WO2015068234A1

WO2015068234A1 - Substrate processing device and substrate processing line

Info

Publication number: WO2015068234A1
Application number: PCT/JP2013/080109
Authority: WO
Inventors: 加藤　光昭
Original assignee: 富士機械製造株式会社
Priority date: 2013-11-07
Filing date: 2013-11-07
Publication date: 2015-05-14
Also published as: JPWO2015068234A1; JP6272346B2

Abstract

In bypass mode, a screen printing device (20) transports a substrate (P) via a second lane (second transport conveyor (34)) and stops the operation of a first lane (first transport conveyor (32)) and a work unit working on the substrate (P). In addition, in the screen printing device (20), an inlet-side partition wall part (52), an outlet-side partition wall part (57), and the chassis (37a) of the stopped work unit separate the exterior and the interior of a predetermined space (K), which is a space where the first transport conveyor (32) is disposed and where the work on the substrate (P) is executed by the work unit (36). In this way, in the bypass mode, an operator is prevented from mistakingly reaching from within the predetermined space (K) and touching an inlet shuttle conveyor (50), an outlet shuttle conveyor (55), or the second transport conveyor (34), which are operating.

Description

Anti-substrate work device and anti-substrate work line

The present invention relates to a substrate working apparatus and a substrate working line that have a first lane and a second lane for transporting a substrate, and perform operations on the substrate.

Conventionally, as an on-board working device that performs work on a substrate, for example, a solder printing device that prints cream solder on the substrate, an adhesive application device that applies an adhesive to the substrate, an electronic component mounting device that mounts electronic components on the substrate Various devices such as an inspection device for inspecting the results of these operations are known. In addition, these counter-to-substrate working devices are arranged side by side in the left-right direction, and work is performed on each device while transporting the substrate from the upstream (for example, the left end) device to the downstream (for example, the right end) device. Work lines are also known. For example, in Patent Document 1, two solder printing devices and four electronic component mounting devices are arranged side by side as a substrate working device to constitute a substrate working line.

The solder printing apparatus disclosed in Patent Document 1 includes a work lane for transporting a substrate and performing solder printing on the upper surface of the substrate, and a substrate for transporting the substrate by passing (bypassing) the work lane. Pass lane. Also, between the two solder printing devices, the board unloaded from the work lane of the upstream solder printing device can be carried into the pass lane of the downstream solder printing device or the upstream solder printing device. A conveyor is provided to carry the substrate unloaded from the path lane of the apparatus into the work lane of the solder printing apparatus on the downstream side. When the solder printing apparatus prints solder on the surface of the board, the upstream solder printing apparatus carries the printing work by transporting the board in the work lane with the surface of the board as the upper surface, and the downstream solder. The printing apparatus transports the substrate in the pass lane. Also, when printing solder on the back side of the board, the upstream side solder printing device transports the board in the pass lane with the back side of the board as the top side, and the downstream solder printing device places the board in the work lane. It is assumed that the printing work is carried out.

Further, in Patent Document 1, the upstream side solder printing apparatus finishes printing on the front surface of the board, and the downstream side solder printing apparatus performs printing work on the back surface of the board. In the solder printing apparatus, the substrate is transferred in the pass lane, and the operator performs setup change (work preparation) to the next production type substrate in the work lane. That is, one of the two solder printing apparatuses performs printing of solder on the board in one solder printing apparatus, while the other printing apparatus transports the board in the pass lane, It describes that a setup change is performed.

JP 2011-235584 A

However, in Japanese Patent Laid-Open No. 2004-228561, the configuration of the on-board working apparatus is specifically described so that the worker can change the work lane in parallel while transporting the substrate on the path lane. It is not described how the working device is specifically operated. When a worker changes the work lane while the board is being transported on the pass lane, the operator's hand should not touch the board being transported or the conveyor being operated. It is necessary to ensure the safety of workers.

The board-to-board working apparatus and board-to-board work line of the present invention has two lanes for carrying a substrate, and the operator's manual work in the other lane is made safer while carrying the substrate in one lane. The main purpose is to do.

The board-to-board working apparatus and the board-to-board working line of the present invention employ the following means in order to achieve the above-mentioned main purpose.

The substrate working apparatus of the present invention is
A substrate working apparatus having a first lane and a second lane for transporting a substrate and performing work on the substrate,
First conveying means arranged in a predetermined space of the apparatus main body and constituting the first lane;
Second conveying means arranged outside the predetermined space of the apparatus main body and constituting the second lane;
Working means for performing work on the substrate on the substrate on the first lane in the predetermined space;
Mode switching means capable of switching between the first mode and the second mode;
During the first mode, the first transport means and the work means are controlled so that the substrate is transported at least in the first lane and the work on the substrate is performed, and during the second mode, the first lane is controlled. Control means for controlling the second transport means so that the substrate is transported in two lanes and stopping the operation of the first transport means and the working means;
A partition that separates the inside and outside of the predetermined space;
It is a summary to provide.

In the substrate work apparatus according to the present invention, during the second mode, the second transport unit is controlled so that the substrate is transported in the second lane and the operation of the first transport unit and the work unit is stopped. While the substrate is transported in the second lane during the second mode, an operator can perform manual work on the first transport unit and the working unit in a predetermined space in which the first transport unit and the working unit are arranged. For this reason, for example, when the production type of the substrate changes from the substrate being transported in the second lane, the operator performs a changeover of the first transport means and the work means in accordance with the substrate of the next production type. Can do. In addition, since the partition portion that separates the inside and outside of the predetermined space is provided, when the worker manually performs the work in the predetermined space while transporting the substrate in the second lane, the operator puts the hand out of the predetermined space to the outside of the predetermined space. It can be made difficult to put out. For this reason, for example, it is possible to prevent the operator from accidentally touching the substrate being transported in the second lane or the second transport means in operation, etc. Can be performed safely. Therefore, in the case of having two lanes of the first lane and the second lane for transporting the substrate, the manual operation of the worker in the first lane is safer while the substrate is transported in the second lane. It can be. During the first mode, it is sufficient that the substrate is transported at least in the first lane and the work on the substrate is performed. The second transport unit may be operating, or the second transport unit is not operating. May be. Further, the “partition wall portion” is not limited as long as it separates the inside and outside of the predetermined space from the inside of the predetermined space so that it is difficult for the operator to put his hand out of the predetermined space. It may be one that cannot be put out, or may have an opening or a gap that allows the operator to put out a hand from the inside of the predetermined space to the outside of the predetermined space. Further, a working means for performing the substrate work may be separately provided on the substrate on the second lane so that the substrate work can be performed even in the second mode.

In the substrate work apparatus of the present invention, the apparatus includes an openable cover attached to the apparatus main body so as to cover the predetermined space, and the control means is configured to open the cover during the first mode. The operations of the first transport unit and the working unit are stopped, and the operation of the second transport unit is not stopped even when the cover is opened during the second mode. In this way, when the cover is opened during the first mode, the first conveying means and the working means can be stopped to ensure the safety of the operator. Further, even when the cover is opened during the second mode, the operation of the second transport means is not stopped, so that the transport of the substrate in the second lane is not hindered. For this reason, during the second mode, the operator can perform manual work in the predetermined space with the cover open and easy to work.

In the substrate-to-board working apparatus according to this aspect of the present invention, when the cover is opened during the second mode, the control means monitors whether or not the working means is operating, and during the monitoring, When the operation is detected, the power supply to the working means can be stopped. By doing so, it is possible to ensure the safety of the worker even when the working means is activated when the cover is opened and the worker is performing manual work in the predetermined space.

Further, in the substrate work apparatus according to the present invention, a plate-like carry-in partition wall portion that forms a carry-in port for carrying the substrate into the first transfer means and separates the inside and outside of the predetermined space as the partition wall portion. And a plate-shaped unloading-side partition wall that forms an unloading port for unloading the substrate from the first transfer means and separates the inside and the outside of the predetermined space. By doing so, it is possible to more reliably prevent the operator from accidentally taking out his hand outside the predetermined space on the substrate carrying-in side to the first carrying unit and the substrate carrying-out side from the first carrying unit. Therefore, it is possible to make the worker perform the manual work in the predetermined space more safely.

In the substrate-to-substrate working apparatus according to this aspect of the present invention, the working means is configured as a housing that is movable at least partially from a working position in the predetermined space to a predetermined position on the second transfer means side, and the control During the second mode, the means stops the housing of the working means at a predetermined position on the second conveying means side, and the partition portion is a space where the second conveying means is disposed and the predetermined space In order to separate them from each other, the casing that is stopped at a predetermined position on the second conveying means side may be used. By doing so, it is not necessary to separately provide a partition wall for separating the space where the second transfer means is disposed from the predetermined space, and thus the number of parts of the substrate working apparatus can be reduced.

In the substrate work apparatus according to the present invention, the apparatus further includes a substrate carry-in means that can carry the substrate from outside the apparatus and deliver it to the first transfer means or the second transfer means, and the control means includes the first mode. During the second mode, the substrate carrying means is controlled so that the substrate carried from outside the apparatus is delivered to the first carrying means, and during the second mode, the substrate carried from outside the apparatus is received by the second carrying means. The substrate carry-in means may be controlled to pass. In this way, the substrate can be transferred from the substrate carry-in means to the first transfer means or the second transfer means depending on whether the current mode is the first mode or the second mode. The previous sorting can be performed by a simple process.

The board-to-board work line of the present invention is
As a board-to-board operation, a solder printing apparatus that prints solder on the board;
An adhesive application device that applies an adhesive on the substrate as a substrate operation;
A component mounting apparatus for mounting a component on the substrate on which the substrate operation has been performed;
A board-to-board work line,
The gist is that at least one of the solder printing device or the adhesive application device is configured as the above-described substrate-to-board working device of the present invention.

In this counter-to-board work line of the present invention, if the solder printing apparatus is configured as the counter-to-board work apparatus of the present invention, the adhesive is applied on the substrate by the adhesive application device without printing the solder on the substrate, and then applied. When the electronic component is mounted on the spot by the electronic component mounting apparatus, the solder printing apparatus transports the board in the second lane, and the operator can perform manual work in the predetermined space. Moreover, in the circuit board work line of the present invention, if the adhesive application device is configured as the circuit board work device of the present invention, solder is printed on the substrate by the solder printing device without applying the adhesive on the substrate. When an electronic component is mounted on an area where solder is printed by an electronic component mounting apparatus, the adhesive application device may transport the substrate with the substrate to the second lane, and an operator may perform manual work in a predetermined space. it can. For this reason, since a setup change etc. in advance when the production type of a board | substrate changes can be performed during a board | substrate operation | work or an electronic component mounting, the operation rate of a board | substrate work line can be improved.

1 is a configuration diagram showing an outline of the configuration of a component mounting line 10. FIG. 2 is a configuration diagram showing an outline of a configuration of a screen printing apparatus 20. FIG. 3 is an explanatory diagram illustrating a lane configuration of the screen printing apparatus 20. FIG. 3 is an explanatory diagram showing a lane configuration of a component mounting line 10. FIG. It is a flowchart which shows an example of a mode switching process routine. It is a flowchart which shows an example of a board | substrate conveyance work processing routine. 6 is a flowchart illustrating an example of a cover closing process routine. It is a flowchart which shows an example of a cover opening time process routine. 5 is an explanatory view showing a state of production of a board P in the component mounting line 10. FIG. It is a block diagram which shows the outline of a structure of the screen printing apparatus 120 of the modification. It is a block diagram which shows the outline of a structure of the carrying-in side partition part 152 and the carrying-out side partition part 157 of a modification.

Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a configuration diagram showing an outline of the configuration of the component mounting line 10, FIG. 2 is a configuration diagram showing an overview of the configuration of the screen printing apparatus 20, and FIG. 3 shows a lane configuration of the screen printing apparatus 20. FIG. 4 is an explanatory diagram showing a lane configuration of the component mounting line 10. In the present embodiment, the X direction refers to the left-right direction of the apparatus among the two axes orthogonal in the horizontal plane, the Y direction refers to the front-rear direction of the apparatus among the two axes orthogonal in the horizontal plane, and the Z direction corresponds to the horizontal plane. An orthogonal direction (vertical direction) perpendicular to each other (refer to FIG. 2).

As shown in FIG. 1, the component mounting line 10 includes a screen printing device 20 that prints solder on a substrate P (see FIG. 2) by screen printing, an adhesive application device 60 that applies an adhesive to the substrate P, and a substrate. A plurality of component mounting apparatuses 70 (seven in the present embodiment) for mounting components on a place where solder is printed on P or an area where an adhesive is applied to the substrate P, and a management computer 80 which manages each apparatus Is provided. In the component mounting line 10, the screen printing device 20, the adhesive application device 60, and the plurality of component mounting devices 70 are sequentially arranged from the upstream side to the downstream side (left to right in the X direction) in the conveyance direction of the substrate P. They are set up side by side. Hereinafter, the screen printing apparatus 20 will be mainly described.

The screen printing apparatus 20 includes a so-called dual lane having a first lane and a second lane for transporting the substrate P. The screen printing apparatus 20 uses a squeegee to push solder into a pattern hole (not shown) formed on the screen S (see the box in FIG. 2) on the first lane, thereby soldering the substrate P below the screen S. Print and do not perform solder printing on the second lane. The conveyance of the substrate P in the first lane is also referred to as printing conveyance, and the conveyance of the substrate P in the second lane is also referred to as path conveyance. The screen printing apparatus 20 includes an apparatus main body 22, a cover 24 that covers the upper surface of the apparatus main body 22, and an operation panel 26 that receives operations from an operator and displays various work screens. FIG. 2 shows a state where the cover 24 is opened. The screen printing apparatus 20 includes a loading shuttle conveyor 50 for loading the substrate P into the apparatus in the left casing 51 of the apparatus main body 22, and the substrate P is mounted in the right casing 56 of the apparatus main body 22. An unloading shuttle conveyor 55 for unloading is provided.

The apparatus main body 22 of the screen printing apparatus 20 includes a first transport conveyor 32 that forms a first lane, a second transport conveyor 34 that forms a second lane, and a work unit 36 that includes various units for solder printing. In addition, a detection sensor group 41 including various detection sensors, a power supply unit 45 that supplies power to each part of the apparatus, and a controller 47 that controls the entire apparatus are incorporated.

As shown in FIG. 3, the first conveyor 32 is composed of three conveyors: an in-conveyor 32a, a main conveyor 32b, and an out-conveyor 32c. Moreover, the 2nd conveyance conveyor 34 is also comprised by three conveyors, the in-conveyor 34a, the main conveyor 34b, and the out conveyor 34c. Each of these conveyors is configured to be able to change the transport width in accordance with the width of the substrate P to be transported. The board P transported by the main conveyor 32b of the first transport conveyor 32 stops at a predetermined printing position such as the center in the left-right direction of the main conveyor 32b, and solder printing is performed by the work unit 36. In the apparatus main body 22, a space where the first transfer conveyor 32 is arranged and solder printing is performed on the substrate P by the work unit 36 is referred to as a predetermined space K, and an image of the predetermined space K is shown in FIGS. 3 is indicated by a dotted line.

The work unit 36 includes a camera unit 37 in which a camera capable of imaging in a vertical direction is incorporated in a substantially rectangular parallelepiped housing 37a, and a substrate P that has been transported to a predetermined printing position by a main conveyor 32b of the first transport conveyor 32. And a squeegee unit 39 that operates by lowering the squeegee to the upper surface of the screen S. The camera unit 37 includes an imaging position between the screen S and the substrate P transported to a predetermined printing position, and a predetermined standby position on the second transport conveyor 34 side (the camera unit 37 (enclosure shown in FIGS. 2 and 3). It is configured to be able to reciprocate back and forth between the position of the body 37a). When the housing 37a moves to the imaging position, the camera unit 37 images the lower substrate P and the upper screen S. The substrate holding unit 38 holds and raises the substrate P so as to correct the positional deviation based on the positional deviation in the front-rear and left-right directions of the substrate P and the screen S detected from the captured image of the camera unit 37. The substrate holding unit 38 raises the substrate P by raising the backup plate from below the substrate P. This backup plate can be replaced with one that matches the size of the substrate S.

The detection sensor group 41 is disposed on the front side of the apparatus main body 22 (see FIG. 2), and is configured to open and close the cover 24 by detecting the opening and closing of the cover 24 by being configured so that a convex portion provided on the back surface of the cover 24 is fitted. A detection sensor 42 and a camera unit standby position detection sensor 43 that is disposed in the vicinity of the standby position of the camera unit 37 and detects whether the camera unit 37 (housing 37a) is in the standby position. In addition, although the detection sensor group 41 is provided with various sensors besides these, since it does not make the summary of this invention, description is abbreviate | omitted.

The carrying-in shuttle conveyor 50 is configured to be movable in the Y direction, and has a position where the substrate P can be transferred to the in-conveyor 32a of the first transfer conveyor 32 (shown by a solid line in FIG. 3), and the second transfer conveyor 34. It moves to a position (illustrated by a dotted line in FIG. 3) where the substrate P can be delivered to the in-conveyor 34a. Further, the carry-out shuttle conveyor 55 is configured to be movable in the Y direction, a position where the substrate P can be transferred from the out conveyor 32c of the first transfer conveyor 32 (shown by a solid line in FIG. 3), and the second transfer. It moves between positions where the substrate P can be delivered from the out conveyor 34c of the conveyor 34 (illustrated by a dotted line in FIG. 3). Further, the carry-in shuttle conveyor 50 and the carry-out shuttle conveyor 55 are configured to be able to change the transport width in accordance with the width of the substrate P to be transported.

Here, as shown in FIG. 3, the inside of the casing 51 in which the carrying-in shuttle conveyor 50 is arranged and the predetermined space K in the apparatus main body 22 are separated by a flat plate-like carrying-in side partition part 52. In the carry-in partition wall 52, the carry-in shuttle conveyor 50 carries the substrate P into the in-conveyor 32 a of the first carry conveyor 32, and the carry-in shuttle conveyor 50 to the second carry conveyer 34. No opening is formed except that the second carry-in port 52b for carrying the substrate P into the in-conveyor 34a is formed. For this reason, the predetermined space K described above communicates with the inside of the casing 51 through the first carry-in port 52a. Therefore, in order for the worker to put his hand into the casing 51 from the predetermined space K, it is necessary to put his hand through the first carry-in port 52a, so that the operator can enter the casing 51 from the predetermined space K without intention. It becomes difficult to put out your hands. Further, the inside of the casing 56 in which the carry-out shuttle conveyor 55 is arranged and the predetermined space K in the apparatus main body 22 are separated by a flat plate-like carry-out side partition wall portion 57. The unloading partition wall 57 has a first unloading port 57 a for unloading the substrate P from the out conveyor 32 c of the first transfer conveyor 32 to the unloading shuttle conveyor 55, and an unloading from the out conveyor 34 c of the second transfer conveyor 34. No opening is formed other than the second carry-out port 57b for carrying the substrate P out to the shuttle conveyor 55. For this reason, the predetermined space K communicates with the inside of the housing 56 through the first carry-out port 57a. Therefore, in order for the operator to put his hand into the housing 56 from the predetermined space K, it is necessary to put his hand through the first carry-out port 57a, so that the operator can enter the housing 56 from the predetermined space K without intention. It becomes difficult to put out your hands. Further, the housing 37a of the camera unit 37 at the predetermined standby position is located between the predetermined space K and the space where the second transfer conveyor 34 is disposed. For this reason, the housing 37a of the camera unit 37 separates the predetermined space K and the space in which the second transport conveyor 34 is disposed in the front-rear direction. Therefore, it is difficult for the operator to put out his hand from the predetermined space K to the space where the second conveyor 34 is disposed.

The controller 47 is configured as a microprocessor centered on a CPU, and includes a memory for storing various processing programs and various data. The controller 47 outputs a control signal to each section such as the first transport conveyor 32, the second transport conveyor 34, the loading shuttle conveyor 50, the unloading shuttle conveyor 55, the work unit 36, the power supply unit 45, and the operation panel 26. A display signal is output, and various information is transmitted to the management computer 80. In addition, the controller 47 inputs an operation signal input by the operator via the operation panel 26, inputs a captured image captured by the camera unit 37 of the work unit 36, and a detection signal from the detection sensor group 41. And various information from the management computer 80 are input.

The adhesive application device 60 is configured as a device that applies an adhesive to the substrate P using an application head for applying an adhesive. Each of the plurality of component mounting apparatuses 70 is configured as an apparatus for mounting a component on the board P using a mounting head for mounting the component. The adhesive application device 60 and the plurality of component mounting devices 70 are configured by dual lanes, and work can be performed on either the front lane or the rear lane. For this reason, the board | substrate carried out from the screen printing apparatus 20 is suitably distributed to the lane of the front side or back side. For example, in the component mounting line 10, as shown in FIG. 4A, the substrate P is transported (printed transport) in the first lane of the screen printing device 20, and the adhesive application device 60 and a plurality of component mounting devices are used. The substrate P is transported in the lane on the front side of 70, or the substrate P is transported (pass transport) in the second lane of the screen printing apparatus 20 as shown in FIG. The board P is transported in the lane on the front side of the plurality of component mounting apparatuses 70.

The management computer 80 is configured as a microprocessor centered on a CPU, and displays a memory for storing various processing programs and various data, an input device 82 such as a keyboard and a mouse for an operator to input various commands, and displays various information. Display 84. Here, what kind of solder print pattern is formed on which substrate P by the screen printing apparatus 20, what kind of adhesive application pattern is formed on which board P by the adhesive application device 60, A plan in which the component mounting apparatus 70 determines which component is mounted on which substrate P, how many substrates P (assembly) on which the component is mounted, and the like is referred to as a substrate P production plan. The management computer 80 receives a production plan from an operator via the input device 82, and sends various instruction information to the screen printing apparatus 20, the adhesive application apparatus 60, and each component mounting apparatus 70 so that production is performed according to the received production plan. Send.

Next, the operation of the screen printing apparatus 20 configured as described above will be described. FIG. 5 is a flowchart showing an example of a mode switching process routine executed by the CPU of the controller 47. This routine is executed when a mode switching instruction is received via the management computer 80. Note that the screen printing apparatus 20 has a printing mode in which the substrate P is transported by printing and a pass mode in which the substrate P is transported by pass transportation. In the pass mode, an instruction to switch to the printing mode is given. During the print mode, an instruction to switch to the pass mode is issued.

When the mode switching processing routine is executed, the controller 47 first determines whether or not the mode switching instruction is a switching instruction to the printing mode (step S100). If the mode switching instruction is a switching instruction to the printing mode, the controller 47 waits for the substrate P to be paid out from the second lane in which the substrate P is being transported (step S110). When the substrate P is paid out from the second lane, the controller 47 stops the operation of the second conveyor 34 (step S120), displays a print mode start waiting screen on the operation panel 26 (step S130), and print mode. It waits for a start instruction (step S140). For example, the controller 47 displays a screen prompting the operator to press the start button of the operation panel 26 as the print mode start waiting screen. When the operator presses the start button, the controller 47 determines that the print mode start instruction has been issued. When the controller 47 determines that the print mode start instruction has been given, the controller 47 turns the pass mode flag from on to off (step S150), activates the first conveyor 32 (step S160), and activates the work unit 36. In step S170, the mode switching process is terminated. The pass mode flag is a flag indicating that the pass mode is in effect, and here the pass mode flag is turned off in order to switch to the print mode. The print mode is started by these processes. Prior to the start of the printing mode, it is necessary to change the screen printing apparatus 20 in accordance with the type (production type) of the substrate P. This setup change includes, for example, replacement of the screen S by the operator, replacement of the squeegee of the squeegee unit 39, replenishment of solder, replacement of the backup plate of the substrate holding unit 38, etc. in the predetermined space K, and the controller 47. The change of the conveyance width of each conveyor, such as the 1st conveyance conveyor 32 by, is mentioned.

On the other hand, if the mode switching instruction is the switching instruction to the pass mode in step S100, the controller 47 waits for the substrate P to be paid out from the first lane in which the printing conveyance is performed (step S180). When the substrate P is paid out from the first lane, the controller 47 stops the operation of the first transfer conveyor 32 (step S190) and stops the operation of the work unit 36 (step S200). In step S200, if each unit of the work unit 36 is not in each standby position, the controller 47 moves each unit to the standby position and then stops it. For this reason, the housing 37a of the camera unit 37 is also stopped at a predetermined standby position. Therefore, as described above, the housing 37a of the camera unit 37 separates the predetermined space K from the space where the second transport conveyor 34 is disposed in the front-rear direction. Next, the controller 47 displays a pass mode start waiting screen on the operation panel 26 (step S210), and waits for a pass mode start instruction (step S220). For example, the controller 47 displays a screen prompting the operator to press the start button of the operation panel 26 as the pass mode start waiting screen. When the worker presses the start button, the controller 47 determines that a pass mode start instruction has been issued. When the controller 47 determines that the pass mode start instruction has been issued, the controller 47 turns the pass mode flag from OFF to ON (step S230), activates the second transfer conveyor 34 (step S240), and ends the mode switching process. To do. The pass mode is started by these processes.

Next, the operation during each mode of the screen printing apparatus 20 will be described. FIG. 6 is a flowchart showing an example of a substrate transfer work processing routine executed by the CPU of the controller 47. In the above-described mode switching process, this routine is repeatedly executed after the start-up process in steps S160 and S170 is completed in the print mode, and is repeatedly executed after the start-up process in step S240 is completed in the pass mode. The

When this routine is executed, the controller 47 first waits until the substrate P can be loaded (step S300). In the printing mode, the substrate P can be received in the first lane and the substrate P can be loaded when there is a substrate P waiting for the next transfer. In the pass mode, the substrate P can be received in the second lane. When there is a substrate P waiting for the next transfer, the substrate P can be loaded. When the board P can be loaded, the controller 47 loads the board P on the loading shuttle 50 (step S310), and determines whether or not the pass mode flag is off (step S320). When the controller 47 determines that the pass mode flag is off, that is, the printing mode is in progress, the controller 47 delivers the substrate P from the carry-in shuttle conveyor 50 to the in-conveyor 32a and transports the substrate P on the first transport conveyor 32 ( The printing is carried out (step S330), and the solder printing process is performed by controlling the work unit 36 during the carrying (step S340). By the processing in steps S330 and S340, the controller 47 first transports the substrate P from the in-conveyor 32a to the main conveyor 32b, stops the substrate P at the printing position during the transport on the main conveyor 32b, and causes the work unit 36 to Perform solder printing. Then, the controller 47 resumes the conveyance of the substrate P by the main conveyor 32b after the solder printing, conveys the substrate P to the out conveyor 32c, and delivers the substrate P from the out conveyor 32c to the unloading shuttle conveyor 55. When the controller 47 delivers the substrate P to the carry-out shuttle conveyor 55, the controller 47 waits until the adhesive coating device 60 is ready to accept the substrate P and can carry out the substrate P (step S360). When the substrate P can be unloaded, the controller 47 unloads the substrate P by the unloading shuttle conveyor 55 (step S370), and ends the substrate transfer work process.

On the other hand, if the controller 47 determines in step S320 that the pass mode flag is on, ie, the pass mode is in effect, the controller 47 delivers the substrate P from the loading shuttle conveyor 50 to the in-conveyor 34a, and the second transfer conveyor 34 sets the substrate. P is conveyed (pass conveyance) (step S350). By the processing in step S350, the controller 47 sequentially transfers the substrate P through the in-conveyor 34a, the main conveyor 34b, and the out-conveyor 34c, and delivers the substrate P to the unloading shuttle conveyor 55. Then, when the substrate P can be unloaded in step S360, the controller 47 unloads the substrate P by the unloading shuttle conveyor 55 in S370 and ends the substrate transfer work process. Note that the adhesive is applied to the substrate P that has been transported by the adhesive by the adhesive application device 60, and the component is mounted by the component mounting device 70. Thus, in the substrate transfer work process, the controller 47 distributes the substrate P to the first lane (first transfer conveyor 32) if the pass mode flag is off, and the second lane (if the pass mode flag is on). The substrate P is distributed to the second transport conveyor 34). That is, the controller 47 determines the distribution destination of the substrate P according to the on / off of the pass mode flag.

Subsequently, processing related to the opening and closing of the cover 24 will be described. FIG. 7 is a flowchart showing an example of a cover closing process routine executed by the CPU of the controller 47, and FIG. 8 is a flowchart showing an example of a cover opening process routine executed by the CPU of the controller 47. 7 is repeatedly executed when the cover opening flag is off, and the cover opening process of FIG. 8 is repeatedly executed when the cover opening flag is on.

7 is executed, the controller 47 first determines whether or not the open state of the cover 24 is detected based on the detection signal from the cover open / close detection sensor 42 (step S400). When the controller 47 determines that the open state of the cover 24 is not detected, that is, when the cover 24 is maintained in the closed state, the controller 47 ends the cover closing process as it is. On the other hand, when the controller 47 determines that the open state of the cover 24 is detected, the controller 47 determines whether or not the pass mode flag is off (step S410). When the controller 47 determines that the pass mode flag is off, that is, the printing mode is in progress, the controller 47 stops the operation of the first conveyor 32 (step S420) and stops the operation of the work unit 36 (step S420). S430). Then, the controller 47 displays the occurrence of the cover opening error on the operation panel 26 (step S440), sets the cover opening flag from off to on (step S450), and ends the cover closing process. Since the screen printing apparatus 20 performs solder printing by transporting the substrate P in the first lane on the near side of the apparatus main body 22 during the printing mode, when the cover 24 is opened, the first transport conveyor in operation There is a risk that the operator's hand touches the 32 or the work unit 36. For this reason, when the cover 24 is opened, the controller 47 stops the operation of the first transfer conveyor 32 and the work unit 36 to ensure the safety of the worker.

On the other hand, if the controller 47 determines in step S410 that the pass mode flag is off, that is, the pass mode is in effect, the controller 47 turns the cover open flag from off to on (step S450), and ends the cover closing process. During the pass mode, the screen printing apparatus 20 is transporting the substrate P in the second lane on the back side of the apparatus main body 22, and the first transport conveyor 32 and the work unit 36 are already stopped. Further, the controller 47 does not stop the second conveyor 34 even when the cover 24 is opened during the pass mode. For this reason, the screen printing apparatus 20 performs the pass conveyance of the substrate P even while the cover 24 is in the open state.

8 is executed, the controller 47 first determines whether or not the pass mode flag is off (step S500). When the controller 47 determines that the pass mode flag is off, that is, the printing mode is in progress, the controller 47 determines whether or not the closed state of the cover 24 is detected based on the detection signal from the cover open / close detection sensor 42. (Step S510). When the controller 47 determines that the closed state of the cover 24 has not been detected, that is, if the cover 24 remains open, the cover opening process is terminated. Further, when the controller 47 determines that the closed state of the cover 24 is detected, that is, when the cover 24 is closed, the controller 47 returns the first transport conveyor 32 (step S520) and moves the work unit 36 to the work unit 36. Return (step S530). In the case where it is difficult to return immediately, such as when it is necessary to once discharge the board P on which the solder printing has been interrupted due to the stop processing in steps S520 and S530 of the cover closing processing, the controller 47 performs the intervention of the operator. Separate processing such as prompting. When the controller 47 performs the return process in step S530, the display of the cover open error on the operation panel 26 is deleted (step S540), the cover open flag is turned off from on (step S550), and the cover open process is terminated. .

On the other hand, if the controller 47 determines in step S500 that the pass mode flag is off, that is, the pass mode is in effect, the controller 47 detects whether or not the cover 24 is closed based on a signal from the cover open / close detection sensor 42. Is determined (step S560). When the controller 47 determines that the closed state of the cover 24 is not detected, that is, when the cover 24 remains open, the controller 47 determines whether or not the operation of the work unit 36 is detected (step S570). ). In the present embodiment, in step S570, the controller 47 determines whether or not the movement of the casing 37a of the camera unit 37 in the work unit 36 has been detected. Therefore, in step S570, the controller 47 inputs the detection signal from the camera unit standby position detection sensor 43, and monitors the movement of the housing 37a of the camera unit 37 from the standby position based on the detection signal. As described above, since the operation of the work unit 36 is stopped during the pass mode, the controller 47 monitors whether or not the work unit 36 malfunctions in the process of step S570. If the controller 47 determines that the operation of the work unit 36 (camera unit 37) has not been detected, the controller closes the cover opening process. If the controller 47 determines that the operation of the work unit 36 (camera unit 37) has been detected, the controller 47 stops the work unit 36 by stopping the power supply from the power supply unit 45 to the work unit 36 (step). (S580), the occurrence of an operation error is displayed on the operation panel 26 (step S590), and the cover opening process is terminated. As described above, during the pass mode in which the substrate P is passed in the second lane, the controller 47 monitors the operation of the work unit 36 while the cover 24 is open, and when the work unit 36 is operated, the controller 47 The power supply to the work unit 36 is stopped and the work unit 36 is forcibly stopped.

Further, if the controller 47 determines that the closed state of the cover 24 is detected in step S560, the controller 47 determines whether or not the power supply is stopped (step S600). When the controller 47 determines that the power supply is stopped, the controller 47 restarts the power supply (step S610) and returns the work unit 36 (step S620). Then, the controller 47 erases the display of the operation error on the operation panel 26 (step S630), turns the cover open flag from on to off (step S640), and ends the cover opening process. If the controller 47 determines in step S600 that the power supply is not stopped, the controller 47 skips the processes in steps S610 to S630, turns the cover open flag from on to off in step S640, and ends the cover opening process. .

Here, the state of production of the board P in the component mounting line 10 is shown in FIG. In FIG. 9, solder is printed on the types A and C of the board P by the screen printing apparatus 20, and the components are mounted on the part mounting apparatus 70, and the adhesive is applied to the type B board P by the adhesive application device 60. Then, the components are mounted by each component mounting apparatus 70. Further, the substrate P is produced in the order of types A, B, and C. Hereinafter, the screen printing apparatus 20 will be mainly described.

First, when the screen printing apparatus 20 is in the printing mode, the type A substrate P is passed through the first lane to perform solder printing. That is, the substrate P is printed and conveyed (FIG. 9A). When the production of the type A board P is completed, solder printing is not performed on the type B board P. Therefore, the controller 47 changes the print mode to the pass mode and passes the type B board P through the second lane. The path is conveyed (FIG. 9B). During the pass mode, as described above, even if the operator opens the cover 24, the controller 47 does not stop the second conveyor 34, so the operator opens the cover 24 during the production of the type B substrate P. Then, the next type C substrate P can be replaced (FIG. 9C). As described above, the setup change includes the exchange of the screen S, the exchange of the squeegee of the squeegee unit 39, the replenishment of solder, etc., and the operator needs to perform manual work in the predetermined space K.

Here, the predetermined space K is separated from the inside of the casing 51 where the carry-in shuttle conveyor 50 is arranged by the carry-in partition wall portion 52, and inside the casing 56 where the carry-out shuttle conveyor 55 is arranged by the carry-out partition wall portion 57. It is separated from. Further, during the pass mode, the predetermined space K is separated from the space in which the second transfer conveyor 34 is disposed by stopping the casing 37a of the camera unit 37 at a predetermined standby position. For these reasons, an operator working in the predetermined space K accidentally puts his hand out of the predetermined space K into the housing 51, the housing 56, and the space where the second conveyor 34 is disposed. Can be prevented. For this reason, it is possible to prevent an operator from erroneously touching the carrying-in shuttle conveyor 50, the carrying-out shuttle conveyor 55, and the second transport conveyor 34 in operation. Thereby, during the pass mode, the operator can safely perform manual work such as setup change in the predetermined space K. Furthermore, when the cover 24 is open during the pass mode, the operation of the housing 37a of the camera unit 37 is monitored, and if the housing 37a is operated, power supply is stopped and the housing 37a is forcibly stopped. Manual work in the predetermined space K can be made safer. Thereby, the operator can perform the setup change of the next type C substrate P more safely during the path conveyance of the type B substrate P. For this reason, when the production of the type B substrate P is completed and the controller 47 changes to the print mode, the screen printing apparatus 20 can immediately start solder printing on the next type C substrate P (FIG. 9). (D)).

Here, the correspondence between the components of the present embodiment and the components of the present invention will be clarified. The screen printing apparatus 20 of the present embodiment corresponds to the substrate work apparatus of the present invention, the apparatus main body 22 corresponds to the apparatus main body of the present invention, the first transfer conveyor 32 corresponds to the first transfer means, and the second transfer. The conveyor 34 corresponds to the second transfer means, the work unit 36 corresponds to the work means, the controller 47 that executes the mode switching processing routine of FIG. 5 corresponds to the mode switching means, and the substrate transfer work processing routine of FIG. The controller 47 to be executed corresponds to the control means, and the carry-in side partition part 52, the carry-out side partition part 57, and the housing 37a of the camera unit 37 correspond to the partition part. The print mode corresponds to the first mode, and the pass mode corresponds to the second mode. The cover 24 corresponds to the cover, the carry-in partition wall 52 corresponds to the carry-in partition wall, the carry-out partition wall 57 corresponds to the carry-out partition wall, and the housing 37a of the camera unit 37 corresponds to the housing. The carrying-in shuttle conveyor 50 corresponds to the board carrying-in means. The adhesive application device 50 corresponds to an adhesive application device, and the component mounting device 70 corresponds to a component mounting device.

According to the screen printing apparatus 20 of the present embodiment described above, during the pass mode, the substrate P is transported by the second transport conveyor 34 and the operation of the first transport conveyor 32 and the work unit 36 in the predetermined space K is stopped. In addition, since the inside and outside of the predetermined space K are separated by the carry-in side partition wall portion 52, the carry-out side partition wall portion 57, and the housing 37a of the camera unit 37 that is stopped, the operator can manually work in the predetermined space K during the pass mode. Can be done more safely. For this reason, in the component mounting line 10, the substrate P is passed through the second lane of the screen printing device 20, the adhesive is applied to the substrate P by the adhesive application device 60, and the component is applied to the substrate P by each component mounting device 70. During the mounting, it is possible to more safely change the setup of the next type of substrate P in the first lane of the screen printing apparatus 20. Therefore, when the type of the board P changes, the downtime associated with the changeover of the component mounting line 10 is shortened, and the operating rate of the component mounting line 10 can be improved.

Moreover, in the screen printing apparatus 20, even if the cover 24 is opened during the pass mode, the operation of the second transfer conveyor 34 is not stopped and the transfer of the substrate P in the second lane is continued. In the pass mode, the manual operation in the predetermined space K can be performed in a state where the cover 24 is opened and the operation is easy. On the other hand, when the cover 24 is opened during the pass mode, the controller 47 monitors whether or not the camera unit 37 is operating. When the controller 47 detects the operation of the camera unit 37 during monitoring, the controller 47 Since power supply is stopped, the safety of the worker can be further ensured.

Furthermore, by providing the carry-in side partition 52 and the carry-out side partition 57, the operator accidentally touches the carry-in side shuttle conveyor 50 or the carry-out side shuttle conveyor 55 during work in the predetermined space K. Can be prevented. Further, since the housing 37a of the camera unit 37 is stopped at the standby position during the pass mode, there is no need to provide a dedicated partition wall for separating the space where the second transfer conveyor 34 is disposed from the predetermined space K. The number of parts of the screen printing apparatus 20 can be reduced. Since the controller 47 determines the distribution destination of the substrate P according to whether the current mode is the print mode or the pass mode (pass mode flag ON / OFF), the determination of the distribution destination of the substrate P is simple. It can be a process.

It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that the present invention can be implemented in various modes as long as it belongs to the technical scope of the present invention.

For example, in the above-described embodiment, the casing 37a of the camera unit 37 that stops at a predetermined standby position is used to separate the inside and outside of the predetermined space K in the front-rear direction of the apparatus main body 22. However, the present invention is not limited to this. is not. For example, a partition wall may be separately attached to the camera unit 37, or a dedicated partition wall may be provided separately from the camera unit 37. FIG. 10 shows an outline of the configuration of a screen printing apparatus 120 according to a modification of the latter case. FIG. 10 shows the configuration of the screen printing apparatus 120 as viewed from the rear side. As shown in the figure, in the apparatus main body 22, a flat partition wall portion 59 that separates the apparatus main body 22 in the front-rear direction is provided. The partition wall 59 is provided on the rear side of the apparatus with respect to the casing 37a of the camera unit 37 at a predetermined standby position and on the front side of the apparatus with respect to the second transport conveyor 34. As described above, by providing the dedicated partition wall portion 59 that partitions the front-rear direction of the apparatus main body 22, it is possible to more reliably prevent an operator from accidentally touching the second transport conveyor 34. In addition, it is good also as what has only the partition part 59 of the front-back direction, and does not have the partition part (the import side partition part 52 and the unloading side partition part 57) of the left-right direction.

In the above-described embodiment, it is not particularly impeded that the operator puts out his / her hand from the work space K from the first carry-in port 52a of the carry-in partition wall portion 52 or the first carry-out port 57a of the carry-out partition wall portion 57. It is not limited to this. For example, a flat plate member 54 may be attached to the upper part of the first carry-in port 52a so as to protrude toward the predetermined space K as shown in the carry-in side partition wall 152 of the modified example of FIG. In this way, the operator is prevented from putting out his hand from the first carry-in port 52a, so that the worker can hardly put his hand into the casing 51 from the predetermined space K. Similarly, a flat plate member 58 may be attached to the upper portion of the first carry-out port 57a so as to protrude toward the predetermined space K as shown in the carry-out side partition wall portion 157 of the modified example of FIG. In this way, the worker is prevented from putting out his hand from the first carry-out port 57a, so that the worker can hardly put his hand into the casing 56 from the predetermined space K. . From these things, the worker can perform manual work in the predetermined space K more safely. Moreover, it is not restricted to what attaches such a flat plate member, but is provided with a shutter that can open and close the first carry-in port 52a of the carry-in partition wall portion 52 and a shutter that can open and close the first carry-out port 57a of the carry-out partition wall portion 57 It is good. In this case, the controller 47 controls each shutter so that the first carry-in port 52a and the first carry-out port 57a are opened during the print mode, and the first carry-in port 52a and the first carry-out port 57a during the pass mode. The shutters may be controlled so as to be in a closed state.

In the embodiment described above, the two openings of the first carry-in port 52a and the second carry-in port 52b are formed in the carry-in partition wall portion 52. However, the present invention is not limited to this, and the first carry-in port 52a and the second carry-in port 52b You may form one opening which connected. Similarly, although two openings, the first carry-out port 57a and the second carry-out port 57b, are formed in the carry-out side partition wall portion 57, the present invention is not limited thereto, and the first carry-out port 57a and the second carry-in port 57b are connected. One opening may be formed.

In the embodiment described above, when the mode switching instruction is a switching instruction to the printing mode, the controller 47 activates the first transport conveyor 32 that performs the substrate work, and stops the operation of the second transport conveyor 34 ( Step S120 in FIG. 5 is used, but it is not essential to stop the operation of the second conveyor 34 when switching to the printing mode. That is, the second transfer conveyor 34 may be activated while the first transfer conveyor 32 is performing the substrate work.

In the above-described embodiment, whether the controller 47 has the pass mode flag turned on or off (step S320 in FIG. 6), that is, either the first transport conveyor 32 or the second transport conveyor 34 depending on the current mode. However, the present invention is not limited to this, and the controller 47 reads the identification information attached to the substrate P, and based on the read identification information, the first conveyance conveyor 32 or the second conveyance conveyor 34 It is good also as what distributes the board | substrate P to either.

In the embodiment described above, the controller 47 monitors the operation of the camera unit 37 (housing 37a) when the cover 24 is opened during the pass mode (step S570 in FIG. 8). Of course, the controller 47 may monitor the operation of other units in the work unit 36, and may monitor the operation of all units in the work unit 36. Alternatively, the controller 47 may not monitor the operation of the work unit 36 even if the cover 24 is opened during the pass mode.

In the above-described embodiment, the screen printing apparatus 20, the adhesive application apparatus 60, and each component mounting apparatus 70 are dual lanes, but the present invention is not limited to this. For example, the adhesive application device 60 and each component mounting device 70 may be a single lane, and the screen printing device 20 may be a dual lane. Further, the screen printing apparatus 20 and each component mounting apparatus 70 may be configured as a single lane, the adhesive application apparatus 60 may be configured as a dual lane, and the adhesive application apparatus 60 may be configured as the substrate-to-board working apparatus of the present invention. Alternatively, the dual lane screen printing device 20 and the adhesive application device 60 may be configured as a substrate-to-board working device of the present invention, and each component mounting device 70 may be a single lane. In this way, any configuration may be used as long as at least one device is a dual lane. Further, the configuration of the component mounting line 10 is not limited to a configuration including one screen printing device 20, one adhesive application device 60, and a plurality of component mounting devices 70. For example, the screen printing device 20 or a plurality of adhesive application devices 60, or a single component mounting device 70.

In the above-described embodiment, the work unit 36 does not perform work (solder printing) on the board P transported in the second lane. However, the present invention is not limited to this, and the board P transported in the second lane On the other hand, the screen printing apparatus 20 may be configured so that the work unit performs work.

The present invention can be used in the mounting technology field in which components are mounted on a substrate.

10 component mounting line, 20, 120 screen printing device, 22 device main body, 24 cover, 26 operation panel, 32 first conveyor, 32a, 34a in conveyor, 32b, 34b main conveyor, 32c, 34c out conveyor, 34 second Conveyor conveyor, 36 work units, 37 camera unit, 37a housing, 38 substrate holding unit, 39 squeegee unit, 41 detection sensor group, 42 cover open / close detection sensor, 43 camera unit standby position detection sensor, 45 power supply unit, 47 controller, 50 carry-in shuttle conveyor, 51, 56 housing, 52, 152 carry-in partition, 52a first carry-in, 52b second carry-in, 54, 58 flat plate member, 55 carry-out shuttle, 57, 157 carry out Bulkhead part, 57a first carry-out port, 57b second carry-out port, 59 bulkhead part, 60 adhesive application device, 70 component mounting device, 80 management computer, 82 input device, 84 display, K work space, P substrate, S screen .

Claims

A substrate working apparatus having a first lane and a second lane for transporting a substrate and performing work on the substrate,
First conveying means arranged in a predetermined space of the apparatus main body and constituting the first lane;
Second conveying means arranged outside the predetermined space of the apparatus main body and constituting the second lane;
Working means for performing work on the substrate on the substrate on the first lane in the predetermined space;
Mode switching means capable of switching between the first mode and the second mode;
During the first mode, the first transport means and the work means are controlled so that the substrate is transported at least in the first lane and the work on the substrate is performed, and during the second mode, the first lane is controlled. Control means for controlling the second transport means so that the substrate is transported in two lanes and stopping the operation of the first transport means and the working means;
A partition that separates the inside and outside of the predetermined space;
The board | substrate working apparatus provided with.
The substrate-working apparatus according to claim 1,
An open / close-type cover attached to the apparatus main body so as to cover the predetermined space;
The control means stops the operation of the first conveying means and the working means when the cover is opened during the first mode, and even when the cover is opened during the second mode. The substrate working apparatus does not stop the operation of the second transfer means.
The substrate working apparatus according to claim 2,
When the cover is opened during the second mode, the control means monitors whether or not the working means is operating, and stops the power supply to the working means when detecting the working means during the monitoring. Yes To substrate work equipment.
It is a substrate working apparatus of any one of Claim 1 thru | or 3, Comprising:
As the partition wall portion, a plate-shaped carry-in side partition wall portion that forms an entrance for loading the substrate into the first transport means and separates the inside and outside of the predetermined space, and unloads the substrate from the first transport means. And a plate-like unloading-side partition wall that separates the inside and the outside of the predetermined space.
The substrate working apparatus according to claim 4,
The working means is configured as a casing that is movable at least partially from a working position in the predetermined space to a predetermined position on the second transport means side,
The control means stops the casing of the working means at a predetermined position on the second transport means side during the second mode,
The substrate working apparatus using the casing that is stopped at a predetermined position on the second transfer means side as the partition wall in order to separate the predetermined space from the space where the second transfer means is arranged.
It is a substrate working apparatus of any one of Claim 1 thru | or 5, Comprising:
A substrate carrying means capable of carrying the substrate from outside the apparatus and delivering it to the first carrying means or the second carrying means;
The control means controls the substrate carry-in means to deliver the substrate carried from outside the apparatus to the first transfer means during the first mode, and carries the substrate carried from outside the apparatus during the second mode. A substrate working apparatus that controls the substrate carry-in means so as to deliver the substrate to the second transfer means.
As a board-to-board operation, a solder printing apparatus that prints solder on the board;
An adhesive application device that applies an adhesive to the substrate as a work for the substrate;
A component mounting apparatus for mounting a component on the substrate on which the substrate operation has been performed;
A board-to-board work line,
At least one of the solder printing device or the adhesive application device is configured as a counter-substrate work apparatus according to any one of claims 1 to 6. A counter-substrate work line.