WO2015064553A1

WO2015064553A1 - Electronic apparatus

Info

Publication number: WO2015064553A1
Application number: PCT/JP2014/078556
Authority: WO
Inventors: 哲也下田
Original assignee: 京セラ株式会社
Priority date: 2013-10-29
Filing date: 2014-10-28
Publication date: 2015-05-07
Also published as: JP5769781B2; JP2015088836A

Abstract

A cover panel is attached to an exterior section. A vibration element is provided on a rear surface of the cover panel, and vibrates the cover panel. A functional member is bonded to the rear surface of the cover panel, and has predetermined functions. An electronic component is positioned on the rear surface side of the cover panel. A bonding section is positioned between the vibration element and the functional member, and bonds the electronic component and the cover panel to each other.

Description

Electronics

The present invention relates to an electronic device that is strong against external force.

Various technologies have been proposed for electronic devices.

In an electronic device in which a vibration element is attached to the cover panel, the periphery of the vibration element (particularly from the area where the vibration element is provided to the area where the touch panel or liquid crystal panel is provided) so as not to hinder the vibration of the cover panel. In many cases, other members are not arranged. For this reason, when a force is applied from the outside to the vicinity of the region of the cover panel where the vibration element is attached, the member attached to the cover panel may be peeled off from the cover panel.

The present invention has been made in view of such circumstances, and an object of the present invention is to provide an electronic device in which a member attached to the cover panel is prevented from peeling off from the cover panel.

An electronic apparatus according to an embodiment of the present invention includes an exterior part exposed to the outside, a cover panel attached to the exterior part, and a vibration element that is provided on the back surface of the cover panel and vibrates the cover panel. A functional member attached to the back surface of the cover panel and having a specific function; an electronic component positioned on the back surface side of the cover panel; and the vibration element and the functional member, An affixing unit for affixing the electronic component and the cover panel is provided.

As described above, even if an external force is applied in the vicinity of the region where the vibration element is attached to the cover panel by providing the pasting portion at a specific position, the external force is applied between the functional member and the cover panel. It can be dispersed not only at the attachment position but also at the affixing portion. Therefore, it can control that a functional member peels from a cover panel.

The objects, features, aspects, and advantages of the present invention will become more apparent from the following detailed description and the accompanying drawings.

It is a front view which shows the external appearance of an electronic device. It is a back view which shows the external appearance of an electronic device. It is a figure which shows the cross-section of an electronic device. It is a figure which shows the cross-section of an electronic device. It is a top view at the time of seeing a cover panel from the inner side main surface side. It is a top view at the time of seeing the cover panel from the inner main surface side before bonding a display panel. It is a figure which shows the electric constitution of an electronic device. It is a top view which shows the structure of a piezoelectric vibration element. It is a side view which shows the structure of a piezoelectric vibration element. It is a figure which shows a mode that a piezoelectric vibration element bends and vibrates. It is a figure which shows a mode that a piezoelectric vibration element bends and vibrates. It is a figure for demonstrating an air conduction sound and a conduction sound. It is a figure which shows the cross-section of an electronic device. It is a top view at the time of seeing a cover panel from the inner side main surface side.

<Appearance of electronic equipment>
1 and 2 are a front view and a back view, respectively, showing the configuration of the electronic device 1. 3 is a schematic diagram of a cross-sectional structure taken along the line AA of the electronic device 1 shown in FIG. FIG. 4 is a schematic diagram of a cross-sectional structure taken along the line BB of the electronic apparatus 1 shown in FIG. FIG. 5 is a rear view of the cover panel 2 included in the electronic device 1. A piezoelectric vibration element 190 and a display panel 120 included in the electronic device 1 are attached to the cover panel 2 shown in FIG. Electronic device 1 according to the present embodiment is a mobile phone such as a smartphone, for example.

As shown in FIGS. 1 to 5, the electronic apparatus 1 includes a transparent cover panel 2 that covers the display surface of the display panel 120 (FIG. 4), a front case 3 that supports the cover panel 2, and a front case 3 And a back side case 4 attached to the case. The back side case 4 houses the battery 200. In the present embodiment, the cover panel 2, the front side case 3, and the back side case 4 constitute an exterior case 5 (exterior portion) of the electronic device 1. The shape of the electronic device 1 is a substantially rectangular plate shape in plan view.

The cover panel 2 constitutes a part other than the peripheral end (peripheral part) in the front part of the electronic device 1. The front side case 3 and the back side case 4 constitute a peripheral end portion, a side portion, and a back portion of the front portion of the electronic device 1. Each of the front side case 3 and the back side case 4 is made of resin, for example. As the resin forming the front side case 3 and the back side case 4, for example, polycarbonate resin, ABS resin, or nylon resin is employed. In a space surrounded by the front case 3 and the back case 4, a board (printed board) 104 on which various components such as a CPU 101 and a DSP 102 described later are mounted is provided.

The cover panel 2 is plate-shaped and has a substantially rectangular shape in plan view. The cover panel 2 has an inner first main surface 20 that faces the display surface of the display panel 120, and an outer second main surface 21 that is located on the opposite side of the first main surface 20. The second main surface 21 constitutes a part of the front surface of the electronic device 1. Hereinafter, the first main surface 20 may be referred to as “inner main surface 20”, and the second main surface 21 may be referred to as “outer main surface 21”.

The cover panel 2 is transparent, and is formed of, for example, glass, acrylic resin, sapphire, or the like. Here, the term “transparent” means that the transmittance for visible light is 70% to 100%. Moreover, the above-mentioned sapphire is made of aluminum oxide (AlO ₃ ) crystal and manufactured industrially.

The cover panel 2 is provided with a transparent display portion (also referred to as a display window) 2a through which the display on the display panel 120 is transmitted. The display portion 2a has a rectangular shape in plan view, for example. Visible light output from the display panel 120 is taken out of the electronic apparatus 1 through the display portion 2a. The user can visually recognize information displayed on the display panel 120 from the outside of the electronic device 1 through the display portion 2a.

Most of the peripheral edge 2b surrounding the display portion 2a in the cover panel 2 is black by applying a film or the like, for example. Thereby, most of the peripheral edge 2b is a non-display portion through which the display on the display panel 120 is not transmitted.

As shown in FIG. 3, a touch panel 130 is attached as a functional member to the inner main surface 20 of the cover panel 2. Here, the functional member refers to a member having specific functions such as a display function and a contact detection function, such as a touch panel, a liquid crystal panel, and an organic EL display panel.

The display panel 120 which is a display unit is attached to the main surface of the touch panel 130 opposite to the main surface on the inner main surface 20 side. That is, the display panel 120 is attached to the inner main surface 20 of the cover panel 2 via the touch panel 130. The display panel 120 is sandwiched between the cover panel 2 and the front case 3. In FIG. 3, the display panel 120 is sandwiched between the cover panel 2 and the front side case 3, but this point is not essential in the present invention. For example, the display panel 120 may be sandwiched between the cover panel 2 and the sheet metal, or may be sandwiched between the cover panel 2 and other members. In the cover panel 2, the portion facing the display panel 120 is the display portion 2a. The user can give various instructions to the electronic device 1 by operating the display portion 2a of the cover panel 2 with a finger or the like.

The display panel 120 has an electronic component 120a. Examples of the electronic component 120a include an IC driver such as a drive driver. For example, when the display panel is a liquid crystal panel, the electronic component 120a corresponds to a drive driver. The electronic component 120 a is located on the back side of the cover panel 2. The electronic component 120 a is provided between the piezoelectric vibration element 190 provided on the inner main surface 20 of the cover panel 2 and the touch panel 130. And the electronic component 120a and the cover panel 2 are affixed by the affixing part 260. FIG. The electronic component 120a and the pasting part 260 are not in contact with the touch panel 130 and the pasting part 270. Therefore, there is a space 600 where no parts exist between the electronic device part 120 a and the pasting part 260, and the touch panel 130 and the pasting part 270. Further, the electronic component 120 a and the pasting part 260 are not in contact with the piezoelectric vibration element 190 and the pasting part 250. Therefore, there is a space 610 in which no component exists between the electronic component 120 a and the pasting portion 260 and the piezoelectric vibration element 190 and the pasting portion 250.

If the electronic device 1 is not provided with the affixing portion 260, when the external force acts on the cover panel 2 near the area where the piezoelectric vibration element 190 exists, the external force is particularly affected by the touch panel 130 and the cover. Of the sticking part 270 between the panels 2 (when the sticking part 260 is the first sticking part, the sticking part 270 is the second sticking part), it works at the end on the electronic component 120a side. Thereby, peeling may occur between the cover panel 2 and the touch panel 130 at the end.

In the present embodiment, a pasting portion 260 is provided between the electronic component 120a located between the piezoelectric vibration element 190 and the touch panel 130 and the cover panel 2. Therefore, when an external force is applied to the vicinity of the region where the piezoelectric vibration element 190 exists in the cover panel 2, the external force is dispersed to the end portion and the sticking member 260. Therefore, the occurrence of peeling or the like at the end is suppressed. Further, since the sticking portion 260 is disposed at a sufficient distance from the piezoelectric vibration element 190, the influence of the sticking portion 260 on the vibration of the cover panel 2 is suppressed to a small value.

Examples of the sticking part 260 include an adhesive part made of an adhesive and an adhesive part made of a double-sided tape.

Further, if the electronic device 1 is not provided with the pasting portion 260, the electronic component 120a collides with the inner main surface 20 (back surface) of the cover panel 2 when the electronic device 1 is dropped. In some cases, cracking of 120a occurred.

In the present embodiment, as described above, the pasting portion 260 is provided between the electronic component 120a positioned between the piezoelectric vibration element 190 and the touch panel 130 and the cover panel 2. Therefore, since the electronic component 120a is fixed, the collision between the cover panel 2 and the electronic component 120a when the electronic device 1 is dropped is suppressed. In particular, when a hard panel such as a panel including a layer made of sapphire (hereinafter referred to as “sapphire layer-containing panel”) provided on the surface of the electronic device 1 is used as the cover panel 2, the electronic component 120 a is used. Cracking is likely to occur. Therefore, it is particularly useful that the sticking portion 120a is provided between the cover panel 2 made of the sapphire layer-containing panel and the electronic component 120a.

The sapphire layer-containing panel may be a single-layer panel including a layer made of sapphire provided on the surface of the electronic device 1, that is, a panel made only of sapphire. The sapphire layer-containing panel may be a composite panel (multilayer panel) having a multilayer structure including a layer made of sapphire provided on the surface of the electronic device 1. For example, the sapphire layer-containing panel has a two-layer structure composed of a layer made of sapphire (sapphire panel) provided on the surface of the electronic device 1 and a layer made of glass (glass panel) attached to the layer. It may be a composite panel. The sapphire layer-containing panel is affixed to the layer (sapphire panel) made of sapphire provided on the surface of the electronic device 1, the layer (glass panel) made of glass attached to the layer, and the layer. A composite panel having a three-layer structure composed of layers made of sapphire (sapphire panel) may be used. The cover panel 2 may include a layer made of a crystalline material other than sapphire, for example, diamond, zirconia, titania, crystal, lithium tantalate, aluminum oxynitride, or the like.

When the display panel 120 is used, the electronic component 120a is activated and heat is generated from the electronic component 120a. In particular, when a thermoplastic adhesive is employed as the sticking portion 260, the sticking portion 260 is softened by heat from the electronic component 120a, so that even if the electronic device 1 falls from the cover panel 2 side, the softening is performed. The applied part 260 can absorb the impact.

As described above, by providing the pasting portion 260 between the electronic component 120a and the cover panel 2, heat generated from the electronic component 120a can be transmitted to the cover panel 2. In particular, when a sapphire layer-containing panel including a sapphire panel having higher thermal conductivity than a glass panel is used as the cover panel 2, heat generated in the electronic component 120 a is easily transmitted to the cover panel 2. Therefore, the electronic component 120a can be cooled.

FIG. 6 is a diagram showing the cover panel 2 before the display panel 120 is pasted when an adhesive is used as the pasting portion 260.

When the display panel 120 is attached to the cover panel 2, first, the adhesive 570 for attaching the edge of the main body of the display panel 120 to the cover panel 2 and the electronic device 120 a are attached to the cover panel 2. The adhesive 560 is applied to the cover panel 2. Thereafter, the cover panel 2 is irradiated with ultraviolet rays once to cure the adhesives 560 and 570 (for example, ultraviolet ray conditions 1500 m ² / mJ). Thereafter, an adhesive 590 for attaching the central portion of the main body of the display panel 2 to the cover panel 2 is applied to the central portion of the cover panel 2. Thereafter, the display panel 120 is affixed to the cover panel 2, and then the cover panel 2 is irradiated with ultraviolet rays. As a result, the cover panel 2 to which the display panel 2 is attached is completed as shown in FIG.

Further, as another specific example of FIG. 3 described above, for example, a structure as shown in FIG. 13 is included. In FIG. 13, a buffer portion 280 is provided between the through hole 140 provided in the front case 3 and the cover panel 2. Such a structure is particularly useful in that the cover panel 2 is prevented from cracking. The reason will be described below.

異なり Unlike glass panels, sapphire panels are difficult to bend and may break if bent beyond a certain level. Therefore, when a sapphire panel layer-containing panel is provided as the cover panel 2, when a force is applied to the sapphire layer-containing panel from the outside of the electronic device 1, the sapphire layer-containing panel is prevented from bending. It is necessary to reduce the clearance (distance from another member) on the back side of the panel.

On the other hand, the front case 3 facing the cover panel 2 is often provided with, for example, a through hole 140 for wiring a flexible substrate 120b for electrically connecting the display panel 120 and the substrate 104. . In this case, the presence of the through-hole 140 increases the clearance on the back side of the sapphire layer-containing panel. Therefore, when an external force is applied to a portion of the outer main surface 21 of the cover panel 2 above the through hole 140, the sapphire layer-containing panel as the cover panel 2 may break.

In the present embodiment, since the buffer portion 280 is provided between the through hole 140 and the cover panel 2, the impact on the sapphire layer-containing panel due to external force is reduced, and the back surface side of the sapphire layer-containing panel is The clearance above the through hole 140 can be reduced. Therefore, the crack of a sapphire layer containing panel can be suppressed. Although the lower surface of the buffer portion 280 is supported by the edge portion of the through hole 140, the method of fixing the buffer portion 280 is not limited to this.

As the cushion material included in the buffer portion 280, for example, a foam is adopted. As this foam, for example, a polyolefin foam, a polyester foam or a urethane foam is used.

In the case of the electronic apparatus 1 shown in FIG. 13, the through hole 140 is provided in the front side case 3. Therefore, the buffer portion 280 is provided between the front side case 3 and the cover panel 2. However, the present invention is not limited to this, and the through hole 140 may be provided anywhere, as long as the buffer portion 280 can reduce the clearance between the through hole 140 and the cover panel 2.

As shown in FIG. 1, a microphone hole 50 may be formed at the lower end of the cover panel 2. Further, as shown in FIG. 2, speaker holes 80 may be formed on the back surface 10 of the electronic device 1, specifically, on the outer surface of the cover panel 41 included in the back side case 4. The cover panel 41 is provided on the back surface of the electronic device 1 and covers the battery 200.

In the exterior case 5, a proximity sensor 140, a front side imaging unit 160, a back side imaging unit 170, and a piezoelectric vibration element 190, which will be described later, are provided. As shown in FIG. 3, the piezoelectric vibration element 190 is attached to the inner main surface 20 of the cover panel 2 with a pasting portion 250 (the pasting portion 250 is the third pasting portion when the pasting portion 260 is the first pasting portion). Is attached). A proximity sensor transparent portion 60 is provided at the upper end of the cover panel 2 so that the proximity sensor 140 in the outer case 5 can be visually recognized from the outside of the electronic device 1. The proximity sensor 140 is attached to the proximity sensor transparent portion 60 from the inside. In addition, a front lens transparent portion 70 is provided at the upper end of the cover panel 2 so that the imaging lens of the front imaging unit 160 in the exterior case 5 can be viewed from the outside of the electronic device 1. The back surface 10 of the electronic device 1 is provided with a back lens transparent portion 90 for allowing the imaging lens of the back surface side imaging unit 170 in the exterior case 5 to be visually recognized from the outside of the electronic device 1.

As shown in FIG. 3, the cover panel 2 is attached to the front case 3 with a double-sided tape or an adhesive. In particular, from the viewpoint of improving vibration characteristics and waterproof characteristics, among the peripheral end portions of the inner main surface 20 of the cover panel 2, the lower end portion and the side end portion are attached with an adhesive, and the upper end portion is a double-sided tape. It may be pasted with.

<Electrical configuration of electronic equipment>
FIG. 7 is a block diagram mainly showing an electrical configuration of the electronic apparatus 1. As shown in FIG. 7, the electronic device 1 is provided with a control unit 100, a wireless communication unit 110, a display panel 120, a touch panel 130, and a proximity sensor 140. Further, the electronic device 1 is provided with a microphone 150, a front side imaging unit 160, a back side imaging unit 170, an external speaker 180, a piezoelectric vibration element 190, and a battery 200. These components other than the cover panel 2 provided in the electronic apparatus 1 are housed in an outer case 5.

The control unit 100 includes a CPU (Central Processing Unit) 101, a DSP (Digital Signal Processing) 102, a storage unit 103, and the like. The control unit 100 comprehensively manages the operation of the electronic device 1 by controlling other components of the electronic device 1.

The storage unit 103 is configured by a non-transitory recording medium that can be read by the control unit 100 (the CPU 101 and the DSP 102) such as a ROM (Read Only Memory) and a RAM (Random Access Memory). The storage unit 103 stores a main program, a plurality of application programs, and the like. The main program is a control program for controlling the electronic device 1, specifically, for controlling each component such as the wireless communication unit 110 and the display panel 120 included in the electronic device 1. Various functions of the control unit 100 are realized by the CPU 101 and the DSP 102 executing various programs in the storage unit 103.

Note that the storage unit 103 may include a computer-readable non-transitory recording medium other than the ROM and RAM. The storage unit 103 may include, for example, a small hard disk drive and an SSD (Solid State Drive).

The wireless communication unit 110 has an antenna 111. The wireless communication unit 110 receives a signal from a mobile phone different from the electronic device 1 or a signal from a communication device such as a web server connected to the Internet by the antenna 111 via the base station. Radio communication unit 110 performs amplification processing and down-conversion on the received signal and outputs the result to control unit 100. The control unit 100 performs a demodulation process or the like on the input reception signal, and acquires a sound signal (sound information) indicating voice or music included in the reception signal.

Further, the wireless communication unit 110 performs up-conversion and amplification processing on the transmission signal including the sound signal and the like generated by the control unit 100, and wirelessly transmits the processed transmission signal from the antenna 111. A transmission signal from the antenna 111 is received through a base station by a mobile phone different from the electronic device 1 or a communication device connected to the Internet.

The display panel 120 which is a display unit is, for example, a liquid crystal display panel or an organic EL panel. The display panel 120 displays various types of information such as characters, symbols, and graphics under the control of the control unit 100. Information displayed on the display panel 120 is visible to the user of the electronic device 1 through the display portion 2 a of the cover panel 2.

The touch panel 130 is, for example, a projected electrostatic capacitance type touch panel. The touch panel 130 detects contact of an object with the display portion 2a of the cover panel 2. The touch panel 130 is affixed to the inner main surface 20 of the cover panel 2. The touch panel 130 includes two sheet-like electrode sensors arranged to face each other. The two electrode sensors are bonded together with a transparent adhesive sheet.

One electrode sensor is formed with a plurality of elongated X electrodes each extending along the X-axis direction (for example, the left-right direction of the electronic device 1) and arranged in parallel to each other. The other electrode sensor is formed with a plurality of elongated Y electrodes that extend along the Y-axis direction (for example, the vertical direction of the electronic device 1) and are arranged in parallel to each other. When a user's finger or the like comes into contact with the display portion 2a of the cover panel 2, the capacitance between the X electrode and the Y electrode under the contact portion changes. Thereby, operation (contact) with respect to the display part 2a of the cover panel 2 is detected in the touch panel 130. The touch panel 130 generates an electrical signal indicating a change in capacitance between the X electrode and the Y electrode and outputs the electrical signal to the control unit 100. The control unit 100 identifies the content of the operation performed on the display portion 2a of the cover panel 2 based on the electrical signal, and performs an operation corresponding thereto.

The proximity sensor 140 is, for example, an infrared proximity sensor. The proximity sensor 140 outputs a detection signal when an object approaches the proximity sensor 140 within a predetermined distance. This detection signal is input to the control unit 100. When receiving the detection signal from the proximity sensor 140, the control unit 100 stops the operation detection function on the touch panel 130, for example.

In the present embodiment, the touch panel 130 detects the contact of an object such as a user's finger with respect to the display portion 2a of the cover panel 2, but the operation detected by the touch panel 130 is not limited to the contact. For example, touch panel 130 may detect the approach of an object such as a user's finger using touch panel 130 with improved capacitance detection accuracy. Moreover, in this Embodiment, although the touch panel has detected user operation, the structure which detects user operation is not limited to a touch panel. For example, the proximity sensor may detect a user operation by detecting the approach of an object such as a user's finger.

The front side imaging unit 160 includes an imaging lens, an imaging element, and the like. The front side imaging unit 160 captures still images and moving images based on the control by the control unit 100. The imaging lens of the front side imaging unit 160 is visible from the front lens transparent unit 70 provided on the front surface of the electronic device 1. Therefore, the front-side imaging unit 160 can image an object present on the front side (the cover panel 2 side) of the electronic device 1.

The back side imaging unit 170 includes an imaging lens and an imaging element. The back side imaging unit 170 captures still images and moving images based on control by the control unit 100. The imaging lens of the rear surface side imaging unit 170 is visible from the rear lens transparent portion 90 provided on the rear surface 10 of the electronic device 1. Therefore, the back surface side imaging unit 170 can image an object existing on the back surface 10 side of the electronic device 1.

The microphone 150 converts sound input from the outside of the electronic device 1 into an electrical sound signal and outputs the electrical sound signal to the control unit 100. Sound from the outside of the electronic device 1 is taken into the electronic device 1 from the microphone hole 50 provided on the front surface of the cover panel 2 and input to the microphone 150. The microphone hole 50 may be provided on the side surface of the electronic device 1 or on the back surface 10. In particular, when a sapphire layer-containing panel is used as the cover panel 2, the processing of the cover panel 2 is difficult. Therefore, the microphone hole 50 is preferably disposed on the side surface or the back surface 10 of the electronic device 1.

The external speaker 180 is, for example, a dynamic speaker. The external speaker 180 converts an electrical sound signal from the control unit 100 into a sound and outputs the sound. The sound output from the external speaker 180 is output to the outside through the speaker hole 80 provided on the back surface 10 of the electronic device 1. The sound output from the speaker hole 80 has a volume that can be heard at a place away from the electronic device 1. Note that a film speaker may be adopted as the external speaker 180.

As described above, the piezoelectric vibration element 190 is attached to the inner main surface 20 of the cover panel 2 provided on the front surface of the electronic device 1 by the attaching member 250. As the sticking member 250, a double-sided tape or an adhesive is used. The piezoelectric vibration element 190 is vibrated by a drive voltage supplied from the control unit 100. The control unit 100 generates a driving voltage based on the sound signal and applies the driving voltage to the piezoelectric vibration element 190. When the piezoelectric vibration element 190 is vibrated based on the sound signal by the control unit 100, the cover panel 2 vibrates based on the sound signal. As a result, the reception sound is transmitted from the cover panel 2 to the user. The volume of the received sound is such that it can be heard properly when the user puts his ear close to the cover panel 2. The received sound transmitted from the cover panel 2 to the user will be described in detail later.

The battery 200 outputs the power source of the electronic device 1. The power output from the battery 200 is supplied to each electronic component included in the control unit 100 and the wireless communication unit 110 included in the electronic device 1. As shown in FIG. 3, for example, a large battery that occupies most of the volume in the back side case 4 is used as the battery 200, but the battery 200 is not limited to this.

<Details of piezoelectric vibration element>
8 and 9 are a top view and a side view showing the structure of the piezoelectric vibration element 190, respectively. As shown in FIGS. 8 and 9, the piezoelectric vibration element 190 has a long shape in one direction. Specifically, the piezoelectric vibration element 190 has a rectangular elongated plate shape in plan view. The piezoelectric vibration element 190 has, for example, a bimorph structure. The piezoelectric vibration element 190 includes a first piezoelectric ceramic plate 190a and a second piezoelectric ceramic plate 190b that are bonded to each other via a shim material 190c.

In the piezoelectric vibration element 190, when a positive voltage is applied to the first piezoelectric ceramic plate 190a and a negative voltage is applied to the second piezoelectric ceramic plate 190b, the first piezoelectric ceramic plate 190a extends along the longitudinal direction. The second piezoelectric ceramic plate 190b expands and contracts along the longitudinal direction. As a result, as shown in FIG. 10, the piezoelectric vibration element 190 bends in a mountain shape with the first piezoelectric ceramic plate 190a outside.

On the other hand, in the piezoelectric vibration element 190, when a negative voltage is applied to the first piezoelectric ceramic plate 190a and a positive voltage is applied to the second piezoelectric ceramic plate 190b, the first piezoelectric ceramic plate 190a is in the longitudinal direction. The second piezoelectric ceramic plate 190b extends along the longitudinal direction. Accordingly, as shown in FIG. 11, the piezoelectric vibration element 190 bends in a mountain shape with the second piezoelectric ceramic plate 190b on the outside.

The piezoelectric vibration element 190 performs flexural vibration along the longitudinal direction by alternately taking the state of FIG. 10 and the state of FIG. The controller 100 applies an alternating voltage in which a positive voltage and a negative voltage appear alternately between the first piezoelectric ceramic plate 190a and the second piezoelectric ceramic plate 190b, thereby causing the piezoelectric vibration element 190 to move in the longitudinal direction. To bend and vibrate.

In addition, in the piezoelectric vibration element 190 shown in FIGS. 8 to 11, only one structure including the first piezoelectric ceramic plate 190a and the second piezoelectric ceramic plate 190b bonded with the shim material 190c interposed therebetween is provided. However, a plurality of such structures may be stacked. The piezoelectric vibration element 190 may be made of an organic piezoelectric material such as polyvinylidene fluoride or polylactic acid in addition to the piezoelectric ceramic material. For example, the piezoelectric vibration element 190 may be configured by using a polylactic acid film as the first piezoelectric plate and the second piezoelectric plate and laminating them. In addition, a transparent electrode made of, for example, ITO (Indium-Tin-Oxide, that is, indium tin oxide) may be used as the electrode.

The piezoelectric vibration element 190 having such a structure is disposed at the peripheral end portion of the inner main surface 20 of the cover panel 2 as shown in FIG. Specifically, the piezoelectric vibration element 190 is disposed at the central portion in the short direction at the upper end portion of the inner main surface 20 of the cover panel 2. Further, the piezoelectric vibration element 190 is arranged such that the longitudinal direction thereof is along the short direction of the cover panel 2. Accordingly, the piezoelectric vibration element 190 performs flexural vibration along the short direction of the cover panel 2. The center of the piezoelectric vibration element 190 in the longitudinal direction coincides with the center in the lateral direction at the upper end of the inner main surface 20 of the cover panel 2.

Here, in the piezoelectric vibration element 190 that performs flexural vibration, the center of the longitudinal direction has the largest amount of displacement. Accordingly, when the center of the piezoelectric vibration element 190 in the longitudinal direction coincides with the center of the short side direction at the upper end of the inner main surface 20 of the cover panel 2, the displacement amount of the piezoelectric vibration element 190 due to flexural vibration is reduced. The largest portion coincides with the center in the lateral direction at the upper end of the inner main surface 20 of the cover panel 2.

In addition, a partial region where the front side case 3 and the display panel 120 are not attached at the upper end of the cover panel 2 is long along the short direction of the cover panel 2. Therefore, due to the shape of the partial region, the partial region is more easily bent along the shorter direction than the longitudinal direction of the cover panel 2. Since the piezoelectric vibration element 190 is disposed in the partial region so that the longitudinal direction (direction in which bending vibration is performed) is along the longitudinal direction of the partial region, the partial region is likely to vibrate. Therefore, it is easy to transmit the received sound from the cover panel 2 to the user.

<Regarding the generation of the reception tone>
In the electronic device 1 according to the present embodiment, the piezoelectric vibration element 190 vibrates the cover panel 2 to transmit air conduction sound and conduction sound from the cover panel 2 to the user. In other words, when the vibration of the piezoelectric vibration element 190 itself is transmitted to the cover panel 2, air conduction sound and conduction sound are transmitted from the cover panel 2 to the user.

Here, the air conduction sound is a sound that is recognized by the human brain by sound waves (air vibrations) entering the ear canal hole (so-called “ear hole”) vibrating the eardrum. On the other hand, the conduction sound is sound that is recognized by the human brain when the auricle is vibrated and the vibration of the auricle is transmitted to the eardrum and the eardrum vibrates. Hereinafter, the air conduction sound and the conduction sound will be described in detail.

FIG. 12 is a diagram for explaining air conduction sound and conduction sound. FIG. 12 shows the structure of the ear of the user of the electronic device 1. In FIG. 12, a wavy line 400 indicates a conduction path of a sound signal (sound information) when airway sound is recognized by the brain. A solid line 410 indicates a conduction path of the sound signal when the conduction sound is recognized by the brain.

When the piezoelectric vibration element 190 attached to the cover panel 2 is vibrated based on an electrical sound signal indicating a received sound, the cover panel 2 vibrates and a sound wave is output from the cover panel 2. When the user holds the electronic device 1 in his hand and brings the cover panel 2 of the electronic device 1 close to the user's auricle 300, or the cover panel 2 of the electronic device 1 is moved to the user's auricle 300. When touched (contacted), sound waves output from the cover panel 2 enter the ear canal hole 310. The sound wave from the cover panel 2 travels in the ear canal hole 310 and vibrates the eardrum 320. The vibration of the eardrum 320 is transmitted to the ossicle 330, and the ossicle 330 vibrates. Then, the vibration of the ossicle 330 is transmitted to the cochlea 340 and converted into an electric signal in the cochlea 340. This electric signal is transmitted to the brain through the auditory nerve 350, and the received sound is recognized in the brain. In this way, air conduction sound is transmitted from the cover panel 2 to the user.

When the user holds the electronic device 1 in his hand and touches the cover panel 2 of the electronic device 1 against the user's auricle 300, the auricle 300 is vibrated by the piezoelectric vibration element 190. It is vibrated by the cover panel 2. The vibration of the auricle 300 is transmitted to the eardrum 320, and the eardrum 320 vibrates. The vibration of the eardrum 320 is transmitted to the ossicle 330, and the ossicle 330 vibrates. Then, the vibration of the ossicle 330 is transmitted to the cochlea 340 and converted into an electric signal in the cochlea 340. This electric signal is transmitted to the brain through the auditory nerve 350, and the received sound is recognized in the brain. In this way, the conduction sound is transmitted from the cover panel 2 to the user. In FIG. 11, the auricular cartilage 300a inside the auricle 300 is also shown.

The bone conduction sound is a sound that is recognized by the human brain by vibrating the skull and directly stimulating the inner ear such as the cochlea. In FIG. 12, for example, when the mandible 500 is vibrated, a sound signal transmission path when a bone conduction sound is recognized by the brain is indicated by a plurality of arcs 420.

As described above, in the present embodiment, the piezoelectric vibrating element 190 appropriately transmits the air conduction sound and the conduction sound from the cover panel 2 to the user of the electronic device 1 by appropriately vibrating the front cover panel 2. Can do. The user can hear the air conduction sound from the cover panel 2 by bringing the ear (auricle) close to the cover panel 2. The user can hear the air conduction sound and the conduction sound from the cover panel 2 by bringing the ear (auricle) into contact with the cover panel 2. In the piezoelectric vibration element 190 according to the present embodiment, the structure is devised so that air conduction sound and conduction sound can be appropriately transmitted to the user. Various merits are produced by configuring the electronic device 1 so that air conduction sound and conduction sound can be transmitted to the user.

For example, since the user can hear a sound by placing the cover panel 2 on his / her ear, the user can make a call without worrying about the position of the electronic device 1 where the ear is placed.

In addition, when the ambient noise is large, the user can make the ambient noise difficult to hear while increasing the volume of the conduction sound by pressing the ear strongly against the cover panel 2. Therefore, the user can make a call appropriately even when the ambient noise is high.

Further, the user can recognize the received sound from the electronic device 1 by placing the cover panel 2 against the ear (more specifically, the auricle) even when the earplug or earphone is attached to the ear. Can do. Further, the user can recognize the received sound from the electronic device 1 by applying the cover panel 2 to the headphones even when the headphones are attached to the ears.

Note that the portion of the cover panel 2 to which the piezoelectric vibration element 190 is attached becomes relatively easy to vibrate. Therefore, the user brings the ear close to or presses the upper end (particularly the central portion of the upper end in the short direction DR2) of the cover panel 2 to which the piezoelectric vibration element 190 is attached. If this happens, it will be easier to hear the sound from the cover panel 2.

In the above example, only one piezoelectric vibration element 190 is provided. However, as shown in FIG. 14, a plurality of piezoelectric vibration elements 190 may be provided on the inner main surface 20 of the cover panel 2. . In the example of FIG. 14, a plurality of piezoelectric vibration elements 190 are arranged along the short direction of the cover panel 2. The piezoelectric vibration elements 190 are arranged such that the longitudinal direction thereof is along the short direction of the cover panel 2. In the example of FIG. 14, two piezoelectric vibration elements 190 are provided, but three or more piezoelectric vibration elements 190 may be provided.

In the above description, the piezoelectric vibration element is mainly described as the vibration element. However, the vibration element is not limited to the piezoelectric vibration element, and may be an eccentric motor (ERM), a linear vibrator, or the like.

In the above example, the case where the present invention is applied to a mobile phone has been described as an example. However, the present invention can also be applied to an electronic device other than a mobile phone such as a smartphone, such as a tablet terminal. .

As described above, the electronic apparatus 1 has been described in detail, but the above description is an example in all aspects, and the present invention is not limited thereto. The various modifications described above can be applied in combination as long as they do not contradict each other. And it is understood that the countless modification which is not illustrated can be assumed without deviating from the scope of the present invention.

DESCRIPTION OF SYMBOLS 1 Electronic device 2 Cover panel 20 1st main surface 21 2nd main surface 100 Control part 120 Display panel 120a Electronic component 190 Piezoelectric vibration element 260 Pasting part

Claims

An exterior part exposed to the outside;
A cover panel attached to the exterior part;
A vibration element provided on the back surface of the cover panel for vibrating the cover panel;
A functional member attached to the back surface of the cover panel and having a specific function;
Electronic components located on the back side of the cover panel;
An electronic apparatus comprising: an affixing portion that is positioned between the vibration element and the functional member and that affixes the electronic component and the cover panel.
The electronic device according to claim 1,
The said sticking part is an electronic device comprised with the adhesive agent softened with the heat produced in the said electronic component.
The electronic device according to claim 2,
The cover panel is an electronic device including a layer made of sapphire provided on a surface of the electronic device.
The electronic device according to claim 3,
A through-hole facing the cover panel is provided inside the exterior part,
An electronic device in which a buffer portion is located between the through hole and the cover panel.
The electronic device according to claim 4,
Further comprising a substrate,
An electronic device in which a flexible substrate that connects the substrate and the display unit passes through the through hole.
The electronic device according to claim 5,
An electronic device in which heat generated in the electronic component is transmitted to the panel through the sticking portion.
The electronic device according to claim 6,
A display unit;
The electronic device is an electronic device that is disposed in the display unit and is a driver that drives the display unit.