WO2014173157A1 - 一种显示基板及驱动集成电路的引线修复方法 - Google Patents
一种显示基板及驱动集成电路的引线修复方法 Download PDFInfo
- Publication number
- WO2014173157A1 WO2014173157A1 PCT/CN2013/090318 CN2013090318W WO2014173157A1 WO 2014173157 A1 WO2014173157 A1 WO 2014173157A1 CN 2013090318 W CN2013090318 W CN 2013090318W WO 2014173157 A1 WO2014173157 A1 WO 2014173157A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- signal
- repair
- lead
- line
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136259—Repairing; Defects
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136259—Repairing; Defects
- G02F1/136263—Line defects
Definitions
- embodiments of the present invention relate to the field of display panels, and in particular, to a display substrate and a lead repair method for driving the integrated circuit.
- a liquid crystal display device includes a liquid crystal display panel, a backlight, a driving circuit board, a flexible circuit board, a source driving integrated circuit (IC), and a gate driving IC.
- the liquid crystal display panel is mainly composed of a lower polarizer, an array substrate, a liquid crystal, a color film substrate, and an upper polarizer.
- On the array substrate there are lateral scanning signal lines and longitudinal data signal lines and a thin film transistor (TFT) switch, wherein the TFT switch is used to control the transmission of the longitudinal data signal according to the lateral scanning signal.
- TFT thin film transistor
- the color filter substrate and the array substrate are sealed by a sealant, and each of the sealant is distributed in the sealant.
- the opposite conductive paste turns on the upper and lower substrates. Since the liquid crystal panel itself does not emit light, a backlight is required to provide light. The liquid crystal deflects at different voltages at different angles, and the transmitted light intensity is different.
- the upper and lower polarizers located outside the liquid crystal panel can control the polarization direction of the light. The polarized light passes through the corresponding color film to form a monochromatic polarized light, and the image is displayed by a combination of three colors of red, green and blue.
- the horizontal scanning signal is used to control the TFT switch, the TFT switch is turned on, the pixel can be charged, and the longitudinal data signal line transmits a signal to each pixel to control the angle of the liquid crystal deflection.
- the array substrate is divided into an effective display area and an outer lead area, the effective display area is a pixel area, and a pixel matrix is distributed; the outer lead area is respectively connected to the effective display area and the gate driving IC, the source driving IC, and the signal of the driving circuit board Transfer to the active display area.
- the existing liquid crystal display panel In the existing liquid crystal display panel, two "mouth" shaped signal repair lines are arranged around the effective display area to repair the defects of the scan lines or signal lines in the effective display area, but if the signals of the outer lead areas are Poor lead wire, for example, poor contact between the signal lead and the source driver IC or the gate drive IC, signal pin disconnection, etc., cannot be repaired under normal conditions, which makes it possible to check the signal leads of the outer lead area after the process of the card. When a defect occurs, it can only be disposed of by scrapping the product, which will result in waste of the product and increase the cost of the product. In summary, the existing liquid crystal display panel cannot repair a bad signal lead in the outer lead area, thereby causing waste of the product and resulting in an increase in the cost of the product.
- the embodiment of the invention provides a method for repairing a lead of a display substrate and a driving integrated circuit, which is used for solving the problem that the existing display substrate cannot repair the defective signal lead in the outer lead area, thereby causing waste of the product, thereby causing the product to be The problem of increased costs.
- a display substrate provided by an embodiment of the present invention includes: a plurality of signal leads on the display substrate, at least one driving integrated circuit, at least one repair chip, at least one repair lead, and at least one repair line; Wherein, a repair chip is connected to at least one driving integrated circuit, and the repair lead is connected to the repair chip, and the repair line is disposed at a crossover with the signal lines connected to the plurality of signal leads and is insulated from the plurality of signal lines;
- the driving integrated circuit outputs a signal output to a defective signal lead to the repair chip when a signal lead connected thereto is defective;
- the repair chip outputs a signal outputted by the received driver integrated circuit to a repair lead connected to itself;
- the repair lead transmits a signal outputted by the repair chip to a corresponding repair line; when the repair line receives a signal from the repair lead, the repair line and a bad signal connected thereto
- the signal line to which the lead is connected is turned on to transmit the signal to the signal line.
- repair lead is located in an outer lead region of the display substrate.
- repair line is located at an edge of the display area of the display substrate.
- the driving integrated circuit includes a feedback channel
- the repairing chip includes an input channel and an output channel corresponding to the input channel, and an input channel of the repair chip is connected to a feedback channel of the driving integrated circuit, and the repair chip The output channel is connected to the repair lead;
- the driver integrated circuit is used to:
- a signal outputted to the defective signal lead is output to the repair chip through a feedback channel corresponding to the signal lead;
- the repair chip is used to:
- the signal output by the driving integrated circuit through its feedback channel is received through its own input channel, and the received signal is output from the corresponding output channel to the repair lead connected to the output channel.
- the driving integrated circuit is a source driving integrated circuit, and the plurality of signal leads on the display substrate are signal leads of the data lines;
- the repair line is configured to transmit a signal transmitted by the received repair wire to a data line connected to the defective signal lead connected to the repair line.
- the driving integrated circuit is a gate driving integrated circuit, and the plurality of signal leads on the display substrate are signal leads of the scanning line;
- the repair line is configured to transmit a signal transmitted by the received repair wire to a scan line connected to the defective signal lead connected to the repair line.
- repair line is disposed in a different layer on the display substrate at a signal line connected to the plurality of signal leads on the display substrate, and is electrically insulated by the insulating layer.
- the repair line receives the signal from the repair lead transmission, the repair line is electrically connected to the signal line connected to the defective signal lead, thereby transmitting the received signal to a defective one.
- Signal line to which the signal leads are connected are connected.
- the driving integrated circuit is located on the display substrate; or the driving integrated circuit is located on a flexible circuit board, and the flexible circuit board is configured to connect a driving circuit board that provides a driving signal to the display substrate and the display Substrate.
- the embodiment of the present invention further provides a lead repairing method for driving an integrated circuit, comprising: providing at least one repair chip, at least one repair lead, and at least one repair line, wherein the at least one repair chip is connected to the driving integrated circuit.
- the at least one repairing lead is connected to the repairing chip, and the repairing line is disposed at a cross between the signal line connected to the signal lead connected to the driving integrated circuit and is insulated from the signal line;
- the method further includes: disconnecting the short-circuit connection point in the signal lead that has been short-circuited from the other portion of the short-circuited signal lead.
- the method further includes:
- connection point of the corresponding repair lead and the repair line for repairing each defective signal lead and the connection point of the repair line and the signal line corresponding to the signal lead is disconnected from the other portion of the repair line.
- a lead repairing method for a display substrate and a driving integrated circuit when a signal lead connected to a driving IC is defective, outputs a signal output to a defective signal lead to a repairing chip, and the repairing chip receives the signal
- the signal outputted by the driver IC is output to the repair lead connected to itself, and the repair lead transmits the signal outputted by the repair chip to the repair line, and the repair line transmits the signal transmitted by the repair lead to the repair.
- the pixel's TFT switch transmits the signal.
- the repair lead Since the repair lead is located in the outer lead area, the repair line is located at the edge of the display area of the display substrate. Therefore, when the signal lead of the outer lead area is defective, the repair lead and the repair line together can replace the bad signal lead transmission signal, thereby It repairs the bad signal lead in the outer lead area, avoids the waste of the product due to the poor signal lead of the outer lead area, and reduces the cost of the product.
- FIG. 1 is a schematic view showing the structure of a display substrate according to an embodiment of the present invention
- FIG. 2 is a view showing the structure of a display substrate according to another embodiment of the present invention
- FIG. 3 is a view showing still another embodiment of the present invention.
- FIG. 4 is a flow chart showing a method of repairing a lead of a driving integrated circuit according to an embodiment of the present invention.
- FIG. 5 is a flow chart showing a method of repairing a lead of a driving integrated circuit according to another embodiment of the present invention
- FIG. 6 is a flow chart showing a method of repairing a lead of a driving integrated circuit in accordance with still another embodiment of the present invention.
- Embodiments of the present invention provide a lead repair method for a display substrate and a driving integrated circuit, by replacing a bad signal lead with a repair lead and a repair line located in a display area of the display substrate, and connecting the signal to the defective signal lead
- the line further turns to the TFT switch of each pixel connected to the signal line, and transmits a signal that the driver IC outputs to the defective signal lead, thereby repairing the signal lead which is bad in the outer lead region, and avoiding the outer lead region
- the waste of products caused by poor signal leads reduces the cost of the product.
- a display substrate provided by an embodiment of the present invention includes: a plurality of signal leads on a display substrate, at least one integrated circuit (integrated circuit, IC is replaced by an IC), at least one repair chip, at least one Repairing a lead wire and at least one repairing wire; wherein, a repairing chip is connected to at least one driving IC, the repairing lead is located in an outer lead area of the display substrate and is connected to the repairing chip, and the repairing line is located in a display area of the display substrate The repair line is disposed across the signal line connected to the plurality of signal leads and insulated from the plurality of signal lines;
- the driving IC is configured to output a signal outputted to a defective signal lead to the repairing chip when a signal lead connected thereto is defective;
- the repair chip is configured to output a signal outputted by the received driving IC to a repair lead connected to itself;
- the repairing lead is configured to transmit the received signal output by the repairing chip to the repairing line; and the repairing line is configured to transmit the signal transmitted by the received repairing lead to the faulty connection with the repairing line The signal line to which the signal lead is connected.
- the display substrate can be the upper substrate or the lower substrate of the display panel.
- the upper substrate of the display panel is a color film substrate
- the lower substrate is an array substrate, which can be used as the display substrate according to the embodiment of the present invention.
- the array substrate includes a plurality of data lines and a plurality of scan lines
- the driving IC is disposed on the array substrate, and is electrically connected by connecting the data lines and the scan lines of the display area to display.
- the driver IC can also be placed on the color film substrate through the conductive spacer
- the pad or other conductive structure transmits signals of the driving IC to the data lines and scanning lines of the array substrate for display. The following embodiments of the present invention will be described with the display substrate as an array substrate.
- the array substrate includes a display area and an outer lead area, and the driving IC transmits signals to a plurality of corresponding signal lines located in the display area through a plurality of signal leads located in the outer lead area to realize display driving.
- the repair line is generally located at the edge of the display area. When repairing a bad signal lead, it can be electrically connected to a signal line connected to a bad signal lead. That is, the repair line is placed close to the signal line and signal. The location where the leads are connected. At the same time, in order to realize the repair line, multiple signal lines can be repaired, and the repair line and the signal line are generally arranged in a cross.
- the cross setting means that if the signal line is a plurality of vertical lines, the repair line can be a horizontal line.
- the repair line may be a vertical line and intersect with each of the signal lines.
- the signal line insulation of the repair line and the plurality of signal leads on the array substrate can be realized by: the repair line and the plurality of signal lines connected to the plurality of signal leads on the array substrate are located in different layers on the array substrate An insulating layer is disposed between a layer where the repair line is located and a plurality of signal lines connected to the plurality of signal leads on the array substrate, thereby realizing a plurality of signal lines connecting the repair line and the plurality of signal leads on the array substrate insulation.
- the repair line transmits the signal transmitted by the repair lead to the signal line connected to the defective signal lead connected to the repair line by the following means: the repair line and the portion of the signal lead that is defective in connecting the signal line It is turned on, thereby transmitting the received signal transmitted by the repairing lead to the signal line, and further transmitting to the TFT switch of each pixel to which the signal line is connected.
- the repair lead can be electrically connected to the repair line or insulated from the repair line.
- the repair lead can be placed in the same layer on the array substrate as the plurality of signal leads on the array substrate.
- the driving IC is a source driving IC
- the plurality of signal leads on the array substrate are signal leads of the data line; and the repairing line is specifically configured to transmit the signal transmitted by the received repairing lead to the connection with the repairing line.
- the signal line to which the signal lead of the defective data line is connected is the data line.
- the driving IC is a gate driving IC
- the plurality of signal leads on the array substrate are signal leads of the scanning line; and the repairing line is specifically configured to transmit the signal transmitted by the received repairing lead to the repairing line
- the signal line to which the signal lead of the connected defective scan line is connected is the scan line.
- the repair line can be set to one or more, if it needs to be repaired in the outer lead area, A good scan line, and need to repair a bad data line in the outer lead area, you can set two repair lines.
- the driving IC may be located on the array substrate in the display panel or on the flexible circuit board for connecting the array substrate and the driving circuit board, and the driving circuit board is used to provide driving signals for the driving IC, wherein the source The driving IC converts the driving signal supplied from the driving circuit into a pixel voltage, and the gate driving IC converts the driving signal supplied from the driving circuit into the gate voltage of the TFT switch.
- the display substrate provided by the embodiment of the invention can be used for repairing a bad signal lead in a signal lead connected to a driving IC, and can also be used for repairing a bad signal lead in a signal lead connected to a plurality of driving ICs.
- the driving IC is configured to: output a signal to the defective signal lead to a defective signal lead, and output the signal to the repairing chip through a feedback channel corresponding to the signal lead in the driving IC.
- the feedback channel corresponding to one signal lead in the driving IC means that when the signal lead is defective, the driving IC outputs a signal outputted to the signal lead from the feedback channel. Since each signal lead is connected to one output channel of the driving IC, the correspondence between the signal lead and the feedback channel in the driving IC is represented by the correspondence between the output channel in the driving IC and the feedback channel in the driving IC. This correspondence can be pre-configured.
- the repair chip is configured to: receive a signal output by the driving IC through a feedback channel of the driving IC through an input channel of the driving IC, and output the received signal from the corresponding output channel according to the corresponding relationship between the input channel and the output channel thereof A repair lead connected to the output channel.
- the output channel corresponding to one input channel in the repair chip means that when receiving the signal through the input channel, the repair chip outputs the received signal from its corresponding output channel.
- the correspondence between the input channel and the output channel in the repair chip is pre-configured.
- each feedback channel of each driver IC is connected to one input channel of a repair chip, and the correspondence between the feedback channel in the driver IC and the input channel in the repair chip is also pre-configured.
- the following is an illustration of three driving ICs in an array substrate to illustrate the operation of the driver IC and the repair chip in different cases.
- the repair line and the repair lead are located on different layers of the array substrate, the layer where the repair line is located, and the repair.
- An insulating layer is disposed between the layers where the leads are located, and the repairing wires and the repairing leads may be welded by laser laser, for example, a laser with a laser emitting function may be used for the laser laser welding.
- Embodiment 1 As shown in FIG. 1, the source driving IC 1, the source driving IC 2, and the source driving IC 3 each have a feedback channel FB, and therefore, a signal line of the data line connected to each output channel of the source driving IC 1 is defective.
- the feedback channels corresponding to the signal leads are the feedback channels FB in the source driver IC1, and the signal leads of the data lines connected to the respective output channels of the source driver IC 2 are bad.
- the feedback channels corresponding to the signal leads are all source drivers.
- the feedback channel FB in IC2 and the signal line of the data line connected to each output channel in the source driver IC3 have a feedback channel corresponding to the feedback channel FB in the source driver IC3.
- the feedback channel FB of the source driver IC1 is connected to the input channel IN1 of the repair chip RC1
- the feedback channel FB of the source driver IC2 is connected to the input channel IN2 of the repair chip RC1
- the feedback channel FB of the source driver IC3 and the input of the repair chip RC2 Channel IN1 is connected.
- One output channel of each source driver IC is connected to a data line through signal leads of the data line.
- the source driving IC 1, the source driving IC 2, and the source driving IC 3 are located on the array substrate 11, and the repairing lines 13 are located in the display region 12 in the array substrate 11. Among them, other input channels and other output channels in the repair chips RC1 and RC2 are not shown in FIG.
- the input channel IN1 in the repair chip RC1 corresponds to the output channel OUT1 in the RC1
- the input channel IN2 in the repair chip RC1 corresponds to the output channel OUT2 in the RC1
- the input channel IN1 in the repair chip RC2 corresponds to the output channel OUT1 in the RC2.
- FIG. 1 shows the two data lines in the outer lead region. The signal leads are broken.
- the source driving IC2 outputs the signal of the signal lead outputted to the data line through the output channel 3, and outputs it to the repairing chip RC1 from its own feedback channel FB.
- the repairing chip RC1 determines that the signal is from the input channel IN2 that receives the signal.
- the source driver IC2; the repair chip RC1 outputs the signal received through the input channel IN2, from the output channel OUT2 corresponding to the input channel IN2, to the repair lead connected to the output channel OUT2; the repair lead and the repair line are laser-laser 13 is turned on, and a signal line (ie, a data line) connected to the defective signal lead connecting the repair line 13 and the output channel 3 of the source driving IC 2 is turned on, and then the signal is transmitted to each pixel connected to the data line.
- the source of the TFT switch (not shown in FIG. 1, the TFT switch is located in the display area 12) realizes normal display, thereby realizing repair of a defective signal lead that connects the output channel 3 of the source drive IC 2.
- the source driver IC3 outputs a signal to the signal line of the data line through the output channel 2,
- the feedback channel FB output ⁇ complex chip RC2, repair chip RC2 according to the input channel IN1 receiving the signal, determine the signal from the source driver IC3; repair chip RC2 will receive the signal through the input channel IN1, from the input channel IN1
- the corresponding output channel OUT1 is output to the repair lead connected to the output channel OUT1; the repair lead is connected to the repair line 13 by laser laser, and the defective signal is connected to the output line 2 of the source drive IC 3 by the repair line 13
- the signal line (ie, the data line) to which the lead is connected is turned on, and the signal is transmitted to the source of the TFT switch (not shown in FIG. 1 and the TFT switch is located in the display area 12) of each pixel connected to the data line to realize normal display. Thereby, repair of a defective signal lead that connects the output channel 2 of the source driver IC 3 is achieved.
- the repair line 13 connects both the defective signal lead connecting the output channel 3 of the source driver IC 2 and the corresponding signal line, the repair lead connected to the output channel OUT2 of the repair chip RC1 is turned on, and the source is driven.
- the portion of the IC3 output channel 2 connected to the defective signal lead connected to the corresponding signal line is connected to the repair lead connected to the output channel OUT1 of the repair chip RC2. Therefore, the connection point a and the connection point b on the repair line 13 are connected.
- the portion between the connection point c and the connection point d needs to be disconnected to avoid signal confusion, wherein the connection point a is the connection point of the repair lead and the repair line 13 connected to the output channel OUT2 of the repair chip RC1, and is connected.
- Point b is the connection point of the defective signal lead connected to the output channel 3 of the source driver IC 2 and the portion where the corresponding signal line is connected to the repair line 13, and the connection point c is the repair lead connected to the output channel OUT1 of the repair chip RC2. Repairing the connection point of the line 13, the connection point d is a defective signal lead connected to the output channel 2 of the source driver IC 3 and corresponding The connection point between the portion where the signal line is connected and the repair line 13.
- the source driver IC1 does not detect that the signal lead of the data line connected to each of its output channels is defective. Therefore, the feedback channel FB of the source driver IC1 does not output a signal.
- Embodiment 2 is a diagrammatic representation of Embodiment 1:
- the source driver IC1, the source driver IC2, and the source driver IC3 each have a feedback channel FB, and therefore, the signal leads of the data lines connected to the respective output channels of the source driver IC 1 are defective.
- the feedback channels corresponding to the signal leads are the feedback channels FB in the source driver IC1, and the signal leads of the data lines connected to the respective output channels of the source driver IC 2 are bad.
- the feedback channels corresponding to the signal leads are all source drivers.
- Feedback channel FB in IC2 source driver
- the signal path of the data line connected to each output channel in IC3 has a bad signal line.
- the corresponding feedback channel is the feedback channel FB in the source driver IC3.
- the feedback channel FB of the source driver IC1 is connected to the input channel IN1 of the repair chip RC
- the feedback channel FB of the source driver IC2 is connected to the input channel IN2 of the repair chip RC
- the feedback channel FB of the source driver IC3 and the input of the repair chip RC Channel IN3 is connected.
- One output channel of each source driver IC is connected to one data line.
- the source driver IC 1, the source driver IC 2, and the source driver IC 3 are located on the array substrate 11, and the repair line 131 and the repair line 132 are located in the display region 12 in the array substrate 11.
- other input channels and other output channels in the repair chip RC are not shown in FIG. 2.
- the input channel IN1 in the repair chip RC corresponds to the output channel OUT1
- the input channel IN2 in the repair chip RC corresponds to the output channel OUT2
- the input channel IN3 in the repair chip RC corresponds to the output channel OUT3.
- the data line connected to the output channel 2 of the source driver IC1 is defective in the outer lead region, the data line connected to the output channel 3 of the source driver IC 2 is defective in the outer lead region, and the signals of the two data lines are shown in FIG.
- the lead wire is disconnected; the data line connected to the output channel 4 of the source driver IC 3 is defective in the outer lead region, and is shown in FIG. 2 as a short circuit of the signal lead of the data line.
- the short circuit of the signal lead of the data line to which the IC is connected may be caused by the short circuit of the signal lead through the conductive metal ball in the anisotropic conductive paste in the sealant and the common electrode of the color filter substrate in the display panel, or Caused by other reasons.
- the driving IC detects that the resistance of the connected signal lead is infinite, that is, the connected signal lead is disconnected, the signal outputted to the signal lead can be output to the repairing chip connected to the driving IC through its own feedback channel. Therefore, when it is determined that the signal lead is short-circuited, the short-circuit connection point on the signal lead is first disconnected from the other portion of the signal lead, and therefore, the signal line of the data line to which the output channel 4 of the source drive IC 3 is connected is to be connected. The shorted connection point s is disconnected from the other portions of the signal lead of the data line.
- the operation of determining whether or not the signal lead is short-circuited can be judged, for example, based on the waveform of the signal line and the display screen, and the disconnecting operation therein can be performed, for example, by a device such as a microscope having a laser emitting function.
- the source driver IC1 outputs the signal of the signal lead outputted to the data line through the output channel 2, and outputs it to the repair chip RC from its own feedback channel FB.
- the repair chip RC determines the signal from the input channel IN1 that receives the signal.
- the source driver IC1; the repair chip RC outputs a signal received through the input channel IN1 from the output channel OUT1 corresponding to the input channel IN1 to the repair lead connected to the output channel OUT1; the repair lead and the repair line 131 are laser-laser Connected, And a connection portion of the defective signal lead and the signal line (ie, the data line) connected to the output channel 2 of the source driver IC 1 is connected to the repair line 131, and the signal is transmitted to the TFT switch of each pixel connected to the data line.
- the source (not shown in Fig. 1, the TFT switch is located in the display area 12) realizes normal display, thereby realizing repair of a defective signal lead that connects the output channel 2 of the source drive IC 1.
- the source driver IC2 outputs a signal of the signal lead outputted to the data line through the output channel 3, and outputs a complex chip RC from its own feedback channel FB.
- the repair chip RC determines that the signal is from the source driver according to the input channel IN2 that receives the signal.
- the repair chip RC outputs a signal received through the input channel IN2 from the output channel OUT2 corresponding to the input channel IN2 to the repair lead connected to the output channel OUT2; the repair lead is connected to the repair line 131 by laser laser.
- the TFT switch realizes normal display, thereby realizing repair of the signal lead of the defective data line to which the output channel 3 of the source drive IC 2 is connected.
- the source driver IC3 outputs a signal of the signal lead outputted to the data line through the output channel 4, and outputs a complex chip RC from its own feedback channel FB.
- the repair chip RC determines the signal from the source driver according to the input channel IN3 that receives the signal.
- the repair chip RC3 outputs a signal received through the input channel IN3 from the output channel OUT3 corresponding to the input channel IN3 to the repair lead connected to the output channel OUT3; the repair lead is connected to the repair line 132 by laser laser.
- a portion where the defective signal lead connecting the output channel 4 of the source driver IC 3 and the signal line (ie, the data line) is connected to the repair line 132, and the signal is transmitted to the TFT switch of each pixel connected to the data line.
- the source (not shown in Fig. 2, the TFT switch is located in the display area 12) realizes normal display, thereby realizing repair of the signal lead of the defective data line to which the output channel 4 of the source drive IC 3 is
- the repair line 131 connects both the signal lead of the defective data line to which the output channel 2 of the source drive IC 1 is connected to the signal line (ie, the data line), and the repair lead connected to the output channel OUT1 of the repair chip RC And connecting the signal lead of the defective data line connected to the output channel 3 of the source driver IC 2 to the signal line (ie, the data line), and the repair lead connected to the output channel OUT2 of the repair chip RC; Therefore, the connection point on the repair line 131 The portion between a and the connection point b and the portion between the connection point c and the connection point d need to be disconnected to avoid signal confusion, wherein the connection point b is a repair lead and a repair line connected to the output channel OUT1 of the repair chip RC.
- connection point a is a connection point of a portion where a signal lead of a defective data line connected to the output channel 2 of the source drive IC 1 is connected to a signal line (ie, the data line) and a repair line 131, and a connection point c
- the connection point d is the signal lead and the signal line of the defective data line connected to the output channel 3 of the source drive IC 2 (ie, the data line) The connection point between the connected portion and the repair line 131.
- the repair line 132 only connects the signal lead of the defective data line connected to the output channel 4 of the source driver IC 3 to the signal line (ie, the data line), and the repair lead connected to the output channel OUT3 of the repair chip RC. No, signal clutter does not occur, so it is not necessary to disconnect the portion between the connection point e and the connection point f from the other portion of the repair line 132, wherein the connection point e is a repair lead connected to the output channel OUT3 of the repair chip RC
- the connection point with the repair line 132 is the connection point of the portion of the signal lead of the defective data line to which the output line 4 of the source drive IC 3 is connected to the signal line (i.e., the data line) and the repair line 132.
- Embodiment 3 is a diagrammatic representation of Embodiment 3
- the correspondence between the bad signal leads in the signal leads of the data lines connected to the respective output channels of the driver IC and the feedback channels in the driver IC is as follows: The number of the output channel connecting the defective signal lead is taken as the new number of the signal lead connected to the output channel, and the defective signal lead connected to the driver IC is sorted according to its new number, and the driver IC outputs to A signal of a bad signal lead is output to a feedback channel with the same number as the new one obtained after sorting the signal lead that has a bad condition. It can be seen from the above correspondence that the number of feedback channels provided in the driver IC is equal to the maximum number of defective signal leads in the signal leads to which the driver IC can be repaired.
- the sum of the number of input channels in the repair chip is equal to the sum of the number of feedback channels in each of the driver ICs connected to the repair chip, and one input channel in one repair chip is connected to a driver IC connected to the repair chip.
- a feedback channel, a feedback channel in a driver IC is connected to an input channel in the repair chip to which the driver IC is connected.
- an input channel in the repair chip and the repair chip The output channels correspond one-to-one. Each of the output channels in a repair chip is connected to a repair lead.
- the source driver IC1 and the source driver IC2 each have two feedback channels, and the source driver IC3 has a feedback channel FB. Therefore, first, the number of the signal lead of the data line in which the defective data line is generated in the data line to which the respective output channels of the source driving IC 1 are connected is determined, and the signal lead of the data line connected to the output channel 2 of the source driving IC 1 is defective. The signal lead of the data line connected to the output channel 5 of the source driver IC 1 is defective.
- the signal leads of the defective data line in the data line connected to the source driver IC 1 are numbered 2 and 5, if the number is from small to In the large sequential order, the new number of the data line numbered 2 is 1, and the new number of the data line numbered 5 is 2. Of course, you can sort them in ascending order by number, or you can sort them in other ways.
- the source driving IC1 outputs the signal of the signal lead output to the data line connected to the output channel 2 to the repair chip RC through its own feedback channel FBI, and the source driving IC1 outputs the signal to the data line connected to the output channel 5.
- the signal of the lead is output to the repair chip RC through its own feedback channel FB2; the signal lead of the data line connected to the output channel 3 of the source drive IC 2 is defective, and therefore, the signal lead of the data line connected to the source drive IC 2 is defective.
- the signal lead number is 3, and when sorting, the new number of the signal lead of the data line numbered 3 is 1, so the source drive IC 2 outputs the signal to the signal lead of the data line connected to the output channel 3.
- the feedback channel FBI is output to the repair chip RC by the same number 1 as the new number 1 of the bad signal lead; since the source drive IC 3 has a feedback channel FB, the data lines of the source drive IC 3 are connected to the respective output channels.
- a bad signal lead in the signal lead can only correspond to the feedback channel FB of the source driver IC3.
- the source driving IC 1, the source driving IC 2, and the source driving IC 3 are located on the array substrate 11, and the repairing lines 13 are located in the display region 12 in the array substrate 11.
- the input channel IN1 corresponds to the output channel OUT1
- the input channel IN2 corresponds to the output channel OUT2
- the input channel IN3 corresponds to the output channel OUT3
- the input channel IN4 corresponds to the output channel OUT4
- the input channel IN5 and The output channel OUT5 corresponds to each other;
- the input channel IN1 in the repair chip RC is connected to the feedback channel FBI of the source driver IC1
- the input channel IN2 in the repair chip RC is connected to the feedback channel FB2 of the source driver IC1, repairing the chip
- the input channel IN3 in the RC is connected to the feedback channel FBI of the source driver IC2, and the input channel IN4 in the repair chip RC is connected to the feedback channel FB2 of the source driver IC2, and the input channel IN5 in the chip RC is repaired
- the data line connected to the output channel 2 of the source driver IC1 and the data line connected to the output channel 5 of the source driver IC1 are both defective in the outer lead region, and the data line connected to the output channel 3 of the source driver IC 2 is outside.
- the lead area is bad, and the signal leads of the three data lines are broken in Figure 3.
- the source driving IC1 outputs the signal of the signal lead outputted to the data line through the output channel 2, and outputs the complex chip RC from its own feedback channel FBI.
- the repair chip RC determines the signal from the input channel IN1 receiving the signal.
- the feedback channel FBI of the source driving IC1; the repair chip RC outputs the signal received through the input channel IN1 from the output channel OUT1 corresponding to the input channel IN1 to the repair lead connected to the output channel OUT1;
- the repair lead is laser-laser Connected to the repair line 13, the connection point of the two is the connection point a, and the signal lead and signal line (ie, the data line) of the defective data line connecting the repair line 13 and the output channel 2 of the source drive IC1
- the connected portion is turned on, and the connection point of the two is the connection point b, thereby realizing the repair of the defective data line connecting the output channel 2 of the source drive IC1.
- the source driver IC1 outputs a signal of the signal lead outputted to the data line through the output channel 5, and outputs a complex chip RC from its own feedback channel FB2, and the repair chip RC determines according to the input channel ⁇ 2 that receives the signal.
- the signal is from the feedback channel FB2 of the source driver IC1; the repair chip RC outputs the signal received through the input channel ⁇ 2, from the output channel OUT2 corresponding to the input channel ⁇ 2, to the repair lead connected to the output channel OUT2;
- the repair lead is connected to the repair line 13, and the connection point between the two is a connection point d, and a portion where the defective signal lead connecting the output channel 5 of the source drive IC 1 is connected to the signal line (the data line) is
- the repair line 13 is turned on, and the connection point between the two is the connection point c, thereby realizing the repair of the signal lead of the data line which is defective in the connection of the output channel 5 of the source drive IC 1.
- the source driver IC2 outputs the signal of the signal lead outputted to the data line through the output channel 3, and outputs the complex chip RC from its own feedback channel FBI.
- the repair chip RC determines the signal from the source driver according to the input channel IN3 receiving the signal.
- the feedback channel FBI of IC2; the repair chip RC outputs the signal received through the input channel IN3, from the output channel OUT3 corresponding to the input channel IN3, to the repair lead connected to the output channel OUT3; the repair lead is repaired by laser laser Line 13 is turned on, the connection point of the two is the connection point e, and the source drive IC2 is driven.
- the portion of the signal line that is connected to the channel 3 that is connected to the signal line is connected to the repair line 13, and the connection point between the two is f, and the signal is transmitted to the TFT of each pixel connected to the data line.
- the source of the switch (not shown in FIG. 3, the TFT switch is located in the display area 12) realizes normal display, thereby realizing repair of the signal lead of the defective data line to which the output channel 3 of the source drive IC 2 is connected.
- the signal lead of the data line of the source line to which the source driver IC3 is connected does not generate a signal line of the defective data line, the signal is not outputted from the feedback path FB of the source driver IC3.
- the repair line 13 connects both the defective signal lead connected to the output channel 2 of the source driver IC 1 and the signal line (ie, the data line), and the repair lead connected to the output channel OUT1 of the repair chip RC.
- the defective signal lead connected to the output channel 5 of the source driver IC1 is connected to the signal line (ie, the data line), and the repair lead connected to the output channel OUT2 of the repair chip RC is turned on, and the output of the source driver IC 2 is also turned on.
- the portion of the channel 3 connected with a bad signal lead connected to the signal line (ie, the data line) is connected to the repair lead connected to the output channel OUT3 of the repair chip RC. Therefore, the connection point a and the connection point b on the repair line 13 are connected.
- the portion between the portion, the portion between the connection point c and the connection point d, and the portion between the connection point e and the connection point f need to be disconnected to avoid signal confusion.
- the driving ICs are all located on the array substrate. In practical applications, the driving ICs may also be located on the flexible circuit boards connecting the array substrate and the driving circuit board.
- only the repair signal lead is broken or shorted in the outer lead region as an example to illustrate the operation mode of the driver IC and the repair chip. In fact, when the signal lead is in poor contact with the driver IC, the operation mode of the driver IC and the repair chip are as described above. The manners given in the examples are the same.
- the source driving IC and the data line are taken as an example to illustrate the working mode of the driving IC and the repairing chip.
- the driving IC is the gate driving IC
- the signal line is the gate line
- the driving IC and the repair chip are The working mode is the same as when the driver IC is the source driver IC
- the driver IC and the repair chip work when the signal line is the data line.
- the display panel described in the above embodiments may be a liquid crystal display panel, an organic light emitting display panel, or any other display panel that is driven by a driving IC, which is not limited in the embodiment of the present invention.
- the embodiment of the invention further provides a lead repairing method for a driving IC, and the lead repairing method is
- the display substrate is provided based on the embodiment of the invention. As shown in FIG. 4, the method includes:
- S401 determining a bad signal lead in a signal lead connected to the driving IC, and transmitting a signal transmitted to the bad signal lead to the repairing chip;
- S402 determining a repair lead corresponding to a defective signal lead in the repair lead connected to the repair chip connected to the driving IC, and transmitting the signal received by the repair chip to the repair line through the determined repair lead;
- step S402 for a signal lead that is defective in one of the driving ICs, determining a repairing lead corresponding to the defective signal lead in the repairing lead connected to the repairing chip connected to the driving IC, includes: Corresponding relationship between a defective signal lead in a signal lead connected to the driving IC and a feedback channel in the driving IC, a correspondence relationship between an input channel and an output channel in the repair chip connected to the driving IC, and an input channel and connection in the repair chip.
- the corresponding relationship of the feedback channels of the driver IC of the repair chip, and the repair leads connected to the respective output channels in the repair chip determine the repair leads corresponding to the defective signal leads in the repair leads to which the repair chip is connected.
- the above three correspondences and the repair leads to which the respective output channels in the repair chip are connected are previously set in the display substrate.
- the lead repairing method provided by the embodiment of the invention further includes:
- S401a disconnecting the short-circuit connection point in the signal lead that is short-circuited from the other portion of the signal lead, so that the short-circuited signal lead becomes a signal lead that is broken, thereby driving the signal lead connecting the short-circuited
- the IC can detect that the signal lead is defective, and outputs a signal output to the defective signal lead to the repair chip to which the driver IC is connected.
- S401 and S401a are not in the order, you can execute S401 first, then execute S401a, or you can execute S401a once after determining a signal lead that has a short circuit, and then determine if the next signal lead is bad. If it is determined that there is no shorted signal lead in the defective signal lead, it is not necessary to execute S401a, and therefore, S401a is not a necessary step.
- the repair method further includes after S403: S404: disconnecting a portion between the connection point of the repair lead and the repair line for repairing each defective signal lead and the connection point of the repair line and the signal line corresponding to the signal lead, and disconnecting the rest of the repair line .
- repair line connects only one repair lead and its corresponding bad signal lead to the corresponding signal line connection portion, after S403, S404 may or may not be performed.
- the embodiments of the present invention can be implemented by hardware, or can be implemented by means of software plus necessary general hardware platform.
- the technical solution of the embodiment of the present invention may be embodied in the form of a software product, which may be stored in a non-volatile storage medium (which may be a CD-ROM, a USB flash drive, a mobile hard disk, etc.).
- a number of instructions are included to cause a computer device (which may be a personal computer, server, or network device, etc.) to perform the methods described in various embodiments of the present invention.
- modules in the apparatus in the embodiments may be distributed in the apparatus of the embodiment according to the description of the embodiments, or may be correspondingly changed in one or more apparatuses different from the embodiment.
- the modules of the above embodiments may be combined into one module, or may be further split into a plurality of sub-modules.
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Control Of Indicators Other Than Cathode Ray Tubes (AREA)
Abstract
一种显示基板和驱动集成电路的引线修复方法,显示基板包括:位于显示基板上的多条信号引线,至少一个驱动集成电路,至少一个修复芯片(RC),至少一条修复引线和至少一条修复线(13);其中,一个修复芯片(RC)连接至少一个驱动集成电路,修复引线与修复芯片(RC)相连,修复线(13)与多条信号引线连接的信号线交叉设置且与信号线绝缘。其中,在驱动集成电路在其连接的信号引线发生不良时,通过用修复引线和修复线(13)代替发生不良的信号引线,解决了现有的显示基板无法修复外引线区中发生不良的信号引线,从而造成了产品的浪费,进而导致产品的成本提高的问题。
Description
一种显示基板及驱动集成电路的引线修复方法 技术领域
一般而言, 本发明实施例涉及显示面板领域, 尤其涉及一种显示基板及 驱动集成电路的引线修复方法。 背景技术
液晶显示装置(LCD, Liquid Crystal Display ) 包括液晶显示面板、 背光 源、 驱动电路板、 柔性电路板、 源极驱动集成电路(Integrated Circuit, 筒称 IC )和栅极驱动 IC。 其中液晶显示面板主要由下偏光片、 阵列基板、 液晶、 彩膜基板、 上偏光片组成。 在阵列基板上具有横向的扫描信号线和纵向的数 据信号线以及薄膜晶体管(TFT, Thin Film Transistor )开关, 其中 TFT开关 用于根据横向扫描信号控制纵向数据信号的传输。 在阵列基板和彩膜基板之 间夹有液晶, 通过在彩膜基板和阵列基板上施加电压来控制液晶的偏转, 彩 膜基板和阵列基板通过封框胶密封, 在封框胶中分布有各向异性导电胶使上 下基板导通。 由于液晶面板本身不会发光, 因此需要背光源来提供光, 液晶 在不同的电压下偏转的角度不同, 透过的光强度也不同, 位于液晶面板外侧 的上下偏光片可控制光的偏振方向, 偏振光透过相应的彩膜形成单色的偏振 光, 通过红绿蓝三种颜色的组合显示出图像。 横向的扫描信号用于控制 TFT 开关, TFT开关打开, 可以对像素进行充电, 纵向数据信号线向各个像素点 传输信号控制液晶偏转的角度。 阵列基板上分为有效显示区和外引线区, 有 效显示区即像素区, 分布着像素矩阵; 外引线区分别连接有效显示区和栅极 驱动 IC、 源极驱动 IC, 将驱动电路板的信号传输至有效显示区。
现有的液晶显示面板中, 会在有效显示区的四周设置两条 "口" 字形的 信号修复线, 用来修复有效显示区中扫描线或信号线的不良, 但是, 如果外 引线区的信号引线发生不良, 例如, 信号引线与源极驱动 IC或者栅极驱动 IC接触不良、 信号引线断开等, 在通常情况下是无法修复的, 这使得在对盒 工艺之后检查出外引线区的信号引线发生不良时, 只能采用产品报废的方式 处理, 这会造成产品的浪费, 导致产品的成本提高。
综上所述, 现有的液晶显示面板无法修复外引线区中发生不良的信号引 线, 从而造成了产品的浪费, 导致产品的成本提高。
此外, 对于其他显示面板, 如有机发光显示面板等, 也有信号引线不良 难以修复的问题。 发明内容
本发明实施例提供了一种显示基板及驱动集成电路的引线修复方法, 用 以解决现有的显示基板无法修复外引线区中发生不良的信号引线, 从而造成 了产品的浪费, 进而导致产品的成本提高的问题。
基于上述问题, 本发明实施例提供的一种显示基板, 包括: 位于所述显 示基板上的多条信号引线、 至少一个驱动集成电路、 至少一个修复芯片、 至 少一条修复引线和至少一条修复线; 其中, 一个修复芯片连接至少一个驱动 集成电路, 所述修复引线与修复芯片相连, 所述修复线与多条信号引线连接 的信号线交叉设置且与多条信号线绝缘;
所述驱动集成电路, 在其连接的信号引线发生不良时, 将输出到发生不 良的信号引线的信号, 输出到所述修复芯片;
所述修复芯片, 将接收到的驱动集成电路输出的信号, 输出到与自身相 连的修复引线;
所述修复引线 ,将接收到的所述修复芯片输出的信号传输到相应修复线; 所述修复线在接收到来自所述修复引线的信号时, 所述修复线和与其相 连的发生不良的信号引线所连的信号线被导通, 从而将所述信号传输到所述 信号线。
进一步的, 所述修复引线位于所述显示基板的外引线区。
进一步的, 所述修复线位于所述显示基板的显示区的边缘。
进一步的, 所述驱动集成电路包括反馈通道, 所述修复芯片包括输入通 道和与输入通道对应的输出通道, 所述修复芯片的输入通道与所述驱动集成 电路的反馈通道相连, 所述修复芯片的输出通道与修复引线相连;
所述驱动集成电路用于:
针对发生不良的信号引线, 将输出到所述发生不良的信号引线的信号, 通过该信号引线对应的反馈通道输出到所述修复芯片;
所述修复芯片用于:
通过自身的输入通道接收所述驱动集成电路通过其反馈通道输出的信 号,并将收到的信号从对应的输出通道输出到与该输出通道相连的修复引线。
进一步的, 所述驱动集成电路为源极驱动集成电路, 所述显示基板上的 多条信号引线为数据线的信号引线;
所述修复线, 用于将接收到的修复引线传输的信号, 传输到与所述修复 线相连的发生不良的信号引线所连接的数据线。
进一步的, 所述驱动集成电路为栅极驱动集成电路, 所述显示基板上的 多条信号引线为扫描线的信号引线;
所述修复线, 用于将接收到的修复引线传输的信号, 传输到与所述修复 线相连的发生不良的信号引线所连接的扫描线。
进一步的, 所述修复线与所述显示基板上的多条信号引线连接的信号线 交叉设置于所述显示基板上的不同层中, 并通过绝缘层实现电气上的绝缘。
进一步的, 所述修复线在接收到来自修复引线传输的信号时, 所述修复 线与发生不良的信号引线连接的信号线被导通, 由此将接收到的所述信号传 输到发生不良的信号引线连接的信号线。
进一步的, 所述驱动集成电路位于所述显示基板上; 或者, 所述驱动集 成电路位于柔性电路板上, 所述柔性电路板用于连接向显示基板提供驱动信 号的驱动电路板和所述显示基板。
本发明实施例还提供一种驱动集成电路的引线修复方法, 包括: 提供至少一个修复芯片、 至少一条修复引线和至少一条修复线, 其中所 述至少一个修复芯片与所述驱动集成电路相连, 所述至少一条修复引线与所 述修复芯片相连, 所述修复线与所述驱动集成电路连接的信号引线连接的信 号线交叉设置且与该信号线绝缘;
确定与所述驱动集成电路相连的信号引线中发生不良的信号引线, 并将 传输至该发生不良的信号引线的信号传输至修复芯片;
确定与所述驱动集成电路相连的修复芯片中与发生不良的信号引线对应 的修复引线, 并通过确定的修复引线将修复芯片接收的信号传输至修复线; 导通修复线与发生不良的信号引线连接的信号线。
进一步的, 当发生不良的信号引线中有发生短路的信号引线时, 在确定
所述修复芯片中与发生不良的信号引线对应的修复引线之前, 还包括: 将发生短路的信号引线中的短路连接点与所述发生短路的信号引线中的 其它部分断开。
进一步的, 当发生不良的信号引线为多条时, 在导通修复线与发生不良 的信号引线连接的信号线之后, 还包括:
将用于修复每条发生不良的信号引线的对应的修复引线与修复线的连接 点和修复线与该信号引线对应的信号线的连接点之间的部分, 与修复线的其 他部分断开。
本发明实施例的有益效果包括:
本发明实施例提供的一种显示基板和驱动集成电路的引线修复方法, 在 驱动 IC连接的信号引线发生不良时, 将输出到发生不良的信号引线的信号, 输出到修复芯片,修复芯片将接收到的驱动 IC输出的信号,输出到与自身相 连的修复引线, 修复引线再将接收到的修复芯片输出的信号传输到修复线, 修复线将接收到的修复引线传输的信号传输到与该修复线相连的发生不良的 信号引线所连接的信号线, 从而用修复弓 )线和修复线替代发生不良的信号引 线, 向发生不良的信号引线所连接的信号线并进一步向该信号线连接的各个 像素的 TFT开关传输信号。 由于修复引线位于外引线区, 修复线位于显示基 板的显示区边缘, 因此, 在外引线区的信号引线发生不良时, 修复引线和修 复线一起可以替代该发生不良的信号引线传输信号, 从而起到修复在外引线 区发生不良的信号引线的作用, 避免了由于外引线区的信号引线发生不良造 成的产品的浪费, 降低了产品的成本。 附图说明
图 1示出了根据本发明的一个实施例的显示基板的结构的示意图; 图 2示出了根据本发明另一个实施例的显示基板的结构示意图; 图 3示出了根据本发明再一个实施例的显示基板的结构示意图; 图 4示出了根据本发明的一个实施例的驱动集成电路的引线修复方法的 流程图;
图 5示出了根据本发明另一个实施例的驱动集成电路的引线修复方法的 流程图;
图 6示出了根据本发明再一个实施例的驱动集成电路的引线修复方法的 流程图。 具体实施方式
本发明实施例提供了一种显示基板及驱动集成电路的引线修复方法, 通 过用修复引线和位于显示基板的显示区中的修复线替代发生不良的信号引 线, 向发生不良的信号引线所连接信号线进而向该信号线连接的各个像素的 TFT开关, 传输驱动 IC输出到该发生不良的信号引线的信号, 从而起到修 复在外引线区发生不良的信号引线的作用, 避免了由于外引线区的信号引线 发生不良造成的产品的浪费, 降低了产品的成本。
下面结合说明书附图, 对本发明实施例提供的一种显示基板及驱动集成 电路的引线修复方法的具体实施方式进行说明。
本发明实施例提供的一种显示基板, 包括: 位于显示基板上的多条信号 引线, 至少一个驱动集成电路(Integrated Circuit, 筒称 IC, 以下均以 IC代 替), 至少一个修复芯片, 至少一条修复引线和至少一条修复线; 其中, 一个 修复芯片连接至少一个驱动 IC,所述修复引线位于所述显示基板的外引线区 且与修复芯片相连, 所述修复线位于所述显示基板的显示区, 所述修复线与 多条信号引线连接的信号线交叉设置且与多条信号线绝缘;
所述驱动 IC, 用于在其连接的信号引线发生不良时, 将输出到发生不良 的信号引线的信号, 输出到所述修复芯片;
所述修复芯片,用于将接收到的驱动 IC输出的信号,输出到与自身相连 的修复引线;
所述修复引线,用于将接收到的所述修复芯片输出的信号传输到修复线; 所述修复线, 用于将接收到的修复引线传输的信号传输到与所述修复线 相连的发生不良的信号引线所连接的信号线。
其中, 显示基板可以为显示面板的上基板或者下基板, 一般情况下显示 面板的上基板为彩膜基板, 下基板为阵列基板, 都可以作为本发明实施例所 述的显示基板, 本发明不做限定。 通常情况下, 阵列基板上包含多条数据线 和多条扫描线,驱动 IC设置于阵列基板上,通过引线与显示区的数据线和扫 描线电连接实现显示。 当然, 驱动 IC也可以设置于彩膜基板上,通过导电隔
垫物或者其他导电结构将驱动 IC的信号传输至阵列基板的数据线和扫描线, 实现显示。 本发明的下述实施例以显示基板为阵列基板进行说明。
阵列基板包括显示区和外引线区,驱动 IC通过位于外引线区的多条信号 引线将信号传输到位于显示区的多条对应的信号线, 以实现显示驱动。 修复 线一般位于显示区的边缘, 用于对发生不良的信号引线进行修复时, 可以与 发生不良的信号引线连接的信号线实现电连接, 也就是说, 修复线的设置位 置靠近信号线与信号引线连接的位置。 同时, 为了实现修复线可以对多条信 号线进行修复, 修复线与信号线一般呈交叉设置, 所述的交叉设置是指如果 信号线为多条竖直的线, 则修复线可以为水平线, 与各条信号线交叉,反之, 如果信号线为多条水平线, 则修复线可以为竖直线, 与各条信号线交叉, 当 然本发明实施例并不局限于此。 修复线与阵列基板上的多条信号引线连接的 信号线绝缘可以通过下述方式实现: 修复线与所述阵列基板上的多条信号引 线连接的多条信号线位于阵列基板上的不同层中, 其中修复线所在的层与阵 列基板上的多条信号引线连接的多条信号线所在的层之间设置绝缘层, 从而 实现修复线与阵列基板上的多条信号引线连接的多条信号线绝缘。
修复线将接收到的修复引线传输的信号传输到与该修复线相连的发生不 良的信号引线所连接的信号线可以通过下述方式实现: 修复线与发生不良的 信号引线中连接信号线的部分被导通, 由此将接收到的修复引线传输的信号 传输到所述信号线, 并进一步传输到该信号线连接的各个像素的 TFT开关。
修复引线可以与修复线导通, 也可以与修复线绝缘。 当修复引线与修复 线绝缘时, 修复引线可以与阵列基板上的多条信号引线位于阵列基板上的同 一层中。
当驱动 IC为源极驱动 IC时, 阵列基板上的多条信号引线为数据线的信 号引线; 修复线, 具体用于将接收到的修复引线传输的信号, 传输到与该修 复线相连的发生不良的数据线的信号引线所连接的信号线即数据线上。
当驱动 IC为栅极驱动 IC时, 所述阵列基板上的多条信号引线为扫描线 的信号引线; 修复线, 具体用于将接收到的修复引线传输的信号, 传输到与 所述修复线相连的发生不良的扫描线的信号引线所连接的信号线即扫描线 上。
修复线可以设置一条也可以设置多条, 若既需要修复在外引线区发生不
良的扫描线, 又需要修复在外引线区发生不良的数据线, 则可以分别设置两 条修复线。
驱动 IC可以位于显示面板中的阵列基板上, 也可以位于柔性电路板上, 该柔性电路板用于连接阵列基板和驱动电路板, 驱动电路板用于为驱动 IC 提供驱动信号,其中,源极驱动 IC将驱动电路提供的驱动信号转换为像素电 压, 栅极驱动 IC将驱动电路提供的驱动信号转换为 TFT开关的栅极电压。
本发明实施例提供的显示基板既可以用于修复一个驱动 IC连接的信号 引线中发生不良的信号引线,还可以用于修复多个驱动 IC连接的信号引线中 发生不良的信号引线。
进一步地, 驱动 IC用于: 针对一条发生不良的信号引线, 将输出到该条 发生不良的信号引线的信号,通过该驱动 IC中与该信号引线对应的反馈通道 输出到所述修复芯片。驱动 IC中与一条信号引线对应的反馈通道是指,在该 条信号引线发生不良时,驱动 IC将输出到该信号引线的信号从该反馈通道输 出。 由于, 每一条信号引线连接驱动 IC的一个输出通道, 因此, 信号引线与 驱动 IC中的反馈通道的对应关系是通过驱动 IC中的输出通道与驱动 IC中的 反馈通道的对应关系来体现的, 这种对应关系可以预先配置。
修复芯片用于: 通过自身的一个输入通道接收驱动 IC通过该驱动 IC的 一个反馈通道输出的信号, 并根据其输入通道与其输出通道的对应关系, 将 收到的信号从对应的输出通道输出到与该输出通道相连的修复引线。 其中, 修复芯片中与一个输入通道相对应的输出通道是指, 在通过该输入通道接收 到信号时, 修复芯片将接收到的信号从其对应的输出通道输出。 修复芯片中 输入通道与输出通道的对应关系是预先配置的。另外,每一个驱动 IC的每一 个反馈通道连接一个修复芯片中的一个输入通道,这种驱动 IC中的反馈通道 与修复芯片中的输入通道的对应关系也是预先配置的。
下面以阵列基板中的三个驱动 IC为例说明不同情况下驱动 IC和修复芯 片的工作方式,在该阵列基板中,修复线与修复引线位于阵列基板的不同层, 修复线所在的层和修复引线所在的层之间设有绝缘层, 修复线和修复引线可 以通过激光镭射熔接, 例如可以采用带有激光发射功能的显微镜等来进行该 激光镭射熔接。
实施例一:
如图 1所示, 源极驱动 IC1、 源极驱动 IC2和源极驱动 IC3各有一个反 馈通道 FB, 因此, 源极驱动 IC1中的各个输出通道所连接的数据线的信号引 线中发生不良的信号引线对应的反馈通道均为源极驱动 IC1 中的反馈通道 FB, 源极驱动 IC2中的各个输出通道所连接的数据线的信号引线中发生不良 的信号引线对应的反馈通道均为源极驱动 IC2 中的反馈通道 FB, 源极驱动 IC3 中的各个输出通道所连接的数据线的信号引线中发生不良的信号引线对 应的反馈通道均为源极驱动 IC3中的反馈通道 FB。源极驱动 IC1的反馈通道 FB与修复芯片 RC1的输入通道 IN1相连, 源极驱动 IC2的反馈通道 FB与 修复芯片 RC1的输入通道 IN2相连, 源极驱动 IC3的反馈通道 FB与修复芯 片 RC2的输入通道 IN1相连。 每个源极驱动 IC的一个输出通道通过数据线 的信号引线连接一条数据线。 在图 1中, 源极驱动 IC1、 源极驱动 IC2和源 极驱动 IC3位于阵列基板 11上, 修复线 13位于阵列基板 11中的显示区 12 中。 其中, 修复芯片 RC1和 RC2中的其它输入通道和其它输出通道在图 1 中未示出。 修复芯片 RC1中的输入通道 IN1与 RC1中输出通道 OUT1相对 应, 修复芯片 RC1中的输入通道 IN2与 RC1中输出通道 OUT2相对应, 修 复芯片 RC2中的输入通道 IN1与 RC2中输出通道 OUT1相对应。
若源极驱动 IC2的输出通道 3连接的数据线在外引线区发生不良, 源极 驱动 IC3的输出通道 2连接的数据线在外引线区发生不良, 图 1所示为这两 条数据线在外引线区的信号引线断开。
此时,源极驱动 IC2将通过输出通道 3输出到数据线的信号引线的信号, 从自身的反馈通道 FB输出给修复芯片 RC1 , 修复芯片 RC1根据接收该信号 的输入通道 IN2, 确定信号来自于源极驱动 IC2; 修复芯片 RC1将通过输入 通道 IN2接收到的信号, 从与输入通道 IN2对应的输出通道 OUT2 , 输出到 与输出通道 OUT2相连的修复引线;通过激光镭射将该修复引线与修复线 13 接通,以及将修复线 13与源极驱动 IC2的输出通道 3连接的发生不良的信号 引线连接的信号线(即数据线)接通, 进而将信号传输至该数据线连接的各 个像素的 TFT开关(图 1中未示出, TFT开关位于显示区 12中) 的源极实 现正常显示, 从而实现对源极驱动 IC2的输出通道 3连接的发生不良的信号 引线的修复。
源极驱动 IC3将通过输出通道 2输出到数据线的信号引线的信号, 从自
身的反馈通道 FB输出^ 复芯片 RC2, 修复芯片 RC2根据接收该信号的输 入通道 IN1 , 确定信号来自于源极驱动 IC3; 修复芯片 RC2将通过输入通道 IN1接收到的信号, 从与输入通道 IN1对应的输出通道 OUT1输出到与输出 通道 OUT1相连的修复引线; 通过激光镭射将该修复引线与修复线 13接通, 以及将修复线 13与源极驱动 IC3的输出通道 2连接的发生不良的信号引线连 接的信号线(即数据线)接通, 进而将信号传输至该数据线连接的各个像素 的 TFT开关(图 1中未示出, TFT开关位于显示区 12中 ) 的源极实现正常 显示, 从而实现对源极驱动 IC3的输出通道 2连接的发生不良的信号引线的 修复。
由于修复线 13既将源极驱动 IC2的输出通道 3连接的发生不良的信号引 线与对应的信号线连接的部分,与修复芯片 RC1的输出通道 OUT2连接的修 复引线接通, 又将源极驱动 IC3的输出通道 2连接的发生不良的信号引线与 对应的信号线连接的部分,与修复芯片 RC2的输出通道 OUT1连接的修复引 线接通, 因此,修复线 13上连接点 a与连接点 b之间的部分和连接点 c与连 接点 d之间的部分需要断开, 以避免信号混乱, 其中, 连接点 a为修复芯片 RC1的输出通道 OUT2连接的修复引线与修复线 13的连接点, 连接点 b为 源极驱动 IC2的输出通道 3连接的发生不良的信号引线与对应的信号线连接 的部分与修复线 13的连接点, 连接点 c为修复芯片 RC2的输出通道 OUT1 连接的修复引线与修复线 13的连接点,连接点 d为源极驱动 IC3的输出通道 2连接的发生不良的信号引线与对应的信号线连接的部分与修复线 13的连接 点。
而源极驱动 IC1并未检测到自身的各个输出通道连接的数据线的信号引 线中有信号引线发生不良, 因此, 源极驱动 IC1的反馈通道 FB并不会输出 信号。
实施例二:
如图 2所示, 源极驱动 IC1、 源极驱动 IC2和源极驱动 IC3各有一个反 馈通道 FB, 因此, 源极驱动 IC1中的各个输出通道所连接的数据线的信号引 线中发生不良的信号引线对应的反馈通道均为源极驱动 IC1 中的反馈通道 FB, 源极驱动 IC2中的各个输出通道所连接的数据线的信号引线中发生不良 的信号引线对应的反馈通道均为源极驱动 IC2 中的反馈通道 FB, 源极驱动
IC3 中的各个输出通道所连接的数据线的信号引线中发生不良的信号引线对 应的反馈通道均为源极驱动 IC3中的反馈通道 FB。源极驱动 IC1的反馈通道 FB与修复芯片 RC的输入通道 IN1相连, 源极驱动 IC2的反馈通道 FB与修 复芯片 RC的输入通道 IN2相连, 源极驱动 IC3的反馈通道 FB与修复芯片 RC的输入通道 IN3相连。每个源极驱动 IC的一个输出通道连接一条数据线。 在图 2中,源极驱动 IC1、源极驱动 IC2和源极驱动 IC3位于阵列基板 11上, 修复线 131和修复线 132位于阵列基板 11中的显示区 12中。 其中, 修复芯 片 RC中的其它输入通道和其它输出通道在图 2中未示出。 修复芯片 RC中 的输入通道 IN1与输出通道 OUT1相对应, 修复芯片 RC中的输入通道 IN2 与输出通道 OUT2相对应,修复芯片 RC中的输入通道 IN3与输出通道 OUT3 相对应。
若源极驱动 IC1的输出通道 2连接的数据线在外引线区发生不良, 源极 驱动 IC2的输出通道 3连接的数据线在外引线区发生不良, 在图 2中显示为 这两条数据线的信号引线断开; 源极驱动 IC3的输出通道 4连接的数据线在 外引线区发生不良, 在图 2中显示为, 这条数据线的信号引线发生短路。 驱 动 IC连接的数据线的信号引线发生短路可能因为信号引线通过封框胶中的 各向异性的导电胶中的导电金属球与显示面板中的彩膜基板的公共电极短路 而引起,也可能因为其他原因造成。 由于驱动 IC在检测到其连接的信号引线 的电阻为无穷大, 即其连接的信号引线断开时, 才能将输出到该信号引线的 信号通过自身的反馈通道输出到该驱动 IC连接的修复芯片, 因此,在确定信 号引线发生短路时, 首先要将信号引线上的短路连接点与该信号引线的其它 部分断开, 因此, 要将源极驱动 IC3的输出通道 4连接的数据线的信号引线 上的短路连接点 s与该数据线的信号引线的其它部分断开。 其中, 确定信号 引线是否发生短路的操作例如可以根据信号线的波形和显示画面来判断, 并 且其中的断开操作例如可由带有激光发射功能的显微镜等装置来执行。
此时,源极驱动 IC1将通过输出通道 2输出到数据线的信号引线的信号, 从自身的反馈通道 FB输出给修复芯片 RC, 修复芯片 RC根据接收该信号的 输入通道 IN1 ,确定信号来自于源极驱动 IC1;修复芯片 RC将通过输入通道 IN1接收到的信号, 从与输入通道 IN1对应的输出通道 OUT1输出到与输出 通道 OUT1相连的修复引线;通过激光镭射将该修复引线与修复线 131接通,
以及将源极驱动 IC1的输出通道 2连接的发生不良的信号引线与信号线(即 数据线) 的连接部分与修复线 131接通, 进而将信号传输至该数据线连接的 各个像素的 TFT开关(图 1中未示出, TFT开关位于显示区 12中) 的源极 实现正常显示, 从而实现对源极驱动 IC1的输出通道 2连接的发生不良的信 号引线的修复。
源极驱动 IC2将通过输出通道 3输出到数据线的信号引线的信号, 从自 身的反馈通道 FB输出^ 复芯片 RC, 修复芯片 RC根据接收该信号的输入 通道 IN2, 确定信号来自于源极驱动 IC2; 修复芯片 RC将通过输入通道 IN2 接收到的信号, 从与输入通道 IN2对应的输出通道 OUT2输出到与输出通道 OUT2相连的修复引线; 通过激光镭射将该修复引线与修复线 131接通, 以 及将源极驱动 IC2输出通道 3连接的发生不良的信号引线与信号线(即该数 据线)连接的部分与修复线 131接通, 进而将信号传输至该数据线连接的各 个像素的 TFT开关(图 2中未示出, TFT开关位于显示区 12中) 的源极实 现正常显示, 从而实现对源极驱动 IC2的输出通道 3连接的发生不良的数据 线的信号引线的修复。
源极驱动 IC3将通过输出通道 4输出到数据线的信号引线的信号, 从自 身的反馈通道 FB输出^ 复芯片 RC, 修复芯片 RC根据接收该信号的输入 通道 IN3 ,确定信号来自于源极驱动 IC3;修复芯片 RC3将通过输入通道 IN3 接收到的信号, 从与输入通道 IN3对应的输出通道 OUT3输出到与输出通道 OUT3相连的修复引线; 通过激光镭射将该修复引线与修复线 132接通, 以 及将源极驱动 IC3的输出通道 4连接的发生不良的信号引线与信号线(即数 据线)连接的部分与修复线 132接通, 进而将信号传输至该数据线连接的各 个像素的 TFT开关(图 2中未示出, TFT开关位于显示区 12中) 的源极实 现正常显示, 从而实现对源极驱动 IC3的输出通道 4连接的发生不良的数据 线的信号引线的修复。
由于修复线 131既将源极驱动 IC1的输出通道 2连接的发生不良的数据 线的信号引线与信号线(即该数据线)相连的部分, 和修复芯片 RC的输出 通道 OUT1连接的修复引线接通, 又将源极驱动 IC2的输出通道 3连接的发 生不良的数据线的信号引线与信号线(即该数据线)相连的部分, 和修复芯 片 RC的输出通道 OUT2连接的修复引线接通; 因此, 修复线 131上连接点
a与连接点 b之间的部分和连接点 c与连接点 d之间的部分需要断开, 以避 免信号混乱, 其中, 连接点 b为修复芯片 RC的输出通道 OUT1连接的修复 引线与修复线 131的连接点, 连接点 a为源极驱动 IC1的输出通道 2连接的 发生不良的数据线的信号引线与信号线(即该数据线)相连的部分与修复线 131的连接点, 连接点 c为修复芯片 RC的输出通道 OUT2连接的修复引线 与修复线 131的连接点, 连接点 d为源极驱动 IC2的输出通道 3连接的发生 不良的数据线的信号引线与信号线(即该数据线)相连的部分与修复线 131 的连接点。
而修复线 132仅将源极驱动 IC3的输出通道 4连接的发生不良的数据线 的信号引线与信号线(即该数据线)相连的部分, 和修复芯片 RC的输出通 道 OUT3连接的修复引线接通, 不会发生信号混乱, 因此可以不必将连接点 e和连接点 f之间的部分与修复线 132的其它部分断开,其中,连接点 e为修 复芯片 RC的输出通道 OUT3连接的修复引线与修复线 132的连接点, 连接 点 f为源极驱动 IC3的输出通道 4连接的发生不良的数据线的信号引线与信 号线(即该数据线)相连的部分与修复线 132的连接点。
实施例三:
当一个驱动 IC中有多个反馈通道时, 该驱动 IC的各个输出通道所连接 的数据线的信号引线中发生不良的信号引线与该驱动 IC 中的反馈通道的对 应关系如下:将驱动 IC中连接发生不良的信号引线的输出通道的编号作为与 该输出通道连接的信号引线的新的编号,对该驱动 IC连接的发生不良的信号 引线按照其新的编号进行排序,该驱动 IC将输出到发生不良的信号引线的信 号, 输出到编号与该条发生不良的信号引线在经过排序后获得的新的编号相 同的反馈通道。根据上述对应关系可以看出,驱动 IC中设置的反馈通道的数 量与能够修复的该驱动 IC所连接的信号引线中发生不良的信号引线的最大 数量相等。 例如,一个驱动 IC中设置了两个反馈通道, 那么最多能够修复该 驱动 IC所连接的信号引线中两条发生不良的信号引线。另夕卜,修复芯片中的 输入通道的数量与连接该修复芯片的各个驱动 IC 中的反馈通道的数量之和 相等,一个修复芯片中的一个输入通道连接于该修复芯片相连的一个驱动 IC 中的一个反馈通道, 一个驱动 IC中的一个反馈通道连接于该驱动 IC相连的 修复芯片中的一个输入通道。 且一个修复芯片中的输入通道与该修复芯片中
的输出通道一一对应。 一个修复芯片中的各个输出通道分别连接一条修复引 线。
如图 3所示, 源极驱动 IC1和源极驱动 IC2各有两个反馈通道, 源极驱 动 IC3有一个反馈通道 FB。 因此,首先确定源极驱动 IC1中的各个输出通道 所连接的数据线中发生不良的数据线的信号引线的编号, 由于与源极驱动 IC1的输出通道 2相连的数据线的信号引线发生不良, 与源极驱动 IC1的输 出通道 5相连的数据线的信号引线发生不良, 因此, 源极驱动 IC1连接的数 据线中发生不良的数据线的信号引线的编号为 2和 5, 若按照编号从小到大 的顺序 序, 则编号为 2的数据线的新的编号为 1 , 编号为 5的数据线的新 的编号为 2。 当然, 也可以按照编号从大到小的顺序排序, 还可以按照其他 方式排序。 于是, 源极驱动 IC1将输出到输出通道 2连接的数据线的信号引 线的信号, 通过自身的反馈通道 FBI输出到修复芯片 RC, 源极驱动 IC1将 输出到输出通道 5 连接的数据线的信号引线的信号, 通过自身的反馈通道 FB2输出到修复芯片 RC; 源极驱动 IC2的输出通道 3连接的数据线的信号 引线发生不良, 因此, 源极驱动 IC2连接的数据线的信号引线中发生不良的 信号引线的编号为 3, 在进行排序时, 编号为 3的数据线的信号引线的新的 编号为 1 , 因此, 源极驱动 IC2将输出到输出通道 3连接的数据线的信号引 线的信号, 通过编号与发生不良的信号引线的新的编号 1 相同的反馈通道 FBI输出到修复芯片 RC; 由于源极驱动 IC3有一个反馈通道 FB, 因此, 源 极驱动 IC3的各个输出通道连接的数据线的信号引线中发生不良的信号引线 只能对应源极驱动 IC3的反馈通道 FB。
在图 3中, 源极驱动 IC1、 源极驱动 IC2和源极驱动 IC3位于阵列基板 11上, 修复线 13位于阵列基板 11中的显示区 12中。 在修复芯片 RC中, 输入通道 IN1与输出通道 OUT1相对应,输入通道 IN2与输出通道 OUT2相 对应, 输入通道 IN3与输出通道 OUT3相对应, 输入通道 IN4与输出通道 OUT4相对应,输入通道 IN5与输出通道 OUT5相对应; 另夕卜,修复芯片 RC 中的输入通道 IN1与源极驱动 IC1的反馈通道 FBI连接, 修复芯片 RC中的 输入通道 IN2与源极驱动 IC1的反馈通道 FB2连接, 修复芯片 RC中的输入 通道 IN3与源极驱动 IC2的反馈通道 FBI连接, 修复芯片 RC中的输入通道 IN4与源极驱动 IC2的反馈通道 FB2连接, 修复芯片 RC中的输入通道 IN5
与源极驱动 IC3的反馈通道 FB连接。 修复芯片 RC中的其它输入通道和其 它输出通道在图 3中未示出。
在图 3中, 源极驱动 IC1的输出通道 2连接的数据线和源极驱动 IC1的 输出通道 5连接的数据线均在外引线区发生不良, 源极驱动 IC2的输出通道 3连接的数据线在外引线区发生不良, 在图 3中这三条数据线的信号引线断 开。
此时,源极驱动 IC1将通过输出通道 2输出到数据线的信号引线的信号, 从自身的反馈通道 FBI输出^ 复芯片 RC, 修复芯片 RC根据接收该信号 的输入通道 IN1 , 确定信号来自于源极驱动 IC1的反馈通道 FBI; 修复芯片 RC将通过输入通道 IN1接收到的信号, 从与输入通道 IN1对应的输出通道 OUT1输出到与输出通道 OUT1相连的修复引线; 通过激光镭射将该修复引 线与修复线 13接通, 二者的连接点为连接点 a, 以及将修复线 13与源极驱 动 IC1的输出通道 2连接的发生不良的数据线的信号引线与信号线(即该数 据线)相连的部分接通, 二者的连接点为连接点 b,从而实现对源极驱动 IC1 的输出通道 2连接的发生不良的数据线的修复。 同样地, 源极驱动 IC1将通 过输出通道 5输出到数据线的信号引线的信号,从自身的反馈通道 FB2输出 ^ί'爹复芯片 RC, 修复芯片 RC根据接收该信号的输入通道 ΙΝ2, 确定信号来 自于源极驱动 IC1的反馈通道 FB2; 修复芯片 RC将通过输入通道 ΙΝ2接收 到的信号, 从与输入通道 ΙΝ2 对应的输出通道 OUT2, 输出到与输出通道 OUT2相连的修复引线; 通过激光镭射将该修复引线与修复线 13接通, 二者 的连接点为连接点 d, 以及将源极驱动 IC1的输出通道 5连接的发生不良的 信号引线与信号线(该数据线)相连的部分与修复线 13接通, 二者的连接点 为连接点 c, 从而实现对源极驱动 IC1的输出通道 5连接的发生不良的数据 线的信号引线的修复。
源极驱动 IC2将通过输出通道 3输出到数据线的信号引线的信号, 从自 身的反馈通道 FBI输出^ 复芯片 RC, 修复芯片 RC根据接收该信号的输 入通道 IN3 , 确定信号来自于源极驱动 IC2的反馈通道 FBI ; 修复芯片 RC 将通过输入通道 IN3 接收到的信号, 从与输入通道 IN3 对应的输出通道 OUT3 , 输出到与输出通道 OUT3相连的修复引线; 通过激光镭射将该修复 引线与修复线 13接通, 二者的连接点为连接点 e, 以及将源极驱动 IC2的输
出通道 3连接的发生不良的信号引线与信号线(即数据线)相连的部分与修 复线 13接通, 二者的连接点为 f, 进而将信号传输至该数据线连接的各个像 素的 TFT开关(图 3中未示出, TFT开关位于显示区 12中 ) 的源极实现正 常显示, 从而实现对源极驱动 IC2的输出通道 3连接的发生不良的数据线的 信号引线的修复。
由于源极驱动 IC2连接的数据线的信号引线中仅有一条数据线的信号引 线发生不良, 因此, 源极驱动 IC2的两个反馈通道中仅有反馈通道 FBI输出 信号, 反馈通道 FB2不会输出信号。
由于源极驱动 IC3连接的数据线的信号引线中没有发生不良的数据线的 信号引线, 因此, 源极驱动 IC3的反馈通道 FB中不会输出信号。
由于修复线 13既将源极驱动 IC1的输出通道 2连接的发生不良的信号引 线与信号线(即数据线 )相连的部分, 和修复芯片 RC的输出通道 OUT1连 接的修复引线接通, 又将源极驱动 IC1的输出通道 5连接的发生不良的信号 引线与信号线(即数据线)相连的部分, 和修复芯片 RC的输出通道 OUT2 连接的修复引线接通, 还将源极驱动 IC2的输出通道 3连接的发生不良的信 号引线与信号线(即数据线 )相连的部分,和修复芯片 RC的输出通道 OUT3 连接的修复引线接通, 因此, 修复线 13上连接点 a与连接点 b之间的部分、 连接点 c与连接点 d之间的部分和连接点 e与连接点 f之间的部分之间需要 断开, 以避免信号混乱。
上述实施例中驱动 IC均位于阵列基板上, 在实际应用时, 驱动 IC还可 以位于连接阵列基板和驱动电路板的柔性电路板上。 上述实施例中仅以修复 信号引线在外引线区断开或者短路为例说明了驱动 IC和修复芯片的工作方 式, 实际上当信号引线与驱动 IC接触不良时, 驱动 IC和修复芯片的工作方 式与上述实施例中给出的方式相同。另外,上述实施例是以源极驱动 IC和数 据线为例说明驱动 IC和修复芯片的工作方式的, 当驱动 IC为栅极驱动 IC、 信号线为栅极线时,驱动 IC和修复芯片的工作方式与驱动 IC为源极驱动 IC、 信号线为数据线时驱动 IC和修复芯片的工作方式相同。
上述实施例所述的显示面板可以为液晶显示面板、 有机发光显示面板或 者其他任何使用驱动 IC进行驱动的显示面板, 本发明实施例不做限定。
本发明实施例还提供了一种驱动 IC的引线修复方法,该引线修复方法是
基于本发明实施例提供的显示基板的。 如图 4所示, 该方法包括:
S401 : 确定与该驱动 IC相连的信号引线中发生不良的信号引线, 并将 传输至该发生不良的信号引线的信号传输至修复芯片;
S402: 确定与该驱动 IC相连的修复芯片所连接的修复引线中与发生不 良的信号引线对应的修复引线, 并通过确定的修复引线将修复芯片接收的信 号传输至修复线;
S403: 导通修复线与发生不良的信号引线连接的信号线。
在上述步骤 S402中, 针对一个驱动 IC中一条发生不良的信号引线, 确 定与该驱动 IC相连的修复芯片所连接的修复引线中与该条发生不良的信号 引线对应的修复引线, 包括:根据该驱动 IC连接的信号引线中发生不良的信 号引线与该驱动 IC中的反馈通道的对应关系、 该驱动 IC连接的修复芯片中 输入通道与输出通道的对应关系、 该修复芯片中的输入通道与连接该修复芯 片的驱动 IC的反馈通道的对应关系,以及该修复芯片中的各个输出通道连接 的修复引线, 确定该修复芯片所连接的修复引线中与发生不良的信号引线对 应的修复引线。 上述三种对应关系以及修复芯片中的各个输出通道连接的修 复引线是在显示基板中预先设置的。
进一步地, 当发生不良的信号引线中有发生短路的信号引线时, 在 S402 确定所述修复芯片所连接的修复引线中与各条发生不良的信号引线对应的修 复引线之前, 如图 5所示, 本发明实施例提供的引线修复方法还包括:
S401a:将发生短路的信号引线中的短路连接点与该信号引线中的其它部 分断开, 使得该发生短路的信号引线变为发生断路的信号引线, 从而使连接 该发生短路的信号引线的驱动 IC能够检测出该条信号引线发生不良,并将输 出到该发生不良的信号引线的信号, 输出到该驱动 IC连接的修复芯片中。
其中, S401与 S401a并没有先后顺序,可以先执行 S401 ,然后执行 S401a, 也可以在确定出一条发生短路的信号引线后, 执行一次 S401a, 然后再确定 下一条信号引线是否发生不良。 如果确定出的发生不良的信号引线中没有发 生短路的信号引线, 则不必执行 S401a, 因此, S401a不是一个必要的步骤。
进一步地, 当同一条修复线需要同时将两条或两条以上的修复引线与其 对应的发生不良的信号引线与信号线连接部分接通时, 如图 6所示, 本发明 实施例提供的引线修复方法在 S403之后还包括:
S404: 将用于修复每条发生不良的信号引线的修复引线与修复线的连接 点和修复线与该信号引线对应的信号线的连接点之间的部分, 与修复线上的 其他部分断开。
如果一条修复线仅将一条修复引线与其对应的发生不良的信号引线与对 应的信号线连接部分接通时, 在 S403之后, 可以执行 S404, 也可以不执行 S404。
通过以上的实施方式的描述, 本领域的技术人员可以清楚地了解到本发 明实施例可以通过硬件实现, 也可以借助软件加必要的通用硬件平台的方式 来实现。 基于这样的理解, 本发明实施例的技术方案可以以软件产品的形式 体现出来,该软件产品可以存储在一个非易失性存储介质(可以是 CD-ROM, U盘, 移动硬盘等) 中, 包括若干指令用以使得一台计算机设备(可以是个 人计算机, 服务器, 或者网络设备等)执行本发明各个实施例所述的方法。
本领域技术人员可以理解附图只是一个优选实施例的示意图, 附图中的 模块或流程并不一定是实施本发明所必须的。
本领域技术人员可以理解实施例中的装置中的模块可以按照实施例描述 进行分布于实施例的装置中, 也可以进行相应变化位于不同于本实施例的一 个或多个装置中。 上述实施例的模块可以合并为一个模块, 也可以进一步拆 分成多个子模块。
上述本发明实施例序号仅仅为了描述, 不代表实施例的优劣。
显然, 本领域的技术人员可以对本发明进行各种改动和变型而不脱离本 发明的精神和范围。 这样, 倘若本发明的这些修改和变型属于本发明权利要 求及其等同技术的范围之内, 则本发明也意图包含这些改动和变型在内。
Claims
1、 一种显示基板, 包括: 位于所述显示基板上的多条信号引线、 至少一 个驱动集成电路、至少一个修复芯片、至少一条修复引线和至少一条修复线; 其中, 一个修复芯片连接至少一个驱动集成电路, 所述修复引线与修复芯片 相连, 所述修复线与所述多条信号引线连接的信号线交叉设置且与多条信号 线绝缘;
所述驱动集成电路, 在其连接的信号引线发生不良时, 将输出到发生不 良的信号引线的信号, 输出到所述修复芯片;
所述修复芯片, 将接收到的驱动集成电路输出的信号, 输出到与自身相 连的修复引线;
所述修复引线 ,将接收到的所述修复芯片输出的信号传输到相应修复线; 所述修复线在接收到来自所述修复引线的信号时, 所述修复线和与其相 连的发生不良的信号引线所连的信号线被导通, 从而将所述信号传输到所述 信号线。
2、如权利要求 1所述的显示基板, 其中, 所述修复引线位于所述显示基 板的外引线区。
3、如权利要求 1所述的显示基板, 其中,修复线位于所述显示基板的显 示区的边缘。
4、如权利要求 1所述的显示基板, 其中, 所述驱动集成电路包括反馈通 道, 所述修复芯片包括输入通道和与输入通道对应的输出通道, 所述修复芯 片的输入通道与所述驱动集成电路的反馈通道相连, 所述修复芯片的输出通 道与所述修复引线相连;
所述驱动集成电路用于:
针对发生不良的信号引线, 将输出到所述发生不良的信号引线的信号, 通过该信号引线对应的反馈通道输出到所述修复芯片;
所述修复芯片用于:
通过自身的输入通道接收所述驱动集成电路通过其反馈通道输出的信 号,并将收到的信号从对应的输出通道输出到与该输出通道相连的修复引线。
5、如权利要求 1所述的显示基板, 其中, 所述驱动集成电路为源极驱动 集成电路, 所述显示基板上的多条信号引线为数据线的信号引线;
所述修复线, 用于将接收到的修复引线传输的信号, 传输到与所述修复 线相连的发生不良的信号引线所连接的数据线。
6、如权利要求 1所述的显示基板, 其中, 所述驱动集成电路为栅极驱动 集成电路, 所述显示基板上的多条信号引线为扫描线的信号引线;
所述修复线, 用于将接收到的修复引线传输的信号, 传输到与所述修复 线相连的发生不良的信号引线所连接的扫描线。
7、如权利要求 1所述的显示基板, 其中, 所述修复线与所述显示基板上 的多条信号引线连接的信号线交叉设置于所述显示基板上的不同层中, 并通 过绝缘层实现电气上的绝缘。
8、如权利要求 1所述的显示基板, 其中, 所述修复线在接收到来自所述 修复引线传输的信号时, 所述修复线与发生不良的信号引线连接的信号线被 导通, 由此将接收到的修复引线传输的信号传输到所述信号线。
9、如权利要求 1所述的显示基板, 其中, 所述驱动集成电路位于所述显 示基板上。
10、 如权利要求 1所述的显示基板, 其中, 所述驱动集成电路位于柔性 电路板上, 所述柔性电路板用于连接向显示基板提供驱动信号的驱动电路板 和所述显示基板。
11、 一种驱动集成电路的引线修复方法, 包括:
提供至少一个修复芯片、 至少一条修复引线和至少一条修复线, 其中所
述至少一个修复芯片与所述驱动集成电路相连, 所述至少一条修复引线与所 述修复芯片相连, 所述修复线与所述驱动集成电路连接的信号引线连接的信 号线交叉设置且与该信号线绝缘;
确定与所述驱动集成电路相连的信号引线中发生不良的信号引线, 并将 传输至该发生不良的信号引线的信号传输至修复芯片;
确定与所述驱动集成电路相连的修复芯片中与发生不良的信号引线对应 的修复引线, 并通过确定的修复引线将修复芯片接收的信号传输至修复线; 导通修复线与发生不良的信号引线连接的信号线。
12、如权利要求 11所述的方法, 其中, 当发生不良的信号引线中有发生 短路的信号引线时, 在确定所述修复芯片中与发生不良的信号引线对应的修 复引线之前, 还包括:
将发生短路的信号引线中的短路连接点与该发生短路的信号引线中的其 它部分断开。
13、 如权利要求 11或 12所述的方法, 其中, 当发生不良的信号引线为 多条时, 在导通修复线与发生不良的信号引线连接的信号线之后, 还包括: 将用于修复每条发生不良的信号引线的对应的修复引线与修复线的连接 点和修复线与该信号引线对应的信号线的连接点之间的部分, 与修复线的其 他部分断开。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/424,257 US9625779B2 (en) | 2013-04-27 | 2013-12-24 | Display substrate and method for repairing lead of driver integrated circuit |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310153956.0A CN103235459B (zh) | 2013-04-27 | 2013-04-27 | 一种显示基板及驱动集成电路的引线修复方法 |
| CN201310153956.0 | 2013-04-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2014173157A1 true WO2014173157A1 (zh) | 2014-10-30 |
Family
ID=48883506
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CN2013/090318 Ceased WO2014173157A1 (zh) | 2013-04-27 | 2013-12-24 | 一种显示基板及驱动集成电路的引线修复方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US9625779B2 (zh) |
| CN (1) | CN103235459B (zh) |
| WO (1) | WO2014173157A1 (zh) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105044946B (zh) * | 2015-09-09 | 2018-09-04 | 京东方科技集团股份有限公司 | 阵列基板、显示装置及修复方法 |
| CN105654886A (zh) * | 2016-01-25 | 2016-06-08 | 重庆京东方光电科技有限公司 | 一种栅极驱动电路、其修复方法及显示装置 |
| CN105511128B (zh) * | 2016-01-28 | 2019-04-26 | 武汉华星光电技术有限公司 | 显示面板、可快捷修复的多路复用器电路及其修复方法 |
| CN205910472U (zh) * | 2016-08-22 | 2017-01-25 | 京东方科技集团股份有限公司 | 一种阵列基板及显示装置 |
| CN109154729B (zh) | 2016-10-10 | 2022-02-01 | 京东方科技集团股份有限公司 | 显示面板及其信号线的修复方法、显示装置 |
| CN106775170B (zh) * | 2017-01-18 | 2020-06-09 | 昆山国显光电有限公司 | 一种柔性电路板及自电容式触摸显示屏 |
| CN107742477B (zh) * | 2017-11-29 | 2021-06-08 | 上海天马微电子有限公司 | 一种柔性显示基板、柔性显示面板和柔性显示装置 |
| CN108538863B (zh) * | 2018-05-17 | 2021-09-17 | 京东方科技集团股份有限公司 | 显示基板及其修复方法、显示装置 |
| CN109100896A (zh) * | 2018-10-08 | 2018-12-28 | 深圳市华星光电技术有限公司 | 阵列基板、显示面板及其显示面板的垂直淡线修复方法 |
| CN113823216B (zh) * | 2020-09-30 | 2022-09-23 | 荣耀终端有限公司 | 一种显示装置、驱动芯片及电子设备 |
| KR102866398B1 (ko) | 2021-05-25 | 2025-09-29 | 삼성전자주식회사 | 디스플레이 구동 회로 및 이를 포함하는 디스플레이 장치 |
| CN116631310B (zh) * | 2023-05-31 | 2026-01-23 | 京东方科技集团股份有限公司 | 一种显示装置及其驱动方法 |
| CN116543685B (zh) * | 2023-06-02 | 2026-05-12 | 北京京东方显示技术有限公司 | 显示装置及其控制方法 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100157190A1 (en) * | 2008-12-19 | 2010-06-24 | Samsung Electronics Co., Ltd. | Display device |
| US20100225870A1 (en) * | 2009-03-09 | 2010-09-09 | Samsung Electronics Co., Ltd. | Array substrate, method of manufacturing the same and method of repairing the same |
| CN101901568A (zh) * | 2010-08-12 | 2010-12-01 | 福建华映显示科技有限公司 | 显示装置 |
| CN102289119A (zh) * | 2011-07-01 | 2011-12-21 | 深圳市华星光电技术有限公司 | 液晶显示器及修复断线的方法 |
| US20120021663A1 (en) * | 2006-03-01 | 2012-01-26 | Hannstar Display Corp. | Repair structure and method for liquid crystal display |
| CN102650784A (zh) * | 2012-01-21 | 2012-08-29 | 京东方科技集团股份有限公司 | 一种阵列基板、液晶显示器件及其修复方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000321599A (ja) * | 1999-05-10 | 2000-11-24 | Hitachi Ltd | 液晶表示装置 |
| KR20070020778A (ko) * | 2005-08-17 | 2007-02-22 | 삼성전자주식회사 | 액정 표시 장치와 이의 검사 방법 및 이의 리페어 방법 |
| TWI334942B (en) * | 2006-03-01 | 2010-12-21 | Hannstar Display Corp | Liquid crystal display |
| US8059223B2 (en) * | 2006-03-01 | 2011-11-15 | Hannstar Display Corp. | Repair structure and method for liquid crystal display |
| KR101241761B1 (ko) * | 2006-07-18 | 2013-03-14 | 삼성디스플레이 주식회사 | 구동 칩, 이를 구비한 표시 장치 및 리페어 방법 |
| TW200909914A (en) * | 2007-08-21 | 2009-03-01 | Himax Tech Ltd | Defect repairing method of liquid crystal display and signal transmission method of source driver and timing controller thereof |
| RU2467365C2 (ru) * | 2008-10-07 | 2012-11-20 | Шарп Кабусики Кайся | Дисплейное устройство, способ для его изготовления и подложка с активной матрицей |
| TW201031959A (en) * | 2009-02-26 | 2010-09-01 | Chunghwa Picture Tubes Ltd | Display panel and repair method thereof |
| KR101765274B1 (ko) * | 2010-12-30 | 2017-08-07 | 삼성디스플레이 주식회사 | 액정표시패널 |
-
2013
- 2013-04-27 CN CN201310153956.0A patent/CN103235459B/zh not_active Expired - Fee Related
- 2013-12-24 US US14/424,257 patent/US9625779B2/en not_active Expired - Fee Related
- 2013-12-24 WO PCT/CN2013/090318 patent/WO2014173157A1/zh not_active Ceased
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120021663A1 (en) * | 2006-03-01 | 2012-01-26 | Hannstar Display Corp. | Repair structure and method for liquid crystal display |
| US20100157190A1 (en) * | 2008-12-19 | 2010-06-24 | Samsung Electronics Co., Ltd. | Display device |
| US20100225870A1 (en) * | 2009-03-09 | 2010-09-09 | Samsung Electronics Co., Ltd. | Array substrate, method of manufacturing the same and method of repairing the same |
| CN101901568A (zh) * | 2010-08-12 | 2010-12-01 | 福建华映显示科技有限公司 | 显示装置 |
| CN102289119A (zh) * | 2011-07-01 | 2011-12-21 | 深圳市华星光电技术有限公司 | 液晶显示器及修复断线的方法 |
| CN102650784A (zh) * | 2012-01-21 | 2012-08-29 | 京东方科技集团股份有限公司 | 一种阵列基板、液晶显示器件及其修复方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20150212379A1 (en) | 2015-07-30 |
| CN103235459A (zh) | 2013-08-07 |
| US9625779B2 (en) | 2017-04-18 |
| CN103235459B (zh) | 2015-06-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103235459B (zh) | 一种显示基板及驱动集成电路的引线修复方法 | |
| CN109841181B (zh) | 阵列基板、显示面板和显示装置 | |
| US9097921B2 (en) | Active matrix display device | |
| US9568791B2 (en) | Liquid crystal display device | |
| US9536459B2 (en) | Testing device and testing method for display panels | |
| CN101999095B (zh) | 有源矩阵基板、显示装置、有源矩阵基板的检查方法和显示装置的检查方法 | |
| US20160204181A1 (en) | Display panel and repairing method thereof | |
| CN100576029C (zh) | 液晶显示板和具有其的液晶显示装置 | |
| US9405162B2 (en) | Active matrix display device with auxiliary repair line | |
| CN104793827B (zh) | 一种阵列基板和自电容式触控显示装置 | |
| CN100444006C (zh) | 用于显示器的薄膜晶体管阵列面板 | |
| US11158222B2 (en) | Test circuit and test method for display panels | |
| US11930672B2 (en) | Display device | |
| KR20160102518A (ko) | 어레이 기판의 배선구조 | |
| CN102819158B (zh) | 一种显示面板 | |
| CN101446725B (zh) | 一种液晶显示装置 | |
| CN116403497A (zh) | 一种显示面板、显示装置及显示面板的测试方法 | |
| CN106054474A (zh) | 液晶显示面板及液晶显示面板线路监测方法 | |
| KR20150077778A (ko) | 디스플레이 장치의 검사 방법 | |
| CN108538863B (zh) | 显示基板及其修复方法、显示装置 | |
| CN106950773B (zh) | 显示装置及显示面板的布线方法 | |
| JP2001005027A (ja) | 液晶表示装置およびそれを用いた液晶表示応用機器 | |
| CN101923236A (zh) | 液晶显示面板及其测试方法 | |
| CN105549270B (zh) | 液晶光配向电路及液晶面板 | |
| KR102092070B1 (ko) | 디스플레이 장치의 검사 방법 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 13882665 Country of ref document: EP Kind code of ref document: A1 |
|
| WWE | Wipo information: entry into national phase |
Ref document number: 14424257 Country of ref document: US |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| 122 | Ep: pct application non-entry in european phase |
Ref document number: 13882665 Country of ref document: EP Kind code of ref document: A1 |