WO2014048984A1 - Dispositif thermoconducteur, appareil de refroidissement et système de résonance magnétique - Google Patents

Dispositif thermoconducteur, appareil de refroidissement et système de résonance magnétique Download PDF

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Publication number
WO2014048984A1
WO2014048984A1 PCT/EP2013/069959 EP2013069959W WO2014048984A1 WO 2014048984 A1 WO2014048984 A1 WO 2014048984A1 EP 2013069959 W EP2013069959 W EP 2013069959W WO 2014048984 A1 WO2014048984 A1 WO 2014048984A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat conducting
conducting device
component
rigid component
stamping
Prior art date
Application number
PCT/EP2013/069959
Other languages
English (en)
Inventor
Zhi Chun Fang
Lei Yang
Original Assignee
Siemens Plc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Plc filed Critical Siemens Plc
Publication of WO2014048984A1 publication Critical patent/WO2014048984A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/20—Arrangements or instruments for measuring magnetic variables involving magnetic resonance
    • G01R33/28—Details of apparatus provided for in groups G01R33/44 - G01R33/64
    • G01R33/38—Systems for generation, homogenisation or stabilisation of the main or gradient magnetic field
    • G01R33/3804—Additional hardware for cooling or heating of the magnet assembly, for housing a cooled or heated part of the magnet assembly or for temperature control of the magnet assembly
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
    • F25D19/006—Thermal coupling structure or interface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F6/00—Superconducting magnets; Superconducting coils
    • H01F6/04—Cooling
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/20—Arrangements or instruments for measuring magnetic variables involving magnetic resonance
    • G01R33/28—Details of apparatus provided for in groups G01R33/44 - G01R33/64
    • G01R33/38—Systems for generation, homogenisation or stabilisation of the main or gradient magnetic field
    • G01R33/381—Systems for generation, homogenisation or stabilisation of the main or gradient magnetic field using electromagnets
    • G01R33/3815—Systems for generation, homogenisation or stabilisation of the main or gradient magnetic field using electromagnets with superconducting coils, e.g. power supply therefor

Definitions

  • the present invention relates to magnetic resonance imaging, and more particularly to a heat conducting device, a cooling apparatus, and a corresponding magnetic resonance system.
  • Magnetic resonance imaging is a biomagnetism nuclear spin imaging technology developed rapidly with the development of the computer technology, electronic circuit technology, and superconductor technology.
  • human tissue is placed in a static magnetic field B 0 ; then, a radio frequency pulse having the same frequency as the precession frequency of hydrogen nuclei is used to excite hydrogen nuclei in the human tissue to cause the hydrogen nuclei to resonate and absorb energy; after the radio frequency pulse is stopped, the hydrogen nuclei emit radio signals at a specific frequency and release the absorbed energy, and the radio signals are recorded by an external receiver and processed by a computer to obtain an image.
  • the heat conduction performance is usually related to two factors: the purity of the heat conducting material and the connection mode of nodes.
  • heat conducting devices in the superconducting magnet of the magnetic resonance system are located between a cold head and a cooled object or between cooled objects.
  • the heat conducting device may connect a first-stage of a cold head to a thermal shielding layer, a current lead, etc.; in other magnets, the heat conducting device may connect two thermal shielding layers.
  • the heat conducting device usually uses one or more flexible braids or laminates of one or more flexible sheets, usually of copper or aluminum, placed in parallel.
  • Such heat conducting devices are typically used to establish a heat conductive connection between the cold head and the cooled object or between cooled objects.
  • the heat conducting device is usually connected to the cold head or the cooled object by screws, or bolted joints.
  • such heat conducting devices have disadvantages of small thermal contact area and easy deformation under high moment of the screws, bolts or nuts. Therefore, such heat conducting devices have high heat resistance.
  • a soft, heat conducting material e.g., an indium film or conductive grease, may be applied to an interface.
  • the present invention provides a heat conducting device, including a flexible component and a first rigid component, in which one end of the flexible component is connected to the first rigid component by a stamping method.
  • the present invention further provides a cooling apparatus, including a cold head and the above heat conducting device, in which the heat conducting device is connected to a thermal coupling member of the cold head.
  • the present invention further provides a magnetic resonance system, including the above heat conducting device, a cold head, and a superconducting magnet, in which the heat conducting device is connected between a thermal coupling member of the cold head and a thermal shielding layer of the superconducting magnet.
  • the heat conducting device is manufactured by a stamping method, a simple process and excellent heat conductivity are achieved, and the cost can be saved with the same effect.
  • FIG. 1A and FIG. IB are side sectional views of a heat conducting device according to a specific embodiment of the present invention.
  • FIG. 2A and FIG. 2B are schematic views of the heat conducting device according to the specific embodiment of the present invention.
  • FIG. 3A and FIG. 3B are schematic views illustrating connection between the heat conducting device according to a specific embodiment of the present invention and a cold head and a cooled object.
  • FIG. 4 is a schematic view of a cooling apparatus according to a specific embodiment of the present invention.
  • FIG. 1A and FIG. IB are side sectional views of a heat conducting device according to a specific embodiment of the present invention.
  • a heat conducting device includes a rigid component 101 and a flexible component 102.
  • a recess is provided on one side of the rigid component 101, one end of the flexible component 102 extends into the recess, and the joint part (i.e., the recess part) of the rigid component and the flexible component is stamped from the outside in a direction perpendicular to the contact surface between the rigid component and a cooled object, so as to connect the rigid component 101 and the flexible component 102.
  • FIG. 1A and FIG. IB are side sectional views of a heat conducting device according to a specific embodiment of the present invention.
  • a heat conducting device includes a rigid component 101 and a flexible component 102.
  • a recess is provided on one side of the rigid component 101, one end of the flexible component 102 extends into the recess, and the joint part (i.e., the recess part
  • FIG. 1 A shows the heat conducting device according to a specific embodiment of the present invention using single-sided stamping 100
  • FIG. IB shows the heat conducting device according to a first specific embodiment of the present invention using double-sided stamping 100
  • FIG. 2A and FIG. 2B are schematic views of the heat conducting device according to a specific embodiment of the present invention.
  • the rigid component 101 is a panel
  • the flexible component 102 is one or more braids arranged in parallel and/or one or more laminates arranged in parallel, and may also be one or more braids arranged in a staggered manner and/or one or more laminates arranged in parallel.
  • the stamping method used for connection between the flexible component and the rigid component is a non-welding process, that is, the braid or the laminate is connected to the panel through mechanical pressure completely, and the method that can be used includes cold rolling, cold breakdown, and cold forging.
  • the braid may be connected to the panel by multi-point stamping: an individual stamping location for each braid or laminate.
  • the braid or the laminate may be connected to the panel by row-by-row stamping, as shown in Fig. 2B, where one or more elongate stamping location may be applied to all, or subsets, of the braids and/or laminates.
  • the stamping may be applied from one side only, as visible in Figs. 2A, 2B; alternatively, stamping may be applied simultaneously on opposite sides of the braids or laminates.
  • one side of the braids or laminates may be stamped with an individual stamping location for each braid or laminate while the other side has one or more elongate stamping location applied to all, or subsets, of the braids and/or laminates.
  • the material of the flexible component and the rigid component is a material of high heat conductivity, e.g., copper or aluminum.
  • a similar arrangement and method may be applied at the other end of the flexible component 102.
  • various components of the heat conducting device are cleaned before assembly.
  • the specific process used will depend on the materials involved, but may include deoxidizing the flexible component and the rigid component, in which a deoxidizing agent may be used dissolved in water or alcohol, and the flexible component and the rigid component are immersed in the solution.
  • the heat conducting device is assembled within 5 hours after the end of the cleaning to prevent recurrence of surface contamination.
  • the surface contact between the panel 101 of the heat conducting device according to the illustrated specific embodiment of the present invention and the cooled object significantly improves the heat conduction efficiency.
  • the stamping method e.g., cold forging, cold rolling, and cold breakdown, used in the production of the heat conducting device according to the specific embodiment of the present invention is easy to implement and facilitates quality control, and results in significantly lowered manufacturing cost.
  • use of the heat conducting device according to the present invention in a superconducting magnet of a magnetic resonance system improves the cooling performance. For example, cryogen loss rate is significantly reduced; and for a zero cryogen loss magnet, the low temperature redundancy, or recondensing margin, is improved.
  • FIG. 3A and FIG. 3B are schematic views illustrating connection between the heat conducting device 110 according to an embodiment of the present invention and a cold head 200 and a cooled object 301.
  • a panel 101 of the heat conducting device according to an embodiment of the present invention is connected to a thermal coupling member 201 of a cold head 200 through bolts.
  • the panel of the heat conducting device according to an embodiment of the present invention is provided with multiple bolt holes through which the heat conducting device 1 10 is thermally connected to the cold head 200 using the bolts to attach it to coupling member 201.
  • FIG. 3A a panel 101 of the heat conducting device according to an embodiment of the present invention is connected to a thermal coupling member 201 of a cold head 200 through bolts.
  • the panel of the heat conducting device according to an embodiment of the present invention is provided with multiple bolt holes through which the heat conducting device 1 10 is thermally connected to the cold head 200 using the bolts to attach it to coupling member 201.
  • the panel 101 of the heat conducting device 1 10 is connected to the thermal coupling member 201 of the cold head 200 by welding.
  • the panel 101 of the heat conducting device 100 according to the specific embodiment of the present invention may also be connected to a thermal shielding layer 301 of a superconducting magnet by bolts or by welding.
  • FIG. 4 is a schematic view of a cooling apparatus according to a specific embodiment of the present invention.
  • the cooling apparatus according to the specific embodiment of the present invention includes a cold head 200 and a heat conducting device 110.
  • the heat conducting device 1 10 includes a rigid component 101 and a flexible component 102.
  • a recess is provided on one side of the rigid component 101
  • one end of the flexible component 102 extends into the recess
  • a wall of the recess part of the rigid component 101 and the flexible component 102 are stamped 100 from the outside, so as to connect the rigid component 101 and the flexible component 102.
  • the other end of the flexible component 102 is connected to a thermal coupling member 201 of the cold head 200 also by stamping.
  • this stamping is performed in a direction perpendicular to a respective contact surface between the rigid component and a cooled object, although this is not necessarily the case.
  • the stamping method used for connection between the flexible component 102 and the rigid component 101 of the heat conducting device 100 and between the flexible component 102 and the thermal coupling member 201 of the cold head 200 is a non-welding process, that is, the flexible component is connected to the thermal coupling member through mechanical pressure completely, and the method that can be used includes cold rolling, cold breakdown, and cold forging.
  • the material of the flexible component and the rigid component is a material of high heat conductivity, e.g., copper or aluminum.
  • the present invention further provides a magnetic resonance system, including a cooling apparatus and a superconducting magnet.
  • the cooling apparatus includes a cold head 200 and a heat conducting device 100.
  • the heat conducting device 110 includes a rigid component 101 and a flexible component 102.
  • a recess is provided on one side of the rigid component 101, one end of the flexible component 102 extends into the recess, and a wall of the rigid component and the flexible component are stamped from the outside, so as to connect the rigid component 101 and the flexible component 102.
  • the other end of the flexible component 102 is connected to a thermal coupling member 201 of the cold head 200 also by stamping.
  • the rigid component of the heat conducting device 100 may be connected to a thermal shielding layer 301 of the superconducting magnet through bolts or by welding.
  • the stamping is preferably carried out in a direction perpendicular to the intended contact surface between the rigid component and a cooled object.
  • the stamping method used for connection between the flexible component 102 and the rigid component 101 of the heat conducting device 100 and between the flexible component 102 and the thermal coupling member 201 of the cold head 200 is a non- welding process, that is, the flexible component is connected to the thermal coupling member through mechanical pressure completely, and the method that can be used includes cold rolling, cold breakdown, and cold forging.
  • the material of the flexible component and the rigid component is a material of high heat conductivity, e.g., copper or aluminum.
  • the present invention provides a heat conducting device, a cooling apparatus, and a magnetic resonance system.
  • the heat conducting device includes a flexible component and a first rigid component, and one end of the flexible component is connected to the first rigid component by a stamping method.
  • the heat conducting device is manufactured by a stamping method, a simple process and excellent heat conductivity are achieved, and the cost can be saved with the same effect.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Containers, Films, And Cooling For Superconductive Devices (AREA)
  • Magnetic Resonance Imaging Apparatus (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

La présente invention concerne un dispositif thermoconducteur (110), un appareil de refroidissement et un système de résonance magnétique. Le dispositif thermoconducteur comprend un élément flexible (102) et un premier élément rigide (101), une extrémité de l'élément flexible étant reliée au premier élément rigide par un procédé d'estampage. Selon la solution technique de l'invention, le dispositif thermoconducteur est fabriqué selon un procédé d'estampage, un processus simple et une excellente conductibilité thermique sont obtenus, pour un coût réduit avec une même efficacité.
PCT/EP2013/069959 2012-09-26 2013-09-25 Dispositif thermoconducteur, appareil de refroidissement et système de résonance magnétique WO2014048984A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201210362795.1 2012-09-26
CN201210362795.1A CN103680803B (zh) 2012-09-26 2012-09-26 一种导热装置、制冷设备和磁共振系统

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Publication Number Publication Date
WO2014048984A1 true WO2014048984A1 (fr) 2014-04-03

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PCT/EP2013/069959 WO2014048984A1 (fr) 2012-09-26 2013-09-25 Dispositif thermoconducteur, appareil de refroidissement et système de résonance magnétique

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CN (1) CN103680803B (fr)
WO (1) WO2014048984A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7409968B2 (ja) 2020-05-28 2024-01-09 株式会社日立製作所 複合材料体およびこれを備える超電導磁石

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB839090A (en) * 1956-12-28 1960-06-29 Amp Inc Improvements in electrical connections and methods and die-sets for making them
CH361602A (de) * 1956-08-20 1962-04-30 Amp Inc Verfahren zum Befestigen der Klemmhülse eines elektrischen Verbindungsstückes an einem in die Klemmhülse eingeführten elektrischen Leiter, elektrischen Verbindungsstück zur Ausführung des Verfahrens und nach dem Verfahren hergestellte Verbindungen
EP0365376A1 (fr) * 1988-10-18 1990-04-25 Mecatraction Jonction d'un câble à une électrode de panneau laminé, notamment panneau chauffant, par cosse agrafée, cosse pour une telle jonction et barrette constituée d'une multiplicité de cosses liées
GB2272061A (en) * 1992-10-28 1994-05-04 Gen Electric Flexible thermal connection system between a cryogenic refrigerator and an MRI superconducting magnet
US5934082A (en) * 1995-09-11 1999-08-10 Siemens Aktiengesellschaft Indirect cooling system for an electrical device
US20060022779A1 (en) * 2004-07-28 2006-02-02 General Electric Company Superconductive magnet including a cryocooler coldhead
JP2011120468A (ja) * 2011-02-07 2011-06-16 Aisin Seiki Co Ltd 超電導装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4701294B2 (ja) * 2009-01-30 2011-06-15 アイシン精機株式会社 超電導装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH361602A (de) * 1956-08-20 1962-04-30 Amp Inc Verfahren zum Befestigen der Klemmhülse eines elektrischen Verbindungsstückes an einem in die Klemmhülse eingeführten elektrischen Leiter, elektrischen Verbindungsstück zur Ausführung des Verfahrens und nach dem Verfahren hergestellte Verbindungen
GB839090A (en) * 1956-12-28 1960-06-29 Amp Inc Improvements in electrical connections and methods and die-sets for making them
EP0365376A1 (fr) * 1988-10-18 1990-04-25 Mecatraction Jonction d'un câble à une électrode de panneau laminé, notamment panneau chauffant, par cosse agrafée, cosse pour une telle jonction et barrette constituée d'une multiplicité de cosses liées
GB2272061A (en) * 1992-10-28 1994-05-04 Gen Electric Flexible thermal connection system between a cryogenic refrigerator and an MRI superconducting magnet
US5934082A (en) * 1995-09-11 1999-08-10 Siemens Aktiengesellschaft Indirect cooling system for an electrical device
US20060022779A1 (en) * 2004-07-28 2006-02-02 General Electric Company Superconductive magnet including a cryocooler coldhead
JP2011120468A (ja) * 2011-02-07 2011-06-16 Aisin Seiki Co Ltd 超電導装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7409968B2 (ja) 2020-05-28 2024-01-09 株式会社日立製作所 複合材料体およびこれを備える超電導磁石

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Publication number Publication date
CN103680803A (zh) 2014-03-26
CN103680803B (zh) 2017-09-01

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