WO2014090302A1

WO2014090302A1 - Electroacoustic component

Info

Publication number: WO2014090302A1
Application number: PCT/EP2012/075279
Authority: WO
Inventors: Xavier PEROIS; Sylvain Jean Ballandras
Original assignee: Epcos AG
Current assignee: TDK Electronics AG
Priority date: 2012-12-12
Filing date: 2012-12-12
Publication date: 2014-06-19
Anticipated expiration: 2015-06-12
Also published as: US20150319537A1; DE112012007215T5; US9596546B2; DE112012007215B4; JP6250697B2; JP2015537492A

Abstract

An improved electroacoustic component is provided. The component comprises a carrier wafer with a passivation layer, a piezoelectric layer above the passivation layer and an interdigitated transducer in an electrode layer on the piezoelectric layer. The component is designated to work with a shear mode or a higher order Lamb mode. Preferred parameter values of the component are also provided. The piezoelectric layer is preferably lithium niobate with a y-cut angle between 50Q and 60Q, preferably 52Q or 55Q, and a thickness of about one μιη or less. The piezoelectric layer is preferably lithium tantalate with a y-cut angle between 45Q and 60Q, preferrably 48Q degrees and a thickness of about one μιη or less. A finite element simulation method for determining optimized parameters of electroacoustic components is also provided, notably including the step of neglecting thermo-differential stress in at least one direction.

Description

Electroacoustic component

The present invention refers to electroacoustic components, e.g. for electroacoustic filters.

Electroacoustic components can be utilized in RF-filters, e.g. of mobile communication devices. The components can com^¬ prise a piezoelectric material and electrode structures.

Utilizing the piezoelectric effect, the electrode structures can convert electromagnetic RF-signals into acoustic waves and vice versa. Due to the shorter wave length of acoustic waves compared to electromagnetic waves, such components al^¬ low small spatial dimensions. Thus, electroacoustic compo^¬ nents are preferred in modern mobile communication devices where small spatial dimensions are desirable.

However, the physical interaction of RF-waves and acoustic waves with the piezoelectric material and the electrode structure is complex, and the number of parameters determin- ing the behavior of the component is large. Such parameters may be, among others, the sound velocity, the frequency, the piezoelectric coupling coefficient. These parameters depend on material parameters like the type of the piezoelectric ma^¬ terial, the orientation of the material, the material of the electrodes, layer thicknesses, etc.. Thus, the dependency of the parameters is also complex, and a change of one parameter usually demands for a change of the other parameters, too, in order to obtain an electroacoustic component with properties satisfying hosting system requirements.

It is an object of the invention to provide an electroacous^¬ tic component with such physical and electric properties, e. g. a small thickness, little insertion loss, a frequency-tern- perature compensation, a high coupling coefficient, a wide^¬ band capability, a high quality factor and a good spectral purity. It is a further object to provide a method for manu^¬ facturing such a device.

A component and a method are provided by the independent claims. Dependent claims provide preferred embodiments.

In the text below numeric values are provided. Tolerance on these numerical values can be in a range of 5% to 10%.

In one embodiment, the electroacoustic component comprises a carrier wafer with a piezoelectric layer above the carrier wafer and an interdigitated transducer in an electrode layer on the piezoelectric layer.

It is possible that a passivation layer is arranged between the carrier wafer and the piezoelectric layer. The passiva^¬ tion layer can comprise S1O₂ (silicon dioxide, silica) and reduce the temperature coefficient of frequencies (TCF) . I.e. the passivation layer can bring about an improved frequency- temperature compensation. The passivation layer can be amorphous and have a thickness of 1 μιη. It is preferably pure, e.g. without ionic pollution, and dense to provide elastic properties of the layer as close as possible from the ones of the bulk material.

It is further possible that the component is designated to work with a particular type of acoustic wave as a main acous- tic wave. The wave can be a shear wave or a Rayleigh wave. However, a shear wave is preferred for various reasons discussed hereafter. Particularly, the capability of the piezoelectric layer used to excite and detect the waves to excite a single mode is particularly wanted, to promote the spectral purity of the resulting spectrum.

The carrier wafer can comprise Si (silicon) and can be a sin- gle crystal Si wafer.

The piezoelectric material can comprise Li b03 (lithium nio- bate) or LiTa03 (lithium tantalate) . The piezoelectric mate^¬ rial can be a single crystal material bonded on a passivated Si wafer.

The interdigitated transducer can comprise an electrode grating structure, e.g. interdigitated electrode fingers connected to one of two busbars, or reflector structures.

The piezoelectric material on the carrier wafer establishes a wave-guiding structure in which acoustic waves can propagate.

In one embodiment, the piezoelectric layer comprises a lith- ium niobate single crystal substrate. The substrate has a (YX1) /a cut with 50° ≤ a ≤ 60°. The thickness of the sub^¬ strate is 0.25 μιη. The carrier wafer comprises silicon and the passivation layer comprises silicon dioxide and has a thickness of 0.25 μιη.

A (YX1) /a cut is a cut where the substrate is rotated around the x-axis and x is the direction parallel to the piezoelec^¬ tric axis of the piezoelectric layer. Details concerning the rotations of piezoelectric materials can be obtained from the IEEE Std-176 standard on piezoelectricity which provides objective definitions of the crystal axes and angular

rotations. Then, a YX cut of crystal corresponds to a plate for which the width lies along the optical (Z) axis, the length along the so-called X crystallographic axis and the thickness along the Y axis in such a way that this later axis is normal to plate surface where the wave is expected to propagate. Therefore, the angle a corresponds to a rotation around the above-defined X axis, yielding specific properties to the substrate based on the angular combination of its intrinsic physical properties.

In this configuration, especially an angle a of 55° is pref- erable.

In one embodiment, the substrate has a (YX1) /a cut with 50° ≤ a ≤ 60° and a thickness of 0.35 μιη. The carrier wafer com^¬ prises silicon and the passivation layer comprises silicon dioxide and has a thickness of 0.25 μιη. The piezoelectric layer comprises a lithium niobate single crystal substrate.

In one embodiment, the piezoelectric layer comprises a lith^¬ ium niobate single crystal substrate having a (YX1) /a cut with a = 55° and a thickness of 0.25 μιη. The carrier wafer comprises silicon. The passivation layer comprises silicon dioxide and has a thickness of 0.25 μιη.

In one embodiment, the piezoelectric layer comprises a lith- ium niobate single crystal substrate and has a (YX1) /a cut with a = 55° and a thickness of 0.35 μιη. The carrier wafer comprises silicon. The passivation layer comprises silicon dioxide and has a thickness of 0.55 μιη. In one embodiment, the piezoelectric layer comprises a lith^¬ ium niobate single crystal substrate. The transducer has a metallization ratio of n = 0.5 and a mechanical period λ/2 of 1.85 μιη. The transducer further has a relative electrode height of h:X = 0.01. It is possible that the height of the electrode is h = 0.075 μιη. The substrate has a (YX1) /a cut with a = 55° and a thickness of 0.35 μιη. The carrier wafer comprises silicon. The passivation layer comprises silicon dioxide and has a thickness of 0.55 μιη.

In one embodiment, the piezoelectric layer comprises a lith^¬ ium niobate single crystal substrate. The transducer has a metallization ratio of n = 0.5 and a mechanical period of 1.85 μιη. The transducer has a relative electrode height of h:X = 0.01. The electrode height h can be 0.05 μιη. The sub^¬ strate has a (YX1) /a cut with a = 55° and a thickness of 0.175 μιη. The carrier wafer comprises silicon. The passiva^¬ tion layer comprises silicon dioxide and has a thickness of 0.275 μπι.

In one embodiment, the piezoelectric layer comprises a lith^¬ ium niobate single crystal substrate. The transducer has a metallization ratio of 0.4 ≤ n ≤ 0.5 and a mechanical period of 1.85 μιη. The transducer further has a relative electrode height of h:X = 0.05. The electrode height h can be 0.350 μιη. The substrate has a (YX1) /a cut with a = 55° and a thickness of 0.35 μιη. The carrier wafer comprises silicon. The passiva^¬ tion layer comprises silicon dioxide and has a thickness of 0.55 μιη .

It is possible that the mechanical period varies within a range of +20% or -20% for each period, e.g. the period of 1.85 μιη. With this degree of freedom for optimizing the pe- riod an advantage for dispersion properties of the wave-guid^¬ ing layer is obtained. The variation further allows to adjust the temperature coefficients of frequency. In one embodiment, the piezoelectric layer comprises a lith^¬ ium niobate single crystal substrate. The transducer has a metallization ratio of n = 0.8. The substrate has a (YX1) /a cut with a = 52°. The carrier wafer comprises silicon. The passivation layer comprises silicon dioxide.

In one embodiment, the piezoelectric layer comprises a lith^¬ ium niobate single crystal substrate. The substrate has a (YX1) /a cut with a = 52° and a thickness of 0.2 μιη. The car^¬ rier wafer comprises silicon. The passivation layer comprises silicon dioxide and has a thickness of 0.4 μιη.

In one embodiment, the transducer has a mechanical period of 1.85 μπι +/- 20%.

In one embodiment, the piezoelectric layer comprises a lith^¬ ium niobate single crystal substrate. The substrate has a (YX1) /a cut with a = 55° and a thickness of 0.35 μιη. The car^¬ rier wafer comprises silicon. The passivation layer comprises silicon dioxide and has a thickness of 0.55 μιη.

In one embodiment, the piezoelectric layer comprises a lith^¬ ium niobate single crystal substrate. The substrate has a (YX1) /a cut with a = 52° and a thickness of 0.2 μιη. The car- rier wafer comprises silicon. The passivation layer comprises silicon dioxide and has a thickness of 0.4 μιη.

In one embodiment, the piezoelectric layer comprises a lith^¬ ium tantalate single crystal substrate.

In one embodiment, the substrate has a (YX1) /a cut with a = 48° and a thickness of 0.465 μιη. The passivation layer com^¬ prises silicon dioxide and has a thickness of 0.1 μιη. The transducer can have a mechanical period of 1.9 μιη or a me^¬ chanical period of 1.9 μιη +/- 20%.

In one embodiment, the substrate has a (YX1) /a cut with a = 55°. The passivation layer comprises silicon dioxide and has a thickness of 1.0 μιη. The component is designated to work with LSAW (LSAW = Leaky SAW = leaky surface acoustic wave) . The carrier wafer has a thickness that may be 350 μιη or lar^¬ ger. The thickness can be between 350 μιη and 500 μιη. However, thicknesses over 500 μιη are also possible.

In one embodiment, the substrate has a (YX1) /a cut with a = 48° and a thickness of 0.465 μιη. The passivation layer com^¬ prises silicon dioxide and has a thickness of 1.0 μιη.

In one embodiment, the carrier wafer is designated to be a wave-guiding material.

In one embodiment, the component comprises a Bragg mirror structure below the substrate.

In one embodiment, the carrier wafer comprises silicon, sap^¬ phire, or diamond-carbon. In one embodiment, the substrate comprises lithium niobate and has a (YX1) /a cut with 45° ≤ a ≤ 60° and a thickness of 1.1 μιη. The passivation layer comprises silicon dioxide and has a thickness of 3 μιη. The carrier wafer has a thickness equal to or larger than 350 μιη.

In one embodiment, the substrate comprises lithium niobate and has a (YX1) /a cut with a = 52°. In one embodiment, the substrate comprises lithium niobate and has a (YX1) /a cut with a = 52° and a thickness of 1.0 μιη. The passivation layer comprises silicon dioxide and has a thickness of 1.0 μιη. The carrier wafer has a thickness equal to or larger than 350 μιη.

In one embodiment, the substrate comprises lithium niobate and has a (YX1) /a cut with a = 52° and a thickness of 1.1 μιη. The carrier wafer has a thickness equal to or larger than 350 μιη.

In one embodiment, the substrate comprises lithium niobate and has a (YX1) /a cut with a = 52°. The passivation layer comprises silicon dioxide and has a thickness of 1.5 μιη. The carrier wafer has a thickness equal to or larger than 350 μιη.

In one embodiment, the substrate comprises lithium niobate and has a (YX1) /a cut with a = 52° and a thickness of 1.2 μιη. The passivation layer comprises silicon dioxide and has a thickness of 1.5 μιη. The carrier wafer has a thickness equal to or larger than 350 μιη.

In one embodiment, the substrate comprises lithium niobate and has a (YX1) /a cut with a = 52° and a thickness of 1.2 μιη. The passivation layer comprises silicon dioxide and has a thickness equal to or larger than 4.0 μιη. The carrier wafer has a thickness equal to or larger than 350 μιη.

In one embodiment, the substrate comprises lithium tantalate and has a (YX1) /a cut with 48° ≤ a ≤ 52°. The passivation layer comprises silicon dioxide. The thickness of the pas^¬ sivation layer is half of the thickness of the carrier wafer. The carrier wafer has a thickness equal to or larger than 350 μιη.

In one embodiment, the substrate comprises lithium tantalate and has a (YX1) /a cut with 48° ≤ a ≤ 52° and a thickness of 1.2 μιη .

In one embodiment, the substrate comprises lithium tantalate and has a (YX1) /a cut with a = 48° and a thickness of 1.2 μιη. The passivation layer comprises silicon dioxide and has a thickness of 1.3 μιη. The carrier wafer has a thickness equal to or larger than 350 μιη.

In one embodiment, the substrate comprises lithium tantalate and has a (YX1) /a cut with a = 48° and a thickness of 2 μιη. The passivation layer comprises silicon dioxide and has a thickness of 1.5 μιη. The carrier wafer has a thickness equal to or larger than 350 μιη. A carrier wafer with a thickness equal to or larger than 350 μιη can be regarded as a semi-infinite substrate, i.e. the bottom of the substrate is mainly free of wave-induced dislocations or is processed in such a way that any

reflection related to the radiation of acoustic waves from the top surface will be diffused an not reflected in phase toward the surface to prevent any unwanted interference.

In one embodiment, the substrate comprises lithium tantalate and has a (YX1) /a cut with a = 48° and a thickness of 2 μιη. The passivation layer comprises silicon dioxide and has a thickness of 2 μιη. The carrier wafer has a thickness equal to or larger than 350 μιη. In one embodiment, the substrate comprises lithium niobate and has a thickness of 1.4 μιη. The passivation layer com^¬ prises silicon dioxide and has a thickness of 5 μιη. The transducer has a metallization ratio n being equal to or lar- ger than 0.4 and not larger than 0.5. The transducer further has a relative electrode height h:X = 0.068. The carrier wa^¬ fer has a thickness equal to or larger than 350 μιη.

In one embodiment, the substrate comprises lithium niobate and has a thickness of 1.2 μιη. The passivation layer com^¬ prises silicon dioxide and has a thickness of 5 μιη. The transducer has a metallization ratio not smaller than 0.4 and not larger than 0.5. The transducer further has a relative electrode height h:X = 0.068. The carrier wafer has a thick- ness equal to or larger than 350 μιη.

In one embodiment, the component is an RF-filter operating at a center frequency F between 1710 MHz and 1785 MHz. A method for determining optimized parameters of elec- troacoustic components comprises the steps:

- providing a simulation system capable of simulating the propagation of acoustic waves at an interface of a piezoelec^¬ tric layer;

- neglecting thermo-differential stress in at least one direction .

In this approach, one of the materials of the stack, e.g. the thicker one, forces the thermal expansion of the whole substrate along the propagation axis which is co-linear to the excitation surface whereas the expansion of the entire material stack along the normal to the substrate thickness is conform to their tabulated coefficients. In one embodiment of the method, the simulation environment is a finite element system.

In one embodiment of the method, the simulation environment is capable of simulating non-linear physical properties.

In one embodiment of the method, the simulation environment is capable of dynamics analysis. In one embodiment of the method, the simulation environment utilizes a Green's function.

In one embodiment of the method, the simulation approach combines finite element analysis and boundary integral methods, e.g. including boundary element analysis.

Further, it is possible that an electroacoustic component works with a higher order Lamb mode. Such a component com^¬ prises a carrier wafer and a piezoelectric layer above the carrier wafer. A passivation layer may be arranged between the carrier wafer and the piezoelectric layer.

The component further comprises an interdigitated transducer in an electrode layer. The electrode layer may be arranged on the piezoelectric layer. Further, the component comprises a Bragg mirror structure below the piezoelectric layer.

The passivation layer can be arranged on a substrate such as a Si substrate or a sapphire substrate.

Examples of electroacoustic components and their basic work^¬ ing principles together with computation results showing advanced properties of electroacoustic components are shown in the figures. Particularly, the figures indicate the

advantages of the above mentioned angular sectors. The advantage of the considered sectors is that it is possible to excite only very small contributions of Rayleigh waves to the predicted spectrum of interdigitated transducers deposited above the piezoelectric layer.

Short description of the Figures FIG. 1 shows a layer stack with a piezoelectric layer PIL over a carrier wafer CW.

FIG. 2 shows an arrangement of an interdigitated

transducer IDT on a piezoelectric layer PIL.

FIG. 3 shows a ladder-type filter structure LTF with se^¬ ries branch resonators SBR and parallel branch resonators PBR. FIG. 4 shows a cross-section through an electrode finger

EF on a piezoelectric substrate/layer.

FIG. 5 shows angle-dependent velocities and a coupling

coefficient for one embodiment of the electroacous- tic component.

FIG. 6 shows angle-dependent velocities and a coupling

coefficient for one embodiment of the electroacous- tic component.

FIG. 7 shows angle-dependent velocities and a coupling

coefficient for one embodiment of the electroacous- tic component. shows frequency-dependent velocities and a coupling coefficient for an embodiment of the electroacous^¬ tic component. shows velocities and a coupling coefficient vs. the thickness of the passivation layer for an embodi^¬ ment of the electroacoustic component. shows velocities and a coupling coefficient vs. the thickness of the piezoelectric layer. shows relative velocity variations and a coupling coefficient vs. temperature. shows the susceptance and the reactance vs. fre^¬ quency for an embodiment of the electroacoustic component . shows the susceptance and the reactance vs. fre^¬ quency for an embodiment of the electroacoustic component . shows the velocity vs. metallization ratio and vs. relative electrode height for an embodiment of the electroacoustic component. shows the coupling coefficient vs. the

metallization ratio and vs. the relative electrode height for an embodiment of the electroacoustic component .

FIG. 16 shows the reflection coefficient modulus vs. the metallization ratio and the relative electrode height for an embodiment of the electroacoustic component . shows the directivity vs. the metallization ratio and vs. the relative electrode height for an em^¬ bodiment of the electroacoustic component. shows the temperature coefficient of frequencies for the resonance and the anti-resonance mode vs. metallization ratio and relative electrode height for an embodiment of the electroacoustic component. shows the temperature coefficient of frequencies for resonance and anti-resonance modes vs. the met^¬ allization ratio and the relative electrode height for an embodiment of the electroacoustic component. shows the velocity vs. the metallization ratio and vs. the relative electrode height for an embodiment of the electroacoustic component. shows the coupling coefficient vs. the

metallization ratio and vs. the relative electrode height for an embodiment of the electroacoustic component . shows the reflection coefficient vs. the

metallization ratio and vs. the relative electrode height for an embodiment of the electroacoustic component . shows the directivity vs. the metallization ratio and the relative electrode height for an embodiment of the electroacoustic component. shows velocities and the coupling coefficient (an^¬ gle-dependent) of an embodiment of the elec^¬ troacoustic component. shows velocities and the coupling coefficient (an^¬ gle-dependent) for an embodiment of the elec^¬ troacoustic component. shows angle-dependent velocities and a coupling coefficient of an embodiment of the electroacoustic component . shows velocities and the coupling coefficient (fre^¬ quency-dependent) of an embodiment of the elec^¬ troacoustic component. shows velocities and the coupling coefficient vs. the thickness of the passivation layer. shows velocities and the coupling coefficient vs. the thickness of the piezoelectric layer for an em^¬ bodiment of the electroacoustic component. shows the velocity vs. the metallization ratio and vs. the relative electrode height for an embodiment of the electroacoustic component.

FIG. 31 shows the coupling coefficient vs. the

metallization ratio and vs. the relative electrode height for an embodiment of the electroacoustic component . shows the reflection coefficient vs. the metallization ratio and vs. the relative electrode height for an embodiment of the electroacoustic component .

FIG. 33 shows the directivity vs. the metallization ratio and vs. the relative electrode height for an em^¬ bodiment of the piezoelectric component. shows angle-dependent velocities and the coupling coefficient for an embodiment of the electroacous tic component. shows angle-dependent velocities and the coupling coefficient for an embodiment of the electroacous^¬ tic component. shows angle-dependent velocities and the coupling coefficient for an embodiment of the electroacous^¬ tic component. shows the real part and the imaginary part (veloc^¬ ity-dependent) of the effective permittivity of an embodiment of the electroacoustic component.

FIG. 38 shows the real part and the imaginary part (fre^¬ quency-dependent) of the effective permittivity of an embodiment of the electroacoustic component. shows velocities and the coupling coefficient vs. the thickness of the layer stack for an embodiment of the electroacoustic component. FIG. 40 shows velocities and the coupling coefficient vs.

the thickness of the layer stack. shows frequency-dependent velocities and the cou pling coefficient for an embodiment of the elec^¬ troacoustic component. shows temperature-dependent relative variations of the velocity for different thicknesses of the pas^¬ sivation layer for an embodiment of the elec^¬ troacoustic component. shows angle-dependent velocities and the coupling coefficient for an embodiment of the electroacous^¬ tic component. shows angle-dependent velocities and the coupling coefficient for an embodiment of the electroacous^¬ tic component. shows angle-dependent velocities and the coupling coefficient for an embodiment of the electroacous tic component.

FIG. 46 shows the thickness-dependent velocities and the coupling coefficient for an embodiment of the elec^¬ troacoustic component. FIG. 47 shows the thickness-dependent velocities and the coupling coefficient for an embodiment of the elec^¬ troacoustic component. shows frequency-dependent velocities and the cou pling coefficient for an embodiment of the elec^¬ troacoustic component. shows relative velocity variations and the coupling coefficient (temperature-dependent) for an embodi^¬ ment of the electroacoustic component. shows temperature-dependent relative variations of velocities and the coupling coefficient for an em^¬ bodiment of the electroacoustic component. shows temperature-dependent variations/relative variations of the velocities and the coupling coef ficient for an embodiment of the electroacoustic component . shows temperature-dependent relative variations of the frequencies and the coupling coefficient for an embodiment of the electroacoustic component. shows the velocity vs. the metallization ratio and vs. the relative electrode height for an embodiment of the electroacoustic component. shows the coupling coefficient vs. the

metallization ratio and vs. the relative electrode height for an embodiment of the electroacoustic component . shows the reflection coefficient vs. the metallization ratio and vs. the relative electrode height for an embodiment of the electroacoustic component . shows the coupling coefficient and the reflection coefficient vs. the relative electrode height for an embodiment of the electroacoustic component. shows the temperature coefficient of frequencies vs. the metallization ratio and vs. the relative electrode height for an embodiment of the elec^¬ troacoustic component. shows the temperature coefficient of frequency vs. the metallization ratio and vs. the relative elec^¬ trode height for an embodiment of the electroacous tic component. FIG. 59 shows the conductance and the susceptance (fre^¬ quency-dependent) of an embodiment of the piezo^¬ electric component.

FIG. 60 shows the conductance and the resistance (fre- quency-dependent ) of an embodiment of the elec^¬ troacoustic component. shows the insertion loss and the phase (frequency dependent) of a ladder-type filter structure. shows the frequency-dependent insertion loss of a ladder-type filter structure with five cascaded elements . Detailed description

FIG. 1 shows a layer stack with a carrier wafer CW. Above the carrier wafer CW, a piezoelectric layer PIL is arranged. Be- tween the piezoelectric layer PIL and the carrier wafer CW, a passivation layer PAL is arranged. An electrode layer EL covers the piezoelectric layer PIL. In the electrode layer EL, electrode structures can be structured that convert between RF signals and acoustic waves.

FIG. 2 shows a top view onto a schematic transducer IDT that may be structured into the electrode layer shown in FIG. 1. The transducer IDT comprises electrode fingers EFI being ar^¬ ranged next to each other. Each electrode finger EFI is con- nected to one of two bus bars BB . The transducer, thus, can be an interdigitated transducer IDT. The area of the

piezoelectric layer which is provided for propagating

acoustic waves is denoted as the acoustic track. The

transducer is arranged in the acoustic track. Structured reflecting elements on one or on both sides of the acoustic track can be utilized to confine acoustic energy in the acoustic track.

The transducer can be a part of an electro-acoustic resona- tor. Electro-acoustic resonators can be electrically con^¬ nected to form an RF-filter as shown in FIG. 3.

FIG. 3 shows a ladder-type filter structure LTF with a series connection of series branch resonators SBR and a plurality of parallel branch resonators PBR in shunt branches that can connect the signal path comprising the series branch resona^¬ tors with a ground potential. FIG. 4 shows a cross-section through an electroacoustic component. The section's plane is perpendicular to an electrode finger EF. The electrode finger EF is arranged on the piezo^¬ electric layer PIL. The electrode finger EF has a height h and a width a. The transducer has a pitch p which is defined as the mean distance between center points of adjacent elec^¬ trode fingers EF or between adjacent excitation centers which are arranged between adjacent electrode fingers. The direc^¬ tion of propagation of acoustic waves is parallel to the sur- face of the piezoelectric layer PIL and orthogonal to the ex^¬ tension of the electrode fingers EF, i.e. the direction of propagation of acoustic waves is along the xl direction. The electrode fingers EF extend in the x3 direction. FIG. 5 shows phase velocities v_free, v_met and the coupling co^¬ efficient K² of a Lamb mode for an electroacoustic component with a 1 μιη thick lithium niobate layer and a 1 μιη thick S1O₂ layer as a passivation layer on the piezoelectric layer. The operating frequency is set to 1 GHz. The velocities and the coupling coefficient depend on the cut angle Θ. The cut angle Θ defines the rotation around the crystal X-axis. Concerning the crystal orientations one must consider first the crystal axes to define the cut angle. The plate axes then do

correspond to rotated crystal axes which usually, cp . the the Std-176 standard, are noted with a prime for one rotation, two primes for two rotations etc. In the present case, i.e. a singly-rotated plate, the crystal axis X corresponds to the xl axis (the axis around which the rotation is achieved) , whereas the rotated Y axis (written Y') coincides with x2 and hence Z' and x3 are colinear.

Vf_ree denotes the phase velocity for a free, i.e. not meta- lized, piezoelectric surface. v_met denotes the velocity for a metalized piezoelectric surface, i.e. a piezoelectric layer supporting an homogeneous metal layer without mass loading effect, i.e. the layer is assumed infinitely thin, but the boundary conditions are those of an homogeneous surface electrical potential forced to zero without any loss of generality .

FIG. 6 shows phase velocities for a free surface v_free and for a metalized surface v_met and the coupling coefficient κ² ver- sus the cut angle Θ for the layer stack as referred to in FIG. 5 but with respect to a shear mode.

FIG. 7 shows the phase velocity v_free for a free surface, the phase velocity v_met for a metalized surface and the coupling coefficient κ² for the layer stacks referred to in FIGs. 5 and 6 versus cut angle Θ. However, FIG. 7 shows the veloci^¬ ties and the coupling coefficient for a longitudinal mode.

In the angular range of 50° to 60°, the Lamb mode is sup- pressed and the shear mode exhibits an electro-mechanical coupling coefficient larger than 15%. Near Θ = 120°, the shear mode is suppressed and the Lamb mode exceeds 4%. Thus, the angular range from 50° to 60° can be utilized with a shear mode, and the angular range around 120° can be used with a Lamb mode. In both angular ranges, the respective lon^¬ gitudinal mode is relatively weak.

Especially an angle of Θ = 55° can be favored for a shear- mode electroacoustic component.

FIG. 8 shows the frequency dependence of the phase velocity for a free surface v_free, of the phase velocity for a meta^¬ lized surface v_met, and the frequency-dependent coupling coef- ficient κ for a cut angle Θ = 55°. The piezoelectric layer comprises lithium niobate and has a thickness of 0.25 μιη. The passivation layer comprises silica and has a thickness of 0.25 μιη .

FIG. 9 shows the phase velocity v_free for a free piezoelectric surface, the phase velocity v_met for a metalized piezoelectric surface and the coupling coefficient κ² vs. the thickness t of the passivation layer. The piezoelectric substrate

comprises Li b03 and has a thickness of 500 nm.

FIG. 10 shows the phase velocity v_free for a free piezoelec^¬ tric surface, the phase velocity v_met for a metalized piezo^¬ electric surface and the coupling coefficient κ² vs. the thickness t of the piezoelectric layer. The piezoelectric substrate comprises LiNb03. The passivation layer comprises S1O₂ and has a thickness of 500 nm.

A high coupling coefficient κ² can be obtained for thin pas- sivation layers. However, a finite passivation layer thickness is needed for reducing the TCF. With a 200 nm thick LiNb0₃ layer and a 400 nm thick Si0₂ layer, a TCF of -2,8 ppm/K can be obtained for v_met and for a resonance frequency, and a TCF of 1.13 ppm/K can be obtained for v_free for an anti- resonance frequency (compare FIGS. 20-23).

FIG. 11 shows the temperature sensitivity of velocity varia^¬ tions Av_met/v_met, Av_free/v_free, and the coupling coefficient κ² in the temperature range from -50° C to 150° C for a shear mode. The piezoelectric layer comprises Li b03 and has a thickness of 350 nm, and the passivation layer comprises S1O₂ and has a thickness of 550 nm. FIG. 12 shows the harmonic admittance of a periodic Al-grat- ing atop a Li b0₃ (YXl)/55° piezoelectric layer on a S1O₂ passivation layer. The pitch p is 1.85 ym, the metallization ratio n = a/p is 0.5. The relative height of the electrode h/λ is 1% with a height h of 75nm. The Li b0₃ has a thickness of 350 nm, and the S1O₂ is 550 nm thick.

FIG. 13 shows the harmonic admittance of a periodic Al-grat- ing atop a Li b0₃ (YXl)/55° piezoelectric layer on a S1O₂ passivation layer. The pitch p is 1.85 ym, the metallization ratio n = a/p is 0.5. The relative height of the electrode h/λ is 1% with a height h of 75nm. The Li b0₃ has a thickness of 175 nm, and the S i0₂ is 275 nm thick. A systematic computation yields: For 0.4 < a/p < 0.45, cou^¬ pling factors in excess of 23% are obtained with a reflection coefficient on a single obstacle, e.g. a single aluminum electrode, approaching 25%. The obstacle can have a relative height h/λ near 5%, e.g. h = 350 nm.

FIG. 14 shows the phase velocity v vs. the metallization ra^¬ tio a/p and vs. the relative electrode height h/λ for an electroacoustic component. FIG. 15 shows the coupling coefficient κ² vs. the

metallization ratio a/p and vs. the relative electrode height h/λ for the component of FIG. 14.

FIG. 16 shows the reflection coefficient modulus |R| vs. the metallization ratio a/p and vs. the relative electrode height h/λ for the component of FIG. 14. FIG. 17 shows the directivity δ vs. the metallization ratio a/p and vs. the relative electrode height h/λ for the compo^¬ nent of FIG. 14. FIGS. 14 to 17 show mixed matrix parameters for an elec- troacoustic component with a piezoelectric layer comprising Li b03 with a cut angle Θ of 55° and a thickness of 350 nm. The piezoelectric layer is arranged on a 550 nm thick S1O₂ layer. The electrode structure comprises Al (Aluminium) and has a pitch p of 1.85 μιη.

FIG. 18 shows the TCF vs. metallization ratio a/p and vs. the relative electrode height h/λ for the resonance frequency f_r and for the anti-resonance frequency f_a. It was found that the use of Al can reduce the TCF by approximately 1 ppm/K per percent of the relative electrode height. A minimum differ^¬ ence of the TCF between f_r and f_a can be obtained at approx. a/p = 0.8. FIG. 19 shows the TCF vs. metallization ratio a/p and vs. the relative electrode height h/λ for the resonance frequency f_r and for the anti-resonance frequency f_a. The component re^¬ ferred to in FIG. 19 has a 200 nm thick (YXl)/52° LiNb0₃ layer on a 400 nm thick S1O₂ layer. At a metallization ratio a/p of approx. 0.6, the difference in TCF for f_r and f_a mainly vanishes and small absolute TCF values are obtained for different normalized heights h.

FIG. 20 shows the phase velocity v vs. the metallization ra- tio a/p and vs. the relative electrode height h/λ for an electroacoustic component. FIG. 21 shows the coupling coefficient κ vs. the metalliza^¬ tion ratio a/p and vs. the relative electrode height for the component of FIG. 20. FIG. 22 shows the reflection coefficient modulus |R| vs. the metallization ratio a/p and vs. the relative electrode height for the component of FIG. 20.

FIG. 23 shows the directivity δ vs. the metallization ratio a/p and vs. the relative electrode height for the component of FIG. 20.

FIGS. 20 to 23 show mixed matrix parameters for an elec- troacoustic component with a piezoelectric layer comprising Li b03 with a cut angle Θ of 52° and a thickness of 200 nm. The piezoelectric layer is arranged on a 400 nm thick S1O₂ layer. The electrode structure comprises Al and has a pitch p of 1.85 μιη . FIG. 24 shows the phase velocity v_free for a free surface, the phase velocity v_met for a metalized surface and the elec- troacoustic coupling coefficient κ² for a Lamb mode of an electroacoustic component. The component has a 1 μιη thick LiTa03 piezoelectric layer on a 1 μιη thick S1O₂ layer.

FIG. 25 shows the phase velocity v_free for a free surface, the phase velocity v_met for a metalized surface and the elec^¬ troacoustic coupling coefficient κ² for a shear mode of an electroacoustic component. The component has a 1 μιη thick LiTa03 piezoelectric layer on a 1 μιη thick S1O₂ layer.

FIG. 26 shows the phase velocity v_free for a free surface, the phase velocity v_met for a metalized surface and the elec- troacoustic coupling coefficient κ for a longitudinal mode of an electroacoustic component. The component has a 1 μιη thick Li a03 piezoelectric layer on a 1 μιη thick S1O₂ layer. FIG. 27 shows the shear mode dispersion of an electroacoustic component with a 1 μιη thick (YXl)/55° Li b03 layer above a 1 μιη thick Si0₂-comprising passivation layer. v_free denotes the phase velocity of a free surface, v_met denotes the phase ve^¬ locity of a metalized surface, and κ² denotes the coupling coefficient.

FIG. 28 shows the phase velocity v_free of a free surface, the phase velocity v_met of a metalized surface and the coupling coefficient κ² vs. the thickness of a passivation layer com- prising Si0₂- The component has a 500 nm thick Li b03 piezo^¬ electric layer.

FIG. 29 shows the phase velocity v_free of a free surface, the phase velocity v_met of a metalized surface and the coupling coefficient κ² vs. the thickness of a piezoelectric layer comprising Li b03. The component has a 500 nm thick Si0₂ pas^¬ sivation layer.

FIG. 30 shows the phase velocity v vs. the metallization ra- tio a/p and vs. the relative electrode height h/λ for an electroacoustic component.

FIG. 31 shows the coupling coefficient κ² vs. the

metallization ratio a/p and vs. the relative electrode height for the component of FIG. 30. FIG. 32 shows the reflection coefficient modulus |R| vs. the metallization ratio a/p and vs. the relative electrode height for the component of FIG. 30. FIG. 33 shows the directivity δ vs. the metallization ratio a/p and vs. the relative electrode height for the component of FIG. 30. This parameter reveals close to zero and

therefore a resonance at the beginning of the frequency stop- band is expected with any sensitivity to the metallization parameters.

FIGS. 30 to 33 show mixed matrix parameters for an elec- troacoustic component with a piezoelectric layer comprising Li b03 with a cut angle Θ of 48° and a thickness of 465 nm. The piezoelectric layer is arranged on a 100 nm thick S1O₂ layer. The electrode structure comprises Al and has a pitch p of 1.9 μιη .

FIG. 34 shows the phase velocity v_free for a free surface, the phase velocity v_met for a metalized surface and the elec- troacoustic coupling coefficient κ² for a longitudinal mode of an electroacoustic component. The component has a 1.1 μιη thick Li b03 piezoelectric layer on a 3 μιη thick S1O₂ sub^¬ strate as a passivation layer. A thickness of 3 μιη is large enough to substantially suppress a dislocation of the under^¬ side of the S1O₂ substrate. Thus, substrates having a thick^¬ ness equal to or larger than 3 μιη can be regarded as semi-in^¬ finite substrates for this mode especially. Whether a

thickness is large enough to make the substrate quasi semi- infinite depends on the frequency. For instance, for

frequencies equal to or higher than 1 GHz, a thickness of 550 nm or even 350 nm can make the substrate appear semi- infinite . FIG. 35 shows the phase velocity v_free for a free surface, the phase velocity v_met for a metalized surface and the elec- troacoustic coupling coefficient κ² for a shear mode of an electroacoustic component. The component has a 1.1 μιη thick Li b03 piezoelectric layer on a 3 μιη thick S1O₂ substrate.

FIG. 36 shows the phase velocity v_free for a free surface, the phase velocity v_met for a metalized surface and the elec- troacoustic coupling coefficient κ² for a longitudinal mode of an electroacoustic component. The component has a 1.1 μιη thick Li b03 piezoelectric layer on a 3 μιη thick S1O₂ sub^¬ strate . FIG. 37 shows the real part Re and the imaginary part Im of the effective permittivity vs. the phase velocity v of an electroacoustic component with a (YXl)/52° Li b03 piezoelec^¬ tric layer on a Si wafer with a S1O₂ passivation layer in be^¬ tween at 600 MHz. The piezoelectric layer is 1.1 μιη thick and the passivation layer is 3 μιη thick.

FIG. 38 shows the real part Re and the imaginary part Im of the effective permittivity vs. the phase velocity v of an electroacoustic component with a (YXl)/52° Li b03 piezoelec- trie layer on a Si wafer with a Si0₂ passivation layer in be^¬ tween at 400 MHz. The piezoelectric layer is 1 μιη thick and the passivation layer is 1 μιη thick.

FIG. 39 shows the phase velocity v_free of a free surface, the phase velocity v_met of a metalized surface and the coupling coefficient κ² vs. the thickness t of a layer stack compris^¬ ing the piezoelectric layer and the passivation layer for an electroacoustic component. The piezoelectric layer is 1.1 μιη thick and comprises (YXl)/52° Li b03. The operation frequency is 400 MHz.

FIG. 40 shows the phase velocity v_free of a free surface, the phase velocity v_met of a metalized surface and the coupling coefficient κ² vs. the thickness t of a layer stack compris^¬ ing the piezoelectric layer and the passivation layer for an electroacoustic component. The passivation layer is 1.5 μιη thick and comprises Si0₂. The operation frequency is 400 MHz.

FIG. 41 shows the phase velocity v_free of a free surface, the phase velocity v_met of a metalized surface and the coupling coefficient κ² vs. the frequency f of a layer stack compris^¬ ing the piezoelectric layer and the passivation layer for an electroacoustic component. The piezoelectric layer is 1.2 μιη thick and comprises (YXl)/52° Li b0₃. The passivation layer is 1.5 μιη thick and comprises Si0₂.

FIG. 42 shows the dependence of the relative velocity Δν/ν on the temperature T. Thus, different Δν/ν vs. temperature T lines for different passivation layer thicknesses are shown. For t = 4 μιη and t = 4.5 μιτι, small temperature-induced veloc^¬ ity variations can be obtained. FIG. 43 shows the phase velocity v_free for a free surface, the phase velocity v_met for a metalized surface and the elec^¬ troacoustic coupling coefficient κ² for an elliptically po^¬ larized mode of an electroacoustic component. The component has a 1.1 μιη thick LiTa03 piezoelectric layer on a 1.5 μιη thick S1O₂ substrate as a passivation layer.

FIG. 44 shows the phase velocity v_free for a free surface, the phase velocity v_met for a metalized surface and the elec- troacoustic coupling coefficient κ² for a shear mode of an electroacoustic component. The component has a 1.1 μιη thick Li a03 piezoelectric layer on a 1.5 μιη thick S1O₂ substrate. FIG. 45 shows the phase velocity v_free for a free surface, the phase velocity v_met for a metalized surface and the elec^¬ troacoustic coupling coefficient κ² for a longitudinal mode of an electroacoustic component. The component has a 1.1 μιη thick LiTa03 piezoelectric layer on a 1.5 μιη thick S1O₂ sub- strate.

FIGS. 42 to 45 show parameters for an electroacoustic compo^¬ nent with LiTa03 as the piezoelectric material. The propor^¬ tion of the piezoelectric layer and the passivation layer is well balanced in FIGS. 43 to 45. The shown results are based on a (YXl)/48° LiTa03 material, which is commercially avail^¬ able and can help verifying computational results.

FIG. 46 shows the phase velocity v_free of a free surface, the phase velocity v_met of a metalized surface and the coupling coefficient κ² vs. the thickness t of a layer stack compris^¬ ing the piezoelectric layer and the passivation layer for an electroacoustic component. The piezoelectric layer is 1 μιη thick and comprises (YXl)/52° LiTa03. The operation frequency is 500 MHz.

FIG. 47 shows the phase velocity v_free of a free surface, the phase velocity v_met of a metalized surface and the coupling coefficient κ² vs. the thickness t of a layer stack compris- ing the piezoelectric layer and the passivation layer for an electroacoustic component. The piezoelectric layer comprises (YXl)/52° LiTa0₃. The passivation layer is 1.4 μιη thick and comprises Si0₂. The operation frequency is 400 MHz. FIG. 48 shows the phase velocity v_free of a free surface, the phase velocity v_met of a metalized surface and the coupling coefficient κ² vs. the frequency f for a layer stack compris^¬ ing the piezoelectric layer and the passivation layer for an electroacoustic component. The piezoelectric layer is 1.2 μιη thick and comprises (YXl)/52° Li b0₃. The passivation layer is 1.4 μιη thick and comprises Si0₂.

FIGS. 46 to 48 show parameters of electroacoustic components that allow favorable operating points. It was found that es^¬ pecially a small TCF can be obtained.

FIG. 49 shows the dependence of the relative velocity Δν/ν on the temperature T for a free surface v_free and for a metalized surface v_met and of the coupling coefficient κ². The

electroacoustic component has a 1.2 μιη thick (YXl)/52° LiTa03 layer on a 1.4 μιη S1O₂ layer.

FIG. 50 shows the dependence of the relative velocity Δν/ν on the temperature T for a free surface v_free and for a metalized surface v_met and of the coupling coefficient κ². The component has a 1.2 μιη thick (YXl)/48° LiTa03 layer on a 1.3 μιη thick S1O2 layer. FIG. 51 shows the dependence of the relative velocity Δν/ν on the temperature T for a free surface v_free and for a metalized surface v_met and of the coupling coefficient κ². The component has a 2 μιη thick (YXl)/48° LiTa03 layer on a 1.5 μιη thick S1O2 layer.

FIG. 52 shows the dependence of the relative velocity Δν/ν on the temperature T for a free surface v_free and for a metalized surface v_met and of the coupling coefficient κ². The component has a 2 μιη thick (YXl)/48° Li a03 layer on a 2 μιη thick S1O₂ layer .

All four components shown in FIGS. 49 to 52 have an operating frequency of 500 MHz. The use of (YXl)/48° LiTa0₃ is favor^¬ able as the TCF can be minimized: A frequency-temperature turnover can be obtained near room temperature while κ² is larger that 10%. However, Rayleigh-wave-like contributions can still be present.

FIG. 53 shows the phase velocity v vs. the metallization ra^¬ tio a/p and vs. the relative electrode height h/λ for an electroacoustic component. FIG. 54 shows the coupling coefficient κ² vs. the

metallization ratio a/p and vs. the relative electrode height for the component of FIG. 30.

FIG. 55 shows the reflection coefficient modulus |R| vs. the metallization ratio a/p and vs. the relative electrode height for the component of FIG. 30.

FIG. 56 shows the optimum of the coupling coefficient κ2 and the reflection coefficient modulus |R|, both vs. the relative electrode height h/λ.

FIGS. 53 to 56 show parameters of the second shear mode of an electroacoustic component with a 1.4 μιη thick (YXl)/52° Li b03 as a piezoelectric material on a 5 μιη thick S1O₂ pas- sivation layer. The passivation layer is arranged on a quasi semi-infinite Si wafer. The pitch of Al electrodes is set to 5 μιη yielding an operation frequency near 400 MHz. FIG. 57 shows the TCF of a component vs. the metallization ratio a/p and vs. the relative electrode height h/λ. The component has a 1.4 μιη thick (YXl)/52° Li b03 layer on a 5 μιη thick S1O₂ layer which itself is arranged on a Si wafer.

FIG. 58 shows the TCF of a component vs. the metallization ratio a/p and vs. the relative electrode height h/λ. The component has a 1.2 μιη thick (YXl)/52° Li b03 layer on a 5 μιη thick S1O₂ layer which itself is arranged on a Si wafer.

From FIGS. 57 and 58 it can be seen that a TCF close to 0 can be obtained, e.g. for relative electrode heights h/λ 7% at frequencies around 500 MHz. To obtain optimal parameters for higher frequencies, e.g. around 2 GHz, the thickness of the passivation layer can be increased, e.g. to up to 2 μιη.

FIG. 59 shows the conductances C and susceptances S as means for the electric response of a series branch resonator and of a parallel branch resonator.

FIG. 60 shows the conductances C and resistances R of a se^¬ ries branch resonator and of a parallel branch resonator.

FIG. 61 shows the transfer function S2₁ and the respective phase of one cell of a ladder type filter structure compris^¬ ing optimized parameters. Required specifications are ful^¬ filled.

FIG. 62 shows the transfer function S2₁ of a ladder-type fil- ter structure comprising 5 cells. Required specifications are fulfilled . List of reference signs:

|R| : modulus of the reflection coefficient

a/p: metallization ratio

a: electrode width

BB : busbar

CW: carrier wafer

EFI : electrode finger

EL: electrode layer

f : frequency

h: height of an electrode finger / thickness of the electrode layer

IDT: transducer

Im(s) : imaginary part of the permittivity

LTF: ladder-type filter structure

p: pitch

PAL: passivation layer

PBR: parallel branch resonator

PIL: piezoelectric layer

Re(s) : real part of the permittivity

S21: transfer function

SBR: series branch resonator

T: temperature

t: thickness

TCF: temperature coefficient of frequency

v: phase velocity

v_free : phase velocity of an acoustic wave at a free surface v_met : phase velocity of an acoustic wave at a metalized surface

δ: directivity

ε : permittivity

Θ: rotation angle coupling coefficient acoustic wavelength Phase

Claims

1. An electroacoustic component, comprising

- a carrier wafer with a passivation layer

- a piezoelectric layer above the passivation layer and

- an interdigitated transducer in an electrode layer on the piezoelectric layer, where

- the component is designated to work with a shear mode.

2. The component of claim 1, where

- the piezoelectric layer comprises a Li b03 single crystal substrate,

- the substrate has a (YX1) /a cut with 50° <= a <= 60° and a thickness of 0.25 μιτι,

- the carrier wafer comprises Si,

- the passivation layer comprises S1O₂ and has a thickness of 0.25 μιη .

3. The component of claim 1, where

- the piezoelectric layer comprises a Li b03 single crystal substrate,

- the substrate has a (YX1) /a cut with 50° <= a <= 60° and a thickness of 0.35 μιτι,

- the carrier wafer comprises Si,

- the passivation layer comprises Si0₂ and has a thickness of 0.25 μιη .

4. The component of claim 1, where

- the piezoelectric layer comprises a Li b03 single crystal substrate,

- the substrate has a (YX1) /a cut with a = 55° and a thickness of 0.25 μιτι,

- the carrier wafer comprises Si, - the passivation layer comprises S1O₂ and has a thickness of 0.25 μιη .

5. The component of claim 1, where

- the piezoelectric layer comprises a Li b03 single crystal substrate,

- the substrate has a (YX1) /a cut with a = 55° and a

thickness of 0.35 μιτι,

- the carrier wafer comprises Si,

- the passivation layer comprises S1O₂ and has a thickness of 0.55 μιη .

6. The component of claim 1, where

- the piezoelectric layer comprises a Li b03 single crystal substrate,

- the transducer has a metallization ratio of n = 0.5 and a relative electrode height of h/λ = 0.01,

- the substrate has a (YX1) /a cut with a = 55° and a

thickness of 0.35 μιτι,

- the carrier wafer comprises Si,

- the passivation layer comprises Si0₂ and has a thickness of 0.55 μιη .

7. The component of claim 1, where

- the piezoelectric layer comprises a Li b03 single crystal substrate,

- the substrate has a (YX1) /a cut with a = 55° and a

thickness of 0.175 μιτι,

- the carrier wafer comprises Si,

- the passivation layer comprises Si0₂ and has a thickness of 0.275 μιη .

8. The component of claim 1, where

- the piezoelectric layer comprises a Li b03 single crystal substrate,

- the transducer has a metallization ratio of 0.4 <= n <= 0.5 and

a relative electrode height of h/λ = 0.05,

- the substrate has a (YX1) /a cut with a = 55° and a

thickness of 0.35 μιτι,

- the carrier wafer comprises Si,

- the passivation layer comprises S1O₂ and has a thickness of 0.55 μιη .

9. The component of claim 1, where

- the piezoelectric layer comprises a Li b03 single crystal substrate,

- the transducer has a metallization ratio of n = 0.8,

- the substrate has a (YX1) /a cut with a = 52°,

- the carrier wafer comprises Si,

- the passivation layer comprises Si0₂-

10. The component of claim 1, where

- the piezoelectric layer comprises a Li b03 single crystal substrate,

- the substrate has a (YX1) /a cut with a = 52° and a

thickness of 0.2 μιτι,

- the carrier wafer comprises Si,

- the passivation layer comprises Si0₂ and has a thickness of 0.4 μπι.

11. The component of claim 1, where

- the piezoelectric layer comprises a Li b03 single crystal substrate, - the substrate has a (YX1) /a cut with a = 55° and a

thickness of 0.35 μιτι,

- the carrier wafer comprises Si,

- the passivation layer comprises S1O₂ and has a thickness of 0.55 μιη .

12. The component of claim 1, where

- the piezoelectric layer comprises a Li b03 single crystal substrate,

- the substrate has a (YX1) /a cut with a = 52° and a

thickness of 0.20 μιτι,

- the carrier wafer comprises Si,

- the passivation layer comprises Si0₂ and has a thickness of 0.40 μπι.

13. The component of claim 1, where

- the piezoelectric layer comprises a LiTa03 single crystal substrate .

14. The component of claim 13, where

- the substrate has a (YX1) /a cut with a = 48° and a

thickness of 0.465 μιτι,

- the passivation layer comprises Si0₂ and has a thickness of

0.10 μπι.

15. The component of claim 13, where

- the substrate has a (YX1) /a cut with a = 55°,

- the passivation layer comprises Si0₂ and has a thickness of

1.0 μιη,

- the component is designated to work with LSAW,

- the carrier wafer has a thickness >= 350 μιη.

16. The component of claim 13, where

- the substrate has a (YX1) /a cut with a = 48° and a

thickness of 0.465 μιτι,

- the passivation layer comprises S1O₂ and has a thickness of 1.0 μιη .

17. The component of claim 13, where

- the carrier wafer is designated to be a wave-guiding material .

18. The component of claim 13, further comprising a Bragg mirror structure below the substrate.

19. The component of claim 18, where the carrier wafer comprises Si, sapphire, or diamond-carbon.

20. The component of claim 1, where

- the substrate comprises LiNb03, has a (YX1) /a cut with 45° <= a <= 60° and a thickness of 1.1 μιτι,

- the passivation layer comprises S1O₂ and has a thickness of 3 μιη,

- the carrier wafer has a thickness >= 350 μιη.

21. The component of claim 1, where

- the substrate comprises Li b03 and has a (YX1) /a cut with a = 52⁰.

22. The component of claim 1, where

- the substrate comprises Li b03 and has a (YX1) /a cut with a = 52° and a thickness of 1.0 μιτι,

- the passivation layer comprises S1O₂ and has a thickness of 1.0 μιη, - the carrier wafer has a thickness >= 350 μιη.

23. The component of claim 1, where

- the substrate comprises Li b03 and has a (YX1) /a cut with a = 52° and a thickness of 1.1 μιτι,

- the carrier wafer has a thickness >= 350 μιη.

24. The component of claim 1, where

- the substrate comprises Li b03 and has a (YX1) /a cut with a = 52 ° ,

- the passivation layer comprises S1O₂ and has a thickness of 1.5 μιη,

- the carrier wafer has a thickness >= 350 μιη.

25. The component of claim 1, where

- the substrate comprises Li b03 and has a (YX1) /a cut with a = 52° and a thickness of 1.2 μιτι,

- the passivation layer comprises S1O₂ and has a thickness of 1.5 μιη,

- the carrier wafer has a thickness >= 350 μιη.

26. The component of claim 1, where

- the passivation layer comprises S1O₂ and has a thickness >= 4.0 μπι,

- the carrier wafer has a thickness >= 350 μιη.

27. The component of claim 1, where

- the substrate comprises LiTa03 and has a (YX1) /a cut with 48° <= a <= 52°,

- the passivation layer comprises Si0₂ and has half the thickness of the carrier wafer, - the carrier wafer has a thickness >= 350 μιη.

28. The component of claim 1, where

- the substrate comprises LiTa03 and has a (YX1) /a cut with 48° <= a <= 52° and a thickness of 1.2 μιτι,

- the passivation layer comprises S1O₂ and has a thickness of 1.4 μιτι,

- the carrier wafer has a thickness >= 350 μιη.

29. The component of claim 1, where

- the substrate comprises LiTa03 and has a (YX1) /a cut with a = 48° and a thickness of 1.2 μιτι,

- the passivation layer comprises S1O₂ and has a thickness of 1.3 μιη,

- the carrier wafer has a thickness >= 350 μιη.

30. The component of claim 1, where

- the substrate comprises LiTa03 and has a (YX1) /a cut with a = 48° and a thickness of 2 μιτι,

- the passivation layer comprises S1O₂ and has a thickness of 1.5 μιη,

- the carrier wafer has a thickness >= 350 μιη.

31. The component of claim 1, where

- the passivation layer comprises Si0₂ and has a thickness of 2 μιτι,

- the carrier wafer has a thickness >= 350 μιη.

32. The component of claim 1, where

- the substrate comprises Li b03 and has a thickness of 1.4 μιη, - the passivation layer comprises S1O₂ and has a thickness of 5 μιη,

- the transducer has a metallization ratio of 0.4 <= n <= 0.5 and a relative electrode height h/λ = 0.068,

- the carrier wafer has a thickness >= 350 μιη.

33. The component of claim 1, where

- the substrate comprises Li b03 and has a thickness of 1.2 μιη,

- the passivation layer comprises S1O₂ and has a thickness of 5 μιη,

- the carrier wafer has a thickness >= 350 μιη.

34. The component of claim 1, being an RF-filter operating at a center frequency 1710 MHz <= f <= 1785 MHz.

35. Method for determining optimized parameters of

electroacoustic components, comprising the steps of:

- providing a simulation system capable of simulating the propagation of acoustic waves at an interface of a

piezoelectric layer,

- neglecting thermo-differential stress in at least one direction.

36. The method of claim 35, where the simulation environment is a finite element system.

37. The method of claim 35, where the simulation environment is capable of simulating non-linear physical properties.

38. The method of claim 35, where the simulation environment is capable of dynamics analysis.

39. The method of claim 35, where the simulation environment utilizes a Green's function.

40. The method of claim 35, wherein the simulation approach combines finite element analysis and boundary integral methods including boundary element analysis.

41. An electroacoustic component, comprising

- a carrier wafer with a passivation layer

- a piezoelectric layer above the passivation layer and

- an interdigitated transducer in an electrode layer on the piezoelectric layer,

- a Bragg mirror structure below the piezoelectric layer, where

- the component is designated to work with a higher order Lamb mode .