WO2014192205A1 - Substrate holder, electronic apparatus, and display device - Google Patents

Substrate holder, electronic apparatus, and display device Download PDF

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Publication number
WO2014192205A1
WO2014192205A1 PCT/JP2014/001566 JP2014001566W WO2014192205A1 WO 2014192205 A1 WO2014192205 A1 WO 2014192205A1 JP 2014001566 W JP2014001566 W JP 2014001566W WO 2014192205 A1 WO2014192205 A1 WO 2014192205A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
base
substrate holder
boss
shaft portion
Prior art date
Application number
PCT/JP2014/001566
Other languages
French (fr)
Japanese (ja)
Inventor
谷口 善宏
努 菊池
Original Assignee
パナソニック株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パナソニック株式会社 filed Critical パナソニック株式会社
Publication of WO2014192205A1 publication Critical patent/WO2014192205A1/en

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1417Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/142Spacers not being card guides

Definitions

  • the present disclosure relates to a substrate holder including a circuit board and a base for holding the circuit board, and an electronic apparatus such as a display device including the substrate holder.
  • Patent Document 1 discloses a shield structure in a plasma display device.
  • a protrusion is provided on the outer periphery of the chassis member, and the back cover is attached in electrical contact with the protrusion.
  • the shield structure can be improved.
  • Patent Document 2 discloses a structure in which a circuit board is mounted on a chassis base in which a large number of bosses and supporting members are arranged in a plasma display device.
  • the present disclosure provides a substrate holder including a substrate and a base for holding the substrate, the substrate holder capable of being thinned, and an electronic device and a display device including the substrate holder.
  • a substrate holder in the present disclosure includes a base having a convex part, a circuit board having an attachment hole into which the convex part is inserted, and a fixing member for fixing the circuit board to the base, and the fixing member is an attachment hole.
  • the shaft is fixed to the convex portion inserted into the shaft, and is provided at the end opposite to the base of the shaft, and comes into contact with the circuit board in a direction opposite to the base of the circuit board. And a flange that regulates the movement of the.
  • the substrate holder in the present disclosure can be thinned, thereby realizing a thinned electronic device such as a display device.
  • FIG. 1 is a cross-sectional view showing a circuit board holding structure in a general electronic device.
  • FIG. 2 is a perspective view showing a schematic configuration of the substrate holder in the first embodiment.
  • FIG. 3 is an exploded perspective view showing an example of a circuit board holding structure in the first embodiment.
  • FIG. 4 is a partially enlarged view around the boss in the AA cross section of FIG.
  • FIG. 5 is a partial cross-sectional view around the boss of the substrate holder in the first modification of the first embodiment.
  • FIG. 6 is a partial cross-sectional view around the boss of the substrate holder in the second modification of the first embodiment.
  • FIG. 7 is a partial cross-sectional view around the boss of the substrate holder in the third modification of the first embodiment.
  • FIG. 1 is a cross-sectional view showing a circuit board holding structure in a general electronic device.
  • FIG. 2 is a perspective view showing a schematic configuration of the substrate holder in the first embodiment.
  • FIG. 3 is an exploded
  • FIG. 8 is a partial cross-sectional view around the boss of the substrate holder in the fourth modification of the first embodiment.
  • FIG. 9 is a partial cross-sectional view around the boss of the substrate holder in the fifth modification of the first embodiment.
  • FIG. 10 is a perspective view showing an appearance of the display device in the second embodiment.
  • FIG. 11 is an exploded perspective view showing an outline of the structure of the display device according to the second embodiment.
  • FIG. 12 is a partial cross-sectional view around the boss in the display device according to the second embodiment.
  • the inventors of the present application have found that the following problems occur with respect to conventional electronic devices such as display devices.
  • FIG. 1 is a cross-sectional view showing a holding structure of a circuit board 505 in a general electronic device 500.
  • the electronic device 500 shown in FIG. 1 is a display device, and a display panel 501 that displays an image is bonded to a base 503 by an adhesive member 502.
  • the adhesive member 502 is an adhesive double-sided tape or a double-sided adhesive sheet.
  • a convex boss 504 is formed on the base 503, and the circuit board 505 is held on the upper surface of the boss 504.
  • the circuit board 505 is covered with a back cover 506 formed of resin or metal.
  • the holding structure of the circuit board 505 is as follows in more detail. That is, the circuit board 505 is disposed on the upper surface of the boss 504, and in this state, the screw 510 is screwed with a screw thread formed on the inner surface of a hole provided in the boss 504. In this way, the circuit board 505 and the base 503 are fastened.
  • FIG. 2 is a perspective view illustrating a schematic configuration of the substrate holder 10 according to the first embodiment.
  • FIG. 3 is an exploded perspective view showing an example of the holding structure of the circuit board 30 in the first embodiment.
  • FIG. 4 is a partially enlarged view around the boss 21 in the AA cross section of FIG.
  • FIG. 4 a part of the cross section of the substrate holder 10 provided in the electronic device 90 is illustrated.
  • the substrate holder 10 in the first embodiment includes a base 20, a circuit board 30, and a fixing member 40.
  • the base 20 is a member that holds the circuit board 30 and is, for example, a member that is obtained by applying press processing or the like to a metal plate generally called a chassis.
  • the base 20 has a boss 21 as shown in FIG.
  • the boss 21 is an example of a convex portion, and is provided integrally with the base 20 by, for example, pressing when the base 20 is molded.
  • the boss 21 and the base 20 may be separate bodies.
  • the boss 21 may be provided on the base 20 by disposing the boss 21 manufactured as a resin molded product on the main surface of the base 20 (the surface on the side where the circuit board 30 is disposed). .
  • the circuit board 30 is, for example, a board in which an electric circuit composed of a plurality of electronic components 80 is arranged on a board body having a resin plate as a base material, and is held by the base 20.
  • the fixing member 40 is a member that fixes the circuit board 30 to the base 20. Specifically, as shown in FIG. 3, the boss 21 of the base 20 is inserted into the mounting hole 31 of the circuit board 30. In this state, the circuit board 30 is attached to the base 20 by the fixing member 40. Fixed.
  • the fixing member 40 includes a shaft portion 41b that is fixed to the boss 21 that is inserted into the mounting hole 31, and a flange portion 42 that is provided at the end of the shaft portion 41b opposite to the base 20.
  • a head portion 41a having an outer diameter larger than the outer diameter of the shaft portion 41b is provided at one end of the shaft portion 41b.
  • the collar part 42 is provided in the fixing member 40 as an annular member through which the shaft part 41b penetrates and is locked by the head part 41a.
  • the fixing member 40 in the present embodiment includes the screw 41 composed of the shaft portion 41b and the head portion 41a, and the flange portion 42 that is an annular member.
  • the flange portion 42 is realized by a washer made of, for example, metal or resin and having an outer diameter larger than the inner diameter of the mounting hole 31.
  • the circuit board 30 is fixed to the base 20 by the fixing member 40 in a state where the boss 21 provided on the base 20 is inserted into the mounting hole 31 of the circuit board 30. .
  • the circuit board 30 is placed in a space (a space on the side of the boss 21) that exists above the base 20 (in the protruding direction of the boss 21) and that corresponds to the height H of the boss 21.
  • the circuit board 30 is held on the base 20 in a state where at least a part of the thickness is accommodated.
  • the shaft portion 41 b is fixed to the boss 21 by screwing the shaft portion 41 b of the fixing member 40 with the female screw portion 22 of the boss 21.
  • the collar portion 42 abuts on the circuit board 30, thereby restricting the movement of the circuit board 30 with the boss 21 inserted in the direction opposite to the base 20.
  • the distance between the plate-like member 91 to which the substrate holder 10 is attached and the cover 92 covering the substrate holder 10 is assumed to be the upper surface of the boss 21. It can be made shorter than the distance when it is fixed to (the surface of the boss 21 on the flange 42 side).
  • the electronic device 90 includes the substrate holder 10 as a structure that holds the circuit board 30, so that the space between the plate-like member 91 and the cover 92 can be narrowed.
  • the electronic device 90 can be thinned.
  • retainer 10 can accommodate the height of the boss
  • the fixing member 40 is realized with a simple configuration of the screw 41 and the collar portion 42 that is locked by the head portion 41a of the screw 41. Further, since the circuit board 30 is fixed by screwing the screw 41 with the female screw portion 22 of the boss 21, the circuit board 30 is fixed to the base 20 more firmly and surely.
  • the fixing member 40 is made of metal, that is, when the metal screw 41 and the metal collar 42 are used, for example, the base 20 that is a metal chassis and the board body of the circuit board 30 Can be at the same potential. That is, the board body of the circuit board 30 can be grounded via the base 20.
  • the type of the electronic device 90 is not particularly limited, and the electronic device 90 is realized as, for example, a display device such as a television, a digital camera, a video camera, or a mobile terminal.
  • a display device such as a television, a digital camera, a video camera, or a mobile terminal.
  • a display device including a substrate holder having the same characteristics as the substrate holder 10 will be described as a second embodiment.
  • a thin-film insulating member 29 made of resin is used as the base 20 and the circuit board. 30.
  • the total thickness of the insulating member 29 and the circuit board 30 is larger than the height H of the boss 21.
  • the circuit board 30 is urged to the base 20 by the elasticity of the flange portion 42, and the circuit board 30 is fixed in this state. Thereby, the circuit board 30 is stably fixed to the base 20.
  • the insulating member 29 is unnecessary.
  • the case where the electrical insulation is not necessary is exemplified when the wiring pattern, the electronic component, a part of the electronic component, and the like are not exposed on the back surface of the circuit board 30.
  • the back surface of the circuit board 30 is only a ground pattern and a solid ground, the back surface of the circuit board 30 is covered with an insulator, and the base 20
  • the case where is formed of a non-conductive material is also exemplified.
  • the circuit board 30 can be brought into close contact with the base 20 directly or through the insulating member 29.
  • the base 20 can also be used as a radiator for heat generated in the circuit board 30. It is also possible to ground the board body of the circuit board 30 via the base 20 made of metal.
  • FIG. 5 is a partial cross-sectional view around the boss 21 of the substrate holder 11 in the first modification of the first embodiment.
  • the substrate holder 11 shown in FIG. 5 includes a base 20, a circuit board 30, and a fixing member 43.
  • the base 20 has a boss 21, and the circuit board 30 has an attachment hole 31 into which the boss 21 is inserted.
  • the fixing member 43 includes a shaft portion 43b and a flange portion 43a provided at an end portion of the shaft portion 43b.
  • the shaft portion 43 b is a member that functions as a male screw, like the shaft portion 41 b in the substrate holder 10, and is fixed to the boss 21 by screwing with the female screw portion 22 of the boss 21.
  • the flange portion 43a in the present modification is provided integrally with the shaft portion 43b. That is, the collar part 43a is comprised by the head of the fixing member 43 implement
  • the shaft portion 43b of the fixing member 43 is fixed to the boss 21 inserted into the mounting hole 31 of the circuit board 30.
  • the flange portion 43a abuts on the circuit board 30, thereby restricting the movement of the circuit board 30 with the boss 21 inserted in the direction opposite to the base 20.
  • the substrate holder 11 in the present modification has a structure that can be reduced in thickness, whereby the electronic device 90 including the substrate holder 11 can also be reduced in thickness.
  • FIG. 6 is a partial cross-sectional view around the boss 21 of the substrate holder 12 in the second modification of the first embodiment.
  • the substrate holder 12 shown in FIG. 6 includes a base 20, a circuit board 30, and a fixing member 44.
  • the base 20 has a boss 21, and the circuit board 30 has an attachment hole 31 into which the boss 21 is inserted.
  • the fixing member 44 has a shaft portion 44b and a flange portion 44a provided at an end portion of the shaft portion 44b.
  • the shaft portion 44b in this modification has a claw portion 44c provided at the end opposite to the flange portion 44a, and the boss 21 has an engagement portion 24 that engages with the claw portion 44c.
  • the engaging portion 24 is configured by a shaft hole formed in the boss 21 into which the shaft portion 44b is inserted and its peripheral edge.
  • the fixing member 44 in the present modification is formed of, for example, a resin having a predetermined elasticity, and the claw portion 44c is inserted into the engaging portion 24 in a deformed state so as to reduce the outer diameter.
  • the shaft portion 44 b of the fixing member 44 is fixed to the boss 21 that is inserted into the mounting hole 31 of the circuit substrate 30.
  • the flange portion 44a comes into contact with the circuit board 30, thereby restricting the movement of the circuit board 30 with the boss 21 inserted in the direction opposite to the base 20.
  • the substrate holder 12 in the present modification has a structure that can be reduced in thickness, whereby the electronic device 90 including the substrate holder 12 can also be reduced in thickness.
  • the fixing member 44 is fixed to the boss 21 by utilizing the elastic deformation of the claw portion 44c, the attaching process of the fixing member 44 to the boss 21 is simplified. Even if the tip of the claw portion 44c comes into contact with the plate-like member 91, damage to the plate-like member 91 is suppressed by the elastic deformation of the claw portion 44c.
  • circuit board 30 is fixed to the base 20 in a state of being biased by the base 20 due to the elasticity of the flange portion 44a. Thereby, the circuit board 30 is stably fixed to the base 20.
  • the fixing member 44 only needs to have at least the claw portion 44c elastically deformable, and the material of the fixing member 44 is not limited to resin.
  • the fixing member 44 may be made of metal.
  • the board body of the circuit board 30 can be grounded via the base 20.
  • FIG. 7 is a partial cross-sectional view around the boss 21 of the substrate holder 13 in the third modification of the first embodiment.
  • the 7 includes a base 20, a circuit board 30, and a fixing member 45.
  • the base 20 has a boss 21, and the circuit board 30 has an attachment hole 31 into which the boss 21 is inserted.
  • the fixing member 45 has a shaft portion 45b and a flange portion 45a provided at an end portion of the shaft portion 45b.
  • the shaft portion 45b in this modification has a claw portion 45c provided at the end opposite to the flange portion 45a, and the boss 21 has an engagement portion 25 that engages with the claw portion 45c.
  • the engaging part 25 has the auxiliary member 60 which engages with the nail
  • the shaft hole into which the shaft portion 45b is inserted is formed in the boss 21 by punching the boss 21 formed of, for example, a metal plate material.
  • auxiliary member 60 as shown in FIG. 7 in the engaging portion 25 a portion that is more easily engaged with the claw portion 45c can be easily and intentionally created. As a result, the reliability of engagement (hook) between the engaging portion 25 and the claw portion 45c is improved.
  • the distance from the collar portion 45a to the claw portion 45c increases by the thickness of the auxiliary member 60. As a result, for example, the formation of the claw portion 45c in the fixing member 45 is facilitated.
  • the substrate holder 13 in the state where at least a part of the thickness of the circuit board 30 is accommodated in the space on the side of the boss 21 that exists above the base 20.
  • the substrate 30 is held.
  • the substrate holder 13 in the present modification has a structure that can be reduced in thickness, and thus the electronic device 90 including the substrate holder 13 can also be reduced in thickness.
  • FIG. 8 is a partial cross-sectional view around the boss 21 of the substrate holder 14 in the fourth modification of the first embodiment.
  • the 8 includes a base 20, a circuit board 30, and a fixing member 40.
  • the base 20 has a boss 21, and the circuit board 30 has an attachment hole 31 into which the boss 21 is inserted.
  • the substrate holder 14 includes the fixing member 40 as in the substrate holder 10 in the first embodiment described with reference to FIGS. 2 to 4, and the fixing member 40 includes the head portion 41a and the shaft portion 41b. And a flange 41 that is an annular member. Further, the shaft portion 41 b is fixed to the boss 21 inserted in the mounting hole 31 of the circuit board 30. As a result, the collar portion 42 abuts on the circuit board 30, thereby restricting the movement of the circuit board 30 in the direction opposite to the base 20.
  • the circuit board 30 is mounted on the base 20 in a state where at least a part of the thickness of the circuit board 30 is accommodated in the space on the side of the boss 21 that exists above the base 20.
  • the substrate holding body 10 in the first embodiment is also the same as the substrate holding body 10 in the first embodiment.
  • the substrate holder 14 is different from the substrate holder 10 in the first embodiment in that there is a gap between the base 20 and the circuit board 30.
  • the substrate holder 14 separates the circuit board 30 and the base 20 so that the circuit board 30 and the main surface 20a, which is the surface on which the bosses 21 of the base 20 are disposed, are disposed. A separation portion 21a for forming a gap is provided.
  • the separation portion 21a is formed by a step provided by the boss 21.
  • the separation part 21a does not need to be formed in the boss 21, and can be realized by, for example, an annular member made of resin or the like disposed so that the boss 21 penetrates.
  • the separation portion 21 a can be realized by a surface (back surface) of the circuit board 30 on the base 20 side or a protrusion formed on the main surface 20 a of the base 20.
  • the substrate holder 14 can hold the circuit board 30 in a state of floating from the main surface 20 a of the base 20.
  • the circuit board 30 can be attached to the base 20.
  • the circuit board 30 and the main surface 20a of the base 20 it is advantageous that there is a gap between them.
  • the insulating member 29 is disposed only between the back surface of the circuit board 30 and the separation portion 21 a, but the insulating member 29 may also be disposed on the main surface 20 a of the base 20. Further, the insulating member 29 may be omitted if the back surface of the circuit board 30 is formed of a ground pattern or the like that does not cause a problem even if the back surface of the circuit board 30 is in contact with the separation portion 21a. Further, if the diameter of the insulating member 29 is increased, the fastening holding area can be expanded, and the fastening stability and reliability are expected to be improved.
  • the substrate holder 14 in the present modification has a structure that can be thinned, and thus the electronic device 90 including the substrate holder 11 can be thinned. Further, according to the substrate holder 14, in addition to this thinning effect, the effect of increasing the types of circuit boards 30 that can be held, and suppressing heat conduction from the circuit board 30 to other members, etc. Is also played.
  • FIG. 9 is a partial cross-sectional view around the boss 23 of the substrate holder 15 in the fifth modification of the first embodiment.
  • a substrate holder 15 shown in FIG. 9 includes a base 20, a circuit board 30, and a fixing member 46.
  • the base 20 has a boss 23 which is a member different from the base 20 and is joined to the base 20 by caulking or welding, and the circuit board 30 has a mounting hole 31 into which the boss 23 is inserted.
  • the fixing member 46 includes a screw 47 including a head portion 47a having a thin flat head shape and a shaft portion 47b, and a flange portion 42 that is an annular member. Further, the shaft portion 47 b is fixed to the boss 23 inserted in the mounting hole 31 of the circuit board 30. As a result, the collar portion 42 abuts on the circuit board 30, thereby restricting the movement of the circuit board 30 in the direction opposite to the base 20.
  • circuit board 30 is held on the base 20 in a state where at least a part of the thickness of the circuit board 30 is accommodated in a space on the side of the boss 23 existing above the base 20.
  • the thickness of the thin flat head of the head 47a of the screw 47 is preferably 0.2 mm to 1.5 mm, more preferably 0.2 mm to 0.6 mm.
  • the boss 23 in this modification is manufactured as a separate member from the base 20.
  • the female screw portion 22 of the boss 23 screwed with the shaft portion 47b for example, instability of the plate thickness caused by burring, and the uncertainties associated with rolling or cutting are eliminated.
  • the reliability of the fastening fastening of the fixing member 46 to the boss 23 is improved.
  • the cover 92 can be disposed closer to the plate-like member 91, so that the electronic device 90 including the substrate holder 15 is further thinned. Can be realized.
  • FIG. 10 is a perspective view showing an appearance of display device 100 according to the second embodiment.
  • FIG. 11 is an exploded perspective view showing an outline of the structure of the display device 100 according to the second embodiment.
  • FIG. 11 in order to clarify the characteristics of the structure of the display apparatus 100, some components such as various cables and electronic components are not shown.
  • the display device 100 includes a display panel 101 and a substrate holder 110.
  • the display device 100 is, for example, a television that outputs video and audio obtained from received broadcast waves and the like.
  • the display device 100 further includes a back cover 106 that covers the substrate holder 110 and a frame body 108 that covers the periphery of the display panel 101.
  • the display device 100 has a structure in which the display panel 101 and the substrate holder 110 are disposed between the frame body 108 and the back cover 106.
  • the display panel 101 is a device that displays an image.
  • the display panel 101 is, for example, an organic EL display panel having, as a light emitting element, an organic EL (Electro Luminescence) diode that is a light emitting diode having a light emitting layer made of an organic compound.
  • the thickness is, for example, about 1 mm to 3 mm.
  • the type of the display panel 101 is not particularly limited.
  • it may be a plasma display panel that is a self-luminous display panel similar to the organic EL display panel, or a liquid crystal display panel having a backlight unit.
  • the substrate holder 110 is a structure having characteristics common to the substrate holder 10 in the first embodiment.
  • the substrate holder 110 includes a base 120, a circuit board 130, and a fixing member 140 that fixes the circuit board 130 to the base 120. Details of the substrate holder 110 will be described later with reference to FIG.
  • the circuit board 130 is a board having a scan drive circuit that supplies a scan drive signal to the display panel 101 via each of the plurality of scan lines 139.
  • the circuit board 130 is illustrated as a vertically long board arranged along the left and right sides of the base 120 that is a metal chassis.
  • the base 120 is also provided with a plurality of circuit boards 150 each having a signal line driving circuit that supplies a signal voltage to the display panel 101 via each of the plurality of signal lines 159. ing.
  • the circuit board 150 is illustrated as a horizontally long board disposed along the upper and lower sides of the base 120.
  • the scan driver circuit is also called a gate driver or a scan driver
  • the signal line driver circuit is also called a data driver or a source driver.
  • circuit boards 160, 161, 162 are also arranged on the base 120.
  • Each of the circuit boards 160, 161, 162 has an electric circuit, for example, a signal processing circuit that processes a received video signal, a control circuit that controls the operation of the scanning drive circuit and the signal line drive circuit, or power to the outside A power supply circuit that receives the data from the power supply and supplies it to each circuit.
  • a signal processing circuit that processes a received video signal
  • a control circuit that controls the operation of the scanning drive circuit and the signal line drive circuit, or power to the outside
  • a power supply circuit that receives the data from the power supply and supplies it to each circuit.
  • the scanning lines 139 and the signal lines 159 are conceptually represented by dotted lines.
  • the display panel 101 is connected to each circuit board 130 and each circuit board 150 by, for example, a flexible cable having a plurality of scanning lines 139 or signal lines 159.
  • the flexible cable connected to the circuit board 130 (150) is folded inwardly outside the base 120, and in this state, the circuit board 130 (150) is joined to the back surface of the display panel 101. It is fixed to the end of the base 120.
  • the display panel 101 is electrically connected to the circuit board 130 (150), and is disposed on the opposite side of the circuit board 130 (150) with the base 120 interposed therebetween.
  • circuit board 130 As described above, a plurality of circuit boards are arranged on the base 120. In order to clearly describe the characteristics of the board holder 110 of the present embodiment, attention is paid to one circuit board 130, and The following description will focus on the holding structure for the circuit board 130.
  • FIG. 12 is a partial cross-sectional view around the boss 121 in the display device 100 according to the second embodiment.
  • the substrate holder 110 includes a base 120, a circuit substrate 130, and a fixing member 140.
  • the base 120 has a boss 121
  • the circuit board 130 has a mounting hole 131 into which the boss 121 is inserted.
  • the base 120 is bonded to the display panel 101 by an adhesive member 102 such as a double-sided tape or a double-sided adhesive sheet.
  • an insulating member 129 that electrically insulates the base 120 and the circuit board 130 is disposed between the base 120 and the circuit board 130.
  • the fixing member 140 includes a shaft portion 141b and a flange portion 142 provided at an end portion of the shaft portion 141b.
  • a head portion 141a having an outer diameter larger than the outer diameter of the shaft portion 141b is provided at one end of the shaft portion 141b.
  • the collar part 142 is provided in the fixing member 140 as an annular member through which the shaft part 141b passes and is locked by the head part 141a.
  • the fixing member 140 in the present embodiment has a screw 141 composed of a shaft portion 141b and a head portion 141a, and a collar portion 142 that is an annular member.
  • the flange 142 is realized by, for example, a washer made of metal or resin and having an outer diameter larger than the inner diameter of the mounting hole 131.
  • the boss 121 provided on the base 120 is inserted in the mounting hole 131 of the circuit board 130 in the direction opposite to the base 120 of the circuit board 130. Is restricted by the collar 142.
  • the thickness of the base 120 is 0.6 mm
  • the thickness of the insulating member 129 is 0.15 mm
  • the thickness of the circuit board 130 is 1.0 mm.
  • the height H of the boss 121 is smaller than 1.15 mm (for example, 1.0 mm), and the length of the shaft 141b of the screw 141 is, for example, 2.0 mm.
  • the thickness of the collar part 142 is 0.5 mm, for example, and this substantially corresponds with the length of the incomplete thread part of the axial part 141b. That is, the portion of the shaft portion 141b that is not used as a male screw is used to connect the shaft portion 141b and the flange portion 142, so that the flange portion 142 does not impair the function of the shaft portion 141b as a male screw. .
  • the substrate holder 110 according to the second embodiment has structural features in common with the substrate holder 10 according to the first embodiment described above.
  • the circuit board 130 is placed in a space (a space on the side of the boss 121) that exists above the base 120 (in the protruding direction of the boss 121) and that corresponds to the height H of the boss 121.
  • the circuit board 130 is held on the base 120 in a state where at least a part of the thickness is accommodated.
  • the distance between the display panel 101 and the back cover 106 is made shorter than the distance when the circuit board 130 is fixed to the upper surface of the boss 121. Can do.
  • the substrate holder 110 As described above, according to the substrate holder 110, the height of the boss 121 for holding the circuit board 130 can be accommodated within the thickness of the circuit board 130. As a result, the display device 100 can be thinned. It becomes.
  • the circuit board 130 is a board having a scanning drive circuit, and is a board directly connected to the display panel 101 by a flexible cable or the like. For this reason, it is preferable to be disposed at a position close to the display panel 101, that is, at an end of the base 120 that is a chassis of the display device 100.
  • the scanning drive circuit can be configured without arranging electronic components or the like on the back surface of the substrate, the back surface of the circuit substrate 130 is brought into close contact with the base 120 directly or through the insulating member 129. Is possible.
  • the substrate holder 110 As a structure for holding such a circuit board 130, a portion corresponding to the end of the base 120 in the display device 100 can be thinned.
  • the peripheral portion of the display device 100 can be made thinner than before.
  • the back cover 106 of the display device 100 is tilted so as to approach the base 120 toward the outside (left side in FIG. 12).
  • the substrate holder 110 at least a part of the thickness of the circuit board 130 is accommodated in the space corresponding to the height H of the boss 121 of the base 120, so that the back cover 106 is tilted more greatly. Can do. Therefore, the thickness of the outermost part of the display device 100 (in FIG. 12, the leftmost part of the display device 100) can be reduced.
  • the display device 100 can be made thinner in appearance.
  • the display device 100 of the present embodiment can be thinned by including the substrate holder 110 as a structure that holds a substrate such as the circuit board 130.
  • the shaft portion of the fixing member is screwed into the female screw portion of the boss, and the circuit board is formed by the collar portion that is an annular member.
  • any of the substrate holders (11, 12, 13, 14) corresponding to the various modified examples (modified examples 1 to 4) of the first embodiment described above is the substrate such as the circuit board 130 in the display device 100. It may be provided as a structure that holds
  • the substrate holder 110 may have different types of holding structures.
  • the substrate holder 110 employs the structure shown in FIG. 12 as a structure for holding the circuit boards 130 and 150, and the substrate holder 14 shown in FIG. 8 as a structure for holding the circuit boards 160, 161, 162.
  • a holding structure (a structure having a separation portion) may be adopted.
  • Embodiments 1 and 2 have been described as examples of the technology disclosed in the present application. However, the technology in the present disclosure is not limited to this, and can also be applied to an embodiment in which changes, replacements, additions, omissions, and the like are appropriately performed. Moreover, it is also possible to combine each component demonstrated in the said Embodiment 1 and 2 into a new embodiment.
  • the outer diameter of the flange portion 42 is larger than the inner diameter of the attachment hole 31, but the relationship between the size of the flange portion 42 and the attachment hole 31 is not limited thereto.
  • the relationship between the size of the flange 42 and the attachment hole 31 may be such that the flange 42 provided in the fixing member 40 does not come out of the attachment hole 31.
  • the major axis may be larger than the inner diameter of the attachment hole 31.
  • the shape of the mounting hole 31 included in the circuit board 30 is not necessarily a round hole, but may be a square hole. That is, the mounting hole 31 may be any size and shape that allows the boss 21 to be inserted and that restricts the movement of the circuit board 30 in the direction opposite to the base 20 by the flange 42.
  • the shape of the collar portion 42 is not necessarily a circle or an ellipse with the shaft portion 41b as the center, and may be a shape constituted by a polygon or a straight line and a curve.
  • the flange portion 42 extends on both the left and right sides of the shaft portion 41 b and is arranged so as to press the left and right peripheral edges of the attachment hole 31. It may be arranged so as to hold only one peripheral edge. That is, the fixing member 40 may be L-shaped as a whole.
  • the total thickness of the insulating member 29 and the circuit board 30 is greater than the height H of the boss 21. That is, the upper surface of the boss 21 is positioned below the main surface of the circuit board 30 (the surface opposite to the base 20).
  • the upper surface of the boss 21 may be positioned above the main surface of the circuit board 30. In short, a part of the boss 21 may protrude from the mounting hole 31 of the circuit board 30.
  • the flange 42 is bent or bent downward or has a portion protruding downward, the flange 42 abuts against the circuit board 30. It is possible to make it. In other words, it is possible to regulate the movement of the circuit board 30 in the direction opposite to the base 20 by the collar portion 42.
  • fixing member 40 and its surrounding structure are the fixing member (43, 44, 45, 140) and its surrounding structure in the first to fourth modifications of the first embodiment and the second embodiment. Also applies.
  • the display device 100 is a television.
  • the display device 100 may be realized as a device including a display panel other than the television.
  • the display device 100 includes a monitor display that displays images input from the outside, digital signage that is used as an advertising medium, a portable terminal that accepts user operations via a touch panel, a tablet terminal, and a table-type display device. It may be realized as.
  • the present disclosure is a substrate holder that includes a substrate and a base that holds a circuit board, and can be applied to a substrate holder that is required to be thin.
  • the present disclosure is applicable to electronic devices such as a television, a monitor display, a digital signage, a mobile terminal, a tablet terminal, and a table type display device.

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  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

A substrate holder (10) is provided with a base (20) which has convex portions (21), a circuit board (30) which has mounting holes (31) into which the convex portions (21) are to be inserted, and fastening members (40) for fastening the circuit board (30) to the base (20). The fastening members (40) are each provided with: a shaft portion (41b) which is to be fastened to a respective convex portion (21) when the convex portion (21) is inserted into a respective mounting hole (31); and a flange portion (42) which is provided on an end portion of the respective shaft portion (41b) on the opposite side from the base (20), and which abuts the circuit board (30) to restrict movement of the circuit board (30) in a direction opposite the base (20).

Description

基板保持体、電子機器、およびディスプレイ装置Substrate holder, electronic device, and display device
 本開示は、回路基板と回路基板を保持する基台とを備える基板保持体、および基板保持体を備える、ディスプレイ装置などの電子機器に関する。 The present disclosure relates to a substrate holder including a circuit board and a base for holding the circuit board, and an electronic apparatus such as a display device including the substrate holder.
 特許文献1は、プラズマディスプレイ装置におけるシールド構造を開示する。このプラズマディスプレイ装置では、シャーシ部材の外周部に突起部が設けられ、突起部にバックカバーを電気的に接触させて取り付ける。これにより、シールド構造の改善が図られる。 Patent Document 1 discloses a shield structure in a plasma display device. In this plasma display device, a protrusion is provided on the outer periphery of the chassis member, and the back cover is attached in electrical contact with the protrusion. Thereby, the shield structure can be improved.
 また、特許文献2は、プラズマディスプレイ装置において、ボス部および支持部材が多数配置されたシャーシベースに回路基板が装着される構造を開示する。 Patent Document 2 discloses a structure in which a circuit board is mounted on a chassis base in which a large number of bosses and supporting members are arranged in a plasma display device.
特開2004-69888号公報JP 2004-69888 A 特開2005-331948号公報JP 2005-331948 A
 本開示は、基板と基板を保持する基台とを備える基板保持体であって、薄型化が可能な基板保持体、並びに、その基板保持体を備える電子機器およびディスプレイ装置を提供する。 The present disclosure provides a substrate holder including a substrate and a base for holding the substrate, the substrate holder capable of being thinned, and an electronic device and a display device including the substrate holder.
 本開示における基板保持体は、凸部を有する基台と、凸部が挿入される取付孔を有する回路基板と、回路基板を基台に固定する固定部材とを備え、固定部材は、取付孔に挿入された状態の凸部に固定される軸部と、軸部の基台とは反対側の端部に備えられ、回路基板と当接することで、回路基板の基台とは反対方向への移動を規制する鍔部とを有する。 A substrate holder in the present disclosure includes a base having a convex part, a circuit board having an attachment hole into which the convex part is inserted, and a fixing member for fixing the circuit board to the base, and the fixing member is an attachment hole. The shaft is fixed to the convex portion inserted into the shaft, and is provided at the end opposite to the base of the shaft, and comes into contact with the circuit board in a direction opposite to the base of the circuit board. And a flange that regulates the movement of the.
 本開示における基板保持体は薄型化が可能であり、これにより、薄型化された、ディスプレイ装置などの電子機器を実現することができる。 The substrate holder in the present disclosure can be thinned, thereby realizing a thinned electronic device such as a display device.
図1は、一般的な電子機器における回路基板の保持構造を示す断面図である。FIG. 1 is a cross-sectional view showing a circuit board holding structure in a general electronic device. 図2は、実施の形態1における基板保持体の構成概要を示す斜視図である。FIG. 2 is a perspective view showing a schematic configuration of the substrate holder in the first embodiment. 図3は、実施の形態1における回路基板の保持構造の一例を示す分解斜視図である。FIG. 3 is an exploded perspective view showing an example of a circuit board holding structure in the first embodiment. 図4は、図2のA-A断面におけるボス周辺の部分拡大図である。FIG. 4 is a partially enlarged view around the boss in the AA cross section of FIG. 図5は、実施の形態1の変形例1における基板保持体のボス周辺の部分断面図である。FIG. 5 is a partial cross-sectional view around the boss of the substrate holder in the first modification of the first embodiment. 図6は、実施の形態1の変形例2における基板保持体のボス周辺の部分断面図である。FIG. 6 is a partial cross-sectional view around the boss of the substrate holder in the second modification of the first embodiment. 図7は、実施の形態1の変形例3における基板保持体のボス周辺の部分断面図である。FIG. 7 is a partial cross-sectional view around the boss of the substrate holder in the third modification of the first embodiment. 図8は、実施の形態1の変形例4における基板保持体のボス周辺の部分断面図である。FIG. 8 is a partial cross-sectional view around the boss of the substrate holder in the fourth modification of the first embodiment. 図9は、実施の形態1の変形例5における基板保持体のボス周辺の部分断面図である。FIG. 9 is a partial cross-sectional view around the boss of the substrate holder in the fifth modification of the first embodiment. 図10は、実施の形態2におけるディスプレイ装置の外観を示す斜視図である。FIG. 10 is a perspective view showing an appearance of the display device in the second embodiment. 図11は、実施の形態2におけるディスプレイ装置の構造の概要を示す分解斜視図である。FIG. 11 is an exploded perspective view showing an outline of the structure of the display device according to the second embodiment. 図12は、実施の形態2のディスプレイ装置におけるボス周辺の部分断面図である。FIG. 12 is a partial cross-sectional view around the boss in the display device according to the second embodiment.
 本願発明者らは、従来のディスプレイ装置等の電子機器に関し、以下の問題が生じることを見出した。 The inventors of the present application have found that the following problems occur with respect to conventional electronic devices such as display devices.
 図1は、一般的な電子機器500における回路基板505の保持構造を示す断面図である。 FIG. 1 is a cross-sectional view showing a holding structure of a circuit board 505 in a general electronic device 500.
 具体的には、図1に示す電子機器500はディスプレイ装置であり、映像を表示するディスプレイパネル501が、接着部材502により基台503と接着されている。接着部材502は、粘着性を有する両面テープまたは両面粘着シート等である。 Specifically, the electronic device 500 shown in FIG. 1 is a display device, and a display panel 501 that displays an image is bonded to a base 503 by an adhesive member 502. The adhesive member 502 is an adhesive double-sided tape or a double-sided adhesive sheet.
 基台503には凸形状のボス504が形成されており、回路基板505はボス504の上面で保持されている。また、樹脂または金属で形成されるバックカバー506により回路基板505が覆われている。 A convex boss 504 is formed on the base 503, and the circuit board 505 is held on the upper surface of the boss 504. The circuit board 505 is covered with a back cover 506 formed of resin or metal.
 回路基板505の保持構造については、より詳細には以下の通りである。すなわち、ボス504の上面に回路基板505が配置され、この状態で、ネジ510が、ボス504に設けられた孔の内面に形成されたネジ山と螺合している。このようにして、回路基板505と基台503とが締結されている。 The holding structure of the circuit board 505 is as follows in more detail. That is, the circuit board 505 is disposed on the upper surface of the boss 504, and in this state, the screw 510 is screwed with a screw thread formed on the inner surface of a hole provided in the boss 504. In this way, the circuit board 505 and the base 503 are fastened.
 このような構造では、回路基板505と基台503のとの間には、ボス504の高さhに対応した空間、つまり、ネジ510による締結のためのネジ山の軸方向の長さに対応した空間が必要である。 In such a structure, the space corresponding to the height h of the boss 504 between the circuit board 505 and the base 503, that is, the axial length of the screw thread for fastening with the screw 510 is supported. Space is needed.
 すなわち、簡単にいうと、図1に示す一般的な電子機器500では、回路基板505と基台503との間には、ボス504の高さhに対応した空隙が必然的に生じ、このことが、電子機器500の薄型化を阻害する一因となっている。 In other words, in the general electronic device 500 shown in FIG. 1, a gap corresponding to the height h of the boss 504 is inevitably generated between the circuit board 505 and the base 503. However, this is one factor that hinders the thickness reduction of the electronic device 500.
 本開示は、このような知見に基づいてなされたものであり、本願発明者らが鋭意検討した結果、薄型化が可能な基板保持体の構造についての着想を得た。 The present disclosure has been made on the basis of such knowledge, and as a result of intensive studies by the inventors of the present application, the idea of the structure of the substrate holder capable of being thinned was obtained.
 以下、適宜図面を参照しながら、実施の形態を詳細に説明する。但し、必要以上に詳細な説明は省略する場合がある。例えば、既によく知られた事項の詳細説明や実質的に同一の構成に対する重複説明を省略する場合がある。これは、以下の説明が不必要に冗長になるのを避け、当業者の理解を容易にするためである。 Hereinafter, embodiments will be described in detail with reference to the drawings as appropriate. However, more detailed description than necessary may be omitted. For example, detailed descriptions of already well-known matters and repeated descriptions for substantially the same configuration may be omitted. This is to avoid the following description from becoming unnecessarily redundant and to facilitate understanding by those skilled in the art.
 なお、本願発明者らは、当業者が本開示を十分に理解するために添付図面および以下の説明を提供するのであって、これらによって請求の範囲に記載の主題を限定することを意図するものではない。 The inventors of the present application provide the accompanying drawings and the following description in order for those skilled in the art to fully understand the present disclosure, and are intended to limit the subject matter described in the claims. is not.
 (実施の形態1)
 以下、図2~図8を用いて実施の形態1を説明する。
(Embodiment 1)
The first embodiment will be described below with reference to FIGS.
 [1-1.構成]
 図2は、実施の形態1における基板保持体10の構成概要を示す斜視図である。
[1-1. Constitution]
FIG. 2 is a perspective view illustrating a schematic configuration of the substrate holder 10 according to the first embodiment.
 図3は、実施の形態1における回路基板30の保持構造の一例を示す分解斜視図である。 FIG. 3 is an exploded perspective view showing an example of the holding structure of the circuit board 30 in the first embodiment.
 図4は、図2のA-A断面におけるボス21周辺の部分拡大図である。 FIG. 4 is a partially enlarged view around the boss 21 in the AA cross section of FIG.
 なお、図4では、電子機器90に備えられた状態の基板保持体10の断面の一部が図示されている。 In FIG. 4, a part of the cross section of the substrate holder 10 provided in the electronic device 90 is illustrated.
 実施の形態1における基板保持体10は、基台20と、回路基板30と、固定部材40とを備える。 The substrate holder 10 in the first embodiment includes a base 20, a circuit board 30, and a fixing member 40.
 基台20は、回路基板30を保持する部材であり、例えば、一般にシャーシと呼ばれる、金属の板材にプレス加工等を加えることで得られる部材である。基台20は、図3に示すようにボス21を有する。 The base 20 is a member that holds the circuit board 30 and is, for example, a member that is obtained by applying press processing or the like to a metal plate generally called a chassis. The base 20 has a boss 21 as shown in FIG.
 ボス21は、凸部の一例であり、例えば、基台20を成型する際のプレス加工によって基台20に一体に設けられる。なお、ボス21と基台20とは別体であってもよい。例えば、樹脂の成型品として作製されたボス21を、基台20の主面(回路基板30が配置される側の面)に配置することで、ボス21が基台20に備えられてもよい。 The boss 21 is an example of a convex portion, and is provided integrally with the base 20 by, for example, pressing when the base 20 is molded. The boss 21 and the base 20 may be separate bodies. For example, the boss 21 may be provided on the base 20 by disposing the boss 21 manufactured as a resin molded product on the main surface of the base 20 (the surface on the side where the circuit board 30 is disposed). .
 回路基板30は、例えば、樹脂製の板材を基材とする基板本体に、複数の電子部品80で構成された電気回路が配置された基板であり、基台20に保持されている。 The circuit board 30 is, for example, a board in which an electric circuit composed of a plurality of electronic components 80 is arranged on a board body having a resin plate as a base material, and is held by the base 20.
 固定部材40は、回路基板30を基台20に固定する部材である。具体的には、図3に示すように、基台20が有するボス21が、回路基板30が有する取付孔31に挿入され、その状態で、固定部材40によって、回路基板30が基台20に固定される。 The fixing member 40 is a member that fixes the circuit board 30 to the base 20. Specifically, as shown in FIG. 3, the boss 21 of the base 20 is inserted into the mounting hole 31 of the circuit board 30. In this state, the circuit board 30 is attached to the base 20 by the fixing member 40. Fixed.
 固定部材40は、取付孔31に挿入された状態のボス21に固定される軸部41bと、軸部41bの基台20とは反対側の端部に備えられた鍔部42とを有する。 The fixing member 40 includes a shaft portion 41b that is fixed to the boss 21 that is inserted into the mounting hole 31, and a flange portion 42 that is provided at the end of the shaft portion 41b opposite to the base 20.
 本実施の形態では、軸部41bの一端には、軸部41bの外径よりも大きな外径を有する頭部41aが設けられている。また、鍔部42は、軸部41bが貫通し、頭部41aによって係止される環状部材として固定部材40に備えられている。 In the present embodiment, a head portion 41a having an outer diameter larger than the outer diameter of the shaft portion 41b is provided at one end of the shaft portion 41b. Moreover, the collar part 42 is provided in the fixing member 40 as an annular member through which the shaft part 41b penetrates and is locked by the head part 41a.
 つまり、本実施の形態における固定部材40は、軸部41bと頭部41aとで構成されるネジ41、および、環状部材である鍔部42を有する。鍔部42は、例えば、金属または樹脂を素材とする、外径が取付孔31の内径よりも大きなワッシャにより実現される。 That is, the fixing member 40 in the present embodiment includes the screw 41 composed of the shaft portion 41b and the head portion 41a, and the flange portion 42 that is an annular member. The flange portion 42 is realized by a washer made of, for example, metal or resin and having an outer diameter larger than the inner diameter of the mounting hole 31.
 このように、基板保持体10では、基台20に設けられたボス21が、回路基板30の取付孔31に挿入された状態で、回路基板30が基台20に固定部材40によって固定される。 As described above, in the substrate holder 10, the circuit board 30 is fixed to the base 20 by the fixing member 40 in a state where the boss 21 provided on the base 20 is inserted into the mounting hole 31 of the circuit board 30. .
 つまり、図4に示すように、基台20の上方(ボス21の突出方向)に存在する、ボス21の高さHに対応する空間(ボス21の側方の空間)に、回路基板30の厚みの少なくとも一部が収容された状態で、回路基板30が基台20に保持される。 That is, as shown in FIG. 4, the circuit board 30 is placed in a space (a space on the side of the boss 21) that exists above the base 20 (in the protruding direction of the boss 21) and that corresponds to the height H of the boss 21. The circuit board 30 is held on the base 20 in a state where at least a part of the thickness is accommodated.
 具体的には、固定部材40の軸部41bが、ボス21が有する雌ネジ部22と螺合することで、軸部41bがボス21に固定される。その結果、鍔部42が回路基板30に当接し、これにより、ボス21が挿入された状態の回路基板30の、基台20とは反対方向への移動が規制される。 Specifically, the shaft portion 41 b is fixed to the boss 21 by screwing the shaft portion 41 b of the fixing member 40 with the female screw portion 22 of the boss 21. As a result, the collar portion 42 abuts on the circuit board 30, thereby restricting the movement of the circuit board 30 with the boss 21 inserted in the direction opposite to the base 20.
 すなわち、基板保持体10を備える電子機器90では、基板保持体10が取り付けられる板状部材91と、基板保持体10を覆うカバー92との間の距離を、仮に回路基板30がボス21の上面(ボス21の鍔部42側の面)に固定されたとした場合の当該距離よりも短くすることができる。 That is, in the electronic device 90 including the substrate holder 10, the distance between the plate-like member 91 to which the substrate holder 10 is attached and the cover 92 covering the substrate holder 10 is assumed to be the upper surface of the boss 21. It can be made shorter than the distance when it is fixed to (the surface of the boss 21 on the flange 42 side).
 つまり、簡単にいうと、電子機器90が、回路基板30を保持する構造体として基板保持体10を備えることで、板状部材91とカバー92との間を狭くすることができ、これにより、電子機器90の薄型化が可能となる。 That is, simply speaking, the electronic device 90 includes the substrate holder 10 as a structure that holds the circuit board 30, so that the space between the plate-like member 91 and the cover 92 can be narrowed. The electronic device 90 can be thinned.
 このように、基板保持体10は、ボス21の高さを、回路基板30の厚み内に収めることができるため、ボス21の高さが電子機器90の厚みに与える影響を抑制することができる。 Thus, since the board | substrate holder | retainer 10 can accommodate the height of the boss | hub 21 in the thickness of the circuit board 30, it can suppress the influence which the height of the boss | hub 21 has on the thickness of the electronic device 90. .
 また、本実施の形態では、ネジ41と、ネジ41の頭部41aで係止される鍔部42という簡易な構成で固定部材40が実現される。さらに、ネジ41がボス21の雌ネジ部22と螺合することで回路基板30が固定されるため、回路基板30の基台20への固定がより強固かつ確実なものとなる。 Further, in the present embodiment, the fixing member 40 is realized with a simple configuration of the screw 41 and the collar portion 42 that is locked by the head portion 41a of the screw 41. Further, since the circuit board 30 is fixed by screwing the screw 41 with the female screw portion 22 of the boss 21, the circuit board 30 is fixed to the base 20 more firmly and surely.
 また、固定部材40が金属製である場合、つまり、金属製のネジ41および金属製の鍔部42を用いた場合、例えば、金属製のシャーシである基台20と、回路基板30の基板本体とを同電位にすることができる。つまり、基台20を介して回路基板30の基板本体を接地することが可能となる。 When the fixing member 40 is made of metal, that is, when the metal screw 41 and the metal collar 42 are used, for example, the base 20 that is a metal chassis and the board body of the circuit board 30 Can be at the same potential. That is, the board body of the circuit board 30 can be grounded via the base 20.
 なお、電子機器90の種類に特に限定はなく、例えば、テレビ等のディスプレイ装置、デジタルカメラ、ビデオカメラ、または、携帯端末等として電子機器90が実現される。上記の基板保持体10と同じ特徴を有する基板保持体を備えるディスプレイ装置については、実施の形態2として説明する。 Note that the type of the electronic device 90 is not particularly limited, and the electronic device 90 is realized as, for example, a display device such as a television, a digital camera, a video camera, or a mobile terminal. A display device including a substrate holder having the same characteristics as the substrate holder 10 will be described as a second embodiment.
 また、本実施の形態では、金属製の基台20と、回路基板30との間を電気的に絶縁するために、例えば樹脂を素材とする薄膜状の絶縁部材29が基台20と回路基板30との間に配置されている。この絶縁部材29と回路基板30との厚みの合計は、ボス21の高さHよりも大きい。 Further, in the present embodiment, in order to electrically insulate between the metal base 20 and the circuit board 30, for example, a thin-film insulating member 29 made of resin is used as the base 20 and the circuit board. 30. The total thickness of the insulating member 29 and the circuit board 30 is larger than the height H of the boss 21.
 そのため、ネジ41がボス21の雌ネジ部22にネジ入れられることで、鍔部42が有する弾性により回路基板30が基台20に付勢され、この状態で回路基板30が固定される。これにより、回路基板30が基台20に安定的に固定される。 Therefore, when the screw 41 is screwed into the female screw portion 22 of the boss 21, the circuit board 30 is urged to the base 20 by the elasticity of the flange portion 42, and the circuit board 30 is fixed in this state. Thereby, the circuit board 30 is stably fixed to the base 20.
 なお、回路基板30の裏面(基台20側の面)と基台20との電気的な絶縁の必要がない場合、絶縁部材29は不要である。当該電気的な絶縁の必要がない場合とは、回路基板30の裏面に、配線パターン、電子部品、および電子部品の一部等が露出していない場合が例示される。また、当該電気的な絶縁の必要がない場合として、回路基板30の裏面がグランドパターンおよびベタ塗りグランドのみの場合、回路基板30の裏面が絶縁体で覆われている場合、並びに、基台20が非導電性の素材で形成されている場合なども例示される。 In addition, when there is no need for electrical insulation between the back surface (surface on the base 20 side) of the circuit board 30 and the base 20, the insulating member 29 is unnecessary. The case where the electrical insulation is not necessary is exemplified when the wiring pattern, the electronic component, a part of the electronic component, and the like are not exposed on the back surface of the circuit board 30. Further, as the case where the electrical insulation is not necessary, the back surface of the circuit board 30 is only a ground pattern and a solid ground, the back surface of the circuit board 30 is covered with an insulator, and the base 20 The case where is formed of a non-conductive material is also exemplified.
 また、ボス21が回路基板30の取付孔31に挿入されるため、回路基板30を、基台20に直接または絶縁部材29を介して密着させることも可能である。この場合、基台20を、回路基板30で発生する熱の放熱体として利用することもできる。また、回路基板30の基板本体を、金属製である基台20を介して接地することも可能である。 Further, since the boss 21 is inserted into the mounting hole 31 of the circuit board 30, the circuit board 30 can be brought into close contact with the base 20 directly or through the insulating member 29. In this case, the base 20 can also be used as a radiator for heat generated in the circuit board 30. It is also possible to ground the board body of the circuit board 30 via the base 20 made of metal.
 ここで、上述の電子機器90の薄型化等の効果を奏する基板保持体の構造、つまり、ボス21の高さを回路基板30の厚み内に収めることができる構造は、図2~図4に示される構造に限定されない。 Here, the structure of the substrate holder that achieves the effect of reducing the thickness of the electronic device 90 described above, that is, the structure in which the height of the boss 21 can be accommodated within the thickness of the circuit board 30 is shown in FIGS. It is not limited to the structure shown.
 そこで、基板保持体の各種の変形例について、上述の基板保持体10との差分を中心に以下に説明する。 Therefore, various modifications of the substrate holder will be described below with a focus on differences from the substrate holder 10 described above.
 [1-2.変形例1]
 図5は、実施の形態1の変形例1における基板保持体11の、ボス21周辺の部分断面図である。
[1-2. Modification 1]
FIG. 5 is a partial cross-sectional view around the boss 21 of the substrate holder 11 in the first modification of the first embodiment.
 図5に示す基板保持体11は、基台20と、回路基板30と、固定部材43とを備える。基台20は、ボス21を有し、回路基板30は、ボス21が挿入される取付孔31を有する。 The substrate holder 11 shown in FIG. 5 includes a base 20, a circuit board 30, and a fixing member 43. The base 20 has a boss 21, and the circuit board 30 has an attachment hole 31 into which the boss 21 is inserted.
 固定部材43は、軸部43bと、軸部43bの端部に備えられた鍔部43aとを有する。軸部43bは、基板保持体10における軸部41bと同じく、雄ネジとして機能する部材であり、ボス21が有する雌ネジ部22と螺合することで、ボス21に固定される。 The fixing member 43 includes a shaft portion 43b and a flange portion 43a provided at an end portion of the shaft portion 43b. The shaft portion 43 b is a member that functions as a male screw, like the shaft portion 41 b in the substrate holder 10, and is fixed to the boss 21 by screwing with the female screw portion 22 of the boss 21.
 本変形例における鍔部43aは、基板保持体10における鍔部42とは異なり、軸部43bと一体に設けられている。つまり、ネジとして実現される固定部材43の頭部により、鍔部43aが構成されている。 Unlike the flange portion 42 in the substrate holder 10, the flange portion 43a in the present modification is provided integrally with the shaft portion 43b. That is, the collar part 43a is comprised by the head of the fixing member 43 implement | achieved as a screw | thread.
 上記構成の基板保持体11において、回路基板30の取付孔31に挿入された状態のボス21に、固定部材43の軸部43bが固定される。その結果、鍔部43aが回路基板30に当接し、これにより、ボス21が挿入された状態の回路基板30の、基台20とは反対方向への移動が規制される。 In the substrate holder 11 having the above configuration, the shaft portion 43b of the fixing member 43 is fixed to the boss 21 inserted into the mounting hole 31 of the circuit board 30. As a result, the flange portion 43a abuts on the circuit board 30, thereby restricting the movement of the circuit board 30 with the boss 21 inserted in the direction opposite to the base 20.
 つまり、基板保持体11では、図5に示すように、基台20の上方に存在する、ボス21の側方の空間に、回路基板30の厚みの少なくとも一部が収容された状態で、回路基板30が保持される。 That is, in the substrate holder 11, as shown in FIG. 5, in the state where at least a part of the thickness of the circuit board 30 is accommodated in the space on the side of the boss 21 that exists above the base 20. The substrate 30 is held.
 従って、本変形例における基板保持体11は薄型化が可能な構造を有しており、これにより、基板保持体11を備える電子機器90の薄型化も可能となる。 Therefore, the substrate holder 11 in the present modification has a structure that can be reduced in thickness, whereby the electronic device 90 including the substrate holder 11 can also be reduced in thickness.
 [1-3.変形例2]
 図6は、実施の形態1の変形例2における基板保持体12の、ボス21周辺の部分断面図である。
[1-3. Modification 2]
FIG. 6 is a partial cross-sectional view around the boss 21 of the substrate holder 12 in the second modification of the first embodiment.
 図6に示す基板保持体12は、基台20と、回路基板30と、固定部材44とを備える。基台20は、ボス21を有し、回路基板30は、ボス21が挿入される取付孔31を有する。 The substrate holder 12 shown in FIG. 6 includes a base 20, a circuit board 30, and a fixing member 44. The base 20 has a boss 21, and the circuit board 30 has an attachment hole 31 into which the boss 21 is inserted.
 固定部材44は、軸部44bと、軸部44bの端部に備えられた鍔部44aとを有する。 The fixing member 44 has a shaft portion 44b and a flange portion 44a provided at an end portion of the shaft portion 44b.
 本変形例における軸部44bは、鍔部44aとは反対側の端部に設けられた爪部44cを有し、ボス21は、爪部44cと係合する係合部24を有する。 The shaft portion 44b in this modification has a claw portion 44c provided at the end opposite to the flange portion 44a, and the boss 21 has an engagement portion 24 that engages with the claw portion 44c.
 係合部24は、具体的には、ボス21に形成された、軸部44bが挿入される軸孔およびその周縁によって構成される。 Specifically, the engaging portion 24 is configured by a shaft hole formed in the boss 21 into which the shaft portion 44b is inserted and its peripheral edge.
 ここで、本変形例における固定部材44は、例えば、所定の弾性を有する樹脂で形成されており、爪部44cは外径を縮めるように変形した状態で、係合部24に挿入される。 Here, the fixing member 44 in the present modification is formed of, for example, a resin having a predetermined elasticity, and the claw portion 44c is inserted into the engaging portion 24 in a deformed state so as to reduce the outer diameter.
 さらに、爪部44cは、係合部24を貫通すると、弾性によって元の形状に復元し、その結果、図6に示すように、ボス21(係合部24)と係合する。これにより、軸部44bは、ボス21から抜け出せないように固定される。 Furthermore, when the claw portion 44c penetrates the engaging portion 24, it is restored to its original shape by elasticity, and as a result, as shown in FIG. 6, it engages with the boss 21 (engaging portion 24). Thereby, the shaft portion 44b is fixed so as not to come out of the boss 21.
 つまり、基板保持体12において、回路基板30の取付孔31に挿入された状態のボス21に、固定部材44の軸部44bが固定される。その結果、鍔部44aが回路基板30に当接し、これにより、ボス21が挿入された状態の回路基板30の、基台20とは反対方向への移動が規制される。 That is, in the substrate holder 12, the shaft portion 44 b of the fixing member 44 is fixed to the boss 21 that is inserted into the mounting hole 31 of the circuit substrate 30. As a result, the flange portion 44a comes into contact with the circuit board 30, thereby restricting the movement of the circuit board 30 with the boss 21 inserted in the direction opposite to the base 20.
 つまり、基板保持体12では、図6に示すように、基台20の上方に存在する、ボス21の側方の空間に、回路基板30の厚みの少なくとも一部が収容された状態で、回路基板30が保持される。 That is, in the substrate holder 12, as shown in FIG. 6, in the state where at least a part of the thickness of the circuit board 30 is accommodated in the space on the side of the boss 21 that exists above the base 20. The substrate 30 is held.
 従って、本変形例における基板保持体12は薄型化が可能な構造を有しており、これにより、基板保持体12を備える電子機器90の薄型化も可能となる。 Therefore, the substrate holder 12 in the present modification has a structure that can be reduced in thickness, whereby the electronic device 90 including the substrate holder 12 can also be reduced in thickness.
 また、爪部44cの弾性変形を利用して、固定部材44のボス21への固定が行われるため、固定部材44のボス21への取り付け工程が簡素化される。また、仮に、爪部44cの先端が、板状部材91に接触したとしても、爪部44cが弾性変形することで、板状部材91の損傷は抑制される。 Further, since the fixing member 44 is fixed to the boss 21 by utilizing the elastic deformation of the claw portion 44c, the attaching process of the fixing member 44 to the boss 21 is simplified. Even if the tip of the claw portion 44c comes into contact with the plate-like member 91, damage to the plate-like member 91 is suppressed by the elastic deformation of the claw portion 44c.
 また、回路基板30は、鍔部44aが有する弾性により、基台20に付勢された状態で基台20に固定される。これにより、回路基板30が基台20に安定的に固定される。 Further, the circuit board 30 is fixed to the base 20 in a state of being biased by the base 20 due to the elasticity of the flange portion 44a. Thereby, the circuit board 30 is stably fixed to the base 20.
 なお、固定部材44は、少なくとも爪部44cが弾性変形可能であればよく、固定部材44の素材は樹脂に限定されない。例えば、固定部材44が、金属によって形成されていてもよい。この場合、上述のように、回路基板30の基板本体を、基台20を介して接地することも可能である。 The fixing member 44 only needs to have at least the claw portion 44c elastically deformable, and the material of the fixing member 44 is not limited to resin. For example, the fixing member 44 may be made of metal. In this case, as described above, the board body of the circuit board 30 can be grounded via the base 20.
 なお、上記の、固定部材44の少なくとも一部が弾性変形すること、およびその効果等は、下記の、変形例3における固定部材45においても同じである。 Note that at least a part of the fixing member 44 is elastically deformed and the effect thereof is the same in the fixing member 45 in Modification 3 described below.
 [1-4.変形例3]
 図7は、実施の形態1の変形例3における基板保持体13の、ボス21周辺の部分断面図である。
[1-4. Modification 3]
FIG. 7 is a partial cross-sectional view around the boss 21 of the substrate holder 13 in the third modification of the first embodiment.
 図7に示す基板保持体13は、基台20と、回路基板30と、固定部材45とを備える。基台20は、ボス21を有し、回路基板30は、ボス21が挿入される取付孔31を有する。 7 includes a base 20, a circuit board 30, and a fixing member 45. The substrate holder 13 shown in FIG. The base 20 has a boss 21, and the circuit board 30 has an attachment hole 31 into which the boss 21 is inserted.
 固定部材45は、軸部45bと、軸部45bの端部に備えられた鍔部45aとを有する。 The fixing member 45 has a shaft portion 45b and a flange portion 45a provided at an end portion of the shaft portion 45b.
 本変形例における軸部45bは、鍔部45aとは反対側の端部に設けられた爪部45cを有し、ボス21は、爪部45cと係合する係合部25を有する。 The shaft portion 45b in this modification has a claw portion 45c provided at the end opposite to the flange portion 45a, and the boss 21 has an engagement portion 25 that engages with the claw portion 45c.
 なお、係合部25は、具体的には、ボス21の、軸部45bが挿入される軸孔に配置された、爪部45cと係合する補助部材60を有する。 In addition, the engaging part 25 has the auxiliary member 60 which engages with the nail | claw part 45c arrange | positioned in the shaft hole into which the shaft part 45b of the boss | hub 21 is specifically inserted.
 ここで、軸部45bが挿入される軸孔は、例えば金属の板材により形成されたボス21に打ち抜き加工をすることでボス21に形成される。 Here, the shaft hole into which the shaft portion 45b is inserted is formed in the boss 21 by punching the boss 21 formed of, for example, a metal plate material.
 その結果、例えば、軸孔の、図7における下方の開口の周縁におけるバリの発生、および、当該周縁のエッジの鈍化(エッジの丸まり)など、当該周縁と、爪部45cとの係合の信頼性が低下する事象が発生し得る。 As a result, the reliability of the engagement between the peripheral edge and the claw portion 45c, such as the generation of burrs at the peripheral edge of the lower opening in FIG. An event that decreases gender may occur.
 そこで、例えば図7に示すような補助部材60を係合部25に配置することで、爪部45cとより係合し易い部分を、容易かつ意図的に作り出すことができる。その結果、係合部25と爪部45cとの係合(引っかかり)の信頼性が向上される。 Therefore, for example, by arranging the auxiliary member 60 as shown in FIG. 7 in the engaging portion 25, a portion that is more easily engaged with the claw portion 45c can be easily and intentionally created. As a result, the reliability of engagement (hook) between the engaging portion 25 and the claw portion 45c is improved.
 また、補助部材60が存在しない場合と比較すると、鍔部45aから爪部45cまでの距離が補助部材60の肉厚の分だけ増加する。その結果、例えば、固定部材45における爪部45cの形成が容易化される。 Further, as compared with the case where the auxiliary member 60 is not present, the distance from the collar portion 45a to the claw portion 45c increases by the thickness of the auxiliary member 60. As a result, for example, the formation of the claw portion 45c in the fixing member 45 is facilitated.
 また、基板保持体13では、図7に示すように、基台20の上方に存在する、ボス21の側方の空間に、回路基板30の厚みの少なくとも一部が収容された状態で、回路基板30が保持される。 Further, in the substrate holder 13, as shown in FIG. 7, in the state where at least a part of the thickness of the circuit board 30 is accommodated in the space on the side of the boss 21 that exists above the base 20. The substrate 30 is held.
 従って、本変形例における基板保持体13は薄型化が可能な構造を有しており、これにより、基板保持体13を備える電子機器90の薄型化も可能となる。 Therefore, the substrate holder 13 in the present modification has a structure that can be reduced in thickness, and thus the electronic device 90 including the substrate holder 13 can also be reduced in thickness.
 [1-5.変形例4]
 図8は、実施の形態1の変形例4における基板保持体14の、ボス21周辺の部分断面図である。
[1-5. Modification 4]
FIG. 8 is a partial cross-sectional view around the boss 21 of the substrate holder 14 in the fourth modification of the first embodiment.
 図8に示す基板保持体14は、基台20と、回路基板30と、固定部材40とを備える。基台20は、ボス21を有し、回路基板30は、ボス21が挿入される取付孔31を有する。 8 includes a base 20, a circuit board 30, and a fixing member 40. The base 20 has a boss 21, and the circuit board 30 has an attachment hole 31 into which the boss 21 is inserted.
 つまり、基板保持体14は、図2~図4を用いて説明した実施の形態1における基板保持体10と同じく、固定部材40を備えており、固定部材40は、頭部41aと軸部41bとで構成されるネジ41と、環状部材である鍔部42とを有する。また、回路基板30の取付孔31に挿入された状態のボス21に軸部41bが固定される。その結果、鍔部42が回路基板30に当接し、これにより、回路基板30の基台20とは反対方向への移動が規制される。 That is, the substrate holder 14 includes the fixing member 40 as in the substrate holder 10 in the first embodiment described with reference to FIGS. 2 to 4, and the fixing member 40 includes the head portion 41a and the shaft portion 41b. And a flange 41 that is an annular member. Further, the shaft portion 41 b is fixed to the boss 21 inserted in the mounting hole 31 of the circuit board 30. As a result, the collar portion 42 abuts on the circuit board 30, thereby restricting the movement of the circuit board 30 in the direction opposite to the base 20.
 また、図8に示すように、基台20の上方に存在する、ボス21の側方の空間に、回路基板30の厚みの少なくとも一部が収容された状態で、回路基板30が基台20に保持されるという点においても、実施の形態1における基板保持体10と同じである。 Further, as shown in FIG. 8, the circuit board 30 is mounted on the base 20 in a state where at least a part of the thickness of the circuit board 30 is accommodated in the space on the side of the boss 21 that exists above the base 20. The substrate holding body 10 in the first embodiment is also the same as the substrate holding body 10 in the first embodiment.
 しかし、基板保持体14は、基台20と回路基板30との間に空隙が存在する点で、実施の形態1における基板保持体10とは異なる。 However, the substrate holder 14 is different from the substrate holder 10 in the first embodiment in that there is a gap between the base 20 and the circuit board 30.
 具体的には、基板保持体14は、回路基板30と基台20とを離隔させることで、回路基板30と、基台20のボス21が配置された面である主面20aとの間に空隙を形成させる離隔部21aを備える。 Specifically, the substrate holder 14 separates the circuit board 30 and the base 20 so that the circuit board 30 and the main surface 20a, which is the surface on which the bosses 21 of the base 20 are disposed, are disposed. A separation portion 21a for forming a gap is provided.
 本変形例では、離隔部21aは、ボス21が有する段差によって形成されている。 In this modification, the separation portion 21a is formed by a step provided by the boss 21.
 なお、離隔部21aは、ボス21に形成されている必要はなく、例えば、ボス21が貫通するように配置された、樹脂等で形成された環状部材によって実現することもできる。 In addition, the separation part 21a does not need to be formed in the boss 21, and can be realized by, for example, an annular member made of resin or the like disposed so that the boss 21 penetrates.
 また、回路基板30の基台20側の面(裏面)、または、基台20の主面20aに形成された突起によって、離隔部21aを実現することもできる。 Also, the separation portion 21 a can be realized by a surface (back surface) of the circuit board 30 on the base 20 side or a protrusion formed on the main surface 20 a of the base 20.
 このように、基板保持体14は、回路基板30を、基台20の主面20aから浮いた状態で保持することができる。 Thus, the substrate holder 14 can hold the circuit board 30 in a state of floating from the main surface 20 a of the base 20.
 これにより、例えば、回路基板30の裏面に電子部品または電子部品の一部等が配置された場合であっても、回路基板30を基台20に取り付けることが可能となる。 Thereby, for example, even when an electronic component or a part of the electronic component is disposed on the back surface of the circuit board 30, the circuit board 30 can be attached to the base 20.
 また、例えば、回路基板30、および、基台20が設置される板状部材91の一方から他方への熱の伝導を抑制させたい場合においても、回路基板30と基台20の主面20aとの間に空隙があることは有利である。 Further, for example, when it is desired to suppress heat conduction from one to the other of the circuit board 30 and the plate-like member 91 on which the base 20 is installed, the circuit board 30 and the main surface 20a of the base 20 It is advantageous that there is a gap between them.
 つまり、離隔部21aを備える基板保持体14によれば、回路基板30および電子機器90のそれぞれを、他方で発生する熱から保護するという効果も奏される。 That is, according to the board | substrate holding body 14 provided with the separation part 21a, the effect of protecting each of the circuit board 30 and the electronic device 90 from the heat which generate | occur | produces on the other side is also show | played.
 なお、図8では、回路基板30の裏面と離隔部21aとの間にのみ絶縁部材29が配置されているが、基台20の主面20aにも絶縁部材29が配置されてもよい。また、回路基板30の裏面が、離隔部21aと接触しても問題がないグランドパターン等で構成されていれば絶縁部材29は無くてもよい。また、絶縁部材29の径を大きくすれば締結保持面積を拡大することができ、締結の安定性、信頼性の向上が見込まれる。 In FIG. 8, the insulating member 29 is disposed only between the back surface of the circuit board 30 and the separation portion 21 a, but the insulating member 29 may also be disposed on the main surface 20 a of the base 20. Further, the insulating member 29 may be omitted if the back surface of the circuit board 30 is formed of a ground pattern or the like that does not cause a problem even if the back surface of the circuit board 30 is in contact with the separation portion 21a. Further, if the diameter of the insulating member 29 is increased, the fastening holding area can be expanded, and the fastening stability and reliability are expected to be improved.
 以上のように、本変形例における基板保持体14は薄型化が可能な構造を有しており、これにより、基板保持体11を備える電子機器90の薄型化も可能となる。また、基板保持体14によれば、この薄型化の効果に加え、保持可能な回路基板30の種類の増加、および、および、回路基板30からの他の部材への熱伝導の抑制等の効果も奏される。 As described above, the substrate holder 14 in the present modification has a structure that can be thinned, and thus the electronic device 90 including the substrate holder 11 can be thinned. Further, according to the substrate holder 14, in addition to this thinning effect, the effect of increasing the types of circuit boards 30 that can be held, and suppressing heat conduction from the circuit board 30 to other members, etc. Is also played.
 [1-6.変形例5]
 図9は、実施の形態1の変形例5における基板保持体15の、ボス23周辺の部分断面図である。
[1-6. Modification 5]
FIG. 9 is a partial cross-sectional view around the boss 23 of the substrate holder 15 in the fifth modification of the first embodiment.
 図9に示す基板保持体15は、基台20と、回路基板30と、固定部材46とを備える。基台20は、カシメまたは溶接等により基台20に接合される、基台20とは別部材のボス23を有し、回路基板30は、ボス23が挿入される取付孔31を有する。 A substrate holder 15 shown in FIG. 9 includes a base 20, a circuit board 30, and a fixing member 46. The base 20 has a boss 23 which is a member different from the base 20 and is joined to the base 20 by caulking or welding, and the circuit board 30 has a mounting hole 31 into which the boss 23 is inserted.
 固定部材46は、薄平頭形状を有する頭部47aと軸部47bとで構成されるネジ47と、環状部材である鍔部42とを有する。また、回路基板30の取付孔31に挿入された状態のボス23に軸部47bが固定される。その結果、鍔部42が回路基板30に当接し、これにより、回路基板30の基台20とは反対方向への移動が規制される。 The fixing member 46 includes a screw 47 including a head portion 47a having a thin flat head shape and a shaft portion 47b, and a flange portion 42 that is an annular member. Further, the shaft portion 47 b is fixed to the boss 23 inserted in the mounting hole 31 of the circuit board 30. As a result, the collar portion 42 abuts on the circuit board 30, thereby restricting the movement of the circuit board 30 in the direction opposite to the base 20.
 また、基台20の上方に存在する、ボス23の側方の空間に、回路基板30の厚みの少なくとも一部が収容された状態で、回路基板30が基台20に保持される。 Further, the circuit board 30 is held on the base 20 in a state where at least a part of the thickness of the circuit board 30 is accommodated in a space on the side of the boss 23 existing above the base 20.
 なお、ネジ47の頭部47aの薄平頭の厚みは0.2mm~1.5mmが好ましく、さらには、0.2mm~0.6mmがさらに好ましい。 Note that the thickness of the thin flat head of the head 47a of the screw 47 is preferably 0.2 mm to 1.5 mm, more preferably 0.2 mm to 0.6 mm.
 本変形例におけるボス23は、基台20とは別部材として作製される。これにより、軸部47bと螺合するボス23の雌ネジ部22において、例えば、バーリング加工により生じる板厚の不安定、および、それに伴う転造または切削の不確実性が排除される。その結果、固定部材46のボス23に対する螺合締結の信頼性が向上される。 The boss 23 in this modification is manufactured as a separate member from the base 20. As a result, in the female screw portion 22 of the boss 23 screwed with the shaft portion 47b, for example, instability of the plate thickness caused by burring, and the uncertainties associated with rolling or cutting are eliminated. As a result, the reliability of the fastening fastening of the fixing member 46 to the boss 23 is improved.
 また、ネジ47の頭部47aが薄平頭形状で構成されることにより、カバー92を、板状部材91により近接させて配置することができるため、基板保持体15を備える電子機器90のさらなる薄型化が可能となる。 Further, since the head 47a of the screw 47 is formed in a thin flat head shape, the cover 92 can be disposed closer to the plate-like member 91, so that the electronic device 90 including the substrate holder 15 is further thinned. Can be realized.
 (実施の形態2)
 次に、図10~図12を用いて実施の形態2を説明する。
(Embodiment 2)
Next, the second embodiment will be described with reference to FIGS.
 [2-1.ディスプレイ装置の構成概要]
 図10は、実施の形態2におけるディスプレイ装置100の外観を示す斜視図である。
[2-1. Outline of display device configuration]
FIG. 10 is a perspective view showing an appearance of display device 100 according to the second embodiment.
 図11は、実施の形態2におけるディスプレイ装置100の構造の概要を示す分解斜視図である。なお、図11では、ディスプレイ装置100の構造の特徴を明確にするために、各種のケーブルおよび電子部品等の、構成要素の一部の図示は省略されている。 FIG. 11 is an exploded perspective view showing an outline of the structure of the display device 100 according to the second embodiment. In FIG. 11, in order to clarify the characteristics of the structure of the display apparatus 100, some components such as various cables and electronic components are not shown.
 本実施の形態のディスプレイ装置100は、ディスプレイパネル101と、基板保持体110とを備える。ディスプレイ装置100は、例えば、受信した放送波等から得られる映像および音声を出力するテレビである。 The display device 100 according to the present embodiment includes a display panel 101 and a substrate holder 110. The display device 100 is, for example, a television that outputs video and audio obtained from received broadcast waves and the like.
 より詳細には、図11に示すように、ディスプレイ装置100はさらに、基板保持体110を覆うバックカバー106と、ディスプレイパネル101の周縁を覆う枠体108とを備える。 More specifically, as shown in FIG. 11, the display device 100 further includes a back cover 106 that covers the substrate holder 110 and a frame body 108 that covers the periphery of the display panel 101.
 つまり、ディスプレイ装置100は、枠体108とバックカバー106との間に、ディスプレイパネル101および基板保持体110が配置された構造を有している。 That is, the display device 100 has a structure in which the display panel 101 and the substrate holder 110 are disposed between the frame body 108 and the back cover 106.
 ディスプレイパネル101は、画像を表示する装置である。ディスプレイパネル101は、例えば、有機化合物で発光層が構成された発光ダイオードである有機EL(Electro Luminescence)ダイオードを発光素子として有する有機ELディスプレイパネルである。また、その厚みは、例えば、1mm~3mm程度である。 The display panel 101 is a device that displays an image. The display panel 101 is, for example, an organic EL display panel having, as a light emitting element, an organic EL (Electro Luminescence) diode that is a light emitting diode having a light emitting layer made of an organic compound. The thickness is, for example, about 1 mm to 3 mm.
 なお、ディスプレイパネル101の種類に特に限定はなく、例えば、有機ELディスプレイパネルと同じく自発光型のディスプレイパネルであるプラズマディスプレイパネル、または、バックライトユニットを有する液晶ディスプレイパネルなどであってもよい。 The type of the display panel 101 is not particularly limited. For example, it may be a plasma display panel that is a self-luminous display panel similar to the organic EL display panel, or a liquid crystal display panel having a backlight unit.
 基板保持体110は、上記実施の形態1における基板保持体10と共通する特徴を有する構造体である。 The substrate holder 110 is a structure having characteristics common to the substrate holder 10 in the first embodiment.
 具体的には、基板保持体110は、基台120と、回路基板130と、回路基板130を基台120に固定する固定部材140とを備える。基板保持体110の詳細については、図12を用いて後述する。 Specifically, the substrate holder 110 includes a base 120, a circuit board 130, and a fixing member 140 that fixes the circuit board 130 to the base 120. Details of the substrate holder 110 will be described later with reference to FIG.
 なお、回路基板130は、本実施の形態では、ディスプレイパネル101に、複数の走査線139のそれぞれを介して走査駆動信号を供給する走査駆動回路を有する基板である。 In the present embodiment, the circuit board 130 is a board having a scan drive circuit that supplies a scan drive signal to the display panel 101 via each of the plurality of scan lines 139.
 図11では、回路基板130は、金属製のシャーシである基台120の左右の辺に沿うように配置された、縦に長尺状の基板として図示されている。 In FIG. 11, the circuit board 130 is illustrated as a vertically long board arranged along the left and right sides of the base 120 that is a metal chassis.
 また、基台120には、これら複数の回路基板130に加え、ディスプレイパネル101に、複数の信号線159のそれぞれを介して信号電圧を供給する信号線駆動回路を有する回路基板150も複数配置されている。図11では、回路基板150は、基台120の上下の辺に沿うように配置された、横に長尺状の基板として図示されている。 In addition to the plurality of circuit boards 130, the base 120 is also provided with a plurality of circuit boards 150 each having a signal line driving circuit that supplies a signal voltage to the display panel 101 via each of the plurality of signal lines 159. ing. In FIG. 11, the circuit board 150 is illustrated as a horizontally long board disposed along the upper and lower sides of the base 120.
 なお、走査駆動回路は、ゲートドライバまたはスキャンドライバ等とも呼ばれ、信号線駆動回路は、データドライバまたはソースドライバ等とも呼ばれる。 Note that the scan driver circuit is also called a gate driver or a scan driver, and the signal line driver circuit is also called a data driver or a source driver.
 また、基台120には、これら回路基板130および150に加え、他の種類の回路基板(回路基板160、161、162)も配置されている。 In addition to these circuit boards 130 and 150, other types of circuit boards ( circuit boards 160, 161, 162) are also arranged on the base 120.
 これら回路基板160、161、162のそれぞれが有する電気回路は、例えば、受信した映像信号を処理する信号処理回路、走査駆動回路および信号線駆動回路の動作を制御する制御回路、または、電力を外部から受け取って各回路に供給する電源回路などである。 Each of the circuit boards 160, 161, 162 has an electric circuit, for example, a signal processing circuit that processes a received video signal, a control circuit that controls the operation of the scanning drive circuit and the signal line drive circuit, or power to the outside A power supply circuit that receives the data from the power supply and supplies it to each circuit.
 なお、図11では、走査線139および信号線159は、点線で概念的に表されている。実際には、ディスプレイパネル101と、各回路基板130および各回路基板150とは、例えば、複数の走査線139または信号線159を有するフレキシブルケーブルで接続される。 In FIG. 11, the scanning lines 139 and the signal lines 159 are conceptually represented by dotted lines. Actually, the display panel 101 is connected to each circuit board 130 and each circuit board 150 by, for example, a flexible cable having a plurality of scanning lines 139 or signal lines 159.
 また、回路基板130(150)と接続されたフレキシブルケーブルは、基台120の外側で内方に折り返され、この状態で、回路基板130(150)が、ディスプレイパネル101の背面に接合された基台120の端部に固定される。 In addition, the flexible cable connected to the circuit board 130 (150) is folded inwardly outside the base 120, and in this state, the circuit board 130 (150) is joined to the back surface of the display panel 101. It is fixed to the end of the base 120.
 つまり、ディスプレイパネル101は、回路基板130(150)と電気的に接続され、基台120を挟んで回路基板130(150)とは反対側に配置されている。 That is, the display panel 101 is electrically connected to the circuit board 130 (150), and is disposed on the opposite side of the circuit board 130 (150) with the base 120 interposed therebetween.
 このように、基台120には、複数の回路基板が配置されているが、本実施の形態の基板保持体110の特徴を明確に説明するために、1つの回路基板130に着目し、その回路基板130についての保持構造を中心に以下に説明する。 As described above, a plurality of circuit boards are arranged on the base 120. In order to clearly describe the characteristics of the board holder 110 of the present embodiment, attention is paid to one circuit board 130, and The following description will focus on the holding structure for the circuit board 130.
 [2-2.基板保持体の構成]
 図12は、実施の形態2のディスプレイ装置100における、ボス121周辺の部分断面図である。
[2-2. Configuration of substrate holder]
FIG. 12 is a partial cross-sectional view around the boss 121 in the display device 100 according to the second embodiment.
 図12に示すように、実施の形態2の基板保持体110は、基台120と、回路基板130と、固定部材140とを備える。基台120は、ボス121を有し、回路基板130は、ボス121が挿入される取付孔131を有する。 As shown in FIG. 12, the substrate holder 110 according to the second embodiment includes a base 120, a circuit substrate 130, and a fixing member 140. The base 120 has a boss 121, and the circuit board 130 has a mounting hole 131 into which the boss 121 is inserted.
 基台120は、ディスプレイパネル101と、例えば両面テープまたは両面粘着シート等である接着部材102によって接着されている。 The base 120 is bonded to the display panel 101 by an adhesive member 102 such as a double-sided tape or a double-sided adhesive sheet.
 また、基台120と回路基板130とを電気的に絶縁する絶縁部材129が、基台120と回路基板130との間に配置されている。 Also, an insulating member 129 that electrically insulates the base 120 and the circuit board 130 is disposed between the base 120 and the circuit board 130.
 固定部材140は、軸部141bと、軸部141bの端部に備えられた鍔部142とを有する。 The fixing member 140 includes a shaft portion 141b and a flange portion 142 provided at an end portion of the shaft portion 141b.
 軸部141bの一端には、軸部141bの外径よりも大きな外径を有する頭部141aが設けられている。また、鍔部142は、軸部141bが貫通し、頭部141aによって係止される環状部材として固定部材140に備えられている。 A head portion 141a having an outer diameter larger than the outer diameter of the shaft portion 141b is provided at one end of the shaft portion 141b. Moreover, the collar part 142 is provided in the fixing member 140 as an annular member through which the shaft part 141b passes and is locked by the head part 141a.
 つまり、本実施の形態における固定部材140は、軸部141bと頭部141aで構成されるネジ141と、環状部材である鍔部142とを有する。鍔部142は、例えば、金属または樹脂を素材とする、外径が取付孔131の内径よりも大きなワッシャにより実現される。 That is, the fixing member 140 in the present embodiment has a screw 141 composed of a shaft portion 141b and a head portion 141a, and a collar portion 142 that is an annular member. The flange 142 is realized by, for example, a washer made of metal or resin and having an outer diameter larger than the inner diameter of the mounting hole 131.
 このように構成された基板保持体110では、基台120に設けられたボス121が、回路基板130の取付孔131に挿入された状態で、回路基板130の、基台120とは反対方向への移動が、鍔部142によって規制される。 In the substrate holder 110 configured as described above, the boss 121 provided on the base 120 is inserted in the mounting hole 131 of the circuit board 130 in the direction opposite to the base 120 of the circuit board 130. Is restricted by the collar 142.
 なお、上記の各構成要素の厚み方向の寸法としては、以下の各値が例示される。すなわち、基台120の厚みは0.6mmであり、絶縁部材129の厚みは0.15mmであり、回路基板130の厚みは1.0mmである。 In addition, as the dimension in the thickness direction of each component described above, the following values are exemplified. That is, the thickness of the base 120 is 0.6 mm, the thickness of the insulating member 129 is 0.15 mm, and the thickness of the circuit board 130 is 1.0 mm.
 また、この場合、ボス121の高さHは、1.15mmより小さく(例えば、1.0mm)、ネジ141の軸部141bの長さは、例えば2.0mmである。また、鍔部142の厚みは、例えば0.5mmであり、これは、軸部141bの不完全ネジ部の長さとほぼ一致する。つまり、軸部141bの、雄ネジとしては使用されない部分が、軸部141bと鍔部142との接続に用いられるため、鍔部142が、軸部141bの雄ネジとしての機能を損なうことがない。 In this case, the height H of the boss 121 is smaller than 1.15 mm (for example, 1.0 mm), and the length of the shaft 141b of the screw 141 is, for example, 2.0 mm. Moreover, the thickness of the collar part 142 is 0.5 mm, for example, and this substantially corresponds with the length of the incomplete thread part of the axial part 141b. That is, the portion of the shaft portion 141b that is not used as a male screw is used to connect the shaft portion 141b and the flange portion 142, so that the flange portion 142 does not impair the function of the shaft portion 141b as a male screw. .
 以上説明したように、実施の形態2における基板保持体110は、上述の実施の形態1における基板保持体10等と共通する構造上の特徴を有する。 As described above, the substrate holder 110 according to the second embodiment has structural features in common with the substrate holder 10 according to the first embodiment described above.
 つまり、図12に示すように、基台120の上方(ボス121の突出方向)に存在する、ボス121の高さHに対応する空間(ボス121の側方の空間)に、回路基板130の厚みの少なくとも一部が収容された状態で、回路基板130が基台120に保持される。 That is, as shown in FIG. 12, the circuit board 130 is placed in a space (a space on the side of the boss 121) that exists above the base 120 (in the protruding direction of the boss 121) and that corresponds to the height H of the boss 121. The circuit board 130 is held on the base 120 in a state where at least a part of the thickness is accommodated.
 従って、基板保持体110を備えるディスプレイ装置100では、ディスプレイパネル101とバックカバー106との間の距離を、仮に回路基板130がボス121の上面に固定されたとした場合の当該距離よりも短くすることができる。 Therefore, in the display device 100 including the substrate holder 110, the distance between the display panel 101 and the back cover 106 is made shorter than the distance when the circuit board 130 is fixed to the upper surface of the boss 121. Can do.
 このように、基板保持体110によれば、回路基板130の保持のためのボス121の高さを、回路基板130の厚み内に収めることができ、その結果、ディスプレイ装置100の薄型化が可能となる。 As described above, according to the substrate holder 110, the height of the boss 121 for holding the circuit board 130 can be accommodated within the thickness of the circuit board 130. As a result, the display device 100 can be thinned. It becomes.
 ここで、回路基板130は、走査駆動回路を有する基板であり、ディスプレイパネル101にフレキシブルケーブル等で直結された基板である。そのため、ディスプレイパネル101に近い位置、つまり、ディスプレイ装置100のシャーシである基台120の端部に配置されることが好ましい。 Here, the circuit board 130 is a board having a scanning drive circuit, and is a board directly connected to the display panel 101 by a flexible cable or the like. For this reason, it is preferable to be disposed at a position close to the display panel 101, that is, at an end of the base 120 that is a chassis of the display device 100.
 また、走査駆動回路は、基板の裏面に電子部品等が配置せずに構成することが可能であるため、回路基板130の裏面を、基台120に直接または絶縁部材129を介して密着させることが可能である。 In addition, since the scanning drive circuit can be configured without arranging electronic components or the like on the back surface of the substrate, the back surface of the circuit substrate 130 is brought into close contact with the base 120 directly or through the insulating member 129. Is possible.
 このような回路基板130を保持する構造体として、基板保持体110を採用することで、ディスプレイ装置100における、基台120の端部に相当する部分の薄型化が可能となる。 By adopting the substrate holder 110 as a structure for holding such a circuit board 130, a portion corresponding to the end of the base 120 in the display device 100 can be thinned.
 つまり、ディスプレイ装置100の周縁部分を従来よりも薄くすることが可能となる。 That is, the peripheral portion of the display device 100 can be made thinner than before.
 例えば、図12に示すように、ディスプレイ装置100のバックカバー106を、外側(図12における左側)に行くに従って基台120に近づけるように傾けた場合を想定する。 For example, as shown in FIG. 12, it is assumed that the back cover 106 of the display device 100 is tilted so as to approach the base 120 toward the outside (left side in FIG. 12).
 この場合、基板保持体110によれば、基台120のボス121の高さHに対応する空間に、回路基板130の厚みの少なくとも一部が収容されるため、バックカバー106をより大きく傾けることができる。そのため、ディスプレイ装置100の最端部(図12では、ディスプレイ装置100の最も左端の部分)の厚みを小さくすることができる。 In this case, according to the substrate holder 110, at least a part of the thickness of the circuit board 130 is accommodated in the space corresponding to the height H of the boss 121 of the base 120, so that the back cover 106 is tilted more greatly. Can do. Therefore, the thickness of the outermost part of the display device 100 (in FIG. 12, the leftmost part of the display device 100) can be reduced.
 このことは、例えば、外観上、ディスプレイ装置100をより薄く見せることができるという点において好ましい。 This is preferable, for example, in that the display device 100 can be made thinner in appearance.
 このように、本実施の形態のディスプレイ装置100は、回路基板130等の基板を保持する構造体として基板保持体110を備えることで、薄型化が可能となる。 As described above, the display device 100 of the present embodiment can be thinned by including the substrate holder 110 as a structure that holds a substrate such as the circuit board 130.
 ここで、本実施の形態のディスプレイ装置100は、実施の形態1における基板保持体10と同じく、固定部材の軸部がボスの雌ネジ部と螺合し、環状部材である鍔部によって回路基板の移動を規制する構造を有する基板保持体110を備えている。 Here, in the display device 100 of the present embodiment, like the substrate holder 10 in the first embodiment, the shaft portion of the fixing member is screwed into the female screw portion of the boss, and the circuit board is formed by the collar portion that is an annular member. A substrate holder 110 having a structure for restricting the movement of the substrate.
 しかしながら、上記の実施の形態1の各種変形例(変形例1~4)に対応する基板保持体(11、12、13、14)のいずれかが、ディスプレイ装置100において、回路基板130等の基板を保持する構造体として備えられてもよい。 However, any of the substrate holders (11, 12, 13, 14) corresponding to the various modified examples (modified examples 1 to 4) of the first embodiment described above is the substrate such as the circuit board 130 in the display device 100. It may be provided as a structure that holds
 また、例えば、基板保持体110が、互いに異なる態様の保持構造を有していてもよい。 Further, for example, the substrate holder 110 may have different types of holding structures.
 例えば、基板保持体110は、回路基板130および150を保持する構造として、図12に示す構造を採用し、回路基板160、161、162を保持する構造として、図8に示す、基板保持体14の保持構造(離隔部を有する構造)を採用してもよい。 For example, the substrate holder 110 employs the structure shown in FIG. 12 as a structure for holding the circuit boards 130 and 150, and the substrate holder 14 shown in FIG. 8 as a structure for holding the circuit boards 160, 161, 162. A holding structure (a structure having a separation portion) may be adopted.
 (他の実施の形態)
 以上のように、本出願において開示する技術の例示として、実施の形態1および2を説明した。しかしながら、本開示における技術は、これに限定されず、適宜、変更、置き換え、付加、省略などを行った実施の形態にも適用可能である。また、上記実施の形態1および2で説明した各構成要素を組み合わせて、新たな実施の形態とすることも可能である。
(Other embodiments)
As described above, Embodiments 1 and 2 have been described as examples of the technology disclosed in the present application. However, the technology in the present disclosure is not limited to this, and can also be applied to an embodiment in which changes, replacements, additions, omissions, and the like are appropriately performed. Moreover, it is also possible to combine each component demonstrated in the said Embodiment 1 and 2 into a new embodiment.
 そこで、以下、他の実施の形態を例示する。 Therefore, other embodiments will be exemplified below.
 例えば、実施の形態1において、鍔部42の外径は、取付孔31の内径よりも大きいとしたが、鍔部42および取付孔31の大きさ等の関係はこれに限定されない。 For example, in the first embodiment, the outer diameter of the flange portion 42 is larger than the inner diameter of the attachment hole 31, but the relationship between the size of the flange portion 42 and the attachment hole 31 is not limited thereto.
 つまり、鍔部42と取付孔31との大きさ等の関係は、固定部材40に備えられた鍔部42が、取付孔31から抜けない関係にあればよい。例えば、鍔部42の外形が楕円である場合、その長径が取付孔31の内径よりも大きければよい。 That is, the relationship between the size of the flange 42 and the attachment hole 31 may be such that the flange 42 provided in the fixing member 40 does not come out of the attachment hole 31. For example, when the outer shape of the collar portion 42 is an ellipse, the major axis may be larger than the inner diameter of the attachment hole 31.
 また、回路基板30が有する取付孔31の形状は丸孔である必要はなく、角孔であってもよい。つまり、取付孔31は、ボス21が挿入可能であり、かつ、鍔部42によって回路基板30の基台20とは反対方向の移動が規制される大きさおよび形状であればよい。 Further, the shape of the mounting hole 31 included in the circuit board 30 is not necessarily a round hole, but may be a square hole. That is, the mounting hole 31 may be any size and shape that allows the boss 21 to be inserted and that restricts the movement of the circuit board 30 in the direction opposite to the base 20 by the flange 42.
 また、鍔部42の形状も軸部41bを中心とした円または楕円である必要はなく、多角形または直線と曲線とで構成される形状であってもよい。 Further, the shape of the collar portion 42 is not necessarily a circle or an ellipse with the shaft portion 41b as the center, and may be a shape constituted by a polygon or a straight line and a curve.
 例えば、図4において、鍔部42は、軸部41bの左右の双方に延設され、取付孔31の左右の周縁を押さえるように配置されているが、鍔部42は、取付孔31の左右の一方の周縁のみを押さえるように配置されてもよい。すなわち、固定部材40は、全体としてL字型の形状であってもよい。 For example, in FIG. 4, the flange portion 42 extends on both the left and right sides of the shaft portion 41 b and is arranged so as to press the left and right peripheral edges of the attachment hole 31. It may be arranged so as to hold only one peripheral edge. That is, the fixing member 40 may be L-shaped as a whole.
 また、実施の形態1において、絶縁部材29と回路基板30との厚みの合計は、ボス21の高さHよりも大きいとした。つまり、ボス21の上面は、回路基板30の主面(基台20とは反対側の面)よりも下方に位置するとした。 In the first embodiment, the total thickness of the insulating member 29 and the circuit board 30 is greater than the height H of the boss 21. That is, the upper surface of the boss 21 is positioned below the main surface of the circuit board 30 (the surface opposite to the base 20).
 しかし、ボス21の上面は、回路基板30の主面よりも上方に位置してもよい。簡単に言うと、ボス21の一部が回路基板30の取付孔31から突出していてもよい。 However, the upper surface of the boss 21 may be positioned above the main surface of the circuit board 30. In short, a part of the boss 21 may protrude from the mounting hole 31 of the circuit board 30.
 この場合であっても、例えば、鍔部42が、下方に湾曲もしくは屈曲している、または、下方に突出した部分を有しているなどであれば、鍔部42を回路基板30に当接させることは可能である。つまり、鍔部42により、回路基板30の、基台20とは反対方向の移動を規制することは可能である。 Even in this case, for example, if the flange 42 is bent or bent downward or has a portion protruding downward, the flange 42 abuts against the circuit board 30. It is possible to make it. In other words, it is possible to regulate the movement of the circuit board 30 in the direction opposite to the base 20 by the collar portion 42.
 なお、これらの固定部材40およびその周辺の構造に関する補足事項は、実施の形態1の変形例1~4および実施の形態2における、固定部材(43、44、45、140)およびその周辺の構造にも適用される。 Note that these supplementary matters regarding the fixing member 40 and its surrounding structure are the fixing member (43, 44, 45, 140) and its surrounding structure in the first to fourth modifications of the first embodiment and the second embodiment. Also applies.
 また、実施の形態2において、ディスプレイ装置100はテレビであるとした。しかし、ディスプレイ装置100はテレビ以外の、ディスプレイパネルを備える装置として実現されてもよい。 In the second embodiment, the display device 100 is a television. However, the display device 100 may be realized as a device including a display panel other than the television.
 例えば、ディスプレイ装置100は、外部から入力される映像を表示するモニタディスプレイ、広告媒体として使用されるデジタルサイネージ、ならびに、タッチパネルによってユーザの操作を受け付ける携帯端末、タブレット端末、および、テーブル型ディスプレイ装置等として実現されてもよい。 For example, the display device 100 includes a monitor display that displays images input from the outside, digital signage that is used as an advertising medium, a portable terminal that accepts user operations via a touch panel, a tablet terminal, and a table-type display device. It may be realized as.
 以上のように、本開示における技術の例示として、実施の形態を説明した。そのために、添付図面および詳細な説明を提供した。 As described above, the embodiments have been described as examples of the technology in the present disclosure. For this purpose, the accompanying drawings and detailed description are provided.
 したがって、添付図面および詳細な説明に記載された構成要素の中には、課題解決のために必須な構成要素だけでなく、上記技術を例示するために、課題解決のためには必須でない構成要素も含まれ得る。そのため、それらの必須ではない構成要素が添付図面や詳細な説明に記載されていることをもって、直ちに、それらの必須ではない構成要素が必須であるとの認定をするべきではない。 Accordingly, among the components described in the accompanying drawings and the detailed description, not only the components essential for solving the problem, but also the components not essential for solving the problem in order to illustrate the above technique. May also be included. Therefore, it should not be immediately recognized that these non-essential components are essential as those non-essential components are described in the accompanying drawings and detailed description.
 また、上述の実施の形態は、本開示における技術を例示するためのものであるから、請求の範囲またはその均等の範囲において種々の変更、置き換え、付加、省略などを行うことができる。 In addition, since the above-described embodiment is for illustrating the technique in the present disclosure, various modifications, replacements, additions, omissions, and the like can be performed within the scope of the claims or an equivalent scope thereof.
 本開示は、基板と、回路基板を保持する基台とを備える基板保持体であって、薄型化が要求される基板保持体に適用可能である。具体的には、テレビ、モニタディスプレイ、デジタルサイネージ、携帯端末、タブレット端末、および、テーブル型ディスプレイ装置などの電子機器に、本開示は適用可能である。 The present disclosure is a substrate holder that includes a substrate and a base that holds a circuit board, and can be applied to a substrate holder that is required to be thin. Specifically, the present disclosure is applicable to electronic devices such as a television, a monitor display, a digital signage, a mobile terminal, a tablet terminal, and a table type display device.
  10、11、12、13、14、15、110 基板保持体
  20、120 基台
  20a 主面
  21、23、121 ボス
  21a 離隔部
  22 雌ネジ部
  24、25 係合部
  29、129 絶縁部材
  30、130、150、160、161、162 回路基板
  31、131 取付孔
  40、43、44、45、46、140 固定部材
  41、47、141 ネジ
  41a、47a、141a 頭部
  41b、43b、44b、45b、47b、141b、 軸部
  42、43a、44a、45a、142 鍔部
  44c、45c 爪部
  60 補助部材
  80 電子部品
  90 電子機器
  91 板状部材
  92 カバー
 100 ディスプレイ装置
 101 ディスプレイパネル
 102 接着部材
 106 バックカバー
 108 枠体
 139 走査線
 159 信号線
10, 11, 12, 13, 14, 15, 110 Substrate holder 20, 120 Base 20a Main surface 21, 23, 121 Boss 21a Separation part 22 Female thread part 24, 25 Engagement part 29, 129 Insulating member 30, 130, 150, 160, 161, 162 Circuit board 31, 131 Mounting hole 40, 43, 44, 45, 46, 140 Fixing member 41, 47, 141 Screw 41a, 47a, 141a Head 41b, 43b, 44b, 45b, 47b, 141b, shaft portion 42, 43a, 44a, 45a, 142 collar portion 44c, 45c claw portion 60 auxiliary member 80 electronic component 90 electronic device 91 plate member 92 cover 100 display device 101 display panel 102 adhesive member 106 back cover 108 Frame 139 Scanning line 159 Signal line

Claims (10)

  1.  凸部を有する基台と、
     前記凸部が挿入される取付孔を有する回路基板と、
     前記回路基板を前記基台に固定する固定部材とを備え、
     前記固定部材は、
     前記取付孔に挿入された状態の前記凸部に固定される軸部と、
     前記軸部の前記基台とは反対側の端部に備えられ、前記回路基板と当接することで、前記回路基板の基台とは反対方向への移動を規制する鍔部とを有する
     基板保持体。
    A base having a convex part;
    A circuit board having a mounting hole into which the convex portion is inserted;
    A fixing member for fixing the circuit board to the base,
    The fixing member is
    A shaft portion fixed to the convex portion inserted into the mounting hole;
    Provided at an end of the shaft portion opposite to the base, and having a flange that restricts movement of the circuit board in a direction opposite to the base by contacting the circuit board body.
  2.  前記凸部は、雌ネジ部を有し、
     前記軸部は、前記雌ネジ部と螺合することで、前記凸部に固定される
     請求項1記載の基板保持体。
    The convex portion has a female screw portion,
    The substrate holder according to claim 1, wherein the shaft portion is fixed to the convex portion by screwing with the female screw portion.
  3.  前記軸部の一端には、前記軸部の外径よりも大きな外径を有する頭部が設けられており、
     前記鍔部は、前記軸部が貫通し、前記頭部によって係止される環状部材である
     請求項2記載の基板保持体。
    At one end of the shaft portion, a head having an outer diameter larger than the outer diameter of the shaft portion is provided,
    The substrate holder according to claim 2, wherein the flange portion is an annular member that penetrates the shaft portion and is locked by the head portion.
  4.  前記軸部は、前記鍔部とは反対側の端部に設けられた爪部を有し、
     前記凸部は、前記凸部に挿入された前記爪部と係合することで、前記軸部を固定する係合部を有する
     請求項1記載の基板保持体。
    The shaft portion has a claw portion provided at an end opposite to the collar portion,
    The board | substrate holding body of Claim 1. The said convex part has an engaging part which fixes the said axial part by engaging with the said nail | claw part inserted in the said convex part.
  5.  前記係合部は、前記凸部に形成された前記軸部が挿入される軸孔に配置された、前記爪部と係合する補助部材を有する
     請求項4記載の基板保持体。
    The substrate holder according to claim 4, wherein the engaging portion includes an auxiliary member that engages with the claw portion, which is disposed in a shaft hole into which the shaft portion formed on the convex portion is inserted.
  6.  さらに、前記回路基板と前記基台とを離隔させることで、前記回路基板と、前記基台の前記凸部が配置された面である主面との間に空隙を形成させる離隔部を有する
     請求項1~5のいずれか1項に記載の基板保持体。
    Furthermore, it has a separation part which forms a space | gap between the said circuit board and the main surface which is the surface where the said convex part of the said base is arrange | positioned by separating the said circuit board and the said base. Item 6. The substrate holder according to any one of Items 1 to 5.
  7.  前記離隔部は、前記凸部が有する段差によって形成されている
     請求項6記載の基板保持体。
    The substrate holder according to claim 6, wherein the separation portion is formed by a step provided by the convex portion.
  8.  前記固定部材は、金属製である
     請求項1~7のいずれか1項に記載の基板保持体。
    The substrate holder according to any one of claims 1 to 7, wherein the fixing member is made of metal.
  9.  請求項1~8のいずれか1項に記載の基板保持体を備える電子機器。 An electronic device comprising the substrate holder according to any one of claims 1 to 8.
  10.  請求項1~8のいずれか1項に記載の基板保持体と、
     画像を表示するディスプレイパネルであって、前記回路基板と電気的に接続され、前記基台を挟んで前記回路基板とは反対側に配置されたディスプレイパネルと、
     を備えるディスプレイ装置。
    A substrate holder according to any one of claims 1 to 8,
    A display panel for displaying an image, wherein the display panel is electrically connected to the circuit board, and is disposed on the opposite side of the circuit board across the base,
    A display device comprising:
PCT/JP2014/001566 2013-05-27 2014-03-19 Substrate holder, electronic apparatus, and display device WO2014192205A1 (en)

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Publication number Priority date Publication date Assignee Title
JP2016201475A (en) * 2015-04-10 2016-12-01 株式会社デンソー Electronic device

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JPS5251065U (en) * 1975-10-09 1977-04-12
JPH04113312U (en) * 1991-03-22 1992-10-02 株式会社ニフコ Locking structure
JP2001332878A (en) * 2000-05-23 2001-11-30 Denso Corp Screw tightening structure of electronic apparatus
JP2005331948A (en) * 2004-05-18 2005-12-02 Samsung Sdi Co Ltd Plasma display apparatus
JP2011166048A (en) * 2010-02-15 2011-08-25 Fujitsu Telecom Networks Ltd Housing of electronic apparatus or the like

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Publication number Priority date Publication date Assignee Title
JPS5251065U (en) * 1975-10-09 1977-04-12
JPH04113312U (en) * 1991-03-22 1992-10-02 株式会社ニフコ Locking structure
JP2001332878A (en) * 2000-05-23 2001-11-30 Denso Corp Screw tightening structure of electronic apparatus
JP2005331948A (en) * 2004-05-18 2005-12-02 Samsung Sdi Co Ltd Plasma display apparatus
JP2011166048A (en) * 2010-02-15 2011-08-25 Fujitsu Telecom Networks Ltd Housing of electronic apparatus or the like

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JP2016201475A (en) * 2015-04-10 2016-12-01 株式会社デンソー Electronic device

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