WO2015022333A3 - Système de micro-usinage laser pour dessiner un motif sur un substrat au moyen d'un micro-usinage laser et procédé - Google Patents

Système de micro-usinage laser pour dessiner un motif sur un substrat au moyen d'un micro-usinage laser et procédé Download PDF

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Publication number
WO2015022333A3
WO2015022333A3 PCT/EP2014/067267 EP2014067267W WO2015022333A3 WO 2015022333 A3 WO2015022333 A3 WO 2015022333A3 EP 2014067267 W EP2014067267 W EP 2014067267W WO 2015022333 A3 WO2015022333 A3 WO 2015022333A3
Authority
WO
WIPO (PCT)
Prior art keywords
laser
light pulses
unit
substrate
light
Prior art date
Application number
PCT/EP2014/067267
Other languages
English (en)
Other versions
WO2015022333A2 (fr
Inventor
Jacobus Lambertus Van Merksteijn
Original Assignee
Climate Invest B.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Climate Invest B.V. filed Critical Climate Invest B.V.
Publication of WO2015022333A2 publication Critical patent/WO2015022333A2/fr
Publication of WO2015022333A3 publication Critical patent/WO2015022333A3/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/10007—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating in optical amplifiers
    • H01S3/1001—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating in optical amplifiers by controlling the optical pumping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/10007—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating in optical amplifiers
    • H01S3/10023—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating in optical amplifiers by functional association of additional optical elements, e.g. filters, gratings, reflectors
    • H01S3/1003—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating in optical amplifiers by functional association of additional optical elements, e.g. filters, gratings, reflectors tunable optical elements, e.g. acousto-optic filters, tunable gratings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/23—Arrangements of two or more lasers not provided for in groups H01S3/02 - H01S3/22, e.g. tandem arrangements of separate active media
    • H01S3/2308—Amplifier arrangements, e.g. MOPA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/23—Arrangements of two or more lasers not provided for in groups H01S3/02 - H01S3/22, e.g. tandem arrangements of separate active media
    • H01S3/2383—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
    • H01S3/0085—Modulating the output, i.e. the laser beam is modulated outside the laser cavity

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Lasers (AREA)

Abstract

La présente invention concerne un système de micro-usinage laser pour dessiner un motif sur un substrat au moyen d'un micro-usinage laser et un procédé. Selon l'invention, plusieurs faisceaux laser réglables individuellement sont utilisés avec un cristal laser unique d'une manière telle que plusieurs impulsions peuvent être appliquées au substrat.
PCT/EP2014/067267 2013-08-12 2014-08-12 Système de micro-usinage laser pour dessiner un motif sur un substrat au moyen d'un micro-usinage laser et procédé WO2015022333A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL2011290 2013-08-12
NL2011290A NL2011290C2 (en) 2013-08-12 2013-08-12 A laser micromachining system for writing a pattern onto a substrate using laser micromachining and method.

Publications (2)

Publication Number Publication Date
WO2015022333A2 WO2015022333A2 (fr) 2015-02-19
WO2015022333A3 true WO2015022333A3 (fr) 2015-04-16

Family

ID=49553775

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2014/067267 WO2015022333A2 (fr) 2013-08-12 2014-08-12 Système de micro-usinage laser pour dessiner un motif sur un substrat au moyen d'un micro-usinage laser et procédé

Country Status (2)

Country Link
NL (1) NL2011290C2 (fr)
WO (1) WO2015022333A2 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030021307A1 (en) * 2001-07-30 2003-01-30 Semiconductor Energy Laboratory Co., Ltd. Laser treatment apparatus and method of manufacturing semiconductor device
US20050041702A1 (en) * 1997-03-21 2005-02-24 Imra America, Inc. High energy optical fiber amplifier for picosecond-nanosecond pulses for advanced material processing applications
WO2008016287A1 (fr) * 2006-08-03 2008-02-07 Uab 'ekspla' Laser à picosecondes stable à cadence de répétition élevée
DE102006062502A1 (de) * 2006-12-28 2008-07-03 Sms Elotherm Gmbh Vorrichtung zum Behandeln zylindrisch geformter Flächen von metallischen Werkstücken
US20130029444A1 (en) * 2011-07-27 2013-01-31 Toshiba Kikai Kabushiki Kaisha Laser dicing method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050041702A1 (en) * 1997-03-21 2005-02-24 Imra America, Inc. High energy optical fiber amplifier for picosecond-nanosecond pulses for advanced material processing applications
US20030021307A1 (en) * 2001-07-30 2003-01-30 Semiconductor Energy Laboratory Co., Ltd. Laser treatment apparatus and method of manufacturing semiconductor device
WO2008016287A1 (fr) * 2006-08-03 2008-02-07 Uab 'ekspla' Laser à picosecondes stable à cadence de répétition élevée
DE102006062502A1 (de) * 2006-12-28 2008-07-03 Sms Elotherm Gmbh Vorrichtung zum Behandeln zylindrisch geformter Flächen von metallischen Werkstücken
US20130029444A1 (en) * 2011-07-27 2013-01-31 Toshiba Kikai Kabushiki Kaisha Laser dicing method

Also Published As

Publication number Publication date
WO2015022333A2 (fr) 2015-02-19
NL2011290C2 (en) 2015-02-16

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