WO2013191508A1

WO2013191508A1 - Multi-array light-emitting diode lighting device, and method for manufacturing same

Info

Publication number: WO2013191508A1
Application number: PCT/KR2013/005507
Authority: WO
Inventors: 한장민; 우현
Original assignee: 주식회사 지앤씨
Priority date: 2012-06-22
Filing date: 2013-06-21
Publication date: 2013-12-27
Also published as: KR20140000040A; KR101483718B1

Abstract

The present invention relates to a multi-array light-emitting diode lighting device and to a method for manufacturing same. The multi-array light-emitting diode lighting device comprises: a base having a power terminal for electrical connection to an external alternating-current power source, the base having a circumferential surface including a plurality of power sockets; and a plurality of cylindrical light-emitting diode modules attached to the power sockets. Each light-emitting diode module comprises: a module base unit attached to the power socket; a cylindrical housing sealingly coupled to the module base unit; a light-emitting diode package installed inside the housing; a power supply module for converting the external alternating-current power and supplying power to the light-emitting diode package; a support structure for fixing the light-emitting diode package and the power supply module; and an insulating heat-dissipating solution with which the housing is filled so as to enable the light-emitting diode package and the power supply module to be immersed therein such that the heat generated by the light-emitting diode package and the power supply module can be dissipated.

Description

Multi-array light emitting diode lighting device and manufacturing method thereof

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multi-array light-emitting diode (LED) illuminator using a heat dissipation liquid having excellent heat dissipation efficiency and a manufacturing method thereof.

Light-emitting diode (LED) lighting equipment has been spotlighted as a lighting device capable of generating brightness similar to that of incandescent and fluorescent lamps with low power.

However, in the case of LED lighting equipment used in various fields such as home lighting, office lighting, factory lighting, street lamps, lamps, landscape lighting, lighting for leisure facilities, etc., there is a problem in that the heat generated from the LED must be efficiently radiated.

The heat dissipation problem in the LED lighting device not only shortens the life of the LED package itself, but also has been made to solve the heat dissipation problem because it shortens the life of the power supply module for supplying the LED and lowers the luminous efficiency.

Therefore, in recent years, in the LED lighting device, a large metal heat sink is attached to dissipate heat of the LED and the power supply module. In addition, various forms and materials have been proposed to increase heat radiation efficiency.

In addition, the cooling method using a large metal heat sink does not have sufficient cooling efficiency, reduces the applicability of the product by making the weight of the LED lighting device itself heavy, and the price of the large metal heat sink itself is high, thereby hampering the commercialization of the LED lighting device. have.

The present invention provides a multi-array light emitting diode lighting device having high heat dissipation efficiency, preventing damage to the light emitting diode chip due to breakdown voltage, and lowering the manufacturing cost in a high output light emitting diode lighting device, in which heat generation is a particular problem, and manufacturing the same. It is to provide a method.

The present invention has been made to solve the above problems, the multi-array light emitting diode lighting device according to an embodiment of the present invention, the base including a power terminal capable of electrical connection with an external AC power source, the base of A plurality of power sockets are formed in the circumferential surface; And a plurality of cylindrical light emitting diode modules attached to the power socket, wherein the light emitting diode module comprises: a module base part attached to the power socket; A cylindrical housing hermetically coupled to the module base portion; A light emitting diode package installed inside the housing; A power supply module for converting the external AC power to supply power to the LED package; A support structure for fixing the light emitting diode package and the power supply module; And an insulating heat dissipation filled in the housing to impregnate the light emitting diode package and the power supply module, thereby dissipating heat generated from the light emitting diode package and the power supply module. device.

According to an aspect of an embodiment of the present invention, the light emitting diode module may further include a sealing material for sealing the housing and the module base part.

According to one embodiment of the present invention, the housing and the sealing material is made of a silicone resin, the insulating heat dissipating liquid may be a silicone-based insulating oil.

According to one embodiment of the present invention, the insulating heat dissipating solution may be one of dimethyl silicone oil, methyl phenyl silicone oil, and methyl hydrogen silicone oil.

According to one embodiment of the present invention, thermally conductive particles including at least one of graphene particles, CNT particles, silica particles, and metal particles may be dispersed in the insulating heat dissipating solution.

According to an embodiment of the present invention, the light emitting diode module may further include a heat rod, part of which is impregnated in the insulating heat dissipating liquid, and part of which protrudes through the base part.

According to one embodiment of the present invention, the base has a circular cross section, and the plurality of power sockets may be installed on the bottom of the base at a predetermined interval.

According to one embodiment of the present invention, the housing may be made of a thermoplastic resin material.

According to an aspect of an embodiment of the present invention, the housing may include glass having a light diffusion coating on the surface thereof.

According to one embodiment of the present invention, the support structure may be used as a power supply line for supplying the external AC power to the power supply module.

According to an aspect of an embodiment of the present invention, the irradiation light of the light emitting diode package may be installed to face outward.

According to an aspect of an embodiment of the present invention, the multi-array light emitting diode illuminator may include a direct type light emitting diode module installed at the center of the base.

Another embodiment of the present invention is a method of manufacturing a multi-array light emitting diode lighting device comprising the steps of: providing a cylindrical housing made of glass; Inserting a light emitting diode package into the housing and installing a power supply module for supplying power to the light emitting diode; Filling the cylindrical housing with an insulating heat dissipation solution; And attaching a base for receiving external AC power to one end of the housing while sealing the opening of the housing with a sealing material.

According to an aspect of another embodiment of the present invention, the method of manufacturing a multi-array light emitting diode lighting device may include installing a heat rod partially impregnated in the insulating heat dissipation liquid and partially protruding from the base portion. have.

According to an aspect of an embodiment of the present invention having the above-described configuration, in the high-power LED lighting apparatus, a plurality of light emitting diode modules are separated, and each module is spaced apart, so that the base bottom has an unspecified mother according to the light distribution curve. In addition, the heat dissipation efficiency is excellent because the heat generated from the power supply module and the light emitting diode package is radiated through the heat dissipation solution to the housing of the module, thereby preventing damage to the light emitting diode chip due to withstand voltage, and high power light emission at low cost. Be able to manufacture and manufacture diode lighting equipment.

Moreover, maintenance costs are low because only damaged LED modules can be replaced individually, and heat rods are installed on each LED, so that the heat absorbed by the heat dissipation is released to the outside world more quickly, thereby improving heat dissipation efficiency. Not only can it be increased, but since the temperature of each light emitting diode module becomes lower than an image point, there is no possibility that a user will be burned.

1 is a perspective view of a multi-array light emitting diode lighting device of one embodiment of the present invention.

Figure 2 is a bottom view of a multi-array light emitting diode lighting device of one embodiment of the present invention.

Figure 3 is a longitudinal cross-sectional view of a multi-array light emitting diode lighting device of one embodiment of the present invention.

4 is a cross-sectional view of a first embodiment of a light emitting diode module used in a multi-array light emitting diode lighting device which is an embodiment of the present invention.

5 is a cross-sectional view of a second embodiment of a light emitting diode module used in a multi-array light emitting diode lighting device which is one embodiment of the present invention.

6 is a cross-sectional view of a third embodiment of a light emitting diode module used in a multi-array light emitting diode lighting device which is one embodiment of the present invention.

Hereinafter, single and multiple array LED lighting equipment using the heat dissipation liquid according to the present invention will be described in more detail with reference to the accompanying drawings. In the following description, a cylindrical LED lighting device has been described as an example, but the present invention is not limited thereto. The LED lighting device may be used in various shapes and shapes, such as a bulb-type LED lighting device, a fluorescent LED lighting device, or a flat panel LED lighting device. It should be understood that it can.

1 is a perspective view of a multi-array LED lighting device according to an embodiment of the present invention, and FIG. 2 is a bottom view of the multi-array LED lighting device according to an embodiment of the present invention. As shown in Figures 1 and 2, the multi-array light emitting diode illuminator 1000, which is an embodiment of the present invention, is generally cylindrical and has a base 10 formed on the top thereof, and a circumference around the bottom of the base 10. The power sockets 20 are formed at predetermined intervals. Here, the cross section of the base is circular, but the present invention is not limited thereto, and may have various shapes such as a rectangle and a polygon. On the other hand, the base bottom surface may be formed of a curved surface in consideration of light distribution characteristics. In addition, the interval may be spaced in consideration of light distribution characteristics. A plurality of cylindrical LED modules 100 are attached to the power socket 20. Accordingly, the cylindrical LED module 100 irradiates light by using an external AC power received through the base 10. The base 10 may be used by replacing a plurality of power terminal blocks according to the purpose of use.

The light emitting diode module 100 may be installed to the light emitting diode package to the outside to be irradiated toward the outside of the lighting device. Since the light emitting diode module 100 is stronger than other lighting devices, the light emitting diode module 100 may not be sufficiently irradiated with a portion directly below the lighting device 1000. In order to prepare for this, the direct type light emitting diode module 200 is installed at the center portion of the base 10, and this problem can be solved. When used in a special environment such as a factory, the light emitting diode module 100 may also be a direct type light emitting diode module.

Hereinafter, the above-described multi-array LED lighting apparatus will be described in more detail through the longitudinal cross-sectional view of FIG. 3 and the cross-sectional views of FIGS. 4 to 6.

As shown, the light emitting diode module 100 is attached to the circumferential surface of the base 10 having a circular cross section at predetermined intervals, and a direct type light emitting diode module 200 is attached to the center portion thereof. The base 10 includes a screw portion 11 which is in direct contact with an external AC power supply, and a base case 13 for accommodating the module base portion 110 of the light emitting diode module and having a cavity therein. Can be configured.

As shown in FIG. 3, the LED module 100 is attached to a power socket 20 installed in the base case 13. The light emitting diode module 100 includes a module base part 110 attached to the power socket 20, a cylindrical housing 130 hermetically coupled to the module base part 110, and an interior of the housing 130. A light emitting diode package 140 installed in the power supply module 150 for converting the external AC power to supply power to the light emitting diode package 140, the light emitting diode package 140, and the power supply module 150. The support structure 160 is fixed to the housing 130 to be filled, so as to impregnate the LED package 140 and the power supply module 150, accordingly the LED package 140 and the power supply It includes an insulating heat dissipation liquid 170 to dissipate heat generated from the module 150.

The configuration of the light emitting diode module will be described in more detail with reference to FIG. 3.

4 is a cross-sectional view of a first embodiment of a light emitting diode module used in a multi-array light emitting diode lighting device according to an embodiment of the present invention, and FIG. 5 is a light emitting diode module used in a multi-array light emitting diode lighting device according to an embodiment of the present invention. 6 is a cross-sectional view of a third embodiment of a light emitting diode module used in a multi-array light emitting diode lighting device which is an embodiment of the present invention.

The light emitting diode module 100 according to an embodiment of the present invention shown in FIG. 4 includes a module base 110, a housing 130, a light emitting diode package 140, a power supply module 150, a support structure 160, The heat dissipation liquid 170 and the power supply line 180 may be configured to be included.

The module base unit 110 is to be electrically connected to the power socket 20 installed in the base case of the base 10 and has a threaded connection unit.

The housing 130 has a cylindrical shape having an opening for receiving the LED package 140, the power supply module 150, the support structure 160, the power supply line 180, and the heat dissipation liquid 170. Glass may be used as the housing 130, and in the case of the present invention, since the heat dissipation efficiency is excellent, a transparent polymer of thermoplastic resin, which is difficult to use at 70 degrees or more, may be used. Inexpensive and workability is enhanced. In particular, when the heat dissipation liquid 170 to be described later is a silicone-based oil, and the housing 130 is also made of a silicone resin material, since the physical properties are similar, durability due to temperature changes can be excellent.

On the other hand, the surface of the housing 130 may be a light diffusion coating for light diffusion, by the light diffusion coating can be scattered to the LED light having a strong straightness can be changed to a more comfortable light to the person.

The light emitting diode package 140 includes an LED for converting electrical energy into light energy, and is generally attached to a PCB. In the present invention, a general light emitting diode package 140 having one LED is used. In addition, a linear light emitting diode may be used in which a plurality of LEDs are arranged vertically. In this case, the light of the linear light emitting diode may be irradiated outward.

The power supply module 150 is a component for changing the external AC power supplied through the base 10 to a power source (DC power source or AC power source) suitable for the light emitting diode package 140. The module 150 and the light emitting diode package 140 serve as heat generating sources for generating heat.

The heat dissipation liquid 170 filled in the cylindrical housing 130 performs a function of absorbing and radiating heat by directly contacting the heat generated by the light emitting diode package 140 and the power supply module (water cooling).

At this time, the heat dissipation liquid 170 should be provided with all of heat dissipation, light transmission, electrical insulation.

In more detail, 1) the thermal conductivity as a heat transfer medium should be excellent, 2) the state of molecular transport to transfer the heat energy (that is, the viscosity of the liquid phase must be high in motion with temperature, and 3) the molecular structure at high temperature 4) Excellent chemical resistance, chemical resistance (non-reactive) that does not occur chemical reaction, corrosion, ion exchange, etc. with other devices, 5) Excellent light transmittance, no change in refractive index at high temperature, 6) Refractive index is freely controlled, and there should be no haze phenomenon that gel or foreign substances are generated by self-synthesis or self-crosslinking. 7) High boiling point , Evaporation should not occur when operating at high temperature, and 8) rapid heat transfer should be made to the material surrounding the fluid (the fine powder by van der Waals' repulsion at the interface) There should be no voids), 9) The change should be small according to the temperature change, 10) The insulation of electric devices should be high, 11) It is environmentally friendly and non-toxic.

Accordingly, the heat dissipation liquid 170 used in the present invention is a straight-type dimethylsilicone (dimetylsilicon oil), methylphenyl silicon oil (methylphenyl silicon oil) or polymethyl hydrogen of the polydimethyl siloxane (Polydemetylsiloxane) type (polymethyl hydrogen siloxane), methyl hydrogen silicone oil and the like can be used.

On the other hand, in order to increase the thermal conductivity of the heat dissipating liquid 170, powdery CNT particles, silica particles, graphene particles, metal particles are further included, thereby increasing the thermal conductivity, these particles are tropical flow, convection effect Can be increased further.

The support structure 160 is a component attached to the module base part 110 to maintain the state in which the power supply module 150 and the light emitting diode package 140 are impregnated in the heat dissipation liquid 170. The support structure 160 may function as a power supply line 180 to be described later. Alternatively, a separate power supply line 180 may be added.

FIG. 5 shows a second embodiment according to the present invention, and has most of the same components as in FIG. 4, except that the module base portion 110 is formed of a pin type connector 110 ′.

6 shows a third embodiment according to the present invention, which is different from the first embodiment of FIG. 4 in that a heat rod 190 is further installed to increase heat dissipation efficiency, and the heat dissipation liquid 170 is leaked. In order to prevent the sealant 120 further includes.

As shown, a part is impregnated in the insulating heat dissipation liquid 170, and a part of the heat absorbed by the heat dissipating liquid 170 is further installed by installing a heat rod 190 through which the module base part 110 is exposed. It is discharged to the outside faster than this, thereby lowering the temperature of the heat dissipation liquid 170 and the temperature of the housing 130 by at least 3 degrees or more. In addition, since the sealing member 120 for sealing the housing 130 and the module base portion 110 is further included, even if the light emitting diode module 100 is installed in the reverse direction, the module base portion 110 and the housing 130 It is possible to prevent the leakage of oil that may occur in the coupling portion of). In addition, when the housing 130 and the sealant 120 are made of a silicone resin, the physical properties of both are similar, so that the degree of bonding may be maintained even after a sudden temperature change. On the other hand, the inside of the housing 130 may have an air layer of a predetermined size in consideration of the expansion of the heat radiation solution according to the temperature rise.

According to an aspect of an embodiment of the present invention having the above-described configuration, in the high output light emitting diode lighting device, a plurality of light emitting diode modules are separated, and each module is spaced apart, and power is supplied to the housing of the module through a heat dissipation liquid. Since heat generated from the module and the light emitting diode package is radiated, the heat dissipation efficiency is excellent, and the high output light emitting diode lighting device can be manufactured and produced at low cost.

Furthermore, since the heat rod is installed in each light emitting diode module, the heat absorbed by the heat dissipation liquid is released to the outer space more quickly, so that not only can the heat dissipation efficiency be improved, but also the temperature of each light emitting diode module is lower than the burn point, There is no fear of the user getting burned.

The above-described multi-array light emitting diode lighting device and a method of manufacturing the same are not limited to the configuration and method of the above-described embodiments, but the embodiments may be all or all of the embodiments so that various modifications may be made. Some may be optionally combined.

Claims

A base including a power terminal capable of electrical connection with an external AC power source, and a plurality of power sockets are formed on a circumferential surface of the base;

And a plurality of cylindrical light emitting diode modules attached to the power socket.

The light emitting diode module,

A module base part attached to the power socket;

A cylindrical housing hermetically coupled to the module base portion;

A light emitting diode package installed inside the housing;

A power supply module for converting the external AC power to supply power to the LED package;

A support structure for fixing the light emitting diode package and the power supply module; And

A multi-array light emitting diode lighting device filled with the housing, the impregnating the light emitting diode package and the power supply module and thus dissipating heat generated from the light emitting diode package and the power supply module. .
The method of claim 1,

The light emitting diode module,

And a sealing material for sealing the housing and the module base portion.
The method of claim 2,

The housing and the sealing material is made of a silicone resin,

The insulating heat dissipating liquid is a silicon-based insulating oil, multiple array light emitting diode lighting device.
The method of claim 3, wherein

The insulation heat dissipation solution is one of dimethyl silicone oil, methyl phenyl silicone oil, methyl hydrogen silicone oil, multiple array light emitting diode illuminator.
The method of claim 4, wherein

The thermal radiation particles containing at least one of graphene particles, CNT particles, silica particles, and metal particles are dispersed in the insulating heat dissipation solution.
The method of claim 1,

And a portion of the heat dissipation part, the heat sink being immersed in the insulating heat dissipation part, and partially exposed through the module base part.
The method of claim 1,

The cross section of the base is circular,

The plurality of power sockets are installed on the bottom of the base at a predetermined interval, multiple array light emitting diode lighting device.
The method of claim 1,

And the housing is made of a thermoplastic resin material.
The method of claim 1,

And the housing comprises glass having a light diffusion coating on its surface.
The method of claim 1,

And the support structure is used as a power supply line for supplying the external AC power to the power supply module.
The method of claim 1,

And the light emitting diode package is installed so that the irradiation light of the light emitting diode package faces outward.
The method of claim 11,

The central array of the base is a direct type light emitting diode module is installed, multiple array LED lighting device.
Providing a cylindrical housing made of glass;

Inserting a light emitting diode package into the housing and installing a power supply module for supplying power to the light emitting diode;

Filling the cylindrical housing with an insulating heat dissipation solution;

Attaching a base for receiving external AC power to one end of the housing while sealing the opening of the housing with a sealing material.
The method of claim 13,

And installing a heat rod partially impregnated in the insulating heat dissipating liquid, a part of which protrudes from the base portion.