WO2013176518A1

WO2013176518A1 - Capacitive touch sensing device including sensor pattern sub groups in which plurality of sensor pads are arranged

Info

Publication number: WO2013176518A1
Application number: PCT/KR2013/004576
Authority: WO
Inventors: 김재흥; 오영진
Original assignee: 크루셜텍 주식회사
Priority date: 2012-05-25
Filing date: 2013-05-24
Publication date: 2013-11-28

Abstract

Provided is a capacitive touch sensing device including one or more sensor pattern groups which are arranged in rows or columns, wherein the sensor pattern groups include a plurality of sensor pads. The sensor pattern groups are formed on capacitive touch panels having single layers, thereby reducing production costs and simplifying a manufacturing process. Additionally, a smaller number of wires are necessary when compared to a structure in which wires are connected to each sensor pad, and thus only a minimum amount of space for wiring is needed.

Description

Capacitive touch sensing device comprising a sensor pattern sub-group in which a plurality of sensor pads are disposed

The present invention relates to a capacitive touch sensing device, and more particularly, to a capacitive touch sensing device including one or more sensor pattern groups arranged in a row or column direction.

The touch screen panel is a device for inputting a user's command by touching with a human hand or other contact means based on the content displayed by the image display device. To this end, the touch screen panel is provided on the front face of the image display device to convert a contact position directly contacted by a human hand or other contact means into an electrical signal. Accordingly, the instruction selected at the contact position is received as an input signal.

As a method of implementing a touch screen panel, a resistive film method, a light sensing method, and a capacitive method are known. The capacitive touch panel detects a change in capacitance formed by the conductive sensing pattern when the human hand or an object is touched by another sensing pattern or ground electrode, and converts the contact position into an electrical signal.

In the capacitive touch screen panel according to the prior art, the linear sensor pad in the lateral direction and the linear sensor pad in the longitudinal direction are formed of an expensive ITO layer, thereby increasing the cost of the product to which the capacitive touch screen panel is applied. Since the process of forming each sensor pad is required, the manufacturing process is also complicated.

In addition, since the sensor pads are formed on both sides of the substrate and wires must be connected to each sensor pad, there is a problem in that a large number of sensor pads has a space limitation in expanding the capacitive touch screen panel to a large area.

1 is a plan view illustrating an example of a capacitive touch screen panel according to the related art.

In the capacitive touch screen panel shown in FIG. 1, a sensor pad 5 is formed on a single layer. Since the touch screen panel has wires connected to each of the sensor pads 5, the capacitive touch screen panel increases, and as the number of the sensor pads 5 increases, the wires increase.

Provided is a capacitive touch sensing device including at least one group of sensor patterns arranged in a row or column direction.

According to one aspect, the first sensor pattern sub-group comprising a plurality of sensor pads; A second sensor pattern subgroup adjacent to the first sensor pattern subgroup in a second axis direction; A third sensor pattern subgroup adjacent to the first sensor pattern subgroup in a first axis direction; And a fourth sensor pattern subgroup adjacent to the second sensor pattern subgroup in a second axis direction, wherein the sensor pads belonging to the first sensor pattern subgroup and the third sensor pattern subgroup are electrically connected to each other. The sensor pads belonging to the second sensor pattern subgroup and the fourth sensor pattern subgroup are electrically connected, respectively, and the order in which the sensor pads belonging to the first sensor pattern subgroup and the third sensor pattern subgroup are connected, A capacitive touch sensing apparatus including a sensor pattern subgroup in which a plurality of sensor pads is arranged, in which the sensor pads belonging to the second sensor pattern subgroup and the fourth sensor pattern subgroup are different from each other is provided.

In this case, the electrically connected sensor pads may be connected by a sensor signal line formed of the same material as the sensor pad.

In addition, the sensor signal line may connect the sensor pads to each other in the display area of the touch panel.

In addition, the sensor pad may be formed of a transparent conductive material.

In addition, the capacitive touch sensing apparatus may further include a touch sensing unit configured to sense a touch based on the difference of the voltage variation in the sensor pad.

The sensor pads of the first to fourth sensor pattern subgroups may be determined by comparing a pattern in which a difference in voltage variation occurs when the touch occurs in a plurality of sensor pads with a predetermined pattern.

In another aspect, the first sensor pattern sub-group including a plurality of sensor pads disposed on the same axis; A second sensor pattern subgroup including a plurality of sensor pads disposed on the same axis as the first sensor pattern subgroup; And a first identification pad for identifying a location of the first sensor pattern subgroup and a second identification pad for identifying a location of the second sensor pattern subgroup, wherein the sensor is included in the first sensor pattern subgroup. A pad is provided with a capacitive touch sensing device including a plurality of sensor pads disposed on the same surface, each of which is electrically connected to a sensor pad included in the second sensor pattern subgroup.

In this case, the sensor pattern group further includes a third sensor pattern subgroup disposed on the same axis as the first sensor pattern subgroup, and a third identification pad for identifying a position of the third sensor pattern subgroup. The sensor pads included in the third sensor pattern subgroup may be electrically connected to the sensor pads included in the first sensor pattern subgroup, respectively.

In addition, the electrically connected sensor pads may be connected to each other by a sensor signal line, and the sensor signal lines may be disposed on the same surface and may not cross each other.

In addition, the sensor signal line may be made of the same material as the sensor pad.

In addition, the sensor pad, the first identification pad, and the second identification pad may be formed of a transparent conductive material.

The sensor pad, the first identification pad, and the second identification pad may output a signal corresponding to a touch state of the touch input tool in response to an alternating voltage alternated with a predetermined frequency in a floating state.

The capacitive touch sensing apparatus may further include a touch sensing unit configured to sense a touch based on a difference between voltage variations in the first identification pad and the second identification pad.

In addition, the first identification pad and the second identification pad may be connected to the touch sensing unit by a sensor signal line.

In the capacitive touch sensing apparatus provided herein, the capacitive touch panel on which the sensor pad is disposed is formed in a single layer, thereby reducing production costs and simplifying the manufacturing process.

In addition, since a smaller number of wirings are required for each sensor pad than a structure in which wirings are connected, space for wiring can be minimized.

1 is a plan view illustrating a capacitive touch screen panel according to the related art.

2A is a diagram illustrating a configuration of a capacitive touch sensing apparatus according to an aspect.

2B illustrates a capacitive touch screen panel installed on the display device.

2C shows an equivalent circuit for touch detection when there is a contact.

3 is a diagram illustrating a capacitive touch sensing apparatus according to an embodiment.

4 is a diagram illustrating a capacitive touch sensing device according to another embodiment.

5 is a diagram illustrating a capacitive touch sensing apparatus according to another embodiment.

6 is a diagram illustrating a configuration of a capacitive touch sensing apparatus according to another aspect.

7 is a diagram illustrating a sensor pattern group of a capacitive touch sensing apparatus according to another exemplary embodiment.

8 is a diagram illustrating a sensor pattern group of a capacitive touch sensing apparatus according to another exemplary embodiment.

9 is a diagram illustrating a sensor pattern group of the capacitive touch sensing apparatus according to another exemplary embodiment.

10 is a diagram illustrating a sensor pattern group of a capacitive touch sensing apparatus according to another exemplary embodiment.

11 is a diagram illustrating a sensor pattern group of a capacitive touch sensing apparatus according to another exemplary embodiment.

12 is a block diagram illustrating a capacitive touch sensing apparatus according to an embodiment.

13 is a flowchart illustrating a touch sensing method according to an aspect.

14 is a flowchart illustrating a touch sensing method according to another aspect.

Hereinafter, with reference to the accompanying drawings will be described the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. Throughout the specification, when a part is said to "include" a certain component, it means that it may further include other components, except to exclude other components unless specifically stated otherwise. In addition, the terms "... unit", "module", etc. described in the specification mean a unit for processing at least one function or operation, which may be implemented in hardware or software or a combination of hardware and software. .

Throughout the specification, when a part is "connected" to another part, it includes not only "directly connected" but also "indirectly connected" with another member in between. . In addition, when a part is said to "include" a certain component, this means that it may further include other components, without excluding the other components unless otherwise stated.

The capacitive touch sensing apparatus described herein includes one or more sensor pattern groups arranged in a row or column direction. The sensor pattern group includes a sensor pattern subgroup in which a plurality of sensor pads are arranged in the same axial direction.

Referring to FIG. 2A, the capacitive touch sensing apparatus 10 may include a sensor pattern group 100 in which a plurality of sensor pads are disposed in a first axis direction.

FIG. 2B illustrates a capacitive touch screen panel installed on the display device, and FIG. 2C illustrates an equivalent circuit for touch detection when there is a contact.

2A to 2C, the capacitive touch sensing apparatus 10 may include one or more sensor pattern groups 100 arranged in a row or column direction.

The sensor pattern group 100 may include a plurality of sensor pads 200 disposed on the same surface.

The sensor pad 200 is a patterned electrode on a substrate for detecting a touch input to form a touch capacitance Ct between a touch input tool such as a finger or a conductor. In this case, the touch capacitance Ct refers to a capacitance formed between the sensor pad 200 and the touch input tool when there is a contact.

Hereinafter, a method of detecting a touch by the capacitive touch screen panel will be described.

Referring to FIG. 2B, a touch screen panel is disposed on the display device 20. Accordingly, the sensor pad 200 may be disposed on the upper surface of the substrate 1, and a protective panel 3 for protecting the sensor pad 200 may be attached to the substrate 1. The touch screen panel may be attached to the display device 20 through the adhesive member 9, and an air gap 9a may be formed between the display device 20.

2B and 2C, when there is contact, capacitance Ct is formed between the finger 8 and the sensor pad 200, and capacitance Cvcom is formed between the sensor pad 200 and the common electrode 202. In the sensor pad 200, an unknown parasitic capacitance Cp is formed.

2C corresponds to an equivalent circuit of a method of detecting a touch by measuring a level shift among capacitive touch detection methods.

Referring to FIG. 2C, when a finger contacts the sensor pad, Cvcom, Cdrv, Cp, Ct, and the like are generated. Here, the capacitive touch screen panel detects a change amount of Ct to recognize a touch.

By substituting the touch capacitance Ct into the following Equation 1, the area of the touch by the touch input tool can be measured.

Equation 1

In Equation 1, silver may be obtained from a medium between the sensor pad 200 and a finger as a dielectric constant. If the tempered glass is attached to the upper surface of the substrate, the dielectric constant can be derived from the relative dielectric constant of the tempered glass multiplied by the dielectric constant of the vacuum. S2 corresponds to the area where the sensor pad 200 faces the finger. For example, if the finger covers all of the sensor pad 200, S2 corresponds to the area of the sensor pad 200, and if the finger covers a portion of the sensor pad 200, S2 is reduced by the area not facing the finger. will be. Since D2 is the distance between the sensor pad 200 and the finger, it will correspond to the thickness of the reinforcement glass or other type of protection panel on the upper surface of the substrate.

According to Equation 1, since Ct is proportional to the opposing area of the finger and the sensor pad 200, the touch occupancy rate of the finger with respect to the sensor pad 200 can be calculated therefrom. Therefore, not only whether the touch signal is detected or not is detected based on Ct but also the area of the touch by the finger can be obtained by substituting Equation 1 below.

The sensor pattern group 100 includes a first sensor pattern subgroup 110 including a plurality of sensor pads, and a second sensor pattern subgroup 120 adjacent to the first sensor pattern subgroup 110 in a second axis direction. , The third sensor pattern subgroup 130 adjacent to the first sensor pattern subgroup 110 in the first axis direction, and the fourth sensor pattern subgroup adjacent to the second sensor pattern subgroup 120 in the second axis direction. 140 may be included.

Here, the sensor pads belonging to the first sensor pattern subgroup 110 and the third sensor pattern subgroup 130 may be electrically connected to each other, and the second sensor pattern subgroup 120 and the fourth sensor pattern subgroup ( The sensor pads belonging to 140 may be electrically connected to each other. In addition, the sensor pads belonging to the first sensor pattern subgroup 110 and the third sensor pattern subgroup 130 are connected to each other, and the second sensor pattern subgroup 120 and the fourth sensor pattern subgroup 140 are connected to each other. The order in which the belonging sensor pads are connected may be different.

In addition, each sensor pad may be connected to any one of the sensor pads of the different sensor pattern subgroups without being connected to any one, and sensor pads included in the same sensor pattern subgroup are not overlapped with each other.

The sensor pads electrically connected to each other may be connected by a sensor signal line formed of the same material as the sensor pad. In addition, the sensor signal line may connect the sensor pads to each other in the display area of the touch panel.

For example, the sensor pads connected to each other in the first sensor pattern subgroup 110 and the third sensor pattern subgroup 130 may be connected to each other by a first sensor signal line (not shown), and the second sensor pattern subgroup 130 may be connected to each other. The sensor pads connected to each other in the group 120 and the fourth sensor pattern subgroup 140 may be connected to each other by a second sensor signal line (not shown). In this case, the first sensor signal line and the second sensor signal line are disposed on the same surface and do not cross each other.

In addition, the sensor pad 200 may be connected to a touch sensing unit (not shown) to be described later by the first sensor signal line and the second sensor signal line.

The first sensor signal line and the second sensor signal line may be made of the same material as the sensor pad 200. For example, when the sensor pad 200 is a transparent conductive material such as ITO, the first sensor signal line and the second sensor signal line may also be formed of the same material.

The capacitive touch sensing device may further include a touch sensing unit (not shown).

The touch detector may detect a touch based on the difference of the voltage variation in the sensor pad 200. In this case, the touch sensing unit may be connected to each sensor pad by a first sensor signal line and a second sensor signal line.

In addition, the touch sensing unit may calculate the touch coordinates on the touch screen by calculating the touch area of each sensor pad based on the difference of the voltage variation in each sensor pad.

Here, when a touch occurs, the sensing area for sensing the touch may include an area in which the two sensor pads 200 are added together. For example, when a touch occurs in an area including a sensor pad belonging to a first sensor pattern subgroup 110 and a second sensor pattern subgroup 120 adjacent in a second axis direction, a touch may be detected. It can be an area. The sensing region will be described later with reference to FIG. 2.

In the meantime, the touch sensing unit compares a pattern, in which a difference in voltage fluctuation occurs when a touch occurs, with a predetermined pattern, and determines which subgroup of the first to fourth sensor pattern subgroups is touched. You can decide. The predetermined pattern may be a pattern in which sensor pads connected in different orders in each row are simultaneously touched over a plurality of rows.

In this case, any one of the sensor pad of the first sensor pattern subgroup 110 and the sensor pad of the third sensor pattern subgroup 130 is electrically connected, and the sensor pad of the second sensor pattern subgroup 120 is electrically connected. Since one of the sensor pads of the fourth sensor pattern subgroup 140 is electrically connected to each other, the touch coordinates may not be easily calculated based on the difference of the voltage variation in each sensor pad.

Accordingly, in one embodiment, the sensor pattern subgroup may include an order in which sensor pads belonging to the first sensor pattern subgroup 110 and the third sensor pattern subgroup 130 are electrically connected, and the second sensor pattern subgroup 120. ) And the sensor pads belonging to the fourth sensor pattern subgroup 140 are electrically connected in different order, so that a sensing area for detecting a touch is located in the sensor pad and second sensor pattern subgroup of the first sensor pattern subgroup 110. If the sensor pad of 120 is included, the touch on each sensor pad may be distinguished and detected. This will be described later with reference to FIG. 3.

In one example, since the capacitive touch panel is formed of a single layer, the cost required to form an expensive ITO layer can be reduced, and the manufacturing process can be simplified since the sensor pad and the sensor signal line are formed on the same surface.

In addition, since a plurality of sensor pads included in the sensor pattern group 100 are connected to each other in the capacitive touch sensing device, a smaller number of wires are required than in the conventional art of forming wires on the respective sensor pads. Space for wiring can be reduced.

3 is a diagram illustrating the capacitive touch sensing device.

The capacitive touch sensing apparatus may include a sensor pattern group 100 in which a plurality of sensor pads 200 are disposed in a first axis direction.

The sensor pad 200 may output a signal according to a touch state in response to an alternating voltage in a floating state after charge is charged. For example, the sensor pad 200 may output a change in touch charge amount or a change in meter charge amount according to a touch state of a touch input tool in response to an alternating voltage alternated at a predetermined frequency, and the touch sensing unit (not shown) to be described later. ) By using the touch charge variation or the metric charge variation in the sensor pad 200, the voltage variation may be measured, and the touch may be sensed based on the touch variation.

Therefore, the capacitive touch sensing apparatus can measure the touch area on the sensor pad 200 based on the difference of the voltage variation. Here, the sensor pads 200 are polygonal in independent states, respectively, and a plurality of sensor pads 200 are disposed over the front of the touch screen. In addition, when the touch area of each sensor pad is calculated, touch coordinates may be calculated on the touch screen.

The sensor pad 200 may be formed of a transparent conductive material. For example, the sensor pad 200 may be formed of a transparent conductive material such as indium tin oxide (ITO), antimony tin oxide (ATO), carbon nano tube (CNT), indium zinc oxide (IZO), but not limited thereto. However, it may be formed of a metal.

The sensor pattern group 100 may include a first sensor pattern subgroup 110, a second sensor pattern subgroup 120, a third sensor pattern subgroup 130, and a fourth sensor pattern subgroup 140. have. Specifically, the sensor pattern group 100 may include a first sensor pattern subgroup 110 including a plurality of sensor pads, and a second sensor pattern subgroup adjacent to the first sensor pattern subgroup 110 in a second axis direction. 120, a third sensor pattern subgroup 130 adjacent to the first sensor pattern subgroup 110 in a first axis direction, and a fourth sensor pattern adjacent to the second sensor pattern subgroup 120 in a second axis direction. Subgroup 140 may be included. That is, in the sensor pattern group 100, as illustrated in FIG. 3, each

sensor pattern subgroup

110, 120, 130, and 140 may include four sensor pads 200, respectively.

In this case, the sensor pads belonging to the first sensor pattern subgroup 110 and the third sensor pattern subgroup 130 may be electrically connected to each other, and the second sensor pattern subgroup 120 and the fourth sensor pattern subgroup ( The sensor pads belonging to 140 may be electrically connected to each other. In addition, the sensor pads belonging to the first sensor pattern subgroup 110 and the third sensor pattern subgroup 130 are connected to each other, and the second sensor pattern subgroup 120 and the fourth sensor pattern subgroup 140 are connected to each other. The order in which the belonging sensor pads are connected may be different.

Here, the sensor pads connected to each other in the first sensor pattern subgroup 110 and the third sensor pattern subgroup 130 may be connected to each other by the first sensor signal lines a1, a2, a3, and a4. In addition, the sensor pads connected to each other in the second sensor pattern subgroup 120 and the fourth sensor pattern subgroup 140 may be connected to each other by the second sensor signal lines b1, b2, b3, and b4. In this case, the first sensor signal line and the second sensor signal line are disposed on the same surface and do not cross each other.

Hereinafter, the sensor pads arranged in the first axial direction will be described as being positioned in the first to fourth columns according to the arrangement order in each subgroup for convenience of description.

For example, the sensor pads positioned in the first column of the first sensor pattern subgroup 110 and the sensor pads positioned in the first column of the third sensor pattern subgroup 130 may be connected by the first sensor signal line a1. On the other hand, the sensor pads positioned in the first column of the second sensor pattern subgroup 120 and the sensor pads positioned in the fourth column of the fourth sensor pattern subgroup 140 may be formed by the second sensor signal line b1. Can be connected.

Similarly, the sensor pads positioned in the second column of the first sensor pattern subgroup 110 and the sensor pads positioned in the second column of the third sensor pattern subgroup 130 may be connected by the first sensor signal line a2. The sensor pads positioned in the second column of the second sensor pattern subgroup 120 and the sensor pads positioned in the first column of the fourth sensor pattern subgroup 140 may be connected by the second sensor signal line b2. .

That is, the order in which the sensor pads belonging to the first sensor pattern subgroup 110 and the third sensor pattern subgroup 130 are connected, and to the second sensor pattern subgroup 120 and the fourth sensor pattern subgroup 140, respectively. The order in which the sensor pads connected are different from each other.

The sensor pads belonging to each subgroup and one of the sensor pads belonging to another subgroup may be connected in various ways.

Each sensor pad is connected to one of the sensor pads included in another sensor pattern subgroup, and not connected to a plurality of sensor pads included in the same sensor pattern subgroup.

For example, the sensor pads positioned in the first column of the second sensor pattern subgroup 120 may be connected to any one of the first to fourth columns of the fourth sensor pattern subgroup 140. However, the sensor pads positioned in the first column of the second sensor pattern subgroup 120 may not be connected to a plurality of sensor pads among the sensor pads positioned in the first to fourth columns of the fourth sensor pattern subgroup 140. Do not.

Further, the first sensor signal lines a1, a2, a3, a4 and the second sensor signal lines b1, b2, b3, b4 do not cross or overlap each other.

In this case, a shape, a position, and the like in which the sensor pads included in the sensor pattern group 100 are connected by the first sensor signal line or the second sensor signal line may be variously implemented.

In addition, the first sensor signal lines a1, a2, a3, and a4 and the second sensor signal lines b1, b2, b3, and b4 may be made of the same material as the sensor pad 200. For example, when the sensor pad 200 is a transparent conductive material such as ITO, the first sensor signal lines a1, a2, a3, and a4 and the second sensor signal lines b1, b2, b3, and b4 may also be formed of the same material. Can be.

The sensing area 30 is an area for sensing a touch and may include an area in which two sensor pads 200 are combined. For example, as illustrated in FIG. 3, the sensing area 30 includes a sensor pad positioned in a first column of the first sensor pattern subgroup 110 and a sensor pad positioned in a first column of the second sensor pattern subgroup 120. It may include the area included.

Meanwhile, the sensor pads 200 are connected to the touch sensing unit (not shown) by the first sensor signal lines a1, a2, a3, and a4 and the second sensor signal lines b1, b2, b3, and b4. Allow touch to be detected.

In addition, the touch detector may detect the touch area by using a difference of the voltage variation in the sensor pad 200 with respect to the sensor pad 200.

Detecting a touch when a touch occurs in the sensing area 30 will be described.

First, as shown in FIG. 3, the sensor pads positioned in the first column of the first sensor pattern subgroup 110 are referred to as 'sensor pad A', and the 'sensor pad A' is referred to as the third sensor pattern subgroup 130. It is connected to 'Sensor Pad B' located in the first column of. In addition, the 'sensor pad a' located in the first row of the second sensor pattern subgroup 120 is connected to the 'sensor pad b' located in the fourth row of the fourth sensor pattern subgroup 140.

'Sensor pad A' belonging to the first sensor pattern subgroup 110 includes 'Sensor pad A' and 'Sensor pad a' in a state connected to 'Sensor pad B' belonging to the third sensor pattern subgroup 130. When a touch is generated in the sensing area 30, the touch area is sensed by using a difference between the voltage variation when the touch is not generated and the touch is generated in the 'sensor pad A'. However, since the 'sensor pad A' and the 'sensor pad B' are electrically connected to each other, it may not be easy to discern since the touch of the 'sensor pad A' and the 'sensor pad B' is sensed.

However, when the difference between the voltage fluctuations of the 'sensor pad A' is calculated and the difference between the voltage fluctuations when no touch occurs and the touch occurs in the 'sensor pad a' included in the sensing area 30 is used, You can find out if a touch has occurred.

As described above, since the 'sensor pad A' and the 'sensor pad B' are connected to each other, and the 'sensor pad a' and the 'sensor pad b' are connected to each other, the difference in voltage variation in each sensor pad is based on the difference. In this case, it is possible to find out that a touch has occurred in the 'sensor pad A' and 'sensor pad a' included in the sensing area 30. You can confirm that.

Since the sensor pattern subgroup shown in FIG. 3 includes a configuration similar to that of the sensor pattern subgroup in FIGS. 2A, 2B, and 2C, the sensor pattern subgroups of FIGS. 2A, 2B, and 2C are omitted, even if omitted below. The information about the group may also be applied to the sensor pattern subgroup shown in FIG. 3.

4 is a diagram illustrating a capacitive touch sensing apparatus according to another exemplary embodiment.

As shown in FIG. 4, the sensor pattern group 100 of the capacitive touch sensing device is extended from the sensor pattern group shown in FIG. 3, and the manner in which the pattern subgroups are connected is shown in FIG. 3. Similar to a group.

The sensor pattern group 100 of the capacitive touch sensing device includes a first sensor pattern subgroup 110, a second sensor pattern subgroup 120, a third sensor pattern subgroup 130, and a fourth sensor pattern subgroup ( 140, the fifth sensor pattern subgroup 150, and the sixth sensor pattern subgroup 160. That is, in the sensor pattern group 100, as illustrated in FIG. 4, six

sensor pattern subgroups

110, 120, 130, 140, 150, and 160 may include four sensor pads 200, respectively. .

Here, the sensor pads belonging to the first sensor pattern subgroup 110, the third sensor pattern subgroup 130, and the fifth sensor pattern subgroup 150 may be electrically connected to each other, and the second sensor pattern subgroup ( 120, the sensor pads belonging to the fourth sensor pattern subgroup 140 and the sixth sensor pattern subgroup 160 may be electrically connected to each other.

In addition, the order in which the sensor pads belonging to the first sensor pattern subgroup 110, the third sensor pattern subgroup 130, and the fifth sensor pattern subgroup 150 are connected, the second sensor pattern subgroup 120, The order in which the sensor pads belonging to the fourth sensor pattern subgroup 140 and the sixth sensor pattern subgroup 160 are connected may be different from each other.

In addition, the sensor pads 200 connected to each other in the first sensor pattern subgroup 110, the third sensor pattern subgroup 130, and the fifth sensor pattern subgroup 150 may include first sensor signal lines a1, a2, and the like. Sensor pads 200 connected to each other by a3 and a4 and connected to each other in the second sensor pattern subgroup 120, the fourth sensor pattern subgroup 140, and the sixth sensor pattern subgroup 160 may be connected to each other. The second sensor signal lines b1, b2, b3, and b4 may be connected to each other.

In the sensor pattern subgroup illustrated in FIG. 3, the sensor pads included in the first sensor pattern subgroup 110 and the third sensor pattern subgroup 130 are connected, and additionally, the fifth sensor pattern subgroup. Sensor pads positioned at 150 are connected to each other. In addition, the sensor pads included in the second sensor pattern subgroup 120 and the fourth sensor pattern subgroup 140 are connected, and additionally, the sensor pads located in the sixth sensor pattern subgroup 160 are connected to each other. Form.

For example, the sensor pads positioned in the first column of the first sensor pattern subgroup 110 may include the sensor pads located in the first column of the third sensor pattern subgroup 130 and the fifth sensor pattern subgroup 150. The sensor pads positioned in the first column may be connected to each other by the first sensor signal line a1, and the sensor pads positioned in the second column of the first sensor pattern subgroup 110 may include the third sensor pattern subgroup 130 and the third sensor pattern subgroup 130. The sensor pads positioned in the first column of the five sensor pattern subgroup 150 and the first sensor signal line a2 may be connected to each other.

Also, a sensor pad positioned in a first column of the second sensor pattern subgroup 120, a sensor pad positioned in a fourth column of the fourth sensor pattern subgroup 140, and a third of the sixth sensor pattern subgroup 160. The sensor pads positioned in the column may be connected by the second sensor signal line b1, and the sensor pads positioned in the second column of the second sensor pattern subgroup 120 and the first column of the fourth sensor pattern subgroup 140. The sensor pad positioned in the sensor pad and the sensor pad positioned in the fourth column of the sixth sensor pattern subgroup 160 may be connected by the second sensor signal line b2.

Similarly, the sensor pads are positioned in the third column of the second sensor pattern subgroup 120, the sensor pads are positioned in the second column of the fourth sensor pattern subgroup 140, and the first row of the sixth sensor pattern subgroup 160. The sensor pad may be connected by the second sensor signal line b3, and the sensor pad may be positioned in the fourth column of the second sensor pattern subgroup 120, and may be positioned in the third column of the fourth sensor pattern subgroup 140. The sensor pad and the sensor pad positioned in the second column of the sixth sensor pattern subgroup 160 may be connected by the second sensor signal line b4.

As described above, since the sensor pattern subgroup illustrated in FIG. 4 includes a configuration similar to that of the sensor pattern subgroup illustrated in FIG. 3, the description of the sensor pattern subgroup illustrated in FIG. It may be applied to the sensor pattern subgroup shown in FIG.

The sensor pattern group of the capacitive touch sensing device may include a sensor pad 200 disposed on the same surface as shown in FIG. 3.

The sensor pattern group of the capacitive touch sensing device includes a first sensor pattern subgroup 110, a second sensor pattern subgroup 120, a third sensor pattern subgroup 130, a fourth sensor pattern subgroup 140, The fifth sensor pattern subgroup 150, the sixth sensor pattern subgroup 160, the seventh sensor pattern subgroup 170, and the eighth sensor pattern subgroup 180 may be included. That is, in the sensor pattern group 100, as illustrated in FIG. 5, eight

sensor pattern subgroups

110, 120, 130, 140, 150, 160, 170, and 180 respectively represent four sensor pads 200. It may include.

As shown in FIG. 5, the sensor pattern group 100 of the capacitive touch sensing apparatus may be connected to each other by the sensor pads included in the sensor pattern subgroup in a similar manner to the sensor pattern subgroups illustrated in FIGS. 3 to 4. have.

The sensor pads 200 electrically connected to the first sensor pattern subgroup 110, the third sensor pattern subgroup 130, the fifth sensor pattern subgroup 150, and the seventh sensor pattern subgroup 170 are included. The first sensor signal lines a1, a2, a3, and a4 may be connected to each other.

For example, a sensor pad positioned in a first column of the first sensor pattern subgroup 110, a sensor pad positioned in a first column of the third sensor pattern subgroup 130, and a fifth sensor pattern subgroup 150 The sensor pads positioned in the first column and the sensor pads positioned in the first column of the seventh sensor pattern subgroup 170 may be connected by the first sensor signal line a1.

On the other hand, a sensor pad electrically connected to the second sensor pattern subgroup 120, the fourth sensor pattern subgroup 140, the sixth sensor pattern subgroup 160, and the eighth sensor pattern subgroup 180 ( 200 may be connected to each other by the second sensor signal lines b1, b2, b3, and b4.

For example, a sensor pad positioned in a first column of the second sensor pattern subgroup 120, a sensor pad positioned in a fourth column of the fourth sensor pattern subgroup 140, and a sixth sensor pattern subgroup 160 The sensor pads positioned in the third column and the sensor pads positioned in the second column of the eighth sensor pattern subgroup 180 may be connected by the second sensor signal line b1. In addition, a sensor pad positioned in the second column of the second sensor pattern subgroup 120, a sensor pad positioned in the first column of the fourth sensor pattern subgroup 140, and a fourth of the sixth sensor pattern subgroup 160. The sensor pads positioned in the column and the sensor pads positioned in the third column of the eighth sensor pattern subgroup 180 may be connected by the second sensor signal line b2.

That is, the sensor pads belonging to the first sensor pattern subgroup 110, the third sensor pattern subgroup 130, the fifth sensor pattern subgroup 150, and the seventh sensor pattern subgroup 170 may be electrically connected to each other. The sensor pads belonging to the second sensor pattern subgroup 120, the fourth sensor pattern subgroup 140, the sixth sensor pattern subgroup 160, and the eighth sensor pattern subgroup 180 may be electrically connected. Can be connected.

In addition, the order in which the sensor pads belonging to the first sensor pattern subgroup 110, the third sensor pattern subgroup 130, the fifth sensor pattern subgroup 150, and the seventh sensor pattern subgroup 170 are connected, The order in which the sensor pads belonging to the second sensor pattern subgroup 120, the fourth sensor pattern subgroup 140, the sixth sensor pattern subgroup 160, and the eighth sensor pattern subgroup 180 may be different from each other. have.

As described above, since the sensor pattern subgroup illustrated in FIG. 5 includes a configuration similar to the sensor pattern subgroup illustrated in FIGS. 3 to 4, the sensor pattern subgroup illustrated in FIGS. The information about may also be applied to the sensor pattern subgroup shown in FIG. 5.

In the sensor pattern subgroups illustrated in FIGS. 3 to 5, the first sensor pattern subgroup 110, the second sensor pattern subgroup 120, the third sensor pattern subgroup 130, and the fourth sensor pattern subgroup The sensor pads of 140 may be electrically connected to sensor pads located in the same row, but the present invention is not limited thereto, and sensor pads located in the same row may be electrically connected to each other.

Meanwhile, the sensor pattern subgroup of the capacitive touch sensing device may be modified to have a configuration similar to that of rotating the sensor pattern subgroup of the capacitive touch sensing device shown in FIGS. 3 to 5 by 90 degrees. In this case, the at least one sensor pattern subgroup may be disposed.

That is, the sensor pattern subgroups of the capacitive touch sensing apparatuses illustrated in FIGS. 3 to 5 may be implemented in a form in which rows and columns are interchanged.

As shown in FIG. 6, the sensor pattern group 100 includes a first sensor pattern subgroup 110 in which a plurality of sensor pads are arranged on the same axis, and a plurality of sensor pads are the same as the first sensor pattern subgroup 110. Identify the positions of the second sensor pattern subgroup 120, the first identification pad 210 and the second sensor pattern subgroup 120, which are arranged on the axis, to identify the position of the first sensor pattern subgroup 110. It may include a second identification pad 220 to.

Here, the first sensor pattern subgroup 110 may correspond to the first identification pad 210, and the second sensor pattern subgroup 120 may correspond to the second identification pad 220. In this case, the first sensor pattern subgroup 110 may be disposed above or below the first identification pad 210, and the second sensor pattern subgroup 120 may be disposed above or above the second identification pad 220. It may be disposed at the bottom. In addition, the sensor pads belonging to the first sensor pattern subgroup 110 and the second sensor pattern subgroup 120 may be connected to sensor pads of other subgroups corresponding to each other. This will be described later with reference to FIG. 7.

The sensor pads connected to each other in the first sensor pattern subgroup 110 and the second sensor pattern subgroup 120 may be connected to each other by a sensor signal line (not shown). At this time, the sensor signal lines are disposed on the same surface and do not cross each other.

In addition, the sensor pad 200 may be connected by a touch sensing unit (not shown) to be described later and a sensor signal line.

Here, the sensor signal line may be made of the same material as the sensor pad 200. For example, when the sensor pad 200 is a transparent conductive material such as ITO, the sensor signal line may also be the same material.

In addition, the sensor pattern group 100 identifies the positions of the third sensor pattern subgroup 130 and the third sensor pattern subgroup 130 arranged on the same axis as the first sensor pattern subgroup 110. It may further include a third identification pad 230. In this case, the third sensor pattern subgroup 130 corresponds to the third identification pad 230, and the third sensor pattern subgroup 130, the first sensor pattern subgroup 110, and the second sensor pattern subgroup It may be connected to the sensor pads belonging to (120). This will be described later with reference to FIG. 8.

In addition, the sensor pattern group 100 may include a third sensor pattern subgroup 130 and a second sensor pattern subgroup including a plurality of sensor pads disposed on the same axis under the first sensor pattern subgroup 110. A fourth sensor pattern subgroup 140 including a plurality of sensor pads disposed on the same axis may be further included below the 120. In this case, the sensor pads belonging to the third sensor pattern subgroup 130 and the fourth sensor pattern subgroup 140 may be connected to sensor pads of other subgroups corresponding to each other. This will be described later with reference to FIG. 9.

The touch detector may detect a touch based on a difference between voltage variations in the sensor pad 200 and the

identification pads

210 and 220 when there is a contact. In this case, the touch sensing unit may be connected to each sensor pad and the identification pad by a sensor signal line.

In addition, the touch sensing unit may calculate a touch area of each sensor pad and the identification pad and calculate touch coordinates on the touch screen through a difference between voltage variations in each sensor pad and the identification pad.

Meanwhile, since the sensor pads of the first sensor pattern subgroup 110 and the sensor pads belonging to the second sensor pattern subgroup 120 are connected to each other, the touch coordinates are calculated only by the difference of the voltage variation in each sensor pad. Is not easy. Therefore, the touch sensing unit detects all touches on each sensor pad and the identification pad to calculate touch coordinates more accurately.

That is, the touch area is sensed by the difference of the voltage variation when there is a contact. However, it can be known from the difference of the voltage variation of the identification pad whether there is a contact in the sensor pad belonging to which sensor pattern subgroup.

The sensor pads belonging to the first sensor pattern subgroup 110 may be electrically connected to the sensor pads belonging to the second sensor pattern subgroup 120 corresponding to each other as follows. First, when there is a contact in the sensor pad of the first sensor pattern subgroup 110, the touch sensing unit senses a touch area by using a difference of the voltage variation in the sensor pad of the first sensor pattern subgroup 110. However, since any one of the sensor pad of the first sensor pattern subgroup 110 and the sensor pad of the second sensor pattern subgroup 120 is electrically connected, the sensor pad of the first sensor pattern subgroup 110 is electrically connected. It is not easy to discern which sensor pad has been touched by using the difference of the voltage variation in.

Therefore, after the touch sensing unit obtains the difference of the voltage variation in the sensor pad, the touch sensing unit of the first identification pad 210 and the second sensor pattern subgroup 120 that identify the position of the first sensor pattern subgroup 110 may be used. The identification pad is classified using the difference of the voltage variation in the second identification pad 220 for identifying the position, and the sensor pad belonging to the first sensor pattern subgroup 110 is connected to the second sensor pattern subgroup 120. You can recognize whether it belongs to a sensor pad.

For example, the sensor pads belonging to the first sensor pattern subgroup 110 and the second sensor pattern subgroup 120 may be disposed on the x-axis, and the first identification pad 210 and the second identification pad 220 may be formed on the x-axis. When disposed under the subgroup, the touch detector may calculate the touched x-axis coordinates by using the difference of the voltage variation in each sensor pad. At this time, since the sensor pads belonging to the first sensor pattern subgroup 110 are connected to the sensor pads belonging to the second sensor pattern subgroup 120 corresponding to each other, the x-axis coordinates corresponding to the two sensor pads are Can be calculated.

Thereafter, the touch sensing unit may calculate the touched y-axis coordinates by using the difference of the voltage variation in each identification pad, and may recognize which sensor pad subgroup is the identification pad for identifying the position of the sensor pattern subgroup. The actual x-axis coordinates touched among the two x-axis coordinates can be calculated.

Since the capacitive touch panel is formed in a single layer, the cost required to form an expensive ITO layer is reduced, and the manufacturing process is simplified because the sensor pad and the sensor signal line are formed on the same surface.

In addition, since the plurality of sensor pads included in the sensor pattern group 100 are connected to each other, the capacitive touch sensing device requires fewer wires than the prior art of forming wires on the respective sensor pads. Therefore, the space for wiring can be reduced.

7 is a diagram illustrating a sensor pattern group of the capacitive touch sensing device.

The sensor pattern group 100 included in the capacitive touch sensing device may include a plurality of sensor pads 200 and a plurality of identification pads 270. For example, the sensor pattern group 100 may include a sensor pad 200 and an identification pad 270 disposed on the same surface as shown in FIG. 7.

The sensor pad 200 outputs a signal according to a contact in response to an alternating voltage in a floating state after charge is charged. For example, the sensor pad 200 may output a charge amount change depending on whether or not the touch input tool is touched in response to an alternating voltage alternated at a predetermined frequency, and the touch sensing unit (not shown) may be used in the sensor pad 200. The change in voltage may be measured using the change in charge amount of, and the touch may be detected based on the change in charge.

Therefore, the capacitive touch sensing apparatus can measure the touch area on the sensor pad based on the difference of the voltage variation. Here, a plurality of sensor pads 200 may be arranged in a polygon of an independent state over the entire touch screen. Therefore, when the touch area of each sensor pad is calculated, the touch coordinates may be calculated on the touch screen.

The identification pad 270, together with the sensor pad 200, outputs a signal according to a touch state in response to an alternating voltage in a floating state after charge is charged, and like a sensor pad, a touch sensing unit may sense a touch. have.

The sensor pad 200 and the identification pad 270 may be formed of a transparent conductive material. For example, the sensor pad 200 and the identification pad 270 are formed of a transparent conductive material such as indium tin oxide (ITO), antimony tin oxide (ATO), carbon nano tube (CNT), and indium zinc oxide (IZO). Can be. In addition, the sensor pad 200 and the identification pad 270 may be formed of metal.

The sensor pattern group 100 may include a first sensor pattern subgroup 110, a second sensor pattern subgroup 120, a first identification pad 210, and a second identification pad 220. In detail, the sensor pattern group 100 includes a first sensor pattern subgroup 110 including a plurality of sensor pads, a first sensor pattern subgroup 110, and a plurality of sensor pads disposed on a first axis. A second identification pad 210 for identifying the position of the second sensor pattern subgroup 120, the first sensor pattern subgroup 110, and a second identification pad for identifying the position of the second sensor pattern subgroup 120. 220 may be included. That is, in the sensor pattern group 100, as shown in FIG. 5, two

sensor pattern subgroups

110 and 120 each include four sensor pads 200 and two

identification pads

210 and 220. can do.

Here, the first sensor pattern subgroup 110 corresponds to the first identification pad 210, and the second sensor pattern subgroup 120 corresponds to the second identification pad 220. In addition, the sensor pads belonging to the first sensor pattern subgroup 110 and the second sensor pattern subgroup 120 may be connected to sensor pads of other subgroups corresponding to each other. That is, the sensor pads of the first sensor pattern subgroup 110 and the second sensor pattern subgroup 120 may be connected to each other by the sensor signal lines c1, c2, c3, and c4.

For example, as illustrated in FIG. 7, the sensor pads positioned in the first column of the first sensor pattern subgroup 110 and the sensor pads positioned in the first column of the second sensor pattern subgroup 120 may include a sensor signal line ( c1), and similarly, the sensor pads positioned in the second column of the first sensor pattern subgroup 110 and the sensor pads positioned in the second column of the second sensor pattern subgroup 120 may include the sensor signal lines c2. Can be connected by.

However, the sensor pads positioned in the first column of the first sensor pattern subgroup 110 may be connected to the sensor pads positioned in another column in addition to the sensor pads positioned in the first column of the second sensor pattern subgroup 120. That is, the sensor pads belonging to each subgroup may be connected to one sensor pad belonging to another subgroup in various embodiments.

On the other hand, the first identification pad 210 may be connected to the touch sensing unit (not shown) by the sensor signal line d1, and the second identification pad 220 may be touch sensing unit (not shown) by the sensor signal line d2. ) Can be connected.

In addition, the sensor signal lines c1, c2, c3, c4, d1, and d2 may be configured not to intersect or overlap each other.

Connection of the sensor pads and the identification pads included in the sensor pattern group by the sensor signal lines may be implemented in various forms.

In addition, the sensor signal lines c1, c2, c3, c4, d1, and d2 may be made of the same material as the sensor pad 200. For example, when the sensor pad 200 is a transparent conductive material such as ITO, the sensor signal lines c1, c2, c3, c4, d1, and d2 may also be the same material.

The sensor pads 200 may be connected to the touch sensing unit by sensor signal lines c1, c2, c3, and c4, and may include identification pads positioned on the first identification pad 210 and the second identification pad 220. 270 may be connected to the touch sensing unit by the sensor signal lines d1 and d2 to sense a contact.

8 and 9 are diagrams illustrating a sensor pattern group of the capacitive touch sensing apparatus according to another aspect.

The sensor pattern group 100 of the capacitive touch sensing apparatus illustrated in FIGS. 8 and 9 is extended from the sensor pattern group illustrated in FIG. 7, and the connection method is similar to the sensor pattern group illustrated in FIG. 7.

In one example, the sensor pattern group 100 of the capacitive touch sensing apparatus may include a first sensor pattern subgroup 110, a second sensor pattern subgroup 120, and a third sensor pattern, as illustrated in FIG. 8. The sub group 130, the first identification pad 210, the second identification pad 220, and the third identification pad 230 may be included. That is, in the sensor pattern group 100, three

sensor pattern subgroups

110, 120, and 130 may include four sensor pads 200 and three

identification pads

210, 220, and 230, respectively. have.

Here, the first sensor pattern subgroup 110 corresponds to the first identification pad 210, the second sensor pattern subgroup 120 corresponds to the second identification pad 220, and the third sensor pattern subgroup 130 corresponds to the third identification pad 230.

In addition, the sensor pads 200 belonging to the first sensor pattern subgroup 110, the second sensor pattern subgroup 120, and the third sensor pattern subgroup 130 may correspond to sensor pads of other subgroups corresponding to each other. Can be connected. In other words, the sensor pads 200 corresponding to each other in the first sensor pattern subgroup 110, the second sensor pattern subgroup 120, and the third sensor pattern subgroup 130 may include sensor signal lines c1, c2, c3, and the like. c4) may be connected to each other.

In the sensor pattern group illustrated in FIG. 7, the sensor pads included in the first sensor pattern subgroup 110 and the second sensor pattern subgroup 120 are connected, and additionally, the third sensor pattern subgroup ( The sensor pads located at 130 are connected to each other.

For example, as illustrated in FIG. 8, a sensor pad positioned in a first column of the first sensor pattern subgroup 110, a sensor pad positioned in a first column of the second sensor pattern subgroup 120, and a third sensor The sensor pads positioned in the first column of the pattern subgroup 130 may be connected by the sensor signal line c1. However, the sensor pads positioned in the first column of the first sensor pattern subgroup 110 may be connected to the sensor pads positioned in the other column of the second sensor pattern subgroup 120 and the third sensor pattern subgroup 130. . That is, the connection with the sensor pads of other subgroups of the sensor pads belonging to each subgroup may be implemented in various forms.

Meanwhile, the first identification pad 210 may be connected to the touch sensing unit (not shown) by the sensor signal line d1, and the second identification pad 220 may be touch sensing unit (not shown) by the sensor signal line d2. ), And the third identification pad 230 may be connected to the touch sensing unit (not shown) by the sensor signal line d3.

9 is a diagram illustrating a sensor pattern group of a capacitive touch sensing apparatus according to another example.

As illustrated in FIG. 8, the sensor pattern group 100 of the capacitive touch sensing device may include a sensor pad 200 and an identification pad 270 disposed on the same surface.

The sensor pattern group of the capacitive touch sensing device includes a first sensor pattern subgroup 110, a second sensor pattern subgroup 120, a third sensor pattern subgroup 130, and a fourth sensor pattern subgroup 140. It may include a first identification pad 210, and a second identification pad 220. That is, in the sensor pattern group 100, as shown in FIG. 6B, four

sensor pattern subgroups

110, 120, 130, and 140 each include four sensor pads, and two identification pads 210 and 220. ) May be included.

Here, the first sensor pattern subgroup 110 and the third sensor pattern subgroup 130 correspond to the first identification pad 210 and the second sensor pattern subgroup 120 and the fourth sensor pattern subgroup ( 140 corresponds to the second identification pad 220. In addition, the sensor pads belonging to the first sensor pattern subgroup 110 and the second sensor pattern subgroup 120 may be connected to sensor pads of other subgroups corresponding to each other, and the third sensor pattern subgroup 130 may be connected. And sensor pads belonging to the fourth sensor pattern subgroup 140 may be connected to sensor pads of other subgroups corresponding to each other.

That is, the sensor pads 200 corresponding to each other in the first sensor pattern subgroup 110 and the second sensor pattern subgroup 120 may be connected by sensor signal lines c1, c2, c3, and c4. The sensor pads 200 corresponding to each other in the sensor pattern subgroup 130 and the fourth sensor pattern subgroup 140 may be connected by sensor signal lines e1, e2, e3, and e4.

Sensor pads included in the first sensor pattern subgroup 110 and the second sensor pattern subgroup 120 shown in FIG. 9 may be connected to sensor pads corresponding to each other as shown in FIG. The sensor pads included in the group 130 and the fourth sensor pattern subgroup 140 may also be connected to sensor pads corresponding to each other.

That is, the sensor pads belonging to the first sensor pattern subgroup 110 and the second sensor pattern subgroup 120 are connected to each other by the sensor signal lines c1, c2, c3, and c4, and the third sensor pattern subgroup ( 130 and the sensor pads belonging to the fourth sensor pattern subgroup 140 may be connected to each other by the sensor signal lines e1, e2, e3, and e4.

On the other hand, the first identification pad 210 may be connected to the touch sensing unit (not shown) by the sensor signal line d1, and the second identification pad 220 may be connected to the touch sensing unit (drawing by the sensor signal line d2). Not displayed).

However, the sensor signal line connects the respective sensor pads as shown in FIG. 7, but the connection method may be implemented in various forms.

At this time, the sensor signal lines c1, c2, c3, c4, d1, d2, e1, e2, e3, e4 are configured not to intersect or overlap each other. In addition, the sensor signal lines c1, c2, c3, c4, d1, d2, e1, e2, e3, and e4 may be made of the same material as the sensor pad 200. For example, when the sensor pad 200 is a transparent conductive material such as ITO, the sensor signal lines c1, c2, c3, c4, d1, and d2 may also be the same material.

8 and 9 illustrate modifications based on the embodiment shown in FIG. 7, and may be applied to various embodiments in addition to the embodiments shown in FIGS. 8 and 9.

10 and 11 are diagrams illustrating a sensor pattern group of the capacitive touch sensing apparatus according to another example.

First, referring to FIG. 10, each of the

sensor pattern subgroups

110, 120, and 130 may correspond to the plurality of

identification pads

210, 220, 230, 240, 250, and 260. In detail, the first sensor pattern subgroup 110 corresponds to the first and

second identification pads

210 and 220, and the second sensor pattern subgroup 120 corresponds to the third and fourth identification pads 230 and 240. ) And the third sensor pattern subgroup 130 may correspond to the fifth and

sixth identification pads

250 and 260.

Sensor pads 200 belonging to each of the

sensor pattern subgroups

110, 120, and 130 may be connected to sensor pads of other subgroups, and the connection method thereof is the same as described with reference to FIGS. 8 and 9.

In the form shown in FIG. 10, since a plurality of identification pads correspond to one sensor pattern subgroup, it is possible to more accurately know which position the sensor pad corresponds to.

For example, an actual touch occurs near the middle of the first identification pad 210 and the second identification pad 220 in the left region of the sensor pad 200 positioned in the first column of the second sensor pattern subgroup 110. The case will be explained on the assumption. According to the embodiment shown in FIG. 7, it will be determined that a touch has occurred on any one of the sensor pads connected to the first sensor signal line c1, and then the first identification pad 210 and the second identification pad. Since it is determined that touch has occurred in all of the 220, the touch pad may not be accurately determined to which sensor group belongs to which of the first sensor pattern subgroup 110 and the second sensor pattern subgroup 120. have. However, in the same case, according to the embodiment shown in FIG. 10, it will be determined that a touch has occurred in the second identification pad 220 and the third identification pad 230. In this case, since the second identification pad 220 does not correspond to the sensor pad connected to the first sensor signal line c1, the touch detection of the second identification pad 220 is processed as a noise so that the third identification pad ( It may be accurately recognized that a touch has occurred on a sensor pad belonging to the second sensor pattern subgroup 120 corresponding to 230.

In FIG. 10, two identification pads correspond to one sensor pattern subgroup, but three or more identification pads may correspond to each other.

Next, referring to FIG. 11, each of the

identification pads

210, 220, 230 may not correspond to one

sensor pattern subgroup

110, 120. Specifically, taking the second identification pad 220 as an example, the sensor pads 200 belonging to different

sensor pattern subgroups

110 and 120 may correspond to one identification pad, that is, the second identification pad 220. It may be. In FIG. 11, two

sensor pattern subgroups

110 and 120 share one identification pad 220, but three or more sensor pattern subgroups may share one identification pad.

Since the connection between each sensor pad, the connection between each sensor pad and the sensor signal line, and the connection between each identification pad and the sensor signal line shown in FIG. 11 have been described above, the description thereof will be omitted herein.

In addition, the sensor pattern group of the capacitive touch sensing apparatus according to the present invention may be configured to rotate the sensor pattern group of the capacitive touch sensing apparatus illustrated in FIGS. 7 to 11 by 90 degrees, One or more sensor pattern groups may be arranged in a column direction, and various modifications are possible.

That is, the sensor pattern group of the capacitive touch sensing apparatus illustrated in FIGS. 7 to 11 may have a form in which rows and columns are interchanged.

Referring to FIG. 12, the capacitive touch sensing apparatus according to another aspect includes a sensor pad 200, a touch capacitance Ct, a parasitic capacitance Cp, a driving capacitance Cdrv, a charging means SW, and a level. It may include a shift detector 300.

First, a touch sensing operation of the touch sensing device will be described.

The sensor pad 200 is an electrode patterned on a substrate to detect a touch input, and forms a touch capacitance Ct between a touch tool such as a finger or a conductor. The sensor pad 200 may be formed of a transparent conductor. For example, the sensor pad 200 may be formed of a transparent material such as indium tin oxide (ITO), antimony tin oxide (ATO), carbon nano tube (CNT), and indium zinc oxide (IZO). In addition, the sensor pad 200 may be formed of metal.

The sensor pad 200 outputs a signal corresponding to a touch state of the touch input tool in response to an alternating voltage Vdrv alternated at a predetermined frequency. For example, the sensor pad 200 outputs a different level shift value depending on whether a contact occurs in response to the alternating voltage Vdrv.

The charging means SW is connected to the output terminal of the sensor pad 200 and supplies a charging signal Vb. The charging means SW may be a three-terminal switching element that performs a switching operation according to a control signal supplied to the on / off control terminal, or may be a linear element such as an OP-AMP that supplies a signal according to the control signal. A touch capacitance Ct, a parasitic capacitance Cp, and a driving capacitance Cdrv are connected to the output terminal of the charging means SW, and the charging means SW is turned on. The charging signal Vb is applied to the input terminal to charge Ct, Cdrv, Cp, and the like. After that, when the charging means SW is turned off, the signals charged in Ct, Cdrv, etc. are isolated in the charged state unless they are discharged separately. In this case, in order to stably isolate the charged signal, the input terminal of the level shift detector 300 to be described later may have a high impedance.

The above-mentioned charging means SW is turned on and the charges charged in the sensor pad are turned off and isolated. This isolated state is called a floating state. The charge of the charging signal isolated between the charging means SW and the level shift detector 300 is changed by the alternating signal applied to the outside. The voltage level is different depending on the contact. This level difference before and after the touch is called level shift.

The touch sensing device may further include alternating voltage generating means (not shown).

The alternating voltage generating means (not shown) applies an alternating voltage Vdrv alternately at a predetermined frequency to the output terminal of the sensor pad 200 via the driving capacitance Cdrv to vary the potential at the sensor pad 200. The alternate voltage generating means may generate a clock signal having the same duty ratio, but may generate an alternate voltage having a different duty ratio.

The common electrode (not shown) commonly plays a role in an electrode or a display device to which a common voltage is applied in the display device. For example, one of the display devices, the LCD, requires a common voltage for driving the liquid crystal. In small and medium-sized LCDs, alternating voltages alternated with a predetermined frequency are used as common voltages to reduce current consumption, and large LCDs use DC voltages as common voltages.

If the common electrode voltage Vcom generated in the display device is used as an alternating voltage, the common electrode capacitance Cvcom serves as the driving capacitance Cdrv. In this case, the driving capacitance Cdrv can be temporarily removed.

In the present specification, a case in which the common electrode voltage is used as an alternating voltage is not described separately, but in this case, the same principle also applies and is included in the scope of the present invention.

The level shift detector 300 detects a level shift generated by the alternating voltage Vdrv in the floating state. That is, the potential of the sensor pad is raised or lowered by the applied alternating voltage Vdrv. The voltage level variation due to the contact has a smaller value than the voltage level variation when there is no contact.

Therefore, the level shift detection unit 300 detects the level shift by comparing the voltage levels before and after the contact. The level shift detector 300 may be formed of a combination of various devices or circuits.

For example, the level shift detection unit 300 may include an amplifying device for amplifying a signal at the output terminal of the sensor pad 200, an analog to digital converter (ADC), a voltage to frequency converter (VFC), a flip-flop, It may be configured by combining at least one of a latch, a buffer, a transistor, a thin film transistor, and a comparator.

The touch detector (not shown) may detect the touch area by using the level shift detected by the level shift detector 300. In this case, the level shift detection unit 300 may be included in the touch sensing unit or may be separately configured.

13 is a flowchart illustrating a touch sensing method according to an aspect.

Referring to FIG. 13, in step S110, the touch sensing device drives the sensor pad 200. Specifically, by applying a charging signal (Vb) to the output terminal of the sensor pad 200 to charge the capacitance connected to the sensor pad 200, such as Cdrv, float, and then alternating voltage (Vdrv) to the output terminal of the sensor pad 200 ) Is applied.

In operation S120, the touch sensing apparatus measures the voltage variation. The touch sensing apparatus may measure a voltage change in the sensor pad 200 when no touch occurs, and measure a voltage change in the sensor pad 200 when a touch occurs.

In operation S130, the touch sensing apparatus detects a level shift using the measured voltage variation. In this case, the touch sensing apparatus may be formed of a combination of various elements or circuits to detect the level shift.

In operation S140, the touch sensing apparatus determines a sensor pattern subgroup. That is, the touch sensing apparatus determines a sensor pattern subgroup in which a touch is detected among the sensor pattern subgroups. In this case, the touch sensing apparatus may determine which sensor pattern subgroup using the detected level shifts.

As described above, since the sensor pads of the sensor pattern subgroups located in the same row are electrically connected to each other, when a level shift value occurs in a specific sensor pad, the touch pad may be detected. It is unknown whether they belong to the group. However, the sensor pads in the subgroup of the sensor pattern located in the adjacent row are electrically connected to the sensor pads in the subgroup in a different order from the corresponding row. Accordingly, the touch when the sensor pads located in two or more rows are touched is recognized as the actual touch only in a predetermined pattern (that is, a pattern in which the sensor pads connected in different order are touched simultaneously over a plurality of rows). It is possible to determine the subgroup to which the sensor pad has been made.

When the subgroup to which the sensor pad belongs is determined, the position of the sensor pad where the actual touch is made is determined.

In operation S150, the touch sensing apparatus calculates touch coordinates. The touch sensing apparatus may calculate touch coordinates using the touch area calculated by the sensor pad belonging to the determined sensor pattern subgroup.

Meanwhile, the level shift detector 300 may detect the level shift with respect to the identification pad (not shown).

Referring to FIG. 14, in step S210A, the touch sensing device drives the sensor pad 200. Specifically, by applying a charging signal (Vb) to the output terminal of the sensor pad 200 to charge the capacitance connected to the sensor pad 200, such as Cdrv, float, and then alternating voltage (Vdrv) to the output terminal of the sensor pad 200 ) Is applied.

In operation S220A, the touch sensing apparatus may measure a voltage variation. That is, the touch sensing device may measure the voltage variation in the sensor pad 200 according to whether the touch pad 200 is in contact with the sensor pad 200.

In step S230A, the touch sensing device detects a level shift using the measured voltage variation. In this case, the touch sensing apparatus may be configured by a combination of various elements or circuits to detect the level shift.

On the other hand, in step S210B, the touch sensing device drives the identification pad. In detail, the charging signal Vb is applied to the output terminal of the identification pad to charge the capacitance connected to the identification pad such as Cdrv, float, and apply an alternating voltage Vdrv to the output terminal of the identification pad.

In step S220B, the touch sensing device measures the voltage variation. The touch sensing apparatus may measure the voltage variation in the identification pad according to whether or not the touch is made.

In step S230B, the touch sensing device detects a level shift using the measured voltage variation. In this case, the touch sensing apparatus may be configured by a combination of various elements or circuits to detect the level shift.

Here, when steps S210A to S230A are performed, steps S210B to S230B may be performed together.

In operation S240, the touch sensing apparatus determines a sensor pattern subgroup in which there is a contact. That is, the touch sensing apparatus determines a sensor pattern subgroup in which a touch is detected from one or more sensor pattern subgroups. In this case, the touch sensing apparatus may determine which sensor pattern subgroup using the level shifts detected in steps S210A to S230A and S210B to S230B.

For example, by detecting the level shift of the identification pad, it is possible to determine which sensor pattern subgroup, and by detecting the level shift of the sensor pad to know which sensor pad is in contact among the sensor pads belonging to the determined sensor pattern subgroup. . That is, the touch sensing device may discriminate the sensor pad that is in contact based on the detected level shifts.

In operation S250, the touch sensing apparatus may calculate touch coordinates. The touch sensing apparatus may calculate touch coordinates using the touch area calculated by the sensor pad belonging to the determined sensor pattern subgroup.

The foregoing description of the present invention is intended for illustration, and it will be understood by those skilled in the art that the present invention may be easily modified in other specific forms without changing the technical spirit or essential features of the present invention. will be. Therefore, the embodiments described above are only illustrative of some aspects of the invention, it should not be understood to limit the scope of the invention. For example, each component described as a single type may be implemented in a distributed manner, and similarly, components described as distributed may be implemented in a combined form.

Claims

A first sensor pattern subgroup including a plurality of sensor pads;

A second sensor pattern subgroup adjacent to the first sensor pattern subgroup in a second axis direction;

A third sensor pattern subgroup adjacent to the first sensor pattern subgroup in a first axis direction; And

A fourth sensor pattern subgroup adjacent to the second sensor pattern subgroup in a second axis direction;

The sensor pads belonging to the first sensor pattern subgroup and the third sensor pattern subgroup are electrically connected to each other.

The sensor pads belonging to the second sensor pattern subgroup and the fourth sensor pattern subgroup are electrically connected to each other.

The order in which the sensor pads belonging to the first sensor pattern subgroup and the third sensor pattern subgroup are connected to each other and the order in which the sensor pads belonging to the second sensor pattern subgroup and the fourth sensor pattern subgroup are connected to each other are different from each other.

Capacitive touch sensing device comprising a sensor pattern sub-group in which a plurality of sensor pads are disposed.
The method of claim 1,

The electrically connected sensor pads are connected by a sensor signal line formed of the same material as the sensor pads.
The method of claim 2,

And the sensor signal line connects the sensor pads to each other in the display area of the touch panel.
The method of claim 2,

The sensor pad is formed of a transparent conductive material.
The method of claim 1,

Capacitive touch sensing device further comprises a touch sensing unit for sensing a touch based on the difference of the voltage change in the sensor pad.
The method of claim 5,

The capacitive type of the plurality of sensor pads determines which subgroup of the first to fourth sensor pattern subgroups is touched by comparing a pattern in which the difference in voltage variation occurs when the touch occurs with a predetermined pattern. Touch sensing device.
A first sensor pattern subgroup including a plurality of sensor pads disposed on the same axis;

A second sensor pattern subgroup including a plurality of sensor pads disposed on the same axis as the first sensor pattern subgroup; And

And a first identification pad identifying a position of the first sensor pattern subgroup and a second identification pad identifying a position of the second sensor pattern subgroup.

Sensor pads included in the first sensor pattern subgroup are electrically connected to sensor pads included in the second sensor pattern subgroup, respectively.

Capacitive touch sensing device comprising a sensor pattern sub-group in which a plurality of sensor pads are disposed.
The method of claim 7, wherein

And a third identification pad identifying a position of the third sensor pattern subgroup and the third sensor pattern subgroup disposed on the same axis as the first sensor pattern subgroup.

The sensor pads included in the third sensor pattern subgroup are electrically connected to the sensor pads included in the first sensor pattern subgroup, respectively.
The method according to claim 7 or 8,

And the first identification pad, the second identification pad, and the third identification pad each include a plurality of pads.
The method of claim 7, wherein

Sensor pads connected to each other in the first sensor pattern subgroup and the second sensor pattern subgroup are connected to each other by a sensor signal line.

And the sensor signal lines are disposed on the same surface and do not cross each other.
The method of claim 10,

The sensor signal line is made of the same material as the sensor pad capacitive touch sensing device.
The method of claim 7, wherein

The sensor pad, the first identification pad, and the second identification pad are transparent conductive materials.
The method of claim 7, wherein

And the sensor pad, the first identification pad, and the second identification pad output a signal according to the touch state of the touch input tool in response to an alternating voltage alternated with a predetermined frequency in a floating state.
The method of claim 7, wherein

And a touch sensing unit configured to sense a touch based on a difference between voltage variations in the sensor pad, the first identification pad, and the second identification pad.
The method of claim 14,

And the first identification pad and the second identification pad are connected to the touch sensing unit by a sensor signal line.
A first sensor pattern subgroup including a plurality of sensor pads arranged in a first axis direction;

A second sensor pattern subgroup including a sensor pad electrically connected to a plurality of sensor pads included in the first sensor pattern subgroup; And

And a plurality of identification pads identifying which one of the sensor pads included in the first sensor pattern subgroup and a sensor pad included in the second sensor pattern subgroup is generated.