WO2014048834A1

WO2014048834A1 - Housing for an optoelectronic component, electronic assembly, method for producing housings and method for producing electronic assemblies

Info

Publication number: WO2014048834A1
Application number: PCT/EP2013/069503
Authority: WO
Inventors: Georg Bogner; Luca HAIBERGER; Michael Zitzlsperger
Original assignee: Osram Opto Semiconductors Gmbh
Priority date: 2012-09-27
Filing date: 2013-09-19
Publication date: 2014-04-03
Also published as: DE102012109139A1

Abstract

In various embodiments, a housing (2) is produced for an optoelectronic component (42). The housing has a leadframe (12) and a mould material (14). The leadframe (12) is formed from an electrically conductive first material and is coated with an electrically conductive second material. The leadframe (12) has a first and a second leadframe section (17, 19) that are physically separated from each other. On a first side of the leadframe (12), the first lead frame section (17) has a receiving region (16) for arranging the optoelectronic component (42) and the second leadframe section (19) has a contact region (18) for contacting the optoelectronic component (42). The leadframe (12) is embedded into the mould material (14). On a first side (4) of the housing (2), the mould material (14) has a receiving recess (15) in which the receiving region (16) and the contact region (18) are freely arranged. The first leadframe section (17) and the second leadframe section (19) each have at least one contact section (22) for contacting the corresponding leadframe section (17, 19), in which contact sections the leadframe sections (17, 19) are exposed on a second side (6) of the housing (2), which forms an edge of the housing (2) in conjunction with the first side (4) of the housing (2), are tapered vertically towards the second side (6) of the housing (2), and are coated with the second material.

Description

Besehreibung

Housing for an optoelectronic component, electronic assembly, method for the manufacture of housings and

Method for producing electronic assemblies

The invention relates to a housing for an optoelectronic component, an electronic assembly, a method for producing housings and a method for producing electronic assemblies.

This patent application claims the priority of German Patent Application DE 10 2012 109 139.0, whose

The disclosure of which is hereby incorporated by reference.

An optoelectronic component can be, for example, a component which absorbs electromagnetic radiation and / or emits an electromagnetic radiation. An electromagnetic radiation absorbing component may be, for example, a solar cell. One

For example, an electromagnetic light emitting device may be an Organic Light Emitting Diode (OLED), a White Organic Light Emitting Diode (WOLED), a Light Emitting Diode (LED), or a Laser Diode. An electromagnetic radiation absorbing and emitting device may be for example a reflection light barrier. Optoelectronic devices are often in housings

arranged, by means of which they can be arranged on printed circuit boards and / or contacted. Known housing for electronic components, such as QFN (quad flat no leads) housing, have as a base material, for example

Leadframe (leadframes) on. The QFN packages are also available as QFN packages and / or as Micro Lead Frame (MLF)

designated and are in the electronics chip housing design for integrated circuits (IC). The term "QFN" includes different sizes of IC packages, all of which can be soldered as surface mounted components on printed circuit boards. In this description, the term "QFN" will also be representative of the following terms

used: MLPQ (Micro Leadframe Package Quad), MLPM (Micro Leadframe Package Micro), MLPD (Micro Leadframe Package

Dual Dual Micro Leadframe Package (DRMLF), Dual Fiat No-lead Package (DFN), Thin Dual Fiat No-lead Package (TDFN), Ultra Thin Dual Fiat No-lead Package (UTDFN), Extreme Thin Dual XDFN Fiat No-lead Package), QFN-TEP (Quad Fiat No Lead Package with Top Exposed Ped), TQFN (Thin Quad Fiat No Lead Package), VQFN (Very Thin Quad Fiat No Leads Package). As an essential feature and in contrast to the similar Quad Fiat Package (QFP), the electrical connections (pins) do not protrude in the form of wires laterally beyond the dimensions of Kunstustummantelung, but are in the form of

Copper connections flat in the bottom of the housing

integrated. This allows the space needed on the

PCB can be reduced and a higher packing density can be achieved. The fact that a housing is designed as a QFN housing may mean, for example, that the housing has no wires leading to the outside, which for example project laterally out of the housing and which, for example, would have to be bent downward when the housing is arranged on a printed circuit board.

In a manufacturing method for producing the housings, the leadframes may, for example, initially be present in a lead frame composite and made of this

to be isolated. Furthermore, the leadframes can be coated with a coating (plating), for example a metallic coating.

For mechanical fastening and / or electrical

Contacting the optoelectronic components, the lead frames, for example, two each

Lead frame sections, wherein, for example, one of the lead frame sections has a receiving area for receiving and / or electrical contacting of the electronic

Component and the other leadframe section one

Contact area for electrically contacting the

have electronic components.

The lead frame may be, for example, a metal structure having as ladder frame sections corresponding to one, two or more pieces of metal. Several ladder frames

and / or the corresponding leadframe sections may, for example, be held together in the leadframe composite, which may be a metal frame, for example. Of the

Leadframe composite, for example, from a

Leadframe blank, for example, a flat

Metal plate is formed, for example by a chemical method such as etching, or by a mechanical method such as punching. The leadframe composite may, for example, a plurality of later, for example, electrode-forming

Have ladder frame sections, which in the

Lead frame composite can be interconnected, for example by means of metal webs. In different

Embodiments may be one of the lead frames

Comprise leadframe portions, which form, for example, the electrodes, wherein the leadframe portions are no longer physically connected to each other by means of the metal, i. For example, after the metal bars have already been cut. Thus, the electrodes form

clearly in various embodiments the

Lead frame itself or represent isolated lead frame of a lead frame composite.

When manufacturing the housing, the lead frame composite can for example be embedded in a molding material, for example in a mold process, for example an injection molding or transfer molding process. The molding material may be formed, for example, as KunstStoffummantelung. The molding material may, for example, epoxy, silicone or a hybrid material having, for example, one of having said materials. The structure of molding material and embedded therein lead frame composite can also be referred to as a housing composite. That the

Lead frame composite or the lead frame in the

Embedded molding material, for example, means that the lead frame or its lead frame sections are at least partially surrounded by the molding material. Parts of the ladder frame can remain free of mold material. For example, the electrical connections for contacting the housing, in particular the leadframe sections of the housing, may be exposed on a lower side of the leadframe. Also, at one of the bottom

opposite top of the lead frame

Receiving recesses in which the receiving areas and / or contact areas are exposed, be free of molding material.

The housings can be singulated from the housing assembly, for example by means of sawing or cutting. The electrical contacts of the housings are on a side opposite the receiving areas of the leadframe sections

formed so that the finished housing on one

Printed circuit board can be placed directly on the resulting physical contact between the housing and circuit board and the electrical contact to the

Lead frame and / or a thermal coupling of the housing can be made to the circuit board.

Further, housings are known, which are formed and in which the optoelectronic components are arranged so that they are laterally tilted mounted on a printed circuit board, so that for example the side of the housing which is substantially perpendicular to a surface of the circuit board, the receiving recess to record the

having optoelectronic component. this causes

For example, in electromagnetic radiation emitting devices that they the electromagnetic radiation substantially laterally, ie in the direction parallel to the Surface of the circuit board, emit. The electronic assemblies with such housings and electromagnetic radiation emitting components arranged therein are referred to, for example, as "side viewers", "sideviewers" or "(micro) side LEDs".

Known QFN housings have no wires on their side surfaces, by means of which they could be contacted laterally tilted on a printed circuit board. The QFN housings may have on their side surfaces only front and / or parting surfaces, in particular sawing or cutting surfaces of the leadframes, in particular of the leadframe sections, which arise when the housing is singulated. However, these interfaces are not coated and relatively rough and are only relatively poor for electrical

Contact, for example by means of soldering, the

electronic assembly compared to the coated surfaces of the lead frame. Known QFN housings are therefore not for producing laterally emitting

used electronic components.

In various embodiments, a housing for an optoelectronic device is provided, which is simple and inexpensive to produce, for example, according to a QFN housing, and / or can be easily mounted on a circuit board that one side of the

Housing having a receiving recess for receiving the optoelectronic component is aligned perpendicular or at least substantially perpendicular to a surface of the circuit board.

In various embodiments, a

electronic assembly provided, which is simple and inexpensive to produce, for example, according to a QFN package, and / or can be easily mounted on a circuit board that one side of the

Housing having a receiving recess in which an optoelectronic device is arranged, vertically or is aligned at least substantially perpendicular to a surface of the circuit board.

In various embodiments, a method is provided for manufacturing optoelectronic package packages that enables the packages to be simply and inexpensively manufactured, for example, according to QFN packages, and / or that allows the packages to be easily mounted on a printed circuit board in that sides of the housings which have receiving recesses for accommodating the optoelectronic components are aligned perpendicularly or at least substantially perpendicular to a surface of the printed circuit board. In various embodiments, a method for manufacturing electronic assemblies is provided, which allows the electronic assemblies simple and

inexpensive, for example, with a QFN housing, and / or that allows the electronic components can be easily mounted on a circuit board that pages of electronic

Assemblies having receiving recesses in which the optoelectronic components are arranged, are aligned perpendicular or at least substantially perpendicular to a surface of the circuit board.

In various embodiments, a housing for an optoelectronic component is provided. The housing has a leadframe which is formed from an electrically conductive first material and which is coated with an electrically conductive second material. The lead frame has a first lead frame portion and a second lead frame portion which are physically separated from each other. On a first page of the

Leadframe, the first lead frame portion has a receiving area for arranging the optoelectronic

Component and the second lead frame section a

Contact area for contacting the optoelectronic Component on. The housing further comprises a molding material, in which the lead frame is embedded and which has a receiving recess on a first side of the housing, in which the receiving area and the contact area are exposed. The first leadframe section and the second

Lead frame section have to contact the

corresponding lead frame section in each case at least one contact portion, in which the

Leadframe portions are exposed on a second side of the housing which forms an edge of the housing with the first side of the housing, wherein the leadframe portions are tapered in the direction perpendicular to the second side of the housing and in which the leadframe portions are coated with the second material are.

The exposed and coated on the second side of the housing leadframe sections allow the housing tilted side to be mounted on a circuit board

and / or to electrically contact, in particular such that the second side of the housing faces the printed circuit board and / or that the first side of the housing is oriented perpendicular or at least substantially perpendicular to a surface of the printed circuit board. For example, that can

Housing in the contact sections in which the

Lead frame sections are exposed and coated, simply soldered to printed circuit boards of the circuit board. For example, the fact that the first side of the housing is oriented substantially perpendicular to the surface may mean that the first side and the surface of the

PCB an angle between 70 ° and 110 °,

For example, between 80 ° and 100 °, for example, include about 90 °.

The housing may be formed, for example, according to a QFN housing. Thus, the exposed and coated on the second side of the housing allow

Lead frame sections to provide a side mount QFN housing. For example, the side-mountable QFN housing can be used for an electromagnetic radiation emitting device, thereby

For example, a sidelooker and / or sideviewer in QFN construction and thus a QFN sidelooker or QFN sideviewer is provided.

In various embodiments, the

Leitrahmenabschnitte exposed in the contact portions on a second side opposite third side of the housing and coated with the second material. Thus, the housing may be secured in the contact portions on the second and / or third side to one or two printed circuit boards. The third side of the case can

For example, with the first side of the housing form a further edge of the housing.

In various embodiments, portions of the second and / or third sides of the housing are

Lead frame exposed, which are not coated with the second material. These are, for example, separating surfaces which, when the housing is singulated, form a housing composite

arise. Since the lead frames in the lead frame composite are coated before separation, there is no second material on the parting surfaces, for example the cutting or sawing surfaces.

In various embodiments, the

Lead frame sections in the contact sections each L-shaped and each have a base portion and a respective leg portion. The leg portions extend from the corresponding one

Base portions. The base sections each form part of the first side of the lead frame. The leg portions are exposed on the second side of the housing and coated with the second material. For example, the

Lead frame sections in the L-shaped portions bent such that the leg portions with the corresponding base portions at an angle of 90 °. When electrically contacting the housing then the leg portions can be physically and electrically connected to the

Conductors of the circuit board are connected. In various embodiments, the

Lead frame sections in the contact sections each U-shaped. For example, the

Lead frame portions in the contact portions each have a base portion and two leg portions extending from the respective base portions. The base sections each form part of the first side of the lead frame. In each contact section are a

Leg portion on the second side of the housing and a leg portion on the third side of the housing

exposed and coated with the second material.

In various embodiments, a cut surface is formed on at least one of the leg portions on a fourth side of the housing, and at the corresponding leg portion, a terrace surface is formed facing away from the cut surface. The cut surface is the same size as the terrace surface. This may help to align and / or balance the housing when mounting to a circuit board, for example by means of a solder connection, relative to the circuit board, for example, to align and / or balance evenly.

In various embodiments, an electronic package is provided that includes the package and the package

having optoelectronic component. The optoelectronic component is arranged in the receiving region and electrically contacted in the contact region. The electronic module can also be used as an optoelectronic module

be designated. The electronic assembly is

for example, a QFN sidelooker or QFN sideviewer.

In various embodiments, the electronic assembly includes a circuit board having conductive traces and on which the housing is arranged so that the second side of the housing faces the circuit board. The

Contact sections are electrically coupled to the tracks. The first side of the housing is perpendicular or at least substantially perpendicular to the surface of the housing

PCB aligned. In the case of an electromagnetic radiation-emitting component as an optoelectronic component, for example, a main emission direction of the optoelectronic component may be parallel or at least substantially parallel to the surface of the printed circuit board. The main radiation direction can be characterized, for example, by a beam path of electromagnetic radiation and / or run along a beam path of electromagnetic radiation emitted by the beam

Optoelectronic component is emitted and along the beam path, the maximum light intensity of the emitted from the optoelectronic component electromagnetic radiation. That the main radiation direction of the optoelectronic component is directed substantially parallel to the surface of the printed circuit board can

For example, mean that a vector containing the

Main emission direction, and the surface of the circuit board include an angle, for example, between -10 ° and + 10 °, for example, between -5 ° and 5 °, for example, from about 0 ° or are parallel.

In various embodiments, a method of manufacturing packages for optoelectronic devices is provided. In the method is first a

Leitrahmenrohling provided, which is formed of an electrically conductive first material. From the

Leadframe blank is produced a Leitrahmenverbund. The lead frame assembly has a leadframe for each housing, each leadframe having a first leadframe

Lead frame portion and a second lead frame portion which are physically separated from each other. On a first side of the ladder frame, the first ones point

Lead frame sections a receiving area for placing the optoelectronic component and the second

Lead frame sections on a contact area for contacting the optoelectronic device. By doing

Leadframe composite are in separation areas, where the housing should be separated from each other,

Contact recesses formed which overlap the separation areas at least partially. The lead frame composite is coated with an electrically conductive second material. The coated ladder frame composite is so in one

Embedded molding material, that the molding material on a first side of the housing has a receiving recess in which the receiving area and the contact area are exposed. In addition, the contact recesses remain free of molding material. The housings are separated by the

Lead frame composite is separated along the separation areas.

For example, the housings are basically manufactured according to the QFN principle. However, in addition to the coating of the lead frame composite, the contact recesses are formed in the separation areas. In the coating of the lead frame composite then the inner walls of the

Contact recesses also coated. In the formation of the molding material, for example when embedding the

Lead frame in the molding material, remain the

Contact recesses free of mold material, whereby the coated inner walls of the contact recesses also remain free of mold material. Since the separation areas extend through the contact recesses, the contact recesses are opened to the outside when separating the housing. Therefore, the coated and exposed former form

Inner walls of the contact recesses after separating the housing parts of the outer wall of the housing, for example, coated in the contact portions and exposed leadframe sections.

In various embodiments, the separation regions are arranged to intersect at crossing points and the contact recesses are formed at the crossing points. This can contribute to forming a contact section by forming a contact recess in up to four adjacent housings.

In various embodiments, the

Contact recesses designed so that to the

Inner walls of the contact recesses the material of

Lead frame sections extending in the direction perpendicular to the first sides of the lead frame. This contributes to the fact that after separating the housing, the exposed at the second or third side of the housing contact portions of the leadframe sections, which are coated with the second material, are particularly large, which can contribute to a good physical and electrical contact. For example, the contact recesses in a

Punching methods are formed in which the edges of the recesses are extruded in the direction perpendicular to the first side of the lead frame. The inner walls of the contact recesses extending perpendicular to the first side of the leadframe form, after the housing has been singulated, for example, the leg sections of the U-shaped or L-shaped leadframe sections in the contact sections.

In various embodiments, a method for manufacturing electronic assemblies is provided in which packages are made, for example, according to the

Previous explained method. Before separating the housing, optoelectronic components are arranged in the housings in the corresponding receiving areas and contacted in the corresponding contact areas.

In various embodiments, at least one of the housings is arranged on a printed circuit board that has conductor tracks, such that the second side of the housing

Printed circuit board faces. The contact sections are electrically coupled to the conductor tracks. The first side of the housing is perpendicular or at least substantially aligned perpendicular to the surface of the circuit board. Trap of electromagnetic radiation emitting

Component as optoelectronic device can

For example, a main emission of the

Optoelectronic device may be parallel or at least substantially parallel to the surface of the circuit board.

Embodiments of the invention are illustrated in the figures and are explained in more detail below.

Show it

Fig. 1 is a first side of an embodiment of a

Housing for an optoelectronic component;

FIG. 2 shows a fourth side of the housing according to FIG. 1 facing away from the first side; FIG. 3 shows a second side of the housing according to FIG. 1, which adjoins the first and the fourth side;

4 shows a third side of the housing according to FIG. 1, which adjoins the first and the fourth side and which faces away from the second side;

FIG. 5A shows a first end side of the housing according to FIG. 1; FIG.

Fig. 5B, a second end face of the housing according to Figure 1, from the first end face of the housing

turned away;

6 shows an exemplary embodiment of a leadframe composite during a method for producing a housing for an optoelectronic component; 7 shows an embodiment of a housing assembly during a method for producing a

Housing for an optoelectronic component; Fig. 8 is a first side of an embodiment of a

Housing for an optoelectronic component;

FIG. 9A shows a first end face of the housing according to FIG. 8; FIG. FIG. 9B shows a second end face of the housing according to FIG. 8; FIG.

10 shows an embodiment of a housing composite

during a manufacturing process for manufacturing a housing for an optoelectronic device;

Fig. 11 is a first side of an embodiment of a

Housing for an optoelectronic component; FIG. 12 shows a first side of an embodiment of an electronic assembly; FIG.

Fig. 13A is a side view of an embodiment of an electronic assembly;

Fig. 13B is a side view of an embodiment of an electronic assembly; a detailed side view of a

Embodiment of an electronic assembly;

15 is a flowchart of an embodiment of a

Method for producing housings for optoelectronic components.

In the following detailed description, reference is made to the accompanying drawings, which are part of this In the description, specific embodiments are shown in which the invention may be practiced. In this regard will

Directional terminology such as "top", "bottom", "front", "back", "front", "rear", etc. used with reference to the orientation of the described figure (s). There

For example, components of embodiments may be positioned in a number of different orientations, directional terminology is illustrative and is in no way limiting. It should be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present invention. It should be understood that the features of the various embodiments described herein may be combined with each other unless specifically stated otherwise. The following detailed description is therefore not to be taken in a limiting sense, and the scope of the present invention is defined by the appended claims.

In the context of this description, the terms

"connected", "connected" and "coupled" used to describe both a direct and indirect connection, a direct or indirect connection and a direct or indirect coupling. In the figures, identical or similar elements are provided with identical reference numerals, as appropriate. An optoelectronic component may be in different

Embodiments be an electromagnetic radiation emitting and / or electromagnetic radiation absorbing component. An electromagnetic

Radiation absorbing component may be, for example, a solar cell. An electromagnetic radiation

emitting device can in different

Embodiments be a semiconductor device emitting electromagnetic radiation and / or as a electromagnetic radiation emitting diode, as an organic electromagnetic radiation emitting diode, as an electromagnetic radiation emitting transistor or as an organic electromagnetic radiation

be formed emitting transistor. The radiation may, for example, be light in the visible range, for example blue or white light, UV light and / or infrared light. In this context, the component emitting electromagnetic radiation can be designed, for example, as a light-emitting diode (LED) or as an organic light-emitting diode (OLED). The light-emitting

Component may be part of an integrated circuit in various embodiments. Furthermore, a

Be provided plurality of light emitting devices, for example housed in a common

Casing .

Fig.l shows a first side 4 of an embodiment of a housing 2 for an optoelectronic device. A second side 6 of the housing 2 forms with the first side 4 an edge of the housing 2. A third side 8 of the housing 2 forms with the first side 4 a further edge of the housing 2. A first end face 10 of the housing 2 is adjacent to the first Page 4, the second page 6 and the first page 8. A second end face 11 of the housing 2 is from the first

Facing away from the end face 10 and adjacent to the first side 4, the second side 6 and the third side 8. The housing 2 is suitable for receiving a

optoelectronic component and for arranging on a carrier, for example a printed circuit board, such that the second side 6 faces the carrier and / or that the first side 4 is oriented perpendicular or substantially perpendicular to a surface of the carrier. For example, in the case of electromagnetic radiation

emissive component as an optoelectronic component, the electromagnetic radiation in parallel or at least in Substantially parallel to a surface of the carrier, such as the circuit board, are emitted. The

Housing 2 may be referred to, for example, as a sidelooker housing and / or as a QFN sidelooker housing. The housing 2 can be used for example in a mobile device, for example a mobile phone, a PDA or a tablet PC, or in a motor vehicle.

A thickness of the housing 2 may, for example, be 100 μm to 1 mm, for example 200 μm to 500 μm, for example 250 μm to 300 μm. A thickness of the lead frame 12 may be, for example, 100 pm to 500 pm, for example 150 pm to 300 pm. The printed circuit board may be, for example, a FR1, FR2, FR3, FR4, FR5, CEM1, CEM2, CEM3, CEM4 or CEM5 printed circuit board, for example a plated-through FR-4 printed circuit board.

The housing 2 has a lead frame 12, which is formed of an electrically conductive first material. The lead frame 12 is coated with an electrically conductive second material. The lead frame 12 may, for example, a first lead frame portion 17 and a second

Lead frame portion 19 have the physical

are separated from each other and are electrically isolated from each other. The first leadframe section 17 may, for example, have a receiving region 16 for receiving the optoelectronic component. The second leadframe section 19 may, for example, have a contact region 18 for electrically contacting the optoelectronic component. Alternatively or additionally, the contact region 18 can be electrically coupled to an ESD protection diode, for example a Zener diode. For example, the ESD protection diode may be bonded to the contact region 18. The electrically conductive first material comprises, for example, a metal, for example copper, for example CuW or CuMo, copper alloys, brass, nickel and / or iron,

For example FeNi, on and / or is formed from it. The electrically conductive second material has, for example a metal on or, for example, nickel, palladium or gold or a mixture or alloy comprising one or more of said metals. The coating may have a thickness, for example, between 0.01 μm and 0.5 μm, for example between 0.1 μm and 0.4 μm, for example between 0.15 μm and 0.3 μm. For example, the coating may have a layer sequence,

For example, a layer sequence comprising a Ni layer, a Pd layer and / or an Au layer. For example, the layer sequence can be 0.5 μm-2.1 μm thick

Ni layer, an approximately 0.05 pm thick Pd layer and / or an approximately 0.01 pm thick Au layer.

The lead frame 12 may, for example, in a

Be embedded molding material 14. The molding material 14 may comprise, for example, epoxy, silicone or a hybrid of epoxy and / or silicone. The material of the molding material 14 may, for example, be white and / or be particularly stable and / or resistant to the electromagnetic radiation generated by the optoelectronic component, for example radiation-resistant and / or heat-resistant. Of the

Molding material 14 has a receiving recess 15 in which the receiving area 16 and the contact area 18 are exposed. It is also located between the first

Lead frame section 17 and the second

Lead frame portion 19 molding material 14, the first lead frame portion 17 relative to the second

Lead frame section 19 electrically isolated. The housing 2 has, for example, at the end faces 10, 11 contact portions 22. The contact portions 22 may alternatively be arranged spaced from the end faces 10, 11. In the contact portions 22 are the

Lead frame 12, for example, the first

Lead frame section 17 and / or the second

Lead frame portion 19, and / or the molding material 14 tapers. In other words, the lead frame 12, for example, the first lead frame portion 17 and / or the second lead frame portion 19, and / or the

Form material 14 in the contact portions 22 in the direction perpendicular to the second and / or third side 6, 8 of the housing 2 formed narrower than outside the

Contact sections 22. In addition, in the

Contact portions 22 of the mold material 14 narrower than the lead frame 12, for example, the first

Lead frame section 17 and / or the second

Lead frame portion 19, be formed. This can

For example, 22 terrace surfaces 20 are formed in the contact portions, which form at the first and second sides 6, 8 of the housing and at the first and second end faces 10, 11 terraces and / or steps.

For example, two are in each contact section

Terrace surfaces 20 formed, one at the first

6 of the housing 2 and one on the second side 8 of the housing. 2

FIG. 2 shows a fourth side 24 of the housing 2 according to FIG. 1, which faces away from the first side 4. At the fourth

Page 24, the second housing 2 may be formed, for example, completely planar and / or planar. In other words, the housing 2 has, for example, no terrace surfaces 20 on its fourth side 24. In contrast, on the fourth side 24 of the lead frame 12, for example, the first Leiterrahmabschnitt 17 and / or the second

Lead frame portion 19, flush with the mold material 14 may be formed. The housing 2 may have on the fourth side 24 a first electrically conductive region 26 and / or a second electrically conductive region 28, the first conductive region 26, for example, a rear side of the

Receiving area 16 and / or the second conductive area 28 may be, for example, a back of the contact area 18. Alternatively, the housing 2 may be completely covered on its fourth side 24 except for the contact portions 22 with molding material 14. For example, the electrically conductive regions 26, 28 are electrically isolated in an additional process step.

FIG. 3 shows a view of the second side 6 of the housing 2 according to FIG. 1. The housing 2 may have separating surfaces 30 of the leadframe 12, for example the first leadframe section 17 or the second, on the second side 6

Lead frame portion 19, have. The lead frame 12 is not coated with the electrically conductive second material at the parting surfaces 30 of the lead frame 12.

For example, during a method for producing the housing 2, the leadframe 12 may be coated with the second material before the housing 2 is singulated, so that the separation surfaces 30 of the leadframe 12, upon which there is no second, arise during the subsequent singulation

Material is located, but the first material of the

Lead frame 12 is exposed. For example, the parting surfaces 30 of the lead frame 12 may be made rougher than the coated surfaces of the lead frame 12.

Furthermore, the molding material 14 on the second side 6 may have a separating surface 32 of the molding material 14, which likewise arises when the housing 2 is singulated. The parting surfaces 30 of the lead frame 12 and the parting surface 32 of the

Shaped material 14 may be formed flush, for example. Before the separation of the housing, the parting surfaces 30, 32 in the corresponding housing assembly, for example, represent transitions from a housing 2 to an adjacent housing 2.

4 shows a view of the third side 8 of the housing 2, which faces away from the second side 6. The third side 8 of the housing 2 may be designed, for example, substantially corresponding to the second side 6 of the housing 2.

FIG. 5A shows a view of the first end face 10 of FIG

Housing 2. At the first end face 10 of the housing 2 is an end face of the first lead frame portion 17th educated. At the front of the first

Lead frame portion 17 can be seen that the

Lead frame 12, for example, the first

Lead frame portion 17, in the contact portion 22nd

For example, may be U-shaped. For example, the first lead frame portion 17 in the

Contact portion 22 on a base portion 29, the

For example, a part of the first side of the lead frame 12, on which also the receiving area 16 and / or the

Contact area 18 are formed forms. Of the

Base portion 29 from, for example, two leg portions 31 extend to the fourth side 24 of the

Housing 2. The leg portions 31 may, for example, with the base portion 29 include a right angle and / or be formed perpendicular or at least substantially perpendicular to this.

For example, the first leadframe section 17 may not be coated on its front side and / or be free of the second material, since the housing 2 may be separated from an adjacent housing 2 when singulated from the housing assembly at the first end face 10, for example by means of cutting or sawing , Therefore, the lead frame 12 at the first end face 10, for example, one of

Have separating surfaces 30 of the lead frame 12, where the lead frame 12 is free of molding material, and / or the molding material 14 may at the first end face 10th

For example, have a further separation surface 32 of the molding material 14. The molding material 14 and the lead frame 12 may at the first end face 10 of the housing. 2

be designed, for example, flush.

FIG. 5B shows a view of the second end face 11 of the housing 2, which, for example, can essentially be designed correspondingly to the first end face 10. At the second end face 11, the second lead frame portion 19 in the contact portion 22, for example, U-shaped

may be formed and the first end face 10th correspondingly, for example, have a base portion 29 and two leg portions 31.

Fig. 6 shows an embodiment of a

Leadframe composite 33 during a method for

Producing a housing 2, for example of the im

Previous explained housing 2. The

Lead frame assembly 33 may, for example, several

Lead frame 12 for correspondingly have a plurality of housing 2.

The lead frames 12 may be connected to each other in the lead frame assembly 33, for example via first webs 36 and / or second webs 38. For example, the first webs 36 may connect the first leadframe sections 17 of adjacent leadframes 12. For example, the second webs 38, the first lead frame portions 17 of lead frame 12 with the second

Connecting lead frame sections 19 of adjacent lead frame 12.

In the lead frame composite 33, for example, free recesses 35 and / or contact recesses 34 may be formed. The lead frame assembly 33 may be formed by etching and / or stamping, for example. For example, the contact recesses 34 may be formed so that they have inner walls which extend in the direction perpendicular to the first side of the lead frame 12, ie in Fig. 6 in the plane, and / or are extruded. The lead frame composite 33 is coated with the second material. For example, the contact recesses 34 and / or their inner walls with the second material

coated. The extruded inner walls of the

Contact recesses can after separating the

Leg sections 31 of the lead frame sections 17, 19 form

In FIG. 6, first dividing lines 38 and second dividing lines 40 perpendicular thereto are shown in broken lines. The The first separating lines 38 intersect the second separating lines 40. The separating lines 38, 40 designate separating regions in which the individual lead frames 12 are separated and / or singulated when the housing 2 is separated from the housing composite. For example, when separating the housing 2, the leadframe composite 33 can be cut or sawn along the parting lines 38, 40. The contact recesses 34 may, for example, be formed and / or arranged such that they pass through the parting lines 38, 40

characterized separation areas at least partially

overlap. For example, the contact recesses 34 can overlap crossing points of the separating lines 38, 34. At the

Separating the leadframe 12 from the leadframe assembly 33 then each one of the contact recesses 34 is divided into four adjacent leadframe 12. In other words, after the separation, four housings 2 each have one segment of one of the contact recesses. Furthermore, after the separation of one of the lead frames 12, four segments of four corresponding contact recesses 34 may have. When separating the lead frames 12 along the parting lines 38, 40, the parting surfaces 30 may arise which are not coated. The inner walls of the contact recesses 34 are largely spaced from the dividing lines 38, 40 and remain intact when separated and are still coated with the second material. The in the contact sections

22 coated leadframe sections 17, 19, for example, the leg portions 31, then for electrical

Contact the housing 2 serve. Furthermore, the effect

Contact recesses 34 that the lead frame 12 are tapered after singulation in the contact portions 22. The contact recesses 34 can thus contribute to the

Form contact sections 22.

Fig. FIG. 7 shows a plan view of a housing composite 41, which may have, for example, the leadframe composite 33 according to FIG. 6, which is embedded, for example, in the molding material 14. The lead frame composite 33 can

For example, embedded in the molding material 14 such be that the receiving areas 16, the contact areas 18, the contact recesses 22 and / or the terrace surfaces 20 are free of molding material. For example, the

Form material 14 recesses 39 whose area is greater than that of the contact recesses 34 and the

Contact recesses 34 completely overlap, from which the terrace surfaces 20 can be formed. In the

Recesses 39 are the terrace surfaces 20 and the

Contact recesses 34 arranged.

When separating the housing 2 and thereby caused

Separate the lead frame 12, the lead frame portions 17, 19 are not cut or sawed in the formed by the contact recesses 34 contact portions 22, so that even after the separation in the contact portions 22, the second material to the corresponding

Lead frame sections 17, 19 is maintained. The

Contact recesses 34 and the recesses 39 may be formed in various embodiments at all crossing points of the dividing lines 38, 40, which may contribute, for example, that the lead frame sections 17, 19 are formed in the contact portions 22 U-shaped.

Fig. 8 shows a view of a first side 4 of a

Embodiment of a housing 2, for example, largely the previously explained in the housing 2

can correspond. For example, the housing 2

only on the second page 6, the exposed

Lead frame sections 17, 19 in the contact sections 22 and / or corresponding terrace surfaces 20 and / or is in the region of the third side 8 completely planar and / or flat.

9A shows a view of a first end face 10 of the housing 2 according to FIG. 8. The first leadframe section 17 may, for example, be L-shaped in the contact section 22 and / or a base section 29 and

only have a leg portion 31. Of the For example, base portion 29 may form part of the first side of lead frame 12. The leg portion 31 may, for example, include a 90 ° angle with the base portion 29 and / or may be perpendicular or substantially thereon. The first lead frame section 17 and the molding material 14 may, for example, at the first

End face 10 may be planar and / or flush.

FIG. 9B shows a view of the second end face 11 of the housing 2 according to FIG. 8, which, for example, largely corresponds to the first end face 10 of the housing 2

can be trained. For example, in the

Contact portion 22 on the second end face 11 of the second contact portion 19 L-shaped and / or has a base portion 29 and a leg portion 31.

10 shows a plan view of an exemplary embodiment of a housing assembly 41, which has a plurality of housings 2, for example housing 2 according to FIG. 8, during one

Method for producing the housing 2. In this

Housing composite 41, the contact recesses 34 and the second recesses 39 along the first dividing lines 38 formed only at each second crossing point. This causes that in the isolated cases 2 only on one side, for example, the second side 6, the

Lead frame sections 17, 19 in the contact portions 22, for example, the leg portions 31, exposed and coated with the second material. The

Contact recesses 34 and the recesses 39 may in various embodiments along the first or second dividing lines 38, 40 only on every second

Junction point be formed, which may for example contribute to the lead frame sections 17, 19 are formed in the contact portions 22 L-shaped.

FIG. 11 shows an exemplary embodiment of the housing 2 which for example largely corresponds to that shown in FIG

Embodiment of the housing 2 may correspond. For example, the receiving recess 15 may be arranged eccentrically, for example, closer to the third side 8 of the housing 2 than on the second side 6 of the housing 2. FIG. 12 shows an embodiment of an electronic assembly 46, for example, a housing 2 according to one of the above explained embodiments and / or an optoelectronic device 42 may have. The optoelectronic component 42 may, for example, be arranged in the receiving region 16 and / or electrically

be contacted. Furthermore, the optoelectronic

Component 42, for example in the contact area 18th

be electrically contacted, for example by means of a bonding wire 44th

FIG. 13A shows an exemplary embodiment of an electronic subassembly which may, for example, comprise the electronic subassembly 46 according to FIG. 12 and a printed circuit board 50. The printed circuit board 50 may, for example, conductor tracks 52

have, for example by means of a conductive

Connection 54, for example, a solder joint, with the lead frame portions 17, 19 of the housing 2 in the

Contact sections 22 mechanically and / or electrically

can be coupled. If the optoelectronic component 42 is a component emitting electromagnetic radiation, then the optoelectronic component 42 can radiate electromagnetic radiation 48 during operation, for example such that the electromagnetic radiation 48 is radiated substantially parallel to a surface of the printed circuit board 50. That the electromagnetic radiation 48 in the

May be substantially parallel to the surface of the printed circuit board 50, may mean, for example, that a main emission of the electromagnetic radiation 48, for example, parallel or at least substantially parallel to the conductor tracks 52 having surface of the circuit board 50. The main emission direction may, for example, correspond to a straight line perpendicular to an active, the electromagnetic radiation 48 emitting, surface of the optoelectronic device 42 is. Alternatively, the main emission direction may correspond to a direction of the electromagnetic radiation along an optical path along which the

electromagnetic radiation has the largest beam intensity.

FIG. 13B shows an exemplary embodiment of an electronic assembly 46, which for example can largely correspond to the electronic assembly 46 shown in FIG. 12 and / or FIG. 13A. In addition, for example, one, two, or more reflectors 56 may be arranged, for example, for reflecting the electromagnetic radiation 48

can contribute. For example, the electromagnetic radiation 48 may be bundled by means of the reflectors 56 and / or deflected away from the printed circuit board 50. The or the

Reflectors 56 may, for example, in the manner of a

be formed reflective film. For example, the reflective film may be arranged flat, parallel to the surface of the printed circuit board 50 on the printed circuit board 50. The reflective film may, for example, have a recess through which the housing 2 can protrude.

FIG. 14 shows a view of an exemplary embodiment of the first end face 10 of the housing 2, which, for example, can be designed substantially corresponding to the first end face 10 of one of the previously explained housing 2. The housing 2 is arranged, for example, on the conductor track 52 of the printed circuit board 50, wherein the solder is not shown in FIG. 14 for reasons of better depiction. On the fourth side 24 of the housing 2, the first leadframe section 17 has a cut surface 60, which is formed when the corresponding contact recess 34 is formed. The cut surface 60 is from the terrace surface 20

away. The cut surface 60 and the terrace surface 20 may be formed, for example, the same size.

The cut surface 60 and the terrace surface 20 both adjoin the side of the leg portion 31, that of the track 52 is facing. This side of the leg portion 31 and at least partially the cut surface 60 and the

Terrace surface 20 can when attaching and / or

Contact the housing 2 are wetted with solder. If the cutting surface 60 and the terrace surface 20 are formed equal size, so act when wetting with solder equal large Benet tion forces on both surfaces 20, 60. This causes a uniform alignment and / or balancing of the housing 2 relative to the circuit board 50. Further For example, the orientation of the housing 2 relative to the circuit board 50 may be predetermined by varying the sizes of the two surfaces 20, 60 relative to one another.

FIG. 15 shows a flow diagram of an embodiment of a method for producing housings for

Optoelectronic components, for example for producing one of the above-described housing 2, and / or an embodiment of a method for producing electronic assemblies, for example for producing one of the above-described electronic

Assemblies 46.

In a step S2, for example, a

Lead frame blank are provided, which is formed for example of a metal plate.

In a step S4, a lead frame composite can be produced, for example one of the above

illustrated lead frame assemblies 33. The lead frame assembly 33 can be made for example from the lead frame blank by means of etching and / or punching. Of the

Leadframe composite 33 may be in a single etch or

Punching process or in several etching or punching processes are produced. For example, the

Leadframe composite 33 are produced by a combination of one or more etching and / or stamping processes. In a step S6 contact recesses in the

Leadframe composite are made, for example, the contact recesses 34 in the lead frame assembly 33. The contact recesses 34 may be formed for example by means of etching or punching. For example, steps S4 and S6 may be performed in one step, for example, in an etching process or in one

Punching process. Alternatively, step S4

For example, in an etching process and the step S6 are performed in a stamping process. Alternatively, steps S4 and S6 may be performed sequentially

Punching process or in one and the same punching process are performed. The contact recesses 34 may be formed, for example, so that their inner walls are extruded and / or stretched perpendicular to the first side of the lead frame 12, whereby, for example, the

Leg portions 31 can be formed.

In a step S8, the ladder frame composite,

For example, the lead frame assembly 33, are coated, for example in a galvanic process.

For example, the lead frame composite 33 is metallized.

In step S8, the contact recesses 34 and their inner walls, and optionally the leg portions 31, are coated. The coating can contribute to the fact that the lead frames 12 can be easily and reliably electrically contacted on their coated surfaces,

for example, are solderable. In a step S10, the lead frame composite can be embedded, for example, the lead frame composite 33 can be embedded in the molding material 14. This can be the

Lead frame assembly 33 are inserted into a mold, which is a negative mold of the later housing composite

provides. The mold points when inlaid

Lead frame composite 33, for example, in the

Receiving areas 16 and in the contact areas 18 and in the area of the recesses 39 highlights and / or stamp so that these areas are free of molding material 14

stay. In the mold can then be liquid or

be supplied at least viscous molding material, which can be subsequently dried and / or cured. Subsequently, the housing composite comprising the lead frame composite 33, for example one of the housing assemblies 41 explained above, can be removed from the molding tool

be removed. In a step S12, optoelectronic components can be arranged in the housings 2 of the housing assembly 41, for example in each case one, two or more of the housings

The above explained optoelectronic components 42 per housing 2. The optoelectronic components 42 can be arranged for example in the receiving recesses 15 of the housing 2.

In a step S14, the housing 2 with the

optoelectronic components 42, so the electronic assemblies 46, from the housing assembly 41, are isolated, for example by means of cutting and / or sawing along the parting lines 38, 40th

Alternatively, the optoelectronic components 42 can also be arranged after the housing 2 has been singulated in the housings 2. In other words, step S14 may be executed before step S12.

Subsequently, the procedure can be ended. Alternatively, the optoelectronic components 42 may be embedded in a potting material before or after the singulation of the housing 2. For example, after arranging

and / or contacting the optoelectronic component 46, the receiving recess 15 are completely or partially filled with the potting material. The potting material may comprise, for example, silicone, TIO ₂ and / or a converter material for converting the electromagnetic radiation. The above-explained method can without the Arranging the optoelectronic component 42 as a method for producing housings 2 for optoelectronic

Components 42 are called. The above-explained method can be used with arranging the

Optoelectronic device 42 as a method for

Manufacture of electronic assemblies 46 may be referred to.

The invention is not limited to those specified

Embodiments limited. For example, 33 may be formed in all embodiments in the lead frame assemblies 33 more or fewer webs. Furthermore, the contact recesses 32 and / or the second

Recesses 39 be shaped differently, for example

circular, angular, for example rectangular, for example polygonal, for example, 5 or 6-angular. Further, in all embodiments, the receiving recesses 15 may be formed differently, for example, circular, rectangular or square. Furthermore, the leadframe sections 17, 19 may be U-shaped or L-shaped in all embodiments, and / or the leg sections 31 may have an acute or obtuse angle with the corresponding base sections 29. Furthermore, in the exemplary embodiments according to FIG. 1 and / or FIG. 8, the receiving recesses 15 can also be arranged eccentrically,

For example, near the second side 6 or near the third side 8. Further, in all embodiments, the receiving recesses 15 may be arranged eccentrically so that they are arranged closer to one of the end faces 10, 11 than the other of the end faces 10, 11. Further the lead frame sections 17, 19 may also be formed so that optoelectronic components 42 can be arranged, which have their two electrical contacts on the

Have top. Furthermore, each of the leadframes may comprise more than two leadframe sections 17, 19, for example one for arranging the optoelectronic devices and two for contacting the optoelectronic devices. Furthermore, the method for producing the housing 2 may comprise more or fewer steps.

Claims

claims

1. housing (2) for an optoelectronic component (42), with

- A lead frame (12) which is formed of an electrically conductive first material, which is coated with an electrically conductive second material and which has a first lead frame portion (17) and a second lead frame portion (19), the physically

are separated from each other, wherein on a first side of the

Lead frame (12) the first lead frame section (17) has a receiving region (16) for arranging the optoelectronic component (42) and the second lead frame section (19) has a contact region (18) for electrically contacting the optoelectronic component (42)

- A molding material (14), in which the lead frame (12) is embedded and on a first side (4) of the

Housing (2) has a receiving recess (15) in which the receiving area (16) and the contact area (18) are exposed,

wherein the first leadframe section (17) and the second leadframe section (19) for electrically contacting the corresponding leadframe section (17, 19) each have at least one contact section (22) in which the leadframe sections (17, 19) on a second side (6). of the housing (2) connected to the first side (4) of the

Housing (2) forms an edge of the housing (2) are exposed, in which the lead frame sections (17, 19) in

Direction perpendicular to the second side (6) of the housing (2) are tapered and in which the lead frame sections (17, 19) are coated with the second material.

2. Housing (2) according to claim 1, wherein the

Lead frame sections (17, 19) in the contact portions (22) on a second side opposite the third side (8) of the housing (2) exposed and coated with the second material.

3. Housing (2) according to any one of the preceding claims, wherein on the second and / or third side (6, 8) of the housing (2) separating surfaces (30) of the lead frame (12) are exposed, not with the second Material are coated.

4. housing (2) according to any one of the preceding claims, wherein the lead frame sections (17, 19) in the

Contact portions (22) are each formed in an L-shape, each having a base portion (29) and a respective leg portion (31) extending from the corresponding base portion (29), wherein the base portions (29) each a part of the first side of Forming the lead frame (12) and wherein the leg portions (31) on the second side (6) of the housing (2) are exposed and coated with the second material.

5. housing (2) according to any one of claims 2 or 3, wherein the lead frame portions (17, 19) in the contact portions (22) are each U-shaped, each having a base portion (29) and two leg portions

(31) extending from the respective base portions (29), wherein the base portions (29) each form part of the first side of the lead frame (12) and wherein in each contact portion (22) has a leg portion (31) on the second Side (6) of the housing (2) and a leg portion (31) on the third side (8) of the housing (2) are exposed and coated with the second material.

6. Housing (2) according to any one of claims 4 or 5, wherein at least one of the leg portions (31) on a fourth side (24) of the housing (2) has a cut surface (60) is formed and in which at the corresponding

Leg portion (31) facing away from the cut surface (60) a terrace surface (20) is formed and in which the cut surface (60) is the same size as the terrace surface (20).

7. An electronic assembly (46) comprising the housing (2) according to any one of the preceding claims and an optoelectronic component (42) which is arranged in the receiving region (16) and which is electrically contacted in the contact region (18).

8. The electronic assembly (46) according to claim 7, comprising a printed circuit board (50) having printed conductors (52) and on which the housing (2) is arranged so that the second side (6) of the housing (2) Printed circuit board (50) facing, wherein the contact portions (22) with the

Conductor tracks (52) are electrically coupled.

9. A method for producing housings (2) for

Optoelectronic components (42), in which:

providing a leadframe blank formed of an electrically conductive first material,

- From the lead frame blank, a lead frame composite (33) is produced, for each housing (2) a

Lead frame (12), wherein each lead frame (12) has a first lead frame portion (17) and a second lead frame portion (19), the physically

are separated, wherein on a first side of the lead frame (12) of the first lead frame portion (17) has a receiving area (16) for arranging the optoelectronic

Component (42) and the second leadframe portion (19) have a contact region (18) for electrically contacting the optoelectronic component (42),

- In the lead frame assembly (33) in separation areas, where the housing (2) to be separated from each other,

Contact recesses (34) are formed, which the

At least partially overlapping separation areas,

- The lead frame composite (33) is coated with an electrically conductive second material

- The coated lead frame composite (33) in one

Forming material (14) is embedded so that the

Forming material (14) on a first side (4) of the housing (2) has a receiving recess (15) in which the Receiving area (16) and the contact area (18) are exposed, and that the contact recesses (34) free of

Mold material (14) remain,

- The housing (2) are separated by the

Lead frame assembly (33) along the separation areas

is separated.

10. The method of claim 9, wherein the separation areas are arranged so that they are at crossing points

and in which the contact recesses (34) are formed at the crossing points.

11. The method according to any one of claims 9 or 10, wherein the contact recesses (39) are formed so that in the region of the edges of the contact recesses (34)

Material of the lead frame sections (17, 19) in the direction perpendicular to the first sides of the lead frames (12)

extends.

12. A method for producing electronic assemblies (46), wherein a housing (2) is produced according to one of the preceding claims and in which prior to the separation of the housing (2) in the housings (2) optoelectronic devices (42) in the corresponding Receiving areas (16) are arranged and contacted in the corresponding contact areas (18).

13. The method of claim 12, wherein the housing (2) on a printed circuit board (50), the conductor tracks (52), is arranged, that the second side of the housing (2) of the printed circuit board (50) faces, and where the

Contact portions (22) with the conductor tracks (52) are electrically coupled.