WO2014193004A1

WO2014193004A1 - Combi-type ic card manufacturing system and manufacturing method

Info

Publication number: WO2014193004A1
Application number: PCT/KR2013/004768
Authority: WO
Inventors: 전제찬; 조용준
Original assignee: 유비벨록스㈜
Priority date: 2013-05-29
Filing date: 2013-05-30
Publication date: 2014-12-04
Also published as: KR101332184B1

Abstract

The present invention relates to a combi-type IC card manufacturing system for bonding an IC chip to an IC card by means of a solder solution, comprising: a press welding unit for bonding the IC chip to the IC card by means of the solder solution by sequentially applying a heat seal press, an ultrasonic welding press, and a cooling press thereto, wherein the ultrasonic welding press radiates ultrasonic waves from under the bottom of the IC card to the bonded parts of the IC chip and IC card when the press compresses the bonded parts with a predetermined pressure from over the top of the IC chip. Implemented in the present invention is a combi-type IC card manufacturing system for bonding an IC card and an IC chip by using an ultrasonic welding press. The present invention allows the IC chip to be securely bonded to the IC card by sequentially applying the heat seal press, ultrasonic welding press, and cooling press to the bonded parts of the IC card and IC chip. Accordingly, the present invention solves the problem of two bonded points falling apart or electrical short circuits occurring frequently when manufacturing or using a conventional combi-type IC card, improves the quality of the card, and significantly reduces the defect rate during manufacturing.

Description

Combi IC card manufacturing system and manufacturing method

The present invention relates to a combination IC card manufacturing system and a manufacturing method, and more particularly, to a combination IC card manufacturing system and method for bonding an IC chip to an IC card with a solder liquid.

An IC card is an IC chip (Intergrated Circuit Chip) that has the ability to process a specific transaction, and includes a microprocessor, a card operating system, a security module, and a memory.

IC card is generally equipped with contact IC card (Intact IC Card) where the information is input and output by contacting the terminal of the card reader and the electrode, and the antenna is provided inside, the information can be entered without contacting the terminal of the card reader Contactless IC cards and Combi-type IC cards capable of playing both the contact and contactless cards can be classified.

In the case of a COB (Chip On Board) seated on the combination IC card, one side is generally provided with a contact electrode for input and output of information by contacting the contact terminal, the other side for protecting the IC chip An antenna electrode is connected to the molding unit and an antenna winding for input and output of contactless information.

1 and 2 is a view showing the structure of a conventional smart card, Figure 1 is an internal configuration of a general smart card for transmitting and receiving data wirelessly using the built-in antenna coil (or loop coil), Figure 2 is a smart An illustration showing the process of mounting a microchip on a card.

1 and 2, the structure of a general combination IC card wirelessly transmitting and receiving data using an antenna coil embedded in the inlay sheet, the front overlay sheet 11, the front printing sheet in order from the top 12, the inlay sheet 13, the rear printing sheet 14 and the rear overlay sheet 15 are laminated.

The rectangular chip base 30 on which the microchip 31 is mounted is inserted into the recess 12a formed in the card upper layer (for example, the front overlay sheet 11 and the front printing sheet 12), and the microchip 31 ) Is inserted into the recess 11a formed in the inlay sheet 13 so that the

contacts

32a and 32b formed on the chip base 30 come into contact with the contacts a1 and a2 of the antenna coil 20. The

contacts

32a and 32b of the microchip 31 are in contact with the contacts a1 and a2 of the antenna coil 20 to enable energization.

In the combination IC card structure shown in FIGS. 1 and 2, the IC chip and the IC card are conventionally crimped by applying a solder solution and thermally fused. The contacts a1 and a2 and the chip of the antenna coil 20 are compressed. The

contacts

32a and 32b of the base 30 were adhered. This conventional bonding method, however, causes poor adhesion between the two points ((a1, a2) & (32a, 32b)) or frequent electrical shorts during fabrication or use of the combination IC card, resulting in poor card quality. There was a problem of low and high defect rate in the manufacturing process.

The object of the present invention is to solve this problem of the prior art,

The present invention provides a combination IC card manufacturing system for bonding IC cards and IC chips using an ultrasonic fusion press.

Additional features and advantages of the invention will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the invention. The objects and other advantages of the invention will be realized in particular by the structure pointed out in the written description as well as the description and the appended drawings.

The present invention implements a combination IC card manufacturing system for bonding IC cards and IC chips using an ultrasonic fusion press.

The present invention is applied to the bonded portion of the IC card and the IC chip in order to apply a thermal welding press, ultrasonic welding press, cooling press in order to ensure that the IC chip firmly adhered to the IC card, the conventional combination IC card during the production or use of the It solved the problem of poor adhesion between two points ((a1, a2) & (32a, 32b)) or frequent electrical shorts, improved the quality of the card, and greatly reduced the defective rate in the manufacturing process.

1 is an internal configuration of a general smart card for transmitting and receiving data wirelessly using the built-in loop coil.

2 is an exemplary view showing a process of mounting a chip on a combination IC card.

Figure 3 is an exemplary view showing an apparatus configuration of a card manufacturing system according to the present invention.

4 is an exemplary view showing an antenna inspection unit.

5 is an exemplary view showing a configuration of a solder liquid application part.

6 is a view showing a vision inspection monitor screen of the coating state detection unit according to the present invention.

Figure 7 is an illustration showing the configuration of the press fusion unit according to the present invention.

8 is a flow chart showing a combination IC card manufacturing process according to the present invention.

*** Explanation of symbols for main parts of drawing ***

100: combination IC card manufacturing system 200: card identification unit

300: antenna inspection unit 400: solder liquid coating unit

500: coating state detection unit 600: chip seat

700: press welding part 710: first heat welding press

720: second heat fusion press 730: third heat fusion press

740: ultrasonic welding press 750: cooling press

760: ultrasonic generator 800: defective product detection unit

820: RF test unit 840: IC chip test unit

860: separate discharge section

In order to achieve the above object, the combination IC card manufacturing system according to the present invention,

When the IC card is transported, an antenna inspection unit which sends a current to the contact point of the antenna coil and checks whether there is a short circuit in the wiring of the antenna coil, a solder liquid application unit which applies solder solution to the contact point of the antenna coil; A coating state detection unit for checking whether the solder solution is applied to the contacts of the antenna coil is normally performed, a chip seating unit for seating the IC chip at a designated position of the IC card, a thermal welding press, an ultrasonic welding press, and a cooling press And a press fusion unit for crimping the IC chip onto the IC card coated with solder, and a defective part detecting unit for testing whether the IC chip and the antenna coil are in a normal state and separating and discharging the genuine product and the defective product. do.

Preferably, the press fusion unit applies a predetermined heat and pressure to press the seated IC chip onto the IC card to which the solder liquid is applied, and applies the predetermined heat and pressure to the IC chip and the IC card. A second heat fusion press for secondary compression of the squeezer, a third heat fusion press for squeezing the IC chip and the IC card three times by applying a predetermined heat and pressure, and applying the predetermined pressure and ultrasonic waves to the IC chip and the IC And a cooling press for cooling the fusion heat of the crimped IC chip and the IC card by applying a cold and pressure of a predetermined temperature to allow the card to achieve ultrasonic welding.

In order to achieve the above object, the combination IC card manufacturing method according to the present invention,

A process of checking whether there is an IC card transferred into the card manufacturing system and whether there is one card transferred, by flowing a current through the contacts of the antenna coil, and checking whether there is a short circuit in the wiring of the antenna coil; Applying a solder solution to the contacts of the antenna coil, checking whether the application of the solder solution is normally performed at the contacts of the antenna coil, placing the IC chip at a designated position of the IC card, a heat welding press, Ultrasonic fusion press followed by cooling press to sequentially press the seated IC chip to the IC card by the solder liquid, test whether the IC chip and the antenna coil connection state is normal, and check the genuine and defective products It consists of the process of separating and discharging.

Preferably, the process of the IC chip is pressed on the IC card,

Applying a predetermined heat and pressure to squeeze the seated IC chip onto the IC card to which the solder solution is applied, and applying a predetermined heat and pressure to squeeze the IC chip and the IC card to the second heat, and Applying a pressure, terminating the IC chip and the IC card in the third step, applying a predetermined pressure and ultrasonic waves to make the IC chip and the IC card ultrasonic welding, applying cold and pressure at a predetermined temperature, And cooling the fusion heat of the crimped IC chip and IC card.

Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

Figure 3 is an exemplary view showing the device configuration of the combination IC card manufacturing system according to the present invention.

As shown in FIG. 3, the combination IC card manufacturing system 100 according to the present invention includes a card checking unit 200, an antenna inspecting unit 300, a solder liquid applying unit 400, an application state detecting unit 500, The chip mounting part 600, the press fusion part 700, and the defective product detection part 800 are configured to be included.

The card identification unit 200 checks whether there is an IC card on the transfer plate 210 in the card manufacturing system and whether the transferred card is one sheet.

Once the card feed cartridge is mounted and the system 100 starts to drive, the IC cards stacked on the card feed cartridge are ejected one by one from the cartridge and placed on the transfer plate, and the system 100 of the system 100 is moved along the transfer plate. Each process goes through.

In the initial stage of the manufacturing process, the card check unit 200 checks whether the IC card is ejected from the card supply cartridge and correctly placed on the transfer plate, and if it is correctly loaded, one card is correct or not.

The IC cards stacked on the card supply cartridge are milled, forming

recesses

11a and 12a for seating the IC chips by milling, and also contacting the antenna coil a1 with precise milling. , a2) is exposed.

As shown in FIG. 4, the antenna inspection unit 300 sends a current through the contacts a1 and a2 of the exposed antenna coil to check whether there is a short circuit in the wiring of the antenna coil. The antenna inspection unit 300 sends a predetermined electrical signal (for example, 24 Volt) through one contact point (for example, a1) of the antenna coil and the electrical signal (for example 24 Volt) at another contact point (for example, a2) of the antenna coil. Check if is detected. 4 is an exemplary view showing an antenna inspection unit.

As shown in FIG. 5, the solder solution applying unit 400 applies solder solution to the exposed antenna coil contacts a1 and a2. The solder liquid application part 400 firstly, the first solder liquid injector 440 for applying the solder liquid to the right contact a2 of the antenna coil and the second solder for applying the solder liquid to the left contact a1 of the antenna coil. It consists of a liquid injector 480. 5 is an exemplary view showing a configuration of a solder liquid application part.

The coating state detection unit 500 checks whether the solder liquid is normally applied to the exposed portions of the antenna coil contacts a1 and a2. As illustrated in FIG. 6, the manager may check whether the solder is normally applied to the naked eye through the monitor. The present invention determines that the solder liquid is normally applied when the distribution area of the applied solder liquid is at most 116% or less and at least 63%, compared with the areas of the contacts a1 and a2. 6 is a view showing a vision inspection monitor screen of the coating state detection unit according to the present invention. The solder liquid distribution of the left contact a1 shown in FIG. 6 is 80%, and the solder liquid distribution of the right contact a2 is 100%.

The chip seating part 600 seats the IC chip at a designated position of the IC card (for example, the

recesses

11a and 12a) by using a mounting arm. When the chip is seated, the chip seating part 600 applies a press (for example, 0.3 to 1.5 seconds) to the IC chip in a heat of approximately 180 ° C., and transfers the IC card to the next process (for example, a press fusion process). In this case, the IC chip seated on the card prevents the feed rate from moving or disappearing (eg due to wind or shock). After the chip mounting process is completed and before the press fusion process is started, it is checked whether the IC chip is placed on the

recesses

11a and 12a of the IC card.

The press fusion unit 700 sequentially applies a thermal fusion press, an ultrasonic fusion press, and a cooling press to press the IC chip seated on the recess to the IC card.

As shown in FIG. 7, the press welding part 700 includes a first heat welding press 710, a second heat welding press 720, a third heat welding press 730, an ultrasonic welding press 740, and cooling. And a press 750. Press fusion unit 700 through the heat fusion press (710 to 730), the heat of about 180 ° C ~ 220 ° C (hereinafter referred to as "210 ° C") and the pressure of 2 bar ~ 4 bar (for 0.5 seconds to 1.0 seconds) In the following, it is referred to as '3.5 bar') so that the solder liquid is evenly applied to the areas of the contacts (a1, a2) and heat fusion between the IC chip and the IC card. 7 is an exemplary view showing a configuration of a press fusion unit according to the present invention.

The first heat fusion press 710 is applied to 210 ° C heat and 3.5 bar pressure, so that the seated IC chip is pressed on the IC card to which the solder liquid is applied.

The second heat fusion press 720 applies a heat of 210 ° C. and a pressure of 3.5 bar to the IC card on which the primary heat fusion is completed, and performs second compression on the IC card.

The third heat welding press 730 is subjected to the third compression by applying heat of 210 ° C. and 3.5 bar pressure.

The ultrasonic fusion press 740 applies a pressure of 3.5 bar and ultrasonic waves to the IC card, the third thermal fusion press is completed, so that the ultrasonic chip fusion to the IC chip and the card. Through the ultrasonic welding press process 740, the IC chip and the card which have undergone three heat welding presses are more firmly bonded.

The card manufacturing system 100 according to the present invention is provided with an ultrasonic generator 760 at the lower side of the ultrasonic welding press 740 as shown in FIG. . When the ultrasonic welding press 740 applies a press of 3.5 bar pressure from the top, at the same time, the ultrasonic generator 760 radiates ultrasonic waves from the lower portion of the IC card to fuse the bonded portion of the IC chip and the card.

When the ultrasonic wave is radiated from the upper part of the IC card, the plastic layer on the IC card side which is bonded to the IC chip melts, thereby causing a problem in that a defective product is produced. The card manufacturing system 100 according to the present invention solves this problem by providing an ultrasonic generator 760 on the lower side of the ultrasonic welding press 740 to perform the ultrasonic welding press 740 process.

The cooling press 750 applies a cold of about 10 ° C. to 15 ° C. and a pressure of 3.5 bar to the IC card on which the ultrasonic welding press is completed, so that the welding between the IC chip and the card is firm.

The defective product detection unit 800 tests whether the connection state of the IC chip and the antenna coil is normal and discharges the regular product and the defective product separately.

The defective product detection unit 800 includes an RF test unit 820, an IC chip test unit 840, and a separation discharge unit 860. The RF test unit 820 is a device for testing whether the IC chip and the antenna coil are normally connected, and transmits a test signal of 10MHz ~ 20MHz (hereinafter referred to as '13 .56MHz ') to the IC card, the IC chip is tested Check whether the signal is detected normally.

As illustrated in FIG. 3, the IC chip test unit 840 includes eight legs of an IC chip (eg, a power supply terminal, an initialization input terminal, a clock terminal, a spare terminal, a ground terminal, and a program). Contact each of the voltage terminals, serial data input / output terminals, and spare terminals) to test whether all eight terminals are normal.

The separation and discharging unit 860 is a device for discharging the IC card determined by the error or poor of the manufacturing process separated from the regular product. The separation discharge unit 860 includes a regular cartridge and a defective cartridge so that the normal IC card and the defective IC card are discharged to different cartridges.

8 is a flowchart showing a combination IC card manufacturing process according to the present invention.

As shown in Fig. 8, the present invention provides that when the card supply cartridge is mounted and the system 100 starts to drive, the card is first ejected from the card supply cartridge and correctly placed on the transfer plate or, if it is correctly loaded, one card. Checks whether the card is correct or not.

Thereafter, the IC card is transferred to the antenna inspecting unit 300, and the antenna inspecting unit 300 sends a current to the contacts a1 and a2 of the exposed antenna coil as shown in FIG. Check for shorts. The antenna inspection unit 300 sends an electrical signal (for example, 24 Volt) to one contact point (for example, a1) of the antenna coil, and detects the electrical signal (for example, 24 Volt) through another contact point (for example, a2). Check if

When it is confirmed that there is no short circuit in the wiring of the antenna coil, the system 100 applies solder to the left and right contacts a1 and a2 of the exposed antenna coil as shown in FIG. 5. (S200) The system 100 first applies the solder liquid to the right contact a2 of the antenna coil, and then applies the solder liquid to the left contact a1 of the antenna coil.

When the solder liquid coating is completed, it is checked whether the solder liquid is normally applied to the exposed portions of the antenna coil contacts a1 and a2.

And, if it is confirmed that the application of the solder solution is normal, the IC chip is seated at the designated position (for example, the

recesses

11a and 12a) of the IC card by using the mounting arm of the chip seating part 600. (S300) Then, by pressing a light press (for example, 0.3 ~ 0.5 seconds) to the seated IC chip with a heat of approximately 180 ℃, to prevent the IC chip seated on the card to move or disappear due to the speed during the transfer process. The system 100 then checks whether the IC chip is placed on the

recesses

11a and 12a of the IC card before the press fusion process starts. This process is simply to check whether there is an IC chip on the

recesses

11a and 12a of the IC card.

If the IC chip is found to be normally placed on the

recesses

11a and 12a of the IC card before the press fusion process starts, the system applies the thermal welding press, the ultrasonic fusion press, and the cooling press to the IC card in sequence. Make sure chips and cards are firmly glued together. (S400)

System 100 uses an IC chip and a card, as shown in FIG. 7, using three thermal fusion presses 710-730, one ultrasonic fusion press 740, and one cold press 750. Bond firmly.

The system 100 first applies a heat of 210 ° C. and a pressure of 3.5 bar through a first heat fusion press 710 to compress the seated IC chip onto an IC card coated with solder.

Then, through the second heat fusion press 720, by applying a heat of 210 ℃ and a pressure of 3.5 bar to the IC card is completed the first heat fusion, and performs a second compression to the IC card.

Then, through the third heat welding press 730, by applying heat of 210 ℃ and 3.5 bar pressure to the IC card, and performs the third compression again.

Then, the ultrasonic fusion press 740, by applying a pressure and ultrasonic wave of 3.5bar to the IC card is completed the third heat fusion press, so that the ultrasonic fusion to the IC chip and the card.

And, through the cold press 750, by applying a cold of about 12 ℃ ~ 13 ℃ cold and 3.5bar to the IC card is completed the ultrasonic fusion press, so that the fusion between the IC chip and the card is firm.

Thereafter, the system 100 tests whether the connection state of the IC chip and the antenna coil is normal and discharges the regular product and the defective product separately. (S500) The system 100 first transmits a 13.56 MHz test signal to the IC card to test whether the IC chip and the antenna coil are normally connected, and checks whether the IC chip detects the test signal normally.

In addition, the ASI chip test unit 840, which consists of eight needles, has eight terminals (for example, a power supply terminal, an initialization input terminal, a clock terminal, a spare terminal, a ground terminal, a program voltage terminal, and a serial data input / output terminal) of an IC chip. And spare terminals) to test whether all 8 IC chip terminals are normal.

The system 100 separates the defective or defective IC card from the regular product and discharges the defective product into the defective cartridge in the above manufacturing process (S100 to S500).

Although the present invention has been described with reference to the embodiment (s) shown in the drawings, this is merely exemplary, and various modifications can be made therefrom by those skilled in the art, and the embodiments described above ( It will be appreciated that all or some of these may be optionally combined. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

As described above, the present invention has implemented a combination IC card manufacturing system for bonding the IC card and IC chip using an ultrasonic fusion press.

Claims

When the IC card is conveyed, the antenna inspection unit 300 for checking whether there is a short circuit in the wiring of the antenna coil by sending a current to the contact of the antenna coil;

A solder liquid applying part 400 for applying a solder liquid to the contacts of the antenna coil;

An application state detection unit 500 which checks whether the application of the solder solution is normally performed at the contacts of the antenna coil;

A chip seating part 600 which seats the IC chip at a designated position of the IC card;

A press fusion unit 700 which presses the thermal fusion press, the ultrasonic fusion press, and the cooling press in order to press the IC chip onto the IC card to which the solder liquid is applied;

Combi-type IC card manufacturing system characterized in that it comprises a defective product detection unit 800 for testing whether the IC chip and the antenna coil connection state is normal and discharge the regular product and the defective product separately.
The method of claim 1, wherein the press fusion unit 700

Applying a predetermined heat and pressure to press the seated IC chip onto the IC card to which the solder liquid is applied;

A second heat fusion press 720 for applying a predetermined heat and pressure to squeeze the IC chip and the IC card in a second manner;

A third heat fusion press 730 for pressing the IC chip and the IC card on a third basis by applying predetermined heat and pressure;

An ultrasonic fusion press 740 for applying ultrasonic pressure and ultrasonic waves to achieve ultrasonic fusion of the IC chip and the IC card;

Combination type IC card manufacturing system characterized in that it comprises a cooling press (750) for cooling the fusion heat of the crimped IC chip and IC card by applying a cold and pressure of a predetermined temperature.
The method of claim 2, wherein the press fusion unit 700

Combi-type IC card manufacturing system, characterized in that the lower side of the ultrasonic fusion press 740, further comprising an ultrasonic generator 760 capable of radiating ultrasonic waves to the bonding portion of the IC chip and the card.
The method of claim 1, wherein the ultrasonic welding press 740 is

Combination type IC card manufacturing system, characterized in that the ultrasonic wave is radiated from the lower portion of the IC card when the press on the IC chip presses the bonded portion of the IC chip and IC card at a predetermined pressure.
In the combination type IC card manufacturing system which adheres the IC chip to the IC card with the solder liquid,

A heat fusion press, an ultrasonic fusion press, and a cooling press are sequentially applied to each other to include a press fusion unit 700 for adhering the IC chip to the IC card as the solder liquid.

The ultrasonic welding press 740 is a combination IC card characterized in that when the press on the IC chip presses the adhesive portion of the IC chip and the IC card at a predetermined pressure so that the ultrasonic wave is radiated to the adhesive portion under the IC card. Manufacturing system.
The method of claim 5, wherein the press fusion unit 700

Applying a predetermined heat and pressure to press the seated IC chip onto the IC card to which the solder liquid is applied;

A second heat fusion press 720 for applying a predetermined heat and pressure to squeeze the IC chip and the IC card in a second manner;

A third heat fusion press 730 for pressing the IC chip and the IC card on a third basis by applying predetermined heat and pressure;

Ultrasonic fusion press 740 to apply a predetermined pressure and ultrasonic waves, so that the IC chip and IC card ultrasonic welding

Combination type IC card manufacturing system characterized in that it comprises a cooling press (750) for cooling the fusion heat of the crimped IC chip and IC card by applying a cold and pressure of a predetermined temperature.
The method of claim 6, wherein the press fusion unit 700

Combi-type IC card manufacturing system, characterized in that the lower side of the ultrasonic fusion press 740, further comprising an ultrasonic generator (760) capable of emitting ultrasonic waves to the bonded portion of the IC chip and the card.
Checking whether there is an IC card transferred into the card manufacturing system and whether there is one card transferred;

Sending a current through a contact point of the antenna coil to check whether there is a short circuit in the wiring of the antenna coil;

Applying a solder solution to the contacts of the antenna coil;

Checking whether the solder solution is applied to the contacts of the antenna coil normally;

Placing the IC chip at a designated position of the IC card;

Applying a thermal fusion press, an ultrasonic fusion press, and a cooling press in order so that the seated IC chip is pressed onto the IC card by solder liquid;

Combi-type IC card manufacturing method characterized in that it comprises a step of testing whether the IC chip and the antenna coil connection state is normal, and separating and discharging the genuine and defective products.
The process of claim 8, wherein the IC chip is pressed onto the IC card.

Applying a predetermined heat and pressure to squeeze the seated IC chip onto an IC card coated with solder;

Subjecting the IC chip and IC card to the second compression by applying a predetermined heat and pressure;

Subjecting the IC chip and IC card to the third step by applying a predetermined heat and pressure;

Applying a predetermined pressure and ultrasonic waves to achieve ultrasonic welding between the IC chip and the IC card;

Combining IC card manufacturing method comprising the step of cooling the fusion heat of the crimped IC chip and IC card by applying a cold and pressure of a predetermined temperature.
The method of claim 8, wherein the ultrasonic welding press

Combination type IC card manufacturing method characterized in that when the press on the IC chip presses the adhesive portion of the IC chip and the IC card at a predetermined pressure so that the ultrasonic wave is radiated to the adhesive portion under the IC card.
In the combi-type IC card manufacturing method for bonding an IC chip to an IC card with a solder liquid,

And a fusion press process of pressing the IC chip to the IC card as a solder liquid by applying a thermal fusion press, an ultrasonic fusion press, and a cooling press in this order.

The ultrasonic welding press is a combination IC card manufacturing method characterized in that the ultrasonic wave is radiated from the lower portion of the IC card to the adhesive portion when the press on the IC chip presses the adhesive portion of the IC chip and IC card at a predetermined pressure.
The method of claim 11, wherein the fusion press process

Applying a predetermined heat and pressure to squeeze the seated IC chip onto an IC card coated with solder;

Subjecting the IC chip and IC card to the second compression by applying a predetermined heat and pressure;

Subjecting the IC chip and IC card to the third step by applying a predetermined heat and pressure;

Applying a predetermined pressure and ultrasonic waves to achieve ultrasonic welding between the IC chip and the IC card;

Combining IC card manufacturing method comprising the step of cooling the fusion heat of the crimped IC chip and IC card by applying a cold and pressure of a predetermined temperature.