WO2015059018A1

WO2015059018A1 - Method and device for forming an organic functional layer structure

Info

Publication number: WO2015059018A1
Application number: PCT/EP2014/072172
Authority: WO
Inventors: Arne FLEISSNER; Thomas Wehlus; Daniel Riedel; Johannes Rosenberger
Original assignee: Osram Oled Gmbh
Priority date: 2013-10-21
Filing date: 2014-10-16
Publication date: 2015-04-30
Also published as: DE102013111591A1

Abstract

In various exemplary embodiments, a method for forming an organic functional layer structure (22) for an optoelectronic component (10) is provided. The method involves applying a first organic material of the organic functional layer structure (22) by means of a coating source (62) to a partial region of a three-dimensional surface (40) to be coated above a substrate (12) of the optoelectronic component (10). The coating source (62) and the substrate (12) are moved during the application of the three-dimensional surface (40) with the first organic material relative to one another such that the first organic material is subsequently applied to other partial regions of the surface (40) to be coated above the substrate (12), and the entire three-dimensional surface (40) is thus coated.

Description

description

Method and apparatus for forming an organic functional layer structure

The invention relates to a method and an apparatus for forming an organic functional layer structure.

Organic-based optoelectronic components,

For example, organic light emitting diodes (organic light

emitting diode (OLED) or organic solar cells are increasingly being put to practical use. For example, OLEDs are finding widespread use in the

General lighting, for example as a surface light source.

An organic optoelectronic device may include an anode and a cathode having an organic functional one

Have layer system in between. The organic

functional layer system can be one or more

Emitter layers have, in which electromagnetic

Radiation is generated, a charge carrier pair generation layer structure of two or more

Charge generation pair (CGL) charge carrier pair generation layers, and one or more electron blockade layers, also referred to as

Hole transport layer (HT), and one or more hole block layers, also referred to as electron transport layer (s) (ETL), for directing the flow of current.

Organic optoelectronic devices are currently

practically only in 2D, so two-dimensional and / or flat, and available in 2.5D. 2.5D refers to the shape of OLEDs on flexible substrates, which can be bent to some extent, so that, for example, a curved OLED can be formed. A simply curved

Surface is thus not in this description as three-dimensional surface, but as a 2.5-dimensional surface.

A three-dimensional surface in this description is a contiguous surface that is in different

Partial areas having different surface normal, wherein at least two of the surface normals spanning a plane and wherein at least one of the surface normal intersects the plane in exactly one point. A surface normal is a straight line that is on a surface or a portion of a

Surface is vertical.

OLEDs on arbitrarily shaped substrates with real SD surfaces are so far largely unknown. The reason for this is the generally desired homogeneous deposition of the thin, organic functional layers on non-planar substrates. For high-performance OLEDs, organic layer stacks are usually formed by physical layers

Applied vapor deposition. These are so-called line-of-sight processes that allow full surface coatings for flat (and possibly curved in moderation) substrates. However, existing methods are for coating the surface of a complex 3D object

unsuitable, because due to shadowing uncoated areas remain.

Furthermore, it is desirable for the function of the OLED to apply the organic functional layers in a precisely defined thickness to the substrate, since otherwise the performance of the OLED can be low. In particular, lateral would be

Layer thickness gradient to unwanted

Luminance gradients and / or color shifts lead.

Existing methods are therefore not suitable even for the production of OLEDs on 3D surfaces, if the substrate is shaped so that a complete shading of

Is excluded because of the

different orientation different Surface areas relative to the coating source would result in extreme layer thickness variations.

Three-dimensional OLEDs can be achieved, for example, by the

Merging multiple 2D OLEDs to 3D bodies are made. For example, a cube may be flat

square 2D OLEDs are produced. However, at the edges of the 3D body remain non-luminous

Edge regions, in particular the edges of the 2D OLEDs, and only edged 3D bodies are possible, which can be assembled from planar surfaces.

In various embodiments, a method for forming an organic functional layer structure is provided that enables an opto-electronic

Component with a coherent, homogeneous

produce three-dimensional organic functional layer structure. Alternatively or additionally, for example, the method may enable the optoelectronic component without non-luminous edges and / or, for example, without

Restriction to produce an edgy geometric shape and / or the optoelectronic component not zusammenzusetzten from flat, two-dimensional sub-components and / or the optoelectronic device simple and / or

inexpensive to produce. Alternatively or additionally, the method can enable three-dimensional outer surfaces and / or three-dimensional inner surfaces of substrates for optoelectronic components with a coherent, three-dimensional, homogeneous, organic functional

Coat layer structure.

In various embodiments, an apparatus for forming an organic functional layer structure is provided which enables an optoelectronic

Component with a coherent, homogeneous,

three-dimensional, organic functional

Layer structure produce. Alternatively or additionally, the device may allow, for example, the optoelectronic component without non-luminous edges and / or, for example without limitation, to produce an angular geometric shape and / or the optoelectronic component not from flat two-dimensional

Compose partial components and / or the

Optoelectronic device simple and / or inexpensive to manufacture. Alternatively or additionally, the method may allow homogeneously coating coherent, three-dimensional outer surfaces and / or three-dimensional inner surfaces of substrates for optoelectronic components with a coherent three-dimensional organic functional layer structure.

In various embodiments, a method of forming an organic functional layer structure for an optoelectronic device is provided. In the method, a first organic material of the

organic functional layer structure by means of a coating source to a portion of a too

Coating three-dimensional surface over one

Substrate of the optoelectronic component applied. The coating source and the substrate are moved relative to one another during the application of the three-dimensional surface with the first organic material such that the first organic material is subsequently applied to other portions of the three-dimensional surface to be coated over the substrate and thus the entire three-dimensional surface is coated. The relative movement between the substrate and the

Coating source such that the three-dimensional

Surface is coated, allows one

Optoelectronic component with a coherent, three-dimensional, homogeneous, organic functional

Layer structure produce, for example a

three-dimensional OLED. In contrast to a 3D OLED assembled from flat OLEDs, the non-luminous edges and the restriction to an edgy are eliminated Outer shape. Furthermore, three-dimensional outer surfaces and / or three-dimensional inner surfaces of substrates which form, for example, hollow bodies can be homogeneously coated. Furthermore, three-dimensional surfaces can be coated, which would lead to shadowing in a conventional coating process, for example in an evaporation chamber. The application of the three-dimensional

Surface with the first organic material can

for example, continuously during the relative movement between the coating source and the substrate. The first organic material can be applied directly to the substrate,

For example, be applied directly to a first electrode layer of the substrate, or to an intermediate layer over the substrate or the first electrode layer.

Coating and / or application may be steaming or spraying. For example, the organic material can be applied in gaseous form and / or by means of a carrier gas, for example via a physical vapor deposition via a tube / nozzle system, or the organic material can be applied in a liquid state or dissolved in liquid.

That the substrate and the coating source are relative

can be moved to each other, for example, mean that the coating source is moved and the substrate remains stationary and thus the substrate can be used as a reference point or that the substrate is moved and the

Coating source remains stationary and thus the

Coating source can be used as a reference point or that the substrate and the coating source are moved. For example, the to be coated

three-dimensional surface of the substrate with the

Departing coating source. The coating source may be relatively small relative to the three-dimensional surface to be coated and form a punctiform coating source. The distance between the coating source and the three-dimensional surface to be coated may be relatively be low compared to the three-dimensional surface. The coating source may be a directed

Have radiation, for example, a

Coating cone with a well-defined

Coating axis or cone axis. The coating cone may be, for example, a conical steam jet or a cone-shaped spray jet. Accordingly, the coating axis may be, for example, a steam jet axis or a spray cone axis.

Moving the coating source and / or the substrate such that the relative movement is formed can

For example, by means of an actuator, for example by means of a robot, done. The actuator unit can be designed, for example, in the manner of a spray painting robot. Alternatively, the actuator unit may move the substrate in front of the coating source.

That the generated three-dimensional layer of the first

For example, in this specification, a local deviation of the thickness of the corresponding layer from an average of the thickness of the entire corresponding layer may be in a range of, for example, 0, 5% to 20%, for example from 2.5% to 10%, for example from 4.0% to 8.0%.

That the generated three-dimensional organic functional layer structure in operation light with a homogeneous

Luminance emitted may be in this description

For example, mean a local deviation of the luminance of an average of the luminance in a range is for example from 0.5% to 20%, for example from 2.5% to 10%, for example from 4.0% to 8.0%.

In various embodiments, the relative movement between the coating source and substrate has a first rotation about a first axis and a second rotation about at least a second axis. In other words, the

Coating source and the substrate so relatively

moved to each other that when setting the

Coating source or the substrate as a reference point, the substrate or the coating source is rotated about the first axis and about the second axis. This allows up

simple and effective way to homogeneously coat the three-dimensional surface by means of the coating source.

When turning around an axis, basically a rotation of less than 360 °, exactly 360 ° or more than 360 ° is possible. In various embodiments, the relative movement between the coating source and the substrate has a first rotation about at least a first axis and a displacement in at least two spatial dimensions. In other words, the coating source and the substrate are moved relative to each other so that when setting the

Coating source or the substrate as a reference point, the substrate or the coating source is rotated about the first axis and in two spatial dimensions, ie in two different spatial directions, is moved. This allows in a simple and effective way, by means of

Coating source to coat the three-dimensional surface homogeneously.

In various embodiments, a

Relative movement between the coating source and substrate on a shift in at least three spatial dimensions. In other words, the coating source and the substrate are moved relative to one another in such a way that, when the coating source or the substrate is used as reference point, the substrate or the coating source has three spatial dimensions, ie three different ones

Spatial directions, is moved. This allows for easy and effective way of homogeneously coating the three-dimensional surface by means of the coating source.

In various embodiments, the relative movement between the coating source and substrate has a first rotation about a first axis and a second rotation about at least a second axis and a displacement in at least one dimension. In other words, the

Coating source and the substrate so relatively

moved to each other that when setting the

Coating source or the substrate as a reference point, the substrate or the coating source is rotated about the first axis and about the second axis and in a dimension, ie in a spatial direction, is moved. This allows a simple and effective way to homogeneously coat the three-dimensional surface by means of the coating source.

In various embodiments, the relative movement between the coating source and substrate has a first rotation about a first axis and a second rotation about at least a second axis and a displacement in at least two spatial dimensions. In other words, the coating source and the substrate become so relative

moved to each other that when setting the

Coating source or the substrate as a reference point that

Substrate or the coating source is rotated about the first axis and about the second axis and in two spatial

Dimensions, ie in two different spatial directions, is moved. This allows a simple and effective way to homogeneously coat the three-dimensional surface by means of the coating source.

In various embodiments, a second

organic material of organic functional

Layer structure by means of the coating source on a portion above the surface to be coated three-dimensional surface, with the first organic material

coated, applied. The coating source and the Substrate during coating of the

Three-dimensional surface with the second organic material relative to each other moves so that subsequently applied to the second organic material on other portions over the surface to be coated, which are coated with the first organic material, so that over the entire surface to be coated three-dimensional surface, a layer of the second organic material is formed. This makes it possible to form a second layer of the second organic material over the first layer of the first organic material, wherein the second

Layer can be a coherent, homogeneous, three-dimensional layer. For example, the two layers may be different sublayers of the organic functional layer structure. Furthermore, even more

Partial layers of the organic functional layer structure by means of the same or further organic materials are formed accordingly. The layers can

in particular a hole injection layer, a

Hole transport layer, an emitter layer, a

Electron transport layer and / or a

Having electron injection layer. The second organic material and / or other organic materials may be applied with the same coating source or with other appropriate coating sources.

Optionally, before applying the first organic

Material a first electrode of the substrate of

Optoelectronic device on a three-dimensional support of the substrate accordingly, ie by means of

Coating source and relative movement between

Coating source and substrate are formed, in which case the organic functional layer structure is formed on the first electrode. Further, optionally, after forming the organic functional layer structure, a second electrode may be on the organic functional one

Layer structure accordingly, so by means of Coating source and relative movement between the coating source and the substrate to be formed.

In various embodiments, during the

Coating the substrate with the first organic

Material and / or the second organic material

Distance between the coating source and the to

coating surface always the same or at least approximately the same. In other words, the

Coating source and the substrate so relatively

moved to each other, that the distance between the

Coating source and to be coated

three-dimensional surface is always the same or at least approximately the same. That the distance

is approximately equal, may mean, for example, that the distance within a possible accuracy of the

Relative movement, that of the actuator unit used

depends, is the same and / or that the distance varies so much that the generated three-dimensional layer is still homogeneous and / or that the luminance of the generated light is still homogeneous. This contributes to the fact that the coating situation over the entire three-dimensional surface to be coated is identical and / or that the entire three-dimensional surface to be coated

is uniformly coated and / or that variations in thickness of the layer produced are excluded.

In various embodiments, during the

Coating the substrate with the first material an angle between a coating axis, for example a

Steam cone axis or a spray cone axis, one

Coating cone, such as a steam cone or a spray cone, and a surface normal on the currently to be coated part of the three-dimensional surface always the same or at least approximately the same. In other words, the coating source and the substrate are moved relative to each other such that the angle between the

Coating axis and the surface normal of the current coated portion is always the same or at least approximately the same. The fact that the angle is approximately equal may mean, for example, that the angle is equal within the scope of a possible accuracy of the relative movement, which depends on the actuator unit used, and / or that the angle varies as much as possible so that the generated three-dimensional layer is nevertheless homogeneous. This contributes to the fact that the coating situation over the entire three-dimensional surface to be coated is identical and / or that the entire three-dimensional surface to be coated is uniformly coated and / or that

Thickness variations of the layer produced are excluded and / or that the luminance of the generated during operation

Light is homogeneous.

In various embodiments, an apparatus for forming an organic functional layer structure for an optoelectronic device is provided. The device has a substrate holder for holding a substrate of the optoelectronic component, wherein the substrate has a three-dimensional surface to be coated. A coating apparatus of the apparatus has a coating source for applying a first

organic functional organic material

Layer structure on a section above the

three-dimensional surface. An actuator unit of

Device is connected to the substrate holder and / or

Coating source mechanically coupled. A control unit of the device is connected to the actuator unit and the

Coating device electrically coupled. The

Control unit, the coating unit and the actuator unit are formed so that the coating unit in

In response to a coating signal from the control unit, the portion above the three-dimensional surface is coated with the first organic material and that the

Actuator in response to a motion signal of

Control unit, the coating source and the substrate during the application of the three-dimensional surface with the first organic material is moved relative to one another such that the coating source applies the first organic material to other subregions above the three-dimensional surface, for example by spraying or vapor deposition, and thus coating the entire three-dimensional surface to be coated. The actuator can, for example, a

Shutter, a valve, a pump and / or one or more electric motor drives. The coating source may be formed as a point-like or as a linear source. The actuator unit and the control unit may be designed according to a robot. For example, the actuator unit can have an arm,

For example, a robot arm, which is controllable by means of the control unit.

In various embodiments, the device has a memory unit connected to the control unit

is electrically coupled and stored on the information regarding the geometric shape of the three-dimensional surface. The control unit is configured to generate the motion signal depending on the information. The information can, for example, by means of an electronic interface or by means of a

User interface into the memory unit. The information can for example meadow

be predetermined and / or known. Alternatively, the information can be detected, for example, by means of a sensor device. The sensor device can, for example by means of laser, the three-dimensional to be coated

Scan surface and get the information.

In various embodiments, the

Coating source on a panel. The aperture can help influence a shape of the coating cone. This can help the coating of the

Three-dimensional surface to control advantageous. A corresponding optoelectronic component has the substrate, which has the first electrode from which a three-dimensional boundary surface of the substrate is formed. The three-dimensional interface is shaped to have a first surface normal, a second surface normal and

has at least a third surface normal. The first and second surface normals span a plane. The third surface normal cuts the plane in exactly one point. The organic functional layer structure is formed on the three-dimensional interface formed by the first electrode and has a homogeneous thickness. A second electrode is on the organic functional

Layer structure formed. During the method for producing the optoelectronic component, for example at the beginning of the method for forming the organic functional layer structure, the first electrode first forms the three-dimensional surface. These

Three-dimensional surface forms after application of the first organic material or the organic functional layer structure, the three-dimensional interface between the first electrode and the layer of first organic material or the organic functional

Layer structure. The organic functional

Layer structure, for example, on only a part of the first electrode formed by the

be formed on the three-dimensional boundary surface or on the entire three-dimensional interface formed by the first electrode and / or beyond the three-dimensional boundary surface formed by the first electrode.

During the operation of the optoelectronic component, the optoelectronic component may, for example, have a three-dimensional luminous surface which has a homogeneous luminance over its entire surface.

The first and / or the second electrode may have a homogeneous or at least approximately homogeneous thickness. The organic functional layer structure may include the first organic material having small molecules, and the fact that the first organic material has small molecules does not necessarily mean that the corresponding molecules are small. small molecules "in the context of organic conductors and / or organic semiconductors for organic functional layer structures for organic

Low molecular weight compounds consisting of molecules with few atoms and / or few molecule groups. The small molecules are in contrast to strong in this regard

crosslinked and / or large molecular chains and / or polymers.

Embodiments of the invention are illustrated in the figures and are explained in more detail below.

Show it:

FIG. 1 shows a conventional optoelectronic component;

Figure 2 is a detailed sectional view of a

Layer structure of the conventional

optoelectronic component according to FIG. 1; Figure 3 shows an embodiment of an optoelectronic

Device in a state during a conventional method for forming an organic functional layer structure of the optoelectronic device;

Figure 4 shows an embodiment of an optoelectronic

FIG. 5 shows the optoelectronic component according to FIG. 3 in a state during one exemplary embodiment of a method for forming an organic functional layer structure of

optoelectronic component; 4 shows the optoelectronic component according to FIG. 4 in a state during an embodiment of a method for forming an organic functional layer structure of FIG

optoelectronic component; an embodiment of an optoelectronic component in a state during an embodiment of a method for forming an organic functional layer structure of the optoelectronic component; an embodiment of an optoelectronic component in a state during an embodiment of a method for forming an organic functional layer structure of the optoelectronic component;

Figure 9 shows an embodiment of a

Coating device;

FIG. 10 is a flowchart of an embodiment of a

Method for forming an organic functional layer structure of a

optoelectronic component.

In the following detailed description, reference is made to the accompanying drawings, which form a part of this specification, and in which is shown by way of illustration specific embodiments in which the invention may be practiced. In this regard, directional terminology such as "top", "bottom", "front", "back", "front", "rear", etc. is used with reference to the orientation of the described figure (s). There Components of embodiments in number

different orientations can be positioned, the directional terminology is illustrative and is in no way limiting. It should be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present invention. It should be understood that the features of the various embodiments described herein may be combined with each other unless specifically stated otherwise. The following detailed description is therefore not to be taken in a limiting sense, and the scope of the present invention is defined by the appended claims.

In the context of this description, the terms

"connected", "connected" and "coupled" used to describe both a direct and indirect connection, a direct or indirect connection and a direct or indirect coupling. In the figures, identical or similar elements are provided with identical reference numerals, as appropriate.

An optoelectronic component may be an electromagnetic radiation emitting device or a

be electromagnetic radiation absorbing component. An electromagnetic radiation absorbing component may be, for example, a solar cell. One

Electromagnetic radiation emitting device may be, for example, a semiconductor device emitting electromagnetic radiation and / or as a diode emitting organic electromagnetic radiation, as a transistor emitting electromagnetic radiation or as an organic electromagnetic radiation

be formed emitting transistor. The radiation may, for example, be light in the visible range, UV light and / or infrared light. In this context, the

electromagnetic radiation emitting device for example, as an organic light-emitting diode

(Organic light emitting diode, OLED) or be designed as an organic light emitting transistor. The light-emitting device may be in different

Embodiments be part of an integrated circuit. Furthermore, a plurality of light-emitting

Be provided components, for example housed in a common housing. FIG. 1 shows a conventional optoelectronic component 1. The conventional optoelectronic component 1 has a carrier 12. On the carrier 12 is a

optoelectronic layer structure formed. The optoelectronic layer structure has a first one

Electrode layer 14 having a first contact portion 16, a second contact portion 18 and a first

Having electrode 20. The carrier 12 and the first

Electrode layer 14 may also be referred to as a substrate. In other words, the substrate may include or be formed by the carrier 12 and the first electrode layer 14. The substrate may be formed by a three-dimensional body, for example a solid body or a hollow body. The second contact section 18 is connected to the first electrode 20 of the optoelectronic

Layer structure electrically coupled. The first electrode 20 is electrically insulated from the first contact portion 16 by means of an electrical insulation barrier 21. Over the first electrode 20, an organic functional layer structure 22 of the optoelectronic layer structure is formed. The organic functional layer structure 22 is thus formed over the substrate. The organic functional layer structure 22 may comprise, for example, one, two or more sub-layers, as explained in greater detail below with reference to FIG. Over the organic functional layer structure 22, a second electrode 23 of the optoelectronic layer structure is formed, which is electrically coupled to the first contact section 16. The first electrode 20 serves, for example, as the anode or cathode of the optoelectronic layer structure. The second electrode 23 serves corresponding to the first electrode as the cathode or anode of the optoelectronic

Layer structure.

Above the second electrode 23 and partially over the first contact portion 16 and partially over the second one

Contact section 18, an encapsulation layer 24 of the optoelectronic layer structure is formed, which encapsulates the optoelectronic layer structure. In the

Encapsulation layer 24, a first recess of the encapsulation layer 24 are formed over the first contact portion 16 and a second recess of the encapsulation layer 24 over the second contact portion 18. In the first recess of the encapsulation layer 24, a first contact region 32 is exposed and in the second recess of the

Encapsulation layer 24, a second contact region 34 is exposed. The first contact region 32 serves for

electrical contacting of the first contact portion 16 and the second contact portion 34 is for electrical

Contacting the second contact portion 18.

Over the encapsulation layer 24, an adhesive layer 36 is formed. The adhesive layer 36 comprises, for example, an adhesive, for example an adhesive,

For example, a laminating adhesive, a paint and / or a resin. Above the adhesive layer 36 is a

Cover body 38 is formed. The adhesive layer 36 serves to attach the cover body 38 to the

Encapsulation layer 24. The cover body 38 has

For example, glass and / or metal. For example, the cover body 38 may be formed substantially of glass and a thin metal layer, such as a

Metal foil, and / or a graphite layer, such as a graphite laminate, have on the glass body. Of the

Cover body 38 serves to protect the conventional

optoelectronic component 1, for example before mechanical forces from outside. Further, the cover body 38 may serve for distributing and / or dissipating heat, which in the conventional optoelectronic

Component 1 is generated. For example, the glass of the cover body 38 can serve as protection against external influences and the metal layer of the cover body 38 can be used for distributing and / or discharging during operation of the conventional

serve optoelectronic device 1 resulting heat. The conventional optoelectronic component 1 can

for example, be separated from a composite component by the carrier 12 along its in Fig. 1 laterally

shown outer edges are scored and then broken and by the cover body 38 is equally scratched along its lateral outer edges shown in Fig. 1 and then broken. In this cracking and breaking is the

Encapsulation layer 24 over the contact areas 32, 34 exposed. Subsequently, the first contact region 32 and the second contact region 34 in another

Process step are exposed, for example by means of an ablation process, for example by means of

Laser ablation, mechanical scratching or a

Etching process. Fig. 2 shows a detailed sectional view of a

Layer structure of an embodiment of a

optoelectronic component, for example of im

Previously explained conventional optoelectronic component 1, wherein the contact portions 16, 18 are not shown in this detail view. The conventional optoelectronic component 1 can be designed as a top emitter and / or bottom emitter. If the conventional optoelectronic component 1 is designed as a top emitter and bottom emitter, the conventional

optoelectronic component 1 as an optically transparent component, for example a transparent organic

LED, be designated. The conventional optoelectronic component 1 has the carrier 12 and an active region above the carrier 12. The carrier 12, the first electrode 20, the first

Contact section 16 and / or the second contact section 18 may be referred to, for example, as a substrate on which the organic functional layer structure 22 is formed, or form the corresponding substrate. Between the carrier 12 and the active region, a first, not shown, barrier layer, for example, a first

Barrier thin film, be formed. The active region comprises the first electrode 20, the organic functional layer structure 22 and the second electrode 23. Above the active region is the encapsulation layer 24

educated. The encapsulation layer 24 may serve as a second barrier layer, for example as a second barrier layer

Barrier thin film, be formed. About the active

Area and optionally over the encapsulation layer 24, the cover body 38 is arranged. The covering body 38 can be arranged, for example, by means of an adhesive layer 36 on the encapsulation layer 24.

The active region is an electrically and / or optically active region. The active region is, for example, the region of the conventional optoelectronic component 1 in which electrical current flows for operation of the conventional optoelectronic component 1 and / or in which electromagnetic radiation is generated or absorbed.

The organic functional layer structure 22 may include one, two or more functional layered structure units and one, two or more intermediate layers between them

Have layer structure units.

The carrier 12 may be translucent or transparent. The carrier 12 serves as a carrier element for electronic elements or layers, for example light-emitting elements. The carrier 12 may be, for example, glass, quartz, and / or a semiconductor material or any other have suitable material or be formed from it.

Further, the carrier 12 may be a plastic film or a

Laminate with one or more plastic films

have or be formed from it. The plastic may have one or more polyolefins. Furthermore, the

Plastic polyvinyl chloride (PVC), polystyrene (PS), polyester and / or polycarbonate (PC), polyethylene terephthalate (PET), polyethersulfone (PES) and / or polyethylene naphthalate (PEN). The carrier 12 may comprise or be formed from a metal, for example copper, silver, gold, platinum, iron, for example a metal compound,

for example steel. The carrier 12 may be formed as a metal foil or metal-coated foil. The carrier 12 may be part of or form part of a mirror structure. The carrier 12 may have a mechanically rigid region and / or a mechanically flexible region or be formed in such a way.

The first electrode 20 may be formed as an anode or as a cathode. The first electrode 20 may be translucent or transparent. The first electrode 20 comprises an electrically conductive material, for example metal and / or a conductive transparent oxide

(transparent conductive oxide, TCO) or a

Layer stacks of multiple layers comprising metals or TCOs. For example, the first electrode 20 may comprise a layer stack of a combination of a layer of a metal on a layer of a TCO, or vice versa. An example is a silver layer deposited on an indium tin oxide (ITO) layer (Ag on ITO) or ITO-Ag-ITO multilayers.

As the metal, for example, Ag, Pt, Au, Mg, Al, Ba, In, Ca, Sm or Li, as well as compounds, combinations or

Alloys of these materials are used.

Transparent conductive oxides are transparent, conductive materials, such as metal oxides, such as Zinc oxide, tin oxide, cadmium oxide, titanium oxide, indium oxide, or indium tin oxide (ITO). In addition to binary metal oxygen compounds such as ZnO, SnO 2 or In 2 O 3, ternary metal oxygen compounds such as AlZnO, Zn 2 SnO 4, Cd SnO 3, Zn SnO 3, Mgln 204, GalnO 3, Zn 2 In 2 O 5 or In 4 Sn 3 O 12 or mixtures are also included

different transparent conductive oxides to the group of TCOs. The first electrode 20 may comprise, as an alternative or in addition to the materials mentioned: networks of metallic nanowires and particles, for example of Ag, networks of carbon nanotubes, graphene particles and layers and / or networks of semiconducting nanowires.

By way of example, the first electrode 20 may have or be formed from one of the following structures: a network of metallic nanowires, for example of Ag, which are combined with conductive polymers

Carbon nanotubes made with conductive polymers

combined and / or graphene layers and composites. Furthermore, the first electrode 20 may comprise electrically conductive polymers or transition metal oxides.

The first electrode 20 may, for example, have a layer thickness in a range of 10 nm to 500 nm,

for example from 25 nm to 250 nm, for example from 50 nm to 100 nm.

The first electrode 20 may be a first electrical

Have connection to which a first electrical potential can be applied. The first electrical potential may be provided by a power source (not shown), such as a power source or a power source

Voltage source. Alternatively, the first electrical

Potential to be applied to the carrier 12 and the first

Electrode 20 are indirectly fed via the carrier 12. The first electrical potential may be, for example, the Ground potential or another predetermined reference potential.

The organic functional layer structure 22 may include a hole injection layer, a hole transport layer, a

Emitter layer, an electron transport layer and / or an electron injection layer. The

Hole injection layer, the hole transport layer, the

Emitter layer, the electron transport layer and / or the electron injection layer have various organic materials or are formed therefrom.

The hole injection layer may be on or above the first

Electrode 20 may be formed. The hole injection layer may comprise or be formed from one or more of the following materials: HAT-CN, Cu (I) pFBz, MoOx, WOx, VOx, ReOx, F4-TCNQ, NDP-2, NDP-9, Bi (III) pFBz , F16CuPc; NPB (Ν, Ν'-bis (naphthalen-1-yl) -N, '-bis (phenyl) -benzidine); beta-NPB N, N'-bis (naphthalen-2-yl) -N, '-bis (phenyl) -benzidine); TPD (N, '- bis (3-methylphenyl) - N,' - bis (phenyl) benzidine); Spiro TPD (N, '- bis (3-methylphenyl) - N,' - bis (phenyl) benzidine); Spiro-NPB (N, 'bis (naphthalen-1-yl) -N,' -bis (phenyl) -spiro); DMFL-TPD Ν, Ν'-bis (3-methylphenyl) -Ν, Ν'-bis (phenyl) -9,9-dimethyl-fluorene); DMFL-NPB (N, N'-bis (naphthalen-1-yl) -N, N'-bis (phenyl) -9,9-dimethyl-fluorene); DPFL-TPD (N, N'-bis (3-methylphenyl) -N, '-bis (phenyl) -9, 9-diphenyl-fluorene); DPFL-NPB (Ν, Ν'-bis (naphthalen-1-yl) -Ν, Ν'-bis (phenyl) -9,9-diphenyl-fluorene); Spiro-TAD (2, 2 ', 7, 7' tetrakis (n, n-diphenylamino) -9,9'-spirobifluorene); 9,9-bis [4- (N, N-bis-biphenyl-4-yl-amino) -phenyl] -9H-fluorene; 9,9-bis [4- (N, N-bis-naphthalen-2-yl-amino) -phenyl] -9H-fluorene; 9,9-bis [4- (N, N'-bis-naphthalen-2-yl-N, '-bis-phenyl-amino) -phenyl] -9H-fluoro; N, N '

bis (phenanthrene-9-yl) -N, '-bis (phenyl) -benzidine; 2.7 bis [N, N-bis (9,9-spiro-bifluoren-2-yl) -amino] -9,9-spiro-bifluorene; 2,2'-bis [N, N-bis (biphenyl-4-yl) amino] 9,9-spiro-bifluorene;

2,2'-bis (N, -di-phenyl-amino) 9,9-spiro-bifluorene; Di- [4- (N, N-ditolylamino) -phenyl] cyclohexane; 2, 2 ', 7, 7' tetra (N, N-di- tolyl) amino-spiro-bifluorene; and / or N, N, ',' -tetra-naphthalen-2-yl-benzidine.

The hole injection layer may have a layer thickness in a range of about 10 nm to about 1000 nm, for example in a range of about 30 nm to about 300 nm, for example in a range of about 50 nm to about 200 nm. On or above the hole injection layer the

Hole transport layer may be formed. The

Hole transport layer may comprise or be formed from one or more of the following materials: NPB (Ν, Ν'-bis (naphthalen-1-yl) -N, '-bis (phenyl) -benzidine); beta-NPB N, '-Bis (naphthalen-2-yl) -N,' -bis (phenyl) -benzidine); TPD

(N, '- bis (3-methylphenyl) - N,' - bis (phenyl) benzidine); Spiro TPD (N, '- bis (3-methylphenyl) - N,' - bis (phenyl) benzidine); Spiro-NPB (N, 'bis (naphthalen-1-yl) -N,' -bis (phenyl) -spiro); DMFL-TPD Ν, Ν'-bis (3-methylphenyl) -Ν, Ν'-bis (phenyl) -9,9-dimethyl-fluorene); DMFL-NPB (N, N'-bis (naphthalen-1-yl) -N, N'-bis (phenyl) -9,9-dimethyl-fluorene); DPFL-TPD (N, N'-bis (3-methylphenyl) -N, '-bis (phenyl) -9, 9-diphenyl-fluorene); DPFL-NPB (Ν, Ν'-bis (naphthalen-1-yl) -Ν, Ν'-bis (phenyl) -9,9-diphenyl-fluorene); Spiro-TAD (2, 2 ', 7, 7' tetrakis (n, n-diphenylamino) -9,9'-spirobifluorene); 9,9-bis [4- (N, N-bis-biphenyl-4-yl-amino) -phenyl] -9H-fluorene; 9,9-bis [4- (N, N-bis-naphthalen-2-yl-amino) -phenyl] -9H-fluorene; 9,9-bis [4- (N, N'-bis-naphthalen-2-yl-N, '-bis-phenyl-amino) -phenyl] -9H-fluoro; N, N '

bis (phenanthrene-9-yl) -N, '-bis (phenyl) -benzidine; 2, 7-bis [N, N-bis (9,9-spiro-bifluoren-2-yl) -amino] -9,9-spiro-bifluorene; 2,2'-bis [N, N-bis (biphenyl-4-yl) amino] 9,9-spiro-bifluorene; 2,2'-bis (N, -di-phenyl-amino) 9,9-spiro-bifluorene; Di- [4- (N, N-ditolylamino) -phenyl] cyclohexane; 2, 2 ', 7, 7' -tetra (N, N-diol-tolyl) amino-spiro-bifluorene; and N, Ν, Ν ', Ν'-tetra-naphthalen-2-yl-benzidine.

The hole transport layer may have a layer thickness in a range of about 5 nm to about 50 nm, for example in a range of about 10 nm to about 30 nm, for example about 20 nm.

On or above the hole transport layer, the one or more emitter layers may be formed, for example with fluorescent and / or phosphorescent emitters. The emitter layer may be organic polymers, organic

Oligomers, organic monomers, organic small, non-polymeric molecules ("small molecules") or a combination of these materials The emitter layer may comprise or be formed from one or more of the following materials: organic or organometallic

Compounds such as derivatives of polyfluorene, polythiophene and polyphenylene (e.g., 2- or 2,5-substituted poly-p-phenylenevinylene) as well as metal complexes, for example

Iridium complexes such as blue phosphorescent FIrPic

(Bis (3,5-difluoro-2- (2-pyridyl) phenyl- (2-carboxypyridyl) iridium III), green phosphorescing Ir (ppy) 3 (tris (2-phenylpyridine) iridium III), red phosphorescent Ru ( dtb-bpy) 3 * 2 (PF6) (tris [4, 4'-di-tert-butyl- (2,2'-bipyridine] ruthenium (III) complex) and blue fluorescent DPAVBi (4, 4-bis [ 4- (di-p-tolylamino) styryl] biphenyl), green fluorescent TTPA (9, 10-bis [N, -di (p-tolyl) -amino] anthracene) and red fluorescent DCM2 (4-dicyanomethylene) -2 -methyl-6-j ulolidyl-9-enyl-4H-pyran) as a non-polymeric emitter. The emitter materials may be suitably embedded in a matrix material, for example a technical ceramic or a polymer, for example an epoxy, or a silicone.

The first emitter layer may have a layer thickness in a range of about 5 nm to about 50 nm,

for example in a range of about 10 nm to about 30 nm, for example about 20 nm.

The emitter layer may have single-color or different-colored (for example blue and yellow or blue, green and red) emitting emitter materials. Alternatively, the Emitter layer have multiple sub-layers that emit light of different colors. By mixing the different colors, the emission of light can result in a white color impression. Alternatively or additionally, it can be provided in the beam path of the primary emission generated by these layers

To arrange converter material that the primary radiation

At least partially absorbed and emitted a secondary radiation of different wavelengths, so that from a (not yet white) primary radiation by the combination of primary radiation and secondary radiation, a white

Color impression results.

On or above the emitter layer, the

Be formed electron transport layer, for example, be deposited. The electron transport layer may include or be formed from one or more of the following materials: NET-18; 2, 2 ', 2 "- (1, 3, 5-benzyltriyl) tris (1-phenyl-1H-benzimidazoles); 2- (4-biphenylyl) -5- (4-tert-butylphenyl) -1, 3 , 4-oxadiazoles, 2, 9-dimethyl-4,7-diphenyl-l, 10-phenanthrolines (BCP), 8-hydroxyquinolinolato-lithium, 4- (naphthalen-1-yl) -3, 5-diphenyl-4H- l, 2, 4-triazoles; 1, 3-bis [2- (2,2'-bipyridine-6-yl) -1,3,4-oxadiazo-5-yl] benzene; 4,7-diphenyl-1 , 10-phenanthrolines (BPhen); 3- (4-biphenylyl) -4-phenyl-5-tert-butylphenyl-1,2,4-triazoles; bis (2-methyl-8-quinolinolates) -4- (phenylphenolato) aluminum; 6,6'-bis [5- (biphenyl-4-yl) -1,3,4-oxadiazol-2-yl] -2,2'-bipyridyl; 2-phenyl-9,10-di (naphthalene 2-yl) -anthracenes; 2, 7-bis [2- (2,2'-bipyridine-6-yl) -1, 3, 4-oxadiazo-5-yl] -9,9-dimethylfluorene; 1, 3-bis [2- (4-tert-butylphenyl) -1,3,4-oxadiazol-5-yl] benzene; 2- (naphthalen-2-yl) -4,7-diphenyl-l, 10-phenanthroline; 2,9-bis (naphthalen-2-yl) -4,7-diphenyl-l, 10-phenanthrolines;

Tris (2, 4, 6-trimethyl-3- (pyridin-3-yl) phenyl) boranes; 1-methyl-2 - (4 - (naphthalen-2-yl) phenyl) -1H-imidazo [4,5- f] [1,10] phenanthroline; Phenyl-dipyrenylphosphine oxides;

Naphthalenetetracarboxylic dianhydride or its imides;

Perylenetetracarboxylic dianhydride or its imides; and Fabrics based on siloles with a

Silacyclopentadiene unit.

The electron transport layer may have a layer thickness

in a range of about 5 nm to about 50 nm, for example, in a range of about 10 nm to about 30 nm, for example about 20 nm.

On or above the electron transport layer, the

Electron injection layer may be formed. The

Electron injection layer may include or may be formed of one or more of the following materials: NDN-26, MgAg, Cs 2 CO 3, Cs 3 PO 4, Na, Ca, K, Mg, Cs, Li, LiF; 2, 2 ', 2 "- (1,3,5-benzene triyl) tris (1-phenyl-1-H-benzimidazoles); 2- (4-biphenylyl) -5- (4-tert-butylphenyl) -1 , 3, 4-oxadiazoles, 2, 9-dimethyl-4,7-diphenyl-l, 10-phenanthrolines (BCP), 8-hydroxyquinolinolato-lithium, 4- (naphthalen-1-yl) -3, 5-diphenyl- 4H-1,2,4-triazoles; 1,3-bis [2- (2,2'-bipyridine-6-yl) -1,3,4-oxadiazo-5-yl] benzene; 4,7-diphenyl -1,10-phenanthrolines (BPhen); 3- (4-biphenylyl) -4-phenyl-5-tert-butylphenyl-1,2,4-triazoles; bis (2-methyl-8-quinolinolates) -4- ( phenylphenolato) aluminum; 6,6'-bis [5- (biphenyl-4-yl) -1,3,4-oxadiazo-2-yl] -2,2'-bipyridyl; 2-phenyl-9,10-di (naphthalen-2-yl) -anthracenes; 2, 7-bis [2- (2,2'-bipyridine-6-yl) -1, 3, 4-oxadiazo-5-yl] -9,9-dimethylfluorene; 1, 3-bis [2- (4-tert-butylphenyl) -1,3,4-oxadiazo-5-yl] benzene; 2- (naphthalen-2-yl) -4,7-diphenyl-l, 10 phenanthrolines; 2,9-bis (naphthalen-2-yl) -4,7-diphenyl-l, 10-phenanthrolines;

Tris (2, 4, 6-trimethyl-3- (pyridin-3-yl) phenyl) boranes; 1-methyl-2 - (4 - (naphthalen-2-yl) phenyl) -1H-imidazo [4,5- f] [1,10] phenanthrolines; Phenyl-dipyrenylphosphine oxides;

Naphthalenetetracarboxylic dianhydride or its imides;

Silacyclopentadieneinheit.

The electron injection layer may have a layer thickness in a range of about 5 nm to about 200 nm, for example in a range of about 20 nm to about 50 nm, for example about 30 nm.

In an organic functional layer structure 22 having two or more organic functional layer structure units, corresponding intermediate layers may be interposed between the organic functional layer structure units

be educated. The organic functional

Layered structure units may each be formed individually according to one embodiment of the above-described organic functional layered structure 22. The intermediate layer may be formed as an intermediate electrode. The intermediate electrode may be electrically connected to an external voltage source. The external voltage source can be at the intermediate electrode

for example, a third electrical potential

provide. However, the intermediate electrode can also have no external electrical connection, for example by the intermediate electrode having a floating electrical potential.

The organic functional layer structure unit may, for example, have a layer thickness of at most approximately 3 μm, for example a layer thickness of at most approximately 1 μm, for example a layer thickness of approximately approximately 300 nm.

The conventional optoelectronic component 1 can optionally have further functional layers, for example arranged on or above the one or more

Emitter layers or on or over the

Electron transport layer. The other functional

Layers can be, for example, internal or external coupling / decoupling structures that enhance the functionality and thus the efficiency of the conventional optoelectronic

Component 1 can further improve. The second electrode 23 may be formed according to any one of the configurations of the first electrode 20, wherein the first electrode 20 and the second electrode 23 are the same or

can be designed differently. The second electrode 23 may be formed as an anode or as a cathode. The second electrode 23 may have a second electrical connection to which a second electrical potential can be applied. The second electrical potential may be provided by the same or a different energy source as the first electrical potential. The second electrical

Potential may be different from the first electrical potential. The second electrical potential can

For example, have a value such that the

Difference from the first electrical potential has a value in a range of about 1.5 V to about 20 V, for example, a value in a range of about 2.5 V to about 15 V, for example, a value in a range of about 3 V. to about 12 V. The encapsulation layer 24 may also be referred to as

Thin-layer encapsulation may be referred to. The

Encapsulation layer 24 may be translucent or

be formed transparent layer. The

Encapsulation layer 24 forms a barrier to chemical contaminants or atmospheric agents, especially to water (moisture) and oxygen. In other words, the encapsulation layer 24 is designed such that it can be damaged by substances which can damage the optoelectronic component, for example water,

Oxygen or solvent, not or at most can be penetrated at very low levels. The

Encapsulation layer 24 may be formed as a single layer, a layer stack, or a layered structure. The encapsulation layer 24 may include or be formed from: alumina, zinc oxide, zirconia,

Titanium oxide, hafnium oxide, tantalum oxide, lanthanum oxide,

Silicon oxide, silicon nitride, silicon oxynitride, Indium tin oxide, indium zinc oxide, aluminum doped zinc oxide, poly (p-phenylene terephthalamide), nylon 66, and mixtures and alloys thereof. The encapsulation layer 24 may have a layer thickness of about 0.1 nm (one atomic layer) to about 1000 nm

For example, a layer thickness of about 10 nm to about 100 nm, for example about 40 nm.

The encapsulation layer 24 may comprise a high refractive index material, for example, one or more high refractive index materials, such as one

Refractive index of 1.5 to 3, for example from 1.7 to 2.5, for example from 1.8 to 2. Optionally, the first barrier layer on the support 12 corresponding to a configuration of

Encapsulation layer 24 may be formed.

The encapsulation layer 24 may be formed, for example, by a suitable deposition method, e.g. by atomic layer deposition (ALD), e.g. a plasma-assisted

Plasma Enhanced Atomic Layer Deposition (PEALD)) or a plasmaless

Atomic deposition method (Plasma-less Atomic Layer

Deposition (PLALD)), or by means of a chemical

Gas phase deposition process (Chemical Vapor Deposition

(CVD)), e.g. a plasma-assisted

Plasma Enhanced Chemical Vapor Deposition (PECVD) or a plasmalase

Gas phase deposition process (Plasma-less Chemical Vapor Deposition (PLCVD)), or alternatively by other means

suitable deposition method. Optionally, a coupling or decoupling layer, for example as an external film (not shown), on the support 12 or as an internal coupling-out layer (not shown) in

Layer cross section of the optoelectronic component 10 be educated. The input / outcoupling layer may have a matrix and scattering centers distributed therein, wherein the average refractive index of the input / outcoupling layer is greater than the average refractive index of the layer from which the

electromagnetic radiation is provided. Furthermore, one or more antireflection coatings may additionally be formed.

The adhesive layer 36 may include, for example, adhesive and / or paint, by means of which the cover body 38, for example, arranged on the encapsulation layer 24, for example glued, is. The adhesive layer 36 may be transparent or translucent. The

Adhesive layer 36 may, for example, comprise particles which scatter electromagnetic radiation, for example light-scattering particles. As a result, the adhesive layer 36 can act as a scattering layer and lead to an improvement in the color angle distortion and the coupling-out efficiency. As light-scattering particles, dielectric

Be provided scattering particles, for example, from a

Metal oxide, for example, silicon oxide (SiO 2), zinc oxide (ZnO), zirconium oxide (ZrO 2), indium tin oxide (ITO) or indium zinc oxide (IZO), gallium oxide (Ga 2 Ox) aluminum oxide, or titanium oxide. Other particles may also be suitable provided they have a refractive index that is different from the effective refractive index of the matrix of the adhesive layer 36

is different, for example, air bubbles, acrylate, or glass bubbles. Furthermore, for example, metallic nanoparticles, metals such as gold, silver, iron nanoparticles, or the like may be provided as light-scattering particles.

The adhesive layer 36 may have a layer thickness greater than 1 ym, for example, a layer thickness of several ym. In various embodiments, the adhesive may be a lamination adhesive. The adhesive layer 36 may have a refractive index that is less than the refractive index of the cover body 38. The adhesive layer 36 may include, for example, a

low-refractive adhesive, such as an acrylate having a refractive index of about 1.3. However, the adhesive layer 36 may also have a

Having high refractive adhesive, for example, has high refractive, non-diffusing particles and has a coating thickness-averaged refractive index, the

about the mean refractive index of the organic

functional layer structure 22, for example in a range of about 1.6 to 2.5, for example from 1.7 to about 2.0. On or above the active area may be a so-called

Getter layer or getter structure, i. a laterally structured getter layer (not shown) may be arranged. The getter layer can be translucent, transparent or opaque. The getter layer may include or be formed from a material that includes fabrics

are harmful to the active area, absorbs and binds. For example, a getter layer may include or be formed from a zeolite derivative. The getter layer may have a layer thickness greater than 1 ym,

for example, a layer thickness of several ym. In

According to various embodiments, the getter layer may comprise a lamination adhesive or in the

Adhesive layer 36 embedded. The covering body 38 can be formed, for example, by a glass body, a metal foil or a sealed plastic film covering body. The cover body 38 can

For example, by means of a frit bonding (glass frit bonding / glass soldering / seal glass bonding) by means of a conventional glass solder in the geometric

Edge regions of the conventional optoelectronic

Component 1 may be arranged on the encapsulation layer 24 or the active region. The cover body 38 can For example, have a refractive index (for example, at a wavelength of 633 nm), for example, 1.3 to 3, for example, from 1.4 to 2, for example from 1.5 to 1.8.

FIG. 3 shows an exemplary embodiment of an optoelectronic component in a state during a conventional method for producing the organic functional

Layer structure 22 of the optoelectronic component 10.

The optoelectronic component 10 has a carrier 12. The carrier 12 is formed in cross-section example, double T-shaped. The carrier 12 may be formed, for example, rotationally symmetrical to an axis of symmetry 55. The carrier 12 is held by a substrate holder 54 and / or is fixedly connected to the substrate holder 54. The carrier 12 has a continuous three-dimensional surface 40 to be coated. The carrier 12 has a surface 42 that is not to be coated. The non-coating surface 42 is the substrate holder 54

facing. By way of example, the carrier 12 is directly physically coupled to the substrate holder 54 on its surface 42 which is not to be coated. The substrate comprises the carrier 12 and may also comprise electrode layer 14, in particular the first electrode 20, the first contact section 16 and / or the second contact section 18. The substrate may be formed, for example, in one piece or in several pieces. The substrate may be a metal layer, a metal body, for example a hollow body or a solid body

or be formed thereof. If the substrate has good electrical conductivity, additional formation of the electrode layer 14, in particular the first electrode 20, the first contact section 16 and / or the second contact section 18 can be dispensed with.

The three-dimensional surface 40 is thereby

characterized in that they are different from each other

has different sub-areas, each one Have surface normals, each of these surface normal is a straight line which intersects the three-dimensional surface 40 in the corresponding portion at right angles, wherein at least two of the surface normal one

span two-dimensional plane and at least one of the surface normal this plane in exactly one point

cuts. Thus, the surface normals are in the

corresponding portion always at a right angle to the three-dimensional surface 40 and are linearly independent of each other.

On the three-dimensional surface 40 of the carrier 12 to be coated, the first electrode layer 14 may be formed (not shown in FIG. 3), of which, in particular, the first electrode 20 is formed. In other words, the carrier 12 shown in FIG. 3 may be representative of the substrate of the optoelectronic component 10. From a side facing away from the carrier 12 of the first electrode layer 14, for example, the first electrode 20, thus can be coated to be coated three-dimensional surface 40 of

Optoelectronic device 10 may be formed.

In the conventional method for coating the substrate or for forming the organic functional

Layer structure 22 may, for example, a first

organic material of organic functional

Layer structure 22 are heated in a conventional reservoir 50 until it evaporates. The conventional one

Reservoir 50 can thus serve as a coating source. The molecules of the first organic material increase in a first direction 52 from the conventional one

Reservoir 50 toward the optoelectronic device 10 on. The first organic material then deposits in several subregions of the coating to be coated

3-dimensional surface 40 and forms a sub-layer of the organic functional layer structure 22 in each of the subregions. However, others remain

uncoated portions 44, for example, due to Shading of these uncoated regions 44 due to the three-dimensional shape of the substrate and in particular of the carrier 12. In other words, the uncoated portions 44 are seen from the coating source in one or more blind spots. Thus, according to the conventional method for forming the organic

functional layer structure 22 not the entire

three-dimensional surface 40 of the substrate are coated with the first organic material. This can

For example, help ensure that of the coated sub-areas no coherent layer but

separated individual layers are formed.

After according to this conventional method and / or according to other conventional methods, a second organic

Material and / or other organic materials of the

organic functional layer structure 22, in particular the partial layers of the organic functional

Layer structure 22, one above the other, is formed a non-contiguous, several separate sub-regions, having organic functional layer structure 22. In particular, in the uncoated

Subareas 44 no organic functional

Layer structure 22 is formed. Thus, that can

Optoelectronic device 10, manufactured, inter alia, by means of the conventional method, do not provide a coherent three-dimensional luminous surface, the one

provides homogeneous luminance. For coating the entire surface 40 to be coated, the substrate could now be rotated so that the

uncoated portions 44 are no longer shaded, and the conventional method could be performed over the uncoated portions 44. However, this would result in transition areas between the first coated areas and the following

coated areas would be double coated, and again, no coherent three-dimensional surface 40 would be homogeneously coated.

FIG. 4 shows an embodiment of an optoelectronic component 10 in a state during the conventional method of forming the organic functional ones

Layer structure 22.

The optoelectronic component 10, in particular the

Substrate or the carrier 12 of the optoelectronic

Component 10, for example, largely in the

Previously explained optoelectronic component 10 correspond. The optoelectronic component 10,

in particular the substrate or the carrier 12 of the

Optoelectronic device 10, has an outer shape through which in the conventional method of the

conventional reservoir 50 seen from no

shaded areas arise and / or there is no blind spot. For example, the carrier 12 may be hemispherical, half-tubular or cup-shaped. The carrier 12 may be formed, for example, rotationally symmetrical to the axis of symmetry 55.

The entire three-dimensional surface 40 of this

Optoelectronic device 10 may by means of

conventional method for forming the organic functional layer structure 22 are completely coated. However, the organic functional layer structure 22 is not formed homogeneously. In particular, the organic functional layer structure 22 in the first

Subareas 46, in which the three-dimensional surface 40 is aligned parallel, nearly parallel or at an acute angle to the first direction 52, a small first thickness on and in second portions 48, in which the first

Direction 52 to the three-dimensional surface 40 has an obtuse angle or perpendicular to this, a large second thickness. The second thickness is greater than the first thickness. With the conventional method for forming the organic functional layer structure 22, therefore, no homogeneous organic functional layer structure 22 on the

three-dimensional surface 40 are formed.

FIG. 5 shows the optoelectronic component 10 according to FIG. 3 in a state during one embodiment of a method for forming the organic functional ones

Layer structure 22.

The method may be performed, for example, by means of an embodiment of an apparatus for forming the organic functional layer structure 22. The

Device comprises the substrate holder 54, an actuator unit 56, a coating device 90 and a control unit 58.

The actuator unit 56 may be formed according to a robot, for example. For example, the actuator unit 56 may comprise an arm 57, for example a robot arm, which is coupled to a coating head 60. Of the

Coating head 60 has a coating source 62. The coating head 60 may, for example, have a joint by means of which the coating source 62 may be rotatably arranged about a first axis 70. The actuator unit 56 is electrically and / or with the control unit 58

physically coupled. The control unit 58 can in the

Actuator 56 may be integrated or disposed externally of this and be electrically coupled thereto.

The coating device 90, which is explained in more detail below with reference to FIG. 9, has the coating head 60. Coating device 90 may optionally include or be coupled to actuator unit 56. The coating device 90 may be electrically and / or physically coupled to the control unit 58. The

Control unit 58 may be in the coating device 90th be integrated or disposed externally of this and be electrically coupled thereto.

The control unit 58 has a memory unit 59. The control unit 58 is suitable for generating one and / or multiple motion signals and for transmitting the

Motion signals to the actuator 56. The movement signals cause actuators, not shown, the actuator unit 56 to move the coating head 60 and / or the coating source 62 in accordance with the movement signals. The control unit 58 is also suitable for generating one or more coating signals and for sending the coating signals to the coating device 90 and / or to the

Actuator 56. The coating signals cause actuators, not shown, the actuator unit 56 a promotion of a first organic material towards the

Allow coating source 62 and the first organic material is applied from the coating source toward the surface to be coated 40 on the surface 40 to be coated. For example, the first organic material is applied in the form of a first coating cone 64 towards the surface 40 to be coated.

For example, the first organic material is in

liquid state and / or dissolved in a liquid towards the coating head 60, for example a spray head, conveyed, for example by means of a pump

Actuator unit 56, and from the coating source 62,

for example, a spray source, out to the

coating surface 40 sprayed.

Alternatively, the first organic material may be in

gaseous state and / or with the aid of a carrier gas to the coating head 60, for example a

Bedampfungskopf be promoted, for example by means of a shutter and / or valve of the actuator 56, and the coating source 62, for example a

Bedampfungsquelle, off on the surface to be coated 40th be steamed. This process can be carried out, for example, according to OVPD and / or vaporjet deposition.

The actuator unit 56 with its actuators allows the

Coating source 62 over the entire to be coated

Surface 40 to move. Thereby, the coherent homogeneous layer of organic material can be formed on the entire coating three-dimensional surface 40. With the help of the actuator 56, the

Coating source 62 over all parts of the zu

Coating three-dimensional surface 40 are moved so that a distance between the coating source 62 and the three-dimensional surface 40 to be coated is always the same or at least approximately the same.

Alternatively or additionally, with the aid of the actuator unit 56, the coating source 62 can be moved over all partial regions of the three-dimensional surface 40 to be coated in such a way that a coating axis of the first

Coating cone 64 always includes the same angle with the surface normals of the subregions of the coated to be coated three-dimensional surface 40. For example, the coating axis and the

Surface normals always be aligned parallel to each other. In other words, the coating axis can always be perpendicular to the current area to be coated. Of the

Coating cone 64 may be, for example, a steam cone or a spray cone. Accordingly, the

Coating axis, for example, be a steam cone axis of the steam cone or a Sprühkegelachse the spray cone.

Alternatively or additionally, the substrate holder 54 may be coupled to the actuator unit 56. The actuator unit 56 can then, with the aid of the actuators, not shown, move the substrate, in particular the carrier 12, past the coating source 62 in such a way that the entire coating to be coated

three-dimensional surface 40 can be coated by means of the coating head and the coating source 62.

In particular, the movement of the substrate during the Coating be such that the coating source 62 always has the same or at least approximately the same distance from the three-dimensional surface 40 during coating. Alternatively or additionally, the

Movement of the substrate during the coating carried out such that the coating axis of the coating cone 64 always the same or at least approximately the same angle with the surface normal of the three-dimensional

Surface 40 includes. For example, the

Coating axis and the surface normals should always be aligned parallel to each other. In other words, the coating axis can always be perpendicular to the current too

standing coating part. The coating of the three-dimensional surface 40 thus takes place during a relative movement between the

Coating source 62 and the substrate. The relative movement may be performed by fixing the position of the substrate and moving the coating source 62, fixing the coating source 62 and moving the substrate, or moving the substrate and the coating source 62.

For reasons of better clarity and to avoid repetition, the relative movement is explained below on the basis of the situations in which the substrate, in particular the carrier 12, is arranged stationary and the coating source 62 is moved. It should be noted, however, that similar or the same or corresponding movements can also be achieved by fixing the coating source 62 and moving the substrate or by moving the substrate and the coating source 62. In other words, the substrate is used as a reference point below

set and the coating source 62 is moved.

Alternatively, the coating source 62 may be fixed and the substrate may be moved.

The entire three-dimensional surface 40 to be coated can be made, for example, with the first organic material coated by rotating the coating source 62 about the first axis 70 and / or about a second axis 72. The second axis 72 is not parallel to the first axis 70. For example, the second axis 72 a

However, the second axis 72 may not be an axis of symmetry and / or the substrate may not be symmetrical. Alternatively or additionally, the entire three-dimensional surface 40 to be coated can be coated by displacing the coating source 62 in one, two or three spatial dimensions. The three spatial dimensions are, for example, the three spatial dimensions of a three-dimensional space, the spatial dimensions being shown, for example, by the X-axis, the Y-axis and the Z-axis of one shown in FIG

Coordinate system can be marked.

For the body shown in Figure 5, rotation about the first and second axes 70, 72 is required. However, other three-dimensional surfaces 40 are conceivable for which the displacement in three spatial dimensions is sufficient and no rotation is necessary or

certain combinations of rotation and displacement

necessary. For example, the three-dimensional surface 40 shown in FIG. 5 can be completely homogeneous

coated by rotating the coating source 62 about the first axis 70 and about the second axis 72 relative to the surface 40 to be coated, and is displaced in at least one dimension, for example in the Z-direction. In addition, the shift into a second

Dimension, for example, in the X direction.

After the coated three-dimensional surface 40 is fully and homogeneously coated with the first organic material, also the second organic

Material or optionally further organic materials are deposited over the three-dimensional surface to be coated. In this way, the coherent

three-dimensional surface 40 with a contiguous homogeneous organic functional layer structure 22 are coated.

Optionally, with a nearly identical method and / or with a nearly identical device, the first

Electrode 20 are formed on the support 12 or the second electrode 23 above the organic functional layer structure 22, in which case, however, the corresponding to the first and second electrode 20, 23 materials must be applied to the respective surface to be coated.

In various embodiments, one of the

Electrodes 20, 23 of the optoelectronic component 10 may be formed mirror-like and / or non-transparent.

For example, in the case of a bottom-emitting OLED, the top electrode, that is to say the second electrode 23, can be of one

be formed reflective metal layer. The

opaque electrode of the OLED can with a

conventional methods, for example by means of multiple conventional coating of the three-dimensional surface 40 are formed from different directions in order to avoid shadowing that would otherwise not complete and / or closed coating of the three-dimensional surface 40 allow.

To the in this case transparent first electrode 20 of the OLED more complex requirements are made. This can e.g. consist of a thin (and thus semi-transparent) metal layer. In order to ensure the requirements for the layer thickness control and homogeneity of this metal layer, the metal layer can be formed, for example, by a method analogous to that described with respect to the organic functional layer structure 22, but this is associated with high thermal requirements for the source systems. Alternatively, solution processable electrodes may be used.

For example, it is conceivable that silver nanowires are the first Electrode 20 on the three-dimensional surface 40 of the

To spray carrier 12, or to provide the three-dimensional support 12 with a solution-processed ITO layer. FIG. 6 shows the optoelectronic shown in FIG

Device 10 in a state during the process for forming the organic functional layer structure 22. The method, for example, according to the method explained with reference to Figure 5 and / or for example by means of the device explained with reference to Figure 5 for

Forming the organic functional layer structure 22 are performed. In particular, with the method and / or the device to be coated

three-dimensional surface 40 coherent, complete and homogeneous with the organic functional

Layer structure 22 are coated. In particular, the organic functional layer structure 22 may be a

have homogeneous thickness. In the optoelectronic components 10 shown in FIG. 5 and FIG. 6, the organic materials and, accordingly, the organic functional layer structure 22 are applied to outer surfaces of the corresponding optoelectronic components 10. Alternatively or additionally, the organic materials or the organic functional layer structure 22 can also be applied to inner surfaces of the

optoelectronic component 10 are applied, provided that the corresponding substrate forms a hollow body. 7 shows an exemplary embodiment of an optoelectronic component 10 in a state during the method for forming the organic functional layer structure 22. The substrate, in particular the carrier 12, forms

for example, a hemispherical or semi-cylindrical or cup-shaped hollow body. The coating source 62 may be moved relative to the substrate such that the coating source 62 is in the cavity formed by the substrate. The substrate source 62 may then be passed over the surface 40 to be coated by rotations about the first axis 70, the second axis 72 and / or displacements in the first, second and / or third dimension such that the entire surface to be coated

three-dimensional surface 40 is coated contiguously and homogeneously with the organic materials and thereby the homogeneous organic functional layer structure 22 is produced.

FIG. 8 shows an exemplary embodiment of an optoelectronic component in a state during the method for

Forming the organic functional layer structure 22. The method can be carried out, for example, according to the method explained with reference to Figure 7. The

Substrate, for example, can correspond almost to the substrate explained with reference to FIG. 7, except that the spherical shape or cylindrical shape over the hemisphere or the half cylinder

goes. Optionally, the coating head 60 may comprise a further joint which permits rotation of the

Coating source 62 allows a third axis 76. The third axis of rotation 76 may, for example, be parallel or antiparallel to the first axis of rotation 70.

9 shows the coating device 90. The

Coating device 90 is connected via the arm 57 with the

Actuator 56 coupled. The coating device 90 has the coating head 60, a reservoir 92, a line system 94 and optionally a pumping system. The

Line system 94 may be one, two or more, for example Have lines, pipes, valves and / or shutter. The lines or pipes of the line system 94 can

be heated, for example. The reservoir 92 may be, for example, a simple reservoir 92 in which only the first organic material is stored. in the

In contrast, the reservoir 92 may however also be adapted to bring the first organic material into a state in which it can be conveyed via the conduit system 94 to the coating source 62 and can be applied out of the coating source 62.

For example, the first organic material may be in

liquid or gaseous state to the

Coating source 62 are promoted. Optionally, the first organic material may be delivered to the coating source 62 by means of a carrier gas.

The first organic material may include, for example

Have substance mixture or be a mixture of substances. The

Mixture of substances may contain one or more of the organic functional substances mentioned above

Layer structure 22 have. For example, the various substances of the substance mixture can already be found in the

Reservoir 92 of the coating device 90 or only in the coating head 60 or only during coating themselves mixed together. The coating device 90, the coating head 60 and / or the line system 94 can accordingly be designed for feeding the substance mixture or the substances of the substance mixture. Further, a plurality of reservoir 92 may be provided accordingly.

The coating device 90 may, for example, have a diaphragm 80. The aperture 80 has a recess 82 through which the first organic material can be applied. For example, the first organic occurs

Material from the coating source 62 in the form of the first coating cone 64 from. The coating cone 64 has, for example, the first coating axis 78. The shape of the first coating cone 64 may, for example, by means of the aperture 80 toward a shape of a second

Coating cones 84 are changed. The second

Coating cone 84 may have the same coating axis 78 as the first coating cone 64 or other coating axis. When using the aperture 80, the organic material may also be on one of

Deposit coating source 62 facing rear 86 of the aperture 80. The aperture 80 can contribute to beam shaping, which may be advantageous for controlling the coating of the three-dimensional surface 40, but with a

may be associated with poorer material yield, since a portion of the organic material on the back 86 of the

Aperture 80 can be deposited.

The function of the coating apparatus 90, the apparatus, and the method of forming the organic functional layer structure 22 have been described with reference to the first

explained organic material. However, the coating apparatus 90, the apparatus or method for forming the organic functional layer structure 22 can readily be applied to the spraying of second organic

Material or other organic material.

The source of organic materials can be realized in various ways. For example, the organic material in the reservoir 92 may be thermally evaporated and passed through the heated line system 94 to the coating source 62, which then

For example, it can act as a point source. Alternatively, the transport of the organic material to

Coating source 62 by means of an inert carrier gas. The basic principle may be a jet-shaped OVJP source (OVJP = Organic Vapor Jet Deposition), but with a large exit orifice for effective coating of large three-dimensional surfaces

enable.

10 shows a flow chart of an embodiment of a method for forming the organic functional layer structure 22.

In an optional step S2, the first organic material may be prepared. For example, the first organic material in a liquid or gaseous

Condition are transferred. Further, the first organic material may be mixed with, for example, a carrier liquid or a carrier gas. If the first organic material is a substance mixture, in step S2 the substances of the substance mixture can be prepared and / or mixed with one another.

In a step S4, a partial area of the

coated three-dimensional surface 40 with the first organic material, for example, sprayed or vapor-deposited. If the first organic material is a

Mixture is, the substances of the mixture can be mixed together in step S4, for example, directly before application to be coated

three-dimensional surface 40 or during application on the three-dimensional surface 40 to be coated. The materials can be conveyed via the same or different lines and / or pipes. In a step S6, the coating source 62 is moved relative to the substrate in three spatial dimensions, for example as explained above

Rotations about the one or both axes 70, 72 and / or the displacement in one, two or three spatial

Dimensions.

The steps S4 and S6 are simultaneously performed over a long period of time such that the entire three-dimensional surface 40 to be coated is homogeneously coated with the first organic material.

In an optional step S8, a second organic material may be prepared. Step S8 may

for example, corresponding to the step S2, with only the second organic material performed.

In steps S10 and S12, corresponding to steps S4 and S6, the entire three-dimensional surface 40 can then be coated with the second organic material. Furthermore, further sub-steps for

Coating the three-dimensional to be coated

Surface 40 with third, fourth and / or further

organic materials are processed until the

organic functional layer structure 22 is completely formed.

The invention is not limited to those specified

Embodiments limited. For example, with Help the above explained methods and

Devices for forming the organic functional layer structure 22 are any three-dimensional

Surface 40, so differently shaped carrier 12 or substrates, homogeneously coated with an organic functional layer structure 22. Furthermore, further layers, such as the electrodes 20, 23 and / or

Barrier layers and / or encapsulation layers and / or adhesive layers are provided with corresponding methods and / or apparatus for forming the corresponding layers.

Claims

claims

A method for forming an organic functional layer structure (22) for an optoelectronic component (10), in which

a first organic material of the organic functional layer structure (22) by means of a

Coating source (62) is applied to a portion of a three-dimensional surface (40) to be coated over a substrate (12) of the optoelectronic component (10),

the coating source (62) and the substrate during the spraying of the first organic material relative

be moved to each other so that the first organic

Material below to other parts of the

coating surface (40) is applied over the substrate and so the entire three-dimensional surface (40) is coated, and

- A relative movement between the coating source (62) and the substrate has a first rotation about a first axis (70) and a second rotation about at least one second axis (72).

2. The method of claim 1, wherein the relative movement between the coating source (62) and substrate a

Has displacement in at least one dimension.

3. The method of claim 2, wherein the relative movement between the coating source (62) and substrate a

Has displacement in at least two spatial dimensions.

4. The method according to any one of the preceding claims, wherein

a second organic material of the organic functional layer structure (22) by means of

Coating source (62) on a portion above the surface to be coated three-dimensional surface (40), with the first organic material is coated, applied and

the coating source (62) and the substrate are moved relative to one another during the coating of the three-dimensional surface (40) with the second organic material such that subsequently the second organic material is applied to other portions above the surface (40) to be coated which are in contact with the substrate first organic material are coated, so that is applied over the entire too

Coating three-dimensional surface (40) is formed a layer of the second organic material.

5. The method according to any one of the preceding claims, wherein during the spraying of the first organic material and / or the second organic material, a distance between the coating source (62) and the zu

Coating three-dimensional surface (40) is always the same or at least approximately the same.

A method according to any one of the preceding claims, wherein during the spraying of the first organic material, an angle between a coating axis (78) of a

Coating cone (64, 84) and a surface normal on the currently to be coated portion above the

three-dimensional surface (40) is always the same or at least approximately the same.

7. Apparatus for forming an organic

functional layered structure (22) for a

optoelectronic component (10) comprising

a substrate holder (54) for holding a substrate of the optoelectronic component (10), the substrate having a three-dimensional surface (40) to be coated,

a coating device (90) having a

Coating source (62) for applying a first

organic functional organic material Layer structure (22) on a portion above the

three-dimensional surface (40),

- An actuator unit (56) with the substrate holder (54) and / or the coating source (62) mechanically

coupled,

a control unit (58) which is electrically coupled to the actuator unit (56) and the coating device (90),

wherein the control unit (58), the coating device (90) and the actuator unit (56) are formed so that the coating device (90) in response to a

Coating signal of the control unit (58) coated the portion above the three-dimensional surface (40) with the first organic material and that the actuator unit (56) in response to a motion signal of the control unit

(58) relative to the coating source (62) and the substrate during the spraying of the first organic material

to each other so that the coating source (62) applies the first organic material subsequently to other portions over the three-dimensional surface (40) of the substrate and thus the entire to be coated

Coated three-dimensional surface (40) and that a relative movement between the coating source (62) and

Substrate has a first rotation about a first axis (70) and a second rotation about at least one second axis (72).

8. Apparatus according to claim 7, which is a storage unit

(59) electrically coupled to the control unit (58) and having information relating to

geometric shape of the three-dimensional surface (40) are stored, wherein the control unit (58) is adapted to the movement signal depending on the

Information generated.

9. Device according to one of claims 7 or 8, wherein the coating source (62) has a diaphragm (80).