WO2015056368A1

WO2015056368A1 - Transfer device and transfer method

Info

Publication number: WO2015056368A1
Application number: PCT/JP2014/002506
Authority: WO
Inventors: 和史杉山
Original assignee: パナソニック株式会社
Priority date: 2013-10-17
Filing date: 2014-05-13
Publication date: 2015-04-23

Abstract

A transfer device, and the like, of the disclosure of the present invention comprises the following: a magnet (21) one end of which is connected to a cord-shaped member (22) and which is hung at a specific height; and a substrate receiving jig (23) having a plate part (232) that comes into contact with at least a portion of the bottom surface of a driver substrate (102) thereby supporting the driver substrate (102), and a projection part (231) that is formed on the plate part (232) and that can be inserted so as to pass through an attachment hole (104) which is a hole in the driver substrate (102) and which is of a pre-determined size. The magnet (21) retains the substrate receiving jig (23) at a specific height by applying a pulling force to the tip end part of the projection part (231) using magnetism.

Description

Transfer device and transfer method

The present disclosure relates to a transfer device used when transferring a substrate, and a transfer method using the transfer device.

Patent Document 1 discloses a substrate holding and fixing jig for holding and fixing a substrate for transporting the substrate to another place. The substrate holding and fixing jig includes a suction cup, a passage for sending air into the suction cup, and an opening / closing valve for opening and closing the atmosphere in the passage. Thereby, the substrate can be held and fixed by vacuum suction.

Japanese Patent Laid-Open No. 2005-008353

This disclosure is intended to provide a transfer apparatus effective for transferring a substrate independent of dimensions and shapes, and a transfer method using the same.

A transfer device according to an aspect of the present disclosure is a transfer device used for transferring a substrate, one end of which is connected to a string-like body and suspended at a predetermined height, and the substrate A flat plate portion that supports the substrate by contacting at least a part of the lower surface, and a hole formed in the flat plate portion that can be inserted through a hole having a predetermined size. A substrate receiving jig having a protruding portion, and the magnet holds the substrate receiving jig at a predetermined height by adsorbing the tip of the protruding portion with a magnetic force.

According to the present disclosure, it is possible to provide a transfer apparatus effective for transferring a substrate independent of dimensions and shapes, and a transfer method using the same.

FIG. 1 is a diagram schematically showing a display panel with a driver substrate. FIG. 2A is a diagram schematically illustrating a method of holding a display panel with a driver substrate using vacuum suction in order to transfer the display panel. FIG. 2B is a side view of FIG. 2A. FIG. 3 is a diagram schematically illustrating the configuration of the transfer apparatus according to the first embodiment. FIG. 4 is a diagram illustrating another example of the configuration of the magnet according to the first embodiment. FIG. 5A is a diagram illustrating an example of a shape when the transfer apparatus according to Embodiment 1 is viewed from above. FIG. 5B is a diagram showing another example of the shape when the transfer device according to Embodiment 1 is viewed from above. FIG. 6 is a flowchart for explaining the transfer method of the present disclosure. FIG. 7A is a diagram schematically illustrating a method of holding the display panel with a driver substrate using the transfer apparatus according to the first embodiment. FIG. 7B is a side view of FIG. 7A. FIG. 8 is a diagram schematically showing the configuration of the substrate receiving jig according to the second embodiment. FIG. 9 is a diagram schematically illustrating another example of the configuration of the substrate receiving jig according to the second embodiment. FIG. 10 is a diagram schematically showing the configuration of the substrate receiving jig according to the third embodiment. FIG. 11 is a diagram schematically illustrating a usage example of the substrate receiving jig according to the third embodiment. FIG. 12 is a diagram schematically illustrating another example of the configuration of the substrate receiving jig according to the third embodiment.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings as appropriate. However, more detailed description than necessary may be omitted. For example, detailed descriptions of already well-known matters and repeated descriptions for substantially the same configuration may be omitted. This is to avoid the following description from becoming unnecessarily redundant and to facilitate understanding by those skilled in the art.

In addition, the inventor (s) provides the accompanying drawings and the following description in order for those skilled in the art to fully understand the present disclosure, and these are intended to limit the claimed subject matter. It is not a thing.

(Embodiment 1)
[Substrate structure]
Hereinafter, the substrate may be described as a driver substrate connected to the display panel by flexible wiring. Of course, the board is not limited to the driver board.

FIG. 1 is a diagram schematically showing a display panel with a driver board.

The display panel 100 with a driver substrate includes a display panel 101, one or more driver substrates 102, and a flexible substrate 103.

The display panel 101 is, for example, a liquid crystal display panel, an organic EL (Electro Luminescence) panel, or a plasma display panel, and is assembled in a display device to display an image.

The driver board 102 includes a mounting hole 104, and a driver circuit for supplying a display signal to the display panel 101 is mounted. Here, the driver substrate 102 is, for example, a printed circuit board (PCB: Printed Circuit Board), but may be formed as a rigid portion of a rigid flexible substrate. The driver circuit is configured by mounting a plurality of components on the surface (component mounting surface) of the driver substrate 102 together with wiring.

The mounting hole 104 is a hole that the driver board 102 has and has a predetermined size. Typically, the attachment hole 104 is a through-hole to which a fastening member such as a screw having a diameter of about 10 mm is attached. The mounting holes 104 are holes that are necessary when the display panel 100 with a driver substrate is assembled to a display device, and are necessarily provided.

The flexible substrate 103 is mounted with flexible wiring, and connects the display panel 101 and the driver substrate 102 physically and electrically. The flexible substrate is, for example, a flexible printed circuit (FPC), but may be formed as a flexible portion of a rigid flexible substrate.

The display panel 100 with a driver board is first manufactured in a clean room, transported outside the clean room, and then assembled into a display device. The mounting table on which the display panel 100 with a driver substrate is mounted is different between inside and outside the clean room. For this reason, it is necessary to transfer the display panel 100 with a driver substrate.

[Description of Conventional Transfer Apparatus and Transfer Method: Transfer Method of Substrate by Vacuum Adsorption Only]
Here, with reference to FIG. 2A and FIG. 2B, a problem in the case where vacuum suction is used to transfer the display panel 100 with a driver substrate will be described.

FIG. 2A is a diagram schematically showing a method of holding a display panel with a driver substrate using vacuum suction in order to transfer the display panel. FIG. 2B is a side view of FIG. 2A. Elements similar to those in FIG. 1 are denoted by the same reference numerals, and detailed description thereof is omitted.

As shown in FIGS. 2A and 2B, the display panel 101 with the driver substrate is transferred by holding the display panel 101 by vacuum suction with the suction pad 905 and holding the driver substrate 102 with vacuum suction by the suction pad 906. Can be listed.

However, the suction pad 905 needs to be vacuum-sucked while avoiding a plurality of components (component mounting positions) mounted on the driver board 102. In other words, the driver board 102 has a restriction on the position where it can be sucked (sucking place). Further, when the dimensions and shape of the driver board 102 are changed, the component mounting position is also changed, so the suction location must also be changed. Furthermore, when a plurality of components and wirings mounted on the driver substrate 102 are increased in density, there may be a case where there is no suction location.

[Description of Transfer Apparatus and Transfer Method of One Embodiment of the Present Invention]
Hereinafter, the transfer device and the transfer method according to the present disclosure will be described.

[Configuration of Transfer Device of Embodiment 1]
FIG. 3 is a diagram schematically illustrating the configuration of the transfer apparatus according to the first embodiment. FIG. 4 is a diagram illustrating another example of the configuration of the magnet according to the first embodiment. FIG. 5A is a diagram illustrating an example of a shape when the transfer apparatus according to Embodiment 1 is viewed from above. FIG. 5B is a diagram showing another example of the shape when the transfer device according to Embodiment 1 is viewed from above.

As shown in FIG. 3, the transfer device 20 is a transfer device used to transfer the driver substrate 102, and includes a magnet 21 connected to the string-like body 22 and a substrate receiving jig 23. .

The substrate receiving jig 23 has a protruding portion 231 and a flat plate portion 232.

The protruding portion 231 is formed in the flat plate portion 232 and is formed so as to be able to be inserted through the mounting hole 104 which is a hole of the driver board 102 and has a predetermined size. The protrusion 231 is a metal that is adsorbed by magnetic force, and is, for example, iron, cobalt, nickel, or an alloy containing these.

The flat plate portion 232 supports the driver board 102 by contacting at least a part of the lower surface of the driver board 102. The flat plate portion 232 only needs to be a material intended for weight reduction, and examples thereof include aluminum, copper iron, and an acrylic resin.

The magnet 21 is connected at one end to the string 22 and suspended at a predetermined height. The magnet 21 holds the substrate receiving jig 23 at a predetermined height by attracting the tip of the protruding portion 231 with a magnetic force. For example, the magnet 21 is typically composed of a permanent magnet, but may be composed of an electromagnet.

One end of the magnet 21 may be directly connected to the string-like body 22 by welding or the like, but the string-like body 22 is passed through the connecting member 211 formed on the magnet 21 as shown in FIG. It may be connected by binding.

Further, the shape when the protrusion 231 and the magnet 21 are viewed from above is an ellipse smaller than the mounting hole 104 as shown in FIG. 5A, for example. Thereby, the protrusion 231 can be easily inserted into the mounting hole 104. Of course, the shape when the protrusion 231 and the magnet 21 are viewed from above may be a circle smaller than the mounting hole 104, such as a circle having a diameter of about 8 mm, for example, as shown in FIG. 5B. The shape is arbitrary as long as it can be smoothly inserted into the mounting hole 104 without hindrance and the horizontal displacement of the driver board 102 can be suppressed through the mounting hole 104.

The string-like body 22 is composed of, for example, a rope, a cable, a metal wire, etc., from which static electricity is prevented, and has a certain length. One end of the string-like body 22 is connected to the magnet 21 and the other end is fixed at a constant height, whereby the magnet 21 can be suspended to a predetermined height. Here, the predetermined height is, for example, a height at which the display panel 101 is held.

[Substrate Transfer Method Using Transfer Device of Embodiment 1]
Here, the case where the transfer apparatus 20 is used in order to transfer the display panel 100 with a driver board | substrate is demonstrated using FIG. 6, FIG. 7A and FIG. 7B.

FIG. 6 is a flowchart for explaining the transfer method of the present disclosure. FIG. 7A is a diagram schematically illustrating a method of holding the display panel with a driver substrate using the transfer apparatus according to the first embodiment. FIG. 7B is a side view of FIG. 7A. Elements similar to those in FIGS. 1, 2A, and 2B are denoted by the same reference numerals, and detailed description thereof is omitted.

First, the protruding portion 231 of the board receiving jig 23 is inserted into the mounting hole 104 so as to penetrate the mounting hole 104 of the driver board 102 (S101).

Next, the driver board 102 is supported by the board receiving jig 23 by bringing the flat plate portion 232 of the board receiving jig 23 into contact with at least a part of the lower surface of the driver board 102 (S102).

Next, each of the plurality of magnets 21 is caused to attract the tip of the protruding portion 231 of the substrate receiving jig 23 by magnetic force, so that the substrate receiving jig 23 is brought to a predetermined height as shown in FIG. 7B, for example. Hold (S103).

Here, each of the plurality of magnets 21 is held at a predetermined height by one end being connected to the string-like body 22. In other words, each of the string-like bodies 22 can be held at a predetermined height by fixing multiple ends at a certain height and connecting one end to one end of the magnet 21.

In this way, by attaching the substrate receiving jig 23 to the mounting hole 104 of the driver substrate 102 and holding the substrate receiving jig 23 with the magnet 21, the driver substrate 102 of the display panel 100 with a driver substrate can be held. Can do.

The display panel 101 is held at a predetermined height by another method such as vacuum suction without using the transfer device 20 as shown in FIG. 7A, for example. In this way, the display panel 100 with a driver substrate held by using the transfer device 20 can be held at substantially the same height as the display panel 101.

[Effects]
According to the present embodiment, for example, as shown in FIGS. 7A and 7B, the display panel 101 is vacuum-sucked and held by the suction pad 905 and the driver substrate 102 is sucked and held by the transfer device 20 by magnetic force. Thus, the display panel 100 with a driver substrate can be transferred while being held at substantially the same height as the display panel 101.

When the display panel 100 with a driver substrate is transferred, the display panel 101 and the driver substrate 102 may be held at the same time in order to prevent the driver substrate 102 from being bent.

In addition, the magnet 21 is free to move, and the substrate receiving jig 23 (particularly the flat plate portion 232) can be easily formed in accordance with the driver substrate, so that it is possible to cope with the size and shape of the driver substrate at a low cost. Specifically, by holding the driver substrate 102 using the transfer device 20 of the present embodiment, the transfer device can be used even if the component placement of the driver substrate 102 is changed due to the size change of the display panel 101. Just increasing the number of 20 can cope.

Furthermore, since the magnet 21 is used, it is very easy to attach and detach the string-like body 22 and the substrate receiving jig 23, and the workability is greatly improved.

In this way, it is possible not only to realize a transfer device effective for holding a substrate independent of dimensions and shapes and a transfer method using the same, but also when changing the size of the display panel 101 or the component arrangement of the driver substrate 102. It is possible to reduce the remodeling cost required for the transfer equipment.

(Embodiment 2)
In the first embodiment, an example of the configuration of the substrate receiving jig 23 has been described. However, the configuration is not limited thereto. In the present embodiment, another example of the configuration of the substrate receiving jig 23 will be described.

Hereinafter, the description of the same parts as those in the first embodiment will be omitted, and different points will be mainly described.

[Configuration of Transfer Device of Embodiment 2]
FIG. 8 is a diagram schematically showing the configuration of the substrate receiving jig according to the second embodiment. Elements similar to those in FIG. 3 are denoted by the same reference numerals, and detailed description thereof is omitted.

The substrate receiving jig 23 A includes a plurality of flat plate portions 232, a plurality of protruding portions 231, and a connecting portion 233. In the present embodiment, the substrate receiving jig 23A has two flat plate portions 232 as shown in FIG.

The protruding portion 231 is formed in each of the plurality of flat plate portions 232 and is formed so as to be insertable through the mounting hole 104. In the present embodiment, one protrusion 231 is formed on each of the two flat plate portions 232 as shown in FIG.

The flat plate portion 232 supports the driver board 102 by contacting at least a part of the lower surface of the driver board 102.

The connecting portion 233 maintains the plurality of flat plate portions 232 on a substantially flat surface and connects one end portions of the plurality of flat plate portions 232 to each other. In the present embodiment, as shown in FIG. 8, the connecting portion 233 maintains the two flat plate portions 232 on a substantially flat surface and connects one ends of the two flat plate portions 232 together. Moreover, the connection part 233 should just be a material aiming at weight reduction, for example, aluminum, copper iron, an acrylic resin etc. can be mentioned.

The substrate receiving jig 23 A configured as described above is held at a predetermined height by the magnet 21 by adsorbing the tip ends of the projecting portions 231 formed on the two flat plate portions 232 with a magnetic force. The There are a plurality of magnets 21 and a plurality of string-like bodies 22. In the present embodiment, each of the plurality of magnets 21 is connected at one end to the string-like body 22 and suspended at a predetermined height.

In addition, in this Embodiment, although the case where the some flat plate part 232 was two was mentioned as an example, it is not restricted to it. For example, as shown in FIG. 9, the plurality of flat plate portions 232 may be constituted by three.

FIG. 9 is a diagram schematically illustrating another example of the configuration of the substrate receiving jig according to the second embodiment. In addition, the same code | symbol is attached | subjected to the element similar to FIG. 8, and detailed description is abbreviate | omitted.

The substrate receiving jig 23B shown in FIG. 9 has three flat plate portions 232, a plurality of protruding portions 231 and a connecting portion 233.

As shown in FIG. 9, the connecting portion 233 A maintains the three flat plate portions 232 on a substantially flat surface and connects one end portions of the three flat plate portions 232 together.

Therefore, the substrate receiving jig 23B is held at a predetermined height by the tips of the protrusions 231 formed on the three flat plate portions 232 by the plurality of magnets 21, respectively. As described above, one end of each magnet 21 is connected to the string-like body 22 and is suspended to a predetermined height.

(Embodiment 3)
In the third embodiment, an example of still another configuration of the substrate receiving jig described in the second embodiment will be described. In the following, description of the same parts as those in the first and second embodiments will be omitted, and different points will be mainly described.

[Configuration of Transfer Device of Embodiment 3]
FIG. 10 is a diagram schematically showing the configuration of the substrate receiving jig according to the third embodiment. Elements similar to those in FIGS. 3 and 8 are denoted by the same reference numerals, and detailed description thereof is omitted.

The substrate receiving jig 23 C includes a plurality of flat plate portions 232, a plurality of protruding portions 231, and a connecting portion 233. In the present embodiment, the substrate receiving jig 23C has two flat plate portions 232 and two protruding portions 231 (protruding

portions

231A and 231B) on each of the flat plate portions 232 as shown in FIG.

As shown in FIG. 10, the protruding portions 231 A and 231 B are formed on the two flat plate portions 232, respectively, so that they can be inserted so as to penetrate the mounting hole 104.

The protruding portion 231A is an example of a first protruding portion of the two protruding portions, and is inserted into the mounting hole 104 so as to penetrate the mounting hole 104 of the driver board 102. The protruding portion 231B is an example of a second protruding portion of the two protruding portions, and is formed closer to one end of the flat plate portion 232 than the protruding portion 231A. Here, one tip of the

protrusions

231A and 231B is attracted by the magnetic force of the magnet 21, whereas the magnet 21 is not attracted by the other tip.

[Usage example of transfer device of embodiment 3]
FIG. 11 is a diagram schematically illustrating a usage example of the substrate receiving jig according to the third embodiment. In addition, the same code | symbol is attached | subjected to the element similar to FIG. 10, and detailed description is abbreviate | omitted.

As shown in FIG. 11, in the substrate receiving jig 23C according to the third embodiment, one tip of the

protrusions

231A and 231B is attracted by the magnetic force of the magnet 21, whereas the other tip is a magnet. 21 is not adsorbed. That is, each of the magnets 21 is configured so that the tip of the protrusion 231B and the tip of the protrusion 231A formed on the one end side of the flat plate portion 232 from the protrusion 231A alternately for each of the one or more flat plates 232, Adsorbed by magnetic force.

Thereby, each of the magnets 21 can hold the substrate receiving jig 23C at a predetermined height while preventing the connecting portion 233 from bending and twisting.

[Effects]
According to the present embodiment, the substrate receiving jig 23 is attached to the mounting hole 104 of the driver substrate 102, and the substrate receiving jig 23 is held by the magnet 21, thereby holding the substrate receiving jig 23C at a predetermined height. can do.

Furthermore, according to the present embodiment, the substrate receiving jig 23C is attached to the mounting hole 104 of the driver substrate 102, and the two protruding portions 231 of the substrate receiving jig 23 are alternately held by the magnets 21 for each flat plate portion 232. As a result, the bending and twisting of the connecting portion 233 of the substrate receiving jig 23 can be prevented, and the driver substrate 102 can be held substantially in parallel.

In addition, the magnet 21 is free to move, and the substrate receiving jig 23 (particularly the flat plate portion 232) can be easily formed in accordance with the driver substrate, so that it is possible to cope with the size and shape of the driver substrate at a low cost. Further, since the magnet 21 is used, the attachment and detachment between the string-like body 22 and the substrate receiving jig 23 becomes very easy, so that the workability is greatly improved.

Therefore, according to the present embodiment, it is possible to realize a transfer apparatus effective for holding a substrate independent of dimensions and shapes and a transfer method using the same.

In addition, in this Embodiment, although the case where the some flat plate part 232 was two was mentioned as an example, it is not restricted to it. For example, as shown in FIG. 12, the plurality of flat plate portions 232 may be configured of three. Hereinafter, this case will be described.

FIG. 12 is a diagram schematically illustrating another example of the configuration of the substrate receiving jig according to the third embodiment. In addition, the same code | symbol is attached | subjected to the element similar to FIG. 11, and detailed description is abbreviate | omitted.

The substrate receiving jig 23D shown in FIG. 12 has three flat plate portions 232, a plurality of protruding portions 231 and a connecting portion 233.

In the present embodiment, the substrate receiving jig 23D has three flat plate portions 232 and two protruding portions 231 (protruding

portions

231A and 231B) on each of the flat plate portions 232 as shown in FIG.

Further, as shown in FIG. 12, the connecting portion 233B maintains the three flat plate portions 232 on a substantially flat surface, and connects one end portions of the three flat plate portions 232 to each other.

Then, the substrate receiving jig 23D has a predetermined height by attracting one of the

protrusions

231A and 231B formed on each of the three flat plate portions 232 by a magnetic force by each of the plurality of magnets 21. Is held. That is, each of the magnets 21 is configured so that the leading end of the protruding portion 231B and the leading end of the protruding portion 231A formed on the one end side of the flat plate portion 232 from the protruding portion 231A alternately for each of the plurality of flat plate portions 232. Adsorb at.

In this manner, each of the magnets 21 can hold the substrate receiving jig 23D at a predetermined height while preventing the connecting portion 233 from bending and twisting.

(Other embodiments)
As described above, Embodiments 1 to 3 have been described as examples of the technology in the present disclosure. For this purpose, the accompanying drawings and detailed description are provided.

Accordingly, among the components described in the accompanying drawings and the detailed description, not only the components essential for solving the problem, but also the components not essential for solving the problem in order to illustrate the above technique. May also be included. Therefore, it should not be immediately recognized that these non-essential components are essential as those non-essential components are described in the accompanying drawings and detailed description.

In addition, since the above-described embodiment is for illustrating the technique in the present disclosure, various modifications, replacements, additions, omissions, and the like can be performed within the scope of the claims or an equivalent scope thereof. That is, the technology in the present disclosure is not limited to this, and can also be applied to an embodiment in which changes, replacements, additions, omissions, and the like are appropriately performed. Also, it is possible to combine the components described in the first to third embodiments to form a new embodiment.

The following cases are also included in the present disclosure.

For example, in the first embodiment, as an example of the shape when viewed from above the flat plate portion, it is illustrated as a quadrangle, but the shape is not limited thereto, and may be an ellipse, a circle, or a polygon. If the driver substrate can be supported, the shape is not limited to a quadrangle.

For example, in the first to third embodiments, the substrate is described as being a driver substrate connected to the display panel by flexible wiring, but is not limited thereto. A driver board mounted on the display panel may be used, or a board other than the driver board may be used. The type of the substrate is not limited as long as the mounting hole having a predetermined size according to the standard or specification can be used.

In the first to third embodiments, the case where the driver board is attached to the periphery of the display panel is described as an example, but the present invention is not limited to this. The driver board may be connected to only one side of the display panel. That is, the number of driver boards to be attached is not limited.

The present disclosure can be applied to a transfer device effective for holding a substrate independent of dimensions and shapes and a transfer method using the transfer device. Specifically, the present disclosure can be applied to a transfer device for holding a driver board connected to a display panel, a transfer facility using the transfer device, and the like.

20 Transfer device 21 Magnet 22 String-

like body

23, 23A, 23B, 23C, 23D Substrate receiving jig 100 Display panel with driver substrate 101 Display panel 102 Driver substrate 103 Flexible substrate 104 Mounting hole 211 Connecting

member

231, 231A, 231B Projection Part 232

Flat part

233, 233A,

233B Connecting part

905, 906 Suction pad

Claims

A transfer device used for transferring a substrate,
One end is connected to the string-like body, and a magnet that is suspended to a predetermined height;
A flat plate portion that supports the substrate by abutting at least a part of the lower surface of the substrate, and a hole formed in the flat plate portion and having a predetermined size that the substrate has. A substrate receiving jig having an insertable protrusion,
The magnet holds the substrate receiving jig at a predetermined height by attracting the tip of the protruding portion with a magnetic force.
Transfer device.
The substrate receiving jig is
A plurality of the flat plate portions;
The protrusion formed on each of the plurality of flat plate portions;
A plurality of the flat plate portions are maintained in a substantially flat surface, and provided with a connecting portion that connects one end portions of the plurality of flat plate portions,
The magnet is plural,
Each of the plurality of magnets holds the substrate receiving jig at the predetermined height by adsorbing the tip of the projecting portion formed on each of the plurality of flat plate portions with a magnetic force.
The transfer device according to claim 1.
The plurality of flat plate portions includes two flat plate portions.
The transfer apparatus according to claim 2.
Two protrusions are formed on each of the plurality of flat plate portions,
The first protrusion of the two protrusions is inserted through the hole,
Each of the magnets includes a tip of a second protrusion formed on the one end side of the first protrusion, and a tip of the first protrusion, of the two protrusions. By alternately adsorbing by a magnetic force for each flat plate part, the substrate receiving jig is held at the predetermined height.
The transfer apparatus according to claim 2 or 3.
The number of magnets is an even number;
The transfer apparatus according to any one of claims 2 to 4.
The magnet is an electromagnet.
The transfer device according to any one of claims 2 to 5.
The substrate is a driver substrate connected to the display panel by flexible wiring,
The predetermined height is a height at which the display panel is held.
The transfer apparatus according to any one of claims 1 to 6.
A method of transferring the substrate using the transfer device according to claim 1,
The protruding portion is inserted so as to penetrate the hole of the substrate, and the substrate is supported by the substrate receiving jig by contacting the flat plate portion with at least a part of the lower surface of the substrate. Let
The substrate receiving jig is held at the predetermined height by adsorbing the tip of the protruding portion to each of the plurality of magnets by magnetic force.
Transfer method.