WO2013189373A3 - 一种内散热的终端 - Google Patents
一种内散热的终端 Download PDFInfo
- Publication number
- WO2013189373A3 WO2013189373A3 PCT/CN2013/081804 CN2013081804W WO2013189373A3 WO 2013189373 A3 WO2013189373 A3 WO 2013189373A3 CN 2013081804 W CN2013081804 W CN 2013081804W WO 2013189373 A3 WO2013189373 A3 WO 2013189373A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- terminal
- heat dissipation
- internal heat
- cavity body
- heat storage
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Connection Of Batteries Or Terminals (AREA)
- Secondary Cells (AREA)
Abstract
本实用新型公开了一种内散热的终端,所述终端包括至少一个内置储热材料的腔体;所述腔体位于所述终端内的无器件的区域。采用本实用新型的技术方案,能够大幅度增强终端的储热能力。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP13807715.1A EP2991458A4 (en) | 2013-04-27 | 2013-08-19 | END UNIT WITH INTERNAL HEAT DISPOSAL |
US14/787,057 US10130010B2 (en) | 2013-04-27 | 2013-08-19 | Internal heat-dissipation terminal |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2013202240424U CN203279336U (zh) | 2013-04-27 | 2013-04-27 | 一种内散热的终端 |
CN201320224042.4 | 2013-04-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2013189373A2 WO2013189373A2 (zh) | 2013-12-27 |
WO2013189373A3 true WO2013189373A3 (zh) | 2014-04-03 |
Family
ID=49509652
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2013/081804 WO2013189373A2 (zh) | 2013-04-27 | 2013-08-19 | 一种内散热的终端 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10130010B2 (zh) |
EP (1) | EP2991458A4 (zh) |
CN (1) | CN203279336U (zh) |
WO (1) | WO2013189373A2 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11558957B2 (en) * | 2020-06-12 | 2023-01-17 | Raytheon Company | Shape memory thermal capacitor and methods for same |
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CN1458562A (zh) * | 2002-01-31 | 2003-11-26 | 王松 | 彩色显示屏电器的热源靠近外壳内壁散热或屏蔽的方法 |
CN1458561A (zh) * | 2002-01-31 | 2003-11-26 | 王松 | 彩色显示屏电器的热源靠近外壳内壁散热或屏蔽的结构 |
CN1592566A (zh) * | 2003-08-28 | 2005-03-09 | 王松 | 彩色显示屏电器的硬件结构 |
CN1599549A (zh) * | 2003-09-16 | 2005-03-23 | 王松 | 彩色显示屏电器热源的屏蔽和散热方法 |
CN2770284Y (zh) * | 2002-01-31 | 2006-04-05 | 王松 | 彩色显示屏电器的热源靠近外壳内壁散热与屏蔽的结构 |
CN101707859A (zh) * | 2009-11-30 | 2010-05-12 | 深圳华为通信技术有限公司 | 自然散热设备及提高设备散热能力的方法 |
CN201709079U (zh) * | 2010-05-26 | 2011-01-12 | 深圳Tcl新技术有限公司 | 屏蔽散热结构 |
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IL122250A (en) * | 1997-11-19 | 2003-07-31 | On Track Innovations Ltd | Smart card amenable to assembly using two manufacturing stages and a method of manufacture thereof |
DE19835127A1 (de) * | 1998-08-04 | 2000-02-10 | Wuerth Elektronik Gmbh | Leiterplatte mit einem Heatsink und Verfahren zum Anbringen eines Heatsink |
US6341062B1 (en) | 2000-03-06 | 2002-01-22 | International Business Machines Corp. | Thermal transfer hinge for hinged mobile computing device and method of heat transfer |
CN1316858C (zh) * | 2001-04-27 | 2007-05-16 | 日本电气株式会社 | 高频电路基板及其制造方法 |
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JP2003086728A (ja) * | 2001-07-05 | 2003-03-20 | Matsushita Electric Ind Co Ltd | 高周波回路の製作方法及びそれを用いた装置 |
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JP4857253B2 (ja) | 2007-12-07 | 2012-01-18 | 株式会社日立製作所 | 画像表示装置 |
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CN101770563B (zh) | 2009-12-30 | 2011-11-02 | 华为终端有限公司 | 智能卡散热装置及其制造方法 |
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FR2963139B1 (fr) * | 2010-07-20 | 2012-09-14 | Oberthur Technologies | Dispositif a microcircuit comprenant des moyens d'amplification du gain d'une antenne |
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2013
- 2013-04-27 CN CN2013202240424U patent/CN203279336U/zh not_active Expired - Lifetime
- 2013-08-19 US US14/787,057 patent/US10130010B2/en active Active
- 2013-08-19 EP EP13807715.1A patent/EP2991458A4/en not_active Withdrawn
- 2013-08-19 WO PCT/CN2013/081804 patent/WO2013189373A2/zh active Application Filing
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1458562A (zh) * | 2002-01-31 | 2003-11-26 | 王松 | 彩色显示屏电器的热源靠近外壳内壁散热或屏蔽的方法 |
CN1458561A (zh) * | 2002-01-31 | 2003-11-26 | 王松 | 彩色显示屏电器的热源靠近外壳内壁散热或屏蔽的结构 |
CN2770284Y (zh) * | 2002-01-31 | 2006-04-05 | 王松 | 彩色显示屏电器的热源靠近外壳内壁散热与屏蔽的结构 |
CN1592566A (zh) * | 2003-08-28 | 2005-03-09 | 王松 | 彩色显示屏电器的硬件结构 |
CN1599549A (zh) * | 2003-09-16 | 2005-03-23 | 王松 | 彩色显示屏电器热源的屏蔽和散热方法 |
CN101707859A (zh) * | 2009-11-30 | 2010-05-12 | 深圳华为通信技术有限公司 | 自然散热设备及提高设备散热能力的方法 |
CN201709079U (zh) * | 2010-05-26 | 2011-01-12 | 深圳Tcl新技术有限公司 | 屏蔽散热结构 |
Also Published As
Publication number | Publication date |
---|---|
US10130010B2 (en) | 2018-11-13 |
EP2991458A4 (en) | 2016-05-25 |
CN203279336U (zh) | 2013-11-06 |
WO2013189373A2 (zh) | 2013-12-27 |
EP2991458A2 (en) | 2016-03-02 |
US20160106002A1 (en) | 2016-04-14 |
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