WO2014094625A1 - 高低音喇叭单体以及高低音耳机结构 - Google Patents

高低音喇叭单体以及高低音耳机结构 Download PDF

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Publication number
WO2014094625A1
WO2014094625A1 PCT/CN2013/089923 CN2013089923W WO2014094625A1 WO 2014094625 A1 WO2014094625 A1 WO 2014094625A1 CN 2013089923 W CN2013089923 W CN 2013089923W WO 2014094625 A1 WO2014094625 A1 WO 2014094625A1
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Prior art keywords
sound
magnetic circuit
frame
woofer
holes
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PCT/CN2013/089923
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English (en)
French (fr)
Inventor
温增丰
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东莞泉声电子有限公司
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Priority to US14/427,636 priority Critical patent/US9602912B2/en
Publication of WO2014094625A1 publication Critical patent/WO2014094625A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1058—Manufacture or assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/24—Structural combinations of separate transducers or of two parts of the same transducer and responsive respectively to two or more frequency ranges
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1008—Earpieces of the supra-aural or circum-aural type
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807—Enclosures comprising vibrating or resonating arrangements
    • H04R1/2811—Enclosures comprising vibrating or resonating arrangements for loudspeaker transducers

Definitions

  • the invention relates to the technology of the horn field, in particular to a high-woofer speaker unit and a high-woofer earphone structure.
  • Headphones are classified according to their switching modes, mainly moving coil mode, moving iron mode, electrostatic type and other magnetic type. Classification is carried out in a structurally separate manner and can be divided into semi-open and closed.
  • the earphone type, the earing type, the in-ear type and the headband type are classified from the wearing form.
  • the existing earphone structure mainly includes a housing, and the inside of the housing is formed with a receiving cavity, and the receiving cavity is provided with a speaker.
  • the sound emitted by the speaker propagates outward, and the sound is transmitted as a sound source.
  • the volume closest to the source of pronunciation is the highest, and the sound spreads around so that the volume gradually decreases.
  • the existing earphone has only one sound chamber (ie, a receiving cavity), so that the high and low sounds all enter the same sound chamber, resulting in high and low sound mixing, making the earphone sound unstable and the sound quality is not good.
  • the present invention is directed to the lack of the prior art, and the main purpose thereof is to provide a high-woofer speaker unit and a high-woofer earphone structure, which can effectively solve the existing earphone high and low sound mixing in a sound chamber so that the earphone The problem of unstable pronunciation and poor sound quality.
  • a high-woofer speaker unit comprising a frame, a magnetic circuit assembly and a diaphragm; the magnetic circuit assembly is disposed at a center of the frame, and the frame is provided with a hollow structure at a periphery of the magnetic circuit assembly, and the Forming an isolation ring formed on the frame, the isolation ring separating the hollow structure to form at least one high sound zone and a low sound zone, the high sound zone being close to the magnetic circuit component, the low sound zone being away from the magnetic circuit component; the vibration film being disposed on the frame and Covers the magnetic circuit assembly, high range and low range.
  • a cover plate is further included, and the cover plate is fixed on the frame and covers the vibration film, and the cover plate is provided with a sound hole.
  • the sound hole includes a first sound hole and a second sound hole, and the first sound hole is connected to the high sound region, and the second sound hole is connected to the low sound region.
  • the cover plate is provided with a plurality of the first sound holes and a plurality of the second sound holes, and the plurality of first sound holes and the plurality of second sound holes are arranged in a circumference, and The plurality of second sound holes are located at a periphery of the plurality of first sound holes.
  • a spacer cover coupled to the lower portion of the spacer ring and located below the magnetic circuit assembly.
  • a high-woofer earphone structure includes a casing and the aforementioned high-woofer speaker unit.
  • the inside of the casing is formed with a receiving cavity, and the high-woofer speaker unit is installed in the receiving cavity.
  • the housing includes a rear housing and an annular baffle fixed to the rear housing, the annular baffle and the rear housing enclosing the receiving cavity, and the high-woofer speaker is embedded in the On the inner circumference of the annular baffle.
  • annular earmuff is fixed on the end surface of the annular baffle.
  • the sound chamber includes a first sound chamber and a second sound chamber, and the second sound chamber is located at a periphery of the first sound chamber and surrounds the first sound chamber.
  • the present invention has obvious advantages and advantageous effects compared with the prior art. Specifically, it can be known from the above technical solutions:
  • the isolation ring is used to separate the hollow structure into at least one high-pitched area and a low-pitched area, so that the high and low sounds are separated, and the high and low sounds are mixed together, thereby making the pronunciation of the earphone more stable.
  • the sound quality is better.
  • the isolation cover is sleeved on the isolation ring, and the isolation cover is used to separate the accommodating cavity to form at least two sound chambers, so that the high and low sounds respectively enter different sound chambers, thereby further improving the sound quality of the earphone. .
  • the plurality of first sound holes and the plurality of second sound holes are arranged in a circumference by using a plurality of the first sound holes and the plurality of second sound holes on the cover plate, and the plurality of sound holes are arranged in a circle.
  • the second sound holes are located at the periphery of the plurality of first sound holes, so that the high sounds uniformly enter and exit the first sound chamber from the first sound hole, so that the bass sound uniformly enters and exits the second sound chamber from the second sound hole, thereby Further improve the uniformity and stability of the headphone pronunciation.
  • Figure 1 is a perspective view showing the assembly of a preferred embodiment of the present invention
  • Figure 2 is an exploded view of a preferred embodiment of the present invention
  • Figure 3 is a cross-sectional view of a preferred embodiment of the present invention.
  • FIGS. 1 through 4 there is shown a specific structure of a preferred embodiment of the present invention including a housing 10 and a tweeter unit 20.
  • the high-woofer speaker unit 20 includes a frame 21, a magnetic circuit assembly 22, and a diaphragm 23; the frame 21 has a disk shape, and a central mounting position of the frame 21 is provided with a hollow mounting position 201, and the magnetic circuit assembly 22 It is disposed at a central position of the frame 21 and is located in the hollow mounting position 201.
  • the frame 21 is provided with a hollow structure at the periphery of the magnetic circuit assembly 22, and the frame 21 is formed with an isolation ring 211, and the isolation ring 211 is hollowed out.
  • the structure is separated to form at least one high-pitched area 202 and a low-pitched area 203, the high-pitched area 202 and the low-range area 203 are fan-shaped through slots, the high-pitched area 202 is close to the magnetic circuit assembly 22, the low-range area 203 is away from the magnetic circuit assembly 22;
  • the diaphragm 23 is disposed on the frame 21 and covers the magnetic circuit assembly 22, the high range 202, and the low range 203.
  • the high-woofer speaker unit 20 further includes a cover plate 24 fixed to the frame 21 and covering the diaphragm 23, and the cover plate 24 is provided with a sound hole.
  • the sound hole includes a first sound hole 204 and a second sound hole 205, the first sound hole 204 is connected to the high sound area 202, the second sound hole 205 is connected to the low sound area 203; and the cover plate 24 is provided with a plurality of the foregoing a first sound hole 204 and a plurality of the second sound holes 205, wherein the plurality of first sound holes 204 and the plurality of second sound holes 205 are arranged in a circumference, and the plurality of second sound holes 205 are located at the same The periphery of the plurality of first sound holes 204.
  • the housing 10 is formed with a receiving cavity 101.
  • the high-woofer speaker unit 20 is mounted in the accommodating cavity 101.
  • the lower part of the spacer ring is sleeved with an isolation cover 30.
  • the isolation cover 30 is located in the magnetic circuit.
  • Below the assembly 22, the isolation cover 30 is located in the accommodating cavity 101 and partitions the accommodating cavity 101 to form at least two sound chambers for accommodating sounds of different high and low frequency bands.
  • the sound chamber A first sound chamber 102 and a second sound chamber 103 are included, and the second sound chamber 103 is located at the periphery of the first sound chamber 102 and surrounds the first sound chamber 102.
  • the housing 10 includes a rear housing 11 and an annular baffle 12 fixed to the rear housing 11.
  • the annular baffle 12 and the rear housing 11 define the receiving cavity 101.
  • the high-woofer speaker unit 20 is embedded on the inner circumference of the annular baffle 12, and an annular earmuff 40 is fixed on the end surface of the annular baffle 12, and the annular earmuff 40 is used for direct contact with the human ear. .
  • the sound emitted by the high-woofer speaker unit 20 propagates outward, and the sound propagates around the pronunciation source to the periphery.
  • the volume closest to the sound source is the highest, and the sound propagates around, causing the volume to gradually decrease.
  • a sound hole 204 is closest to the sound source, such that the formed high sound is passed from the first sound hole 204 into the first sound chamber 102, and the second sound hole 205 is farthest from the sound source, so that the formed bass is from the second sound hole 205. Surrounded into the second chamber 103.
  • the design of the present invention is focused on: firstly, at least one isolation cover is sleeved on the speaker, and the isolation cover is used to separate the accommodating cavity to form at least two sound chambers, and corresponding to each of the sound chambers is disposed on the speaker Connect the sound hole of the corresponding sound chamber, so that the high and low sounds are respectively in different sound chambers, avoiding the mixing of high and low sounds, so that the sound of the earphone is more stable and the sound quality is better.
  • the plurality of first sound holes and the plurality of the second sound holes are arranged in a circle, and the plurality of sound holes are arranged in a circle.
  • the second sound holes are located at the periphery of the plurality of first sound holes, so that the high sounds uniformly enter and exit the first sound chamber from the first sound hole, so that the bass sound uniformly enters and exits the second sound chamber from the second sound hole, thereby Further improve the uniformity and stability of the headphone pronunciation.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Manufacturing & Machinery (AREA)
  • Headphones And Earphones (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

本发明公开一种高低音喇叭单体以及高低音耳机结构，该高低音喇叭单体包括有框架、磁气回路组件以及振动膜；该磁气回路组件设置于框架的中心位置上，该框架上位于磁气回路组件的外围设置有镂空结构，且该框架上成型有隔离环，该隔离环将镂空结构分隔形成至少一高音区和一低音区，该高音区靠近磁气回路组件，该低音区远离磁气回路组件；该振动膜设置于框架上并覆盖住磁气回路组件、高音区和低音区；该高低音喇叭单体设置于一壳体内形成高低音耳机结构；藉此，通过于框架上成型有隔离环，利用隔离环将镂空结构分隔形成至少一高音区和一低音区，以使得高低音分隔开，避免高低音混合在一起，从而使得耳机的发音更加稳定，音质更好。

Description

高低音喇叭单体以及高低音耳机结构 技术领域
本发明涉及喇叭领域技术，尤其是指一种高低音喇叭单体以及高低音耳机结构。
背景技术
耳机根据其换能方式分类，主要有动圈方式、动铁方式、静电式和等磁式。从结构上分开方式进行分类，可分为半开放式和封闭式。从佩带形式上分类则有耳塞式、挂耳式、入耳式和头带式。
现有的耳机结构主要包括有壳体，该壳体的内部成型有容置腔，该容置腔装设有一扬声器，在使用时，由扬声器发出的声音向外传播，声音的传播以发音源为中心向四周传播，离发音源最近的地方音量最高，声音向四周传播而使得音量逐渐降低。然而现有的耳机仅有一音室（即容置腔），使得高低音均进入同一音室中环绕，导致高低音混合，使得耳机发音不稳定，音质不佳。
发明内容
有鉴于此，本发明针对现有技术存在之缺失，其主要目的是提供一种高低音喇叭单体以及高低音耳机结构，其能有效解决现有之耳机高低音混合在一个音室中使得耳机发音不稳定、音质不佳的问题。
为实现上述目的，本发明采用如下之技术方案：
一种高低音喇叭单体，包括有框架、磁气回路组件以及振动膜；该磁气回路组件设置于框架的中心位置上，该框架上位于磁气回路组件的外围设置有镂空结构，且该框架上成型有隔离环，该隔离环将镂空结构分隔形成至少一高音区和一低音区，该高音区靠近磁气回路组件，该低音区远离磁气回路组件；该振动膜设置于框架上并覆盖住磁气回路组件、高音区和低音区。
作为一种优选方案，进一步包括有盖板，该盖板固定于框架上并覆盖于振动膜的上方，该盖板上设置有音孔。
作为一种优选方案，所述音孔包括有第一音孔和第二音孔，该第一音孔连通高音区，该第二音孔连通低音区。
作为一种优选方案，所述盖板上设置多个前述第一音孔和多个前述第二音孔，该多个第一音孔和多个第二音孔均呈周圆排布，且该多个第二音孔均位于该多个第一音孔的外围。
作为一种优选方案，进一步包括有隔离盖，该隔离盖与该隔离环的下部套合连接并位于磁气回路组件的下方。
一种高低音耳机结构，包括有壳体以及前述高低音喇叭单体，该壳体的内部成型有容置腔，该高低音喇叭单体装设于该容置腔中。
作为一种优选方案，所述壳体包括有后壳以及固定于该后壳上的环形挡板，该环形挡板与后壳围构成前述容置腔，该高低音喇叭单体嵌设于该环形挡板内侧周缘上。
作为一种优选方案，所述环形挡板的端面上固设有环形耳套。
作为一种优选方案，所述音室包括有第一音室和第二音室，该第二音室位于第一音室的外围并包围住该第一音室。
本发明与现有技术相比具有明显的优点和有益效果，具体而言，由上述技术方案可知：
一、通过于框架上成型有隔离环，利用隔离环将镂空结构分隔形成至少一高音区和一低音区，以使得高低音分隔开，避免高低音混合在一起，从而使得耳机的发音更加稳定，音质更好。
二、通过于隔离环上套合有一隔离盖，利用该隔离盖将容置腔分隔形成有至少两个音室，以此使得高低音分别进入不同的音室中，可进一步提高耳机的发音品质。
三、通过于盖板上设置多个前述第一音孔和多个前述第二音孔，利用该多个第一音孔和多个第二音孔均呈周圆排布，并配合该多个第二音孔均位于该多个第一音孔的外围，以此使得高音从第一音孔均匀地进出第一音室，使得低音从第二音孔均匀地进出第二音室，从而进一步提高耳机发音的均匀性和稳定性。
附图说明
图1是本发明之较佳实施例的组装立体示意图；
图2是本发明之较佳实施例的分解图；
图3是本发明之较佳实施例的截面图；
图4是本发明之较佳实施例中高低音喇叭单体的分解图。
附图标识说明：
10、壳体 11、后壳
12、环形挡板 101、容置腔
102、第一音室 103、第二音室
20、高低音喇叭单体 21、框架
211、隔离环 22、磁气回路组件
23、振动膜 24、盖板
201、中空安装位 202、高音区
203、低音区 204、第一音孔
205、第二音孔 30、隔离盖
40、环形耳套
具体实施方式
请参照图1至图4所示，其显示出了本发明之较佳实施例的具体结构，包括有壳体10以及高低音喇叭单体20。
该高低音喇叭单体20包括有框架21、磁气回路组件22以及振动膜23；该框架21呈圆盘状，该框架21的中心位置上设置有中空安装位201，该磁气回路组件22设置于框架21的中心位置上并位于中空安装位201中，该框架21上位于磁气回路组件22的外围设置有镂空结构，且该框架21上成型有隔离环211，该隔离环211将镂空结构分隔形成至少一高音区202和一低音区203，该高音区202和低音区203均呈扇形通槽，该高音区202靠近磁气回路组件22，该低音区203远离磁气回路组件22；该振动膜23设置于框架21上并覆盖住磁气回路组件22、高音区202和低音区203。
以及，该高低音喇叭单体20还包括有盖板24，该盖板24固定于框架21上并覆盖于振动膜23的上方，该盖板24上设置有音孔，在本实施例中，该音孔包括有第一音孔204和第二音孔205，该第一音孔204连通高音区202，该第二音孔205连通低音区203；并且，该盖板24上设置多个前述第一音孔204和多个前述第二音孔205，该多个第一音孔204和多个第二音孔205均呈周圆排布，且该多个第二音孔205均位于该多个第一音孔204的外围。
该壳体10的内部成型有容置腔101，该高低音喇叭单体20装设于该容置腔101中，前述隔离环的下部套合有一隔离盖30，该隔离盖30位于磁气回路组件22的下方，且该隔离盖30位于该容置腔101中并将容置腔101分隔形成有至少两个用于容纳不同高低音频段声音的音室，在本实施例中，该音室包括有第一音室102和第二音室103，该第二音室103位于第一音室102的外围并包围住该第一音室102。
具体而说，在本实施例中，该壳体10包括有后壳11以及固定于该后壳11上的环形挡板12，该环形挡板12与后壳11围构成前述容置腔101，该高低音喇叭单体20嵌设于该环形挡板12内侧周缘上，且该环形挡板12上的端面上固设有环形耳套40，该环形耳套40用于与人体耳部直接接触。
使用时，由高低音喇叭单体20发出的声音向外传播，声音的传播以发音源为中心向四周传播，离发音源最近的地方音量最高，声音向四周传播而使得音量逐渐降低，由于第一音孔204离发音源最近，使得形成的高音从第一音孔204进入第一音室102中环绕，该第二音孔205离发音源最远，使得形成的低音从第二音孔205进入第二音室103中环绕。
本发明的设计重点在于：首先，通过于扬声器上套合有至少一隔离盖，利用该隔离盖将容置腔分隔形成有至少两个音室，并对应每一音室于扬声器上均设置有连通对应之音室的音孔，以此使得高低音分别进行不同的音室中，避免高低音混合在一起，从而使得耳机的发音更加稳定，音质更好。其次，通过于盖板上设置多个前述第一音孔和多个前述第二音孔，利用该多个第一音孔和多个第二音孔均呈周圆排布，并配合该多个第二音孔均位于该多个第一音孔的外围，以此使得高音从第一音孔均匀地进出第一音室，使得低音从第二音孔均匀地进出第二音室，从而进一步提高耳机发音的均匀性和稳定性。
以上所述，仅是本发明的较佳实施例而已，并非对本发明的技术范围作任何限制，故凡是依据本发明的技术实质对以上实施例所作的任何细微修改、等同变化与修饰，均仍属于本发明技术方案的范围内。

Claims (9)

  1. 一种高低音喇叭单体，其特征在于：包括有框架、磁气回路组件以及振动膜；该磁气回路组件设置于框架的中心位置上，该框架上位于磁气回路组件的外围设置有镂空结构，且该框架上成型有隔离环，该隔离环将镂空结构分隔形成至少一高音区和一低音区，该高音区靠近磁气回路组件，该低音区远离磁气回路组件；该振动膜设置于框架上并覆盖住磁气回路组件、高音区和低音区。
  2. 根据权利要求1所述的高低音喇叭单体，其特征在于：进一步包括有盖板，该盖板固定于框架上并覆盖于振动膜的上方，该盖板上设置有音孔。
  3. 根据权利要求2所述的高低音喇叭单体，其特征在于：所述音孔包括有第一音孔和第二音孔，该第一音孔连通高音区，该第二音孔连通低音区。
  4. 根据权利要求3所述的高低音喇叭单体，其特征在于：所述盖板上设置多个前述第一音孔和多个前述第二音孔，该多个第一音孔和多个第二音孔均呈周圆排布，且该多个第二音孔均位于该多个第一音孔的外围。
  5. 根据权利要求1所述的高低音喇叭单体，其特征在于：进一步包括有隔离盖，该隔离盖与该隔离环的下部套合连接并位于磁气回路组件的下方。
  6. 一种高低音耳机结构，其特征在于：包括有壳体以及如权利要求1至4任一项所述的高低音喇叭单体，该壳体的内部成型有容置腔，该高低音喇叭单体装设于该容置腔中。
  7. 根据权利要求6所述的高低音耳机结构，其特征在于：所述壳体包括有后壳以及固定于该后壳上的环形挡板，该环形挡板与后壳围构成前述容置腔，该高低音喇叭单体嵌设于该环形挡板内侧周缘上。
  8. 根据权利要求7所述的高低音耳机结构，其特征在于：所述环形挡板的端面上固设有环形耳套。
  9. 根据权利要求6所述的高低音耳机结构，其特征在于：所述音室包括有第一音室和第二音室，该第二音室位于第一音室的外围并包围住该第一音室。
PCT/CN2013/089923 2012-12-21 2013-12-19 高低音喇叭单体以及高低音耳机结构 WO2014094625A1 (zh)

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