WO2014020016A1 - Dispositif de découplage entre antennes - notamment des antennes patchs montées sur un aéronef - Google Patents
Dispositif de découplage entre antennes - notamment des antennes patchs montées sur un aéronef Download PDFInfo
- Publication number
- WO2014020016A1 WO2014020016A1 PCT/EP2013/065987 EP2013065987W WO2014020016A1 WO 2014020016 A1 WO2014020016 A1 WO 2014020016A1 EP 2013065987 W EP2013065987 W EP 2013065987W WO 2014020016 A1 WO2014020016 A1 WO 2014020016A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- patches
- substrate
- antennas
- decoupling
- thickness
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
- H01Q1/521—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/27—Adaptation for use in or on movable bodies
- H01Q1/28—Adaptation for use in or on aircraft, missiles, satellites, or balloons
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/27—Adaptation for use in or on movable bodies
- H01Q1/28—Adaptation for use in or on aircraft, missiles, satellites, or balloons
- H01Q1/286—Adaptation for use in or on aircraft, missiles, satellites, or balloons substantially flush mounted with the skin of the craft
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
- H01Q1/526—Electromagnetic shields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
- H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
- H01Q15/006—Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
- H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
- H01Q15/006—Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces
- H01Q15/008—Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces said selective devices having Sievenpipers' mushroom elements
Definitions
- the invention relates to the general field of antennas. It relates more particularly to the problem of decoupling between antennas close to each other. It applies in particular, but not exclusively, decoupling antennas patches mounted on the fuselage of an aircraft.
- Some electromagnetic systems such as airborne radio altimeter systems, consist of two antennas, a transmitting antenna and a receiving antenna, operating in principle in the same frequency band. Consequently, to avoid direct coupling between the two antennas, a coupling which very substantially disturbs the operation of the system, attempts are made to optimize the respective locations of these antennas. This is to try to keep the two antennas as far as possible from each other in order to limit the coupling, while maintaining a compatible distance between the overall operation and the implantation constraints (mechanical constraints, length and routing of the two antennas). cables, accessibility, etc.).
- the standards in force require spacing the two antennas from each other by a minimum distance of about 70 cm.
- a known solution for reinforcing the decoupling between two antennas close to each other and operating in the same frequency band is to interpose between the two antennas a device having a high impedance in the band considered.
- the high-impedance device is a thin planar element consisting of a dielectric substrate, on one side of which are disposed patches of conductive material. the other face is covered by a conductive plane, acting as a ground plane.
- the dimensions and shapes of the patches and their arrangement is mainly a function of the desired frequency and decoupling.
- Such a metasurface element or metamaterial-based structure is commonly referred to.
- the decoupling of two patch antennas can be developed a posteriori by realizing a high impedance device on a separate printed circuit and by arranging this circuit between the two printed circuits constituting the antennas.
- reinforcing the decoupling of patch antennas disposed on the external surface of the fuselage of an aircraft it is necessary to attempt to use the solution described above, consisting in interposing between the two antennas, in the coupling zone, a printed circuit constituting a high impedance surface.
- the devices currently developed have a relatively rigid structure that favors their implementation on a surface with curvatures, the outer surface of the fuselage of an aircraft for example, the surface of the device hardly fit the profile of the surface on which it is placed, especially when the device has a large surface.
- the substrate used to make the printed circuit constituting the high impedance structure has a certain elasticity, it is limited and the maintenance of the surface of the device in close contact with that of the fuselage requires the use of means powerful fasteners disposed at different points of the high impedance device, generally at the periphery of said device and which generally require intervention on the structure itself.
- An object of the invention is to provide a simple device for improving the decoupling between antennas, in particular in the case of radio equipment using several patch antennas operating in the same frequency band.
- Another object of the invention is to propose a device that is simple to implement and that can be used both for equipping new aircraft with properly decoupled antennas and for simply remounting aircraft already in service to improve the performance of the aircraft. decoupling antennas already installed on the fuselage.
- an object of the invention is to propose a solution, both effective and simple to implement, the coupling problems that may exist between two antennas placed close to each other on the surface of a carrier structure that is not necessarily flat, the fuselage of an aircraft for example, this solution being applicable both during the installation of the equipment concerned on the structure in question, and during a maintenance operation to improve the equipment.
- the subject of the invention is a high-impedance passive device, in particular enabling radio-frequency decoupling between two antennas operating at least partially in a common frequency band disposed on the surface of a carrier structure.
- the device comprises a substrate consisting of a layer of flexible dielectric material of given thickness e, on the surface of which patches of conducting material are arranged having a given geometry and arrangement, as well as means for ensuring that it is fixed on a mass plane on the surface of the structure, so that the layer formed by the patches is separated from the surface of the structure by the thickness of the substrate; the substrate thickness e, being determined as a function of the geometry, the number and the arrangement of the patches as well as the aerodynamic constraints imposed on the devices, the latter has an impedance producing the desired decoupling in the frequency band considered.
- the device according to the invention comprises:
- a substrate of dielectric material of given thickness disposed between the sheet of conductive material and the patches, the thickness, e, of dielectric material between the patches and the surface of the sheet of conductive material facing said patches maintaining the latter; at the desired distance from the latter;
- the thickness e of the substrate, as well as the geometry, the number and the arrangement of the patches are determined, taking into account the external constraints, so as to obtain the desired decoupling value.
- the device according to the invention then comprises a ground plane integrated in its own structure and it is fixed to the surface of the carrier structure via this ground plane.
- the ground plane on which the device according to the invention is fixed is constituted by the structure itself.
- the device according to the invention can have the following characteristics which can optionally be combined.
- the dielectric material of the substrate is a flexible material of elastomeric type that can match the shape of the surface of the structure on which the device is mounted.
- the dielectric material used is polychloroprene.
- the patches are electrically connected to said sheet of conductive material by conductors, or vias
- the means for fixing the device to the surface of the structure consist of a layer of adhesive material disposed on the face of the conductive sheet facing the surface of said supporting structure or on the face of the device intended to be fixed to this same surface.
- the permittivity of the material forming the substrate, the thickness of the substrate, e, separating said patches from the conductive sheet as well as the dimensions of the patches and their arrangement are defined in such a way that the device presents the desired impedance in the frequency band considered, and that its thickness is sufficiently small to minimize the effects of the implementation of the device on the aerodynamic characteristics of the structure.
- a substrate layer covers the plane of the patches so as to provide mechanical and / or chemical protection of the free surface of the device, in other words the face bearing the patches, and in particular protection against erosion .
- the external surface of the device is covered with a purely dielectric coating.
- FIG. 3 illustrates an example of application of the device according to the invention to an aircraft
- the device according to the invention when placed on a plane, takes the form of a flat element 1 1 having a conductive surface 12 forming a plane of mass, above which are placed pellets, or patches, conductors 13. These patches 13 are preferably placed in the same plane in a preferably regular arrangement, a matrix arrangement as shown in Figure 1 for example.
- the space between the conductive face and the plane in which the patches are located is embedded in a dielectric substrate 15.
- the conductive patches 13 are connected to the conductive face 12 via connecting links or vias 14.
- the conductive patches 13 can be isolated from the conductive face 12. According to the form considered the distance between the conductive face and the plane of the patches is of course different.
- the size and the implantation pitch of the patches 13, as well as the thickness e of substrate separating the surface of the patches from the conductive surface 12, are moreover determined so that the structure thus formed has a high impedance for the frequency band considered, which band corresponds to the operating band of the antennas 17 and 18 whose decoupling is to be reinforced.
- the determination of these parameters can be carried out in any known manner, by means of a radio circuit design software for example.
- the thickness e is nevertheless chosen as low as possible so as to that the installation of the device on this wall does not generate aerodynamic turbulence.
- the substrate used to produce the high-impedance device according to the invention is advantageously constituted by a flexible material, an elastomeric material, chosen in particular for its dielectric and mechanical characteristics (elasticity, erosion resistance, etc.), a polychloroprene for example.
- the embodiment of the device according to the invention is then done by integrating on one side of the substrate 15 the conductive patches 13, metal pellets for example, and on the other side the conductive layer 12, a thin sheet of metal for example, then by electrically connecting (placing vias) the patches 13 to the conductive layer 12 through the substrate 15.
- the electrical connections 14 are made by piercing the substrate 15 at the level of the patches 13 and filling with a brazing metal holes made.
- the surface of the patches 13 is covered with a coating that limits erosion.
- This coating may consist of a top layer of elastomeric material, the material constituting the substrate generally, as in the embodiment illustrated in Figure 2. It may also be constituted by a paint layer having the desired dielectric characteristics.
- the device 1 1 thus produced has the advantage, because of its flexible and elastic structure, that it can be placed on a surface that is not necessarily flat, the support face of the device on said surface, the face that carries the conductive layer 12 generally , which can conform naturally to fit the profile of the considered surface.
- the attachment of the device and its adjustment on this surface, made by printing a minimum of stresses on the substrate 15, are advantageously facilitated with respect to a device comprising a rigid substrate.
- the device according to the invention can therefore be placed and held in place, in contact with the surface 19, by any fastening means.
- the device according to the invention is attached to the surface considered by simple bonding.
- the structure described above can be advantageously completed by a layer 16 of adhesive material, an acrylic adhesive film for example, covering the laying surface of the device on the structure, that is to say, in the case of the embodiment considered, the face of the substrate 15 which carries the conductive layer 12 generally.
- FIG. 3 shows an example of application of the device according to the invention for decoupling antennas forming a radio altimeter, which equipment is generally doubled, as illustrated in FIG.
- the device according to the invention is placed on the zone of the fuselage, 31 or 32, which separates the two antennas 17 and 18 of the radioaltimeter considered.
- These antennas are, for functional reasons, located under the fuselage, at a place where the wall 19 of the fuselage is generally not flat, so that the flexible, deformable nature of the substrate 15 appears here as particularly advantageous.
- the device is then held in place by simply gluing it with the adhesive film 16.
- the thickness of the substrate 15 is determined in such a way that the device 11 has a thickness substantially identical to that of the patch antennas 17 and 18 between which it is placed.
- the shape and dimensions of the patches 13 are then determined so as to maximize the impedance of the device, given the thickness of the substrate 15 and its dielectric characteristics.
- the device 1 1 according to the invention may have the following structural and dimensional characteristics:
- Polychloroprene substrate with a thickness of 3.175 mm and a relative permittivity of 3.5;
- FIGS. 1 to 3 corresponds to a particular embodiment which has the main advantage of being able to be mounted on any type of conductive support or not.
- the fact of having a ground plane 12 integrated in the device makes it possible to mount it on any support without the decoupling characteristics are altered.
- such an embodiment makes it possible to have conductive elements, patches, having an inductive and capacitive impedance, the inductive component of the impedance resulting from the presence of vias connecting each patch 13 to the ground plane 12 constituted by by the sheet of conductive material integrated in the device.
- An essential characteristic of the invention is here the malleability of the device and its propensity to easily marry the profile of the surface on which it is fixed, so that its attachment itself does not require the implementation of any means that can alter in any way the surface of the structure under consideration, a single layer of adhesive being sufficient.
- the patches 13 are mounted floating relative to the ground plane 12 constituted by the metal sheet, the vias connecting the patches to the ground plane being then absent from the structure it remains otherwise identical to that of the previous embodiment.
- ground plane provided by the metal sheet 12 in the first embodiment described can then be provided directly by the support, so that the latter disappears.
- Such an embodiment is thus particularly suitable for placing on the surface 19 of the fuselage of an aircraft, surface 19 generally made of metal or made of composite materials incorporating a metal protection to meet "electrical" requirements of the type protection against lightning or maintaining electrical continuity.
- the surface of the aircraft then constitutes the ground plane on which the device is fixed on the structure.
- the structure of the device is then simply reduced to a surface consisting of patches such as those described above, integrated in the thickness of a substrate layer. Such an embodiment is illustrated in FIG. 5.
- This embodiment has the advantage of obtaining a very homogeneous device, formed of a substrate layer in which the patches are incorporated, and therefore more resistant to abrasion, without the need for a coating. complementary protection.
- the device obtained also has the advantage of being easier to fix by means of adhesive on the support considered, insofar as the lower face of the device is constituted by the surface of the substrate directly in contact with the substrate. the adhesive film 16 and not by a metal sheet.
- Such an embodiment can thus perfectly be used to carry out operations of setting up an additional decoupling element such as that illustrated in FIG.
- the major advantage of the device according to the invention resides, more generally, in the fact that its implementation on an existing structure to improve the decoupling of two antennas mounted on this structure, close to one of the other, requires practically no intervention on the structure itself or on the antennas concerned.
- the flexible and monobloc structure of the device advantageously makes it possible to mount it on any support profile, plane or not, the fixing of the device on the support considered can be carried out by simple gluing, by means of an adhesive film by for example, despite the aerodynamic stresses to which the device may be subjected, when it is mounted on the surface of a particular aircraft fuselage.
- this solution is not limited to complex and fragile structures such as an aircraft fuselage, but can be envisaged. for various structures.
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Astronomy & Astrophysics (AREA)
- Aviation & Aerospace Engineering (AREA)
- General Physics & Mathematics (AREA)
- Remote Sensing (AREA)
- Electromagnetism (AREA)
- Details Of Aerials (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/418,377 US9577326B2 (en) | 2012-07-31 | 2013-07-30 | Device for decoupling antennas mounted on an aircraft |
CN201380042214.9A CN104685709B (zh) | 2012-07-31 | 2013-07-30 | 天线解耦装置,尤其是安装在航空器上的贴片天线 |
BR112015001812A BR112015001812A2 (pt) | 2012-07-31 | 2013-07-30 | dispositivo de desacoplamento entre antenas, em particular antenas patchs montadas sobre uma aeronave |
EP13744511.0A EP2880711A1 (fr) | 2012-07-31 | 2013-07-30 | Dispositif de découplage entre antennes - notamment des antennes patchs montées sur un aéronef |
CA2880039A CA2880039A1 (fr) | 2012-07-31 | 2013-07-30 | Dispositif de decouplage entre antennes - notamment des antennes patchs montees sur un aeronef |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1257448 | 2012-07-31 | ||
FR1257448A FR2994342B1 (fr) | 2012-07-31 | 2012-07-31 | Dispositif de decouplage entre antennes - notamment des antennes patchs montees sur un aeronef |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2014020016A1 true WO2014020016A1 (fr) | 2014-02-06 |
Family
ID=47227949
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2013/065987 WO2014020016A1 (fr) | 2012-07-31 | 2013-07-30 | Dispositif de découplage entre antennes - notamment des antennes patchs montées sur un aéronef |
Country Status (7)
Country | Link |
---|---|
US (1) | US9577326B2 (fr) |
EP (1) | EP2880711A1 (fr) |
CN (1) | CN104685709B (fr) |
BR (1) | BR112015001812A2 (fr) |
CA (1) | CA2880039A1 (fr) |
FR (1) | FR2994342B1 (fr) |
WO (1) | WO2014020016A1 (fr) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3295515A4 (fr) * | 2015-05-12 | 2019-01-09 | Board of Regents, The University of Texas System | Systèmes et procédés comprenant des métamatériaux anisotropiques à variation spatiale en vue d'une compatibilité électromagnétique |
US10396443B2 (en) * | 2015-12-18 | 2019-08-27 | Gopro, Inc. | Integrated antenna in an aerial vehicle |
EP3199976B1 (fr) * | 2016-01-29 | 2022-04-20 | Denso Corporation | Antenne radar plane pour détection multicible et multimode automobile |
JP6704169B2 (ja) * | 2016-05-31 | 2020-06-03 | パナソニックIpマネジメント株式会社 | 誘電体基板及びアンテナ装置 |
US10096893B2 (en) * | 2016-12-02 | 2018-10-09 | Laird Technologies, Inc. | Patch antennas |
JP7057517B2 (ja) * | 2017-06-23 | 2022-04-20 | 株式会社ソシオネクスト | アンテナ装置 |
WO2020124315A1 (fr) * | 2018-12-17 | 2020-06-25 | 华为技术有限公司 | Procédé et structure de découplage électromagnétique d'un réseau d'antennes |
US11355838B2 (en) * | 2019-03-18 | 2022-06-07 | Infineon Technologies Ag | Integration of EBG structures (single layer/multi-layer) for isolation enhancement in multilayer embedded packaging technology at mmWave |
US11038277B2 (en) * | 2019-07-24 | 2021-06-15 | The Boeing Company | High impedance surface (HIS) enhanced by discrete passives |
CN114982063A (zh) * | 2020-01-16 | 2022-08-30 | 三星电子株式会社 | 通信系统中的包括浮置辐射器的天线模块以及包括其的电子设备 |
US11217877B2 (en) * | 2020-01-24 | 2022-01-04 | Motorola Mobility Llc | Managing antenna module heat and RF emissions |
TWI784680B (zh) * | 2021-08-19 | 2022-11-21 | 特崴光波導股份有限公司 | 天線結構及天線陣列結構 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2001069723A1 (fr) * | 2000-03-15 | 2001-09-20 | Hrl Laboratories, Llc. | Antenne en trefle vivaldi |
WO2001073893A1 (fr) * | 2000-03-29 | 2001-10-04 | Hrl Laboratories, Llc | Surface d'impedance reglable |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6670932B1 (en) * | 2000-11-01 | 2003-12-30 | E-Tenna Corporation | Multi-resonant, high-impedance surfaces containing loaded-loop frequency selective surfaces |
US6441792B1 (en) * | 2001-07-13 | 2002-08-27 | Hrl Laboratories, Llc. | Low-profile, multi-antenna module, and method of integration into a vehicle |
US6952190B2 (en) * | 2002-10-16 | 2005-10-04 | Hrl Laboratories, Llc | Low profile slot antenna using backside fed frequency selective surface |
EP1723696B1 (fr) * | 2004-02-10 | 2016-06-01 | Optis Cellular Technology, LLC | Mecanismes accordables |
WO2006121818A2 (fr) * | 2005-05-05 | 2006-11-16 | Rodrigo Alvarez Icaza Rivera | Transducteurs a fibres elastomeres dielectriques |
DE102006012452B4 (de) * | 2006-03-17 | 2010-10-28 | Imst Gmbh | PBG-Struktur mit Berandung |
US20080136710A1 (en) * | 2006-12-07 | 2008-06-12 | Nokia Corporation | Apparatus including antennas providing suppression of mutual coupling between current-carrying elements and methods for forming same |
-
2012
- 2012-07-31 FR FR1257448A patent/FR2994342B1/fr not_active Expired - Fee Related
-
2013
- 2013-07-30 EP EP13744511.0A patent/EP2880711A1/fr not_active Withdrawn
- 2013-07-30 WO PCT/EP2013/065987 patent/WO2014020016A1/fr active Application Filing
- 2013-07-30 CA CA2880039A patent/CA2880039A1/fr not_active Abandoned
- 2013-07-30 CN CN201380042214.9A patent/CN104685709B/zh active Active
- 2013-07-30 US US14/418,377 patent/US9577326B2/en active Active
- 2013-07-30 BR BR112015001812A patent/BR112015001812A2/pt not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001069723A1 (fr) * | 2000-03-15 | 2001-09-20 | Hrl Laboratories, Llc. | Antenne en trefle vivaldi |
WO2001073893A1 (fr) * | 2000-03-29 | 2001-10-04 | Hrl Laboratories, Llc | Surface d'impedance reglable |
Non-Patent Citations (1)
Title |
---|
CALOZ C ET AL: "Composite right/left-handed transmission line metamaterials", IEEE MICROWAVE MAGAZINE, IEEESERVICE CENTER, PISCATAWAY, NJ, US, vol. 5, no. 3, 1 September 2004 (2004-09-01), pages 34 - 50, XP011119759, ISSN: 1527-3342 * |
Also Published As
Publication number | Publication date |
---|---|
FR2994342B1 (fr) | 2016-02-05 |
CN104685709A (zh) | 2015-06-03 |
US20150194728A1 (en) | 2015-07-09 |
CN104685709B (zh) | 2017-10-20 |
EP2880711A1 (fr) | 2015-06-10 |
BR112015001812A2 (pt) | 2017-07-04 |
US9577326B2 (en) | 2017-02-21 |
CA2880039A1 (fr) | 2014-02-06 |
FR2994342A1 (fr) | 2014-02-07 |
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