WO2014205465A1 - Device and method for electrically testing product substrates - Google Patents

Device and method for electrically testing product substrates Download PDF

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Publication number
WO2014205465A1
WO2014205465A1 PCT/AT2014/000135 AT2014000135W WO2014205465A1 WO 2014205465 A1 WO2014205465 A1 WO 2014205465A1 AT 2014000135 W AT2014000135 W AT 2014000135W WO 2014205465 A1 WO2014205465 A1 WO 2014205465A1
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WO
WIPO (PCT)
Prior art keywords
substrate
product substrate
product
carrier substrate
electrical
Prior art date
Application number
PCT/AT2014/000135
Other languages
German (de)
French (fr)
Inventor
Stefan Pargfrieder
Original Assignee
Stefan Pargfrieder
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stefan Pargfrieder filed Critical Stefan Pargfrieder
Publication of WO2014205465A1 publication Critical patent/WO2014205465A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means

Definitions

  • the invention describes an apparatus and a method for the electrical testing of
  • the electrical testing of product substrates is a commonly performed characterization process in the semiconductor industry.
  • the product substrate usually includes a plurality of individual chips, wherein prior to singulation of the product substrate, typically each individual chip is electrically tested for functionality and possibly performance.
  • test is usually by means of one or more contact needles ei ne electrical connection to the test object to be tested, here a chip located on the product substrate produced.
  • the test usually also takes place on the processed side.
  • Product substrates are also increasingly being used on both sides, i. processed on the front and back and processed.
  • electrical contacts of the chips are also increasingly carried out on both sides.
  • it increasingly results in the need for bilateral electricalmaschinei tion for the implementation of the electrical tests.
  • the back of the product substrate as a single and common electrical contact for all chips designed to be flat, for example as an emitter in transistors.
  • the necessary for the electrical test contacting can be carried out, for example, as a single joint contact surface.
  • the thin product substrates typically have reduced dimensional stability, exhibit intrinsic mechanical deformation and deflection, or can roll without mechanical support.
  • carrier devices which work with releasable adhesive, such as Wax, or carrier systems in combination with light or temperature-releasable films, so-called thermal release or UV release films.
  • Anherente property of these carrier systems is their need for solving the product substrate from the carrier substrate each external physical Quantities such as temperature, light, as well as the need for each product substrate to be processed consumption material, in the form of, for example, wax or films to use.
  • a carrier technology is sought which is based on no need to use consumables and media and functions solely with mechanical force to connect and disconnect the product substrate to and from the carrier substrate.
  • a mobile, substantially dimensionally stable and planar composite consisting of a thin product substrate joined to a planar, dimensionally stable carrier substrate.
  • the carrier substrate is
  • the carrier substrate is advantageously designed, at least partially, flat with self-adhesive, residue-free adhesive elements with high dry adhesiveness.
  • Dry adhesiveness is understood to mean the formation of adhesive forces between surfaces without adhesion-promoting substances, such as adhesives. Such adhesive compounds are also characterized by the fact that they can be removed without residues again. Adhesion forces are believed to be based on van der Waals forces in fasteners having high dry adhesivity. Among other known from nature on gecko legs or insects (see also WO 01/49776 A2), such bonding agents may have finely structured surfaces.
  • Product substrates usually have an external peripheral so-called technological edge, which is not equipped with functional chips. This edge is typically 0mm to about 20mm wide, preferably as small as possible.
  • the carrier substrate can be mutatis mutandis, at least partially, be equipped with adhesive elements on the technological edge.
  • the object of the invention is to specify a device and a method for the transport and the electrical test of product substrates.
  • the invention is based on the idea to connect a thin product substrate with a mobile, electrically conductive, with at least partially, areal high dry adhesivity equipped device to supply this composite of the device for electrical testing of the product substrate to perform the electrical test on the composite, the Remove composite from the device again, and then disconnect the product substrate again from this device.
  • the composite is in its mechanical dimensions as equal to originally thick product substrates and as compatible as possible compatible with the state of the art manufacturing environments and thus allows a technically and economically advantageous intended use in combination with existing systems,
  • the device according to the invention consists of carrier substrate and adhesive elements.
  • Carrier substrate is at least partially, carried out electrically conductive.
  • the device is, on the side facing the product substrate, at least partially executed on the outer peripheral edge, with adhesive elements for receiving the product substrate.
  • the adhesive elements can, off 80 economic and manufacturing reasons, advantageously be carried out electrically insulating.
  • the inclusion of a product substrate of this device is carried out under atmospheric conditions under the influence of a planar force on the product substrate and device according to the invention.
  • the release of a product substrate from the device takes place, for example, by utilizing the mechanical flexibility of the product substrate and / or the device by means of the peeling process.
  • the device is advantageously designed with the highest possible electrical conductivity.
  • Thin product substrates are generally not pianistic and may be bent to a different degree due to, inter alia, internal mechanical stresses and their own weight.
  • the device is preferably equipped with gas-permeable openings for sucking the product substrate by means of negative pressure.
  • the contact pins are pressed against the product substrate to achieve a reliable, preferably 95 low electrical resistance.
  • the contact pins do not pierce through the product substrate.
  • the gas-permeable openings for the vacuum suction in the device on the side facing the product substrate are designed according to the smallest possible opening area.
  • the device is equipped with one or more openings for the vacuum suction which has the largest possible geographical distance to the respective electrical contacting points on the
  • the surface of the product substrate facing the test needles is as flat and planar as possible.
  • the surface of the device according to the invention is thus designed as a planar surface.
  • product substrate for example, a semiconductor wafer is meant, which has a thickness between 0.5 ⁇ and 2mm, preferably between 0.5 ⁇ and 200 ⁇ , more preferably between 0.5 ⁇ and 50 ⁇ having.
  • carrier substrate for example, a semiconductor wafer is meant, which has a thickness between 0.5 ⁇ and 2mm, preferably between 0.5 ⁇ and 200 ⁇ , more preferably between 0.5 ⁇ and 50 ⁇ having.
  • carrier substrate is meant according to the invention an electrically conductive plate.
  • the electrical conductivity is, at least partially, in the range of 1 * 10E0 S / m to more than 60 * 10E6 S / m, more preferably in the range of 1 * 10E6 S / m to more than 60 * 10E6 S / m.
  • a carrier substrate is
  • the diameter and the contour of the carrier substrate corresponds for example to that of
  • the diameter and the contour of the carrier substrate is 0 mm to
  • adhesive elements are meant a functional and dry adherent adhesive surface suitable for the application.
  • the adhesive elements are permanently connected to the carrier substrate.
  • On the product substrate side facing the adhesive elements are equipped with a self-adhesive, residue-free detachable surface.
  • the adhesive elements can be made elastic, preferred values of the modulus of elasticity are in the range of 1 MPa - 5000 MPa, more preferably 135 is the range 2 MPa - 200 MPa.
  • the adhesive elements at least partially, by elastic mechanical deformation to adapt to existing on the product substrate, topographies.
  • Topographic elevations on the product substrate preferably have values in the range of lnm-1 mm, preferably 10 nm-20 ⁇ m.
  • test device a device for electrical testing of product substrates or a composite of product substrate and device according to the invention.
  • the test device consists for example of electrically conductive contact needles, electrical conductive connections, an evaluation device and a
  • the product substrate or the composite is supplied to the test device.
  • the product substrate or the composite is received in a receiving device, for example by means of negative pressure, electrostatically acting actuators and / or by means of mechanical clamping.
  • the contact pins respectively contact individual pads on a respective chip on the product substrate front.
  • the current / voltage dependence of the closed circuit is determined sequentially for each individual chip of the product substrate. After completion of the determination of the current / voltage dependence, the contact pins are removed.
  • the product substrate or composite is removed from the receiving device.
  • a receiving device for the electrical test is preferably, at least partially, equipped with electrically conductive surface.
  • the recording takes place, for example, flat.
  • product substrate and carrier substrate can, for example by means of negative pressure, means
  • electrostatically acting actuators and / or by means of mechanical clamping.
  • Receiving device is advantageously with a possible defined and low electrical contact resistance of the device to the receiving device, preferably in the area
  • the contact resistance of the product substrate to the device according to the invention is as low as possible, preferably in the range from 0 ohms to 1 kOhm,
  • 175 particularly preferably 0 ohms to 1 ohms.
  • the performance of the electrical test can take place, for example, at temperatures in the range from - S0 ° C to + 150 ° C, preferably the process is carried out at room temperature.
  • the performance of the electrical test can be carried out, for example, at variable ambient pressure, for example in the range of 10E-8mBar to 5 bar, preferably in the range of 180 atmospheric pressure.
  • the performance of the electrical test can be done, for example, under different conditions
  • Ambient atmospheres are performed, for example, under a noble gas atmosphere, such as Ar or He, or for example under non-oxidizing ambient atmospheres such as N2 or preferably in ambient air.
  • a noble gas atmosphere such as Ar or He
  • non-oxidizing ambient atmospheres such as N2 or preferably in ambient air.
  • Figure 1 Schematic side view of a product substrate 1 and representation of the measuring principle for performing electrical tests with contacting the product substrate front side 11 and the product substrate rear side 12th
  • FIG. 2 Schematic detail view A of a product substrate front side 11 and contacting of a chip 15 of the product substrate 1 by means of contact needles 41 and 43 on the contacts 16 and 17.
  • FIG. 3 Schematic view of a test device 4 and receiving device 3.
  • Figure 4 Schematic side view of a product substrate 1 with test device 4 and
  • FIG. 5 Schematic representation of a method for an electrical test of a composite of product substrate 1 and carrier substrate 2.
  • FIG. 6 Schematic representation of a composite of product substrate 1 and carrier substrate 2 and test device 4 with recording of the composite 1, 2 by means of negative pressure in receiving device 3.
  • FIG. 7 Schematic representation of a carrier substrate 2 provided in a planar manner with electrically conductive material 22.
  • FIG. 8 Schematic representation of a carrier substrate 2 equipped with electrically conductive material 22 and on the peripheral edge B with adhesive elements 21.
  • FIG. 9 Schematic side view of a carrier substrate 2 equipped with electrically conductive material 22 and with adhesion elements 21.
  • Figure 10 Schematic side view of a carrier substrate 2 equipped with electrically conductive material 22 and surface applied adhesive elements 24 and planar surface O.
  • FIG. 11 Schematic representation of a carrier substrate 2 equipped with electrically conductive material 22 and gas-permeable openings 23.
  • FIG. 12 Schematic side view of a carrier substrate 2 with a thin, curved product substrate 1.
  • FIG. 13 Schematic side view of a receiving device 3, carrier substrate 2 and product substrate 1 planarized by means of vacuum (vacuum).
  • FIG. 14 Schematic side view of a product substrate 1, carrier substrate 2, gas-permeable openings 23 with dimension D23.
  • FIG. 15 Schematic side view of a composite of product substrate 1, carrier substrate 2, FIG.
  • Receiving device 3 and electrical conductive connection 40 Detail view A of the composite 1- 3.40 with a schematic representation of the electrical resistors R12, R2, R23, R3, R340.
  • Figure 1 Schematic side view of a product substrate 1 and representation of the measuring principle for performing two-sided electrical tests.
  • Contact needles 41, 43
  • Figure 2 Schematic detail A of a product substrate 1 and contacting a chip 15 of the product substrate 1 by means of contact pins 41 and 43 on the contacts 16 and 17. The chips 15 are contacted sequentially and tested.
  • Figure 3 Schematic view of a test device 4, consisting of evaluation device 45, electrically conductive connections 40,42,44, contact needles 41, 43 and receiving device.
  • Figure 4 Schematic side view of a product substrate 1 with test device 4 and
  • Evaluation device is connected to electrically conductive connections 42, 44 and contact needles 41, 43 to product substrate 1.
  • Product substrate 1 is of
  • Receiving device 3 was connected to electrically conductive connection 40. A closed electrical circuit is made.
  • FIG. 5 Schematic representation of a method for an electrical test of a composite of product substrate 1 and carrier substrate 2. 1) Inserting product substrate 1 and carrier substrate 2 2) Producing a composite of product substrate 1 and carrier substrate 2 outside the test device 4. 3) Introducing a composite of product substrate 1 and carrier substrate 2 in receiving device 3. 4) performing electrical test by means of test device 4. 5) applying composite of product substrate 1 and carrier substrate 2 from receiving device 3 and separating product substrate 1 from
  • Figure 6 Schematic representation of a composite of product substrate 1 and carrier substrate 2 and test device 4 with recording of the composite 1.2 by means of negative pressure in receiving device 3. A closed electrical circuit is made.
  • FIG. 7 Schematic representation of a carrier substrate 2 equipped with electrically conductive material 22.
  • Figure 8 Schematic representation of a carrier substrate 2 equipped with electrically conductive material 22 and equipped on the peripheral edge B with adhesive elements 21st
  • FIG. 9 Schematic side view of a carrier substrate 2 equipped with electrically conductive material 22 and adhesive elements 21.
  • FIG. 10 Schematic side view of a carrier substrate 2 equipped with electrically conductive material 22, adhesive elements 21 and surface applied adhesive elements 24 and planar surface O.
  • FIG. 11 Schematic representation of a carrier substrate 2 equipped with electrically conductive material 22 and gas-permeable openings 23.
  • FIG. 12 Schematic side view of a carrier substrate 2 with a thin, intrinsically bent product substrate 1.
  • FIG. 13 Schematic side view of a receiving device 3, carrier substrate 2 and product substrate 1 planarized by means of vacuum (vacuum).
  • Figure 14 Schematic side view of a product substrate 1, carrier substrate 2, gas-permeable openings 23 with dimension D23, and contact needle 43 with dimension DS.
  • Figure 15 Schematic side view of a composite of product substrate 1, carrier substrate 2, receiving device 3 and electrical conductive connection 40.
  • R12 describes the electrical contact resistance of product substrate 1 with carrier substrate 2.
  • R2 describes the electrical resistance of carrier substrate 2.
  • R23 describes the electrical contact resistance of carrier substrate 2 with receiving device 3.
  • R3 describes the electrical resistance of receiving device 3.
  • R340 describes the electrical contact resistance of receiving device 3 with electrically conductive connection 40.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

The invention relates to a device and a method for electrically testing thin product substrates (1) with the aid of a self-adhesive, clean-release carrier substrate (2). The device consists of an electrically conductive carrier substrate (2) which, on the surface facing the product substrate (1), is equipped with adhesive, clean-release adhesive elements (21). According to the invention, the method for electrically testing a product substrate (1) is carried out in chronological order and according to the following features: a) connecting a product substrate (1) to a carrier substrate (2) according to claims 1)-4); b) feeding the compound consisting of the product substrate (1) and the carrier substrate (2) to a receiving device (3); c) carrying out an electrical test on the composite consisting of the product substrate (1) and the carrier substrate (2) and the receiving device (3) by means of the test device (4); d) removing the composite consisting of the product substrate (1) and the carrier substrate (2) from the receiving device (3); and e) detaching the product substrate (1) from the carrier substrate (2).

Description

Patentschrift  Patent
Vorrichtung und Verfahren für das elektrische Testen von Produktsubstraten  Apparatus and method for electrical testing of product substrates
Beschreibung  description
Die Erfindung beschreibt eine Vorrichtung und ein Verfahren für das elektrische Testen von The invention describes an apparatus and a method for the electrical testing of
Produktsubstraten. Product substrates.
Der elektrische Test von Produktsubstraten ist in der Halbleiterindustrie ein üblicherweise durchgeführter Charakterisierungsvorgang. Das Produktsubstrat enthält in der Regel eine Vielzahl von einzelnen Chips, wobei vor dem Vereinzeln des Produktsubstrats in der Regel jeder einzelne Chip elektrisch auf Funktionalität und gegebenenfalls auf Leistungsfähigkeit getestet wird. The electrical testing of product substrates is a commonly performed characterization process in the semiconductor industry. The product substrate usually includes a plurality of individual chips, wherein prior to singulation of the product substrate, typically each individual chip is electrically tested for functionality and possibly performance.
Bei dem elektrischen Test wird in der Regel mittels einem oder mehreren Kontaktnadeln ei ne elektrische Verbindung zu dem zu testenden Prüfobjekt, hier ein auf dem Produktsubstrat befindlicher Chip, hergestellt. Bei einseitig bearbeiteten und prozessierten Produktsubstraten erfolgt der Test in der Regel auch jeweils von der prozessierten Seite. Vermehrt werden Produktsubstrate auch beidseitig, d.h. auf Vorderseite und Rückseite bearbeitet und prozessiert. Vermehrt sind daraus resultierend auch beidseitig elektrische Kontakte der Chips ausgeführt. Resultierend ergibt sich daraus vermehrt die Notwendigkeit der beidseitigen elektrischen Kontakti erung für die Durchführung der elektrischen Tests. In the electrical test is usually by means of one or more contact needles ei ne electrical connection to the test object to be tested, here a chip located on the product substrate produced. In the case of one-sided processed and processed product substrates, the test usually also takes place on the processed side. Product substrates are also increasingly being used on both sides, i. processed on the front and back and processed. As a result, electrical contacts of the chips are also increasingly carried out on both sides. As a result, it increasingly results in the need for bilateral electrical Kontakti tion for the implementation of the electrical tests.
Vielfach ist beispielsweise die Rückseite des Produktsubstrats als einzelner und gemeinsamer elektrischer Kontakt für alle Chips flächig ausgeführt, beispielsweise als Emitter bei Transistoren . Die für den elektrischen Test notwendige Kontaktierung kann dabei beispielsweise auch als einzelner gemeinsamer Kontakt flächig ausgeführt werden. In many cases, for example, the back of the product substrate as a single and common electrical contact for all chips designed to be flat, for example as an emitter in transistors. The necessary for the electrical test contacting can be carried out, for example, as a single joint contact surface.
Produktsubstrate werden durch die fortschreitende Miniaturisierung von elektronischen Product substrates are being developed by the progressive miniaturization of electronic
Anwendungen immer dünner ausgeführt. Die dünnen Produktsubstrate haben in der Regel eine verminderte Formstabilität, zeigen eine intrinsische mechanische Deformation und Durchbiegung oder können sich ohne mechanische Unterstützung einrollen. Applications run thinner and thinner. The thin product substrates typically have reduced dimensional stability, exhibit intrinsic mechanical deformation and deflection, or can roll without mechanical support.
Die Aufbewahrung, der Transport und der elektrische Test von dünnen Produktsubstraten ohne mechanische Unterstützung ist, wenn überhaupt, nur mit hohem technischem und wirtschaftlichem Aufwand realisierbar. Ökonomisch und technisch anstrebenswert ist die Verwendung und weitere Nutzung von bestehenden Anlagen und Aufbewahrungs - und Transportvorrichtungen, konzipiert für das Testen von weitgehend planaren und formstabilen Produktsubstraten. The storage, transport and electrical testing of thin product substrates without mechanical support is feasible, if at all, only with great technical and economic effort. Economically and technically desirable is the use and further use of existing equipment and storage and transport devices, designed for the testing of largely planar and dimensionally stable product substrates.
Für die Bearbeitung, Aufbewahrung- und den Transport von dünnen Produktsubstraten werden unterschiedliche mobile mechanische Unterstützungs- und Trägervorrichtungen und -verfahren verwendet. Beispielsweise Trägervorrichtungen welche mit lösbaren Kleber, wie beispielsweise Wax, arbeiten oder Trägersysteme in Kombination mit Licht- oder Temperaturlösbaren Folien, sogenannte Thermal-Release oder UV-Release Folien. Inherente Eigenschaft dieser Trägersysteme ist deren Notwendigkeit, für das Lösen des Produktsubstrats vom Trägersubstrats jeweils externe physikalische Größen wie beispielsweise Temperatur, Licht einzubringen, sowie die Notwendigkeit für jedes zu bearbeitende Produktsubstrat Verbrauchsmaterial, in Form von beispielsweise Wachs oder Folien, zu verwenden. Vorteilhafterweise ist eine Trägertechnologie anstrebsam, welche ohne Notwendigkeit zur Verwendung von Verbrauchsmaterialien und -medien basiert und einzig mit mechanischer Kraft zum Verbinden und Lösen des Produktsubstrats auf und von dem Trägersubstrat funktioniert. Various mobile mechanical support and support devices and methods are used for the processing, storage and transport of thin product substrates. For example, carrier devices which work with releasable adhesive, such as Wax, or carrier systems in combination with light or temperature-releasable films, so-called thermal release or UV release films. Anherente property of these carrier systems is their need for solving the product substrate from the carrier substrate each external physical Quantities such as temperature, light, as well as the need for each product substrate to be processed consumption material, in the form of, for example, wax or films to use. Advantageously, a carrier technology is sought which is based on no need to use consumables and media and functions solely with mechanical force to connect and disconnect the product substrate to and from the carrier substrate.
Zur Nutzung von bestehenden Anlagen und Aufbewahrungs- und Transportvorrichtungen für das Testen von dünnen Produktsubstraten, ist es in Folge dessen vorteilhaft, einen mobilen, weitgehend formstabilen und planaren Verbund, bestehend aus dünnem Produktsubstrat verbunden mit einem planaren, formstabilen Trägersubstrat, zur Verfügung zur haben. Das Trägersubstrat ist  Consequently, in order to utilize existing equipment and storage and transport devices for testing thin product substrates, it is advantageous to have a mobile, substantially dimensionally stable and planar composite consisting of a thin product substrate joined to a planar, dimensionally stable carrier substrate. The carrier substrate is
vorteilhafterweise, zumindest partiell, flächig elektrisch leitfähig ausgestaltet. Zur Aufnahme und weitgehenden Planarisierung des Produktsubstrat ist das Trägersubstrat vorteilhafterweise, zumindest partiell, flächig mit selbsthaftenden, rückstandsfreilösbaren Haftelementen mit hoher Trockenadhäsivität ausgestaltet. advantageously, at least partially, designed to be electrically conductively planar. For receiving and extensive planarization of the product substrate, the carrier substrate is advantageously designed, at least partially, flat with self-adhesive, residue-free adhesive elements with high dry adhesiveness.
Unter Trockenadhäsivität wird die Ausbildung von adhäsiven Kräften zwischen Oberflächen ohne haftvermittelnde Stoffe, wie Klebstoffe, verstanden. Solche Haftverbindungen zeichnen sich auch dadurch aus, dass sie sich ohne Rückstände wieder entfernen lassen. Man nimmt an, dass bei Verbindungsmitteln mit hoher Trockenadhäsivität die Haftkräfte auf van-der-Waals-Kräften basieren. Unter anderem auch aus der Natur an Gecko-Beinen oder Insekten (siehe auch WO 01/49776 A2) bekannt, können solche Verbindungsmittel feinstrukturierte Oberflächen aufweisen. Dry adhesiveness is understood to mean the formation of adhesive forces between surfaces without adhesion-promoting substances, such as adhesives. Such adhesive compounds are also characterized by the fact that they can be removed without residues again. Adhesion forces are believed to be based on van der Waals forces in fasteners having high dry adhesivity. Among other known from nature on gecko legs or insects (see also WO 01/49776 A2), such bonding agents may have finely structured surfaces.
Produktsubstrate weisen in der Regel einen aussen umlaufenden sogenannten technologischen Rand auf, welcher nicht mit funktionsfähigen Chips ausgestattet ist. Dieser Rand ist typischerweise 0mm bis in etwa 20mm breit, vorzugweise so klein wie möglich. Das Trägersubstrat kann sinngemäß, zumindest partiell, am technologischen Rand mit Haftelementen ausgestattet werden. Product substrates usually have an external peripheral so-called technological edge, which is not equipped with functional chips. This edge is typically 0mm to about 20mm wide, preferably as small as possible. The carrier substrate can be mutatis mutandis, at least partially, be equipped with adhesive elements on the technological edge.
Aufgabe der Erfindung ist es eine Vorrichtung und ein Verfahren für den Transport und den elektrischen Test von Produktsubstraten anzugeben.  The object of the invention is to specify a device and a method for the transport and the electrical test of product substrates.
Der Erfindung liegt der Gedanke zugrunde, ein dünnes Produktsubstrat mit einer mobilen, elektrisch leitfähigen, mit, zumindest partiell, flächig hoher Trockenadhäsivität ausgestatteten Vorrichtung zu verbinden, diesen Verbund der Vorrichtung zum elektrischen Test des Produktsubstrats zuzuführen, den elektrischen Test an dem Verbund durchzuführen, den Verbund von der Vorrichtung wieder zu entfernen, und anschließend das Produktsubstrat wieder von dieser Vorrichtung zu trennen. Der Verbund ist in seinen mechanischen Dimensionen möglichst gleichwertig zu ursprünglich dicken Produktsubstraten und möglichst kompatibel zu dem der Stand der Technik entsprechenden Fertigungsumgebungen ausgestaltet und ermöglicht somit eine technisch und ökonomisch vorteilhafte bestimmungsgemäße Verwendung in Kombination mit bestehenden Anlagen,  The invention is based on the idea to connect a thin product substrate with a mobile, electrically conductive, with at least partially, areal high dry adhesivity equipped device to supply this composite of the device for electrical testing of the product substrate to perform the electrical test on the composite, the Remove composite from the device again, and then disconnect the product substrate again from this device. The composite is in its mechanical dimensions as equal to originally thick product substrates and as compatible as possible compatible with the state of the art manufacturing environments and thus allows a technically and economically advantageous intended use in combination with existing systems,
Aufbewahrungs- und Transportvorrichtungen. Die mobile, elektrisch leitfähige, mit hoher Storage and transport devices. The mobile, electrically conductive, with high
Trockenadhäsivität ausgestattete Vorrichtung ist vorteilhafterweise für den vielfach Trockenadhäsivität equipped device is advantageously for many times
wiederverwendbaren bestimmungsgemäßen Gebrauch ausgestaltet. reusable intended use designed.
Die erfindungsgemäße Vorrichtung besteht aus Trägersubstrat und Haftelementen. Das  The device according to the invention consists of carrier substrate and adhesive elements. The
Trägersubstrat ist zumindest partiell, elektrisch leitfähig ausgeführt. Die Vorrichtung ist, auf der dem Produktsubstrat zugewandten Seite, am äußeren umlaufenden Rand zumindest partiell, mit Haftelementen zur Aufnahme des Produktsubstrats ausgeführt. Die Haftelemente können, aus 80 ökonomischen und herstellungstechnischen Gründen, vorteilhafterweise elektrisch isolierend ausgeführt sein. Carrier substrate is at least partially, carried out electrically conductive. The device is, on the side facing the product substrate, at least partially executed on the outer peripheral edge, with adhesive elements for receiving the product substrate. The adhesive elements can, off 80 economic and manufacturing reasons, advantageously be carried out electrically insulating.
Beispielsweise erfolgt die Aufnahme eines Produktsubstrats dieser Vorrichtung bei atmosphärischen Bedingungen unter Wirken einer flächigen Kraft auf Produktsubstrat und erfindungsgemäßer Vorrichtung zueinander.  For example, the inclusion of a product substrate of this device is carried out under atmospheric conditions under the influence of a planar force on the product substrate and device according to the invention.
85 Das Lösen eines Produktsubstrat von der Vorrichtung erfolgt beispielsweise durch Ausnutzung der mechanischen Flexibilität des Produktsubstrats und/oder der Vorrichtung mittels Abschälvorganges.  The release of a product substrate from the device takes place, for example, by utilizing the mechanical flexibility of the product substrate and / or the device by means of the peeling process.
Um den Einfluß der Vorrichtung beim elektrischen Test des Verbundes möglichst gering zu halten, ist die Vorrichtung vorteilhafterweise mit möglichst hoher elektrischer Leitfähigkeit ausgestaltet. In order to minimize the influence of the device during the electrical test of the composite, the device is advantageously designed with the highest possible electrical conductivity.
Dünne Produktsubstrate sind in der Regel nicht pianar und können unter anderem Aufgrund interner 90 mechanischer Spannungen und des Eigengewichtes in unterschiedlicher Ausprägung durchgebogen sein. Zum Erreichen einer möglichst konformen und planaren Auflage des Produktsubstrats, ist die Vorrichtung vorzugsweise mit gasdurchlässigen Öffnungen zum Ansaugen des Produktsubstrats mittels Unterdruck ausgestattet.  Thin product substrates are generally not pianistic and may be bent to a different degree due to, inter alia, internal mechanical stresses and their own weight. To achieve a conformable and planar support of the product substrate, the device is preferably equipped with gas-permeable openings for sucking the product substrate by means of negative pressure.
Beim elektrischen Test werden die Kontaktnadeln zum Erreichen eines zuverlässigen, möglichst 95 geringen elektrischen Widerstandes, an das Produktsubstrat gedrückt. Im Besonderen bei dünnen Produktsubstraten ist dabei zu achten, dass die Kontaktnadeln nicht durch das Produktsubstrat hindurch stechen. Vorzugweise sind die gasdurchlässigen Öffnungen für die Unterdruckansaugung in der Vorrichtung auf der dem Produktsubstrat zugewandten Seite entsprechend mit möglichst kleinem Öffnungsbereich ausgeführt. Alternativ bzw. ergänzend ist die Vorrichtung mit einer oder 100 mehreren Öffnungen für die Unterdruckansaugung ausgestattet welche einen möglichst großen geographischen Abstand zu den jeweiligen elektrischen Kontaktierungsstellen auf dem  In the electrical test, the contact pins are pressed against the product substrate to achieve a reliable, preferably 95 low electrical resistance. In particular, with thin product substrates, it should be ensured that the contact pins do not pierce through the product substrate. Preferably, the gas-permeable openings for the vacuum suction in the device on the side facing the product substrate are designed according to the smallest possible opening area. Alternatively or additionally, the device is equipped with one or more openings for the vacuum suction which has the largest possible geographical distance to the respective electrical contacting points on the
Produktsusbstrat aufweisen.  Product base have.
Für technisch und ökonomisches zuverlässiges und wirtschaftliches Testen der Produktsubstrate ist die den Testnadeln zugewandte Oberfläche des Produktsubstrates möglichst eben und pianar 105 ausgeführt. Vorteilhafterweise ist somit die Oberfläche der erfindungsgemäßen Vorrichtung als planare Oberfläche ausgeführt.  For technically and economically reliable and economical testing of the product substrates, the surface of the product substrate facing the test needles is as flat and planar as possible. Advantageously, the surface of the device according to the invention is thus designed as a planar surface.
Diese Aufgabe wird mit den beschriebenen Merkmalen von Anspruch 1 und Anspruch 5 gelöst. Vorteilhafte Weiterbildungen der Erfindung sind in den Unteransprüchen angegeben. In den Rahmen der Erfindung fallen auch sämtliche Kombinationen aus zumindest zwei in der Beschreibung, den 110 Ansprüchen und/oder den Figuren angegebenen Merkmalen. Bei den angegebenen Wertebereichen sollen auch innerhalb der genannten Grenzen liegende Werte als Grenzwerte offenbart und in beliebigen Kombinationen beanspruchbar sein.  This object is achieved with the described features of claim 1 and claim 5. Advantageous developments of the invention are specified in the subclaims. All combinations of at least two features specified in the description, the claims and / or the figures also fall within the scope of the invention. Within the specified value ranges, values lying within the stated limits should also be disclosed as limit values and be claimable in any combination.
Beschreibung Produktsubstrat Description Product substrate
Mit Produktsubstrat ist beispielsweise ein Halbleiterwafer gemeint, der eine Dicke zwischen 0,5μσι und 2mm, bevorzugt zwischen 0,5μιη und 200μηι, besonders bevorzugt zwischen 0,5μηι und 50μηι, aufweist. Beschreibung Trägersubstrat By product substrate, for example, a semiconductor wafer is meant, which has a thickness between 0.5μσι and 2mm, preferably between 0.5μιη and 200μηι, more preferably between 0.5μηι and 50μηι having. Description of carrier substrate
Mit Trägersubstrat ist erfindungsgemäß eine elektrisch leitfähige Platte gemeint. Die elektrische 120 Leitfähigkeit ist, zumindest partiell, im Bereich von 1* 10E0 S/m bis mehr als 60* 10E6 S/m, besonders bevorzugt im Bereich von 1*10E6 S/m bis mehr als 60*10E6 S/m. Ein Trägersubstrat ist By carrier substrate is meant according to the invention an electrically conductive plate. The electrical conductivity is, at least partially, in the range of 1 * 10E0 S / m to more than 60 * 10E6 S / m, more preferably in the range of 1 * 10E6 S / m to more than 60 * 10E6 S / m. A carrier substrate is
vorteilhafterweise scheibenförmig ausgeführt und weist eine Dicke zwischen 0,5μπ) und 10mm auf, bevorzugt im Bereich von ΙΟΟμηη bis 1mm, besonders bevorzugt im Bereich von 400μηι bis 900μηη. advantageously disc-shaped and has a thickness between 0.5μπ) and 10mm, preferably in the range of ΙΟΟμηη to 1mm, more preferably in the range of 400μηι to 900μηη.
Der Durchmesser und die Kontur des Trägersubstrats entspricht beispielsweise dem des The diameter and the contour of the carrier substrate corresponds for example to that of
125 Produktsubstrats, bevorzugt ist der Durchmesser und die Kontur des Trägersubstrats um 0mm bis125 product substrate, preferably the diameter and the contour of the carrier substrate is 0 mm to
200mm, besonders bevorzugt um 0,02mm bis 10mm umlaufend größer als der Durchmesser des200mm, more preferably by 0.02mm to 10mm circumferentially larger than the diameter of
Produktsubstrats. Product substrate.
Beschreibung Haftelemente Description adhesive elements
Als Haftelemente sind mit einer der Anwendung entsprechenden funktionalen und trocken- 130 adhäsiven Oberfläche ausgestattete Haftelemente gemeint. Die Haftelemente sind dabei dauerhaft mit dem Trägersubstrat verbunden. Auf der dem Produktsubstrat zugewandten Seite sind die Haftelemente mit einer selbsthaftenden, rückstandsfrei lösbaren Oberfläche ausgestattet. By adhesive elements are meant a functional and dry adherent adhesive surface suitable for the application. The adhesive elements are permanently connected to the carrier substrate. On the product substrate side facing the adhesive elements are equipped with a self-adhesive, residue-free detachable surface.
Als vorteilhafte Ausgestaltung können die Haftelemente elastisch ausgeführt werden, bevorzugte Werte des Elastizitätsmodul sind dabei im Bereich von 1 MPa - 5000 MPa, besonders bevorzugt ist 135 dabei der Bereich 2 MPa - 200 MPa.  As an advantageous embodiment, the adhesive elements can be made elastic, preferred values of the modulus of elasticity are in the range of 1 MPa - 5000 MPa, more preferably 135 is the range 2 MPa - 200 MPa.
Als vorteilhafte Ausgestaltung können sich die Haftelemente, zumindest partiell, durch elastische mechanische Verformung an, auf dem Produktsubstrat vorhandenen, Topographien anpassen. Topographische Erhebungen auf dem Produktsubtrat weisen dabei bevorzugt Werte im Bereich von lnm - 1mm, bevorzugt lOnm - 20μηη, auf.  As an advantageous embodiment, the adhesive elements, at least partially, by elastic mechanical deformation to adapt to existing on the product substrate, topographies. Topographic elevations on the product substrate preferably have values in the range of lnm-1 mm, preferably 10 nm-20 μm.
140 Beschreibung Testvorrichtung 140 Description Test device
Mit einer Testvorrichtung ist eine Vorrichtung zum elektrischen Test von Produktsubstraten bzw. einem Verbund aus Produktsubstrat und erfindungsgemäßer Vorrichtung gemeint. By a test device is meant a device for electrical testing of product substrates or a composite of product substrate and device according to the invention.
Die Testvorrichtung besteht dabei beispielsweise aus elektrisch leitfähigen Kontaktnadeln, elektrischen leitfähigen Verbindungen, einer Auswertevorrichtung sowie einer The test device consists for example of electrically conductive contact needles, electrical conductive connections, an evaluation device and a
145 Aufnahmevorrichtung. Für die Durchführung des Testverfahrens wird das Produktsubstrat bzw. der Verbund der Testvorrichtung zugeführt. Das Produktsubstrat bzw. der Verbund wird in einer Aufnahmevorrichtung beispielsweise mittels Unterdruck, elektrostatisch wirkenden Aktuatoren und/oder mittels mechanischer Klemmung aufgenommen. Die Kontaktnadeln kontaktieren jeweils einzelne Kontaktierungsstellen auf einem jeweiligen Chip an der Produktsubstratvorderseite. Ein 145 recording device. For carrying out the test method, the product substrate or the composite is supplied to the test device. The product substrate or the composite is received in a receiving device, for example by means of negative pressure, electrostatically acting actuators and / or by means of mechanical clamping. The contact pins respectively contact individual pads on a respective chip on the product substrate front. One
150 bestimmungsgemäßer geschlossener Stromkreislauf, bestehend aus Auswertevorrichtung, elektrisch leitfähigen Verbindungen, elektrisch leitfähigen Kontaktnadeln, Produktsubstrat bzw. Verbund und Aufnahmeeinheit ist hergestellt. 150 intended closed circuit consisting of evaluation device, electrically conductive connections, electrically conductive contact needles, product substrate or composite and recording unit is made.
Als elektrischer Test wird in der Regel die Strom-/Spannungsabhängigkeit des geschlossenen Stromkreises wird sequenziell für jeden einzelnen Chip des Produktsubstrats festgestellt. Nach 155 Abschluß der Feststellung der Strom-/Spannungsabhängigkeit werden die Kontaktnadeln entfernt. As an electrical test, usually the current / voltage dependence of the closed circuit is determined sequentially for each individual chip of the product substrate. After completion of the determination of the current / voltage dependence, the contact pins are removed.
Das Produktsubstrat bzw. der Verbund wird aus der Aufnahmevorrichtung entfernt. Gegebenenfalls können innerhalb der Vorrichtung zum elektrischen Test weitere Bearbeitungsverfahren, wie beispielsweise das sogenannten Inking (=Markieren nicht funktionaler Chips) an dem Produktsubstrat durchgeführt werden. The product substrate or composite is removed from the receiving device. Optionally, within the apparatus for electrical testing further processing methods, such as For example, the so-called inking (= marking non-functional chips) are performed on the product substrate.
160 Bei einem, an der Vorder- und Rückseite, bearbeiteten und prozessierten Produktsubstrat wird die160 For a product substrate processed and processed at the front and back, the
Rückseite des Produktsubstrates bzw. eines Verbundes elektrisch kontaktiert, die Kontaktierung kann beispielsweise, zumindest partiell, flächig erfolgen. Eine Aufnahmevorrichtung zum elektrischen Test ist dabei vorzugsweise, zumindest partiell, flächig elektrisch leitfähig ausgestattet. Die Aufnahme erfolgt beispielsweise flächig. Die Aufnahme des Produktsubstrates oder eines Verbundes ausContacted rear side of the product substrate or a composite electrically, the contacting can be done, for example, at least partially, area. A receiving device for the electrical test is preferably, at least partially, equipped with electrically conductive surface. The recording takes place, for example, flat. The inclusion of the product substrate or a composite
165 Produktsubstrat und Trägersubstrat kann dabei beispielsweise mittels Unterdruck, mittels 165 product substrate and carrier substrate can, for example by means of negative pressure, means
elektrostatisch wirkenden Aktuatoren oder/und mittels mechanischer Klemmung erfolgen.  electrostatically acting actuators and / or by means of mechanical clamping.
Der flächige oder partiell flächige Verbund aus erfindungsgemäßer Vorrichtung und  The planar or partially planar composite of inventive device and
Aufnahmeeinrichtung ist vorteilhafterweise mit einem möglichst definiertem und geringem elektrischen Kontaktwiderstand von der Vorrichtung zur Aufnahmeeinrichtung, bevorzugt im Bereich Receiving device is advantageously with a possible defined and low electrical contact resistance of the device to the receiving device, preferably in the area
170 0 Ohm bis 1 kOhm, besonders bevorzugt 0 Ohm bis 1 Ohm, sowie mit einem jeweils möglichst 170 0 ohms to 1 kOhm, more preferably 0 ohms to 1 ohms, and with one each as possible
geringem und definierten elektrischen Widerstand von der erfindungsgemäßen Vorrichtung und der Aufnahmeeinrichtung selbst, jeweils im Bereich 0 Ohm bis 1 kOhm, besonders bevorzugt im Bereich 0 Ohm bis 1 Ohm, ausgestattet. Vorteilhafterweise ist der Kontaktwiderstand von Produktsubstrat zur erfindungsgemäßen Vorrichtung möglichst gering, bevorzugt im Bereich 0 Ohm bis 1 kOhm, low and defined electrical resistance of the inventive device and the recording device itself, each in the range 0 ohms to 1 kohms, particularly preferably in the range 0 ohms to 1 ohms equipped. Advantageously, the contact resistance of the product substrate to the device according to the invention is as low as possible, preferably in the range from 0 ohms to 1 kOhm,
175 besonders bevorzugt 0 Ohm bis 1 Ohm. 175 particularly preferably 0 ohms to 1 ohms.
Die Durchführung des elektrischen Test kann beispielsweise bei Temperaturen vm Bereich on - S0°C bis +150°C stattfinden, bevorzugt wird der Vorgang bei Raumtemperatur durchgeführt. The performance of the electrical test can take place, for example, at temperatures in the range from - S0 ° C to + 150 ° C, preferably the process is carried out at room temperature.
Die Durchführung des elektrischen Test kann beispielsweise bei variablen Umgebungsdruck durchgeführt werden, beispielsweise im Bereich von 10E-8mBar bis 5 Bar, bevorzugt im Bereich von 180 atmosphärischen Druck. The performance of the electrical test can be carried out, for example, at variable ambient pressure, for example in the range of 10E-8mBar to 5 bar, preferably in the range of 180 atmospheric pressure.
Die Durchführung des elektrischen Test kann beispielsweise unter unterschiedlichen  The performance of the electrical test can be done, for example, under different
Umgebungsatmosphären durchgeführt werden, beispielsweise unter Edelgasatmosphäre, wie Ar oder He, oder beispielsweise unter nicht-oxidierenden Umgebungsatmosphären wie beispielsweise N2 oder bevorzugt an Umgebungsluft.  Ambient atmospheres are performed, for example, under a noble gas atmosphere, such as Ar or He, or for example under non-oxidizing ambient atmospheres such as N2 or preferably in ambient air.
185 Weitere Vorteile, Merkmale und Einzelheiten der Erfindung ergeben sich aus der nachfolgenden Beschreibung bevorzugter Ausführungsbeispiele sowie anhand der Zeichnungen; Diese zeigen in: Other advantages, features and details of the invention will become apparent from the following description of preferred embodiments and from the drawings; These show in:
Figur 1: Schematische Seitenansicht eines Produktsubstrats 1 und Darstellung des Meßprinzips zur Durchführung von elektrischen Tests mit Kontaktierung des Produktsubstratvorderseite 11 und Produktsubstratrückseite 12. Figure 1: Schematic side view of a product substrate 1 and representation of the measuring principle for performing electrical tests with contacting the product substrate front side 11 and the product substrate rear side 12th
190 Figur 2: Schematische Detailansicht A einer Produktsubstratvorderseite 11 und Kontaktierung eines Chips 15 des Produktsubstrats 1 mittels Kontaktnadeln 41 und 43 an den Kontakten 16 und 17. FIG. 2: Schematic detail view A of a product substrate front side 11 and contacting of a chip 15 of the product substrate 1 by means of contact needles 41 and 43 on the contacts 16 and 17.
Figur 3: Schematische Ansicht einer Testvorrichtung 4 und Aufnahmevorrichtung 3. FIG. 3: Schematic view of a test device 4 and receiving device 3.
Figur 4: Schematische Seitenansicht eines Produktsubstrats 1 mit Testvorrichtung 4 und  Figure 4: Schematic side view of a product substrate 1 with test device 4 and
Aufnahmevorrichtung 3. 195 Figur 5: Schematische Darstellung eines Verfahrens für einen elektrischen Test eines Verbundes aus Produktsubstrat 1 und Trägersubstrat 2. Recording device 3. FIG. 5: Schematic representation of a method for an electrical test of a composite of product substrate 1 and carrier substrate 2.
Figur 6: Schematische Darstellung eines Verbund aus Produktsubstrat 1 und Trägersubstrats 2 und Testvorrichtung 4 mit Aufnahme des Verbundes 1,2 mittels Unterdruck in Aufnahmevorrichtung 3.FIG. 6: Schematic representation of a composite of product substrate 1 and carrier substrate 2 and test device 4 with recording of the composite 1, 2 by means of negative pressure in receiving device 3.
Figur 7: Schematische Darstellung eines Trägersubstrats 2 flächig ausgestattet mit elektrisch 200 leitfähigem Material 22. FIG. 7: Schematic representation of a carrier substrate 2 provided in a planar manner with electrically conductive material 22.
Figur 8: Schematische Darstellung eines Trägersubstrats 2 ausgestattet mit elektrisch leitfähigen Material 22 und am umlaufenden Rand B mit Haftelementen 21.  FIG. 8: Schematic representation of a carrier substrate 2 equipped with electrically conductive material 22 and on the peripheral edge B with adhesive elements 21.
Figur 9: Schematische Seitenansicht eines Trägersubstrats 2 ausgestattet mit elektrisch leitfähigem Material 22 und mit Haftelementen 21.  FIG. 9: Schematic side view of a carrier substrate 2 equipped with electrically conductive material 22 and with adhesion elements 21.
205 Figur 10: Schematische Seitenansicht eines Trägersubstrats 2 ausgestattet mit elektrisch leitfähigem Material 22 und flächig aufgebrachten Haftelementen 24 und planare Oberfläche O. 205 Figure 10: Schematic side view of a carrier substrate 2 equipped with electrically conductive material 22 and surface applied adhesive elements 24 and planar surface O.
Figur 11: Schematische Darstellung eines Trägersubstrats 2 ausgestattet mit elektrisch leitfähigem Material 22 und gasdurchlässigen Öffnungen 23.  FIG. 11: Schematic representation of a carrier substrate 2 equipped with electrically conductive material 22 and gas-permeable openings 23.
Figur 12: Schematische Seitenansicht eines Trägersubstrats 2 mit einem dünnen, gebogenen 210 Produktsubstrat 1.  FIG. 12: Schematic side view of a carrier substrate 2 with a thin, curved product substrate 1.
Figur 13: Schematische Seitenansicht einer Aufnahmevorrichtung 3, Trägersubstrat 2 und mittels Unterdruck (Vacuum) planarisierten Produktsubstrat 1.  FIG. 13: Schematic side view of a receiving device 3, carrier substrate 2 and product substrate 1 planarized by means of vacuum (vacuum).
Figur 14: Schematische Seitenansicht eine Produktsubstrat 1, Trägersubstrat 2, gasdurchlässige Öffnungen 23 mit Dimension D23. FIG. 14: Schematic side view of a product substrate 1, carrier substrate 2, gas-permeable openings 23 with dimension D23.
215 Figur 15: Schematische Seitenansicht eines Verbundes aus Produktsubstrat 1, Trägersubstrat 2,215 FIG. 15: Schematic side view of a composite of product substrate 1, carrier substrate 2, FIG.
Aufnahmevorrichtung 3 und elektrischer leitfähiger Verbindung 40. Detailansicht A des Verbundes 1- 3,40 mit schematischer Darstellung der elektrischen Widerstände R12, R2, R23, R3, R340. Receiving device 3 and electrical conductive connection 40. Detail view A of the composite 1- 3.40 with a schematic representation of the electrical resistors R12, R2, R23, R3, R340.
Zeichnungen drawings
In den Figuren sind gleiche Bauteile und Bauteile mit der gleichen Funktion mit den gleichen Bezugszeichen gekennzeichnet.  In the figures, the same components and components with the same function with the same reference numerals.
Erklärungen Explanations
1 Produktsubstrat 1 product substrate
11 Produktsubstratvorderseite  11 product substrate front
12 Produktsubstratrückseite 15 Chip im Produktsubstrat (1) 12 product substrate back 15 chip in the product substrate (1)
16, 17 elektrischer Kontakt von Chip (15) im Produktsubstrat (1) 16, 17 electrical contact of chip (15) in the product substrate (1)
2 Trägersubstrat 2 carrier substrate
B äußerer umlaufender Rand  B outer peripheral edge
21 Haftelement 21 adhesive element
22 elektrisch leitfähiges Material 22 electrically conductive material
23 gasdurchlässige Öffnung im Trägersubstrat 2 D23 Dimension einer Öffnung im Trägersubstrat 2 23 gas-permeable opening in the carrier substrate 2 D23 dimension of an opening in the carrier substrate 2
24 Haftelemente (flächig aufgebracht)  24 adhesive elements (applied flatly)
3 Aufnahmevorrichtung 3 receiving device
31 Aufnahmevorrichtungsoberseite 31 cradle top
4 Testvorrichtung 4 test device
40, 42, 44 elektrisch leitfähige Verbindung  40, 42, 44 electrically conductive connection
41, 43 Kontaktnadel  41, 43 contact needle
DS Durchmesser einer Kontaktnadel DS diameter of a contact needle
45 Auswertevorrichtung  45 evaluation device
R12 elektrischer Kontaktwiderstand zwischen Produktsubstrat (1) und Trägersubstrat (2)R12 electrical contact resistance between product substrate (1) and carrier substrate (2)
R2 elektrischer Widerstand von Trägersubstrat (2) R2 electrical resistance of carrier substrate (2)
R23 elektrischer Kontaktwiderstand zwischen Trägersubstrat (2) und R23 electrical contact resistance between the carrier substrate (2) and
Aufnahmevorrichtung (3)  Receiving device (3)
R3 elektrischer Widerstand von Aufnahmevorrichtung (3) elektrischer Kontaktwiderstand zwischen Aufnahmevorrichtung (3) und elektrisch leitfähiger Verbindung (40). R3 electrical resistance of recording device (3) electrical contact resistance between receiving device (3) and electrically conductive connection (40).
Figur 1: Schematische Seitenansicht eines Produktsubstrats 1 und Darstellung des Meßprinzips zur Durchführung von beidseitigen elektrischen Tests. Kontaktnadeln 41, 43 kontaktieren Figure 1: Schematic side view of a product substrate 1 and representation of the measuring principle for performing two-sided electrical tests. Contact needles 41, 43
Produktsubstratvorderseite 11. Elektrische leitfähige Verbindung 40 kontaktiert Product substrate front 11. Electrical conductive connection 40 contacted
Produktsubstratrückseite 12. Mit den elektrischen leitfähigen Verbindungen 42, 44 und einer Auswertevorrichtung 45 wird ein geschlossener Stromkreislauf hergestellt. Product substrate back 12. With the electrical conductive connections 42, 44 and an evaluation device 45, a closed circuit is produced.
Figur 2: Schematische Detailansicht A eine Produktsubstrates 1 und Kontaktierung eines Chips 15 des Produktsubstrats 1 mittels Kontaktnadeln 41 und 43 an den Kontakten 16 und 17. Die Chips 15 werden sequenziell kontaktiert und getestet.  Figure 2: Schematic detail A of a product substrate 1 and contacting a chip 15 of the product substrate 1 by means of contact pins 41 and 43 on the contacts 16 and 17. The chips 15 are contacted sequentially and tested.
Figur 3: Schematische Ansicht einer Testvorrichtung 4, bestehend aus Auswertevorrichtung 45, elektrisch leitfähigen Verbindungen 40,42,44, Kontaktnadeln 41, 43 und Aufnahmevorrichtung 3.Figure 3: Schematic view of a test device 4, consisting of evaluation device 45, electrically conductive connections 40,42,44, contact needles 41, 43 and receiving device. 3
Figur 4: Schematische Seitenansicht eines Produktsubstrats 1 mit Testvorrichtung 4 und Figure 4: Schematic side view of a product substrate 1 with test device 4 and
Aufnahmevorrichtung 3. Auswertevorrichtung ist mit elektrisch leitfähigen Verbindungen 42,44 und Kontaktnadeln 41,43 mit Produktsubstrat 1 verbunden. Produktsubstrat 1 ist von Recording device 3. Evaluation device is connected to electrically conductive connections 42, 44 and contact needles 41, 43 to product substrate 1. Product substrate 1 is of
Aufnahmevorrichtung 3 aufgenommen. Aufnahmevorrichtung 3 ist mit elektrisch leitfähiger Verbindung 40 verbunden. Ein geschlossener elektrischer Kreis ist hergestellt. Recording device 3 was added. Receiving device 3 is connected to electrically conductive connection 40. A closed electrical circuit is made.
Figur 5: Schematische Darstellung eines Verfahrens für einen elektrischen Test eines Verbundes aus Produktsubstrat 1 und Trägersubstrat 2. 1) Einbringen Produktsubstrat 1 und Trägersubstrat 2 2) Herstellen Verbund aus Produktsubstrat 1 und Trägersubstrat 2 ausserhalb der Testvorrichtung 4. 3) Einbringen Verbund aus Produktsubstrat 1 und Trägersubstrat 2 in Aufnahmevorrichtung 3. 4) Durchführen elektrischer Test mittels Testvorrichtung 4. 5) Ausbringen Verbund aus Produktsubstrat 1 und Trägersubstrat 2 aus Aufnahmevorrichtung 3 und Trennen von Produktsubstrat 1 von  FIG. 5: Schematic representation of a method for an electrical test of a composite of product substrate 1 and carrier substrate 2. 1) Inserting product substrate 1 and carrier substrate 2 2) Producing a composite of product substrate 1 and carrier substrate 2 outside the test device 4. 3) Introducing a composite of product substrate 1 and carrier substrate 2 in receiving device 3. 4) performing electrical test by means of test device 4. 5) applying composite of product substrate 1 and carrier substrate 2 from receiving device 3 and separating product substrate 1 from
Trägersubstrat 2. Carrier substrate 2.
Figur 6: Schematische Darstellung eines Verbund aus Produktsubstrat 1 und Trägersubstrat 2 und Testvorrichtung 4 mit Aufnahme des Verbundes 1,2 mittels Unterdruck in Aufnahmevorrichtung 3. Ein geschlossener elektrischer Kreis ist hergestellt.  Figure 6: Schematic representation of a composite of product substrate 1 and carrier substrate 2 and test device 4 with recording of the composite 1.2 by means of negative pressure in receiving device 3. A closed electrical circuit is made.
Figur 7: Schematische Darstellung eines Trägersubstrats 2 ausgestattet mit elektrisch leitfähigem Material 22. FIG. 7: Schematic representation of a carrier substrate 2 equipped with electrically conductive material 22.
Figur 8: Schematische Darstellung eines Trägersubstrats 2 ausgestattet mit elektrisch leitfähigen Material 22 und ausgestattet am umlaufenden Rand B mit Haftelementen 21. Figure 8: Schematic representation of a carrier substrate 2 equipped with electrically conductive material 22 and equipped on the peripheral edge B with adhesive elements 21st
Figur 9: Schematische Seitenansicht eines Trägersubstrats 2 ausgestattet mit elektrisch leitfähigem Material 22 und Haftelementen 21. FIG. 9: Schematic side view of a carrier substrate 2 equipped with electrically conductive material 22 and adhesive elements 21.
Figur 10: Schematische Seitenansicht eines Trägersubstrats 2 ausgestattet mit elektrisch leitfähigem Material 22, Haftelementen 21 und flächig aufgebrachten Haftelementen 24 und planarer Oberfläche O. Figur 11: Schematische Darstellung eines Trägersubstrats 2 ausgestattet mit elektrisch leitfähigem Material 22 und gasdurchlässigen Öffnungen 23. Figure 10: Schematic side view of a carrier substrate 2 equipped with electrically conductive material 22, adhesive elements 21 and surface applied adhesive elements 24 and planar surface O. FIG. 11: Schematic representation of a carrier substrate 2 equipped with electrically conductive material 22 and gas-permeable openings 23.
Figur 12: Schematische Seitenansicht eines Trägersubstrats 2 mit einem dünnen, intrinsisch gebogenen Produktsubstrat 1. FIG. 12: Schematic side view of a carrier substrate 2 with a thin, intrinsically bent product substrate 1.
Figur 13: Schematische Seitenansicht einer Aufnahmevorrichtung 3, Trägersubstrat 2 und mittels Unterdruck (Vacuum) planarisierten Produktsubstrat 1. FIG. 13: Schematic side view of a receiving device 3, carrier substrate 2 and product substrate 1 planarized by means of vacuum (vacuum).
Figur 14: Schematische Seitenansicht eine Produktsubstrat 1, Trägersubstrat 2, gasdurchlässige Öffnungen 23 mit Dimension D23, sowie Kontaktnadel 43 mit Dimension DS. Figure 14: Schematic side view of a product substrate 1, carrier substrate 2, gas-permeable openings 23 with dimension D23, and contact needle 43 with dimension DS.
Figur 15: Schematische Seitenansicht eines Verbundes aus Produktsubstrat 1, Trägersubstrat 2, Aufnahmevorrichtung 3 und elektrischer leitfähiger Verbindung 40. Detailansicht A des Verbundes 1- 3,40 mit schematischer Darstellung der elektrischen Widerstände R12, R2, R23, R3, R340. R12 beschreibt den elektrischen Kontaktwiderstand von Produktsubstrat 1 mit Trägersubstrat 2. R2 beschreibt den elektrischen Widerstand des Trägersubstrat 2.R23 beschreibt den elektrischen Kontaktwiderstand von Trägersubstrat 2 mit Aufnahmevorrichtung 3. R3 beschreibt den elektrischen Widerstand der Aufnahmevorrichtung 3. R340 beschreibt den elektrischen Kontaktwiderstand von Aufnahmevorrichtung 3 mit elektrisch leitfähiger Verbindung 40. Figure 15: Schematic side view of a composite of product substrate 1, carrier substrate 2, receiving device 3 and electrical conductive connection 40. Detail view A of the composite 1- 3.40 with a schematic representation of the electrical resistors R12, R2, R23, R3, R340. R12 describes the electrical contact resistance of product substrate 1 with carrier substrate 2. R2 describes the electrical resistance of carrier substrate 2.R23 describes the electrical contact resistance of carrier substrate 2 with receiving device 3. R3 describes the electrical resistance of receiving device 3. R340 describes the electrical contact resistance of receiving device 3 with electrically conductive connection 40.

Claims

Patentansprüche claims
1) Vorrichtung zur Aufnahme eines Produktsubstrates mit folgenden Merkmalen:  1) Device for receiving a product substrate having the following features:
Ein elektrisch leitfähiges Trägersubstrat (2), zumindest partiell, auf der dem Produktsubstrat (1) zugewandten Oberfläche, im Bereich des äußeren umlaufenden Randes (B) mit einer Breite kleiner als 15mm, ausgestattet mit, auf der dem Produktsubstrat (1) zugewandten Oberfläche mit selbsthaftenden, rückstandsfrei lösbaren Eigenschaften ausgestatteten, Haftelementen (21). An electrically conductive carrier substrate (2), at least partially, on the surface facing the product substrate (1), in the region of the outer peripheral edge (B) with a width smaller than 15 mm, equipped with, on the product substrate (1) facing surface with Self-adhesive, residue-free detachable properties equipped, adhesive elements (21).
2) Vorrichtung nach Anspruch 1) wobei das Trägersubstrat (2) zumindest partiell, auf der dem Produktsubstrat zugewandten Oberfläche, mit flächig aufgebrachten Haftelementen (24) ausgestattet ist und die dem Produktsubstrat zugewandte Oberfläche aus Trägersubstrat (2) und flächig aufgebrachten Haftelementen (24) eine flächig planare Oberfläche (0) ausbilden. 2) Device according to claim 1) wherein the carrier substrate (2) is at least partially, on the product substrate facing surface, provided with surface applied adhesive elements (24) and the product substrate facing surface of the carrier substrate (2) and surface applied adhesive elements (24). form a planar planar surface (0).
3) Vorrichtung nach Anspruch 1) und Anspruch 2), ausgestattet mit einer oder mehreren 3) Device according to claim 1) and claim 2), equipped with one or more
durchgehenden gasdurchlässigen Öffnungen (23).  continuous gas-permeable openings (23).
4) Vorrichtung nach Anspruch 3), ausgestattet mit einer an der dem Produktsubstrat (1) 4) Device according to claim 3), equipped with a on the product substrate (1)
zugewandten Seite, maximalen Öffnungsweite (D23) der gasdurchlässigen Öffnung (23) von maximal 1mm, bevorzugt kleiner 0.1mm, besonders bevorzugt kleiner als 0.001mm.  facing side, maximum opening width (D23) of the gas-permeable opening (23) of a maximum of 1mm, preferably less than 0.1mm, more preferably less than 0.001mm.
5) Verfahren zum elektrischen Test eines Produktsubstrats (1), in chronologischer Reihenfolge nach folgenden Merkmalen: 5) Method for electrical testing of a product substrate (1), in chronological order, according to the following features:
Verbinden eines Produktsubstrat (1) mit einem Trägersubstrat (2) entsprechend den Ansprüchen 1) - 4).  Connecting a product substrate (1) to a carrier substrate (2) according to claims 1) - 4).
Zuführen des Verbundes aus Produktsubstrat (1) und Trägersubstrat (2) in eine Aufnahmevorrichtung (3)  Feeding the composite of product substrate (1) and carrier substrate (2) into a receiving device (3)
Durchführen eines elektrischen Test an dem Verbund aus Produktsubstrat (1) und Trägersubstrat (2) und Aufnahmevorrichtung (3) mittels Testvorrichtung (4) Entfernen des Verbundes aus Produktsubstrat (1) und Trägersubstrat (2) von der Aufnahmevorrichtung (3).  Performing an electrical test on the composite of product substrate (1) and carrier substrate (2) and receiving device (3) by means of a test device (4) removing the composite of product substrate (1) and carrier substrate (2) from the receiving device (3).
Lösen des Produktsubstrates (1) von dem Trägersubstrat (2)  Detaching the product substrate (1) from the carrier substrate (2)
6) Verfahren nach Anspruch 5), dadurch gekennzeichnet, das das Trägersubstrat (2) 6) Method according to claim 5), characterized in that the carrier substrate (2)
entsprechend den Ansprüchen l)-4), nach bestimmungsgemäßer Verwendung und bestimmungsgemäßer Durchführung vom Verfahren unter Anspruch 5), mit den Ihr in diesem Zustand gegebenen physikalischen, chemischen und elektrischen Eigenschaften für die bestimmungsgemäße Aufnahme eines Produktsubstrats (1) wieder verwendet werden kann.  according to claims l) -4), after proper use and proper implementation of the method under claim 5), with your given in this state physical, chemical and electrical properties for the intended inclusion of a product substrate (1) can be reused.
PCT/AT2014/000135 2013-06-28 2014-07-01 Device and method for electrically testing product substrates WO2014205465A1 (en)

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ATA537/2013A AT514514A1 (en) 2013-06-28 2013-06-28 Apparatus and method for electrical testing of product substrates

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