WO2014021618A1

WO2014021618A1 - Integrated inorganic el display device and method for manufacturing same

Info

Publication number: WO2014021618A1
Application number: PCT/KR2013/006854
Authority: WO
Inventors: 나정수; 김영민
Original assignee: 어레인보우 주식회사
Priority date: 2012-07-30
Filing date: 2013-07-30
Publication date: 2014-02-06
Also published as: KR20140071427A; KR101533436B1; CN104508612A

Abstract

According to one embodiment of the present invention, an integrated inorganic EL display device and a method for manufacturing the same are disclosed. The integrated inorganic EL display device can comprise: a touch input unit for receiving a touch input of a user; an inorganic EL display unit arranged on the touch input unit and comprising an inorganic EL for emitting light in a predetermined pattern; and a control circuit unit arranged on the touch input unit or the inorganic EL display unit and making the inorganic EL display unit emit light according to the touch input.

Description

Integrated inorganic EL display device and manufacturing method thereof

The present invention relates to an integrated inorganic EL display device and a manufacturing method thereof, and more particularly, to an integrated inorganic EL display device and a manufacturing method thereof in which a touch input unit, an inorganic EL display unit and a control circuit unit are integrated.

Printed circuit boards (PCBs) are conductors (usually copper) that can transmit electrical signals on insulated substrates. They work by constructing electrical circuits when mounting electronic components. In general, a copper foil such as copper is attached onto an insulating plate such as phenol / epoxy, and then etched according to circuit wiring to form a necessary circuit, and to form a hole for connecting between circuits and mounting parts. PCBs, which are likened to the nerves of the human body, are being used as core components used in all electronic devices, from small home appliances to advanced mobile communication devices.

These PCBs can be categorized into EPOXY (FR-4), FUEXIBLE, REGID FUEXIBLE, METAL PCB, TAFLON, etc. These are problematic due to the large amount of environmentally harmful substances emitted from the manufacturing process to the use process or disposal process. have. In particular, PCB bonding method is mostly using lead, lead is replaced by tin due to environmental regulations, but not completely solved. PCBs are also inflexible, with some exceptions. In other words, the conventional PCB has a circuit formed on a rigid substrate, its use was limited.

In order to solve this problem, a flexible printed circuit board (FPCB) has been introduced. FPCB is a circuit board using a flexible insulating board, unlike PCB, it can solve the problem of flexibility, but still does not solve the environmental problem, and the manufacturing cost is expensive due to the process and material, and also, FPCB has been used only in limited space in video cameras, car stereos, and heads of computers and printers that require flexibility such as bending, overlapping, folding, curling and twisting.

Therefore, there is a need for a technology that is environmentally friendly and economical and that can extend the use of conventional circuit boards.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and provides an environment-friendly and economical flexible circuit board, and an inorganic EL display device in which a control circuit unit, an inorganic EL display unit, and a touch input unit are implemented as a flexible circuit board. For the purpose of providing it.

According to one embodiment of the present invention, an integrated inorganic EL display device is disclosed. An integrated inorganic EL display device includes a touch input unit configured to receive a touch input of a user; An inorganic EL display unit disposed on the touch input unit and including an inorganic EL (electro luminescence) to emit light in a predetermined pattern; And a control circuit portion disposed on the touch input portion or the inorganic EL display portion to cause the inorganic EL display portion to emit light according to the touch input.

According to one embodiment of the present invention, a method of manufacturing an integrated inorganic EL display device is disclosed. A method for manufacturing an integrated inorganic EL display device includes forming a touch input unit for receiving a touch input of a user; Forming an inorganic EL display unit on the touch input unit, the inorganic EL display unit including an inorganic electroluminescence (EL) emitting light in a predetermined pattern; And forming, on the touch input unit or the inorganic EL display unit, a control circuit unit for causing the inorganic EL display unit to emit light according to the touch input.

According to the present invention, the touch input portion, the inorganic EL display portion, and the control circuit portion can be manufactured integrally. This can result in a streamlined manufacturing process and a shorter manufacturing time, resulting in lower manufacturing costs.

According to the present invention, the touch input unit, the inorganic EL display unit, and the control circuit unit are formed on a base film having a transparent and flexible property, so that the touch input unit, the inorganic EL display unit, and the control circuit unit can be used suitably for the trend of miniaturized and thinned electronic products. It is possible to provide a display suitable for flexible materials.

According to the present invention, unlike a conventional PCB implemented as a PCB, by implementing a control circuit portion for forming a circuit wiring and an adhesive layer using a printing ink and a conductive adhesive, the environmental regulatory material, for example, Pb, Cd in the manufacturing process , Hg, Cr ⁶⁺ , PBB, PBDE and the like are not used at all, and thus do not generate dangerous substances that may occur during production, use and disposal.

BRIEF DESCRIPTION OF THE DRAWINGS In order to better understand the drawings cited in the detailed description of the invention, a brief description of each drawing is provided.

1 shows an integrated inorganic EL display device according to an embodiment of the present invention.

2 illustrates a touch input unit according to an embodiment of the present invention.

3 shows an inorganic EL display unit according to an embodiment of the present invention.

4 shows a control circuit unit according to an embodiment of the present invention.

5 shows a control circuit portion according to an additional embodiment of the present invention.

6 illustrates a flexible circuit board according to an embodiment of the present invention.

Fig. 7 shows a method of manufacturing the integrated inorganic EL display device according to the embodiment of the present invention.

8 illustrates a method of manufacturing the inorganic EL display unit according to the embodiment of the present invention.

9 illustrates a method of manufacturing a control circuit unit according to an embodiment of the present invention.

10 illustrates a method of manufacturing a control circuit portion according to an additional embodiment of the present invention.

11A and 11B show examples of flexible circuit boards in accordance with one embodiment of the present invention.

Hereinafter, embodiments according to the present invention will be described with reference to the accompanying drawings. Meanwhile, in describing the present invention, when it is determined that a detailed description of a related known configuration or function may obscure the gist of the present invention, the detailed description thereof will be omitted. In addition, embodiments of the present invention will be described below, but the technical spirit of the present invention is not limited thereto and may be variously modified and modified by those skilled in the art.

Throughout the specification, when a part is "connected" to another part, this includes not only "directly connected" but also "indirectly connected" with another element in between. . Throughout the specification, when a part is said to "include" a certain component, it means that it can further include other components, without excluding other components unless specifically stated otherwise.

The integrated inorganic EL display device includes a touch input unit 100 for receiving a user touch signal; An inorganic EL display unit 200 including inorganic EL (Inorganic Electro Luminescence) emitting light in a predetermined pattern; And a control circuit unit 300 for determining the light emission pattern of the inorganic EL display unit 200 based on the user's touch signal received by the touch input unit 100 and outputting the same.

The touch input unit 100 is for receiving a user's touch input. Specifically, the touch input unit 100 is implemented on a tempered glass sheet or a predetermined film, and recognizes a user's touch on the surface of the tempered glass sheet or the predetermined film. The signal may be converted into a signal and then transferred to the control circuit unit 300.

The inorganic EL display unit 200 means a flat-shaped inorganic electroluminescence device that emits light in a predetermined pattern (pattern).

The control circuit unit 300 may recognize a user touch signal input through the touch input unit 100 and transmit a signal for allowing the inorganic EL display unit 200 to emit light to the inorganic EL display unit 200.

Referring to Figure 1 (a), the touch input unit 100; An inorganic EL display unit 200 on the touch input unit 100; And the control circuit portion 300 on the inorganic EL display portion 200 is shown. That is, the touch input unit 100; Inorganic EL display unit 200; And the control circuit unit 300 may be stacked in one piece.

Referring to FIG. 1B, the inorganic EL display unit 200 and the control circuit unit 300 may be stacked on the touch input unit 100, but may not be stacked with each other, and may exist in a horizontal direction to be integrally formed. have.

Conventionally, a touch input unit, an inorganic EL display unit; And a control circuit unit as a separate component, which is manufactured separately and connected through a conductive wire, in the present invention, the touch input unit 100 and the inorganic EL display unit 200; And the control circuit 300 may be manufactured in one piece.

Referring to FIG. 2, the touch input unit 100 may include an outer protective layer 110; And a touch panel layer 120.

The outer protective layer 110 protects the touch panel layer 120 from the outside and transmits a user's input to the touch panel layer 120. For example, the outer protective layer 110 may be formed of tempered glass, a predetermined film, or the like. have. Here, the predetermined film has high dielectric constant, dielectric breakdown voltage and surface volume resistance due to high mechanical strength, excellent thermal and electrical insulation properties, and is used in a portion having a high flowability and an organic shape deformation. It is preferable that this film is possible. In addition, the tempered glass is preferably a glass tempered by heating the formed plate glass to 500 ~ 600 ℃ close to the softening temperature and then quenched with compressed cooling air to compress the deformation of the surface portion and then tensilely deforms the inside.

The touch panel layer 120 may recognize a user touch acting on the surface of the outer protective layer 110 and convert the touch to an electrical signal. The user touch can be implemented not only by the contact of the biocharged user's finger but also by the separate touch means embodied by a non-biomaterial having the same level of charge as the biocharge. Thus, since the touch panel layer 120 is disposed directly on the outer protective layer 110, the minute user touch signal acting on the outer protective layer 110 may be easily recognized or received.

The touch panel layer 120 may be formed in various ways, for example, a capacitive method, a resistive method, a surface acoustic method, and an infrared ray, according to an embodiment to which the present invention is applied. It may be implemented by a scanning infrared method, a piezoelectric method, or the like.

2 illustrates a touch panel layer 120 implemented by a contact capacitive method. The touch panel layer 120 may include a grid pattern layer 122 disposed on the outer protective layer 110; An electrode layer 124 disposed on the grid pattern layer 122; And a transparent protective layer 126 disposed on the electrode layer 124.

The grid pattern layer 122 may be a type of an electrode structure such as a mesh that is disposed on the upper portion of the outer protective layer 110 in a lattice form and used to detect a user's touch in detail. The electrode layer 124 may serve to detect an electrical change detected from the grid pattern layer 122 and transmit it to the outside of the touch panel layer 120 (that is, the control circuit unit 300). According to an embodiment, the grid pattern layer 122 and the electrode layer 124 may be implemented as one module as necessary. In addition, the transparent protective layer 126 disposed on the electrode layer 124 protects physical shock as well as an insulation function for preventing external exposure of electrical changes occurring in the grid pattern layer 122 and the electrode layer 124. It can also play a role.

That is, when a signal due to a user touch is input on the outer protective layer 110, the input signal is finely sensed by the grid pattern layer 122, and the touch panel layer 120 is performed without an electrical noise signal by the electrode layer 124. From to the control circuitry 300. The touch panel layer 120 may be embodied in a transparent manner as in the outer protective layer 110.

In FIG. 2, the touch panel layer 120 is illustrated as being formed in the entire area of the outer protective layer 110, but as an example, the touch panel layer 120 may be formed only on a part of the outer protective layer 110. Can be.

Referring to FIG. 3, the inorganic EL display unit 200 includes a transparent electrode layer 210; A first electrode 220 disposed on the transparent electrode layer 210 to transfer power from the control circuit unit 300 to the transparent electrode layer 210; A fluorescent layer 230 disposed on the transparent electrode layer 210 and emitting light by applying an electric field generated between the transparent electrode layer 210 and the rear electrode layer 250; A dielectric layer 240 disposed on the fluorescent layer 230 to provide insulation between the transparent electrode layer 210 and the back electrode layer 250; A rear electrode layer 250 disposed on the dielectric layer 240 to generate an electric field together with the transparent electrode layer 210; A second electrode 260 disposed on the back electrode layer 250 to transfer electric power from the control circuit unit 300 to the back electrode layer 250; The protective layer 270 may be disposed on the rear electrode layer 250 and the second electrode 260 to provide protection from physical shock as well as an insulation function for preventing external exposure of the electric field.

The inorganic EL display unit 200 is formed in a predetermined pattern, and can emit a predetermined pattern in accordance with a signal applied from the control circuit unit 300. Specifically, in the inorganic EL display unit 200 formed in a predetermined pattern, from the control circuit unit 300 to the transparent electrode layer 210 and the back electrode layer 250 through the first electrode 220 and the second electrode 260. When electric power is applied, an electric field is generated between the transparent electrode layer 210 and the back electrode layer 250, so that the fluorescent layer 230 emits light.

The inorganic EL display unit 200 is preferably formed of a transparent material, but may be opaque or translucent in some embodiments. In addition, the first electrode 220 and the second electrode 260 may be a material having excellent conductivity, such as silver paste and carbon paste, but are not limited thereto, and various materials may be adopted.

The control circuit unit 300 includes a base film 310; Circuit wiring 320; Insulating layer 330; Adhesive layer 340; Circuit component 350 and reinforcement seal 360.

The base film 310 is a substrate on which the circuit wiring 320, the insulating layer 330, and the adhesive layer 340 are disposed, and may have a bendable film form. In some embodiments, an opening (ie, a via-hole) is formed in at least one region of the base film, and thus the touch input unit 100 and / or the inorganic EL display unit 200 may be formed through a circuit wiring extending through the opening. ) Can be electrically connected. The thin and curved property of the base film 310 is suitable for the trend of electronic products which are becoming smaller and thinner. In particular, the curved property is later combined with the inorganic EL display unit and the touch input unit to be suitable for various designs and flexible materials. It is possible to implement a display device. In addition, since the base film 310 is thin and light, it can reduce a lot of logistics costs in transportation and loading.

The base film 310 may be made of a material capable of densely printing conductive printing ink to form the circuit wiring 320 on the base film 310. In some embodiments, the base film 310 may be transparent, translucent, or opaque. When used as a transparent and flexible component, the base film 310 made of a plastic-based material is preferable. For example, in the plastic series, PET (polyethylene terephthalate), PI (polyimide), and PU (polyurethane) -based synthetic resin that can withstand high temperatures of 130 degrees or more may be used.

The circuit wiring 320 may be formed on the base film 310. Specifically, the circuit wiring 320 prints the circuit wiring 320 using a conductive printing ink, for example, silver paste, carbon paste, indium tin oxide (ITO) nanoparticle paste, or the like, and prints the printed circuit wiring ( It can be formed by drying 320). The printing of the circuit wiring 320 using the printing ink is performed by screen printing using, for example, silk engraving, wherein the silk engraving is a photosensitive and cleaning process using a plate making film produced based on the schematic of the circuit. Can be produced via According to an embodiment, the circuit wiring 320 may extend to the outside to be electrically connected to at least one of the touch input unit 100 and the inorganic EL display unit 200.

An insulating layer 330 may be formed on the circuit wiring 320. The insulating layer 330 is for insulation of the circuit wiring 320. Specifically, the circuit wiring 320 is not in contact with air to prevent oxidation of the circuit wiring 320, and the conductivity of the circuit wiring 320 is improved. You can keep it. Specifically, the insulating layer 330 is formed by printing an insulating ink having insulation on the circuit wiring 320 and / or the base film 310 by screen printing, and drying the printed insulating ink. Can be. Here, the insulating ink is classified into a thermosetting ink, a thermoplastic ink, a UV curing ink, and the like according to a constituent material, and may be referred to as an insulating paste, a printing insulator, an insulating coating agent, or the like. In addition, the printing of the insulating layer 330 using the insulating ink is performed by screen printing using, for example, silk plate making, wherein the silk plate making may be performed by using a plate making film manufactured based on the design of the circuit. It can be produced through a washing process. Insulating ink may be printed on at least a portion of the insulating layer 330 to form a through-hole 335 for applying a conductive adhesive and mounting a circuit component. At least a portion of the circuit wire 320 and the circuit component may be electrically connected through the through hole 335. The insulating layer 330 is preferably transparent. However, the insulating layer 330 is exemplary, and according to an embodiment, the insulating layer 330 may be translucent or opaque. In FIG. 4, the insulating layer 330 is illustrated as forming the entire area of the base film 310 and the circuit wiring 320. However, the insulating layer 330 may be formed only on the circuit wiring 320. have.

The adhesive layer 340 may be formed on at least a portion of the circuit wiring 320. The adhesive layer 340 is for mounting various circuit components such as an inverter, a connector, and an IC chip on the circuit wiring 320, and the position of the circuit component among the circuit wiring 320, that is, through the insulating layer 330, is provided. It may be formed by applying a conductive adhesive in the hole 335. Since the conductive adhesive is used, the circuit component 350 may be stably mounted in the control circuit portion and electrically connected to the circuit wiring 320 through the adhesive layer 340. Here, the electroconductive adhesive is a conductive and adhesive adhesive used in place of conventional soldering for the bonding of circuit wiring, and according to the material or property thereof, a room temperature dry adhesive, a room temperature curing adhesive, a heat curing adhesive, It may be classified into a hot-baking adhesive, UV curing adhesive and the like.

The circuit component 350 may be mounted on the adhesive layer 340. The circuit component 350 may include various circuit components usable in the art, such as an inverter, a connector, and an IC chip. When the circuit component 350 is mounted on the adhesive layer 340, the circuit component 350 may be electrically connected to the circuit wiring 320.

4 and 5, the same components are referred to by the same terms and reference numerals. In the following, redundant description is omitted.

The control circuit portion shown in FIG. 5 further includes circuit wiring 380 as compared to the control circuit portion shown in FIG. 4, so that the

circuit wirings

320 and 380 can form a two-layer laminated structure. The circuit wiring 380 may have the same configuration as the circuit wiring 320.

The insulating layer 330 is formed on the circuit wiring 380, not the circuit wiring 320, and between the circuit wiring 320 and the circuit wiring 380 for separation and insulation between the

circuit wiring

320 and 380. The insulating layer 370 may be formed. The insulating layer 370 is formed in the same manner as the insulating layer 330. However, unlike the insulating layer 330, the through hole 335 is not formed in the insulating layer 370. Instead, the insulating layer 370 is formed. Via-holes 375 may be formed in at least a portion of the circuit board, to electrically connect at least a portion of the circuit lines 320 and at least a portion of the circuit lines 380. The insulating layer 370 is preferably transparent, but according to an embodiment, the insulating layer 370 may be translucent or opaque. According to an embodiment, the circuit wiring 380 may extend to the outside and be electrically connected to at least one of the touch input unit 100 and the inorganic EL display unit 200.

In FIG. 5, the insulating layer 370 is illustrated as being formed in the entire region of the base film 310 and the circuit wiring 320, and the insulating layer 330 is the entire region of the insulating layer 370 and the circuit wiring 380. Although illustrated as being formed in, this is exemplary and the insulating layer 370 may be formed only on the circuit wiring 320, or the insulating layer 330 may be formed only on the circuit wiring 380. In addition, although the circuit wiring of the two-layer structure is shown in FIG. 5, this is merely an example, and circuit wiring of various structures may be used according to an embodiment to which the present invention is applied.

6 (a) and 6 (b), the control circuit portion of Figure 4 and the control circuit of Figure 5 is added to the reinforcing seal 360, respectively, the same configuration in Figures 4 to 6 the same Refer to terms and reference numerals. In the following, redundant description is omitted.

The reinforcement seal 360 may be formed in the circuit component 350. This is in view of the fact that the conductive adhesive for mounting the circuit component 350 is weaker than the solder used for mounting the circuit component in the conventional PCB, such as adhesion, durability, etc., the adhesion, moisture resistance of the circuit component 350 In order to improve acid resistance, temperature resistance, and the like, specifically, it may be formed by applying a reinforcing agent to the circuit component 350 and drying the applied reinforcing agent. The reinforcing agent may be used, for example, UV adhesive, silicone adhesive and the like, but this is illustrative, and according to the embodiment to which the present invention is applied, various reinforcing agents, for example, a rubber-based material, a synthetic resin-based material, etc. may be used. Can be.

In FIG. 6, the reinforcement seal 360 is shown as being formed by applying a reinforcement to the contact between the circuit component 350 and the adhesive layer 340, which is illustrative and, in accordance with an embodiment, includes the contact, The reinforcement may be applied to the entire circuit component 350 to form the reinforcement seal 360.

1 and 7, the touch input unit 100 may be formed (S710). S710 may be performed by forming the touch panel layer 120 on a predetermined tempered glass sheet or film. For example, in an ITO film having an ITO deposition material deposited on a predetermined film, the touch input unit 100 may be formed by etching the ITO layer to have a predetermined pattern and attaching an electrode and a protective layer. The touch panel layer 120 may exist over the entire surface of the tempered glass sheet or the film, or may exist in at least one region. In addition, the ITO film may be attached to the tempered glass sheet.

Subsequently, the inorganic EL display unit 200 may be formed on the touch input unit 100 (step S720). In operation S720, the inorganic EL display unit 200 may be formed on the touch input unit 100 to implement a display device in which a user input and a screen display corresponding thereto are integrated. In one embodiment, the inorganic EL display unit 200 may be positioned on the film or the tempered glass sheet on which the touch input unit 100 is based, but may not be overlapped to avoid interference with the touch panel layer 120. have.

Subsequently, the control circuit unit 300 may be formed (step S730). The control circuit unit 300 determines the light emission pattern of the inorganic EL display unit 200 based on the user's touch signal received by the touch input unit 100, and outputs it to the inorganic EL display unit 200. It may be configured to be integrated with the input unit 100 and the inorganic EL display unit 200. Specifically, the control circuit unit 300 is connected to the touch input unit 100 and the electrodes of the inorganic EL display unit 200 (that is, the first electrode 220 and the second electrode 260) through circuit wiring. It may be formed on the (100) or the inorganic EL display unit 200.

3 and 8, first, the transparent electrode layer 210 may be formed (step S810). Step S810 may be performed by printing a conductive functional ink, for example, a conductive polymer, and drying the printed conductive polymer.

In operation S820, the first electrode 220 may be formed on the transparent electrode layer 210. The first electrode 220 is connected to the circuit wiring of the control circuit unit 300 and receives power from the control circuit unit 300 and then transfers the power to the transparent electrode layer 210. The first electrode 220 may be formed of various conductive materials available in the art. Can be configured. Step S820 may be performed by printing a conductive printing ink, for example, silver paste, carbon paste, ITO nanoparticle paste, and drying the printed conductive printing ink.

Subsequently, the fluorescent layer 230 may be formed on the transparent electrode layer 210 (S830). The fluorescent layer 230 emits light by an electric field generated by the transparent electrode layer 210 and the back electrode layer 250, and step S830 is performed by printing the light emitting ink according to the screen printing method and drying the printed light emitting ink. Can be. As a material of the fluorescent ink, based on ZnS, Cu, Cl, Mn, and the like may be selectively added to emit various colors.

Subsequently, the dielectric layer 240 may be formed on the fluorescent layer 230 (S840). The dielectric layer 240 is to prevent damage to the electrode through insulation between the transparent electrode layer 210 and the back electrode layer 250. Specifically, in step S840, the dielectric ink is printed according to the screen printing method, and the printed dielectric ink is printed. It may be carried out by drying. For example, the dielectric ink may be prepared as a paste using a plasticizer after dissolving a polyester resin-based polymer resin in a solvent.

Subsequently, the back electrode layer 250 may be formed on the dielectric layer 240 (operation S850). The step S850 may be performed by printing a conductive printing ink, for example, silver paste, carbon paste, ITO nanoparticle paste, or the like, and drying the printed conductive printing ink according to the screen printing method. When the back electrode layer 250 is made of silver having excellent reflectance, the light directed to the back electrode layer 250 by the emission of the fluorescent layer 230 is reflected toward the transparent electrode layer 210 to increase the luminous efficiency. Can be. The back electrode layer 250 may generate an electric field together with the transparent electrode layer 210 to cause the fluorescent layer 230 to emit light.

Subsequently, the second electrode 260 may be formed on the back electrode layer 250 (S860). The second electrode 260 is connected to the circuit wiring of the control circuit unit 300 to receive power from the control circuit unit 300 and then transfer the power to the back electrode layer 250, and may be made of various conductive materials that can be used in the art. Can be configured. The step S860 may be performed by printing the conductive printing ink, for example, silver paste, carbon paste, ITO nanoparticle paste, and drying the printed conductive printing ink.

Subsequently, the protective layer 270 may be formed on the back electrode layer 250 (operation S870). The step S870 may be performed by printing insulating ink on the back electrode layer 250 and the second electrode 260 and drying the printed insulating ink. Here, the insulating ink is classified into a thermosetting ink, a thermoplastic ink, a UV curing ink, and the like according to a constituent material, and may be referred to as an insulating paste, a printing insulator, an insulating coating agent, or the like. In addition, the printing of the protective layer 270 using the insulating ink is performed by screen printing using, for example, silk plate making, where the silk plate making is performed by using a plate making film produced based on the design of the circuit. It can be produced through a washing process. The protective layer 270 may provide protection from physical shock along with an insulation function for preventing external exposure of the electrical change of the transparent electrode layer 210 and the rear electrode layer 250.

4 and 9, first, a base film 310 may be provided (operation S910). The base film 310 is a substrate on which circuit wiring, an adhesive layer, circuit components, and the like are disposed, and may have a bendable film form. The flexible property of the base film 310, that is, the thin and curved property is suitable for the trend of electronic products which are increasingly miniaturized and thinned, and the curved property can be provided to provide a display suitable for various designs and flexible materials. The base film 310 may be made of a material from which conductive printing inks can be densely printed to form circuit wiring on the base film 310.

In an embodiment, step S910 may include fixing the base film 310 by using a base film fixing part (not shown) to prevent a flow error occurring according to the manufacturing process of the base film 310. Can be. That is, since the base film 310 is made of a flexible and thin material, a flow error may occur during the transfer and mounting process for the manufacturing process according to the steps S910 to S950. To prevent this, the step S910 may be performed using a base film fixing part (not shown) for fixing the base film 310. As the base film fixing part, for example, a jig, an air suction plate, or the like can be used. By mounting the base film 310 on the base film fixing part manufactured according to the base film 310, it is possible to prevent a flow error occurring in a process including a subsequent transfer, mounting, and the like.

Next, the circuit wiring 320 may be formed on the base film 310 (S920). Specifically, step S920 may be performed by printing the circuit wiring 320 using the conductive printing ink and drying the printed circuit wiring 320.

In this case, the circuit wiring 320 may be printed according to a screen printing method, for example, using silk plate making. Silk plate making is made through the photosensitive and washing process using a plate film produced based on the design of the circuit, for example, circuit board plate, insulation plate plate, adhesive plate plate (in metal mask printing), etc. Can be. Silk printing is used to print the printing ink on the base film 310, wherein the printing ink may be a conductive printing ink such as silver paste, carbon paste, and ITO nanoparticle paste. Here, the silver paste may be prepared by combining with an epoxy resin in various concentrations such as 40%, 50%, 60%, 70%, etc., depending on the silver content, but in consideration of conductivity, it is preferable to have a silver content of 50% or more.

The printed circuit wiring 320 may be dried and cured after printing of the circuit wiring 320. The drying may be carried out using infrared drying, various drying methods and drying apparatus available in the art, such as a box oven. In one example, the drying may be performed for at least 5 minutes at a high temperature of 130 degrees or more. In one example, when a PET film is used as the base film 310, drying may be performed for 5 to 10 minutes at a temperature of 120 to 130 degrees. The above configuration is exemplary, and drying conditions, that is, drying temperature and time may vary depending on a drying environment, a printing ink, and the type of the base film 310.

Next, the insulating layer 330 may be formed after the circuit wiring 320 is formed (S930). Specifically, step S930 may be performed by printing the insulating layer 330 on the base film 310 and / or the circuit wiring 320 using the insulating ink, and drying the printed insulating layer 330.

The insulating layer 330 is for insulation of the circuit wiring 320. Specifically, the circuit wiring 320 is not in contact with air to prevent oxidation of the circuit wiring 320 and to protect the circuit wiring 320. It can maintain conductivity. The printing of the insulating ink may be performed by screen printing, and at least a portion of the insulating layer 330 may be printed such that a through-hole 335 is formed for the application of the conductive adhesive and the mounting of the circuit component. Can be. At least a portion of the circuit wire 320 and the circuit component may be electrically connected through the through hole 335. The insulating layer 330 is preferably transparent. However, the insulating layer 330 is exemplary, and according to an embodiment, the insulating layer 330 may be translucent or opaque.

Drying of the printed insulating layer 330 may be performed using infrared drying, various drying methods and drying apparatuses available in the art, such as a box oven. In one example, drying of the insulating layer 330 may be performed between 100 and 130 degrees. The above configuration is exemplary, and drying conditions, that is, drying temperature and time may vary depending on a drying environment, characteristics of an insulating layer, and the like.

Next, an adhesive layer may be formed (step S940). Specifically, step S940 may be formed by applying a conductive adhesive in the through hole 335 of the insulating layer 330, that is, the circuit component 320 is to be installed. In this case, the conductive adhesive is preferably an environmentally friendly conductive adhesive agent that does not use lead, and the application of the conductive adhesive is, for example, a perforated portion similar to an individual dot coating method or a silk printing method using a liquid precise metering dispenser or the like. Various coating techniques available in the art, such as a metal mask printing method in which an adhesive is filled in, may be used. Since the conductive adhesive is used, the circuit component may be stably mounted in the control circuit unit 300 and electrically connected to the circuit wiring 320 through the adhesive layer 340.

In an embodiment, step S920 may further include drying the base film 310 before printing the circuit wiring 320. When the base film 310 is composed of plastics PET, PI, and PU, since the deformation of the base film 310 may occur when the printed circuit wiring is dried, the base film 310 may be dried at a temperature higher than the drying temperature of the printing ink. Initial drying of the base film 310 may be performed at a temperature of 10 to 20 degrees.

In one embodiment, step S940 may further include applying a temporary adhesive. The temporary adhesive here is for fixing a circuit component which is subsequently joined in a simple manner such as, for example, an instant adhesive, a double-sided tape, and the conductive adhesive is sufficiently cured since the conductive adhesive does not cure to the required hardness at room temperature. This is to secure the circuit components until it is stable. Application of the temporary adhesive may be performed before or after application of the conductive adhesive.

Next, the circuit component 350 may be mounted on the adhesive layer 340 (operation S950). Specifically, step S950 may be performed by mounting the circuit component 350 on the adhesive layer 340, that is, the applied conductive adhesive, and drying the applied conductive adhesive.

The mounting of the circuit component 350 may be performed using, for example, a high speed chip mount automation equipment (SMT) used in a conventional PCB, and may be performed using different equipment for each circuit component 350 or each circuit. This may be done using the same equipment for the component 350. In addition, when the circuit component 350 is seated, for example, a physical marking method using a Thomson machine or a visual marking method using vision equipment is used, for example, in order to minimize an error range and mount it at an accurate position. Can be. The above method is exemplary, and various mounting methods may be used according to the embodiment to which the present invention is applied.

After the circuit component 350 is seated, drying of the applied conductive adhesive may be performed. The drying is to increase the adhesion of the circuit component 350 adhered to the base film 310 by the conductive adhesive. The drying may be carried out using infrared drying, various drying methods and drying apparatus available in the art, such as a box oven. In one example, drying may be performed by heating at a drying temperature between 80 and 110 degrees for 5 to 10 minutes. Such a configuration is exemplary, and drying conditions, that is, drying temperature and time may vary depending on circuit components, conductive adhesives, and the like.

In an additional embodiment, the method 900 may further include forming a reinforcement seal 360 in the circuit component 350, as shown with reference to FIG. 6A. The step of forming the reinforcement seal 360 may be performed in consideration of the fact that the conductive adhesive is weak in adhesive strength or durability compared to the solder used to mount the circuit component on a conventional PCB. In order to improve wettability, acid resistance, temperature resistance, and the like, specifically, the reinforcing agent may be applied to the contact portion between the circuit part 350 and the adhesive layer 340 or the entire circuit part 350, and the applied reinforcing agent may be dried. Can be.

The reinforcing agent may be applied by, for example, a separate spray application method using a liquid precise metering dispenser or the like, and may apply the contact surface of the circuit part 350 or the entire circuit part 350. For example, a reinforcing agent may be used as a UV adhesive, a silicone adhesive, and the like, which is exemplary, and according to an embodiment to which the present invention is applied, a rubber-based or synthetic resin-based material may be used.

Drying of the applied reinforcement may differ depending on the reinforcement. For example, when a UV adhesive is used as a reinforcing agent, drying may be performed by UV irradiation through a UV irradiator. For example, when a silicone adhesive is used as a reinforcing agent, infrared drying may be performed by heat through a box oven or the like. Drying can be done in a curing manner. This drying method is exemplary and drying may be performed in various drying methods according to the embodiment to which the present invention is applied.

Steps S1010 and S1020 are described in the same manner as steps S910 and S920 described with reference to FIG. 9. In the following, redundant description is omitted.

5 and 10, after forming the circuit wiring 320, an insulating layer 370 may be formed (step S1030). Specifically, step S1030 may be performed by printing the insulating layer 370 on the base film 310 and the circuit wiring 320 using the insulating ink, and drying the printed insulating layer 370.

The insulating layer 370 may prevent oxidation of the circuit wiring 320, maintain the conductivity by protecting the circuit wiring 320, and at the same time, achieve separation and insulation between the

circuit wirings

320 and 380. The printing of the insulating ink may be performed by screen printing, and at least a portion of the insulating layer 370 may be printed to form a via hole 375 so that at least a portion of the circuit wiring 320 and the circuit wiring 380 may be printed. At least some of them may be electrically connected. Preferably, the insulating layer 370 is transparent, but this is exemplary. In some embodiments, the insulating layer 370 may be translucent or opaque.

Drying of the printed insulating layer 370 may be performed using infrared drying, various drying methods and drying apparatuses available in the art, such as a box oven. In one example, the drying of the insulating layer 370 may be performed between 100 and 130 degrees. The above configuration is exemplary, and drying conditions, that is, drying temperature and time may vary depending on a drying environment, characteristics of an insulating layer, and the like.

Next, the circuit wiring 380 may be formed on the insulating layer 370 (S1040). Operation S1040 may be performed in the same manner as operation S1020, and at least a portion of the circuit wiring 380 may be connected to at least a portion of the circuit wiring 320 through the via hole 375 of the insulating layer 370.

Next, after the circuit wiring 380 is formed, the insulating layer 330 and the adhesive layer 340 may be formed, and the circuit component 350 may be mounted on the adhesive layer 340 (steps S1050 to S1070). Steps S1050 and S1070 are described in the same manner as steps S930 and S950 described with reference to FIG. 9, and thus redundant descriptions are omitted.

In an additional embodiment, the method 1000 may include forming a reinforcement seal 360 in the circuit component 350, as shown with reference to FIG. 6B. Forming the reinforcement seal 360 is described in the same manner as forming the reinforcement seal described with reference to FIGS. 9 and 6A.

In FIG. 10, a method of manufacturing a circuit wiring having a two-layer structure is shown. However, this is merely an example, and circuit wiring having various structures may be used according to an embodiment to which the present invention is applied.

Referring to FIG. 11A, the flexible circuit board may be used together with the display 200 emitting light according to a predetermined pattern and the touch input unit 100 receiving a touch signal of a user as an input. Specifically, the circuit wiring is printed on one region of one surface of the base film and the circuit component is mounted to form the control circuit unit 300. In addition, the inorganic EL display unit 200 may be disposed on another region of one surface of the base film, and the touch input unit 100 may be disposed on the other region of one surface of the base film and / or the display unit 200.

Referring to FIG. 11B, as illustrated, the touch input unit receives a user's touch input and transmits the touch input to the control circuit unit, and the control circuit unit outputs the display unit according to a predetermined pattern based on the input received from the touch input unit. .

Conventionally, the display unit and / or the touch input unit and the control circuit unit for controlling them are manufactured in a separate configuration (that is, manufactured in a separate substrate) and connected, but according to the present invention, as shown in FIGS. 11A and 11B. The control circuit unit, the inorganic EL display unit, and the touch input unit can be integrated and manufactured and used. This simplifies the process, enables economical and efficient production, and can be suitably used for miniaturized and thinned electronic products. In addition, the inorganic EL display device according to the present invention can be utilized in various products in that the whole is transparent and bendable.

As described above, the optimum embodiment has been disclosed in the drawings and the specification. Although specific terms have been used herein, they are used only for the purpose of describing the present invention and are not intended to limit the scope of the invention as defined in the claims or the claims. Therefore, those skilled in the art will understand that various modifications and equivalent other embodiments are possible from this. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims

A touch input unit to receive a user's touch input;

An inorganic EL display unit disposed on the touch input unit and including an inorganic EL (electro luminescence) to emit light in a predetermined pattern; And

A control circuit section disposed on the touch input section or the inorganic EL display section and causing the inorganic EL display section to emit light in accordance with the touch input

Integrated inorganic EL display device comprising a.
The method of claim 1,

The inorganic EL display unit,

Transparent electrode layer; A first electrode disposed on the transparent electrode layer to transfer electric power from the control circuit unit to the transparent electrode layer; A fluorescent layer disposed on the transparent electrode layer to emit light by applying an electric field generated between the transparent electrode layer and the bottom electrode layer; A dielectric layer disposed on the fluorescent layer to provide insulation between the transparent electrode layer and the back electrode layer; The back electrode layer disposed on the dielectric layer to generate an electric field together with the transparent electrode layer; A second electrode disposed on the back electrode layer to transfer electric power from the control circuit unit to the back electrode layer; And a protective layer disposed on the back electrode layer and the second electrode to provide electrical protection and physical protection.
The method of claim 1,

The control circuit unit,

Bendable base film; Circuit wiring formed on the base film by a conductive printing ink printed according to a screen printing method; An insulating layer formed on the circuit wiring by insulating ink printed according to the screen printing method; An adhesive layer formed by a conductive adhesive in a through-hole of the insulating layer; And a circuit component mounted on the adhesive layer.
The method of claim 3, wherein

The control circuit unit,

And a reinforcing seal formed by applying a reinforcing agent to a contact portion between the circuit component and the adhesive layer.
The method of claim 3, wherein

The control circuit unit,

A second insulating layer formed between the circuit wiring and the insulating layer by the insulating ink printed according to the screen printing method; And a second circuit wiring formed between the second insulating layer and the insulating layer by the printing ink printed according to the screen printing method.

At least a portion of the circuit wiring and at least a portion of the second circuit wiring are electrically connected through via-holes of the second insulating layer.
The method of claim 4, wherein

At least one of the circuit wiring and the second circuit wiring extends outside the control circuit portion to be electrically connected to at least one of the touch input portion and the inorganic EL display portion.
The method of claim 6,

And the base film includes an opening formed in one region of the base film for extending outward of at least one of the circuit wiring and the second circuit wiring.
Forming a touch input unit configured to receive a touch input of a user;

Forming an inorganic EL display unit on the touch input unit, the inorganic EL display unit including an inorganic electroluminescence (EL) emitting light in a predetermined pattern; And

Forming a control circuit portion on the touch input portion or the inorganic EL display portion to cause the inorganic EL display portion to emit light in accordance with the touch input;

Method of manufacturing an integrated inorganic EL display device comprising a.
The method of claim 8,

Forming the inorganic EL display unit,

According to the screen printing method, printing a conductive polymer to form a transparent electrode layer;

Printing a conductive printing ink on the transparent electrode layer according to the screen printing method to form a first electrode transferring power from the control circuit part to the transparent electrode layer;

Printing a fluorescent ink according to the screen printing method to form a fluorescent layer on the transparent electrode layer;

Printing a dielectric ink according to the screen printing method to form a dielectric layer on the fluorescent layer to provide insulation between the transparent electrode layer and the back electrode layer;

Printing the conductive printing ink on the dielectric layer according to the screen printing method to form a back electrode layer generating an electric field together with the transparent electrode layer;

Printing the conductive printing ink on the back electrode layer according to the screen printing method to form a second electrode transferring power from the control circuit part to the back electrode layer; And

And forming a protective layer by printing an insulating ink on the back electrode layer and the second electrode in accordance with the screen printing method.
The method of claim 8,

Forming the control circuit unit,

Providing a bendable base film;

Printing a conductive printing ink according to a screen printing method to form circuit wiring on the base film;

Printing an insulating ink according to the screen printing method to form an insulating layer on the circuit wiring;

Forming an adhesive layer using a conductive adhesive in the through-hole of the insulating layer; And

A method for manufacturing an integrated inorganic EL display device, comprising mounting a circuit component on the adhesive layer.
The method of claim 10,

Providing the base film,

And fixing the base film by using a base film fixing part for preventing a flow error of the base film generated in accordance with a manufacturing process.
The method of claim 10,

Forming the circuit wiring,

And drying the base film before forming the circuit wiring to prevent deformation of the base film.
The method of claim 10,

Forming the adhesive layer,

A method of manufacturing an integrated inorganic EL display device, further comprising applying a temporary adhesive, in addition to the conductive adhesive, for stable fixing of circuit components until the conductive adhesive is cured.
The method of claim 10,

Forming the control circuit unit,

Forming a reinforcing seal by applying a reinforcing agent to a contact portion between the circuit component and the adhesive layer.
The method of claim 10,

Forming the control circuit unit,

After the forming of the circuit wiring, printing the insulating ink according to the screen printing method to form a second insulating layer on the circuit wiring; And

Printing the printing ink according to the screen printing method to form a second circuit wiring on the second insulating layer;

Forming an insulating layer on the circuit wiring is performed on the second circuit wiring, at least a portion of the circuit wiring and at least a portion of the second circuit wiring are via-holes of the second insulating layer. Electrically connected via

Method for manufacturing an integrated inorganic EL display device.
The method of claim 15,

At least one of the circuit wiring and the second circuit wiring extends outside the control circuit portion to be electrically connected to at least one of the touch input portion and the inorganic EL display portion.
The method of claim 16,

And the base film includes an opening formed in one region of the base film for extending outward of at least one of the circuit wiring and the second circuit wiring.