WO2014204242A1 - Led lighting cooling device - Google Patents

Led lighting cooling device Download PDF

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Publication number
WO2014204242A1
WO2014204242A1 PCT/KR2014/005435 KR2014005435W WO2014204242A1 WO 2014204242 A1 WO2014204242 A1 WO 2014204242A1 KR 2014005435 W KR2014005435 W KR 2014005435W WO 2014204242 A1 WO2014204242 A1 WO 2014204242A1
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WO
WIPO (PCT)
Prior art keywords
led lighting
heat
led
cooling device
fins
Prior art date
Application number
PCT/KR2014/005435
Other languages
French (fr)
Korean (ko)
Inventor
한재섭
Original Assignee
주식회사 엠티티
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Publication date
Priority claimed from KR20130071251A external-priority patent/KR20140147630A/en
Priority claimed from KR1020130103610A external-priority patent/KR101529546B1/en
Application filed by 주식회사 엠티티 filed Critical 주식회사 엠티티
Publication of WO2014204242A1 publication Critical patent/WO2014204242A1/en

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Definitions

  • the present invention relates to an LED lighting cooling device that improves air flow and facilitates manufacturing, and more particularly, adds horizontal air flow to the normal vertical air flow generated between the heat radiating fins and the heat radiating fins, respectively.
  • the heat dissipation fins of the structure that can exchange the air between the heat dissipation fins of the structure, to improve the heat dissipation performance due to natural convection compared to the same heat transfer area of the conventional, and for each LED fins cooling device easy to install will be.
  • LED Light Emitting Diode
  • LED Light Emitting Diode
  • a heat dissipation structure using a heat pipe is used, but the heat pipe heat dissipation method applied to a conventional LED lighting cooling device is evaporated even at a low temperature when a working fluid is injected into a sealed container and vacuumed. As heat is transferred by latent heat, heat resistance generated from heat exchange is minimized, and the cooling effect is increased even with a small temperature difference, and it is also used in various cooling technologies and LED lighting.
  • the heat transfer surface where the high temperature heat and the low temperature fluid is in contact with the outside of the pipe is attached to the fan can be cooled by forced convection to increase the cooling performance.
  • the present invention has been made to solve the above problems, an object of the present invention to facilitate the installation of the heat radiation fin, while providing a LED lighting cooling device that can realize productivity at all times and cost by minimizing the components for installation. There is.
  • Another object of the present invention is to add a horizontal air flow and mutual air flow in addition to the upward air flow generated in a conventional heat radiation fin to promote natural convection, thereby providing an excellent air flow heat dissipation performance.
  • the partition is installed to be divided into a plurality of vertically on the LED lighting mounting surface so that the heat generated on the LED lighting mounting surface is conducted.
  • the middle portion of the split heat dissipation fin is provided including a heat dissipation fin which is twisted at a set angle to form an air flow.
  • the middle portion of the split heat sink fin is formed by twisting a plurality of times at a predetermined angle, and is formed by twisting in the opposite inclination direction with respect to the longitudinal direction of the split heat sink fin, respectively.
  • a plurality of split radiating fins are radially installed on the LED lighting mounting surface, and a convection free space is formed in the central portion of the LED lighting device.
  • the base plate is in contact with the LED light source, the base plate is formed with a plurality of support grooves, the support It is formed in a number corresponding to the number of grooves, each side is formed with a projection, the other side is formed with a fitting groove to be fitted into the support groove is a heat dissipation fin to release heat transferred from the base plate, the heat dissipation fins
  • a fitting hole for fitting the respective protrusions is formed to be in close contact with the base plate, and is provided including a pressure fixing plate coupled to the base plate using a coupling means in the state in which the protrusion is fitted in the fitting hole.
  • the contact plate is formed to be inclined downward from both sides of the bottom of the heat sink fin, the contact plate is in close contact with the base plate.
  • the present invention by adding horizontal air flow and mutual air flow in addition to the upward air flow generated in the ordinary heat dissipation fin, the natural convection is promoted, thereby improving heat dissipation performance.
  • FIG. 1 and 2 is a perspective view of one embodiment showing a LED lighting cooling device according to the prior art.
  • Figure 3a is a schematic diagram showing a circular LED lighting cooling apparatus according to the present invention.
  • Figure 3b is a schematic diagram showing a rectangular LED lighting cooling apparatus according to the present invention.
  • Figure 3c is a plan view showing a circular LED lighting cooling apparatus according to the present invention.
  • Figure 4a is a front view showing a heat radiation fin of the LED lighting cooling apparatus according to the present invention.
  • Figure 4b is a three-dimensional view showing the heat radiation fin of the LED lighting cooling apparatus according to the present invention.
  • Figure 4c is a schematic diagram showing the assembly of the heat dissipation fin according to the present invention.
  • FIG. 5 is a perspective view showing the LED lighting cooling device according to another embodiment of the present invention.
  • FIG. 6 is a plan view of FIG. 5.
  • FIG. 7 is a cross-sectional view taken along line A-A of FIG. 6, and unnecessary portions are taken along line A-A.
  • FIG 8 is a plan view showing a base plate of the LED lighting cooling apparatus according to another embodiment of the present invention.
  • FIG. 9 is a plan view showing a pressing failure plate of the LED lighting cooling device according to another embodiment of the present invention.
  • FIG. 10 is a perspective view showing a heat radiation fin of the LED lighting cooling device according to another embodiment of the present invention.
  • FIG. 11 is a view showing the side structure of the heat radiation fin of the LED lighting cooling apparatus according to another embodiment of the present invention.
  • FIG. 12 is a view showing the assembly process of the LED lighting cooling apparatus according to another embodiment of the present invention.
  • the present invention has the following features to achieve the above object.
  • Heat radiating fins 20 are installed on the LED lighting mounting surfaces to conduct heat generated from the LED lighting mounting surfaces, and vertically divided into a plurality of heat dissipating fins, the intermediate portions of each of the divided thermal radiation fins 23 being twisted at a set angle to form an air flow. It is to provide an LED lighting cooling device that improves the air flow including).
  • the middle portion of the split radiating fin 23 is formed by twisting a plurality of times at a set angle, it is formed by twisting in the opposite inclination direction with respect to the longitudinal direction of the split radiating fin 23, respectively.
  • split heat radiation fin 23 is structurally fixed and at the same time to include a heat radiation fin 25 to include the function of the heat radiation fin.
  • a plurality of split radiating fins 23 are radially installed on the LED lighting mounting surface 201, and a convective free space 50 is formed at the center of the LED lighting device. .
  • LED lighting cooling device is composed of a LED lighting mounting portion and a heat dissipation portion.
  • the LED light mounting unit is equipped with an LED light source unit formed of a plurality of LED elements on the bottom surface, the LED light source unit can be disposed directly on the bottom surface of the LED light mounting unit, a plurality of LED elements are coupled
  • the LED light source may be mounted on the bottom surface of the LED light mounting portion.
  • the heat radiation fin 20 is installed to be in thermal contact with the upper surface of the LED light mounting surface 201, the high heat generated in the LED light source is transferred to the heat radiation fin 20, the high heat generated in the LED light source is radiated. .
  • the heat dissipation fins 20 are formed to be stacked in plural in correspondence with the LED lighting mounting surface 201 to induce heat dissipation by natural convection.
  • the heat dissipation fin 20 may be selectively configured in the shape of a round, square, pentagon, etc. as shown in Figure 2, it can quickly dissipate high heat generated in the LED light source.
  • Figure 3a is a schematic diagram showing a circular LED lighting cooling apparatus according to the present invention
  • Figure 3c is a plan view showing a circular LED lighting cooling apparatus according to the present invention, which will be described in detail as follows.
  • the heat dissipation fin 20 is installed by bending the lower end to thermally contact the LED lighting mounting surface 201, and vertically divided into a plurality of, the middle portion of each divided heat dissipation fin 23 divided by a set angle Then, the vertical air flow and the horizontal air flow of the LED lighting cooling device and the mutual air flow between each of the heat radiation fins are formed to be smooth.
  • the heat dissipation fin 20 has a structure for forming a smooth and optimal air flow with a minimum of air resistance flowing into the heat dissipation fin in the cold air to cool the lighting device of high heat by natural convection to be.
  • Figure 3b is a schematic view showing a rectangular LED lighting cooling device according to the present invention, when the LED lighting device is a quadrangle as shown in the figure, a plurality of heat radiation fins 20 in a size corresponding to the LED lighting mounting surface 201 3A, when the LED lighting apparatus is circular, as shown in FIG. 3A, a plurality of radiating fins 20 are radially installed on the LED lighting mounting surface 201, and a convection free space 50 is formed at the center portion.
  • Figure 4a is a front view showing the heat dissipation fin of the LED lighting cooling apparatus according to the present invention
  • Figure 4b is a three-dimensional view showing the heat dissipation fin of the LED lighting cooling apparatus according to the present invention
  • Figure 4c is a schematic view showing the assembly of the heat dissipation fin according to the present invention. to be.
  • the heat dissipation fin 20 according to the present invention is formed by twisting the middle portion of the split heat dissipation fin 23 at a set angle a plurality of times. It allows the air flow between them to be interchanged, and to smoothly discharge the heat radiated from the lower end to the outside.
  • edge radiating fins 25 forming the rim surface of the radiating fins to structurally fix the split radiating fins 23 to include the function of the radiating fins at the same time.
  • heat dissipation is smoothly performed due to the natural convection due to the structure of the heat dissipation fin 20, thereby minimizing efficiency deterioration due to heat generated from the LED light source unit 10.
  • the heat dissipation fins 20 are radially installed on the LED light mounting surface 201 to be mounted with the LED light source unit, for installation through holes formed in each of the heat dissipation fins 20 And corresponding to the through-holes of the LED lighting mounting surface 201 corresponding to this should be fixed with bolts, nuts, etc. This process is applied to each of the heat dissipation fins 20, so that the installation is inconvenient, it takes a long time do.
  • LED lighting cooling apparatus is a disk-shaped base plate 10, a plurality of radiating fins 20 which are radially installed on the base plate 10, the base plate 10 and Together, the plurality of heat dissipation fins 20 are composed of a pressure fixing plate 30 which is fixed to the base plate 10 at the same time.
  • FIG. 5 is a perspective view showing the LED lighting cooling apparatus according to another embodiment of the present invention
  • Figure 6 is a plan view of Figure 5
  • Figure 7 is a AA cross-sectional view of Figure 6, unnecessary parts are deleted AA cross-sectional view
  • Figure 8 9 is a plan view showing a base plate of the LED lighting cooling apparatus according to another embodiment of the present invention
  • Figure 9 is a plan view showing a pressure failure plate of the LED lighting cooling apparatus according to another embodiment of the present invention
  • Figure 10 is the present invention
  • Figure 11 is a perspective view showing a heat radiation fin of the LED lighting cooling apparatus according to another embodiment of
  • Figure 11 is a view showing the side structure of the heat radiation fin of the LED lighting cooling apparatus according to another embodiment of the present invention.
  • the base plate 10 is in contact with the LED light source of the LED lighting device, a plurality of support grooves 12 are formed in the edge as shown in FIG.
  • the heat dissipation fins 20 are formed in a number corresponding to the number of the support grooves 12, and as shown in Figure 7, each side is formed with a projection 22, the other side is fitted to the support groove 12
  • the groove 21 is formed to contact the base plate 10 to release the heat transferred from the base plate 10.
  • the heat dissipation fin 20 is vertically divided into a plurality of as shown in Figure 10, by twisting the middle portion (23a) of each divided heat dissipation fin 23 at a set angle, the vertical air flow and the horizontal of the LED lighting cooling device By forming the air flow and the mutual air flow between each of the radiating fins smoothly, to promote the natural convection, compared to the same heat transfer area of the conventional radiating fins.
  • the split radiating fins 23 are formed by twisting the middle portion 23a of the split radiating fins 23 at a set angle a plurality of times, so that the split radiating fins 23 are twisted in opposite inclination directions with respect to the longitudinal direction of the split radiating fins 23, respectively. .
  • the heat dissipation fin 20 includes a frame heat dissipation fin 25 to include a function of the heat dissipation fin while at the same time structurally fixing the split heat dissipation fin 23.
  • the heat dissipation fins 20 are installed on the base plate 10 so as to include a convection free space 50 in the central portion thereof.
  • the heat dissipation fins 20 are formed in the contact plate 24 formed to be inclined downward from both sides of the bottom of the heat dissipation fins 20 to be in close contact with the base plate 10 together with the pressure fixing plate 30 as shown in FIGS. do.
  • the pressure fixing plate 30 has a plurality of fitting holes 32 for fitting the protrusions 22 of the heat dissipation fins 20 to each other, and the heat dissipation fins 20 contacting the base plate 10 to the base plate 10.
  • the protrusion 22 of the heat dissipation fin 20 is coupled to the base plate 10 using a coupling means in a state of being fitted into the fitting hole 32.
  • FIG. 12 is a view showing the assembly process of the LED lighting cooling apparatus according to another embodiment of the present invention.
  • the projections 22 of the radiating fins 20 are arranged radially toward the center of the convective free space 50.
  • the pressure fixing plate 30 is disposed at the upper portion of the protrusion 22, and the protrusions 22 of the heat dissipation fins 20 are fitted into the fitting holes 32 of the pressure fixing plate 30.
  • the pressure fixing plate 30 presses the heat dissipation fin 20 downward, and the heat dissipation fin 20 The lower part of the) is in close contact with the base plate 10 to further improve heat dissipation efficiency.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

The present invention relates to an LED lighting cooling device that has improved air flow and is easily manufactured. The LED lighting cooling device of an LED lighting apparatus, on which a typical LED light source unit constituted by a plurality of LED devices is mounted, includes a radiation fin that is provided in the form of divided radiation fins which are vertically divided in plurality on an LED lighting mounting surface to conduct heat generated from the LED lighting mounting surface, wherein a middle portion of each of the divided radiation fins is twisted at a preset angle to form an air flow. According to the present invention, a horizontal air flow and a reciprocal air flow may be additionally added to an upward air flow that is generated in a typical radiation fin to promote natural convection, thereby improving radiation performance. Also, since the LED lighting cooling device is easily installed, the production cost and manufacturing time thereof may be reduced in comparison to LED lighting cooling devices that use existing coupling methods employing bolts, nuts, riveting, epoxy, caulking, and the like.

Description

LED조명 냉각장치LED lighting chiller
본 발명은 공기흐름을 개선하고, 제조를 용이하게 한 LED조명 냉각장치에 관한 것으로서, 보다 상세하게는 방열핀과 방열핀 사이에 발생하는 통상의 수직공기흐름에 수평공기흐름을 추가하고, 더 나이가 각각의 방열핀 사이의 공기를 상호 교환할 수 있는 구조의 방열핀을 제공하여, 종래의 동일한 전열면적 대비 자연 대류로 인한 방열 성능을 향상시킬 수 있도록 하며, 각 방열핀의 설치가 용이한 LED조명 냉각장치에 관한 것이다.The present invention relates to an LED lighting cooling device that improves air flow and facilitates manufacturing, and more particularly, adds horizontal air flow to the normal vertical air flow generated between the heat radiating fins and the heat radiating fins, respectively. The heat dissipation fins of the structure that can exchange the air between the heat dissipation fins of the structure, to improve the heat dissipation performance due to natural convection compared to the same heat transfer area of the conventional, and for each LED fins cooling device easy to install will be.
LED(Light Emitting Diode)는 광 효율이 높고 수명이 길며 환경유해물질을 사용하지 않기 때문에 차세대 친환경 광원으로서 기존 광원들을 대체할 수 있을 것으로 기대된다. LED (Light Emitting Diode) is expected to be able to replace existing light sources as next-generation eco-friendly light source because it has high light efficiency, long life and does not use environmentally harmful materials.
그러나 LED 조명은 공급된 전력 중 80% 이상이 열에너지로 전환되며, 이에 따른 온도증가가 광출력 저하 및 파장이동의 원인이 되고, 수명을 급격하게 감소시키는 것으로 알려져 있다. However, it is known that more than 80% of the power supplied to the LED light is converted to thermal energy, and the increase in temperature causes the light output to fall and the wavelength shift, and the life span is drastically reduced.
상기와 같은 문제점을 해결하기 위해, 히트파이프를 이용한 방열구조를 이용하고 있으나, 종래의 LED조명냉각장치에 적용된 히트파이프 방열방법은 밀폐된 용기 내에 작동 유체를 주입하여 진공으로 하게 되면 낮은 온도에서도 증발하여 잠열에 의해 열이 전달되는 것으로 열 교환에서 발생하는 열 저항이 최소화되어, 적은 온도차로도 냉각효과를 크게 할 수 있는 장점을 가져, 각종 냉각 기술 및 LED 조명에도 사용된다.In order to solve the above problems, a heat dissipation structure using a heat pipe is used, but the heat pipe heat dissipation method applied to a conventional LED lighting cooling device is evaporated even at a low temperature when a working fluid is injected into a sealed container and vacuumed. As heat is transferred by latent heat, heat resistance generated from heat exchange is minimized, and the cooling effect is increased even with a small temperature difference, and it is also used in various cooling technologies and LED lighting.
또한, 고온열과 저온유체가 접촉하는 전열면이 파이프 외부이므로 팬을 부착하여 강제 대류로 냉각하여 냉각 성능을 높일 수 있다.In addition, since the heat transfer surface where the high temperature heat and the low temperature fluid is in contact with the outside of the pipe is attached to the fan can be cooled by forced convection to increase the cooling performance.
하지만, LED 조명에 강제 대류를 위한 팬 등이 설치되면 조명의 사이즈가 커지고 별도의 팬 가동을 위한 전력이 소비되고, 팬에서 소음이 발생되는 문제점이 있다.However, when a fan for forced convection is installed in the LED light, the size of the light is increased, power is consumed for operating a separate fan, and noise is generated from the fan.
이와 같이, 가격 경쟁력에도 문제점이 있는 히트파이프를 이용한 방열기술을 배제하고, 또한 강제 대류 대신 자연 대류를 이용하면서도 방열 성능이 우수하고, 설치가 용이한 LED 조명의 냉각장치 개발이 절실히 요구되고 있는 실정이다.As such, there is an urgent need for the development of a cooling device for LED lighting, which is excellent in heat dissipation performance and easy to install while using natural convection instead of forced convection, except for heat dissipation technology using heat pipe, which has a problem in price competitiveness. to be.
본 발명은 상기와 같은 문제점을 해결하기 위해 안출된 것으로서, 본 발명의 목적은 방열핀 설치를 용이하게 하면서도, 설치를 위한 부품을 최소화하여 생산성 항상 및 원가절감을 실현할 수 있는 LED조명냉각장치를 제공하는 데 있다.The present invention has been made to solve the above problems, an object of the present invention to facilitate the installation of the heat radiation fin, while providing a LED lighting cooling device that can realize productivity at all times and cost by minimizing the components for installation. There is.
본 발명의 다른 목적은 통상의 방열핀에 발생되는 상향공기흐름에 추가적으로 수평공기흐름 및 상호 공기흐름을 부가하여 자연 대류를 촉진시킴으로써, 방열 성능이 우수한 공기흐름을 제공하도록 하는 데 있다.Another object of the present invention is to add a horizontal air flow and mutual air flow in addition to the upward air flow generated in a conventional heat radiation fin to promote natural convection, thereby providing an excellent air flow heat dissipation performance.
본 발명의 또 다른 목적 및 장점들은 하기에 설명될 것이며, 본 발명의 실시예에 의해 알게 될 것이다. 또한, 본 발명의 목적 및 장점들은 특허청구범위에 나타낸 수단 및 조합에 의해 실현될 수 있다.Further objects and advantages of the present invention will be described below and will be appreciated by the embodiments of the present invention. Furthermore, the objects and advantages of the present invention can be realized by means and combinations indicated in the claims.
다수의 LED 소자들로 형성되는 일반적인 LED 광원부가 장착된 LED 조명장치의 LED조명냉각장치에 있어서, LED조명 장착면에 발생되는 열이 전도되도록 상기 LED조명 장착면에 다수개로 수직 분할되도록 설치되는 분할방열핀으로서, 상기 분할방열핀의 중간부가 설정각도로 비틀어져 공기흐름이 형성되는 방열핀을 포함하여 제공된다.In the LED lighting cooling device of the LED lighting device equipped with a general LED light source formed of a plurality of LED elements, the partition is installed to be divided into a plurality of vertically on the LED lighting mounting surface so that the heat generated on the LED lighting mounting surface is conducted. As the heat dissipation fin, the middle portion of the split heat dissipation fin is provided including a heat dissipation fin which is twisted at a set angle to form an air flow.
여기서 상기 분할방열핀의 중간부를 설정각도로 다수번 비틀어서 형성하되, 분할방열핀의 길이방향에 대하여 각각 반대경사방향으로 비틀어서 형성된다.Here, the middle portion of the split heat sink fin is formed by twisting a plurality of times at a predetermined angle, and is formed by twisting in the opposite inclination direction with respect to the longitudinal direction of the split heat sink fin, respectively.
아울러, 상기 분할방열핀을 구조적으로 고정함과 동시에 방열핀의 기능을 포함하는 테두리방열핀을 더 포함하여 제공된다.In addition, at the same time structurally fixed to the split heat radiation fins are provided further comprising a heat radiation fin including the function of the heat radiation fins.
더욱이, 상기 LED조명장치가 방사형인 경우에는, 상기 LED조명 장착면에 방사상으로 상기 분할방열핀이 다수개 설치되며, 상기 LED조명장치 중앙부에는 대류여유공간이 형성된다.In addition, when the LED lighting device is radial, a plurality of split radiating fins are radially installed on the LED lighting mounting surface, and a convection free space is formed in the central portion of the LED lighting device.
다른 실시예에서는 다수의 LED 소자들로 형성되는 일반적인 LED 광원부가 장착된 LED 조명장치의 LED조명냉각장치에 있어서, 상기 LED 광원부와 접촉되며, 가장자리에는 다수개의 지지홈이 형성된 베이스판과, 상기 지지홈의 개수와 대응되는 개수로 형성되며, 각각의 일측은 돌기가 형성되고, 타측은 상기 지지홈에 끼움되는 끼움홈이 형성되어 상기 베이스판으로부터 전달되는 열이 방출되는 방열핀과, 상기 방열핀을 상기 베이스판에 밀착시키기 위해 상기 각각의 돌기가 끼움결합되기 위한 끼움홀이 형성되고, 상기 돌기가 끼움홀에 끼워진 상태로 결합수단을 이용해 상기 베이스판에 결합되는 가압고정판을 포함하여 제공된다.In another embodiment, in the LED lighting cooling device of the LED lighting apparatus equipped with a general LED light source unit formed of a plurality of LED elements, the base plate is in contact with the LED light source, the base plate is formed with a plurality of support grooves, the support It is formed in a number corresponding to the number of grooves, each side is formed with a projection, the other side is formed with a fitting groove to be fitted into the support groove is a heat dissipation fin to release heat transferred from the base plate, the heat dissipation fins A fitting hole for fitting the respective protrusions is formed to be in close contact with the base plate, and is provided including a pressure fixing plate coupled to the base plate using a coupling means in the state in which the protrusion is fitted in the fitting hole.
아울러, 상기 방열핀의 하부로부터 양측으로 하향 경사지게 형성된 밀착판이 형성되어, 상기 밀착판이 상기 베이스판에 밀착된다.In addition, the contact plate is formed to be inclined downward from both sides of the bottom of the heat sink fin, the contact plate is in close contact with the base plate.
본 발명에 의하면 통상의 방열핀에 발생되는 상향공기흐름에 추가적으로 수평공기흐름 및 상호 공기흐름을 부가하여 자연 대류를 촉진시킴으로써, 방열 성능을 향상시키는 효과가 있다.According to the present invention, by adding horizontal air flow and mutual air flow in addition to the upward air flow generated in the ordinary heat dissipation fin, the natural convection is promoted, thereby improving heat dissipation performance.
또한 설치가 용이하기 때문에 기존의 볼트,너트, 리베팅, 엑폭시, 코킹(caulking) 등의 결합방식 대비 원가가 절감되고, 제조 시간이 단축되는 등의 효과를 가진다.In addition, since it is easy to install, the cost is reduced and manufacturing time is reduced compared to the conventional coupling method of bolts, nuts, riveting, epoxy, caulking, and the like.
도 1과 도 2는 종래기술에 의한 LED 조명냉각장치를 나타낸 일실시예의 사시도이다.1 and 2 is a perspective view of one embodiment showing a LED lighting cooling device according to the prior art.
도 3a는 본 발명에 따른 원형 LED조명 냉각장치를 나타낸 개략도이다.Figure 3a is a schematic diagram showing a circular LED lighting cooling apparatus according to the present invention.
도 3b는 본 발명에 따른 사각형 LED조명 냉각장치를 나타낸 개략도이다.Figure 3b is a schematic diagram showing a rectangular LED lighting cooling apparatus according to the present invention.
도 3c는 본 발명에 따른 원형 LED조명 냉각장치를 나타낸 평면도이다.Figure 3c is a plan view showing a circular LED lighting cooling apparatus according to the present invention.
도 4a는 본 발명에 따른 LED조명 냉각장치의 방열핀을 나타낸 정면도이다.Figure 4a is a front view showing a heat radiation fin of the LED lighting cooling apparatus according to the present invention.
도 4b는 본 발명에 따른 LED조명 냉각장치의 방열핀을 나타낸 입체도이다.Figure 4b is a three-dimensional view showing the heat radiation fin of the LED lighting cooling apparatus according to the present invention.
도 4c는 본 발명에 따른 방열핀의 조립체를 나타낸 개략도이다.Figure 4c is a schematic diagram showing the assembly of the heat dissipation fin according to the present invention.
도 5는 본 발명의 다른 실시예에 따른 LED 조명냉각장치를 나타낸 사시도이다.5 is a perspective view showing the LED lighting cooling device according to another embodiment of the present invention.
도 6은 도 5의 평면도이다.6 is a plan view of FIG. 5.
도 7은 도 6의 A-A 단면도로서, 불필요한 부분은 삭제된 A-A 단면도이다.FIG. 7 is a cross-sectional view taken along line A-A of FIG. 6, and unnecessary portions are taken along line A-A.
도 8은 본 발명의 다른 실시예에 따른 LED 조명냉각장치의 베이스판을 나타낸 평면도이다.8 is a plan view showing a base plate of the LED lighting cooling apparatus according to another embodiment of the present invention.
도 9는 본 발명의 다른 실시예에 따른 LED 조명냉각장치의 가압고장판을 나타낸 평면도이다.9 is a plan view showing a pressing failure plate of the LED lighting cooling device according to another embodiment of the present invention.
도 10은 본 발명의 다른 실시예에 따른 LED 조명냉각장치의 방열핀을 나타낸 사시도이다.10 is a perspective view showing a heat radiation fin of the LED lighting cooling device according to another embodiment of the present invention.
도 11은 본 발명의 다른 실시예에 따른 LED 조명냉각장치의 방열핀의 측면구조를 도시한 도면이다.11 is a view showing the side structure of the heat radiation fin of the LED lighting cooling apparatus according to another embodiment of the present invention.
도 12는 본 발명의 다른 실시예에 따른 LED 조명냉각장치의 조립과정을 나타낸 도면이다.12 is a view showing the assembly process of the LED lighting cooling apparatus according to another embodiment of the present invention.
본 발명의 여러 실시예들을 상세히 설명하기 전에, 다음의 상세한 설명에 기재되거나 도면에 도시된 구성요소들의 구성 및 배열들의 상세로 그 응용이 제한되는 것이 아니라는 것을 알 수 있을 것이다. 본 발명은 다마른 실시예들로 구현되고 실시될 수 있고 다양한 방법으로 수행될 수 있다. 또, 장치 또는 요소 방향(예를 들어 "전(front)", "후(back)", "위(up)", "아래(down)", "상(top)", "하(bottom)", "좌(left)", "우(right)", "횡(lateral)")등과 같은 용어들에 관하여 본원에 사용된 표현 및 술어는 단지 본 발명의 설명을 단순화하기 위해 사용되고, 관련된 장치 또는 요소가 단순히 특정 방향을 가져야 함을 나타내거나 의미하지 않는다는 것을 알 수 있을 것이다. 또한, "제 1(first)", "제 2(second)", 및 "제 3(third)"과 같은 용어는 설명을 위해 본원 및 첨부 청구항들에 사용되고 상대적인 중요성 또는 취지를 나타내거나 의미하는 것으로 의도되지 않는다.Before describing the various embodiments of the present invention in detail, it will be appreciated that the application is not limited to the details of construction and arrangement of components described in the following detailed description or illustrated in the drawings. The invention can be implemented and practiced in different embodiments and can be carried out in various ways. In addition, device or element orientation (e.g., "front", "back", "up", "down", "top", "bottom" The expressions and predicates used herein with respect to terms such as "," "left", "right", "lateral", etc. are used merely to simplify the description of the present invention, and related apparatus. Or it will be appreciated that the element does not simply indicate or mean that it should have a particular direction. Also, terms such as “first”, “second”, and “third” are used in the present specification and in the appended claims for the purpose of explanation or to indicate or mean relative importance or intent. It is not intended.
본 발명은 상기의 목적을 달성하기 위해 아래의 특징을 갖는다.The present invention has the following features to achieve the above object.
이하 첨부된 도면을 참조로 본 발명의 바람직한 실시예를 상세히 설명하도록 한다. 이에 앞서, 본 명세서 및 청구범위에 사용된 용어나 단어는 통상적이거나 사전적인 의미로 한정해서 해석되어서는 아니 되며, 발명자는 그 자신의 발명을 가장 최선의 방법으로 설명하기 위해 용어의 개념을 적절하게 정의할 수 있다는 원칙에 입각하여 본 발명의 기술적 사상에 부합하는 의미와 개념으로 해석되어야만 한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, terms or words used in the present specification and claims should not be construed as being limited to the common or dictionary meanings, and the inventors should properly explain the concept of terms in order to best explain their own invention. Based on the principle that can be defined, it should be interpreted as meaning and concept corresponding to the technical idea of the present invention.
따라서, 본 명세서에 기재된 실시예와 도면에 도시된 구성은 본 발명의 가장 바람직한 일 실시예에 불과할 뿐이고 본 발명의 기술적 사상을 모두 대변하는 것은 아니므로, 본 출원시점에 있어서 이들을 대체할 수 있는 다양한 균등물과 변형 예들이 있을 수 있음을 이해하여야 한다. Therefore, the embodiments described in the specification and the drawings shown in the drawings are only the most preferred embodiment of the present invention and do not represent all of the technical idea of the present invention, various modifications that can be replaced at the time of the present application It should be understood that there may be equivalents and variations.
이를 위한 본 발명의 일실시예를 살펴보면,Looking at one embodiment of the present invention for this purpose,
다수의 LED 소자들로 형성되는 일반적인 LED 광원부가 장착된 LED 조명장치의 LED조명냉각장치에 있어서,In the LED lighting cooling device of the LED lighting device equipped with a general LED light source formed of a plurality of LED elements,
LED조명 장착면에 발생되는 열이 전도되도록 상기 LED조명 장착면에 설치되고, 다수개로 수직분할시키되, 분할된 각각의 분할방열핀(23)의 중간부가 설정각도로 비틀어져 공기흐름이 형성되는 방열핀(20)을 포함하는 공기흐름을 개선한 LED조명 냉각장치를 제공하는 것이다. Heat radiating fins 20 are installed on the LED lighting mounting surfaces to conduct heat generated from the LED lighting mounting surfaces, and vertically divided into a plurality of heat dissipating fins, the intermediate portions of each of the divided thermal radiation fins 23 being twisted at a set angle to form an air flow. It is to provide an LED lighting cooling device that improves the air flow including).
또한, 상기 분할방열핀(23)의 중간부를 설정각도로 다수번 비틀어서 형성하되, 분할방열핀(23)의 길이방향에 대하여 각각 반대경사방향으로 비틀어서 형성되는 것이다.In addition, the middle portion of the split radiating fin 23 is formed by twisting a plurality of times at a set angle, it is formed by twisting in the opposite inclination direction with respect to the longitudinal direction of the split radiating fin 23, respectively.
또한, 상기 분할방열핀(23)을 구조적으로 고정함과 동시에 방열핀의 기능을 포함하도록 테두리방열핀(25)을 더 포함하는 것이다. In addition, the split heat radiation fin 23 is structurally fixed and at the same time to include a heat radiation fin 25 to include the function of the heat radiation fin.
또한, 상기 LED조명장치가 방사형인 경우에, 상기 LED조명 장착면(201)에 방사상으로 상기 분할방열핀(23)이 다수개 설치되며, 상기 LED조명장치 중앙부는 대류여유공간(50)이 형성된다. In addition, when the LED lighting device is radial, a plurality of split radiating fins 23 are radially installed on the LED lighting mounting surface 201, and a convective free space 50 is formed at the center of the LED lighting device. .
이하, 도 1 내지 도 4를 참조하여 본 발명의 바람직한 일실시예에 따른 LED조명 냉각장치에 대해 상세히 설명하도록 한다.Hereinafter, an LED lighting cooling apparatus according to an exemplary embodiment of the present invention will be described in detail with reference to FIGS. 1 to 4.
도 1과 도 2는 종래기술에 의한 LED 조명냉각장치를 나타낸 일실시예의 사시도로서, 일반적으로 LED조명 냉각장치는 LED 조명장착부와 방열부로 이루어진다.1 and 2 is a perspective view of one embodiment showing a LED lighting cooling device according to the prior art, generally LED lighting cooling device is composed of a LED lighting mounting portion and a heat dissipation portion.
상기 LED 조명장착부는 하단면에 다수의 LED 소자들로 형성되는 LED 광원부가 장착되고, LED 광원부는 다수의 LED 소자들이 LED 조명장착부의 하단면에 직접 배치될 수 있고, 다수의 LED 소자들이 결합된 LED 광원부가 상기 LED 조명장착부는 하단면에 장착될 수 있다. The LED light mounting unit is equipped with an LED light source unit formed of a plurality of LED elements on the bottom surface, the LED light source unit can be disposed directly on the bottom surface of the LED light mounting unit, a plurality of LED elements are coupled The LED light source may be mounted on the bottom surface of the LED light mounting portion.
도 1을 살펴보면, 방열핀(20)은 LED 조명장착면(201)의 상면에 열적으로 접촉되도록 설치되어, LED 광원부에서 발생하는 고열이 방열핀(20)으로 전달되어, LED 광원부에서 발생한 고열이 방열된다.1, the heat radiation fin 20 is installed to be in thermal contact with the upper surface of the LED light mounting surface 201, the high heat generated in the LED light source is transferred to the heat radiation fin 20, the high heat generated in the LED light source is radiated. .
상기의 방열핀(20)이 LED 조명장착면(201)에 대응되게 다수개로 적층되도록 형성되어, 자연대류에 의하여 방열을 유도하도록 한다. 또한, 상기 방열핀(20)은 도 2에서와 같이 선택적으로 둥근형, 사각형, 오각형 등의 형상으로 구성될 수 있으며, LED 광원부에서 발생한 고열을 신속하게 방열할 수 있다.The heat dissipation fins 20 are formed to be stacked in plural in correspondence with the LED lighting mounting surface 201 to induce heat dissipation by natural convection. In addition, the heat dissipation fin 20 may be selectively configured in the shape of a round, square, pentagon, etc. as shown in Figure 2, it can quickly dissipate high heat generated in the LED light source.
그러나, 도1 또는 도2에 의한 종래기술은 방열을 위한 공기흐름이 단지 방열핀과 방열핀사이의 수직공간에 의한 수직공기흐름에 의해 이루어지는 것으로서, 이러한 수직공기채널에 의한 자연대류만으로 LED조명에서 발생되는 고열을 냉각시키기에는 그 방열효과는 기대치 이하인 경우가 발생하게 된다.However, the prior art according to Figure 1 or 2 is that the air flow for heat dissipation is made only by the vertical air flow by the vertical space between the heat dissipation fin and the heat dissipation fin, which is generated in the LED lighting only by natural convection by the vertical air channel In order to cool high heat, the heat radiation effect may be less than expected.
이에 본 발명에서는 방열효과를 높이기 위해 공기흐름을 다양하게 형성하도록 한다.Therefore, in the present invention, to form a variety of air flow to increase the heat dissipation effect.
아래의 도 3에서 도 4를 통해 방열효과를 높이기 위한 본 발명에 따른 LED조명 냉각장치의 구조에 대해 더욱 자세히 설명하도록 한다.3 to 4 will be described in more detail with respect to the structure of the LED lighting cooling apparatus according to the present invention for increasing the heat dissipation effect.
도 3a는 본 발명에 따른 원형 LED조명 냉각장치를 나타낸 개략도이고, 도 3c는 본 발명에 따른 원형 LED조명 냉각장치를 나타낸 평면도로서, 이를 상세히 설명하면 다음과 같다.Figure 3a is a schematic diagram showing a circular LED lighting cooling apparatus according to the present invention, Figure 3c is a plan view showing a circular LED lighting cooling apparatus according to the present invention, which will be described in detail as follows.
본 발명에 의한 방열핀(20)은 LED조명장착면(201)에 열적으로 접촉하도록 하단부가 절곡되어 설치되고, 다수개로 수직분할시키되, 분할된 각각의 분할방열핀(23)의 중간부를 설정각도로 비틀어서, 상기 LED조명냉각장치의 수직공기흐름과 수평공기흐름 및 각각의 방열핀 사이의 상호공기흐름이 원활하도록 형성한다.The heat dissipation fin 20 according to the present invention is installed by bending the lower end to thermally contact the LED lighting mounting surface 201, and vertically divided into a plurality of, the middle portion of each divided heat dissipation fin 23 divided by a set angle Then, the vertical air flow and the horizontal air flow of the LED lighting cooling device and the mutual air flow between each of the heat radiation fins are formed to be smooth.
이러한 본 발명에 따른 방열핀(20)은 고열의 조명장치를 자연대류에 의하여 냉각시키는데 있어서, 주의의 찬 공기가 방열핀 내부로 유입되는 공기저항을 최소로 한 원할한 최적의 공기흐름을 형성시키기 위한 구조이다.The heat dissipation fin 20 according to the present invention has a structure for forming a smooth and optimal air flow with a minimum of air resistance flowing into the heat dissipation fin in the cold air to cool the lighting device of high heat by natural convection to be.
도 3b는 본 발명에 따른 사각형 LED조명 냉각장치를 나타낸 개략도로서, 도면에서와 같이 LED조명장치가 사각형인 경우에는, LED조명 장착면(201)에 대응되는 크기로 상기 방열핀(20)이 다수개 설치되며, 도 3a에서와 같이 LED조명장치가 원형인 경우에는, LED조명 장착면(201)에 방사상으로 방열핀(20)이 다수개 설치되며, 중앙부에는 대류여유공간(50)이 형성되도록 한다. Figure 3b is a schematic view showing a rectangular LED lighting cooling device according to the present invention, when the LED lighting device is a quadrangle as shown in the figure, a plurality of heat radiation fins 20 in a size corresponding to the LED lighting mounting surface 201 3A, when the LED lighting apparatus is circular, as shown in FIG. 3A, a plurality of radiating fins 20 are radially installed on the LED lighting mounting surface 201, and a convection free space 50 is formed at the center portion.
도 4a는 본 발명에 따른 LED조명 냉각장치의 방열핀을 나타낸 정면도이고, 도 4b는 본 발명에 따른 LED조명 냉각장치의 방열핀을 나타낸 입체도이고, 도 4c는 본 발명에 따른 방열핀의 조립체를 나타낸 개략도이다.Figure 4a is a front view showing the heat dissipation fin of the LED lighting cooling apparatus according to the present invention, Figure 4b is a three-dimensional view showing the heat dissipation fin of the LED lighting cooling apparatus according to the present invention, Figure 4c is a schematic view showing the assembly of the heat dissipation fin according to the present invention. to be.
본 발명에 따른 방열핀(20)은 분할방열핀(23)의 중간부를 설정각도로 다수번 비틀어서 형성시키며, 분할방열핀(23)의 길이방향에 대하여 각각 반대경사방향으로 비틀어서, 수평공기흐름 및 방열핀사이의 공기흐름을 상호 교환될 수 있도록 하며, 하단부로부터 방열된 공기들을 원활하게 외부로 방출시킬 수 있도록 한다.The heat dissipation fin 20 according to the present invention is formed by twisting the middle portion of the split heat dissipation fin 23 at a set angle a plurality of times. It allows the air flow between them to be interchanged, and to smoothly discharge the heat radiated from the lower end to the outside.
또한, 방열핀의 태두리면을 형성하는 테두리방열핀(25)을 형성하여 분할방열핀(23)을 구조적으로 고정함에 동시에 방열핀의 기능을 포함하도록 한다.In addition, by forming the edge radiating fins 25 forming the rim surface of the radiating fins to structurally fix the split radiating fins 23 to include the function of the radiating fins at the same time.
상기와 같이 방열핀(20)의 구조에 의해 자연 대류로 인해 열교환이 원활하게 이루어져 LED 광원부(10)에서 발생되는 열에 의한 효율 저하 현상을 최소화할 수 있다.As described above, heat dissipation is smoothly performed due to the natural convection due to the structure of the heat dissipation fin 20, thereby minimizing efficiency deterioration due to heat generated from the LED light source unit 10.
또한, 자연 대류에 의한 열 교환이 원활하게 이루어는 구조로서 빛에 의한 상승 온도를 대기온도에 신속하게 다중 분산시키도록 하여 광원장치의 성능향상과 수명연장이 이루어질 수 있어 팬 등의 강제 대류를 이용함으로써 나타날 수 있는 대형화, 소음문제, 전원 공급 문제 등을 해결할 수 있다.In addition, heat exchange by natural convection is performed smoothly, so that the rising temperature caused by light can be multi-dispersed quickly to the air temperature, and the performance of the light source device can be improved and the life can be extended. It can solve the problem of enlargement, noise, and power supply.
아래에서는 상기와 같은 방열핀의 설치를 용이하도록 하는 LED조명 냉각장치에 대해 자세히 설명하도록 한다.Below will be described in detail with respect to the LED lighting cooling device to facilitate the installation of the heat radiation fin as described above.
전술한 도 1에서 종래기술에 따른 LED조명냉각장치에서는 LED 광원부가 장착될 LED조명장착면(201)에 방열핀(20)이 방사상으로 설치되는데, 설치를 위해서는 각각의 방열핀(20)에 형성된 관통공 및 이와 대응되는 LED조명장착면(201)의 관통공을 일치시켜 볼트, 너트 등으로 고정해야하고, 이러한 과정은 각각의 방열핀(20)에 모두 적용되기에 설치가 불편하고, 작업시간도 오래 걸리게 된다.In the above-described LED lighting device according to the prior art in Figure 1, the heat dissipation fins 20 are radially installed on the LED light mounting surface 201 to be mounted with the LED light source unit, for installation through holes formed in each of the heat dissipation fins 20 And corresponding to the through-holes of the LED lighting mounting surface 201 corresponding to this should be fixed with bolts, nuts, etc. This process is applied to each of the heat dissipation fins 20, so that the installation is inconvenient, it takes a long time do.
이에 반해, 본 발명의 다른 실시예에 따른 LED조명냉각장치는 원판형의 베이스판(10)과, 베이스판(10)에 방사상으로 설치되는 다수개의 방열핀(20)과, 베이스판(10)과 함께 다수개의 방열핀(20)을 베이스판(10)에 동시에 밀착 고정시키는 가압고정판(30)으로 구성되어 있어, 종래에 비해 설치가 용이하여 생산성이 향상된다.On the other hand, LED lighting cooling apparatus according to another embodiment of the present invention is a disk-shaped base plate 10, a plurality of radiating fins 20 which are radially installed on the base plate 10, the base plate 10 and Together, the plurality of heat dissipation fins 20 are composed of a pressure fixing plate 30 which is fixed to the base plate 10 at the same time.
구체적으로, 도 5 내지 도 12를 참조하여 본 발명의 다른 실시예를 통해 방열핀의 설치관계에 대해 자세히 설명하도록 한다.Specifically, with reference to Figures 5 to 12 to be described in detail with respect to the installation relationship of the heat radiation fins through another embodiment of the present invention.
도 5는 본 발명의 다른 실시예에 따른 LED 조명냉각장치를 나타낸 사시도이고, 도 6은 도 5의 평면도이고, 도 7은 도 6의 A-A 단면도로서, 불필요한 부분은 삭제된 A-A 단면도이고, 도 8은 본 발명의 다른 실시예에 따른 LED 조명냉각장치의 베이스판을 나타낸 평면도이고, 도 9는 본 발명의 다른 실시예에 따른 LED 조명냉각장치의 가압고장판을 나타낸 평면도이고, 도 10은 본 발명의 다른 실시예에 따른 LED 조명냉각장치의 방열핀을 나타낸 사시도이고, 도 11은 본 발명의 다른 실시예에 따른 LED 조명냉각장치의 방열핀의 측면구조를 도시한 도면이다.5 is a perspective view showing the LED lighting cooling apparatus according to another embodiment of the present invention, Figure 6 is a plan view of Figure 5, Figure 7 is a AA cross-sectional view of Figure 6, unnecessary parts are deleted AA cross-sectional view, Figure 8 9 is a plan view showing a base plate of the LED lighting cooling apparatus according to another embodiment of the present invention, Figure 9 is a plan view showing a pressure failure plate of the LED lighting cooling apparatus according to another embodiment of the present invention, Figure 10 is the present invention Figure 11 is a perspective view showing a heat radiation fin of the LED lighting cooling apparatus according to another embodiment of, Figure 11 is a view showing the side structure of the heat radiation fin of the LED lighting cooling apparatus according to another embodiment of the present invention.
도면을 참조하면, 베이스판(10)은 LED조명장치의 LED 광원부와 접촉되며, 도 8에서와 같이 가장자리에는 다수개의 지지홈(12)이 형성된다.Referring to the drawings, the base plate 10 is in contact with the LED light source of the LED lighting device, a plurality of support grooves 12 are formed in the edge as shown in FIG.
방열핀(20)은 지지홈(12)의 개수와 대응되는 개수로 형성되며, 도 7에서와 같이 각각의 일측은 돌기(22)가 형성되고, 타측은 상기 지지홈(12)에 끼움결합되는 끼움홈(21)이 형성되어 상기 베이스판(10)에 접촉됨으로써 베이스판(10)으로부터 전달된 열을 방출하게 된다.The heat dissipation fins 20 are formed in a number corresponding to the number of the support grooves 12, and as shown in Figure 7, each side is formed with a projection 22, the other side is fitted to the support groove 12 The groove 21 is formed to contact the base plate 10 to release the heat transferred from the base plate 10.
이러한 방열핀(20)은 도 10에서와 같이 다수개로 수직분할시키되, 분할된 각각의 분할방열핀(23)의 중간부(23a)를 설정각도로 비틀어서, 상기 LED조명냉각장치의 수직공기흐름과 수평공기흐름 및 각각의 방열핀 사이의 상호공기흐름을 원활하도록 형성하여, 종래 방열핀의 동일한 전열면적 대비, 자연 대류를 촉진시키도록 한다.The heat dissipation fin 20 is vertically divided into a plurality of as shown in Figure 10, by twisting the middle portion (23a) of each divided heat dissipation fin 23 at a set angle, the vertical air flow and the horizontal of the LED lighting cooling device By forming the air flow and the mutual air flow between each of the radiating fins smoothly, to promote the natural convection, compared to the same heat transfer area of the conventional radiating fins.
한편, 분할방열핀(23)은 분할방열핀(23)의 중간부(23a)를 설정각도로 다수번 비틀어서 형성하되, 분할방열핀(23)의 길이방향에 대하여 각각 반대경사방향으로 비틀어서 형성되도록 한다.On the other hand, the split radiating fins 23 are formed by twisting the middle portion 23a of the split radiating fins 23 at a set angle a plurality of times, so that the split radiating fins 23 are twisted in opposite inclination directions with respect to the longitudinal direction of the split radiating fins 23, respectively. .
그리고 방열핀(20)은 분할방열핀(23)을 구조적으로 고정함에 동시에 방열핀의 기능을 포함하도록 테두리방열핀(25)을 포함한다. And the heat dissipation fin 20 includes a frame heat dissipation fin 25 to include a function of the heat dissipation fin while at the same time structurally fixing the split heat dissipation fin 23.
아울러 도 7에서와 같이 베이스판(10)이 원형판인 경우에는 방열핀(20)을 베이스판(10)에 방사상으로 중앙부에 대류여유공간(50)을 포함하도록 설치된다.In addition, as shown in FIG. 7, when the base plate 10 is a circular plate, the heat dissipation fins 20 are installed on the base plate 10 so as to include a convection free space 50 in the central portion thereof.
또한, 상기 방열핀(20)은 도 10,11에서와 같이 가압고정판(30)과 함께 베이스판(10)에 더욱 밀착되도록 방열핀(20)의 하부로부터 양측으로 하향 경사지게 형성된 밀착판(24)이 형성된다.In addition, the heat dissipation fins 20 are formed in the contact plate 24 formed to be inclined downward from both sides of the bottom of the heat dissipation fins 20 to be in close contact with the base plate 10 together with the pressure fixing plate 30 as shown in FIGS. do.
가압고정판(30)은 방열핀(20)의 돌기(22)가 끼움결합되기 위한 다수개의 끼움홀(32)이 형성되고, 베이스판(10)에 접촉된 방열핀(20)을 베이스판(10)에 더욱 더 밀착시키기 위해, 방열핀(20)의 돌기(22)를 끼움홀(32)에 끼운 상태로 결합수단을 이용하여 베이스판(10)에 결합시킨다.The pressure fixing plate 30 has a plurality of fitting holes 32 for fitting the protrusions 22 of the heat dissipation fins 20 to each other, and the heat dissipation fins 20 contacting the base plate 10 to the base plate 10. In order to be in close contact with each other, the protrusion 22 of the heat dissipation fin 20 is coupled to the base plate 10 using a coupling means in a state of being fitted into the fitting hole 32.
상기와 같이 가압고정판(30)을 포함하는 LED 조명냉각장치의 조립과정을 도면을 참조하여 더욱 자세히 설명하도록 한다.The assembly process of the LED lighting cooling device including the pressure fixing plate 30 as described above will be described in more detail with reference to the accompanying drawings.
도 12는 본 발명의 다른 실시예에 따른 LED 조명냉각장치의 조립과정을 나타낸 도면이다.12 is a view showing the assembly process of the LED lighting cooling apparatus according to another embodiment of the present invention.
도면을 참조하면, 먼저 베이스판(10)의 가장자리에 마련된 지지홈(12)에 방열핀(20)의 끼움홈(21)을 끼움결합시켜 방사상으로 다수개 설치한다.Referring to the drawings, first, by inserting the fitting groove 21 of the heat radiation fin 20 into the support groove 12 provided on the edge of the base plate 10 to install a plurality of radial.
이때에, 상기 방열핀(20)을 방사상으로 결합시키면 대류여유공간(50) 중심측으로 각 방열핀(20)의 돌기(22)가 방사상으로 배열된다.At this time, when the radiating fins 20 are radially coupled, the projections 22 of the radiating fins 20 are arranged radially toward the center of the convective free space 50.
그리고 돌기(22)의 상부에서 가압고정판(30)을 배치시키고, 각 방열핀(20)의 돌기(22)를 가압고정판(30)의 끼움홀(32)에 끼움결합시킨다.Then, the pressure fixing plate 30 is disposed at the upper portion of the protrusion 22, and the protrusions 22 of the heat dissipation fins 20 are fitted into the fitting holes 32 of the pressure fixing plate 30.
그런 다음, 볼트(31)와 베이스판(10)에 내설된 암나사(11)를 이용하여 볼트(31)를 조이게 되면 가압고정판(30)이 방열핀(20)을 하방으로 가압하게 되어, 방열핀(20)의 하부가 베이스판(10)에 밀착되어 열 방출 효율이 더욱 더 향상된다.Then, when the bolt 31 is tightened using the internal thread 11 installed in the bolt 31 and the base plate 10, the pressure fixing plate 30 presses the heat dissipation fin 20 downward, and the heat dissipation fin 20 The lower part of the) is in close contact with the base plate 10 to further improve heat dissipation efficiency.
이상 본 발명이 양호한 실시예와 관련하여 설명되었으나, 본 발명의 기술 분야에 속하는 자들은 본 발명의 본질적인 특성에서 벗어나지 않는 범위 내에 다양한 변경 및 수정을 용이하게 실시할 수 있을 것이다. 그러므로 개시된 실시예는 한정적인 관점이 아니라 설명적인 관점에서 고려되어야 하고, 본 발명의 진정한 범위는 전술한 설명이 아니라 특허청구범위에 나타나 있으며, 그와 동등한 범위 내에 있는 모든 차이점은 본 발명에 포함된 것으로 해석되어야 할 것이다.Although the present invention has been described in connection with the preferred embodiment, those skilled in the art will be able to easily make various changes and modifications without departing from the essential characteristics of the present invention. Therefore, the disclosed embodiments should be considered in descriptive sense only and not for purposes of limitation, and the true scope of the present invention is shown in the claims rather than the foregoing description, and all differences within the equivalent scope are included in the present invention. Should be interpreted as.

Claims (6)

  1. 다수의 LED 소자들로 형성되는 일반적인 LED 광원부가 장착된 LED 조명장치의 LED조명냉각장치에 있어서,In the LED lighting cooling device of the LED lighting device equipped with a general LED light source formed of a plurality of LED elements,
    LED조명 장착면에 발생되는 열이 전도되도록 LED조명 장착면에 설치되고, 다수개로 수직분할시키되, 분할된 각각의 분할방열핀의 중간부가 설정각도로 비틀어져 공기흐름이 형성되는 방열핀을;Heat radiating fins installed on the LED lighting mounting surfaces to conduct heat generated from the LED lighting mounting surfaces and vertically divided into a plurality of heat dissipating fins, each of which is divided by an intermediate portion of the divided heat radiating fins at a set angle;
    포함하는 것을 특징으로 하는 LED조명 냉각장치.LED lighting chiller comprising a.
  2. 제1항에 있어서,The method of claim 1,
    상기 분할방열핀의 중간부를 설정각도로 다수번 비틀어서 형성하되, 분할방열핀의 길이방향에 대하여 각각 반대경사방향으로 비틀어서 형성되는 것을 특징으로 하는 LED조명 냉각장치.The intermediate portion of the split heat sink fin is formed by twisting a plurality of times at a predetermined angle, LED lighting cooling device, characterized in that formed by twisting in the opposite inclination direction with respect to the longitudinal direction of the split heat sink fin, respectively.
  3. 제2항에 있어서,The method of claim 2,
    상기 분할방열핀을 구조적으로 고정함과 동시에 방열핀의 기능을 포함하는 테두리방열핀을 더 포함하는 것을 특징으로 하는 LED조명 냉각장치.LED lighting cooling device further comprises a structural heat-fixing fins having a function of the heat radiation fins and structurally fixing the split heatsink.
  4. 제2항 또는 제3항에 있어서,The method according to claim 2 or 3,
    상기 LED조명장치가 방사형인 경우에는, 상기 LED조명 장착면에 방사상으로 상기 분할방열핀이 다수개 설치되며, 상기 LED조명장치 중앙부에는 대류여유공간(231)이 형성되는 것을 특징으로 하는 LED조명 냉각장치.When the LED lighting device is radial, a plurality of split radiating fins are radially installed on the LED lighting mounting surface, and a convection free space 231 is formed in the central portion of the LED lighting device. .
  5. 다수의 LED 소자들로 형성되는 일반적인 LED 광원부가 장착된 LED 조명장치의 LED조명냉각장치에 있어서,In the LED lighting cooling device of the LED lighting device equipped with a general LED light source formed of a plurality of LED elements,
    상기 LED 광원부와 접촉되며, 가장자리에는 다수개의 지지홈이 형성된 베이스판과;A base plate in contact with the LED light source and having a plurality of support grooves formed at an edge thereof;
    상기 지지홈의 개수와 대응되는 개수로 형성되며, 각각의 일측은 돌기가 형성되고, 타측은 상기 지지홈에 끼움되는 끼움홈이 형성되어 상기 베이스판으로부터 전달되는 열이 방출되는 방열핀과;A heat dissipation fin formed in a number corresponding to the number of the supporting grooves, each of which has a protrusion formed thereon, and the other side of which has a fitting groove which is fitted into the supporting groove to discharge heat transferred from the base plate;
    상기 방열핀을 상기 베이스판에 밀착시키기 위해 상기 각각의 돌기가 끼움결합되기 위한 끼움홀이 형성되고, 상기 돌기가 끼움홀에 끼워진 상태로 결합수단을 이용해 상기 베이스판에 결합되는 가압고정판;A pressure fixing plate coupled to the base plate using a coupling means in a state in which fitting holes for fitting the respective protrusions are formed to closely contact the heat dissipation fins to the base plate, and the protrusions are fitted in the fitting holes;
    을 포함하는 것을 특징으로 하는 LED조명 냉각장치.LED lighting cooling apparatus comprising a.
  6. 제 5항에 있어서,The method of claim 5,
    상기 방열핀의 하부로부터 양측으로 하향 경사지게 형성된 밀착판이 형성되어, 상기 밀착판이 상기 베이스판에 밀착되는 것을 특징으로 하는 LED조명 냉각장치.LED lighting cooling device, characterized in that the contact plate formed to be inclined downward from both sides of the bottom of the heat radiation fin, the contact plate is in close contact with the base plate.
PCT/KR2014/005435 2013-06-20 2014-06-19 Led lighting cooling device WO2014204242A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20130071251A KR20140147630A (en) 2013-06-20 2013-06-20 LED cooling device of air flow type
KR10-2013-0071251 2013-06-20
KR1020130103610A KR101529546B1 (en) 2013-08-30 2013-08-30 LED cooling device of air flow type
KR10-2013-0103610 2013-08-30

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WO2014204242A1 true WO2014204242A1 (en) 2014-12-24

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101047757B1 (en) * 2010-01-19 2011-07-07 권병일 Heatsink for lamp
KR101048454B1 (en) * 2009-03-24 2011-07-12 주식회사 엠티티 Cooling device for LED lighting using heat pipe
KR101240908B1 (en) * 2011-06-09 2013-03-11 주식회사 파인테크닉스 LED illuminator

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101048454B1 (en) * 2009-03-24 2011-07-12 주식회사 엠티티 Cooling device for LED lighting using heat pipe
KR101047757B1 (en) * 2010-01-19 2011-07-07 권병일 Heatsink for lamp
KR101240908B1 (en) * 2011-06-09 2013-03-11 주식회사 파인테크닉스 LED illuminator

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