WO2015070647A1 - Nand gate circuit, display back panel, display and electronic device - Google Patents

Nand gate circuit, display back panel, display and electronic device Download PDF

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Publication number
WO2015070647A1
WO2015070647A1 PCT/CN2014/083725 CN2014083725W WO2015070647A1 WO 2015070647 A1 WO2015070647 A1 WO 2015070647A1 CN 2014083725 W CN2014083725 W CN 2014083725W WO 2015070647 A1 WO2015070647 A1 WO 2015070647A1
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Prior art keywords
transistor
level
pull
input
pole
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PCT/CN2014/083725
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French (fr)
Chinese (zh)
Inventor
吴仲远
宋丹娜
段立业
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京东方科技集团股份有限公司
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Priority to US14/420,880 priority Critical patent/US9325315B2/en
Priority to EP14859294.2A priority patent/EP3070848B1/en
Publication of WO2015070647A1 publication Critical patent/WO2015070647A1/en

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Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03KPULSE TECHNIQUE
    • H03K19/00Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
    • H03K19/0175Coupling arrangements; Interface arrangements
    • H03K19/0185Coupling arrangements; Interface arrangements using field effect transistors only
    • H03K19/018507Interface arrangements
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03KPULSE TECHNIQUE
    • H03K19/00Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
    • H03K19/02Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components
    • H03K19/08Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using semiconductor devices
    • H03K19/094Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using semiconductor devices using field-effect transistors
    • H03K19/0944Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using semiconductor devices using field-effect transistors using MOSFET or insulated gate field-effect transistors, i.e. IGFET
    • H03K19/09441Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using semiconductor devices using field-effect transistors using MOSFET or insulated gate field-effect transistors, i.e. IGFET of the same canal type
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03KPULSE TECHNIQUE
    • H03K19/00Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
    • H03K19/02Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components
    • H03K19/08Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using semiconductor devices
    • H03K19/094Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using semiconductor devices using field-effect transistors
    • H03K19/0944Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using semiconductor devices using field-effect transistors using MOSFET or insulated gate field-effect transistors, i.e. IGFET
    • H03K19/09441Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using semiconductor devices using field-effect transistors using MOSFET or insulated gate field-effect transistors, i.e. IGFET of the same canal type
    • H03K19/09443Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using semiconductor devices using field-effect transistors using MOSFET or insulated gate field-effect transistors, i.e. IGFET of the same canal type using a combination of enhancement and depletion transistors
    • H03K19/09445Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using semiconductor devices using field-effect transistors using MOSFET or insulated gate field-effect transistors, i.e. IGFET of the same canal type using a combination of enhancement and depletion transistors with active depletion transistors
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03KPULSE TECHNIQUE
    • H03K19/00Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
    • H03K19/20Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits characterised by logic function, e.g. AND, OR, NOR, NOT circuits

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a NAND gate circuit, a display backplane, a display, and an electronic device.
  • a-Si (Amorphous Silicon) TFT transistor Thin Film Transistor
  • LTPS Low Temperature Poly-silicon
  • Oxide TFT transistors oxide TFT transistors
  • a-Si TFT transistors have the disadvantages of low mobility and poor stability
  • LTPS TFT transistors are not suitable for the preparation of large-sized panels.
  • the I-V transfer characteristic of the oxide TFT transistor is usually a depletion type, that is, when the gate-source voltage Vgs of the oxide TFT transistor is zero, the oxide TFT transistor is still turned on.
  • the depletion TFT transistor brings great difficulty to the integrated circuit of the backplane.
  • the NAND gate is a commonly used logic circuit in digital circuits. For two input NAND gates, when both input signals are high, the output signal is low, when only one input signal is high, the other input When the signal is low, the output signal is high.
  • the commonly used NAND gate circuit is mainly composed of CMOS (Complementary Metal Oxide Semiconductor) [3 ⁇ 4 channel], two N-type transistors connected to the input signal are connected in series, and the input signal is simultaneously input. The two P-type transistors are connected in parallel with each other.
  • CMOS Complementary Metal Oxide Semiconductor
  • A is the first input signal
  • B is the second input signal
  • Out is the output signal
  • Vdd is high
  • Vss is low.
  • CMOS circuits have the advantages of low leakage and low power consumption. Due to thin film transistor processes such as oxide TFT transistors, there is usually only one type of TFT transistor, such as an N-type TFT transistor, which generates a large leakage current when a logic gate is provided. And static power consumption.
  • Figure 2 is a circuit diagram of a NAND gate using an N-type transistor.
  • the labels T1, ⁇ 2, and ⁇ 3 are the first ⁇ -type transistor, the second ⁇ -type transistor, and the third ⁇ -type transistor, respectively, and ⁇ 2 respectively indicate the first input signal and the second input signal, OUT.
  • Indicates the output signal VDD indicates high level, VSS indicates low level; T3 forms diode connection and acts as pull-up resistor.
  • ⁇ and IN2 are high at the same time, ⁇ and T2 are simultaneously turned on, pulling OUT low; However, since T3 is long-pass, there is a DC path from VDD to VSS.
  • the output low level is determined by the series resistance of T3 and ' ⁇ , ⁇ 2, and cannot reach VSS.
  • T1 and ⁇ 2 are turned off. Since ⁇ 3 is diode-connected, OUT is equal to VDD VTH, and VTH is the threshold voltage of T3. At this time, OUT cannot reach VDD.
  • the conventional NMOS (N- Mental Oxide Semiconductor) structure has the disadvantages of non-track-to-rail output and large leakage current.
  • the main purpose of the present disclosure is to provide a NAND gate circuit, a display backplane, a display, and an electronic device, so that when the input transistor is a depletion TFT transistor, the NAND gate output can be losslessly transmitted, and the NAND gate output rail-to-rail is realized. .
  • the present disclosure provides a NAND gate circuit including at least two input transistors, each of which is connected to an input signal, a first pole and a NAND gate output of the first input transistor. Connecting, the second pole of the last input transistor is connected to the first level; except for the last input transistor, the second pole of each input transistor is connected to the first pole of the next input transistor;
  • the circuit further includes at least two pull-up modules and at least two input control transistors. Each of the input control transistors has a gate connected to the input signal, and a first pole is respectively connected to a control end of the corresponding pull-up module. The second pole is connected to the first level;
  • a first pole of the first input transistor is connected to the second level output terminal through the pull-up module; and the input control transistor is configured to control when the input signal connected to the gate thereof is at a second level
  • the potential of the control terminal of the pull-up module connected to the first pole of the input transistor is a first level;
  • the at least two pull-up modules are configured to disconnect the connection between the second level output end and the NAND gate output when all of the input signals are at a second level, and As all said When the input signals are not all at the second level, the connection between the second level output terminal and the NAND gate output terminal is turned on.
  • the at least two input transistors and the at least two input control transistors are both depletion mode NMOS transistors, wherein the first extreme source, the second extreme drain, and the second The level is high and the first level is low.
  • the at least two input transistors and the at least two input control transistors are both depletion mode PMOS transistors, wherein the first extreme drain, the second extreme source, the second level Is low, the first level is high.
  • the pull-up module includes a first pull-up transistor, a second pull-up transistor, and a storage capacitor, where
  • the gate of the second pull-up transistor is a control end of the pull-up module
  • the first pull-up transistor is connected to the second level output terminal, the first pole is connected to the » pole of the first pull-up transistor, and the second pole is connected to the gate of the second pull-up transistor Pole connection
  • the second pull-up transistor has a first pole connected to the second level output terminal, and a second pole connected to the NAND gate output terminal;
  • the storage capacitor is connected between a gate of the second pull-up transistor and a second pole of the second pull-up transistor.
  • both the first pull-up transistor and the second pull-up transistor are depletion mode NMOS transistors.
  • both the first pull-up transistor and the second pull-up transistor are depletion mode PMOS transistors.
  • the present disclosure also provides a display backplane comprising the NAND gate circuit described above.
  • the present disclosure also provides a display comprising the display backplane described above.
  • the present disclosure also provides an electronic device including the NAND gate circuit described above.
  • the NAND gate circuit, the display backplane, the display and the electronic device of the present disclosure can make the input transistor be a depletion TFT transistor by using an input control transistor and a pull-up module,
  • the non-gate output can also be transmitted without loss, realize the NAND gate output rail-to-rail, and reduce leakage current, improving the stability and speed of the NAND gate circuit.
  • 1 is a circuit diagram of a conventional NAND gate circuit composed of a CMOS circuit;
  • FIG. 2 is a circuit diagram of a NAND gate of a conventional ffi N-type transistor
  • FIG. 3 is a circuit diagram of a NAND gate circuit according to an embodiment of the present disclosure.
  • FIG. 4 is a circuit diagram of a NAND gate circuit according to another embodiment of the present disclosure.
  • the source and drain of the TFT transistor employed in all embodiments of the present disclosure are symmetrical, so that the source and drain are indistinguishable.
  • one of the poles is referred to as a source and the other pole is referred to as a drain.
  • the transistor can be divided into an NMOS transistor (n-type metal-oxide-semiconductor field effect transistor) and a PMOS transistor (p-type metal-oxide-semiconductor field effect transistor).
  • NMOS transistor n-type metal-oxide-semiconductor field effect transistor
  • PMOS transistor p-type metal-oxide-semiconductor field effect transistor
  • the NAND gate circuit of the embodiment of the present disclosure includes at least two input transistors, a gate of each of the input transistors is connected to an input signal, and a first pole of the first input transistor is connected to a NAND gate output, and finally a second pole of an input transistor is coupled to the first level; except for the last input transistor, the second pole of each input transistor is coupled to the first pole of the next input transistor;
  • the NAND circuit further includes at least two pull-up modules and at least two input control transistors.
  • Each of the input control transistors has a gate connected to the input signal, and the first pole and the corresponding pull-up module respectively.
  • the control terminal is connected, and the second pole is connected to the first level;
  • a first pole of the first input transistor is connected to the second level output terminal through the pull-up module; and the input control transistor is configured to control when the input signal connected to the gate thereof is at a second level
  • the potential of the control terminal of the pull-up module connected to the first pole of the input transistor is a first level;
  • the at least two pull-up modules are configured to disconnect the connection between the second level output end and the NAND gate output when all of the input signals are at a second level, and When all of the input signals are not at the second level, the connection between the second level output and the NAND output is turned on.
  • the NAND gate circuit of the embodiment of the present disclosure can make the NAND gate output ffi non-destructively transmit and realize the NAND gate output when the input transistor is a depletion type TTT transistor by using an input control transistor and a pull-up module. Rail-to-rail, and reduce leakage current, improve the stability and speed of NAND gates.
  • the at least two input transistors and the at least two input control transistors are both depletion mode NMOS transistors, in which case the first source is the source, the second source is the drain, and the second level is the high level. Flat, the first level is low.
  • the at least two input transistors and the at least two input control transistors are both depletion mode PMOS transistors, wherein the first extreme drain, the second extreme source, and the second level are low Flat, the first level is high.
  • the first pole of the NMOS transistor may be a source, and the second pole of the NMOS transistor may be a drain.
  • the second level can be a high level and the first level can be a low level. It is conceivable that the implementation using a PMOS transistor is easily conceivable by those skilled in the art without creative efforts and is therefore within the scope of the embodiments of the present disclosure.
  • the NAND circuit includes:
  • a first input transistor Ti a gate connected to the first input signal IN1, a source and a NAND gate output
  • a second input transistor T2 the gate is connected to the second input signal IN2, the source is connected to the drain of the first input transistor T1, and the drain is connected to the low level VSS;
  • the first input control transistor T3 has a gate connected to the first input signal IN1 and a drain connected to a low level VSS;
  • a second input control transistor ⁇ 4 the gate is connected to the second input signal ⁇ 2, and the drain is connected to a low level VSS;
  • the NAND gate circuit further includes a first pull-up module 31 and a second pull-up module 32;
  • the source of the second input control transistor T4 is connected to the control terminal D2 of the second pull-up module 32;
  • the source of the first input transistor T1 is connected to the high-level output terminal of the output high level VDD through the first pull-up module 31;
  • the source of the first input transistor T1 is also connected to the high-level output terminal of the output high level VDD through the second pull-up module 32;
  • the first pull-up module 31 and the second pull-up module 32 are configured to turn off the high-level output when the first input signal IN1 and the second input signal IN2 are both high. a connection between the terminal and the NAND gate output terminal OUT, cutting off a charging current from the high-level output terminal to the NAND gate output terminal OUT, so that an output signal of the NAND gate output terminal OUT can be Reaching the low level output of the low level output
  • the first pull-up module 31 and the second pull-up module 32 are further configured to turn on the high when the first input signal IN1 and the second input signal IN2 are not both high.
  • a connection between the level output terminal and the NAND gate output terminal OUT transmits a lossless high level VDD to the NAND gate output terminal OUT.
  • T1 and T2, ⁇ 3, and ⁇ 4 are both depletion mode NMOS transistors.
  • ⁇ 3 control makes the potential of D1 low.
  • Ping, ⁇ 4 control causes the potential of D2 to be low, thereby disconnecting the high-level output from OUT;
  • T3 controls the potential of D1 to be low, and T4 is turned off, so that the second pull-up module 32 controls to make VDD transmit to OUT without loss;
  • T4 control causes D2 to be low and T3 is turned off, so that the first pull-up module 31 controls VDD to be transmitted to OUT without loss.
  • the pull-up module includes a first pull-up transistor, a second pull-up transistor, and a storage capacitor, and a gate of the second pull-up transistor is a control end of the pull-up module;
  • the first pull-up transistor has a gate connected to the second level output terminal, a first pole connected to a pole of the first pull-up transistor, and a second pole connected to a gate of the second pull-up transistor Pole connection
  • the second pull-up transistor, the first pole is connected to the second level output terminal, and the second pole is connected to the NAND gate output terminal;
  • the storage capacitor is connected between a gate of the second pull-up transistor and a second pole of the second pull-up transistor.
  • both the first pull-up transistor and the second pull-up transistor are depletion mode NMOS transistors.
  • both the first pull-up transistor and the second pull-up transistor are depletion mode PMOS transistors.
  • the NAND gate circuit described in the embodiment of the present disclosure includes:
  • the first input transistor T1 the gate is connected to the first input signal ⁇ , the source and the NAND gate output
  • a second input transistor T2 the gate is connected to the second input signal ⁇ 2, the source is connected to the drain of the first input transistor T1, and the drain is connected to the low level VSS;
  • a second input control transistor ⁇ 4 a gate connected to the second input signal ⁇ 2, and a drain connected to a low level VSS;
  • the first pull-up module 41 has its control terminal D1 connected to the source of the first input control transistor ⁇ 3.
  • the second pull-up module 42 has a control terminal D2 connected to the source of the second input control transistor ⁇ 4;
  • the first pull-up module 41 includes:
  • the first pull-up transistor ⁇ 5, the gate and the source are connected to a high level VDD;
  • a second pull-up transistor ⁇ 6 the drain is connected to the drain of the first pull-up transistor ⁇ 5 of the first pull-up module 41, the source is connected to the high level VDD, and the drain is connected to the NAND gate output terminal OUT And a first storage capacitor C1 connected between the gate of the second pull-up transistor T6 of the first pull-up module 41 and the drain of the second pull-up transistor T6;
  • the end point connected to the gate of the second pull-up transistor T6 is the control terminal D1 of the first pull-up module 41;
  • the second pull-up module 42 includes:
  • the third pull-up transistor T7, the gate and the source are connected to a high level VDD;
  • a fourth pull-up transistor T8 having a gate connected to a drain of the third pull-up transistor ⁇ 7, a source connected to a high level VDD, and a drain connected to the NAND gate output terminal OUT;
  • the end point connected to the gate of the fourth pull-up transistor T8 is the control terminal D2 of the second pull-up module 42;
  • XI ⁇ ⁇ 2, ⁇ 3, ⁇ 4, ⁇ 5, ⁇ , 6, ⁇ 7 and ⁇ ⁇ 8 are depletion type NMOS tubes.
  • T1 and T2 are turned on at the same time, the output signal is pulled low; T3 and T4 are also turned on, and the gate voltages of T6 and T8 are pulled low to make T6 and ⁇ 8 is turned off, and the charging current from the high-level output terminal of the output high level VDD to the NAND gate output terminal OUT is cut off. At this point, the output signal can reach VSS;
  • T1 When IN1 is high and IN2 is low, T1 is turned on, T2 is turned off, and the pull-down path of NAND gate output terminal OUT is cut off by T2, while T3 is turned on and T4 is turned off; diode-connected T7 is turned on, and VDD is turned on. T7 charges C2, so that the gate potential of T8 rises, turns T8 on, and transmits high level to OUT. As the OUT voltage rises, VDD continuously charges C2 through the turned-on T7, so that the gate of T8 The pole potential continues to rise and can reach a positive voltage exceeding (VDD+VTH8).
  • VTH8 is the threshold voltage of T8, making T8 fully conductive, so that VDD can be transmitted from the drain of T8 to the source of T8 without loss (ie OUT) );
  • T5 and T6 can be W/L (transistors with small width and length, which will make T6 gate low when OUT output low level, and leakage of T6 off state) Less than the conduction quiescent current of T3 in Figure 2.
  • the size of the ⁇ 5 is small, the sum of the on-state quiescent currents of ⁇ 5 and ⁇ 6 is much smaller than the on-state quiescent current of ⁇ 3 in Fig. 2, thereby reducing the leakage current.
  • ⁇ 7 and ⁇ 8 are the same as ⁇ 5 and ⁇ 6, and will not be repeated here.
  • the NAND gate circuit of the embodiment of the present disclosure adopts a capacitor bootstrap structure, which is composed of 8 TFT transistors and 2 capacitors, can make the output rail-to-rail, realize full voltage swing, and make the output lossless transmission, and Reduce leakage current and improve the stability and speed of NAND gate circuits.
  • the present disclosure also provides a display backplane comprising the NAND gate circuit described above.
  • the present disclosure also provides a display comprising the display backplane described above.
  • the present disclosure also provides an electronic device including the above NAND gate circuit.

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Abstract

A NAND gate circuit, a display back panel and a display. The NAND gate circuit comprises at least two input transistors (T1, T2), at least two pull-up modules (31, 32) and at least two input control transistors (T3, T4), wherein first electrodes of both the input transistors (T1, T2) are connected to an output end of a second level via the pull-up modules (31, 32); the input control transistors (T3, T4) are used for, when input signals which gate electrodes thereof access are at the second level, controlling to enable the electric potential at control ends of the pull-up modules (31, 32) connected to the first electrodes of the input transistors (T1, T2) to be at a first level; and the at least two pull-up modules (31, 32) are used for disconnecting the output end of the second level from an output end of a NAND gate when all input signals are at the second level, and used for connecting the output end of the second level with the output end of the NAND gate when the input signals are not all at the second level. When a depletion type TFT is adopted, the output of the NAND gate can be transmitted without loss, the rail-to-rail output of the NAND gate is realized, and leakage currents are reduced, thereby increasing the stability and speed of a NAND circuit.

Description

与非 η电路、 显示器背板、 显示器和电子设备  And non-η circuits, display backplanes, displays and electronic devices
本申请 张2013年 11月 15日提交的中国专利申请 No. 201310573352.1 的优先权权益, 其全部内容结合于此作为参考。 The priority of Chinese Patent Application No. 201310573352.1, filed on Nov. 15, 2013, is hereby incorporated by reference.
本发明涉及显示技术领域, 尤其涉及一种与非门电路、 显示器背板、 显示 器和电子设备。 The present invention relates to the field of display technologies, and in particular, to a NAND gate circuit, a display backplane, a display, and an electronic device.
目前制造显示器件背板的工艺有很多种, 如 a- Si (非晶硅) TFT晶体管 (Thin Film Transistor ,薄膜场效应晶体管)显示器件, LTPS (Low Temperature Poly- silicon, 低温多晶硅) TFT显示器件, Oxide TFT晶体管 (氧化物 TFT 晶体管)显示器件等, a- Si TFT晶体管具有迁移率低和稳定性差的缺点, LTPS TFT晶体管不适于大尺寸面板的制备。 氧化物 TFT晶体管的 I- V转移特性通 常为耗尽型, 即在氧化物 TFT晶体管的栅源电压 Vgs为零时, 氧化物 TFT晶 体管仍然导通。 At present, there are many processes for manufacturing display device backplanes, such as a-Si (Amorphous Silicon) TFT transistor (Thin Film Transistor) display device, LTPS (Low Temperature Poly-silicon) TFT display device. , Oxide TFT transistors (oxide TFT transistors) display devices, etc., a-Si TFT transistors have the disadvantages of low mobility and poor stability, and LTPS TFT transistors are not suitable for the preparation of large-sized panels. The I-V transfer characteristic of the oxide TFT transistor is usually a depletion type, that is, when the gate-source voltage Vgs of the oxide TFT transistor is zero, the oxide TFT transistor is still turned on.
耗尽型 TFT晶体管给背板集成的电路设 i†带来很大难度。 与非门是数字 电路中常用的逻辑电路, 对于两输入与非门, 当两个输入信号都为高电平时, 输出信号为低电平, 当只有一个输入信号为高电平, 另一个输入信号为低电平 时, 输出信号为高电平。 如图 1 所示, 常用的与非门电路主要由 CMOS ( Complementary Metal Oxide Semiconductor,互补金属氧化物半导体 )【¾路组 成, 接入输入信号的两个 N型晶体管相互串联, 同时接入输入信号的两个 P 型晶体管相互并联。 在图 1中, A为第一输入信号, B为第二输入信号, Out 为输出信号, Vdd标示高电平, Vss标示低电平。 CMOS电路具有漏电小, 低 功耗的优点。 由于如氧化物 TFT晶体管等薄膜晶体管工艺, 通常只有一种类 型的 TFT晶体管, 如 N型 TFT晶体管, 在设†逻辑门时会产生较大的漏电流 和静态功耗。 The depletion TFT transistor brings great difficulty to the integrated circuit of the backplane. The NAND gate is a commonly used logic circuit in digital circuits. For two input NAND gates, when both input signals are high, the output signal is low, when only one input signal is high, the other input When the signal is low, the output signal is high. As shown in Figure 1, the commonly used NAND gate circuit is mainly composed of CMOS (Complementary Metal Oxide Semiconductor) [3⁄4 channel], two N-type transistors connected to the input signal are connected in series, and the input signal is simultaneously input. The two P-type transistors are connected in parallel with each other. In Figure 1, A is the first input signal, B is the second input signal, Out is the output signal, Vdd is high, and Vss is low. CMOS circuits have the advantages of low leakage and low power consumption. Due to thin film transistor processes such as oxide TFT transistors, there is usually only one type of TFT transistor, such as an N-type TFT transistor, which generates a large leakage current when a logic gate is provided. And static power consumption.
图 2为釆用 N型晶体管的与非门的电路图。 在图 2中, 标号为 Tl、 Τ2、 Τ3的分别是第一 Ν型晶体管、 第二 Ν型晶体管、 第三 Ν型晶体管, ΙΝ】、 ΙΝ2 分别标示第一输入信号、 第二输入信号, OUT标示输出信号, VDD标示高电 平, VSS标示低电平; T3形成二极管连接, 起到上拉电阻的作用, 当 ΙΝΊ和 IN2同时为高时, ΤΊ和 T2同时导通, 将 OUT拉低; 但由于 T3是长通, 存在 由 VDD到 VSS的直流通路, 同时输出低电平由 T3与' Π、 Τ2的串联电阻分 压决定, 不能达到 VSS; 当 ΙΝ〗 和 ΙΝ2中一个为低或者都为低时, T1和 Τ2 截止, 由于 Τ3为二极管连接, OUT等于 VDD VTH, VTH为 T3的阈值电 压, 此时 OUT 也不能达到 VDD。 由上可知, 传统的 NMOS (N- Mental Oxide Semiconductor, n型金属 -氧化物半导体) 结构的与非门存 在输出不能轨到轨和漏电流大等缺点。  Figure 2 is a circuit diagram of a NAND gate using an N-type transistor. In FIG. 2, the labels T1, Τ2, and Τ3 are the first 晶体管-type transistor, the second Ν-type transistor, and the third Ν-type transistor, respectively, and ΙΝ2 respectively indicate the first input signal and the second input signal, OUT. Indicates the output signal, VDD indicates high level, VSS indicates low level; T3 forms diode connection and acts as pull-up resistor. When both ΙΝΊ and IN2 are high at the same time, ΤΊ and T2 are simultaneously turned on, pulling OUT low; However, since T3 is long-pass, there is a DC path from VDD to VSS. At the same time, the output low level is determined by the series resistance of T3 and 'Π, Τ2, and cannot reach VSS. When ΙΝ and ΙΝ2 are low or both When low, T1 and Τ2 are turned off. Since Τ3 is diode-connected, OUT is equal to VDD VTH, and VTH is the threshold voltage of T3. At this time, OUT cannot reach VDD. As can be seen from the above, the conventional NMOS (N- Mental Oxide Semiconductor) structure has the disadvantages of non-track-to-rail output and large leakage current.
本公开的主要目的在于提供一种与非门电路、显示器背板、显示器和电子 设备, 使得输入晶体管为耗尽型 TFT晶体管时, 与非门输出能无损传输, 实 现与非门输出轨到轨。 The main purpose of the present disclosure is to provide a NAND gate circuit, a display backplane, a display, and an electronic device, so that when the input transistor is a depletion TFT transistor, the NAND gate output can be losslessly transmitted, and the NAND gate output rail-to-rail is realized. .
为了达到上述目的, 本公开提供了一种与非门电路,包括至少两输入晶体 管, 每个所述输入晶体管的 »极接入一输入信号,第一输入晶体管的第一极和 与非门输出端连接, 最后一输入晶体管的第二极接入第一电平; 除了最后一输 入晶体管之外, 每一输入晶体管的第二极与下一输入晶体管的第一极连接; 所述与非门电路还包括至少两个上拉模块和至少两输入控制晶体管; 每一所述输入控制晶体管, 栅极分别接入一所述输入信号, 第一极分别与 对应的上拉模块的控制端连接, 第二极接入所述第一电平;  In order to achieve the above object, the present disclosure provides a NAND gate circuit including at least two input transistors, each of which is connected to an input signal, a first pole and a NAND gate output of the first input transistor. Connecting, the second pole of the last input transistor is connected to the first level; except for the last input transistor, the second pole of each input transistor is connected to the first pole of the next input transistor; The circuit further includes at least two pull-up modules and at least two input control transistors. Each of the input control transistors has a gate connected to the input signal, and a first pole is respectively connected to a control end of the corresponding pull-up module. The second pole is connected to the first level;
所述第一输入晶体管的第一极通过该上拉模块与第二电平输出端连接; 所述输入控制晶体管用于当其栅极接入的输入信号为第二电平时,控制使 得与该输入晶体管的第一极连接的上拉模块的控制端的电位为第一电平;  a first pole of the first input transistor is connected to the second level output terminal through the pull-up module; and the input control transistor is configured to control when the input signal connected to the gate thereof is at a second level The potential of the control terminal of the pull-up module connected to the first pole of the input transistor is a first level;
所述至少两个上拉模块,用于当所有的所述输入信号都为第二电平时, 断 开所述第二电平输出端与所述与非门输出端之间的连接,并 ^于当所有的所述 输入信号不都为第二电平时,导通所述第二电平输出端与所述与非门输出端之 间的连接。 The at least two pull-up modules are configured to disconnect the connection between the second level output end and the NAND gate output when all of the input signals are at a second level, and As all said When the input signals are not all at the second level, the connection between the second level output terminal and the NAND gate output terminal is turned on.
在一个示例中,所述至少两输入晶体管和所述至少两输入控制晶体管都为 耗尽型 NMOS晶体管, 其中, 所述第一极为源极, 所述第二极为漏极, 所述 第二电平为高电平, 所述第一电平为低电平。  In one example, the at least two input transistors and the at least two input control transistors are both depletion mode NMOS transistors, wherein the first extreme source, the second extreme drain, and the second The level is high and the first level is low.
在一个示例中,所述至少两输入晶体管和所述至少两输入控制晶体管都为 耗尽型 PMOS 晶体管, 其中所述第一极为漏极, 所述第二极为源极, 所述第 二电平为低电平, 所述第一电平为高电平。  In one example, the at least two input transistors and the at least two input control transistors are both depletion mode PMOS transistors, wherein the first extreme drain, the second extreme source, the second level Is low, the first level is high.
在一个示例中, 所述上拉模块包括第一上拉晶体管、第二上拉晶体管和存 储电容, 其中,  In one example, the pull-up module includes a first pull-up transistor, a second pull-up transistor, and a storage capacitor, where
所述第二上拉晶体管的栅极为该上拉模块的控制端;  The gate of the second pull-up transistor is a control end of the pull-up module;
所述第一上拉晶体管, 櫥极与所述第二电平输出端连接,第一极与所述第 一上拉晶体管的 »极连接, 第二极与所述第二上拉晶体管的栅极连接;  The first pull-up transistor is connected to the second level output terminal, the first pole is connected to the » pole of the first pull-up transistor, and the second pole is connected to the gate of the second pull-up transistor Pole connection
所述第二上拉晶体管,第一极与所述第二电平输出端连接,第二极与所述 与非门输出端连接;  The second pull-up transistor has a first pole connected to the second level output terminal, and a second pole connected to the NAND gate output terminal;
所述存储电容,连接于所述第二上拉晶体管的栅极和所述第二上拉晶体管 的第二极之间。  The storage capacitor is connected between a gate of the second pull-up transistor and a second pole of the second pull-up transistor.
实施时, 当所述输入晶体管和所述输入控制晶体管为耗尽型 NMOS晶体 管时, 第一上拉晶体管和第二上拉晶体管都为耗尽型 NMOS晶体管。  In implementation, when the input transistor and the input control transistor are depletion mode NMOS transistors, both the first pull-up transistor and the second pull-up transistor are depletion mode NMOS transistors.
实施时, 当所述输入晶体管和所述输入控制晶体管为耗尽型 PMOS 晶体 管时, 第一上拉晶体管和第二上拉晶体管都为耗尽型 PMOS晶体管。  In implementation, when the input transistor and the input control transistor are depletion mode PMOS transistors, both the first pull-up transistor and the second pull-up transistor are depletion mode PMOS transistors.
本公开还提供了一种显示器背板, 包括上述的与非门电路。  The present disclosure also provides a display backplane comprising the NAND gate circuit described above.
本公开还提供了一种显示器, 包括上述的显示器背板。  The present disclosure also provides a display comprising the display backplane described above.
本公开还提供了一种电子设备, 包括上述的与非门电路。  The present disclosure also provides an electronic device including the NAND gate circuit described above.
与现有技术相比, 本公开所述的与非门电路、 显示器背板、 显示器和电子 设备通过采用输入控制晶体管和上拉模块,可以使得所述输入晶体管为耗尽型 TFT晶体管时, 与非门输出也能无损传输, 实现与非门输出轨到轨, 并降低漏 电流, 提髙与非门电路的稳定性和速度。 图 1是现有的由 CMOS电路组成的与非门电路的电路图; Compared with the prior art, the NAND gate circuit, the display backplane, the display and the electronic device of the present disclosure can make the input transistor be a depletion TFT transistor by using an input control transistor and a pull-up module, The non-gate output can also be transmitted without loss, realize the NAND gate output rail-to-rail, and reduce leakage current, improving the stability and speed of the NAND gate circuit. 1 is a circuit diagram of a conventional NAND gate circuit composed of a CMOS circuit;
图 2是现有的采 ffi N型晶体管的与非门的电路图;  2 is a circuit diagram of a NAND gate of a conventional ffi N-type transistor;
图 3是本公开一实施例所述的与非门电路的电路图;  3 is a circuit diagram of a NAND gate circuit according to an embodiment of the present disclosure;
图 4是本公开另一实施例所述的与非门电路的电路图。  4 is a circuit diagram of a NAND gate circuit according to another embodiment of the present disclosure.
下面将结合本公开实施例中的附图,对本公开实施例中的技术方案进行清 楚、 完整地描述, 显然, 所描述的实施例仅仅是本公开一部分实施例, 而不是 全部的实施例。基于本公开中的实施例, 本领域普通技术人员在没有做出创造 性劳动前提下所获得的所有其他实施例, 都属于本发明保护的范围。 BRIEF DESCRIPTION OF THE DRAWINGS The technical solutions in the embodiments of the present disclosure will be described in the following detailed description of the embodiments of the present disclosure. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present disclosure without making creative labor are within the scope of the present invention.
本公开所有实施例中采用的 TFT晶体管的源极和漏极是对称的, 所以其 源极、 漏极是没有区别的。 在本公开实施例中, 为区分 TFT晶体管除欐极之 外的两极, 将其中一极称为源极, 另一极称为漏极。 此外, 按照场效应晶体管 的特性区分可以将晶体管分为 NMOS管(n型金属 -氧化物-半导体场效应晶体 管) 和 PMOS管 (p型金属 -氧化物-半导体场效应晶体管)。 在本公开实施例 提供的 AMOLED像素电路中,所有晶体管均是以 NMOS管为例进行的说明, 可以想到的是采 PMOS 管实现是本领域技术人员可在没有做出创造性劳动 前提下轻易想到的, 因此也是在本公开的实施例保护范围内的。  The source and drain of the TFT transistor employed in all embodiments of the present disclosure are symmetrical, so that the source and drain are indistinguishable. In the embodiment of the present disclosure, in order to distinguish the two poles of the TFT transistor except the drain, one of the poles is referred to as a source and the other pole is referred to as a drain. In addition, according to the characteristics of the field effect transistor, the transistor can be divided into an NMOS transistor (n-type metal-oxide-semiconductor field effect transistor) and a PMOS transistor (p-type metal-oxide-semiconductor field effect transistor). In the AMOLED pixel circuit provided by the embodiment of the present disclosure, all of the transistors are described by taking an NMOS transistor as an example. It is conceivable that the implementation of the PMOS transistor can be easily imagined by those skilled in the art without creative work. Therefore, it is also within the scope of the embodiments of the present disclosure.
本公开实施例所述的与非门电路,包括至少两输入晶体管, 每个所述输入 晶体管的栅极接入一输入信号,第一输入晶体管的第一极和与非门输出端连接, 最后一输入晶体管的第二极接入第一电平; 除了最后一输入晶体管之外, 每一 输入晶体管的第二极与下一输入晶体管的第一极连接;  The NAND gate circuit of the embodiment of the present disclosure includes at least two input transistors, a gate of each of the input transistors is connected to an input signal, and a first pole of the first input transistor is connected to a NAND gate output, and finally a second pole of an input transistor is coupled to the first level; except for the last input transistor, the second pole of each input transistor is coupled to the first pole of the next input transistor;
所述与非门电路还包括至少两个上拉模块和至少两输入控制晶体管; 每一所述输入控制晶体管, 栅极分别接入一所述输入信号, 第一极分别与 对应的上拉模块的控制端连接, 第二极接入所述第一电平;  The NAND circuit further includes at least two pull-up modules and at least two input control transistors. Each of the input control transistors has a gate connected to the input signal, and the first pole and the corresponding pull-up module respectively. The control terminal is connected, and the second pole is connected to the first level;
所述第一输入晶体管的第一极通过该上拉模块与第二电平输出端连接; 所述输入控制晶体管用于当其栅极接入的输入信号为第二电平时,控制使 得与该输入晶体管的第一极连接的上拉模块的控制端的电位为第一电平; 所述至少两个上拉模块,用于当所有的所述输入信号都为第二电平时, 断 开所述第二电平输出端与所述与非门输出端之间的连接,并^于当所有的所述 输入信号不都为第二电平时,导通所述第二电平输出端与所述与非门输出端之 间的连接。 a first pole of the first input transistor is connected to the second level output terminal through the pull-up module; and the input control transistor is configured to control when the input signal connected to the gate thereof is at a second level The potential of the control terminal of the pull-up module connected to the first pole of the input transistor is a first level; The at least two pull-up modules are configured to disconnect the connection between the second level output end and the NAND gate output when all of the input signals are at a second level, and When all of the input signals are not at the second level, the connection between the second level output and the NAND output is turned on.
本公开实施例所述的与非门电路通过采用输入控制晶体管和上拉模块,可 以使得当所述输入晶体管为耗尽型 TTT晶体管时,与非门输出 ffi能无损传输, 实现与非门输出轨到轨, 并降低漏电流, 提高与非门电路的稳定性和速度。  The NAND gate circuit of the embodiment of the present disclosure can make the NAND gate output ffi non-destructively transmit and realize the NAND gate output when the input transistor is a depletion type TTT transistor by using an input control transistor and a pull-up module. Rail-to-rail, and reduce leakage current, improve the stability and speed of NAND gates.
根据一种具体实施方式,所述至少两输入晶体管和所述至少两输入控制晶 体管都为耗尽型 NMOS晶体管, 此时第一极为源极, 第二极为漏极, 第二电 平为高电平, 第一电平为低电平。  According to a specific embodiment, the at least two input transistors and the at least two input control transistors are both depletion mode NMOS transistors, in which case the first source is the source, the second source is the drain, and the second level is the high level. Flat, the first level is low.
根据一种具体实施方式,所述至少两输入晶体管和所述至少两输入控制晶 体管都为耗尽型 PMOS 晶体管, 此时第一极为漏极, 第二极为源极, 第二电 平为低电平, 第一电平为高电平。  According to a specific embodiment, the at least two input transistors and the at least two input control transistors are both depletion mode PMOS transistors, wherein the first extreme drain, the second extreme source, and the second level are low Flat, the first level is high.
在以下本公开实施例提供的具体的与非门电路中, 所有晶体管均是以 NMOS管为例进行的说明, 其中 NMOS管的第一极可以是源极, NMOS管的 第二极可以是漏极, 第二电平可以为高电平, 第一电平可以为低电平。 可以想 到的是采用 PMOS 管实现是本领域技术人员可在没有做出创造性劳动前提下 轻易想到的, 因此也是在本公开的实施例保护范围内的。  In the following specific NAND gate circuit provided by the embodiments of the present disclosure, all transistors are described by taking an NMOS transistor as an example. The first pole of the NMOS transistor may be a source, and the second pole of the NMOS transistor may be a drain. The second level can be a high level and the first level can be a low level. It is conceivable that the implementation using a PMOS transistor is easily conceivable by those skilled in the art without creative efforts and is therefore within the scope of the embodiments of the present disclosure.
如图 3所示, 在一具体实施例中, 所述与非门电路包括;  As shown in FIG. 3, in a specific embodiment, the NAND circuit includes:
第一输入晶体管 Ti , 栅极接入第一输入信号 IN1, 源极和与非门输出端 a first input transistor Ti, a gate connected to the first input signal IN1, a source and a NAND gate output
OUT连接; OUT connection;
第二输入晶体管 T2 , 栅极接入第二输入信号 IN2, 源极与所述第一输入 晶体管 T1的漏极连接, 漏极接入低电平 VSS ;  a second input transistor T2, the gate is connected to the second input signal IN2, the source is connected to the drain of the first input transistor T1, and the drain is connected to the low level VSS;
第一输入控制晶体管 T3, 栅极接入所述第一输入信号 IN1 , 漏极接入低 电平 VSS ;  The first input control transistor T3 has a gate connected to the first input signal IN1 and a drain connected to a low level VSS;
以及, 第二输入控制晶体管 Τ4, 栅极接入所述第二输入信号 ΙΝ2, 漏极 接入低电平 VSS;  And a second input control transistor Τ4, the gate is connected to the second input signal ΙΝ2, and the drain is connected to a low level VSS;
所述与非门电路还包括第一上拉模块 31和第二上拉模块 32 ;  The NAND gate circuit further includes a first pull-up module 31 and a second pull-up module 32;
所述第一输入控制晶体管 Τ3的源极与所述第一上拉模块 31的控制端 D1 连接; a source of the first input control transistor T3 and a control terminal D1 of the first pull-up module 31 connection;
所述第二输入控制晶体管 T4的源极与所述第二上拉模块 32的控制端 D2 连接;  The source of the second input control transistor T4 is connected to the control terminal D2 of the second pull-up module 32;
所述第一输入晶体管 T1 的源极通过所述第一上拉模块 31 与输出高电平 VDD的高电平输出端连接;  The source of the first input transistor T1 is connected to the high-level output terminal of the output high level VDD through the first pull-up module 31;
所述第一输入晶体管 T1 的源极也通过所述第二上拉模块 32与所述输出 高电平 VDD的高电平输出端连接;  The source of the first input transistor T1 is also connected to the high-level output terminal of the output high level VDD through the second pull-up module 32;
所述第一上拉模块 31和所述第二上拉模块 32, 用于当所述第一输入信号 IN1和所述第二输入信号 IN2都为高电平时,断开所述高电平输出端与所述与 非门输出端 OUT之间的连接, 截断从所述高电平输出端到所述与非门输出端 OUT的充电电流,使得所述与非门输出端 OUT的输出信号可以达到所述低电 平输出端输出的低电平  The first pull-up module 31 and the second pull-up module 32 are configured to turn off the high-level output when the first input signal IN1 and the second input signal IN2 are both high. a connection between the terminal and the NAND gate output terminal OUT, cutting off a charging current from the high-level output terminal to the NAND gate output terminal OUT, so that an output signal of the NAND gate output terminal OUT can be Reaching the low level output of the low level output
所述第一上拉模块 31和所述第二上拉模块 32, 还) ¾于当所述第一输入信 号 IN1和所述第二输入信号 IN2不都为高电平时,导通所述高电平输出端与所 述与非门输出端 OUT之间的连接, 传输无损的高电平 VDD到所述与非门输 出端 OUT。  The first pull-up module 31 and the second pull-up module 32 are further configured to turn on the high when the first input signal IN1 and the second input signal IN2 are not both high. A connection between the level output terminal and the NAND gate output terminal OUT transmits a lossless high level VDD to the NAND gate output terminal OUT.
在本公开该具体实施例所述的与非门电路中, T1和 T2、 Τ3和 Τ4都为耗 尽型 NMOS晶体管, 当 IN1和 ΙΝ2都为高电平时, Τ3控制使得 D1的电位为 低电平, Τ4控制使得 D2的电位为低电平,从而断开所述高电平输出端与 OUT 之间的连接;  In the NAND gate circuit described in this embodiment of the present disclosure, T1 and T2, Τ3, and Τ4 are both depletion mode NMOS transistors. When both IN1 and ΙΝ2 are high level, Τ3 control makes the potential of D1 low. Ping, Τ4 control causes the potential of D2 to be low, thereby disconnecting the high-level output from OUT;
当 IN1为高电平而 IN2为低电平时, T3控制使得 D1的电位为低电平, 而 T4关断, 从而第二上拉模块 32控制使得 VDD无损地传输到 OUT;  When IN1 is high and IN2 is low, T3 controls the potential of D1 to be low, and T4 is turned off, so that the second pull-up module 32 controls to make VDD transmit to OUT without loss;
当 IN2为高电平而 IN1为低电平时, T4控制使得 D2的电位为低电平, 而 T3关断, 从而第一上拉模块 31控制使得 VDD无损地传输到 OUT。  When IN2 is high and IN1 is low, T4 control causes D2 to be low and T3 is turned off, so that the first pull-up module 31 controls VDD to be transmitted to OUT without loss.
具体的,所述上拉模块包括第一上拉晶体管、第二上拉晶体管和存储电容, 所述第二上拉晶体管的栅极为该上拉模块的控制端;  Specifically, the pull-up module includes a first pull-up transistor, a second pull-up transistor, and a storage capacitor, and a gate of the second pull-up transistor is a control end of the pull-up module;
所述第一上拉晶体管, 栅极与所述第二电平输出端连接,第一极与所述第 一上拉晶体管的極极连接, 第二极与所述第二上拉晶体管的栅极连接; 所述第二上拉晶体管, 第一极与所述第二电平输出端连接, 第二极与所述 与非门输出端连接; The first pull-up transistor has a gate connected to the second level output terminal, a first pole connected to a pole of the first pull-up transistor, and a second pole connected to a gate of the second pull-up transistor Pole connection The second pull-up transistor, the first pole is connected to the second level output terminal, and the second pole is connected to the NAND gate output terminal;
所述存储电容,连接于所述第二上拉晶体管的栅极和所述第二上拉晶体管 的第二极之间。  The storage capacitor is connected between a gate of the second pull-up transistor and a second pole of the second pull-up transistor.
实施时, 当所述输入晶体管和所述输入控制晶体管为耗尽型 NMOS晶体 管时, 第一上拉晶体管和第二上拉晶体管都为耗尽型 NMOS晶体管。  In implementation, when the input transistor and the input control transistor are depletion mode NMOS transistors, both the first pull-up transistor and the second pull-up transistor are depletion mode NMOS transistors.
实施时, 当所述输入晶体管和所述输入控制晶体管为耗尽型 PMOS 晶体 管时, 第一上拉晶体管和第二上拉晶体管都为耗尽型 PMOS晶体管。  In implementation, when the input transistor and the input control transistor are depletion mode PMOS transistors, both the first pull-up transistor and the second pull-up transistor are depletion mode PMOS transistors.
如图 4所示, 本公开实施例所述的与非门电路包括:  As shown in FIG. 4, the NAND gate circuit described in the embodiment of the present disclosure includes:
第一输入晶体管 Tl, 栅极接入第一输入信号 ΙΝΊ, 源极和与非门输出端 The first input transistor T1, the gate is connected to the first input signal ΙΝΊ, the source and the NAND gate output
OUT连接; OUT connection;
第二输入晶体管 T2, 栅极接入第二输入信号 ΙΝ2, 源极与所述第一输入 晶体管 T1的漏极连接, 漏极接入低电平 VSS ;  a second input transistor T2, the gate is connected to the second input signal ΙΝ2, the source is connected to the drain of the first input transistor T1, and the drain is connected to the low level VSS;
第一输入控制晶体管 Τ3, 栅极接入所述第一输入信号 IN1 , 漏极接入低 电平 VSS ;  a first input control transistor Τ3, a gate connected to the first input signal IN1, and a drain connected to a low level VSS;
第二输入控制晶体管 Τ4, 栅极接入所述第二输入信号 ΙΝ2 , 漏极接入低 电平 VSS ;  a second input control transistor Τ4, a gate connected to the second input signal ΙΝ2, and a drain connected to a low level VSS;
第一上拉模块 41, 其控制端 D1与所述第一输入控制晶体管 Τ3的源极连 接 *  The first pull-up module 41 has its control terminal D1 connected to the source of the first input control transistor Τ3.
以及, 第二上拉模块 42, 其控制端 D2与所述第二输入控制晶体管 Τ4的 源极连接;  And the second pull-up module 42 has a control terminal D2 connected to the source of the second input control transistor Τ4;
所述第一上拉模块 41包括:  The first pull-up module 41 includes:
第一上拉晶体管 Τ5, 栅极和源极接入高电平 VDD;  The first pull-up transistor Τ5, the gate and the source are connected to a high level VDD;
第二上拉晶体管 Τ6 , 欐极与所述第一上拉模块 41 的第一上拉晶体管 Τ5 的漏极连接, 源极接入高电平 VDD, 漏极与所述与非门输出端 OUT连接; 以及, 第一存储电容 Cl, 连接于所述第一上拉模块 41的第二上拉晶体管 T6的栅极和所述第二上拉晶体管 T6的漏极之间;  a second pull-up transistor Τ6, the drain is connected to the drain of the first pull-up transistor Τ5 of the first pull-up module 41, the source is connected to the high level VDD, and the drain is connected to the NAND gate output terminal OUT And a first storage capacitor C1 connected between the gate of the second pull-up transistor T6 of the first pull-up module 41 and the drain of the second pull-up transistor T6;
与所述第二上拉晶体管 T6的栅极连接的端点为所述第一上拉模块 41 的 控制端 D1 ; 所述第二上拉模块 42包括: The end point connected to the gate of the second pull-up transistor T6 is the control terminal D1 of the first pull-up module 41; The second pull-up module 42 includes:
第三上拉晶体管 T7, 栅极和源极接入高电平 VDD;  The third pull-up transistor T7, the gate and the source are connected to a high level VDD;
第四上拉晶体管 T8,栅极与所述第三上拉晶体管 Τ7的漏极连接, 源极接 入高电平 VDD, 漏极与所述与非门输出端 OUT连接;  a fourth pull-up transistor T8 having a gate connected to a drain of the third pull-up transistor Τ7, a source connected to a high level VDD, and a drain connected to the NAND gate output terminal OUT;
以及, 第二存储电容 C2,连接于所述第四上拉晶体管 T8的栅极和所述第 四上拉晶体管 T8的漏极之间;  And a second storage capacitor C2 connected between the gate of the fourth pull-up transistor T8 and the drain of the fourth pull-up transistor T8;
与所述第四上拉晶体管 T8的栅极连接的端点为所述第二上拉模块 42的 控制端 D2;  The end point connected to the gate of the fourth pull-up transistor T8 is the control terminal D2 of the second pull-up module 42;
XI禾 Π Τ2、 Τ3、 Τ4、 Τ5、 Ί,6、 Τ7禾 Π Τ8为耗尽型 NMOS管。  XI Π Τ 2, Τ 3, Τ 4, Τ 5, Ί, 6, Τ 7 and Π Τ 8 are depletion type NMOS tubes.
在本公开该实施例所述的与非门电路工作时:  When the NAND gate circuit described in this embodiment of the present disclosure operates:
当 IN1和 IN2同时为高电平,此时 T1和 T2同时导通,将输出信号拉低; T3和 T4也导通, 将 T6和 T8的栅极电压拉至低电平, 使 T6禾 Π Τ8关断, 截 断来自输出高电平 VDD的高电平输出端对与非门输出端 OUT的充电电流。 此时输出信号可以达到 VSS;  When IN1 and IN2 are at the same time, T1 and T2 are turned on at the same time, the output signal is pulled low; T3 and T4 are also turned on, and the gate voltages of T6 and T8 are pulled low to make T6 and Τ8 is turned off, and the charging current from the high-level output terminal of the output high level VDD to the NAND gate output terminal OUT is cut off. At this point, the output signal can reach VSS;
当 IN1为高, IN2为低时, T1导通, T2截止, 与非门输出端 OUT的下 拉通路被 T2截断, 同时 T3导通, T4截止; 二极管连接的 T7导通, VDD通 过导通的 T7对 C2充电, 使得 T8的栅极电位升高, 使 T8导通, 传输高电平 到 OUT; 随着 OUT电压的上升, VDD通过导通的 T7对 C2持续充电, 丛而 使 T8的栅极电位持续抬升,一直可以达到超过 (VDD+VTH8)的正电压, VTH8 是 T8的阈值电压, 使 T8完全导通, 从而 VDD可以从 T8的漏极无损地传输 到 T8的源极 (即 OUT);  When IN1 is high and IN2 is low, T1 is turned on, T2 is turned off, and the pull-down path of NAND gate output terminal OUT is cut off by T2, while T3 is turned on and T4 is turned off; diode-connected T7 is turned on, and VDD is turned on. T7 charges C2, so that the gate potential of T8 rises, turns T8 on, and transmits high level to OUT. As the OUT voltage rises, VDD continuously charges C2 through the turned-on T7, so that the gate of T8 The pole potential continues to rise and can reach a positive voltage exceeding (VDD+VTH8). VTH8 is the threshold voltage of T8, making T8 fully conductive, so that VDD can be transmitted from the drain of T8 to the source of T8 without loss (ie OUT) );
当 INI为低, IN2为高时, Ti截止, T2导通, 与非门输出端的下拉通路 被 T1截断; 同时 T4导通, T3截止; 二极管连接的 T5导通, VDD通过导通 的 T5对 C1充电,使得 T6的栅极电位升高,使 T6导通,传输高电平到 OUT; 随着 OUT的电压的上升, C1使 T6的欐极电位持续抬升, 一直可以达到超过 (VDD+VTH6) 的正电压, VTH6为 T6的阈值电压, 使 T6完全导通, 丛而 VDD可以从 T6的漏极无损地传输到 T6的源极 (即 OUT)。  When INI is low and IN2 is high, Ti is off and T2 is on. The pull-down path of the NAND gate output is truncated by T1. At the same time, T4 is turned on and T3 is turned off. The diode-connected T5 is turned on, and VDD is turned on. C1 is charged, so that the gate potential of T6 is raised, T6 is turned on, and the high level is transmitted to OUT. As the voltage of OUT rises, C1 causes the potential of T6 to continuously rise, which can be exceeded (VDD+VTH6). The positive voltage, VTH6 is the threshold voltage of T6, making T6 fully conductive, and VDD can be losslessly transmitted from the drain of T6 to the source of T6 (ie, OUT).
在图 4中, 与驱动晶体管相比, T5和 T6可以是 W/L (宽长 很小的晶 体管, 这样会在 OUT输出低电平时, T6栅极为低电平, T6的关态的漏电远 小于图 2中 T3的导通静态电流。 另外由于 Τ5的尺寸很小, Τ5和 Τ6的导通 静态电流之和都会远小于图 2中 Τ3的导通静态电流, 从而降低漏电流。 图 4 中 Τ7、 Τ8与 Τ5、 Τ6情况相同, 这里不再复述。 In Figure 4, compared to the drive transistor, T5 and T6 can be W/L (transistors with small width and length, which will make T6 gate low when OUT output low level, and leakage of T6 off state) Less than the conduction quiescent current of T3 in Figure 2. In addition, since the size of the Τ5 is small, the sum of the on-state quiescent currents of Τ5 and Τ6 is much smaller than the on-state quiescent current of Τ3 in Fig. 2, thereby reducing the leakage current. In Fig. 4, Τ7 and Τ8 are the same as Τ5 and Τ6, and will not be repeated here.
本公开该实施例所述的与非门电路, 采用电容自举结构, 由 8个 TFT晶 体管和 2个电容构成, 可以使输出轨到轨, 实现全电压摆幅, 并使得输出无损 传输, 并降低漏电流, 提高与非门电路的稳定性和速度。  The NAND gate circuit of the embodiment of the present disclosure adopts a capacitor bootstrap structure, which is composed of 8 TFT transistors and 2 capacitors, can make the output rail-to-rail, realize full voltage swing, and make the output lossless transmission, and Reduce leakage current and improve the stability and speed of NAND gate circuits.
本公开还提供了一种显示器背板, 包括上述的与非门电路。  The present disclosure also provides a display backplane comprising the NAND gate circuit described above.
本公开还提供了一种显示器, 包括上述的显示器背板。  The present disclosure also provides a display comprising the display backplane described above.
本公开还提供一种电子设备, 包括上述的与非门电路。  The present disclosure also provides an electronic device including the above NAND gate circuit.
以上所述是本发明的优选实施方式, 应当指出,对于本技术领域的普通技 术人员来说,在不脱离本发明所述原理的前提下,还可以作出若干改进和润饰, 这些改进和润饰也应视为本发明的保护范围。  The above is a preferred embodiment of the present invention, and it should be noted that those skilled in the art can also make several improvements and retouchings without departing from the principles of the present invention. It should be considered as the scope of protection of the present invention.

Claims

1 . 一种与非门电路, 包括至少两输入晶体管, 每个所述输入晶体管的栅 极接入一输入信号,第一输入晶体管的第一极和与非门输出端连接, 最后一输 入晶体管的第二极接入第一电平; 除了最后一输入晶体管之外, 每一输入晶体 管的第二极与下一输入晶体管的第一极连接; 1. A NAND gate circuit, including at least two input transistors, the gate of each input transistor is connected to an input signal, the first electrode of the first input transistor is connected to the output terminal of the NAND gate, and the last input transistor The second pole of is connected to the first level; except for the last input transistor, the second pole of each input transistor is connected to the first pole of the next input transistor;
其中,所述与非门电路还包括至少两个上拉模块和至少两输入控制晶体管; 每一所述输入控制晶体管, »极分别接入一所述输入信号,第一极分别与 对应的上拉模块的控制端连接, 第二极接入所述第一电平; Wherein, the NAND gate circuit also includes at least two pull-up modules and at least two input control transistors; each of the input control transistors has a first pole connected to one of the input signals, and a first pole is connected to the corresponding upper pole respectively. The control end of the pull module is connected, and the second pole is connected to the first level;
所述第一输入晶体管的第一极通过该上拉模块与第二电平输出端连接; 所述输入控制晶体管用于当其栅极接入的输入信号为第二电平时,控制使 得与该输入晶体管的第一极连接的上拉模块的控制端的电位为第一电平; The first pole of the first input transistor is connected to the second level output terminal through the pull-up module; the input control transistor is used to control the input signal connected to the second level when the input signal connected to its gate is the second level. The potential of the control terminal of the pull-up module connected to the first pole of the input transistor is the first level;
所述至少两个上拉模块, 用于当所有的所述输入信号都为第二电平时, 断 开所述第二电平输出端与所述与非门输出端之间的连接,并) ¾于当所有的所述 输入信号不都为第二电平时,导通所述第二电平输出端与所述与非门输出端之 间的连接。 The at least two pull-up modules are used to disconnect the second level output terminal from the NAND gate output terminal when all the input signals are at the second level, and) ¾ When all the input signals are not at the second level, the connection between the second level output terminal and the NAND gate output terminal is turned on.
2. 如权利要求 1 所述的与非门电路, 其中, 所述至少两输入晶体管和所 述至少两输入控制晶体管都为耗尽型 NMOS晶体管。 2. The NAND gate circuit of claim 1, wherein the at least two input transistors and the at least two input control transistors are depletion mode NMOS transistors.
3. 根据权利要求 2所述的与非门电路, 其中, 所述第一极为源极, 所述 第二极为漏极, 所述第二电平为高电平, 所述第一电平为低电平。 3. The NAND gate circuit according to claim 2, wherein the first pole is a source, the second pole is a drain, the second level is a high level, and the first level is low level.
4. 如权利要求 1 所述的与非门电路, 其中, 所述至少两输入晶体管和所 述至少两输入控制晶体管都为耗尽型 PMOS晶体管。 4. The NAND circuit of claim 1, wherein the at least two input transistors and the at least two input control transistors are depletion mode PMOS transistors.
5. 根据权利要求 4所述的与非门电路, 其中, 所述第一极为漏极, 所述 第二极为源极, 所述第二电平为低电平, 所述第一电平为高电平。 5. The NAND gate circuit according to claim 4, wherein the first pole is a drain, the second pole is a source, the second level is a low level, and the first level is high level.
6. 如权利要求 1 所述的与非门电路, 其中, 所述上拉模块包括第一上拉 晶体管、 第二上拉晶体管和存储电容, 其中, 6. The NAND gate circuit of claim 1, wherein the pull-up module includes a first pull-up transistor, a second pull-up transistor and a storage capacitor, wherein,
所述第二上拉晶体管的栅极为该上拉模块的控制端; The gate of the second pull-up transistor is the control end of the pull-up module;
所述第一上拉晶体管, 栅极与所述第二电平输出端连接,第一极与所述第 一上拉晶体管的極极连接, 第二极与所述第二上拉晶体管的栅极连接; 所述第二上拉晶体管, 第一极与所述第二电平输出端连接, 第二极与所述 与非门输出端连接; The gate of the first pull-up transistor is connected to the second level output terminal, the first electrode is connected to the electrode of the first pull-up transistor, and the second electrode is connected to the gate of the second pull-up transistor. pole connection; The second pull-up transistor has a first pole connected to the second level output terminal and a second pole connected to the NAND gate output terminal;
所述存储电容,连接于所述第二上拉晶体管的栅极和所述第二上拉晶体管 的第二极之间。 The storage capacitor is connected between the gate electrode of the second pull-up transistor and the second electrode of the second pull-up transistor.
7, 如权利要求 6所述的与非门电路, 其中, 当所述输入晶体管和所述输 入控制晶体管为耗尽型 NMOS晶体管时, 第一上拉晶体管和第二上拉晶体管 都为耗尽型 NMOS晶体管。 7. The NAND circuit of claim 6, wherein when the input transistor and the input control transistor are depletion NMOS transistors, both the first pull-up transistor and the second pull-up transistor are depletion mode. type NMOS transistor.
8. 根据权利要求 7所述的与非门电路, 其中, 所述第一极为源极, 所述 第二极为漏极, 所述第二电平为高电平, 所述第一电平为低电平。 8. The NAND gate circuit according to claim 7, wherein the first pole is a source, the second pole is a drain, the second level is a high level, and the first level is low level.
9. 如权利要求 6所述的与非门电路, 其中, 当所述输入晶体管和所述输 入控制晶体管为耗尽型 PMOS 晶体管时, 第一上拉晶体管和第二上拉晶体管 都为耗尽型 PMOS晶体管。 9. The NAND circuit of claim 6, wherein when the input transistor and the input control transistor are depletion PMOS transistors, both the first pull-up transistor and the second pull-up transistor are depletion mode. type PMOS transistor.
10. 根据权利要求 9所述的与非门电路, 其中, 所述第一极为漏极, 所述 第二极为源极, 所述第二电平为低电平, 所述第一电平为高电平。 10. The NAND gate circuit according to claim 9, wherein the first pole is a drain, the second pole is a source, the second level is a low level, and the first level is high level.
11. 一种显示器背板, 其特征在于, 包括如权利要求 1 至 10中任一权利 要求所述的与非门电路。 11. A display backplane, characterized by comprising a NAND gate circuit as claimed in any one of claims 1 to 10.
12. —种显示器, 其特征在于, 包括如权利要求 13所述的显示器背板。 12. A display, characterized by comprising the display backplane as claimed in claim 13.
13. 一种电子设备, 包括如权利要求 1-10所述的与非门电路。 13. An electronic device, including the NAND gate circuit as claimed in claims 1-10.
PCT/CN2014/083725 2013-11-15 2014-08-05 Nand gate circuit, display back panel, display and electronic device WO2015070647A1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017068233A1 (en) * 2015-10-23 2017-04-27 Ari Paasio Low power logic family

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103560782B (en) * 2013-11-15 2015-04-22 京东方科技集团股份有限公司 NAND gate circuit, displayer backboard and displayer
CN104575425B (en) * 2015-01-09 2017-04-12 深圳市华星光电技术有限公司 Scanning driving circuit and NAND logic operation circuit thereof
CN104883181B (en) * 2015-06-10 2018-03-16 京东方科技集团股份有限公司 OR-NOT circuit, shift register, array base palte and display device
US11626875B2 (en) * 2018-04-20 2023-04-11 Texas Instruments Incorporated Stress reduction on stacked transistor circuits
CN108735163B (en) * 2018-05-30 2020-11-17 京东方科技集团股份有限公司 OR logic operation circuit for array substrate row driving unit
CN110690889B (en) * 2019-10-14 2021-08-10 华南理工大学 Level shift circuit

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6392486B1 (en) * 2001-08-14 2002-05-21 Xilinx, Inc. Low-noise common-gate amplifier for wireless communications
US7061279B1 (en) * 2004-12-30 2006-06-13 Broadcom Corporation System and method for high frequency, high output swing buffers
CN1835402A (en) * 2005-03-15 2006-09-20 凌阳科技股份有限公司 Self bias high frequency logical gate and nor gate and NAND gate applied the same
CN101354924A (en) * 2007-07-23 2009-01-28 奇晶光电股份有限公司 Shift register circuit and pull-up unit thereof
CN101547004A (en) * 2009-05-12 2009-09-30 威盛电子股份有限公司 And gate circuit
JP2010098666A (en) * 2008-10-20 2010-04-30 Seiko Epson Corp Exclusive-or circuit and electro-optical device
CN103560782A (en) * 2013-11-15 2014-02-05 京东方科技集团股份有限公司 NAND gate circuit, displayer backboard and displayer

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100498453B1 (en) * 2002-11-04 2005-07-01 삼성전자주식회사 Output buffer circuit capable of reducing skew of output data
US8013633B2 (en) * 2007-06-20 2011-09-06 Hewlett-Packard Development Company, L.P. Thin film transistor logic
US8570066B2 (en) * 2011-03-24 2013-10-29 Electronics And Telecommunications Research Institute Inverter, NAND gate, and NOR gate
TWI488163B (en) * 2013-01-23 2015-06-11 Au Optronics Corp Shift register, gate drive circuit using the register and display device using the register

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6392486B1 (en) * 2001-08-14 2002-05-21 Xilinx, Inc. Low-noise common-gate amplifier for wireless communications
US7061279B1 (en) * 2004-12-30 2006-06-13 Broadcom Corporation System and method for high frequency, high output swing buffers
CN1835402A (en) * 2005-03-15 2006-09-20 凌阳科技股份有限公司 Self bias high frequency logical gate and nor gate and NAND gate applied the same
CN101354924A (en) * 2007-07-23 2009-01-28 奇晶光电股份有限公司 Shift register circuit and pull-up unit thereof
JP2010098666A (en) * 2008-10-20 2010-04-30 Seiko Epson Corp Exclusive-or circuit and electro-optical device
CN101547004A (en) * 2009-05-12 2009-09-30 威盛电子股份有限公司 And gate circuit
CN103560782A (en) * 2013-11-15 2014-02-05 京东方科技集团股份有限公司 NAND gate circuit, displayer backboard and displayer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017068233A1 (en) * 2015-10-23 2017-04-27 Ari Paasio Low power logic family

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US9325315B2 (en) 2016-04-26
US20160028398A1 (en) 2016-01-28
EP3070848A4 (en) 2017-08-02

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