WO2014087842A1 - Liquid crystal resin composition for camera module and camera module using same - Google Patents
Liquid crystal resin composition for camera module and camera module using same Download PDFInfo
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- WO2014087842A1 WO2014087842A1 PCT/JP2013/081324 JP2013081324W WO2014087842A1 WO 2014087842 A1 WO2014087842 A1 WO 2014087842A1 JP 2013081324 W JP2013081324 W JP 2013081324W WO 2014087842 A1 WO2014087842 A1 WO 2014087842A1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/346—Clay
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
- C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C08L23/0869—Acids or derivatives thereof
- C08L23/0884—Epoxide containing esters
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/12—Polyester-amides
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K19/00—Liquid crystal materials
- C09K19/04—Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit
- C09K19/38—Polymers
- C09K19/3804—Polymers with mesogenic groups in the main chain
- C09K19/3809—Polyesters; Polyester derivatives, e.g. polyamides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
- C08L25/08—Copolymers of styrene
- C08L25/14—Copolymers of styrene with unsaturated esters
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
Definitions
- the present invention relates to a liquid crystal resin composition for a camera module and a camera module using the same.
- Liquid crystalline resins typified by liquid crystalline polyester resins have excellent mechanical strength, heat resistance, chemical resistance, electrical properties, etc. in a well-balanced manner and have excellent dimensional stability. It's being used. Recently, liquid crystal resins have been used for precision equipment parts by taking advantage of these features.
- a small amount of dust, dust, etc. will affect the performance of the equipment.
- a part used in an optical device such as a camera module
- the optical characteristics of the camera module are significantly deteriorated.
- the parts that make up the camera module (hereinafter sometimes referred to as “camera module parts”) are ultrasonically cleaned before being assembled and attached to the surface. Small dust, oil, dust, etc. are removed.
- the molded body formed by molding the liquid crystalline resin composition is easy to peel off because the molecular orientation of the polymer is particularly large in the surface portion.
- the fluffing phenomenon of peeling and fluffing occurs, and the fluffed raised portion causes small dust.
- liquid crystalline resin composition when used as a raw material for camera module parts, a special liquid crystalline resin composition that does not raise the surface of the molded body even when the molded body is subjected to ultrasonic cleaning is used.
- a special liquid crystalline resin composition a liquid crystalline resin composition for a camera module containing a liquid crystalline resin, a specific talc, and carbon black is disclosed (see Patent Document 1).
- the liquid crystalline resin composition for a camera module described in Patent Document 1 has insufficient suppression of raising of the surface of the molded article, and the molded article is more difficult to raise the surface of the molded article.
- a liquid crystalline resin composition for a camera module for manufacturing the above is required.
- the lens holder moves up and down on the guide that becomes the base of the lens holder by the action of the magnetic force generated by the coil wound around the lens holder and the permanent magnet arranged around the coil, Adjust the focus of the lens.
- the lens holder is usually made of a material containing a liquid crystalline resin
- the guide is made of a resin other than the liquid crystalline resin, for example, a material containing nylon.
- the present invention has been made to solve the above-mentioned problems, and its object is to provide a liquid crystalline resin composition for a camera module for producing a camera module component that is less likely to be raised and charged. There is to do.
- the inventors of the present invention have made extensive studies to solve the above problems. As a result, by using a liquid crystalline resin composition for a camera module containing a liquid crystalline resin, a specific non-conductive filler, a specific copolymer and a specific conductive filler in a specific ratio, The present inventors have found that the problem can be solved and have completed the present invention. More specifically, the present invention provides the following.
- the (C2) styrene copolymer is composed of styrenes and a glycidyl ester of ⁇ , ⁇ -unsaturated acid, and the (D1) fibrous conductive filler is an average fiber.
- the length is 50 ⁇ m or more, and the (D2) non-fibrous conductive filler is at least one selected from a plate-like filler and a granular filler having an average particle diameter of 20 nm to 50 ⁇ m, and has a volume resistivity.
- a camera module part comprising the liquid crystalline resin composition for a camera module described in (1).
- a camera module comprising a lens holder and a guide serving as a pedestal of the lens holder, wherein the lens holder is made of the liquid crystalline resin composition for camera modules described in (1), A camera module made of a material other than a liquid crystalline resin composition for a camera module.
- a camera module component is produced using the liquid crystalline resin composition for a camera module of the present invention as a raw material, a camera module component that is less likely to be raised and charged is obtained.
- the liquid crystalline resin composition for a camera module of the present invention contains (A) a liquid crystalline resin, (B) a nonconductive filler, (C) a copolymer, and (D) a conductive filler.
- the (A) liquid crystalline resin used in the present invention refers to a melt processable polymer having a property capable of forming an optically anisotropic molten phase.
- the property of the anisotropic molten phase can be confirmed by a conventional polarization inspection method using an orthogonal polarizer. More specifically, the anisotropic molten phase can be confirmed by using a Leitz polarizing microscope and observing a molten sample placed on a Leitz hot stage under a nitrogen atmosphere at a magnification of 40 times.
- the liquid crystalline polymer applicable to the present invention is inspected between crossed polarizers, the polarized light is normally transmitted even in the molten stationary state, and optically anisotropic.
- the type of the above (A) liquid crystalline resin is not particularly limited, but is preferably an aromatic polyester or an aromatic polyester amide.
- the polyester which partially contains aromatic polyester or aromatic polyester amide in the same molecular chain is also in that range. They preferably have a logarithmic viscosity (IV) of at least about 2.0 dl / g, more preferably 2.0-10.0 dl / g when dissolved in pentafluorophenol at 60 ° C. at a concentration of 0.1% by weight. .) Are preferably used.
- the aromatic polyester or aromatic polyester amide as the liquid crystalline resin (A) applicable to the present invention is particularly preferably at least one selected from the group consisting of aromatic hydroxycarboxylic acids, aromatic hydroxyamines, and aromatic diamines.
- Aromatic hydroxycarboxylic acids such as p-hydroxybenzoic acid and 6-hydroxy-2-naphthoic acid, and 2,6-dihydroxy.
- Aromatic diols such as naphthalene, 1,4-dihydroxynaphthalene, 4,4′-dihydroxybiphenyl, hydroquinone, resorcin, compounds represented by the following general formula (I), and compounds represented by the following general formula (II)
- Aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid, 4,4′-diphenyldicarboxylic acid, 2,6-naphthalenedicarboxylic acid, and compounds represented by the following general formula (III); p-aminophenol, p- Aromatic amines such as phenylenediamine are listed.
- X a group selected from alkylene (C 1 -C 4 ), alkylidene, —O—, —SO—, —SO 2 —, —S—, and —CO—
- the (A) liquid crystalline resin used in the present invention can be prepared by a known method using a direct polymerization method or a transesterification method from the above monomer compound (or a mixture of monomers). A combination method or a slurry polymerization method is used.
- the above compounds having ester-forming ability may be used for polymerization as they are, or may be modified from a precursor to a derivative having ester-forming ability in the previous stage of polymerization.
- various catalysts can be used. Typical examples include dialkyl tin oxide, diaryl tin oxide, titanium dioxide, alkoxy titanium silicates, titanium alcoholates, and alkali of carboxylic acid.
- the amount of the catalyst used is generally about 0.001 to 1% by mass, particularly about 0.01 to 0.2% by mass, based on the total weight of the monomers. If the polymer produced by these polymerization methods is further necessary, the molecular weight can be increased by solid-phase polymerization by heating in a reduced pressure or an inert gas.
- the melt viscosity of the (A) liquid crystalline resin obtained by the above method is not particularly limited. In general, those having a melt viscosity at a molding temperature of 10 MPa or more and 600 MPa or less at a shear rate of 1000 sec ⁇ 1 can be used. However, those having a very high viscosity are not preferable because the fluidity is extremely deteriorated.
- the (A) liquid crystalline resin may be a mixture of two or more liquid crystalline resins.
- the content of (A) liquid crystal resin is 55 to 91% by mass. If the content of component (A) is 55% by mass or more, it is preferable for fluidity and suppression of raising of the surface of the molded body, and if the content of component (A) is 91% by mass or less, it is preferable for heat resistance. .
- the preferable content of component (A) is 60 to 80% by mass.
- Non-conductive filler comprises: (B1) a fibrous non-conductive filler having an average fiber diameter of 1.0 ⁇ m or less and an average fiber length of 5 to 50 ⁇ m; and (B2) a plate having an average particle diameter of 50 ⁇ m or less. At least one selected from at least one non-fibrous non-conductive filler selected from particulate fillers and particulate fillers.
- the average fiber diameter of the fibrous nonconductive filler is 1.0 ⁇ m or less, and the preferable average fiber diameter is 0.3 to 0.6 ⁇ m.
- the average fiber diameter a value obtained by capturing a stereoscopic microscope image from a CCD camera into a PC and measuring the image by an image processing method is employed.
- the average fiber length of (B1) fibrous nonconductive filler is 5 to 50 ⁇ m, and the preferable average fiber length is 7 to 30 ⁇ m.
- the average fiber length is 5 ⁇ m or more, the mechanical strength and the deflection temperature under load necessary for the camera module are easily maintained, and when the average fiber length is 50 ⁇ m or less, the raising effect on the surface of the molded body is likely to increase.
- the average fiber length a value obtained by taking a stereoscopic microscope image from a CCD camera into a PC and measuring by an image processing method using an image measuring machine is adopted.
- any fiber can be used as long as it is a fibrous non-conductive filler that satisfies the above shape, but examples of (B1) fibrous non-conductive filler include glass fiber, asbestos fiber, and silica fiber. Inorganic fibrous materials such as silica / alumina fiber, zirconia fiber, boron nitride fiber, silicon nitride fiber, boron fiber, and potassium titanate fiber.
- As the component (B1) two or more kinds of fibrous nonconductive fillers may be used.
- potassium titanate fibers are preferably used as the component (B1).
- the non-fibrous non-conductive filler is at least one selected from a plate-like filler and a granular filler having an average particle diameter of 50 ⁇ m or less.
- the average particle diameter is preferably 10 to 20 ⁇ m. In this specification, the value measured by the laser diffraction / scattering particle size distribution measurement method is adopted as the average particle size.
- any filler can be used as long as it is a non-fibrous non-conductive filler that satisfies the above shape, and examples of the plate-like filler include talc, mica, and glass flakes.
- particulate fillers include silica, quartz powder, glass beads, glass powder, calcium oxalate, aluminum oxalate, kaolin, clay, diatomaceous earth, wollastonite, etc .; iron oxide, titanium oxide, zinc oxide And metal oxides such as alumina; metal carbonates such as calcium carbonate and magnesium carbonate; metal sulfates such as calcium sulfate and barium sulfate; silicon carbide; silicon nitride;
- the component (B2) two or more kinds may be used.
- the component (B2) it is preferable to use talc and mica of plate-like filler and silica of granular filler, and it is more preferable to use talc and mica of plate-like filler.
- the content of the component (B) (the sum of the content of the component (B1) and the content of the component (B2)) is 5 to 20% by mass in the liquid crystal composition for a camera module of the present invention. is there.
- the content of the component (B) is 5% by mass or more, the mechanical strength and the deflection temperature under load necessary for the camera module are easily secured, and when the content is 20% by mass or less, the effect of suppressing the raising of the surface of the molded article is increased.
- Cheap A more preferable content is 10 to 20% by mass.
- the (C) copolymer is at least one selected from (C1) an olefin copolymer and (C2) a styrene copolymer.
- Mixing the component (C) with the liquid crystalline resin composition for a camera module contributes to suppressing raising of the surface of the molded product when the molded product obtained by molding the composition is subjected to ultrasonic cleaning. The reason for suppressing the raising is not clarified, but it is considered that by adding a certain amount, the surface state of the molded body is changed, and the change contributes to suppressing the raising.
- Examples of the olefin copolymer include a copolymer composed of a repeating unit derived from an ⁇ -olefin and a repeating unit derived from a glycidyl ester of an ⁇ , ⁇ -unsaturated acid.
- the ⁇ -olefin is not particularly limited and includes, for example, ethylene, propylene, butene, etc. Among them, ethylene is preferably used.
- the glycidyl ester of ⁇ , ⁇ -unsaturated acid is represented by the following general formula (IV). Examples of the glycidyl ester of ⁇ , ⁇ -unsaturated acid include glycidyl acrylate, glycidyl methacrylate, glycidyl ethacrylate, glycidyl itaconate, and glycidyl methacrylate is particularly preferable.
- the content of repeating units derived from ⁇ -olefin is 87 to 98% by mass, and the content of repeating units derived from glycidyl ester of ⁇ , ⁇ -unsaturated acid is 13 It is preferably 2% by mass.
- the (C1) olefin copolymer used in the present invention is a third component other than the above two components within the scope of the present invention, such as acrylonitrile, acrylic ester, methacrylic ester, ⁇ -methylstyrene, maleic anhydride, etc.
- a repeating unit derived from one or more olefinic unsaturated esters may be contained in an amount of 0 to 48 parts by mass with respect to 100 parts by mass of the two components.
- the olefin copolymer as the component (C1) of the present invention can be easily prepared by a normal radical polymerization method using a monomer and a radical polymerization catalyst corresponding to each component. More specifically, the presence of a suitable solvent or chain transfer agent is usually obtained by mixing ⁇ -olefin and glycidyl ester of ⁇ , ⁇ -unsaturated acid in the presence of a radical generator at 500 to 4000 atm and 100 to 300 ° C. It can be produced by a method of copolymerization under or in the absence.
- It can also be produced by a method in which an ⁇ -olefin, a glycidyl ester of ⁇ , ⁇ -unsaturated acid and a radical generator are mixed and melt graft copolymerized in an extruder.
- Examples of the (C2) styrenic copolymer include a copolymer composed of a repeating unit derived from styrene and a repeating unit derived from a glycidyl ester of an ⁇ , ⁇ -unsaturated acid. Since the glycidyl ester of ⁇ , ⁇ -unsaturated acid is the same as that described for the component (C1), description thereof is omitted.
- styrenes examples include styrene, ⁇ -methylstyrene, brominated styrene, divinylbenzene and the like, and styrene is preferably used.
- the (C2) styrenic copolymer used in the present invention may be a multi-component copolymer containing a repeating unit derived from one or more of the other vinyl monomers as the third component in addition to the above two components.
- Suitable as the third component is a repeating unit derived from one or more olefinic unsaturated esters such as acrylonitrile, acrylic acid ester, methacrylic acid ester, and maleic anhydride.
- a styrene copolymer containing 40% by mass or less of these repeating units in the styrene copolymer is preferred as the component (C2).
- the content of the repeating unit derived from the glycidyl ester of ⁇ , ⁇ -unsaturated acid is 2 to 20% by mass, and the content of the repeating unit derived from styrene is 80 to It is preferably 98% by weight.
- the styrene copolymer can be prepared by a normal radical polymerization method using a monomer corresponding to each component and a radical polymerization catalyst. More specifically, styrenes and glycidyl esters of ⁇ , ⁇ -unsaturated acids are usually present in the presence of a radical generator at 500 to 4000 atm and 100 to 300 ° C. in the presence of a suitable solvent or chain transfer agent. Or it can manufacture by the method of copolymerizing in absence.
- It can also be produced by a method in which styrenes, an ⁇ , ⁇ -unsaturated glycidyl ester and a radical generator are mixed and subjected to melt graft copolymerization in an extruder.
- the (C) copolymer is preferably an (C1) olefin copolymer in terms of heat resistance, but the ratio of the (C1) component to the (C2) component is in accordance with the required characteristics as appropriate. Can be selected.
- the content of the (C) copolymer (total amount of the (C1) component and the (C2) component) is 2 to 10% by mass in the camera module resin composition of the present invention.
- the content of the component (C) is 2% by mass or more from the viewpoint of suppressing raising of the surface of the molded body, and being 10% by mass or less obtains a good molded body without impairing fluidity. It is necessary for the reason.
- a more preferable content is 2 to 7% by mass.
- the conductive filler is selected from (D1) a fibrous conductive filler having an average fiber length of 50 ⁇ m or more, and (D2) a plate-like filler and a granular filler having an average particle diameter of 20 nm to 50 ⁇ m. And at least one non-fibrous conductive filler.
- the average fiber length of the fibrous conductive filler is 50 ⁇ m or more.
- the average fiber length of 50 ⁇ m or more is necessary from the viewpoint of developing antistatic properties.
- the upper limit of the said average fiber length is not specifically limited, For example, 10 mm is mentioned practically.
- any fiber can be used as long as it is a fibrous conductive filler satisfying the above shape.
- fibrous conductive filler include carbon fibers; conductive fibers such as metal fibers. Glass fibers, whiskers, inorganic fibers, ore fibers, and the like are coated with a metal such as nickel or copper to impart conductivity.
- carbon fibers examples include PAN-based carbon fibers made from polyacrylonitrile and pitch-based carbon fibers made from pitch.
- metal fibers examples include fibers made of mild steel, stainless steel, steel and alloys thereof, copper, brass, aluminum and alloys thereof, titanium, lead and the like. As these metal fibers, those coated with other metals can be used in order to impart further conductivity if necessary due to their conductivity.
- whisker examples include silicon nitride whisker, silicon trinitride whisker, basic magnesium sulfate whisker, barium titanate whisker, silicon carbide whisker, and boron whisker.
- inorganic fiber examples include fibers made of rock wool, zirconia, alumina silica, potassium titanate, barium titanate, titanium oxide, silicon carbide, alumina, silica, blast furnace slag, and the like.
- ore fiber examples include fibers made of asbestos.
- (D1) Two or more kinds of fibrous conductive fillers may be used as the component.
- the content of the component is 1 to 5% by mass in the resin composition for a camera module of the present invention. It is necessary for the content of the component (D1) to be 1% by mass or more from the viewpoint of developing antistatic properties, and 5% by mass or less means that the conductivity is adjusted to a semiconductive region and flow. It is necessary in terms of suppressing the deterioration of the sex and the raising of the hair raising property. A more preferable content is 2 to 4% by mass.
- the non-fibrous conductive filler is at least one selected from a plate-like filler and a granular filler having an average particle diameter of 20 nm to 50 ⁇ m.
- the average particle size of 20 nm or more is necessary from the viewpoint of suppressing a decrease in fluidity.
- the average particle diameter of 50 ⁇ m or less is necessary in terms of suppressing deterioration of surface smoothness.
- any filler can be used as long as it is a non-fibrous conductive filler satisfying the above shape, but as the plate-like filler, graphite, plate-like metal powder (for example, aluminum, iron, copper) Etc.
- the particulate filler include carbon black, particulate metal powder (for example, aluminum, iron, copper), particulate conductive ceramics (for example, zinc oxide, tin oxide, indium tin oxide) and the like.
- the component (D2) two or more kinds may be used. In the present invention, graphite and carbon black are preferably used as the component (D2).
- the average particle size is preferably 5 to 50 ⁇ m and the thickness is preferably 0.5 to 10 ⁇ m.
- the average particle size is preferably 20 to 100 nm.
- the content of the component is 1 to 15% by mass in the resin composition for a camera module of the present invention.
- the content of the component (D2) is 1% by mass or more, which is necessary in terms of suppressing variation in conductivity and exhibiting stable antistatic properties, and being 15% by mass or less This is necessary in terms of suppressing the decrease.
- a more preferable content is 2 to 10% by mass.
- the liquid crystalline resin composition for a camera module of the present invention includes other polymers, known substances generally added to synthetic resins, that is, antioxidants, ultraviolet absorbers, etc., as long as the effects of the present invention are not impaired.
- Stabilizers, antistatic agents other than component (D), flame retardants, colorants such as dyes and pigments, lubricants, mold release agents, crystallization accelerators, crystal nucleating agents, etc. are added as appropriate according to the required performance. be able to.
- the preparation of the resin composition for a camera module of the present invention is not particularly limited. For example, by blending the above components (A), (B), (C), and (D), and melt-kneading these using a single screw or twin screw extruder, a liquid crystalline resin for a camera module Preparation of the composition takes place.
- the shape of the component (B) in the liquid crystalline resin composition for a camera module of the present invention is different from the shape of the component (B) before blending.
- the shape of the above component (B) is the shape before blending. If the shape before blending is as described above, a camera module component that is less prone to raising the surface can be obtained.
- the shape of the component (D) in the liquid crystalline resin composition for a camera module of the present invention is different from the shape of the component (D) before blending.
- the shape of the above component (D) is the shape before blending. If the shape before blending is as described above, a camera module component that is difficult to be charged can be obtained.
- the liquid crystalline resin composition for a camera module of the present invention obtained as described above preferably has a melt viscosity of 50 Pa ⁇ sec or less.
- One of the characteristics of the liquid crystalline resin composition for camera modules of the present invention is that it has high fluidity and excellent moldability.
- the melt viscosity a value obtained by a measurement method based on ISO 11443 under conditions of a cylinder temperature of 350 ° C. and a shear rate of 1000 sec ⁇ 1 is adopted.
- the liquid crystalline resin composition for a camera module of the present invention preferably has a deflection temperature under load of 200 ° C. or higher.
- the point which is excellent in heat resistance is also one of the characteristics of the liquid crystalline resin composition for camera modules of this invention.
- For the deflection temperature under load a value measured by a method based on ISO 75-1 or 2 is adopted.
- the liquid crystalline resin composition for a camera module of the present invention has a volume resistivity of 1 ⁇ 10 4 to 1 ⁇ 10 14 ⁇ ⁇ cm. That is, the conductivity of the volume resistivity is adjusted to a semiconductive region, thereby exhibiting excellent antistatic properties. If the volume resistivity is less than 1 ⁇ 10 4 ⁇ ⁇ cm, the electrical conductivity may be too high and a short circuit may occur. If the volume resistivity exceeds 1 ⁇ 10 14 ⁇ ⁇ cm, the electrical conductivity may be too low to exhibit antistatic properties.
- a camera module component is manufactured using the liquid crystalline resin composition for a camera module. If the resin composition of the present invention is used as a raw material, the camera module component is less likely to be charged. Therefore, the camera module component comprising the resin composition of the present invention is less likely to cause malfunction due to static electricity.
- the surface of the camera module component is hardly raised. Since the camera module component is ultrasonically cleaned, it is required that the surface is not easily raised even if the ultrasonic cleaning is performed. If the resin composition of the present invention is used, even if the ultrasonic cleaning of camera module parts is performed under stronger conditions, there will be no or almost no dropouts causing dust and the like. Accordingly, after the camera module parts are incorporated into the finished product, the dust generated by raising the surface of the camera module parts hardly affects the quality of the finished product.
- the camera module 1 includes a substrate 10, an optical element 11, a lead wire 12, a lens holder 13, a barrel 14, a lens 15, an IR filter 16, and a guide 17.
- the optical element 11 is disposed on the substrate 10, and the optical element 11 and the substrate 10 are electrically connected by a lead wiring 12.
- the guide 17 is disposed on the substrate 10
- the lens holder 13 is disposed on the guide 17, and the guide 17 and the lens holder 13 cover the optical element 11.
- the lens holder 13 has an opening at the top, and a spiral groove is formed on the wall surface of the opening.
- the barrel 14 has a cylindrical shape, and the lens 15 is held inside the cylindrical shape so as to be substantially horizontal.
- a spiral convex portion is formed on the side wall of one end of the cylinder, and this spiral convex portion and the spiral groove portion formed on the opening wall surface of the lens holder 13 are screwed together,
- the barrel 14 is connected to the lens holder 13.
- An IR filter 16 is disposed at one end of the barrel 14 so as to close one end of the cylindrical barrel 14. As shown in FIG. 1, the IR filter 16 and the lens 15 are arranged substantially in parallel.
- the lens holder 13 includes a magnetic force generated by a coil (not shown) wound around the lens holder 13 and a permanent magnet (not shown) arranged around the coil.
- the distance between the lens 15 and the optical element 11 changes by moving up and down on the guide 17 by the action of.
- the focus of the camera can be adjusted by adjusting this distance.
- the lens holder 13 which is a camera module component can be manufactured using the liquid crystalline resin composition for a camera module of the present invention as a raw material.
- a general liquid crystalline resin composition is not suitable as a raw material for producing these parts.
- the lens holder 13 is manufactured using a general liquid crystalline resin composition as a raw material, the following problems occur.
- Molded products made of general liquid crystalline resin compositions are easily charged negatively, and generate static electricity between molded products made of materials that easily charge positively, such as nylon. However, this causes a malfunction in the camera module.
- a molded body formed by molding a general liquid crystalline resin composition is likely to raise the surface of the molded body because the molecular orientation of the polymer is particularly large in the surface portion, and this raising causes generation of small dust. . If this small dust adheres to the lens 15 or the like, the performance of the camera module is degraded.
- the camera module parts such as the lens holder 13 are ultrasonically cleaned before being incorporated into the camera module 1 for the purpose of removing dust and small dust on the surface.
- the surface of a molded product formed by molding a general liquid crystalline resin composition is easily raised, the surface becomes fluffy when ultrasonically cleaned. Since such a problem arises, the molded object formed by shape
- the focus adjustment is performed on the guide 17 by the action of the magnetic force generated by the coil (not shown) wound around the lens holder 13 and the permanent magnet (not shown) arranged around the coil. It is done by moving up and down. At this time, first, static electricity is generated between the lens holder 13 formed of a molded body formed by molding the liquid crystalline resin composition and the guide 17 formed of a molded body formed of a material containing nylon or the like. The lens holder 13 is liable to malfunction. Secondly, as described above, the molded body obtained by molding a general liquid crystalline resin composition is likely to have a raised surface, and thus the surface may be peeled off to produce a peeled product. There is a high possibility that the peeled material becomes small dust and adheres to the lens 15 or the like, thereby reducing the performance of the camera module.
- the liquid crystalline resin composition for a camera module of the present invention is difficult to be charged when formed into a molded body, Further, since the surface state of the molded body has been improved so that even if the molded body is ultrasonically cleaned, the problem of raising the hair hardly occurs, it can be preferably used as a raw material for the lens holder 13.
- examples of the material for the guide 17 include materials other than the liquid crystalline resin composition for a camera module of the present invention. Etc.
- ⁇ Material> -Liquid crystalline resin liquid crystalline polyester amide resin: Vectra (registered trademark) E950i (manufactured by Polyplastics Co., Ltd.) ⁇ Olefin copolymer: Bond First 2C (ethylene-glycidyl methacrylate copolymer (containing 6% by mass of glycidyl methacrylate)) manufactured by Sumitomo Chemical Co., Ltd. -Fibrous conductive filler: manufactured by Toho Tenax Co., Ltd.
- HTC432 PAN-based carbon fiber, average fiber diameter 10 ⁇ m, average fiber length 6 mm
- -Non-fibrous conductive filler 1 CP manufactured by Nippon Graphite Industry Co., Ltd. (graphite, average particle size 10 ⁇ m, plate-like)
- Non-fibrous conductive filler 2 VULCAN XC305 (carbon black, average particle size 20 nm, granular) manufactured by Cabot Japan Co., Ltd.
- -Fibrous non-conductive filler Tismo N-102 (potassium titanate fiber, average fiber diameter 0.3 to 0.6 ⁇ m, average fiber length 10 to 20 ⁇ m) manufactured by Otsuka Chemical Co., Ltd.
- -Non-fibrous non-conductive filler Crown Talc PP (Talc, average particle diameter 12.8 ⁇ m, average aspect ratio 6, plate shape) manufactured by Matsumura Sangyo Co., Ltd.
- melt viscosity of the liquid crystalline resin compositions for camera modules of Examples and Comparative Examples was measured using the pellets. Specifically, the apparent melt viscosity under conditions of a cylinder temperature of 350 ° C. and a shear rate of 1000 sec ⁇ 1 was measured according to ISO 11443 using a capillary rheometer (Capillograph 1D manufactured by Toyo Seiki: piston diameter 10 mm). For the measurement, an orifice having an inner diameter of 1 mm and a length of 20 mm was used. The results are shown in Table 1.
- ⁇ Load deflection temperature> The pellets of Examples and Comparative Examples were molded under the following molding conditions using a molding machine (“SE100DU” manufactured by Sumitomo Heavy Industries, Ltd.) to obtain test specimens (4 mm ⁇ 10 mm ⁇ 80 mm). Thereafter, the deflection temperature under load was measured by a method in accordance with ISO 75-1 and 2. Note that 1.8 MPa was used as the bending stress. The results are shown in Table 1. ⁇ Molding condition ⁇ Cylinder temperature: 350 ° C Mold temperature: 80 °C Back pressure: 2.0MPa Injection speed: 33mm / sec
- the molded bodies before and after being subjected to an ultrasonic cleaning machine were compared, and the area (raised area) of the fluffed portion on the surface of the molded body was evaluated with an image measuring instrument (LUZEXFS manufactured by Nireco Corporation).
- the evaluation area was 750 mm 2 (12.5 mm ⁇ 60 mm), and the ratio (%) of the raised area to the evaluation area was used as a result.
- the results are shown in Table 1. The smaller the raising area, the higher the raising suppression effect.
- the molded body produced using the pellets of the examples had a volume resistivity in the range of 1 ⁇ 10 4 to 1 ⁇ 10 14 ⁇ ⁇ cm. It was. Moreover, it was confirmed that the surface of the molded body was not fluffed even after ultrasonic cleaning. From these results, the molded body formed by molding the pellets of the examples is superior in antistatic property and surface state compared to the molded body formed by molding normal liquid crystalline resin composition pellets such as comparative examples. Can be said to be very different.
- the molded body produced using the pellets of the examples was excellent in heat resistance and impact resistance.
Abstract
Description
本発明のカメラモジュール用液晶性樹脂組成物は、(A)液晶性樹脂、(B)非導電性充填剤、(C)共重合体、及び(D)導電性充填剤を含有する。 <Liquid crystal resin composition for camera module>
The liquid crystalline resin composition for a camera module of the present invention contains (A) a liquid crystalline resin, (B) a nonconductive filler, (C) a copolymer, and (D) a conductive filler.
本発明で使用する(A)液晶性樹脂とは、光学異方性溶融相を形成し得る性質を有する溶融加工性ポリマーを指す。異方性溶融相の性質は、直交偏光子を利用した慣用の偏光検査法により確認することが出来る。より具体的には、異方性溶融相の確認は、Leitz偏光顕微鏡を使用し、Leitzホットステージに載せた溶融試料を窒素雰囲気下で40倍の倍率で観察することにより実施できる。本発明に適用できる液晶性ポリマーは直交偏光子の間で検査したときに、たとえ溶融静止状態であっても偏光は通常透過し、光学的に異方性を示す。 [(A) Liquid crystalline resin]
The (A) liquid crystalline resin used in the present invention refers to a melt processable polymer having a property capable of forming an optically anisotropic molten phase. The property of the anisotropic molten phase can be confirmed by a conventional polarization inspection method using an orthogonal polarizer. More specifically, the anisotropic molten phase can be confirmed by using a Leitz polarizing microscope and observing a molten sample placed on a Leitz hot stage under a nitrogen atmosphere at a magnification of 40 times. When the liquid crystalline polymer applicable to the present invention is inspected between crossed polarizers, the polarized light is normally transmitted even in the molten stationary state, and optically anisotropic.
(1)主として芳香族ヒドロキシカルボン酸及びその誘導体の1種又は2種以上からなるポリエステル;
(2)主として(a)芳香族ヒドロキシカルボン酸及びその誘導体の1種又は2種以上と、(b)芳香族ジカルボン酸、脂環族ジカルボン酸、及びそれらの誘導体の1種又は2種以上と、(c)芳香族ジオール、脂環族ジオール、脂肪族ジオール、及びそれらの誘導体の少なくとも1種又は2種以上、とからなるポリエステル;
(3)主として(a)芳香族ヒドロキシカルボン酸及びその誘導体の1種又は2種以上と、(b)芳香族ヒドロキシアミン、芳香族ジアミン、及びそれらの誘導体の1種又は2種以上と、(c)芳香族ジカルボン酸、脂環族ジカルボン酸、及びそれらの誘導体の1種又は2種以上、とからなるポリエステルアミド;
(4)主として(a)芳香族ヒドロキシカルボン酸及びその誘導体の1種又は2種以上と、(b)芳香族ヒドロキシアミン、芳香族ジアミン、及びそれらの誘導体の1種又は2種以上と、(c)芳香族ジカルボン酸、脂環族ジカルボン酸、及びそれらの誘導体の1種又は2種以上と、(d)芳香族ジオール、脂環族ジオール、脂肪族ジオール、及びそれらの誘導体の少なくとも1種又は2種以上、とからなるポリエステルアミド等が挙げられる。更に上記の構成成分に必要に応じ分子量調整剤を併用してもよい。 More specifically,
(1) A polyester mainly composed of one or more aromatic hydroxycarboxylic acids and derivatives thereof;
(2) Mainly (a) one or more aromatic hydroxycarboxylic acids and derivatives thereof, and (b) one or more aromatic dicarboxylic acids, alicyclic dicarboxylic acids, and derivatives thereof (C) a polyester comprising at least one or more of aromatic diol, alicyclic diol, aliphatic diol, and derivatives thereof;
(3) Mainly (a) one or more aromatic hydroxycarboxylic acids and derivatives thereof, and (b) one or more aromatic hydroxyamines, aromatic diamines, and derivatives thereof; c) Polyesteramide comprising one or more of aromatic dicarboxylic acid, alicyclic dicarboxylic acid, and derivatives thereof;
(4) Mainly (a) one or more aromatic hydroxycarboxylic acids and derivatives thereof; and (b) one or more aromatic hydroxyamines, aromatic diamines and derivatives thereof; c) one or more of aromatic dicarboxylic acid, alicyclic dicarboxylic acid, and derivatives thereof; and (d) at least one of aromatic diol, alicyclic diol, aliphatic diol, and derivatives thereof. Or the polyesteramide which consists of 2 or more types is mentioned. Furthermore, you may use a molecular weight modifier together with said structural component as needed.
(B)非導電性充填剤は、(B1)平均繊維径1.0μm以下、且つ平均繊維長が5~50μmの繊維状非導電性充填剤と、(B2)平均粒子径50μm以下の、板状充填剤及び粒状充填剤から選択される少なくとも1種の非繊維状非導電性充填剤とから選択される少なくとも1種である。 [(B) Non-conductive filler]
(B) Non-conductive filler comprises: (B1) a fibrous non-conductive filler having an average fiber diameter of 1.0 μm or less and an average fiber length of 5 to 50 μm; and (B2) a plate having an average particle diameter of 50 μm or less. At least one selected from at least one non-fibrous non-conductive filler selected from particulate fillers and particulate fillers.
(C)共重合体は、(C1)オレフィン系共重合体及び(C2)スチレン系共重合体から選択される少なくとも1種である。(C)成分をカメラモジュール用液晶性樹脂組成物に配合させることが、当該組成物を成形してなる成形体を超音波洗浄したときの、成形体表面の起毛を抑えることに寄与する。
起毛を抑える理由については明確になっておるわけではないが、ある一定量配合させることにより、成形体表面状態を変化させ、その変化が起毛を抑えることに寄与していると考えられる。 [(C) Copolymer]
The (C) copolymer is at least one selected from (C1) an olefin copolymer and (C2) a styrene copolymer. Mixing the component (C) with the liquid crystalline resin composition for a camera module contributes to suppressing raising of the surface of the molded product when the molded product obtained by molding the composition is subjected to ultrasonic cleaning.
The reason for suppressing the raising is not clarified, but it is considered that by adding a certain amount, the surface state of the molded body is changed, and the change contributes to suppressing the raising.
(D)導電性充填剤は、(D1)平均繊維長が50μm以上の繊維状導電性充填剤と、(D2)平均粒子径が20nm~50μmの、板状充填剤及び粒状充填剤から選択される少なくとも1種の非繊維状導電性充填剤と、からなる。 [(D) conductive filler]
(D) The conductive filler is selected from (D1) a fibrous conductive filler having an average fiber length of 50 μm or more, and (D2) a plate-like filler and a granular filler having an average particle diameter of 20 nm to 50 μm. And at least one non-fibrous conductive filler.
(D2)成分がカーボンブラックである場合、平均粒子径は20~100nmであることが好ましい。 When the component (D2) is graphite, the average particle size is preferably 5 to 50 μm and the thickness is preferably 0.5 to 10 μm.
When the component (D2) is carbon black, the average particle size is preferably 20 to 100 nm.
本発明のカメラモジュール用液晶性樹脂組成物には、本発明の効果を害さない範囲で、その他の重合体、一般に合成樹脂に添加される公知の物質、即ち、酸化防止剤や紫外線吸収剤等の安定剤、(D)成分以外の帯電防止剤、難燃剤、染料や顔料等の着色剤、潤滑剤、離型剤、及び結晶化促進剤、結晶核剤等も要求性能に応じ適宜添加することができる。 [Other ingredients]
The liquid crystalline resin composition for a camera module of the present invention includes other polymers, known substances generally added to synthetic resins, that is, antioxidants, ultraviolet absorbers, etc., as long as the effects of the present invention are not impaired. Stabilizers, antistatic agents other than component (D), flame retardants, colorants such as dyes and pigments, lubricants, mold release agents, crystallization accelerators, crystal nucleating agents, etc. are added as appropriate according to the required performance. be able to.
本発明のカメラモジュール用樹脂組成物の調製は特に限定されない。例えば、上記(A)、(B)、(C)、及び(D)成分を配合して、これらを1軸又は2軸押出機を用いて溶融混練処理することで、カメラモジュール用液晶性樹脂組成物の調製が行われる。 [Preparation of liquid crystalline resin composition for camera module]
The preparation of the resin composition for a camera module of the present invention is not particularly limited. For example, by blending the above components (A), (B), (C), and (D), and melt-kneading these using a single screw or twin screw extruder, a liquid crystalline resin for a camera module Preparation of the composition takes place.
本発明のカメラモジュール用液晶性樹脂組成物中の(B)成分の形状と、配合される前の(B)成分の形状とは異なる。上述の(B)成分の形状は配合される前の形状である。配合される前の形状が上述の通りであれば、表面が起毛しにくいカメラモジュール用部品が得られる。 [Liquid crystalline resin composition for camera modules]
The shape of the component (B) in the liquid crystalline resin composition for a camera module of the present invention is different from the shape of the component (B) before blending. The shape of the above component (B) is the shape before blending. If the shape before blending is as described above, a camera module component that is less prone to raising the surface can be obtained.
上記カメラモジュール用液晶性樹脂組成物を用いて、カメラモジュール用部品を製造する。本発明の樹脂組成物を原料として用いれば、カメラモジュール用部品が帯電しにくくなる。したがって、本発明の樹脂組成物からなるカメラモジュール用部品は、静電気による動作不良を起こしにくい。 <Camera module parts and camera module>
A camera module component is manufactured using the liquid crystalline resin composition for a camera module. If the resin composition of the present invention is used as a raw material, the camera module component is less likely to be charged. Therefore, the camera module component comprising the resin composition of the present invention is less likely to cause malfunction due to static electricity.
・液晶性樹脂(液晶性ポリエステルアミド樹脂):ベクトラ(登録商標)E950i(ポリプラスチックス(株)製)
・オレフィン系共重合体:住友化学(株)製 ボンドファースト2C(エチレン-グリシジルメタクリレート共重合体(グリシジルメタクリレートを6質量%含有))
・繊維状導電性充填剤:東邦テナックス(株)製 HTC432(PAN系炭素繊維、平均繊維径10μm、平均繊維長6mm)
・非繊維状導電性充填剤1:日本黒鉛工業(株)製 CP(黒鉛、平均粒子径10μm、板状)
・非繊維状導電性充填剤2:キャボットジャパン(株)製 VULCAN XC305(カーボンブラック、平均粒子径20nm、粒状)
・繊維状非導電性充填剤:大塚化学(株)製 ティスモN-102(チタン酸カリウム繊維、平均繊維径0.3~0.6μm、平均繊維長10~20μm)
・非繊維状非導電性充填剤:松村産業(株)製 クラウンタルクPP(タルク、平均粒子径12.8μm、平均アスペクト比6、板状) <Material>
-Liquid crystalline resin (liquid crystalline polyester amide resin): Vectra (registered trademark) E950i (manufactured by Polyplastics Co., Ltd.)
・ Olefin copolymer: Bond First 2C (ethylene-glycidyl methacrylate copolymer (containing 6% by mass of glycidyl methacrylate)) manufactured by Sumitomo Chemical Co., Ltd.
-Fibrous conductive filler: manufactured by Toho Tenax Co., Ltd. HTC432 (PAN-based carbon fiber, average fiber diameter 10 μm, average fiber length 6 mm)
-Non-fibrous conductive filler 1: CP manufactured by Nippon Graphite Industry Co., Ltd. (graphite, average particle size 10 μm, plate-like)
・ Non-fibrous conductive filler 2: VULCAN XC305 (carbon black, average particle size 20 nm, granular) manufactured by Cabot Japan Co., Ltd.
-Fibrous non-conductive filler: Tismo N-102 (potassium titanate fiber, average fiber diameter 0.3 to 0.6 μm, average fiber length 10 to 20 μm) manufactured by Otsuka Chemical Co., Ltd.
-Non-fibrous non-conductive filler: Crown Talc PP (Talc, average particle diameter 12.8 μm, average aspect ratio 6, plate shape) manufactured by Matsumura Sangyo Co., Ltd.
上記成分を、表1に示す割合で二軸押出機((株)日本製鋼所製TEX30α型)を用いて、シリンダー温度350℃にて溶融混練し、カメラモジュール用液晶性樹脂組成物ペレットを得た。 <Manufacture of liquid crystalline resin composition for camera module>
The above components were melt-kneaded at a cylinder temperature of 350 ° C. using a twin-screw extruder (TEX30α type, manufactured by Nippon Steel Works) at the ratio shown in Table 1 to obtain a liquid crystalline resin composition pellet for a camera module. It was.
実施例及び比較例のカメラモジュール用液晶性樹脂組成物の溶融粘度を、上記ペレットを用いて測定した。具体的には、キャピラリー式レオメーター(東洋精機製キャピログラフ1D:ピストン径10mm)により、シリンダー温度350℃、せん断速度1000sec-1の条件での見かけの溶融粘度をISO 11443に準拠して測定した。測定には、内径1mm、長さ20mmのオリフィスを用いた。結果を表1に示す。 <Melt viscosity>
The melt viscosity of the liquid crystalline resin compositions for camera modules of Examples and Comparative Examples was measured using the pellets. Specifically, the apparent melt viscosity under conditions of a cylinder temperature of 350 ° C. and a shear rate of 1000 sec −1 was measured according to ISO 11443 using a capillary rheometer (Capillograph 1D manufactured by Toyo Seiki: piston diameter 10 mm). For the measurement, an orifice having an inner diameter of 1 mm and a length of 20 mm was used. The results are shown in Table 1.
上記ペレットから130mm×13mm×0.8mmの曲げ試験片を作製し、これを用いて、ASTM D790に準拠し、曲げ強度及び曲げ弾性率を測定した。結果を表1に示す。 <Bending test>
A bending test piece of 130 mm × 13 mm × 0.8 mm was prepared from the above pellets, and the bending strength and bending elastic modulus were measured using the bending test piece in accordance with ASTM D790. The results are shown in Table 1.
実施例及び比較例のペレットを、成形機(住友重機械工業社製 「SE100DU」)を用いて、以下の成形条件で成形し、測定用試験片(4mm×10mm×80mm)を得た。その後、ISO 75-1,2に準拠した方法で荷重たわみ温度を測定した。なお、曲げ応力としては、1.8MPaを用いた。結果を表1に示す。
〔成形条件〕
シリンダー温度: 350℃
金型温度: 80℃
背圧: 2.0MPa
射出速度: 33mm/sec <Load deflection temperature>
The pellets of Examples and Comparative Examples were molded under the following molding conditions using a molding machine (“SE100DU” manufactured by Sumitomo Heavy Industries, Ltd.) to obtain test specimens (4 mm × 10 mm × 80 mm). Thereafter, the deflection temperature under load was measured by a method in accordance with ISO 75-1 and 2. Note that 1.8 MPa was used as the bending stress. The results are shown in Table 1.
〔Molding condition〕
Cylinder temperature: 350 ° C
Mold temperature: 80 ℃
Back pressure: 2.0MPa
Injection speed: 33mm / sec
φ100mm×3mmtの平板試験片を用い、ASTM D257に準拠して、体積抵抗率を測定した。結果を表1に示す。 <Volume resistivity>
Volume resistivity was measured according to ASTM D257 using a flat test piece of φ100 mm × 3 mmt. The results are shown in Table 1.
実施例及び比較例のペレットを、成形機(住友重機械工業社製 「SE30DUZ」)を用いて、以下の成形条件で成形し、12.5mm×120mm×0.8mmの成形体を得た。この成形体を半分に切断したものを試験片として使用した。
〔成形条件〕
シリンダー温度: 350℃
金型温度: 90℃
射出速度: 80mm/sec
〔評価〕
半分に切断した成形体を3分間、室温の水中で超音波洗浄機(出力300W、周波数45kHz)にかけた。その後、超音波洗浄機にかける前後の成形体を比較して、成形体表面の毛羽立った部分の面積(起毛面積)を画像測定器((株)ニレコ製LUZEXFS)にて評価した。なお、評価面積は750mm2(12.5mm×60mm)であり、上記評価面積に対する上記起毛面積の割合(%)を結果として用いた。結果を表1に示す。
起毛面積が少ないほど、起毛抑制効果が高い評価となる。 <Evaluation of napping state (surface napping suppression effect) on the surface of the molded body>
The pellets of Examples and Comparative Examples were molded under the following molding conditions using a molding machine (“SE30DUZ” manufactured by Sumitomo Heavy Industries, Ltd.) to obtain a molded body of 12.5 mm × 120 mm × 0.8 mm. What cut | disconnected this molded object in half was used as a test piece.
〔Molding condition〕
Cylinder temperature: 350 ° C
Mold temperature: 90 ℃
Injection speed: 80mm / sec
[Evaluation]
The molded body cut in half was subjected to an ultrasonic cleaner (output 300 W, frequency 45 kHz) in water at room temperature for 3 minutes. Thereafter, the molded bodies before and after being subjected to an ultrasonic cleaning machine were compared, and the area (raised area) of the fluffed portion on the surface of the molded body was evaluated with an image measuring instrument (LUZEXFS manufactured by Nireco Corporation). The evaluation area was 750 mm 2 (12.5 mm × 60 mm), and the ratio (%) of the raised area to the evaluation area was used as a result. The results are shown in Table 1.
The smaller the raising area, the higher the raising suppression effect.
10 基板
11 光学素子
12 リード配線
13 レンズホルダー
14 バレル
15 レンズ
16 IRフィルター
17 ガイド DESCRIPTION OF SYMBOLS 1 Camera module 10 Board |
Claims (4)
- (A)液晶性樹脂、
(B1)繊維状非導電性充填剤及び(B2)非繊維状非導電性充填剤から選択される少なくとも1種の(B)非導電性充填剤、
(C1)オレフィン系共重合体及び(C2)スチレン系共重合体から選択される少なくとも1種の(C)共重合体、並びに
(D1)繊維状導電性充填剤及び(D2)非繊維状導電性充填剤からなる(D)導電性充填剤
を含有し、
(A)成分の含有量が55~91質量%、(B)成分の含有量が5~20質量%、(C)成分の含有量が2~10質量%、(D1)成分の含有量が1~5質量%、(D2)成分の含有量が1~15質量%であり、
前記(B1)繊維状非導電性充填剤は、平均繊維径が1.0μm以下、且つ平均繊維長が5~50μmであり、
前記(B2)非繊維状非導電性充填剤は、平均粒子径が50μm以下の、板状充填剤及び粒状充填剤から選択される少なくとも1種であり、
前記(C1)オレフィン系共重合体は、α-オレフィンとα,β-不飽和酸のグリシジルエステルとから構成され、
前記(C2)スチレン系共重合体は、スチレン類とα,β-不飽和酸のグリシジルエステルとから構成され、
前記(D1)繊維状導電性充填剤は、平均繊維長が50μm以上であり、
前記(D2)非繊維状導電性充填剤は、平均粒子径が20nm~50μmの、板状充填剤及び粒状充填剤から選択される少なくとも1種であり、
体積抵抗率が1×104~1×1014Ω・cmであるカメラモジュール用液晶性樹脂組成物。 (A) liquid crystalline resin,
At least one (B) non-conductive filler selected from (B1) fibrous non-conductive filler and (B2) non-fibrous non-conductive filler,
(C1) an olefin copolymer and (C2) at least one (C) copolymer selected from styrene copolymers, and (D1) fibrous conductive filler and (D2) non-fibrous conductive Containing a conductive filler (D) composed of a conductive filler,
The content of component (A) is 55 to 91% by mass, the content of component (B) is 5 to 20% by mass, the content of component (C) is 2 to 10% by mass, and the content of component (D1) is 1 to 5% by mass, the content of component (D2) is 1 to 15% by mass,
The (B1) fibrous nonconductive filler has an average fiber diameter of 1.0 μm or less and an average fiber length of 5 to 50 μm.
The (B2) non-fibrous non-conductive filler is at least one selected from a plate-like filler and a granular filler having an average particle diameter of 50 μm or less,
The (C1) olefin copolymer is composed of an α-olefin and a glycidyl ester of an α, β-unsaturated acid,
The (C2) styrene copolymer is composed of styrenes and glycidyl ester of α, β-unsaturated acid,
The (D1) fibrous conductive filler has an average fiber length of 50 μm or more,
The (D2) non-fibrous conductive filler is at least one selected from a plate-like filler and a granular filler having an average particle diameter of 20 nm to 50 μm,
A liquid crystalline resin composition for a camera module having a volume resistivity of 1 × 10 4 to 1 × 10 14 Ω · cm. - 請求項1記載のカメラモジュール用液晶性樹脂組成物からなるカメラモジュール用部品。 A camera module part comprising the liquid crystalline resin composition for a camera module according to claim 1.
- レンズホルダーである請求項2記載のカメラモジュール用部品。 3. The camera module component according to claim 2, wherein the camera module component is a lens holder.
- レンズホルダーと、前記レンズホルダーの台座となるガイドとを備えるカメラモジュールであって、
前記レンズホルダーは、請求項1記載のカメラモジュール用液晶性樹脂組成物からなり、
前記ガイドは、前記カメラモジュール用液晶性樹脂組成物以外の材料からなるカメラモジュール。
A camera module comprising a lens holder and a guide serving as a base for the lens holder,
The lens holder is made of a liquid crystalline resin composition for a camera module according to claim 1,
The guide is a camera module made of a material other than the liquid crystalline resin composition for the camera module.
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CN201380062895.5A CN104822775B (en) | 2012-12-03 | 2013-11-20 | Camera module use liquid crystalline resin composition and use its camera module |
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JPWO2014087842A1 (en) | 2017-01-05 |
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