WO2013189373A3 - 一种内散热的终端 - Google Patents

一种内散热的终端 Download PDF

Info

Publication number
WO2013189373A3
WO2013189373A3 PCT/CN2013/081804 CN2013081804W WO2013189373A3 WO 2013189373 A3 WO2013189373 A3 WO 2013189373A3 CN 2013081804 W CN2013081804 W CN 2013081804W WO 2013189373 A3 WO2013189373 A3 WO 2013189373A3
Authority
WO
WIPO (PCT)
Prior art keywords
terminal
heat dissipation
internal heat
cavity body
heat storage
Prior art date
Application number
PCT/CN2013/081804
Other languages
English (en)
French (fr)
Other versions
WO2013189373A2 (zh
Inventor
侯方西
Original Assignee
中兴通讯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 中兴通讯股份有限公司 filed Critical 中兴通讯股份有限公司
Priority to EP13807715.1A priority Critical patent/EP2991458A4/en
Priority to US14/787,057 priority patent/US10130010B2/en
Publication of WO2013189373A2 publication Critical patent/WO2013189373A2/zh
Publication of WO2013189373A3 publication Critical patent/WO2013189373A3/zh

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018Presence of a frame in a printed circuit or printed circuit assembly

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Connection Of Batteries Or Terminals (AREA)
  • Secondary Cells (AREA)

Abstract

本实用新型公开了一种内散热的终端,所述终端包括至少一个内置储热材料的腔体;所述腔体位于所述终端内的无器件的区域。采用本实用新型的技术方案,能够大幅度增强终端的储热能力。
PCT/CN2013/081804 2013-04-27 2013-08-19 一种内散热的终端 WO2013189373A2 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP13807715.1A EP2991458A4 (en) 2013-04-27 2013-08-19 END UNIT WITH INTERNAL HEAT DISPOSAL
US14/787,057 US10130010B2 (en) 2013-04-27 2013-08-19 Internal heat-dissipation terminal

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN2013202240424U CN203279336U (zh) 2013-04-27 2013-04-27 一种内散热的终端
CN201320224042.4 2013-04-27

Publications (2)

Publication Number Publication Date
WO2013189373A2 WO2013189373A2 (zh) 2013-12-27
WO2013189373A3 true WO2013189373A3 (zh) 2014-04-03

Family

ID=49509652

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2013/081804 WO2013189373A2 (zh) 2013-04-27 2013-08-19 一种内散热的终端

Country Status (4)

Country Link
US (1) US10130010B2 (zh)
EP (1) EP2991458A4 (zh)
CN (1) CN203279336U (zh)
WO (1) WO2013189373A2 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11558957B2 (en) * 2020-06-12 2023-01-17 Raytheon Company Shape memory thermal capacitor and methods for same

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CN1599549A (zh) * 2003-09-16 2005-03-23 王松 彩色显示屏电器热源的屏蔽和散热方法
CN2770284Y (zh) * 2002-01-31 2006-04-05 王松 彩色显示屏电器的热源靠近外壳内壁散热与屏蔽的结构
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CN1458561A (zh) * 2002-01-31 2003-11-26 王松 彩色显示屏电器的热源靠近外壳内壁散热或屏蔽的结构
CN2770284Y (zh) * 2002-01-31 2006-04-05 王松 彩色显示屏电器的热源靠近外壳内壁散热与屏蔽的结构
CN1592566A (zh) * 2003-08-28 2005-03-09 王松 彩色显示屏电器的硬件结构
CN1599549A (zh) * 2003-09-16 2005-03-23 王松 彩色显示屏电器热源的屏蔽和散热方法
CN101707859A (zh) * 2009-11-30 2010-05-12 深圳华为通信技术有限公司 自然散热设备及提高设备散热能力的方法
CN201709079U (zh) * 2010-05-26 2011-01-12 深圳Tcl新技术有限公司 屏蔽散热结构

Also Published As

Publication number Publication date
US10130010B2 (en) 2018-11-13
EP2991458A4 (en) 2016-05-25
CN203279336U (zh) 2013-11-06
WO2013189373A2 (zh) 2013-12-27
EP2991458A2 (en) 2016-03-02
US20160106002A1 (en) 2016-04-14

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