WO2014071848A1 - 标识芯片收容装置、光纤熔配模块、光纤管理装置和装配方法 - Google Patents

标识芯片收容装置、光纤熔配模块、光纤管理装置和装配方法 Download PDF

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Publication number
WO2014071848A1
WO2014071848A1 PCT/CN2013/086652 CN2013086652W WO2014071848A1 WO 2014071848 A1 WO2014071848 A1 WO 2014071848A1 CN 2013086652 W CN2013086652 W CN 2013086652W WO 2014071848 A1 WO2014071848 A1 WO 2014071848A1
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WO
WIPO (PCT)
Prior art keywords
optical fiber
chip
fiber
identification chip
storage device
Prior art date
Application number
PCT/CN2013/086652
Other languages
English (en)
French (fr)
Inventor
郭明松
马建军
舒思文
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to EP13853721.2A priority Critical patent/EP2908161B1/en
Priority to MX2015005686A priority patent/MX344043B/es
Priority to CA2890967A priority patent/CA2890967C/en
Priority to AU2013344064A priority patent/AU2013344064B2/en
Priority to ES13853721.2T priority patent/ES2633977T3/es
Publication of WO2014071848A1 publication Critical patent/WO2014071848A1/zh
Priority to US14/705,695 priority patent/US9632259B2/en

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/38—Mechanical coupling means having fibre to fibre mating means
    • G02B6/3807—Dismountable connectors, i.e. comprising plugs
    • G02B6/3895—Dismountable connectors, i.e. comprising plugs identification of connection, e.g. right plug to the right socket or full engagement of the mating parts
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/44—Mechanical structures for providing tensile strength and external protection for fibres, e.g. optical transmission cables
    • G02B6/4439—Auxiliary devices
    • G02B6/444—Systems or boxes with surplus lengths
    • G02B6/4452—Distribution frames
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/44—Mechanical structures for providing tensile strength and external protection for fibres, e.g. optical transmission cables
    • G02B6/4439—Auxiliary devices
    • G02B6/444—Systems or boxes with surplus lengths
    • G02B6/4452—Distribution frames
    • G02B6/44526—Panels or rackmounts covering a whole width of the frame or rack
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/44—Mechanical structures for providing tensile strength and external protection for fibres, e.g. optical transmission cables
    • G02B6/4439—Auxiliary devices
    • G02B6/444—Systems or boxes with surplus lengths
    • G02B6/4453—Cassettes
    • G02B6/4454—Cassettes with splices
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/44—Mechanical structures for providing tensile strength and external protection for fibres, e.g. optical transmission cables
    • G02B6/4479—Manufacturing methods of optical cables
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y10T29/49137—Different components

Definitions

  • the invention relates to the field of optical fiber network management, in particular to an identification chip receiving device, a fiber fusion module, a fiber management device and an assembly method.
  • radio frequency I only 1 (Radio Frequency Ident I-I-Ion) (RFID) and an electronic I-only (Electronic Identity).
  • RFID Radio Frequency Ident I-I-Ion
  • elD Electronic Identity
  • FIG. 1 illustrates an implementation of an electronic tag in the form of an RFID.
  • the common optical fiber connector 101 is used to mount the RFID chip 102 on the optical fiber connector 101 by using the upper and lower buckles 103, and then the optical fiber connector 101 is connected to the optical fiber adapter to implement optical fiber communication.
  • the RFID chip 102 on the plug of the optical fiber connector 101 can store not only the inherent fiber ID information but also various user information.
  • a Principal Circuit Board (PCB) soldered with an antenna is required for transmitting information to the RFID reader.
  • PCB Principal Circuit Board
  • the access position of the RFID chip 102 needs to be very close to the antenna on the PCB, so the buckle 103 needs to be inserted under the optical fiber adapter, so the optical fiber connector 101 needs to be unplugged first during the installation process, and the buckle 103 is used.
  • the optical fiber connector 101 is inserted back into the optical fiber adapter, so that the buckle 103 with the RFID chip is inserted under the optical fiber adapter, so that the online installation of continuous service cannot be realized. Additional equipment is required when reading data, which increases costs.
  • the PCB is placed inside the tray and the inside of the tray is soft The cable is placed under the fiber, so installing the PCB requires all the soft cables to be pulled out, which is very inconvenient for upgrading the ordinary network to the intelligent network.
  • Figure 2 is a prior art implementation of an elD form electronic tag.
  • the solution uses a customized fiber optic adapter 104 and a fiber optic connector 105.
  • a chip slot 108 is added to the fiber optic connector 105 for the built-in elD chip 106, and the customized fiber optic adapter 104 is soldered to the PCB 107.
  • the optical fiber adapter 104 is inserted into the optical fiber connector 105, and the pin of the eID chip 106 is connected to the PCB 107 to realize external signal reading of the elD chip 106.
  • a custom fiber optic adapter 104 is required for soldering on the PCB 107, while a custom fiber optic connector 105 is required, with the chip slot 108 reserved for accommodating the elD chip 106. Therefore, the intelligent network using this method cannot be compatible with the ordinary network, and the cost is high. When the elD chip is installed, the service must be interrupted, otherwise the online installation cannot be realized. In addition, since the PCB and the adapter are soldered together, they cannot be replaced separately if the adapter is damaged. Summary of the invention
  • the object of the present invention is to solve the problems of high cost and uninterrupted service installation in the prior art, and to provide an identification chip housing device, a fiber fusion module, a fiber management device and a mounting method.
  • an embodiment of the present invention provides an identification chip receiving device, including: a chip receiving structure for accommodating a chip for identifying a fiber optic connector and electrically connecting the chip to an external device;
  • the ferrule structure is used for socketing on the fiber optic connector.
  • an embodiment of the present invention provides a fiber fusion module, including:
  • the distribution board has a fiber adapter card position, and is used for a card-mounted fiber adapter, and a cutout groove is disposed under each card position for mounting a chip receiving structure for identifying the chip housing device; Mounted under the fiber adapter card slot, the gold finger on the circuit board is exposed from the hollow recess below the fiber adapter card position;
  • a bottom cover is capped over the circuit board to cover the back side of the distribution panel, and the circuit board is packaged in the fiber fusion module.
  • an embodiment of the present invention provides a fiber management apparatus, characterized in that:
  • the fiber management device includes an identification chip receiving device and a fiber fusion module;
  • the ferrule structure of the chip accommodating device is labeled and fastened to the optical fiber connector, and the chip accommodating structure of the identifiable chip accommodating device is installed in the hollow recess;
  • the chip in the chip housing structure communicates with the outside through the chip housing structure and the circuit board.
  • an embodiment of the present invention provides a method for assembling a fiber management device for assembling a fiber management device, including:
  • the fiber fusion module includes a distribution panel
  • the chip receiving structure of the chip receiving device is latched into the hollow recess of the fiber fusion module; and the ferrule structure of the chip receiving device is sleeved on the fiber connector.
  • the optical chip management device, the optical fiber fusion module, the optical fiber management device and the assembly method provided by the embodiments of the present invention implement a fiber optic management device with good compatibility and low cost, and can provide the optical fiber without interrupting the optical fiber communication.
  • the network is equipped with electronic tags to upgrade the ordinary network to the intelligent network.
  • FIG. 1 is a schematic structural view of a prior art optical fiber connector card-attached RFID chip
  • FIG. 2 is a schematic structural view of a built-in elD chip of a prior art optical fiber connector
  • FIG. 3 is a schematic structural diagram of an identifier chip housing device according to an embodiment of the present invention.
  • FIG. 4 is a schematic structural view of a chip accommodating structure in the tag chip accommodating device shown in FIG. 3;
  • FIG. 5 is a schematic view showing the ferrule structure in the tag chip accommodating device shown in FIG.
  • FIG. 6 is an exploded view of a fiber fusion module according to an embodiment of the present invention.
  • FIG. 7 is a structural schematic view of a distribution panel, a PCB, and a bottom cover portion of the optical fiber fusion module shown in FIG. 6.
  • FIG. 8 is an enlarged partial detail view of FIG.
  • FIG. 9 is a schematic diagram of an optical fiber management apparatus according to an embodiment of the present invention.
  • FIG. 10 is a structural diagram of electrical signal transmission of a fiber management device according to an embodiment of the present invention
  • FIG. 11 is a schematic diagram of signal transmission of a fiber management device according to an embodiment of the present invention
  • FIG. 12 is a schematic diagram of a method for assembling an optical fiber management device according to an embodiment of the present invention
  • FIG. 13 is a second schematic diagram of an assembly method of a fiber management device according to an embodiment of the present invention.
  • the identification chip receiving device, the optical fiber fusion module, the optical fiber management device and the assembly method provided by the embodiment of the invention add a chip for identifying the optical fiber connector to the optical fiber connector by using the identification chip receiving device to be engaged, and ⁇
  • the fiber fusion module with the added PCB is electrically connected to the chip to realize electrical signal communication with the outside.
  • the solution can be applied to a fiber-optic communication system, and adds certain intelligent features to the fiber-optic network device by using a chip that identifies the fiber-optic connector, such as identification and management of the fiber-optic connection, optical fiber intelligent indication, etc., and can be introduced into a field tool such as a PDA. Real-time interoperability between fiber-optic network equipment and inventory management systems.
  • FIG. 3 is a schematic structural diagram of an identifier chip housing device according to an embodiment of the present invention.
  • the identification chip receiving device is made of a plastic material, and of course, it can be made of other materials as needed, and its external structure is integrally formed.
  • the identification chip housing device can be classified into a chip housing structure 21 and a ferrule structure 22, depending on the function.
  • the chip housing structure 21 is for accommodating a chip for identifying the fiber connector (the elD chip is exemplified in the following embodiments).
  • the ferrule structure 22 can be sleeved on the fiber optic connector for attaching the chip accommodating structure 21 and its internal chip to the fiber optic connector.
  • the above-mentioned chip has an electronic identifier with a global unique address, and it can be fixed on the fiber connector to identify the fiber connector, and realize the visual management and management accuracy of the fiber resource.
  • the chip housing structure 21 includes an elD chip and two springs 30.
  • the elD chip may have two chip pins, one of which is a signal pin 11 and the other is a ground pin 12, and the pin area is, for example, 1. 2 x 4. 8 mm. ⁇ Using large-sized pin design, it can ensure that the pin can be used for soldering or direct contact with signals.
  • the elD chip in the chip housing structure 21 can be electrically connected to an external device by direct contact with the elastic piece 30.
  • the two elastic pieces 30 placed in the chip housing structure 21 are identical, and are divided into three parts, an upper elastic piece portion 31, a lower elastic piece portion 32, and a bullet preventing structure 33.
  • the upper elastic piece portion 31, the lower elastic piece portion 32, and the bullet preventing lifting structure 33 may be integrally formed of metal, and the upper elastic piece portion 31 and the lower elastic piece portion 32, the upper elastic piece portion 31, and the joint for preventing the elastic pin lifting structure 33 are provided. Both are bent structures, and the bent structure makes the elastic piece 30 have elastic characteristics.
  • the pins 12 are in contact with each other and are pressed against the two pins of the elD chip; the upper elastic portion 31 of the two elastic pieces 30 are bent from the middle and protrude outside the chip receiving structure 21, and the intermediate bent portion is used for external
  • the device (described in more detail below) is electrically connected to contact the information of the elD chip.
  • the bullet preventing structure 33 is located at the top end of the elastic piece 32. 5 ⁇ , for the metal width of the elastic body of the elastic structure of the elastic body is 1. 5mm, for The card is placed in the plastic material of the chip housing structure 21, and of course, other materials may be used.
  • the positioning rib 211 can also be disposed outside the chip accommodating structure 21 to ensure that the identification chip accommodating device 20 can be accurately positioned when it is inserted into the fiber fusion splicing module (described in detail below).
  • the shrapnel is placed on an external device.
  • the elastic piece includes an upper elastic piece portion and a lower elastic piece portion, and the upper elastic piece portion can be connected to an external device by being welded to the PCB.
  • the lower elastic piece contacts and is pressed against the pins of the e lD chip to realize electrical connection between the elD chip and the external device.
  • the ferrule structure 22 is a hollow openable sleeve-like structure that can be sleeved on the optical fiber connector 8 to fix the chip accommodating structure 21 connected to the body and the e lD chip accommodated therein to the optical fiber connector. 8 on.
  • the front end on the fastening surface 221 of the ferrule structure 22 may have a front positioning member 2211.
  • the front portion is The positioning member 2211 is aligned with the projection 81 on the fiber optic connector 8 for indicating the position of the mounting.
  • the latching surface 221 can also have a latching protrusion 2212 that is engaged with the slot 2222 of the folding structure 222.
  • the buckled ferrule structure 22 forms a hollow rectangular parallelepiped and is sleeved on the optical fiber connector. 8 on.
  • the fold structure 222 can also have a rear positioning structure 2221 that is in contact with the handshake ramp 82 of the fiber optic connector 8 for tightly securing the fiber optic connector 8 and the ferrule structure 22.
  • a beveled recess 223 is provided in the foldable movable portion to facilitate the folding of the ferrule structure 22.
  • the ferrule structure 22 When the folded structure 222 of the ferrule structure 22 of the chip housing device 20 is in an open state, the ferrule structure 22 is inserted from the optical fiber 9 toward the optical fiber connector 8. After the positioning member 2211 is in alignment with the protruding member 81, the latching protrusion 2212 on the fastening surface 221 is engaged with the slot 1111 on the folding structure 222. At this time, the handshake slope 82 of the optical fiber connector 8 is The rear positioning structure 2221 achieves close contact, The identification chip housing device 20 completes the fixation on the fiber optic connector 8. At this time, the optical fiber 9 to which the optical fiber connector 8 is connected is an intelligent optical fiber with elD.
  • the method of socketing the identification chip receiving device 20 on the optical fiber connector 8 realizes the intelligent upgrade of the optical fiber 9 without replacing the optical fiber connector 8.
  • the electrical signal of the e I D chip carried on the optical fiber connector 8 is transmitted from the chip pin to the external device through contact with the elastic piece 30, and the optical path portion and the circuit portion on the optical fiber 9 are completely separated from each other. If the optical path portion (ie, the optical fiber 9) is damaged, only the optical fiber 9 is replaced, and the elD chip 10 of the circuit portion can be removed with the identification of the chip receiving device 20, and the optical fiber connection of the replaced optical fiber 9 can be reinstalled after the optical path is replaced. On the 8th. Similarly, if the circuit portion in the identification chip housing device 20 is damaged, it is only necessary to remove the identification chip housing device 20 for replacement.
  • FIG. 6 is an exploded view of a fiber fusion module according to an embodiment of the present invention.
  • the optical fiber fusion module 40 mainly includes: a PCB 41, a wiring board 42 and a bottom cover 43, and a welding plate 44 and a cover plate 45.
  • Fig. 7 is a structural view showing the structure of the wiring board 42, the PCB 41, and the bottom cover 43 of the optical fiber fusion module 40 of Fig. 6.
  • the distribution panel 42 has 12 fiber adapter slots 421, which can be loaded with 12 fiber adapters 422, and a hollow recess at the edge portion of each fiber adapter slot 421.
  • the slot 423 is for mounting the chip housing structure 21 that identifies the chip housing device 20.
  • a positioning hole 424 may be disposed on the sidewall of each of the hollow recesses 423.
  • the shape structure is matched with the shape and structure of the positioning rib 211 outside the chip receiving structure 21; When the structure 21 is inserted into the hollow recess 423, the positioning rib 211 is inserted into the positioning hole 424 to be firmly engaged, so that the identification chip housing device 20 is accurately pressed onto the PCB 41.
  • the distribution panel 42 can also be provided with an expandable base 425, which can expand the fusion end of the optical fiber into 24 cores, and can fit 24 fiber adapters 422 to meet the requirements of the dual LC.
  • the PCB 41 is mounted below the fiber adapter slot 421.
  • the PCB 41 has a circuit structure connected to the serial bus 50 and a gold finger 411 serving as an electrical connection contact point, and the gold finger 411 is exposed from the hollow groove 423 at the edge of the fiber adapter card 421.
  • the gold fingers 411 are two metal electrode contacts respectively in contact with two elastic pieces 30 in the chip receiving structure 21 mounted in the hollow recess 423, wherein one of the electrode contacts passes through the elastic piece 30 and The signal pin 11 of the elD chip is connected, The information of the e lD chip is transmitted to the serial bus 50 via the PCB 41, and the other electrode contact is connected to the ground pin 12 of the e lD chip through another spring 30 to have a potential of zero.
  • the bottom cover 43 is located on the bottom surface of the fiber fusion module 40. After the PCB 41 is mounted on the fiber fusion module 40, it is overlaid on the PCB 41, so as to be covered on the back surface of the distribution panel 42, and the PCB 41 is packaged in the fiber fusion. Inside the module.
  • the PCB 41 of the fiber fusion module 40 is coupled to the serial bus 50 to communicate information to the external communication system.
  • the optical path portion of the fiber fusion module 40 is completely separate from the circuit portion. If the optical path portion (ie, fiber optic adapter 422 and its attached fiber portion) is damaged, only the optical path portion needs to be replaced. If the PCB 41 of the circuit part fails, it can be removed with the bottom cover 43 open, and the new PCB 41 can be reinstalled in the fiber fusion module 40.
  • FIG. 9 is a schematic diagram of an optical fiber management apparatus according to an embodiment of the present invention.
  • the fiber management device includes the fiber fusion module 40 and the identification chip housing device 20 provided in the above embodiments.
  • the optical fiber 9 is inserted into the optical fiber adapter 422 of the optical fiber fusion module 40 through the optical fiber connector 8, and the optical path communication connection between the optical fiber 9 and the optical fiber fusion module 40 is realized.
  • the chip accommodating device 20 is assembled and fastened to the optical fiber connector 8. At this time, the chip accommodating structure 21 of the chip accommodating device 20 is mounted in the hollow recess 423 below the optical fiber adapter 422, and inserted into the positioning hole 424 through the positioning rib 211. The chip is firmly bonded, so that the chip housing structure 21 is accurately pressed onto the PCB 41, and the gold finger 411 of the PCB 41 is pressed by the spring 30 in the chip housing device 20.
  • FIG. 1 A schematic diagram of the signal transmission of the electrical connection of the fiber management device is shown in FIG.
  • the signal of the e lD chip 10 is connected to the external communication system via the shrapnel 30, the PCB 41, and the serial bus 50 connected to the PCB 41.
  • the optical signals are transmitted through the two optical fibers 9, 99 connected by the optical fiber connectors 8, 88 connected at both ends of the optical fiber adapter 422; the electrical signals are transmitted through the identification chip housing device 20, the PCB 41, and the serial bus 50. transmission.
  • the external network management system 60 sends a signal, and the signal is transmitted to the PCB 41 through the serial bus 50, and the PCB 41 is based on The connected information identifying the e lD chip contained in the chip housing device 20 finds the corresponding port.
  • the identification chip receiving device 20 on the connector 8 is also pulled out from the optical fiber fusion module, and the electrical connection between the elD chip and the PCB 41 in the identification chip housing device 20 is interrupted, and the PCB 41 is externally connected through the serial bus 50.
  • the network management system 60 sends a signal that the fiber communication of the port has been interrupted.
  • fiber system maintenance such as fiber communication for accessing a port
  • the electrical connection between the eMD chip housed in the chip housing device 20 and the PCB 41 is identified along with the fiber connector 8. Established with the connection of the fiber optic adapter 422.
  • the information of the elD chip is transmitted to the network management system 60 through the PCB 41 and the serial bus 50.
  • the network management system 60 verifies the received information and determines whether the optical fiber connection is correct. If not, the network management system 60 will send a message to the PCB 41 to inform the connection error via the LED.
  • each end-to-end link can be conveniently marked, displayed, and managed in the network management system, facilitating the installation and maintenance of the fiber-optic communication device.
  • the optical fiber not including the optical fiber management device can be simultaneously compatible, and as shown in FIG. 9, the optical fiber connector 8 to which the chip storage device 20 is attached is connected. 6 and the optical fiber 7 connected to the optical fiber connector 8 without the identification chip receiving device 20 can be connected to the optical fiber fusion module 40 to which the PCB 41 is attached, and the optical fiber connector 8 and the two optical fibers are used.
  • the access fiber adapters 422 are all identical, which greatly enhances the applicability of the fiber management device, and easily achieves compatibility between the ordinary network and the intelligent network.
  • an embodiment of the present invention provides a method for assembling an optical fiber management device, that is, a method for upgrading a conventional optical fiber network to an intelligent optical fiber network by using an optical fiber management device.
  • the identification chip receiving device 20 in the open state is inserted from the optical fiber into the optical fiber connector, and the chip receiving structure of the identification chip receiving device 20 is locked on the PCB 41 of the optical fiber fusion module. Then, the ferrule structure of the chip receiving device 20 is sleeved on the fiber connector 8, and the buckle is fastened. The fiber connector 8 is upgraded.
  • the elD chip of the identification fiber connector housed in the chip housing structure passes through the pin
  • the shrapnel is in contact with the gold finger of the PCB 41 to achieve electrical connection with the external communication system.
  • the ordinary optical network is upgraded to an intelligent optical network with an elD chip.
  • Upgrading only requires the addition of PCBs and identification chip containment devices with elD chips, which effectively reduces costs.
  • the method of adding the elD chip to the chip receiving device does not affect the normal light.
  • the bottom cover 43 is simply removed, the PCB 41 is removed, and the replacement is performed.
  • a new PCB 41 can be installed with the bottom cover 43 installed.
  • the maintenance process is simple and does not affect the optical path operation, and the communication service of the optical fiber system does not need to be interrupted.
  • the identification chip housing device 20 When the elD chip is damaged and needs to be replaced, the identification chip housing device 20 is simply opened, the fiber optic adapter is detached from the fiber optic adapter, removed, and a tag chip housing device 20 equipped with a new elD chip is mounted. The maintenance process also does not affect the communication service of the fiber system.
  • the fiber management device and the chip housing structure of the present invention can also be used to accommodate other chips other than the I I D chip that can be used for fiber identification, such as RF I D.
  • a person skilled in the art can modify the apparatus and methods of the various examples described herein to implement the described functions, but such implementation should not be considered to be beyond the scope of the present invention.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Light Guides In General And Applications Therefor (AREA)
  • Mechanical Coupling Of Light Guides (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Replacement Of Web Rolls (AREA)

Abstract

一种标识芯片收容装置（20）、光纤熔配模块（40）、光纤管理装置和装配该光纤管理装置的方法。该光纤管理装置包括标识芯片收容装置（20）和光纤熔配模块（40）。该标识芯片收容装置（20）包括芯片容置结构（21）和卡套结构（22）。其中，芯片容置结构（21）用于容纳标识光纤连接器（8）的芯片（10）并且实现芯片（10）与外部设备的电连接，卡套结构（22）用于套接在光纤连接器（8）上。该光纤管理装置兼容性好，方便从普通网络升级到智能网络，不需要中断光纤通讯业务。

Description

标识芯片收容装置、 光纤熔配模块、 光纤管理装置和装配方法 本申请要求于 2012年 11月 7日提交中国专利局、申请号为 201210441049.1、 发明名称为"标识芯片收容装置、光纤熔配模块、光纤管理装置和装配方法，，的中 国专利申请的优先权， 其全部内容通过引用结合在本申请中。 技术领域
本发明涉及光纤网络管理领域， 特别是一种标识芯片收容装置、 光纤熔配 模块、 光纤管理装置和装配方法。 背景技术
随着通信技术的发展， 光纤传输被越来越多地运用到通信系统中。 必然带 来光纤管理的难度增加。 于是各种方便光纤管理的技术孕育而生， 如在每一个 连接器上增加纸质标签或者使用光电复合缆。 然而纸质标签容易损害， 且不能 实现智能化管理， 光电复合缆价格昂贵， 且不能解决已经铺设好的光纤的问题。
于是， 一种在光纤连接器上加入带芯片的电子标签技术产生了， 这种技术 有射频 i只另1 J ( Radio Frequency Ident if icat ion, RFID )和电子 i只另 ( Electronic Ident i ty, elD ) 两种形式。
图 1示意了一种釆用 RFID形式电子标签的实现方式。 如图 1所示， 在普通 光纤连接器 101釆用上下两片卡扣 103将 RFID芯片 102卡装在光纤连接器 101 上， 再将光纤连接器 101 连接到光纤适配器上实现光纤通讯， 安装在光纤连接 器 101插头上的 RFID芯片 102 , 不仅可以保存固有的光纤 ID信息， 还可以保存 各种用户信息。 当读取 RFID芯片 102的数据时， 需要一个焊接有天线的电路板 ( Pr inted circui t board, PCB ), 用于向 RFID 阅读器发送信息。 此方案的缺 点在于： 技术复杂， 成本高。 受发射功率的限制， RFID芯片 102接入位置需要 非常接近 PCB上的天线， 因而卡扣 103需要插入到光纤适配器下面， 所以在安 装过程中需要先将光纤连接器 101拔下， 用卡扣 103卡装上 RFID芯片 102后再 将光纤连接器 101插回光纤适配器中， 从而将带有 RFID芯片的卡扣 103插入光 纤适配器下方， 因此无法实现不断业务的在线安装。 在读取数据时还需要额外 的设备， 增加了成本。 此外， 因为 PCB放置于托盘的内部， 并且托盘内部有软 排线放置在光纤下面， 因此安装 PCB需要将所有软排线拔出， 非常不便于普通 网络向智能网络的升级。
图 2是一种现有的釆用 elD形式电子标签的实现方式。 如图 2所示， 该方 案釆用定制的光纤适配器 104和光纤连接器 105 ,在光纤连接器 105上增加芯片 插槽 108用于内置 elD芯片 106 , 将定制的光纤适配器 104焊接在 PCB 107上， 再将光纤适配器 104与光纤连接器 105相插接，使 e ID芯片 106的管脚与 PCB 107 相连接， 实现外部对 elD芯片 106的信号读取。 此方案的缺点在于： 需要定制 化的光纤适配器 104用于焊接在 PCB 107上， 同时需要釆用定制的光纤连接器 105 , 预留有芯片插槽 108的位置用于容置 elD芯片 106。 因此釆用此方法的智 能网络无法与普通网络相兼容， 且成本高， 在安装 elD 芯片时必须中断业务， 否则无法实现在线安装。 此外， 由于 PCB与适配器是焊接在一起的， 如果适配 器发生损坏无法单独更换。 发明内容
本发明的目的是为了解决现有技术中高成本和无法不中断业务进行升级安 装的问题， 提供了一种标识芯片收容装置、 光纤熔配模块、 光纤管理装置和装 配方法。
在第一方面， 本发明实施例提供了一种标识芯片收容装置， 包括： 芯片容置结构， 用于容纳标识光纤连接器的芯片并且实现所述芯片与外部 设备的电连接；
卡套结构， 用于套接在光纤连接器上。
在第二方面， 本发明实施例提供了一种光纤熔配模块， 包括：
配线盘， 所述配线盘具有光纤适配器卡位， 用于卡装光纤适配器， 每个卡 位的下方具有一个镂空凹槽， 用于安装标识芯片收容装置的芯片容置结构； 电路板， 装配在所述光纤适配器卡位的下方， 所述电路板上的金手指从所 述光纤适配器卡位的下方镂空凹槽露出；
底盖， 盖合在所述电路板之上， 从而盖合在配线盘的背面， 将所述电路板 封装在所述光纤熔配模块内。
在第三方面， 本发明实施例提供了一种光纤管理装置， 其特征在于， 所述 光纤管理装置包括标识芯片收容装置和光纤熔配模块；
其中， 标识芯片收容装置的卡套结构套装并扣合在光纤连接器上， 所述标 识芯片收容装置的芯片容置结构安装在所述镂空凹槽里；
所述芯片容置结构内的芯片通过芯片容置结构和电路板实现与外部的通 信。
在第四方面， 本发明实施例提供了一种光纤管理装置的装配方法， 用于装 配光纤管理装置， 包括：
开启光纤熔配模块背面的底盖， 其中光纤熔配模块包括配线盘；
将电路板装入配线盘上预留的位置， 装上底盖；
将标识芯片收容装置的芯片容置结构卡接在光纤熔配模块的镂空凹槽内； 将标识芯片收容装置的卡套结构套接在光纤连接器上。
应用本发明实施例提供的标识芯片收容装置、 光纤熔配模块、 光纤管理装 置和装配方法， 实现了一种兼容性好、 低成本的光纤管理装置， 可以在不中断 光纤通讯的情况下给光纤网络加装电子标签， 实现普通网络到智能网络的升级。 附图说明
图 1为现有技术光纤连接器卡接 RFID芯片的结构示意图；
图 2为现有技术光纤连接器内置 elD芯片的结构示意图；
图 3为本发明实施例提供的标识芯片收容装置的结构示意图；
图 4为图 3所示标识芯片收容装置中的芯片容置结构的结构示意图； 图 5为图 3所示标识芯片收容装置中的卡套结构在光纤连接器上的安装示 意图；
图 6为本发明实施例提供的光纤熔配模块的爆炸图；
图 7为图 6所示光纤熔配模块的配线盘、 PCB和底盖部分的结构示意图； 图 8为图 7的局部细节放大图；
图 9为本发明实施例提供的光纤管理装置的示意图；
图 10为本发明实施例提供的光纤管理装置的电信号传输的架构图； 图 11为本发明实施例提供的光纤管理装置的信号传输示意图；
图 12为本发明实施例提供的光纤管理装置的装配方法示意图之一； 图 13为本发明实施例提供的光纤管理装置的装配方法示意图之二。 具体实施方式
下面通过附图和实施例， 对本发明的技术方案做进一步的详细描述。
本发明实施例提供的标识芯片收容装置、 光纤熔配模块、 光纤管理装置和 装配方法釆用标识芯片收容装置卡接的方法在光纤连接器上增加一颗用于标识 光纤连接器的芯片， 以及釆用增加了 PCB 的光纤熔配模块与芯片进行电连接， 实现了与外部的电信号通信。 此方案可以应用于光纤通讯系统中， 通过使用标 识光纤连接器的芯片为光纤网络设备增加一定的智能特性， 例如光纤连接的识 别和管理， 光纤智能指示等， 并且可以通过引入 PDA等现场工具， 实现光纤网 络设备与存量管理系统的实时互通。
图 3为本发明实施例提供的标识芯片收容装置的结构示意图。 标识芯片收 容装置为塑胶材料制成， 当然也可以根据需要由其他材料制成， 其外部结构为 一体制成。 根据功能不同， 标识芯片收容装置可分为芯片容置结构 21和卡套结 构 22。 芯片容置结构 21用于容纳标识光纤连接器的芯片（下述各实施例中均以 elD 芯片为例）。 卡套结构 22 可以套接在光纤连接器上， 用于将芯片容置结构 21及其内部芯片加装在光纤连接器上。 上述芯片内具有全球唯一地址的电子标 识， 将其固定在光纤连接器上可以用于标识光纤连接器， 实现光纤资源的可视 化管理及管理的准确性。
在一个实施例中， 芯片容置结构 21包括一颗 elD芯片和两个弹片 30。如图 4所示， elD芯片可以具有两个芯片管脚， 其中一个为信号管脚 11 , 另一个为接 地管脚 12 , 管脚面积例如为 1. 2 x 4. 8mm。 釆用大尺寸的管脚设计， 可以保证管 脚既可用于焊接， 也可以通过直接接触读写信号。 芯片容置结构 21内的 elD芯 片可以通过与弹片 30直接接触实现与外部设备的电连接的。 置于芯片容置结构 21内的两个弹片 30完全相同， 各分为 3部分， 上弹片部 31、 下弹片部 32和防 止弹针翘起结构 33。 上弹片部 31、 下弹片部 32和防止弹针翘起结构 33可以由 金属一体制成， 且上弹片部 31与下弹片部 32、 上弹片部 31与防止弹针翘起结 构 33的连接处均为弯折结构， 这种弯折结构使得弹片 30具有弹性特征。 两个 弹片 30的下弹片部 32分别与 elD芯片的两个芯片管脚中的信号管脚 11和接地 管脚 12相接触， 压紧在 elD芯片的两个管脚上； 两个弹片 30的上弹片部 31从 中间弯折， 突出在芯片容置结构 21之外， 中间弯折部分用于与外部设备（在下 文中予以详述）相接触进行电连接， 传递 elD 芯片的信息。 防止弹针翘起结构 33位于弹片 32的顶端。防止弹针翘起结构 33部分的金属宽度比上弹片 31和下 弹片 32宽， 例如， 弹片 30整体的金属宽度为 1匪， 防止弹针翘起结构 33的金 属宽度为 1. 5mm, 用于卡置在芯片容置结构 21的塑胶材质中， 当然， 也可以是 其他材质。 釆用这种结构设计， 既能保证弹片 30的正常弹性形变， 又可以保证 弹片始终处于芯片容置结构 21中， 在插拔的过程中不至于被损坏。 芯片容置结 构 21外侧还可设有定位筋 211 ,可以保证标识芯片收容装置 20被插入光纤熔配 模块（在下文中予以详述） 时， 能够被精确定位。
在另一个实施例中， 弹片置于外部设备上。 该弹片包括上弹片部和下弹片 部， 上弹片部可以通过焊接在 PCB上的方式与外部设备相连接。 当芯片容置结 构 21安装入外部设备时， 下弹片与 e lD芯片的管脚相接触并压紧， 实现 elD芯 片与外部设备的电连接。
卡套结构 22为中空的可打开的套状结构， 可以套接在光纤连接器 8上， 从 而将与之一体连接的芯片容置结构 21及其内部容置的 e lD芯片固定在光纤连接 器 8上。 在一个实施例中， 如图 5所示， 在卡套结构 22扣合面 221上的前端可 以具有前定位件 2211 , 在将卡套结构 11套接在光纤连接器 8上的时候， 将前定 位件 2211与光纤连接器 8上的凸件 81对齐， 用于指示安装的位置。 在扣合面 221上还可以具有卡扣凸起部 2212 , 与翻折结构 222上的卡槽 2222相扣合， 扣 合后的卡套结构 22形成一个中空的长方体， 套接在光纤连接器 8上。 翻折结构 222上还可以具有后定位结构 2221 , 与光纤连接器 8的握手斜面 82相接触， 用 于将光纤连接器 8和卡套结构 22紧密的固定在一起。 在可翻折的活动部位具有 斜面凹槽 223 , 便于将卡套结构 22进行翻折扣合。
当标识芯片收容装置 20的卡套结构 22的翻折结构 222处于打开状态时， 从光纤 9向光纤连接器 8方向套入卡套结构 22。 当前定位件 2211与凸件 81对 齐接触后， 将扣合面 221上的卡扣凸起部 2212与翻折结构 222上的卡槽 1111 相扣合， 此时光纤连接器 8的握手斜面 82与后定位结构 2221 实现紧密接触， 标识芯片收容装置 20完成了在光纤连接器 8上的固定。 此时， 光纤连接器 8所 连接的光纤 9为带有 elD的智能光纤。
釆用在光纤连接器 8上套接标识芯片收容装置 20的方式， 实现了无需更换 光纤连接器 8即可完成对光纤 9的智能升级。
光纤连接器 8上带有的 e I D芯片的电信号由芯片管脚通过与弹片 30接触向 外部设备传递， 和光纤 9 上的光路部分与电路部分是完全分开的。 如果光路部 分（即光纤 9 )发生损坏， 只需更换光纤 9 , 电路部分的 elD芯片 10可以随标 识芯片收容装置 20打开而拆下， 在光路更换后可以重新安装在更换后光纤 9的 光纤连接器 8上。 同样， 如果标识芯片收容装置 20内的电路部分发生损坏， 只 需拆下标识芯片收容装置 20进行更换即可。
图 6为本发明实施例提供的光纤熔配模块的爆炸图。光纤熔配模块 40主要 包括： PCB 41、 配线盘 42和底盖 43 , 此外还包括熔接盘 44、 盖板 45。
图 7示意了图 6光纤熔配模块 40的配线盘 42、 PCB41和底盖 43部分的结 构示意图的结构图。
在一个实施例中，如图 Ί所示，配线盘 42上具有 12个光纤适配器卡位 421 , 可以卡装 12个光纤适配器 422 , 在每个光纤适配器卡位 421的边缘部分有一个 镂空凹槽 423 , 用于安装标识芯片收容装置 20的芯片容置结构 21。 在每个镂空 凹槽 423的侧壁上还可以设置有一个定位孔 424 , 如图 8所示， 其形状结构与芯 片容置结构 21外侧的定位筋 211的形状结构相匹配； 在芯片容置结构 21插入 镂空凹槽 423时， 定位筋 211插入定位孔 424中牢固接合， 使标识芯片收容装 置 20被准确的压紧在 PCB 41之上。
配线盘 42上还可以配置有一个可扩展底座 425 , 可以将光纤的熔接端扩展 为 24芯， 可以卡装 24个光纤适配器 422 , 满足双 LC的需求。
PCB 41装配在光纤适配器卡位 421 的下方。 PCB 41上具有与串口总线 50 相连接的电路结构和用作电连接接触点的金手指 411 ,金手指 411从光纤适配器 卡位 421边缘的镂空凹槽 423中露出。 在一个例子中， 金手指 411为两个金属 电极触点，分别于与安装在镂空凹槽 423内的芯片容置结构 21内的两个弹片 30 相接触， 其中一个电极触点通过弹片 30与 elD芯片的信号管脚 11相连接， 通 过 PCB 41向串口总线 50传输 e lD芯片的信息， 另一个电极触点通过另一个弹 片 30与 e lD芯片的接地管脚 12相连接， 使其电位为 0。
底盖 43位于光纤熔配模块 40的底面， 在光纤熔配模块 40上装配 PCB 41 之后盖合在 PCB 41之上， 从而盖合在配线盘 42的背面， 将 PCB 41封装在光纤 熔配模块内。
光纤熔配模块 40的 PCB 41与串口总线 50相连接， 向外部通讯系统传递信 息。
光纤熔配模块 40上的光路部分与电路部分是完全分开的。如果光路部分（即 光纤适配器 422 及其连接的光纤部分）发生损坏， 只需对光路部分进行更换。 电路部分的 PCB 41如果发生故障， 可以随底盖 43打开而拆下， 更换新的 PCB 41 后可以重新安装在光纤熔配模块 40内。
图 9为本发明实施例提供的光纤管理装置的示意图。 光纤管理装置包括上 述实施例提供的光纤熔配模块 40和标识芯片收容装置 20。
光纤 9通过光纤连接器 8插入安装在光纤熔配模块 40的光纤适配器 422中， 实现光纤 9与光纤熔配模块 40的光路通讯连接。
标识芯片收容装置 20套装并扣合在光纤连接器 8上，此时标识芯片收容装 置 20的芯片容置结构 21安装在光纤适配器 422下方的镂空凹槽 423里， 通过 定位筋 211插入定位孔 424中牢固接合，使芯片容置结构 21被准确的压紧在 PCB 41之上， 此时 PCB 41的金手指 411被标识芯片收容装置 20中的弹片 30压紧。
光纤管理装置的电连接的信号传输示意图如图 10所示。 e lD芯片 10的信号 通过弹片 30 、 PCB 41、 以及连接在 PCB 41上的串口总线 50与外部通信系统建 立连接。
如图 11所示， 光信号通过光纤适配器 422两端接入的光纤连接器 8、 88连 接的两根光纤 9、 99进行传输； 电信号通过标识芯片收容装置 20、 PCB 41和串 口总线 50进行传输。 在一个实施例中， 当需要进行光纤系统维护， 如中断某个 端口的光纤通讯时， 外部的网管系统 60会给出一个信号，信号通过串口总线 50 传输到 PCB 41上， PCB 41根据与其相连接的标识芯片收容装置 20中容置的 e lD 芯片的信息找到相应的端口。 当该端口的光纤连接器 8被拔下后， 套接在光纤 连接器 8上的标识芯片收容装置 20也从光纤熔配模块中拔出， 标识芯片收容装 置 20中容置的 elD芯片与 PCB 41之间的电连接中断， PCB 41通过串口总线 50 向外部的网管系统 60发送一个信号， 报告该端口的光纤通讯已被中断。 在另一 个实施例中， 当需要进行光纤系统维护， 如接入某个端口的光纤通讯时， 标识 芯片收容装置 20中容置的 elD芯片与 PCB 41之间的电连接随着光纤连接器 8 与光纤适配器 422的连接而建立起来。 elD芯片的信息通过 PCB 41和串口总线 50传递到网管系统 60 , 网管系统 60对收到的信息进行验证， 判断光纤连接是 否正确。 如果不正确， 网管系统 60会发送信息到 PCB 41 , 通过 LED告知连接错 误。
通过釆用光纤管理装置， 可以在网络管理系统中方便的标记、 显示、 管理 每一个端到端的链路， 便于光纤通讯设备的安装和维护。
此外， 在一个釆用了光纤管理装置的光纤网络系统中， 可以同时兼容不安 装光纤管理装置的光纤， 如图 9所示， 加装了标识芯片收容装置 20的光纤连接 器 8接入的光纤 6和不加装标识芯片收容装置 20的光纤连接器 8接入的光纤 7 都可以连接在加装了 PCB 41 的光纤熔配模块 40上， 两根光纤所釆用的光纤连 接器 8和所接入的光纤适配器 422都是完全一样的， 这就大大增强了光纤管理 装置的适用性， 轻松地实现了普通网络和智能网络的兼容。
最后， 本发明实施例提供了一种光纤管理装置的装配方法， 即应用光纤管 理装置将传统光纤网络升级为智能光纤网络的方法。 首先， 如图 12所示， 开启传统光纤网络中光纤熔配模块背面的底盖 43 , 露 出配线盘 42的底部。 将 PCB 41装入配线盘 42上预留的位置， 安装好之后装上 底盖 43。 光纤熔配模块升级完毕。
其次， 如图 13所示， 从光纤向光纤连接器方向套入呈打开状态的标识芯片 收容装置 20 , 将标识芯片收容装置 20 的芯片容置结构卡接在光纤熔配模块的 PCB 41上， 再将标识芯片收容装置 20的卡套结构套接在光纤连接器 8上， 扣紧 卡扣。 光纤连接器 8升级完毕。
此时， 芯片容置结构内所容纳的标识光纤连接器的 elD芯片， 其管脚通过 弹片与 PCB 41的金手指相接触， 实现与外部通讯系统的电连接。
通过上述步骤， 普通光纤网络就升级为带有 elD芯片的智能光纤网络。 升 级只需要增 PCB 以及带有 elD芯片的标识芯片收容装置， 有效的降低了成本。 并且釆用这种套装标识芯片收容装置而加装 elD 芯片的方式不会影响正常的光 此外， 当 PCB 41发生损坏需要进行设备维护时， 只需将底盖 43拆下， 取 出 PCB 41 , 更换一个新的 PCB 41安装上再装好底盖 43即可， 维护过程简单并 且不影响光路工作， 无需中断光纤系统的通讯业务。
当 elD芯片发生损坏需要更换时， 只需将标识芯片收容装置 20打开， 从光 纤适配器向光纤方向褪出， 取下， 再安装上一个装有新的 elD 芯片的标识芯片 收容装置 20即可。 维护过程同样不影响光纤系统的通讯业务。
专业人员应该还可以进一步意识到， 本发明的光纤管理装置及芯片容置结 构还可以用于容置除 e I D芯片之外的其他可用于光纤标识的芯片，比如 RF I D等。 专业技术人员可以对本文中所公开的实施例描述的各示例的装置和方法稍作变 换来实现所描述的功能， 但是这种实现不应认为超出本发明的范围。
以上所述的具体实施方式， 对本发明的目的、 技术方案和有益效果进行了 进一步详细说明， 所应理解的是， 以上所述仅为本发明的具体实施方式而已， 并不用于限定本发明的保护范围， 凡在本发明的精神和原则之内， 所做的任何 修改、 等同替换、 改进等， 均应包含在本发明的保护范围之内。

Claims

权 利 要求 书
1、 一种标识芯片收容装置， 其特征在于， 所述标识芯片收容装置包括： 芯片容置结构， 用于容纳标识光纤连接器的芯片并且实现所述芯片与外部 设备的电连接；
卡套结构， 用于套接在光纤连接器上。
2、根据权利要求 1所述的标识芯片收容装置， 其特征在于， 所述芯片容置 结构和所述卡套结构用塑胶一体制成。
3、根据权利要求 1所述的标识芯片收容装置， 其特征在于， 所述芯片容置 结构包括金属弹片， 用于实现所述芯片与所述外部设备之间的电连接。
4、根据权利要求 3所述的标识芯片收容装置， 其特征在于， 所述金属弹片 包括上弹片部和下弹片部； 所述外部设备包括电路板； 所述芯片包括电子识别 elD 芯片； 所述上弹片部与所述下弹片部一体连接， 所述金属弹片的下弹片部 与所述 elD芯片的芯片管脚相接触， 所述上弹片部与所述电路板的金手指相接 触。
5、根据权利要求 4所述的标识芯片收容装置， 其特征在于， 所述 elD芯片 的两个芯片管脚具有展宽的面积。
6、根据权利要求 3所述的标识芯片收容装置， 其特征在于， 所述金属弹片 为弯折结构。
7、根据权利要求 4所述的标识芯片收容装置， 其特征在于， 所述上弹片部 顶端具有防止弹片翘起结构。
8、根据权利要求 7所述的标识芯片收容装置， 其特征在于， 所述防止弹片 翘起结构是顶端加宽的金属弹片， 用于将所述金属弹片的顶端固定在所述卡套 结构的卡槽内。
9、根据权利要求 1所述的标识芯片收容装置， 其特征在于， 所述卡套结构 为可打开的中空的套状结构， 用于卡接在所述光纤连接器上。
10、 根据权利要求 1所述的标识芯片收容装置， 其特征在于， 所述卡套结 构具有前定位件， 用于与所述光纤连接器上的凸件对接， 指示所述标识芯片收 容装置的安装位置。
11、 根据权利要求 1所述的标识芯片收容装置， 其特征在于， 所述卡套结 构具有翻折结构。
12、根据权利要求 11所述的标识芯片收容装置， 其特征在于， 所述卡套结 构具有卡扣凸起部， 用于与所述翻折结构上的卡槽相扣合。
13、根据权利要求 11所述的标识芯片收容装置， 其特征在于， 所述翻折结 构上还具有后定位结构， 用于与所述光纤连接器的握手斜面相接触， 以固定所 述标识芯片收容装置。
14、 一种光纤熔配模块， 其特征在于， 所述光纤熔配模块包括：
配线盘， 所述配线盘具有光纤适配器卡位， 用于卡装光纤适配器， 每个卡 位的下方具有一个镂空凹槽， 用于安装标识芯片收容装置的芯片容置结构； 电路板， 装配在所述光纤适配器卡位的下方， 所述电路板上的金手指从所 述光纤适配器卡位的下方镂空凹槽露出；
底盖， 盖合在所述电路板之上， 从而盖合在配线盘的背面， 将所述电路板 封装在所述光纤熔配模块内。
15、根据权利要求 14所述的一种光纤熔配模块， 其特征在于， 所述金手指 为金属电极触点， 所述金属电极触点经过所述电路板的电路与串口总线相连进 行对夕卜通讯。
16、根据权利要求 14所述的一种光纤熔配模块， 其特征在于， 所述镂空凹 槽的一侧具有定位孔， 用于指示芯片容置结构安装的位置。
17、一种光纤管理装置，其特征在于，所述光纤管理装置包括权利要求 1-13 任一项所述的标识芯片收容装置和权利要求 14-16 任一项所述的光纤熔配模 块；
其中， 标识芯片收容装置的卡套结构套装并扣合在光纤连接器上， 所述标 识芯片收容装置的芯片容置结构安装在所述镂空凹槽内；
所述芯片容置结构内的芯片通过芯片容置结构和电路板实现与外部的通 信。
18、一种光纤管理装置的装配方法，用于装配如权利要求 17所述的光纤管 理装置， 其特征在于， 所述方法包括：
开启光纤熔配模块背面的底盖， 其中光纤熔配模块包括配线盘； 将电路板装入配线盘上预留的位置， 装上底盖；
将标识芯片收容装置的芯片容置结构卡接在光纤熔配模块的镂空凹槽内； 将标识芯片收容装置的卡套结构套接在光纤连接器上。
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