 140 and the driving electrode lines 150 are formed on the light blocking layer 161 formed in the non-display area 160, through which light is not transmitted, so that the ITO Or need not be formed of a transparent material such as ZnO. Accordingly, the receiving electrode lines 140 and the driving electrode lines 150 may be formed of various kinds of opaque metal materials having excellent conductivity.
다음, 도 5d를 참조하면, 상기 수신전극부(121)들, 상기 구동전극부(131)들, 상기 구동전극 연결부(132)들, 상기 수신전극라인(140)들 및 상기 구동전극라인(150)들을 포함한 전면에, 절연막(191)이 도포된다. 상기 절연막(191)은, PAC 또는 PAS와 같은 절연물질로 형성될 수 있다. Next, referring to FIG. 5D, the receiving electrode parts 121, the driving electrode parts 131, the driving electrode connecting parts 132, the receiving electrode lines 140, and the driving electrode line 150 are described. The insulating film 191 is applied to the entire surface including the (). The insulating layer 191 may be formed of an insulating material such as PAC or PAS.
상기 절연막(191)에는, 마스크를 이용하여, 복수의 컨택홀들이 형성된다. A plurality of contact holes are formed in the insulating layer 191 using a mask.
예를 들어, 상기 절연막(191) 중, 상기 수신전극부(121)들 각각에 대응되는 위치에는, 두 개의 컨택홀들이 형성되고, 상기 수신전극라인(140)들과 상기 구동전극라인(150)들 각각에 대응되는 위치에는 하나의 컨택홀이 형성되며, 상기 구동전극부(131)들 중 상기 차광층과 인접되어 있는 구동전극부(131)들에 대응되는 위치에는 하나의 컨택홀이 형성된다. 상기 컨택홀들은 포토마스크 공정에 의해 형성될 수 있다. For example, two contact holes are formed at positions corresponding to each of the receiving electrode parts 121 of the insulating film 191, and the receiving electrode lines 140 and the driving electrode line 150 are formed. One contact hole is formed at a position corresponding to each of the ones, and one contact hole is formed at a position corresponding to the driving electrode portions 131 adjacent to the light blocking layer among the driving electrode portions 131. . The contact holes may be formed by a photomask process.
다음, 도 5e를 참조하면, 서로 이격되어 있는 두 개의 상기 수신전극부(121)들을 상기 컨택홀들을 통해 연결시키는 수신전극브릿지(122), 상기 수신전극라인(140)과 상기 수신전극부(121)를 상기 컨택홀들을 통해 연결시키는 수신라인브릿지(181) 및 상기 구동전극라인(150)과 상기 구동전극부(131)를 상기 컨택홀들을 통해 연결시키는 구동라인브릿지(182)가, 상기 절연막(191) 상에 형성된다. Next, referring to FIG. 5E, the receiving electrode bridge 122, the receiving electrode line 140, and the receiving electrode 121 which connect the two receiving electrode parts 121 spaced apart from each other through the contact holes. ) A receiving line bridge 181 connecting the contact holes through the contact holes and a driving line bridge 182 connecting the driving electrode line 150 and the driving electrode unit 131 through the contact holes. 191).
상기 수신전극브릿지(122), 상기 수신라인브릿지(181) 및 상기 구동라인브릿지(182)는, 두 개의 공정을 통해, 상기 절연막(191) 상에 형성된다.The receiving electrode bridge 122, the receiving line bridge 181, and the driving line bridge 182 are formed on the insulating layer 191 through two processes.
첫 번째 공정은, 도 6 및 도 7에 도시된 바와 같은 제1터치패널 제조 장치(620)에서 수행된다. The first process is performed in the first touch panel manufacturing apparatus 620 as shown in FIGS. 6 and 7.
상기 제1터치패널 제조 장치(620)는, 미세 패턴으로 형성되는 상기 브릿지들(181, 182, 122)을 형성하기 위한 것으로서, 유기금속 전구체(metal organic precursor)를 이용하는 화학 기상 증착(CVD) 방법(이하, 간단히 'CVD 방법'이라 함)을 이용한다. 즉, 상기 제1터치패널 제조 장치(620)는, 상기 CVD 방법을 이용하여, 전도성을 가진 투명한 산화물, 예를 들어, ZnO와 같은 Zn계 산화물을 증착시켜, 상기 브릿지들을 형성한다. 이하에서는 설명의 편의상, 상기 전도성을 가진 투명한 산화물이, 상기 산화 아연(ZnO)인 경우를 일예로 하여 본 발명이 설명된다. 이 경우, 상기 전극부들도 상기 산화 아연으로 형성될 수 있다. The first touch panel manufacturing apparatus 620 is for forming the bridges 181, 182, and 122 formed in a fine pattern, and a chemical vapor deposition (CVD) method using a metal organic precursor. (Hereinafter, simply referred to as 'CVD method'). That is, the first touch panel manufacturing apparatus 620 uses the CVD method to deposit conductive transparent oxides, for example, Zn-based oxides such as ZnO to form the bridges. Hereinafter, for convenience of description, the present invention will be described by taking the case where the conductive transparent oxide is zinc oxide (ZnO) as an example. In this case, the electrode parts may also be formed of the zinc oxide.
상기 브릿지들을 형성하기 위해, 상기 제1터치패널 제조 장치(620)는, 도 7에 도시된 바와 같이, 챔버(621), 기판 지지부(622) 및 가스 분사부(626, 623)를 포함한다. 상기 가스 분사부는, 가스 분사유닛(623) 및 가스 공급부(626)를 포함하며, 상기 가스 공급부(626)는, 제1가스 공급기(624) 및 제2가스 공급기(625)를 포함한다. In order to form the bridges, the first touch panel manufacturing apparatus 620 includes a chamber 621, a substrate support 622, and gas injectors 626 and 623, as shown in FIG. 7. The gas injection unit includes a gas injection unit 623 and a gas supply unit 626, and the gas supply unit 626 includes a first gas supplier 624 and a second gas supplier 625.
그러나, 상기 제1터치패널 제조 장치(620)는 도 7에 도시된 형태 이외에도 다양한 형태로 구성될 수 있다. However, the first touch panel manufacturing apparatus 620 may be configured in various forms in addition to the form shown in FIG.
상기에서 설명된, 도 5a 내지 도 5d의 과정이 수행되어, 상기 기판(111) 상에 상기 절연막(191)이 형성되면, 상기 기판(111)은, 도 7에 도시된 바와 같은 제1터치패널 제조 장치(620)의 상기 챔버(621) 내부로 유입되어, 상기 기판 지지부(622)에 놓여진다. When the above-described process of FIGS. 5A to 5D is performed to form the insulating film 191 on the substrate 111, the substrate 111 may have a first touch panel as illustrated in FIG. 7. It flows into the chamber 621 of the manufacturing apparatus 620 and is placed on the substrate support 622.
이후, 상기 가스 분사유닛(623)을 통해 금속 원료 물질(Zn계 금속 전구체)과 반응 가스가 상기 기판(111)으로 분사되면서, 상기 브릿지들(181, 182, 122)이 형성된다.Thereafter, the metal raw material (Zn-based metal precursor) and the reaction gas are injected onto the substrate 111 through the gas injection unit 623, and thus the bridges 181, 182, and 122 are formed.
두 번째 공정은, 도 8에 도시된 바와 같은 제2터치패널 제조 장치(630)에서 수행된다. The second process is performed in the second touch panel manufacturing apparatus 630 as shown in FIG. 8.
상기 제2터치패널 제조 장치(630)는, 플라즈마 화학 기상 증착(PECVD: Plasma Enhanced CVD) 방법(이하, 간단히 'PECDV'라 함)을 이용하여, 수소(H2)를 이온화 시킨 후, 상기 첫 번째 공정에서 상기 ZnO을 이용하여 형성된 상기 브릿지들(122, 181, 182)을 포함하는 상기 기판 상에, 상기 수소 이온을 분사시킨다. The second touch panel manufacturing apparatus 630 is ionized with hydrogen (H 2 ) by using a plasma chemical vapor deposition (PECVD) method (hereinafter, simply referred to as 'PECDV'). In the first process, the hydrogen ions are injected onto the substrate including the bridges 122, 181, and 182 formed using the ZnO.
상기 수소 이온에 의해, 상기 ZnO 막의 표면에 O-H 본딩(Bonding)이 형성되어, 상기 ZnO 막의 면저항이 개선될 수 있다. 즉, 상기 제2터치패널 제조 장치(630)에서 수행되는 카본 성분 제거 공정에 의해, 산소 성분이 제거됨으로써, 상기 ZnO 막(브릿지)의 면저항이 개선될 수 있다. O-H bonding is formed on the surface of the ZnO film by the hydrogen ions, thereby improving sheet resistance of the ZnO film. That is, the oxygen resistance is removed by the carbon component removal process performed by the second touch panel manufacturing apparatus 630, thereby improving the sheet resistance of the ZnO film (bridge).
또한, 상기 제1터치패널 제조 장치(620)를 통해 상기 ZnO 막(브릿지)이 형성되는 동안, 상기 ZnO 막의 표면에 CxHx기가 생성된다. 상기 CxHx기는, 상기 카본 성분 제거 공정 중에, 상기 수소 이온과 결합되어 CH4와 같은 물질을 형성한다. 이 경우, 상기 ZnO 막에서 카본(Carbon, 탄소) 성분이 제거될 수 있기 때문에, 상기 브릿지(122, 181, 182)들의 투과도가 개선될 수 있다. 즉, 상기 카본 성분 제거 장치(630)에서 수행되는 카본 성분 제거 공정에 의해, 상기 ZnO막(브릿지)의 투과율이 개선될 수 있다. In addition, while the ZnO film (bridge) is formed through the first touch panel manufacturing apparatus 620, CxHx groups are generated on the surface of the ZnO film. The CxHx group combines with the hydrogen ions to form a substance such as CH 4 during the carbon component removal process. In this case, since the carbon component may be removed from the ZnO film, the permeability of the bridges 122, 181, and 182 may be improved. That is, the transmittance of the ZnO film (bridge) may be improved by the carbon component removing process performed by the carbon component removing apparatus 630.
부연하여 설명하면, 상기 카본 성분 제거 공정에 의해, 상기 ZnO 막(브릿지)의 면저항이 개선될 수 있으며, 상기 ZnO 막의 투과도가 개선될 수 있다. Specifically, by the carbon component removal process, the sheet resistance of the ZnO film (bridge) can be improved, and the permeability of the ZnO film can be improved.
이를 위해, 상기 제2터치패널 제조 장치(630)로는 상기 브릿지(122, 181, 182)(ZnO)가 형성되어 있는 상기 기판(111)이 투입된다.To this end, the substrate 111 on which the bridges 122, 181, and 182 (ZnO) are formed is introduced into the second touch panel manufacturing apparatus 630.
상기 기판(111)이 투입되면, 상기 제2터치패널 제조 장치(630)는, 수소(H2)가 혼합되어 있는 다양한 종류의 가스를 이온화 시켜, 상기 기판(111)으로 투입시킨다. When the substrate 111 is inserted, the second touch panel manufacturing apparatus 630 ionizes various kinds of gases in which hydrogen (H 2 ) is mixed and introduces the gas into the substrate 111.
마지막으로, 도 5f를 참조하면, 상기 브릿지들(122, 181, 182)을 포함한 상기 기판(111)의 전면에 보호막(192)이 형성된다. 이 경우, 상기 보호막(192)은, 상기 구동라인브릿지(182)의 끝단이, 외부로 노출되도록, 형성된다. 상기 보호막(192)에 의해 커버되지 않고 외부로 노출된 부분은, 상기 패드(170)가 된다. 상기 패드(170)에는, 상기 터치 드라이버 IC(300)가 장착되어 있는 상기 플렉서블 인쇄회로기판(FPCB)(200)이 전기적으로 연결된다. Finally, referring to FIG. 5F, a passivation layer 192 is formed on an entire surface of the substrate 111 including the bridges 122, 181, and 182. In this case, the passivation layer 192 is formed such that an end of the driving line bridge 182 is exposed to the outside. The portion exposed to the outside without being covered by the passivation layer 192 becomes the pad 170. The flexible printed circuit board (FPCB) 200 on which the touch driver IC 300 is mounted is electrically connected to the pad 170.
상기 과정들에 의해, 상기 터치패널(100)의 제조 공정이 완료된다.By the above processes, the manufacturing process of the touch panel 100 is completed.
상기 플렉서블 인쇄회로기판(200)이 연결되어 있는 상기 터치패널(100)이, OCR(Optically Clear Resin)과 같은 접착제 또는, OCA(Optically Clear Adhesive)와 같은 접착테이프에 의해, 상기 패널의 상단에 부착됨으로써, 터치패널(100)이 구비된 표시장치가 제조될 수 있다. The touch panel 100 to which the flexible printed circuit board 200 is connected is attached to the top of the panel by an adhesive such as OCR (Optically Clear Resin) or an adhesive tape such as OCA (Optically Clear Adhesive). As a result, the display device with the touch panel 100 may be manufactured.
상기에서 설명된 본 발명에 따른 터치패널 제조 방법을 간단히 정리하면 다음과 같다. Briefly summarized the manufacturing method of the touch panel according to the present invention described above is as follows.
즉, 본 발명에 따른 터치패널 제조 방법은, 기판의 표시영역(110)에 전극부들(121, 131)을 형성하는 단계, 상기 기판의 비표시영역(160a, 160b)에 차광층(161)을 형성하는 단계, 상기 차광층(161) 상에 전극라인(140, 150)을 형성하는 단계 및 전도성을 가진 투명한 산화물을 이용하여, 상기 전극부(121, 131)와 상기 전극라인을 연결하는 라인브릿지(181, 182)를 형성하는 단계를 포함한다.That is, in the method of manufacturing the touch panel according to the present invention, forming the electrode parts 121 and 131 in the display area 110 of the substrate, and forming the light blocking layer 161 in the non-display areas 160a and 160b of the substrate. Forming, forming the electrode line (140, 150) on the light shielding layer 161 and using a transparent oxide having a conductive, line bridge connecting the electrode (121, 131) and the electrode line Forming 181, 182.
여기서, 전도성을 가진 투명한 상기 산화물은 산화 아연(ZnO)이 될 수 있으며, 이 외에도, 다양한 종류의 Zn계 산화물이 될 수 있다. 또한, 상기 라인브릿지(181, 182)는, 유기 금속 화학 기상 증착(MOCVD) 방법을 이용하여 형성될 수 있다. Here, the conductive transparent oxide may be zinc oxide (ZnO), and in addition, may be various kinds of Zn-based oxide. In addition, the line bridges 181 and 182 may be formed using an organometallic chemical vapor deposition (MOCVD) method.
또한, 본 발명에 따른 터치패널 제조 방법에는, 상기 라인브릿지의 표면에 가스를 반응시켜, 상기 라인브릿지(181, 182)의 형성과정에서 생성된 카본성분을 제거하는 단계를 더 포함할 수 있다. 여기서, 상기 카본성분을 제거하는 단계는, 수소 가스를 이용한 플라즈마 화학 기상 증착(PECVD) 방법을 이용하여 수행될 수 있다. In addition, the method for manufacturing a touch panel according to the present invention may further include removing a carbon component generated during the formation of the line bridges 181 and 182 by reacting a gas to the surface of the line bridge. The carbon component may be removed by using a plasma chemical vapor deposition (PECVD) method using hydrogen gas.
또한, 본 발명에 따른 터치패널 제조 방법에서, 상기 전극부들(121, 131)은, 제1터치전극(120)을 형성하며 전기적으로 서로 분리되어 있는 제1전극부(121)들 및 전기적으로 서로 연결되어 제2터치전극(130)을 형성하는 제2전극부(131)들을 포함하며, 상기 라인브릿지(122)를 형성하는 공정과 동일한 공정을 통해, 상기 제1전극부(121)들 간을 전기적으로 연결시키는 전극브릿지(122)들이 형성될 수 있다. 여기서, 상기 전극부들(121, 131) 역시, 전도성을 가진 투명한 상기 산화물을 이용하여, 형성될 수 있다. In addition, in the method of manufacturing a touch panel according to the present invention, the electrode parts 121 and 131 form the first touch electrode 120 and are electrically separated from each other and the first electrode parts 121 that are electrically separated from each other. And second electrode parts 131 connected to form the second touch electrode 130, and between the first electrode parts 121 through the same process as that of forming the line bridge 122. Electrode bridges 122 that connect electrically may be formed. Here, the electrode parts 121 and 131 may also be formed using the transparent transparent oxide.
이하에서는, 본 발명에 따른 터치패널 제조 시스템(600)이 설명된다. 이하의 설명 중 상기에서 설명된 내용들은 간단히 설명되거나, 생략된다.Hereinafter, a touch panel manufacturing system 600 according to the present invention is described. In the following description, the contents described above are simply described or omitted.
본 발명에 따른 터치패널 제조 시스템(600)은, 도 6에 도시된 바와 같이, 상기 제1터치패널 제조 장치(620) 및 상기 제2터치패널 제조 장치(630)를 포함한다. As illustrated in FIG. 6, the touch panel manufacturing system 600 according to the present invention includes the first touch panel manufacturing apparatus 620 and the second touch panel manufacturing apparatus 630.
첫째, 상기 제1터치패널 제조 장치(620)는, 도 7에 도시된 바와 같이, 반응 공간을 갖는 챔버(621), 표시영역에 형성되어 있는 전극부들, 상기 표시영역의 외곽에 형성되는 비표시영역에 형성된 차광층과, 상기 차광층 상에 형성된 전극라인을 포함하는 제조기판(100a)을 지지하며, 상기 챔버 내부에 배치되는 기판 지지부(622), 상기 전극부와 상기 전극라인을 연결하는 라인브릿지를 형성하기 위한, 전도성을 가진 투명한 산화물(ZnO)을, 상기 제조기판 상에 형성하기 위해, 금속 원료 물질과 반응 가스를 상기 제조기판으로 분사시키는 가스 분사부(623)를 포함한다. 이 경우, 상기 제조기판(100a)은, 상기에서 도 5a 내지 도 5d의 공정을 거친 기판을 의미한다. First, as illustrated in FIG. 7, the first touch panel manufacturing apparatus 620 includes a chamber 621 having a reaction space, electrode portions formed in a display area, and a non-display formed outside the display area. A line supporting the manufacturing substrate 100a including a light blocking layer formed in an area and an electrode line formed on the light blocking layer, and a substrate supporting part 622 disposed in the chamber, and a line connecting the electrode part and the electrode line. And a gas injector 623 for injecting a metal raw material and a reactive gas into the fabrication substrate to form conductive transparent oxide (ZnO) on the fabrication substrate to form a bridge. In this case, the manufacturing substrate 100a refers to a substrate that has been subjected to the processes of FIGS. 5A to 5D.
상기에서 설명된 도 5a 내지 도 5d의 공정들은, 상기 ITO를 증착시키기 위한 스퍼터링장치, 상기 절연막(191)을 형성하기 위한 장치, 상기 절연막(191)에 상기 컨택홀들을 형성하기 위한 장치들을 통해 수행될 수 있다. 이러한 장치들은 상기 터치패널(100)을 제조하기 위해 일반적으로 이용되는 장치들이므로, 이에 대한 상세한 설명은 생략된다. 5A to 5D described above are performed through a sputtering apparatus for depositing the ITO, an apparatus for forming the insulating layer 191, and apparatuses for forming the contact holes in the insulating layer 191. Can be. Since these devices are generally used to manufacture the touch panel 100, detailed description thereof will be omitted.
상기 가스 분사부는, 가스 분사유닛(623) 및 가스 공급부(626)를 포함하며, 상기 가스 공급부(626)는, 제1가스 공급기(624) 및 제2가스 공급기(625)를 포함한다. The gas injection unit includes a gas injection unit 623 and a gas supply unit 626, and the gas supply unit 626 includes a first gas supplier 624 and a second gas supplier 625.
상기 가스 분사부의 상기 가스 공급부(626)는, 상기 금속 원료 물질로 Zn계 금속 전구체를 분사하고, 상기 반응 가스로 산소 함유 가스를 분사할 수 있다. 이를 위해, 상기 제1가스 공급기(624)는 상기 금속 원료 물질을 상기 가스 분사유닛(623)으로 공급할 수 있으며, 상기 제2가스 공급기(625)는 상기 반응 가스를 상기 가스 분사유닛(623)으로 분사할 수 있다. The gas supply unit 626 of the gas injection unit may inject a Zn-based metal precursor with the metal raw material and inject an oxygen-containing gas with the reaction gas. To this end, the first gas supplier 624 may supply the metal raw material to the gas injection unit 623, and the second gas supplier 625 may supply the reaction gas to the gas injection unit 623. Can spray
또한, 상기 가스 분사부는, 상기 라인브릿지와 함께, 상기 제2전극부들 간을 전기적으로 연결시키는 전극브릿지들을 형성하기 위해, 상기 금속 원료 물질과 상기 반응 가스를 상기 제조기판으로 분사시키는 기능을 수행한다. In addition, the gas injector, together with the line bridge, serves to inject the metal raw material and the reaction gas to the manufacturing substrate to form electrode bridges electrically connecting the second electrode portions. .
즉, 상기 제1터치패널 제조 장치(620)는, 상기 제조기판 상에, 유기 금속 화학 기상 증착(MOCVD) 방법을 이용하여 상기 라인브릿지를 형성하는 기능을 수행한다. 따라서, 상기 제1터치패널 제조 장치(620)는, 상기 유기 금속 화학 기상 증착 방법을 수행하는 장치들이 포함하고 있는 구성요소들을 기본적으로 포함하고 있다. That is, the first touch panel manufacturing apparatus 620 performs a function of forming the line bridge on the manufacturing substrate by using an organic metal chemical vapor deposition (MOCVD) method. Accordingly, the first touch panel manufacturing apparatus 620 basically includes components included in the apparatuses for performing the organometallic chemical vapor deposition method.
둘째, 상기 제2터치패널 제조 장치(630)는, 도 8에 도시된 바와 같이, 반응 공간을 갖는 챔버(631), 표시영역에 형성되어 있는 전극부들, 상기 표시영역의 외곽에 형성되는 비표시영역에 형성된 차광층, 상기 차광층 상에 형성된 전극라인과, 유기 금속 화학 기상 증착(MOCVD) 방법에 의해 형성되어 상기 전극부와 상기 전극라인을 연결하는 라인브릿지를 포함하는 제조기판(100b)을 지지하며, 상기 챔버 내부에 배치되는 서셉터(632), 및 가스 공급부(634)에서 공급되는 공정 가스를 플라즈마 방전에 의해 이온화시켜, 이온화된 공정 가스를 상기 제조기판 상에 분사시키는 플라즈마 생성부(633)를 포함한다. 상기 플라즈마 생성부(633)는 RF(Radio Frequency) 전원(635)에 전지적으로 접속되어 있다. Second, as illustrated in FIG. 8, the second touch panel manufacturing apparatus 630 includes a chamber 631 having a reaction space, electrode portions formed in the display area, and a non-display formed outside the display area. A manufacturing substrate 100b including a light blocking layer formed in an area, an electrode line formed on the light blocking layer, and a line bridge formed by an organic metal chemical vapor deposition (MOCVD) method to connect the electrode part and the electrode line; And a plasma generator for supporting the susceptor 632 disposed in the chamber and the process gas supplied from the gas supply unit 634 by ionizing the plasma by a plasma discharge, and spraying the ionized process gas onto the manufacturing substrate. 633). The plasma generator 633 is electrically connected to an RF (Radio Frequency) power source 635.
이 경우, 상기 제조기판(100b)은, 상기 제1터치패널 제조 장치(620)를 거친 기판을 의미한다. 따라서, 상기 제2터치패널 제조 장치(620)로 유입된 상기 제조기판(100b)에는 상기 라인브릿지(122)가 형성되어 있다. In this case, the manufacturing substrate 100b refers to a substrate that has passed through the first touch panel manufacturing apparatus 620. Therefore, the line bridge 122 is formed on the manufacturing substrate 100b introduced into the second touch panel manufacturing apparatus 620.
상기 공정 가스는, 수소(H2) 가스가 될 수 있다. 상기 제2터치패널 제조 장치(630)에 의해, 상기 이온화된 공정 가스는, 상기 라인브릿지를 형성하는 전도성을 가진 투명한 산화물의 산소(O)와 결합된다. 이 경우, 상기 수소 이온에 의해, 상기 ZnO 막의 표면에 O-H 본딩(Bonding)이 형성됨으로써, 상기 ZnO 막의 면저항이 개선될 수 있다. The process gas may be hydrogen (H 2 ) gas. By the second touch panel manufacturing apparatus 630, the ionized process gas is combined with oxygen (O) of a transparent oxide having conductivity to form the line bridge. In this case, by forming the OH bonding on the surface of the ZnO film by the hydrogen ions, the sheet resistance of the ZnO film can be improved.
또한, 상기 이온화된 공정 가스는, 상기 라인브릿지 형성과정에서 생성되어 상기 제조기판 상에 형성되어 있는 카본성분과 결합된다. 이 경우, 상기 제1터치패널 제조 장치(620)를 통해 상기 ZnO 막(브릿지)이 형성되는 동안, 상기 ZnO 막의 표면에 생성된 CxHx기가, 상기 수소 이온과 결합되어 CH4와 같은 물질을 형성함으로써, 상기 ZnO 막에서 카본(Carbon, 탄소) 성분이 제거되어, 상기 브릿지(122, 181, 182)들의 투과도가 개선될 수 있다.In addition, the ionized process gas is generated during the line bridge formation process and combined with the carbon component formed on the manufacturing substrate. In this case, while the ZnO film (bridge) is formed through the first touch panel manufacturing apparatus 620, CxHx groups generated on the surface of the ZnO film are combined with the hydrogen ions to form a material such as CH 4. In addition, the carbon component may be removed from the ZnO layer to improve the permeability of the bridges 122, 181, and 182.
즉, 상기 제2터치패널 제조 장치(630)는, 플라즈마 화학 기상 증착(PECVD) 방법을 이용하여, 상기 기판을 처리함으로써, 상기 ZnO로 형성된 상기 브릿지의 면저항과 투과도가 개선될 수 있다. 따라서, 상기 제2터치패널 제조 장치(630)는, 상기 플라즈마 화학 기상 증착 방법을 수행하는 장치들이 포함하고 있는 구성요소들을 기본적으로 포함하고 있다. That is, the second touch panel manufacturing apparatus 630 may improve surface resistance and transmittance of the bridge formed of ZnO by treating the substrate by using a plasma chemical vapor deposition (PECVD) method. Accordingly, the second touch panel manufacturing apparatus 630 basically includes components included in devices for performing the plasma chemical vapor deposition method.
상기에서 설명된 본 발명을 정리하면 다음과 같다. The present invention described above is summarized as follows.
본 발명은, 터치패널의 제조에 관한 것으로서, 특히, ZnO을 이용하여 브릿지(122, 181, 182)를 형성하며, 상기 브릿지에 대하여 카본 제거 공정을 수행함으로써, 상기 브릿지의 전기적 특성(저항 또는 전도도) 및 광학적 특성(투과도)를 개선시키고 있다. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the manufacture of touch panels, in particular, forming bridges 122, 181, and 182 using ZnO, and performing carbon removal processes on the bridges, thereby providing electrical characteristics (resistance or conductivity) of the bridges. ) And optical properties (transmittance).
본 발명에 의하면, 상기 터치패널의 수신전극들 및 구동전극들을 형성하는 브릿지를, ITO 대신 ZnO을 이용하여 형성할 수 있으며, 상기 수신전극들 및 상기 구동전극들 전체를 상기 ZnO을 이용하여 형성할 수 있다. 특히, 상기 ZnO 막(브릿지)은 MOCVD를 이용하고 있는 제1터치패널 제조 장치(620)를 통해 제조될 수 있기 때문에, 상기 브릿지의 스텝 커버리지(step coverage)가 개선되어 터치패널의 양산성이 개선될 수 있다. 또한, 상기 ITO보다 저렴한 상기 ZnO가 이용됨으로써, 터치패널의 제조 단가가 절감될 수 있다. 시뮬레이션 및 실험 결과에 의하면, 상기 브릿지, 특히, 상기 라인브릿지(181, 182)와 상기 차광층(161)의 접촉시, 스텝 커버리지(step coverage)가 개선되어 90% 이상의 양산성이 확보될 수 있다. According to the present invention, a bridge forming the receiving electrodes and the driving electrodes of the touch panel may be formed using ZnO instead of ITO, and the entirety of the receiving electrodes and the driving electrodes may be formed using the ZnO. Can be. In particular, since the ZnO film (bridge) may be manufactured through the first touch panel manufacturing apparatus 620 using MOCVD, the step coverage of the bridge is improved, thereby improving mass productivity of the touch panel. Can be. In addition, since ZnO which is cheaper than ITO is used, manufacturing cost of a touch panel may be reduced. According to simulation and experiment results, when the bridge, in particular, the line bridges 181 and 182 and the light shielding layer 161, the step coverage (improved step coverage) can be improved to ensure mass productivity of 90% or more. .
또한, 본 발명에 의하면, 상기 ZnO막에 대해 카본 제거 공정을 수행함으로써, 상기 브릿지의 면저항이 감소될 수 있으며, 투과도가 향상될 수 있다. 상기 면저항이 감소됨에 따라, 상기 터치패널이 장착된 표시장치의 구동시, 배터리 소모량이 감소될 수 있다. 시뮬레이션 및 실험 결과에 의하면, 상기 카본 제거 공정에 의해 상기 ZnO의 면저항이 40~50% 가까이 감소됨을 알 수 있다. In addition, according to the present invention, by performing a carbon removal process for the ZnO film, the sheet resistance of the bridge can be reduced, the transmittance can be improved. As the sheet resistance is reduced, battery consumption may be reduced when driving the display device on which the touch panel is mounted. Simulation and experimental results show that the sheet resistance of the ZnO is reduced by 40-50% by the carbon removal process.
또한, ITO를 이용한 종래의 터치패널 제조 방법에서는, 불량 발생시, re-work 공정이 불가능 하였으나, 본 발명에서와 같이 ZnO 막이 사용되는 경우에는, 손쉽게 re-work 공정이 수행될 수 있어, 양산성이 개선될 수 있다.In addition, in the conventional touch panel manufacturing method using ITO, when a defect occurs, re-work process is impossible, but when the ZnO film is used as in the present invention, the re-work process can be easily performed, Can be improved.
또한, 상기 설명에서는, 상기 ZnO 막의 특성을 개선하는 과정이, 수소 이온을 상기 ZnO 막에 분사하는 상기 카본 제거 공정에 의해 의해 수행되고 있으나, 상기 ZnO막이 형성된 상기 기판을 고온에서 어닐링(annealing) 하는 것에 의해서도 상기 ZnO막의 특성이 개선될 수도 있다. In addition, in the above description, the process of improving the characteristics of the ZnO film is performed by the carbon removing process of injecting hydrogen ions into the ZnO film, but annealing the substrate on which the ZnO film is formed at a high temperature. In addition, the properties of the ZnO film may be improved.
본 발명이 속하는 기술분야의 당업자는 본 발명이 그 기술적 사상이나 필수적 특징을 변경하지 않고서 다른 구체적인 형태로 실시될 수 있다는 것을 이해할 수 있을 것이다.  그러므로, 이상에서 기술한 실시 예들은 모든 면에서 예시적인 것이며 한정적인 것이 아닌 것으로 이해해야만 한다. 본 발명의 범위는 상기 상세한 설명보다는 후술하는 특허청구범위에 의하여 나타내어지며, 특허청구범위의 의미 및 범위 그리고 그 등가 개념으로부터 도출되는 모든 변경 또는 변형된 형태가 본 발명의 범위에 포함되는 것으로 해석되어야 한다.Those skilled in the art to which the present invention pertains will understand that the present invention can be implemented in other specific forms without changing the technical spirit or essential features. Therefore, it is to be understood that the embodiments described above are exemplary in all respects and not restrictive. The scope of the present invention is shown by the following claims rather than the detailed description, and all changes or modifications derived from the meaning and scope of the claims and their equivalent concepts should be construed as being included in the scope of the present invention. do.

Claims (20)

  1. 기판의 표시영역에 전극부들을 형성하는 단계;Forming electrode portions in the display area of the substrate;
    상기 기판의 비표시영역에 차광층을 형성하는 단계;Forming a light blocking layer on a non-display area of the substrate;
    상기 차광층 상에 전극라인을 형성하는 단계; 및Forming an electrode line on the light blocking layer; And
    전도성을 가진 투명한 산화물을 이용하여, 상기 전극부와 상기 전극라인을 연결하는 라인브릿지를 형성하는 단계를 포함하는 터치패널 제조 방법.Using a transparent oxide having conductivity, forming a line bridge connecting the electrode part and the electrode line.
  2. 제 1 항에 있어서,The method of claim 1,
    전도성을 가진 투명한 상기 산화물은 산화 아연(ZnO)인 것을 특징으로 하는 터치패널 제조 방법.The conductive transparent oxide is zinc oxide (ZnO) touch panel manufacturing method, characterized in that.
  3. 제 1 항에 있어서,The method of claim 1,
    상기 라인브릿지를 형성하는 단계는,Forming the line bridge,
    유기 금속 화학 기상 증착(MOCVD) 방법을 이용하여 상기 라인브릿지를 형성하는 것을 특징으로 하는 터치패널 제조 방법. And forming the line bridge by using an organometallic chemical vapor deposition (MOCVD) method.
  4. 제 1 항에 있어서,The method of claim 1,
    상기 라인브릿지의 표면에 가스를 반응시켜, 상기 라인브릿지의 형성과정에서 생성된 카본성분을 제거하는 단계를 더 포함하는 터치패널 제조 방법.And reacting a gas to a surface of the line bridge to remove the carbon component generated during the formation of the line bridge.
  5. 제 4 항에 있어서,The method of claim 4, wherein
    상기 카본성분을 제거하는 단계는, Removing the carbon component,
    수소 가스를 이용한 플라즈마 화학 기상 증착(PECVD) 방법을 이용하여 수행되는 것을 특징으로 하는 터치패널 제조 방법. A touch panel manufacturing method using a plasma chemical vapor deposition (PECVD) method using hydrogen gas.
  6. 제 1 항에 있어서,The method of claim 1,
    상기 전극부들은, 제1터치전극을 형성하며 전기적으로 서로 분리되어 있는 제1전극부들 및 전기적으로 서로 연결되어 제2터치전극을 형성하는 제2전극부들을 포함하며, The electrode parts may include first electrode parts that form a first touch electrode and are electrically separated from each other, and second electrode parts that are electrically connected to each other to form a second touch electrode.
    상기 라인브릿지를 형성하는 단계는, 상기 라인브릿지를 형성하는 공정과 동일한 공정을 통해, 상기 제1전극부들 간을 전기적으로 연결시키는 전극브릿지들을 형성하는 것을 특징으로 하는 터치패널 제조 방법.The forming of the line bridges may include forming electrode bridges electrically connecting the first electrode portions through the same process as forming the line bridges.
  7. 제 1 항에 있어서,The method of claim 1,
    상기 전극부들은, 전도성을 가진 투명한 상기 산화물을 이용하여, 형성되는 것을 특징으로 하는 터치패널 제조 방법. The electrode parts are formed using the transparent conductive oxide, the method of manufacturing a touch panel.
  8. 반응 공간을 갖는 챔버;A chamber having a reaction space;
    표시영역에 형성되어 있는 전극부들, 상기 표시영역의 외곽에 형성되는 비표시영역에 형성된 차광층과, 상기 차광층 상에 형성된 전극라인을 포함하는 제조기판을 지지하며, 상기 챔버 내부에 배치되는 기판 지지부; A substrate supporting a manufacturing substrate including electrode parts formed in the display area, a light blocking layer formed on a non-display area formed outside the display area, and an electrode line formed on the light blocking layer, Support;
    상기 전극부와 상기 전극라인을 연결하는 라인브릿지를 형성하기 위한, 전도성을 가진 투명한 산화물을, 상기 제조기판 상에 형성하기 위해, 금속 원료 물질과 반응 가스를 상기 제조기판으로 분사시키는 가스 분사부를 포함하는 터치패널 제조 장치.And a gas injector for injecting a metal raw material and a reactive gas into the fabrication substrate to form a transparent transparent oxide on the fabrication substrate to form a conductive transparent oxide for forming the line bridge connecting the electrode portion and the electrode line. Touch panel manufacturing apparatus.
  9. 제 8 항에 있어서,The method of claim 8,
    상기 가스 분사부는, 상기 금속 원료 물질로 Zn계 금속 전구체를 분사하고, 상기 반응 가스로 산소 함유 가스를 분사하는 것을 특징으로 하는 터치패널 제조 장치. And the gas injector injects a Zn-based metal precursor into the metal raw material and injects an oxygen-containing gas into the reaction gas.
  10. 제 8 항에 있어서,The method of claim 8,
    상기 전극부들은, 전기적으로 서로 연결되어 제1터치전극을 형성하는 제1전극부들 및 제2터치전극을 형성하며 전기적으로 서로 분리되어 있는 제2전극부들을 포함하며, The electrode parts may include first electrode parts electrically connected to each other to form a first touch electrode and second electrode parts that are electrically separated from each other to form a second touch electrode.
    상기 가스 분사부는, 상기 라인브릿지와 함께, 상기 제2전극부들 간을 전기적으로 연결시키는 전극브릿지들을 형성하기 위해, 상기 금속 원료 물질과 상기 반응 가스를 상기 제조기판으로 분사시키는 것을 특징으로 하는 터치패널 제조 장치. The gas injector, together with the line bridge, injects the metal raw material and the reactive gas onto the manufacturing substrate to form electrode bridges electrically connecting the second electrode portions. Manufacturing device.
  11. 제 8 항에 있어서,The method of claim 8,
    전도성을 가진 투명한 상기 산화물은 산화 아연(ZnO)인 것을 특징으로 하는 터치패널 제조 장치. The conductive transparent oxide is a touch panel manufacturing device, characterized in that zinc oxide (ZnO).
  12. 제 8 항에 있어서,The method of claim 8,
    상기 가스 분사부는, 유기 금속 화학 기상 증착(MOCVD) 방법을 이용하여 상기 라인브릿지를 형성하는 것을 특징으로 하는 터치패널 제조 장치. And the gas injector forms the line bridge using an organometallic chemical vapor deposition (MOCVD) method.
  13. 반응 공간을 갖는 챔버;A chamber having a reaction space;
    표시영역에 형성되어 있는 전극부들, 상기 표시영역의 외곽에 형성되는 비표시영역에 형성된 차광층, 상기 차광층 상에 형성된 전극라인과, 유기 금속 화학 기상 증착(MOCVD) 방법에 의해 형성되어 상기 전극부와 상기 전극라인을 연결하는 라인브릿지를 포함하는 제조기판을 지지하며, 상기 챔버 내부에 배치되는 서셉터; 및Electrode portions formed in the display area, a light blocking layer formed on the non-display area formed outside the display area, an electrode line formed on the light blocking layer, and an electrode formed by an organic metal chemical vapor deposition (MOCVD) method A susceptor supporting a manufacturing substrate including a line bridge connecting a part and the electrode line to the inside of the chamber; And
    가스 공급부에서 공급되는 공정 가스를 플라즈마 방전에 의해 이온화시켜, 이온화된 공정 가스를 상기 제조기판 상에 분사시키는 플라즈마 생성부를 포함하는 터치패널 제조 장치. And a plasma generating unit which ionizes the process gas supplied from the gas supply unit by plasma discharge, and injects the ionized process gas onto the manufacturing substrate.
  14. 제 13 항에 있어서, The method of claim 13,
    상기 라인브릿지는, 산화 아연(ZnO)으로 형성되는 것을 특징으로 하는 터치패널 제조 장치. The line bridge is a touch panel manufacturing apparatus, characterized in that formed of zinc oxide (ZnO).
  15. 제 13 항에 있어서,The method of claim 13,
    상기 이온화된 공정 가스는, 상기 라인브릿지를 형성하는 전도성을 가진 투명한 산화물의 산소(O)와 결합되는 것을 특징으로 하는 터치패널 제조 장치. And the ionized process gas is combined with oxygen (O) of a transparent oxide having conductivity to form the line bridge.
  16. 제 13 항에 있어서,The method of claim 13,
    상기 이온화된 공정 가스는, 상기 라인브릿지 형성과정에서 생성되어 상기 제조기판 상에 형성되어 있는 카본성분과 결합되는 것을 특징으로 하는 터치패널 제조 장치. The ionized process gas, the touch panel manufacturing apparatus, characterized in that coupled to the carbon component formed in the line bridge forming process formed on the manufacturing substrate.
  17. 제 13 항에 있어서,The method of claim 13,
    상기 공정 가스는, 수소(H2) 가스인 것을 특징으로 하는 터치패널 제조 장치. The process gas is a hydrogen (H 2 ) gas, characterized in that the touch panel manufacturing apparatus.
  18. 제 13 항에 있어서, The method of claim 13,
    상기 공정 가스는, 플라즈마 화학 기상 증착(PECVD) 방법에 의해 상기 제조기판과 반응하는 것을 특징으로 하는 터치패널 제조 장치.The process gas is a touch panel manufacturing apparatus, characterized in that for reacting with the manufacturing substrate by a plasma chemical vapor deposition (PECVD) method.
  19. 표시영역에 형성되어 있는 전극부들, 상기 표시영역의 외곽에 형성되는 비표시영역에 형성된 차광층과, 상기 차광층 상에 형성된 전극라인을 포함하는 제조기판 상에, 상기 전극부와 상기 전극라인을 연결하는 라인브릿지로 이용될 전도성을 가진 투명한 산화물을 형성하기 위해, 금속 원료 물질과 반응 가스를 상기 제조기판으로 분사시키는 제1터치패널 제조 장치; 및The electrode part and the electrode line may be formed on a manufacturing substrate including electrode parts formed in the display area, light blocking layers formed in the non-display area formed outside the display area, and electrode lines formed on the light blocking layer. A first touch panel manufacturing apparatus for injecting a metal raw material and a reactant gas onto the manufacturing substrate to form a transparent oxide having conductivity to be used as a line bridge to connect to the manufacturing substrate; And
    가스 공급부에서 공급되는 공정 가스를 플라즈마 방전에 의해 이온화시켜, 이온화된 공정 가스를, 상기 제1터치패널 제조장치로부터 배출된 상기 제조기판 상에 분사시키는 제2터치패널 제조 장치를 포함하는 터치패널 제조 시스템. Manufacturing a touch panel comprising a second touch panel manufacturing apparatus for ionizing the process gas supplied from the gas supply unit by plasma discharge to inject the ionized process gas on the manufacturing substrate discharged from the first touch panel manufacturing apparatus system.
  20. 제 19 항에 있어서, The method of claim 19,
    상기 산화물은 산화 아연(ZnO)이며, 상기 공정 가스는 수소(H)2 가스인 것을 특징으로 하는 터치패널 제조 시스템.And the oxide is zinc oxide (ZnO), and the process gas is hydrogen (H) 2 gas.
PCT/KR2014/011338 2013-11-25 2014-11-25 Apparatus, system, and method for manufacturing touch panel WO2015076637A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2013-0143568 2013-11-25
KR1020130143568A KR20150061065A (en) 2013-11-25 2013-11-25 Apparatus, system and method of manufacturing a touch panel

Publications (1)

Publication Number Publication Date
WO2015076637A1 true WO2015076637A1 (en) 2015-05-28

Family

ID=53179830

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2014/011338 WO2015076637A1 (en) 2013-11-25 2014-11-25 Apparatus, system, and method for manufacturing touch panel

Country Status (3)

Country Link
KR (1) KR20150061065A (en)
TW (1) TW201530407A (en)
WO (1) WO2015076637A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110141034A1 (en) * 2009-12-14 2011-06-16 Wintek Corporation Touch panel
KR20110136089A (en) * 2010-06-14 2011-12-21 일진디스플레이(주) Capacitive touch sensor
WO2012047013A2 (en) * 2010-10-05 2012-04-12 네오뷰코오롱 주식회사 Electrostatic capacity-type touch panel device and method for manufacturing same
WO2013022127A1 (en) * 2011-08-09 2013-02-14 삼성전자주식회사 Mocvd apparatus
WO2013066015A1 (en) * 2011-10-31 2013-05-10 주식회사 원익아이피에스 Apparatus and method for treating a substrate

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110141034A1 (en) * 2009-12-14 2011-06-16 Wintek Corporation Touch panel
KR20110136089A (en) * 2010-06-14 2011-12-21 일진디스플레이(주) Capacitive touch sensor
WO2012047013A2 (en) * 2010-10-05 2012-04-12 네오뷰코오롱 주식회사 Electrostatic capacity-type touch panel device and method for manufacturing same
WO2013022127A1 (en) * 2011-08-09 2013-02-14 삼성전자주식회사 Mocvd apparatus
WO2013066015A1 (en) * 2011-10-31 2013-05-10 주식회사 원익아이피에스 Apparatus and method for treating a substrate

Also Published As

Publication number Publication date
TW201530407A (en) 2015-08-01
KR20150061065A (en) 2015-06-04

Similar Documents

Publication Publication Date Title
WO2015093868A1 (en) Device, system, and method for manufacturing touch panel
WO2016178498A1 (en) Touch panel
WO2013062385A1 (en) Touch panel
WO2015137643A1 (en) Touch window
WO2012018176A2 (en) Optical touch screen and method for assembling the same
WO2020027418A1 (en) Display panel and manufacturing method therefor
WO2015050332A1 (en) Touch window and display including the same
CN101813844A (en) Touch panel and possess the display device of this touch panel
WO2017018718A1 (en) Touch input apparatus including display module in which pressure electrode is formed, and method for forming pressure electrode
US10928936B2 (en) Touch display substrate with a conductive shield layer and method for manufacturing the same, display device and method for driving the same
WO2016159509A1 (en) Touch sensor
WO2019168303A1 (en) Digitizer integrated with touch sensor and display device comprising same
WO2015174678A1 (en) Conductive structure and preparation method therefor
WO2020218704A1 (en) Display device
WO2018070789A1 (en) Window substrate, method for producing same, and image display device comprising same
WO2015137642A2 (en) Touch window and display with the same
CN107229360A (en) Contact panel, its manufacture method and touch control display apparatus
WO2015002483A1 (en) Touch sensor for touch screen panel, manufacturing method thereof, and touch screen panel including same
WO2015030404A1 (en) Touch sensing electrode and touch screen panel having same
WO2015046769A1 (en) Touch sensing electrode and touch screen panel having same
WO2012008725A2 (en) Touch sensing panel for delivering sensing signal to touch sensor chip by using circuit board, and touch sensing device
WO2013122293A1 (en) Touch screen panel having white coating layer and method for vacuum coating touch screen panel with white coating film
WO2015122678A1 (en) Touch window
WO2021145549A1 (en) Display module and manufacturing method therefor
WO2015076637A1 (en) Apparatus, system, and method for manufacturing touch panel

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 14864683

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 14864683

Country of ref document: EP

Kind code of ref document: A1