WO2015045210A1

WO2015045210A1 - Organic el display apparatus

Info

Publication number: WO2015045210A1
Application number: PCT/JP2014/002660
Authority: WO
Inventors: 小笠原　真也; 南木　照男
Original assignee: パナソニック株式会社
Priority date: 2013-09-30
Filing date: 2014-05-21
Publication date: 2015-04-02

Abstract

An organic EL display apparatus (10) is provided with an organic EL panel (1) for displaying an image on a front screen, a chassis (2) for supporting the back-surface side of the organic EL panel (1), and a spacer (12) disposed between at least a part of the peripheral edge section (1b) of the organic EL panel (1) and the chassis (2). At least a part of the organic EL panel (1) is curved to protrude toward the back-surface side, and the center portion (1a), which is closer to the center than the peripheral edge section, (1b) is supported by the chassis (2) in a state of being in contact therewith.

Description

Organic EL display device

The present disclosure relates to an organic EL display device including an organic EL panel that displays an image.

The organic EL (electroluminescence) display device includes an organic EL panel as a display panel for displaying an image. Further, the organic EL panel includes an organic EL element as a light emitting element that emits light based on a video signal input to the display device (see, for example, Patent Document 1).

JP 2013-97157 A

However, the organic EL panel has a problem that it is easily affected by heat.

The present disclosure has been made in view of such a current situation, and an object thereof is to provide an organic EL display device capable of reducing the adverse effects of heat on the organic EL panel.

In order to achieve the above object, an organic EL display device according to the present disclosure includes at least one of an organic EL panel that displays an image on a front surface, a chassis that supports a back side of the organic EL panel, and a peripheral portion of the organic EL panel. And a spacer disposed between the chassis and the chassis, and the organic EL panel is at least partially curved convexly toward the back side, and located at the center side of the peripheral edge Is supported by the chassis in contact with the chassis.

According to the present disclosure, adverse effects of heat on the organic EL panel can be reduced.

FIG. 1 is a perspective view showing the appearance of the organic EL display device according to the first embodiment. FIG. 2 is an exploded perspective view in which a part of the organic EL display device according to Embodiment 1 is disassembled. FIG. 3 is a cross-sectional view illustrating an example of a schematic structure of an organic EL element serving as an RGB pixel portion in the organic EL panel included in the organic EL display device according to the first embodiment. FIG. 4 is a circuit diagram showing an example of a circuit configuration for driving an organic EL element included in the organic EL display device according to the first embodiment. FIG. 5 is a cross-sectional view showing a cross-sectional structure of the RGB sub-pixel portion in the organic EL display device according to the first embodiment. FIG. 6 is a cross-sectional view of the organic EL display device of FIG. 1 along AA. FIG. 7 is a diagram for explaining the effect that one of the spacers is bonded with weak adhesion in the organic EL display device according to the first embodiment. FIG. 8 is an enlarged view of a main part in a longitudinal sectional view of the vicinity of the center of the organic EL display device according to the second embodiment. FIG. 9 is an enlarged view of a main part in a longitudinal sectional view of the vicinity of the center of the organic EL display device according to the third embodiment.

(Knowledge that became the basis of the present invention)
The present inventors have found that the following problems occur with respect to the organic EL display device described in the “Background Art” column. That is, the present inventors have found that the adverse effect on the organic EL panel due to the heat generated by the organic EL panel itself is specifically the following problem.

The first problem is an adverse effect of heat on the organic EL panel due to a temperature difference in the temperature distribution of the organic EL panel. As described above, the inventors have found that the organic EL panel has a temperature distribution in which the central portion of the organic EL panel becomes hotter than the peripheral portion during light emission.

The organic EL element generally includes a light emitting layer that emits light to display an image. However, the characteristics of the light emitting layer are irreversibly deteriorated due to a temperature rise due to heat generation of the light emitting element itself. As a result, in the organic EL display device, in the organic EL element constituting each pixel, the deterioration depending on the temperature generated in the organic EL panel, that is, the degree at the substantially central portion and the peripheral portion is different, and It will progress. As a result, there is a problem in that the image quality uniformity of the entire screen is lost and good image display is impaired. In other words, the organic EL panel has a problem that the characteristics of the organic EL element are easily deteriorated by heat. For this reason, compared with PDP (plasma display panel) and LCD (liquid crystal display), the tolerance for temperature distribution is small. Therefore, in the organic EL display device, it is necessary to further reduce the temperature difference generated in the organic EL panel which is a display panel.

As a result of the study by the present inventor, as the organic EL panel, by randomly cooling the entire organic EL display device, the temperature distribution of the organic EL panel becomes, for example, a temperature distribution of 40 ° C. to 20 ° C. However, if the cooling effect is positively different between the central part and both end parts, the uniform temperature distribution of about 40 ° C. as a whole is more uneven in the deterioration of characteristics due to the heat of the organic EL element. And the image quality uniformity of the entire screen can be realized, which is preferable.

The second problem is an adverse effect of heat on the organic EL panel due to the difference in thermal expansion between the organic EL panel and the chassis on which the organic EL panel is supported. Generally, the organic EL panel is mainly made of glass, and the chassis is made of metal (for example, mainly aluminum). As described above, the organic EL panel and the chassis are often made of materials having different linear expansion coefficients. In such a case, when the organic EL panel and the chassis are firmly bonded, if a temperature change occurs, warping occurs due to a difference in linear expansion coefficient between the organic EL panel and the chassis. .

In addition, as described above, when the organic EL panel is mainly composed of glass and the chassis is mainly composed of aluminum, the linear expansion coefficient of aluminum is about three times the linear expansion coefficient of glass. The chassis expands more than the organic EL panel due to the temperature rise. When the chassis expands in this way, the organic EL panel is pulled by the chassis, and there is a problem that the glass constituting the organic EL panel is easily damaged because it is weak against pulling.

The present disclosure has been made on the basis of such knowledge, and as a result of intensive studies by the present inventors, the structure of an organic EL display device capable of reducing the adverse effects of heat on the organic EL panel is disclosed. I got an idea.

Hereinafter, embodiments will be described in detail with reference to the drawings as appropriate. However, more detailed description than necessary may be omitted. For example, detailed descriptions of already well-known matters and repeated descriptions for substantially the same configuration may be omitted. This is to avoid the following description from becoming unnecessarily redundant and to facilitate understanding by those skilled in the art.

In addition, the inventor provides the accompanying drawings and the following description in order for those skilled in the art to fully understand the present disclosure, and is not intended to limit the subject matter described in the claims. .

Hereinafter, an organic EL display device according to an embodiment of the present disclosure will be described with reference to the drawings. However, the embodiment of the present disclosure is not limited to this.

(Embodiment 1)
FIG. 1 is a perspective view showing an appearance of an organic EL display device according to Embodiment 1 of the present invention. FIG. 2 is an exploded perspective view in which a part of the organic EL display device according to Embodiment 1 of the present invention is disassembled. FIG. 3 is a cross-sectional view showing an example of a schematic structure of an organic EL element serving as an RGB pixel portion in the organic EL panel included in the organic EL display device according to Embodiment 1 of the present invention. FIG. 4 is a circuit diagram showing an example of a circuit configuration for driving an organic EL element included in the organic EL display device according to Embodiment 1 of the present invention. FIG. 5 is a cross-sectional view showing a cross-sectional structure of the RGB sub-pixel portion in the organic EL display device according to Embodiment 1 of the present invention.

1 and FIG. 2, the organic EL display device 10 includes an organic EL panel 1, a chassis 2, an escutcheon frame 3, a back cover 4, a spacer 12, and a stand 50. Hereinafter, the same functions are denoted by the same reference numerals and the description thereof is omitted.

In the organic EL display device 10, the surface on which the image is displayed on the organic EL panel 1 is the front side (display side), and the surface on which the

electric circuit boards

5, 6, etc. on the back side of the organic EL panel 1 are installed is the back side ( (Non-display surface side). Hereinafter, for convenience of explanation, the left-right direction is defined by the orientation when the organic EL display device is viewed from the front side, and the top and bottom are the top and bottom when the organic EL display device is installed as shown in FIGS. Define as

(Structure of organic EL panel)
As shown in FIGS. 3 and 4, the organic EL panel 1 provided in the organic EL display device 10 includes, from the lower layer, a thin film transistor array device 101 in which a plurality of thin film transistors are arranged, an anode 102 which is a lower electrode, and an organic material. The light emitting part is composed of a light emitting part including a light emitting part composed of a light emitting layer 103 and a cathode 104 which is a transparent upper electrode. The light-emitting portion has a structure in which a light-emitting layer 103 is disposed between a pair of electrodes, that is, an anode 102 and a cathode 104, and a hole transport layer (see below) is provided between the anode 102 and the light-emitting layer 103. Are stacked, and an electron transport layer (see later) is stacked between the light emitting layer 103 and the transparent cathode 104. The thin film transistor array device 101 has a plurality of pixels 105 arranged in a matrix.

Each pixel 105 is driven by a pixel circuit 106 provided therein. In addition, the thin film transistor array device 101 includes a plurality of gate wirings 107 arranged in a row, a plurality of source wirings 108 as signal wirings arranged in a row so as to intersect the gate wirings 107, and a parallel to the source wiring 108. And a plurality of power supply wires 109 extending in the direction.

As shown in FIG. 4, the gate wiring 107 connects the gate electrode 110g of the thin film transistor 110 operating as a switching element included in each pixel circuit 106 for each row. The source wiring 108 connects the source electrodes 110 s of the thin film transistors 110 that operate as switching elements included in each of the pixel circuits 106 for each column. The power supply wiring 109 connects the drain electrode 111d of the thin film transistor 111 operating as a driving element included in each pixel circuit 106 for each column.

As shown in FIG. 4, the pixel circuit 106 includes a thin film transistor 110 that operates as a switching element, a thin film transistor 111 that operates as a driving element, and a capacitor 112 that stores data to be displayed in the corresponding pixel.

The thin film transistor 110 includes a gate electrode 110g connected to the gate wiring 107, a source electrode 110s connected to the source wiring 108, a drain electrode 110d connected to the gate electrode 111g of the capacitor 112 and the thin film transistor 111, and a semiconductor film (FIG. Not shown). When a voltage is applied to the connected gate wiring 107 and source wiring 108, the thin film transistor 110 stores the voltage value applied to the source wiring 108 in the capacitor 112 as display data.

The thin film transistor 111 includes a gate electrode 111g connected to the drain electrode 110d of the thin film transistor 110, a drain electrode 111d connected to the power supply wiring 109 and the capacitor 112, a source electrode 111s connected to the anode 102, and a semiconductor film (not shown). Z). The thin film transistor 111 supplies a current corresponding to the voltage value held by the capacitor 112 from the power supply wiring 109 to the anode 102 through the source electrode 111s. In other words, the organic EL panel 1 of the organic EL display device having the above configuration adopts an active matrix system in which display control is performed for each pixel 105 located at the intersection of the gate wiring 107 and the source wiring 108.

In addition, in the organic EL display device, the light emitting portion that emits light of at least red, green, and blue emission colors includes a plurality of sub-pixels having at least red (R), green (G), and blue (B) light emitting layers. A plurality of pixels are formed in a matrix. The sub-pixels constituting each pixel are separated from each other by a bank. The bank is provided by forming a ridge extending in parallel with the gate wiring 107 and a ridge extending in parallel with the source wiring 108 so as to intersect each other. A subpixel having an RGB light emitting layer is formed in a portion surrounded by the protrusions, that is, an opening of the bank.

FIG. 5 is a cross-sectional view showing the cross-sectional structure of the RGB sub-pixel portion in the organic EL panel of the organic EL display device. As shown in FIG. 5, in the organic EL panel 1, a thin film transistor array device 122 constituting the pixel circuit 106 described above is formed on a base substrate 121 such as a glass substrate or a flexible resin substrate. In the thin film transistor array device 122, an anode 123, which is a lower electrode, is formed through a planarization insulating film (not shown). On the anode 123, a hole transport layer 124, an RGB light emitting layer 125 made of an organic material, an electron transport layer 126, and a cathode 127, which is a transparent upper electrode, are sequentially stacked. An EL light emitting unit is configured.

Further, the light emitting layer 125 of the light emitting unit is formed in a region partitioned by the bank 128 which is an insulating layer. The bank 128 is for ensuring insulation between the anode 123 and the cathode 127 and partitioning the light emitting region into a predetermined shape, and is made of, for example, a photosensitive resin such as silicon oxide or polyimide.

In the above embodiment, only the hole transport layer 124 and the electron transport layer 126 are shown, but the hole transport layer 124 and the electron transport layer 126 are laminated with a hole injection layer and an electron injection layer, respectively. Is formed.

The light emitting unit configured in this manner is covered with a sealing layer 129 such as silicon nitride, and further, a sealing substrate such as a transparent glass substrate or flexible resin substrate is provided on the sealing layer 129 via an adhesive layer 130. 131 is sealed by being bonded over the entire surface.

Here, the shape, material, size and the like of the base substrate 121 are not particularly limited and can be appropriately selected according to the purpose. For example, a glass material such as alkali-free glass or soda glass, a silicon substrate, or a metal substrate may be used. Moreover, you may use a polymeric material for the purpose of weight reduction or flexibility. Polyethylene terephthalate, polycarbonate, polyethylene naphthalate, polyamide, polyimide, etc. are suitable as the polymer material, but other known polymers such as acetate resin, acrylic resin, polyethylene, polypropylene, polyvinyl chloride resin, etc. A substrate material may be used. When a polymer material is used as a substrate, an organic EL light emitting element is formed after forming a polymer substrate on a rigid base material such as glass by a coating method or pasting, and then a rigid material such as glass is formed. A manufacturing method is used to remove a substrate.

The anode 123 is a metal material having good electrical conductivity such as aluminum, aluminum alloy or copper, or a metal oxide or metal sulfide having high electrical conductivity such as light-transmitting IZO, ITO, tin oxide, indium oxide or zinc oxide. Etc. As a film forming method, a thin film forming method such as a vacuum deposition method, a sputtering method, or an ion plating method is used.

The hole transport layer 124 is made of a polyvinyl carbazole material, a polysilane material, a polysiloxane derivative, a phthalocyanine compound such as copper phthalocyanine, an aromatic amine compound, or the like. As a film forming method, various coating methods can be used, and the film is formed to a thickness of about 10 nm to 200 nm. The hole injection layer stacked on the hole transport layer 124 is a layer that enhances hole injection from the anode 123, and is a metal oxide such as molybdenum oxide, vanadium oxide, or aluminum oxide, a metal nitride, or a metal. Oxynitride is formed by sputtering.

The light emitting layer 125 is mainly composed of an organic material that emits fluorescence, phosphorescence, or the like, and a dopant is added as necessary to improve the characteristics. As a high molecular weight organic material suitable for the printing method, a polyvinyl carbazole derivative, a polyparaphenylin derivative, a polyfluorene derivative, a polyphenylene vinylene derivative, or the like is used. The dopant is used for shifting the emission wavelength and improving the light emission efficiency, and many dye-based and metal complex-based dopants have been developed. In addition, when the light emitting layer 125 is formed over a large substrate, a printing method is suitable, and the light emitting layer 125 having a thickness of about 20 nm to 200 nm is formed by using an ink jet method among various printing methods.

The electron transport layer 126 is made of a material such as a benzoquinone derivative, a polyquinoline derivative, or an oxadiazole derivative. As a film forming method, a vacuum deposition method, a coating method, or the like is used, and the film is usually formed to a thickness of about 10 nm to 200 nm. The electron injection layer is made of a material such as barium, phthalocyanine, or lithium fluoride, and is formed by a vacuum deposition method, a coating method, or the like.

The material of the cathode 127 differs depending on the light extraction direction. When light is extracted from the cathode 127 side, a light-transmitting conductive material such as ITO, IZO, tin oxide, or zinc oxide is used. When light is extracted from the anode 123 side, a material such as platinum, gold, silver, copper, tungsten, aluminum, or an aluminum alloy is used. As a film forming method, a sputtering method, a vacuum evaporation method, or the like is used, and the film is formed to a thickness of about 50 nm to 500 nm.

The bank 128 is a structure necessary for filling a sufficient amount of the solution containing the material of the light emitting layer 125 in the region, and is formed in a predetermined shape by a photolithography method. The shape of the sub-pixel of the organic EL light emitting unit can be controlled by the shape of the bank 128.

The sealing layer 129 is formed by forming a silicon nitride film, and a CVD (chemical vapor deposition) method is used as the film forming method.

In the organic EL panel 1 having the above-described configuration, the panel itself generates heat in order to emit light. Difference in temperature distribution occurs. In the present disclosure, the following configuration is adopted to prevent a temperature difference between the central portion 1a and the peripheral portion 1b of the organic EL panel 1. Hereinafter, a configuration for reducing a difference in temperature distribution of the organic EL panel 1 in the present disclosure will be described.

FIG. 6 is an AA longitudinal sectional view of the organic EL display device of FIG.

As shown in FIGS. 2 and 6, the organic EL display device 10 includes, from the front side, an escutcheon frame 3, an organic EL panel 1, a spacer 12, a chassis 2, various

electric circuit boards

5, 6 and a fan unit 11, and a back. The cover 4 is combined in order.

The escutcheon frame 3 is a frame-like member that is fixed to the back cover 4 by pressing the peripheral edge of the organic EL panel 1 from the front side.

The organic EL panel 1 displays an image on the front. The organic EL panel 1 is a self-luminous display panel. The chassis 2 supports the back side of the organic EL panel 1. The chassis 2 is a metal member that promotes heat dissipation of the organic EL panel 1 and also functions as an electrical ground, and generally has good thermal conductivity and electrical conductivity, and is made of, for example, aluminum. . Various

electrical circuit boards

5 and 6 are disposed in the chassis 2.

The spacer 12 is disposed between the four sides of the peripheral edge of the organic EL panel 1 and the chassis 2. That is, the spacer 12 is a heat insulating material that insulates between the peripheral edge portion 1 b of the organic EL panel 1 and the chassis 2. The spacer 12 is mainly made of a resin having a thermal conductivity lower than that of a metal. The spacer 12 has a long sheet shape, and both surfaces thereof are adhesive. In addition, the spacer 12 has one surface (hereinafter referred to as “first surface 12a”) having weak adhesiveness and the other surface (hereinafter referred to as “second surface 12b”) having strong adhesiveness. is doing. That is, as for the spacer 12, the first surface 12a is more adhesive than the second surface 12b. For example, the spacer 12 is made of Nitto Denko Corporation's No. 5000 double-sided tape (or No. 7694 double-sided tape made by DIC Corporation) and DF8350 made by Toyo Ink Co., Ltd., which has weak adhesion. And a double-sided tape (or No. 7692 double-sided tape manufactured by Teraoka Seisakusho Co., Ltd.). Thus, by sticking a commercially available double-sided tape, the spacer 12 having one surface having strong adhesiveness and the other surface having weak adhesiveness can be constituted.

Here, as shown in FIG. 6, the organic EL panel 1 is configured such that at least a part thereof is convexly curved toward the back side, and the central portion 1 a is in contact with the chassis 2 rather than the peripheral portion 1 b. 2 is supported. Note that “the state in which the central portion 1a is in contact with the chassis 2 rather than the peripheral portion 1b” means that the area in which the central portion 1a is in contact with the chassis is larger than the area in which the peripheral portion 1b is in contact with the chassis 2. Alternatively, the pressure applied when the central portion 1a contacts the chassis may be greater than the pressure applied when the peripheral edge portion 1b contacts the chassis 2.

More specifically, the organic EL panel 1 is supported by the chassis 2 by bonding the four sides of the peripheral edge portion 1b and the chassis 2 to each surface of the spacer 12. The organic EL panel 1 is not bonded to the chassis 2 at the center 1a. That is, the organic EL panel 1 is not bonded to the chassis 2 except for the portion where the spacer 12 is disposed. Furthermore, in other words, the organic EL panel 1 includes a bonding region R1 that is the peripheral portion 1b and a region bonded to the chassis 2 via the spacer 12, and a region on the center side of the bonding region R1. And a non-bonded region R2 which is a non-bonded region.

The fan unit 11 takes air from outside into the space between the back cover 4 and the chassis 2 as indicated by an arrow 20a, and the arrows 20b for air-cooling the various

electric circuit boards

5 and 6 and the chassis 2. An air flow as shown in Fig. 2 is generated. The fan unit 11 draws in air heated by cooling the various

electric circuit boards

5 and 6 and the chassis 2 as indicated by an arrow 20c, and from the space between the back cover 4 and the chassis 2. Discharge as shown by arrow 20d. In this way, the fan unit 11 can cool the various

electric circuit boards

5 and 6 and the chassis 2 by performing forced ventilation in the space between the back cover 4 and the chassis 2.

(Characteristic)
According to the organic EL display device 10 according to the first embodiment, the spacers 12 are arranged between the four sides of the peripheral edge 1 b of the organic EL panel 1 and the chassis 2, and from the peripheral edge 1 b of the organic EL panel 1. Also, the central portion 1 a on the central side is in contact with the chassis 2. For this reason, the heat generated in the peripheral portion 1b of the organic EL panel 1 can be hardly transmitted to the chassis 2, and the heat generated in the central portion 1a of the organic EL panel 1 can be easily transmitted to the chassis. Thereby, in the organic EL panel 1, the heat of the central portion 1a having a relatively high temperature can be radiated more efficiently than the heat of the peripheral portion 1b having a relatively low temperature. For this reason, the difference of the temperature distribution of the peripheral part 1b and the center part 1a which arises in the organic EL panel 1 can be reduced.

Further, according to the organic EL display device 10 according to the first embodiment, the spacer 12 is bonded to the organic EL panel 1 with weak adhesion and is bonded to the chassis 2 with strong adhesion.

Here, FIG. 7 is a diagram for explaining the effect that one of the spacers is bonded with weak adhesion in the organic EL display device according to the first embodiment. Specifically, FIG. 7A is an enlarged view of a region A1 in FIG. 6 before the temperature rises (that is, at a normal temperature when the organic EL display device is not turned on). FIG. 7B is an enlarged view of the region A1 in FIG. 6 after the temperature rise (that is, after a predetermined time has elapsed since the organic EL display device was turned on).

As shown in FIG. 7A, there is no deviation between the organic EL panel 1 and the chassis 2 at room temperature. However, as shown in FIG. 7B, after the temperature rise, the chassis 2 is organic because the linear expansion coefficient of the aluminum chassis 2 is larger than that of the organic EL panel 1 mainly made of glass. Since it expands larger than the EL panel 1, it extends mainly in the surface direction of the chassis 2. In FIG. 7B, the chassis 2 extends upward from the organic EL panel 1. At this time, since the spacer 12 is adhered to the chassis 2 with strong adhesion on the second surface 12b, the spacer 12 moves upward as the chassis 2 expands. On the other hand, since the spacer 12 is bonded to the organic EL panel 1 with weak adhesion on the first surface 12 a, the spacer 12 does not follow the expansion of the chassis 2 and the first surface 12 a of the spacer 12. Slide with the organic EL panel 1 adhered. For this reason, even if a deviation due to a temperature change occurs between the organic EL panel 1 and the chassis 2, the deviation due to the difference in thermal expansion between the organic EL panel 1 and the chassis 2 is absorbed in the portion bonded with weak adhesion. can do. Thereby, generation | occurrence | production of the warp by the difference in the linear expansion coefficient of the organic EL panel 1 and the chassis 2 at the time of a temperature change can be prevented. Moreover, when the temperature rises, the organic EL panel 1 can be prevented from being damaged by being pulled by the chassis 2.

In addition, according to the organic EL display device 10 according to the first embodiment, the organic EL panel 1 has the flatness of the chassis 2 and rough unevenness on the surface because the central portion 1a is not bonded to the chassis. Even if there exists, it can be made to be supported only by the convex part of the unevenness | corrugation of the chassis 2. FIG. In short, when the entire surface of the organic EL panel 1 is bonded to the chassis 2, the organic EL panel 1 is stuck on the concave portion of the chassis 2. Since only the peripheral edge 1b of the organic EL panel 1 is bonded without bonding the entire surface of the panel 1 to the chassis 2, the organic EL panel 1 is supported by the chassis 2 in a state in which the plane of the organic EL panel 1 is secured. Can do.

(Embodiment 2)
Hereinafter, the second embodiment will be described with reference to FIG.

FIG. 8 is an enlarged view of a main part in a longitudinal sectional view of the vicinity of the center of the organic EL display device according to the second embodiment.

The organic EL display device 10a according to the second embodiment is different from the organic EL display device 10 according to the first embodiment in the cross-sectional shape of the escutcheon frame 13. The configuration of the organic EL display device 10a other than the escutcheon frame 13 is the same as the configuration of the organic EL display device 10 according to Embodiment 1, and the same reference numerals as those of the organic EL display device 10 are given. Therefore, the description thereof is omitted.

As shown in FIG. 8, the escutcheon frame 13 has a rear side so that the end 13 a on the opening side is in contact with a portion of the peripheral edge 1 b of the organic EL panel 1 that is convexly curved toward the back side. Bulges towards In other words, the escutcheon frame 13 is pressed from the front so that a portion of the organic EL panel 1 on the center side of the organic EL panel 1 is closer to the chassis 2 than a portion of the peripheral portion 1b outside the organic EL panel 1 is. . In addition, in FIG. 8, although it is a cross section of the upper part of the escutcheon frame 13, it has the same shape also about the cross section in the part of the upper and lower sides and right and left.

According to the organic EL display device 10a according to the second embodiment, the escutcheon frame 13 holds the peripheral edge portion 1b of the organic EL panel 1 from the front so that the central portion is closer to the chassis 2 than the outer portion. Therefore, even if the center part 1a of the organic EL panel 1 is not bonded to the chassis 2, the center part 1a of the organic EL panel 1 can be configured to keep in contact with the chassis 2.

(Embodiment 3)
Hereinafter, Embodiment 3 will be described with reference to FIG.

FIG. 9 is an enlarged view of a main part in a longitudinal sectional view of the vicinity of the center of the organic EL display device according to the third embodiment.

The organic EL display device 10b according to the third embodiment is different from the organic EL panel 1 according to the first embodiment in the configuration of the organic EL panel 60. The configuration of the organic EL display device 10b other than the organic EL panel 60 is the same as the configuration of the organic EL display device 10 according to Embodiment 1, and the same reference numerals as those of the organic EL display device 10 are given. Therefore, the description is omitted.

The organic EL panel 60 includes a main panel 61 and an aluminum sheet 62 having the same configuration as the organic EL panel 1 described in the first and second embodiments. The aluminum sheet 62 is affixed to the back side of the main panel 61 and is made of aluminum which is a material having a larger linear expansion coefficient than that of the main panel 61 made of glass.

According to the organic EL display device 10b according to the third embodiment, the aluminum sheet 62 made of a material having a larger linear expansion coefficient than that of the main panel 61 is attached to the back side of the organic EL panel 60. For this reason, when the temperature rises due to self-heating of the main panel 61 of the organic EL panel 60, the organic EL panel 60 is warped to be convex toward the back side. For this reason, even if the center part of the organic EL panel 60 is not bonded to the chassis 2, the state in contact with the chassis 2 can be maintained.

(Modification)
(1)
In the organic

EL display devices

10, 10 a, and 10 b according to the first to third embodiments, the spacer 12 has the first surface 12 a having weak adhesion and the second surface 12 b has strong adhesion. Not limited to this. For example, both surfaces of the spacer 12 have strong adhesiveness, and the surface treatment of the one surface of the organic EL panel 1 and the chassis 2 that are in contact with the first surface is difficult to be adhered, and is in contact with the second surface. Surface processing that the other surfaces of the organic EL panel 1 and the chassis 2 to be easily adhered may be performed. That is, the surface of the organic EL panel 1 and the chassis 2 that contacts one spacer is subjected to surface processing that is less likely to adhere than the surface that contacts the other spacer, so that the spacer You may implement | achieve the structure adhere | attached with one side by strong adhesion and the other and weak adhesion.

(2)
In the organic

EL display devices

10, 10 a, and 10 b according to the first to third embodiments, the spacer 12 has different adhesiveness between the first surface 12 a and the second surface 12 b. It may be the same adhesiveness to the bonding partner. That is, if the central portion 1a of the organic EL panel 1 is in contact with the chassis 2 and the peripheral portion 1b of the organic EL panel is thermally insulated by the chassis 2 and the spacer 12, the temperature distribution in the organic EL panel 1 is increased. The occurrence of a difference can be reduced. In short, since at least the first problem can be solved, it is not essential that the bonding performance of the spacer 12 and the bonding partner on both sides thereof is different.

(3)
In the organic

EL display devices

10, 10 a, and 10 b according to the first to third embodiments, the central portion 1 a of the organic EL panel 1 is in contact with the chassis 2, but is not limited thereto, and is in contact with the chassis 2. It does not have to be. Specifically, if one of the peripheral edge 1b of the organic EL panel 1 and the chassis 2 is bonded with strong adhesion by the spacer 12, and the other is bonded with weak adhesion by the spacer 12, the organic EL panel 1 The generation of warp due to the difference in the amount of thermal expansion from the chassis 2 can be suppressed. In short, since at least the second problem can be solved, it is not essential that the central portion 1a of the organic EL panel 1 is in contact with the chassis.

(4)
In the organic

EL display devices

10, 10 a, and 10 b according to Embodiments 1 to 3 described above, the organic EL panel 1 is bonded to the chassis 2 with the spacer 12 at the four sides of the peripheral edge 1 b. 2 are not limited to the four sides of the peripheral edge 1b. For example, two opposite sides of the peripheral edge 1 b may be bonded to the chassis 2 by the spacer 12. In this case, the target portion to be bonded may be the two upper and lower sides of the organic EL panel 1 or the two left and right sides. Further, the target part to be bonded may be three sides excluding the upper side of the organic EL panel 1. As shown in FIG. 1 and the like, if the organic EL display device 10 is installed so that the organic EL panel 1 is parallel to at least the vertical direction, the upper part of the organic EL panel 1 is more upward. From the viewpoint that the temperature tends to be higher than the lower part due to the convection of air, it serves the purpose of eliminating the difference in temperature distribution. As described above, the spacer 12 may be appropriately disposed in a portion where the temperature of the organic EL panel 1 is likely to be lowered depending on conditions such as the installation state of the organic EL panel 1.

In addition, when there exists a location in which the spacer is not arrange | positioned among the peripheral part 1b of the organic electroluminescent panel 1, the said location may be directly adhere | attached on the chassis 2, and it is physical like the following modification (5). It is good also as a form supported by the chassis 2, and when intensity | strength is ensured only in the part currently adhere | attached with the spacer, it is good also as a form which is not supported at the said location.

(5)
In the organic

EL display devices

10, 10 a, and 10 b according to the first to third embodiments, the organic EL panel 1 is bonded to the chassis 2 with the spacers 12. Both surfaces of the spacers 12 have adhesiveness. It does not have to be. That is, if the spacer 12 is disposed between at least a part of the peripheral edge 1b of the organic EL panel 1 and the chassis 2, the spacer 12 does not need to have adhesiveness. For example, the organic EL panel 1 may be supported by the chassis 2 by providing a member that holds the organic EL panel 1 and the chassis 2, or the organic EL panel 1 and the chassis 2 are fastened by screws, rivets, or the like. The organic EL panel 1 may be supported by a shape that fits into the chassis 2.

(6)
In the organic

EL display devices

10, 10a, and 10b according to the first to third embodiments, the organic EL panel 1 has a non-adhesion region R2 that is a region that is not bonded to the chassis 2 (that is, the organic EL display 1). In the panel 1, the central portion 1a is not bonded to the chassis 2), but is not limited thereto. In short, the center portion 1a of the organic EL panel 1 may be bonded to the chassis 2 if the flatness of the surface on the front side of the chassis 2 is sufficiently small.

As described above, the embodiments have been described as examples of the technology in the present disclosure. For this purpose, the accompanying drawings and detailed description are provided.

Accordingly, among the components described in the accompanying drawings and the detailed description, not only the components essential for solving the problem, but also the components not essential for solving the problem in order to illustrate the above technique. May also be included. Therefore, it should not be immediately recognized that these non-essential components are essential as those non-essential components are described in the accompanying drawings and detailed description.

In addition, since the above-described embodiment is for illustrating the technique in the present disclosure, various modifications, replacements, additions, omissions, and the like can be performed within the scope of the claims or an equivalent scope thereof.

As described above, the present disclosure is useful in providing an organic EL display device.

DESCRIPTION OF

SYMBOLS

1,60 Organic EL panel 1a Center part 1b Peripheral part 2

Chassis

3, 13 Escussion frame 4

Back cover

5, 6

Electric circuit board

10, 10a, 10b Organic EL display device 11 Fan unit 12 Spacer

12a First surface

12b Second surface 13a End 20a to 20d Arrow 50 Stand 61 Main panel 62 Aluminum sheet 101 Thin film transistor array device 102 Anode 103 Light emitting layer 104 Cathode 105 Pixel 106 Pixel circuit 107 Gate wiring 108 Source wiring 109 Power supply wiring 110 Thin film transistor

110g Gate electrode

110s Source electrode

110d Drain Electrode 111 Thin film transistor

111d Drain electrode

111g Gate electrode

111s Source electrode 112 Capacitor 121 Base substrate 122 Thin film transistor array device 23 anode 124 hole transport layer 125 luminescent layer 126 electron-transporting layer 127 cathode 128 bank 129 sealing 130 adhesive layer 131 sealing substrate R1 bonded regions R2 unbonded regions

Claims

An organic EL panel that displays an image on the front;
A chassis that supports the back side of the organic EL panel;
A spacer disposed between at least a part of a peripheral edge of the organic EL panel and the chassis;
With
The organic EL panel is supported by the chassis in a state where at least part of the organic EL panel is convexly curved toward the back side, and a central portion that is closer to the center than the peripheral edge is in contact with the chassis. EL display device.
The spacer is in the form of a sheet, and both surfaces thereof are adhesive.
The organic EL panel has a rectangular shape, and is supported by the chassis by adhering at least two opposing sides of the peripheral portion and the chassis to each surface of the spacer. The organic EL display device according to claim 1.
The organic EL display device according to claim 2, wherein the organic EL panel is supported by the chassis by bonding the four sides of the peripheral edge portion and the chassis to each surface of the spacer.
The organic EL display device according to claim 2, wherein the spacer is bonded to one of the organic EL panel and the chassis with strong adhesion, and is bonded to the other with weak adhesion.
The organic EL display device according to any one of claims 1 to 4, wherein the central portion of the organic EL panel is not bonded to the chassis.
further,
6. The organic EL display according to claim 1, further comprising a frame-like member that presses the peripheral edge portion of the organic EL panel from the front face so that a central portion is closer to the chassis than an outer portion. apparatus.
The organic EL display device according to claim 1, wherein a sheet made of a material having a larger linear expansion coefficient than the organic EL panel is attached to the back side of the organic EL panel.
An organic EL panel that displays an image on the front;
A chassis that supports the back side of the organic EL panel;
A spacer disposed between a peripheral portion of the organic EL panel and the chassis;
With
The organic EL panel is a peripheral area and an adhesion area that is an area bonded to the chassis via the spacer, and a central area of the adhesion area, and is not bonded to the chassis. A non-adhesive region that is a region,
The said spacer is adhere | attached with the said adhesion | attachment area | region of the said organic electroluminescent panel, and one of the said chassis by strong adhesion, The organic EL display apparatus is adhere | attached with the other by weak adhesion.