WO2014025154A1 - Feuille émettrice de chaleur et procédé de fabrication - Google Patents

Feuille émettrice de chaleur et procédé de fabrication Download PDF

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Publication number
WO2014025154A1
WO2014025154A1 PCT/KR2013/006838 KR2013006838W WO2014025154A1 WO 2014025154 A1 WO2014025154 A1 WO 2014025154A1 KR 2013006838 W KR2013006838 W KR 2013006838W WO 2014025154 A1 WO2014025154 A1 WO 2014025154A1
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WO
WIPO (PCT)
Prior art keywords
heat
layer
heat dissipation
web
solvent
Prior art date
Application number
PCT/KR2013/006838
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English (en)
Korean (ko)
Inventor
서인용
이승훈
정용식
소윤미
Original Assignee
주식회사 아모그린텍
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020130089635A external-priority patent/KR101518995B1/ko
Application filed by 주식회사 아모그린텍 filed Critical 주식회사 아모그린텍
Priority to CN201380041560.5A priority Critical patent/CN104520100B/zh
Publication of WO2014025154A1 publication Critical patent/WO2014025154A1/fr
Priority to US14/611,518 priority patent/US20150144320A1/en
Priority to US17/016,832 priority patent/US11456230B2/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • D—TEXTILES; PAPER
    • D04—BRAIDING; LACE-MAKING; KNITTING; TRIMMINGS; NON-WOVEN FABRICS
    • D04H—MAKING TEXTILE FABRICS, e.g. FROM FIBRES OR FILAMENTARY MATERIAL; FABRICS MADE BY SUCH PROCESSES OR APPARATUS, e.g. FELTS, NON-WOVEN FABRICS; COTTON-WOOL; WADDING ; NON-WOVEN FABRICS FROM STAPLE FIBRES, FILAMENTS OR YARNS, BONDED WITH AT LEAST ONE WEB-LIKE MATERIAL DURING THEIR CONSOLIDATION
    • D04H1/00—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres
    • D04H1/40—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties
    • D04H1/42—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties characterised by the use of certain kinds of fibres insofar as this use has no preponderant influence on the consolidation of the fleece
    • D04H1/4374—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties characterised by the use of certain kinds of fibres insofar as this use has no preponderant influence on the consolidation of the fleece using different kinds of webs, e.g. by layering webs
    • D—TEXTILES; PAPER
    • D04—BRAIDING; LACE-MAKING; KNITTING; TRIMMINGS; NON-WOVEN FABRICS
    • D04H—MAKING TEXTILE FABRICS, e.g. FROM FIBRES OR FILAMENTARY MATERIAL; FABRICS MADE BY SUCH PROCESSES OR APPARATUS, e.g. FELTS, NON-WOVEN FABRICS; COTTON-WOOL; WADDING ; NON-WOVEN FABRICS FROM STAPLE FIBRES, FILAMENTS OR YARNS, BONDED WITH AT LEAST ONE WEB-LIKE MATERIAL DURING THEIR CONSOLIDATION
    • D04H1/00—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres
    • D04H1/70—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres characterised by the method of forming fleeces or layers, e.g. reorientation of fibres
    • D04H1/72—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres characterised by the method of forming fleeces or layers, e.g. reorientation of fibres the fibres being randomly arranged
    • D04H1/728—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres characterised by the method of forming fleeces or layers, e.g. reorientation of fibres the fibres being randomly arranged by electro-spinning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment

Definitions

  • the present invention relates to a heat dissipation sheet installed in an electronic device to discharge heat generated inside the device to the outside, and more particularly, to a heat dissipation sheet manufactured in the form of a nano-web by an electrospinning method and a method of manufacturing the same.
  • the current electronic devices are thinner and thinner and their performance is higher. Therefore, the electronic devices must be quickly discharged to the outside to prevent the electronic devices from being damaged by heat. Therefore, the heat radiation sheet is used to release the heat energy generated inside the system to the outside.
  • the conventional heat dissipation sheet is a heat conductive metal plate, as disclosed in Korean Patent Publication No. 10-0721462 (May 17, 2007), and a tacky adhesive formed on at least one side of the metal plate and having a cell as a foam structure therein. It includes a foam sheet, wherein the adhesive foam sheet is formed of an adhesive mixture containing a pressure-sensitive adhesive and a cell-forming agent, the pressure-sensitive adhesive is an acrylic resin, a silicone resin or a polyurethane resin, the cell forming agent is composed of a micro hollow tool do.
  • the conventional heat dissipation sheet has a problem that it is difficult to use a thin thickness electronic devices such as portable electronic devices because the thickness is thick because the adhesive foam sheet is attached to the surface of the metal plate.
  • the heat dissipation sheet is used to punch out according to the size of the heat generating part to attach to the heat generating parts of the electronic device, in the case of the conventional heat dissipation sheet, there is a problem that precise punching is difficult because the foam sheet has adhesiveness when punching.
  • An object of the present invention is to provide a heat dissipation sheet and a method of manufacturing the same, which are manufactured in the form of a nanoweb by an electrospinning method to improve the thermal conductivity while making the thickness thin.
  • Another object of the present invention is to produce a pressure-sensitive adhesive layer for attaching to the heating element by the electrospinning method, it is possible to improve the punchability and the heat-conductive material is included, the adhesive layer can also have a heat dissipation performance can improve heat dissipation performance It is to provide a heat dissipation sheet and a method of manufacturing the same.
  • the heat dissipation sheet of the present invention comprises a heat dissipation layer formed in the form of a web having a plurality of pores by electrospinning a spinning solution mixed with a polymer material and a solvent, or a polymer material, a heat conductive material and a solvent; And an adhesive layer formed on one side or both sides of the heat dissipating layer and electrospinning an adhesive material mixed with an adhesive, a heat conductive material, and a solvent to form a web.
  • the heat dissipation sheet of the present invention is a substrate in the form of a web formed by the electrospinning method; An adhesive layer laminated on one surface of the substrate; And a metal layer coated on the other side of the substrate and having a thermal conductivity.
  • Method for producing a heat dissipation sheet of the present invention comprises the steps of electrospinning the pressure-sensitive adhesive material, the heat conductive material and the solvent mixed adhesive material to form a pressure-sensitive adhesive layer of the nano-web form; And forming a heat dissipating layer in the form of a web by electrospinning a spinning solution in which a polymer material and a solvent, or a polymer material, a heat conductive material and a solvent are mixed on one surface of the adhesive layer.
  • the heat dissipation sheet of the present invention is manufactured in the form of a web by the electrospinning method, thereby making the thickness thin, and there is an advantage that it can be applied to a thin electronic device.
  • the heat dissipation sheet of the present invention may be produced in the form of a web by electrospinning the pressure-sensitive adhesive layer to improve the punchability, and includes a heat conductive material in the pressure-sensitive adhesive layer has the advantage of improving the heat dissipation performance.
  • FIG. 1 is a cross-sectional view of a heat radiation sheet according to a first embodiment of the present invention.
  • FIG 2 is an enlarged view of a heat radiation layer according to a first embodiment of the present invention.
  • FIG 3 is a cross-sectional view of a heat radiation sheet according to a second embodiment of the present invention.
  • Figure 4 is a block diagram of an electrospinning apparatus for producing a heat radiation sheet of the present invention.
  • FIG. 1 is a cross-sectional view of a heat radiation sheet according to a first embodiment of the present invention
  • Figure 2 is an enlarged view of a heat radiation sheet according to a first embodiment of the present invention.
  • the heat dissipation sheet according to the first embodiment is formed by the electrospinning method and includes a heat conductive material, the heat dissipation layer 10 in the form of a nano-web having thermal conductivity, and adhesively laminated on one or both surfaces of the heat dissipation layer 10.
  • Layer 20 is formed by the electrospinning method and includes a heat conductive material, the heat dissipation layer 10 in the form of a nano-web having thermal conductivity, and adhesively laminated on one or both surfaces of the heat dissipation layer 10.
  • the heat dissipating layer 10 forms a spinning solution by mixing a polymer material and a solvent capable of electrospinning, or a polymer material, a heat conducting material and a solvent in a predetermined ratio, and electrospinning the spinning solution to form the nanofibers 14,
  • the nanofibers 14 are accumulated to form a nano web having a plurality of pores 12.
  • the nano web may be referred to as a web.
  • the radiation method applied to the present invention is a general electrospinning, air electrospinning (AES: Air-Electrospinning), electrospray (electrospray), electrobrown spinning, centrifugal electrospinning Flash-electrospinning can be used.
  • AES Air-Electrospinning
  • electrospray electrospray
  • electrobrown spinning electrobrown spinning
  • centrifugal electrospinning Flash-electrospinning Flash-electrospinning Flash-electrospinning Flash-electrospinning Flash-electrospinning can be used.
  • the radiation layer 10 and the adhesive layer 20 of the present invention can be applied to any spinning method of the spinning method that can be made in the form of the nanofibers accumulated.
  • the polymeric material used to make the heat dissipating layer 10 may be, for example, polyvinylidene fluoride (PVDF), poly (vinylidene fluoride-co-hexafluoropropylene), perfuluropolymer, polyvinyl chloride or poly Polyethylene including vinylidene chloride and copolymers thereof and polyethylene glycol derivatives including polyethylene glycol dialkyl ether and polyethylene glycol dialkyl ester, poly (oxymethylene-oligo-oxyethylene), polyethylene oxide and polypropylene oxide , Polyvinyl acetate, poly (vinylpyrrolidone-vinylacetate), polystyrene and polystyrene acrylonitrile copolymer, polyacrylonitrile copolymer including polyacrylonitrile methyl methacrylate copolymer, polymethyl methacrylate , Polymethyl methacrylate copolymers and mixtures thereof This may be used.
  • PVDF polyvinylidene fluoride
  • the thermally conductive material may be any one of thermally conductive metals such as Ni, Cu, and Ag, and conductive carbon, carbon black, carbon nanotubes, and conductive polymers (PDOT). In addition, any material may be used as long as the material has thermal conductivity.
  • the thermally conductive particles are dispersed in the nanofibers 14 of the heat dissipating layer 10 in the form of a nanoweb. That is, part of the thermally conductive particles are exposed to the surface of the nanofibers 14 of the heat dissipation layer 10 to participate in thermal conduction.
  • the thickness is determined according to the radiation amount of the spinning solution. Therefore, there is an advantage that it is easy to make the thickness of the heat radiation layer 10 to a desired thickness.
  • the heat dissipation layer 10 is formed in the form of a nano web in which the nanofibers are accumulated by the spinning method, the heat dissipation layer 10 may be formed in a form having a plurality of pores without a separate process, and the size of the pores is adjusted according to the amount of spinning solution. It is also possible.
  • the adhesive layer 20 is manufactured by the same electrospinning method as the method of making the heat dissipation layer 10. That is, a pressure-sensitive adhesive, a thermally conductive material and a solvent are mixed to form a thermally conductive adhesive material having a viscosity suitable for electrospinning, and the thermally conductive adhesive material has a predetermined thickness on one or both sides of the heat dissipating layer 10 by an electrospinning method. Laminate.
  • the adhesive layer 20 is radiated in the form of ultrafine fiber strands and adheres to the surface of the heat dissipating layer 10. At this time, the adhesive material is introduced into the pores 12 of the heat insulating layer 10 to increase the adhesive strength between the heat radiation layer 10 and the adhesive layer 20. Therefore, the phenomenon that the heat dissipation layer 10 peels off from the adhesive layer 20 is reduced, and the reliability of the heat dissipation sheet is improved. In addition, the thickness of the adhesive layer 20 is reduced by the adhesive material introduced into the pores 12 to implement an ultra-thin heat dissipation sheet.
  • the same material as the heat conductive material forming the heat dissipating layer 10 may be used.
  • the adhesive layer 20 is manufactured by separately manufacturing the heat-dissipating layer 10 and the adhesive layer 20 by an electrospinning method, in addition to the method of directly electrospinning a thermally conductive adhesive material to the heat-dissipating layer 10, and then laminating them. In the process, a method of laminating the thermally conductive adhesive layer 20 on one or both surfaces of the heat dissipation layer 10 may also be applied.
  • the thickness of the adhesive layer 20 is determined according to the radiation amount of the thermally conductive adhesive material. Therefore, the thickness of the adhesion layer 20 can be made free.
  • the adhesive layer 20 includes a heat conductive material, since the adhesive layer 20 has adhesiveness and thermal conductivity to attach the heat dissipation layer to the heat generating parts, the heat dissipation performance may be improved.
  • thermally conductive particles may be dispersed and disposed between the heat dissipation layer 10 and the adhesive layer 20. Thermally conductive particles are disposed outside the nanofibers of the heat dissipation layer 10 and the nanofibers of the pressure-sensitive adhesive layer 20 positioned on the interface between the heat dissipation layer 10 and the adhesive layer 20. By transferring the generated heat to the heat dissipation layer 10, it is possible to increase the heat dissipation efficiency.
  • the thermally conductive particles and the solvent are mixed to make a spray solution, and a bead consisting of the thermally conductive particles and the solvent is sprayed onto the nanoweb of the adhesive layer 20 by an electrospraying process, the solvent is volatilized and thermally conductive. Particles are dispersed in the nanoweb of the adhesive layer 20. Thereafter, when the nanoweb of the heat dissipation layer 10 is formed on the nanoweb of the adhesive layer 20 to which the thermally conductive particles are injected, the thermally conductive particles are formed between the heat dissipation layer 10 and the adhesive layer 20 described above.
  • distribution can be manufactured.
  • the heat dissipation layer 10 quickly diffuses heat generated from a heat generator such as an LED, a CPU, an IC, and the like, thereby preventing a local temperature rise of the heat generator.
  • a heat generator such as an LED, a CPU, an IC, and the like
  • FIG 3 is a cross-sectional view of a heat radiation sheet according to a second embodiment of the present invention.
  • the heat dissipation sheet according to the second embodiment is coated on the base 30 of the nano-web form formed by the electrospinning method, the adhesive layer 40 laminated on one side of the base 30, and the other side of the base 30 And includes a metal layer 50 having thermal conductivity.
  • the substrate 30 mixes a polymer material and a solvent in a predetermined ratio to form a spinning solution having an electrospinable viscosity, and electrospins the spinning solution to form nanofibers, and the nanofibers are accumulated to have a plurality of pores. It is formed in the form of a nano web (nano web).
  • the substrate 30 may also have the same structure as the heat dissipation layer 10 in the first embodiment. That is, the substrate 30 may be formed of a polymer material to perform a role of supporting the metal layer, and a structure having a role of supporting a metal layer and a heat conducting role at the same time by including a heat conductive material such as the heat dissipation layer 10. It is also possible to apply.
  • the polymer material forming the substrate 30 is the same as the polymer material described in the first embodiment, a detailed description thereof will be omitted.
  • the adhesive layer 40 is the same as the structure of the adhesive layer 20 described in the first embodiment, a detailed description thereof will be omitted.
  • Ni, Cu, Ag, or the like may be used as the metal having a thermal conductivity, and the metal layer 50 may be applied with a method of attaching a metal foil.
  • the heat dissipation sheet according to the second embodiment may be provided with a metal layer 50 having excellent thermal conductivity to further improve heat dissipation performance.
  • the metal layer 50 may be implemented as a metal pattern layer coated on the other surface of the substrate 30 in a pattern shape, and the metal pattern layer has a larger contact area than the metal layer 50 having a bulk surface. As a result, the heat dissipation efficiency is increased.
  • Figure 4 is a block diagram showing an electrospinning apparatus for manufacturing a heat radiation sheet according to the present invention.
  • the electrospinning apparatus of the present invention comprises a first mixing tank 70 in which a pressure sensitive adhesive, a heat conductive material and a solvent are mixed, and a spinning solution in which an electrospinable polymer material, a heat conductive material, and a solvent are mixed.
  • the second radiation nozzle 76 connected to the mixing tank 72 to form the heat dissipation layer 10, and disposed below the first radiation nozzle 74 and the second radiation nozzle 76, may be attached to the adhesive layer 20.
  • the heat dissipation layer 10 includes a collector 78 sequentially stacked.
  • the first mixing tank 70 is provided with a first stirrer 60 to mix the polymer material, the heat conductive material and the solvent evenly, and to maintain a constant viscosity of the spinning solution, and the second mixing tank 72 includes an adhesive, A second stirrer 62 is provided to mix the heat conductive material and the solvent evenly and to maintain the viscosity of the adhesive material.
  • the nanofibers 14 are radiated to the collector. 14 is collected to form a nano web.
  • first radiation nozzle 74 and the second radiation nozzle 76 may be arranged in plurality, may be arranged sequentially in one chamber, each may be arranged in different chambers.
  • Each of the first radiation nozzles 74 and the second radiation nozzles 76 is provided with an air injection device 64 so that the nanofibers 14 radiated from the first radiation nozzles 74 and the second radiation nozzles 76 are formed. It is not captured by the collector 78 and prevents it from flying.
  • Collector 78 is used a conveyor for automatically transferring the release film 82 so that the adhesive layer 20 and the heat dissipation layer 10 are sequentially stacked on the release film 82, or the adhesive layer 20 and the heat dissipation layer
  • the table form can be used when 10 is formed in different chambers.
  • a release film roll 80 wound around the release film 82 is disposed to supply the release film 82 to the upper surface of the collector 78.
  • a pressure roller 86 is provided at the rear of the collector 78 to pressurize (calender) the pressure-sensitive adhesive layer 20 and the heat dissipation layer 10 to a predetermined thickness, and is pressed while passing through the pressure roller 86.
  • a sheet roll 88 is provided on which a heat dissipation sheet having a predetermined thickness is wound.
  • the release film 82 wound around the release film roll 80 is released and supplied to the collector 78.
  • the adhesive material is made into the nanofibers 14 in the first radiation nozzle 74 to radiate onto the surface of the release film 82. . Then, the nanofibers 14 are accumulated on the surface of the release film 82 to form an adhesive layer 20.
  • the adhesive layer 20 contains a heat conductive material, the adhesive layer 20 serves to dissipate heat even in the adhesive layer 20 itself.
  • the air injector 64 installed in the first radiation nozzle 74 the air is injected to the nanofibers 14 so that the nanofibers 14 do not fly and the release film 82 does not fly. To be collected and integrated on the surface of the
  • the adhesive layer 20 is moved to the lower portion of the second radiation nozzle 76 and the high voltage electrostatic force is applied between the collector 78 and the second radiation nozzle 76. As a result, the spinning solution is made into the nanofibers 14 on the adhesive layer 20 in the second spinning nozzle 76 to be spun. Then, the heat radiation layer 10 in the form of a nano web having a plurality of pores 12 on the surface of the adhesive layer 20 is formed.
  • the heat dissipation sheet completed while going through this process is pressed to a predetermined thickness while passing through the pressure roller (86). Then, it is wound around the sheet roll 88 and stored.
  • the adhesive layer 20 is disposed on one side or both sides of the heat dissipation layer 10, and the heat dissipation layer 10 and adhesive
  • the method of laminating and manufacturing between the layers 30 is also applicable.
  • each of the heat dissipation layer 10 and the adhesive layer 20 is one of a non-woven fabric, a paper, and a polyolefin-based film such as PE, PP, etc., made of a polymer material that is not dissolved by a solvent used in the spinning solution.
  • the heat dissipation sheet has a structure in which the metal layer 50 is coated on the surface of the substrate 30 formed by the electrospinning method, the adhesive layer 40 and the substrate 30 are manufactured in the same manner as above, and then the substrate 30 By coating the metal layer 50 on the surface of the) to produce a heat dissipation sheet.
  • the substrate 30 may include a heat conducting material in the same manner as the heat dissipation layer 10 described above, and a structure in which only the polymer material is electrospun to perform only a role of the substrate may be applied.
  • the present invention provides a heat dissipation sheet that can be made thin in thickness by manufacturing in the form of a nano-web by the electrospinning method, which can be applied to an electronic device having a thin thickness.

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  • Engineering & Computer Science (AREA)
  • Textile Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)

Abstract

L'invention concerne une feuille émettrice de chaleur qui comprend: une couche émettrice de chaleur se présentant sous forme d'un voile comprenant plusieurs pores et obtenu par électrofilage d'un matériau polymère et d'un solvant, ou d'une solution de filage consistant en un mélange d'un matériau polymère, d'un matériau conduisant la chaleur et d'un solvant ; et une couche adhérente stratifiée sur un ou les deux côtés de la couche émettrice de chaleur, et se présentant sous forme d'un voile obtenu par électrofilage d'un matériau adhésif consistant en un mélange d'un adhésif, d'un matériau conduisant la chaleur et d'un solvant.
PCT/KR2013/006838 2012-08-06 2013-07-30 Feuille émettrice de chaleur et procédé de fabrication WO2014025154A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201380041560.5A CN104520100B (zh) 2012-08-06 2013-07-30 散热片及其制备方法
US14/611,518 US20150144320A1 (en) 2012-08-06 2015-02-02 Heat radiation sheet and method of manufacturing same
US17/016,832 US11456230B2 (en) 2012-08-06 2020-09-10 Heat radiation sheet and method of manufacturing same

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20120085769 2012-08-06
KR10-2012-0085769 2012-08-06
KR1020130089635A KR101518995B1 (ko) 2012-08-06 2013-07-29 방열 시트 및 그 제조방법
KR10-2013-0089635 2013-07-29

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US14/611,518 Division US20150144320A1 (en) 2012-08-06 2015-02-02 Heat radiation sheet and method of manufacturing same

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Publication Number Publication Date
WO2014025154A1 true WO2014025154A1 (fr) 2014-02-13

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PCT/KR2013/006838 WO2014025154A1 (fr) 2012-08-06 2013-07-30 Feuille émettrice de chaleur et procédé de fabrication

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Cited By (1)

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Publication number Priority date Publication date Assignee Title
CN105241297A (zh) * 2014-07-04 2016-01-13 英诺晶片科技股份有限公司 散热片

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KR20050113937A (ko) * 2004-05-31 2005-12-05 주식회사 엘지화학 점착 방열시트
KR100725028B1 (ko) * 2006-10-24 2007-06-07 (주) 아모센스 나노 복합체 탄소섬유를 이용한 방열시트의 제조방법
KR20070080546A (ko) * 2006-02-07 2007-08-10 (주) 아모센스 방열시트의 제조방법

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Publication number Priority date Publication date Assignee Title
KR20040083573A (ko) * 2003-03-24 2004-10-06 김찬 전기방사에 의한 카본나노튜브가 분산된 나노복합체 탄소섬유 제조 및 그의 전기이중층 슈퍼캐퍼시터용 전극제조
KR20050062407A (ko) * 2003-12-19 2005-06-23 남재도 탄소나노튜브를 포함하는 복합체 및 탄소나노튜브집합체의 제조방법
KR20050113937A (ko) * 2004-05-31 2005-12-05 주식회사 엘지화학 점착 방열시트
KR20070080546A (ko) * 2006-02-07 2007-08-10 (주) 아모센스 방열시트의 제조방법
KR100725028B1 (ko) * 2006-10-24 2007-06-07 (주) 아모센스 나노 복합체 탄소섬유를 이용한 방열시트의 제조방법

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105241297A (zh) * 2014-07-04 2016-01-13 英诺晶片科技股份有限公司 散热片
KR20160005231A (ko) * 2014-07-04 2016-01-14 주식회사 이노칩테크놀로지 방열 시트
KR101885664B1 (ko) * 2014-07-04 2018-08-06 주식회사 모다이노칩 방열 시트의 제조 방법

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