WO2014015712A1

WO2014015712A1 - Heat dissipation system for computer server and heat dissipation and temperature decreasing method therefor

Info

Publication number: WO2014015712A1
Application number: PCT/CN2013/076658
Authority: WO
Inventors: 齐口
Original assignee: 齐贸屋贸易（深圳）有限公司
Priority date: 2012-07-26
Filing date: 2013-06-03
Publication date: 2014-01-30
Also published as: CN102854949A

Abstract

The present invention relates to a heat dissipation system for a computer server and a heat dissipation and temperature decreasing method therefor, comprising a control module, a temperature sensing module, a server, and a plurality of heat dissipation devices arranged on the cabinet of the server. Each of the heat dissipation devices comprises a compressor, a condenser and an evaporator, the compressor being a direct current inverter compressor, and the operating power supply of the heat dissipation devices being input from the server. The temperature sensing module is used for monitoring the surface temperature of an internal electronic component of the server. The control module comprises a sensing module and an execution module connected thereto, the sensing module being used for detecting the usage rate change of an internal electronic component of the server during operating and monitoring the change of the operating current of the main board of the server, and the execution module being used for processing a signal transmitted from the sensing module and temperature sensing module, and controlling the operation of the heat dissipation devices. The present invention is capable of performing refrigeration rapidly and effectively, saving electric energy, and improving the heat dissipation efficiency. Furthermore, the structure is simple, the volume is small, the efficiency is high, and the installation and maintenance are both convenient.

Description

Computer server heat dissipation system and method for performing heat dissipation and cooling thereof

Technical field

The invention belongs to the technical field of heat dissipation of a computer server, and particularly relates to a heat dissipation system of a computer server and a method for performing heat dissipation and cooling thereof.

Background technique

Nowadays, computer network service systems are getting bigger and bigger. With the introduction of cloud technology, the requirements for computer servers will become higher and higher. The heat generated by the server is one of the biggest destructive factors. The increase in heat generation temperature affects the service life of the server and seriously affects the stability of its work. How to dissipate the server is still an important technical issue.

At present, most of the computer server cooling system and its heat dissipation method use central air conditioning to dissipate heat or use water-cooled fan coils to dissipate heat. These cooling and cooling systems not only occupy a large amount of space and space, but also have complicated structure to cause troubles in installation and maintenance. The key is that these cooling systems have a fatal flaw. When there is a sudden power outage, the server will automatically start the backup battery immediately, continue to maintain its work, and the work process is almost unaffected. However, at this time, the cooling system cannot work because there is no spare battery, and the server cannot be dissipated, which seriously affects the computing speed and service life of the server.

On the other hand, the existing server cooling system has the following disadvantages:

First, the use of central air conditioning to dissipate heat can not be targeted to the local heat dissipation in the server, which can not effectively protect the local.

Second, the fan coil water cooling system not only requires the external cooling tower to supply cold water and water inlet and outlet pipes, but also the fan coil area is large, the heat exchange rate of water is not very good; plus the computer server is layered, the lower layer The heat will flow to the upper layer, resulting in the highest temperature at the top layer and the largest amount of heat required. The existing heat dissipation system does not solve this problem.

From another point of view, the existing computer server cooling system and its heat dissipation method are generally delayed passive mode. When the temperature sensor detects that the temperature of the air in the server cabinet rises, the heat dissipation system starts to work. At this time, the server The local temperature has risen very high and the heat dissipation system does not provide effective protection. Even some server cooling systems, regardless of the server working, the cooling system has been running, the purpose is to make the ambient temperature in the space where the server is located stable within a certain temperature range, the overall heat dissipation, slow temperature drop, low cooling efficiency. At the same time, this approach is bound to waste a lot of power.

technical problem

The technical problem to be solved by the present invention is to provide a computer server heat dissipation system and a heat dissipation method thereof. The heat dissipation device is actively activated in advance according to the use condition of the server to perform preheating, and is not affected by the power failure, and can be synchronized with the operation of the server.

Technical solution

The present invention is achieved by providing a computer server heat dissipation system including a control module, a temperature sensing module, a server, and a plurality of heat dissipating devices disposed on the server cabinet, the heat dissipating device including a compressor, a condenser, and An evaporator, the compressor is a DC inverter compressor, an operating power of the heat sink is input from the server; the temperature sensing module is configured to monitor a surface temperature of an internal electronic component of the server; The module includes a sensing module and an execution module connected thereto, the sensing module is configured to detect a change in usage of an internal electronic component of the server, and monitor a change in a working current of a motherboard of the server, where the performing The module is configured to process signals transmitted by the sensing module and the temperature sensing module, and control operation of the heat sink.

Further, the evaporator is disposed on a front side or a back side of the cabinet, and the evaporator is provided with a cooling fan for blowing heat to the internal electronic components of the server, and the outside of the evaporator is provided with a protective cover.

Further, the compressor and the condenser are disposed at the top or the back of the cabinet, and the outside of the compressor and the condenser are provided with a protective cover.

Further, an exhaust air outlet is disposed at a top of the protective cover, and an exhaust fan is disposed at the exhaust air outlet; an air suction port is disposed at a bottom of the outer cover, and a suction fan is disposed at the air suction opening.

Further, the internal electronic components of the server include a motherboard card, a CPU, a memory module, and a hard disk.

Further, a multi-layer server is arranged in the cabinet.

The present invention also provides a method for cooling and cooling a computer server heat dissipation system as described above, comprising the steps of:

Step 1 , when the control module detects that the usage rate of one or more electronic components in the server exceeds a preset upper limit value, that is, the heat dissipation device is controlled to be activated, and the server is actively provided in advance. Heat dissipation

In the second step, the heat dissipation device continues to operate. During the operation, the control module continuously detects the change of the usage rate of the electronic component, and when the usage rate of the electronic component is detected to be lower than a preset lower limit value. And the temperature sensing module detects that the surface temperature of the electronic component is lower than a preset temperature limit value, the heat dissipation device reduces the cooling capacity operation, or stops the operation;

Step 3: When the temperature sensing module detects that the surface temperature of the electronic component is higher than a temperature limit value, the sensing module activates the heat dissipation device to dissipate heat until the temperature is lower than a temperature limit value, and the heat dissipation device Stop running

Step 4: The control module detects that the current of the motherboard of the server increases and exceeds a preset current limit value, that is, controls the heat sink to start, and actively releases heat to the server in advance;

Step 5: When the computer server system is powered off, the computer server heat dissipation system runs through the battery inside the server system, and continuously cools the server.

Beneficial effect

Compared with the prior art, in the computer server heat dissipation system and the heat dissipation method thereof, the DC inverter compressor is used, and the power is input from the server. When the server is suddenly powered off, the server immediately uses the backup power supply to continue to operate, and the heat sink is used because Getting power from the server can also work immediately, in sync with the server's work, and continue to give the server a cool state. On the other hand, the sensing module can detect the change of the usage rate of the electronic components in the server, or monitor the change of the working current of the server motherboard. When the variation is greater than the set limit value, the execution module actively turns on the heat sink. Pre-heat dissipation and adjustable cooling capacity of the heat sink. To achieve the purpose of fast and effective cooling, save energy and improve heat dissipation efficiency. Moreover, the structure is simple, the volume is small, the efficiency is high, and the installation and maintenance are very convenient.

DRAWINGS

Figure 1 is a schematic diagram of the control of the present invention;

2 is a perspective view of a preferred embodiment of the present invention;

3 is a perspective view showing the open state of the rear door of the cabinet of FIG. 1;

Figure 4 is a perspective view of the shieldless cover and the protective cover of Figure 3;

Figure 5 is a perspective view of another perspective of Figure 4;

Figure 6 is a perspective view of another preferred embodiment of the present invention;

7 is a perspective view showing the open state of the rear door of the cabinet of FIG. 6;

Figure 8 is a perspective view of Figure 7 without a protective cover and a protective cover.

Embodiments of the invention

The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It is understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

Please refer to FIG. 1 , which is a schematic diagram of a control principle of the present invention. The present invention includes a control module 1 , a temperature sensing module 2 , a server 3 , and a heat sink 4 .

The control module 1 includes an inductive module 11 and an execution module 12 connected thereto. The server 3 includes a plurality of electronic components 31 that generate a large amount of heat. The electronic components 31 include a motherboard card, a CPU, a memory module, and a hard disk. These electronic components have a remarkable feature, which requires power consumption during work calculation or data exchange, so that the operating current of the main board 32 of the server 3 is increased, and heat is easily produced. If it is not cooled down in time, it will slow down its operation speed. In serious cases, its internal precision electronic chip will even be burned out. Therefore, timely cooling of the server is an important measure to ensure the stability of its operation. Moreover, the usage rate of the electronic component 31 and the magnitude of the operating current are proportional to the amount of heat generated. The higher the usage rate, the larger the operating current, and the longer the usage time, the greater the heat generated, and vice versa. . Therefore, it is possible to predict the change in heat generation by detecting the change in the usage rate and the operating current, and actively take measures to reduce the surface temperature of the electronic component in advance.

The sensing module 11 can detect the change of the usage rate of the electronic component 31 in the server 3 and the operating current of the main board 32. The executing module 12 can process the signal transmitted by the sensing module 11 and can also control the operation of the heat sink 4. When the amount of data processing of the server 3 is increased, the amount of cooling of the heat sink 4 is increased, and the server 3 is actively pre-cooled. The temperature sensing module 2 monitors the surface temperature of the electronic component 31 in real time, and transmits the monitoring signal to the execution module 12 for processing, and the execution module 12 can analyze and judge the monitoring data. When the temperature exceeds the set limit value, the heat sink 4 operates, and when the temperature decreases and falls below the limit value, the heat sink 4 reduces the cooling capacity operation or stops the operation. The temperature sensing module 2 can supplement the above heat dissipation method. In any case, as long as the surface temperature of the electronic component is higher than the limit value, the heat sink 4 can be activated to perform passive heat dissipation.

In the present invention, the sensing module 11 detects both the change in the usage rate of the electronic component 31 in the server 3 and the operating current change of the main board 32, and the monitoring signal is transmitted to the executing module 12 for processing. Of course, in actual use, the sensing module 11 can also detect only the change of the usage rate of the electronic component 31 in the server 3 during operation or only the operating current of the main board 32. When the sensing module 11 detects electronic components, such as a motherboard card, a CPU, a memory module, and a hard disk, when one or more usage rates increase beyond a set upper limit, the execution module 12 controls the heat sink 4 to start. Proactively dissipate heat to the server 3 in advance. Moreover, if the sensing module 11 detects that the current of the main board 32 of the server 3 increases and exceeds a preset limit value, the execution module 12 also controls the heat sink 4 to be activated to actively dissipate heat to the server 3 in advance.

Referring to FIG. 2 to FIG. 5, a preferred embodiment of the present invention includes a server 3, a heat sink 4, and a cabinet 5. The heat sink 4 of the present embodiment is disposed on the computer server cabinet 5. The heat sink 4 includes a compressor 41, a condenser 42, and an evaporator 43. In the present embodiment, the compressor 41 is a DC inverter compressor, which has the characteristics of small volume, high energy efficiency, and fast cooling. Since the DC power source is used, the compressor 41 can use the DC power in the server 3 as its power source, without being affected by the power failure, and can be synchronized with the operation of the server 3. This is also one of the innovations of the present invention. The power system of the existing server heat sink is different from the power system of the server. The server is often equipped with a backup power source, and the heat sink is not. Under normal circumstances, the heat sink 4 works by converting the external AC power into DC power through the current conversion device. When a sudden power failure occurs, the computer server is powered by the backup power system, and the operation is not affected, but the heat sink has to be If the power is turned off and the work stops, the server cannot be dissipated, which will seriously affect the computing speed and service life of the server, and even cause the electronic components of the server to burn out due to high temperature.

The evaporator 33 is disposed on the back of the cabinet 5, and a multi-layer computer server 3 is installed inside the cabinet 5, which is ten layers in this embodiment. The rear side of the cabinet 5 is provided with a rear door 51. The evaporator 43 is disposed on the rear door 51 of the cabinet 5, which saves space and can be easily opened for maintenance. The evaporator 43 is provided with two cooling fans 431, and the cooling fan 431 can blow heat to the electronic components in the server 3. The outer portion of the evaporator 43 is provided with a protective cover 44 for enclosing the cold air without spreading, blowing the cold air from the fan port 45 and protecting the pipeline interface of the evaporator 43. The compressor 41 and the condenser 42 are disposed at the top of the cabinet 5 to facilitate the provision of an exhaust duct (not shown) such that heat generated by the condenser 42 is exhausted from the top of the cabinet 5. The outside of the compressor 41 is provided with a protective cover 46 for guiding the discharge of hot air for protecting the pipes of the compressor 41 and the condenser 42.

Of course, the evaporator 43 can also be disposed on the front side of the cabinet 5 (not shown) to dissipate heat from the electronic components in the server 3.

Referring to FIG. 6 to FIG. 8, which is another preferred embodiment of the present invention, the embodiment also includes a server 3', a heat sink 4', and a cabinet 5'. A plurality of computer servers 3' are disposed in the cabinet 5', and this embodiment is ten layers. The heat sink 4' specifically dissipates heat to the server 3'. The heat sink 4' includes a compressor 41', a condenser 42', and an evaporator 43'. The embodiment is different from the previous embodiment only in that the evaporator 43' of the present embodiment is disposed on the rear door 51' on the back of the cabinet 5', and the outer portion of the evaporator 43' is provided with a protective cover 44'; the compressor 41 'And the condenser 42' is disposed on the back of the evaporator 43'. The outer portion of the condenser 42' is provided with a cover 45'. The outer cover 45' is fixed to the rear door 51' of the cabinet 5'. The top of the outer cover 45' is provided with an air outlet 46', and an exhaust fan 47 is provided at the air outlet 46'. '; at the bottom of the outer cover 45' is provided with a suction opening (not shown), and a suction fan 48' is provided at the suction opening. The rest of the assembly and heat dissipation control methods are exactly the same as those in the previous embodiment, and will not be described again.

Referring to FIG. 1 together, the computer server heat dissipation system of the present invention can adopt the following method to achieve the purpose of cooling and cooling the computer server:

In the first step, the control module 1 detects that the electronic component 31 in the server 3, such as the CPU, the memory module and the hard disk, may have one or more usage rates exceeding the set upper limit value, that is, the heat sink 4 is controlled. Start up, actively radiate heat to the server 3 in advance; the higher the usage rate of the electronic component 21, the faster the running speed of the heat sink 4, the larger the cooling capacity, and the faster the heat dissipation speed;

In step two, the heat sink 4 continues to operate, and the control module 1 continuously detects the change in the usage rate of the electronic component 31. When it is detected that the electronic component usage rate of the server 3 is lower than the set lower limit value, until the temperature sensing module 2 detects that the surface temperature of the electronic component 31 is lower than a limit value preset in the heat dissipation device 1, the heat dissipation The device 4 reduces the cooling capacity operation, or stops the operation, and saves electric energy;

Step 3: When the temperature sensing module 2 detects that the surface temperature of the electronic component 31 is higher than the limit value, the sensing module 11 activates the heat sink 4 to dissipate heat; when the temperature is lower than the limit value, the heat sink 4 stops operating;

Step 4: When the control module 1 detects that the current of the mainboard 32 of the server 3 increases and exceeds a preset limit value, the control device 4 is activated to actively dissipate heat to the server 3 in advance;

Step 5: When the computer server system is powered off, the computer server cooling system can be operated by the battery inside the server 3 system, and the server 3 is continuously cooled.

In summary, the computer server heat dissipation system and the heat dissipation method thereof of the present invention, compared with the conventional heat dissipation method, when the server 3 is suddenly powered off, will not stop working because the heat sink device 4 has no power, but may be from the server 3. The power supply is immediately activated, synchronized with the operation of the server 3, and continues to dissipate heat to the server 3. Moreover, the heat dissipating device 4 can detect the change of the usage rate of the important electronic components 31 on the computer server 3 and the working current change of the main board 32 in real time, predict the heat generation amount in advance, and adjust the cooling speed of the heat dissipating device 4 in advance. Take measures to cool down and heat in advance. The heat dissipation system of the invention has a faster reaction speed, faster and more efficient cooling, and improves heat dissipation efficiency, and the energy saving effect is more remarkable.

The above is only the preferred embodiment of the present invention, and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection of the present invention. Within the scope.

Claims

A computer server heat dissipation system, comprising: a control module, a temperature sensing module, a server, and a plurality of heat dissipating devices disposed on the server cabinet, the heat dissipating device comprising a compressor, a condenser and an evaporator, The compressor is a DC inverter compressor, and a working power source of the heat sink is input from the server; the temperature sensing module is configured to monitor a surface temperature of an internal electronic component of the server; and the control module includes a sensing module and An execution module connected to the sensing module, configured to detect a change in usage of an internal electronic component of the server, and monitor a change in a working current of a motherboard of the server, where the execution module is used for The signals transmitted by the sensing module and the temperature sensing module are processed, and the operation of the heat sink is controlled.
A computer server heat dissipation system according to claim 1, wherein said evaporator is disposed on a front side or a back side of said cabinet, said evaporator being provided with a cooling fan for blowing heat to internal electronic components of the server, The outer part of the evaporator is provided with a protective cover.
The computer server heat dissipation system according to claim 1, wherein said compressor and condenser are disposed at a top or a back of said cabinet, and said compressor and said condenser are provided with a protective cover.
The computer server heat dissipation system according to claim 3, wherein an air exhaust port is disposed at a top of the protective cover, an exhaust fan is disposed at the air exhaust port, and an air suction port is disposed at a bottom of the outer cover. A suction fan is provided at the air inlet.
The computer server heat dissipation system according to claim 1, wherein the internal electronic components of the server comprise a motherboard card, a CPU, a memory module, and a hard disk.
A computer server heat dissipation system according to claim 1, wherein said cabinet is provided with a plurality of servers.
A method for cooling and cooling a computer server heat dissipation system according to claim 1, comprising the steps of:

Step 1 , when the control module detects that the usage rate of one or more electronic components in the server exceeds a preset upper limit value, that is, the heat dissipation device is controlled to be activated, and the server is actively provided in advance. Heat dissipation

In the second step, the heat dissipation device continues to operate. During the operation, the control module continuously detects the change of the usage rate of the electronic component, and when the usage rate of the electronic component is detected to be lower than a preset lower limit value. And the temperature sensing module detects that the surface temperature of the electronic component is lower than a preset temperature limit value, the heat dissipation device reduces the cooling capacity operation, or stops the operation;

Step 3: When the temperature sensing module detects that the surface temperature of the electronic component is higher than a temperature limit value, the sensing module activates the heat dissipation device to dissipate heat until the temperature is lower than a temperature limit value, and the heat dissipation device Stop running

Step 4: The control module detects that the current of the motherboard of the server increases and exceeds a preset current limit value, that is, controls the heat sink to start, and actively releases heat to the server in advance;

Step 5: When the computer server system is powered off, the computer server heat dissipation system runs through the battery inside the server system, and continuously cools the server.