WO2014063756A1 - Système de coupe, dispositif d'impression et procédé de coupe d'un substrat - Google Patents

Système de coupe, dispositif d'impression et procédé de coupe d'un substrat Download PDF

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Publication number
WO2014063756A1
WO2014063756A1 PCT/EP2012/071311 EP2012071311W WO2014063756A1 WO 2014063756 A1 WO2014063756 A1 WO 2014063756A1 EP 2012071311 W EP2012071311 W EP 2012071311W WO 2014063756 A1 WO2014063756 A1 WO 2014063756A1
Authority
WO
WIPO (PCT)
Prior art keywords
cutting
substrate
section
cutting unit
feeding
Prior art date
Application number
PCT/EP2012/071311
Other languages
English (en)
Inventor
Emilio LOPEZ MATOS
Pedro TEIXIDO
Jose Ma. MONTSERRAT
Gianni Cessel
Emilio Angulo
Original Assignee
Hewlett-Packard Development Company, L.P.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett-Packard Development Company, L.P. filed Critical Hewlett-Packard Development Company, L.P.
Priority to PCT/EP2012/071311 priority Critical patent/WO2014063756A1/fr
Publication of WO2014063756A1 publication Critical patent/WO2014063756A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J11/00—Devices or arrangements  of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form
    • B41J11/66—Applications of cutting devices
    • B41J11/663—Controlling cutting, cutting resulting in special shapes of the cutting line, e.g. controlling cutting positions, e.g. for cutting in the immediate vicinity of a printed image
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • B26F2001/3893—Cutting-out; Stamping-out cutting out by using an oscillating needle
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • B26F1/44—Cutters therefor; Dies therefor
    • B26F2001/4454—Die heads carrying several moveable tools

Definitions

  • This invention relates to a cutting arrangement, a printing device, and a method of cutting a substrate.
  • the substrate may subsequently be cut by a cutting machine.
  • the substrate may be manually transferred between the printer and the cutting machine.
  • Figure 1 shows a printing and cutting arrangement according to an example.
  • Figure 2a shows a perspective view of a cutting head according to an example.
  • FIG. 2b shows a section of the cutting head of Figure 2a.
  • Figure 2c shows the cutting head of Figure 2a viewed along the z-direction.
  • Figure 3 schematically illustrates successive sets of overlapping perforations.
  • Figure 4 shows an example of a control section according to an example.
  • Figure 5 shows an arrangement according to an example.
  • Figure 6 shows an arrangement of cutting and printing heads according to an example.
  • FIG. 1 An example of a printing and cutting arrangement is shown in Figure 1 .
  • the arrangement includes a print section 1 10 and a cutting section 120.
  • a substrate support 140 is to support a substrate 130, such that the substrate can be moved relative to the print section
  • the substrate support 140 may be a platen, for example. In the example of Figure 1 , the substrate support 140 is to move a substrate along a feeding direction.
  • the feeding direction will be referred to as the y-direction, the y-axis being parallel to the feeding direction.
  • An x-direction may be defined as perpendicular to the y-axis and parallel to a surface of the substrate.
  • a z-direction is defined as perpendicular to the x and y-directions (i.e. perpendicular to the plane of Figure 1 ).
  • the print section 1 10 is to apply an image to the substrate 120, e.g. by ink jet printing.
  • the cutting section 120 is to produce one or more cuts in the substrate.
  • the cutting section 120 and print section 1 10 are arranged in parallel with respect to the substrate feed direction.
  • the print section 1 10 and the cutting section 120 are arranged substantially along the y-direction relative to each other and each is spaced from the substrate support 140 (and the substrate, when in use) along the z-direction.
  • the movement of the substrate along the feeding direction by the substrate support 140 is such that different parts of the substrate along the y- direction may be acted upon (printed or cut, respectively) by the print section 1 10 and the cutting section 120.
  • the printing and cutting of a substrate 130 may be performed at substantially the same time, e.g. such that the time period in which the substrate 130 is printed at least partially overlaps with the time period in which the substrate 130 is cut. This reduces the time needed to process the substrate 130.
  • the print section 1 10 and cutting section 120 are synchronized. This simplifies use of the same substrate feed rate (which may be fixed) for cutting and printing. This improves process flow.
  • the substrate feed direction does not change (e.g. does not reverse) during the printing and cutting operation.
  • printing and cutting may be performed at the normal printing rate, such that cutting does not reduce throughput.
  • the print section 1 10 includes a print carriage 1 15.
  • the print section 1 10 is to move the print carriage 1 15 across the surface of the substrate 130 in the x- direction such that the print section 1 10 may act on different parts of the substrate 130 along the x-direction.
  • Figure 1 shows the cutting section 120 having a cutting carriage 125 and a first movement section 123a.
  • the first movement section 123a is to move the cutting carriage 125 across the surface of the substrate 130 in the x-direction.
  • the cutting carriage 125 of Figure 1 includes a cutting head 127 and a second movement section 123b.
  • the second movement section 123b is to move the cutting head 127 in the x and y-directions.
  • the second movement section 123b may include two (possibly independent) actuators, such as motors or servos, to cause the movement of the cutting head 127.
  • the first 123a and second 123b movement sections are referred to herein as the movement section 123.
  • the movement section 120 may move the cutting head 127 along only one of the x-axis or y-axis.
  • the movement section 123 may cause linear or curvelinear movement of the cutting head 127 and/or the cutting unit 125.
  • the movement section 123 may cause the cutting head 127 and/or cutting unit 125 to move translationally (i.e. undergo translational motion, be translated or be displaced).
  • the movement of the cutting head 127 and/or cutting unit 125 may be relative to the substrate support 140.
  • the translational motion may be linear or curvilinear. Additional motion, such as rotation, is also possible.
  • the movement section 123 is to move the cutting head 127 faster than the movement of the print carriage 1 15 by the print section 1 10.
  • the cutting section 120 may be controlled by a controller (described later) to cut arbitrary shapes (e.g. curvilinear shapes) in or from the substrate 130.
  • the controller may receive information describing the shape to be cut.
  • the information may be formatted as, or in a similar manner to, image data.
  • the information may be formatted similar to monochrome information suitable for defining an image to be printed by a print head, but defining locations at which the substrate should be cut, rather than defining locations at which the substrate should be printed.
  • the information may be in the form of a bitmap.
  • the information may define a two-dimensional shape (or two- dimensional pattern) to be cut in the substrate (in the x-y plane) by the cutting section 120.
  • Figures 2a to 2c show an example of the cutting head 127.
  • Figure 2a shows a perspective view of the cutting head 127.
  • Figure 2b shows a view of the cutting head 127 from the x or y-direction, while Figure 2c shows the cutting head 127 when viewed along the z-axis.
  • the cutting head 127 includes a plurality of cutting elements 210 (for clarity not all of these are shown in Figure 2a).
  • the cutting elements according to this example are needles or pointed shafts that are able to pierce or penetrate the substrate.
  • the needles have circular cross section, but other shapes of cross section are possible.
  • the cutting elements 210 mayhave sharpened vertical edges, be chisel-shaped, etc.
  • the cutting elements could alternatively be rods or shafts that are not pointed. Needles, as shown in Figure 2, are simple and effective cutting elements.
  • the cutting elements 210 may be heated (e.g. be heated needles)
  • the cutting elements 210 are actuatable by an actuating section220 (shown in Figure 2b).
  • the actuating section 220 causes the cutting elements 210 to extend toward the substrate support 140 substantially along the z-direction, such that when a substrate 130 is provided on the substrate support 140, the extended cutting elements 210 cut and/or pierce the substrate 130.
  • the cutting elements 210 of Figures 2a to 2c are in a matrix arrangement, with a cutting element 210 at each intersection of a square or rectangular grid.
  • the actuating section 220 may be to independently actuate the cutting elements.
  • the example of Figure 2 includes an actuating element 225 for each cutting element 210 (only one actuating element is shown in Figure 2a).
  • the actuating element 225 may include a solenoid.
  • the actuating element 225 may be located at an end of the cutting element 210 distal from the substrate 130.
  • the actuating element may also include a biasing element 227 (only one is shown in Figure 2a) to bias the cutting element 210 towards the non-extended, or retracted, state. Accordingly, the cutting elements will retract when the respective actuating element 225 is not activated.
  • a biasing element 227 such as a helical spring, provides an inexpensive and quick-acting return (retraction) mechanism for the cutting element 210.
  • Each cutting element 210 punches or cuts the substrate to produce a perforation.
  • the inventors have determined experimentally that a spacing of around 20 ⁇ or less between the cutting elements 210 results in good shape quality in the cutting for some printing applications (such as vinyl sticker generation).
  • a controller moves the cutting head 127 to improve the spatial resolution of the cutting head 127.
  • Perforations from successive actuations of the cutting elements 210 at different points on the substrate 230 may result in one or more continuous cuts in the substrate by overlap of the perforations.
  • Figure 3 shows a schematic example of a first set of perforations 310 produced by the cutting head 127 as open circles.
  • a second set of perforations 320 produced after the first set is shown as circles with diagonal shading.
  • a third set of perforations 330 produced after the second set 320 is shown as circles with vertical shading.
  • the first 310, second 320 and third 330 sets overlap to form a continuous cut.
  • Such an arrangement allows a reduction in the density of cutting elements 210 (i.e. allows an increasein inter-cutting element 210 spacing)while still allowing a good cut shape quality.
  • the cutting elements 210 may be actuated while the cutting head 127 is in a first position to produce a first set of holes or perforations.
  • the holes of the first set of holes may have gaps (i.e. unperforated substrate) between them, the gaps corresponding to portions of the substrate 130 that cannot be cut by the cutting head 127 in the first position due to spacing between the cutting elements 210.
  • the movement section 123 and/or the substrate feed may be to move the cutting head 127 to a second position relative to the substrate 130, such that actuation of the cutting elements 210 in the second position produces a set of holes or perforations in the gaps.
  • the ability to move the cutting carriage 127 in the x-direction facilitates the overlap of perforations in the x-direction.
  • the ability to move the cutting carriage in the y-direction simplifies producing an overlap of perforations in the y-direction by reducing the interdependence between the speed with which perforations are produced that the speed at which the substrate is fed.
  • the cutting carriage 127 may move backwards and forwards in the substrate feed direction. In some examples this allows shape finishing without requiring changes in the speed at which the substrate 130 is fed.
  • the cutting may be performed without delaying or interrupting the printing process, and in some examples the cutting may be performed at essentially the same time as the printing. Thus, cutting may be performed in addition to printing with little or no increase in the time required to process the substrate 130.
  • the cutting section 120 does not cut through the whole depth of the substrate.
  • some arrangements may be used for cutting vinyl for sticker generation.
  • the cutting section 120 doesn't cut (or penetrate)completely through the substrate, only the top area where the sticker is printed (or is to be printed) is cut. After the cutting and printing is completed, the user may remove the sticker by hand, for
  • cut, pierce, etc. are used to include both the case for completely penetrating the substrate and the case of only partially penetrating the substrate (substantially along the z-direction).
  • references herein to perforations could equally be applied to cuts or holes resulting from partial piercing of the substrate in the z-direction.
  • the cutting section 120 and print section 1 10 are provided in a single printing device. This avoids the need to transfer the substrate from a printing device to a cutting device (e.g. manually), and improves throughput. Furthermore, a device having a print section 1 10 and a cutting section 120 is likely to be less expensive to produce and may have a smaller footprint than separate printing and cutting devices.This also simplifies synchronization of the printing and cutting, improving the flow of substrate through the system.
  • the cutting section 120 may be integral to a printing device including the print section 1 10.
  • the cutting section is a removable module that may be combined with a printing device comprising the print section 1 10.
  • a removable cutting section 120 improves flexibility and simplifies maintenance.
  • An integral cutting system 120 is simple and is likely to be simple and relatively inexpensive to produce.
  • the time required for the cutting head 175 to process (e.g. traverse and perforate) the substrate in the x-direction may be predictably determined and fixed, regardless of the complexity of the shape(s) to be cut. This is beneficial when the cutting and printing are to be performed in parallel at the same substrate feed rate.
  • a sensor section may be provided to improve the accuracy of the movement and/or positioning of the cutting section 120.
  • two encoder sensor devices are used to provide feedback on the position of the substrate to the movement section 123.
  • the sensor section may be particularly advantageous when movement of the cutting head 127 is used to improve the spatial resolution of the cutting head 127, as more accurate positioning of the cutting head 127 relative to the substrate 130 may be required to produce good quality shaping.
  • the encoder sensor may be a device that gives a number of electric pulses
  • proportional to movement may be part of the servo-systems to provide feedback of the physical movement, to implement a control algorithm.
  • Quadrature Incremental Encoders provide precise and cost efficient sensors for use in the sensor section.
  • the sensor section mayalternatively or additionally includeother types of sensors, such as a potentiometer, alinear variable differential transformer (LVDT), a tachometer, etc.
  • LVDT alinear variable differential transformer
  • FIG. 4 shows an example of a control section 400 for controlling the cutting section 120.
  • the control section 400 includes a processor 410, such as a printer embedded computer.
  • the processor is to communicate with a controller 420, which may be a control circuit, such as a microcontroller-based control circuit.
  • the controller 420 controls power drivers 430.
  • the power drivers 430 are to individually drive the actuating elements 225 (illustrated as solenoids in Figure 4).
  • the power drivers 430 are also to drive the movement section 123 (e.g. by controlling motors in the movement section 123).
  • the power drivers 430 may receive feedback from the sensors (e.g. encoder sensor 440). In some examples feedback from the sensors 440 may be received by the processor 410 and/or the controller 420, instead of or in addition to being received by the power drivers 430.
  • a power supply section 450 may provide power for some or all of the components in Figure 4.
  • FIG. 5 shows a method 500 according to an example.
  • the method 500 starts at 510.
  • a substrate 130 is fed past or over the substrate support 140 (e.g. including a platen) by the substrate support 140.
  • the substrate 130 is cut by a cutting unit 120 and an image is formed on the substrate 130 by a print section 1 10.
  • the cutting includes moving the cutting unit 125 relative to the platen and cutting the substrate 130 by the cutting unit 125.
  • the feeding 520 is monodirectional during the printing and cutting.
  • the method terminates at 540.
  • the method may be performed, at least in part, by a processor carrying out machine readable instructions.
  • the machine readable instructions may be retained in a non-transient store, such as a hard drive, RAM, ROM, etc.
  • the machine readable instructions may be embodied as software, firmware, etc.
  • the feeding 520 is performed at a substantially constant speed during the forming of the image and cutting 530.
  • the cutting unit 125 is moved such that the spatial resolution of the cutting is greater than a density of cutting elements 210 of the cutting unit 125.
  • the cutting unit 125 is moved substantially parallel to the surface of the substrate 130.
  • the substrate 130 may be bent or folded during the printing and cutting process.
  • Figure 6 shows an arrangement in which the cutting 120 and printing 1 10 sections are arranged one above the other to reduce a footprint of the device.
  • the x, y and z directions are defined relative to the substrate 130 and change orientation with the substrate 130.
  • the axes are defined by the portion of the substrate 130 relevant to the cutting section 120 (e.g. the portion of the substrate on which cutting is being performed). The same applies to references to the plane of the substrate 130 and similar terms.
  • the print section 1 10 does not include a print carriage 1 15 that is moveable in the x-direction.
  • the print section may include a page-wide- array, such that an image forming unit (such as an array of ink-jet nozzles) extends across the area that is to be printed (e.g.. the substrate width).
  • the cutting section 120 may be fixed in the x direction relative to the substrate support 140, and may move only in the y-direction.
  • the cutting section may include a cutting unit that is the width of the area to be cut (such as the width of the substrate) similar to a page-wide printing array.
  • references to the print 1 10 and cutting 120 sections being fixed or immoveable in one or more directions should be understood to mean that they are stationary during normal operation of printing and/or cutting a medium. Movement of these sections for maintenance or setup/configuration, etc. may be possible in some examples.
  • the cutting section 120 is arranged before the print section 130 along the substrate feed direction, such that each portion of the substrate encounters the cutting section, and any cutting of that portion is performed, before the portion reaches the print section, and any printing is performed on that portion.
  • the print section 1 10 may be arranged before the cutting section 120 along the substrate feed direction.
  • the printing process may affect the dimensions of the substrate.
  • performing cutting before printing may reduce or eliminate printing and/or cutting artifacts due to variation of substrate dimensions caused by the printing process (alternatively, or in addition, complexity may be reduced by reducing/avoiding the need to correct for such variation).
  • Latex inks may be cured immediately after printing, and the curing process may affect the mechanical dimensions of the substrate.
  • the cutting elements 210 need not be arranged in a matrix pattern, and could instead be arranged in a single row, a plurality of offset rows, or an irregular pattern, for example.
  • an actuating element 225 other than a solenoid may be used.
  • the actuating element 225 could include a micromotor.
  • substrate has been used to include any medium suitable for printing and cutting.
  • the substrate may be paper, cardboard, vinyl, etc.

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  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Handling Of Sheets (AREA)

Abstract

L'invention concerne un système de coupe qui permet de couper un substrat situé sur un support de substrat et qui comporte une unité de coupe présentant une pluralité d'éléments de coupe pouvant être actionnés indépendamment, l'actionnement d'un élément de coupe faisant en sorte que l'élément de coupe perce un substrat sur le support de substrat ; une section de déplacement pour amener l'unité de coupe à déplacer l'unité de coupe par rapport au support de substrat.
PCT/EP2012/071311 2012-10-26 2012-10-26 Système de coupe, dispositif d'impression et procédé de coupe d'un substrat WO2014063756A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/EP2012/071311 WO2014063756A1 (fr) 2012-10-26 2012-10-26 Système de coupe, dispositif d'impression et procédé de coupe d'un substrat

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2012/071311 WO2014063756A1 (fr) 2012-10-26 2012-10-26 Système de coupe, dispositif d'impression et procédé de coupe d'un substrat

Publications (1)

Publication Number Publication Date
WO2014063756A1 true WO2014063756A1 (fr) 2014-05-01

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2921309A1 (fr) * 2014-03-20 2015-09-23 Matan Digital Printing Ltd Procédé et système pour sectionner une maquette d'un support
EP4037907A4 (fr) * 2019-10-04 2023-11-08 Kana Holdings, LLC Système de fourniture de caractéristiques tridimensionnelles sur des produits d'impression de grand format

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0476398A2 (fr) * 1990-09-19 1992-03-25 Gerber Garment Technology, Inc. Méthode et dispositif d'étiquetage pour une machine de découpe de matériau en feuille
EP0950752A1 (fr) * 1998-04-15 1999-10-20 Gerber Garment Technology, Inc. Dispositif et procédé d'impression textile d'images imbriquées
US20040085422A1 (en) * 2002-10-31 2004-05-06 Kelley Richard A. Media incising printer
US20050248644A1 (en) * 2003-07-02 2005-11-10 Lexmark International, Inc. Method for enhancing perforation speed
US20060228151A1 (en) * 2005-03-30 2006-10-12 Xerox Corporation Method and system for custom paper cutting
DE102007026409A1 (de) * 2007-06-06 2008-12-11 OCé PRINTING SYSTEMS GMBH Verfahren und Vorrichtung zum Perforieren und/oder Trennen von Trägermaterial

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0476398A2 (fr) * 1990-09-19 1992-03-25 Gerber Garment Technology, Inc. Méthode et dispositif d'étiquetage pour une machine de découpe de matériau en feuille
EP0950752A1 (fr) * 1998-04-15 1999-10-20 Gerber Garment Technology, Inc. Dispositif et procédé d'impression textile d'images imbriquées
US20040085422A1 (en) * 2002-10-31 2004-05-06 Kelley Richard A. Media incising printer
US20050248644A1 (en) * 2003-07-02 2005-11-10 Lexmark International, Inc. Method for enhancing perforation speed
US20060228151A1 (en) * 2005-03-30 2006-10-12 Xerox Corporation Method and system for custom paper cutting
DE102007026409A1 (de) * 2007-06-06 2008-12-11 OCé PRINTING SYSTEMS GMBH Verfahren und Vorrichtung zum Perforieren und/oder Trennen von Trägermaterial

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2921309A1 (fr) * 2014-03-20 2015-09-23 Matan Digital Printing Ltd Procédé et système pour sectionner une maquette d'un support
EP4037907A4 (fr) * 2019-10-04 2023-11-08 Kana Holdings, LLC Système de fourniture de caractéristiques tridimensionnelles sur des produits d'impression de grand format

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