WO2014064541A3 - Light emitting diode package with enhanced heat conduction - Google Patents

Light emitting diode package with enhanced heat conduction Download PDF

Info

Publication number
WO2014064541A3
WO2014064541A3 PCT/IB2013/003043 IB2013003043W WO2014064541A3 WO 2014064541 A3 WO2014064541 A3 WO 2014064541A3 IB 2013003043 W IB2013003043 W IB 2013003043W WO 2014064541 A3 WO2014064541 A3 WO 2014064541A3
Authority
WO
WIPO (PCT)
Prior art keywords
led
heat conduction
light emitting
emitting diode
silicon
Prior art date
Application number
PCT/IB2013/003043
Other languages
French (fr)
Other versions
WO2014064541A2 (en
Inventor
Mordehai Margalit
Original Assignee
Mordehai Margalit
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mordehai Margalit filed Critical Mordehai Margalit
Publication of WO2014064541A2 publication Critical patent/WO2014064541A2/en
Publication of WO2014064541A3 publication Critical patent/WO2014064541A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/19—Manufacturing methods of high density interconnect preforms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/25—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of a plurality of high density interconnect connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/921—Connecting a surface with connectors of different types
    • H01L2224/9212—Sequential connecting processes
    • H01L2224/92142—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92144—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a build-up interconnect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)

Abstract

A light emitting diode (LED) device and packaging with enhance heat conduction. An LED in a wafer level processing (WLP) package is disclosed using vias in the silicon to route the electrical connections to the LED backside and a dedicated hole in the silicon with a direct heat conduction route from the LED to the printed circuit board. Certain layers act to promote mechanical, electrical, thermal, or optical characteristics of the device. The device avoids or ameliorates heat dissipation problems found in conventional LED devices. Some embodiments include a plurality of optically permissive layers, including an optically permissive cover substrate comprising phosphors and/or quantum dots.
PCT/IB2013/003043 2012-10-05 2013-10-07 Light emitting diode package with enhanced heat conduction WO2014064541A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261710156P 2012-10-05 2012-10-05
US61/710,156 2012-10-05

Publications (2)

Publication Number Publication Date
WO2014064541A2 WO2014064541A2 (en) 2014-05-01
WO2014064541A3 true WO2014064541A3 (en) 2014-11-20

Family

ID=50545410

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2013/003043 WO2014064541A2 (en) 2012-10-05 2013-10-07 Light emitting diode package with enhanced heat conduction

Country Status (1)

Country Link
WO (1) WO2014064541A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10872915B2 (en) * 2019-01-22 2020-12-22 Advanced Semiconductor Engineering, Inc. Optical package structure and method for manufacturing the same

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060092532A1 (en) * 2004-10-29 2006-05-04 Ouderkirk Andrew J High brightness LED package with multiple optical elements
US20060163683A1 (en) * 2002-12-20 2006-07-27 Gundula Roth Luminescent body and optical device including the same
US20060278885A1 (en) * 2005-06-14 2006-12-14 Industrial Technology Research Institute LED wafer-level chip scale packaging
US20100068421A1 (en) * 2008-09-17 2010-03-18 3M Innovative Properties Company Light diffusive pressure sensitive adhesive
WO2011033516A1 (en) * 2009-09-20 2011-03-24 Viagan Ltd. Wafer level packaging of electronic devices
US20110309382A1 (en) * 2010-06-18 2011-12-22 Glo Ab Nanowire led structure and method for manufacturing the same
US20120223351A1 (en) * 2011-03-06 2012-09-06 Viagan Ltd. Light emitting diode package and method of manufacture

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060163683A1 (en) * 2002-12-20 2006-07-27 Gundula Roth Luminescent body and optical device including the same
US20060092532A1 (en) * 2004-10-29 2006-05-04 Ouderkirk Andrew J High brightness LED package with multiple optical elements
US20060278885A1 (en) * 2005-06-14 2006-12-14 Industrial Technology Research Institute LED wafer-level chip scale packaging
US20100068421A1 (en) * 2008-09-17 2010-03-18 3M Innovative Properties Company Light diffusive pressure sensitive adhesive
WO2011033516A1 (en) * 2009-09-20 2011-03-24 Viagan Ltd. Wafer level packaging of electronic devices
US20110309382A1 (en) * 2010-06-18 2011-12-22 Glo Ab Nanowire led structure and method for manufacturing the same
US20120223351A1 (en) * 2011-03-06 2012-09-06 Viagan Ltd. Light emitting diode package and method of manufacture

Also Published As

Publication number Publication date
WO2014064541A2 (en) 2014-05-01

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