WO2014143910A1

WO2014143910A1 - Manufacturing apparatus for depositing a material and a gasket for use therein

Info

Publication number: WO2014143910A1
Application number: PCT/US2014/028081
Authority: WO
Inventors: Matthew DEEG; David C. HILLABRAND; Keith Mccoy; Stephen Coppola; Julian Kamibayashiyama; Melissa VELTMAN
Original assignee: Hemlock Semiconductor Corporation
Priority date: 2013-03-15
Filing date: 2014-03-14
Publication date: 2014-09-18

Abstract

A gasket seals a chamber of a manufacturing apparatus, which is used to deposit a material on a carrier body. The manufacturing apparatus including a housing defining a chamber. An electrode is disposed through the housing. The housing defines an inlet for introducing a deposition composition, which comprises the material or a precursor thereof, into the chamber. The gasket comprises a body portion defining an upper groove for positioning adjacent the electrode. The body portion of the gasket also defines a lower groove opposite the upper groove for positioning adjacent the housing. A first sealing element is disposed within the upper groove for sealing against the electrode. A second sealing element is disposed within the lower groove for sealing against the housing. Sealing between the electrode and the housing prevents the deposition composition from escaping the chamber.

Description

MANUFACTURING APPARATUS FOR DEPOSITING A MATERIAL

AND A GASKET FOR USE THEREIN

RELATED APPLICATIONS

[0001] This application claims priority to and all advantages of United States Provisional Patent Application No. 61/792,330, filed on March 15, 2013, the content of which is incorporated herein by reference.

FIELD OF THE INVENTION

[0002] The present invention relates to a manufacturing apparatus for depositing a material on a carrier body. More specifically, the present invention relates to a gasket for use with the manufacturing apparatus.

BACKGROUND OF THE INVENTION

[0003] Manufacturing apparatuses for depositing material on a carrier body are known in the art. For example, silicon may be deposited on the carrier body to produce polycrystalline silicon. It is desirable to deposit the material with a high purity such that contamination of the material by impurities is limited. Depositing the material, especially silicon, with high purity involves careful control of environmental conditions surrounding the deposition process. For example, components of the manufacturing apparatus can potentially contribute impurities to the material, which contaminates the material. Furthermore, when the components are heated many impurities present therein are subject to release from the substances. The impurities that are released by the components can be introduced within the reaction chamber and be absorbed by the material thereby contaminating the material. As such, any component that is subject to heating in the presence of the material can have a significant effect on contamination to the material.

[0004] In a conventional manufacturing apparatus, a gasket is used to seal the reaction chamber. The gasket is a potential point of contamination of the material. For example, the gasket is heated as the carrier body is heated in the presence of a deposition gas to deposit the material on the carrier body. The heating of the gasket and the exposure of the gasket to the deposition gas results in the release of impurities into the reaction chamber from the gasket. Additionally, as the gasket is heated, the gasket losses flexibility and suffers extensive creep relaxation, which prevents the gasket from properly sealing the reaction chamber. As such, there remains a need to provide an improved gasket for a manufacturing apparatus for depositing material on a carrier body.

SUMMARY OF THE INVENTION AND ADVANTAGES

[0005] A gasket seals a chamber of a manufacturing apparatus. The manufacturing apparatus is used to deposits a material on a carrier body. The manufacturing apparatus including a housing defining the chamber. The housing includes a jar and a base plate for coupling with the jar. An electrode is disposed through the housing with the electrode at least partially disposed within the chamber. The housing defines an inlet for introducing a deposition composition, which comprises the material or a precursor thereof, into the chamber. The gasket comprises a body portion defining an upper groove for positioning adjacent the electrode. The body portion of the gasket also defines a lower groove opposite the upper groove for positioning adjacent the housing. A first sealing element is disposed within the upper groove for sealing against the electrode. A second sealing element is disposed within the lower groove for sealing against the housing. Sealing between the electrode and the housing prevents the deposition composition from escaping the chamber.

BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Other advantages of the present invention will be readily appreciated, as the same becomes better understood by reference to the following detailed description when considered in connection with the accompanying drawings wherein:

[0007] Figure 1 is a cross-sectional view of a manufacturing apparatus for depositing a material on a carrier body including an electrode;

[0008] Figure 2 is a cross-sectional view of a portion of the manufacturing apparatus showing a gasket disposed between a housing and an electrode;

[0009] Figure 3A is a perspective of the gasket with a body portion of the gasket partially cut away;

[0010] Figure 3B is a cross-sectional view of the gasket taken along line 3B-3B of Figure 3A showing a first sealing element disposed in an upper groove and a second sealing element disposed in a lower groove;

[0011] Figure 4A is a perspective of the gasket with the body portion of the gasket partially cut away; [0012] Figure 4B is a cross-sectional view of the gasket taken along line 4B-4B of Figure 4A showing an alternative embodiment of the first sealing element and the second sealing element;

[0013] Figure 5 is a perspective view of the gasket showing a gasket segment connecting the first and second sealing elements;

[0014] Figure 6 is a cross-sectional view of the gasket taken along line 6-6 of Figure 5 showing the gasket segments;

[0015] Figure 7 is a perspective view of the gasket with a projecting extending from the body portion of the gasket; and

[0016] Figure 8 is a cross-section view of a portion of the manufacturing apparatus showing the gasket disposed between the housing and the electrode and the projection of the gasket extending through the housing.

DETAILED DESCRIPTION OF THE INVENTION

[0017] Referring to the Figures, wherein like numerals indicate like or corresponding parts throughout the several views, a manufacturing apparatus 10 for deposition of a material 12 is shown. During operation of the manufacturing apparatus 10, the material 12 is deposited on a carrier body 14. For example, the manufacturing apparatus 10 may be a chemical vapor deposition reactor, such as a Siemens type chemical vapor deposition reactor, for depositing silicon on the carrier body 14 to produce high purity polycrystalline silicon. As is known with the Siemens Method, the carrier body 14 may have a substantially U-shaped configuration, as shown in Figure 1. However, it is to be appreciated that the carrier body 14 may have configurations other than the U-shaped configuration. Additionally, when the material 12 to be deposited is silicon, the carrier body 14 is typically a silicon slim rod comprising high purity silicon. The silicon is deposited on the silicon slim rod for producing high purity polycrystalline silicon.

[0018] With reference to Figure 1, the manufacturing apparatus 10 comprises a housing 16 defining a chamber 18. The housing 16 includes a jar 20 and a base plate 22 for coupling to the jar 20 to form the housing 16. The jar 20 of the housing 16 has at least one wall 24 with the wall 24 typically presenting a cylindrical configuration of the housing 16. However, it is to be appreciated that the jar 20 of the housing 16 may have configurations other than cylindrical, such as a cubed configuration. Generally, the wall 24 of the jar 20 has an interior that is hollow. The wall 24 of the jar 20 and the base plate 22, when coupled together, define the chamber 18. The jar 20 has an end 26 that is open for allowing access to the chamber 18. The base plate 22 is coupled to the end 26 of the jar 20 for covering the end 26.

[0019] The housing 16 may include a flange 28, which extends from the wall 24 of the housing 16. More specifically, the flange 28 extends transversely from the wall 24 of the housing 16. Typically, the flange 28 is parallel with the base plate 22 when the base plate 22 is coupled to the housing 16. Typically, both the flange 28 and the base plate 22 define a hole 30 for receiving a fastener 32, such as a bolt, to secure the jar 20 to the base plate 22. Said differently, the fastener 32 prevents the jar 20 and the base plate 22 from moving relative to each other. It is to be appreciated that the hole 30 in the flange 28 and the base plate 22 may be threaded for receiving threads of the fastener 32.

[0020] The base plate 22 may define a channel 34. The channel 34 is defined about a periphery of the base plate 22. Additionally, the flange 28 of the housing 16 may have a finger 36 extending from the flange 28 for engaging the channel 34 of the base plate 22. The engagement of the finger 36 of the flange 28 with the channel 34 of the base plate 22 ensures that the base plate 22 and the housing 16 are properly aligned when coupling the housing 16 to the base plate 22. The engagement of the finger 36 of the flange 28 with the channel 34 of the base plate 22 also prevents a blowout of the wall 24 of the jar 20 during operation of the manufacturing apparatus 10.

[0021] The housing 16 defines an inlet 38 for introducing a deposition composition, which comprises the material 12 to be deposited or a precursor thereof, into the chamber 18. Similarly, the housing 16 may define an outlet 40 for allowing the deposition composition, or a reaction byproduct thereof, to be exhausted from the chamber 18. It is to be appreciated that the inlet 38 and/or the outlet 40 may be defined by either the jar 20 or the base plate 22 of the housing 16. Typically, an inlet pipe 42 is connected to the inlet 38 for delivering the deposition composition to the chamber 18 and an exhaust pipe 44 is connected to the outlet 40 for removing the deposition composition, or a reaction byproduct thereof, from the chamber 18.

[0022] The manufacturing apparatus 10 includes an electrode 46 disposed through the housing 16. The electrode 46 is at least partially disposed within the chamber 18. For example, the electrode 46 is typically disposed through the base plate 22 with a portion of the electrode 46 supporting the carrier body 14 within the chamber 18. However, it is to be appreciated that the electrode may be disposed through the wall 24 of the jar 20. In one embodiment, the electrode 46 has a shaft 48 and a head 50 disposed at an end 52 of the shaft 48. In such an embodiment, the head 50 is disposed within the chamber 18 for supporting the carrier body 14.

[0023] With reference to Figure 2, a socket 54 is connected to the electrode 46 within the chamber 18 for receiving the carrier body 14. Said differently, the socket 54 separates the carrier body 14 from the electrode 46 while allowing the electrode 46 to support the carrier body 14 within the chamber 18. It is to be appreciated that the socket 54 may also be referred to as a chuck or a poly chuck by those skilled in the art. The electrode 46, and in particular the head 50 of the electrode 46, may define a cup 56 for receiving the socket 54. As such, the socket 54 may be at least partially disposed within the cup 56 to connect the socket 54 to the electrode 46.

[0024] Typically, the electrode 46 comprises an electrically conductive material such as copper, silver, nickel, Inconel, gold, and combinations thereof. The electrode 46 is heated within the chamber 18 by passing an electric current through the electrode 46. Additionally, the socket 54 also comprises an electrically conductive material, such as graphite. Graphite is selected for the socket 54 because graphite is rigid enough to securely mount the carrier body 14 to the electrode 46 while conducting the electric current from the electrode 46 thought the socket 54 and into the carrier body 14. Although not required, ends 58A, 58B of the socket 54 may be tapered to focus the electrical current into the carrier body 14.

[0025] As a result of passing the electric current from the electrode 46 to the carrier body 14 via the socket 54, the carrier body 14 is heated to a deposition temperature by a process known as Joule heating. Typically, the deposition temperature of the carrier body 14 within the reaction chamber 18 is of from about 800 to about 1,250, more typically of from about 900 to about 1,150, and even more typically of from about 950 to about 1,100 degrees centigrade.

[0026] Heating the carrier body 14 to the deposition temperature generally facilitates thermal decomposition of the deposition composition. As alluded to above, the deposition composition comprises the material 12 to be deposited on the carrier body 14 or a precursor thereof. Therefore, the thermal decomposition of the deposition composition results in the material 12 being deposited on the heated carrier body 14. For example, when the material 12 to be deposited is silicon, the deposition composition may comprise a halosilane, such as a chlorosilane or a bromosilane. However, it is to be appreciated that the deposition composition may comprise other precursors, especially silicon containing molecules such as silane, silicon tetrachloride, tribromosilane, and trichlorosilane. It is also to be appreciated that the manufacturing apparatus 10 can be used to deposit materials other than silicon on the carrier body 14.

[0027] Generally, it is beneficial to prevent impurities from contaminating the material 12. An impurity or impurities, as the terms are generally used herein, are defined as an element or a compound the presence of which is undesirable in the material 12 deposited. For example, when the material 12 to be deposited is silicon, the impurities of concern typically include aluminum, arsenic, boron, phosphorous, iron, nickel, copper, chromium, and combinations thereof. Generally, limiting impurities present in the material 12 deposited on the carrier body 14 results in a high purity of the material 12. High purity, as the term is used herein, means that the material 12 has an impurity content of less than or equal to 1 parts per million atomic. However, it is to be appreciated that when the material 12 to be deposited is silicon, there are additional distinctions between deposited silicons, which can be made based on sequentially lower impurity contents. While the above threshold for characterizing the material 12 as having a high purity provides an upper limit for the impurity content, deposited silicons can still be characterized as high purity with substantially lower impurity content than the threshold set forth above.

[0028] As described above, the electrode 46 is disposed through the housing 16. It is to be appreciated that the electrode 46 may be disposed through the jar 20 of the housing 16 or the base plate 22 of the housing 16. Generally, the mechanical interaction between the electrode 46 and the housing 16 is insufficient to seal the chamber 18. Said differently, the mechanical interaction between the electrode 46 and the housing 16 is insufficient prevent the deposition composition from escaping the chamber 18. Therefore, the manufacturing apparatus 10 may further comprise a gasket 60 disposed between the housing 16 and the electrode 46 for sealing the chamber 18 at the electrode 46 to prevent the deposition composition from escaping the chamber 18 at the electrode 46. It is to be appreciated that the gasket 60 may also be referred to as a seal.

[0029] With reference to Figure 3A, the gasket 60 includes a body portion 62 presenting the gasket 60 with a ring configuration. Said differently, the body portion 62 of the gasket 60 has a circular cross-section and defines a central hole 64 for allowing the gasket 60 to be disposed about the electrode 46. For example, when the electrode 46 includes the shaft 48, the central hole 64 of the body portion 62 of the gasket 60 allows the shaft 48 of the electrode 46 to be disposed though the body portion 62 of the gasket 60 for sealing the chamber 18 between the shaft 48 of the electrode 46 and the housing 16. It is to be appreciated that when the electrode 46 includes the head 50, the gasket 60 seals between the head 50 of the electrode 46 and the housing 16, as best shown in Figure 2. When the head 50 of the electrode 46 is present, the gasket 60 is compressed between the head 50 of the electrode 46 and the housing 16 for sealing the chamber 18 to prevent the deposition composition from escaping the chamber 18. For example, when the deposition composition is a gas, such as trichlorosilane, the gasket 60 prevents the gas from escaping the chamber 18. Additionally, compressing the gasket 60 between the head 50 of the electrode 46 and the housing 16 prevents impurities external to the chamber 18 from entering the chamber 18 during operation of the manufacturing apparatus 10.

[0030] With reference to Figure 3B, the body portion 62 of the gasket 60 defines an upper groove 66 for positioning adjacent the electrode 46. The body portion 62 also defines a lower groove 68 opposite the upper grove. The lower groove 68 is generally positioned adjacent the housing 16. A first sealing element 70 is disposed within the upper groove 66 for sealing against the electrode 46. Likewise, a second sealing element 72 is disposed within the lower groove 68 for sealing against the housing 16. It is to be appreciated that the sealing elements 70, 72 may be held within the upper and lower grooves 66, 68 by any suitable method. For example, the sealing elements 70, 72 may be press fit into the upper and lower grooves 66, 68. Furthermore, an adhesive may be used to bond the sealing elements 70, 72 within the upper and lower grooves 66, 68.

[0031] Typically, each of the sealing elements 70, 72 have an inner wall 74 abutting the body portion 62 within either the upper or lower groove 66, 68, an outer wall 76 spaced from the inner wall 74 and also abutting the body portion 62 within either the upper or lower groove 66, 68. As shown in Figures 3A and 3B, the sealing elements 70, 72 may have a rectangular cross-section. Alternatively, as shown in Figures 4A and 4B, the sealing elements 70, 72 may include a sealing lip 78 disposed between the inner and outer walls 74, 76 for sealing against either the base plate 22 of the housing 16 or the electrode 46. Each of the sealing elements 70, 72 may define a pair of furrows 80, which are separated by the sealing lip 78 such that each of the sealing elements 70, 72 have a W-shaped configuration in cross-section.

[0032] With reference to Figures 5 and 6, it is to be appreciated that the gasket 60 may include at least one gasket segment 82 extending through the body portion 62 of the gasket 60 to interconnect the first and second sealing elements 70, 72. In such an embodiment, the body portion 62 of the gasket 60 may define at least one gasket channel 84 extending between the upper and lower grooves 66, 68 with the gasket segment 82 disposed within the gasket channel 84 for interconnecting the first and second sealing elements 70, 72. It is to be appreciated that although a plurality of the gasket segments 82 are shown in Figures 5 and 6, a single gasket segment 82 may alternatively be provided.

[0033] The body portion 62 of the gasket 60 may comprise a ceramic material 12, such as silicon nitride, alumina, zirconia, zirconia toughened alumina, sialon, and combinations thereof. The ceramic material 12 is used to provide electrical insulation between the electrode 46 and the housing 16. Said differently, the ceramic material 12 of the body portion 62 of the gasket 60 prevents the electric current from passing into the housing 16 from the electrode 46. Therefore, the housing 16 is not energized by the electric current passing though the electrode 46. Additionally, an insulating sleeve 86 may be disposed about the electrode 46 outside the chamber 18 for preventing the electric current from passing into the housing 16 from the electrode 46.

[0034] With reference to Figures 7 and 8, the gasket 60 may further comprise a projection 88 extending from the body portion 62 with the projection 88 adapted to be at least partially disposed through the housing 16. The projection 88 prevents the electrode 46 from contacting the housing 16. When present, the projection 88 also comprises the ceramic material 12.

[0035] Each of the sealing elements 70, 72 may comprise an elastomeric material for providing each of the sealing elements 70, 72 with flexibility. For example, the sealing elements 70, 72 may be a flexible graphite material, such as Grafoil®, which is commercially available from GrafTech International. Additionally, the sealing elements 70, 72 may be the elastomeric material, which is selected from the group of perfluoro rubber, perfluoroelastomer, resilient metal-based materials, silicone or other organic elastomers, and combinations thereof. Providing the sealing elements 70, 72 with flexibility allows the sealing elements 70, 72 to seal against uneven surfaces of either the electrode 46 or the base plate 22 of the housing 16.

[0036] During operation of the manufacturing apparatus 10, pressure within the chamber 18 may increase to an operating pressure. Typically, the operating pressure is about 15, more typically of from about 2 to about 8, and even more typically of from about 3 to about 7 atmospheres. Although pressure within the chamber 18 may reach the operating pressure, the gasket 60 is still capable of sealing between the electrode 46 and the housing 16.

[0037] Generally, the gasket 60 is in atmospheric communication with the chamber 18. As such, the gasket 60, and, in particular the sealing elements 70, 72 of the gasket 60, are heated as the temperature within the chamber 18 approaches the operating temperature.

[0038] The gasket 60 is also in atmospheric communication with the carrier body 14 within the chamber 18 and is therefore in atmospheric communication with the material 12 as it is deposited on the carrier body 14. Therefore, care must be taken to ensure that the gasket 60 does not contribute impurities into the chamber 18. As such, the sealing elements 70, 72 and the body portion 62 of the gasket 60 have a thermal stability suitable to prevent decomposition, which can result in an introduction of impurities into the chamber 18, when the gasket 60 is exposed to the operating temperature within the chamber 18. Therefore, due to the thermal stability of the sealing elements 70, 72 of the gasket 60, the gasket 60 minimally contributes impurities, if at all, into the chamber 18 during operation of the manufacturing apparatus 10.

[0039] Typically, when the material 12 deposited on the carrier body 14 is to be high purity, the flexible graphite or elastomeric material of the sealing elements 70, 72 of the gasket 60 contributes an amount of impurities to the material 12 deposited on the carrier body 14 that is less than 100 parts per billion atomic. Therefore, the gasket 60 can be used within the manufacturing apparatus 10, which deposits the material 12 having the high purity. For example, when the material 12 deposited is silicon for producing polycrystalline silicon, the polycrystalline silicon is produced with the high purity because possible contamination by the gasket 60 has been limited or even eliminated.

[0040] The limitation or prevention of impurities within the gasket 60 from contaminating the material 12 deposited on the carrier body 14 allows the material 12 deposited on the carrier body 14, especially polycrystalline silicon, to meet and/or exceed the high purity threshold described above. Additionally, the limitation or prevention of impurities from the gasket 60 contaminating the material 12 deposited on the carrier body 14 may be accomplished despite the fact that the manufacturing apparatus 10 is not equipped with cooling devices for reducing the heating of the gasket 60.

[0041] Obviously, many modifications and variations of the present invention are possible in light of the above teachings. The foregoing invention has been described in accordance with the relevant legal standards; thus, the description is exemplary rather than limiting in nature. Variations and modifications to the disclosed embodiment may become apparent to those skilled in the art and do come within the scope of the invention. Accordingly, the scope of legal protection afforded this invention may only be determined by studying the following claims.

Claims

CLAIMS What is claimed is:

1. A manufacturing apparatus for depositing a material on a carrier body, said manufacturing apparatus comprising:

a housing defining a chamber;

an electrode disposed through said housing with said electrode at least partially disposed within said chamber,

an inlet defined by said housing for introducing a deposition composition, which comprises the material or a precursor thereof, into said chamber; and

a gasket disposed between said housing and said electrode for preventing the deposition composition from escaping said chamber, said gasket comprising;

a body portion defining an upper groove adjacent said electrode and said body portion defining a lower groove opposite said upper grove and adjacent said housing, a first sealing element disposed within said upper groove for sealing against said electrode, and

a second sealing element disposed within said lower groove for sealing against said housing.

2. A manufacturing apparatus as set forth in claim 1 wherein each of said sealing elements have an inner wall abutting said body portion within said groove, an outer wall spaced from said inner wall and abutting said body portion within said groove, and a sealing lip disposed between said inner and outer walls for sealing against either said housing or said electrode.

3. A manufacturing apparatus as set forth in claim 2 wherein each of said sealing elements have a pair of furrows separated by said sealing lip such that said sealing elements have a W-shaped configuration in cross-section.

4. A manufacturing apparatus as set forth in any preceding claim wherein said body portion of said gasket comprises a ceramic material.

5. A manufacturing apparatus as set forth in claim 4 wherein said body portion comprises silicon nitride.

6. A manufacturing apparatus as set forth in claim 4 wherein said first and second sealing elements comprise a flexible graphite material.

7. A manufacturing apparatus as set forth in claim 4 wherein said first and second sealing elements comprise an elastomeric material.

8. A manufacturing apparatus as set forth in claim 7 wherein said elastomeric material contributes less than about 1 parts per million atomic of impurities to the material deposited on the carrier body.

9. A manufacturing apparatus as set forth in claim 8 wherein the material deposited on the carrier body is silicon.

10. A manufacturing apparatus as set forth in any preceding claim wherein at least one gasket segment interconnects said first and second sealing elements.

11. A manufacturing apparatus as set forth in claim 10 wherein said body portion of said gasket defines at least one gasket channel extending between said upper and lower grooves with said gasket segment disposed within said gasket channel for interconnecting said first and second sealing elements.

12. A manufacturing apparatus as set forth in any preceding claim wherein said gasket further comprises a projection extending from said body portion with said projection at least partially disposed through said housing.

13. A manufacturing apparatus as set forth in any preceding claim wherein said gasket is disposed between said electrode and said base plate of said housing.

14. A gasket for sealing a chamber of a manufacturing apparatus, which deposits a material on a carrier body, with the manufacturing apparatus including a housing defining a chamber, an electrode disposed through the housing with the electrode at least partially disposed within the chamber, and an inlet defined by the housing for introducing a deposition composition, which comprises the material or a precursor thereof, into the chamber, the gasket comprising:

a body portion defining an upper groove for positioning adjacent the electrode and said body portion defining a lower groove opposite said upper groove for positioning adjacent the housing; a first sealing element disposed within said upper groove for sealing against the electrode to prevent the deposition composition from escaping the chamber between said body of said gasket and the electrode; and

a second sealing element disposed within said lower groove for sealing against the housing to prevent the deposition composition from escaping the chamber between said body of said gasket and the housing.

15. A gasket as set forth in claim 14 wherein each of said sealing elements have an inner wall abutting said body portion within said groove, an outer wall spaced from said inner wall and abutting said body portion within said groove, and a sealing lip disposed between said inner and outer walls for sealing against either the housing or the electrode.

16. A gasket as set forth in claim 15 wherein each of said sealing elements have a pair of furrows separated by said sealing lip such that said sealing elements have a W-shaped configuration in cross-section.

17. A gasket as set forth in any one of claims 14-16 wherein said body portion comprises a ceramic material.

18. A gasket as set forth in claim 17 wherein said body portion comprises silicon nitride.

19. A gasket as set forth in claim 17 wherein said first and second sealing elements comprise a flexible graphite material.

20. A gasket as set forth in claim 17 wherein said first and second sealing elements comprises an elastomeric material.

21. A gasket as set forth in claim 20 wherein said elastomeric material contributes less than about 1 parts per million atomic of impurities to the material deposited on the carrier body.

22. A gasket as set forth in claim 21 wherein the material deposited on the carrier body is silicon.

23. A gasket as set forth in any one of claims 14-22 wherein at least one gasket segment interconnects said first and second sealing elements.

24. A gasket as set forth in claim 23 wherein said body portion of said gasket defines at least one gasket channel extending between said upper and lower grooves with said gasket segment disposed within said gasket channel for interconnecting said first and second sealing elements.

25. A gasket as set forth in any one of claims 14-24 further comprises a projection extending from said body portion with said projection adapted to be at least partially disposed through the housing.