WO2014043850A1

WO2014043850A1 - Large-size display screen and manufacturing method thereof

Info

Publication number: WO2014043850A1
Application number: PCT/CN2012/081540
Authority: WO
Inventors: 余晓军; 魏鹏; 刘自鸿
Original assignee: 深圳市柔宇科技有限公司
Priority date: 2012-09-18
Filing date: 2012-09-18
Publication date: 2014-03-27
Also published as: CN103918021A; CN103918021B

Abstract

Disclosed are a large-size display screen and a manufacturing method thereof, wherein the large-size display screen comprises a front display plate (1) and a thin film transistor backplate (2). The thin film transistor backplate (2) is provided with row scanning lines (21, 71), column scanning lines (22, 72) and a thin film transistor array for driving the front display plate (1). The thin film transistor backplate (2) is formed by splicing together a plurality of thin film transistor backplate units (20), each of the thin film transistor backplate units (20) being provided with via holes (24) in one-to-one correspondence with the row scanning lines (21, 71) and the column scanning lines (22, 72). Both of the row scanning lines (21, 71) and the column scanning lines (22, 72) on each of the thin film transistor backplate units (20) spliced to one another lead to the back of the thin film transistor backplate (2) through the corresponding via holes (24) for electrical connection. The large-size display screen and the manufacturing method thereof avoid the occupation of the space at the front side of the display screen, realize seamless splicing of display screen units, reduce costs, increase the yield of good products and are suitable for mass production.

Description

Large-size display screen and manufacturing method thereof

Technical field

The invention belongs to the technical field of display, and in particular relates to a large-sized display screen and a manufacturing method thereof.

Background technique

At present, in the field of display technology, the demand for large-screen display is increasing day by day. In various display technologies such as PDP, LCD, and OLED technologies, the size of the display device itself is difficult to be large, so that at the same time, low cost and high yield are large. Screen displays are very difficult, which affects the development of high-performance, large-screen display technology, and limits the application of display technology in conference rooms, home theater, outdoor advertising and other fields.

In order to obtain a large-sized display screen, the prior art mostly adopts a splicing technique to directly splicing a plurality of display screens of an ultra-narrow bezel, but due to the existence of the row/column scanning driving circuit at the edge of the display screen, the "seamless" cannot be truly realized. splice.

In order to eliminate the splicing gap, another existing method is to use an optical lens array to enlarge the image to the framing screen frame area for seamless display, and the large use and precise alignment of the optical lens increases the manufacturing cost of the display. Moreover, the alignment of the optical lens necessarily has an error, which inevitably reduces the yield and makes the preparation process of the large-sized display device more complicated.

technical problem

SUMMARY OF THE INVENTION An object of the present invention is to provide a large-sized display screen which aims to solve the problem of a large splicing gap of a conventional large-sized display screen, and to control manufacturing cost and improve yield.

Technical solution

The present invention is achieved in that a large-sized display screen includes a display front panel and a thin film transistor backplane, and the thin film transistor backplane is provided with a row scan line, a column scan line, and a thin film for driving the display front panel. a transistor array, wherein the thin film transistor backplane is formed by splicing a plurality of thin film transistor backplane units, and each of the thin film transistor backplane units is provided with a via hole corresponding to the row scan line and the column scan line. ;

The row scan lines and the column scan lines on each of the thin film transistor backplane units spliced to each other are respectively led to the back of the thin film transistor backplane through the corresponding via holes and electrically connected.

Another object of the present invention is to provide a method of manufacturing a large-sized display screen comprising the following steps:

Preparing a thin film transistor backplane unit with row scan lines and column scan lines to be spliced, and opening via holes corresponding to the row scan lines and the column scan lines at the splicing edges of the thin film transistor back panel unit;

Leading the row scan line and the column scan line to the back of the thin film transistor backplane unit through corresponding via holes;

And electrically connecting the row scan lines and the column scan lines of the pre-stitched thin film transistor backplane unit to the back of the thin film transistor backplane unit to obtain a spliced thin film transistor backplane;

A display front panel of a single structure is obtained, and the display front panel and the thin film transistor back panel are assembled to form a large-sized display screen.

It is still another object of the present invention to provide another method of manufacturing a large size display screen comprising the steps of:

Forming a thin film transistor backplane unit with a row scan line and a column scan line, and forming a via hole corresponding to the row scan line and the column scan line at a splice edge of the thin film transistor back panel unit;

Obtaining a display front panel unit, and assembling the display front panel unit and the thin film transistor back panel unit into a display unit body;

The row scan lines and the column scan lines of the pre-stitched display unit body are electrically connected to the back of the thin film transistor back panel unit, respectively, to form a large-sized display screen.

Beneficial effect

The invention provides a via hole on the thin film transistor back plate of the display screen, and leads the row scan line and the column scan line to the back of the thin film transistor back plate through the via hole, and electrically connects on the back thereof to avoid occupying the thin film transistor. The space on the front side of the backplane eliminates the splicing gap caused by the row and column scanning circuits, thereby achieving seamless splicing of large-size displays. Moreover, the complexity and cost of the manufacturing method are effectively controlled, and the manufacturing process is simplified, the cost is reduced, and the influence of the lens alignment accuracy is avoided, compared with the conventional method of eliminating the splicing gap by using the optical lens system. This improves the yield of the product, which in turn increases production efficiency and is suitable for mass production.

DRAWINGS

1 is a cross-sectional view showing a first structure of a large-sized display screen according to a first embodiment of the present invention;

2 is a perspective view of a thin film transistor back plate in a large-sized display screen according to a first embodiment of the present invention;

3 is a front view of a thin film transistor backplane and a pixel in a large-sized display screen according to a first embodiment of the present invention;

4 is a front elevational view of a thin film transistor backplane in a large-sized display screen according to a first embodiment of the present invention;

5 is a rear view of a thin film transistor back plate in a large-sized display screen according to a first embodiment of the present invention;

Figure 6 is a cross-sectional view showing a second structure of a large-sized display screen according to a first embodiment of the present invention;

Figure 7 is a cross-sectional view showing a third structure of the large-sized display screen according to the first embodiment of the present invention;

Figure 8 is a cross-sectional view showing a first structure of a large-sized display screen according to a second embodiment of the present invention;

9 is a perspective view of a support substrate and a thin film transistor backplane in a large-sized display screen according to a second embodiment of the present invention;

10 is a perspective view of a support substrate in a large-sized display screen according to a second embodiment of the present invention;

11 is a partial structural schematic view of a support substrate of the area A in FIG. 10;

Figure 12 is a cross-sectional view showing a second structure of a large-sized display screen according to a second embodiment of the present invention;

13 is a flow chart of a method for manufacturing a large-sized display screen according to a third embodiment of the present invention;

14 is a flow chart of a method of manufacturing a large-sized display screen according to a fourth embodiment of the present invention.

Embodiments of the invention

The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It is understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

The specific implementation of the present invention will be described in more detail below with reference to specific embodiments:

Embodiment 1:

1 is a cross-sectional view showing a large-sized display screen according to a first embodiment of the present invention, and FIG. 2 is a perspective view showing a thin film transistor back plate in the large-sized display screen, and FIG. 3 is a view showing the large-sized display screen. The top view of the thin film transistor backplane and the pixels, for convenience of explanation, only the parts related to the present embodiment are shown.

As shown in FIGS. 1 and 3, the large-sized display panel includes a front panel 1 and a thin film transistor backplane 2, and the thin film transistor backplane 2 is provided with a row scan line 21 and a column scan line 22 for driving the display front panel 1, and The array-type thin film transistor 23 shows that the front plate 1 includes the pixel 11 and the package substrate 12. The thin film transistor 23 is in one-to-one correspondence with the pixels 11 in the display front panel 1. Further, the thin film transistor backplane 2 is formed by splicing a plurality of thin film transistor backplane units 20.

Further in conjunction with FIGS. 2 and 3, in order to achieve seamless splicing, the present embodiment opens a plurality of vias 24 on each of the thin film transistor backplane units 20 (preferably near the splicing edges). The via hole 24 is in one-to-one correspondence with the row scanning line 21 and the column scanning line 22 on the thin film transistor back panel unit 20 on which it is located. Moreover, the conductive vias are filled in the via holes 24, such as highly conductive metals, and each of the row scan lines 21 and the column scan lines 22 are connected to the conductive medium in the corresponding via holes 24, thereby conducting electricity. The medium extends to the back of the thin film transistor backplane unit 20 and is electrically connected at the back.

4, 5, when the thin film transistor backplane unit is spliced, the first row of scan lines 211 on one thin film transistor backplane unit and the second row of scan lines 212 on the other thin film transistor backplane unit are respectively The corresponding first via hole 241 and the second via hole 242 are led out. At the back of the thin film transistor backplane unit 20, the conductive medium in the first via hole 241 and the second via hole 242 passes through the flexible wire 3 (row The wires are connected, and the anisotropic conductive adhesive 4 may be coated on the back of the two via holes, and then the two ends of the wire 3 are respectively connected to the two via holes by a flexible tape automatic connection (TAB). Anisotropic conductive adhesive 4 on it. In this way, the first row of scan lines 211 and the second row of scan lines 212 are electrically connected, and in the same manner, all of the row scan lines 21 that need to be electrically connected to each other can be connected, and the column scan lines 22 are connected. the same. Further, seamless splicing is achieved between each of the thin film transistor backplane units 20.

It should be noted that the display front panel 1 may be a large-size display front panel of a single piece, as shown in FIG. 7; or may be formed by splicing a plurality of display front panel units 10 like the thin film transistor backplane 2, and each display front panel The units each have a number of pixels and a package substrate, as shown in Figures 1, 6. No matter what type of display front panel is used, the width of the splicing slot is not significantly affected. The present invention can select the type of the front panel according to actual needs, and the embodiment does not need to be strictly limited. When the front panel of the splicing structure is used, each of the display front panel units 10 and the thin film transistor back panel unit 20 aligned therewith form a display unit body, and the large-sized display screen is considered to be formed by splicing a plurality of display unit bodies.

The large-size display screen provided in this embodiment guides the row scanning line 21 and the column scanning line 22 to the back of the back sheet of the thin film transistor through the via hole 24, and is connected at the back thereof through the flexible wire 3, so that the front side of the thin film transistor backplane is not required. The space truly realizes the seamless splicing of large-size displays. Moreover, compared with the conventional splicing screen, the large-sized display screen only increases the through-holes, which does not complicate the manufacturing process; and can be compared with the conventional display screen which uses the lens to cover the splicing gaps. To the extent that the cost is reduced, in addition, since the influence of the lens alignment accuracy is avoided, the yield can be effectively improved.

Further, in conjunction with FIG. 1, the package substrate 12 of the front panel 1 can be bonded by the encapsulant 5 and the thin film transistor backplane 2, and the vias 24 can be located inside the encapsulant 5, as shown in FIG. The outer side of the encapsulant 5, as shown in Fig. 6, is not necessarily limited in this embodiment.

Further, when the display front panel 1 adopts a splicing structure, a support plate 6 can also be covered on the outer side of the spliced display screen, and the support plate 6 is mainly used for carrying a plurality of display unit bodies to ensure the stability of the large-size display screen. The splicing makes the overall size of the large-sized display more beautiful and can be used as a package substrate at the same time. The support plate 6 can be located on the front side (image output side) of the display screen or on the back side of the display screen. When the front panel 1 is shown as a single-piece structure, the support panel 6 can also be omitted, on the one hand, the thickness of the display screen is reduced, and on the other hand, the process and manufacturing cost are saved.

It can be understood that the row scan line 21 and the column scan line 22 need to be connected to the driving module to control the operating state of the thin film transistor 23. As an implementation manner, for any one of the first row of scan lines 211 and the second row of scan lines 212 (FIG. 4) that are electrically connected, only one row scan driver module may be provided, and no spliced thin film transistor backplane is required. A separate line scan driving module is provided on the unit 20. For any set of electrically connected column scan lines, only one column scan drive module can be provided, and there is no need to provide a separate column scan drive module on each of the spliced thin film transistor backplane units 20. This can reduce the number of row scan driver modules and column scan driver modules, greatly simplify the circuit structure and driving method, and reduce the cost.

It can be understood that the display manner of the front panel 1 does not restrict the seamless splicing. The front panel 1 may be a liquid crystal panel or an OLED panel. Regardless of which panel is used, it usually includes a light-emitting component, and a color filter (which is not shown in the figure, when the OLED panel is used, whether or not the color filter is disposed according to the type of light-emitting of the OLED) may be disposed. For a liquid crystal panel, the light emitting component is a liquid crystal layer, and for the OLED panel, the light emitting component is an OLED layer. The color filter may include an array of red, green, and blue color filter units, and each of the red, green, and blue color filter cells and a region of the alignment light-emitting component form a pixel 11 whose light-emitting state is corresponding to the thin film transistor. 23 control.

In summary, in the embodiment, the through-holes 24 are opened on the thin film transistor backplane unit 20, and the row and column scan lines are led from the vias 24 to the back of the thin film transistor backplane, and are electrically connected through the flexible wires 3 at the back thereof. The connection eliminates the need for space on the front of the display, enabling seamless splicing of large displays. At the same time, the manufacturing process and yield of the display screen have been improved and optimized, and the manufacturing cost is saved, which is suitable for mass production.

Embodiment 2:

Fig. 8 is a cross-sectional view showing a first structure of a large-sized display screen according to a second embodiment of the present invention, and for convenience of explanation, only parts related to the present embodiment are shown.

The basic structure of the large-size display screen provided in this embodiment is similar to that described in the first embodiment. As shown in FIGS. 3 and 8, each includes a front panel 1 and a thin film transistor backplane 2 spliced by the thin film transistor backplane unit 20. The thin film transistor backplane 2 is provided with a row scanning line 21 and a column scanning line 22, and a thin film transistor 23 distributed in an array, and the thin film transistor 23 is in one-to-one correspondence with the pixels 11 in the display front panel 1. Each of the thin film transistor backplane units 20 is provided with a plurality of via holes 24, and the via holes 24 are in one-to-one correspondence with the row scan lines 21 and the column scan lines 22 on the thin film transistor back panel unit 20 on which they are located. Each of the row scan lines 21 and the column scan lines 22 are connected to the conductive medium in the corresponding via holes 24, and further extend to the back of the thin film transistor backplane 2 through the conductive medium. Different from the above-mentioned first embodiment, in the present embodiment, the connection manners of the row scanning line 21 and the column scanning line 22 are different. Referring specifically to FIGS. 9 and 10, the large-sized display screen of the present embodiment further includes a large-sized support substrate 7 having a lead structure, and the surface of the support substrate 7 with the lead structure is in contact with the back of the thin film transistor backplane 2.

Specifically, the lead structure includes a row scan lead 71 and a column scan lead 72. The row scan lead 71 is correspondingly disposed with the via hole 24 corresponding to the common scan line 21, and the column scan lead 72 has a via hole corresponding to the same scan line 22. 24 corresponding settings. Preferably, a terminal for facilitating electrical connection with the via hole 24, that is, the row scanning lead terminal 711 and the column scanning lead terminal 721 can be formed on the row scanning lead 71 and the column scanning lead 72, as shown in FIG. The conductive medium in the via hole 24 may be in in-situ contact with the row scan lead terminal 711 and the column scan lead terminal 721. In this way, as long as the support substrate 7 and the display panel are assembled in a good position, the corresponding row scan lines 21 on the plurality of display screens can be connected in series by a row scan lead 71, according to the same connection method. The corresponding column scan lines 22 on the plurality of display screens are connected in series by a column scan lead 72. Further, all the row and column scan lines are connected by all of the row scan leads 71 and the column scan leads 72, thereby achieving seamless splicing of the thin film transistor backplane 2.

The same as the first embodiment, the front panel 1 can be displayed in a large size display of the front panel, as shown in FIG. 12; or the plurality of display front panel units 10 can be spliced, as shown in FIG. limit.

In this embodiment, the row scanning lead 71 and the column scanning lead 72 may be distributed in various forms, and may be a regular vertical and horizontal arrangement as shown in FIG. 10, which is a preferred distribution mode, which is convenient for manufacturing and display list. Body stitching. In addition, the shape and arrangement of the leads may be irregular, as long as the vias 24 corresponding to the row scanning lines 21 are aligned with the row scanning leads 71, and the vias 24 corresponding to the column scanning lines 22 are By aligning the column scan leads 72, an effective connection of the row and column scan lines can be realized, and the shape and distribution form of the leads are not strictly limited.

As an improvement of the embodiment, for any set of electrically connected first row scan lines 211 and second row scan lines 212 (FIG. 4), only one row scan driving module may be provided, and no corresponding splicing unit is required. Set up a separate line scan driver module. For any set of electrically connected column scan lines, only one column scan drive module can be provided, and there is no need to provide a separate column scan drive module for each splicing unit. The row scan driving module and the column scan driving module may be disposed on the support substrate 7 or may be disposed on the display screen. In this way, the spliced large-size display screen is greatly simplified in circuit structure and driving mode, and the cost is correspondingly reduced.

Further, the structure of the display front panel 1 of the display panel in this embodiment may be the same as that of the first embodiment, that is, it may be a liquid crystal display or an OLED display, etc., and the driving principle of the front panel 1 is also the same. The foregoing embodiment 1 is the same, and details are not described herein again.

In addition, in this embodiment, since the support substrate 7 with the lead wire is used, the support substrate 7 can also have the same function as the support plate 6 in the first embodiment, that is, for carrying a plurality of display unit bodies, and ensuring a large size. Stable splicing of the display. Of course, another support plate can also be placed above the display front panel 1 to further protect the display screen. In summary, in this embodiment, the row and column scan lines are led to the back of the thin film transistor backplane through the via holes 24, and the support substrate 7 with the row and column scan leads is butted on the back, and the row and column scan leads are The row and column scan lines are connected in series to achieve seamless splicing of the display screen. In addition, compared with the conventional display, the large-size display also controls the manufacturing cost and the complexity of the manufacturing process, and improves the yield, which is suitable for mass production.

The manufacturing method of the above large-size display screen will be described below by way of a specific embodiment:

Embodiment 3:

Fig. 13 is a flow chart showing a method of manufacturing a large-sized display screen according to a third embodiment of the present invention, and for convenience of explanation, only parts related to the present embodiment are shown.

The method mainly includes the following steps:

In step S301, a thin film transistor backplane unit with row scan lines and column scan lines to be spliced is prepared, and via holes corresponding to the row scan lines and the column scan lines are formed at the splicing edges of the thin film transistor back panel unit. ;

In step S302, the row scan line and the column scan line are led to the back of the thin film transistor backplane unit through the corresponding via holes;

In step S303, the row scan lines and the column scan lines of the pre-spliced thin film transistor backplane unit are electrically connected to the back of the thin film transistor backplane unit, respectively, to obtain a spliced thin film transistor backplane;

In step S304, a display front panel of a single structure is obtained, and the display front panel and the thin film transistor backplane are assembled to form a large-sized display screen.

In the present embodiment, when the OLED display is employed, the display front panel 1 can be directly prepared on the thin film transistor backplane 2.

It can be understood that the order of performing steps S301-303 and step S304 is not strictly limited, and other preparation processes (such as preparing a row scan line, a column scan line on a thin film transistor backplane unit, preparing a display front panel, etc.) can be used. The technical process is carried out, and this embodiment is not strictly limited.

Further, as a preferred implementation manner of step S302, a conductive medium may be filled in the via hole, and the row scan line and the column scan line are connected to the conductive medium in the corresponding via hole, and the conductive medium is used. The scan lines and column scan lines are directed to the back of the thin film transistor backplane.

Further, as a preferred implementation manner of step S303, it can be implemented as follows:

First, a substrate is selected, and the thin film transistor back plate unit is placed on the substrate with the back facing up;

Then, the row scan lines and the column scan lines to be connected are respectively connected by wires on the back to realize splicing of the thin film transistor back panel unit.

Specifically, the connection of the row scan lines or the column scan lines can be realized by connecting the conductive medium in the via holes corresponding to the row scan lines and the column scan lines to be connected by using flexible wires.

Further, after the display screen is spliced, another large-size support plate can be assembled on the front or the back for further supporting and protecting the spliced large-sized display.

Further, after the display screen is spliced, a set of row scan driving modules and a set of column scan driving modules can be set, and then all the flexible wires connected to the row scanning lines are connected to the row scanning driving module, and all the columns are arranged. The flexible wires connected to the scan lines are connected to the column scan drive module. This can avoid the provision of a scan driving module on each of the thin film transistor backplane units, which simplifies the circuit structure and the driving method, and can reduce the cost.

As another preferred implementation of step S303, it can be implemented as follows:

First, a support substrate having a plurality of row scan leads and column scan leads is prepared such that the row scan leads correspond to the via holes corresponding to the row scan lines, so that the column scan leads are aligned with the via holes corresponding to the column scan lines. correspond;

Then, the thin film transistor backplane unit is aligned and assembled on the support substrate, and the conductive medium in the via hole is connected with the row scan lead and the column scan lead in a pair position to realize splicing of the thin film transistor backplane unit.

The structure of the support substrate may be as shown in FIG. 10, but is not limited to the structure shown in FIG. 10. For example, the shape of the row scan lead and the column scan lead does not have to have a regular shape as shown in FIG. 10, as long as the line scan line can be ensured. The via hole is aligned with the row scan lead, and the via hole corresponding to the column scan line is aligned with the column scan lead.

At this time, a row scan driving module and a set of column scan driving modules may be disposed on the support substrate, and the row scan lead and the column scan lead are respectively connected to the row scan driving module and the column scan driving module. Of course, the row scan driver module and the column scan driver module can also be disposed on the thin film transistor backplane. Regardless of where the row scan driver module and the column scan driver module are placed, only a single set needs to be provided, which simplifies the circuit structure and the driving method, and can reduce the cost.

The large-size display screen of the display front panel of the spliced structure of the thin film transistor back plate and the single structure can be obtained by the method of the embodiment, and the preparation method is performed by opening a via hole on the thin film transistor back plate unit, and scanning the line and The column scan lines are led to the back of the back sheet of the thin film transistor through the via holes, and are electrically connected through the flexible wires or the support substrate, thereby avoiding occupying the space on the front side of the display screen, and realizing the seamless splicing of the display screen. In addition, the method saves cost compared with the conventional method of eliminating stitching gaps by using a lens, simplifies the manufacturing process, and improves the yield rate, thereby greatly improving the production efficiency, and is suitable for batches of large-size displays. produce.

Embodiment 4:

Fig. 14 is a flow chart showing a method of manufacturing a large-sized display screen according to a fourth embodiment of the present invention, and for convenience of explanation, only parts related to the present embodiment are shown.

The method mainly includes the following steps:

In step S401, a thin film transistor backplane unit having a row scan line and a column scan line is prepared, and a via hole corresponding to the row scan line and the column scan line is formed at a splice edge of the thin film transistor back panel unit;

In step S402, the row scan lines and the column scan lines are led to the back of the thin film transistor backplane unit through the corresponding via holes;

In step S403, the display front panel unit is obtained, and the display front panel unit and the thin film transistor back panel unit are assembled into a display unit body;

In this embodiment, the manner of displaying the front panel unit is not strictly limited. In addition, when an OLED display is employed, the display front panel unit can be directly fabricated on the thin film transistor backplane unit.

In step S404, the row scan lines and the column scan lines of the pre-spliced display unit body are electrically connected to the back of the thin film transistor backplane unit, respectively, to form a large-sized display screen.

Further, as a preferred implementation manner of step S402, a conductive medium may be filled in the via hole, and the row scan line and the column scan line are connected to the conductive medium in the corresponding via hole, and the conductive medium is used. The scan lines and column scan lines are directed to the back of the thin film transistor backplane. Further, as a preferred implementation manner of step S404, it can be implemented as follows:

First, selecting a substrate, placing the pre-spliced display unit body on the substrate and placing the back side upward;

Then, the row scan lines and the column scan lines to be connected are respectively connected by wires to form a large-sized display screen.

As another preferred implementation of step S404, it can be implemented as follows:

Then, the display unit body is aligned and assembled on the support substrate, and the conductive medium in the via hole is connected with the row scan lead and the column scan lead in a one-to-one position to form a large-sized display screen.

In this embodiment, the setting positions of the line scan driving module and the column scanning driving module may be the same as those in the foregoing embodiment 3, and details are not described herein again.

The large-size display screen spliced by the display unit body can be obtained by the method of the embodiment. The preparation method also guides the row scan line and the column scan line through the via hole to the back of the thin film transistor back plate through the via hole. And through the flexible wire or the support substrate for electrical connection, the seamless integration of the display screen is realized. In addition, the method saves cost and improves production efficiency compared with the conventional method of eliminating stitching gaps by using a lens, and is suitable for mass production.

The above is only the preferred embodiment of the present invention, and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection of the present invention. Within the scope.

Claims

A large-sized display screen comprising a display front panel and a thin film transistor backplane, wherein the thin film transistor backplane is provided with a row scan line, a column scan line and a thin film transistor array for driving the display front panel, wherein The thin film transistor backplane is formed by splicing a plurality of thin film transistor backplane units, and each of the thin film transistor backplane units is provided with a via hole corresponding to the row scan line and the column scan line;

The row scan lines and the column scan lines on each of the thin film transistor backplane units spliced to each other are respectively led to the back of the thin film transistor backplane through the corresponding via holes and electrically connected.
The large-size display screen according to claim 1, wherein the via hole is filled with a conductive medium, and the row scan line and the column scan line are both connected to a conductive medium in a corresponding via hole;

The conductive medium in the via holes corresponding to the row scan lines or the column scan lines electrically connected to each other is electrically connected at the back of the thin film transistor back sheet.
The large-size display screen according to claim 2, wherein the conductive medium in the via holes corresponding to the mutually connected row scan lines or the column scan lines is conducted by wires on the back of the thin film transistor backplane. Electrical connection.
The large-size display screen according to claim 3, wherein all the wires electrically connected to the row scanning lines are connected to the same row scanning driving module;

All of the wires electrically connected to the column scan lines are connected to the same column of scan drive modules.
The large-size display screen of claim 2, further comprising a support substrate connected to the back of the thin film transistor backplane, wherein the support substrate is provided with:

a row scan lead, corresponding to the via hole corresponding to the row scan line;

a column scan lead corresponding to the via hole corresponding to the column scan line;

The conductive medium in the via holes corresponding to the row scan lines or the column scan lines electrically connected to each other is electrically connected to the back of the thin film transistor backplane through the row scan leads and the column scan leads, respectively.
A large-size display screen according to claim 5, wherein all of said row scan leads are connected to the same row of scan driving modules;

All of the column scan leads are connected to the same column of scan drive modules.
The large-size display screen according to claim 6, wherein the line scan driving module and the column scan driving module are disposed on the support substrate.
The large-size display screen according to claim 6, wherein the row scan driving module and the column scan driving module are disposed on the thin film transistor backplane.
The large-sized display screen according to any one of claims 1 to 8, wherein the display front panel has a single structure.
The large-size display screen according to any one of claims 1 to 8, wherein the display front panel is formed by splicing a plurality of display front panel units.
The large-size display screen according to claim 10, wherein said display front panel unit is disposed in a pair with said thin film transistor back panel unit, and each of said display front panel unit and alignment film is disposed The transistor substrate unit constitutes one display unit body.
A method of manufacturing a large-sized display screen, comprising the steps of:

Preparing a thin film transistor backplane unit with row scan lines and column scan lines to be spliced, and opening via holes corresponding to the row scan lines and the column scan lines at the splicing edges of the thin film transistor back panel unit;

Leading the row scan line and the column scan line to the back of the thin film transistor backplane unit through corresponding via holes;

And electrically connecting the row scan lines and the column scan lines of the pre-stitched thin film transistor backplane unit to the back of the thin film transistor backplane unit to obtain a spliced thin film transistor backplane;

A display front panel of a single structure is obtained, and the display front panel and the thin film transistor back panel are assembled to form a large-sized display screen.
The method according to claim 12, wherein the step of guiding the row scan lines and the column scan lines to the back of the thin film transistor backplane unit through corresponding via holes is specifically:

Filling the via hole with a conductive medium;

The row scan lines and the column scan lines are connected to the conductive medium in the corresponding via holes to direct the row scan lines and the column scan lines toward the back of the thin film transistor backplane.
The method according to claim 12 or 13, wherein the row scan lines and the column scan lines of the pre-spliced thin film transistor backplane unit are electrically connected to the back of the thin film transistor backplane unit, respectively. The steps of the spliced thin film transistor backplane are specifically as follows:

Selecting a substrate, placing the thin film transistor backplane unit on the substrate and placing the back side upward;

A row of scan lines and a column scan line to be connected are respectively connected by wires on the back to realize splicing of the thin film transistor backplane unit.
The method according to claim 13, wherein the row scan lines and the column scan lines of the pre-spliced thin film transistor backplane unit are electrically connected to the back of the thin film transistor backplane unit, respectively, to obtain a spliced The steps of the thin film transistor backplane are specifically as follows:

Preparing a support substrate having a plurality of row scan leads and column scan leads, the row scan leads being corresponding to via holes corresponding to the row scan lines, such that the column scan leads are scanned corresponding to the columns Corresponding vias of the line;

Aligning the thin film transistor backplane unit to the support substrate, and electrically connecting the conductive medium in the via hole to the row scan lead and the column scan lead to realize a thin film transistor backplane unit Splicing.
A method of manufacturing a large-sized display screen, comprising the steps of:

Forming a thin film transistor backplane unit with a row scan line and a column scan line, and forming a via hole corresponding to the row scan line and the column scan line at a splice edge of the thin film transistor back panel unit;

Leading the row scan line and the column scan line to the back of the thin film transistor backplane unit through corresponding via holes;

Obtaining a display front panel unit, and assembling the display front panel unit and the thin film transistor back panel unit into a display unit body;

The row scan lines and the column scan lines of the pre-stitched display unit body are electrically connected to the back of the thin film transistor back panel unit, respectively, to form a large-sized display screen.
The method according to claim 16, wherein the step of guiding the row scan lines and the column scan lines to the back of the thin film transistor backplane unit through corresponding via holes is specifically:

Filling the via hole with a conductive medium;

The row scan lines and the column scan lines are connected to the conductive medium in the corresponding via holes to direct the row scan lines and the column scan lines toward the back of the thin film transistor backplane.
The method according to claim 17 or 18, wherein the row scan lines and the column scan lines of the pre-spliced display unit body are electrically connected to the back of the thin film transistor backplane unit, respectively. The steps to form a large-size display are as follows:

Selecting a substrate, placing the pre-spliced display unit body on the substrate and placing the back side upward;

The row scan lines and the column scan lines to be connected are respectively connected by wires to form a large-sized display screen.
The method according to claim 17, wherein said row scan lines and column scan lines of said pre-spliced display unit body are electrically connected to each other at a back of said thin film transistor backplane unit to form a large The steps of the size display are as follows:

Preparing a support substrate having a plurality of row scan leads and column scan leads, the row scan leads being corresponding to via holes corresponding to the row scan lines, such that the column scan leads are scanned corresponding to the columns Corresponding vias of the line;

The display unit body is aligned and assembled on the support substrate, and the conductive medium in the via hole is connected to the row scan lead and the column scan lead in a pair to form a large-sized display screen.