WO2014206693A1 - Circuiterie électrique - Google Patents

Circuiterie électrique Download PDF

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Publication number
WO2014206693A1
WO2014206693A1 PCT/EP2014/061526 EP2014061526W WO2014206693A1 WO 2014206693 A1 WO2014206693 A1 WO 2014206693A1 EP 2014061526 W EP2014061526 W EP 2014061526W WO 2014206693 A1 WO2014206693 A1 WO 2014206693A1
Authority
WO
WIPO (PCT)
Prior art keywords
busbar
circuit board
power semiconductor
bridge
circuit arrangement
Prior art date
Application number
PCT/EP2014/061526
Other languages
German (de)
English (en)
Inventor
Klaus Voigtlaender
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Publication of WO2014206693A1 publication Critical patent/WO2014206693A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters
    • H05K7/14329—Housings specially adapted for power drive units or power converters specially adapted for the configuration of power bus bars
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10272—Busbars, i.e. thick metal bars mounted on the PCB as high-current conductors

Definitions

  • the invention relates to an electrical circuit arrangement according to the preamble of independent claim 1.
  • topologies such as H, H5, B2, B6, M2, M6, 3H etc. are often used.
  • This allows electric motors to be electronically commutated, energy converters such as DC / DC converters, solar inverters or wind turbines to be operated or energy stored in accumulators.
  • These electrical circuit arrangements are often soldered in a discrete design on printed circuit boards or soldered as leaded components on stamped grid, welded or connected by insulation displacement connections.
  • a further expansion stage envisages the use of industrial modules, such as frame modules or mold modules. This reduces the wiring effort.
  • IMS Insulated Metal Substrate
  • ceramics or DBC (Direct Bonded Copper, also called DCB).
  • DCB Direct Bonded Copper
  • EP 2 043 412 B1 discloses an electrical control unit which comprises a printed circuit board with at least one bore and at least one planar busbar with peg-shaped characteristics.
  • the circuit board and the busbar are joined together so that there is a prefixing for further processing.
  • the pins of the busbar are so deep pressed into the holes in the PCB, that the top of the pins flush with the PCB surface - ie with a copper layer on the circuit board - closes.
  • the busbar lies flat on the underside of the circuit board and contributes only a few millimeters.
  • the resulting subassembly is designed to be like a normal PCB in one
  • Standard SMD production line can be further processed.
  • At least one power semiconductor component is arranged on the upper side of the printed circuit board.
  • the power semiconductor devices are positioned and soldered together with other SMD components on the circuit board. They are thus on both the copper layer of the circuit board and on the top of the pin.
  • the electrical circuit arrangement according to the invention with the features of independent claim 1 has the advantage that at the same time electrical contacting and cooling of the power semiconductor components takes place, so that the usual controls of electric motors, inverters and converters can be implemented inexpensively.
  • Embodiments of the present invention allow 1 to n half-bridge modules to be applied to an upper surface of a printed circuit board and two parallel to the other
  • busbars Bottom of the circuit board arranged busbars can be supplied.
  • an additional bus bar is arranged on the underside of the circuit board, which run perpendicular to the two parallel supply busbars.
  • the busbars used are preferably designed as three-dimensionally shaped busbars and are unbound.
  • Embodiments of the electrical circuit arrangement according to the invention advantageously increase the number of identical parts.
  • the two power supply rails can be made as equal parts and the additional busbars as equal parts.
  • the printed circuit board which is inserted between the power semiconductor components and the busbars, serves as a short low-impedance electrical connection and as a carrier for the others Control electronics.
  • the short connections can also be represented by wired semiconductors.
  • a further advantage of the electrical circuit arrangement according to the invention is that, based on a half-bridge module, various topologies with an arbitrary number of half-bridge modules and good electrical conductivity and simultaneously
  • Heat dissipation can be represented.
  • busbars are placed in sub-tolerance force-free as equal parts and fixed.
  • the assembly results in a low-tolerance smooth surface on the underside.
  • these semi-finished products are then rotated and equipped with electronic components and power semiconductor components and connected to one another by electrical bonding or soldering processes.
  • different busbar geometries and a number of busbars adapted to the topology are used.
  • a drain terminal of a power semiconductor device is located at
  • Package bottom and a source terminal is guided via one or more pins from the power semiconductor device.
  • the activation takes place via a gate connection, which is usually arranged next to the source connection. Therefore, the drain is applied directly to a contact element of the bus bar, while the source terminal is routed through wired connections or contact areas on the circuit board. Since the drain connection rests directly on the contact element or over a filled Lotspalt, there is an excellent thermal conductivity, which is orders of magnitude better than in cooling by via arrays, thermal paste or slug-up cooling.
  • the PCB assembly is scalable and can be done with the DPAK, D2PAK or other SMD package packages, including the wired TO-220, TO-247, and so on.
  • the advantage is that the current does not have traces the circuit board, but is guided by thicker wires.
  • two or more components can be connected in parallel.
  • the known technologies such as screw holes, pressed-in screws, welding, for all embodiments of the present electrical circuit arrangement according to the invention
  • embodiments of the electrical circuit arrangement consist of a populated printed circuit board with a single-layer or multilayer busbar arrangement, wherein the busbars are not insulated.
  • These electrical circuit arrangements can then be installed in a protected environment, such as washing machines, fuse boxes, switch boxes, relay boxes, body computers, domain power output stages, electric motors, starters, generators or Ebike Powerpacks. By overmolding or potting isolated circuits can be made. This could then be installed independently in machines or vehicles.
  • Embodiments of the present invention provide an electrical circuit arrangement with a printed circuit board, at least two power semiconductor components, which are arranged on an upper side of the printed circuit board, and a first and second bus bar, which are arranged parallel to each other on a lower side of the printed circuit board.
  • the at least two power semiconductor components are each thermally and electrically contacted via a connection electrode with a contact element, which is guided through an opening in the circuit board and is contacted thermally and electrically with a busbar.
  • each case two power semiconductor components are connected to form a half-bridge module having two supply connections and a common bridge connection, wherein a first supply connection of the half-bridge module to the first busbar and a second supply connection of the half-bridge module to the second busbar are contacted.
  • the common bridge terminal of the half-bridge module is thermally and electrically contacted directly with a contact element, which is passed through an opening in the circuit board and thermally and electrically contacted with an additional bus bar, which is arranged perpendicular to the first and second bus bar on the underside of the circuit board and a corresponding phase for a subsequent electrical load provides.
  • the half-bridge modules can be arranged on the printed circuit board, wherein the number of additional bus bars corresponds to the number of half-bridge modules.
  • the half-bridge modules are preferably arranged on the circuit board, that the additional busbars are also arranged parallel to each other.
  • the contact elements may have a pin which projects into the corresponding opening in the printed circuit board, so that an upper side of the pin is flush with a arranged on the upper side of the printed circuit board contact area.
  • the openings in the circuit board as
  • a lower side of the respective power semiconductor component is thermally and electrically contacted with the upper side of the corresponding contact element, wherein the respective power semiconductor component rests on the upper side of the corresponding contact element and the corresponding contact region.
  • a corresponding source terminal of the first power semiconductor component of the respective half-bridge module can be electrically contacted with a contact element of the second busbar designed as a second supply terminal of the half-bridge module.
  • a corresponding source terminal of the second power semiconductor component of the respective half-bridge module can be electrically contacted with a contact area arranged on the upper side of the printed circuit board, which is electrically and mechanically connected to the bridge terminal.
  • the busbars can be arranged depending on the installation space in a common plane or in several levels. For example, if the installation height is limited, then a flat design of the electrical circuit arrangement according to the invention can be selected, in which all the busbars are arranged in a plane or position.
  • the first bus bar and the at least one additional bus bar may be disposed in a common plane and the second bus bar may be disposed in another level.
  • the second busbar and the at least one additional busbar can be arranged in a common plane and the first busbar can be arranged in a further plane or position.
  • FIG. 1 shows a schematic representation of a mechanical arrangement of a first exemplary embodiment of an electrical circuit arrangement according to the invention with a half-bridge module.
  • FIG. 2 shows an electrical equivalent circuit diagram of the first exemplary embodiment of the electrical circuit arrangement according to the invention from FIG. 1.
  • 3 shows a schematic representation of a mechanical arrangement of a second exemplary embodiment of an electrical circuit arrangement according to the invention with two half-bridge modules.
  • 4 shows an electrical equivalent circuit diagram of the second exemplary embodiment of the electrical circuit arrangement according to the invention from FIG. 3.
  • Fig. 5 shows a schematic representation of a mechanical arrangement of a third embodiment of an electrical circuit arrangement according to the invention with three half-bridge modules.
  • FIG. 6 shows an electrical equivalent circuit diagram of the third exemplary embodiment of the electrical circuit arrangement according to the invention from FIG. 5.
  • FIG. 7 shows a schematic sectional view along the section line VII-VII in FIGS. 1, 3 and 5.
  • FIG. 8 shows a perspective exploded view of the components of the first exemplary embodiment of the electrical circuit arrangement according to the invention from FIG. 1.
  • FIG. 9 shows a schematic representation of a mechanical arrangement of a fourth exemplary embodiment of an electrical circuit arrangement according to the invention with a half-bridge module.
  • FIG. 10 shows a schematic sectional view along the section line X-X in FIG. 9.
  • Fig. 1 1 shows a schematic representation of a mechanical arrangement of a fifth embodiment of an electrical circuit arrangement according to the invention with a half-bridge module.
  • FIG. 12 shows a schematic sectional illustration along the section line XII-XII in FIG. 11.
  • 13 shows a schematic representation of a mechanical arrangement of a sixth exemplary embodiment of an electrical circuit arrangement according to the invention with a half-bridge module.
  • 14 shows a schematic sectional view along the section line XIV-
  • FIG. 15 shows a perspective mechanical representation of a seventh exemplary embodiment of an electrical circuit arrangement according to the invention with three half-bridge modules.
  • FIGS. 1 to 15 the illustrated exemplary embodiments of an inventive electrical circuit arrangement 1A, 1B, 1C,
  • 1 A.1, 1 A.2, 1 A.3 each have a printed circuit board 3, 3.1, 3.2, 3.3, at least two power semiconductor components 10A1, 10B1, 10A2, 10B2, 10A3, 10B3, which on an upper side of the printed circuit board 3, 3.1, 3.2, 3.3 are arranged, and a first and second busbar 20, 30, 30.1, 30.2, 30.3, which are arranged parallel to each other on an underside of the circuit board 3, 3.1, 3.2, 3.3.
  • the at least two power semiconductor components 10A1, 10B1, 10A2, 10B2, 10A3, 10B3 are each thermally and electrically contacted via a connection electrode D, S with a contact element 22, 32, which passes through an opening 5 in the printed circuit board 3, 3.1, 3.2, 3.3 and is thermally and electrically contacted with a bus bar 20, 30, 30.1, 30.2, 30.3.
  • two power semiconductor components 10A1, 10B1, 10A2, 10B2, 10A3, 10B3 are interconnected to form a half-bridge module HB1, HB2, HB3 with two supply connections (+), (-) and a common bridge connection P1, P2, P3.
  • a first supply connection (+) of the half-bridge module HB1, HB2, HB3 is contacted with the first busbar 20 and a second supply connection (-) of the
  • Half-bridge module HB1, HB2, HB3 is contacted with the second busbar 30, 30.1, 30.2, 30.3.
  • the common bridge connection P1, P2, P3 of the half-bridge module HB1, HB2, HB3 is thermally and electrically contacted directly with a contact element 42, which is passed through an opening 5 in the printed circuit board 3, 3.1, 3.2, 3.3 and thermally and electrically with an additional busbar
  • 40A1, 40A2, 40A3 which are perpendicular to the first and second Busbar 20, 30, 30.1, 30.2, 30.3 on the underside of the circuit board 3, 3.1, 3.2, 3.3 is arranged and provides a corresponding phase for a subsequent electrical load available.
  • the contact elements 22, 32, 42 in the illustrated embodiments of the inventive electrical circuit arrangements 1A, 1 B, 1 C, 1A.1, 1A.2, 1A.3 each have a pin which projects into the corresponding opening 5 in the printed circuit board 3, 3.1, 3.2, 3.3, so that an upper side of the pin with a on the Top of the circuit board 3, 3.1, 3.2, 3.3 disposed contact region 7 is flush.
  • the openings 5 in the circuit board 3, 3.1, 3.2, 3.3 respectively as
  • an underside of the respective power semiconductor component 10A1, 10B1, 10A2, 10B2, 10A3, 10B3 is thermally and electrically contacted to the top side of the corresponding contact element 22, 42 , where the respective
  • Power semiconductor device 10A1, 10B1, 10A2, 10B2, 10A3, 10B3 rests on the top of the corresponding contact element 22, 42 and the corresponding contact region 7.
  • the power semiconductor components 10A1, 10B1, 10A2, 10B2, 10A3, 10B3 are positioned and soldered together with other components on the printed circuit board 3, 3.1, 3.2, 3.3. They are thus both on the contact area 7 of the circuit board 3, 3.1, 3.2, 3.3 and on the top of the pin.
  • Source terminal S is arranged. Therefore, the drain terminal D is applied directly to the contact element 22, 42 of the respective busbar 20, 40A1, 40A2, 40A3, while the source terminal S via wired connections or conductors on the circuit board 3, 3.1, 3.2, 3.3 is performed. Because the
  • the assembly is scalable and can be done with the packages DPAK, D2PAK or other SMD packages, including the wired TO-220, TO-247, etc. With wire, there is the advantage that the current does not pass through printed circuit boards3, 3.1, 3.2 , 3.3, but is guided by thicker wires. To increase the current, two or more components can be connected in parallel.
  • a drain terminal D of a first power semiconductor component 10A1, 10A2, 10A3 of the respective half-bridge module HB1, HB2, HB3 is designed as a bridge terminal P1, P2, P3 and with the contact element 42 of the corresponding additional busbar
  • Source terminal S of the first power semiconductor component 10A1, 10A2, 10A3 of the respective half-bridge module HB1, HB2, HB3 is electrically connected to a second supply terminal (-) of the half-bridge module HB1, HB2, HB3 contacted.
  • a drain connection D of a second power semiconductor component 10B1, 10B2, 10B3 of the respective half-bridge module HB1, HB2, HB3 is designed as a first supply connection (+) and contacted directly with the contact element 22 of the first busbar 22 thermally and electrically.
  • the 10B3 of the respective half-bridge module HB1, HB2, HB3 is with a on the Top side of the circuit board 3, 3.1, 3.2, 3.3 arranged electrically contacted contact area 7, which is electrically and mechanically connected to the bridge terminal P1, P2, P3.
  • the two power semiconductor components 10A1, 10B1, 10A2, 10B2, 10A3, 10B3 of the individual half-bridge modules HB1, HB2, HB3 are arranged in a common plane at right angles to each other, that the source terminals S of the second power semiconductor devices 10B1, 10B2, 10B3 in the direction of associated first power semiconductor device 10A1, 10A2, 10A3 are aligned.
  • the electrical connection between the source terminals S of the second power semiconductor components 10B1, 10B2, 10B3 and the drain terminals D of the associated first power semiconductor components 10A1, 10A2, 10A3 in the form of a wire bridge or a conductor can advantageously be kept as short as possible.
  • a plurality of half-bridge modules HB1, HB2, HB3 can be arranged on the printed circuit board 3, 3.1, 3.2, 3.3, the number of additional busbars 40A1, 40A2, 40A3 corresponding to the number of half-bridge modules HB1, HB2, HB3.
  • the busbars 20, 30, 30.1, 30.2, 30.3, 40A1, 40A2, 40A3 can be arranged in a common plane or in several planes depending on the installation space. According to the selected topology different geometries and connection arrangements for the bus bars 20, 30, 30.1, 30.2, 30.3, 40A1, 40A2, 40A3 are shown.
  • a first exemplary embodiment of the electrical circuit arrangement 1A comprises a half-bridge module HB1 which comprises a first power semiconductor component 10A1 and a second power semiconductor component 10B1.
  • a half-bridge module HB1 is also referred to as a B2 topology.
  • the first power semiconductor component 10A1 is thermally and electrically contacted via its drain terminal D directly to the contact element 42 of the additional bus bar 40A1.
  • the drain terminal D of the second power semiconductor device 10B1 is directly thermally and electrically contacted with the contact element 22 of the first bus bar 20.
  • the source terminal S of the first power semiconductor component 10A1 is connected via an electrical connection, not shown in FIG.
  • the source connection S of the second power semiconductor component 10B1 is electrically contacted via an electrical connection, not shown in FIG. 1, to the contact region 7 arranged on the upper side of the printed circuit board 3, which is electrically connected to the bridge connection P1 or the
  • Drain terminal D of the first power semiconductor device 10A1 is electrically and mechanically connected.
  • the electrical circuit arrangement 1A according to the invention comprises two parallel supply busbars 20, 30 and a phase busbar 40A1 running perpendicular to the supply busbars 20, 30.
  • the equivalent circuit diagram according to FIG. 2 additionally shows a choke inductance L and an intermediate circuit capacitance C.
  • a second exemplary embodiment of the electrical circuit arrangement 1B comprises two half-bridge modules HB1, HB2, which each comprise a first power semiconductor component 10A1, 10A2 and a second power semiconductor component 10B1, 10B2.
  • the illustrated circuit 1 B is also referred to as H topology.
  • the first power semiconductor component 10A1 of the first half-bridge module HB1 is thermally and electrically contacted via its drain terminal D directly with a contact element 42 of the additional busbar 40A1.
  • the first power semiconductor component 10A2 of the second half-bridge module HB2 is thermally and electrically contacted via its drain terminal D directly with a contact element 42 of the additional busbar 40A2.
  • Source terminals S of the first power semiconductor components 10A1, 10A2 and the second power semiconductor component 10B1, 10B2 are analogous to the first embodiment with the second supply terminal (-) of the respective half-bridge module HB1, HB2 running contact element 32 of the second busbar 30 or with the on top of the circuit board 3 arranged electrically contacted, which is electrically and mechanically connected to the bridge terminal P1, P2 and the drain terminal D of the first power semiconductor device 10A1, 10A2 of the respective half-bridge module HB1, HB2.
  • the inventive electric circuit arrangement 1 B two parallel supply busbars 20, 30 and two perpendicular to the supply busbars 20, 30 extending phase busbars 40A1, 40A2.
  • the equivalent circuit diagram according to FIG. 4 additionally shows a choke inductance L and an intermediate circuit capacitance C.
  • a third exemplary embodiment of the electrical circuit arrangement 1C comprises three half-bridge modules HB1, HB2, HB3, which each have a first power semiconductor component 10A1, 10A2, 10A3 and a second power semiconductor component
  • the illustrated circuit arrangement I C is also referred to as B6 topology.
  • the first power semiconductor component 10A1 of the first half-bridge module HB1 is thermally and electrically contacted via its drain terminal D directly with a contact element 42 of the additional busbar 40A1.
  • the first power semiconductor component 10A2 of the second half-bridge module HB2 is thermally and electrically contacted via its drain terminal D directly with a contact element 42 of the additional busbar 40A2.
  • the first power semiconductor component 10A3 of the third half-bridge module HB3 is thermally and electrically contacted via its drain terminal D directly to a contact element 42 of the additional busbar 40A3.
  • the drain terminals D of the second power semiconductor components 10B1, 10B2, 10B3 of the three half-bridge modules HB1, HB2, HB3 are directly thermally and electrically contacted with contact elements 22 of the first bus bar 20.
  • 10B3 are analogous to the first and second embodiments with the second supply terminal (-) of the respective half-bridge module HB1, HB2, HB3 running contact element 32 of the second busbar 30 or with the arranged on the top of the circuit board 3 contact area 7 electrically contacted, which with the bridge connection P1, P2, P3 or the drain connection
  • the electrical circuit arrangement 1C comprises two parallel supply busbars 20, 30 and three phases running perpendicular to the supply busbars 20, 30.
  • the equivalent circuit diagram according to FIG. 6 additionally shows a choke inductance L and a DC link capacitance C.
  • the busbars 20, 30, 40A1, 40A2, 40A3 on the underside of the printed circuit board 3 are in two planes or layers arranged.
  • the first busbar 20 and the at least one additional busbar 40A1, 40A2, 40A3 are arranged in a common plane, and the second busbar 30 is located in a further plane below the at least one additional busbar 40A1,
  • the second busbar 30 is rotated by 90 ° compared to the first busbar 20. By rotation through 90 ° can be optimized while maintaining the current carrying capacity of the second busbar 30, the areal space and the circuit board 3 are made narrower.
  • the second busbar 30 has projections 34, which carry the contact elements 32 of the second busbar 30, so that the pins of the contact elements 32 through the openings 5 guided in the circuit board 3 and are electrically connected to the corresponding contact areas 7 at the top of the circuit board.
  • the bushings 9. 1 which also correspond to the insulation 9, pass through the pins of the contact elements 32 of the second bus bar 30.
  • the directional arrows in FIG. 8 indicate with which contact elements 22, 32, 42 or contact regions 7 the various connection electrodes D, S, G of the power semiconductor components 10A1, 10B1 of the illustrated half-bridge module HB1 are electrically contacted.
  • a fourth exemplary embodiment of the electrical circuit arrangement 1A.1 according to the invention is optimized in terms of overall height.
  • the illustrated half-bridge module HB1 comprises a first power semiconductor component 10A1, a second power semiconductor component 10B1, two parallel supply busbars 20, 30.1 and a phase busbar 40A1 running perpendicular to the supply busbars 20, 30.1.
  • the interconnection of individual components corresponds to the B2 topology described in connection with the first embodiment.
  • the bus bars 20, 30.1, 40A1 in the fourth exemplary embodiment of the electrical circuit arrangement 1A.1 according to the invention are also arranged on the underside of the printed circuit board 3.1 in two planes or layers.
  • the first busbar 20 and the at least one additional busbar 40A1 are arranged in a common plane and the second busbar 30.1 is arranged in a further plane below the at least one additional busbar 40A1, the second
  • Busbar 30.1 is separated by an insulation 9A.1 of the at least one additional busbar 40A1.
  • the second busbar 30.1 is rotated by 90 ° and arranged flat below the additional busbar 40A1.
  • the height of the circuit arrangement 1A.1 according to the invention can be reduced in an advantageous manner, although the area requirement increases as the circuit board 3.1 becomes wider.
  • the second busbar 30.1 also in the fourth embodiment on projections 34.1, which carry the contact elements 32.1 of the second busbar 30.1, so that the pins of the contact elements 32.1 through the openings 5 in the circuit board 3.1 guided and electrically connected to the corresponding contact areas 7 at the top of the circuit board.
  • the illustrated B2 topology of the fourth exemplary embodiment of the electrical circuit arrangement 1A.1 according to the invention can easily be expanded to an H topology or B6 topology by adding further half-bridge modules HB2, HB3.
  • FIGS. 11 and 12 a fifth embodiment of the electrical circuit arrangement 1A.2 according to the invention is described with reference to FIGS.
  • the illustrated half-bridge module HB1 comprises, analogous to the first and fourth exemplary embodiments, a first power semiconductor component 10A1, a second power semiconductor component 10B1, two parallel supply busbars 20, 30.2 and a phase armor running perpendicular to the supply busbars 20, 30.2. Busbar 40A1.
  • the interconnection of the individual components corresponds to the B2 topology described in connection with the first exemplary embodiment.
  • the busbars 20, 30.2, 40A1 in the fifth exemplary embodiment of the electrical circuit arrangement 1A.2 according to the invention are also arranged on the underside of the printed circuit board 3.2 in two planes or layers.
  • the first busbar 20 and the at least one additional busbar 40A1 are arranged in a common plane and the second busbar 30.2 is arranged in a further plane below the at least one additional busbar 40A1, the second
  • Busbar 30 is separated by an insulation 9A.2 of the at least one additional busbar 40A1.
  • the second busbar 30.2 is rotated by 90 ° in comparison to the first three exemplary embodiments and is arranged flat below the additional busbar 40A1.
  • the second busbar 30.2 is rotated by 90 ° in comparison to the first three exemplary embodiments and is arranged flat below the additional busbar 40A1.
  • Busbar 30.2 shifted towards the center of the circuit board 3.2 and also extends below the first power semiconductor device 10A1.
  • the height and the area requirement of the circuit arrangement 1A.2 according to the invention can be reduced, since the circuit board 3.2 is narrower.
  • the illustrated B2 topology of the fifth exemplary embodiment of the electrical circuit arrangement 1A.2 according to the invention can be obtained by adding further half-bridge modules HB2,
  • HB3 can easily be extended to a H topology or B6 topology.
  • illustrated half-bridge module HB1 comprises a first power semiconductor component 10A1, a second power semiconductor component 10B1, two parallel supply busbars 20, 30.3 and a phase current rail 40A1 running perpendicular to the supply busbars 20, 30.3.
  • the interconnection of the individual components corresponds to that in
  • bus bars 20, 30.3, 40A1 in the fifth exemplary embodiment of the inventive electrical circuit arrangement 1 A.3 are arranged on the underside of the printed circuit board 3.3 in a common plane or position.
  • the second busbar 30.3 is arranged between the first busbar 20 and the at least one additional busbar 40A1.
  • the height of the pins of the contact elements 32.3 can be reduced, so that the second busbar 30.3 can be made identical to the first busbar 20, so that the number of identical parts can be further increased.
  • the height of the circuit arrangement 1A.3 according to the invention can be reduced at the expense of a higher space requirement, since the printed circuit board 3.3 compared to the fifth embodiment is wider again.
  • the illustrated B2 topology of the sixth exemplary embodiment of the inventive electrical circuit arrangement 1A.3 can easily be expanded to an H topology or B6 topology by adding further half-bridge modules HB2, HB3.
  • FIG. 15 shows such an extension to a B6 topology as the seventh embodiment of an inventive electrical circuit arrangement 1 D with three half-bridge modules HB1, HB2, HB3.
  • the seventh exemplary embodiment of the electrical circuit arrangement 1 D according to the invention is optimized with respect to the overall height.
  • the illustrated B6 topology comprises three half-bridge modules HB1, HB2, HB3, each comprising a first power semiconductor component 10A1, 10A2, 10A3 and a second power semiconductor component 10B1, 10B2, 10B2, two parallel supply busbars 20, 30.3 and three perpendicular to the power supply rails 20, 30.3 extending phase busbar 40A1, 40A2, 40A3.
  • the interconnection of the individual components corresponds to the B6 topology described in connection with the third exemplary embodiment.
  • all bus bars 20, 30.3, 40A1, 40A2, 40A3 in the seventh embodiment of the electrical circuit arrangement 1 D according to the invention arranged on the underside of the printed circuit board 3.3 in a common plane or position.
  • the second busbar 30.3 is arranged analogously to the sixth exemplary embodiment between the first busbar 20 and the at least one additional busbar 40A1, 40A2, 40A3.
  • an insulation and the projections on the second busbar 30.3 can advantageously be dispensed with, so that the second busbar 30.3 bears the contact elements 32.3 directly analogous to the first busbar 20.
  • the height of the pins of the contact elements 32.3 can be reduced, so that the second busbar 30.3 constructed identical to the first busbar 20 and the number of identical parts can be further increased.
  • the height of the circuit arrangement 1 D according to the invention can be reduced at the expense of a larger area requirement.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Power Engineering (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

L'invention concerne une circuiterie électrique (1C) comprenant une carte de circuits imprimés (3), au moins deux éléments semi-conducteurs de puissance (10A1, 10B1, 10A2, 10B2, 10A3, 10B3) qui sont disposés sur un côté supérieur de la carte de circuits imprimés (3) et une premier et une deuxième barre omnibus (20, 30) qui sont disposées parallèlement entre elles sur un côté inférieur de la carte de circuits imprimés (3), lesdits deux éléments semi-conducteurs de puissance (10A1, 10B1, 10A2, 10B2, 10A3, 10B3) étant respectivement mis thermiquement et électriquement en contact par l'intermédiaire d'une électrode de connexion avec un élément de contact (22, 32) qui est guidé par une ouverture (5) dans la carte de circuits imprimés (3) et est mis thermiquement et électriquement en contact avec une barre omnibus (20, 30). Selon l'invention, deux éléments semi-conducteurs de puissance (10A1, 10B1, 10A2, 10B2, 10A3, 10B3) sont respectivement montés en un module demi-pont (HB1, HB2, HB3) comprenant deux raccordements d'alimentation (+, -) et un raccordement de pont commun (P1, P2, P3), un premier raccordement d'alimentation (+) du module demi-pont (HB1, HB2, HB3) étant mis en contact avec la première barre omnibus (20) et un deuxième raccordement d'alimentation (-) du module demi-pont (HB1, HB2, HB3) étant mis en contact avec la deuxième barre omnibus (30, 30.1, 30.2, 30.3), le raccordement de pont commun (P1, P2, P3) du module demi-pont (HB1, HB2, HB3) étant mis directement thermiquement et électriquement en contact avec un élément de contact (42) qui est guidé par une ouverture (5) dans la carte de circuits imprimés (3) et mis thermiquement et électriquement en contact avec une barre omnibus (40A1, 40A2, 40A3) supplémentaire qui est disposée perpendiculairement à la première et à la deuxième barre omnibus (20, 30, 30.1, 30.2, 30.3) sur le côté inférieur de la carte de circuits imprimés (3) et met à disposition une phase correspondante pour un consommateur électrique suivant.
PCT/EP2014/061526 2013-06-26 2014-06-04 Circuiterie électrique WO2014206693A1 (fr)

Applications Claiming Priority (2)

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DE102013212263.2 2013-06-26
DE102013212263.2A DE102013212263A1 (de) 2013-06-26 2013-06-26 Elektrische Schaltungsanordnung

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EP3461241A1 (fr) * 2017-09-25 2019-03-27 Delphi Technologies, Inc. Dispositif de commutation électrique
FR3091139B1 (fr) * 2018-12-21 2020-12-11 Safran Electrical & Power Module de distribution électrique comprenant des socles supportant conjointement des barres de puissance et des composants de puissance
FR3095318B1 (fr) 2019-04-16 2021-04-09 G Cartier Tech Dispositif de commande a refroidissement optimise pour actionneur electrique
DE102019122035A1 (de) * 2019-08-16 2021-02-18 Seg Automotive Germany Gmbh Baugruppe mit Halbleiterbauelement und Verfahren zum Herstellen hierfür

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