WO2014132424A1 - Electronic module and production method for same - Google Patents

Electronic module and production method for same Download PDF

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Publication number
WO2014132424A1
WO2014132424A1 PCT/JP2013/055577 JP2013055577W WO2014132424A1 WO 2014132424 A1 WO2014132424 A1 WO 2014132424A1 JP 2013055577 W JP2013055577 W JP 2013055577W WO 2014132424 A1 WO2014132424 A1 WO 2014132424A1
Authority
WO
WIPO (PCT)
Prior art keywords
functional unit
substrate
electronic module
heat sink
base plate
Prior art date
Application number
PCT/JP2013/055577
Other languages
French (fr)
Japanese (ja)
Inventor
康亮 池田
清水　正章
Original Assignee
新電元工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新電元工業株式会社 filed Critical 新電元工業株式会社
Priority to PCT/JP2013/055577 priority Critical patent/WO2014132424A1/en
Priority to CN201380002168.XA priority patent/CN104137259B/en
Priority to JP2014502286A priority patent/JP5778333B2/en
Publication of WO2014132424A1 publication Critical patent/WO2014132424A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/071—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next and on each other, i.e. mixed assemblies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00—Conversion of dc power input into dc power output
    • H02M3/02—Conversion of dc power input into dc power output without intermediate conversion into ac
    • H02M3/04—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters
    • H02M3/10—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M3/145—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M3/155—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to an electronic module and a manufacturing method thereof, and more particularly to an electronic module including a heat sink and a manufacturing method thereof.
  • the conventional regulator 100 includes a power unit 110, a control unit 120, and a heat sink 130.
  • the power unit 110 performs power conversion by an electronic component 112 such as a semiconductor switch mounted on the substrate 111.
  • the control unit 120 controls the power unit 110 by an electronic component 122 such as a control element mounted on the substrate 121.
  • the power unit 110 and the control unit 120 are electrically connected by a connection terminal 113.
  • the heat sink 130 includes a base plate 131 and a plurality of fins 132 erected on the lower surface of the base plate 131.
  • the regulator 100 is connected to an external device via the external connection terminal 123.
  • both the power unit 110 and the control unit 120 are provided on the base plate 131 of the heat sink 130.
  • Patent Document 1 discloses a semiconductor device in which a semiconductor element is sandwiched between two heat sinks.
  • the size increases. That is, conventionally, there has been a problem that it is difficult to downsize an electronic module including a heat sink such as a regulator.
  • an object of the present invention is to provide an electronic module that can be miniaturized. Another object of the present invention is to provide an electronic module manufacturing method capable of improving the manufacturability of the electronic module.
  • An electronic module includes: A first functional unit having a first substrate and an electronic component mounted on the first substrate; A second functional unit having a second substrate and a second substrate on which an electronic component mounted on the second substrate is mounted, and electrically connected to the first functional unit; A heat sink for cooling the first and second functional units,
  • the heat sink has a base plate provided with a storage portion therein, The first functional unit is stored in the storage unit such that the first substrate contacts an inner wall surface of the storage unit of the base plate, The second functional unit is fixed on the base plate so that the second substrate is in contact with a main surface of the base plate.
  • the storage portion includes a recess formed in a first side surface connected to the main surface of the base plate, or a through-hole penetrating from the first side surface to a second side surface opposite to the first side surface. It may be made to become.
  • the storage portion includes a first side surface connected to the main surface of the base plate, a second side surface opposite to the first side surface, and the main surface, the first side surface, and the second side surface. You may make it open to the 3rd side surface connected.
  • a plurality of connection terminals that electrically connect the first functional unit and the second functional unit are provided in stripes on the side surfaces of the base plate connected to the main surface so as to be insulated from each other. You may make it accommodate in each groove part.
  • the first functional part housed in the housing part includes a first through hole reaching the housing part from the main surface of the base plate, and a second through hole penetrating the first substrate in the thickness direction. You may make it fix in the said heat sink with the screw inserted in the hole and screwing in the screw hole formed in the inner wall of the said accommodating part.
  • the second functional unit may be fixed on the base plate by inserting the screw into a through-hole penetrating the second substrate in the thickness direction.
  • the heat sink is A heat sink body with a recess formed on the surface; A lid having a first main surface and a second main surface opposite to the first main surface; The lid is attached to the heat sink body so that the first main surface is in contact with the surface of the heat sink body and covers the recess, and constitutes the storage portion together with the recess, and the second function
  • the part may be fixed to the second main surface of the lid.
  • the first functional unit may be fixed to the first main surface of the lid.
  • connection terminals that electrically connect the first functional unit and the second functional unit are inserted into through holes that penetrate the lid in the thickness direction so as to be insulated from each other. You may do it.
  • the storage part may be sealed by the recess of the heat sink body and the lid, and the first functional part may be stored in a sealed state in the heat sink.
  • the first functional unit is a power unit that converts input power input to the first functional unit into desired output power
  • the second functional unit is a control unit that controls the power unit. There may be.
  • the first substrate may be in contact with the inner wall surface of the storage portion of the base plate via a heat conducting member.
  • a recess may be provided on the main surface of the first substrate facing the inner wall surface of the storage portion, and a heat conducting member may be disposed in the recess so as to contact the inner wall surface of the storage portion.
  • An electronic module manufacturing method includes: A first functional unit having a first substrate on which an electronic component is mounted; a second functional unit having a second substrate on which the electronic component is mounted; and a base plate.
  • a method of manufacturing an electronic module comprising a heat sink for cooling a functional unit,
  • the first functional unit includes a first side surface connected to the main surface of the base plate, a second side surface opposite to the first side surface, and the main surface, the first side surface, and the second side surface.
  • An electronic module manufacturing method includes: A first functional unit having a first substrate on which an electronic component is mounted; a second functional unit having a second substrate on which the electronic component is mounted; a heat sink body; and a lid. And a method of manufacturing an electronic module comprising a heat sink for cooling the second functional unit, Fixing the first functional unit to the lid so that the first substrate is in contact with one main surface of the lid; Attaching the lid to the heat sink body such that the first functional part is housed in a recess provided in the heat sink body; Fixing the second functional unit to the lid so that the second substrate is in contact with the other main surface of the lid; It is characterized by providing.
  • the heat sink includes a base plate having a storage portion provided therein, and the first functional unit is provided in the storage portion so that the first substrate is in contact with the inner wall surface of the storage portion of the base plate.
  • the second functional unit is stored on the base plate so that the second substrate is in contact with the main surface of the base plate.
  • the first functional unit when the first functional unit is stored in the heat sink storage unit, the first functional unit is connected to the main surface of the base plate, the first side surface, The first side surface and the second side surface opposite to the first side surface, and the third side surface connected to the main surface, the first side surface, and the second side surface are slid into the storage portion.
  • the first functional unit it is not necessary to align the first functional unit with the storage unit of the heat sink with high accuracy, the first functional unit can be easily stored in the storage unit, and the electronic module is manufactured. Can be improved.
  • the first functional unit when the first functional unit is stored in the heat sink storage unit, the first functional unit is connected to one of the lids of the heat sink.
  • the lid body is fixed to the lid body so as to be in contact with the main surface, and then the lid body is attached to the heat sink body so that the first functional part is accommodated in the recess provided in the heat sink body.
  • FIGS. 1 and 2 show a perspective view and a cross-sectional view, respectively, of the electronic module 1 according to the first embodiment.
  • FIG. 2 is a cross-sectional view of the electronic module 1 along a plane passing through the center line of the two screws 40, 40 in more detail.
  • FIG. 3 is a cross-sectional view of the first substrate 11 of the electronic module 1.
  • the electronic module 1 includes a first functional unit 10, a second functional unit 20, and a heat sink 30.
  • the first functional unit 10 is a power unit that converts input power input to the first functional unit 10 into desired output power, for example.
  • the first functional unit 10 includes a first substrate 11 and an electronic component (for example, a semiconductor switch) 12 mounted on the first substrate 11.
  • the first substrate 11 has an insulating base material 11a made of an insulating material such as ceramic, and conductor layers 11b and 11c provided on the insulating base material 11a.
  • the conductor layers 11b and 11c are made of copper foil or the like.
  • the conductor layer 11b is processed into a predetermined pattern, and the electronic component 12 is joined to the conductor layer 11b.
  • the conductor layer 11c is not patterned and is in contact with the inner wall surface of the storage portion 31a1. Note that the first substrate 11 may not include the conductor layer 11c.
  • the second functional unit 20 is, for example, a control unit that controls a semiconductor switch of the power unit.
  • the second functional unit 20 includes a second substrate 21 and an electronic component 22 mounted on the second substrate 21. Similar to the first substrate 11, the second substrate 21 is an insulating base material made of an insulating material such as ceramic, and a conductor layer such as a copper foil provided on the insulating base material and processed into a predetermined pattern. Have And the electronic component 22 is joined to this conductor layer.
  • the heat sink 30 is for cooling the first functional unit 10 and the second functional unit 20, and includes a base plate 31 provided with a storage unit 31 a 1 therein and a plurality of fins 32 erected on the base plate 31. And have.
  • the base plate 31 has a substantially rectangular parallelepiped shape, and has a main surface (upper surface) 31b, a side surface 31c connected to the main surface 31b, and a side surface 31d opposite to the side surface 31c.
  • the storage portion 31a1 is formed of a through-hole penetrating from the side surface 31c to the side surface 31d. As shown in FIGS. 1 and 2, the through hole may be formed in a shape that fits with the first substrate 11. Thereby, the 1st functional part 10 can be accurately arrange
  • the storage portion 31a1 is not limited to the through hole, and may include a recess formed in the side surface 31c. That is, the side surface 31d of the base plate 31 may not be opened.
  • the second functional unit 20 is arranged on the main surface 31 b of the base plate 31.
  • a plurality of groove portions 33 provided in a stripe shape are provided on the side surface 31 c of the base plate 31.
  • the connection terminal 13 is accommodated in the groove 33.
  • the storage part 31a1 provided in the base plate 31 is a space for storing the first functional part.
  • the first functional unit 10 is stored in the storage unit 31a1 so that the first substrate 11 is in contact with the inner wall surface of the storage unit 31a1.
  • the first substrate 11 may be in direct contact with the inner wall surface of the storage portion 31a1, or may be in contact with the inner wall surface via a heat conductive member (a heat radiation sheet, heat radiation grease, or the like).
  • the second functional unit 20 is fixed on the base plate 31 so that the second substrate 21 is in contact with the main surface 31 b of the base plate 31.
  • connection terminals 13 are respectively accommodated in a plurality of groove portions 33 provided on the side surface 31c of the base plate 31 so as to be insulated from each other. Thereby, since the connection terminal 13 does not jump out of the heat sink 30, the electronic module 1 can be further reduced in size.
  • the first functional unit 10 stored in the storage unit 31 a 1 is fixed in the heat sink 30 by screws 40.
  • the screw 40 is inserted into the through hole 34 that reaches the housing part 31a1 from the main surface 31b of the base plate 31 and the through hole 14 that penetrates the first substrate 11 in the thickness direction, and is formed on the inner wall of the housing part 31a1.
  • the screw hole 35 is screwed.
  • the second functional unit 20 is fixed on the base plate 31 by inserting a screw 40 through a through hole 24 that penetrates the second substrate 21 in the thickness direction.
  • the 1st and 2nd function parts 10 and 20 can be fixed to the heat sink 30 with a small number of screws.
  • the first functional unit 10 and the second functional unit 20 may be fixed to the heat sink 30 with separate screws, respectively.
  • the first functional unit 10 is positioned and inserted into the storage unit 31a1, and stored in the storage unit 31a1 so that the first substrate 11 is in contact with the inner wall surface of the storage unit 31a1.
  • the second functional unit 20 is fixed on the base plate 31 so that the second substrate 21 contacts the main surface 31 b of the base plate 31.
  • the electronic module 1 since the first functional unit 10 is stored in the storage unit 31 a 1, an area for installing the first functional unit 10 on the base plate 31 is not necessary, and the electronic module is greatly increased. Can be reduced in size. Moreover, since the 1st board
  • a heat conducting member 11e such as a heat radiating sheet or heat radiating grease may be disposed in the recess 11d provided in the conductor layer 11c.
  • the heat conducting member 11e is disposed in the recess 11d so as to be in contact with the inner wall surface of the storage portion 31a1.
  • substrate 11 is not provided with the conductor layer 11c, you may provide the recessed part which accommodates a heat conductive member in the insulating base material 11a.
  • a concave portion is provided on the main surface of the first substrate 11 facing the inner wall surface of the storage portion, and the heat conducting member is arranged in the concave portion so as to contact the inner wall surface of the storage portion.
  • the distance between the insulating base 11a and the heat sink 30 is smaller than that of the recess 11d. It becomes shorter by the depth. As a result, the heat dissipation of the electronic module 1 can be improved.
  • the heat conducting member 11e does not protrude from the main surface of the first substrate 11, when the first functional unit 10 is stored in the storage unit, the heat dissipation sheet is caught by the opening of the storage unit and is torn or rounded. In addition, heat radiation grease is prevented from adhering to the opening end of the storage portion. As a result, the manufacturability of the electronic module 1 can be improved.
  • FIG. 4 is a perspective view of the electronic module 2 according to the second embodiment.
  • One of the differences between the second embodiment and the first embodiment is the configuration of the storage unit.
  • the second embodiment will be described focusing on this difference.
  • the storage unit 31a2 that stores the first functional unit 10 is provided in the base plate 31 as a substantially notched shape as shown in FIG. That is, the storage portion 31a2 is open to the side surface 31c, the side surface 31d opposite to the side surface 31c, and the side surface 31e.
  • the side surface 31e is a side surface (the right side surface in FIG. 4) of the base plate 31 connected to the main surface 31b, the side surface 31c, and the side surface 31d.
  • the first functional unit 10 is fixed in the heat sink 30 with screws or the like as in the first embodiment.
  • an area for installing the first functional unit on the base plate is not required, and the electronic module can be greatly reduced in size.
  • the first functional unit 10 is slid into the storage unit 31a2 and stored in the storage unit 31a2 so that the first substrate 11 is in contact with the inner wall surface of the storage unit 31a2.
  • the storage portion 31a2 is opened in three directions in a cutout shape, it is not necessary to align the first functional portion 10 with the storage portion 31a2 of the heat sink 30 with high accuracy. 10 can be easily stored in the storage section.
  • the second functional unit 20 is fixed on the base plate 31 so that the second substrate 21 contacts the main surface 31 b of the base plate 31.
  • the manufacturability of the electronic module can be improved.
  • FIG. 5A is a perspective view of the heat sink body 36 of the heat sink 30 of the electronic module 3 according to this embodiment.
  • FIG. 5B is a perspective view of the lid 37 of the heat sink 30.
  • FIG. 6 is a cross-sectional view of the electronic module 3 according to the third embodiment.
  • the heat sink 30 includes a heat sink body 36 and a lid 37.
  • a lid 37 is attached to the heat sink body 36 to constitute the heat sink 30.
  • the heat sink body 36 has a recess 36a formed on the surface (upper surface) 36b.
  • the recess 36a opens to the side surface 36c and the side surface 36d of the heat sink body 36.
  • the side surface 36c is a front side surface
  • the side surface 36d is a back side surface.
  • the lid 37 has a main surface 37a and a main surface 37b opposite to the main surface 37a.
  • the lid 37 is attached to the heat sink body 36 so that the main surface 37a is in contact with the surface 36b of the heat sink body 36 and covers the recess 36a.
  • the main surface 37 b of the lid body 37 becomes the main surface 31 b of the base plate 31.
  • the lid body 37 constitutes a storage portion 31 a 3 that stores the first functional portion 10 together with the recess 36 a of the heat sink body 36.
  • the first functional unit 10 is fixed to the main surface 37 a of the lid 37 by, for example, screwing.
  • the first functional unit 10 may be fixed to the bottom surface of the recess 36a.
  • the second functional unit 20 is fixed to the main surface 37 b of the lid 37 by, for example, screwing.
  • the lid body 37 is provided with a through hole 38 that penetrates the lid body 37 in the thickness direction.
  • a plurality of connection terminals 13 that electrically connect the first functional unit 10 and the second functional unit 20 are inserted into the respective through holes 38 so as to be insulated from each other. Yes. Thereby, since the connection terminal 15 does not jump out of the heat sink 30, the electronic module 1 can be further reduced in size.
  • an area for installing the first functional unit on the base plate is not required, and the electronic module can be significantly downsized.
  • the recess 36 a of the heat sink body 36 may be provided so as not to open on the side surfaces 36 c and 36 d of the heat sink body 36.
  • the storage portion 31 a 3 is sealed by the recess 36 a of the heat sink body 36 and the lid body 37, and the first functional unit 10 is stored in the heat sink 30 in a sealed state. Accordingly, it is possible to reduce the electromagnetic wave emitted to the outside along with the operation of the electronic module and to suppress the influence on the operation of the electronic module due to the electromagnetic wave from the outside.
  • the first functional unit 10 is fixed to the lid body 37 so that the first substrate 11 is in contact with the main surface 37 a of the lid body 37. At this time, the first functional unit 10 is fixed to the lid 37 so that the connection terminal 13 is inserted through the through hole 38 of the lid 37.
  • the lid 37 is attached to the heat sink body 36 so that the first functional unit 10 is accommodated in the recess 36 a provided in the heat sink body 36.
  • the second functional unit 20 is fixed to the lid body 37 so that the second substrate 21 is in contact with the main surface 37 b of the lid body 37.
  • the second functional unit 20 is fixed to the lid 37 so that the connection terminal 13 is inserted through the through hole of the second substrate 21. Thereafter, the connection terminal 13 is soldered to the second substrate 21.
  • the first functional unit 10 and the second functional unit 20 are fixed to the lid body 37 with screws or an adhesive.
  • the manufacturability of the electronic module can be improved.
  • First functional part 11 First substrate 11a Insulating base material 11b, 11c Conductive layer 11d Recess 11e Thermal conduction member 12 Electronic component 13 Connection terminal 14 Through hole 20 Second functional part 21 First 2 substrate 22 electronic component 23 external connection terminal 24 through hole 30 heat sink 31 base plate 31a1, 31a2, 31a3 storage part 31b main surface 31c, 31d, 31e side surface 32 fin 33 groove part 34 through hole 35 screw hole 36 heat sink body 36a concave part 36b upper surface 36c, 36d Side surface 37 Cover body 37a, 37b Main surface 38 Through hole 40 Screw 100 Regulator 110 Power unit 111 Substrate 112 Electronic component 113 Connection terminal 120 Control unit 121 Substrate 122 Electronic component 123 External connection terminal 130 Heat sink 131 Base plate 132 Fin

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

[Problem] To provide an electronic module that can be miniaturized and a production method for the same. [Solution] An electronic module (1) according to one embodiment is provided with: a first functional part (10) that includes a substrate (11) having an electronic part (12) attached thereto; a second functional part (20) that includes a substrate (21) having an electronic part (22) attached thereto, and connects electrically to the first functional part (10); and a heat sink (30) that cools the first functional part (10) and second functional parts (20). The heat sink (30) includes a base plate (31) to which a storage part (31a) is internally provided. The first functional part (10) is housed within the storage part (31a) such that the first substrate (11) is contacted to an inner wall of the storage part (31a) of the base plate (31). The second functional part (20) is fixed upon the base plate (31) such that the second substrate (21) is contacted to a main surface (31b) of the base plate (31).

Description

電子モジュールおよびその製造方法Electronic module and manufacturing method thereof
　本発明は、電子モジュールおよびその製造方法、より詳しくは、ヒートシンクを備えた電子モジュールおよびその製造方法に関する。 The present invention relates to an electronic module and a manufacturing method thereof, and more particularly to an electronic module including a heat sink and a manufacturing method thereof.
　従来、電子モジュールの一つとして、入力電力から所望の出力電力を得るためのレギュレータが知られている。図８に示すように、従来のレギュレータ１００は、パワー部１１０、制御部１２０およびヒートシンク１３０を備えている。パワー部１１０は、基板１１１上に実装された半導体スイッチ等の電子部品１１２により電力変換を行う。制御部１２０は、基板１２１上に実装された制御素子等の電子部品１２２によりパワー部１１０を制御する。パワー部１１０と制御部１２０は、接続端子１１３により電気的に接続されている。ヒートシンク１３０は、ベースプレート１３１と、このベースプレート１３１の下面に立設された複数のフィン１３２とを有する。また、レギュレータ１００は、外部接続端子１２３を介して外部の機器と接続される。 Conventionally, a regulator for obtaining desired output power from input power is known as one of electronic modules. As shown in FIG. 8, the conventional regulator 100 includes a power unit 110, a control unit 120, and a heat sink 130. The power unit 110 performs power conversion by an electronic component 112 such as a semiconductor switch mounted on the substrate 111. The control unit 120 controls the power unit 110 by an electronic component 122 such as a control element mounted on the substrate 121. The power unit 110 and the control unit 120 are electrically connected by a connection terminal 113. The heat sink 130 includes a base plate 131 and a plurality of fins 132 erected on the lower surface of the base plate 131. The regulator 100 is connected to an external device via the external connection terminal 123.
　図８に示すように、従来のレギュレータ１００においては、パワー部１１０および制御部１２０のいずれも、ヒートシンク１３０のベースプレート１３１上に設けられている。 As shown in FIG. 8, in the conventional regulator 100, both the power unit 110 and the control unit 120 are provided on the base plate 131 of the heat sink 130.
　なお、特許文献１には、半導体素子を２つのヒートシンクで挟んだ半導体装置が開示されている。 Note that Patent Document 1 discloses a semiconductor device in which a semiconductor element is sandwiched between two heat sinks.
特開２０１２－２２７５３２号公報JP 2012-227532 A
　上記のように、従来の電子モジュールでは、パワー部１１０と制御部１２０が同一平面上に並べて設けられるため、サイズが大きくなってしまう。即ち、従来は、レギュレータ等のヒートシンクを備える電子モジュールを小型化することが困難であるという課題があった。 As described above, in the conventional electronic module, since the power unit 110 and the control unit 120 are provided side by side on the same plane, the size increases. That is, conventionally, there has been a problem that it is difficult to downsize an electronic module including a heat sink such as a regulator.
　そこで、本発明は、小型化可能な電子モジュールを提供することを目的とする。また、本発明は、該電子モジュールの製造性を向上させることが可能な電子モジュールの製造方法を提供することを目的とする。 Therefore, an object of the present invention is to provide an electronic module that can be miniaturized. Another object of the present invention is to provide an electronic module manufacturing method capable of improving the manufacturability of the electronic module.
　本発明の一態様に係る電子モジュールは、
　第１の基板と、前記第１の基板に実装された電子部品とを有する第１の機能部と、
　第２の基板と、前記第２の基板に実装された電子部品が実装された第２の基板とを有し、前記第１の機能部に電気的に接続された第２の機能部と、
　前記第１および第２の機能部を冷却するヒートシンクと、を備え、
　前記ヒートシンクは、内部に収納部が設けられたベースプレートを有し、
　前記第１の機能部は、前記第１の基板が前記ベースプレートの前記収納部の内壁面に接するように前記収納部内に収納され、
　前記第２の機能部は、前記第２の基板が前記ベースプレートの主面に接するように前記ベースプレート上に固定されている、ことを特徴とする。 An electronic module according to an aspect of the present invention includes:
A first functional unit having a first substrate and an electronic component mounted on the first substrate;
A second functional unit having a second substrate and a second substrate on which an electronic component mounted on the second substrate is mounted, and electrically connected to the first functional unit;
A heat sink for cooling the first and second functional units,
The heat sink has a base plate provided with a storage portion therein,
The first functional unit is stored in the storage unit such that the first substrate contacts an inner wall surface of the storage unit of the base plate,
The second functional unit is fixed on the base plate so that the second substrate is in contact with a main surface of the base plate.
　また、前記電子モジュールにおいて、
　前記収納部は、前記ベースプレートの前記主面につながる第１の側面に形成された凹部、または、前記第１の側面から前記第１の側面と反対側の第２の側面まで貫通する貫通孔からなるようにしてもよい。 In the electronic module,
The storage portion includes a recess formed in a first side surface connected to the main surface of the base plate, or a through-hole penetrating from the first side surface to a second side surface opposite to the first side surface. It may be made to become.
　また、前記電子モジュールにおいて、
　前記収納部は、前記ベースプレートの前記主面につながる第１の側面、前記第１の側面と反対側の第２の側面、並びに、前記主面、前記第１の側面および前記第２の側面につながる第３の側面に開口しているようにしてもよい。 In the electronic module,
The storage portion includes a first side surface connected to the main surface of the base plate, a second side surface opposite to the first side surface, and the main surface, the first side surface, and the second side surface. You may make it open to the 3rd side surface connected.
　また、前記電子モジュールにおいて、
　前記第１の機能部と前記第２の機能部とを電気的に接続する複数の接続端子が、互いに絶縁されるように、前記ベースプレートの前記主面につながる側面にストライプ状に設けられた複数の溝部にそれぞれ収納されているようにしてもよい。 In the electronic module,
A plurality of connection terminals that electrically connect the first functional unit and the second functional unit are provided in stripes on the side surfaces of the base plate connected to the main surface so as to be insulated from each other. You may make it accommodate in each groove part.
　また、前記電子モジュールにおいて、
　前記収納部内に収納された前記第１の機能部は、前記ベースプレートの前記主面から前記収納部に達する第１の貫通孔と、前記第１の基板を厚さ方向に貫通する第２の貫通孔とに挿通され、かつ前記収納部の内壁に形成されたネジ穴に螺合するネジにより、前記ヒートシンク内に固定されているようにしてもよい。 In the electronic module,
The first functional part housed in the housing part includes a first through hole reaching the housing part from the main surface of the base plate, and a second through hole penetrating the first substrate in the thickness direction. You may make it fix in the said heat sink with the screw inserted in the hole and screwing in the screw hole formed in the inner wall of the said accommodating part.
　また、前記電子モジュールにおいて、
　前記ネジが前記第２の基板を厚さ方向に貫通する貫通孔に挿通されることにより、前記第２の機能部は前記ベースプレート上に固定されているようにしてもよい。 In the electronic module,
The second functional unit may be fixed on the base plate by inserting the screw into a through-hole penetrating the second substrate in the thickness direction.
　また、前記電子モジュールにおいて、
　前記ヒートシンクは、
　表面に凹部が形成されたヒートシンク本体と、
　第１の主面と、前記第１の主面と反対側の第２の主面とを有する蓋体と、を有し、
　前記蓋体は、前記第１の主面が前記ヒートシンク本体の前記表面に接し且つ前記凹部を覆うように、前記ヒートシンク本体に取付けられ、前記凹部とともに前記収納部を構成し、前記第２の機能部は、前記蓋体の前記第２の主面に固定されているようにしてもよい。 In the electronic module,
The heat sink is
A heat sink body with a recess formed on the surface;
A lid having a first main surface and a second main surface opposite to the first main surface;
The lid is attached to the heat sink body so that the first main surface is in contact with the surface of the heat sink body and covers the recess, and constitutes the storage portion together with the recess, and the second function The part may be fixed to the second main surface of the lid.
　また、前記電子モジュールにおいて、
　前記第１の機能部は、前記蓋体の前記第１の主面に固定されているようにしてもよい。 In the electronic module,
The first functional unit may be fixed to the first main surface of the lid.
　また、前記電子モジュールにおいて、
　前記第１の機能部と前記第２の機能部とを電気的に接続する複数の接続端子は、互いに絶縁されるように、前記蓋体を厚さ方向に貫通する貫通孔に挿通されているようにしてもよい。 In the electronic module,
The plurality of connection terminals that electrically connect the first functional unit and the second functional unit are inserted into through holes that penetrate the lid in the thickness direction so as to be insulated from each other. You may do it.
　また、前記電子モジュールにおいて、
　前記収納部は前記ヒートシンク本体の前記凹部と前記蓋体とにより密閉され、前記第１の機能部は、前記ヒートシンク内に密閉状態に収納されているようにしてもよい。 In the electronic module,
The storage part may be sealed by the recess of the heat sink body and the lid, and the first functional part may be stored in a sealed state in the heat sink.
　また、前記電子モジュールにおいて、
　前記第１の機能部は、前記第１の機能部に入力された入力電力を所望の出力電力に変換するパワー部であり、前記第２の機能部は、前記パワー部を制御する制御部であってもよい。 In the electronic module,
The first functional unit is a power unit that converts input power input to the first functional unit into desired output power, and the second functional unit is a control unit that controls the power unit. There may be.
　また、前記電子モジュールにおいて、
　前記第１の基板は、熱伝導部材を介して前記ベースプレートの前記収納部の内壁面に接しているようにしてもよい。 In the electronic module,
The first substrate may be in contact with the inner wall surface of the storage portion of the base plate via a heat conducting member.
　また、前記電子モジュールにおいて、
　前記収納部の内壁面に対向する前記第１の基板の主面に凹部が設けられ、熱伝導部材が前記収納部の内壁面に接するように前記凹部に配置されているようにしてもよい。 In the electronic module,
A recess may be provided on the main surface of the first substrate facing the inner wall surface of the storage portion, and a heat conducting member may be disposed in the recess so as to contact the inner wall surface of the storage portion.
　本発明の一態様に係る電子モジュールの製造方法は、
　電子部品が実装された第１の基板を有する第１の機能部と、電子部品が実装された第２の基板を有する第２の機能部と、ベースプレートを有し、前記第１および第２の機能部を冷却するヒートシンクとを備える電子モジュールの製造方法であって、
　前記第１の機能部を、前記ベースプレートの前記主面につながる第１の側面、前記第１の側面と反対側の第２の側面、並びに、前記主面、前記第１の側面および前記第２の側面につながる第３の側面に開口する収納部内にスライドさせ、前記第１の基板が前記収納部の内壁面に接するように前記収納部内に収納する工程と、
　前記第２の機能部を、前記第２の基板が前記ベースプレートの前記主面に接するように前記ベースプレート上に固定する工程と、
　を備えることを特徴とする。 An electronic module manufacturing method according to an aspect of the present invention includes:
A first functional unit having a first substrate on which an electronic component is mounted; a second functional unit having a second substrate on which the electronic component is mounted; and a base plate. A method of manufacturing an electronic module comprising a heat sink for cooling a functional unit,
The first functional unit includes a first side surface connected to the main surface of the base plate, a second side surface opposite to the first side surface, and the main surface, the first side surface, and the second side surface. Slid into the storage portion that opens to the third side surface connected to the side surface of the storage portion, and the first substrate is stored in the storage portion so as to contact the inner wall surface of the storage portion;
Fixing the second functional unit on the base plate so that the second substrate is in contact with the main surface of the base plate;
It is characterized by providing.
　本発明の一態様に係る電子モジュールの製造方法は、
　電子部品が実装された第１の基板を有する第１の機能部と、電子部品が実装された第２の基板を有する第２の機能部と、ヒートシンク本体および蓋体を有し、前記第１および第２の機能部を冷却するヒートシンクとを備える電子モジュールの製造方法であって、
　前記第１の機能部を、前記第１の基板が前記蓋体の一方の主面に接するように前記蓋体に固定する工程と、
　前記第１の機能部が前記ヒートシンク本体に設けられた凹部に収納されるように、前記蓋体を前記ヒートシンク本体に取付ける工程と、
　前記第２の機能部を、前記第２の基板が前記蓋体の他方の主面に接するように前記蓋体に固定する工程と、
　を備えることを特徴とする。 An electronic module manufacturing method according to an aspect of the present invention includes:
A first functional unit having a first substrate on which an electronic component is mounted; a second functional unit having a second substrate on which the electronic component is mounted; a heat sink body; and a lid. And a method of manufacturing an electronic module comprising a heat sink for cooling the second functional unit,
Fixing the first functional unit to the lid so that the first substrate is in contact with one main surface of the lid;
Attaching the lid to the heat sink body such that the first functional part is housed in a recess provided in the heat sink body;
Fixing the second functional unit to the lid so that the second substrate is in contact with the other main surface of the lid;
It is characterized by providing.
　本発明に係る電子モジュールでは、ヒートシンクは、内部に収納部が設けられたベースプレートを有し、第１の機能部は、第１の基板がベースプレートの収納部の内壁面に接するように収納部内に収納され、第２の機能部は、第２の基板がベースプレートの主面に接するようにベースプレート上に固定されている。これにより、本発明によれば、ベースプレート上に第１の機能部を設置する領域が不要となり、電子モジュールを大幅に小型化することができる。 In the electronic module according to the present invention, the heat sink includes a base plate having a storage portion provided therein, and the first functional unit is provided in the storage portion so that the first substrate is in contact with the inner wall surface of the storage portion of the base plate. The second functional unit is stored on the base plate so that the second substrate is in contact with the main surface of the base plate. Thereby, according to this invention, the area | region which installs a 1st function part on a baseplate becomes unnecessary, and an electronic module can be reduced in size significantly.
　また、本発明の一態様に係る電子モジュールの製造方法では、第１の機能部をヒートシンクの収納部に収納する際、第１の機能部を、ベースプレートの主面につながる第１の側面、第１の側面と反対側の第２の側面、並びに、主面、第１の側面および第２の側面につながる第３の側面に開口する収納部内にスライドさせる。これにより、本発明によれば、第１の機能部をヒートシンクの収納部に対して高精度に位置合せする必要がなくなり、第１の機能部を容易に収納部内に収納でき、電子モジュールの製造性を向上させることができる。 In the electronic module manufacturing method according to one aspect of the present invention, when the first functional unit is stored in the heat sink storage unit, the first functional unit is connected to the main surface of the base plate, the first side surface, The first side surface and the second side surface opposite to the first side surface, and the third side surface connected to the main surface, the first side surface, and the second side surface are slid into the storage portion. Thus, according to the present invention, it is not necessary to align the first functional unit with the storage unit of the heat sink with high accuracy, the first functional unit can be easily stored in the storage unit, and the electronic module is manufactured. Can be improved.
　また、本発明の一態様に係る電子モジュールの製造方法では、第１の機能部をヒートシンクの収納部に収納する際、第１の機能部を、第１の基板がヒートシンクの蓋体の一方の主面に接するように蓋体に固定し、その後、第１の機能部がヒートシンク本体に設けられた凹部に収納されるように蓋体をヒートシンク本体に取付ける。これにより、本発明によれば、第１の機能部をヒートシンクの収納部に対して高精度に位置合せする必要がなくなり、第１の機能部を容易に収納部内に収納でき、小型化可能な電子モジュールの製造性を向上させることができる。 In the method for manufacturing an electronic module according to one aspect of the present invention, when the first functional unit is stored in the heat sink storage unit, the first functional unit is connected to one of the lids of the heat sink. The lid body is fixed to the lid body so as to be in contact with the main surface, and then the lid body is attached to the heat sink body so that the first functional part is accommodated in the recess provided in the heat sink body. Thereby, according to this invention, it becomes unnecessary to align the 1st functional part with the storage part of a heat sink with high precision, a 1st functional part can be easily accommodated in a storage part, and size reduction is possible. The manufacturability of the electronic module can be improved.
第１の実施形態に係る電子モジュールの斜視図である。It is a perspective view of the electronic module which concerns on 1st Embodiment. 第１の実施形態に係る電子モジュールの断面図である。It is sectional drawing of the electronic module which concerns on 1st Embodiment. 第１の実施形態に係る電子モジュールの第１の基板の断面図である。It is sectional drawing of the 1st board | substrate of the electronic module which concerns on 1st Embodiment. 第２の実施形態に係る電子モジュールの斜視図である。It is a perspective view of the electronic module which concerns on 2nd Embodiment. （ａ）は、第３の実施形態に係るヒートシンクのヒートシンク本体の斜視図であり、（ｂ）は、該ヒートシンクの蓋体の斜視図である。(A) is a perspective view of the heat sink main body of the heat sink which concerns on 3rd Embodiment, (b) is a perspective view of the cover body of this heat sink. 第３の実施形態に係る電子モジュールの断面図である。It is sectional drawing of the electronic module which concerns on 3rd Embodiment. 第３の実施形態の変形例に係るヒートシンク本体の斜視図である。It is a perspective view of the heat sink main body which concerns on the modification of 3rd Embodiment. 従来の電子モジュール（レギュレータ）の斜視図である。It is a perspective view of the conventional electronic module (regulator).
　以下、図面を参照しつつ本発明の実施形態について説明する。なお、各図において同等の機能を有する構成要素には同一の符号を付し、同一符号の構成要素の詳しい説明は繰り返さない。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in each figure, the component which has an equivalent function is attached | subjected the same code | symbol, and detailed description of the component of the same code | symbol is not repeated.
（第１の実施形態）
　本発明の第１の実施形態に係る電子モジュール１について、図１～図３を参照しつつ説明する。図１および図２は、第１の実施形態に係る電子モジュール１の斜視図および断面図をそれぞれ示している。図２は、より詳しくは、電子モジュール１の、２本のネジ４０，４０の中心線を通る平面に沿う断面図である。また、図３は、電子モジュール１の第１の基板１１の断面図である。 (First embodiment)
An electronic module 1 according to a first embodiment of the present invention will be described with reference to FIGS. 1 and 2 show a perspective view and a cross-sectional view, respectively, of the electronic module 1 according to the first embodiment. FIG. 2 is a cross-sectional view of the electronic module 1 along a plane passing through the center line of the two screws 40, 40 in more detail. FIG. 3 is a cross-sectional view of the first substrate 11 of the electronic module 1.
　電子モジュール１は、図１に示すように、第１の機能部１０と、第２の機能部２０と、ヒートシンク３０とを備えている。 As shown in FIG. 1, the electronic module 1 includes a first functional unit 10, a second functional unit 20, and a heat sink 30.
　第１の機能部１０は、例えば、第１の機能部１０に入力された入力電力を所望の出力電力に変換するパワー部である。この第１の機能部１０は、第１の基板１１と、第１の基板１１に実装された電子部品（例えば半導体スイッチ）１２とを有する。 The first functional unit 10 is a power unit that converts input power input to the first functional unit 10 into desired output power, for example. The first functional unit 10 includes a first substrate 11 and an electronic component (for example, a semiconductor switch) 12 mounted on the first substrate 11.
　図３に示すように、第１の基板１１は、セラミックなどの絶縁材料からなる絶縁基材１１ａと、絶縁基材１１ａ上に設けられた導体層１１ｂ，１１ｃとを有する。導体層１１ｂ，１１ｃは銅箔などからなる。導体層１１ｂは所定のパターンに加工されており、導体層１１ｂに電子部品１２が接合される。導体層１１ｃは、パターン加工されておらず、収納部３１ａ１の内壁面に接する。なお、第１の基板１１は、導体層１１ｃを備えなくてもよい。 As shown in FIG. 3, the first substrate 11 has an insulating base material 11a made of an insulating material such as ceramic, and conductor layers 11b and 11c provided on the insulating base material 11a. The conductor layers 11b and 11c are made of copper foil or the like. The conductor layer 11b is processed into a predetermined pattern, and the electronic component 12 is joined to the conductor layer 11b. The conductor layer 11c is not patterned and is in contact with the inner wall surface of the storage portion 31a1. Note that the first substrate 11 may not include the conductor layer 11c.
　第２の機能部２０は、例えば、パワー部の半導体スイッチを制御する制御部である。この第２の機能部２０は、第２の基板２１と、第２の基板２１に実装された電子部品２２とを有する。第２の基板２１は、第１の基板１１と同様、セラミックなどの絶縁材料からなる絶縁基材と、該絶縁基材上に設けられ、所定のパターンに加工された銅箔などの導体層とを有する。そして、該導体層に電子部品２２が接合されている。 The second functional unit 20 is, for example, a control unit that controls a semiconductor switch of the power unit. The second functional unit 20 includes a second substrate 21 and an electronic component 22 mounted on the second substrate 21. Similar to the first substrate 11, the second substrate 21 is an insulating base material made of an insulating material such as ceramic, and a conductor layer such as a copper foil provided on the insulating base material and processed into a predetermined pattern. Have And the electronic component 22 is joined to this conductor layer.
　ヒートシンク３０は、第１の機能部１０および第２の機能部２０を冷却するためのものであり、内部に収納部３１ａ１が設けられたベースプレート３１と、ベースプレート３１に立設された複数のフィン３２とを有する。 The heat sink 30 is for cooling the first functional unit 10 and the second functional unit 20, and includes a base plate 31 provided with a storage unit 31 a 1 therein and a plurality of fins 32 erected on the base plate 31. And have.
　ベースプレート３１は、略直方体状であり、主面（上面）３１ｂと、主面３１ｂにつながる側面３１ｃと、側面３１ｃと反対側の側面３１ｄとを有する。 The base plate 31 has a substantially rectangular parallelepiped shape, and has a main surface (upper surface) 31b, a side surface 31c connected to the main surface 31b, and a side surface 31d opposite to the side surface 31c.
　収納部３１ａ１は、側面３１ｃから側面３１ｄまで貫通する貫通孔からなる。この貫通孔は、図１および図２に示すように、第１の基板１１と嵌合する形状に形成されてもよい。これにより、第１の機能部１０を収納部３１ａ１内に精度良く配置することができる。なお、収納部３１ａ１は、貫通孔に限らず、側面３１ｃに形成された凹部からなるようにしてもよい。即ち、ベースプレート３１の側面３１ｄは開口していなくてもよい。 The storage portion 31a1 is formed of a through-hole penetrating from the side surface 31c to the side surface 31d. As shown in FIGS. 1 and 2, the through hole may be formed in a shape that fits with the first substrate 11. Thereby, the 1st functional part 10 can be accurately arrange | positioned in the accommodating part 31a1. Note that the storage portion 31a1 is not limited to the through hole, and may include a recess formed in the side surface 31c. That is, the side surface 31d of the base plate 31 may not be opened.
　図１および図２に示すように、ベースプレート３１の主面３１ｂには、第２の機能部２０が配置されている。また、図１に示すように、ベースプレート３１の側面３１ｃには、ストライプ状に設けられた複数の溝部３３が設けられている。後述するように、溝部３３内に接続端子１３が収納されている。 As shown in FIGS. 1 and 2, the second functional unit 20 is arranged on the main surface 31 b of the base plate 31. In addition, as shown in FIG. 1, a plurality of groove portions 33 provided in a stripe shape are provided on the side surface 31 c of the base plate 31. As will be described later, the connection terminal 13 is accommodated in the groove 33.
　ベースプレート３１内に設けられた収納部３１ａ１は、第１の機能部を収納するスペースである。図１および図２に示すように、第１の機能部１０は、第１の基板１１が収納部３１ａ１の内壁面に接するように、収納部３１ａ１内に収納されている。なお、第１の基板１１は、収納部３１ａ１の内壁面に直接接してもよいし、熱伝導部材（放熱シート、放熱グリスなど）を介して内壁面に接してもよい。 The storage part 31a1 provided in the base plate 31 is a space for storing the first functional part. As shown in FIGS. 1 and 2, the first functional unit 10 is stored in the storage unit 31a1 so that the first substrate 11 is in contact with the inner wall surface of the storage unit 31a1. The first substrate 11 may be in direct contact with the inner wall surface of the storage portion 31a1, or may be in contact with the inner wall surface via a heat conductive member (a heat radiation sheet, heat radiation grease, or the like).
　また、第２の機能部２０は、図１および図２に示すように、第２の基板２１がベースプレート３１の主面３１ｂに接するように、ベースプレート３１上に固定されている。 Further, as shown in FIGS. 1 and 2, the second functional unit 20 is fixed on the base plate 31 so that the second substrate 21 is in contact with the main surface 31 b of the base plate 31.
　図１に示すように、第２の機能部２０は、複数の接続端子１３により、第１の機能部１０に電気的に接続されている。これらの接続端子１３は、互いに絶縁されるように、ベースプレート３１の側面３１ｃに設けられた複数の溝部３３にそれぞれ収納されている。これにより、接続端子１３がヒートシンク３０の外に飛び出さないため、電子モジュール１をより小型化することができる。 As shown in FIG. 1, the second functional unit 20 is electrically connected to the first functional unit 10 by a plurality of connection terminals 13. These connection terminals 13 are respectively accommodated in a plurality of groove portions 33 provided on the side surface 31c of the base plate 31 so as to be insulated from each other. Thereby, since the connection terminal 13 does not jump out of the heat sink 30, the electronic module 1 can be further reduced in size.
　ここで、第１の機能部１０および第２の機能部２０の固定方法について、図２を参照して説明する。収納部３１ａ１内に収納された第１の機能部１０は、ネジ４０によりヒートシンク３０内に固定されている。ネジ４０は、ベースプレート３１の主面３１ｂから収納部３１ａ１に達する貫通孔３４と、第１の基板１１を厚さ方向に貫通する貫通孔１４とに挿通され、かつ収納部３１ａ１の内壁に形成されたネジ穴３５に螺合している。 Here, a method of fixing the first functional unit 10 and the second functional unit 20 will be described with reference to FIG. The first functional unit 10 stored in the storage unit 31 a 1 is fixed in the heat sink 30 by screws 40. The screw 40 is inserted into the through hole 34 that reaches the housing part 31a1 from the main surface 31b of the base plate 31 and the through hole 14 that penetrates the first substrate 11 in the thickness direction, and is formed on the inner wall of the housing part 31a1. The screw hole 35 is screwed.
　第２の機能部２０は、図２に示すように、ネジ４０が第２の基板２１を厚さ方向に貫通する貫通孔２４に挿通されることにより、ベースプレート３１上に固定されている。これにより、第１および第２の機能部１０，２０を少ない数のネジでヒートシンク３０に固定することができる。なお、第１の機能部１０と第２の機能部２０は、別個のネジによりヒートシンク３０にそれぞれ固定されてもよい。 As shown in FIG. 2, the second functional unit 20 is fixed on the base plate 31 by inserting a screw 40 through a through hole 24 that penetrates the second substrate 21 in the thickness direction. Thereby, the 1st and 2nd function parts 10 and 20 can be fixed to the heat sink 30 with a small number of screws. The first functional unit 10 and the second functional unit 20 may be fixed to the heat sink 30 with separate screws, respectively.
　次に、第１の実施形態に係る電子モジュール１の製造方法について説明する。 Next, a method for manufacturing the electronic module 1 according to the first embodiment will be described.
　まず、第１の機能部１０を収納部３１ａ１内に位置決めして挿入し、第１の基板１１が収納部３１ａ１の内壁面に接するように収納部３１ａ１内に収納する。次に、第２の機能部２０を第２の基板２１がベースプレート３１の主面３１ｂに接するようにベースプレート３１上に固定する。 First, the first functional unit 10 is positioned and inserted into the storage unit 31a1, and stored in the storage unit 31a1 so that the first substrate 11 is in contact with the inner wall surface of the storage unit 31a1. Next, the second functional unit 20 is fixed on the base plate 31 so that the second substrate 21 contacts the main surface 31 b of the base plate 31.
　以上説明したように、電子モジュール１では、第１の機能部１０は収納部３１ａ１内に収納されるため、ベースプレート３１上に第１の機能部１０を設置する領域が不要となり、電子モジュールを大幅に小型化することができる。また、第１の基板１１が収納部３１ａ１の内壁面に接し、かつ、第２の基板２１がベースプレート３１の主面３１ｂに接するため、放熱性を維持することができる。 As described above, in the electronic module 1, since the first functional unit 10 is stored in the storage unit 31 a 1, an area for installing the first functional unit 10 on the base plate 31 is not necessary, and the electronic module is greatly increased. Can be reduced in size. Moreover, since the 1st board | substrate 11 is in contact with the inner wall face of the accommodating part 31a1, and the 2nd board | substrate 21 is in contact with the main surface 31b of the baseplate 31, heat dissipation can be maintained.
　なお、図３に示すように、放熱シートまたは放熱グリスなどの熱伝導部材１１ｅが導体層１１ｃに設けられた凹部１１ｄ内に配置されてもよい。この熱伝導部材１１ｅは、収納部３１ａ１の内壁面に接するように凹部１１ｄ内に配置される。第１の基板１１が導体層１１ｃを備えない場合は、熱伝導部材を収納する凹部を絶縁基材１１ａに設けてもよい。 As shown in FIG. 3, a heat conducting member 11e such as a heat radiating sheet or heat radiating grease may be disposed in the recess 11d provided in the conductor layer 11c. The heat conducting member 11e is disposed in the recess 11d so as to be in contact with the inner wall surface of the storage portion 31a1. When the 1st board | substrate 11 is not provided with the conductor layer 11c, you may provide the recessed part which accommodates a heat conductive member in the insulating base material 11a.
　このように収納部の内壁面に対向する第１の基板１１の主面に凹部が設けられ、熱伝導部材が収納部の内壁面に接するように該凹部に配置されるようにすることで、凹部１１ｄの設けられていない第１の基板１１と収納部３１ａ１の内壁面との間に熱伝導部材１１ｅを配置する場合に比して、絶縁基材１１ａとヒートシンク３０間の距離が凹部１１ｄの深さ分だけ短くなる。その結果、電子モジュール１の放熱性を向上させることができる。 In this way, a concave portion is provided on the main surface of the first substrate 11 facing the inner wall surface of the storage portion, and the heat conducting member is arranged in the concave portion so as to contact the inner wall surface of the storage portion. Compared with the case where the heat conducting member 11e is arranged between the first substrate 11 where the recess 11d is not provided and the inner wall surface of the storage portion 31a1, the distance between the insulating base 11a and the heat sink 30 is smaller than that of the recess 11d. It becomes shorter by the depth. As a result, the heat dissipation of the electronic module 1 can be improved.
　さらに、熱伝導部材１１ｅが第１の基板１１の主面から出っ張らないため、第１の機能部１０を収納部内に収納する際、放熱シートが収納部の開口に引っかかって破れたり丸まったりすることや、放熱グリスが収納部の開口端に付着することが防止される。その結果、電子モジュール１の製造性を向上させることができる。 Further, since the heat conducting member 11e does not protrude from the main surface of the first substrate 11, when the first functional unit 10 is stored in the storage unit, the heat dissipation sheet is caught by the opening of the storage unit and is torn or rounded. In addition, heat radiation grease is prevented from adhering to the opening end of the storage portion. As a result, the manufacturability of the electronic module 1 can be improved.
（第２の実施形態）
　次に、本発明の第２の実施形態について図４を参照して説明する。図４は、第２の実施形態に係る電子モジュール２の斜視図である。第２の実施形態と第１の実施形態との相違点の一つは、収納部の構成である。以下、この相違点を中心に第２の実施形態について説明する。 (Second Embodiment)
Next, a second embodiment of the present invention will be described with reference to FIG. FIG. 4 is a perspective view of the electronic module 2 according to the second embodiment. One of the differences between the second embodiment and the first embodiment is the configuration of the storage unit. Hereinafter, the second embodiment will be described focusing on this difference.
　第２の実施形態に係る電子モジュール２では、第１の機能部１０を収納する収納部３１ａ２は、図４に示すように、略切り欠き状のものとしてベースプレート３１に設けられている。即ち、収納部３１ａ２は、側面３１ｃ、側面３１ｃと反対側の側面３１ｄ、および側面３１ｅに開口している。側面３１ｅは、主面３１ｂ、側面３１ｃおよび側面３１ｄにつながるベースプレート３１の側面（図４では右側面）である。 In the electronic module 2 according to the second embodiment, the storage unit 31a2 that stores the first functional unit 10 is provided in the base plate 31 as a substantially notched shape as shown in FIG. That is, the storage portion 31a2 is open to the side surface 31c, the side surface 31d opposite to the side surface 31c, and the side surface 31e. The side surface 31e is a side surface (the right side surface in FIG. 4) of the base plate 31 connected to the main surface 31b, the side surface 31c, and the side surface 31d.
　第１の機能部１０は、第１の実施形態と同様、ネジ等により、ヒートシンク３０内に固定されている。 The first functional unit 10 is fixed in the heat sink 30 with screws or the like as in the first embodiment.
　第２の実施形態によれば、第１の実施形態と同様、ベースプレート上に第１の機能部を設置する領域が不要となり、電子モジュールを大幅に小型化することができる。 According to the second embodiment, as in the first embodiment, an area for installing the first functional unit on the base plate is not required, and the electronic module can be greatly reduced in size.
　次に、第２の実施形態に係る電子モジュール２の製造方法について説明する。 Next, a method for manufacturing the electronic module 2 according to the second embodiment will be described.
　まず、第１の機能部１０を収納部３１ａ２内にスライドさせ、第１の基板１１が収納部３１ａ２の内壁面に接するように収納部３１ａ２内に収納する。この際、収納部３１ａ２は切り欠き状に三方に開口しているので、第１の機能部１０をヒートシンク３０の収納部３１ａ２に対して高精度に位置合せする必要がなくなり、第１の機能部１０を容易に収納部内に収納できる。 First, the first functional unit 10 is slid into the storage unit 31a2 and stored in the storage unit 31a2 so that the first substrate 11 is in contact with the inner wall surface of the storage unit 31a2. At this time, since the storage portion 31a2 is opened in three directions in a cutout shape, it is not necessary to align the first functional portion 10 with the storage portion 31a2 of the heat sink 30 with high accuracy. 10 can be easily stored in the storage section.
　次に、第２の機能部２０を、第２の基板２１がベースプレート３１の主面３１ｂに接するようにベースプレート３１上に固定する。 Next, the second functional unit 20 is fixed on the base plate 31 so that the second substrate 21 contacts the main surface 31 b of the base plate 31.
　上記の製造方法では、第１の機能部を収納部に高精度に位置決めして挿入する必要がなくなる。よって、第２の実施形態によれば、電子モジュールの製造性を向上させることができる。 In the above manufacturing method, it is not necessary to position and insert the first functional unit into the storage unit with high accuracy. Therefore, according to the second embodiment, the manufacturability of the electronic module can be improved.
（第３の実施形態）
　次に、本発明の第３の実施形態について、図５および図６を参照して説明する。図５（ａ）は、本実施形態に係る電子モジュール３のヒートシンク３０のヒートシンク本体３６の斜視図である。図５（ｂ）は、ヒートシンク３０の蓋体３７の斜視図である。図６は、第３の実施形態に係る電子モジュール３の断面図である。 (Third embodiment)
Next, a third embodiment of the present invention will be described with reference to FIGS. FIG. 5A is a perspective view of the heat sink body 36 of the heat sink 30 of the electronic module 3 according to this embodiment. FIG. 5B is a perspective view of the lid 37 of the heat sink 30. FIG. 6 is a cross-sectional view of the electronic module 3 according to the third embodiment.
　第３の実施形態と第１の実施形態との相違点の一つは、ヒートシンク３０の構成である。以下、この相違点を中心に第３の実施形態について説明する。 One of the differences between the third embodiment and the first embodiment is the configuration of the heat sink 30. Hereinafter, the third embodiment will be described focusing on this difference.
　第３の実施形態では、ヒートシンク３０は、ヒートシンク本体３６と、蓋体３７とを有する。蓋体３７がヒートシンク本体３６に取付けられて、ヒートシンク３０が構成される。 In the third embodiment, the heat sink 30 includes a heat sink body 36 and a lid 37. A lid 37 is attached to the heat sink body 36 to constitute the heat sink 30.
　図５（ａ）に示すように、ヒートシンク本体３６は、表面（上面）３６ｂに、凹部３６ａが形成されている。凹部３６ａは、ヒートシンク本体３６の側面３６ｃおよび側面３６ｄに開口している。図５（ａ）において、側面３６ｃは正面側の側面であり、側面３６ｄは背面側の側面である。 As shown in FIG. 5A, the heat sink body 36 has a recess 36a formed on the surface (upper surface) 36b. The recess 36a opens to the side surface 36c and the side surface 36d of the heat sink body 36. In FIG. 5A, the side surface 36c is a front side surface, and the side surface 36d is a back side surface.
　図５（ｂ）に示すように、蓋体３７は、主面３７ａと、主面３７ａと反対側の主面３７ｂとを有する。蓋体３７は、主面３７ａがヒートシンク本体３６の表面３６ｂに接し且つ凹部３６ａを覆うように、ヒートシンク本体３６に取付けられる。蓋体３７の主面３７ｂは、ベースプレート３１の主面３１ｂとなる。そして、図６に示すように、蓋体３７は、ヒートシンク本体３６の凹部３６ａとともに、第１の機能部１０を収納する収納部３１ａ３を構成する。 As shown in FIG. 5B, the lid 37 has a main surface 37a and a main surface 37b opposite to the main surface 37a. The lid 37 is attached to the heat sink body 36 so that the main surface 37a is in contact with the surface 36b of the heat sink body 36 and covers the recess 36a. The main surface 37 b of the lid body 37 becomes the main surface 31 b of the base plate 31. As shown in FIG. 6, the lid body 37 constitutes a storage portion 31 a 3 that stores the first functional portion 10 together with the recess 36 a of the heat sink body 36.
　第１の機能部１０は、図６に示すように、例えばネジ止めにより、蓋体３７の主面３７ａに固定されている。なお、第１の機能部１０は、凹部３６ａの底面に固定されてもよい。第２の機能部２０は、図６に示すように、例えばネジ止めにより、蓋体３７の主面３７ｂに固定されている。 As shown in FIG. 6, the first functional unit 10 is fixed to the main surface 37 a of the lid 37 by, for example, screwing. The first functional unit 10 may be fixed to the bottom surface of the recess 36a. As shown in FIG. 6, the second functional unit 20 is fixed to the main surface 37 b of the lid 37 by, for example, screwing.
　また、図５（ｂ）に示すように、蓋体３７には、蓋体３７を厚さ方向に貫通する貫通孔３８が設けられている。図６に示すように、第１の機能部１０と第２の機能部２０とを電気的に接続する複数の接続端子１３が、互いに絶縁されるように、各々の貫通孔３８に挿通されている。これにより、接続端子１５がヒートシンク３０の外に飛び出さないため、電子モジュール１をより小型化することができる。 Further, as shown in FIG. 5B, the lid body 37 is provided with a through hole 38 that penetrates the lid body 37 in the thickness direction. As shown in FIG. 6, a plurality of connection terminals 13 that electrically connect the first functional unit 10 and the second functional unit 20 are inserted into the respective through holes 38 so as to be insulated from each other. Yes. Thereby, since the connection terminal 15 does not jump out of the heat sink 30, the electronic module 1 can be further reduced in size.
　第３の実施形態によれば、第１の実施形態と同様、ベースプレート上に第１の機能部を設置する領域が不要となり、電子モジュールを大幅に小型化することができる。 According to the third embodiment, similarly to the first embodiment, an area for installing the first functional unit on the base plate is not required, and the electronic module can be significantly downsized.
　なお、図７に示すように、ヒートシンク本体３６の凹部３６ａは、ヒートシンク本体３６の側面３６ｃおよび３６ｄに開口しないように設けてもよい。この場合、収納部３１ａ３はヒートシンク本体３６の凹部３６ａと蓋体３７とにより密閉され、第１の機能部１０は、ヒートシンク３０内に密閉状態に収納される。これにより、電子モジュールの動作に伴って外部に放出される電磁波を低減するとともに、外部からの電磁波による電子モジュールの動作への影響を抑制することができる。 As shown in FIG. 7, the recess 36 a of the heat sink body 36 may be provided so as not to open on the side surfaces 36 c and 36 d of the heat sink body 36. In this case, the storage portion 31 a 3 is sealed by the recess 36 a of the heat sink body 36 and the lid body 37, and the first functional unit 10 is stored in the heat sink 30 in a sealed state. Accordingly, it is possible to reduce the electromagnetic wave emitted to the outside along with the operation of the electronic module and to suppress the influence on the operation of the electronic module due to the electromagnetic wave from the outside.
　次に、第３の実施形態に係る電子モジュール３の製造方法について説明する。 Next, a method for manufacturing the electronic module 3 according to the third embodiment will be described.
　まず、第１の機能部１０を、第１の基板１１が蓋体３７の主面３７ａに接するように蓋体３７に固定する。このとき、接続端子１３が蓋体３７の貫通孔３８に挿通されるように、第１の機能部１０を蓋体３７に固定する。 First, the first functional unit 10 is fixed to the lid body 37 so that the first substrate 11 is in contact with the main surface 37 a of the lid body 37. At this time, the first functional unit 10 is fixed to the lid 37 so that the connection terminal 13 is inserted through the through hole 38 of the lid 37.
　次に、第１の機能部１０がヒートシンク本体３６に設けられた凹部３６ａに収納されるように、蓋体３７をヒートシンク本体３６に取付ける。 Next, the lid 37 is attached to the heat sink body 36 so that the first functional unit 10 is accommodated in the recess 36 a provided in the heat sink body 36.
　次に、第２の機能部２０を、第２の基板２１が蓋体３７の主面３７ｂに接するように蓋体３７に固定する。このとき、接続端子１３が第２の基板２１の貫通孔に挿通されるように、第２の機能部２０を蓋体３７に固定する。その後、接続端子１３を第２の基板２１にはんだ付けする。 Next, the second functional unit 20 is fixed to the lid body 37 so that the second substrate 21 is in contact with the main surface 37 b of the lid body 37. At this time, the second functional unit 20 is fixed to the lid 37 so that the connection terminal 13 is inserted through the through hole of the second substrate 21. Thereafter, the connection terminal 13 is soldered to the second substrate 21.
　なお、第１の機能部１０および第２の機能部２０の蓋体３７への固定は、ネジまたは接着剤等により行う。 The first functional unit 10 and the second functional unit 20 are fixed to the lid body 37 with screws or an adhesive.
　上記の製造方法では、第１の機能部を収納部に対して高精度に位置決めして挿入する必要がなくなる。よって、第３の実施形態によれば、電子モジュールの製造性を向上させることができる。 In the above manufacturing method, it is not necessary to position and insert the first functional part with high accuracy relative to the storage part. Therefore, according to the third embodiment, the manufacturability of the electronic module can be improved.
　上記の記載に基づいて、当業者であれば、本発明の追加の効果や種々の変形を想到できるかもしれないが、本発明の態様は、上述した個々の実施形態に限定されるものではない。異なる実施形態にわたる構成要素を適宜組み合わせてもよい。特許請求の範囲に規定された内容及びその均等物から導き出される本発明の概念的な思想と趣旨を逸脱しない範囲で種々の追加、変更及び部分的削除が可能である。 Based on the above description, those skilled in the art may be able to conceive additional effects and various modifications of the present invention, but the aspects of the present invention are not limited to the individual embodiments described above. . You may combine suitably the component covering different embodiment. Various additions, modifications, and partial deletions can be made without departing from the concept and spirit of the present invention derived from the contents defined in the claims and equivalents thereof.
１，２，３　電子モジュール
１０　第１の機能部
１１　第１の基板
１１ａ　絶縁基材
１１ｂ，１１ｃ　導体層
１１ｄ　凹部
１１ｅ　熱伝導部材
１２　電子部品
１３　接続端子
１４　貫通孔
２０　第２の機能部
２１　第２の基板
２２　電子部品
２３　外部接続端子
２４　貫通孔
３０　ヒートシンク
３１　ベースプレート
３１ａ１，３１ａ２，３１ａ３　収納部
３１ｂ　主面
３１ｃ，３１ｄ，３１ｅ　側面
３２　フィン
３３　溝部
３４　貫通孔
３５　ネジ穴
３６　ヒートシンク本体
３６ａ　凹部
３６ｂ　上面
３６ｃ，３６ｄ　側面
３７　蓋体
３７ａ,３７ｂ　主面
３８　貫通孔
４０　ネジ
１００　レギュレータ
１１０　パワー部
１１１　基板
１１２　電子部品
１１３　接続端子
１２０　制御部
１２１　基板
１２２　電子部品
１２３　外部接続端子
１３０　ヒートシンク
１３１　ベースプレート
１３２　フィン 1, 2, 3 Electronic module 10 First functional part 11 First substrate 11a Insulating base material 11b, 11c Conductive layer 11d Recess 11e Thermal conduction member 12 Electronic component 13 Connection terminal 14 Through hole 20 Second functional part 21 First 2 substrate 22 electronic component 23 external connection terminal 24 through hole 30 heat sink 31 base plate 31a1, 31a2, 31a3 storage part 31b main surface 31c, 31d, 31e side surface 32 fin 33 groove part 34 through hole 35 screw hole 36 heat sink body 36a concave part 36b upper surface 36c, 36d Side surface 37 Cover body 37a, 37b Main surface 38 Through hole 40 Screw 100 Regulator 110 Power unit 111 Substrate 112 Electronic component 113 Connection terminal 120 Control unit 121 Substrate 122 Electronic component 123 External connection terminal 130 Heat sink 131 Base plate 132 Fin

Claims (15)

  1. 　第１の基板と、前記第１の基板に実装された電子部品とを有する第１の機能部と、
    　第２の基板と、前記第２の基板に実装された電子部品が実装された第２の基板とを有し、前記第１の機能部に電気的に接続された第２の機能部と、
    　前記第１および第２の機能部を冷却するヒートシンクと、を備え、
    　前記ヒートシンクは、内部に収納部が設けられたベースプレートを有し、
    　前記第１の機能部は、前記第１の基板が前記ベースプレートの前記収納部の内壁面に接するように前記収納部内に収納され、
    　前記第２の機能部は、前記第２の基板が前記ベースプレートの主面に接するように前記ベースプレート上に固定されている、ことを特徴とする電子モジュール。     A first functional unit having a first substrate and an electronic component mounted on the first substrate;
    A second functional unit having a second substrate and a second substrate on which an electronic component mounted on the second substrate is mounted, and electrically connected to the first functional unit;
    A heat sink for cooling the first and second functional units,
    The heat sink has a base plate provided with a storage portion therein,
    The first functional unit is stored in the storage unit such that the first substrate contacts an inner wall surface of the storage unit of the base plate,
    The electronic module, wherein the second functional unit is fixed on the base plate so that the second substrate is in contact with a main surface of the base plate.
  2. 　前記収納部は、前記ベースプレートの前記主面につながる第１の側面に形成された凹部、または、前記第１の側面から前記第１の側面と反対側の第２の側面まで貫通する貫通孔からなることを特徴とする請求項１に記載の電子モジュール。 The storage portion includes a recess formed in a first side surface connected to the main surface of the base plate, or a through-hole penetrating from the first side surface to a second side surface opposite to the first side surface. The electronic module according to claim 1, wherein
  3. 　前記収納部は、前記ベースプレートの前記主面につながる第１の側面、前記第１の側面と反対側の第２の側面、並びに、前記主面、前記第１の側面および前記第２の側面につながる第３の側面に開口していることを特徴とする請求項１に記載の電子モジュール。 The storage portion includes a first side surface connected to the main surface of the base plate, a second side surface opposite to the first side surface, and the main surface, the first side surface, and the second side surface. The electronic module according to claim 1, wherein the electronic module opens at a third side surface to be connected.
  4. 　前記第１の機能部と前記第２の機能部とを電気的に接続する複数の接続端子が、互いに絶縁されるように、前記ベースプレートの前記主面につながる側面にストライプ状に設けられた複数の溝部にそれぞれ収納されていることを特徴とする請求項１に記載の電子モジュール。 A plurality of connection terminals that electrically connect the first functional unit and the second functional unit are provided in stripes on the side surfaces of the base plate connected to the main surface so as to be insulated from each other. The electronic module according to claim 1, wherein the electronic module is housed in each of the grooves.
  5. 　前記収納部内に収納された前記第１の機能部は、前記ベースプレートの前記主面から前記収納部に達する第１の貫通孔と、前記第１の基板を厚さ方向に貫通する第２の貫通孔とに挿通され、かつ前記収納部の内壁に形成されたネジ穴に螺合するネジにより、前記ヒートシンク内に固定されていることを特徴とする請求項１に記載の電子モジュール。 The first functional part housed in the housing part includes a first through hole reaching the housing part from the main surface of the base plate, and a second through hole penetrating the first substrate in the thickness direction. The electronic module according to claim 1, wherein the electronic module is fixed in the heat sink by a screw inserted into a hole and screwed into a screw hole formed in an inner wall of the storage portion.
  6. 　前記ネジが前記第２の基板を厚さ方向に貫通する貫通孔に挿通されることにより、前記第２の機能部は前記ベースプレート上に固定されていることを特徴とする請求項５に記載の電子モジュール。 The said 2nd function part is being fixed on the said baseplate by the said screw being penetrated by the through-hole which penetrates a said 2nd board | substrate in the thickness direction, The said base plate is characterized by the above-mentioned. Electronic module.
  7. 　前記ヒートシンクは、
    　表面に凹部が形成されたヒートシンク本体と、
    　第１の主面と、前記第１の主面と反対側の第２の主面とを有する蓋体と、を有し、
    　前記蓋体は、前記第１の主面が前記ヒートシンク本体の前記表面に接し且つ前記凹部を覆うように、前記ヒートシンク本体に取付けられ、前記凹部とともに前記収納部を構成し、前記第２の機能部は、前記蓋体の前記第２の主面に固定されていることを特徴とする請求項１に記載の電子モジュール。     The heat sink is
    A heat sink body with a recess formed on the surface;
    A lid having a first main surface and a second main surface opposite to the first main surface;
    The lid is attached to the heat sink body so that the first main surface is in contact with the surface of the heat sink body and covers the recess, and constitutes the storage portion together with the recess, and the second function The electronic module according to claim 1, wherein the portion is fixed to the second main surface of the lid.
  8. 　前記第１の機能部は、前記蓋体の前記第１の主面に固定されていることを特徴とする請求項７に記載の電子モジュール。 The electronic module according to claim 7, wherein the first functional unit is fixed to the first main surface of the lid.
  9. 　前記第１の機能部と前記第２の機能部とを電気的に接続する複数の接続端子は、互いに絶縁されるように、前記蓋体を厚さ方向に貫通する貫通孔に挿通されていることを特徴とする請求項７に記載の電子モジュール。 The plurality of connection terminals that electrically connect the first functional unit and the second functional unit are inserted into through holes that penetrate the lid in the thickness direction so as to be insulated from each other. The electronic module according to claim 7.
  10. 　前記収納部は前記ヒートシンク本体の前記凹部と前記蓋体とにより密閉され、前記第１の機能部は、前記ヒートシンク内に密閉状態に収納されていることを特徴とする請求項７に記載の電子モジュール。 The electronic device according to claim 7, wherein the storage unit is sealed by the recess of the heat sink body and the lid, and the first functional unit is stored in a sealed state in the heat sink. module.
  11. 　前記第１の機能部は、前記第１の機能部に入力された入力電力を所望の出力電力に変換するパワー部であり、前記第２の機能部は、前記パワー部を制御する制御部であることを特徴とする請求項１に記載の電子モジュール。 The first functional unit is a power unit that converts input power input to the first functional unit into desired output power, and the second functional unit is a control unit that controls the power unit. The electronic module according to claim 1, wherein the electronic module is provided.
  12. 　前記第１の基板は、熱伝導部材を介して前記ベースプレートの前記収納部の内壁面に接していることを特徴とする請求項１に記載の電子モジュール。 The electronic module according to claim 1, wherein the first substrate is in contact with an inner wall surface of the storage portion of the base plate via a heat conductive member.
  13. 　前記収納部の内壁面に対向する前記第１の基板の主面に凹部が設けられ、熱伝導部材が前記収納部の内壁面に接するように前記凹部に配置されていることを特徴とする請求項１に記載の電子モジュール。 A concave portion is provided on a main surface of the first substrate facing an inner wall surface of the storage portion, and a heat conducting member is disposed in the concave portion so as to contact the inner wall surface of the storage portion. Item 2. The electronic module according to Item 1.
  14. 　電子部品が実装された第１の基板を有する第１の機能部と、電子部品が実装された第２の基板を有する第２の機能部と、ベースプレートを有し、前記第１および第２の機能部を冷却するヒートシンクとを備える電子モジュールの製造方法であって、
    　前記第１の機能部を、前記ベースプレートの前記主面につながる第１の側面、前記第１の側面と反対側の第２の側面、並びに、前記主面、前記第１の側面および前記第２の側面につながる第３の側面に開口する収納部内にスライドさせ、前記第１の基板が前記収納部の内壁面に接するように前記収納部内に収納する工程と、
    　前記第２の機能部を、前記第２の基板が前記ベースプレートの前記主面に接するように前記ベースプレート上に固定する工程と、
    　を備えることを特徴とする電子モジュールの製造方法。     A first functional unit having a first substrate on which an electronic component is mounted; a second functional unit having a second substrate on which the electronic component is mounted; and a base plate. A method of manufacturing an electronic module comprising a heat sink for cooling a functional unit,
    The first functional unit includes a first side surface connected to the main surface of the base plate, a second side surface opposite to the first side surface, and the main surface, the first side surface, and the second side surface. Slid into the storage portion that opens to the third side surface connected to the side surface of the storage portion, and the first substrate is stored in the storage portion so as to contact the inner wall surface of the storage portion;
    Fixing the second functional unit on the base plate so that the second substrate is in contact with the main surface of the base plate;
    An electronic module manufacturing method comprising:
  15. 　電子部品が実装された第１の基板を有する第１の機能部と、電子部品が実装された第２の基板を有する第２の機能部と、ヒートシンク本体および蓋体を有し、前記第１および第２の機能部を冷却するヒートシンクとを備える電子モジュールの製造方法であって、
    　前記第１の機能部を、前記第１の基板が前記蓋体の一方の主面に接するように前記蓋体に固定する工程と、
    　前記第１の機能部が前記ヒートシンク本体に設けられた凹部に収納されるように、前記蓋体を前記ヒートシンク本体に取付ける工程と、
    　前記第２の機能部を、前記第２の基板が前記蓋体の他方の主面に接するように前記蓋体に固定する工程と、
    　を備えることを特徴とする電子モジュールの製造方法。     A first functional unit having a first substrate on which an electronic component is mounted; a second functional unit having a second substrate on which the electronic component is mounted; a heat sink body; and a lid. And a method of manufacturing an electronic module comprising a heat sink for cooling the second functional unit,
    Fixing the first functional unit to the lid so that the first substrate is in contact with one main surface of the lid;
    Attaching the lid to the heat sink body such that the first functional part is housed in a recess provided in the heat sink body;
    Fixing the second functional unit to the lid so that the second substrate is in contact with the other main surface of the lid;
    An electronic module manufacturing method comprising:
PCT/JP2013/055577 2013-02-28 2013-02-28 Electronic module and production method for same WO2014132424A1 (en)

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