WO2014058261A1

WO2014058261A1 - Display module

Info

Publication number: WO2014058261A1
Application number: PCT/KR2013/009087
Authority: WO
Inventors: 계영일; 김건호
Original assignee: 서울반도체 주식회사
Priority date: 2012-10-12
Filing date: 2013-10-11
Publication date: 2014-04-17
Also published as: KR20140002275U

Abstract

The present design relates to a display module comprising: a PCB on which at least one semiconductor optical element is arranged; a housing for accommodating the PCB such that the semiconductor optical element is exposed; a mask film which has a shape corresponding to the PCB and is arranged on the PCB, and which is printed with opaque paint on a remaining portion excluding the shape of the character, numeral, or figure such that the shape of the character, numeral or figure can be formed in the position corresponding to the semiconductor optical element; and a plurality of exterior films each of which having a shape corresponding to the mask film, and which are stacked on the mask film, and which are painted with the paint having the same color as the outer surface of an electronic device in which the PCB is mounted. Thus, the display module of the present invention may reduce manufacturing costs and may shorten the manufacturing process, and enables information to be exposed only by a light emission of the semiconductor optical element, thereby achieving an aesthetic enhancement in the outer appearance of a product.

Description

Display module

The present invention relates to a display module, and more particularly, to a display module that can reduce manufacturing costs and shorten the manufacturing process, and obtain information of a beautiful product by exposing information only by light emission of a semiconductor optical device. .

In recent years, home appliances such as refrigerators and water purifiers have been developed and released so that the control panel is integrated with the outer surface of the product in order to enhance the beauty of the appearance.

As such a product, the same thing as the "refrigerator display part" (henceforth a "prior art") of Unexamined-Japanese-Patent No. 10-2008-0045044 like FIG.

The prior art is composed of a control panel 110, a diffusion sheet 120, a display window 130, as shown, the display window 130 is a perspective part 131 for displaying the operating state of the refrigerator and other parts thereof. It is made of a margin part 132, even if the light from the control panel 110 is displayed so that the background color of the see-through part 131 and the margin part 132 match.

However, the prior art has to be manufactured so that the thickness of the display window 130 itself can withstand the pressure, there is a problem in slimming as a whole, thereby increasing the volume of the entire device.

In addition, the prior art has a problem that the manufacturing process of the product is increased, such as injection molding the display window 130, and fastening the display window 130 and the like. In addition, in the prior art, only the background color of the transparent part 131 and the margin part 132 of the display window 130 matches and the color of the outer surface of the home appliance on which the display window 130 is mounted is completely hidden. There was a problem that was not.

The present invention is designed to improve the above problems, and to provide a display module that can reduce the manufacturing cost and shorten the manufacturing process.

In addition, the present invention is to provide a display module that can be obtained by exposing information only by the light emission of the semiconductor optical element and the display window is concealed in the same color as the outer surface of the home appliance to obtain the appearance of a beautiful product.

The present invention to achieve the above object, the at least one semiconductor optical device arrayed PCB; A housing accommodating the PCB to expose the semiconductor optical device; A mask film disposed on the PCB in a shape corresponding to the PCB and having an opaque coating on the remaining portions except for the shape such that a shape such as a letter, a number, or a figure is disposed at a position corresponding to the semiconductor optical device; And an exterior film laminated on the mask film in a shape corresponding to that of the mask film, and having a paint having the same color as that of the outer surface of the electronic device on which the PCB is mounted. Modules can be provided.

Here, the housing is characterized in that coupled to the outer panel forming the outer surface of the electronic device along the edge of the cut portion penetrated in a shape corresponding to the PCB.

In this case, the surface of the exterior film disposed on the uppermost layer of the plurality of exterior packaging films is the same height as the outer surface of the exterior panel.

The dead front type display module may further include a cover film of the same material and color as the exterior panel attached to the exterior film.

And, the surface of the cover film is characterized in that the same height as the outer surface of the exterior panel.

The dead front type display module may further include a touch screen film disposed between the PCB and the mask film, electrically connected to the PCB, and printed with a circuit pattern operated in a pressure sensitive manner. It is done.

The dead front type display module may further include a touch screen film disposed between the mask film and the exterior film, electrically connected to the PCB, and printed with a circuit pattern operated in a pressure sensitive manner. It features.

The housing may include a driving circuit board electrically connected to the semiconductor optical device, a signal electrically connected to the PCB and the driving circuit board, and sensing a user approaching the PCB to operate the semiconductor optical device. It further comprises a sensor for transmitting to the drive circuit board side.

The dead front type display module may further include a first adhesive layer formed on a rear surface of the mask film and attached to the PCB.

The dead front type display module may further include a second adhesive layer formed on a rear surface of the exterior film facing the mask film and attached to the mask film.

The dead front type display module may further include a second adhesive layer formed on a rear surface of each of the exterior films and attached to the exterior films.

And, the light transmittance from the exterior film to the PCB surface is characterized in that 5 to 40%.

The housing may further include a driving circuit board electrically connected to the semiconductor optical device.

The paint printed on the mask film is disposed on a surface of the mask film opposite to the PCB.

In addition, the coating material printed on the exterior film is characterized in that disposed on the surface of the exterior film facing the mask film.

According to the present invention of the configuration as described above can achieve the following effects.

First of all, the present invention conceals the semiconductor optical element of the PCB embedded in the above-described electronic device by an external film having the same color as one unit with the outer surface of the electronic device, and displays information only when the semiconductor optical device emits light. Provision is possible.

The present invention is to sequentially stack a mask film and a plurality of exterior films on a PCB array of semiconductor optical devices, the mask film and the exterior film is produced so that each can be attached like an adhesive tape to reduce the manufacturing cost and to improve the manufacturing process This can be extremely simplified.

1 is an exploded perspective view showing the overall structure of a dead front type display module according to an embodiment of the present invention.

2 is a cross-sectional conceptual view showing the overall structure of a dead front type display module according to an embodiment of the present invention.

3 is a cross-sectional conceptual view showing the overall structure of a dead front type display module according to another embodiment of the present invention.

Figure 4 is an exploded perspective view showing the overall structure of a dead front type display module according to another embodiment of the present invention.

5 and 6 are perspective views showing the actual operating state of the dead front type display module according to an embodiment of the present invention.

7 is an exploded perspective view showing the overall configuration of a display module according to the prior art.

Hereinafter, with reference to the accompanying drawings will be described a preferred embodiment of the present invention.

1 is an exploded perspective view showing the overall structure of a dead front type display module according to an embodiment of the present invention, Figure 2 is a cross-sectional conceptual view showing the overall structure of a dead front type display module according to an embodiment of the present invention.

As can be seen, the present invention can be understood that the mask film 300 and the plurality of exterior films 400 are bonded to be sequentially stacked on the PCB 100 accommodated in the housing 200.

The PCB 100 is an array of at least one semiconductor optical device 101, the semiconductor optical device 101 is employed as a light source by employing such as an LED.

The housing 200 accommodates the PCB 100 so that the semiconductor optical device 101 is exposed.

The mask film 300 is attached on the PCB 100 in a shape corresponding to the PCB 100, and shapes 301 to 309 such as letters, numbers, or figures are disposed at positions corresponding to the semiconductor optical device 101. The paint is opaquely printed on the remaining portions except for the shapes 301 to 309.

The exterior film 400 is stacked on the mask film 300 in a shape corresponding to that of the mask film 300, and the paint having the same color as that of the outer surface of the electronic device 900 on which the PCB 100 is mounted is printed. will be.

The present invention is applicable to the embodiment as described above, it is of course also possible to apply the following various embodiments.

The housing 200 accommodates the PCB 100 as described above, and is cut through the exterior panel 910 that forms the outer surface of the electronic device 900 in a shape corresponding to the PCB 100, as shown. Coupled along the edge of the portion 912.

Here, when the user intuitively grasps the surface of the exterior film 400 disposed on the uppermost layer of the exterior laminated film 400, the exterior panel 400 may not be distinguished from the exterior panel 910 of the electronic device 900. It is preferable to achieve the same height as the outer surface of the 910.

In this case, the light transmittance from the exterior film 400 to the surface of the PCB 100 is 5 to 40% so that the user can visually understand the structure of the exterior panel 910 through the exterior film 400 even under bright direct sunlight. Do not let it.

In addition, the paint 301 printed on the mask film 300 may be disposed on the opposite surface, but may be opposed to the PCB 100 as shown in FIG. 2 to prevent dropping from the mask film 300 and maintain durability. It is arranged on the surface of the mask film 300.

The paint 401 printed on the exterior film 400 may be disposed on an opposite surface, but the exterior film facing the mask film 300 may be prevented from falling off from the exterior film 400 and maintain durability. 400) to be placed on the plane.

In addition, a first adhesive layer g1 attached to the PCB 100 is formed on the rear surface of the mask film 300 so as to simplify and easily manufacture the fabrication process.

In addition, a second adhesive layer g2 attached to the mask film 300 is formed on the rear surface of the exterior film 400 facing the mask film 300 so as to simplify and easily manufacture the fabrication process.

In addition, of course, the second adhesive layer g2 may be attached to the adjacent exterior film 400.

On the other hand, the subject innovation is a cover film of the same material and color as the exterior panel 910 attached to the surface of the exterior film 400 to protect the surface of the exterior film 400 and reinforce structural strength as shown in FIG. Embodiments of the structure further including 500 may be applied.

Here, the surface of the cover film 500 is preferably the same height as the outer surface of the exterior panel 910 so that when the user intuitively grasps it, the surface of the cover film 500 cannot be distinguished from the exterior panel 910 of the electronic device 900.

Meanwhile, the present invention further includes a touch screen film 600 for convenience of operation when the semiconductor optical device 101 emits light when the user approaches and uses the electronic device 900 as shown in FIG. 4. An example might apply.

That is, the touch screen film 600 is disposed between the PCB 100 and the mask film 300, is electrically connected to the PCB 100, and a circuit pattern 610 that is operated in a pressure sensitive manner is printed. .

In detail, the circuit pattern 610 may sense the pressure of the user's finger pressing by arranging the pressure sensitive unit at a position corresponding to various shapes 301 to 309 of the mask film 300.

In addition, although the present invention is not specifically illustrated, the touch screen film 600 may be disposed between the mask film 300 and the exterior film 400 in some cases.

Meanwhile, the housing 200 is electrically connected to the driving circuit board 700 and the PCB 100 and the driving circuit board 700, which are electrically connected to the semiconductor optical device 101 as shown in FIG. 4, and the PCB 100. The embodiment may further include a sensor (not shown) which senses a user approaching the side and transmits a signal for operating the semiconductor optical device 101 to the driving circuit board 700.

Therefore, in the state as shown in FIG. 5 in which the user does not approach the electronic device 900, the exact position thereof may not be determined in reality, but the dead front type display module 800 at the position indicated by the dotted line is the outer surface of the electronic device 900. Integral with the user's naked eye maintains no state at all. The dead front type display module 800 may be defined as a structure in which the display window 130 of FIG. 7 is deleted.

However, when the user approaches the electronic device 900, the above-described sensor senses the user's motion and transmits a signal instructing the operation of the semiconductor optical device 101 to the driving circuit board 700. 6) while the dead front type display module 800 appears on the outer surface of the electronic device 900 as shown in FIG. 6, it will be in a state waiting for a user's operation.

As described above, the present invention provides a dead front type display module capable of reducing the manufacturing cost and shortening the manufacturing process and obtaining a beautiful product appearance by exposing information only by light emission of a semiconductor optical device. It can be seen that.

In addition, many modifications and applications are also possible to those skilled in the art within the scope of the basic technical idea of the present invention.

Claims

A PCB in which at least one semiconductor optical device is arrayed;

A housing accommodating the PCB to expose the semiconductor optical device;

A mask film disposed on the PCB, printed with an opaque paint, and having a light transmitting portion corresponding to a position where the optical elements are arranged; And

And an exterior film laminated on the mask film in a shape corresponding to that of the mask film and having a paint of the same color as that of the outer surface of the electronic device on which the PCB is mounted.
The method according to claim 1,

The housing,

And a display module coupled to an exterior panel forming an outer surface of the electronic device along an edge of a cutout portion penetrating into a shape corresponding to the PCB.
The method according to claim 2,

The display module of claim 1, wherein a surface of the exterior film disposed on an uppermost layer of the exterior laminated film has the same height as an exterior surface of the exterior panel.
The method according to claim 2,

The display module,

And a cover film of the same material and color as the exterior panel attached to the surface of the exterior film.
The method according to claim 4,

And a surface of the cover film is flush with an outer surface of the exterior panel.
The method according to claim 1,

The display module,

And a touch screen film disposed between the PCB and the mask film, electrically connected to the PCB, and printed with a circuit pattern operated in a pressure sensitive manner.
The method according to claim 1,

The display module,

And a touch screen film disposed between the mask film and the exterior film, electrically connected to the PCB, and printed with a circuit pattern operated in a pressure sensitive manner.
The method according to claim 1,

The housing,

A driving circuit board electrically connected to the semiconductor optical device;

And a sensor electrically connected to the PCB and the driving circuit board, the sensor detecting a user approaching the PCB side and transmitting a signal for operating the semiconductor optical device to the driving circuit board side.
The method according to claim 1,

The display module,

And a first adhesive layer formed on a rear surface of the mask film and attached to the PCB.
The method according to claim 1,

The display module,

And a second adhesive layer formed on a rear surface of the exterior film facing the mask film and attached to the mask film.
The method according to claim 1,

The display module,

And a second adhesive layer formed on a rear surface of each of the exterior films and attached to the exterior films.
The method according to claim 1,

Display module, characterized in that the light transmittance from the exterior film to the PCB surface is 5 to 40%.
The method according to claim 1,

The housing,

And a driving circuit board electrically connected to the semiconductor optical device.
The method according to claim 1,

The paint printed on the mask film is disposed on a surface of the mask film opposite the PCB.
The method according to claim 1,

The paint printed on the exterior film is disposed on a surface of the exterior film opposite to the mask film.