WO2014007007A1 - Electronic component mounting board - Google Patents

Electronic component mounting board Download PDF

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Publication number
WO2014007007A1
WO2014007007A1 PCT/JP2013/065125 JP2013065125W WO2014007007A1 WO 2014007007 A1 WO2014007007 A1 WO 2014007007A1 JP 2013065125 W JP2013065125 W JP 2013065125W WO 2014007007 A1 WO2014007007 A1 WO 2014007007A1
Authority
WO
WIPO (PCT)
Prior art keywords
power
electronic component
system electronic
board
component mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2013/065125
Other languages
French (fr)
Inventor
Ken Ito
Yoshihito Aoki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yazaki Corp
Original Assignee
Yazaki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yazaki Corp filed Critical Yazaki Corp
Publication of WO2014007007A1 publication Critical patent/WO2014007007A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the printed circuit board [PCB]

Definitions

  • the invention relates to an electronic component mounting board on which components configuring an electronic circuit are mounted.
  • PTL 1 Patent Literature 1
  • FIG. 10 suggests an on-vehicle electrical equipment unit on which an electronic circuit for controlling an internal combustion engine and the like is mounted.
  • FIG. 10 shows a configuration of a board surface on which the electronic circuit is mounted.
  • a semiconductor relay module 2 that is configured by modularizing a plurality of semiconductor relays 2a to 2f, which are power-system electronic components, is mounted on one side of a control board 1.
  • Signal-system electronic components 3a, 3b are mounted on a part of the control board 1 , which is spaced from the semiconductor relay module 2 by a predetermined distance.
  • the semiconductor relay module 2 has lead parts 4 for a connector to which an external connector (not shown) is inserted and lead parts 5 for board connection that are electrically connected to the control board 1.
  • the power-system electronic components (semiconductor relays 2a to 2f) generate heat because large currents are consumed.
  • the semiconductor relays 2a to 2f that are the power-system electronic components are modularized and the semiconductor relay module 2 and the signal-system electronic components 3a, 3b are separately mounted.
  • the invention has been made to solve the above problem and an object of the invention is to provide an electronic component mounting board capable of preventing a failure and runaway of a signal-system electronic component due to heat of a power-system electronic component and reducing the cost.
  • An electronic component mounting board comprising:
  • a board that has one side and the other side being opposite to the one side, wherein a power-system electronic component mounting region is assigned to a part of the board which is closed to the one side, and wherein a signal-system electronic component mounting region is assigned to a part of the board which is separated from the power-system electronic component mounting region and is close to the other side;
  • a power-system electronic component for controlling a power supply-system that is mounted on the power-system electronic component mounting region
  • a power-system connection terminal that is provided at the one side of the board and is connected to the power-system electronic component.
  • the electronic component mounting board further includes other power-system electronic component for controlling the power supply-system
  • the power-system electronic component is mounted on a front surface of the board in the power-system electronic component mounting region and the other power-system electronic component is mounted on a backside surface of the board in the power-system electronic component mounting region, the front surface being opposite to the backside surface in the same part of the power-system electronic component mounting region
  • the power-system electronic component and the other power-system electronic component are electrically connected to the power-system connection terminal commonly through a wired pattern formed on the board.
  • the power-system connection terminal includes a plurality of output terminals having one ends respectively connected to the plurality of the power-system electronic components and the other ends connected to a load, and a power supply terminal having one end commonly connected to the plurality of the power-system electronic components and the other end connected to a power supply, and the power supply terminal is arranged at a center portion of the one side of the board.
  • FIG. 1 is a perspective view of an electronic component mounting board according to a first illustrative embodiment of the invention.
  • FIG. 2 is a plan configuration view of the electronic component mounting board according to the first illustrative embodiment of the invention.
  • FIG. 3 is a plan configuration view of a power-system electronic component mounting region of the electronic component mounting board according to the first illustrative embodiment of the invention.
  • FIG. 4 shows a side configuration of the power-system electronic component mounting region of the electronic component mounting board according to the first illustrative embodiment of the invention, which is a sectional view taken along an A-A arrow direction of FIG. 3.
  • FIG. 5 is a perspective view of a connector housing that accommodates therein the electronic component mounting board of FIG. 1.
  • FIG. 6 is a plan configuration view of an electronic component mounting board according to a second illustrative embodiment of the invention.
  • FIG. 7 is a plan configuration view of a power-system electronic component mounting region of the electronic component mounting board according to the second illustrative embodiment of the invention.
  • FIG. 8 is a side configuration view of a power-system electronic component mounting region of an electronic component mounting board according to a third illustrative embodiment of the invention.
  • FIG. 9 is a bottom configuration view showing main parts of FIG. 8.
  • FIG. 10 is a plan view showing an example of a control board of an on-vehicle electrical equipment unit of the related art.
  • FIG. 1 is a perspective view of an electronic component mounting board according to a first illustrative embodiment of the invention
  • FIG. 2 shows a plan configuration of FIG. 1
  • FIG. 3 shows a plan configuration of main parts of FIG. 1
  • FIG. 4 is a sectional view taken along an A-A arrow direction of FIG. 3
  • FIG. 5 shows a connector housing that accommodates therein the board of FIG. 1.
  • a board 10 is made of an insulating synthetic resin and has a rectangular shape.
  • the board 10 is formed with a pattern (a conductive path such as wiring pattern, a GND pattern and the like) by a printed wiring technology.
  • the board 10 has a power-system electronic component mounting region 11 , which is assigned to a part close to one side 10a, and a signal-system electronic component mounting region 12 that is assigned to a part being separated from the power-system electronic component mounting region 11 by a predetermined distance and is close to the other side 10b. Meanwhile, the electronic components and the like that are mounted on the board 10 are not shown in FIG. 2.
  • power-system electronic component mounting region 11 of the board 10 power-system electronic components 20a to 20c that control a power supply-system and consume large currents to thus generate heat and a power supply terminal 21 , output terminals 22a to 22e and a GND terminal 23, which formed by conductive members, are mounted.
  • a plurality of signal-system connection terminals 24 and signal-system electronic components 30 that perform signal processing and are vulnerable to the heat are mounted on a surface of the signal-system electronic component mounting area 12 of the board 10.
  • Each of the power-system electronic components 20a to 20c has six leads 40 at a side thereof facing the one side 10a of the board 10 and one terminal 50 for power application at an opposite side thereof to the one side 10a.
  • the terminal 50 is made of conductive metal and is electrically connected to a pattern 10P PI for a power supply formed on the board 10 and an end portion of the pattern 10P P i for a power supply facing the one side 10a is electrically connected to the power supply terminal 21 , as shown in FIG. 3.
  • the six leads 40 of the respective power-system electronic components 20a to 20c are made of conductive metal.
  • the respective three left leads 40 of each of the power-system electronic components 20a to 20c are electrically connected to patterns 10P 0 i to IOP 03 for output that are formed on the board 10.
  • An end portion of the pattern IOP 01 for output facing the one side 10a is electrically connected to the output terminals 22a, 22b.
  • An end portion of the pattern IOP0 2 for output facing the one side 10a is electrically connected to the output terminals 22c, 22d.
  • An end portion of the pattern 10P 03 for output facing the one side 10a is electrically connected to the output terminal 22e.
  • One of the respective three leads 40 of the respective power-system electronic components 20a to 20c is electrically connected to a GND pattern 10PG formed on the board 10 and an end portion of the GND pattern 10P G facing the one side 10a is electrically connected to the GND terminal 23.
  • the other two of the respective three right leads 40 of the power-system electronic components 20a to 20c are electrically connected to a wiring pattern (not shown) for receiving a signal from a microcomputer (signal-system electronic component) and a wiring pattern (not shown) for transmitting a current value flowing through the power-system electronic components 20a to 20c to the microcomputer. As shown in FIG.
  • the output terminal 22e has one end portion 22ea that is connected to a pattern of the board 10 by a soldering, an erection portion 22eb that upwards erects from the one end portion 22ea by a predetermined height at an outer side of the one side 10a of the board 10 and a body potion 22ec that extends from the erection portion 22eb in an outer direction of the board 10.
  • FIG. 4 showing a side configuration taken along an
  • A-A line of FIG. 3 also shows the signal-system connection terminal 24.
  • One end portion 24a of the signal-system connection terminal 24 is electrically connected to a pattern on the surface of the board 10 by the soldering and the pattern is connected with a lead 30a made of conductive metal.
  • the signal-system connection terminal 24 has a first erection portion 24b that vertically erects from the one end portion 24a to a position slightly higher than the height of the power-system electronic component 20c, a first body portion 24c that passes above the power-system electronic component 20c from the erection portion 24b and extends in parallel with the board 10, a second erection portion 24d that upwards erects from the body portion 24c by a predetermined height and a second body portion 24e that extends from the erection portion 24d in parallel with the board 10 in the outer direction of the board 10.
  • All of the four signal-system connection terminals 24 have the same configuration as that of the above-described signal-system connection terminal 24.
  • a connector for example, a female terminal, (not shown) is inserted to the power supply terminal 21 , the output terminals 22a to 22e, the GND terminal 23 and the signal-system connection terminals 24, which configure the power-system connection terminal, from an outside.
  • the board 0 may be made of a low-priced material such as FR4
  • Fluor Retardant Type 4 which is made to have a plate shape by enabling an epoxy resin to soak into a glass fiber fabric and then performing thermal hardening processing for the same and which has both flame retardation and low conductivity properties.
  • the electronic component mounting board 10 of FIG. 1 configured as described above is formed by first mounting the power-system electronic components 20a to 20c and the signal-system electronic components 30 on the board 10, attaching ones of the signal-system connection terminals 24 and the power-system connection terminals 21 , 22a to 22e, 23 and then attaching the others.
  • the electronic component mounting board of FIG. 1 is accommodated in a mold having an external shape as shown in FIG. 5 and a resin is injected and molded in the mold, so that the connector housing 60 of FIG. 5 having the electronic component mounting board accommodated therein is completed.
  • the board 10 is clearly divided into the power-system electronic component mounting region 11 assigned to a part close to one side 10a and the signal-system electronic component mounting region 12 separated from the region 11.
  • the power supply terminal 21 is disposed in the vicinity of the output terminals 22a to 22e of the power-system electronic components 20a to 20c mounted on the one side 10a of the board 10, the current is supplied from the power supply terminal 21 to the power-system electronic components 20a to 20c through the pattern 10P P i for a power supply and the terminal 50 and the current is output to the output terminals 22a to 22e through the leads 40 of the power-system electronic components 20a to 20c and the patterns 10Poi to IOP 03 for output.
  • the mounting regions 11 , 12 of the power-system electronic components and the signal-system electronic components are divided while providing the power-system electronic components 20a to 20c and the signal-system electronic components 30 as one module.
  • the heat from the power-system electronic components 20a to 20c is difficult to transfer to the signal-system electronic components 30, so that a failure and runaway of the signal-system electronic components 3a, 3b due to the heat can be prevented.
  • the power supply terminal 21 is arranged at the left end portion of the one side 10a of the board 10.
  • the power supply terminal 21 is arranged at a center of the terminal groups 22a to 22e, 23, as shown in FIGS. 6 and 7.
  • FIGS. 6 and 7 the same parts as those of FIGS. 2 and 3 are denoted with the same reference numerals.
  • the pattern 10Pp 2 for a power supply to which the terminals 50 for a power supply of the power-system electronic components 20a to 20c are connected is formed on the board 10 in the power-system electronic component mounting region 1 1 , extends from a center thereof towards the center of the one side 10a of the board 10 and is electrically connected to the power supply terminal 21 at the center.
  • the other parts have the same configuration as those of the first illustrative embodiment.
  • the power supply terminal 21 is arranged in the vicinity of the center of the respective terminal groups 22a to 22e, 23 electrically connected to the power-system electronic components 20a to 20c, a current path has a rout flowing the current through the power supply 21 , the pattern 10Pp 2 for a power supply, the terminals 50, the power-system electronic components 20a to 20c, the leads 40, the patterns 10P 0 i to 10P 0 3 for output, and the output terminals 22a to 22e in this order, and the shortest path can be obtained.
  • the current value flowing through the power-system electronic components 20a to 20c can effectively suppress the heat generation of the power-system electronic components 20a to 20c since the closer the electronic components from the power supply terminal 21 , the heat generation is reduced.
  • the power-system electronic components 20a to 20c are mounted only on the surface of the board 10.
  • the power-system electronic components are mounted on both surfaces of the board and the output terminals are commonly used.
  • FIG. 8 is a view taken along a B-B arrow direction of FIG. 3 in a configuration of the third illustrative embodiment
  • FIG. 9 is a view seen from a backside of the board of FIG. 8.
  • FIGS. 8 and 9 the same parts as those of FIGS. 3 and 4 are denoted with the same reference numerals.
  • a power-system electronic component 20d is mounted on a backside of the part corresponding to the mounting position of the power-system electronic component 20a of the board 10.
  • the power-system electronic component 20d on the backside has one terminal 50 for power application and six leads 40, like the power-system electronic component 20a on the surface.
  • the terminal 50 of the power-system electronic component 20d is electrically connected to the pattern 10P PI for a power supply and the end portion of the pattern 10P PI for a power supply facing the one side 10a is electrically connected to the power supply terminal 21.
  • the three right leads of the six leads 40 of the power-system electronic component 20d are electrically connected to the output terminals 22a, 22b having one end portions connected to the pattern 10P P i for a power supply.
  • the three left leads of the six leads 40 of the power-system electronic component 20d are electrically connected to a pattern for GND connection (a pattern that is connected to the GND pattern 10P G in FIG. 3), a wiring pattern for receiving a signal from the microcomputer (signal-system electronic component) and a wiring pattern for transmitting a current value flowing through the power-system electronic component 20d to the microcomputer, which patterns are shown with the solid lines in FIG. 9. same configuration.
  • the signal-system connection terminal 24 is also shown in FIG. 8.
  • the power-system electronic component 20d on the board backside is supplied with the current from the power supply terminal 21 through the pattern 10P PI for a power supply and the terminal 50, like the power-system electronic component 20a on the surface, and the current is output from the leads 40 of the power-system electronic component 20d to the same output terminals 22a, 22b as those of the power-system electronic component 20a.
  • the configuration of the second illustrative embodiment where the power supply terminal 21 is arranged at the center of the one side 10a of the board 10 and the third illustrative embodiment may be combined. Also in this case, the same operations and effects as the above-described ones are obtained.
  • the respective mounting numbers of the power-system electronic components 20a to 20c, the power supply terminal 21 , the output terminals 22a to 22e and the GND terminal 23 and the number of the leads 40 of the power-system electronic components are not limited to and may be different from those of the first to third illustrative embodiments.
  • an electronic component mounting board capable of preventing a failure and runaway of a signal-system electronic component due to heat of a power-system electronic component and reducing the cost can be obtained.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)

Description

DESCRIPTION
ELECTRONIC COMPONENT MOUNTING BOARD Technical Field
The invention relates to an electronic component mounting board on which components configuring an electronic circuit are mounted.
Background Art
For example, PTL 1 (Patent Literature 1) shown in FIG. 10 suggests an on-vehicle electrical equipment unit on which an electronic circuit for controlling an internal combustion engine and the like is mounted. FIG. 10 shows a configuration of a board surface on which the electronic circuit is mounted.
In FIG. 10, a semiconductor relay module 2 that is configured by modularizing a plurality of semiconductor relays 2a to 2f, which are power-system electronic components, is mounted on one side of a control board 1.
Signal-system electronic components 3a, 3b are mounted on a part of the control board 1 , which is spaced from the semiconductor relay module 2 by a predetermined distance. The semiconductor relay module 2 has lead parts 4 for a connector to which an external connector (not shown) is inserted and lead parts 5 for board connection that are electrically connected to the control board 1.
Citation List
Patent Literature
[PTL 1] JP-A-2002-293201
In FIG. 10, compared to the signal-system electronic components 3a, 3b, the power-system electronic components (semiconductor relays 2a to 2f) generate heat because large currents are consumed. In order to exclude an influence of the heat of the power-system electronic components, the semiconductor relays 2a to 2f that are the power-system electronic components are modularized and the semiconductor relay module 2 and the signal-system electronic components 3a, 3b are separately mounted.
Thereby, the heat generation of the semiconductor relays 2a to 2f is suppressed and a failure and runaway of the signal-system electronic components 3a, 3b due to the heat can be prevented. However, in order to modularize the semiconductor relays 2a to 2f that are the power-system electronic components, the number of elements to be processed is increased and a processing cost for integrating the increased number of elements into one is caused to increase the cost. Summary of Invention Technical Problem
The invention has been made to solve the above problem and an object of the invention is to provide an electronic component mounting board capable of preventing a failure and runaway of a signal-system electronic component due to heat of a power-system electronic component and reducing the cost.
Solution to Problem
An electronic component mounting board, comprising:
a board that has one side and the other side being opposite to the one side, wherein a power-system electronic component mounting region is assigned to a part of the board which is closed to the one side, and wherein a signal-system electronic component mounting region is assigned to a part of the board which is separated from the power-system electronic component mounting region and is close to the other side;
a power-system electronic component for controlling a power supply-system that is mounted on the power-system electronic component mounting region;
a signal-system electronic component for performing signal processing that is mounted on the signal-system electronic component mounting region; and
a power-system connection terminal that is provided at the one side of the board and is connected to the power-system electronic component. According to the above configuration, since the signal-system electronic component is mounted in the region of the part distant from the power-system electronic component mounting region, it is possible to prevent a failure and runaway of the signal-system electronic component due to heat of the power-system electronic component. Also, since it is not necessary to perform special processing, it is possible to reduce the cost.
For example, the electronic component mounting board further includes other power-system electronic component for controlling the power supply-system, the power-system electronic component is mounted on a front surface of the board in the power-system electronic component mounting region and the other power-system electronic component is mounted on a backside surface of the board in the power-system electronic component mounting region, the front surface being opposite to the backside surface in the same part of the power-system electronic component mounting region, and the power-system electronic component and the other power-system electronic component are electrically connected to the power-system connection terminal commonly through a wired pattern formed on the board.
According to the above configuration, it is possible to output the respective output currents of the power-system electronic component on the surface and the power-system electronic component on the backside to the same power-system connection terminal and to reduce the cost.
For example, a plurality of the power-supply electronic components are mounted along the one side of the board in the power-system electronic component mounting region, the power-system connection terminal includes a plurality of output terminals having one ends respectively connected to the plurality of the power-system electronic components and the other ends connected to a load, and a power supply terminal having one end commonly connected to the plurality of the power-system electronic components and the other end connected to a power supply, and the power supply terminal is arranged at a center portion of the one side of the board.
According to the above configuration, since a connection distance between the power supply terminal and the respective power-system electronic components is shortened, it is possible to effectively suppress the heat generation of the power-system electronic components.
Advantageous Effects of Invention
It is possible to prevent the failure and runaway of the signal-system electronic component due to the heat of the power-system electronic component and to reduce the cost.
It is possible to output the current from the same power-system connection terminal even when the specifications are different between the power-system electronic component on the surface of the board and the power-system electronic component on the backside. Also, since the same board can be used, the cost can be reduced.
Since the connection distance between the power supply terminal and the respective power-system electronic components is shortened, it is possible to effectively suppress the heat generation of the power-system electronic components.
Brief Description of Drawings
FIG. 1 is a perspective view of an electronic component mounting board according to a first illustrative embodiment of the invention.
FIG. 2 is a plan configuration view of the electronic component mounting board according to the first illustrative embodiment of the invention.
FIG. 3 is a plan configuration view of a power-system electronic component mounting region of the electronic component mounting board according to the first illustrative embodiment of the invention.
FIG. 4 shows a side configuration of the power-system electronic component mounting region of the electronic component mounting board according to the first illustrative embodiment of the invention, which is a sectional view taken along an A-A arrow direction of FIG. 3.
FIG. 5 is a perspective view of a connector housing that accommodates therein the electronic component mounting board of FIG. 1.
FIG. 6 is a plan configuration view of an electronic component mounting board according to a second illustrative embodiment of the invention.
FIG. 7 is a plan configuration view of a power-system electronic component mounting region of the electronic component mounting board according to the second illustrative embodiment of the invention.
FIG. 8 is a side configuration view of a power-system electronic component mounting region of an electronic component mounting board according to a third illustrative embodiment of the invention.
FIG. 9 is a bottom configuration view showing main parts of FIG. 8. FIG. 10 is a plan view showing an example of a control board of an on-vehicle electrical equipment unit of the related art.
Description of Embodiments
Hereinafter, illustrative embodiments of the invention will be described with reference to the drawings. However, it should be noted that the invention is not limited to the illustrative embodiments.
[First Illustrative Embodiment]
FIG. 1 is a perspective view of an electronic component mounting board according to a first illustrative embodiment of the invention, FIG. 2 shows a plan configuration of FIG. 1 , FIG. 3 shows a plan configuration of main parts of FIG. 1 , FIG. 4 is a sectional view taken along an A-A arrow direction of FIG. 3 and FIG. 5 shows a connector housing that accommodates therein the board of FIG. 1.
In FIGS. 1 to 5, a board 10 is made of an insulating synthetic resin and has a rectangular shape. The board 10 is formed with a pattern (a conductive path such as wiring pattern, a GND pattern and the like) by a printed wiring technology.
As shown in FIGS. 1 and 2, the board 10 has a power-system electronic component mounting region 11 , which is assigned to a part close to one side 10a, and a signal-system electronic component mounting region 12 that is assigned to a part being separated from the power-system electronic component mounting region 11 by a predetermined distance and is close to the other side 10b. Meanwhile, the electronic components and the like that are mounted on the board 10 are not shown in FIG. 2. In the power-system electronic component mounting region 11 of the board 10, power-system electronic components 20a to 20c that control a power supply-system and consume large currents to thus generate heat and a power supply terminal 21 , output terminals 22a to 22e and a GND terminal 23, which formed by conductive members, are mounted.
A plurality of signal-system connection terminals 24 and signal-system electronic components 30 that perform signal processing and are vulnerable to the heat are mounted on a surface of the signal-system electronic component mounting area 12 of the board 10.
Each of the power-system electronic components 20a to 20c has six leads 40 at a side thereof facing the one side 10a of the board 10 and one terminal 50 for power application at an opposite side thereof to the one side 10a.
The terminal 50 is made of conductive metal and is electrically connected to a pattern 10PPI for a power supply formed on the board 10 and an end portion of the pattern 10PPi for a power supply facing the one side 10a is electrically connected to the power supply terminal 21 , as shown in FIG. 3. The six leads 40 of the respective power-system electronic components 20a to 20c are made of conductive metal. The respective three left leads 40 of each of the power-system electronic components 20a to 20c are electrically connected to patterns 10P0i to IOP03 for output that are formed on the board 10.
An end portion of the pattern IOP01 for output facing the one side 10a is electrically connected to the output terminals 22a, 22b. An end portion of the pattern IOP02 for output facing the one side 10a is electrically connected to the output terminals 22c, 22d. An end portion of the pattern 10P03 for output facing the one side 10a is electrically connected to the output terminal 22e.
One of the respective three leads 40 of the respective power-system electronic components 20a to 20c is electrically connected to a GND pattern 10PG formed on the board 10 and an end portion of the GND pattern 10PG facing the one side 10a is electrically connected to the GND terminal 23.
The other two of the respective three right leads 40 of the power-system electronic components 20a to 20c are electrically connected to a wiring pattern (not shown) for receiving a signal from a microcomputer (signal-system electronic component) and a wiring pattern (not shown) for transmitting a current value flowing through the power-system electronic components 20a to 20c to the microcomputer. As shown in FIG. 4, the output terminal 22e has one end portion 22ea that is connected to a pattern of the board 10 by a soldering, an erection portion 22eb that upwards erects from the one end portion 22ea by a predetermined height at an outer side of the one side 10a of the board 10 and a body potion 22ec that extends from the erection portion 22eb in an outer direction of the board 10.
The output terminals 22a to 22d of the power-system electronic components 20a, 20b have the same configuration as that shown in FIG. 4. In the meantime, FIG. 4 showing a side configuration taken along an
A-A line of FIG. 3 also shows the signal-system connection terminal 24.
One end portion 24a of the signal-system connection terminal 24 is electrically connected to a pattern on the surface of the board 10 by the soldering and the pattern is connected with a lead 30a made of conductive metal. The signal-system connection terminal 24 has a first erection portion 24b that vertically erects from the one end portion 24a to a position slightly higher than the height of the power-system electronic component 20c, a first body portion 24c that passes above the power-system electronic component 20c from the erection portion 24b and extends in parallel with the board 10, a second erection portion 24d that upwards erects from the body portion 24c by a predetermined height and a second body portion 24e that extends from the erection portion 24d in parallel with the board 10 in the outer direction of the board 10. All of the four signal-system connection terminals 24 have the same configuration as that of the above-described signal-system connection terminal 24. A connector, for example, a female terminal, (not shown) is inserted to the power supply terminal 21 , the output terminals 22a to 22e, the GND terminal 23 and the signal-system connection terminals 24, which configure the power-system connection terminal, from an outside. The board 0 may be made of a low-priced material such as FR4
(Flame Retardant Type 4) which is made to have a plate shape by enabling an epoxy resin to soak into a glass fiber fabric and then performing thermal hardening processing for the same and which has both flame retardation and low conductivity properties.
The electronic component mounting board 10 of FIG. 1 configured as described above is formed by first mounting the power-system electronic components 20a to 20c and the signal-system electronic components 30 on the board 10, attaching ones of the signal-system connection terminals 24 and the power-system connection terminals 21 , 22a to 22e, 23 and then attaching the others.
Then, the electronic component mounting board of FIG. 1 is accommodated in a mold having an external shape as shown in FIG. 5 and a resin is injected and molded in the mold, so that the connector housing 60 of FIG. 5 having the electronic component mounting board accommodated therein is completed.
In the meantime, the other end portions of the signal-system connection terminals 24 and power-system connection terminals 21 , 22a to 22e, 23 are arranged at a connection port 60a-side of the connector housing 60 of FIG. 5.
In the above configuration, the board 10 is clearly divided into the power-system electronic component mounting region 11 assigned to a part close to one side 10a and the signal-system electronic component mounting region 12 separated from the region 11. Also, the power supply terminal 21 is disposed in the vicinity of the output terminals 22a to 22e of the power-system electronic components 20a to 20c mounted on the one side 10a of the board 10, the current is supplied from the power supply terminal 21 to the power-system electronic components 20a to 20c through the pattern 10PPi for a power supply and the terminal 50 and the current is output to the output terminals 22a to 22e through the leads 40 of the power-system electronic components 20a to 20c and the patterns 10Poi to IOP03 for output.
Like this, the mounting regions 11 , 12 of the power-system electronic components and the signal-system electronic components are divided while providing the power-system electronic components 20a to 20c and the signal-system electronic components 30 as one module. Thus, it is not necessary to perform special processing, so that it is possible to reduce the cost. Further, the heat from the power-system electronic components 20a to 20c is difficult to transfer to the signal-system electronic components 30, so that a failure and runaway of the signal-system electronic components 3a, 3b due to the heat can be prevented.
The above configuration is useful when the connection with a connector having a power supply terminal and an output terminal arranged at one side is made. [Second Illustrative Embodiment]
In the first illustrative embodiment, the power supply terminal 21 is arranged at the left end portion of the one side 10a of the board 10. However, in a second illustrative embodiment, the power supply terminal 21 is arranged at a center of the terminal groups 22a to 22e, 23, as shown in FIGS. 6 and 7. In FIGS. 6 and 7, the same parts as those of FIGS. 2 and 3 are denoted with the same reference numerals.
The pattern 10Pp2 for a power supply to which the terminals 50 for a power supply of the power-system electronic components 20a to 20c are connected is formed on the board 10 in the power-system electronic component mounting region 1 1 , extends from a center thereof towards the center of the one side 10a of the board 10 and is electrically connected to the power supply terminal 21 at the center. The other parts have the same configuration as those of the first illustrative embodiment. Like this, since the power supply terminal 21 is arranged in the vicinity of the center of the respective terminal groups 22a to 22e, 23 electrically connected to the power-system electronic components 20a to 20c, a current path has a rout flowing the current through the power supply 21 , the pattern 10Pp2 for a power supply, the terminals 50, the power-system electronic components 20a to 20c, the leads 40, the patterns 10P0i to 10P03 for output, and the output terminals 22a to 22e in this order, and the shortest path can be obtained. The current value flowing through the power-system electronic components 20a to 20c can effectively suppress the heat generation of the power-system electronic components 20a to 20c since the closer the electronic components from the power supply terminal 21 , the heat generation is reduced. [Third illustrative Embodiment]
In the first and second illustrative embodiments, the power-system electronic components 20a to 20c are mounted only on the surface of the board 10. However, in a third illustrative embodiment, as shown in FIGS. 8 and 9, the power-system electronic components are mounted on both surfaces of the board and the output terminals are commonly used. FIG. 8 is a view taken along a B-B arrow direction of FIG. 3 in a configuration of the third illustrative embodiment and FIG. 9 is a view seen from a backside of the board of FIG. 8. In FIGS. 8 and 9, the same parts as those of FIGS. 3 and 4 are denoted with the same reference numerals. In FIGS. 8 and 9, a power-system electronic component 20d is mounted on a backside of the part corresponding to the mounting position of the power-system electronic component 20a of the board 10. The power-system electronic component 20d on the backside has one terminal 50 for power application and six leads 40, like the power-system electronic component 20a on the surface.
The terminal 50 of the power-system electronic component 20d is electrically connected to the pattern 10PPI for a power supply and the end portion of the pattern 10PPI for a power supply facing the one side 10a is electrically connected to the power supply terminal 21.
In FIG. 9, the three right leads of the six leads 40 of the power-system electronic component 20d are electrically connected to the output terminals 22a, 22b having one end portions connected to the pattern 10PPi for a power supply.
In FIG. 9, the three left leads of the six leads 40 of the power-system electronic component 20d are electrically connected to a pattern for GND connection (a pattern that is connected to the GND pattern 10PG in FIG. 3), a wiring pattern for receiving a signal from the microcomputer (signal-system electronic component) and a wiring pattern for transmitting a current value flowing through the power-system electronic component 20d to the microcomputer, which patterns are shown with the solid lines in FIG. 9. same configuration. In the meantime, the signal-system connection terminal 24 is also shown in FIG. 8.
The power-system electronic component 20d on the board backside is supplied with the current from the power supply terminal 21 through the pattern 10PPI for a power supply and the terminal 50, like the power-system electronic component 20a on the surface, and the current is output from the leads 40 of the power-system electronic component 20d to the same output terminals 22a, 22b as those of the power-system electronic component 20a.
Like this, since it is possible to output the respective output currents of the power-system electronic component on the surface and the power-system electronic component on the backside from the same output terminals, it is possible to secure the power-system electronic components and the various terminals 21 , 22a to 22e, 23 with the shortest path even when the devices having different specifications, for example, loads having different current values are connected.
Therefore, it is possible to effectively utilize the board backside and to use the same board even when the specifications are different, so that it is possible to reduce the cost.
Also, the configuration of the second illustrative embodiment where the power supply terminal 21 is arranged at the center of the one side 10a of the board 10 and the third illustrative embodiment may be combined. Also in this case, the same operations and effects as the above-described ones are obtained.
In the meantime, the respective mounting numbers of the power-system electronic components 20a to 20c, the power supply terminal 21 , the output terminals 22a to 22e and the GND terminal 23 and the number of the leads 40 of the power-system electronic components are not limited to and may be different from those of the first to third illustrative embodiments.
The present application is based on Japanese Patent Application No.
2012-150626 filed on July 4, 2012, the contents of which are incorporated herein by reference.
Industrial Applicability
By the above invention, an electronic component mounting board capable of preventing a failure and runaway of a signal-system electronic component due to heat of a power-system electronic component and reducing the cost can be obtained. Reference Signs List
10 board
10a one side
10Pp-i,10Pp2 pattern for power supply
10Poi to 10Po3 pattern for output
10PpG GND pattern 11 power-system electronic component mounting region
12 signal-system electronic component mounting region 20a to 20d power-system electronic components
21 power supply terminal
22a to 22e output terminals
23 GND terminal
24 signal-system connection terminal
30 signal-system electronic components
40 leads
50 terminals
60 connector housing

Claims

1. An electronic component mounting board, comprising:
a board that has one side and the other side being opposite to the one side, wherein a power-system electronic component mounting region is assigned to a part of the board which is closed to the one side, and wherein a signal-system electronic component mounting region is assigned to a part of the board which is separated from the power-system electronic component mounting region and is close to the other side;
a power-system electronic component for controlling a power supply-system that is mounted on the power-system electronic component mounting region;
a signal-system electronic component for performing signal processing that is mounted on the signal-system electronic component mounting region; and
a power-system connection terminal that is provided at the one side of the board and is connected to the power-system electronic component.
2. The electronic component mounting board according to claim 1 , further comprising:
other power-system electronic component for controlling the power supply-system,
wherein the power-system electronic component is mounted on a front surface of the board in the power-system electronic component mounting region and the other power-system electronic component is mounted on a backside surface of the board in the power-system electronic component mounting region, the front surface being opposite to the backside surface in the same part of the power-system electronic component mounting region; and
wherein the power-system electronic component and the other power-system electronic component are electrically connected to the power-system connection terminal commonly through a wired pattern formed on the board.
3. The electronic component mounting board according to claim 1 or 2, wherein a plurality of the power-supply electronic components are mounted along the one side of the board in the power-system electronic component mounting region,
wherein the power-system connection terminal includes:
a plurality of output terminals having one ends respectively connected to the plurality of the power-system electronic components and the other ends connected to a load; and
a power supply terminal having one end commonly connected to the plurality of the power-system electronic components and the other end connected to a power supply; and
wherein the power supply terminal is arranged at a center portion of the one side of the board.
PCT/JP2013/065125 2012-07-04 2013-05-24 Electronic component mounting board Ceased WO2014007007A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-150626 2012-07-04
JP2012150626A JP6128766B2 (en) 2012-07-04 2012-07-04 Electronic component mounting board

Publications (1)

Publication Number Publication Date
WO2014007007A1 true WO2014007007A1 (en) 2014-01-09

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PCT/JP2013/065125 Ceased WO2014007007A1 (en) 2012-07-04 2013-05-24 Electronic component mounting board

Country Status (2)

Country Link
JP (1) JP6128766B2 (en)
WO (1) WO2014007007A1 (en)

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