WO2014071608A1 - 一种灯具散热结构 - Google Patents

一种灯具散热结构 Download PDF

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Publication number
WO2014071608A1
WO2014071608A1 PCT/CN2012/084377 CN2012084377W WO2014071608A1 WO 2014071608 A1 WO2014071608 A1 WO 2014071608A1 CN 2012084377 W CN2012084377 W CN 2012084377W WO 2014071608 A1 WO2014071608 A1 WO 2014071608A1
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WO
WIPO (PCT)
Prior art keywords
heat
thermally conductive
heat dissipation
lamp housing
lamp
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Application number
PCT/CN2012/084377
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English (en)
French (fr)
Inventor
姚文斌
Original Assignee
Yao Wenbin
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Publication date
Application filed by Yao Wenbin filed Critical Yao Wenbin
Priority to PCT/CN2012/084377 priority Critical patent/WO2014071608A1/zh
Publication of WO2014071608A1 publication Critical patent/WO2014071608A1/zh

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0035—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources the fastening means being capable of simultaneously attaching of an other part, e.g. a housing portion or an optical component
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the utility model provides a heat dissipating structure for a lamp, in particular to a heat dissipating material with a small heat dissipating area and a thermal conductive coating layer, which increases the heat dissipating speed of the metal material.
  • Lighting is an indispensable technology in human daily life. From traditional tungsten filament bulbs to light-emitting diodes (LEDs), it is enough to show technology as human beings. Bringing more convenience, however, the LED has the characteristics of high luminosity, long projection distance, strong optical rotation, long service life, etc. However, for the LED, the received electric energy is converted into thermal energy, so the LED The temperature of the LED can not be effectively reduced, so that the service life of the LED is relatively reduced. Thus, the heat dissipation problem of the LED has been plaguing various industries.
  • the street lamp 1 is composed of a lamp cover 10 , a lamp housing 11 , a light-emitting device 12 , a circuit board 13 and a heat dissipation fin 14 .
  • the lamp housing 11 is formed with an accommodating space 110.
  • the accommodating space 110 can erect the illuminating device 12, the circuit board 13 and the heat dissipating fins 14 by using one side of the circuit board 13
  • the light-emitting device 12 can be soldered, and the heat-dissipating fins 14 are mounted on the other side thereof.
  • the lamp cover 10 is locked to the edge of the lamp housing 11, so that when the street lamp 1 is to be activated, the light is emitted.
  • the device 12 can be turned on by the circuit board 13.
  • the light-emitting device 12 after being energized generates a large amount of thermal energy. At this time, most of the thermal energy is transmitted to the lamp housing through the heat conduction function of the heat dissipation fins 14. In the accommodating space 110 of the 11th, a part of the heat energy is absorbed by the lamp housing 11 and then transmitted to the outside.
  • the heat dissipating fins 14 disposed in the street lamp 1 have the function of dissipating heat, the heat dissipating fins 14 only conduct a part of the heat energy on the circuit board 13, and then use the molecules in the air as a transmission medium. The heat energy is transmitted to the lamp housing 11, so that the conducted heat energy tends to concentrate around the light-emitting device 12, and cannot be efficiently transmitted to the outside through the lamp housing 11, thereby shortening the service life of the light-emitting device 12.
  • the street lamp 1 after the heat sink fins 14 is added tends to increase in weight, the cost is relatively increased, and the heat cannot be completely cooled, so that the market cannot be effectively grasped, thereby reducing market competitiveness.
  • the utility model of the present invention collects relevant materials, and through multi-party evaluation and consideration, and through years of experience accumulated in the industry, through continuous trial and modification, the heat dissipation area is designed to be small and A new patented person who is coated with a heat-conducting member of a coating solvent layer to increase the heat dissipation structure of the metal material.
  • the main purpose of the present invention is: a heat dissipation structure of a lamp, the heat dissipation structure comprising: a lamp cover, a lamp housing, a heat-conducting substrate and a light-emitting module, wherein the lamp housing defines an accommodation space, and the heat conduction
  • the light-emitting module is fixed on one surface of the heat-conducting substrate, and the light-emitting module is provided with an LED (Light Emitting Diode) at one end, wherein the light-emitting module defines
  • the accommodating space is capable of loading a plurality of heat-conducting materials having thermal conductivity, and the surface of the heat-conducting materials is coated with a thermal conductive coating capable of adsorbing thermal energy and rapidly conducting heat.
  • the illuminating material can pass through the illuminating material.
  • the heat conductive material conducts the heat energy generated by the light emitting module to the heat conductive materials through the heat conductive substrate, and then transfers the heat energy to the lamp shell by the heat conductive materials, so that the heat conductive materials are small in size and further on the surface thereof Covered with thermal conductive coatings, it dissipates heat quickly for optimum heat dissipation.
  • the secondary object of the present invention is that the heat-conducting substrate and the heat-conducting materials are made of a metal having excellent thermal conductivity (such as copper, aluminum, and iron), and the heat-conducting materials are made into a chip body state. Samples (recycled materials can also be used), so the weight is very light and easy to assemble, and not only reduces the cost, but also effectively achieves the effect of heat dissipation. On the other hand, it can effectively grasp the market and enhance market competitiveness. .
  • the heat energy generated by the light-emitting module can be transmitted to the heat-conducting materials through the heat-conducting substrate, and the heat energy is transmitted to the lamp housing by the heat-conducting materials, and thus,
  • the heat-conducting material has a small volume, and the surface is covered with a thermal conductive coating, so the heat dissipation speed is fast to achieve the best heat dissipation effect.
  • Figure 1 is a prior art street light fixture.
  • FIG. 2 is a perspective assembled view of a preferred embodiment of the present invention.
  • FIG 3 is an exploded perspective view of a preferred embodiment of the present invention.
  • FIG. 4 is a schematic view of the operation of the preferred embodiment of the present invention.
  • Figure 5 is a schematic view of the operation of the preferred embodiment of the present invention.
  • Figure 6 is a schematic view of the operation of the preferred embodiment of the present invention.
  • Figure 7 is a partially enlarged schematic view of a preferred embodiment of the present invention.
  • FIG. 2 and FIG. 3 are a three-dimensional combination diagram and a perspective exploded view of a preferred embodiment of the present invention.
  • the utility model relates to a heat dissipation structure of a lamp, and the heat dissipation structure 2
  • the lamp housing 20 includes a lamp housing 20, a lamp housing 21, a heat-conducting substrate 22, and a light-emitting module 23, wherein the lamp housing 21 defines an accommodating space 211, and the heat-conducting substrate 22 is assembled to the lamp housing 21.
  • the light-emitting module 23 is fixed on one surface of the heat-conducting substrate 22, and the light-emitting module 23 is provided with an LED 231 (Light Emitting Diode) at one end, and then the lamp cover 20 and the lamp housing 21 are fixed to each other.
  • the accommodating space 211 defined by the lamp housing 21 can be loaded with a plurality of heat-conducting materials 24 having thermal conductivity, and the surface of the heat-conducting materials 24 is covered with heat energy capable of adsorbing heat and conducting heat.
  • Paint 25 when the lamp is activated, it can pass through the guide
  • the heat emitting member 24 is generated by the module 23 is conducted to the heat conducting member 24 such that the heat conductive substrate 22 via, the thermally conductive member 24 such re-transmission of thermal energy to the lamp housing 21.
  • the lamp housing 21 defines an accommodating space 211, and the accommodating space 211 can accommodate a plurality of heat dissipating members 24 (such as copper chips and aluminum chips).
  • the surface of the heat conducting material 24 is covered with a thermal conductive coating 25 (such as an organic coating and an inorganic coating) which can increase the heat dissipation rate and improve the heat conduction efficiency, and the lamp cover 20 and the lamp housing 21 are fixed to each other.
  • a thermal conductive coating 25 such as an organic coating and an inorganic coating
  • FIG. 5 and FIG. 6 are schematic diagrams 2 and 3 of the preferred embodiment of the present invention.
  • the heat conducting materials 24 are irregularly curved.
  • the body surface so the contact surface can be changed with the environment or by the compression of external force.
  • the heat sink 24 has a small surface area, and the surface thereof is covered with a thermal conductive coating 25 (as shown in the figure). 7)), so the heat dissipation speed is fast, so that the heat energy of the heat conductive substrate 22 can be transmitted to the accommodating space 211 in the lamp housing 21 by the heat conducting material 24, and the heat is transmitted to the outdoor by the lamp housing 21. In order to achieve the best heat dissipation effect.
  • the surface of the heat-conducting material 24 is covered with a thermal conductive coating 25, so that the heat dissipation speed is fast to achieve the best heat dissipation effect.
  • the heat conducting substrate 22 and the heat conducting materials 24 are made of a metal having excellent thermal conductivity (such as copper, aluminum, and iron), and the heat conducting materials 24 are formed into a chip body,
  • the weight is very light, and it is also installed by the assembler.
  • the relative cost reduction can effectively achieve the effect of heat dissipation, so that the market can be effectively grasped and the market competitiveness can be enhanced.
  • the heat dissipation structure of the metal material of the present invention can achieve its efficacy and purpose when used, so the utility model is a practical utility model with excellent practicability, and is in accordance with the application requirements of the new patent.
  • the trial committee will grant this utility model as soon as possible to protect the hard-working utility model of the utility model. If there is any doubt in the audit committee, please do not hesitate to give instructions, the utility model will try its best to cooperate with it.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

一种灯具散热结构，包括：一灯罩（20），一灯壳（21），一导热基板（22）及一发光模块（23），其中灯壳（21）界定出有一容置空间（211），导热基板（22）组装于灯壳（21）的一预定位置，发光模块（23）固定于导热基板（22）的一面上，发光模块（23）的一端装设有LED（231），其中灯壳（21）界定出的容置空间（211）可装填多个具有大面积导热特质的导热材（24），导热材（24）的表面披覆有可吸附热能并导热快速的导热性涂料（25），当灯具启动时，可透过导热材（24）将发光模块（23）所产生的热能经由导热基板（22）传导至多个导热材（24），再由多个导热材（24）把热能传送至灯壳（21），如此，由于多个导热材（24）的表面积范围小，再者由于其表面披覆有导热性涂料（25），因此散热速度快以达到最佳散热效果的目的。

Description

一种灯具散热结构 技术领域
本实用新型为提供一种灯具散热结构，尤指一种散热面积小且披覆有导热性涂料层的导热材，使其增加散热速度的金属物质之散热结构。
 背景技术
由于现今科技不断的进步，各种材料与技术也随之提升，照明是人类日常生活中不可缺少的一项科技，由传统的钨丝灯泡到现在的发光二极管（ＬＥＤ），足以显示科技为人类带来更多的便利，然而，发光二极管具有高光度、投射距离远、聚旋光性强、使用寿命长等特性，惟，对该ＬＥＤ而言，其所接受之电能多转换成为热能，因此ＬＥＤ的温度始终无法有效降低，使得ＬＥＤ的使用寿命相对减少，如此，ＬＥＤ之散热问题一直困扰着各家业者。
然而，目前市面大多数的灯具散热结构，其材质多以铜、铝金属为主，若欲达到较佳之散热效果，往往会使结构过于庞大使得重量过重，亦影响外观之美感，并不符合轻薄短小之时尚潮流。再者，一般ＬＥＤ灯系将ＬＥＤ灯之电路板直接锁固于该灯具座体上，但由于电路板之传导系数较低，令该散热结构无法有效的将ＬＥＤ产生的热源散去外界，因此有业者在内部装设有一散热鳍片，以达到较佳之散热效果。以路灯灯具为例，请参阅图1所示，系为习用之路灯灯具，该路灯灯具１系由一灯罩１０、一灯壳１１、一发光装置１２、一电路板１３及一散热鳍片１４所结合而成，其中该灯壳１１系形成有一容置空间１１０，该容置空间１１０系可架设该发光装置１２、电路板１３及该散热鳍片１４，藉由该电路板１３一侧面系可焊接该发光装置１２，其另一侧面则装设有该散热鳍片１４，再者，将该灯罩１０锁固于该灯壳１１之边缘，如此当该路灯灯具１欲启动时，该发光装置１２可藉由该电路板１３导通，通电后的发光装置１２则会产生出大量的热能，此时，透过该散热鳍片１４的导热功能，将大部分的热能导出至该灯壳１１的容置空间１１０中，再由灯壳１１吸收部分热能再传送至外界。
 技术问题
然上述该路灯灯具于使用时，为确实存在下列问题与缺失尚待改进：
一、由于该路灯灯具１中所设置的散热鳍片１４虽有散热之功用，惟，该散热鳍片１４仅将电路板１３上之热能传导出一部分，再利用空气中的分子作为传递媒介将热能传送至灯壳１１上，使得传导出的热能往往集中于发光装置１２周围，无法有效的藉由灯壳１１再传送至室外，造成发光装置１２使用寿命缩短。
二、如上所述，加装散热鳍片１４后的路灯灯具１往往重量也随之增加，成本相对提高，又无法完全有效散热，故无法有效掌握市场，因此降低市场竞争力。
是以，要如何解决上述习用之问题与缺失，即为本实用新型之实用新型人与从事此行业之相关厂商所亟欲研究改善之方向所在者。
 技术解决方案
本实用新型之实用新型人有鉴于上述缺失，乃搜集相关资料，经由多方评估及考虑，并以从事于此行业累积之多年经验，经由不断试作及修改，始设计出此种散热面积小且披覆有涂料溶剂层的导热件，使其增加散热速度的金属物质之散热结构的新型专利者。
本实用新型之主要目的在于：一种灯具散热结构，该散热结构系包括：一灯罩、一灯壳、一导热基板及一发光模块，其中该灯壳系界定出有一容置空间，而该导热基板系组装于该灯壳之一预定位置，该发光模块系固定于该导热基板之一面上，该发光模块于一端系装设有ＬＥＤ（Ｌｉｇｈｔ　Ｅｍｉｔｔｉｎｇ　Ｄｉｏｄｅ　发光二极管），其中该灯壳所界定出的该容置空间系可装填复数具有导热特质的导热材，而该等导热材其表面系披覆有可吸附热能并导热快速之导热性涂料，当该灯具启动时，系可透过该等导热材将发光模块所产生的热能经由该导热基板传导至该等导热材，再由该等导热材把热能传送至灯壳，如此，因该等导热材其体积小，再者于其表面系披覆有导热性涂料，因此散热速度快以达到最佳散热效果之目的。
本实用新型之次要目的在于：由于该导热基板与该等导热材系由导热性极佳的金属（如铜、铝及铁）所制成，而该等导热材系制作成一屑体之态样(亦可用回收材料)，因此其重量十分轻巧，且易于组装人员安装，再者，不仅相对降低成本，亦可有效达到散热之效果，另一方面故能有效掌握市场，进而增强市场竞争力。
 有益效果
当该灯具启动时，系可透过该等导热材将发光模块所产生的热能经由该导热基板传导至该等导热材，再由该等导热材把热能传送至灯壳，如此，因该等导热材其体积小，再者于其表面系披覆有导热性涂料，因此散热速度快以达到最佳散热效果之目的。
附图说明
图1 是现有技术路灯灯具。
图2　为本实用新型较佳实施例之立体组合图。
图3　为本实用新型较佳实施例之立体分解图。
图4　为本实用新型较佳实施例之动作示意图。
图5　为本实用新型较佳实施例之动作示意图。
图6　为本实用新型较佳实施例之动作示意图。
图7　为本实用新型较佳实施例之局部放大示意图。
 本发明的实施方式
为达成上述目的及功效，本实用新型所采用之技术手段及构造，兹绘图就本实用新型较佳实施例详加说明其特征与功能如下。
请参阅图2及图3所示，系为本实用新型较佳实施例之立体组合图、立体分解图，由图中可清楚看出，本实用新型系一种灯具散热结构，该散热结构２系包括：一灯罩２０、一灯壳２１、一导热基板２２及一发光模块２３，其中该灯壳２１系界定出有一容置空间２１１，而该导热基板２２系组装于该灯壳２１之一预定位置，该发光模块２３系固定于该导热基板２２之一面上，该发光模块２３于一端系装设有ＬＥＤ２３１（Ｌｉｇｈｔ　Ｅｍｉｔｔｉｎｇ　Ｄｉｏｄｅ　发光二极管），再将该灯罩２０与该灯壳２１相互固定达到一密封状态，其中该灯壳２１所界定出的该容置空间２１１系可装填复数具有导热特质的导热材２４，而该等导热材２４其表面系披覆有可吸附热能并导热快速之导热性涂料２５（如图7所示），当该灯具启动时，系可透过该等导热材２４将发光模块２３所产生的热能经由该导热基板２２传导至该等导热材２４，再由该等导热材２４把热能传送至灯壳２１。
藉由上述之结构、组成设计，兹就本实用新型之使用作动情形说明如下，请同时配合参阅图4及图7所示，系为本实用新型较佳实施例之动作示意图1及局部放大示意图，由图中可清楚看出，该灯壳２１系界定出有一容置空间２１１，而该容置空间２１１系可置放复数散热件导热材２４（如：铜屑、铝屑），再者于该等导热材２４之表面系披覆有一层可增加散热速度并提升导热效率之导热性涂料２５（如：有机涂料与无机涂料），另外将该灯罩２０与该灯壳２１相互固定达到一密封状态，如此，对于组装人员欲将该等导热材２４装设于该壳体２１内之容置空间２１１时，不仅更方便且亦可节省安装的时间，以提升生产效率。
请同时配合参阅图5及图6所示，系为本实用新型较佳实施例之动作示意图2及图3，由图中可清楚看出，由于该等导热材２４系为弯曲不规则之屑体态样，因此其接触面则可随着环境或受外力的压缩而有所改变，再者，该等散热件２４其表面积范围小，另于其表面系披覆有导热性涂料２５（如图7所示），因此散热速度快，如此，可藉由该等导热材２４把该导热基板２２的热能传送至该灯壳２１内之容置空间２１１，再由该灯壳２１将热传导至室外，以达到最佳散热效果之目的。
惟，以上所述仅为本实用新型之较佳实施例而已，非因此即局限本实用新型之专利范围，故举凡运用本实用新型说明书及图式内容所为之简易修饰及等效结构变化，均应同理包含于本实用新型之专利范围内，合予陈明。
故，请参阅全部附图所示，本实用新型使用时，与习用技术相较，着实存在下列优点：
一、透过该等导热材２４其表面系披覆有导热性涂料２５，因此散热速度快以达到最佳散热效果之目的。
二、由于该导热基板２２与该等导热材２４系由导热性极佳的金属（如铜、铝及铁）所制成，而该等导热材２４系制作成一屑体之态样，因此其重量十分轻巧，且亦于组装人员安装，再者，相对降低成本，可有效达到散热之效果，故能有效掌握市场，进而增强市场竞争力。
综上所述，本实用新型之金属物质之散热结构于使用时，为确实能达到其功效及目的，故本实用新型诚为一实用性优异之实用新型，为符合新型专利之申请要件，爰依法提出申请，盼　审委早日赐准本实用新型，以保障实用新型人之辛苦实用新型，倘若　钧局审委有任何稽疑，请不吝来函指示，实用新型人定当竭力配合，实感德便。
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Claims (5)

  1. 一种灯具散热结构，该散热结构系包括：一灯罩、一灯壳、一导热基板及一发光模块，其中该灯壳系界定出有一容置空间，而该导热基板系组装于该灯壳之一预定位置，该发光模块则固定于该导热基板之一面上，再者，该发光模块于一端系装设于有一个以上之ＬＥＤ，其特征在于:该灯壳所界定出的该容置空间系可装填复数具有导热特质的导热材，而该导热材其表面系披覆有可吸附热能并导热快速之导热性涂料。
  2. 如权利要求1所述的灯具散热结构，其特征在于，其中该导热材系可为一铜屑。
  3. 如权利要求1所述的灯具散热结构，其特征在于，其中该导热材系可为一铝屑。
  4. 如权利要求1所述的灯具散热结构，其特征在于，其中该导热性涂料系可为一有机涂料。
  5. 如权利要求1所述的灯具散热结构，其特征在于，其中该导热性涂料系可为一无机涂料。
PCT/CN2012/084377 2012-11-09 2012-11-09 一种灯具散热结构 WO2014071608A1 (zh)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201724019U (zh) * 2010-05-19 2011-01-26 游志明 强化散热的led灯
CN201787371U (zh) * 2010-06-30 2011-04-06 谭巧珠 高效散热的led日光灯管
CN102042525A (zh) * 2011-01-28 2011-05-04 江苏生日快乐光电科技有限公司 Led照明装置
CN102135249A (zh) * 2011-01-30 2011-07-27 厦门莱肯照明科技有限公司 Led灯装置
CN202171137U (zh) * 2011-06-14 2012-03-21 唐开元 一种超导热管led日光灯
DE202011101257U1 (de) * 2011-05-23 2012-05-30 Promotec Gmbh Leuchtdioden-Leuchtmittel

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201724019U (zh) * 2010-05-19 2011-01-26 游志明 强化散热的led灯
CN201787371U (zh) * 2010-06-30 2011-04-06 谭巧珠 高效散热的led日光灯管
CN102042525A (zh) * 2011-01-28 2011-05-04 江苏生日快乐光电科技有限公司 Led照明装置
CN102135249A (zh) * 2011-01-30 2011-07-27 厦门莱肯照明科技有限公司 Led灯装置
DE202011101257U1 (de) * 2011-05-23 2012-05-30 Promotec Gmbh Leuchtdioden-Leuchtmittel
CN202171137U (zh) * 2011-06-14 2012-03-21 唐开元 一种超导热管led日光灯

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