WO2014034261A1 - Fuse - Google Patents

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Publication number
WO2014034261A1
WO2014034261A1 PCT/JP2013/068338 JP2013068338W WO2014034261A1 WO 2014034261 A1 WO2014034261 A1 WO 2014034261A1 JP 2013068338 W JP2013068338 W JP 2013068338W WO 2014034261 A1 WO2014034261 A1 WO 2014034261A1
Authority
WO
WIPO (PCT)
Prior art keywords
melting point
point metal
wiring
low melting
metal part
Prior art date
Application number
PCT/JP2013/068338
Other languages
French (fr)
Japanese (ja)
Inventor
番場　真一郎
酒井　範夫
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to JP2014532859A priority Critical patent/JPWO2014034261A1/en
Priority to KR1020157003463A priority patent/KR20150029028A/en
Priority to CN201380043450.2A priority patent/CN104584175A/en
Publication of WO2014034261A1 publication Critical patent/WO2014034261A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/044—General constructions or structure of low voltage fuses, i.e. below 1000 V, or of fuses where the applicable voltage is not specified
    • H01H85/045—General constructions or structure of low voltage fuses, i.e. below 1000 V, or of fuses where the applicable voltage is not specified cartridge type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/0039—Means for influencing the rupture process of the fusible element
    • H01H85/0047—Heating means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/05—Component parts thereof
    • H01H85/055—Fusible members
    • H01H85/08—Fusible members characterised by the shape or form of the fusible member
    • H01H85/11—Fusible members characterised by the shape or form of the fusible member with applied local area of a metal which, on melting, forms a eutectic with the main material of the fusible member, i.e. M-effect devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/46—Circuit arrangements not adapted to a particular application of the protective device
    • H01H85/463—Circuit arrangements not adapted to a particular application of the protective device with printed circuit fuse
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/05—Component parts thereof
    • H01H85/055—Fusible members
    • H01H85/08—Fusible members characterised by the shape or form of the fusible member
    • H01H85/10—Fusible members characterised by the shape or form of the fusible member with constriction for localised fusing

Definitions

  • the present invention relates to a fuse.
  • Patent Document 1 describes a fuse element in which a low-melting-point metal is attached to a fused part of a wiring as an example of a fuse element.
  • a fuse element in which a low-melting-point metal is attached to a fused part of a wiring as an example of a fuse element.
  • An object of the present invention is to provide a fuse capable of reliably interrupting an overcurrent.
  • the fuse according to the present invention includes an insulating substrate, wiring, a low melting point metal part, and a heating element.
  • the wiring is arranged on one main surface of the insulating substrate.
  • the low melting point metal part is provided on the wiring.
  • the low melting point metal part has a lower melting point than the wiring.
  • the low melting point metal part dissolves the wiring when it becomes a melt.
  • the heating element heats the low melting point metal part. In plan view, the heating element is provided on the other side of the one end in the direction in which the wiring extends in the region where the low melting point metal portion is disposed.
  • the heating element in the plan view, has the low melting point metal portion from the other side than the one end portion in the extending direction of the wiring in the region where the low melting point metal portion is arranged. It is provided over the other side rather than the other side end in the extending direction of the wiring in the arranged region.
  • the wiring includes a fused part and a non-fused part.
  • the fusing part is relatively easily blown by melting in the melt of the low melting point metal part.
  • the non-blown part is located on one side of the fused part in the direction in which the wiring extends.
  • the non-blown part is relatively difficult to blow.
  • the heating element is arranged so as not to overlap the fusing part.
  • the fusing portion is made of a metal having a relatively high melting rate with respect to the melt of the low melting point metal portion.
  • the unmelted portion is made of a metal having a relatively low dissolution rate with respect to the melt of the low melting point metal portion.
  • the fusing part includes at least one of Au and Ag.
  • the non-blown part includes at least one of Cu, Pb, Ni, and Pt.
  • the fused part is narrower than the non-fused part.
  • the fused part is thinner than the non-fused part.
  • the fuse further includes a liquid repellent portion.
  • the liquid repellent portion is provided on one main surface of the insulating substrate on one side in the wiring extending direction with respect to the low melting point metal portion.
  • the liquid repellent part repels the melt of the low melting point metal part.
  • the heating element is provided on one main surface of the substrate or inside the substrate.
  • the fuse further includes an insulating layer that insulates the wiring from the low melting point metal part.
  • the low melting point metal portion is mainly composed of Sn.
  • FIG. 1 is a schematic cross-sectional view of a fuse in the first embodiment.
  • FIG. 2 is a schematic cross-sectional view of a fuse in the second embodiment.
  • FIG. 3 is a schematic plan view of a fuse in the second embodiment.
  • FIG. 4 is a schematic cross-sectional view of a fuse in the third embodiment.
  • FIG. 5 is a schematic cross-sectional view of a fuse in the fourth embodiment.
  • FIG. 6 is a schematic cross-sectional view of a fuse in the fifth embodiment.
  • FIG. 1 is a schematic cross-sectional view of a fuse in the first embodiment.
  • the fuse 1 shown in FIG. 1 may be a passive element that automatically disconnects the wiring 11 when an overcurrent occurs in the wiring 11 described later, or detects the overcurrent and actively connects the wiring 11. It may be an active element that cuts off.
  • the fuse 1 includes an insulating substrate 10.
  • the insulating substrate 10 can be constituted by, for example, a ceramic substrate such as an alumina substrate, a resin substrate, or the like.
  • the insulating substrate 10 may be a multilayer substrate having wiring inside.
  • wiring 11 is arranged on the first main surface 10 a of the insulating substrate 10.
  • One end of the wiring 11 is connected to a terminal electrode 13 disposed on the second main surface 10 b by a via hole electrode 12.
  • the other end of the wiring 11 is connected to a terminal electrode 15 disposed on the second main surface 10b by a via hole electrode 14.
  • the wiring 11 has a fusing part 11a and a non-fusing part 11b.
  • the fusing part 11 a is a part that is relatively easily melted by melting in the melt of the low melting point metal part 20, and the non-melting part 11 b is relatively melted by melting in the melt of the low melting point metal part 20. It is a part that is difficult to melt.
  • the fusing part 11a is made of a metal having a relatively high dissolution rate with respect to the melt of the low melting point metal part 20, and the non-melting part 11b is with respect to the melt of the low melting point metal part 20. It consists of a metal with a relatively low dissolution rate. More specifically, in the present embodiment, the fusing part 11a includes at least one of Au and Ag. It is preferable that the fusing part 11a is comprised with the alloy containing at least one of Ag, Au, or Ag and Au. In the present embodiment, the non-blown part 11b includes at least one of Cu, Pd, Ni, and Pt. The non-blown part 11b is preferably made of Cu, Pd, Ni, Pt, or an alloy containing at least one of Cu, Pd, Ni, and Pt.
  • the low melting point metal part 20 is arranged on the wiring 11.
  • the low melting point metal portion 20 has a melting point lower than that of the wiring 11 and is made of a low melting point metal that melts the wiring 11 when it becomes a melt.
  • Specific examples of such low melting point metals include Sn alloys such as SnSb, SnCu, SnAg, SnAgCu, SnCuNi.
  • an insulating layer 21 is disposed between the low melting point metal part 20 and the wiring 11.
  • the insulating layer 21 electrically insulates the wiring 11 from the low melting point metal part 20.
  • the terminal electrode 13 and the terminal electrode 15 are electrically connected by the via-hole electrodes 12 and 14 and the wiring 11, and no current flows through the low melting point metal part 20. Therefore, the wiring 11 tends to generate heat when an overcurrent occurs. Therefore, the fuse function of the fuse 1 is likely to be activated.
  • the insulating layer 21 can electrically insulate the low melting point metal part 20 and the wiring 11 and can be removed by melting in the melt of the low melting point metal part 20 or volatilizing when the melt is generated. It is preferable that The insulating layer 21 can be made of, for example, rosin flux, organic acid flux, or the like.
  • the fuse 1 is provided with a heating element 30 for heating the low melting point metal part 20. Therefore, the fuse 1 can function as a passive element or an active element.
  • the heating element 30 can be constituted by, for example, a resistance heating element.
  • the heating element 30 is disposed on the second main surface 10 b of the insulating substrate 10.
  • the heating element 30 may be electrically connected to the terminal electrode 13 and the terminal electrode 15, for example. In that case, when an overcurrent flows through the wiring 11, the overcurrent also flows through the heating element 30 and the heating element 30 generates heat.
  • the wiring 11 and the low melting point metal part 20 are covered with a sealing member 50 disposed on the insulating substrate 10.
  • the fuse function of fuse 1 is expressed as follows.
  • an overcurrent flows through the fuse 1, the wiring 11 generates heat.
  • an overcurrent is detected by a detection mechanism (not shown), current is supplied to the heating element 30 and the heating element 30 generates heat.
  • the low melting point metal part 20 is melted and a melt of the low melting point metal part 20 is generated.
  • the wiring 11 is cut and the terminal electrode 13 and the terminal electrode 15 are electrically insulated.
  • the fusing part 11 a is preferentially blown out of the wiring 11. Even after the melted part 11a is melted, at least a part of the non-fused part 11b remains.
  • the melt of the low melting point metal part is conductive. For this reason, if the melt of the low melting point metal portion connects the remaining portions of the wiring, the fuse function does not appear.
  • one end portion of the heating element 30 is provided so as to overlap a part of the low melting point metal portion 20 and the other end portion when the insulating substrate 10 is viewed in plan. .
  • the center of the heating element 30 in the x-axis direction which is the direction in which the wiring material 11 extends, is located on the x2 side of the center of the low melting point metal part 20 in the x-axis direction.
  • the heating element 30 is provided on the x2 side from the x1 side end in the x-axis direction, which is the direction in which the wiring member 11 extends, in the region where the low melting point metal part 20 is disposed. Therefore, since the melt of the low melting point metal part 20 flows toward a region where the temperature is higher, the melt of the low melting point metal part 20 tends to flow toward the x2 side. Therefore, the fuse function is surely exhibited and the overcurrent can be reliably interrupted.
  • the heating element 30 is, in plan view, the x2-side from the x1-side end of the region where the low-melting-point metal part 20 is disposed. Therefore, it is more preferable that the low melting point metal portion 20 is provided over the x2 side rather than the x2 side end portion in the x-axis direction of the region where the low melting point metal portion 20 is disposed. Furthermore, it is preferable that the heating element 30 is arranged so as not to overlap the fusing part 11a in plan view. It is preferable that the heat generating body 30 is arranged on the x2 side from the fusing part 11a. Furthermore, the heating element 30 is preferably located on the x2 side with respect to the low melting point metal part 20.
  • a liquid repellent part 40 is provided on the insulating substrate 10 on the x 1 side in the x-axis direction with respect to the low melting point metal part 20.
  • the liquid repellent part 40 repels the melt of the low melting point metal part 20. For this reason, the melt of the low melting point metal part 20 is repelled to the x2 side by the liquid repellent part 40 and moves more smoothly to the x2 side.
  • the liquid repellent portion 40 is preferably provided across the wiring 11 in the width direction of the wiring 11.
  • the liquid repellent part 40 can be comprised by resin materials, such as glass materials, such as a borosilicate type glass, and an epoxy resin, for example. “Repel the melt” means that the contact angle is 90 ° or more.
  • the fuse 1 of this embodiment exists as a single element, the fuse of the present invention may be incorporated in an electronic component.
  • the fuse of the present invention may be integrated with a wiring board of an electronic component.
  • FIG. 2 is a schematic cross-sectional view of a fuse in the second embodiment.
  • FIG. 3 is a schematic plan view of a fuse in the second embodiment.
  • FIG. 4 is a schematic cross-sectional view of a fuse in the third embodiment. In FIG. 3, drawing of the sealing member is omitted.
  • the wiring 11 is composed of a single layer.
  • the fusing part 11a is provided narrower than the non-fusing part 11b.
  • the fusing part 11a is provided thinner than the non-fusing part 11b. Even in these cases, the melted part 11a is more easily melted into the melt of the low melting point metal part 20 than the non-fused part 11b.
  • the wiring 11 is a single layer and does not have to have a narrow part or a thin part.
  • the fusing part 11a of the wiring 11 is a part on which the low melting point metal part 20 is provided.
  • the heating element 30 is located on the x2 side of the low melting point metal part 20 in plan view.
  • FIG. 5 is a schematic cross-sectional view of a fuse in the fourth embodiment.
  • FIG. 6 is a schematic cross-sectional view of a fuse in the fifth embodiment.
  • the heating element 30 is provided on the first main surface 10 a of the insulating substrate 10.
  • the low melting point metal part 20 and the heating element 30 are insulated by the insulating layer 60.
  • the heating element 30 is provided inside the insulating substrate 10. In these cases, the heat of the heating element 30 is more easily supplied to the low melting point metal part 20 than when the heating element 30 is provided on the second main surface 10b. Therefore, the wiring 11 is easily melted.

Abstract

Provided is a fuse which can reliably cut off overcurrent. A fuse (1) is provided with an insulating substrate (10), wiring (11), a low melting point metal part (20), and a heating element (30). The wiring (11) is arranged on one main surface (10a) of the insulating substrate (10). The low melting point metal part (20) is disposed on the wiring (11). The low melting point metal part (20) has a lower melting point than the wiring (11). The low melting point metal part (20) dissolves the wiring (11) when the low melting point metal part (20) turns into melt. The heating element (30) heats the low melting point metal part (20). In planar view, the heating element (30) is disposed further towards one side of a region on which the low melting point metal part (20) is arranged than the edge of the other side in the direction in which the wiring (11) extends.

Description

ヒューズfuse
　本発明は、ヒューズに関する。 The present invention relates to a fuse.
　従来、電子部品に対してヒューズエレメントを接続し、過電流から電子部品を保護する試みがなされている。例えば、特許文献１には、ヒューズエレメントの一例として、配線の溶断部に低融点金属が付着したヒューズエレメントが記載されている。このヒューズエレメントに過電流が流れると、低融点金属が溶融し、低融点金属の融液が形成される。この低融点金属の融液に溶断部が溶解することにより溶断部が溶断される。その結果、過電流が遮断される。 Conventionally, attempts have been made to protect electronic components from overcurrent by connecting fuse elements to the electronic components. For example, Patent Document 1 describes a fuse element in which a low-melting-point metal is attached to a fused part of a wiring as an example of a fuse element. When an overcurrent flows through the fuse element, the low melting point metal melts and a low melting point metal melt is formed. The melted portion is melted by dissolving the melted portion in the melt of the low melting point metal. As a result, the overcurrent is cut off.
特開２００９－９９３７２号公報JP 2009-99372 A
　しかしながら、特許文献１に記載のヒューズエレメントでは、過電流を確実に遮断できない場合があるという問題がある。 However, the fuse element described in Patent Document 1 has a problem that the overcurrent may not be cut off reliably.
　本発明の目的は、過電流を確実に遮断できるヒューズを提供することにある。 An object of the present invention is to provide a fuse capable of reliably interrupting an overcurrent.
　本発明に係るヒューズは、絶縁性基板と、配線と、低融点金属部と、発熱体とを備える。配線は、絶縁性基板の一主面上に配されている。低融点金属部は、配線の上に設けられている。低融点金属部は、配線よりも低い融点を有する。低融点金属部は、融液となった際に配線を溶解させる。発熱体は、低融点金属部を加熱する。平面視において、発熱体は、低融点金属部が配された領域の配線の延びる方向における一方側端部よりも他方側に設けられている。 The fuse according to the present invention includes an insulating substrate, wiring, a low melting point metal part, and a heating element. The wiring is arranged on one main surface of the insulating substrate. The low melting point metal part is provided on the wiring. The low melting point metal part has a lower melting point than the wiring. The low melting point metal part dissolves the wiring when it becomes a melt. The heating element heats the low melting point metal part. In plan view, the heating element is provided on the other side of the one end in the direction in which the wiring extends in the region where the low melting point metal portion is disposed.
　本発明に係るヒューズのある特定の局面では、平面視において、発熱体は、低融点金属部が配された領域の配線の延びる方向における一方側端部よりも他方側から、低融点金属部が配された領域の配線の延びる方向における他方側端部よりも他方側にわたって設けられている。 In a specific aspect of the fuse according to the present invention, in the plan view, the heating element has the low melting point metal portion from the other side than the one end portion in the extending direction of the wiring in the region where the low melting point metal portion is arranged. It is provided over the other side rather than the other side end in the extending direction of the wiring in the arranged region.
　本発明に係るヒューズの別の特定の局面では、配線は、溶断部と、非溶断部とを含む。溶断部は、低融点金属部の融液に融解することにより相対的に溶断されやすい。非溶断部は、配線の延びる方向において溶断部の一方側に位置している。非溶断部は、相対的に溶断されにくい。平面視において、発熱体が、溶断部と重ならないように配されている。 In another specific aspect of the fuse according to the present invention, the wiring includes a fused part and a non-fused part. The fusing part is relatively easily blown by melting in the melt of the low melting point metal part. The non-blown part is located on one side of the fused part in the direction in which the wiring extends. The non-blown part is relatively difficult to blow. In a plan view, the heating element is arranged so as not to overlap the fusing part.
　本発明に係るヒューズの他の特定の局面では、溶断部は、低融点金属部の融液に対する溶解速度が相対的に高い金属からなる。非溶断部は、低融点金属部の融液に対する溶解速度が相対的に低い金属からなる。 In another specific aspect of the fuse according to the present invention, the fusing portion is made of a metal having a relatively high melting rate with respect to the melt of the low melting point metal portion. The unmelted portion is made of a metal having a relatively low dissolution rate with respect to the melt of the low melting point metal portion.
　本発明に係るヒューズのさらに他の特定の局面では、溶断部がＡｕ及びＡｇの少なくとも一方を含む。非溶断部がＣｕ、Ｐｂ、Ｎｉ及びＰｔのうちの少なくとも一種を含む。 In yet another specific aspect of the fuse according to the present invention, the fusing part includes at least one of Au and Ag. The non-blown part includes at least one of Cu, Pb, Ni, and Pt.
　本発明に係るヒューズのさらに別の特定の局面では、溶断部は、非溶断部よりも幅狭である。 In yet another specific aspect of the fuse according to the present invention, the fused part is narrower than the non-fused part.
　本発明に係るヒューズのまた他の特定の局面では、溶断部は、非溶断部よりも薄い。 In another specific aspect of the fuse according to the present invention, the fused part is thinner than the non-fused part.
　本発明に係るヒューズのまた別の特定の局面では、ヒューズは、撥液部をさらに備える。撥液部は、絶縁性基板の一主面上において、低融点金属部に対して、配線の延びる方向の一方側に設けられている。撥液部は、低融点金属部の融液をはじく。 In another specific aspect of the fuse according to the present invention, the fuse further includes a liquid repellent portion. The liquid repellent portion is provided on one main surface of the insulating substrate on one side in the wiring extending direction with respect to the low melting point metal portion. The liquid repellent part repels the melt of the low melting point metal part.
　本発明に係るヒューズのさらにまた他の特定の局面では、発熱体は、基板の一主面上または基板の内部に設けられている。 In yet another specific aspect of the fuse according to the present invention, the heating element is provided on one main surface of the substrate or inside the substrate.
　本発明に係るヒューズのさらにまた別の特定の局面では、ヒューズは、配線と低融点金属部とを絶縁する絶縁層をさらに備える。 In yet another specific aspect of the fuse according to the present invention, the fuse further includes an insulating layer that insulates the wiring from the low melting point metal part.
　本発明に係るヒューズのまたさらに他の特定の局面では、低融点金属部は、Ｓｎを主成分とする。 In yet another specific aspect of the fuse according to the present invention, the low melting point metal portion is mainly composed of Sn.
　本発明によれば、過電流を確実に遮断できるヒューズを提供することができる。 According to the present invention, it is possible to provide a fuse capable of reliably interrupting overcurrent.
図１は、第１の実施形態におけるヒューズの略図的断面図である。FIG. 1 is a schematic cross-sectional view of a fuse in the first embodiment. 図２は、第２の実施形態におけるヒューズの略図的断面図である。FIG. 2 is a schematic cross-sectional view of a fuse in the second embodiment. 図３は、第２の実施形態におけるヒューズの略図的平面図である。FIG. 3 is a schematic plan view of a fuse in the second embodiment. 図４は、第３の実施形態におけるヒューズの略図的断面図である。FIG. 4 is a schematic cross-sectional view of a fuse in the third embodiment. 図５は、第４の実施形態におけるヒューズの略図的断面図である。FIG. 5 is a schematic cross-sectional view of a fuse in the fourth embodiment. 図６は、第５の実施形態におけるヒューズの略図的断面図である。FIG. 6 is a schematic cross-sectional view of a fuse in the fifth embodiment.
　以下、本発明を実施した好ましい形態の一例について説明する。但し、下記の実施形態は、単なる例示である。本発明は、下記の実施形態に何ら限定されない。 Hereinafter, an example of a preferable embodiment in which the present invention is implemented will be described. However, the following embodiment is merely an example. The present invention is not limited to the following embodiments.
　また、実施形態等において参照する各図面において、実質的に同一の機能を有する部材は同一の符号で参照することとする。また、実施形態等において参照する図面は、模式的に記載されたものである。図面に描画された物体の寸法の比率などは、現実の物体の寸法の比率などとは異なる場合がある。図面相互間においても、物体の寸法比率等が異なる場合がある。具体的な物体の寸法比率等は、以下の説明を参酌して判断されるべきである。 In each drawing referred to in the embodiment and the like, members having substantially the same function are referred to by the same reference numerals. The drawings referred to in the embodiments and the like are schematically described. A ratio of dimensions of an object drawn in a drawing may be different from a ratio of dimensions of an actual object. The dimensional ratio of the object may be different between the drawings. The specific dimensional ratio of the object should be determined in consideration of the following description.
　（第１の実施形態）
　図１は、第１の実施形態におけるヒューズの略図的断面図である。 (First embodiment)
FIG. 1 is a schematic cross-sectional view of a fuse in the first embodiment.
　図１に示されるヒューズ１は、後述する配線１１に過電流が生じた際に配線１１が自動的に切断される受動素子であってもよいし、過電流を検知し、能動的に配線１１を切断する能動素子であってもよい。 The fuse 1 shown in FIG. 1 may be a passive element that automatically disconnects the wiring 11 when an overcurrent occurs in the wiring 11 described later, or detects the overcurrent and actively connects the wiring 11. It may be an active element that cuts off.
　ヒューズ１は、絶縁性基板１０を備えている。絶縁性基板１０は、例えば、アルミナ基板などのセラミック基板や樹脂基板等により構成することができる。絶縁性基板１０は、内部に配線を有する多層基板であってもよい。 The fuse 1 includes an insulating substrate 10. The insulating substrate 10 can be constituted by, for example, a ceramic substrate such as an alumina substrate, a resin substrate, or the like. The insulating substrate 10 may be a multilayer substrate having wiring inside.
　絶縁性基板１０の第１の主面１０ａの上には、配線１１が配されている。配線１１の一方側端部は、ビアホール電極１２によって第２の主面１０ｂの上に配された端子電極１３に接続されている。配線１１の他方側端部は、ビアホール電極１４によって第２の主面１０ｂの上に配された端子電極１５に接続されている。 On the first main surface 10 a of the insulating substrate 10, wiring 11 is arranged. One end of the wiring 11 is connected to a terminal electrode 13 disposed on the second main surface 10 b by a via hole electrode 12. The other end of the wiring 11 is connected to a terminal electrode 15 disposed on the second main surface 10b by a via hole electrode 14.
　配線１１は、溶断部１１ａと、非溶断部１１ｂとを有する。溶断部１１ａは、低融点金属部２０の融液に融解することにより相対的に溶断されやすい部分であり、非溶断部１１ｂは、低融点金属部２０の融液に融解することにより相対的に溶断されにくい部分である。 The wiring 11 has a fusing part 11a and a non-fusing part 11b. The fusing part 11 a is a part that is relatively easily melted by melting in the melt of the low melting point metal part 20, and the non-melting part 11 b is relatively melted by melting in the melt of the low melting point metal part 20. It is a part that is difficult to melt.
　本実施形態では、具体的には、溶断部１１ａは、低融点金属部２０の融液に対する溶解速度が相対的に高い金属からなり、非溶断部１１ｂは、低融点金属部２０の融液に対する溶解速度が相対的に低い金属からなる。より具体的には、本実施形態では、溶断部１１ａは、Ａｕ及びＡｇの少なくとも一方を含む。溶断部１１ａは、Ａｇ、Ａｕ、またはＡｇ及びＡｕの少なくとも一方を含む合金により構成されていることが好ましい。本実施形態では、非溶断部１１ｂは、Ｃｕ、Ｐｄ、Ｎｉ及びＰｔのうちの少なくとも一種を含む。非溶断部１１ｂは、Ｃｕ、Ｐｄ、Ｎｉ、Ｐｔ、またはＣｕ、Ｐｄ、Ｎｉ及びＰｔのうちの少なくとも一種を含む合金により構成されていることが好ましい。 Specifically, in the present embodiment, the fusing part 11a is made of a metal having a relatively high dissolution rate with respect to the melt of the low melting point metal part 20, and the non-melting part 11b is with respect to the melt of the low melting point metal part 20. It consists of a metal with a relatively low dissolution rate. More specifically, in the present embodiment, the fusing part 11a includes at least one of Au and Ag. It is preferable that the fusing part 11a is comprised with the alloy containing at least one of Ag, Au, or Ag and Au. In the present embodiment, the non-blown part 11b includes at least one of Cu, Pd, Ni, and Pt. The non-blown part 11b is preferably made of Cu, Pd, Ni, Pt, or an alloy containing at least one of Cu, Pd, Ni, and Pt.
　配線１１の上には、低融点金属部２０が配されている。この低融点金属部２０は、配線１１よりも低い融点を有すると共に、融液となった際に配線１１を融解させる低融点金属からなる。このような低融点金属の具体例としては、例えば，ＳｎＳｂ、ＳｎＣｕ、ＳｎＡｇ，ＳｎＡｇＣｕ，ＳｎＣｕＮｉ等のＳｎ合金が挙げられる。 The low melting point metal part 20 is arranged on the wiring 11. The low melting point metal portion 20 has a melting point lower than that of the wiring 11 and is made of a low melting point metal that melts the wiring 11 when it becomes a melt. Specific examples of such low melting point metals include Sn alloys such as SnSb, SnCu, SnAg, SnAgCu, SnCuNi.
　低融点金属部２０と配線１１との間には、絶縁層２１が配されている。この絶縁層２１によって配線１１と低融点金属部２０とが電気的に絶縁されている。このため、通常時においては、端子電極１３と端子電極１５とは、ビアホール電極１２，１４と配線１１とによって電気的に接続されており、低融点金属部２０には電流は流れない。従って、過電流が生じたときに配線１１が発熱しやすい。よって、ヒューズ１のヒューズ機能が発動しやすい。 Between the low melting point metal part 20 and the wiring 11, an insulating layer 21 is disposed. The insulating layer 21 electrically insulates the wiring 11 from the low melting point metal part 20. For this reason, in a normal state, the terminal electrode 13 and the terminal electrode 15 are electrically connected by the via- hole electrodes 12 and 14 and the wiring 11, and no current flows through the low melting point metal part 20. Therefore, the wiring 11 tends to generate heat when an overcurrent occurs. Therefore, the fuse function of the fuse 1 is likely to be activated.
　絶縁層２１は、低融点金属部２０と配線１１とを電気的に絶縁できると共に、低融点金属部２０の融液に融解したり、融液が生じたときに揮発するなどして除去されたりするものであることが好ましい。絶縁層２１は、例えば、ロジン系フラックス、有機酸系フラックス等により成することができる。 The insulating layer 21 can electrically insulate the low melting point metal part 20 and the wiring 11 and can be removed by melting in the melt of the low melting point metal part 20 or volatilizing when the melt is generated. It is preferable that The insulating layer 21 can be made of, for example, rosin flux, organic acid flux, or the like.
　ヒューズ１には、低融点金属部２０を加熱する発熱体３０が設けられている。このため、ヒューズ１は、受動素子としても機能するし、能動素子として機能させることもできる。発熱体３０は、例えば、抵抗発熱体により構成することができる。なお、本実施形態では、発熱体３０は、絶縁性基板１０の第２の主面１０ｂの上に配されている。発熱体３０は、例えば、端子電極１３と端子電極１５とに電気的に接続されていてもよい。その場合は、配線１１に過電流が流れた際に発熱体３０にも過電流が流れ発熱体３０が発熱する。 The fuse 1 is provided with a heating element 30 for heating the low melting point metal part 20. Therefore, the fuse 1 can function as a passive element or an active element. The heating element 30 can be constituted by, for example, a resistance heating element. In the present embodiment, the heating element 30 is disposed on the second main surface 10 b of the insulating substrate 10. The heating element 30 may be electrically connected to the terminal electrode 13 and the terminal electrode 15, for example. In that case, when an overcurrent flows through the wiring 11, the overcurrent also flows through the heating element 30 and the heating element 30 generates heat.
　配線１１、低融点金属部２０は、絶縁性基板１０の上に配された封止部材５０により覆われている。 The wiring 11 and the low melting point metal part 20 are covered with a sealing member 50 disposed on the insulating substrate 10.
　ヒューズ１のヒューズ機能は以下のようにして発現する。ヒューズ１に過電流が流れた際には、配線１１が発熱する。または、図示しない検知機構により過電流が検出され、発熱体３０に電流が供給され発熱体３０が発熱する。その結果、低融点金属部２０が融解され、低融点金属部２０の融液が生じる。この低融点金属部２０の融液に配線１１が融解することにより、配線１１が切断され、端子電極１３と端子電極１５との間が電気的に絶縁される。具体的には、配線１１のうち、溶断部１１ａが優先的に溶断される。溶断部１１ａが溶断された後においても、非溶断部１１ｂの少なくとも一部は残存している。 The fuse function of fuse 1 is expressed as follows. When an overcurrent flows through the fuse 1, the wiring 11 generates heat. Alternatively, an overcurrent is detected by a detection mechanism (not shown), current is supplied to the heating element 30 and the heating element 30 generates heat. As a result, the low melting point metal part 20 is melted and a melt of the low melting point metal part 20 is generated. When the wiring 11 is melted in the melt of the low melting point metal part 20, the wiring 11 is cut and the terminal electrode 13 and the terminal electrode 15 are electrically insulated. Specifically, the fusing part 11 a is preferentially blown out of the wiring 11. Even after the melted part 11a is melted, at least a part of the non-fused part 11b remains.
　ところで、低融点金属部の融液は導電性を有する。このため、低融点金属部の融液が配線の残部同士を接続しているとヒューズ機能は発現しない。ここで、ヒューズ１では、発熱体３０の一方端部が、絶縁性基板１０を平面視したときに、低融点金属部２０の一部と重なり、他方端部が重ならないように設けられている。平面視において、配線材１１の延びる方向であるｘ軸方向における発熱体３０の中央が低融点金属部２０のｘ軸方向における中央よりもｘ２側に位置している。平面視において、発熱体３０が、低融点金属部２０が配された領域の、配線材１１の延びる方向であるｘ軸方向のｘ１側端部よりもｘ２側に設けられている。よって、低融点金属部２０の融液は、より温度が高い領域に向かって流動するため、低融点金属部２０の融液は、ｘ２側に向かって流動しやすい。従って、ヒューズ機能が確実に発現し、過電流を確実に遮断することができる。 By the way, the melt of the low melting point metal part is conductive. For this reason, if the melt of the low melting point metal portion connects the remaining portions of the wiring, the fuse function does not appear. Here, in the fuse 1, one end portion of the heating element 30 is provided so as to overlap a part of the low melting point metal portion 20 and the other end portion when the insulating substrate 10 is viewed in plan. . In plan view, the center of the heating element 30 in the x-axis direction, which is the direction in which the wiring material 11 extends, is located on the x2 side of the center of the low melting point metal part 20 in the x-axis direction. In plan view, the heating element 30 is provided on the x2 side from the x1 side end in the x-axis direction, which is the direction in which the wiring member 11 extends, in the region where the low melting point metal part 20 is disposed. Therefore, since the melt of the low melting point metal part 20 flows toward a region where the temperature is higher, the melt of the low melting point metal part 20 tends to flow toward the x2 side. Therefore, the fuse function is surely exhibited and the overcurrent can be reliably interrupted.
　低融点金属部２０の融液をｘ２側に向かってより流動しやすくなる観点から、平面視において、発熱体３０は、低融点金属部２０が配された領域のｘ１側端部よりもｘ２側から、低融点金属部２０が配された領域のｘ軸方向におけるｘ２側端部よりもｘ２側にわたって設けられていることがより好ましい。さらには、平面視において、発熱体３０が、溶断部１１ａと重ならないように配されていることが好ましい。発熱体３０が、溶断部１１ａよりもｘ２側に配されていることが好ましい。さらには、発熱体３０が低融点金属部２０よりもｘ２側に位置していることが好ましい。 From the viewpoint of facilitating the flow of the melt of the low-melting-point metal part 20 toward the x2 side, the heating element 30 is, in plan view, the x2-side from the x1-side end of the region where the low-melting-point metal part 20 is disposed. Therefore, it is more preferable that the low melting point metal portion 20 is provided over the x2 side rather than the x2 side end portion in the x-axis direction of the region where the low melting point metal portion 20 is disposed. Furthermore, it is preferable that the heating element 30 is arranged so as not to overlap the fusing part 11a in plan view. It is preferable that the heat generating body 30 is arranged on the x2 side from the fusing part 11a. Furthermore, the heating element 30 is preferably located on the x2 side with respect to the low melting point metal part 20.
　さらに、ヒューズ１では、絶縁性基板１０上において、低融点金属部２０に対して、ｘ軸方向のｘ１側に撥液部４０が設けられている。撥液部４０は、低融点金属部２０の融液をはじく。このため、低融点金属部２０の融液は、撥液部４０によりｘ２側にはじかれ、よりスムーズにｘ２側に移動する。撥液部４０は、配線１１の幅方向において配線１１に跨がって設けられていることが好ましい。撥液部４０は、例えば、ホウケイ酸系ガラスなどのガラス材料、エポキシ樹脂などの樹脂材料などにより構成することができる。なお、「融液をはじく」とは、接触角が９０°以上であることをいう。 Furthermore, in the fuse 1, a liquid repellent part 40 is provided on the insulating substrate 10 on the x 1 side in the x-axis direction with respect to the low melting point metal part 20. The liquid repellent part 40 repels the melt of the low melting point metal part 20. For this reason, the melt of the low melting point metal part 20 is repelled to the x2 side by the liquid repellent part 40 and moves more smoothly to the x2 side. The liquid repellent portion 40 is preferably provided across the wiring 11 in the width direction of the wiring 11. The liquid repellent part 40 can be comprised by resin materials, such as glass materials, such as a borosilicate type glass, and an epoxy resin, for example. “Repel the melt” means that the contact angle is 90 ° or more.
　なお、本実施形態のヒューズ１は、単独の素子として存在しているが、本発明のヒューズは、電子部品に組み込まれていてもよい。例えば、本発明のヒューズは、電子部品の配線基板と一体化されていてもよい。 In addition, although the fuse 1 of this embodiment exists as a single element, the fuse of the present invention may be incorporated in an electronic component. For example, the fuse of the present invention may be integrated with a wiring board of an electronic component.
　以下、本発明の好ましい実施形態の他の例について説明する。以下の説明において、上記第１の実施形態と実質的に共通の機能を有する部材を共通の符号で参照し、説明を省略する。 Hereinafter, another example of the preferred embodiment of the present invention will be described. In the following description, members having substantially the same functions as those of the first embodiment are referred to by the same reference numerals, and description thereof is omitted.
　（第２及び第３の実施形態）
　図２は、第２の実施形態におけるヒューズの略図的図断面である。図３は、第２の実施形態におけるヒューズの略図的平面図である。図４は、第３の実施形態におけるヒューズの略図的断面図である。なお、図３においては、封止部材の描画を省略している。 (Second and third embodiments)
FIG. 2 is a schematic cross-sectional view of a fuse in the second embodiment. FIG. 3 is a schematic plan view of a fuse in the second embodiment. FIG. 4 is a schematic cross-sectional view of a fuse in the third embodiment. In FIG. 3, drawing of the sealing member is omitted.
　第１の実施形態では、溶断部１１ａと非溶断部１１ｂとで材料が互いに異なる例について説明した。但し、本発明は、この構成に限定されない。図２及び図４に示されるように、第２及び第３の実施形態では、配線１１は、単一の層により構成されている。図３に示されるように、第２の実施形態に係るヒューズ２では、溶断部１１ａは、非溶断部１１ｂよりも幅狭に設けられている。図４に示されるように、第３の実施形態に係るヒューズ３では、溶断部１１ａは、非溶断部１１ｂよりも薄く設けられている。これらの場合であっても、溶断部１１ａの方が、非溶断部１１ｂよりも低融点金属部２０の融液に融解しやすい。 In the first embodiment, the example in which the materials are different from each other in the fused part 11a and the non-fused part 11b has been described. However, the present invention is not limited to this configuration. As shown in FIGS. 2 and 4, in the second and third embodiments, the wiring 11 is composed of a single layer. As shown in FIG. 3, in the fuse 2 according to the second embodiment, the fusing part 11a is provided narrower than the non-fusing part 11b. As shown in FIG. 4, in the fuse 3 according to the third embodiment, the fusing part 11a is provided thinner than the non-fusing part 11b. Even in these cases, the melted part 11a is more easily melted into the melt of the low melting point metal part 20 than the non-fused part 11b.
　また、配線１１は、単一の層であって、幅狭部や薄い部分を有さなくてもよい。その場合は、配線１１の溶断部１１ａは、低融点金属部２０が上に設けられた部分となる。この場合は、平面視において、発熱体３０が低融点金属部２０よりもｘ２側に位置していることが特に好ましい。 Further, the wiring 11 is a single layer and does not have to have a narrow part or a thin part. In that case, the fusing part 11a of the wiring 11 is a part on which the low melting point metal part 20 is provided. In this case, it is particularly preferable that the heating element 30 is located on the x2 side of the low melting point metal part 20 in plan view.
　（第４及び第５の実施形態）
　図５は、第４の実施形態におけるヒューズの略図的断面図である。図６は、第５の実施形態におけるヒューズの略図的断面図である。 (Fourth and fifth embodiments)
FIG. 5 is a schematic cross-sectional view of a fuse in the fourth embodiment. FIG. 6 is a schematic cross-sectional view of a fuse in the fifth embodiment.
　図５に示されるように、第４の実施形態に係るヒューズ４では、発熱体３０が絶縁性基板１０の第１の主面１０ａ上に設けられている。低融点金属部２０と発熱体３０とは、絶縁層６０によって絶縁されている。図６に示されるように、第５の実施形態に係るヒューズ５では、発熱体３０が絶縁性基板１０の内部に設けられている。これらの場合は、発熱体３０が第２の主面１０ｂ上に設けられている場合よりも、発熱体３０の熱が低融点金属部２０に供給されやすい。従って、配線１１が溶断されやすい。 As shown in FIG. 5, in the fuse 4 according to the fourth embodiment, the heating element 30 is provided on the first main surface 10 a of the insulating substrate 10. The low melting point metal part 20 and the heating element 30 are insulated by the insulating layer 60. As shown in FIG. 6, in the fuse 5 according to the fifth embodiment, the heating element 30 is provided inside the insulating substrate 10. In these cases, the heat of the heating element 30 is more easily supplied to the low melting point metal part 20 than when the heating element 30 is provided on the second main surface 10b. Therefore, the wiring 11 is easily melted.
１～５…ヒューズ
１０…絶縁性基板
１０ａ…第１の主面
１０ｂ…第２の主面
１１…配線
１１ａ…溶断部
１１ｂ…非溶断部
１２，１４…ビアホール電極
１３，１５…端子電極
２０…低融点金属部
２１…絶縁層
３０…発熱体
４０…撥液部
５０…封止部材
６０…絶縁層 DESCRIPTION OF SYMBOLS 1-5 ... Fuse 10 ... Insulating board | substrate 10a ... 1st main surface 10b ... 2nd main surface 11 ... Wiring 11a ... Fusing part 11b ... Unblown part 12, 14 ... Via- hole electrode 13, 15 ... Terminal electrode 20 ... Low melting point metal part 21 ... insulating layer 30 ... heating element 40 ... liquid repellent part 50 ... sealing member 60 ... insulating layer

Claims (11)

  1. 　絶縁性基板と、
    　前記絶縁性基板の一主面上に配された配線と、
    　前記配線の上に設けられており、前記配線よりも低い融点を有するとともに、融液となった際に前記配線を溶解させる低融点金属部と、
    　前記低融点金属部を加熱する発熱体と、
    を備え、
    　平面視において、前記発熱体は、前記低融点金属部が配された領域の前記配線の延びる方向における一方側端部よりも他方側に設けられている、ヒューズ。     An insulating substrate;
    Wiring disposed on one main surface of the insulating substrate;
    A low melting point metal part which is provided on the wiring and has a melting point lower than that of the wiring and which dissolves the wiring when it becomes a melt;
    A heating element for heating the low melting point metal part;
    With
    In the plan view, the heating element is provided on the other side of one end in the direction in which the wiring extends in a region where the low melting point metal portion is disposed.
  2. 　平面視において、前記発熱体は、前記低融点金属部が配された領域の前記配線の延びる方向における一方側端部よりも他方側から、前記低融点金属部が配された領域の前記配線の延びる方向における他方側端部よりも他方側にわたって設けられている、請求項１に記載のヒューズ。 In a plan view, the heating element is formed on the wiring in the region in which the low melting point metal part is disposed from the other side of the one end in the direction in which the wiring extends in the region in which the low melting point metal part is disposed. The fuse according to claim 1, which is provided over the other side rather than the other side end in the extending direction.
  3. 　前記配線は、
    　前記低融点金属部の融液に融解することにより相対的に溶断されやすい溶断部と、
    　前記配線の延びる方向において前記溶断部の一方側に位置しており、相対的に溶断されにくい非溶断部と、
    を含み、
    　平面視において、前記発熱体が、前記溶断部と重ならないように配されている、請求項１または２に記載のヒューズ。     The wiring is
    A melted portion that is relatively easily melted by melting in the melt of the low melting point metal portion, and
    A non-blown part that is located on one side of the fused part in the direction in which the wiring extends, and is relatively less likely to be fused;
    Including
    The fuse according to claim 1, wherein the heating element is arranged so as not to overlap the fusing part in a plan view.
  4. 　前記溶断部は、前記低融点金属部の融液に対する溶解速度が相対的に高い金属からなり、
    　前記非溶断部は、前記低融点金属部の融液に対する溶解速度が相対的に低い金属からなる、請求項３に記載のヒューズ。     The fusing part is made of a metal having a relatively high dissolution rate with respect to the melt of the low melting point metal part,
    4. The fuse according to claim 3, wherein the non-blown part is made of a metal having a relatively low dissolution rate with respect to the melt of the low melting point metal part.
  5. 　前記溶断部がＡｕ及びＡｇの少なくとも一方を含み、
    　前記非溶断部がＣｕ、Ｐｂ、Ｎｉ及びＰｔのうちの少なくとも一種を含む、請求項４に記載のヒューズ。     The fusing part includes at least one of Au and Ag;
    The fuse according to claim 4, wherein the non-blown part includes at least one of Cu, Pb, Ni, and Pt.
  6. 　前記溶断部は、前記非溶断部よりも幅狭である、請求項３～５のいずれか一項に記載のヒューズ。 The fuse according to any one of claims 3 to 5, wherein the fusing part is narrower than the non-fusing part.
  7. 　前記溶断部は、前記非溶断部よりも薄い、請求項３～６のいずれか一項に記載のヒューズ。 The fuse according to any one of claims 3 to 6, wherein the fused part is thinner than the non-fused part.
  8. 　前記絶縁性基板の一主面上において、前記低融点金属部に対して、前記配線の延びる方向の一方側に設けられており、前記低融点金属部の融液をはじく撥液部をさらに備える、請求項１～７のいずれか一項に記載のヒューズ。 Provided on one main surface of the insulating substrate with respect to the low melting point metal part on one side in the direction in which the wiring extends, and further includes a liquid repellent part that repels the melt of the low melting point metal part. The fuse according to any one of claims 1 to 7.
  9. 　前記発熱体は、前記基板の一主面上または前記基板の内部に設けられている、請求項１～８のいずれか一項に記載のヒューズ。 The fuse according to any one of claims 1 to 8, wherein the heating element is provided on one main surface of the substrate or inside the substrate.
  10. 　前記配線と前記低融点金属部とを絶縁する絶縁層をさらに備える、請求項１～９のいずれか一項に記載のヒューズ。 The fuse according to any one of claims 1 to 9, further comprising an insulating layer that insulates the wiring and the low-melting-point metal part.
  11. 　前記低融点金属部は、Ｓｎを主成分とする、請求項１～１０のいずれか一項に記載のヒューズ。 The fuse according to any one of claims 1 to 10, wherein the low-melting-point metal part is composed mainly of Sn.
PCT/JP2013/068338 2012-08-29 2013-07-04 Fuse WO2014034261A1 (en)

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CN201380043450.2A CN104584175A (en) 2012-08-29 2013-07-04 Fuse

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7142751B1 (en) 2021-07-05 2022-09-27 三菱電機株式会社 Power conversion device and interrupting mechanism

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6739922B2 (en) * 2015-10-27 2020-08-12 デクセリアルズ株式会社 Fuse element
JP6452001B2 (en) * 2016-06-08 2019-01-16 株式会社村田製作所 Electronic device and method for manufacturing electronic device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57113535A (en) * 1980-11-27 1982-07-15 Bitsukumannbueruke Gmbh Electric fuse
JPH0538748U (en) * 1991-10-29 1993-05-25 カルソニツク株式会社 Ventilation control device for automobile air conditioner
JP2000285777A (en) * 1999-03-31 2000-10-13 Nec Kansai Ltd Protective element
JP2004087467A (en) * 2002-06-28 2004-03-18 Fujikura Ltd Thermal fuse for resistive circuit substrate

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007041529A2 (en) * 2005-10-03 2007-04-12 Littelfuse, Inc. Fuse with cavity forming enclosure
CN201449830U (en) * 2009-06-19 2010-05-05 西安中熔电气有限公司 Fuse resistor with M effect point

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57113535A (en) * 1980-11-27 1982-07-15 Bitsukumannbueruke Gmbh Electric fuse
JPH0538748U (en) * 1991-10-29 1993-05-25 カルソニツク株式会社 Ventilation control device for automobile air conditioner
JP2000285777A (en) * 1999-03-31 2000-10-13 Nec Kansai Ltd Protective element
JP2004087467A (en) * 2002-06-28 2004-03-18 Fujikura Ltd Thermal fuse for resistive circuit substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7142751B1 (en) 2021-07-05 2022-09-27 三菱電機株式会社 Power conversion device and interrupting mechanism
JP2023008013A (en) * 2021-07-05 2023-01-19 三菱電機株式会社 Power conversion device and interruption mechanism

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CN104584175A (en) 2015-04-29
TW201409518A (en) 2014-03-01
KR20150029028A (en) 2015-03-17

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