WO2014106276A2 - Dispositif d'imagerie infrarouge ayant un obturateur - Google Patents

Dispositif d'imagerie infrarouge ayant un obturateur Download PDF

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Publication number
WO2014106276A2
WO2014106276A2 PCT/US2013/078551 US2013078551W WO2014106276A2 WO 2014106276 A2 WO2014106276 A2 WO 2014106276A2 US 2013078551 W US2013078551 W US 2013078551W WO 2014106276 A2 WO2014106276 A2 WO 2014106276A2
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WO
WIPO (PCT)
Prior art keywords
infrared
paddle
housing
imaging module
infrared imaging
Prior art date
Application number
PCT/US2013/078551
Other languages
English (en)
Other versions
WO2014106276A3 (fr
Inventor
Theodore R. HOELTER
Joseph Kostrzewa
Pierre Boulanger
Barbara Sharp
Eric A. KURTH
Nicholas HÖGASTEN
Katrin Strandemar
Original Assignee
Flir Systems, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/966,052 external-priority patent/US9473681B2/en
Priority claimed from US14/099,818 external-priority patent/US9723227B2/en
Priority claimed from US14/101,245 external-priority patent/US9706139B2/en
Priority claimed from US14/101,258 external-priority patent/US9723228B2/en
Priority claimed from US14/138,040 external-priority patent/US9451183B2/en
Priority claimed from US14/138,058 external-priority patent/US10244190B2/en
Priority claimed from US14/138,052 external-priority patent/US9635285B2/en
Priority to CN201390001132.5U priority Critical patent/CN205175557U/zh
Application filed by Flir Systems, Inc. filed Critical Flir Systems, Inc.
Publication of WO2014106276A2 publication Critical patent/WO2014106276A2/fr
Publication of WO2014106276A3 publication Critical patent/WO2014106276A3/fr
Priority to CN201480076762.8A priority patent/CN106068446B/zh
Priority to PCT/US2014/073096 priority patent/WO2015103446A2/fr
Priority to KR1020167021120A priority patent/KR102418369B1/ko
Priority to PCT/US2014/073098 priority patent/WO2015103448A2/fr
Priority to US14/747,865 priority patent/US10389953B2/en
Priority to US16/511,365 priority patent/US10996542B2/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/0295—Nulling devices or absolute detection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0803—Arrangements for time-dependent attenuation of radiation signals
    • G01J5/0804—Shutters
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0803—Arrangements for time-dependent attenuation of radiation signals
    • G01J5/0805—Means for chopping radiation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0806—Focusing or collimating elements, e.g. lenses or concave mirrors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/20—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/52—Radiation pyrometry, e.g. infrared or optical thermometry using comparison with reference sources, e.g. disappearing-filament pyrometer
    • G01J2005/526—Periodic insertion of emissive surface

Definitions

  • One or more embodiments of the invention relate generally to infrared imaging devices and more particularly, for example, to infrared imaging devices having a shutter.
  • Some infrared imaging devices may be equipped with a shutter that may be used for calibration and other purposes.
  • Conventional shutters for infrared imaging devices are often situated in an optical path between an optical element (e.g., a lens) and infrared sensors of the infrared imaging devices.
  • an optical element e.g., a lens
  • infrared sensors of the infrared imaging devices e.g., a laser
  • such an arrangement of the shutter also blocks out-of- field (e.g., emitted by a housing and/or a lens barrel enclosing the optical element) infrared radiation, and thus does not allow compensating for such out-of-field infrared radiation to achieve a more accurate calibration.
  • the increased space requirements may be problematic especially for small form factor infrared imaging devices designed to be integrated into small electronic devices such as mobile phones.
  • a shutter assembly may be provided for an infrared imaging module to selectively block external infrared radiation from reaching infrared sensors of the infrared imaging module.
  • the shutter assembly may comprise a paddle situated external to an optical element (e.g., lens) and adapted to be selectively moved by an actuator to substantially block external infrared radiation from entering the optical element.
  • an optical element e.g., lens
  • the shutter assembly may be stacked relative to a housing of the infrared imaging module without excessively increasing the overall profile of the infrared imaging module.
  • a temperature sensor may be provided on the paddle, on a shutter assembly body, or within the housing to permit an accurate measurement of a temperature associated with the paddle for calibration and other purposes.
  • one or more conductive traces may be formed on interior and/or exterior surfaces of the housing to facilitate passing of electrical signals to and/or from components of the shutter assembly, according to some embodiments.
  • a system in one embodiment, includes an infrared imaging module comprising: an infrared sensor assembly having infrared sensors and adapted to capture image frames; and a shutter assembly comprising: a paddle adapted to selectively block external infrared radiation from reaching the infrared sensors, and an actuator adapted to selectively move the paddle in response to a control signal to block external infrared radiation from reaching the infrared sensors.
  • a method in another embodiment, includes selectively moving a paddle to block external infrared radiation from reaching infrared sensors of an infrared sensor assembly; capturing, using the infrared sensor assembly, image frames of infrared radiation emitted from the paddle; wherein the paddle is selectively moved by an actuator in response to a control signal; wherein the paddle and the actuator are part of a shutter assembly; and wherein the shutter assembly and the infrared sensor assembly are part of an infrared imaging module.
  • Fig. 1 illustrates an infrared imaging module configured to be implemented in a host device in accordance with an embodiment of the disclosure.
  • Fig. 2 illustrates an assembled infrared imaging module in accordance with an embodiment of the disclosure.
  • Fig. 3 illustrates an exploded view of an infrared imaging module juxtaposed over a socket in accordance with an embodiment of the disclosure.
  • Fig. 4 illustrates an example implementation of an optical element that may be implemented in an infrared imaging module in accordance with an embodiment of the disclosure.
  • Figs. 5A-E illustrate cross-sectional views of infrared imaging modules implemented with several form factors in accordance with various embodiments of the disclosure.
  • Figs. 5F-P illustrate additional views of infrared imaging modules implemented with several form factors in accordance with various embodiments of the disclosure.
  • Figs. 6-8 illustrate infrared imaging modules implemented with several topologies in accordance with various embodiments of the disclosure.
  • Figs. 9A-B illustrate an infrared imaging module installed in a socket in accordance with various embodiments of the disclosure.
  • Fig. 10A illustrates the infrared imaging module of Fig. 9A removed from the socket in accordance with an embodiment of the disclosure.
  • Fig. 10B illustrates the infrared imaging module of Fig. 9A with a cover of a housing shown in semi-transparent form to reveal a metal layer of the housing in accordance with an embodiment of the disclosure.
  • Fig. IOC illustrates the infrared imaging module of Fig. 9A with the cover and the metal layer both shown in semi-transparent form to reveal several components enclosed by the housing in accordance with an embodiment of the disclosure.
  • Figs. 1 1 A-B illustrate the infrared imaging module of Fig. 9A with the housing removed in accordance with various embodiments of the disclosure.
  • Figs. 12A-D illustrate several views of the housing of the infrared imaging module of Fig. 9A having an interior metal layer in accordance with various embodiments of the disclosure.
  • Fig. 12E illustrates a housing having interior and exterior metal layers in accordance with an embodiment of the disclosure.
  • Fig. 13 illustrates a cross section of housing 120 taken at line 1 3-13 of Fig. 12B in accordance with an embodiment of the disclosure.
  • Fig. 14 illustrates a process for manufacturing the infrared imaging module of Fig. 9A in accordance with an embodiment of the disclosure.
  • Figs. 15A-15C illustrate various views of an infrared imaging module having a shutter assembly in accordance with an embodiment of the disclosure.
  • Figs. 16A-16D illustrate various views of the shutter assembly of Figs. 15A-15C in accordance with an embodiment of the disclosure.
  • Figs. 17A-17C illustrate various views of an infrared imaging module having a shutter assembly in accordance with another embodiment of the disclosure.
  • Figs. 18A-18C illustrate various views of an infrared imaging module having a shutter assembly and a housing with conductive traces provided on one or more exterior surfaces in accordance with an embodiment of the disclosure.
  • Fig. 19 illustrates a bottom perspective view of the shutter assembly of Figs. 18A- 18C in accordance with an embodiment of the disclosure.
  • Figs. 20A-20B illustrate various views of an infrared imaging module having a shutter assembly and a housing with conductive traces provided on exterior and interior surfaces in accordance with an embodiment of the disclosure.
  • Fig. 21 illustrates a shutter assembly in accordance with an embodiment of the disclosure.
  • Fig. 22 illustrates the shutter assembly of Fig. 21 positioned for assembly as part of infrared imaging module in accordance with an embodiment of the disclosure.
  • Figs. 23A-B illustrate various views of an infrared imaging module with the shutter of Fig. 21 installed and shown in semi-transparent form to illustrate contacts of the shutter engaged with pads on an external surface of a housing in accordance with various embodiments of the disclosure.
  • Fig. 24 illustrates a flowchart a process to capture image data of a uniform irradiance scene using an infrared imaging module having a shutter assembly in accordance with an embodiment of the disclosure.
  • Fig. 1 illustrates an infrared imaging module 100 (e.g., an infrared camera or an infrared imaging device) configured to be implemented in a host device 102 in accordance with an embodiment of the disclosure.
  • Infrared imaging module 100 may be implemented, for one or more embodiments, with a small form factor and in accordance with wafer level packaging techniques along with other novel infrared camera packaging techniques as discussed herein.
  • infrared imaging module 100 may be configured to be implemented in a small portable host device 102, such as a mobile telephone, a tablet computing device, a laptop computing device, a personal digital assistant, a visible light camera, a music player, or any other appropriate device.
  • infrared imaging module 100 may be used to provide infrared imaging features to host device 102.
  • infrared imaging module 100 may be configured to capture, process, and/or otherwise manage infrared images and provide such infrared images to host device 102 for use in any desired fashion (e.g., for further processing, to store in memory, to display, to use by various applications running on host device 102, to export to other devices, or other uses).
  • infrared imaging module 100 may be configured to operate at low voltage levels and over a wide temperature range.
  • infrared imaging module 100 may operate using a power supply of approximately 2.4 volts, 2.5 volts, 2.8 volts, or lower voltages, and operate over a temperature range of approximately -20 degrees C to approximately +60 degrees C (e.g., providing a suitable dynamic range and performance over approximately 80 degrees C).
  • infrared imaging module 100 may experience reduced amounts of self heating in comparison with other types of infrared imaging devices. As a result, infrared imaging module 100 may be operated without requiring significant additional measures to compensate for such self heating.
  • host device 102 may include a socket 104, a shutter 105, a processor 195, a memory 196, a display 197, and/or other components 198.
  • Socket 104 may be configured to receive infrared imaging module 100 as identified by arrow 101.
  • Fig. 2 illustrates infrared imaging module 100 assembled in socket 104 in accordance with an embodiment of the disclosure.
  • Processor 195 may be implemented as any appropriate processing device (e.g., logic device, microcontroller, processor, application specific integrated circuit (ASIC), or other device) that may be used by host device 102 to execute appropriate instructions, such as software instructions provided in memory 196.
  • Display 197 may be used to display captured and/or processed infrared images and/or other images, data, and information.
  • Other components 198 may be used to implement any features of host device 102 as may be desired for various applications (e.g., a visible light camera or other components).
  • infrared imaging module 100 and socket 104 may be implemented for mass production to facilitate high volume applications, such as for implementation in mobile telephones or other devices (e.g., requiring small form factors).
  • the combination of infrared imaging module 100 and socket 104 may exhibit overall dimensions of approximately 8.5 mm by 8.5 mm by 5.9 mm while infrared imaging module 100 is installed in socket 104.
  • FIG. 3 illustrates an exploded view of infrared imaging module 100 juxtaposed over socket 104 in accordance with an embodiment of the disclosure.
  • Infrared imaging module 100 may include a lens barrel 1 10, a housing 120, an infrared sensor assembly 128, a circuit board 170, a base 150, and a processing module 160.
  • Lens barrel 1 10 may at least partially enclose an optical element 180 which is partially visible in Fig. 3 through an aperture 1 12 in lens barrel 1 10.
  • Lens barrel 100 may include a substantially cylindrical extension 1 14 which may be used to interface lens barrel 100 with an aperture 122 in housing 120.
  • Infrared sensor assembly 128 may be implemented, for example, with a cap 130 (e.g., a lid) mounted on a substrate 140.
  • Infrared sensor assembly 128 may include a plurality of infrared sensors 132 (e.g., infrared detectors) implemented in an array or other fashion on substrate 140 and covered by cap 130 (e.g., shown in Figs. 5A-K, 5M-P, and 8).
  • infrared sensor assembly 128 may be implemented as a focal plane array (FPA).
  • FPA focal plane array
  • Such a focal plane array may be implemented, for example, as a vacuum package assembly (e.g., sealed by cap 130 and substrate 140).
  • infrared sensor assembly 128 may be implemented as a wafer level package (e.g., infrared sensor assembly 128 may be singulated from a set of vacuum package assemblies provided on a wafer). In one embodiment, infrared sensor assembly 128 may be implemented to operate using a power supply of approximately 2.4 volts, 2.5 volts, 2.8 volts, or similar voltages. In various embodiments, infrared sensor assembly 128 may be implemented with infrared sensors 132 and any other components as desired.
  • Infrared sensors 132 may be configured to detect infrared radiation (e.g., infrared energy) from a target scene including, for example, mid wave infrared wave bands (MWIR), long wave infrared wave bands (LWIR), and/or other thermal imaging bands as may be desired in particular implementations.
  • infrared sensor assembly 128 may be provided in accordance with wafer level packaging techniques.
  • Infrared sensors 132 may be implemented, for example, as microbolometers or other types of thermal imaging infrared sensors arranged in any desired array pattern to provide a plurality of pixels.
  • infrared sensors 132 may be implemented as vanadium oxide (VOx) detectors with a 17 ⁇ pixel pitch.
  • VOx vanadium oxide
  • arrays of approximately 32 by 32 infrared sensors 132, approximately 64 by 64 infrared sensors 132, approximately 80 by 64 infrared sensors 132, or other array sizes may be used.
  • Substrate 140 may include various circuitry including, for example, a read out integrated circuit (ROIC) with dimensions less than approximately 5.5 mm by 5.5 mm in one embodiment.
  • Substrate 140 may also include bond pads 142 that may be used to contact complementary connections positioned on inside surfaces of housing 120 when infrared imaging module 100 is assembled as shown in Figs. 5 A, 5B, and 5C.
  • the ROIC may be implemented with low-dropout regulators (LDO) to perform voltage regulation to reduce power supply noise introduced to infrared sensor assembly 128 and thus provide an improved power supply rejection ratio (PSRR).
  • LDO low-dropout regulators
  • PSRR power supply rejection ratio
  • Infrared sensor assembly 128 may capture images (e.g., image frames) and provide such images from its ROIC at various rates.
  • Processing module 160 may be used to perform appropriate processing of captured infrared images and may be implemented in accordance with any appropriate architecture.
  • processing module 160 may be implemented as an ASIC.
  • ASIC may be configured to perform image processing with high performance and/or high efficiency.
  • processing module 160 may be implemented with a general purpose central processing unit (CPU) which may be configured to execute appropriate software instructions to perform image processing, coordinate and perform image processing with various image processing blocks, coordinate interfacing between processing module 160 and host device 102, and/or other operations.
  • processing module 160 may be implemented with a field programmable gate array (FPGA).
  • Processing module 160 may be implemented with other types of processing and/or logic circuits in other embodiments as would be understood by one skilled in the art.
  • processing module 160 may also be implemented with other components where appropriate, such as, volatile memory, non-volatile memory, and/or one or more interfaces (e.g., infrared detector interfaces, inter-integrated circuit (I2C) interfaces, mobile industry processor interfaces (M ), joint test action group (JTAG) interfaces (e.g., IEEE 1 149.1 standard test access port and boundary-scan architecture), and/or other interfaces).
  • interfaces e.g., infrared detector interfaces, inter-integrated circuit (I2C) interfaces, mobile industry processor interfaces (M ), joint test action group (JTAG) interfaces (e.g., IEEE 1 149.1 standard test access port and boundary-scan architecture), and/or other interfaces).
  • housing 120 When infrared imaging module 100 is assembled, housing 120 may substantially enclose infrared sensor assembly 128, base 150, and processing module 160. Housing 120 may facilitate connection of various components of infrared imaging module 100. For example, in one embodiment, housing 120 may provide electrical connections 126 to connect various components as further described.
  • Electrical connections 126 may be electrically connected with bond pads 142 when infrared imaging module 100 is assembled.
  • electrical connections 126 may be embedded in housing 120, provided on inside surfaces of housing 120, and/or otherwise provided by housing 120. Electrical connections 126 may terminate in connections 124 protruding from the bottom surface of housing 120 as shown in Fig. 3. Connections 124 may connect with circuit board 170 when infrared imaging module 100 is assembled (e.g., housing 120 may rest atop circuit board 170 as shown in Figs. 5A-C and Figs. 5F-I). Processing module 160 may be electrically connected with circuit board 170 through appropriate electrical connections.
  • infrared sensor assembly 128 may be electrically connected with processing module 160 through, for example, conductive electrical paths provided by: bond pads 142, complementary connections on inside surfaces of housing 120, electrical connections 126 of housing 120, connections 124, and circuit board 170.
  • such an arrangement may be implemented without requiring wire bonds to be provided between infrared sensor assembly 128 and processing module 160.
  • electrical connections 126 in housing 120 may be made from any desired material (e.g., copper or any other appropriate conductive material). In one embodiment, electrical connections 126 may aid in dissipating heat from infrared imaging module 100.
  • Substrate 140 of infrared sensor assembly 128 may be mounted on base 150.
  • base 150 e.g., a pedestal
  • base 150 may be made, for example, of copper formed by metal injection molding (MIM) and provided with a black oxide or nickel-coated finish.
  • base 1 0 may be made of any desired material, such as for example zinc, aluminum, or magnesium, as desired for a given application and may be formed by any desired applicable process, such as for example aluminum casting, MIM, or zinc rapid casting, as may be desired for particular applications.
  • base 150 may be implemented to provide structural support, various circuit paths, thermal heat sink properties, and other features where appropriate.
  • base 150 may be a multi-layer structure implemented at least in part using ceramic material.
  • circuit board 170 may receive housing 120 and thus may physically support the various components of infrared imaging module 100.
  • circuit board 170 may be implemented as a printed circuit board (e.g., an FR4 circuit board or other types of circuit boards), a rigid or flexible interconnect (e.g., tape or other type of interconnects), a flexible circuit substrate, a flexible plastic substrate, or other appropriate structures.
  • base 150 may be implemented with the various features and attributes described for circuit board 170, and vice versa.
  • Socket 104 may include a cavity 106 configured to receive infrared imaging module 100 (e.g., as shown in the assembled view of Fig. 2).
  • Infrared imaging module 100 and/or socket 104 may include appropriate tabs, arms, pins, fasteners, or any other appropriate engagement members which may be used to secure infrared imaging module 100 to or within socket 104 using friction, tension, adhesion, and/or any other appropriate manner.
  • socket 104 may include engagement members 107 that may engage surfaces 109 of housing 120 when infrared imaging module 100 is inserted into a cavity 106 of socket 104.
  • Other types of engagement members may be used in other embodiments.
  • Infrared imaging module 100 may be electrically connected with socket 104 through appropriate electrical connections (e.g., contacts, pins, wires, or any other appropriate connections).
  • socket 104 may include electrical connections 108 which may contact corresponding electrical connections of infrared imaging module 100 (e.g., interconnect pads, contacts, or other electrical connections on side or bottom surfaces of circuit board 170, bond pads 142 or other electrical connections on base 150, or other connections).
  • Electrical connections 108 may be made from any desired material (e.g., copper or any other appropriate conductive material).
  • electrical connections 108 may be mechanically biased to press against electrical connections of infrared imaging module 100 when infrared imaging module 100 is inserted into cavity 106 of socket 104. In one embodiment, electrical connections 108 may at least partially secure infrared imaging module 100 in socket 104. Other types of electrical connections may be used in other embodiments.
  • Socket 104 may be electrically connected with host device 102 through similar types of electrical connections.
  • host device 102 may include electrical connections (e.g., soldered connections, snap-in connections, or other connections) that connect with electrical connections 108 passing through apertures 190 as shown in Figs. 2-3 and 5A-P.
  • electrical connections may be made to the sides and/or bottom of socket 104.
  • Various components of infrared imaging module 100 may be implemented with flip chip technology which may be used to mount components directly to circuit boards without the additional clearances typically needed for wire bond connections. Flip chip connections may be used, as an example, to reduce the overall size of infrared imaging module 100 for use in compact small form factor applications.
  • processing module 160 may be mounted to circuit board 170 using flip chip connections.
  • flip chip connections For example, in Figs. 5A-C, 5F-I, and 5L (further described herein), infrared imaging module 100 may be implemented with such flip chip configurations.
  • infrared imaging module 100 and/or associated components may be implemented in accordance with various techniques (e.g., wafer level packaging techniques) as set forth in U.S. Patent Application No. 12/844,124 filed July 27, 2010, and U.S. Provisional Patent Application No. 61/469,651 filed March 30, 201 1, which are incorporated herein by reference in their entirety.
  • infrared imaging module 100 and/or associated components may be implemented, calibrated, tested, and/or used in accordance with various techniques, such as for example as set forth in U.S. Patent No. 7,470,902 issued December 30, 2008, U.S. Patent No. 6,028,309 issued February 22, 2000, U.S. Patent No.
  • Fig. 4 illustrates an example implementation of optical element 180 that may be implemented in infrared imaging module 100 in accordance with an embodiment of the disclosure.
  • optical element 180 may be implemented as a silicon etched wafer level single element optic in accordance with various dimensions shown in Fig. 4.
  • optical element 180 may be implemented substantially as a cube, but with two slightly convex faces on faces providing apertures.
  • optical element 180 may include a physical aperture 182 and a smaller clear aperture 184.
  • Optical element 180 allows through the desired infrared wavelengths to infrared sensor assembly 128.
  • optical element 180 may be a single etched wafer level optical element made of silicon with the following specifications: image plane of 0.54 mm by 0.54 mm (e.g., when implemented for an infrared sensor assembly 128 having a 32 by 32 array of infrared sensors 132 with 17 ⁇ pixel pitch); horizontal field of view (FoV) of approximately 55.7 degrees; F/# approximately equal to 0.91 ; modulated transfer function (MTF) of approximately 0.46 at 29 cy/mm; an anti-reflective coating with less than approximately two percent loss per surface; and focused at infinity.
  • image plane of 0.54 mm by 0.54 mm (e.g., when implemented for an infrared sensor assembly 128 having a 32 by 32 array of infrared sensors 132 with 17 ⁇ pixel pitch); horizontal field of view (FoV) of approximately 55.7 degrees; F/# approximately equal to 0.91 ; modulated transfer function (MTF) of approximately 0.46 at 29 cy/mm; an anti-reflective coating with less than
  • optical element 180 may be integrated as part of a wafer level package that includes infrared sensor assembly 128.
  • optical element 180 may be implemented as part of cap 130, stacked on various components of infrared sensor assembly 128 (e.g., with appropriate spacers provided therebetween), or otherwise integrated with various components of infrared sensor assembly 128.
  • host device 102 may include other components 198 such as a non-thermal camera (e.g., a visible light camera or other type of non-thermal imager).
  • the non-thermal camera may be a small form factor imaging module or imaging device, and may, in some embodiments, be implemented in a manner similar to the various embodiments of infrared imaging module 100 disclosed herein, with one or more sensors and/or sensor arrays responsive to radiation in non-thermal spectrums (e.g., radiation in visible light wavelengths, ultraviolet wavelengths, and/or other non-thermal wavelengths).
  • the non-thermal camera may be implemented with a charge-coupled device (CCD) sensor, an electron multiplying CCD (EMCCD) sensor, a complementary metal- oxide-semiconductor (CMOS) sensor, a scientific CMOS (sCMOS) sensor, or other filters and/or sensors.
  • CCD charge-coupled device
  • EMCD electron multiplying CCD
  • CMOS complementary metal- oxide-semiconductor
  • sCMOS scientific CMOS
  • the non-thermal camera may be co-located with infrared imaging module 100 and oriented such that a field-of-view (FOV) of the non-thermal camera at least partially overlaps a FOV of infrared imaging module 100.
  • infrared imaging module 100 and a non-thermal camera may be implemented as a dual sensor module sharing a common substrate according to various techniques described in U.S. Provisional
  • various components may be configured to superimpose, fuse, blend, or otherwise combine infrared images (e.g., including thermal images) captured by infrared imaging module 100 and non-thermal images (e.g., including visible light images) captured by a non-thermal camera, whether captured at substantially the same time or different times (e.g., time-spaced over hours, days, daytime versus nighttime, and/or otherwise).
  • thermal and non-thermal images may be processed to generate combined images (e.g., one or more processes performed on such images in some embodiments). For example, scene-based NUC processing may be performed (as further described herein), true color processing may be performed, and/or high contrast processing may be performed.
  • thermal images may be blended with non-thermal images by, for example, blending a radiometric component of a thermal image with a corresponding component of a non-thermal image according to a blending parameter, which may be adjustable by a user and/or machine in some embodiments.
  • luminance or chrominance components of the thermal and non-thermal images may be combined according to the blending parameter.
  • such blending techniques may be referred to as true color infrared imagery.
  • a blended image may comprise a non-thermal color image, which includes a luminance component and a chrominance component, with its luminance value replaced and/or blended with the luminance value from a thennal image.
  • the use of the luminance data from the thermal image causes the intensity of the true non-thermal color image to brighten or dim based on the temperature of the object.
  • these blending techniques provide thermal imaging for daytime or visible light images.
  • high spatial frequency content may be obtained from one or more of the thermal and non-thermal images (e.g., by performing high pass filtering, difference imaging, and/or other techniques).
  • a combined image may include a radiometric component of a thermal image and a blended component including infrared (e.g., thermal) characteristics of a scene blended with the high spatial frequency content, according to a blending parameter, which may be adjustable by a user and/or machine in some embodiments.
  • high spatial frequency content from non-thermal images may be blended with thermal images by superimposing the high spatial frequency content onto the thermal images, where the high spatial frequency content replaces or overwrites those portions of the thermal images corresponding to where the high spatial frequency content exists.
  • the high spatial frequency content may include edges of objects depicted in images of a scene, but may not exist within the interior of such objects.
  • blended image data may simply include the high spatial frequency content, which may subsequently be encoded into one or more components of combined images.
  • a radiometric component of thermal image may be a chrominance component of the thermal image
  • the high spatial frequency content may be derived from the luminance and/or chrominance components of a non-thermal image.
  • a combined image may include the radiometric component (e.g., the chrominance component of the thermal image) encoded into a chrominance component of the combined image and the high spatial frequency content directly encoded (e.g., as blended image data but with no thermal image contribution) into a luminance component of the combined image.
  • blended image data may include the high spatial frequency content added to a luminance component of the thermal images, and the resulting blended data encoded into a luminance component of resulting combined images.
  • any of the techniques disclosed in the following applications may be used in various embodiments: U.S. Patent Application No. 12/477,828 filed June 3, 2009; U.S. Patent Application No. 12/766,739 filed April 23, 2010; U.S. Patent Application No. 13/105,765 filed May 1 1 , 201 1 ; U.S. Patent Application No. 13/437,645 filed April 2, 2012; U.S. Provisional Patent Application No. 61/473,207 filed April 8, 201 1 ; U.S. Provisional Patent Application No. 61/746,069 filed December 26, 2012; U.S. Provisional Patent Application No. 61/746,074 filed December 26, 2012; U.S. Provisional Patent Application No. 61/748,018 filed December 31, 2012; U.S. Provisional Patent Application No.
  • host device 102 may include shutter 105.
  • shutter 105 may be selectively positioned over socket 104 (e.g., as identified by arrows 103) while infrared imaging module 100 is installed therein.
  • shutter 105 may be used, for example, to protect infrared imaging module 100 when not in use.
  • Shutter 105 may also be used as a temperature reference as part of a calibration process (e.g., a non-uniformity correction (NUC) process or other calibration processes) for infrared imaging module 100 as would be understood by one skilled in the art.
  • NUC non-uniformity correction
  • shutter 105 may be made from various materials such as, for example, polymers, glass, or other materials.
  • shutter 105 may include one or more coatings to selectively filter electromagnetic radiation and/or adjust various optical properties of shutter 105 (e.g., a uniform blackbody coating or a reflective gold coating).
  • shutter 105 may be fixed in place to protect infrared imaging module 100 at all times.
  • shutter 105 or a portion of shutter 105 may be made from appropriate materials (e.g., polymers) that do not substantially filter desired infrared wavelengths.
  • a shutter may be implemented as part of infrared imaging module 100 (e.g., within or as part of a lens barrel or other components of infrared imaging module 100), as would be understood by one skilled in the art.
  • a shutter e.g., shutter 105 or other type of external or internal shutter
  • FIGs. 5 A-E illustrate cross-sectional views of infrared imaging modules 100 implemented with several form factors in accordance with various embodiments of the disclosure.
  • each of Figs. 5A-E shows a cross-sectional view of an infrared imaging module 100 while installed in a corresponding socket 104, and another cross- sectional view of the same infrared imaging module 100 but separated from its corresponding socket 104.
  • FIGS. 5A-E show a variety of physical implementations of various components identified in Figs. 1 -4.
  • Fig. 5A shows a physical implementation of infrared imaging module 100 and socket 104 corresponding to the embodiments illustrated in Figs. 2-3
  • Figs. 5B-E show other examples of physical implementations.
  • electrical connections 126 may be provided in housing 120 as discussed to infrared sensor assembly 128 and circuit board 170.
  • wire bonds 143 and 145 may be used to connect infrared sensor assembly 128 to processing module 160.
  • wire bonds 143 and 145 may pass through base 150.
  • wire bonds 143 and 145 may connect to circuitry in base 150 without passing through base 150.
  • wire bonds 143 and 145 may connect to electrical connections 147 to provide electrical connections between various portions of infrared imaging module 100 to socket 104 and/or host device 102.
  • sockets 104 shown in Figs. 5A-E may be implemented as mobile telephone camera sockets available from, for example, Molex® Incorporated of Lisle, Illinois in accordance with various part numbers identified in Table 1 below. Table 1 further identifies various example aspects of sockets 104 shown in Figs. 5A-E.
  • Figs. 5F-P illustrate additional views of infrared imaging module 100 implemented with several form factors in accordance with various embodiments of the disclosure.
  • Fig. 5F illustrates an embodiment of infrared imaging module 100 similar to Fig. 5A.
  • electrical connections 126 are shown on an inside surface of housing 120.
  • electrical connections 108 are depicted in a contrasting color for further clarity.
  • electrical connections 147 are shown on side surfaces of circuit board 170 which may connect to electrical connections 108.
  • Fig. 5G illustrates an embodiment of infrared imaging module 100 similar to Fig. 5A with electrical connections 108 depicted in a contrasting color for further clarity on a bottom surface of socket 104 which may be used to interface with appropriate connections of host device 102.
  • Fig. 5H illustrates an embodiment of infrared imaging module 100 similar to Fig. 5C.
  • electrical connections 126 are shown on an inside surface of housing 120.
  • electrical connections 108 are depicted in a contrasting color for further clarity.
  • Fig. 51 illustrates an embodiment of infrared imaging module 100 that provides another view of the embodiment shown in Fig. 5H.
  • contacts 172 are shown on a bottom surface of circuit board 170 which may contact electrical connections 108 when infrared imaging module 100 is inserted into socket 104. Accordingly, it will be appreciated that the various components of infrared imaging module 100 may be electrically connected to host device 102 through contacts 172 and electrical connections 108.
  • Fig. 5 J illustrates an embodiment of infrared imaging module 100 similar to Fig. 5D and with socket 104 similar to that illustrated in Fig. 5E.
  • electrical connections 108 are depicted in a contrasting color for further clarity.
  • electrical connections 147 are shown on side surfaces of circuit board 170 which may connect to electrical connections 108.
  • Fig. 5K illustrates an embodiment of infrared imaging module 100 that provides another view of the embodiment shown in Fig. 5 J.
  • electrical connections 147 are further shown on bottom surfaces of circuit board 170 which may connect with appropriate electrical connections 108.
  • Fig. 5L illustrates several embodiments of infrared imaging module 100 in exploded views.
  • electrical connections 126 are shown on an inside surface of housing 120.
  • electrical connections 147 are shown on side surfaces of circuit board 170 which may connect to electrical connections 108.
  • electrical connections 108 are depicted in a contrasting color for further clarity inside socket and also on a bottom surface of socket 104 which may be used to interface with infrared imaging module 100 and host device 102.
  • Fig. 5M illustrates an embodiment of infrared imaging module 100 implemented with various components of infrared sensor assembly 128 (e.g., cap 130 and substrate 140) having a substantially uniform width.
  • infrared sensor assembly 128 e.g., cap 130 and substrate 140
  • substrate 140 may be implemented with a split (e.g., multi-layer) implementation with the ROIC provided on one or both layers and connected to other circuitry of substrate 140 through the layers (e.g., through appropriate silicon vias or other connections).
  • split e.g., multi-layer
  • substrate 140 may be connected to base 150 through solder balls 144 (e.g., to implement flip chip mounting), and processing module 160 may be connected to base 150 through wire bonds 145.
  • Fig. 5N illustrates an embodiment of infrared imaging module 100 that provides another view of the embodiment shown in Fig. 5M.
  • Fig. 50 illustrates an embodiment of infrared imaging module 100 with infrared sensor assembly 128 implemented in a similar fashion as Figs. 5M-N.
  • processing module 160 may be integrated as part of substrate 140.
  • Fig. 5P illustrates an embodiment of infrared imaging module 100 that provides another view of the embodiment shown in Fig. 50.
  • Fig. 5P further illustrates electrical connections 108 on a bottom surface of socket 104.
  • FIG. 6-8 illustrate infrared imaging modules 100 implemented with several topologies in accordance with various embodiments of the disclosure.
  • FIG. 6 illustrates infrared imaging module 100 after encapsulation.
  • FIG. 7 illustrates infrared imaging module 100 with processing module 160 mounted on circuit board 170 and external to housing 120 to provide a lower overall profile for imaging module 100.
  • Fig. 8 illustrates infrared imaging module 100 of Fig. 7 with housing 120 shown transparent for purposes of illustrating examples of cap 130, an array of infrared sensors 132, and wire bonds 143. As shown in Fig. 8, various components of infrared sensor assembly 128 may be connected to circuit board 170 through wire bonds 143.
  • housing 120 may be implemented with a substantially non-metal cover configured to substantially or completely enclose various components of infrared imaging module 100.
  • One or more metal layers may be disposed on various interior and/or exterior surfaces of the cover (e.g., a plurality, a majority, substantially all, or all of such surfaces).
  • Such implementations may be used to reduce the effects of various environmental conditions which may otherwise adversely affect the performance of infrared imaging module 100.
  • one or more conductive traces e.g., electrical connections
  • housing 120 may be implemented with a substantially non-metal cover configured to substantially or completely enclose various components of infrared imaging module 100.
  • One or more metal layers may be disposed on various interior and/or exterior surfaces of the cover (e.g., a plurality, a majority, substantially all, or all of such surfaces).
  • conductive traces e.g., electrical connections
  • housing 120 may be implemented with a substantially non-metal cover configured to substantially or completely enclose various components of infrare
  • Figs. 9A and 9B illustrate top perspective and bottom perspective views, respectively, of infrared imaging module 100 installed in socket 104 in accordance with various embodiments of the disclosure.
  • infrared imaging module 100 may include housing 120 and lens barrel 110 having aperture 112.
  • socket 104 may include electrical connections 108 which may contact corresponding electrical connections of infrared imaging module 100.
  • Fig. 10A illustrates infrared imaging module 100 removed from socket 104 in accordance with an embodiment of the disclosure.
  • infrared imaging module 100 may include base 150 with electrical connections 147 to connect various portions of infrared imaging module 100 to socket 104 and/or host device 102.
  • housing 120 is shown having a substantially non-metal cover 910 with exposed exterior surfaces.
  • exterior surfaces of housing 120 are not covered by metal layers.
  • Fig. 10B illustrates infrared imaging module 100 with cover 910 of housing 120 shown in semi-transparent form to reveal a metal layer 920 (e.g., a metalized surface) of housing 120 in accordance with an embodiment of the disclosure.
  • metal layer 920 is disposed on substantially all interior surfaces of cover 910.
  • Fig. I OC illustrates infrared imaging module 100 with cover 910 and metal layer 920 both shown in semi-transparent form to reveal several components enclosed by housing 120 in accordance with an embodiment of the disclosure.
  • housing 120 may substantially enclose various components.
  • housing 120 may substantially enclose infrared sensor assembly 128 which may be implemented, for example, with a focal plane array in a vacuum package assembly sealed by cap 130 and substrate 140.
  • housing 120 is illustrated as having a generally square or rectangular shape in Figs. 9A, l OA-C, and 12A-E (further described herein), any desired shape may be used to at least partially or completely enclose one or more desired components of infrared imaging module 100.
  • housing 120 is illustrated as mounted on base 150 in Figs. l OA-C, other mounting configurations are also contemplated. Any desired set of components may be substantially or completely enclosed by housing 120 in various embodiments to seal such components from external environments.
  • Figs. 1 1A-B illustrate infrared imaging module 100 with housing 120 removed in accordance with various embodiments of the disclosure.
  • cap 130 and substrate 140 of infrared sensor assembly 128 are shown mounted on base 150 with a thermal spreader 1 102 (e.g., copper or graphite in some embodiments) therebetween.
  • wire bond contacts 1 104 and 1 106 are shown on substrate 140 and base 150, respectively, to receive wire bonds 143 (not shown in Fig. 11 A).
  • processing module 160 is illustrated as being mounted on an underside of base 150.
  • processing module 160 may be connected to substrate 140 through wire bonds 143 and 145 (not shown in Fig. 1 IB) as previously described.
  • housing 120 may include a cover 910 and one or more metal layers.
  • Cover 910 may be a substantially non-metal cover implemented with material having relatively low thermal conductivity and relatively high emissivity (e.g., emissivity in a range of approximately 0.8 to approximately 0.95 in some embodiments).
  • cover 910 may be comprised substantially of plastic and/or other appropriate material.
  • metal layers 920 may be disposed on various interior and/or exterior (e.g., inside and/or outside) surfaces of cover 910 (e.g., a plurality, a majority, substantially all, or all of such surfaces).
  • metal layer 920 may be disposed on various interior surfaces of cover 910 facing infrared sensor assembly 128 in the manner shown in Figs. 12A-D.
  • metal layer 920 may be disposed on various exterior surfaces of cover 910 that face external components or external
  • interior and exterior metal layers 920 may be used.
  • two metal layers 920 are shown on interior and exterior surfaces, denoted 920A and 920B, respectively.
  • cover 910 may undergo a metalization process in which various metal layers are deposited and/or otherwise provided on cover 910.
  • housing 120 may include various conductive traces 930 that are electrically isolated from metal layer 920.
  • conductive traces 930 may be provided on one or more interior surfaces, one or more exterior surfaces, and/or in walls of cover 910.
  • conductive traces 930 may be used to provide electrical connections between various components within an interior cavity 912 enclosed by housing 120 (e.g., the space occupied by infrared sensor assembly 128 and/or other components) and/or from various components within cavity 912 to an exterior of housing 120.
  • insulating material e.g., having low electrical
  • conductive traces 930 may be substantially surrounded by insulating material.
  • voids e.g., empty spaces
  • voids may be introduced between conductive traces 930 and metal layer 920 such that the substantially non-conductive cover 910 is exposed and effectively insulates conductive traces 930 from metal layer 920.
  • metal layer 920 may be implemented with material having relatively high thermal conductivity, relatively low emissivity (e.g., emissivity in a range of approximately 0.02 to approximately 0.1 1 in some embodiments), and having a tendency to maintain these properties despite exposure to a variety of environmental conditions over several years.
  • metal layer 920 may be implemented as one or more layers disposed on cover 910 (e.g., disposed directly on cover 910 and/or on top of one or more intermediate layers and/or structures). In some embodiments, metal layer 920 may be implemented by a plurality of sublayers of different metals, each of which may have beneficial characteristics to permit the multi-layered implementation to achieve improved performance over a single layer implementation using a single type of metal.
  • a copper sublayer may be provided at low cost which exhibits high thermal conductivity and affixes well to plastic. Such a copper sublayer may oxidize rapidly to a high emissivity and thus may be coated in some embodiments.
  • a nickel sublayer may be provided which maintains low emissivity even after oxidation.
  • a gold sublayer may be expensive to deposit in thick layers and may not affix well to plastic, but exhibits low emissivity and generally resists oxidization.
  • metal layer 920 may exhibit various advantages associated with different types of metals, while also compensating for various performance tradeoffs associated with particular types of metals.
  • Fig. 13 illustrates a cross section of housing 120 taken at line 13-13 of Fig. 12B in accordance with an embodiment of the disclosure
  • metal layer 920 is implemented as a plurality of sublayers on cover 910.
  • metal layer 920 may include: a copper sublayer 922 (e.g., a base sublayer) disposed on cover 910 having a thickness of approximately 10 ⁇ ; a nickel sublayer 924 (e.g., an intermediate sublayer) having a thickness of approximately 6 ⁇ (e.g., or thicker to improve the performance of metal layer 920 in providing electromagnetic interference shielding further described herein); and/or a gold sublayer 926 (e.g., a top sublayer) having a thickness in a range of approximately 0.1 ⁇ to approximately 3 ⁇ .
  • a copper sublayer 922 e.g., a base sublayer
  • nickel sublayer 924 e.g., an intermediate sublayer
  • a gold sublayer 926 e.g., a top sublayer
  • metal layer 920 may be implemented to extend at areas 950 over a lip of cover 910 and onto an outer surface of cover 910. Areas 950 may be used, for example, to electrically connect metal layer 920 to one or more electrical connections 1 1 10 (see Figs. l OA-C and 1 1 A).
  • conductive traces 930 may be implemented to extend at areas 960 over a lip of cover 910 and onto an outer surface of cover. Areas 960 may be used, for example, to electrically connect one or more conductive traces 930 to one or more electrical connections 1108 (see Fig. 11 A).
  • Electrical connections 1 108 and 1 1 10 may be used for various purposes including, for example, grounding, production assembly evaluation, operation (e.g., to transmit and/or receive electrical signals between various components), and/or other purposes as appropriate.
  • conductive epoxy or solder may be provided to secure and electrically connect areas 950 and/or 960 to one or more electrical connections 1 1 10 and/or 1108, respectively.
  • housing 120 may be manufactured in a manner that permits conductive traces 930 and/or other components to be included in or on housing 120.
  • conductive traces 930 may be manufactured as part of metal layer 920.
  • conductive traces 930 may be efficiently provided with metal layer 920 during a metalization operation, and then electrically isolated from the remainder of metal layer 920 by appropriate insulating material or voids.
  • the overall cost of housing 120 may be reduced over conventional approaches using discrete wires/cables to provide electrical connections.
  • conductive traces 930 have be formed as part of a metallization process for metal layer 920 using the same sublayers 922, 924, and 926.
  • Voids in areas 940 may be formed, for example, by masking cover 910 during formation of metal layer 920, etching area 940 after formation, and/or other appropriate techniques.
  • housing 120 may be a molded interconnect device (MID) manufactured in accordance with appropriate injection molding techniques.
  • housing 120 may be implemented with electrical connections (e.g., electrical connections 126 described herein or others as appropriate).
  • various components may be partially or fully embedded (e.g., implanted, formed, or otherwise provided) in housing 120, or mounted on appropriate interior or exterior surfaces of housing 120 using such manufacturing techniques.
  • a temperature measurement component 980 e.g., a thermistor, temperature diode, and/or other appropriate component
  • a temperature measurement component 980 may be provided.
  • Temperature measurement component 980 may also be electrically connected to one or more conductive traces 930 and/or electrical connections 126. As a result, temperature
  • measurement component 980 may provide signals used to accurately measure temperatures associated with housing 120. Such temperatures may include, for example, temperatures of housing 120 itself, temperatures of cavity 912, temperatures of components disposed in cavity 912, and/or other related temperatures.
  • signals from temperature measurement component 980 may be carried by conductive traces 930 and/or electrical connections 126 from the walls of housing 120 or cavity 912 to appropriate components external to housing 120 and/or appropriate components of infrared imaging module 100 for processing.
  • Such temperature measurements may be used to more accurately determine radiation contributions from out-of-field sources, improve the thermographic accuracy of the infrared sensor assembly 128, and perform various non- uniformity correction processes such as supplemental flat field corrections and/or to correct for out-of-field radiation.
  • various problems associated with conventional infrared imaging systems may be substantially reduced.
  • conventional systems may experience reduced thermographic accuracy and may exhibit low spatial frequency non-uniformity resulting from undesired external radiation, such as out-of-field radiation that is received from a location outside a field of view of a target scene desired to be imaged, and/or received from various components of such systems.
  • infrared imaging module 100 may substantially reduce in infrared imaging module 100 by the low emissivity of metal layer 920.
  • the low emissivity of metal layer 920 m y reduce the effects of out-of-field radiation received by infrared sensor assembly 128 by reducing the power emitted by housing 120 toward infrared sensor assembly 128.
  • the power emitted by a surface may be expressed as W( ,T)*e, where ⁇ is the wavelength of infrared radiation, T is the temperature of the surface, and e is the emissivity of the surface.
  • the emitted power may be considered a linear function of the emissivity.
  • Metal such as gold has an emissivity of approximately 0.02, nickel has an emissivity in a range of approximately 0.05 to approximately 0.1 1, and aluminum has an emissivity in a range of approximately 0.05 to approximately 0.09, all of which may be substantially less than that of cover 910 (e.g., having an emissivity in a range of approximately 0.8 to approximately 0.95 in the case of plastic or similar material). Accordingly, considering the emissivities discussed above, power emitted from metal layer 920 may be approximately one tenth of that emitted from cover 910.
  • infrared sensor assembly 128 may be operated with greater thermographic accuracy, as there is less need to compensate for out-of-field radiation when performing temperature measurements of objects in a target scene.
  • infrared sensor assembly 128 may be operated with improved thermographic accuracy and uniformity.
  • Metal layer 920 may be used to improve the thermal conductivity of infrared imaging module 100 and thus reduce additional problems associated with conventional infrared imaging systems.
  • conventional systems may experience non-uniform heating (e.g., hot spots) from various components (e.g., mounted inside or outside a housing) and/or various external heat sources.
  • non-uniform heating e.g., hot spots
  • components e.g., mounted inside or outside a housing
  • various external heat sources e.g., the temperature distribution across such systems may vary significantly, especially as various components are selectively switched on and off. If left uncorrected, non-uniform heating of a housing may result in low spatial frequency non- uniformities exhibited at the sensors.
  • Cover 910 may be implemented with a material (e.g., comprised substantially of plastic and/or other material) having relatively low thermal conductivity (e.g., also a relatively slow thermal time constant).
  • metal layer 920 with a higher thermal conductivity (e.g., also a faster thermal time constant) than cover 910, heat may be more uniformly distributed around infrared sensor assembly 128 and thus reduce the detrimental effects of non-uniform heating, especially where infrared imaging module 100 is used in close proximity to other
  • the high thermal conductivity of metal layer 920 may permit components of infrared imaging module 100 to be more effectively cooled by convection.
  • heat generated by infrared sensor assembly 128 and processing module 160 may be received by the various surfaces of metal layer 920 and passed to housing 120 which provides a large surface area for convection cooling.
  • temperature variations in housing 120 may be reduced to allow for more accurate temperature measurements of housing 120 (e.g., by temperature measurement component 980).
  • the increased heat flow in housing 120 permits infrared imaging module 100 to achieve a lower steady state operating temperature which improves the dynamic range of infrared sensors 132 and the reliability of infrared imaging module 100.
  • Metal layer 920 may also be used to provide an electromagnetic interference (EMI) shield in a manner that overcomes several problems associated with conventional approaches,
  • EMI shields implemented as separate structures that must be positioned over various components for shielding. Such structures occupy valuable space, reduce convective cooling, and involve additional assembly costs, all of which make them poorly suited to small form factor applications.
  • metal layer 920 may be grounded (e.g., at areas 950 as discussed) and operate as an EMI shield.
  • metal layer 920 may operate as a shield to substantially attenuate EMI emitted by infrared sensor assembly 128, processing module 160, and/or various components enclosed by housing 120 to thus shield components of host device 102 and/or an external environment from the EMI and reduce possible interference.
  • Metal layer 920 may also operate as a shield to substantially attenuate external EMI (e.g., EMI incident on cover 910) to shield infrared sensor assembly 128 and/or various components enclosed by housing 120.
  • metal layer 920 effectively provides a compact EMI shield integrated with housing 120 that does not occupy additional external space and does not require the fitting of additional external components (e.g., thus reducing materials and assembly costs).
  • metal layer 920 may actually improve the cooling of infrared imaging module 100.
  • Fig. 14 illustrates a process for manufacturing infrared imaging module 100 in accordance with an embodiment of the disclosure. Although particular operations are identified in Fig. 14, fewer or greater numbers of operations may be performed as desired in accordance with appropriate manufacturing techniques.
  • cover 910 is provided.
  • operation 1410 may include forming cover 910 using MID techniques to partially or fully embed various electrical connections 126 and/or components (e.g., temperature measurement component 980 or others) within cover 910.
  • components may be attached and/or connected in operation 1440 further described herein.
  • metal layer 920 is provided.
  • operation 1420 may be performed by metalizing surfaces of cover 910 as part of a MID manufacturing process (e.g., as part of operation 1410), thus saving cost and time.
  • metal layer 920 may be formed as a single layer and/or several sublayers (e.g., sublayers 922, 924, 926, and/or others) in accordance with appropriate metalization techniques.
  • cover 910 may be appropriately masked during operation 1420 to define conductive traces 930 and/or areas 940.
  • conductive traces 930 may be formed as portions of metal layer 920 during operation 1420.
  • conductive traces 930 and/or areas 940 may be provided in other operations.
  • conductive traces 930 are provided (e.g., if not already provided in operation 1420).
  • operation 1430 may include etching and/or otherwise removing portions of metal layer 920 to expose areas 940 and thus define conductive traces 930 from metal layer 920.
  • conductive traces 930 may be metal that is separately provided in operation 1430. For example, portions of metal layer 920 may be removed in areas 940 and also in areas designated to receive conductive traces 930. One or more metal layers for conductive traces 930 may then be provided in appropriate removed areas between existing portions of metal layer 920,
  • operation 1430 may also include insulating (e.g., electrically isolating) conductive traces 930 from metal layer 920 (e.g., if not already performed in operation 1420). This may include, for example, maintaining voids in areas 940, providing insulating material in areas 940, substantially or completely surrounding conductive traces 930 with insulating material, and/or other appropriate insulating techniques.
  • insulating e.g., electrically isolating
  • one or more components are attached to housing 120 and/or connected to conductive traces 930.
  • temperature measurement component 980 may be connected to conductive traces 930 and mounted on an interior surface of housing 120.
  • components of infrared imaging module 100 intended to reside within cavity 912 are provided.
  • operation 1450 may include manufacturing or otherwise providing infrared sensor assembly 128 and/or other components of infrared imaging module 100.
  • operation 1460 the components provided in operation 1450 are substantially or completely enclosed within cavity 912.
  • operation 1460 may include positioning infrared sensor assembly 128 and housing 120 relative to each other such that housing 120 at least substantially encloses infrared sensor assembly 128 and such that metal layer 920 is disposed on various interior surfaces of cover 910 facing infrared sensor assembly 128.
  • cover 910 may be lowered over infrared sensor assembly 128.
  • infrared sensor assembly 128 may be inserted into cavity 912.
  • operation 1460 may include various operations to assemble infrared imaging module 100, such as by mounting housing 120 on base 150 or circuit board 170. In other embodiments, operation 1460 may include assembling various portions of housing 120 together to enclose components. In other embodiments, housing 120 may be formed around components during its manufacture.
  • infrared imaging module 100 is engaged with socket 104, for example, in accordance with various techniques described herein.
  • operation 1470 may include inserting infrared imaging module 100 into socket 104 of host device 102 such that housing 120 engages with socket 104.
  • metal layer 920 has been primarily described as being on one or more interior surfaces of cover 910, metal layer 920 may be provided on various interior and/or exterior surfaces of cover 910 as may be desired to further realize the various emissivity, conductivity, shielding, and other advantages provided by metal layer 920.
  • Figs. 15A-15C illustrate various views of infrared imaging module 100 having a shutter assembly 1500 in accordance with an embodiment of the disclosure.
  • Fig. 15A illustrates a top perspective view of infrared imaging module 100 with shutter assembly 1500 stacked on top of housing 120 and/or lens barrel 1 10 and with processing module 160 mounted on circuit board 170 and external to housing 120
  • Fig. 15B illustrates a top plan view of infrared imaging module 100 of Fig. 15A
  • Fig. 15C illustrates a cross- sectional view along line 15C-15C of infrared imaging module 100 of Figs. 15A-15B.
  • shutter assembly 1500 may be adapted to substantially block external infrared radiation from entering optical elements 180A (e.g., including multiple elements defining a multi-element lens) and/or aperture 1 12 selectively in response to a control signal (e.g., a drive voltage/current).
  • shutter assembly 1500 may include a paddle 1502 that may be selectively moved by an actuator 1504 to instead provide infrared radiation from paddle 1502 to infrared sensors 132 through aperture 1 12 and/or optical elements 180A, to the exclusion of external infrared radiation from a scene.
  • shutter assembly 1500 may be utilized as an approximate black body for performing NUC process or other calibration processes as would be understood by one skilled in the art.
  • shutter assembly 1500 may be utilized to perform a shutter-based flat field correction (FFC) process appropriately modified from shutter-based FFC techniques set forth in U.S. Patent Application No. 12/391, 156 filed February 23, 2009, which is incorporated herein by reference in its entirety.
  • FFC flat field correction
  • shutter assembly 1500 may be adapted to be stacked relative to housing 120 and/or lens barrel 1 10 in a manner that allows an added height 1506 attributable to shutter assembly 1500 in the overall profile to be only a portion of a height 1508 of shutter assembly.
  • shutter assembly 1500 may be included in infrared imaging module 100 to provide benefits of having a shutter situated external to optical elements 180/180A as further discussed herein, while still maintaining compact overall dimensions of infrared imaging module 100.
  • shutter assembly 1500 may be provided separately from housing 120, shutter assembly 1500 may be integrated with infrared imaging module 100 in various form factors and topologies described above with respect to various embodiments of Figs. 5A-14 with few modifications or design changes, for example.
  • a more accurate calibration may be achieved, for example, when performing various shutter-based calibration processes described above. That is, paddle 1502 external to optical elements 180/180A may not block out-of-field radiation emitted from housing 120 and/or lens barrel 1 10 from reaching infrared sensors 132, thereby allowing calibration processes to more accurately correct for such out-of-field radiation when obtaining calibration data.
  • a non-uniformity correction process may be able to correct low spatial frequency non-uniformity attributable to such out-of-field radiation.
  • a radiometric calibration process may be able to determine outputs of infrared sensor assembly 128 attributable to such out-of-field radiation, and compensate for the contribution of such out-of-field radiation to provide a more accurate radiometric measurement of temperatures associated with a scene or object.
  • infrared radiant flux received by infrared sensors 132 may be the sum of infrared radiant flux emitted from out-of-field sources (e.g., housing 120 and/or lens barrel 110) and infrared radiant flux emitted from paddle 1202.
  • out-of-field sources e.g., housing 120 and/or lens barrel 110
  • infrared flux emitted from paddle 1202 reaching infrared sensors 132 ⁇ IR_Flux Padd i e may be calculated as would be understood by one skilled in the art. Then the output attributable to out-of-field sources may be derived as follows:
  • infrared sensor assembly 128 attributable to infrared radiation from housing 120 and/or barrel 1 10 ⁇ Output out-of-fieid) may then be subtracted during or after image capturing so that the resulting output may be representative of infrared flux levels associated with a scene, thereby producing radiometrically calibrated images.
  • infrared imaging module 100 having shutter assembly 1500 may advantageously permit more accurate NUC, radiometric, and/or other calibration of infrared imaging module 100.
  • Shutter assembly 1500 as well as methods of manufacturing infrared imaging module
  • Fig. 16A illustrates a top perspective view of shutter assembly 1500.
  • shutter assembly 1500 may include a body 1510 adapted to carry or otherwise support various components of shutter assembly 1500, and a cover 1512 coupled to body 1510 to at least partially enclose some components of shutter assembly 1500.
  • shutter assembly 1500 may include a recess 1514 formed (e.g., molded, stamped, machined, or otherwise fabricated) on a surface of body 1510, as shown in Fig. 16B illustrating a bottom perspective view of shutter assembly 1500.
  • recess 1514 may be shaped to receive at least a portion of housing 120 and/or lens barrel 110, such that added height 1506 may be reduced when shutter assembly 1500 is stacked relative to housing 120 as described above with respect to Fig. 15C.
  • housing 120 and lens barrel 1 10 may have various shapes and/or configurations at their interface.
  • lens barrel 1 10 may have a portion protruding from housing 120 and/or in some implementations housing 120 may have a protruding lip encircling a portion of lens barrel 1 10.
  • recess 1514 may be shaped to receive a portion (e.g., a protruding portion) of lens barrel 1 10, a portion (e.g., a protruding lip) of housing 120, or portions of both barrel 120 and housing 110.
  • a portion e.g., a protruding portion
  • a portion e.g., a protruding lip
  • recess 1514 may be shaped to receive a protruding portion of lens barrel 1 10 and a protruding lip portion of housing 120, such that shutter assembly 1500 may be nested on top of lens barrel 110 to position paddle 1502 external to optical elements 180A/180 while still maintaining a thin profile.
  • body 1510 may be substantially L-shaped or otherwise shaped to locate large components (e.g., actuator 1504) off to a side to reduce overall profile without nesting substantially all of shutter assembly 1500 over lens barrel 1 10 and/or housing 120.
  • shutter assembly 1500 may not need recess 1514 formed on body 1510 if, for example, adding an entire height of shutter assembly 1500 does not affect particular applications of infrared imaging module 100. It is also contemplated that for
  • infrared imaging module 100 without a separate lens barrel, such as for example if optical elements 180A/180 are provided on a housing or if the housing implements a lens barrel, recess 1514 may be shaped to receive a portion of such a housing.
  • shutter assembly 1500 may be secured in position relative to housing 120 and/or lens barrel 100 by recess 1514 receivingly engaging (e.g., holding using friction and/or tension) a corresponding portion of housing 120 and/or lens barrel 1 10.
  • shutter assembly 1500 may be secured in position using adhesives, tabs, arms, pins, fasteners, screws, or any other appropriate engagement members, in addition to or instead of recess 1514 receivingly engaging a corresponding portion of housing 120 and/or lens barrel 1 10.
  • shutter assembly 1500 may be described in further detail with reference to Fig. 16C, which illustrates a top perspective view of shutter assembly 1500 with cover 1512 removed to reveal various components.
  • body 1510 may be adapted to carry, support, and/or provide appropriate mounting locations for various components including paddle 1502, actuator 1504, cover 1512, and/or a base plate 1516.
  • shutter assembly 1500 may include base plate 1516 mounted on body 1510, for example, via support pins 1518A-1518B extending from body 1510 or otherwise mounted on body.
  • base plate 1516 may have an aperture 1517 formed thereon and suitably positioned to allow infrared radiation to pass through to aperture 1 12 and/or optical elements 180A/180 when paddle 1502 is in an open position as shown in Fig. 16C.
  • Actuator 1504 may be adapted to selectively move paddle 1502 between an open position (as shown in Fig. 16C) and a closed position in response to a control signal (e.g., a drive voltage or current) received from an appropriate component of infrared imaging module 100 (e.g., processing module 160, or other components) or from an external source (e.g., via components and/or connections on circuit board 170).
  • a control signal e.g., a drive voltage or current
  • actuator 1504 may be implemented using a magnetic rotor, electric motor, or other similar
  • actuator 1504 adapted to produce motion and/or force in response to receiving an electric current and/or voltage.
  • actuator 1504 may be implemented using a thermal actuator adapted to generate motion by thermal expansion amplification, piezoelectric actuator adapted to generate motion by piezoelectric effect, or other types of micro-electro-mechanical system (MEMS) actuators.
  • MEMS micro-electro-mechanical system
  • actuator 1504 may be adapted to selectively move a drive pin 1520, which in tum pivotingly moves paddle 1502 around support pin 1 518A between an open position and a closed position.
  • paddle 1502 may be pivotingly moved by drive pin 1520 from an open position (as shown) to a closed position in response to actuator 1504 receiving a control signal (e.g., drive current/voltage), according to some embodiments.
  • paddle 1502 When in the open position, paddle 1502 may allow external infrared radiation to pass to aperture 1 12 and/or optical elements 180A/180, whereas when in the closed position, paddle 1502 may substantially block external infrared radiation from reaching aperture 1 12 and/or optical elements 180A/180.
  • Other drive mechanisms appropriate for selectively moving paddle 1502 or any other appropriate shutter member (e.g., a focal plane shutter, leaf shutter, or others) between open and closed positions may be provided for other embodiments.
  • shutter assembly 128 may include, according to various embodiments, a temperature sensor 1522 adapted to detect a temperature associated with paddle 1502.
  • temperature sensor 1522 may be implemented using a discrete component disposed on and/or at least partially embedded in paddle 1502.
  • the discrete temperature sensor 1522 may be implemented using a thermistor, thermocouple, temperature- sensing diode, or other appropriate low mass temperature sensor device that may be disposed on paddle 1502 without significantly adding mass to paddle 1502.
  • shutter assembly 1500 may include one or more electrical wires 1524 routed on and/or at least partially embedded within paddle 1502, and adapted to electrically connect to the discrete temperature sensor 1522 for obtaining a temperature reading (e.g., represented as resistance, voltage, current, or other electrical characteristic produced by temperature sensor 1522).
  • a temperature reading e.g., represented as resistance, voltage, current, or other electrical characteristic produced by temperature sensor 1522.
  • paddle 1502 may be a molded interconnect device (MID) formed using an appropriate MID method, which may allow embedded conductive traces to be formed on paddle 1502.
  • MID molded interconnect device
  • one or more electrical wires 1524 may be implemented using such conductive traces embedded (e.g., fully or partially embedded, formed, implanted, or otherwise provided) in a MID paddle 1502.
  • paddle 1502 may be made from a silicon substrate, with temperature sensor 1522 and electrical wires 1524 fabricated on the silicon substrate as integrated circuits using an appropriate semiconductor fabrication process.
  • a silicon paddle 1502 may be doped with appropriate dopant on at least one surface to reduce infrared transmissivity of silicon paddle 1502, so that silicon paddle 1502 may substantially block external infrared radiation when in the closed position.
  • a temperature-sensing diode may be fabricated as an integrated component on silicon paddle 1502 to implement temperature sensor 1522.
  • the temperature- sensing diode implementing temperature sensor 1522 may be modeled after (e.g., appropriately modified from) the 2N2222 transistor appropriate for temperature
  • a large number of silicon paddles 1502 with integrated temperature sensors 1522 and electrical wires 1524 may be fabricated on a single wafer (e.g., up to several hundreds of silicon paddles 1 02 on a wafer depending on wafer size and paddle size).
  • a single wafer e.g., up to several hundreds of silicon paddles 1 02 on a wafer depending on wafer size and paddle size.
  • close to one thousand silicon paddles 1502 having an approximate size of 3 mm by 7 mm may be fabricated on a typical 0.35 ⁇ process wafer, thereby reducing the cost to manufacture each paddle 1502.
  • silicon paddles 1502 fabricated on a wafer may be singulated using laser cutting or other appropriate singulation technique suitable for dicing irregular shaped dies.
  • a temperature sensor to detect a paddle temperature may be provided at other parts or components of infrared imaging module 100.
  • a temperature sensor e.g., a thermistor, thermocouple, temperature-sensing diode, thermopile, pyroelectric sensor, or other suitable sensor
  • a temperature sensor may be disposed on or in shutter assembly body 1510 at a location appropriate for detecting a temperature associated with paddle 1502 through convective and/or radiative transfer of heat to/from paddle 1502.
  • FIG. 17A-17C illustrate various views of infrared imaging module 100 having a temperature sensor 980A provided on an interior surface of housing 120 and a thermal conductor 1702 adapted to communicate thermal energy between body 1510 of shutter assembly 1500 and temperature sensor 980A, in accordance with an embodiment of the disclosure. More specifically, Fig. 17A illustrates a top perspective view of infrared imaging module 100 having temperature sensor 980A and thermal conductor 1702, Fig. 17B illustrates the infrared imaging module 100 of Fig. 17A with housing 120 shown in semi- transparent form to reveal temperature sensor 980A provided on an interior surface of housing 120, and Fig. 17C illustrates a cross-sectional view along line 17C-17C of the infrared imaging module 100 of Figs. 17A-17B.
  • temperature sensor 980A may be implemented in a same or similar manner as temperature measurement component 980 of Figs. 12A-12C and 12E. In the illustrated embodiment, temperature sensor 980A partially or fully embedded
  • temperature sensor 980A may be partially or fully embedded in, or mounted on an exterior surface of housing 120.
  • temperature sensor 980A may be electrically connected to one or more conductive traces 930A formed on or at least partially embedded in a surface of housing 120 in a similar manner as conductive traces 930 of Figs. 12A-12E or in other appropriate manner.
  • thermal conductor 1702 may be provided in a gap 1704 between shutter assembly body 1510 and housing 120 to thermally couple shutter assembly body 1510 to at least a portion (e.g., a portion near temperature sensor 980A) of housing 120.
  • housing 120 and/or shutter assembly body 1510 may have one or more surfaces raised, lowered, or otherwise shaped to reduce gap 1704, so as to achieve, for example, a better thermal coupling using smaller thermal conductor 1702.
  • Thermal conductor 1702 may be made of any suitable material having high thermal conductivity.
  • thermal conductor 1702 may be implemented by applying or otherwise providing thermally conductive epoxy, solder, a thermal pad, a copper shim, or other suitable thermal conductor material between gap 1704 to thermally couple housing 120 and shutter assembly body 1510.
  • thermal conductor 1 702 may facilitate communication of thermal energy between at least a portion (e.g., a portion near temperature sensor 980A) of housing 120 and shutter assembly body 1 10, so that an approximate temperature ambient to paddle 1502 may be detected by temperature sensor 980A.
  • actuator 1504 may be adapted to receive a control signal (e.g., a drive voltage or current) from an appropriate component.
  • the control signal may be received from or via an appropriate component on substrate 140 and/or circuit board 170.
  • a temperature reading e.g., represented as resistance, voltage, current, or other electrical characteristic produced by a temperature sensor
  • processing module 160 e.g., processing module 160
  • one or more conductive traces may be provided on one or more surfaces of housing 120, and may be adapted to transmit the control signal and/or the temperature reading between shutter assembly body 1510 and substrate 140/circuit board 170.
  • Fig. 18A illustrates a top perspective view of infrared imaging module
  • conductive traces 930B may be formed on one or more exterior surfaces of housing 120 to transmit the control signal and the temperature reading, but otherwise formed or provided in a similar manner as conductive traces 930 described above with respect to Figs. 12A-13.
  • temperature sensor 980A may be provided within housing 120 (e.g., embodiments described above with respect to Figs. 17A-17C)
  • conductive traces 930B may not be needed for transmitting a temperature reading, but rather conductive 930A may be utilized to transmit the temperature reading as described above.
  • Conductive traces 930B may be routed or otherwise patterned to run between appropriate electrical contacts on circuit board 170 and electrical pads 1802 on shutter assembly body 1510. As shown in Figs. 18B and 18C, conductive traces 930B may contact or at least reach close proximity to corresponding electrical pads 1802 on shutter assembly body 1510. In some embodiments, solder, conductive epoxy, or other suitable material may be applied at the interface of conductive traces 930B and corresponding electrical pads 1802 so as to provide and/or enhance electrical connections between conductive traces 930B and corresponding electrical pads 1802. Electrical pads 1802 are more clearly shown in Fig. 19, which illustrates a bottom perspective view of shutter assembly 1502 having electrical pads 1802 provided on body 1510 in accordance with an embodiment of the disclosure. In various embodiments, electrical pads 1802 may be electrically connected to corresponding contacts of actuator 1504 and/or electrical wires 1524 via electrical traces and/or electrical wires provided on body 1510 and/or base plate 1516.
  • Fig. 20A illustrates a top perspective view of infrared imaging module 100 having conductive traces 930C formed on one or more exterior and interior surfaces of housing 120
  • Fig. 20B illustrates a top perspective view of the infrared imaging module 100 of Fig. 20A with shutter assembly body 1510 shown in semi-transparent form to reveal electrical pads 1802, in accordance with an embodiment of the disclosure.
  • conductive traces 930C may additionally or alternatively be routed on one or more interior surfaces of housing 120 as desired for particular designs and/or requirements. Similar to conductive traces 930B, conductive traces 930C may interface with corresponding electrical pads 1802 provided on shutter assembly body 1510.
  • control signals for actuator 1504 and/or temperature readings from temperature sensor 1522 may be communicated without a need for additional cables and/or connectors external to infrared imaging module 100, thereby saving the cost of additional cables and/or connectors, reducing total space requirements, and/or otherwise removing complexities of having additional cables and/or connectors.
  • various embodiments of infrared imaging module 100 having shutter assembly 1500 may beneficially provide a calibration target external to optical elements 180A/180 to permit a more accurate calibration, using paddle 1502 adapted to selectively block external infrared radiation from entering optical elements 180A/180.
  • paddle 1502 may be provided external to optical elements 180A/180 without excessively increasing the overall profile of infrared imaging module 100, according to one or more embodiments.
  • Various embodiments of infrared imaging module 100 having shutter assembly 1500 may also advantageously allow an accurate measurement of a temperature associated with paddle 1502 by providing temperature sensor 1522/980A positioned and adapted to obtain an accurate temperature reading associated with paddle 1502, thereby permitting a more accurate calibration to be achieved.
  • Fig. 21 illustrates another shutter assembly 1 1700 that may be installed as part of infrared imaging module 100
  • Fig. 22 illustrates shutter assembly 1 1700 positioned for assembly as part of infrared imaging module 100
  • Figs. 23A-B illustrate various views of infrared imaging module 100 with shutter assembly 1 1700 shown in semi-transparent form to illustrate contacts 11702 engaged with pads 1 1402 on an external surface of another housing 11 120 in accordance with various embodiments of the disclosure.
  • any components of Figs. 21-23B may be used in place of and/or in addition to any of the components of the present disclosure.
  • shutter assembly 11700 and/or housing 1 1 120 may be used in place of shutter assembly 1500 and/or housing 120 in appropriate embodiments.
  • Conductive traces 1 1400 may be provided on housing 11 120 and used to provide electrical connections.
  • Conductive traces 1 1400 include pads 1 1402 and 1 1408, and various intermediate portions as shown.
  • pads 11402 may be positioned substantially on a top surface of housing 1 1120
  • pads 1 1408 may be positioned on a lower side and/or may wrap around under a bottom surface of housing 1 1120.
  • conductive traces 1 1400 may pass electrical signals (e.g., control signals, data signals, power, and/or other types as appropriate) between electrical connections 11802 (e.g., pads) of base 1 1800 and components electrically connected to pads 1 1402 (e.g., various electrical components such as those of infrared imaging module 100 and/or appropriate portions of the various shutter assemblies discussed herein). Conductive traces 1 1400 may connect to electrical connections of base 150, circuit board 170, socket 104, and/or other components where appropriate in various installations.
  • electrical signals e.g., control signals, data signals, power, and/or other types as appropriate
  • electrical connections 11802 e.g., pads
  • pads 1 1402 e.g., various electrical components such as those of infrared imaging module 100 and/or appropriate portions of the various shutter assemblies discussed herein.
  • Conductive traces 1 1400 may connect to electrical connections of base 150, circuit board 170, socket 104, and/or other components where appropriate in various installations.
  • Shutter assembly 1 1700 includes contacts 1 1702 that may engage with pads 11402 of housing 1 1 120 when shutter assembly 1 1700 is installed as part of infrared imaging module 100.
  • contacts 1 1702 may be compression contacts (e.g., spring contacts) configured to be biased against pads 1 1402 when shutter assembly 1 1700 is installed on housing 11 120 (see Figs. 19A-B).
  • contacts 1 1702 may be implemented in other appropriate forms and/or may be soldered or otherwise connected to pads 11402.
  • Shutter assembly 11700 includes a paddle 11502, an actuator 11504, and may further include any of the various components as discussed herein with regard to shutter assembly 1500.
  • Electrical signals to operate actuator 1 1504 may be passed between base 1 1 180 and actuator 1 1504 through electrical connections 1 1802, pads 1 1408, intermediate portions of conductive traces 1 1400, pads 1 1402, contacts 11702, and wires 11701.
  • Shutter assembly 11700 also includes a recess 1 1704 configured to receive lens barrel 1 10 and an external ring 1 1810 of housing 1 1 120 as shutter assembly 1 1700 is installed onto housing 1 1 120.
  • Shutter assembly 1 1700 also includes an orientation groove 1 1706 configured to receive an orientation tab 11808 of housing 1 1 120 to align shutter assembly 11700 relative to housing 1 1 120.
  • process 2100 to capture image data of a uniform irradiance scene using infrared imaging module 100 having shutter assembly 1500 (e.g., or shutter assembly 1 1700) in accordance with an embodiment of the disclosure.
  • process 2100 may be performed as part of various NUC and/or radiometric calibration process to obtain calibrated infrared imaging module 100 as would be understood by one skilled in the art.
  • paddle 1502 may be pivotingly rotated, slid, or otherwise moved to substantially block external infrared radiation from entering aperture 1 12 and/or optical elements 180A/180.
  • a control signal e.g., a drive voltage and/or current
  • an appropriate component e.g., processing module 160, processor 195, other appropriate external component and/or other component of infrared imaging module 100
  • actuator 1504 to pivotingly rotate, slide, or otherwise move paddle 1502 to a position (e.g., a closed position) for substantially blocking aperture 1 12 and/or optical elements 180A/180.
  • infrared image data of a scene may be captured at infrared sensor assembly 128.
  • infrared radiation emitted from paddle 1502 may be passed through optical elements 180A/180 and received at infrared sensors 132 of infrared sensor assembly 128.
  • ROIC of infrared sensor assembly 128 may generate infrared image frames corresponding to the received infrared radiation, and provided such image frames at various rates, as described herein.
  • the captured infrared image frames of the scene provided by paddle 1502 may be processed by processing module 160 of infrared imaging module 100, and in some embodiments, the processed image frames may be provided to processor 195 of host device 102 for further processing.
  • a temperature associated with paddle 1502 may be detected.
  • a temperature of paddle 1502 or a temperature ambient to paddle 1502 may be detected using temperature sensor 1522 or 980A.
  • a resistance, voltage, current, or other electrical property indicative of the temperature may be transmitted via electrical wires 1524, conductive traces 930A, and/or conductive traces 930B/930C.
  • the temperature reading, along with the infrared image data captured at block 2104 may be received and processed by processing element 160, processor 195, and/or other appropriate component of infrared imaging module 100 or host device 102 to perform various radiometric calibration processes, NUC processes, or other calibration processes.
  • Operations of block 2106 may be performed prior to block 2104 or block 2102 without departing from the scope and spirit of the disclosure.
  • a temperature associated with paddle 1 502 may be detected during or prior to capturing infrared image data of the scene provided by paddle 1502.
  • paddle 1502 may be pivotingly rotated, slid, or otherwise moved back to an open position to allow external infrared radiation enter aperture 1 12 and/or optical elements 180A/180.
  • the control signal that was asserted to cause actuator 1504 to move paddle 1502 to the closed position may be lowered, withdrawn, or otherwise removed to allow paddle 1502 to return to the open position.
  • another control signal may be generated by an appropriate component (e.g., processing module 160, processor 195, other appropriate external component and/or other component of infrared imaging module 100) and transmitted via conductive traces 930B/930C to actuator 1504 to pivotingly rotate, slide, or otherwise move paddle 1502 back to the open position.
  • infrared imaging module 100 and/or host device 102 may perform normal image capture operations or perform calibration operations using an external scene.
  • shutter assembly 1500/11700 may be implemented with various minimum and maximum specifications. However, it will be appreciated that the specifications set forth herein are merely examples and that other specifications may be used where appropriate.
  • shutter assembly 1500/1 1 170 may be implemented to add approximately 0.6 mm or less to the overall height (e.g., Z dimension) of infrared imaging module 100.
  • shutter assembly 1500/11170 may be implemented with length and width (e.g., X and Y dimensions) less than approximately 9.0 mm by
  • the length and width may be approximately 8.5 mm by approximately 8.5 mm. In some embodiments, the length, width, and height may be no greater than approximately 10.5 mm by approximately 10.5 mm by approximately 2.0 mm. In some embodiments, the length, width, and height may be no greater than approximately 8.5 mm by approximately 8.5 mm by approximately 2.0 mm.
  • paddle 1502/1 1502 may have approximately a 1.9 mm diameter viewable by infrared imaging module 100. In some embodiments, paddle 1502/1 1502 may exhibit open and close times less than approximately 30 milliseconds. In some embodiments, such open and close times may be less than approximately 10 milliseconds.
  • actuator 1504/1 1504 may utilize a drive voltage approximately 2.0 volts or less, and exhibit drive power consumption of approximately 400 milliwatts or less. In some embodiments, such drive voltage may be approximately 1.8 volts. In some embodiments, no power is required to maintain paddle 1 02/1 1502 in the open position.
  • paddle 1502/1 1502 may provide high and/or low emissivity surfaces. In some embodiments, paddle 1502/11502 may exhibit high thermal conductivity. In some embodiments, paddle 1502/1 1502 and actuator 1504/11504 may be rated for a lifetime reliability of greater than 100,000 cycles. In some embodiments, such lifetime reliability may be greater than 1,000,000 cycles. In some embodiments, shutter assembly 1500/1 1700 may be implemented to operate over a temperature range of approximately -10 degrees C to approximately +65 degrees C. In some embodiments, shutter assembly 1500/1 1700 may be implemented to withstand at least 10,000g 0.2 ms shocks.
  • signals detected by an FPA correspond to the sum of infrared radiation from a scene that is focused onto infrared sensors by the lens, the lens self-emission, the out-of-field of view signal (e.g., emitted by the housing, lens barrel, and/or other components), and any uncompensated output drift associated with FPA temperature changes or FPA 1/f noise.
  • the signal contribution from the scene typically must be known independently from the signal contributions from the above-mentioned sources, which may require that the signal contributions from all of the sources be calculated.
  • the signal contribution from the scene is replaced with the infrared signal contribution from a highly emissive shutter (e.g., paddle) when the shutter is closed.
  • a highly emissive shutter e.g., paddle
  • a reflective shutter may be provided.
  • paddle 1502/1 1502 may be configured with a substantially reflective low emissivity interior surface 1503/11503 that faces the FPA (e.g., infrared sensor assembly 128 including infrared sensors 132) when paddle 1502/11502 is in a closed position.
  • Surface 1503/11503 may reflect infrared (e.g., thermal) radiation originating from the FPA back to the FPA.
  • infrared radiation may pass from infrared sensors 132, continue up through various components of infrared imaging module 100, reflect off of surface 1503, travel back through various components of infrared imaging module 100, and be received by infrared sensors 132.
  • Surface 11503 may similarly reflect such ray traces.
  • Infrared imaging module 100 may include one or more temperature sensors (e.g., one or more temperature sensors 1505 may be embedded in the FPA and/or provided elsewhere) which permit infrared imaging module 100 to know one or more temperatures associated with one or more regions of the FPA.
  • infrared imaging module 100 and/or various appropriate processors may calibrate infrared sensors 132 of the FPA (e.g., perform thermographic calibration thereof) using the one or more known temperatures associated with the FPA, and without requiring knowledge of the actual temperature of paddle 1502/1 1502 itself.
  • paddle 1502/1 1502 and/or shutter assembly 1500/11500 may be implemented without temperature sensors, and further without associated heating or cooling components (e.g., to maintain a substantially uniform temperature), thus saving weight and cost, and reducing thickness and complexity.
  • such calibration may further account for attenuation of the infrared radiation caused by, for example, passing through various components of infrared imaging module 100 twice (e.g., over various ray traces 1507 which may include passing from infrared sensors 132 up through optical elements 180A to surface 1503/1 1503, and returning from surface 1503/1 1503 back through optical elements 180A to infrared sensors 132).
  • surface 1503/1 1503 may be gold coated or aluminum coated. These and/or other coatings or surfaces may be used as desired such that paddle 1502/1 1 502 exhibits negligible self emission with regard to signals detected by infrared sensors 132 while paddle 1502/1 1502 is closed. Although interior surface 1503/1 1503 is illustrated as substantially flat, other surface shapes (e.g., curved surfaces) may be used in other embodiments, for example, to reflect additional infrared radiation back to the FPA, provide desired spot sizes for the area imaged by individual infrared sensors 132, and/or fine tune appropriate characteristics of surface 1503/11503.
  • various embodiments provided by the present disclosure can be implemented using hardware, software, or combinations of hardware and software. Also where applicable, the various hardware components and/or software components set forth herein can be combined into composite components comprising software, hardware, and/or both without departing from the spirit of the present disclosure. Where applicable, the various hardware components and/or software components set forth herein can be separated into sub-components comprising software, hardware, or both without departing from the spirit of the present disclosure. In addition, where applicable, it is contemplated that software components can be implemented as hardware components, and vice-versa.
  • Non-transitory instructions, program code, and/or data can be stored on one or more non-transitory machine readable mediums. It is also contemplated that software identified herein can be

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Abstract

La présente invention porte sur un ensemble obturateur, pour un module d'imagerie infrarouge, qui permet d'empêcher de manière sélective qu'un rayonnement infrarouge externe n'atteigne des capteurs infrarouges du module d'imagerie infrarouge. Par exemple, l'ensemble obturateur peut comporter un cache qui est situé à l'extérieur par rapport à un élément optique (par exemple une lentille) et qui est conçu pour être déplacé de manière sélective par un actionneur afin d'empêcher sensiblement un rayonnement infrarouge externe d'entrer dans l'élément optique. L'ensemble obturateur peut être empilé par rapport à un boîtier du module d'imagerie infrarouge sans augmenter de manière excessive le profil général du module d'imagerie infrarouge. Une surface intérieure d'émissivité faible, sensiblement réfléchissante, peut être agencée sur le cache pour réfléchir un rayonnement infrarouge provenant d'un ensemble capteur infrarouge du module d'imagerie infrarouge en retour vers l'ensemble capteur infrarouge.
PCT/US2013/078551 2011-06-10 2013-12-31 Dispositif d'imagerie infrarouge ayant un obturateur WO2014106276A2 (fr)

Priority Applications (7)

Application Number Priority Date Filing Date Title
CN201390001132.5U CN205175557U (zh) 2012-12-31 2013-12-31 成像系统
PCT/US2014/073098 WO2015103448A2 (fr) 2013-12-31 2014-12-31 Techniques de fixation de dispositifs à capteur d'imagerie double bande
KR1020167021120A KR102418369B1 (ko) 2013-12-31 2014-12-31 듀얼 밴드 영상화 센서를 갖는 부착장치
PCT/US2014/073096 WO2015103446A2 (fr) 2013-12-31 2014-12-31 Fixation de dispositif à capteur d'imagerie double bande
CN201480076762.8A CN106068446B (zh) 2013-12-31 2014-12-31 具有双波段成像传感器的设备附件
US14/747,865 US10389953B2 (en) 2011-06-10 2015-06-23 Infrared imaging device having a shutter
US16/511,365 US10996542B2 (en) 2012-12-31 2019-07-15 Infrared imaging system shutter assembly with integrated thermister

Applications Claiming Priority (22)

Application Number Priority Date Filing Date Title
US201261748018P 2012-12-31 2012-12-31
US201261747789P 2012-12-31 2012-12-31
US61/748,018 2012-12-31
US61/747,789 2012-12-31
US201361792582P 2013-03-15 2013-03-15
US201361793952P 2013-03-15 2013-03-15
US61/793,952 2013-03-15
US61/792,582 2013-03-15
US13/966,052 US9473681B2 (en) 2011-06-10 2013-08-13 Infrared camera system housing with metalized surface
US13/966,052 2013-08-13
US14/099,818 US9723227B2 (en) 2011-06-10 2013-12-06 Non-uniformity correction techniques for infrared imaging devices
US14/099,818 2013-12-06
US14/101,258 2013-12-09
US14/101,258 US9723228B2 (en) 2011-06-10 2013-12-09 Infrared camera system architectures
US14/101,245 2013-12-09
US14/101,245 US9706139B2 (en) 2011-06-10 2013-12-09 Low power and small form factor infrared imaging
US14/138,052 US9635285B2 (en) 2009-03-02 2013-12-21 Infrared imaging enhancement with fusion
US14/138,052 2013-12-21
US14/138,058 US10244190B2 (en) 2009-03-02 2013-12-21 Compact multi-spectrum imaging with fusion
US14/138,040 US9451183B2 (en) 2009-03-02 2013-12-21 Time spaced infrared image enhancement
US14/138,040 2013-12-21
US14/138,058 2013-12-21

Related Parent Applications (8)

Application Number Title Priority Date Filing Date
US13/966,052 Continuation-In-Part US9473681B2 (en) 2009-03-02 2013-08-13 Infrared camera system housing with metalized surface
US14/099,818 Continuation-In-Part US9723227B2 (en) 2009-03-02 2013-12-06 Non-uniformity correction techniques for infrared imaging devices
US14/101,245 Continuation-In-Part US9706139B2 (en) 2009-03-02 2013-12-09 Low power and small form factor infrared imaging
US14/101,258 Continuation-In-Part US9723228B2 (en) 2009-03-02 2013-12-09 Infrared camera system architectures
US14/138,058 Continuation-In-Part US10244190B2 (en) 2009-03-02 2013-12-21 Compact multi-spectrum imaging with fusion
US14/138,052 Continuation-In-Part US9635285B2 (en) 2009-03-02 2013-12-21 Infrared imaging enhancement with fusion
US14/138,040 Continuation-In-Part US9451183B2 (en) 2009-03-02 2013-12-21 Time spaced infrared image enhancement
US14/747,865 Continuation-In-Part US10389953B2 (en) 2011-06-10 2015-06-23 Infrared imaging device having a shutter

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US14/747,865 Continuation US10389953B2 (en) 2011-06-10 2015-06-23 Infrared imaging device having a shutter

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Cited By (9)

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CN114112061A (zh) * 2021-10-11 2022-03-01 黑龙江业博科技有限公司 一种晶体管式焊接电源焊头温度快速在线测量方法及系统
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