WO2014138840A1 - Electroplating assembly and related components - Google Patents
Electroplating assembly and related components Download PDFInfo
- Publication number
- WO2014138840A1 WO2014138840A1 PCT/CA2013/050198 CA2013050198W WO2014138840A1 WO 2014138840 A1 WO2014138840 A1 WO 2014138840A1 CA 2013050198 W CA2013050198 W CA 2013050198W WO 2014138840 A1 WO2014138840 A1 WO 2014138840A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- rod
- electroplating
- rack
- pieces
- receiving terminal
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/005—Contacting devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
Definitions
- the invention relates to the field of electroplating, and more particularly to electroplating components configured for mounting on racks.
- Electroplating is well established process that uses electrical current to reduce cations of a desired material from a solution and coat a conductive object with a thin layer of the material, typically such as a metal. Electroplating is primarily used in practice for depositing a layer of material to bestow a desired property (for example, abrasion and wear resistance, corrosion protection, lubricity, aesthetic qualities, etc.) to a surface that otherwise lacks that property.
- a desired property for example, abrasion and wear resistance, corrosion protection, lubricity, aesthetic qualities, etc.
- the process used in electroplating is called electro deposition.
- the part to be plated is typically but not always made the cathode (negative electrode) of the circuit.
- the anode is made of the actual metal to be plated on the (cathode) part. Both components are immersed in a solution called an electrolyte containing one or more dissolved metal salts as well as other ions that facilitate the deposition process.
- a power supply provides current to the anode-electrolyte-cathode circuit.
- metal atoms that comprise it are oxidized allowing them to dissolve in the electrolyte solution. This is just one type of electroplating.
- electroplating examples include an inert anode (like platinum) and dissolved metal salt in the electrolyte.
- an inert anode like platinum
- dissolved metal salt in the electrolyte.
- Plastic parts may be plated with many finishes such as nickel, chrome, copper or a plethora of other metal.
- the raw plastic part is typically attached to a metal/conducting rack that is successively immersed into various tanks. In some of these tanks, the racks are supplied with electric current.
- the rack with the plastic parts on it may be immersed, for example, into an acid bath that chemically etches and cleans the surface of the part.
- the parts on the rack undergo various etching/cleaning stages.
- the next step involves a deposition process/routine of copper metal. That step makes the plastic part nearly but not completely conducting. To make the parts conducting, in preparation for the elecrodeposition process an additional step is usually required. That step is known in the art as a copper strike.
- the rack clips are in electrical connection with the part surfaces, the part is electrically conductive and the rack can go into the electrodeposition tanks and receive the final metallic coating or coatings of typically but not exclusively, nickel, chrome or other metals.
- Prior art electroplating systems generally include a large number of clips for a given rack relative to the number of pieces which are being electroplated while being carried on a given rack. Often, this results in low throughput, and increased man-hours required in preparing - that is loading - the rack for the electroplating process, and subsequent unloading. In addition, rack throughput and control of current to different parts of the rack is problematic, often resulting in less than optimal coating of pieces that have not been fully electroplated.
- an electroplating assembly having a pieces assembly and individual pieces which substantially reduce the number of clips for a given rack relative to the number of pieces which are electroplated while being carried on a given rack. This is accomplished by concatenating pieces such that current flows between adjacent pieces arranged on the rack in a novel way.
- an electroplating system including an electroplating rack including at least one electrically conductive frame member and at least one electrically conductive rack connecting member for connecting a pieces assembly to the rack.
- the pieces assembly includes an electrically conductive elongate rod having a central axis and at least one receiving terminal. The elongate rod is connected to the rack connecting member at first and second ends thereof.
- the pieces assembly also including a plurality of pieces, each piece having a final-shape portion and a means for attaching connected to the final-shape portion, with the means for attaching is sized and otherwise dimensioned to be fixedly received in the at least one receiving terminal.
- the at least one receiving terminal comprises a recess depressed from an outer surface of the elongate rod.
- each piece further includes a joining portion connecting the final-shape portion and the means for attaching; the final-shape portion adapted to be disconnected from the joining portion following an electroplating process.
- the means for attaching comprises a tubular portion adapted to slidingly engage the outer surface of the rod, at least one projecting clip attached to the tubular portion, and an engaging element at an end of the at least one projecting clip.
- the engaging element is sized and otherwise dimensioned to be friction fit into the at least one receiving terminal.
- the at least one projecting clip is tapered towards a central axis of the tubular portion.
- the at least one projecting clip is spring loaded with a bias towards the central axis.
- the at least one receiving terminal comprises at least one pair of receiving terminals arranged on opposite sides of the rod, and the at least one projecting clip comprises two projecting clips.
- the recess comprises a generally rectangular slot.
- a rod for use in an electroplating system in which a plurality of pieces to be electroplated are mounted on the rod; the rod including an electrically conductive elongate portion having a central axis and at least one receiving terminal for receiving at least one of the plurality of pieces and means for connecting first and second ends of the rod to an electroplating rack.
- the at least one receiving terminal comprises a recess depressed from an outer surface of the elongate rod.
- the at least one receiving terminal comprises at least one pair of receiving terminals arranged on opposite sides of the rod.
- the recess comprises a generally rectangular slot.
- a method for electroplating including providing an electroplating rack including at least one electrically conductive frame member and at least one electrically conductive rack connecting member for connecting a pieces assembly to the rack; mounting a plurality of pieces on an electrically conductive elongate rod; the elongate rod having a central axis and at least one receiving terminal; the plurality of pieces having a final-shape portion and a means for attaching connected to the final- shape portion; wherein the means for attaching is sized and otherwise dimensioned to be fixedly received in the at least one receiving terminal; attaching the rod with the mounted plurality of pieces onto the electroplating rack; and, carrying out an electroplating reaction.
- the rack, pieces assembly, rod and pieces are as herein described.
- Figure 1 is a perspective view of an electroplating rack on which embodiments of the invention may be mounted.
- Figure 2 is a perspective view of a pieces assembly according to one embodiment of the invention. In Figure 2, pieces are removed for ease of illustration and understanding.
- Figure 3 is a top view of the assembly of Figure 2.
- Figure 4 is an exploded view of one piece mounted on a rod according to the invention.
- Figure 5 is a detail view of a receiving terminal on the rod and connecting means on the plastic piece of the embodiment of Figure 2.
- Figure 6 is a perspective view of an end portion of the rod with a piece mounted in the receiving terminal.
- electroplating system 250 includes a rigid electroplating rack frame 2B formed of electrically conductive members which are in electrical contact with one another for removably mounting thereon the assemblies 6B of preferably identical molded plastic pieces 5B (shown in more detail in Figure 2).
- the present invention is directed primarily at novel assemblies 6B of molded plastic pieces 5B that may be adapted for use on various electroplating rack frames, including the example rack frame 2B. It will be appreciated that other rack frames are applicable and the invention may be used with same. These include present prior art rack frames, and racks frames that may later be developed.
- the means for connecting 35 includes a sleeve that is press-fit into a receiving portion on the rack, or alternatively, is held by clips (not shown) of the rack shown in Figure 1.
- the means for connecting 35 includes a sleeve that is press-fit into a receiving portion on the rack, or alternatively, is held by clips (not shown) of the rack shown in Figure 1.
- an end cap 40 may be provided to prevent an adjacent piece 5N from becoming dislodged prematurely from the rod 10.
- the end cap 40 may also provide a degree of safety, by reducing the sharpness of the end of the rod 10, and also provides a surface area on which the rod 10 can be handled.
- plastic pieces 5B may be arranged to fit outwardly from the rack frame 2B.
- a rack 2B is shown in Figure 1, and has a top and bottom and, front and back and defining therebetween an axial direction, and left and right sides and defining therebetween a longitudinal direction.
- the rack is electrically conductive and includes attachment means for mounting the rod.
- the rack illustrated is exemplary only, and as will be appreciated by one skilled in the art, any electrically conductive rack suitable for electroplating may be used.
- FIGS 2 and 3 show a representative assembly 6B according to one embodiment of the invention.
- the assembly 6B is characterized generally by a current transmitting rod 10 that is attachable and detachable from the rack of Figure 1.
- the current transmitting rod 10 preferably includes a central axis 15 along which current is transmitted to a plurality of piece receiving terminals 20.
- the piece receiving terminals 20 are sized and otherwise dimensioned to receive a respective piece 5A thereon.
- Piece 5A has a corresponding means for attaching 30 to the terminals 20.
- each of the receiving terminals 20 will have an associated piece 5N, but for ease of understanding and illustration, pieces are only illustrated on some of the terminals 20 of the skewer 10.
- each piece 5B is provided in a manner that permits each piece to be independently attached to the rod 10 along the central axis thereof.
- Each of the pieces 5B are preferably molded plastic pieces-and are identical to each other such that large volumes of pieces may be electroplated at a time. This arrangement provides significant advantages over the prior art, where typically electroplating only occurs between a single piece and the rack itself.
- each plastic piece 5 A preferably includes a joining portion 45 and a final- shape portion 50, where the joining portion 45 permits attachment with the rod 10, and the final- shape portion represents the desired end-use piece that is to be electroplated. These elements are typically formed from a molded plastic, and are of a material capable of being electroplated.
- both the joining portion 45 and the final-shape portion 50 will be electroplated, but the final-shape portion 50 is detached from the joining portion 45 prior to use. This detachment may occur, for example, by providing a break point between the joining portion 45 and the final-shape portion 50, such that detachment can occur manually. The joining portion 45 is then discarded, or recycled.
- FIGS. 4, 5 and 6, there are shown detail views of a single piece 5A, and a respective receiving terminal 20 for receiving the piece 5A.
- a terminal 20 proximate the end of the rod 10 is shown, however, the illustrations are applicable to any particular terminal 20 on the rod 10.
- Piece 5B may have various sections which project outwardly relative to one another but are not described in detail here.
- the final-shape portion 50 forms a final shape part that may take on any appearance or configuration, and is not limited to the embodiments herein illustrated.
- Joining portion 45 preferably includes an elongate member 60 leading to the means for attaching 30, which provides an interface between the piece being electroplated, and the terminal 20 of the rod 10.
- the terminal 20 preferably includes a generally rectangular shaped, or other non-circular shaped, recess or cavity 65 depressed from an outer surface 70 of the rod 10. Shown more clearly in Figure 6, recess 65 may be a slot formed on an outer surface of the rod 70, defined by an inner surface 75 including a flat, or generally flat, bottom that is sized and otherwise dimensioned to receive a engaging element 80 of the means for receiving 30 of the piece 5 A. Details of the piece 5A are provided below.
- the recess 65 further includes sidewalls 85 onto which the means for receiving 30 is clipped.
- the recess 65 is sized and otherwise dimensioned to engage the means for receiving 30 of the piece 5 A in a friction-fit arrangement, such that the piece 5 A is unable to move, either in translation or in rotation, when engaged in the recess 65.
- Pieces 5 A are joined to the rod 10 by an interference fit connection or a snap fit connection, along the central axis 15 of the rod 10.
- the final shape portion 50 is the portion of the piece 5A that is intended to be used as an end-product.
- final shape portion 50 is attached to a joining portion 45, by break portion 90. Break portion 90 defines the point at which the final shape portion 50 is separated from the joining portion 45.
- the final shape portion 50 may be any shape being electroplated, and only a representative version is depicted here.
- the joining portion 45 is shown elongated, and disproportionately larger than the final shape portion 50, for ease of illustration.
- the size of the joining portion 45 may be adjusted to optimize the process should be and/or minimize byproduct. Focusing now on the means for attaching 30, which is connected to the joining portion 45, a generally tubular portion having an inner diameter 100 within a predetermined tolerance larger than the outer diameter of the rod 10, such that the inner diameter 100 of the tubular portion slidingly engages the outer surface 105 of the rod 10. Projecting from the tubular portion 95, in a direction parallel with the central axis 15 of the rod 10, are a pair of projecting clips 110 that have disposed at ends thereof, engaging elements 80 extending into the terminals 65 of the rod 10.
- Engaging elements 80 extend perpendicular to the central axis 15 from the projecting clips and are arranged such that the distance between the engaging elements 80a and 80b is less than the outer diameter of the rod 10.
- the projecting clips 110 are provided with sufficient flexibility to permit the projecting clips 10, and the engaging elements 80a and 80b, to be displaced by flexing, relative to the tubular portion 95, such that the tubular portion 95 can slide over the outer surface 105 of the rod 10.
- inner walls 115 of the projecting clips 110 may be tapered to provide spring action in the flexing of the projecting clips 110, with a bias towards engagement of the engaging elements 80 with the terminals 20.
- Various modifications to the interaction between the rod 10 and the means for attaching 30 are contemplated.
- a plurality of rods 10 are each donned with a plurality of pieces 5N before mounting on an electroplating rack. Any means for mounting on the rack may be used, provided that current is able to flow from the rack to the rods 10.
- the pieces In fixedly mounting the plurality of pieces 5N onto each rod 10, the pieces may be slid from an end of the rod until engagement of the engaging elements 80 with the terminals 65 (as shown in Figure 4, for example).
- Tooling may be developed to mount a number of pieces 5N onto the rod 10 simultaneously. After the electroplating process has been complete, the pieces 5N can either be individually removed, or the final shape portion can be detached from the joining portion, and the removal of any waste material still attached to the rod performed separately. It is also feasible that tooling be used to remove multiple pieces simultaneously.
- the removable rod 10 allows for pieces to be mounted on the rod at a location distal from the electroplating facility.
- mounting on the rod facilitates shipping and transport of the pieces as well.
- the pieces may be mounted onto the rod, packaged and shipped to an electroplating facility.
- the electroplating process can be completed, and the rod with pieces intact can be shipped to another facility for further processing, where the final shape portion can be removed, and processed further as needed.
- This arrangement is not possible in the majority of prior art systems where pieces have to be removed from the electroplating rack individually.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CA2013/050198 WO2014138840A1 (en) | 2013-03-14 | 2013-03-14 | Electroplating assembly and related components |
CA2906214A CA2906214A1 (en) | 2013-03-14 | 2013-03-14 | Electroplating assembly and related components |
US14/775,845 US20160024682A1 (en) | 2011-09-22 | 2013-03-14 | Electroplating Assembly And Related Components |
MX2015012753A MX2015012753A (en) | 2013-03-14 | 2013-03-14 | Electroplating assembly and related components. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CA2013/050198 WO2014138840A1 (en) | 2013-03-14 | 2013-03-14 | Electroplating assembly and related components |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2014138840A1 true WO2014138840A1 (en) | 2014-09-18 |
Family
ID=51535642
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CA2013/050198 WO2014138840A1 (en) | 2011-09-22 | 2013-03-14 | Electroplating assembly and related components |
Country Status (3)
Country | Link |
---|---|
CA (1) | CA2906214A1 (en) |
MX (1) | MX2015012753A (en) |
WO (1) | WO2014138840A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105112987A (en) * | 2015-09-28 | 2015-12-02 | 无锡市星亿涂装环保设备有限公司 | Electroplating conductive stick swinging and water-pouring device |
CN111501081A (en) * | 2020-05-25 | 2020-08-07 | 扬州虹扬科技发展有限公司 | Jig for rack plating and tin plating process |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3056739A (en) * | 1959-11-13 | 1962-10-02 | Machlett Lab Inc | Electroplating rack |
CA1215939A (en) * | 1983-05-24 | 1986-12-30 | Horst Mallok | Plating rack |
EP1600529A2 (en) * | 2004-05-26 | 2005-11-30 | Komag, Inc. | Method and apparatus for applying a voltage to one or more substrates during plating |
CA2631055A1 (en) * | 2007-05-11 | 2008-11-11 | Lacks Enterprises, Inc. | Method and apparatus for racking articles for surface treatment |
-
2013
- 2013-03-14 MX MX2015012753A patent/MX2015012753A/en unknown
- 2013-03-14 WO PCT/CA2013/050198 patent/WO2014138840A1/en active Application Filing
- 2013-03-14 CA CA2906214A patent/CA2906214A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3056739A (en) * | 1959-11-13 | 1962-10-02 | Machlett Lab Inc | Electroplating rack |
CA1215939A (en) * | 1983-05-24 | 1986-12-30 | Horst Mallok | Plating rack |
EP1600529A2 (en) * | 2004-05-26 | 2005-11-30 | Komag, Inc. | Method and apparatus for applying a voltage to one or more substrates during plating |
CA2631055A1 (en) * | 2007-05-11 | 2008-11-11 | Lacks Enterprises, Inc. | Method and apparatus for racking articles for surface treatment |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105112987A (en) * | 2015-09-28 | 2015-12-02 | 无锡市星亿涂装环保设备有限公司 | Electroplating conductive stick swinging and water-pouring device |
CN105112987B (en) * | 2015-09-28 | 2018-06-26 | 无锡星亿智能环保装备股份有限公司 | A kind of plating flies a bar swing pouring device |
CN111501081A (en) * | 2020-05-25 | 2020-08-07 | 扬州虹扬科技发展有限公司 | Jig for rack plating and tin plating process |
Also Published As
Publication number | Publication date |
---|---|
CA2906214A1 (en) | 2014-09-18 |
MX2015012753A (en) | 2016-06-10 |
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