WO2014203554A1 - Resin-sealed sensor device - Google Patents

Resin-sealed sensor device Download PDF

Info

Publication number
WO2014203554A1
WO2014203554A1 PCT/JP2014/052603 JP2014052603W WO2014203554A1 WO 2014203554 A1 WO2014203554 A1 WO 2014203554A1 JP 2014052603 W JP2014052603 W JP 2014052603W WO 2014203554 A1 WO2014203554 A1 WO 2014203554A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin
pad
sensor device
suspension
sealed
Prior art date
Application number
PCT/JP2014/052603
Other languages
French (fr)
Japanese (ja)
Inventor
矢口　昭弘
雅秀 林
Original Assignee
日立オートモティブシステムズ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立オートモティブシステムズ株式会社 filed Critical 日立オートモティブシステムズ株式会社
Priority to DE112014002924.6T priority Critical patent/DE112014002924T5/en
Priority to US14/899,263 priority patent/US20160146849A1/en
Publication of WO2014203554A1 publication Critical patent/WO2014203554A1/en

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5783—Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed

Definitions

  • a sensor element such as an inertial force sensor for detecting acceleration or angular velocity, or an inertial force sensor in which a plurality of acceleration / angular velocity detectors are combined, and a circuit board on which the sensor element is mounted by resin molding or the like.
  • the present invention relates to a resin-sealed inertial force sensor device formed by stopping and forming a package.
  • acceleration sensors and angular velocity sensors are particularly widespread for controlling equipment (for example, airbags) for preventing skidding and improving passenger safety.
  • the sensor device will be installed in the engine room when applied to automobiles, so it is necessary to withstand severe environmental loads such as heat changes and mechanical vibrations, and it is installed in a limited space. In order to make this possible, it is essential to reduce the size of the sensor device itself.
  • inertial force sensors are used for posture control (for example, for horizontal control) of attached accessories in order to perform stable work on slopes.
  • the acceleration sensors and angular velocity sensors mounted on the various sensor devices described above are designed to be miniaturized, multi-functional and complex, and to improve mass productivity.
  • Silicon (Si) micromachining technology (MEMS: Micro Electro) Detection methods using Mechanical Systems are becoming mainstream.
  • a silicon fine comb-like structure is formed by a microfabrication technique, and a physical quantity such as acceleration or angular velocity is detected by converting a minute displacement of the comb-like structure into an electric signal.
  • a circuit board for example, LSI board
  • LSI board that processes signals from the sensor and controls signal input / output with the outside
  • the sensor is mounted on the board, and the sensor and circuit board are mounted on the pad (tab). Leads that transmit electrical signals to the outside are connected to the pad and then sealed with resin.
  • the pad and the lead are integrally formed as a lead frame, and after the package is formed of resin, the lead is an inner lead in the package and an outer lead protruding outside the package. On the other hand, the pad is held on the lead frame by the suspension leads.
  • resin packaging of inertial force sensors a resin-sealed package by a transfer mold method is generally used.
  • a circuit board and an inertial force sensor element are mounted on a pad via an adhesive (including an adhesive film such as DAF (die attach film)), and after these are bonded, a thin metal wire ( Wires are electrically connected between the inertial force sensor element and the circuit board, and between the circuit board and the inner lead.
  • an adhesive including an adhesive film such as DAF (die attach film)
  • Wires are electrically connected between the inertial force sensor element and the circuit board, and between the circuit board and the inner lead.
  • the assembly is placed in a mold, resin is injected from one end of the mold, and the resin is cured to form a resin-sealed package.
  • unnecessary portions such as the outer frame of the lead frame other than the outer leads are cut and removed, and the outer lead is processed into a predetermined shape to manufacture a resin-sealed sensor device.
  • This imbalance of the resin flow causes a distribution in the pressure due to the resin flow acting on the sensor element and the circuit board surface, and if the suspension lead cannot withstand this pressure distribution, the pad moves in the vertical direction (the thickness direction of the member). fluctuate. Due to this variation, the resin may be cured and packaged while the sensor element is tilted from the horizontal.
  • the inertial force sensor element of acceleration or angular velocity is mounted in a state tilted from the horizontal, the sensor output will drop by that tilt angle (If the tilt angle is ⁇ , it will be 1 / cos ⁇ lower). This is a factor that hinders the stability of the sensor.
  • Patent Documents 1 and 2 disclose sensor devices that take into account the prevention of tilting of the sensor element in the transfer mold package.
  • a plurality of suspension leads for holding a sensor are formed on each of a pair of two sides of a rectangular circuit board in plan view.
  • the present invention has been made in view of the above-described problems.
  • a resin-sealed sensor device in which a sensor element for detecting an inertial force such as acceleration and angular velocity is mounted on a pad and molded entirely with resin
  • a resin-sealed sensor device includes a sensor element for detecting a physical quantity, a circuit board on which the sensor element is mounted, the circuit board, and a rectangular shape in plan view.
  • a circuit unit composed of a pad having a circular or elliptical shape, a suspension lead connected to the pad and an external conductive lead, and a molded resin body for sealing the circuit unit.
  • each of the divided regions is formed by temporarily dividing the shape into four regions.
  • the suspension leads are respectively disposed.
  • a pad having a rectangular shape, a circular shape, or an elliptical shape in plan view on which a sensor element and a circuit board are mounted has two axes orthogonal to the center point.
  • Suspension leads are arranged in each of the four divided regions that are formed when the intersections of the two are matched, thereby suppressing or eliminating the deformation and inclination of the circuit unit composed of the sensor element, the circuit board, and the pad at the time of resin injection. Therefore, the sensor output error is suppressed, and a highly reliable resin-sealed sensor device is obtained.
  • Embodiment 1 of the resin-sealed sensor apparatus of this invention Comprising: It is the figure which showed the inside except the upper mold resin body.
  • FIG. 2 is an II-II arrow view of FIG. 1.
  • FIG. 3 is a view taken in the direction of arrows III-III in FIG. 1. It is a top view of Embodiment 1 of a pad and a suspension lead. It is a top view of Embodiment 2 of a pad and a suspension lead. It is a top view of Embodiment 3 of a pad and a suspension lead. It is a top view of Embodiment 4 of a pad and a suspension lead.
  • FIG. 1 is a plan view of Embodiment 1 of the resin-sealed sensor device of the present invention, showing the inside thereof except for the upper mold resin body, and FIG. 2 is an arrow II-II in FIG.
  • FIG. 3 is a longitudinal sectional view of the apparatus, and FIG. 3 is a sectional view taken along arrows III-III in FIG.
  • a resin-sealed sensor device 100 shown in FIG. 1 includes a sensor element 1 for detecting a physical quantity such as inertia force (acceleration and angular velocity), a circuit board 2 (also referred to as a semiconductor element) on which the sensor element 1 is mounted, and a circuit board. 2 and a pad 3 (also referred to as a die pad, chip pad, tab, etc.) having a rectangular shape in plan view, suspension leads 5A, 5B, 5C, 5D connected to the pad 3, and external electrical leads 4 , And a molded resin body 20 that seals the circuit unit 10.
  • a physical quantity such as inertia force (acceleration and angular velocity)
  • a circuit board 2 also referred to as a semiconductor element
  • a circuit board. 2 and a pad 3 also referred to as a die pad, chip pad, tab, etc.
  • the sensor element 1 and the circuit board 2, and the circuit board 2 and the pad 3 are both connected by a paste-like or film-like bonding material 7.
  • An electrode (not shown) on the upper surface of the sensor element 1 and an electrode (not shown) on the upper surface of the circuit board 2 are electrically connected by a wire 6, and the electrode of the circuit board 2 and the external conductive lead 4 are also the same.
  • the wires 6 are electrically connected.
  • the external conductive lead 4 is formed integrally with an inner lead that is in the molded resin body 20 and is electrically connected to the circuit board 2 and an outer lead that is connected to an external mounting board (not shown) or a housing. The whole is composed.
  • the sensor element 1 incorporates a comb-like physical quantity detection unit formed by finely processing silicon (Si), and the periphery thereof is laminated and sealed with Si, glass, or the like.
  • Si finely processing silicon
  • the circuit board 2 is obtained by forming predetermined fine circuits and electrodes on Si by a semiconductor process processing technique.
  • the circuit board 2 controls the detection operation of the sensor element 1 and also performs control for inputting and outputting a detection signal from the sensor element 1 to and from the inside and outside of the apparatus 100.
  • connection between the pad and the suspension lead means that both are integrally formed of the same material as described above, and both are separate members of different materials. It also means that it is integrated through a connection process.
  • the pad 3, the external conducting lead 4, and the suspension leads 5A to 5D constituting the lead frame are formed of a metal material such as copper (Cu), an alloy thereof, or an iron-nickel alloy (Fe-42Ni or the like).
  • the wire 6 is, for example, a gold (Au) material thin wire with a diameter of 20 to 25 ⁇ m.
  • the mold resin body 20 is made of, for example, a thermosetting resin (epoxy resin) filled with silica particles.
  • both conductive and non-conductive materials can be applied.
  • a paste-like or film-like bonding material mainly composed of resin, epoxy resin, polyimide resin, or the like is applied.
  • a paste or film-like bonding material filled with silver (Ag) particles is applied.
  • the film-like bonding material 7 can keep the thickness uniform after bonding the members, variation in the mounting position of the members (variation in horizontality) can be suppressed, and variation in output of the sensor element 1 can be reduced. The effect can be expected.
  • the sensor element 1, the circuit board 2, the pad 3, and the mold resin body 20 are all rectangular in shape in plan view.
  • these planar view shapes are not limited to rectangles, and may be squares, circles, ellipses, or the like.
  • a rectangle or a square includes a shape in which a corner portion is chamfered and curved.
  • the manufacturing method of the resin-sealed sensor device 100 will be outlined.
  • the sensor element 1, the circuit board 2, the pads 3, the suspension leads 5A to 5D, and the external electrical leads 4 are assembled, and the sensor element 1 and the circuit board 2 and the circuit board 2 and the external electrical leads using the wires 6 are assembled. 4
  • Each circuit unit 10 is assembled by making electrical connections.
  • the manufactured circuit unit 10 is placed in a mold die (not shown) having a cavity having a predetermined shape, and at this time, the suspension leads 5A to 5D are fixed to the four sides of the die, and the circuit unit 10 is fixed. Suspend in the cavity.
  • resin is injected into the cavity from one end of the mold, and is cured to form the molded resin body 20 so as to surround the circuit unit 10.
  • the suspension leads 5A to 5D maintain the planar posture of the circuit unit 10 suspended in the mold against the resin pressure of the resin injected into the cavity, and deform the deformation. It has an inhibitory effect.
  • FIG. 4 shows an embodiment of the pad 3 and the suspension leads 5A to 5D constituting the resin-sealed sensor device 100 shown in FIG.
  • the pad 3 is rectangular (rectangular) in plan view, and the long side 3a (length t1) and the short side 3b (length t2) of the two pairs Suspension leads 5A to 5D are connected to the respective midpoints.
  • the four suspension leads 5A to 5D extend in the direction perpendicular to each side at the midpoint of each side of the pad 3.
  • the present inventors are conducting an experiment for calculating the amount of deflection as follows. Specifically, a copper pad with a thickness of 0.15mm is manufactured on a rectangular plane with dimensions of 5mm x 3mm, and an evenly distributed load of 0.5MPa is applied to the pad with the pad supported at the midpoint of each side of the pad. The maximum deflection amount is measured when the load is loaded and when the same equally distributed load is loaded while the pad is supported at each corner of the same pad.
  • the pad 3 and the suspension leads 5A to 5D shown in FIG. 4 are supported by the suspension lead at the midpoint of each side of the pad. It turns out that it is a form which can reduce effectively the deformation
  • FIG. 5 is a plan view of Embodiment 2 of the pad and the suspension lead.
  • the long side 3a and the short side 3b are respectively divided into three equal parts, and a range of 1/3 of the center is set as a central region, and the suspension leads 5A to 5D are respectively disposed in the central region. .
  • the setting of the central area is not limited to the central area when each side is divided into three equal parts, but suspension leads are arranged according to the relationship between the planar dimensions and thickness of the pad, and the applied load.
  • an appropriate range in which deformation and deflection of the pad can be effectively suppressed can be set, and each side can be set to a central region divided into five, a central region divided into seven, or the like.
  • FIG. 6 is a plan view of the pad and the suspension lead according to the third embodiment.
  • four suspension leads 5A to 5D are disposed at four points where two circular diameters intersect the circular shape with respect to the pad 3A having a circular shape in plan view.
  • these four suspension leads 5A to 5D are included in the four virtual divided areas A to D formed when the intersecting point O of the two orthogonal axes L1 and L2 coincides with the center of the circular pad 3A. Exists in each.
  • FIG. 7 is a plan view of Embodiment 4 of the pad and the suspension lead.
  • four suspension leads 5A to 5D are arranged at four points where the elliptical major axis and minor axis intersect the elliptical shape with respect to the elliptical pad 3B.
  • these four suspension leads 5A to 5D are formed of four virtual divided areas A to D formed when the intersection point O of the two orthogonal axes L1 and L2 coincides with the center of the elliptical pad 3B. Each exists inside.
  • FIG. 8 is a plan view of the second embodiment of the resin-sealed sensor device of the present invention, and shows the inside thereof except for the upper mold resin body.
  • the resin-sealed sensor device 100A shown in FIG. 1 and the resin-sealed sensor device 100 shown in FIG. 1 have different configurations in which the suspension leads 5C ′ and 5D ′ on the long sides extend to the outside of the molded resin body 20, It is a point which has an effect
  • one of the suspension leads 5C 'and 5D' is a suspension lead for signal use, and is electrically connected to the sensor element 1 and the circuit board 2 via the wire 6.
  • FIG. 8 shows an example in which the suspension lead 5 ⁇ / b> C ′ is connected to the circuit board 2 with a wire 6.
  • the resin-sealed sensor device 100A can be downsized relative to the resin-sealed sensor device 100. This also contributes to miniaturization of the printed circuit board and equipment on which the resin-sealed sensor device 100A is mounted.
  • suspension leads 5C 'and 5D' include the outer leads, it is also possible to expect a heat radiation action. That is, the heat generated by the operation of the circuit board 2 can be radiated from the suspension leads 5C ′ and 5D ′ to the outside of the resin-sealed sensor device 100A via the pad 3, thereby improving the heat dissipation of the device. It leads to.
  • suspension leads 5C 'and 5D' may be signal leads and suspension leads.
  • suspension lead for signal use may be connected to a ground terminal outside the resin-sealed sensor device 100A, thereby reducing noise superimposed on the output signal of the resin-sealed sensor device 100A. It becomes possible to do. In this case, it is possible to enhance resistance to noise by connecting the entire lower surface of the circuit board 2 to an external ground terminal.
  • FIG. 9 is a plan view of Embodiment 3 of the resin-sealed sensor device according to the present invention, and shows the inside thereof except for the upper mold resin body.
  • the resin-sealed sensor device 100B shown in the figure and the resin-sealed sensor device 100 shown in FIG. 1 are different in that the sensor element 1A has a biaxial acceleration sensor element 1a having detection sensitivity in the X-axis direction and the Y-axis direction, 1b.
  • the four suspension leads 5A to 5D each include a pair of two suspension leads whose extending direction is the X-axis direction, and another pair of two suspension leads whose extending direction is the Y-axis direction orthogonal to the X-axis direction.
  • the extending direction of the suspension leads 5A to 5D and the detection axis direction by the biaxial acceleration sensor elements 1a and 1b coincide with each other.
  • each sensor element 1a, 1b If there is a tilt in the detection axis direction of each sensor element 1a, 1b, there is a risk of significant output fluctuations depending on the tilt angle.
  • the suspension leads 5A to 5D in the direction coinciding with the output axis of the sensor, it is possible to suppress deformation or inclination of the pad 3 on which the acceleration sensor elements 1a and 1b are mounted in the detection axis direction. This leads to suppression of output fluctuations of the sensor elements 1a and 1b.
  • the two-axis acceleration sensor elements 1a and 1b are integrated to form the sensor element 1A.
  • the acceleration sensor elements 1a and 1b are separate and separated on the circuit board. It may be mounted in a state (not shown).
  • the acceleration sensor elements 1a and 1b are mounted at separate positions, the respective portions that are not easily affected by the expansion / contraction of the molded resin body 20 or the deformation of the entire resin-sealed sensor device are provided.
  • An element can be mounted.
  • a triaxial sensor element obtained by adding an acceleration sensor element in the Z-axis direction to a biaxial acceleration sensor may be applied, or a sensor element combining an acceleration sensor and an angular velocity sensor may be applied.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Pressure Sensors (AREA)
  • Gyroscopes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

The purpose of the present invention is to provide a resin-sealed sensor device formed by mounting a sensor element for detecting an inertial force such as acceleration or angular velocity on a pad and sealing the entirety thereof in a resin, said resin-sealed sensor device being provided such that tilting or deformation of the sensor element or pad during resin injection is reduced or eliminated so as to suppress or eliminate sensor output errors and ensure that the resin-sealed sensor device is highly reliable. The resin-sealed sensor device (100) according to the present invention is constituted by a circuit unit (10) and a molded resin body (20) sealing the circuit unit (10), said circuit unit (10) comprising a sensor element (1) for physical quantity detection, a circuit board (2), a pad (3) which has a shape in planar view of any among a rectangle, a circle, and an ellipse, hanger leads (5A to 5D) and external power leads (4) connected to the pad (3). A hanger lead (5A to 5D) is arranged in each of the divided regions that can be formed from the shape of the pad (3) being virtually divided into four regions when the intersection (O) of two orthogonal axes (L1,L2) coincides with the center of the shape of the pad (3).

Description

樹脂封止型センサ装置Resin-sealed sensor device
　本発明は、加速度や角速度を検出する１つの慣性力センサ、もしくは複数の加速度や角速度の検出部が複合された慣性力センサ等のセンサ素子とこれを搭載する回路基板をトランスファーモールドなどによって樹脂封止してパッケージを形成してなる樹脂封止型慣性力センサ装置に関する。 In the present invention, a sensor element such as an inertial force sensor for detecting acceleration or angular velocity, or an inertial force sensor in which a plurality of acceleration / angular velocity detectors are combined, and a circuit board on which the sensor element is mounted by resin molding or the like. The present invention relates to a resin-sealed inertial force sensor device formed by stopping and forming a package.
　近年、自動車や農業機械、建設機械などでは車両姿勢の安定制御や安全性の向上、あるいは作業性の向上のために種々の物理量を検出するセンサ装置が開発されている。 In recent years, sensor devices that detect various physical quantities have been developed in automobiles, agricultural machines, construction machines, and the like for stable control of vehicle posture, improvement of safety, and improvement of workability.
　自動車においては、横滑り防止や乗員の安全性向上のための機器（例えばエアバック）制御用として、特に加速度センサや角速度センサの適用が拡大している。 In automobiles, the application of acceleration sensors and angular velocity sensors is particularly widespread for controlling equipment (for example, airbags) for preventing skidding and improving passenger safety.
　また、センサ装置の自動車への適用においてはエンジンルームへの搭載も想定されることから、熱変化や機械的振動などの過酷な環境負荷に耐えることが必要であるとともに、限られたスペースに搭載可能とするために、センサ装置自体も小型化することが不可欠となっている。 In addition, it is assumed that the sensor device will be installed in the engine room when applied to automobiles, so it is necessary to withstand severe environmental loads such as heat changes and mechanical vibrations, and it is installed in a limited space. In order to make this possible, it is essential to reduce the size of the sensor device itself.
　また、農業機械や建設機械では、傾斜地などで安定した作業を実施するために、接続される付属機の姿勢制御用（たとえば水平制御用）として慣性力センサが使用されている。 In addition, in agricultural machines and construction machines, inertial force sensors are used for posture control (for example, for horizontal control) of attached accessories in order to perform stable work on slopes.
　上記する各種のセンサ装置に搭載される加速度センサや角速度センサでは、小型化や多機能化および複合化、さらには量産性向上などを目的として、シリコン（Si）の微細加工技術(MEMS：Micro Electro Mechanical Systems)を用いた検出手段が主流となってきている。微細加工技術によってシリコンの微細なくし歯状構造体を形成し、このくし歯状構造体の微小変位を電気信号に変換することにより、加速度や角速度などの物理量を検出している。 The acceleration sensors and angular velocity sensors mounted on the various sensor devices described above are designed to be miniaturized, multi-functional and complex, and to improve mass productivity. Silicon (Si) micromachining technology (MEMS: Micro Electro) Detection methods using Mechanical Systems are becoming mainstream. A silicon fine comb-like structure is formed by a microfabrication technique, and a physical quantity such as acceleration or angular velocity is detected by converting a minute displacement of the comb-like structure into an electric signal.
　このMEMS技術で製作された慣性力センサ（加速度センサや角速度センサ）を備えたセンサ装置の形態として、センサからの信号を処理するとともに外部との信号入出力を制御する回路基板(例えばLSI基板)の上にセンサを搭載し、これらセンサおよび回路基板をパッド（タブ）に搭載し、外部との電気的信号の伝達を行うリードをパッドに接続した上で、これらを樹脂で封止してパッケージを構成した形態のセンサ装置はよく知られるところである。 As a form of sensor device equipped with inertial force sensors (acceleration sensor and angular velocity sensor) manufactured by this MEMS technology, a circuit board (for example, LSI board) that processes signals from the sensor and controls signal input / output with the outside The sensor is mounted on the board, and the sensor and circuit board are mounted on the pad (tab). Leads that transmit electrical signals to the outside are connected to the pad and then sealed with resin. The sensor device in the form of the above is well known.
　この形態のセンサ装置では、パッドとリードはリードフレームとして一体に形成されており、樹脂によるパッケージ形成後に、リードは、パッケージ内にあるインナーリードとパッケージの外に突出したアウターリードとなる。一方、パッドは吊りリードによってリードフレームに保持されている。なお、慣性力センサの樹脂によるパッケージングでは、トランスファーモールド方式による樹脂封止パッケージが一般的である。 In this type of sensor device, the pad and the lead are integrally formed as a lead frame, and after the package is formed of resin, the lead is an inner lead in the package and an outer lead protruding outside the package. On the other hand, the pad is held on the lead frame by the suspension leads. In addition, in resin packaging of inertial force sensors, a resin-sealed package by a transfer mold method is generally used.
　トランスファーモールドによるパッケージングでは、パッド上に回路基板と慣性力センサ素子が接着剤（DAF（ダイアタッチフィルム）などの接着フィルムを含む）を介して搭載され、これらが接着された後に、金属細線（ワイヤ）によって慣性力センサ素子と回路基板の間、および回路基板とインナーリードの間が電気的に接続される。その後、この組立体はモールド金型内に載置され、金型の一端から樹脂が注入され、これが硬化することで樹脂封止パッケージが形成される。パッケージが形成された後、アウターリード以外のリードフレーム外枠などの不要部分が切断除去され、アウターリードを所定の形状に加工することで樹脂封止型センサ装置が製造される。 In packaging by transfer molding, a circuit board and an inertial force sensor element are mounted on a pad via an adhesive (including an adhesive film such as DAF (die attach film)), and after these are bonded, a thin metal wire ( Wires are electrically connected between the inertial force sensor element and the circuit board, and between the circuit board and the inner lead. Thereafter, the assembly is placed in a mold, resin is injected from one end of the mold, and the resin is cured to form a resin-sealed package. After the package is formed, unnecessary portions such as the outer frame of the lead frame other than the outer leads are cut and removed, and the outer lead is processed into a predetermined shape to manufacture a resin-sealed sensor device.
　ところで、このトランスファーモールドによる樹脂封止では、パッケージ内部のセンサ素子や回路基板の配置、インナーリード形状などに起因して樹脂流動にアンバランスが生じる場合がある。 By the way, in the resin sealing by this transfer mold, there is a case where an imbalance occurs in the resin flow due to the arrangement of the sensor element and circuit board inside the package, the inner lead shape, and the like.
　この樹脂流動のアンバランスは、センサ素子や回路基板表面に作用する樹脂流動による圧力に分布を生じさせ、この圧力分布に吊りリードが耐えられなくなるとパッドが上下方向(部材の厚さ方向)に変動する。この変動によってセンサ素子が水平から傾いた状態になったまま樹脂が硬化し、パッケージングされる場合がある。 This imbalance of the resin flow causes a distribution in the pressure due to the resin flow acting on the sensor element and the circuit board surface, and if the suspension lead cannot withstand this pressure distribution, the pad moves in the vertical direction (the thickness direction of the member). fluctuate. Due to this variation, the resin may be cured and packaged while the sensor element is tilted from the horizontal.
　加速度や角速度の慣性力センサ素子が水平から傾いた状態で実装されると、センサ出力はその傾斜角度分だけ低下（傾斜角をθとすると1/cosθ低下）するため、これが出力誤差となってセンサの安定性を阻害する要因となる。 If the inertial force sensor element of acceleration or angular velocity is mounted in a state tilted from the horizontal, the sensor output will drop by that tilt angle (If the tilt angle is θ, it will be 1 / cosθ lower). This is a factor that hinders the stability of the sensor.
　このようにトランスファーモールドパッケージでのセンサ素子の傾斜防止を考慮したセンサ装置が特許文献１，２に開示されている。 In this way, Patent Documents 1 and 2 disclose sensor devices that take into account the prevention of tilting of the sensor element in the transfer mold package.
　特許文献１に開示されるセンサ装置では、センサを保持するための吊りリードが平面視矩形の回路基板の一対の２つの辺にそれぞれ複数本形成されている。 In the sensor device disclosed in Patent Document 1, a plurality of suspension leads for holding a sensor are formed on each of a pair of two sides of a rectangular circuit board in plan view.
　一方、特許文献２に開示される半導体装置においては、センサチップおよびコントローラチップを搭載する平面視矩形のダイパッドの一対の対向する２つの辺に吊りリードがそれぞれ１本ずつ形成されている形態や、さらに他の一対の２つの辺のうちの１つの辺に吊りリードが形成されている形態（合計３つの吊りリードでダイパッドが吊られた形態）が開示されている。 On the other hand, in the semiconductor device disclosed in Patent Document 2, a configuration in which one suspension lead is formed on each of a pair of two opposing sides of a rectangular die pad mounting a sensor chip and a controller chip, Furthermore, a form in which a suspension lead is formed on one side of another pair of two sides (a form in which the die pad is suspended by a total of three suspension leads) is disclosed.
特開２０１３－４４５２４号公報JP 2013-44524 A 特開２０１０－１７７５１０号公報JP 2010-177510 A
　特許文献１に記載のセンサ装置では、平面視矩形の回路基板の一対の２つの辺をそれぞれ２本の吊りリードが支持するように形成されているので、その吊り方向に対しての変形には抵抗力がある。しかしながら、吊りリード形成面以外の他の一対の辺は吊りリードにて支持されていないことから、この一対の辺における変形や、この一対の辺で規定される方向の変形に対する抵抗力は不足しており、回路基板の変形防止としては不十分である。そのため、センサ出力を用いて高精度の車体制御や付属機器の姿勢制御を実施する場合には、センサの変形による誤差が問題となる可能性が高い。 In the sensor device described in Patent Document 1, since two suspension leads are formed to support each of a pair of two sides of a rectangular circuit board in plan view, Resistant. However, since the other pair of sides other than the suspension lead forming surface is not supported by the suspension lead, the resistance force against the deformation in the pair of sides and the deformation defined in the pair of sides is insufficient. Therefore, it is insufficient for preventing deformation of the circuit board. For this reason, when highly accurate vehicle body control or accessory device attitude control is performed using the sensor output, there is a high possibility that an error due to deformation of the sensor becomes a problem.
　この問題は、平面視矩形のダイパッドの一対の対向する２つの辺のみ、あるいは３つの辺のみを吊りリードで支持する特許文献２に記載の半導体装置においても同様に生じるものである。仮にダイパッドの３つの辺をそれぞれ吊りリードで吊った場合では、吊りリードで吊られていない残りの１辺の樹脂注入時の変形や傾きは抑制できず、センサチップの傾斜等による出力誤差を解消できない。尤も、特許文献２において吊りリードでダイパッドを吊る目的は、既述するように樹脂注入時のセンサ素子の傾き等を抑制することを目的としたものではなく、キャビティ内に樹脂を完全に充填することを目的としたものであることから、このようにダイパッドの２辺もしくは３辺を吊りリードで吊った形態であっても、特許文献２で掲げる目的は十分に達成されるものと考えられる。 This problem also occurs in the semiconductor device described in Patent Document 2 in which only two pairs of opposing sides or only three sides of a rectangular die pad in plan view are supported by suspension leads. If the three sides of the die pad are suspended by suspension leads, the remaining one side that is not suspended by the suspension leads cannot be deformed or tilted during resin injection, eliminating output errors due to sensor chip tilt, etc. Can not. However, the purpose of suspending the die pad with the suspension lead in Patent Document 2 is not the purpose of suppressing the inclination of the sensor element at the time of resin injection as described above, and the resin is completely filled in the cavity. Therefore, even if the two or three sides of the die pad are suspended by the suspension leads as described above, it is considered that the object described in Patent Document 2 is sufficiently achieved.
　本発明は上記する問題に鑑みてなされたものであり、加速度や角速度といった慣性力を検出するセンサ素子がパッド上に搭載され、全体が樹脂にてモールドされた樹脂封止型センサ装置において、樹脂注入時におけるセンサ素子やパッドの傾斜や変形を低減もしくは解消することでセンサ出力誤差が抑制もしくは解消された、信頼性の高い樹脂封止型センサ装置を提供することを目的とする。 The present invention has been made in view of the above-described problems. In a resin-sealed sensor device in which a sensor element for detecting an inertial force such as acceleration and angular velocity is mounted on a pad and molded entirely with resin, It is an object of the present invention to provide a highly reliable resin-sealed sensor device in which sensor output errors are suppressed or eliminated by reducing or eliminating the tilt and deformation of sensor elements and pads during injection.
　前記目的を達成すべく、本発明による樹脂封止型センサ装置は、物理量検出用のセンサ素子と、前記センサ素子を搭載する回路基板と、前記回路基板を搭載するとともに、平面視形状が矩形、円形、楕円形のいずれかの形状を有するパッドと、前記パッドに接続される吊りリードおよび外部電通リードと、からなる回路ユニットと、前記回路ユニットを封止するモールド樹脂体と、から構成される樹脂封止型センサ装置において、パッドの前記いずれかの形状の中心点に、直交する２つの軸の交点を一致させた際に、該形状が４つの領域に仮に分割されてできる各分割領域に、それぞれ前記吊りリードが配設されているものである。 In order to achieve the above object, a resin-sealed sensor device according to the present invention includes a sensor element for detecting a physical quantity, a circuit board on which the sensor element is mounted, the circuit board, and a rectangular shape in plan view. A circuit unit composed of a pad having a circular or elliptical shape, a suspension lead connected to the pad and an external conductive lead, and a molded resin body for sealing the circuit unit. In the resin-sealed sensor device, when the intersecting point of two orthogonal axes coincides with the center point of any one of the shapes of the pad, each of the divided regions is formed by temporarily dividing the shape into four regions. The suspension leads are respectively disposed.
　本発明の樹脂封止型センサ装置によれば、センサ素子と回路基板を搭載する平面視形状が矩形、円形、楕円形のいずれかの形状を有するパッドが、その中心点に直交する２つの軸の交点を一致させた際にできる４つの各分割領域に吊りリードが配設されていることにより、樹脂注入時におけるセンサ素子、回路基板およびパッドからなる回路ユニットの変形や傾斜を抑制もしくは解消することができ、もってセンサ出力誤差を抑制して信頼性の高い樹脂封止型センサ装置となる。 According to the resin-sealed sensor device of the present invention, a pad having a rectangular shape, a circular shape, or an elliptical shape in plan view on which a sensor element and a circuit board are mounted has two axes orthogonal to the center point. Suspension leads are arranged in each of the four divided regions that are formed when the intersections of the two are matched, thereby suppressing or eliminating the deformation and inclination of the circuit unit composed of the sensor element, the circuit board, and the pad at the time of resin injection. Therefore, the sensor output error is suppressed, and a highly reliable resin-sealed sensor device is obtained.
本発明の樹脂封止型センサ装置の実施の形態１の平面図であって上方のモールド樹脂体を除いてその内部を示した図である。It is the top view of Embodiment 1 of the resin-sealed sensor apparatus of this invention, Comprising: It is the figure which showed the inside except the upper mold resin body. 図１のII－II矢視図である。FIG. 2 is an II-II arrow view of FIG. 1. 図１のIII－III矢視図である。FIG. 3 is a view taken in the direction of arrows III-III in FIG. 1. パッドと吊りリードの実施の形態１の平面図である。It is a top view of Embodiment 1 of a pad and a suspension lead. パッドと吊りリードの実施の形態２の平面図である。It is a top view of Embodiment 2 of a pad and a suspension lead. パッドと吊りリードの実施の形態３の平面図である。It is a top view of Embodiment 3 of a pad and a suspension lead. パッドと吊りリードの実施の形態４の平面図である。It is a top view of Embodiment 4 of a pad and a suspension lead. 本発明の樹脂封止型センサ装置の実施の形態２の平面図であって上方のモールド樹脂体を除いてその内部を示した図である。It is the top view of Embodiment 2 of the resin sealing type | mold sensor apparatus of this invention, Comprising: It is the figure which showed the inside except the upper mold resin body. 本発明の樹脂封止型センサ装置の実施の形態３の平面図であって上方のモールド樹脂体を除いてその内部を示した図である。It is the top view of Embodiment 3 of the resin-sealed sensor apparatus of this invention, Comprising: It is the figure which showed the inside except the upper mold resin body.
　以下、図面を参照して本発明の樹脂封止型センサ装置の実施の形態を説明する。 Hereinafter, embodiments of the resin-sealed sensor device of the present invention will be described with reference to the drawings.
（樹脂封止型センサ装置の実施の形態１）
＜樹脂封止型センサ装置について＞
　図１は本発明の樹脂封止型センサ装置の実施の形態１の平面図であって上方のモールド樹脂体を除いてその内部を示した図であり、図２は図１のII－II矢視図であって装置の長手方向断面図であり、図３は図１のIII－III矢視図であって装置の短手方向断面図である。 (Embodiment 1 of resin-sealed sensor device)
<Resin-sealed sensor device>
FIG. 1 is a plan view of Embodiment 1 of the resin-sealed sensor device of the present invention, showing the inside thereof except for the upper mold resin body, and FIG. 2 is an arrow II-II in FIG. FIG. 3 is a longitudinal sectional view of the apparatus, and FIG. 3 is a sectional view taken along arrows III-III in FIG.
　図１で示す樹脂封止型センサ装置１００は、慣性力（加速度や角速度）などの物理量検出用のセンサ素子１と、センサ素子１を搭載する回路基板２（半導体素子ともいう）と、回路基板２を搭載するとともに平面視形状が矩形（長方形）のパッド３（ダイパッド、チップパッド、タブなどともいう）と、パッド３に接続される吊りリード５Ａ，５Ｂ，５Ｃ，５Ｄおよび外部電通リード４と、からなる回路ユニット１０と、回路ユニット１０を封止するモールド樹脂体２０と、から大略構成されている。 A resin-sealed sensor device 100 shown in FIG. 1 includes a sensor element 1 for detecting a physical quantity such as inertia force (acceleration and angular velocity), a circuit board 2 (also referred to as a semiconductor element) on which the sensor element 1 is mounted, and a circuit board. 2 and a pad 3 (also referred to as a die pad, chip pad, tab, etc.) having a rectangular shape in plan view, suspension leads 5A, 5B, 5C, 5D connected to the pad 3, and external electrical leads 4 , And a molded resin body 20 that seals the circuit unit 10.
　センサ素子１と回路基板２、回路基板２とパッド３はともに、ペースト状もしくはフィルム状の接合材７で接続されている。 The sensor element 1 and the circuit board 2, and the circuit board 2 and the pad 3 are both connected by a paste-like or film-like bonding material 7.
　センサ素子１の上面にある不図示の電極と回路基板２の上面にある不図示の電極はワイヤ６にて電気的に接続されており、回路基板２の該電極と外部電通リード４も同様にワイヤ６にて電気的に接続されている。 An electrode (not shown) on the upper surface of the sensor element 1 and an electrode (not shown) on the upper surface of the circuit board 2 are electrically connected by a wire 6, and the electrode of the circuit board 2 and the external conductive lead 4 are also the same. The wires 6 are electrically connected.
　外部電通リード４は、モールド樹脂体２０内にあって回路基板２と電気的に接続されるインナーリードと、不図示の外部の実装基板や筐体などに接続されるアウターリードが一体に形成されてその全体が構成されている。 The external conductive lead 4 is formed integrally with an inner lead that is in the molded resin body 20 and is electrically connected to the circuit board 2 and an outer lead that is connected to an external mounting board (not shown) or a housing. The whole is composed.
　センサ素子１は、シリコン（Si）を微細加工して形成されたくし歯状の物理量検出部を内蔵しており、それらの周囲がSiやガラスなどで積層封止されている。このセンサ素子１としては、加速度センサや角速度センサが単独に存在する形態のほか、これらが複数個複合化された形態が適用される。 The sensor element 1 incorporates a comb-like physical quantity detection unit formed by finely processing silicon (Si), and the periphery thereof is laminated and sealed with Si, glass, or the like. As the sensor element 1, in addition to a form in which an acceleration sensor and an angular velocity sensor exist independently, a form in which a plurality of these sensors are combined is applied.
　回路基板２は、半導体プロセス加工技術によって所定の微細な回路や電極がSi上に形成されたものである。この回路基板２は、センサ素子１の検出動作を制御するとともに、センサ素子１からの検出信号を装置１００の内外に入出力するための制御などもおこなう。 The circuit board 2 is obtained by forming predetermined fine circuits and electrodes on Si by a semiconductor process processing technique. The circuit board 2 controls the detection operation of the sensor element 1 and also performs control for inputting and outputting a detection signal from the sensor element 1 to and from the inside and outside of the apparatus 100.
　パッド３、外部電通リード４、および吊りリード５Ａ～５Ｄは、同素材で一体に形成されており、モールド樹脂体２０が形成される前の段階では全体としてリードフレームを構成している。なお、本明細書において、パッドと吊りリードの「接続」とは、このように双方が同素材で一体に形成されていることを意味することの他にも、双方が異種素材の別部材であって接続工程を経て一体とされることをも意味する。 The pad 3, the external conductive lead 4, and the suspension leads 5A to 5D are integrally formed of the same material, and constitute a lead frame as a whole before the molding resin body 20 is formed. In this specification, “connection” between the pad and the suspension lead means that both are integrally formed of the same material as described above, and both are separate members of different materials. It also means that it is integrated through a connection process.
　このリードフレームを構成するパッド３、外部電通リード４、および吊りリード５Ａ～５Ｄは、銅(Cu)やその合金、鉄－ニッケル合金(Fe-42Niなど)等の金属材料から形成される。 The pad 3, the external conducting lead 4, and the suspension leads 5A to 5D constituting the lead frame are formed of a metal material such as copper (Cu), an alloy thereof, or an iron-nickel alloy (Fe-42Ni or the like).
　ワイヤ６は、たとえば直径20～25μmの金(Au)素材の細線が使用される。 The wire 6 is, for example, a gold (Au) material thin wire with a diameter of 20 to 25 μm.
　モールド樹脂体２０は、たとえばシリカ粒子が充填された熱硬化性樹脂（エポキシ樹脂）から形成される。 The mold resin body 20 is made of, for example, a thermosetting resin (epoxy resin) filled with silica particles.
　センサ素子１と回路基板２、および回路基板２とパッド３を接続する接合材７には、導電性、非導電性の双方の材料が適用可能であるが、導電性が不要な場合は、シリコーン樹脂やエポキシ樹脂、ポリイミド樹脂などを主成分とするペースト状もしくはフィルム状の接合材が適用される。一方、導電性が必要な場合は、銀(Ag)粒子が充填されたペースト状もしくはフィルム状の接合材が適用される。中でも、フィルム状の接合材７は、部材同士の接合後にその厚みを均一に保つことができるため、部材の搭載位置のばらつき（水平度のばらつき）を抑制でき、センサ素子１の出力のばらつき低減効果が期待できる。 For the bonding material 7 that connects the sensor element 1 and the circuit board 2 and between the circuit board 2 and the pad 3, both conductive and non-conductive materials can be applied. A paste-like or film-like bonding material mainly composed of resin, epoxy resin, polyimide resin, or the like is applied. On the other hand, when conductivity is required, a paste or film-like bonding material filled with silver (Ag) particles is applied. In particular, since the film-like bonding material 7 can keep the thickness uniform after bonding the members, variation in the mounting position of the members (variation in horizontality) can be suppressed, and variation in output of the sensor element 1 can be reduced. The effect can be expected.
　図示例では、センサ素子１、回路基板２、パッド３、モールド樹脂体２０の平面視形状がともに矩形（長方形）である。なお、これらの平面視形状は矩形に限定されるものでなく、正方形、円形、楕円形などであってもよい。また、長方形や正方形には、隅角部が面取りされて湾曲している形状も包含される。 In the illustrated example, the sensor element 1, the circuit board 2, the pad 3, and the mold resin body 20 are all rectangular in shape in plan view. In addition, these planar view shapes are not limited to rectangles, and may be squares, circles, ellipses, or the like. In addition, a rectangle or a square includes a shape in which a corner portion is chamfered and curved.
　ここで、樹脂封止型センサ装置１００の製造方法を概説する。 Here, the manufacturing method of the resin-sealed sensor device 100 will be outlined.
　トランスファーモールドに先行して、センサ素子１、回路基板２、パッド３および吊りリード５Ａ～５Ｄ、および外部電通リード４を組み付け、ワイヤ６によるセンサ素子１と回路基板２、回路基板２と外部電通リード４それぞれの電気的接続をおこなって回路ユニット１０を組み付けておく。 Prior to the transfer molding, the sensor element 1, the circuit board 2, the pads 3, the suspension leads 5A to 5D, and the external electrical leads 4 are assembled, and the sensor element 1 and the circuit board 2 and the circuit board 2 and the external electrical leads using the wires 6 are assembled. 4 Each circuit unit 10 is assembled by making electrical connections.
　製作された回路ユニット１０を、所定形状のキャビティを具備する不図示のモールド金型内に載置し、この際に吊りリード５Ａ～５Ｄを金型のそれぞれ４辺に固定して回路ユニット１０をキャビティ内に吊持させる。 The manufactured circuit unit 10 is placed in a mold die (not shown) having a cavity having a predetermined shape, and at this time, the suspension leads 5A to 5D are fixed to the four sides of the die, and the circuit unit 10 is fixed. Suspend in the cavity.
　この状態で金型の一端から樹脂をキャビティ内に注入し、これが硬化することで回路ユニット１０を包囲するようにしてモールド樹脂体２０が形成される。 In this state, resin is injected into the cavity from one end of the mold, and is cured to form the molded resin body 20 so as to surround the circuit unit 10.
　モールド樹脂体２０が形成された後、アウターリード以外のリードフレーム外枠などの不要部分を切断除去し、アウターリードを所定の形状に加工することによって図示する樹脂封止型センサ装置１００が製造される。 After the molding resin body 20 is formed, unnecessary portions such as the outer frame of the lead frame other than the outer leads are cut and removed, and the outer lead is processed into a predetermined shape, whereby the resin-sealed sensor device 100 shown in the drawing is manufactured. The
　吊りリード５Ａ～５Ｄは、このモールド樹脂体２０形成の際に、キャビティ内に注入された樹脂の樹脂圧に対して金型内で吊持された回路ユニット１０の平面姿勢を保持し、変形を抑制する作用を奏するものである。 When the mold resin body 20 is formed, the suspension leads 5A to 5D maintain the planar posture of the circuit unit 10 suspended in the mold against the resin pressure of the resin injected into the cavity, and deform the deformation. It has an inhibitory effect.
　次に、以下、パッドと吊りリードの実施の形態を説明する。 Next, embodiments of the pad and the suspension lead will be described below.
＜パッドと吊りリードの実施の形態１＞
　図１で示す樹脂封止型センサ装置１００を構成するパッド３と吊りリード５Ａ～５Ｄの実施の形態を図４に示す。 <Embodiment 1 of Pad and Hanging Lead>
FIG. 4 shows an embodiment of the pad 3 and the suspension leads 5A to 5D constituting the resin-sealed sensor device 100 shown in FIG.
　図示する形態のパッド３と吊りリード５Ａ～５Ｄにおいて、パッド３は平面視形状が矩形（長方形）であり、二対のうちの長辺３ａ（長さt1）、短辺３ｂ（長さt2）の各中点に吊りリード５Ａ～５Ｄが接続されている。 In the pad 3 and the suspension leads 5A to 5D of the form shown in the drawing, the pad 3 is rectangular (rectangular) in plan view, and the long side 3a (length t1) and the short side 3b (length t2) of the two pairs Suspension leads 5A to 5D are connected to the respective midpoints.
　そして、これら４つの吊りリード５Ａ～５Ｄは、直交する２軸Ｌ１，Ｌ２の交点Ｏを矩形のパッド３の中心に一致させた際にできる４つの仮想の分割領域Ａ～Ｄの中にそれぞれ存在している。 These four suspension leads 5A to 5D are respectively present in four virtual divided areas A to D formed when the intersecting point O of the two orthogonal axes L1 and L2 coincides with the center of the rectangular pad 3. is doing.
　さらに、４つの吊りリード５Ａ～５Ｄは、パッド３の各辺の中点において各辺に対して直交する方向に延設している。 Furthermore, the four suspension leads 5A to 5D extend in the direction perpendicular to each side at the midpoint of each side of the pad 3.
　ところで、本発明者等は、以下のようなたわみ量を算定する実験をおこなっている。具体的には、寸法が5mm×3mmの矩形平面で厚み0.15mmの銅素材のパッドを製作し、このパッドの各辺の中点でパッドを支持した状態で0.5MPaの等分布荷重をパッドに載荷させた場合と、同様のパッドの各隅角部でパッドを支持した状態で同様の等分布荷重を載荷させた場合とで、双方の最大たわみ量を測定したものである。 By the way, the present inventors are conducting an experiment for calculating the amount of deflection as follows. Specifically, a copper pad with a thickness of 0.15mm is manufactured on a rectangular plane with dimensions of 5mm x 3mm, and an evenly distributed load of 0.5MPa is applied to the pad with the pad supported at the midpoint of each side of the pad. The maximum deflection amount is measured when the load is loaded and when the same equally distributed load is loaded while the pad is supported at each corner of the same pad.
　測定の結果、パッドの各辺の中点で支持した場合の最大たわみ量が16μmであったのに対して、パッドの各隅角部で支持した場合の最大たわみ量が164μmであり、およそ10倍もの相違があった。 As a result of the measurement, the maximum deflection when supported at the midpoint of each side of the pad was 16 μm, whereas the maximum deflection when supported at each corner of the pad was 164 μm, approximately 10 There were twice as many differences.
　この検証結果より、図４で示す形態のパッド３と吊りリード５Ａ～５Ｄでは、パッドの各辺の中点で吊りリードにて支持されていることから、パッドの剛性も高くなり、作用する荷重に対する変形やたわみを効果的に低減できる形態であることが分かる。 From this verification result, the pad 3 and the suspension leads 5A to 5D shown in FIG. 4 are supported by the suspension lead at the midpoint of each side of the pad. It turns out that it is a form which can reduce effectively the deformation | transformation and bending | flexion with respect to.
　なお、図示を省略するが、各辺に対して吊りリードが直交せずに傾斜して配設されている形態であっても、変形やたわみ低減効果を十分に期待することができる。 Although illustration is omitted, even if the suspension leads are arranged so as to be inclined with respect to each side without being orthogonal to each other, the effect of reducing deformation and deflection can be sufficiently expected.
＜パッドと吊りリードの実施の形態２＞
　一方、図５は、パッドと吊りリードの実施の形態２の平面図である。この形態では、長辺３ａ、短辺３ｂをそれぞれ三等分し、それらの中央の1/3の範囲を中央領域とし、この中央領域内に吊りリード５Ａ～５Ｄをそれぞれ配設したものである。 <Embodiment 2 of Pad and Hanging Lead>
On the other hand, FIG. 5 is a plan view of Embodiment 2 of the pad and the suspension lead. In this embodiment, the long side 3a and the short side 3b are respectively divided into three equal parts, and a range of 1/3 of the center is set as a central region, and the suspension leads 5A to 5D are respectively disposed in the central region. .
　なお、中央領域の設定は、各辺を三等分した際の中央の領域に限定されるものでなく、パッドの平面寸法と厚みの関係、作用する荷重との関係より、吊りリードを配設した際にパッドの変形やたわみを効果的に抑制できる適宜の範囲を設定でき、各辺を五等分した中央領域、七等分した中央領域などに設定することもできる。 Note that the setting of the central area is not limited to the central area when each side is divided into three equal parts, but suspension leads are arranged according to the relationship between the planar dimensions and thickness of the pad, and the applied load. In this case, an appropriate range in which deformation and deflection of the pad can be effectively suppressed can be set, and each side can be set to a central region divided into five, a central region divided into seven, or the like.
＜パッドと吊りリードの実施の形態３＞
　図６は、パッドと吊りリードの実施の形態３の平面図である。この形態では、平面視形状が円形のパッド３Ａに対し、２つの直交する直径と該円形が交差する４つの点に４つの吊りリード５Ａ～５Ｄが配設されている。 <Embodiment 3 of Pad and Hanging Lead>
FIG. 6 is a plan view of the pad and the suspension lead according to the third embodiment. In this embodiment, four suspension leads 5A to 5D are disposed at four points where two circular diameters intersect the circular shape with respect to the pad 3A having a circular shape in plan view.
　この形態においても、これら４つの吊りリード５Ａ～５Ｄは、直交する２軸Ｌ１，Ｌ２の交点Ｏを円形のパッド３Ａの中心に一致させた際にできる４つの仮想の分割領域Ａ～Ｄの中にそれぞれ存在している。 Also in this embodiment, these four suspension leads 5A to 5D are included in the four virtual divided areas A to D formed when the intersecting point O of the two orthogonal axes L1 and L2 coincides with the center of the circular pad 3A. Exists in each.
　図示する形態のパッドと吊りリードによっても、パッドの変形およびたわみの低減効果を期待することができ、作用する樹脂圧に対してパッドの水平姿勢を保持できる作用を期待することができる。 Also with the pad and the suspension lead in the form shown in the figure, it is possible to expect the effect of reducing the deformation and deflection of the pad, and the effect of maintaining the horizontal posture of the pad against the acting resin pressure.
＜パッドと吊りリードの実施の形態４＞
　図７は、パッドと吊りリードの実施の形態４の平面図である。この形態では、平面視形状が楕円形のパッド３Ｂに対し、楕円形の長軸および短軸と該楕円形が交差する４つの点に４つの吊りリード５Ａ～５Ｄが配設されている。 <Embodiment 4 of Pad and Hanging Lead>
FIG. 7 is a plan view of Embodiment 4 of the pad and the suspension lead. In this embodiment, four suspension leads 5A to 5D are arranged at four points where the elliptical major axis and minor axis intersect the elliptical shape with respect to the elliptical pad 3B.
　この形態においても、これら４つの吊りリード５Ａ～５Ｄは、直交する２軸Ｌ１，Ｌ２の交点Ｏを楕円形のパッド３Ｂの中心に一致させた際にできる４つの仮想の分割領域Ａ～Ｄの中にそれぞれ存在している。 Also in this embodiment, these four suspension leads 5A to 5D are formed of four virtual divided areas A to D formed when the intersection point O of the two orthogonal axes L1 and L2 coincides with the center of the elliptical pad 3B. Each exists inside.
　図示する形態のパッドと吊りリードによっても、パッドの変形およびたわみの低減効果を期待することができ、作用する樹脂圧に対してパッドの水平姿勢を保持できる作用を期待することができる。 Also with the pad and the suspension lead in the form shown in the figure, it is possible to expect the effect of reducing the deformation and deflection of the pad, and the effect of maintaining the horizontal posture of the pad against the acting resin pressure.
（樹脂封止型センサ装置の実施の形態２）
　次に、樹脂封止型センサ装置の他の実施の形態２について説明する。ここで、図８は本発明の樹脂封止型センサ装置の実施の形態２の平面図であって上方のモールド樹脂体を除いてその内部を示した図である。 (Embodiment 2 of resin-sealed sensor device)
Next, another embodiment 2 of the resin-sealed sensor device will be described. Here, FIG. 8 is a plan view of the second embodiment of the resin-sealed sensor device of the present invention, and shows the inside thereof except for the upper mold resin body.
　図示する樹脂封止型センサ装置１００Ａと図１で示す樹脂封止型センサ装置１００の異なる構成は、長辺にある各吊りリード５Ｃ’、５Ｄ’がモールド樹脂体２０の外部に延出して、外部電通リードとしての作用を有する点である。 The resin-sealed sensor device 100A shown in FIG. 1 and the resin-sealed sensor device 100 shown in FIG. 1 have different configurations in which the suspension leads 5C ′ and 5D ′ on the long sides extend to the outside of the molded resin body 20, It is a point which has an effect | action as an external electricity-conducting lead.
　さらに、吊りリード５Ｃ’、５Ｄ’のいずれか一方は信号用リード兼用吊りリードであり、センサ素子１および回路基板２とワイヤ６を介して電気的に接続されている点である。図８では、吊りリード５Ｃ’が回路基板２とワイヤ６で接続されている例を示してある。 Furthermore, one of the suspension leads 5C 'and 5D' is a suspension lead for signal use, and is electrically connected to the sensor element 1 and the circuit board 2 via the wire 6. FIG. 8 shows an example in which the suspension lead 5 </ b> C ′ is connected to the circuit board 2 with a wire 6.
　吊りリードの一部をこのように外部電通リードとして使用することにより、パッド３を支持する吊りリードを外部電通リードとは別体に設ける必要がなくなるため、図示例では長辺のスペースを小さくすることが可能となり、樹脂封止型センサ装置１００に対して樹脂封止型センサ装置１００Ａを小型化することができる。そして、このことは樹脂封止型センサ装置１００Ａを搭載するプリント基板や機器の小型化にも寄与することになる。 By using a part of the suspension lead as the external conductive lead in this way, it is not necessary to provide the suspension lead supporting the pad 3 separately from the external conductive lead, and therefore the long side space is reduced in the illustrated example. Thus, the resin-sealed sensor device 100A can be downsized relative to the resin-sealed sensor device 100. This also contributes to miniaturization of the printed circuit board and equipment on which the resin-sealed sensor device 100A is mounted.
　さらに、吊りリード５Ｃ’、５Ｄ’がアウターリードを包含することから、これらに放熱作用を期待することもできる。すなわち、回路基板２が動作することによって発生した熱を、パッド３を介して吊りリード５Ｃ’、５Ｄ’から樹脂封止型センサ装置１００Ａの外部へ放熱することができ、装置の放熱性の向上に繋がる。 Furthermore, since the suspension leads 5C 'and 5D' include the outer leads, it is also possible to expect a heat radiation action. That is, the heat generated by the operation of the circuit board 2 can be radiated from the suspension leads 5C ′ and 5D ′ to the outside of the resin-sealed sensor device 100A via the pad 3, thereby improving the heat dissipation of the device. It leads to.
　なお、吊りリード５Ｃ’、５Ｄ’の一方のみでなく、双方が信号用リード兼用吊りリードであってもよい。 In addition, not only one of the suspension leads 5C 'and 5D', but both may be signal leads and suspension leads.
　また、信号用リード兼用吊りリードを樹脂封止型センサ装置１００Ａの外部にあるグランド端子に接続してもよく、このことにより、樹脂封止型センサ装置１００Ａの出力信号に重畳されるノイズを低減することが可能となる。なお、この場合は、回路基板２の下面全体を外部のグランド端子と接続することでノイズに対する耐性強化を図ることができる。 Further, the suspension lead for signal use may be connected to a ground terminal outside the resin-sealed sensor device 100A, thereby reducing noise superimposed on the output signal of the resin-sealed sensor device 100A. It becomes possible to do. In this case, it is possible to enhance resistance to noise by connecting the entire lower surface of the circuit board 2 to an external ground terminal.
（樹脂封止型センサ装置の実施の形態３）
　次に、樹脂封止型センサ装置の他の実施の形態３について説明する。ここで、図９は本発明の樹脂封止型センサ装置の実施の形態３の平面図であって上方のモールド樹脂体を除いてその内部を示した図である。 (Embodiment 3 of resin-sealed sensor device)
Next, another embodiment 3 of the resin-sealed sensor device will be described. Here, FIG. 9 is a plan view of Embodiment 3 of the resin-sealed sensor device according to the present invention, and shows the inside thereof except for the upper mold resin body.
　図示する樹脂封止型センサ装置１００Ｂと図１で示す樹脂封止型センサ装置１００の異なる構成は、センサ素子１ＡがＸ軸方向とＹ軸方向に検出感度を有する２軸の加速度センサ素子１ａ、１ｂから構成されている点である。さらに、４つの吊りリード５Ａ～５Ｄが、Ｘ軸方向を延伸方向とする一対の２つの吊りリードと、Ｘ軸方向に直交するＹ軸方向を延伸方向とする他の一対の２つの吊りリードとから構成され、吊りリード５Ａ～５Ｄの延伸方向と２軸の加速度センサ素子１ａ、１ｂによる検出軸方向が一致している点である。 The resin-sealed sensor device 100B shown in the figure and the resin-sealed sensor device 100 shown in FIG. 1 are different in that the sensor element 1A has a biaxial acceleration sensor element 1a having detection sensitivity in the X-axis direction and the Y-axis direction, 1b. Further, the four suspension leads 5A to 5D each include a pair of two suspension leads whose extending direction is the X-axis direction, and another pair of two suspension leads whose extending direction is the Y-axis direction orthogonal to the X-axis direction. The extending direction of the suspension leads 5A to 5D and the detection axis direction by the biaxial acceleration sensor elements 1a and 1b coincide with each other.
　各センサ素子１ａ、１ｂのそれぞれの検出軸方向に傾斜が生じると、傾斜角度に応じた顕著な出力変動が生じる恐れがある。図示するようにセンサの出力軸と一致する方向に吊りリード５Ａ～５Ｄを設けることにより、加速度センサ素子１ａ、１ｂが搭載されているパッド３の検出軸方向への変形や傾斜を抑制することができ、センサ素子１ａ、１ｂの出力変動の抑制に繋がる。 If there is a tilt in the detection axis direction of each sensor element 1a, 1b, there is a risk of significant output fluctuations depending on the tilt angle. As shown in the figure, by providing the suspension leads 5A to 5D in the direction coinciding with the output axis of the sensor, it is possible to suppress deformation or inclination of the pad 3 on which the acceleration sensor elements 1a and 1b are mounted in the detection axis direction. This leads to suppression of output fluctuations of the sensor elements 1a and 1b.
　なお、図示例は２軸の加速度センサ素子１ａ、１ｂが一体となってセンサ素子１Ａが構成されたものであるが、加速度センサ素子１ａ、１ｂが別体であって、回路基板上で離れた状態で搭載された形態であってもよい（図示略）。 In the illustrated example, the two-axis acceleration sensor elements 1a and 1b are integrated to form the sensor element 1A. However, the acceleration sensor elements 1a and 1b are separate and separated on the circuit board. It may be mounted in a state (not shown).
　このように別体で離れた位置に加速度センサ素子１ａ、１ｂが搭載されている形態では、モールド樹脂体２０の膨張収縮や樹脂封止型センサ装置全体の変形による影響を受け難い部位にそれぞれの素子を搭載することが可能となる。 Thus, in the form in which the acceleration sensor elements 1a and 1b are mounted at separate positions, the respective portions that are not easily affected by the expansion / contraction of the molded resin body 20 or the deformation of the entire resin-sealed sensor device are provided. An element can be mounted.
　さらに、２軸の加速度センサにＺ軸方向の加速度センサ素子を加えた３軸のセンサ素子を適用してもよいし、加速度センサと角速度センサを組み合わせたセンサ素子を適用してもよい。 Furthermore, a triaxial sensor element obtained by adding an acceleration sensor element in the Z-axis direction to a biaxial acceleration sensor may be applied, or a sensor element combining an acceleration sensor and an angular velocity sensor may be applied.
　１，１Ａ…センサ素子、２…回路基板（半導体素子）、３，３Ａ，３Ｂ…パッド、４…外部電通リード、５Ａ，５Ｂ，５Ｃ，５Ｃ’，５Ｄ，５Ｄ’…吊りリード、６…ワイヤ、７…接合材、１０…回路ユニット、２０…モールド樹脂体、１００，１００Ａ，１００Ｂ…樹脂封止型センサ装置、Ｌ１，Ｌ２…直交する２軸 DESCRIPTION OF SYMBOLS 1,1A ... Sensor element, 2 ... Circuit board (semiconductor element), 3, 3A, 3B ... Pad, 4 ... External electric conduction lead, 5A, 5B, 5C, 5C ', 5D, 5D' ... Suspension lead, 6 ... Wire , 7: bonding material, 10 ... circuit unit, 20 ... molded resin body, 100, 100A, 100B ... resin-sealed sensor device, L1, L2 ... two orthogonal axes

Claims (9)

  1. 　物理量検出用のセンサ素子と、
    　前記センサ素子を搭載する回路基板と、
    　前記回路基板を搭載するとともに、平面視形状が矩形、円形、楕円形のいずれかの形状を有するパッドと、
    　前記パッドに接続される吊りリードおよび外部電通リードと、からなる回路ユニットと、
    　前記回路ユニットを封止するモールド樹脂体と、から構成される樹脂封止型センサ装置において、
    　パッドの前記いずれかの形状の中心点に、直交する２つの軸の交点を一致させた際に、該形状が４つの領域に仮に分割されてできる各分割領域に、それぞれ前記吊りリードが配設されている樹脂封止型センサ装置。     A sensor element for detecting a physical quantity;
    A circuit board on which the sensor element is mounted;
    The circuit board is mounted, and a pad having a rectangular shape, a circular shape, or an elliptical shape in plan view;
    A circuit unit comprising a suspension lead and an external electrical lead connected to the pad;
    In a resin-sealed sensor device composed of a molded resin body that seals the circuit unit,
    When the intersection of two orthogonal axes is made to coincide with the center point of any one of the shapes of the pad, the suspension leads are arranged in each of the divided regions formed by temporarily dividing the shape into four regions. Resin-sealed sensor device.
  2. 　前記パッドの平面視形状が矩形であり、前記吊りリードが該矩形の４つの辺のそれぞれの中央領域に配設されている請求項１に記載の樹脂封止型センサ装置。 The resin-sealed sensor device according to claim 1, wherein the pad has a rectangular shape in plan view, and the suspension lead is disposed in a central region of each of the four sides of the rectangle.
  3. 　前記吊りリードが前記矩形の４つの辺のそれぞれの中点に配設されている請求項２に記載の樹脂封止型センサ装置。 3. The resin-sealed sensor device according to claim 2, wherein the suspension lead is disposed at a midpoint of each of the four sides of the rectangle.
  4. 　前記吊りリードが前記矩形の４つの辺のそれぞれの中点において、該辺に対して直交している請求項３に記載の樹脂封止型センサ装置。 4. The resin-encapsulated sensor device according to claim 3, wherein the suspension lead is orthogonal to each side of each of the four sides of the rectangle.
  5. 　少なくとも１つの前記吊りリードが前記外部電通リードを兼用している請求項１に記載の樹脂封止型センサ装置。 2. The resin-encapsulated sensor device according to claim 1, wherein at least one of the suspension leads also serves as the external conductive lead.
  6. 　前記吊りリードの延伸方向と前記センサ素子による検出軸方向が一致している請求項１に記載の樹脂封止型センサ装置。 The resin-encapsulated sensor device according to claim 1, wherein an extending direction of the suspension lead coincides with a detection axis direction of the sensor element.
  7. 　４つの前記吊りリードは、Ｘ軸方向を延伸方向とする一対の２つの吊りリードと、Ｘ軸方向に直交するＹ軸方向を延伸方向とする他の一対の２つの吊りリードと、から構成されており、
    　前記センサ素子は、Ｘ軸方向とＹ軸方向に検出感度を有する２軸の加速度センサ素子である請求項６に記載の樹脂封止型センサ装置。     The four suspension leads include a pair of two suspension leads whose extending direction is the X-axis direction and another pair of two suspension leads whose extending direction is the Y-axis direction orthogonal to the X-axis direction. And
    The resin-sealed sensor device according to claim 6, wherein the sensor element is a biaxial acceleration sensor element having detection sensitivity in the X-axis direction and the Y-axis direction.
  8. 　前記パッドの平面視形状が円形であり、２つの直交する直径と該円形が交差する４つの点に４つの前記吊りリードが配設されている請求項１に記載の樹脂封止型センサ装置。 The resin-sealed sensor device according to claim 1, wherein the shape of the pad in plan view is a circle, and the four suspension leads are arranged at four points where the two perpendicular diameters intersect the circle.
  9. 　前記パッドの平面視形状が楕円形であり、該楕円形の長軸および短軸と該楕円形が交差する４つの点に４つの前記吊りリードが配設されている請求項１に記載の樹脂封止型センサ装置。 2. The resin according to claim 1, wherein the pad has an elliptical shape in plan view, and the four suspension leads are arranged at four points where the major axis and minor axis of the ellipse intersect the ellipse. Sealed sensor device.
PCT/JP2014/052603 2013-06-20 2014-02-05 Resin-sealed sensor device WO2014203554A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE112014002924.6T DE112014002924T5 (en) 2013-06-20 2014-02-05 Resin molded sensor device
US14/899,263 US20160146849A1 (en) 2013-06-20 2014-02-05 Resin-Sealed Sensor Device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013129448A JP2015005597A (en) 2013-06-20 2013-06-20 Resin sealed type sensor device
JP2013-129448 2013-06-20

Publications (1)

Publication Number Publication Date
WO2014203554A1 true WO2014203554A1 (en) 2014-12-24

Family

ID=52104303

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2014/052603 WO2014203554A1 (en) 2013-06-20 2014-02-05 Resin-sealed sensor device

Country Status (4)

Country Link
US (1) US20160146849A1 (en)
JP (1) JP2015005597A (en)
DE (1) DE112014002924T5 (en)
WO (1) WO2014203554A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016113828A1 (en) * 2015-01-16 2016-07-21 株式会社デンソー Composite sensor
CN107976168A (en) * 2017-12-04 2018-05-01 江西天河传感器科技有限公司 A kind of angular displacement sensor trembles service life device

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106796151A (en) * 2014-08-01 2017-05-31 卡尔·弗罗伊登伯格公司 The application of sensor, the filter element including sensor and such filter element
JP2018096941A (en) * 2016-12-16 2018-06-21 株式会社デンソー Collision detection sensor

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006229263A (en) * 2006-06-05 2006-08-31 Renesas Technology Corp Semiconductor device
JP2007048994A (en) * 2005-08-11 2007-02-22 Akita Denshi Systems:Kk Semiconductor device and its manufacturing method
JP2007066967A (en) * 2005-08-29 2007-03-15 Yamaha Corp Semiconductor device and its manufacturing process
JP2011044601A (en) * 2009-08-21 2011-03-03 Tokai Rika Co Ltd Lead frame, package type electronic component and electronic apparatus
JP2013044524A (en) * 2011-08-21 2013-03-04 Denso Corp Angular velocity sensor device
JP2013062351A (en) * 2011-09-13 2013-04-04 Alps Green Devices Co Ltd Mounting structure for electronic component

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4553720B2 (en) * 2004-12-21 2010-09-29 Ｏｋｉセミコンダクタ株式会社 Semiconductor device and manufacturing method thereof
EP1860694A1 (en) * 2005-03-16 2007-11-28 Yamaha Corporation Semiconductor device, semiconductor device manufacturing method and cover frame
EP1795496A2 (en) * 2005-12-08 2007-06-13 Yamaha Corporation Semiconductor device for detecting pressure variations
US8022433B2 (en) * 2006-09-06 2011-09-20 Hitachi Metals, Ltd. Semiconductor sensor device and method for manufacturing same
JP4380748B2 (en) * 2007-08-08 2009-12-09 ヤマハ株式会社 Semiconductor device and microphone package
JP5191915B2 (en) * 2009-01-30 2013-05-08 ルネサスエレクトロニクス株式会社 Semiconductor device and manufacturing method thereof
WO2013080238A1 (en) * 2011-11-28 2013-06-06 日立オートモティブシステムズ株式会社 Composite sensor and method of manufacture therefor
KR101504898B1 (en) * 2013-08-12 2015-03-23 앰코 테크놀로지 코리아 주식회사 Micro-fluidic package

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007048994A (en) * 2005-08-11 2007-02-22 Akita Denshi Systems:Kk Semiconductor device and its manufacturing method
JP2007066967A (en) * 2005-08-29 2007-03-15 Yamaha Corp Semiconductor device and its manufacturing process
JP2006229263A (en) * 2006-06-05 2006-08-31 Renesas Technology Corp Semiconductor device
JP2011044601A (en) * 2009-08-21 2011-03-03 Tokai Rika Co Ltd Lead frame, package type electronic component and electronic apparatus
JP2013044524A (en) * 2011-08-21 2013-03-04 Denso Corp Angular velocity sensor device
JP2013062351A (en) * 2011-09-13 2013-04-04 Alps Green Devices Co Ltd Mounting structure for electronic component

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016113828A1 (en) * 2015-01-16 2016-07-21 株式会社デンソー Composite sensor
JP2016133352A (en) * 2015-01-16 2016-07-25 株式会社デンソー Composite sensor
CN107976168A (en) * 2017-12-04 2018-05-01 江西天河传感器科技有限公司 A kind of angular displacement sensor trembles service life device
CN107976168B (en) * 2017-12-04 2024-03-01 江西天河传感器科技有限公司 Angular displacement sensor tremble life-span device

Also Published As

Publication number Publication date
JP2015005597A (en) 2015-01-08
US20160146849A1 (en) 2016-05-26
DE112014002924T5 (en) 2016-03-10

Similar Documents

Publication Publication Date Title
US7571647B2 (en) Package structure for an acceleration sensor
EP2434297A1 (en) Structure having chip mounted thereon and module provided with the structure
US7615835B2 (en) Package for semiconductor acceleration sensor
US7540190B2 (en) Semiconductor device with acceleration sensor
US7554168B2 (en) Semiconductor acceleration sensor device
US20060130584A1 (en) Acceleration sensor
WO2014203554A1 (en) Resin-sealed sensor device
US10903156B2 (en) Electronic device with stud bumps
JP5978170B2 (en) Transfer mold type sensor device
EP2006248B1 (en) Die mounting stress isolator
JP2009041962A (en) External force detection device and method of manufacturing
US20150355220A1 (en) Inertial sensor module having hermetic seal formed of metal and multi-axis sensor employing the same
JP4428210B2 (en) Mounting structure of physical quantity sensor
US7152473B1 (en) Integrated and multi-axis sensor assembly and packaging
JP5033045B2 (en) Semiconductor element mounting structure
JPWO2009119346A1 (en) Magnetic sensor package
JP6416704B2 (en) Resin-sealed sensor device
WO2020145076A1 (en) Semiconductor device and method for manufacturing same
JP2015210161A (en) Inertia force sensor device
JP2022121271A (en) electric element
JP2018105641A (en) Wiring board for sensor and sensor device
JP2010230640A (en) Acceleration sensor device
KR20150001538A (en) Inertial sensor
JP2010276478A (en) Acceleration sensor device
JP2016211903A (en) Mems device, electronic module, and electronic apparatus

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 14814436

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 14899263

Country of ref document: US

WWE Wipo information: entry into national phase

Ref document number: 112014002924

Country of ref document: DE

122 Ep: pct application non-entry in european phase

Ref document number: 14814436

Country of ref document: EP

Kind code of ref document: A1