WO2014049121A3 - Verfahren zum herstellen eines optoelektronischen bauelements und optoelektronisches bauelement - Google Patents

Verfahren zum herstellen eines optoelektronischen bauelements und optoelektronisches bauelement Download PDF

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Publication number
WO2014049121A3
WO2014049121A3 PCT/EP2013/070193 EP2013070193W WO2014049121A3 WO 2014049121 A3 WO2014049121 A3 WO 2014049121A3 EP 2013070193 W EP2013070193 W EP 2013070193W WO 2014049121 A3 WO2014049121 A3 WO 2014049121A3
Authority
WO
WIPO (PCT)
Prior art keywords
optoelectronic component
producing
substrate
forming
optoelectronic
Prior art date
Application number
PCT/EP2013/070193
Other languages
English (en)
French (fr)
Other versions
WO2014049121A2 (de
Inventor
Arndt Jaeger
Daniel Steffen Setz
Original Assignee
Osram Opto Semiconductors Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh filed Critical Osram Opto Semiconductors Gmbh
Priority to US14/430,947 priority Critical patent/US9444074B2/en
Priority to CN201380051164.0A priority patent/CN104704645B/zh
Priority to KR1020157010974A priority patent/KR101782473B1/ko
Publication of WO2014049121A2 publication Critical patent/WO2014049121A2/de
Publication of WO2014049121A3 publication Critical patent/WO2014049121A3/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/85—Arrangements for extracting light from the devices
    • H10K50/854—Arrangements for extracting light from the devices comprising scattering means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/81—Anodes
    • H10K50/816—Multilayers, e.g. transparent multilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/85—Arrangements for extracting light from the devices
    • H10K50/858—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Led Devices (AREA)

Abstract

Verfahren zum Herstellen eines optoelektronischen Bauelements und optoelektronisches Bauelement In verschiedenen Ausführungsbeispielen wird ein Verfahren zum Herstellen eines optoelektronischen Bauelements bereitgestellt. Das Verfahren kann aufweisen ein Ausbilden mindestens eines Bereichs (220) mit einem erhöhten Brechungsindex an mindestens einer vorgegebenen Position in einem Substrat (202) an einer Oberfläche des Substrats (202) (S4002, S4106) und ein Bilden einer Elektrodenschicht (204) auf oder über der Oberfläche des Substrats (202) (S4006, S4102).
PCT/EP2013/070193 2012-09-28 2013-09-27 Verfahren zum herstellen eines optoelektronischen bauelements und optoelektronisches bauelement WO2014049121A2 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US14/430,947 US9444074B2 (en) 2012-09-28 2013-09-27 Method for producing an optoelectronic component and optoelectronic component
CN201380051164.0A CN104704645B (zh) 2012-09-28 2013-09-27 用于制造光电子器件的方法和光电子器件
KR1020157010974A KR101782473B1 (ko) 2012-09-28 2013-09-27 광전자 컴포넌트를 제조하는 방법 및 광전자 컴포넌트

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012109209.5A DE102012109209B4 (de) 2012-09-28 2012-09-28 Verfahren zum Herstellen eines optoelektronischen Bauelements und optoelektronisches Bauelement
DE102012109209.5 2012-09-28

Publications (2)

Publication Number Publication Date
WO2014049121A2 WO2014049121A2 (de) 2014-04-03
WO2014049121A3 true WO2014049121A3 (de) 2014-08-07

Family

ID=49274636

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2013/070193 WO2014049121A2 (de) 2012-09-28 2013-09-27 Verfahren zum herstellen eines optoelektronischen bauelements und optoelektronisches bauelement

Country Status (5)

Country Link
US (1) US9444074B2 (de)
KR (1) KR101782473B1 (de)
CN (1) CN104704645B (de)
DE (1) DE102012109209B4 (de)
WO (1) WO2014049121A2 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014201034A1 (de) * 2013-10-17 2015-04-23 POG-Präzisionsoptik Gera GmbH Gewerbepark Optisches Bauelement mit transparentem Grundkörper und einer passiv lichtstreuenden Struktur
CN110783157B (zh) * 2019-10-24 2021-11-05 北方夜视技术股份有限公司 一种应用于多碱光电阴极的复合光学薄膜及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020118271A1 (en) * 1998-06-05 2002-08-29 Seji Mashimo Exposure unit for image forming apparatus using electrophotographic system, electrophotographic image forming apparatus
WO2002085807A2 (de) * 2001-04-19 2002-10-31 Bora Glas Gmbh Verfahren zum laserstrahlgestützten eintrag von metallionen in glas zur erzeugung von farblosen und farbigen pixeln
US20110266562A1 (en) * 2008-10-24 2011-11-03 Saint-Gobain Glass France Glass substrate with an electrode, especially a substrate intended for an organic light-emitting diode device
WO2012084630A1 (de) * 2010-12-20 2012-06-28 Osram Opto Semiconductors Gmbh Verfahren zum herstellen eines optoelektronischen bauelements und optoelektronisches bauelement

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6309991B1 (en) 1996-08-29 2001-10-30 Corning Incorporated Silica with low compaction under high energy irradiation
DE10159959A1 (de) * 2001-12-06 2003-06-26 Heraeus Quarzglas Quarzglasrohling für ein optisches Bauteil und Verwendung desselben
JP2003282260A (ja) * 2002-03-26 2003-10-03 Dainippon Printing Co Ltd エレクトロルミネッセンス表示装置
DE102004001458B4 (de) 2004-01-08 2012-01-19 Schott Ag Glas mit deutlich verbesserter Stabilität gegen Strahlenbeschädigungen, ein Verfahren zu seiner Herstellung sowie dessen Verwendung
US7851995B2 (en) 2006-05-05 2010-12-14 Global Oled Technology Llc Electroluminescent device having improved light output
DE102008015697A1 (de) * 2008-03-26 2009-10-01 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines strukturierten optoelektronischen Bauelementes und Anordnung zur Durchführung eines solchen

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020118271A1 (en) * 1998-06-05 2002-08-29 Seji Mashimo Exposure unit for image forming apparatus using electrophotographic system, electrophotographic image forming apparatus
WO2002085807A2 (de) * 2001-04-19 2002-10-31 Bora Glas Gmbh Verfahren zum laserstrahlgestützten eintrag von metallionen in glas zur erzeugung von farblosen und farbigen pixeln
US20110266562A1 (en) * 2008-10-24 2011-11-03 Saint-Gobain Glass France Glass substrate with an electrode, especially a substrate intended for an organic light-emitting diode device
WO2012084630A1 (de) * 2010-12-20 2012-06-28 Osram Opto Semiconductors Gmbh Verfahren zum herstellen eines optoelektronischen bauelements und optoelektronisches bauelement

Also Published As

Publication number Publication date
CN104704645B (zh) 2017-06-09
KR101782473B1 (ko) 2017-09-27
US20150255752A1 (en) 2015-09-10
KR20150060952A (ko) 2015-06-03
CN104704645A (zh) 2015-06-10
US9444074B2 (en) 2016-09-13
DE102012109209B4 (de) 2017-05-11
DE102012109209A1 (de) 2014-04-03
WO2014049121A2 (de) 2014-04-03

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