WO2013175942A1 - Composite module - Google Patents

Composite module Download PDF

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Publication number
WO2013175942A1
WO2013175942A1 PCT/JP2013/062521 JP2013062521W WO2013175942A1 WO 2013175942 A1 WO2013175942 A1 WO 2013175942A1 JP 2013062521 W JP2013062521 W JP 2013062521W WO 2013175942 A1 WO2013175942 A1 WO 2013175942A1
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WO
WIPO (PCT)
Prior art keywords
substrate
electronic component
functional block
case
main surface
Prior art date
Application number
PCT/JP2013/062521
Other languages
French (fr)
Japanese (ja)
Inventor
川野　浩嗣
尚史 円居
宏毅 加藤
Original Assignee
株式会社村田製作所
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Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Publication of WO2013175942A1 publication Critical patent/WO2013175942A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0256—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms
    • H05K5/026—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms having standardized interfaces
    • H05K5/0278—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms having standardized interfaces of USB type

Definitions

  • the present invention relates to a composite module including a plurality of substrates, and more particularly to, for example, a wireless LAN module.
  • Patent Document 1 describes a circuit module using two printed boards as a composite module.
  • this circuit module two printed circuit boards are housed in a case.
  • a desired wiring pattern is formed on the main surface of each printed circuit board, and a plurality of desired electronic components are mounted to constitute a circuit module. Since the circuit module can be reduced in size in the planar direction by using a plurality of substrates in a stacked manner as in the circuit module described in Patent Document 1, the circuit module can be separated from another mother substrate (for example, a cellular phone). When mounted on a mother board), the mounting area can be reduced.
  • mother substrate for example, a cellular phone
  • a circuit module using a plurality of printed circuit boards includes a plurality of functional blocks, for example, a high-frequency functional block, a power supply functional block, a digital functional block for processing a baseband signal, etc.
  • the scale of the circuit module Is relatively large.
  • the electronic component elements such as inductors and capacitors constituting the filter included in the high-frequency functional block and the electronic component elements such as transformer components used in the DC-DC converter constituting the power supply functional block are the same. If they are arranged close to each other on the printed circuit board, there is a problem in that signal interference occurs between them, and desired electrical characteristics cannot be obtained or malfunction occurs.
  • a main object of the present invention is a composite module including a plurality of substrates, and by reducing interference of signals or the like between electronic component elements constituting different functional blocks arranged on each substrate,
  • An object of the present invention is to provide a composite module capable of preventing deterioration of electrical characteristics.
  • the composite module according to the present invention realizes a predetermined function different from the first functional block and the first substrate on which the first functional block including the electronic component element for realizing the predetermined function is arranged.
  • the other main surface of the first substrate and the one main surface of the second substrate are arranged to face each other.
  • the electronic component element constituting the first functional block and the electronic component element constituting the second functional block face each other via the first substrate or the second substrate. Are preferably arranged.
  • a planar ground electrode is preferably provided on one main surface or inside of the first substrate and on one main surface or inside of the second substrate.
  • the first functional block is a power function block
  • an electronic component element constituting the power function block is disposed on a main surface of the first substrate facing the case.
  • the electronic component elements constituting the power supply functional block are mounted on one main surface facing the case on the first substrate, and in a region different from the region where the electronic component elements are mounted.
  • An external connection connector is preferably arranged.
  • the composite module according to the present invention realizes a predetermined function different from the first functional block and the first substrate on which the first functional block including the electronic component element for realizing the predetermined function is arranged.
  • the second functional block including the electronic component element for the second board is arranged, that is, since different functional blocks are arranged on each board, interference of signals and the like between the functional blocks is prevented. Can be reduced.
  • the composite module according to the present invention is arranged so that the other main surface of the first substrate and the one main surface of the second substrate face each other, the area in the planar direction of the composite module can be reduced. Since it can do, while having the above-mentioned effect, a composite module can be reduced in size.
  • the electronic component element constituting the first functional block and the electronic component constituting the second functional block are arranged to face each other via the first substrate or the second substrate. Therefore, for example, since the signal generated in the first functional block is attenuated by the material of the first substrate, the amount of the signal interfering with the second functional block can be reduced. The effect of suppressing the interference can be improved. Furthermore, since the composite module according to the present invention is provided with a planar ground electrode on one main surface or inside of the first substrate and on one main surface or inside of the second substrate, the composite module is surrounded by the ground electrode. Interference between functional blocks between the portion and other portions can be reduced.
  • the first functional block is the power function block
  • the electronic component elements constituting the power function block are arranged on the main surface of the first substrate facing the case.
  • the magnetic field generated in the functional block may be combined with other functional block components.
  • the electronic component elements constituting the power supply functional block are mounted on one main surface facing the case on the first substrate, and in a region different from the region where the electronic component elements are mounted. Since the external connection connector is disposed, the external connection connector suppresses the spread of the magnetic field generated in the power function block, and therefore the effect of suppressing interference between the function blocks can be further improved.
  • a composite module including a plurality of substrates is used to reduce electrical characteristics degradation by reducing interference of signals or the like between electronic component elements constituting different functional blocks arranged on each substrate. It is possible to provide a composite module that can prevent the above.
  • FIG. 1 is an exploded perspective view of a wireless LAN module according to a first embodiment of the present invention.
  • FIG. 2 is a schematic sectional view of the wireless LAN module according to the first embodiment of the present invention.
  • the wireless LAN module 10 is a module for enabling a wireless communication function to be exerted on the electronic device by connecting to the electronic device, for example.
  • the wireless LAN module 10 illustrated in FIG. 1 includes at least a case 12 and a substrate unit 14.
  • the wireless LAN module 10 further includes a button member 16, a lens member 18, and an antenna 20.
  • the case 12 is provided to accommodate at least the substrate part 14.
  • the case 12 is provided for housing the button member 16, the lens member 18, and the antenna 20.
  • the case 12 is formed in a rectangular parallelepiped shape.
  • the case 12 includes a first case 22 and a second case 24.
  • substrate part 14 contains the 1st board
  • the first case 22 is formed in a box shape by the side surface portion 30 and the upper surface portion 32.
  • the side surface portion 30 of the first case 22 includes one side surface 34a and the other side surface 34b extending along the long side direction and the height direction.
  • the one side surface 34a and the other side surface 34b are formed to face each other.
  • a rectangular opening 36 is formed on the lower side of the first case 22 (the side facing the upper surface portion 32).
  • a groove 36 a having an L-shaped cross section is formed along the inner surface of the opening 36.
  • a storage portion 38 is provided inside the box formed by the side surface portion 30 and the upper surface portion 32 of the first case 22.
  • an inner wall surface 40 is formed on the surface of the side surface portion 30 on the storage portion 38 side.
  • a plurality of substrate protrusions 42 for supporting the substrate portion 14 are formed on the inner wall surface 40.
  • the substrate projection 42 is formed in a bar shape having a substantially circular cross section having one end and the other end.
  • the board projections 42 formed on the first case 22 are provided to support the one main surface 72a of the second board 28 of the board 14 so as to be pressed.
  • the substrate projections 42 are formed at two locations on the inner wall surface 40 of the first side surface 34a of the first case 22 at a predetermined interval, and the inner wall surface 40 of the other side surface 34b is 1
  • the substrate protrusion 42 is formed.
  • the length of the board protrusion 42 is, for example, longer than the length of the opening 36 from the upper surface 32 of the first case 22, and the length of the second board 28 inside the case 12 is determined by this length. The position in the thickness direction is determined.
  • a connector opening 32 a is formed in the upper surface portion 32 of the first case 22.
  • the connector opening 32a is formed to penetrate an external connection connector 66 described later.
  • a cylindrical tube portion 32b is formed to support the external connection connector 66.
  • the second case 24 is formed in a box shape by the side surface portion 44 and the bottom surface portion 46.
  • the side surface portion 44 of the second case 24 includes one side surface 48a and the other side surface 48b extending along the long side direction and the height direction, and the one end surface 50a and the other side extending along the short side direction and the height direction.
  • the end surface 50b is included.
  • One side surface 48a and the other side surface 48b are formed to face each other, and one end surface 50a and the other end surface 50b are also formed to face each other.
  • the bottom surface portion 46 is formed with a button opening 46a and a lens opening 46b.
  • a rectangular opening 52 is formed on the upper side of the second case 24 (the side facing the bottom surface 46).
  • a protruding edge portion 52 a is formed along the substantially inner edge of the opening 52.
  • a storage portion 54 is provided inside the second case 24 formed in a box shape by the side surface portion 44 and the bottom surface portion 46.
  • an inner wall surface 56 is formed on a surface of the side surface portion 44 on the storage portion 54 side.
  • a plurality of substrate projections 58 for supporting the substrate portion 14 are formed on the inner wall surface 56.
  • the substrate projections 58 formed on the second case 24 include the first substrate projections 58a for supporting the first substrate 26 of the substrate unit 14 and the second substrate of the substrate unit 14. And a second substrate projection 58b for supporting the 28.
  • the first substrate projection 58a and the second substrate projection 58b are each formed in a rod shape having a substantially circular or substantially rectangular cross section having one end and the other end.
  • one location is provided on the inner wall surface 56 on the one side surface 48a of the second case 24, one location is provided on the inner wall surface 56 on the other side surface 48b, and one location is provided on the inner wall surface 56 on the one end surface 50a.
  • a first substrate projection 58a is formed.
  • the first substrate projection 58 a is formed to have a length from the bottom surface 46 to the opening 52 of the second case 24, for example.
  • the lengths of the first substrate projections 58a are the same.
  • the position of the first substrate 26 in the thickness direction within the case 12 is determined by the length of the first substrate projection 58a.
  • the second substrate projection 58b is provided at one position on the inner wall surface 56 at a position different from the first substrate projection 58a, that is, at a predetermined interval from the first substrate projection 58a. It is formed.
  • the second substrate projection 58b is formed to have an intermediate length between the bottom surface 46 and the opening 52 of the second case 24, for example. The lengths of the respective second substrate projections 58b are the same.
  • the position of the second substrate 28 in the thickness direction within the case 12 is determined by the length of the second substrate projection 58b.
  • FIG. 3 is a plan view of a substrate portion according to the present invention
  • FIG. 3 (a) is a plan view of the first substrate
  • FIG. 3 (b) is a plan view of the second substrate.
  • the substrate unit 14 includes a first substrate 26 and a second substrate 28.
  • substrate 28 are formed with a printed circuit board etc., for example. Further, the thickness of the first substrate 26 is formed to be thicker than the thickness of the second substrate 28.
  • the first substrate 26 is formed in a rectangular plate shape and includes one main surface 60a and the other main surface 60b.
  • a first functional block 62 for realizing a predetermined function is disposed on the one main surface 60a of the first substrate 26.
  • the first functional block 62 has a wiring pattern (not shown) and an electronic component element 64 is mounted thereon. ing.
  • the electronic component element 64 mounted on the first functional block 62 is, for example, an electronic component element 64 related to a power supply circuit.
  • the electronic component element 64 is, for example, a coil component such as a DC-DC converter. Therefore, when the first substrate 26 is stored in the case 12, the upper surface portion 32 of the first case 22 and the electronic component element 64 related to the power supply circuit mounted on the first functional block 62 are opposed to each other. Be placed.
  • a connection connector 66 is mounted in one area of the one main surface 60a of the first substrate 26 and outside the area where the electronic component element 64 related to the power circuit mounted on the first functional block 62 is mounted.
  • the external connector 66 for example, a 5-pin or 8-pin USB connector is used.
  • the other end side of the first substrate 26 with respect to the other main surface 60b is mechanically connected to the first substrate 26 and the second substrate 28 with a desired interval in the thickness direction of each substrate.
  • a board connecting connector 68 is provided.
  • an edge portion 70 is provided along the outer periphery of the first substrate 26.
  • a plurality of, for example, semicircular recesses 70 a are formed on the edge portion 70 of the first substrate 26 corresponding to the substrate projections 42 formed on the first case 22.
  • a total of three recesses 70a are provided on each long side of the edge portion 70. Therefore, the board projections 42 formed in the first case 22 are inserted into the recesses 70a.
  • the end edge portion 70 of the other main surface 60 b of the first substrate 26 is supported by one end of the first substrate projection 58 a formed at three locations on the inner wall surface 40 of the second case 24. Supported by
  • the second substrate 28 is formed in a rectangular plate shape and includes one main surface 72a and the other main surface 72b.
  • the one main surface 72a of the second substrate 28 is arranged with a desired interval in the thickness direction of each substrate through the substrate connecting connector 68 so as to face the other main surface 60b of the first substrate 26.
  • the size of the outer shape of the second substrate 28 is substantially the same as the size of the first substrate 26.
  • a second functional block 74 for realizing a predetermined function different from the first functional block 62 is disposed on the one main surface 72a of the second substrate 28, and a wiring pattern (not shown) is provided.
  • the electronic component elements 76a and 76b are mounted.
  • the electronic component element 64 mounted on the first functional block 62 and the electronic component elements 76a and 76b mounted on the second functional block 74 are arranged, for example, with the first substrate 26 interposed therebetween. Therefore, they are not arranged so as to face each other directly.
  • the electronic component elements 76a and 76b mounted on the second functional block 74 are, for example, electronic component elements related to a control circuit such as a wireless LAN IC or MCU (micro control unit).
  • the other main surface 60b of the first substrate 26 on which the external connection connector 66 is mounted is an area facing the first substrate 26 with the first main surface 72a of the second substrate 28 facing the one main surface 72a.
  • the component element 76a is arranged.
  • the electronic component element 76 a is mounted on the one main surface 72 a of the second substrate 28 in a region immediately below the surface on which the external connection connector 66 is mounted.
  • the electronic component element 76a mounted on the second functional block 74 is an electronic component element that generates relatively high heat.
  • the writing mode and the reading mode are set in hardware by the terminal setting by the potential at the setting terminal. Therefore, by pulling out setting terminals necessary for terminal setting to the board connecting connector 68, the terminal setting (potential) can be set to the writing mode when inspecting the single board, and the connector of the composite module.
  • the board can be set to read mode.
  • a heat radiating member 78 is disposed on the upper surface of the electronic component element 76a (that is, the surface opposite to the surface on which the electronic component element 76a is mounted on the second substrate 28).
  • the heat radiating member 78 has a role of absorbing heat generated by the electronic component element 76 a and further has a role of buffering the first substrate 26 and the second substrate 28.
  • the heat dissipation member 78 is disposed between the first substrate 26 and the second substrate 28. In the heat dissipation member 78, the surface opposite to the upper surface side of the electronic component element 76 a is in contact with the other main surface 60 b of the first substrate 26.
  • the heat radiation member 78 is disposed so as to face the lower surface of the external connection connector 66 with the first substrate 26 interposed therebetween.
  • the heat radiation member 78 has a size that covers at least the upper surface of the electronic component element 76a.
  • a resin having high thermal conductivity is used as a material of the heat radiating member 78.
  • a ceramic or metal-based filler-containing silicon resin is preferable.
  • an edge portion 80 is provided along the outer periphery of the second substrate 28.
  • a plurality of semicircular recesses 80 a are formed on the edge portion 80 of the second substrate 28 in correspondence with the first substrate projections 58 a formed on the second case 24.
  • three recesses 80a are provided on each side of the edge 80 other than the other end where the board connecting connector 68 is provided. Therefore, the first substrate projection 58a is inserted into the recess 80a.
  • the end edge portion 80 of the one main surface 72a of the second substrate 28 is supported so as to be pressed by one end of the substrate projection 42 formed on the inner wall surface 40 of the first case 22, and the second substrate 28 is supported.
  • the other main surface 72 b of the substrate 28 is supported so as to be supported by one end of the second substrate projection 58 b formed on the inner wall surface 56 of the second case 24.
  • the position supported by the one end of the substrate projection 42 formed on the inner wall surface 40 of the first case 22 at the edge 80 of the one main surface 72a of the second substrate 28, and the first The position supported at the end edge portion 80a of the other main surface 72b of the second substrate 28 so as to be supported by one end of the second substrate projection 58b formed on the inner wall surface 56 of the second case 24.
  • the second substrate 28 When the second substrate 28 is viewed in plan, the second substrate 28 has different positions.
  • a substrate connecting connector 68 for connecting the substrates is provided between the other main surface 60b of the first substrate 26 and the one main surface 72a of the second substrate 28, whereby the substrate unit 14 is provided.
  • the heat generated in the electronic component element 76a can be transferred toward the first substrate 26 via the board connection connector 68, the electronic component element 76a The generated heat can be radiated more efficiently.
  • the thickness of the first substrate 26 on which the external connection connector 66 is mounted is formed to be thicker than the thickness of the second substrate 28, the load applied when inserting into the external connection connector 66 is received. Can do.
  • the second substrate 28 is formed thin, the wiring accuracy can be improved, and in addition, the through hole formed in the second substrate 28 can be thinned.
  • the thickness of the entire composite module 10 can be reduced by forming the second substrate 28 thin, the composite module 10 can be reduced in size.
  • the heat radiating member 78 since the heat radiating member 78 is provided, the heat generated in the electronic component element 76a is absorbed by the heat radiating member 78, and further, the absorbed heat is transferred to the external connection connector 66. Heat is radiated to the electronic device to which the wireless LAN module 10 is connected via the external connection connector 66. Therefore, since heat generated in the electronic component element 76a can be efficiently radiated, deterioration of characteristics of various electronic component elements and the wireless LAN module 10 mounted on the module can be prevented.
  • the end edge portion 68 of the other main surface 60 b of the first substrate 26 is supported by one end of the first substrate projection 58 a formed at three locations on the inner wall surface 40 of the second case 24.
  • the end edge portion 80 of the one main surface 72a of the second substrate 28 is supported so as to be pressed by one end of the substrate projection 42 formed on the inner wall surface 40 of the first case 22.
  • the second main surface 72b of the second substrate 28 is supported so as to be supported by one end of the second substrate projection 58b formed on the inner wall surface 56 of the second case 24.
  • the substrate 26 and the second substrate 28 can be supported so as not to be deformed inside the case 12.
  • the second substrate 28 has different positions, so that the strength for supporting the substrate can be improved as compared with the case where the substrate 28 is supported at the same position.
  • a semicircular recess 80a is formed on the edge 80 of the second substrate 28 corresponding to the first substrate projection 58a formed on the second case 24.
  • the first board projection 58a is inserted into the recess 80a, and the first board projection 58a is inserted into the recess 80a. Since the positions of the second substrate 28 in the long side direction and the short side direction are fixed, the mounting accuracy of the second substrate 28 in the case 12 can be improved.
  • the button member 16 is provided, for example, to execute communication start or reset when performing ID authentication with a connection destination device that performs wireless connection using the wireless LAN module 10.
  • the lens member 18 includes a lens 18a and a lens holding portion 18b.
  • the lens 18 a is provided to guide light from an LED lamp (not shown) indicating the operation state of the wireless LAN module 10 toward the outside of the case 12.
  • maintenance part 18b is provided in order to hold
  • the antenna 20 is provided for transmitting and receiving wireless radio waves for realizing wireless communication with an external wireless LAN terminal or the like.
  • the antenna 20 is formed in a rectangular plate shape, and is formed with a button opening 20a and a lens opening 20b.
  • the antenna 20 is disposed, for example, on the other main surface 72b side of the second substrate 28.
  • the antenna 20 is disposed so as to contact the bottom surface portion 46 of the second case 24.
  • the substrate portion 14 is mainly in contact with the case 12 via the substrate protrusions 42 and 58, and the antenna 20 is disposed on the other main surface 72b side of the second substrate 28.
  • the antenna 20 is housed in the case 12, the antenna 20 is disposed so as to contact the bottom surface portion 46 of the second case 24, so that the heat generated in the electronic component element 76a is transferred to the case 12. Can dissipate heat. Therefore, the heat generated inside the wireless LAN module 10 can be radiated more efficiently.
  • the substrate unit 14 includes the first functional block 62 disposed on the first substrate 26, and is separated from the first substrate 26, and the second substrate Since the second functional block 74 is arranged at 28, interference of signals and the like between the respective functional blocks can be reduced. Further, since the first functional block 62 and the second functional block 74 are arranged so as not to face each other directly, the effect of reducing the above-described interference can be further improved. Therefore, it is possible to prevent deterioration of electrical characteristics in the wireless LAN module 10.
  • the first functional block 62 includes the electronic component element 64 relating to the power supply circuit, for example, a coil component such as a DC-DC converter.
  • the electronic component element 64 relating to the power supply circuit, for example, a coil component such as a DC-DC converter.
  • the electronic component element 64 and the like related to the power supply circuit mounted on 62 are arranged so as to face each other, the coupling with the electronic component element housed in the case 12 can be suppressed.
  • the electronic component element 64 relating to the power supply circuit mounted on the first functional block 62 on the one end side of the one main surface 60 a of the first substrate 26. Since the external connection connector 66 is mounted in a region excluding the region where the circuit board is mounted, the external connection connector 66 is connected to the first functional block 62 in the electronic component element 64 relating to the power supply circuit, for example, DC -Since the spread of the magnetic field generated in the coil component such as the DC converter is suppressed, the effect of suppressing the interference between the functional blocks can be further improved.
  • FIG. 4 is a schematic cross-sectional view of the second embodiment of the wireless LAN module according to the present invention.
  • the wireless LAN module 110 illustrated in FIG. 4 includes at least a case 112 and a substrate unit 114.
  • the case 112 is provided to accommodate at least the substrate portion 114.
  • the case 112 is configured in the same manner as the case 12 in the first embodiment, and thus description thereof is omitted. Further, the description of the substrate projections for supporting the substrate unit 114 is also omitted.
  • the substrate unit 114 includes a first substrate 126 and a second substrate 128.
  • the first substrate 126 and the second substrate 128 are formed of, for example, a printed circuit board. Further, the thickness of the first substrate 126 is formed to be thicker than the thickness of the second substrate 128.
  • the first substrate 126 is formed in a rectangular plate shape and includes one main surface 60a and the other main surface 60b. On one main surface 60a of the first substrate 126, a first functional block for realizing a predetermined function is disposed.
  • the first functional block has a ground electrode 82 and a wiring pattern (not shown) formed in a planar shape, and an electronic component element 164 is mounted thereon.
  • the electronic component element 164 mounted on the first functional block is a coil component such as a DC-DC converter.
  • the external connection connector 166 is provided in a region excluding the region where the electronic component element 64 mounted on the first functional block is mounted on one end side of the one main surface 60a of the first substrate 126.
  • the external connection connector 166 for example, a 5-pin or 8-pin USB connector is used.
  • the other end side of the first substrate 126 with respect to the other main surface 60b is mechanically connected to the first substrate 26 and the second substrate 28 with a desired interval in the thickness direction of each substrate.
  • a board connecting connector 168 is provided.
  • the second substrate 128 is formed in a rectangular plate shape and includes one main surface 72a and the other main surface 72b.
  • the one main surface 72a of the second substrate 128 is arranged with a desired interval in the thickness direction of each substrate through the substrate connecting connector 168 so as to face the other main surface 60b of the first substrate 126.
  • the size of the outer shape of the second substrate 128 is substantially the same as the size of the first substrate 128.
  • a second functional block for realizing a predetermined function different from the first functional block is arranged on the one main surface 72a of the second substrate 128, and the ground electrode 84 formed in a planar shape or the like
  • the electronic component elements 176a and 176b are mounted while having a wiring pattern (not shown).
  • the electronic component element 176a mounted on the second functional block is, for example, an electronic component element such as an inductor or a capacitor constituting a filter included in the high frequency functional block, or a wireless LAN IC. Further, the electronic component element 176b mounted on the second functional block is an electronic component that generates relatively high heat.
  • a heat dissipation member 178 is disposed on the upper surface of the electronic component element 176b (that is, the surface opposite to the surface on which the electronic component element 176b is mounted on the second substrate 128).
  • the heat radiating member 178 is substantially the same as the heat radiating member 78 in the first embodiment, and a description thereof will be omitted.
  • the ground electrode 82 is provided on the one main surface 60a of the first substrate 126, and the ground electrode 84 is provided on the one main surface 72a of the second substrate 128. Therefore, interference between functional blocks between the portion surrounded by the ground electrodes 82 and 84 and the other portions can be reduced. Therefore, it is possible to further prevent deterioration of electrical characteristics in the wireless LAN module 110.
  • the first substrate and the second substrate are disposed so as to face each other, but the present invention is not limited to this, and the first substrate and the second substrate are not limited thereto.
  • the substrates may be arranged in a column.
  • a power circuit is arranged in the first functional block on the first substrate, and a digital circuit is arranged in the second functional block on the second substrate.
  • the present invention is not limited to this, and various changes may be made.
  • the heat radiating member is disposed on the upper surface of the electronic component element.
  • the present invention is not limited to this, and the heat radiating member may not be disposed.
  • the substrate protrusion is formed on the case in order to support the substrate portion.
  • the present invention is not limited to this, and the substrate portion may be formed by another configuration. You may make it support. Therefore, the first substrate and the second substrate of the substrate portion in the wireless LAN module according to the above-described embodiment have recesses for penetrating the substrate protrusions on the edge portions. It may not be formed.
  • the first substrate is formed thicker than the second substrate.
  • the present invention is not limited to this, and the thickness of the first substrate is the second substrate.
  • the second substrate may be formed to be thicker than the thickness of the first substrate.
  • the ground electrode is formed on one main surface of the first substrate or the second substrate.
  • the present invention is not limited to this, and the first substrate is not limited thereto. Alternatively, it may be formed inside the second substrate.
  • the external connection connector is disposed on the first board, but the present invention is not limited to this.
  • the electronic component element constituting the first functional block and the electronic component element constituting the second functional block may be arranged to face each other via both the first substrate and the second substrate. Absent. By separating each functional block through a plurality of substrates, signal interference between both blocks can be further reduced.
  • the composite module according to the present invention can be applied to an application that allows a desired function to be further added to an electronic device such as a home appliance or an AV device.

Abstract

Provided is a composite module which contains multiple substrates and which prevents degradation of electrical characteristics by reducing signal interference between electronic component elements configuring different functional blocks arranged on the substrates. A wireless LAN module, as the composite module, includes a first substrate (26) on which is arranged a first functional block (62) containing an electronic component element (64) for realizing a prescribed function, a second substrate (28) on which is arranged a second functional block (74) containing electronic component elements (76a, 76b) for realizing a prescribed function different from that realized in the first functional block (62), and a case (12) which houses the first substrate (26) and the second substrate (28).

Description

複合モジュールCompound module
　この発明は、複数の基板を含む複合モジュールに関し、特にたとえば、無線ＬＡＮモジュールに関する。 The present invention relates to a composite module including a plurality of substrates, and more particularly to, for example, a wireless LAN module.
　特許文献１には、複合モジュールとして、２枚のプリント基板を使用した回路モジュールが記載されている。この回路モジュールでは、２枚のプリント基板がケース内に収納されている。そして、各プリント基板の主面上には、所望の配線パターンが形成されており、複数の所望の電子部品が実装されることにより、回路モジュールが構成されている。特許文献１に記載される回路モジュールのように複数の基板を重ねて使用することにより、回路モジュールの平面方向におけるサイズを小さくすることができるため、回路モジュールを別のマザー基板（たとえば、携帯電話のマザー基板）等に実装した際に、その実装面積を小さくできるという効果を有する。 Patent Document 1 describes a circuit module using two printed boards as a composite module. In this circuit module, two printed circuit boards are housed in a case. A desired wiring pattern is formed on the main surface of each printed circuit board, and a plurality of desired electronic components are mounted to constitute a circuit module. Since the circuit module can be reduced in size in the planar direction by using a plurality of substrates in a stacked manner as in the circuit module described in Patent Document 1, the circuit module can be separated from another mother substrate (for example, a cellular phone). When mounted on a mother board), the mounting area can be reduced.
特開２０１１－１８１６３５号公報JP 2011-181635 A
　しかしながら、複数のプリント基板を利用するような回路モジュールでは、複数の機能ブロック、たとえば、高周波機能ブロック、電源機能ブロック、ベースバンド信号などを処理するデジタル機能ブロックなどを備えるため、その回路モジュールの規模が比較的大きくなる。その場合、たとえば、高周波機能ブロックに含まれるフィルタを構成するインダクタやコンデンサ等の電子部品素子と、電源機能ブロックを構成するＤＣ－ＤＣコンバータなどに使用されるトランス部品などの電子部品素子とが同一プリント基板上に近接して配置されると、両者の間で信号の干渉が発生し、所望の電気特性が得られなかったり、誤動作を起こしたりするという問題があった。 However, since a circuit module using a plurality of printed circuit boards includes a plurality of functional blocks, for example, a high-frequency functional block, a power supply functional block, a digital functional block for processing a baseband signal, etc., the scale of the circuit module Is relatively large. In that case, for example, the electronic component elements such as inductors and capacitors constituting the filter included in the high-frequency functional block and the electronic component elements such as transformer components used in the DC-DC converter constituting the power supply functional block are the same. If they are arranged close to each other on the printed circuit board, there is a problem in that signal interference occurs between them, and desired electrical characteristics cannot be obtained or malfunction occurs.
　それゆえに、この発明の主たる目的は、複数の基板を含む複合モジュールであって、各基板上に配置される異なる機能ブロックを構成する電子部品素子の間における信号等の干渉を低減することで、電気特性の劣化を防止することのできる複合モジュールを提供することである。 Therefore, a main object of the present invention is a composite module including a plurality of substrates, and by reducing interference of signals or the like between electronic component elements constituting different functional blocks arranged on each substrate, An object of the present invention is to provide a composite module capable of preventing deterioration of electrical characteristics.
　この発明にかかる複合モジュールは、所定の機能を実現するための電子部品素子を含む第１の機能ブロックが配置される第１の基板と、第１の機能ブロックとは異なる所定の機能を実現するための電子部品素子を含む第２の機能ブロックが配置される第２の基板と、第１の基板および第２の基板を収納するためのケースと、
を含む、複合モジュールである。
　また、この発明にかかる複合モジュールでは、第１の基板の他方主面と第２の基板の一方主面とが対向するように配置されることが好ましい。
　さらにまた、この発明にかかる複合モジュールでは、第１の機能ブロックを構成する電子部品素子と第２の機能ブロックを構成する電子部品素子とが第１の基板または第２の基板を介して対向して配置されることが好ましい。
　この発明にかかる複合モジュールでは、第１の基板の一方主面または内部、および第２の基板の一方主面または内部に面状のグランド電極がそれぞれ設けられることが好ましい。
　また、この発明にかかる複合モジュールでは、第１の機能ブロックは電源機能ブロックであり、第１の基板におけるケースに対向する主面に電源機能ブロックを構成する電子部品素子が配置されることが好ましい。
　さらに、この発明にかかる複合モジュールでは、電源機能ブロックを構成する電子部品素子は、第１の基板におけるケースに対向する一方主面に実装され、電子部品素子が実装される領域とは異なる領域に外部接続用コネクタが配置されることが好ましい。 The composite module according to the present invention realizes a predetermined function different from the first functional block and the first substrate on which the first functional block including the electronic component element for realizing the predetermined function is arranged. A second substrate on which a second functional block including an electronic component element is disposed; a case for housing the first substrate and the second substrate;
Is a composite module.
In the composite module according to the present invention, it is preferable that the other main surface of the first substrate and the one main surface of the second substrate are arranged to face each other.
Furthermore, in the composite module according to the present invention, the electronic component element constituting the first functional block and the electronic component element constituting the second functional block face each other via the first substrate or the second substrate. Are preferably arranged.
In the composite module according to the present invention, a planar ground electrode is preferably provided on one main surface or inside of the first substrate and on one main surface or inside of the second substrate.
In the composite module according to the present invention, it is preferable that the first functional block is a power function block, and an electronic component element constituting the power function block is disposed on a main surface of the first substrate facing the case. .
Furthermore, in the composite module according to the present invention, the electronic component elements constituting the power supply functional block are mounted on one main surface facing the case on the first substrate, and in a region different from the region where the electronic component elements are mounted. An external connection connector is preferably arranged.
　この発明にかかる複合モジュールは、所定の機能を実現するための電子部品素子を含む第１の機能ブロックが配置される第１の基板と、第１の機能ブロックとは異なる所定の機能を実現するための電子部品素子を含む第２の機能ブロックが配置される第２の基板となるように、すなわち、各基板に異なる機能ブロックが配置されているので、各機能ブロック間における信号等の干渉を低減することができる。
　また、この発明にかかる複合モジュールは、第１の基板の他方主面と第２の基板の一方主面とが対向するように配置されるので、複合モジュールにおける平面方向の面積を低減することができることから、上述の効果を奏するとともに、複合モジュールを小型化することができる。
　さらに、この発明にかかる複合モジュールは、第１の機能ブロックを構成する電子部品素子と第２の機能ブロックを構成する電子部品とが第１の基板または第２の基板を介して対向して配置されるので、例えば第１の機能ブロックで発生した信号は第１の基板の材質などにより減衰されるので、第２の機能ブロックへ干渉する信号の量を低減できるため、機能ブロック間における信号等の干渉を抑制する効果を向上することができる。
　さらにまた、この発明にかかる複合モジュールは、第１の基板の一方主面または内部、および第２の基板の一方主面または内部に面状のグランド電極がそれぞれ設けられるので、グランド電極に囲まれる部分と、それ以外の部分との機能ブロック間の干渉を低減することができる。
　また、この発明にかかる複合モジュールは、第１の機能ブロックが電源機能ブロックであり、第１の基板におけるケースに対向する主面に電源機能ブロックを構成する電子部品素子が配置されるので、電源機能ブロックにおいて発生する磁界により他の機能ブロックの部品と結合する可能性があるところ、前述のような構成とすることで、ケース内部の部品との結合を抑制することができる。
　さらに、この発明にかかる複合モジュールは、電源機能ブロックを構成する電子部品素子は、第１の基板におけるケースに対向する一方主面に実装され、電子部品素子が実装される領域とは異なる領域に外部接続用コネクタが配置されるので、この外部接続用コネクタが、電源機能ブロックで発生する磁界の広がりを抑制することから、機能ブロック間における干渉を抑制する効果をさらに向上することができる。 The composite module according to the present invention realizes a predetermined function different from the first functional block and the first substrate on which the first functional block including the electronic component element for realizing the predetermined function is arranged. The second functional block including the electronic component element for the second board is arranged, that is, since different functional blocks are arranged on each board, interference of signals and the like between the functional blocks is prevented. Can be reduced.
Moreover, since the composite module according to the present invention is arranged so that the other main surface of the first substrate and the one main surface of the second substrate face each other, the area in the planar direction of the composite module can be reduced. Since it can do, while having the above-mentioned effect, a composite module can be reduced in size.
Furthermore, in the composite module according to the present invention, the electronic component element constituting the first functional block and the electronic component constituting the second functional block are arranged to face each other via the first substrate or the second substrate. Therefore, for example, since the signal generated in the first functional block is attenuated by the material of the first substrate, the amount of the signal interfering with the second functional block can be reduced. The effect of suppressing the interference can be improved.
Furthermore, since the composite module according to the present invention is provided with a planar ground electrode on one main surface or inside of the first substrate and on one main surface or inside of the second substrate, the composite module is surrounded by the ground electrode. Interference between functional blocks between the portion and other portions can be reduced.
In the composite module according to the present invention, the first functional block is the power function block, and the electronic component elements constituting the power function block are arranged on the main surface of the first substrate facing the case. There is a possibility that the magnetic field generated in the functional block may be combined with other functional block components. However, by using the configuration as described above, it is possible to suppress the coupling with the components inside the case.
Furthermore, in the composite module according to the present invention, the electronic component elements constituting the power supply functional block are mounted on one main surface facing the case on the first substrate, and in a region different from the region where the electronic component elements are mounted. Since the external connection connector is disposed, the external connection connector suppresses the spread of the magnetic field generated in the power function block, and therefore the effect of suppressing interference between the function blocks can be further improved.
　この発明によれば、複数の基板を含む複合モジュールであって、各基板上に配置される異なる機能ブロックを構成する電子部品素子の間における信号等の干渉を低減することで、電気特性の劣化を防止することのできる複合モジュールを提供することができる。 According to the present invention, a composite module including a plurality of substrates is used to reduce electrical characteristics degradation by reducing interference of signals or the like between electronic component elements constituting different functional blocks arranged on each substrate. It is possible to provide a composite module that can prevent the above.
　この発明の上述の目的、その他の目的、特徴および利点は、図面を参照して行う以下の発明を実施するための形態の説明から一層明らかとなろう。 The above-mentioned object, other objects, features, and advantages of the present invention will become more apparent from the following description of the embodiments for carrying out the invention with reference to the drawings.
この発明にかかる無線ＬＡＮモジュールの第１の実施の形態についての分解斜視図である。It is a disassembled perspective view about 1st Embodiment of the wireless LAN module concerning this invention. この発明にかかる無線ＬＡＮモジュールの第１の実施の形態についての断面模式図である。It is a cross-sectional schematic diagram about 1st Embodiment of the wireless LAN module concerning this invention. この発明にかかる基板部の平面図であり、（ａ）は第１の基板の平面図であり、（ｂ）は第２の基板の平面図である。It is a top view of the board | substrate part concerning this invention, (a) is a top view of a 1st board | substrate, (b) is a top view of a 2nd board | substrate. この発明にかかる無線ＬＡＮモジュールの第２の実施の形態についての断面模式図である。It is a cross-sectional schematic diagram about 2nd Embodiment of the wireless LAN module concerning this invention.
　本発明にかかる複合モジュールとしての無線ＬＡＮモジュールの実施の形態の一例について説明する。図１は、本発明にかかる無線ＬＡＮモジュールの第１の実施の形態についての分解斜視図である。また、図２は、本発明にかかる無線ＬＡＮモジュールの第１の実施の形態についての断面模式図である。この無線ＬＡＮモジュール１０は、たとえば、電子機器に接続することで、その電子機器に無線通信の機能を発揮できるようにするためのモジュールである。 An example of an embodiment of a wireless LAN module as a composite module according to the present invention will be described. FIG. 1 is an exploded perspective view of a wireless LAN module according to a first embodiment of the present invention. FIG. 2 is a schematic sectional view of the wireless LAN module according to the first embodiment of the present invention. The wireless LAN module 10 is a module for enabling a wireless communication function to be exerted on the electronic device by connecting to the electronic device, for example.
　図１に記載の無線ＬＡＮモジュール１０は、少なくとも、ケース１２と、基板部１４とを備える。また、無線ＬＡＮモジュール１０は、さらに、ボタン部材１６と、レンズ部材１８と、アンテナ２０とを備える。 The wireless LAN module 10 illustrated in FIG. 1 includes at least a case 12 and a substrate unit 14. The wireless LAN module 10 further includes a button member 16, a lens member 18, and an antenna 20.
　ケース１２は、少なくとも基板部１４を収納するために設けられる。また、ケース１２は、ボタン部材１６、レンズ部材１８およびアンテナ２０を収納するために設けられる。ケース１２は、直方体状に形成される。ケース１２は、第１のケース２２および第２のケース２４を含む。ここで、基板部１４は、たとえば、第１の基板２６および第２の基板２８を含む。 The case 12 is provided to accommodate at least the substrate part 14. The case 12 is provided for housing the button member 16, the lens member 18, and the antenna 20. The case 12 is formed in a rectangular parallelepiped shape. The case 12 includes a first case 22 and a second case 24. Here, the board | substrate part 14 contains the 1st board | substrate 26 and the 2nd board | substrate 28, for example.
　第１のケース２２は、側面部３０および上面部３２により箱状に形成される。第１のケース２２の側面部３０は、長辺方向および高さ方向に沿って延びる一方側面３４ａおよび他方側面３４ｂを含む。一方側面３４ａおよび他方側面３４ｂは、それぞれ対向するように形成される。 The first case 22 is formed in a box shape by the side surface portion 30 and the upper surface portion 32. The side surface portion 30 of the first case 22 includes one side surface 34a and the other side surface 34b extending along the long side direction and the height direction. The one side surface 34a and the other side surface 34b are formed to face each other.
　第１のケース２２の下方側（上面部３２に対向する側）には、矩形状の開口部３６が形成される。開口部３６の内側面に沿って、断面Ｌ字型の溝部３６ａが形成される。溝部３６ａには、第１のケース２２と第２のケース２４とを組み合わせてケース１２を形成するとき、後述する第２のケース２４の突縁部５２ａがはめ込まれる。 A rectangular opening 36 is formed on the lower side of the first case 22 (the side facing the upper surface portion 32). A groove 36 a having an L-shaped cross section is formed along the inner surface of the opening 36. When the case 12 is formed by combining the first case 22 and the second case 24 into the groove 36a, a protruding edge 52a of the second case 24 described later is fitted.
　第１のケース２２の側面部３０および上面部３２により箱状に形成された内部には、収納部３８が設けられている。また、側面部３０における収納部３８側の面には、内壁面４０が形成されている。 A storage portion 38 is provided inside the box formed by the side surface portion 30 and the upper surface portion 32 of the first case 22. In addition, an inner wall surface 40 is formed on the surface of the side surface portion 30 on the storage portion 38 side.
　内壁面４０には、基板部１４を支持するための基板用突起部４２が複数形成されている。基板用突起部４２は、一方端および他方端を有する断面略円形の棒状に形成される。第１のケース２２に形成される基板用突起部４２は、基板部１４の第２の基板２８の一方主面７２ａを押さえるように支持するために設けられる。 A plurality of substrate protrusions 42 for supporting the substrate portion 14 are formed on the inner wall surface 40. The substrate projection 42 is formed in a bar shape having a substantially circular cross section having one end and the other end. The board projections 42 formed on the first case 22 are provided to support the one main surface 72a of the second board 28 of the board 14 so as to be pressed.
　本実施の形態においては、第１のケース２２の一方側面３４ａにおける内壁面４０に２か所、所定の間隔を設けて基板用突起部４２が形成され、そして他方側面３４ｂにおける内壁面４０に１か所、基板用突起部４２が形成される。基板用突起部４２の長さは、たとえば、第１のケース２２の上面部３２から開口部３６の長さよりも長く形成されており、この長さにより、ケース１２の内部における第２の基板２８の厚み方向の位置が決定される。 In the present embodiment, the substrate projections 42 are formed at two locations on the inner wall surface 40 of the first side surface 34a of the first case 22 at a predetermined interval, and the inner wall surface 40 of the other side surface 34b is 1 The substrate protrusion 42 is formed. The length of the board protrusion 42 is, for example, longer than the length of the opening 36 from the upper surface 32 of the first case 22, and the length of the second board 28 inside the case 12 is determined by this length. The position in the thickness direction is determined.
　また、第１のケース２２の上面部３２にはコネクタ用開口部３２ａが形成される。コネクタ用開口部３２ａは、後述する外部接続用コネクタ６６を貫装するために形成される。コネクタ用開口部３２ａには、外部接続用コネクタ６６を支持するために筒状の筒状部３２ｂが形成されている。 Further, a connector opening 32 a is formed in the upper surface portion 32 of the first case 22. The connector opening 32a is formed to penetrate an external connection connector 66 described later. In the connector opening portion 32a, a cylindrical tube portion 32b is formed to support the external connection connector 66.
　第２のケース２４は、側面部４４および底面部４６により箱状に形成される。第２のケース２４の側面部４４は、長辺方向および高さ方向に沿って延びる一方側面４８ａおよび他方側面４８ｂを含み、また、短辺方向および高さ方向に沿って延びる一方端面５０ａおよび他方端面５０ｂを含む。一方側面４８ａおよび他方側面４８ｂは、それぞれ対向するように形成され、一方端面５０ａおよび他方端面５０ｂも、それぞれ対向するように形成される。また、底面部４６には、ボタン用開口部４６ａおよびレンズ用開口部４６ｂが形成されている。 The second case 24 is formed in a box shape by the side surface portion 44 and the bottom surface portion 46. The side surface portion 44 of the second case 24 includes one side surface 48a and the other side surface 48b extending along the long side direction and the height direction, and the one end surface 50a and the other side extending along the short side direction and the height direction. The end surface 50b is included. One side surface 48a and the other side surface 48b are formed to face each other, and one end surface 50a and the other end surface 50b are also formed to face each other. The bottom surface portion 46 is formed with a button opening 46a and a lens opening 46b.
　第２のケース２４の上方側（底面部４６に対向する側）には、矩形状の開口部５２が形成される。開口部５２の略内側の端縁に沿って、突縁部５２ａが形成される。突縁部５２ａは、第１のケース２２と第２のケース２４とを組み合わせてケース１２を形成するとき、上述した第１のケース２２の溝部３６ａにはめ込まれる。 A rectangular opening 52 is formed on the upper side of the second case 24 (the side facing the bottom surface 46). A protruding edge portion 52 a is formed along the substantially inner edge of the opening 52. When the case 12 is formed by combining the first case 22 and the second case 24, the projecting edge portion 52a is fitted into the groove 36a of the first case 22 described above.
　第２のケース２４の側面部４４および底面部４６により箱状に形成された内部には、収納部５４が設けられている。また、側面部４４における収納部５４側の面には、内壁面５６が形成されている。 A storage portion 54 is provided inside the second case 24 formed in a box shape by the side surface portion 44 and the bottom surface portion 46. In addition, an inner wall surface 56 is formed on a surface of the side surface portion 44 on the storage portion 54 side.
　内壁面５６には、基板部１４を支持するための基板用突起部５８が複数形成されている。第２のケース２４に形成される基板用突起部５８は、基板部１４の第１の基板２６を支えるように支持するための第１の基板用突起部５８ａと基板部１４の第２の基板２８を支えるように支持するための第２の基板用突起部５８ｂとを含む。第１の基板用突起部５８ａおよび第２の基板用突起部５８ｂは、それぞれ一方端および他方端を有する断面略円形もしくは略矩形の棒状に形成される。 A plurality of substrate projections 58 for supporting the substrate portion 14 are formed on the inner wall surface 56. The substrate projections 58 formed on the second case 24 include the first substrate projections 58a for supporting the first substrate 26 of the substrate unit 14 and the second substrate of the substrate unit 14. And a second substrate projection 58b for supporting the 28. The first substrate projection 58a and the second substrate projection 58b are each formed in a rod shape having a substantially circular or substantially rectangular cross section having one end and the other end.
　本実施の形態においては、第２のケース２４の一方側面４８ａにおける内壁面５６に１か所、他方側面４８ｂにおける内壁面５６に１か所、そして、一方端面５０ａにおける内壁面５６に１か所、第１の基板用突起部５８ａが形成される。第１の基板用突起部５８ａは、たとえば、第２のケース２４の底面部４６から開口部５２までの長さに形成される。それぞれの第１の基板用突起部５８ａの長さは、同一である。この第１の基板用突起部５８ａの長さにより、ケース１２の内部における第１の基板２６の厚み方向の位置が決定される。また、第２のケース２４の一方側面４８ａにおける内壁面５６に１か所、他方側面４８ｂにおける内壁面５６に１か所、一方端面５０ａにおける内壁面５６に１か所、そして、他方端面５０ｂにおける内壁面５６に１か所、第１の基板用突起部５８ａとは異なる位置で、すなわち、第１の基板用突起部５８ａとは所定の間隔を設けて、第２の基板用突起部５８ｂが形成される。第２の基板用突起部５８ｂは、たとえば、第２のケース２４の底面部４６と開口部５２との中間の長さに形成される。それぞれの第２の基板用突起部５８ｂの長さは、同一である。この第２の基板用突起部５８ｂの長さにより、ケース１２の内部における第２の基板２８の厚み方向の位置が決定される。 In the present embodiment, one location is provided on the inner wall surface 56 on the one side surface 48a of the second case 24, one location is provided on the inner wall surface 56 on the other side surface 48b, and one location is provided on the inner wall surface 56 on the one end surface 50a. A first substrate projection 58a is formed. The first substrate projection 58 a is formed to have a length from the bottom surface 46 to the opening 52 of the second case 24, for example. The lengths of the first substrate projections 58a are the same. The position of the first substrate 26 in the thickness direction within the case 12 is determined by the length of the first substrate projection 58a. Further, one location on the inner wall surface 56 of the second side surface 48a of the second case 24, one location on the inner wall surface 56 of the other side surface 48b, one location on the inner wall surface 56 of the one end surface 50a, and on the other end surface 50b. The second substrate projection 58b is provided at one position on the inner wall surface 56 at a position different from the first substrate projection 58a, that is, at a predetermined interval from the first substrate projection 58a. It is formed. The second substrate projection 58b is formed to have an intermediate length between the bottom surface 46 and the opening 52 of the second case 24, for example. The lengths of the respective second substrate projections 58b are the same. The position of the second substrate 28 in the thickness direction within the case 12 is determined by the length of the second substrate projection 58b.
　次に、基板部１４について説明する。図３は、本発明にかかる基板部の平面図であり、図３（ａ）は第１の基板の平面図であり、図３（ｂ）は第２の基板の平面図である。基板部１４は、第１の基板２６および第２の基板２８を含む。第１の基板２６および第２の基板２８は、たとえば、プリント基板等により形成される。また、第１の基板２６の厚みは、第２の基板２８の厚みよりも厚く形成される。 Next, the substrate unit 14 will be described. FIG. 3 is a plan view of a substrate portion according to the present invention, FIG. 3 (a) is a plan view of the first substrate, and FIG. 3 (b) is a plan view of the second substrate. The substrate unit 14 includes a first substrate 26 and a second substrate 28. The 1st board | substrate 26 and the 2nd board | substrate 28 are formed with a printed circuit board etc., for example. Further, the thickness of the first substrate 26 is formed to be thicker than the thickness of the second substrate 28.
　第１の基板２６は、矩形の板状に形成されており、一方主面６０ａおよび他方主面６０ｂを含む。第１の基板２６の一方主面６０ａには、所定の機能を実現するための第１の機能ブロック６２が配置されており、配線パターン（図示せず）を有するとともに電子部品素子６４が実装されている。第１の機能ブロック６２に実装される電子部品素子６４としては、たとえば、電源回路に関する電子部品素子６４である。電子部品素子６４は、たとえば、ＤＣ－ＤＣコンバータ等のコイル部品等である。したがって、第１の基板２６がケース１２に収納されたとき、第１のケース２２の上面部３２と第１の機能ブロック６２に実装される電源回路に関する電子部品素子６４等とが対向するように配置される。また、第１の基板２６の一方主面６０ａの一方端部側であって、第１の機能ブロック６２に実装される電源回路に関する電子部品素子６４等が実装される領域を除く領域において、外部接続用コネクタ６６が実装される。外部接続用コネクタ６６は、たとえば、５ピンあるいは８ピンのＵＳＢコネクタが用いられる。また、第１の基板２６の他方主面６０ｂとの他方端側には、第１の基板２６と第２の基板２８とにおける所望の各基板の厚み方向の間隔を設けて機械的に接続するために、基板接続用コネクタ６８が設けられる。 The first substrate 26 is formed in a rectangular plate shape and includes one main surface 60a and the other main surface 60b. A first functional block 62 for realizing a predetermined function is disposed on the one main surface 60a of the first substrate 26. The first functional block 62 has a wiring pattern (not shown) and an electronic component element 64 is mounted thereon. ing. The electronic component element 64 mounted on the first functional block 62 is, for example, an electronic component element 64 related to a power supply circuit. The electronic component element 64 is, for example, a coil component such as a DC-DC converter. Therefore, when the first substrate 26 is stored in the case 12, the upper surface portion 32 of the first case 22 and the electronic component element 64 related to the power supply circuit mounted on the first functional block 62 are opposed to each other. Be placed. Further, in one area of the one main surface 60a of the first substrate 26 and outside the area where the electronic component element 64 related to the power circuit mounted on the first functional block 62 is mounted, A connection connector 66 is mounted. As the external connector 66, for example, a 5-pin or 8-pin USB connector is used. Further, the other end side of the first substrate 26 with respect to the other main surface 60b is mechanically connected to the first substrate 26 and the second substrate 28 with a desired interval in the thickness direction of each substrate. For this purpose, a board connecting connector 68 is provided.
　また、第１の基板２６の外周に沿って、端縁部７０が設けられる。第１の基板２６の端縁部７０には、第１のケース２２に形成される基板用突起部４２に対応して、たとえば、半円形状の凹部７０ａが複数形成されている。凹部７０ａは、たとえば、端縁部７０において、各長辺に合計３か所設けられる。したがって、凹部７０ａには、第１のケース２２に形成される基板用突起部４２が貫装される。そして、第１の基板２６の他方主面６０ｂの端縁部７０が、第２のケース２４の内壁面４０に３か所形成される第１の基板用突起部５８ａの一方端により支えられるように支持される。 Further, an edge portion 70 is provided along the outer periphery of the first substrate 26. A plurality of, for example, semicircular recesses 70 a are formed on the edge portion 70 of the first substrate 26 corresponding to the substrate projections 42 formed on the first case 22. For example, a total of three recesses 70a are provided on each long side of the edge portion 70. Therefore, the board projections 42 formed in the first case 22 are inserted into the recesses 70a. The end edge portion 70 of the other main surface 60 b of the first substrate 26 is supported by one end of the first substrate projection 58 a formed at three locations on the inner wall surface 40 of the second case 24. Supported by
　第２の基板２８は、矩形の板状に形成されており、一方主面７２ａおよび他方主面７２ｂを含む。第２の基板２８の一方主面７２ａは、第１の基板２６の他方主面６０ｂと対向するように基板接続用コネクタ６８を介して、所望の各基板の厚み方向の間隔を設けて配置される。また、第２の基板２８の外形の大きさは、第１の基板２６の大きさと略同一である。第２の基板２８の一方主面７２ａには、第１の機能ブロック６２とは異なる所定の機能を実現するための第２の機能ブロック７４が配置されており、配線パターン（図示せず）を有するとともに電子部品素子７６ａ，７６ｂが実装されている。したがって、第１の機能ブロック６２に実装される電子部品素子６４と第２の機能ブロック７４に実装される電子部品素子７６ａ，７６ｂとは、たとえば、第１の基板２６を間に挟むようにして配置されていることから、それぞれ直接対向するように配置されていない。 The second substrate 28 is formed in a rectangular plate shape and includes one main surface 72a and the other main surface 72b. The one main surface 72a of the second substrate 28 is arranged with a desired interval in the thickness direction of each substrate through the substrate connecting connector 68 so as to face the other main surface 60b of the first substrate 26. The The size of the outer shape of the second substrate 28 is substantially the same as the size of the first substrate 26. A second functional block 74 for realizing a predetermined function different from the first functional block 62 is disposed on the one main surface 72a of the second substrate 28, and a wiring pattern (not shown) is provided. The electronic component elements 76a and 76b are mounted. Therefore, the electronic component element 64 mounted on the first functional block 62 and the electronic component elements 76a and 76b mounted on the second functional block 74 are arranged, for example, with the first substrate 26 interposed therebetween. Therefore, they are not arranged so as to face each other directly.
　第２の機能ブロック７４に実装される電子部品素子７６ａ，７６ｂとしては、たとえば、無線ＬＡＮ用ＩＣやＭＣＵ（マイクロコントロールユニット）等の制御回路に関する電子部品素子である。また、外部接続用コネクタ６６が実装される第１の基板２６の他方主面６０ｂの第１の基板２６を挟んで対向する領域であって、第２の基板２８の一方主面７２ａに、電子部品素子７６ａは配置される。換言すると、外部接続用コネクタ６６の実装される面の直下側の領域であって、第２の基板２８の一方主面７２ａに、電子部品素子７６ａが実装される。なお、第２の機能ブロック７４に実装される電子部品素子７６ａは、比較的、高発熱する電子部品素子である。 The electronic component elements 76a and 76b mounted on the second functional block 74 are, for example, electronic component elements related to a control circuit such as a wireless LAN IC or MCU (micro control unit). In addition, the other main surface 60b of the first substrate 26 on which the external connection connector 66 is mounted is an area facing the first substrate 26 with the first main surface 72a of the second substrate 28 facing the one main surface 72a. The component element 76a is arranged. In other words, the electronic component element 76 a is mounted on the one main surface 72 a of the second substrate 28 in a region immediately below the surface on which the external connection connector 66 is mounted. Note that the electronic component element 76a mounted on the second functional block 74 is an electronic component element that generates relatively high heat.
　ここで、たとえば、ＭＣＵに含まれるＲＯＭへの書き込みを実行する際、設定端子における電位による端子設定で、ハード的に書き込みモードと読み込みモードとを設定している。そこで、基板接続用コネクタ６８に、端子設定のために必要な設定端子を引き出しておくことで、基板単品の検査時に、端子設定（電位）を書き込みモードに設定することができ、複合モジュールのコネクタボードでは読み込みモードに設定することができる。 Here, for example, when writing to the ROM included in the MCU, the writing mode and the reading mode are set in hardware by the terminal setting by the potential at the setting terminal. Therefore, by pulling out setting terminals necessary for terminal setting to the board connecting connector 68, the terminal setting (potential) can be set to the writing mode when inspecting the single board, and the connector of the composite module. The board can be set to read mode.
　そして、電子部品素子７６ａの上面（すなわち、電子部品素子７６ａが第２の基板２８に実装される面とは反対側の面）には、放熱用部材７８が配置されている。放熱用部材７８は、電子部品素子７６ａの発熱を吸熱する役割を有するとともに、さらに、第１の基板２６と第２の基板２８に対する緩衝の役割を有する。放熱用部材７８は、第１の基板２６および第２の基板２８との間に配置される。そして、放熱用部材７８において、電子部品素子７６ａの上面側とは反対側の面は、第１の基板２６の他方主面６０ｂに接している。したがって、放熱用部材７８は、第１の基板２６を挟んで外部接続用コネクタ６６の下面と対向するように配置される。また、放熱用部材７８は、少なくとも、電子部品素子７６ａの上面を覆う大きさを有する。放熱用部材７８の材料としては、熱伝導率の高い樹脂が用いられ、たとえば、セラミックや金属系のフィラ含有のシリコン樹脂が好ましい。 A heat radiating member 78 is disposed on the upper surface of the electronic component element 76a (that is, the surface opposite to the surface on which the electronic component element 76a is mounted on the second substrate 28). The heat radiating member 78 has a role of absorbing heat generated by the electronic component element 76 a and further has a role of buffering the first substrate 26 and the second substrate 28. The heat dissipation member 78 is disposed between the first substrate 26 and the second substrate 28. In the heat dissipation member 78, the surface opposite to the upper surface side of the electronic component element 76 a is in contact with the other main surface 60 b of the first substrate 26. Therefore, the heat radiation member 78 is disposed so as to face the lower surface of the external connection connector 66 with the first substrate 26 interposed therebetween. The heat radiation member 78 has a size that covers at least the upper surface of the electronic component element 76a. As a material of the heat radiating member 78, a resin having high thermal conductivity is used. For example, a ceramic or metal-based filler-containing silicon resin is preferable.
　また、第２の基板２８の外周に沿って、端縁部８０が設けられる。第２の基板２８の端縁部８０には、第２のケース２４に形成される第１の基板用突起部５８ａに対応して、たとえば、半円形状の凹部８０ａが複数形成されている。凹部８０ａは、たとえば、端縁部８０において、基板接続用コネクタ６８が設けられる他方端側以外の各辺に３か所設けられる。したがって、凹部８０ａには、第１の基板用突起部５８ａが貫装される。そして、第２の基板２８の一方主面７２ａの端縁部８０は、第１のケース２２の内壁面４０に形成される基板用突起部４２の一方端により押さえるように支持され、第２の基板２８の他方主面７２ｂは、第２のケース２４の内壁面５６に形成される第２の基板用突起部５８ｂの一方端により支えられるように支持される。なお、第２の基板２８の一方主面７２ａの端縁部８０において第１のケース２２の内壁面４０に形成される基板用突起部４２の一方端により押さえるように支持される位置と、第２の基板２８の他方主面７２ｂの端縁部８０ａにおいて第２のケース２４の内壁面５６に形成される第２の基板用突起部５８ｂの一方端により支えられるように支持される位置とは、第２の基板２８を平面視したとき、第２の基板２８においてそれぞれ異なる位置である。 Further, an edge portion 80 is provided along the outer periphery of the second substrate 28. For example, a plurality of semicircular recesses 80 a are formed on the edge portion 80 of the second substrate 28 in correspondence with the first substrate projections 58 a formed on the second case 24. For example, three recesses 80a are provided on each side of the edge 80 other than the other end where the board connecting connector 68 is provided. Therefore, the first substrate projection 58a is inserted into the recess 80a. The end edge portion 80 of the one main surface 72a of the second substrate 28 is supported so as to be pressed by one end of the substrate projection 42 formed on the inner wall surface 40 of the first case 22, and the second substrate 28 is supported. The other main surface 72 b of the substrate 28 is supported so as to be supported by one end of the second substrate projection 58 b formed on the inner wall surface 56 of the second case 24. The position supported by the one end of the substrate projection 42 formed on the inner wall surface 40 of the first case 22 at the edge 80 of the one main surface 72a of the second substrate 28, and the first The position supported at the end edge portion 80a of the other main surface 72b of the second substrate 28 so as to be supported by one end of the second substrate projection 58b formed on the inner wall surface 56 of the second case 24. When the second substrate 28 is viewed in plan, the second substrate 28 has different positions.
　なお、第１の基板２６の他方主面６０ｂと第２の基板２８の一方主面７２ａとの間に、それぞれの基板同士を連結するための基板接続用コネクタ６８を設けることで、基板部１４の熱容量を増加させることができ、さらに、電子部品素子７６ａにおいて発生した熱を、基板接続用コネクタ６８を介して第１の基板２６に向かって伝熱させることができることから、電子部品素子７６ａにおいて発生した熱をより効率よく放熱することができる。 It is to be noted that a substrate connecting connector 68 for connecting the substrates is provided between the other main surface 60b of the first substrate 26 and the one main surface 72a of the second substrate 28, whereby the substrate unit 14 is provided. In addition, since the heat generated in the electronic component element 76a can be transferred toward the first substrate 26 via the board connection connector 68, the electronic component element 76a The generated heat can be radiated more efficiently.
　また、外部接続用コネクタ６６が実装される第１の基板２６の厚みは、第２の基板２８の厚みよりも厚く形成されるので、外部接続用コネクタ６６に差し込む際に掛かる荷重を受容することができる。また、第２の基板２８が薄く形成されることで、配線精度を向上させることができ、加えて、第２の基板２８に形成されるスルーホールを細くすることができる。また、第２の基板２８が薄く形成されることで、複合モジュール１０全体の厚みを薄くすることができることから、複合モジュール１０を小型化することができる。 In addition, since the thickness of the first substrate 26 on which the external connection connector 66 is mounted is formed to be thicker than the thickness of the second substrate 28, the load applied when inserting into the external connection connector 66 is received. Can do. Further, since the second substrate 28 is formed thin, the wiring accuracy can be improved, and in addition, the through hole formed in the second substrate 28 can be thinned. In addition, since the thickness of the entire composite module 10 can be reduced by forming the second substrate 28 thin, the composite module 10 can be reduced in size.
　さらに、放熱用部材７８が設けられることから、電子部品素子７６ａにおいて発生した熱が、放熱用部材７８により吸熱され、さらに、その吸熱された熱が外部接続用コネクタ６６に伝熱することによって、無線ＬＡＮモジュール１０が接続される電子機器に、外部接続用コネクタ６６を介して放熱される。したがって、電子部品素子７６ａにおいて発生した熱を効率よく放熱することができることから、このモジュールに実装される種々の電子部品素子や無線ＬＡＮモジュール１０の特性の劣化等を防止することができる。 Furthermore, since the heat radiating member 78 is provided, the heat generated in the electronic component element 76a is absorbed by the heat radiating member 78, and further, the absorbed heat is transferred to the external connection connector 66. Heat is radiated to the electronic device to which the wireless LAN module 10 is connected via the external connection connector 66. Therefore, since heat generated in the electronic component element 76a can be efficiently radiated, deterioration of characteristics of various electronic component elements and the wireless LAN module 10 mounted on the module can be prevented.
　また、第１の基板２６の他方主面６０ｂの端縁部６８が、第２のケース２４の内壁面４０に３か所形成される第１の基板用突起部５８ａの一方端により支えられるように支持され、また、第２の基板２８の一方主面７２ａの端縁部８０は、第１のケース２２の内壁面４０に形成される基板用突起部４２の一方端により押さえるように支持され、第２の基板２８の他方主面７２ｂは、第２のケース２４の内壁面５６に形成される第２の基板用突起部５８ｂの一方端により支えられるように支持されるので、第１の基板２６および第２の基板２８が、ケース１２の内部において変形しないように支持することができる。 Further, the end edge portion 68 of the other main surface 60 b of the first substrate 26 is supported by one end of the first substrate projection 58 a formed at three locations on the inner wall surface 40 of the second case 24. Further, the end edge portion 80 of the one main surface 72a of the second substrate 28 is supported so as to be pressed by one end of the substrate projection 42 formed on the inner wall surface 40 of the first case 22. The second main surface 72b of the second substrate 28 is supported so as to be supported by one end of the second substrate projection 58b formed on the inner wall surface 56 of the second case 24. The substrate 26 and the second substrate 28 can be supported so as not to be deformed inside the case 12.
　さらに、第２の基板２８の一方主面７２ａの端縁部８０において、第１のケース２２の内壁面４０に形成される基板用突起部４２の一方端により押さえるように支持される位置と、第２の基板２８の他方主面７２ｂは、第２のケース２４の内壁面５６に形成される第２の基板用突起部５８ｂの一方端により支えられるように支持される位置とは、第２の基板２８を平面視したとき、第２の基板２８においてそれぞれ異なる位置であることから、同一の位置で支持する場合と比較したとき、基板を支持するための強度を向上させることができる。 Furthermore, at the end edge portion 80 of the one main surface 72a of the second substrate 28, a position supported so as to be pressed by one end of the substrate projection 42 formed on the inner wall surface 40 of the first case 22; The position where the other main surface 72b of the second substrate 28 is supported so as to be supported by one end of the second substrate projection 58b formed on the inner wall surface 56 of the second case 24 is the second. When the substrate 28 is viewed in plan, the second substrate 28 has different positions, so that the strength for supporting the substrate can be improved as compared with the case where the substrate 28 is supported at the same position.
　さらにまた、第２の基板２８の端縁部８０には、第２のケース２４に形成される第１の基板用突起部５８ａに対応して、たとえば、半円形状の凹部８０ａが、基板接続用コネクタ６８が設けられる他方端側以外の各辺に複数形成されており、この凹部８０ａには、第１の基板用突起部５８ａが貫装されるので、第１の基板用突起部５８ａにより、第２の基板２８の長辺方向および短辺方向の位置が固定されることから、第２の基板２８のケース１２内における搭載精度を向上させることができる。 Furthermore, for example, a semicircular recess 80a is formed on the edge 80 of the second substrate 28 corresponding to the first substrate projection 58a formed on the second case 24. The first board projection 58a is inserted into the recess 80a, and the first board projection 58a is inserted into the recess 80a. Since the positions of the second substrate 28 in the long side direction and the short side direction are fixed, the mounting accuracy of the second substrate 28 in the case 12 can be improved.
　また、外部接続用コネクタ６６のみを変更する必要が生じた場合、制御回路に関する電子部品素子７６ａ，７６ｂ等が実装されている第２の基板２８を含めて変更する必要はなく、外部接続用コネクタ６６が実装されている第１の基板２６のみを変更することで対応することができる。 Further, when it is necessary to change only the external connection connector 66, it is not necessary to change including the second board 28 on which the electronic component elements 76a, 76b and the like related to the control circuit are mounted. This can be dealt with by changing only the first board 26 on which 66 is mounted.
　ボタン部材１６は、たとえば、無線ＬＡＮモジュール１０を使用して無線による接続を行う接続先の機器とのＩＤ認証を行うときの通信開始やリセットを実行するために設けられる。 The button member 16 is provided, for example, to execute communication start or reset when performing ID authentication with a connection destination device that performs wireless connection using the wireless LAN module 10.
　レンズ部材１８は、レンズ１８ａおよびレンズ保持部１８ｂを含む。レンズ１８ａは無線ＬＡＮモジュール１０の動作状態を示すＬＥＤランプ（図示せず）からの光をケース１２の外部へ向けて導出するために設けられる。そして、レンズ保持部１８ｂは、レンズ１８ａを保持するために設けられる。 The lens member 18 includes a lens 18a and a lens holding portion 18b. The lens 18 a is provided to guide light from an LED lamp (not shown) indicating the operation state of the wireless LAN module 10 toward the outside of the case 12. And the lens holding | maintenance part 18b is provided in order to hold | maintain the lens 18a.
　アンテナ２０は、外部の無線ＬＡＮ端末等との間の無線通信を実現するための無線電波を送受信するために設けられる。アンテナ２０は、矩形の板状に形成されており、ボタン用開口部２０ａおよびレンズ用開口部２０ｂが形成されている。アンテナ２０は、たとえば、第２の基板２８の他方主面７２ｂ側に配置される。そして、アンテナ２０がケース１２に収納されたとき、アンテナ２０は、第２のケース２４の底面部４６に接触するように配置される。 The antenna 20 is provided for transmitting and receiving wireless radio waves for realizing wireless communication with an external wireless LAN terminal or the like. The antenna 20 is formed in a rectangular plate shape, and is formed with a button opening 20a and a lens opening 20b. The antenna 20 is disposed, for example, on the other main surface 72b side of the second substrate 28. When the antenna 20 is housed in the case 12, the antenna 20 is disposed so as to contact the bottom surface portion 46 of the second case 24.
　なお、基板部１４は、主に、ケース１２に基板用突起部４２，５８を介して接触しており、また、アンテナ２０が、第２の基板２８の他方主面７２ｂ側に配置されており、かつ、アンテナ２０がケース１２に収納されたとき、アンテナ２０は、第２のケース２４の底面部４６に接触するように配置されているので、電子部品素子７６ａにおいて発生した熱を、ケース１２に放熱することができる。したがって、無線ＬＡＮモジュール１０の内部において発生した熱をより効率よく放熱することができる。 The substrate portion 14 is mainly in contact with the case 12 via the substrate protrusions 42 and 58, and the antenna 20 is disposed on the other main surface 72b side of the second substrate 28. When the antenna 20 is housed in the case 12, the antenna 20 is disposed so as to contact the bottom surface portion 46 of the second case 24, so that the heat generated in the electronic component element 76a is transferred to the case 12. Can dissipate heat. Therefore, the heat generated inside the wireless LAN module 10 can be radiated more efficiently.
　本発明にかかる無線ＬＡＮモジュール１０によれば、基板部１４が、第１の基板２６には第１の機能ブロック６２を配置しており、第１の基板２６から離間して、第２の基板２８には第２の機能ブロック７４を配置しているので、それぞれの機能ブロック間における信号等の干渉を低減することができる。また、第１の機能ブロック６２と第２の機能ブロック７４とは、直接対向しないようにそれぞれが配置されているので、前述の干渉を低減する効果をより向上することができる。したがって、無線ＬＡＮモジュール１０における電気特性の劣化を防止することができる。 According to the wireless LAN module 10 according to the present invention, the substrate unit 14 includes the first functional block 62 disposed on the first substrate 26, and is separated from the first substrate 26, and the second substrate Since the second functional block 74 is arranged at 28, interference of signals and the like between the respective functional blocks can be reduced. Further, since the first functional block 62 and the second functional block 74 are arranged so as not to face each other directly, the effect of reducing the above-described interference can be further improved. Therefore, it is possible to prevent deterioration of electrical characteristics in the wireless LAN module 10.
　また、本発明にかかる無線ＬＡＮモジュール１０によれば、第１の機能ブロック６２には電源回路に関する電子部品素子６４、たとえば、ＤＣ－ＤＣコンバータ等のコイル部品が含まれているので、そのコイルで発生する磁界により他の機能ブロックの電子部品素子と結合する可能性があるところ、第１の基板２６がケース１２に収納されたとき、第１のケース２２の上面部３２と第１の機能ブロック６２に実装される電源回路に関する電子部品素子６４等とが対向するように配置されるので、ケース１２の内部に収納される電子部品素子との結合を抑制することができる。 Further, according to the wireless LAN module 10 of the present invention, the first functional block 62 includes the electronic component element 64 relating to the power supply circuit, for example, a coil component such as a DC-DC converter. Where there is a possibility of coupling with the electronic component elements of other functional blocks due to the generated magnetic field, when the first substrate 26 is housed in the case 12, the upper surface portion 32 of the first case 22 and the first functional block. Since the electronic component element 64 and the like related to the power supply circuit mounted on 62 are arranged so as to face each other, the coupling with the electronic component element housed in the case 12 can be suppressed.
　さらに、本発明にかかる無線ＬＡＮモジュール１０によれば、第１の基板２６の一方主面６０ａの一方端部側であって、第１の機能ブロック６２に実装される電源回路に関する電子部品素子６４等が実装される領域を除く領域において、外部接続用コネクタ６６が実装されているので、この外部接続用コネクタ６６が、第１の機能ブロック６２には電源回路に関する電子部品素子６４、たとえば、ＤＣ－ＤＣコンバータ等のコイル部品で発生する磁界の広がりを抑制することから、機能ブロックの間における干渉を抑制する効果をさらに向上することができる。 Furthermore, according to the wireless LAN module 10 of the present invention, the electronic component element 64 relating to the power supply circuit mounted on the first functional block 62 on the one end side of the one main surface 60 a of the first substrate 26. Since the external connection connector 66 is mounted in a region excluding the region where the circuit board is mounted, the external connection connector 66 is connected to the first functional block 62 in the electronic component element 64 relating to the power supply circuit, for example, DC -Since the spread of the magnetic field generated in the coil component such as the DC converter is suppressed, the effect of suppressing the interference between the functional blocks can be further improved.
　次に、本発明にかかる無線ＬＡＮモジュールの第２の実施の形態について説明する。図４は、この発明にかかる無線ＬＡＮモジュールの第２の実施の形態についての断面模式図である。 Next, a second embodiment of the wireless LAN module according to the present invention will be described. FIG. 4 is a schematic cross-sectional view of the second embodiment of the wireless LAN module according to the present invention.
　図４に記載の無線ＬＡＮモジュール１１０は、少なくとも、ケース１１２と、基板部１１４とを備える。 4 includes at least a case 112 and a substrate unit 114. The wireless LAN module 110 illustrated in FIG.
　ケース１１２は、少なくとも基板部１１４を収納するために設けられる。ここで、ケース１１２は、第１の実施の形態におけるケース１２と同様に構成されているので、説明を省略する。また、基板部１１４を支持するための基板用突起部についても説明を省略する。 The case 112 is provided to accommodate at least the substrate portion 114. Here, the case 112 is configured in the same manner as the case 12 in the first embodiment, and thus description thereof is omitted. Further, the description of the substrate projections for supporting the substrate unit 114 is also omitted.
　基板部１１４は、第１の基板１２６および第２の基板１２８を含む。第１の基板１２６および第２の基板１２８は、たとえば、プリント基板等により形成される。また、第１の基板１２６の厚みは、第２の基板１２８の厚みよりも厚く形成される。 The substrate unit 114 includes a first substrate 126 and a second substrate 128. The first substrate 126 and the second substrate 128 are formed of, for example, a printed circuit board. Further, the thickness of the first substrate 126 is formed to be thicker than the thickness of the second substrate 128.
　第１の基板１２６は、矩形の板状に形成されており、一方主面６０ａおよび他方主面６０ｂを含む。第１の基板１２６の一方主面６０ａには、所定の機能を実現するための第１の機能ブロックが配置されている。第１の機能ブロックには、面状に形成されるグランド電極８２や配線パターン（図示せず）を有するとともに電子部品素子１６４が実装されている。第１の機能ブロックに実装される電子部品素子１６４としては、ＤＣ－ＤＣコンバータ等のコイル部品等である。 The first substrate 126 is formed in a rectangular plate shape and includes one main surface 60a and the other main surface 60b. On one main surface 60a of the first substrate 126, a first functional block for realizing a predetermined function is disposed. The first functional block has a ground electrode 82 and a wiring pattern (not shown) formed in a planar shape, and an electronic component element 164 is mounted thereon. The electronic component element 164 mounted on the first functional block is a coil component such as a DC-DC converter.
　さらに、第１の基板１２６の一方主面６０ａの一方端部側であって、第１の機能ブロックに実装される電子部品素子６４が実装される領域を除く領域において、外部接続用コネクタ１６６が実装される。外部接続用コネクタ１６６は、たとえば、５ピンあるいは８ピンのＵＳＢコネクタが用いられる。また、第１の基板１２６の他方主面６０ｂとの他方端側には、第１の基板２６と第２の基板２８とにおける所望の各基板の厚み方向の間隔を設けて機械的に接続するために、基板接続用コネクタ１６８が設けられる。 Further, the external connection connector 166 is provided in a region excluding the region where the electronic component element 64 mounted on the first functional block is mounted on one end side of the one main surface 60a of the first substrate 126. Implemented. As the external connection connector 166, for example, a 5-pin or 8-pin USB connector is used. Further, the other end side of the first substrate 126 with respect to the other main surface 60b is mechanically connected to the first substrate 26 and the second substrate 28 with a desired interval in the thickness direction of each substrate. For this purpose, a board connecting connector 168 is provided.
　第２の基板１２８は、矩形の板状に形成されており、一方主面７２ａおよび他方主面７２ｂを含む。第２の基板１２８の一方主面７２ａは、第１の基板１２６の他方主面６０ｂと対向するように基板接続用コネクタ１６８を介して、所望の各基板の厚み方向の間隔を設けて配置される。また、第２の基板１２８の外形の大きさは、第１の基板１２８の大きさと略同一である。第２の基板１２８の一方主面７２ａには、第１の機能ブロックとは異なる所定の機能を実現するための第２の機能ブロックが配置されており、面状に形成されるグランド電極８４や配線パターン（図示せず）を有するとともに電子部品素子１７６ａ，１７６ｂが実装されている。 The second substrate 128 is formed in a rectangular plate shape and includes one main surface 72a and the other main surface 72b. The one main surface 72a of the second substrate 128 is arranged with a desired interval in the thickness direction of each substrate through the substrate connecting connector 168 so as to face the other main surface 60b of the first substrate 126. The The size of the outer shape of the second substrate 128 is substantially the same as the size of the first substrate 128. A second functional block for realizing a predetermined function different from the first functional block is arranged on the one main surface 72a of the second substrate 128, and the ground electrode 84 formed in a planar shape or the like The electronic component elements 176a and 176b are mounted while having a wiring pattern (not shown).
　第２の機能ブロックに実装される電子部品素子１７６ａとしては、たとえば、高周波機能ブロックに含まれるフィルタを構成するインダクタやコンデンサ等、あるいは無線ＬＡＮ用ＩＣ等の電子部品素子である。また、第２の機能ブロックに実装される電子部品素子１７６ｂとしては、比較的、高発熱する電子部品である。 The electronic component element 176a mounted on the second functional block is, for example, an electronic component element such as an inductor or a capacitor constituting a filter included in the high frequency functional block, or a wireless LAN IC. Further, the electronic component element 176b mounted on the second functional block is an electronic component that generates relatively high heat.
　そして、電子部品素子１７６ｂの上面（すなわち、電子部品素子１７６ｂが第２の基板１２８に実装される面と反対側の面）には、放熱用部材１７８が配置されている。なお、放熱用部材１７８は、第１の実施の形態における放熱用部材７８と略同一であるので、説明を省略する。 And, on the upper surface of the electronic component element 176b (that is, the surface opposite to the surface on which the electronic component element 176b is mounted on the second substrate 128), a heat dissipation member 178 is disposed. The heat radiating member 178 is substantially the same as the heat radiating member 78 in the first embodiment, and a description thereof will be omitted.
　本発明にかかる無線ＬＡＮモジュール１１０によれば、第１の基板１２６の一方主面６０ａにグランド電極８２を設けており、さらに、第２の基板１２８の一方主面７２ａにグランド電極８４を設けているので、グランド電極８２，８４に囲まれる部分と、それ以外の部分との機能ブロック間の干渉を低減することができる。したがって、無線ＬＡＮモジュール１１０における電気特性の劣化をより防止することができる。 According to the wireless LAN module 110 of the present invention, the ground electrode 82 is provided on the one main surface 60a of the first substrate 126, and the ground electrode 84 is provided on the one main surface 72a of the second substrate 128. Therefore, interference between functional blocks between the portion surrounded by the ground electrodes 82 and 84 and the other portions can be reduced. Therefore, it is possible to further prevent deterioration of electrical characteristics in the wireless LAN module 110.
　なお、上述の実施の形態にかかる無線ＬＡＮモジュールでは、第１の基板および第２の基板がそれぞれ対向するように配置されているが、これに限られるものではなく、第１の基板および第２の基板が縦列となるように配置されるようにしてもよい。 In the wireless LAN module according to the above-described embodiment, the first substrate and the second substrate are disposed so as to face each other, but the present invention is not limited to this, and the first substrate and the second substrate are not limited thereto. The substrates may be arranged in a column.
　また、上述の実施の形態にかかる無線ＬＡＮモジュールでは、第１の基板における第１の機能ブロックには電源回路が配置され、第２の基板における第２の機能ブロックにはデジタル回路が配置されているが、これに限られるものではなく、種々変更されてもよい。 In the wireless LAN module according to the above-described embodiment, a power circuit is arranged in the first functional block on the first substrate, and a digital circuit is arranged in the second functional block on the second substrate. However, the present invention is not limited to this, and various changes may be made.
　また、上述の実施の形態にかかる無線ＬＡＮモジュールでは、電子部品素子の上面に放熱用部材が配置されているがこれに限るものではなく、放熱用部材は配置されていなくてもよい。 Further, in the wireless LAN module according to the above-described embodiment, the heat radiating member is disposed on the upper surface of the electronic component element. However, the present invention is not limited to this, and the heat radiating member may not be disposed.
　さらにまた、上述の実施の形態にかかる無線ＬＡＮモジュールでは、基板部を支持するためにケースには基板用突起部が形成されているが、これに限るものではなく、他の構成により基板部を支持するようにしてもよい。したがって、上述の実施の形態にかかる無線ＬＡＮモジュールにおける基板部の第１の基板および第２の基板の端縁部には、基板用突起部を貫装するための凹部が形成されているが、形成されていなくてもよい。 Furthermore, in the wireless LAN module according to the above-described embodiment, the substrate protrusion is formed on the case in order to support the substrate portion. However, the present invention is not limited to this, and the substrate portion may be formed by another configuration. You may make it support. Therefore, the first substrate and the second substrate of the substrate portion in the wireless LAN module according to the above-described embodiment have recesses for penetrating the substrate protrusions on the edge portions. It may not be formed.
　また、上述の実施の形態にかかる無線ＬＡＮモジュールでは、第１の基板が第２の基板よりも厚く形成されているが、これに限るものではなく、第１の基板の厚みが第２の基板の厚みと略同一の厚みにされてもよく、第２の基板が第１の基板の厚みよりも厚く形成されてもよい。 In the wireless LAN module according to the above-described embodiment, the first substrate is formed thicker than the second substrate. However, the present invention is not limited to this, and the thickness of the first substrate is the second substrate. The second substrate may be formed to be thicker than the thickness of the first substrate.
　さらに、上述の実施の形態にかかる無線ＬＡＮモジュールでは、グランド電極は、第１の基板または第２の基板の一方主面に形成されているが、これに限られるものではなく、第１の基板または第２の基板の内部に形成されてもよい。 Furthermore, in the wireless LAN module according to the above-described embodiment, the ground electrode is formed on one main surface of the first substrate or the second substrate. However, the present invention is not limited to this, and the first substrate is not limited thereto. Alternatively, it may be formed inside the second substrate.
　さらに、上述の実施の形態にかかる無線ＬＡＮモジュールでは、外部接続用コネクタは第１の基板に配置されているが、これに限られるものではない。 Furthermore, in the wireless LAN module according to the above-described embodiment, the external connection connector is disposed on the first board, but the present invention is not limited to this.
　また、第１の機能ブロックを構成する電子部品素子と第２の機能ブロックを構成する電子部品素子とは、第１の基板及び第２の基板の両方を介して対向して配置されても構わない。複数の基板を介して各機能ブロックを離間することにより、両ブロック間における信号の干渉をさらに低減することができる。 In addition, the electronic component element constituting the first functional block and the electronic component element constituting the second functional block may be arranged to face each other via both the first substrate and the second substrate. Absent. By separating each functional block through a plurality of substrates, signal interference between both blocks can be further reduced.
　この発明にかかる複合モジュールは、家電製品やＡＶ機器等である電子機器に接続して、それら電子機器に対してさらに所望の機能を追加することを可能とするような用途に適用できる。 The composite module according to the present invention can be applied to an application that allows a desired function to be further added to an electronic device such as a home appliance or an AV device.
　１０、１１０　無線ＬＡＮモジュール
　１２　ケース
　１４、１１４　基板部
　１６　ボタン部材
　１８　レンズ部材
　１８ａ　レンズ
　１８ｂ　レンズ保持部
　２０　アンテナ
　２０ａ　ボタン用開口部
　２０ｂ　レンズ用開口部
　２２　第１のケース
　２４　第２のケース
　２６、１２６　第１の基板
　２８、１２８　第２の基板
　３０　側面部
　３２　上面部
　３２ａ　コネクタ用開口部
　３２ｂ　筒状部
　３４ａ　一方側面
　３４ｂ　他方側面
　３６　開口部
　３６ａ　溝部
　３８　収納部
　４０　内壁面
　４２　基板用突起部
　４４　側面部
　４６　底面部
　４６ａ　ボタン用開口部
　４６ｂ　レンズ用開口部
　４８ａ　一方側面
　４８ｂ　他方側面
　５０ａ　一方端面
　５０ｂ　他方端面
　５２　開口部
　５２ａ　突縁部
　５４　収納部
　５６　内壁面
　５８　基板用突起部
　５８ａ　第１の基板用突起部
　５８ｂ　第２の基板用突起部
　６０ａ　一方主面
　６０ｂ　他方主面
　６２　第１の機能ブロック
　６４、１６４　電子部品素子
　６６、１６６　外部接続用コネクタ
　６８、１６８　基板接続用コネクタ
　７０　端縁部
　７０ａ　凹部
　７２ａ　一方主面
　７２ｂ　他方主面
　７４　第２の機能ブロック
　７６ａ、７６ｂ、１７６ａ、１７６ｂ　電子部品素子
　７８、１７８　放熱用部材
　８０　端縁部
　８０ａ　凹部
　８２、８４　グランド電極 10, 110 Wireless LAN module 12 Case 14, 114 Substrate part 16 Button member 18 Lens member 18a Lens 18b Lens holding part 20 Antenna 20a Button opening 20b Lens opening 22 First case 24 Second case 26, 126 First substrate 28, 128 Second substrate 30 Side surface portion 32 Upper surface portion 32a Connector opening portion 32b Tubular portion 34a One side surface 34b The other side surface 36 Opening portion 36a Groove portion 38 Storage portion 40 Inner wall surface 42 Substrate projection portion 44 Side surface Portion 46 bottom surface portion 46a button opening portion 46b lens opening portion 48a one side surface 48b other side surface 50a one end surface 50b other end surface 52 opening portion 52a projecting edge portion 54 storage portion 56 inner wall surface 58 substrate projection portion 58a for the first substrate Projection 58b Second substrate projection 60a Direction main surface 60b other main surface 62 first functional block 64, 164 electronic component element 66, 166 external connection connector 68, 168 board connection connector 70 edge 70a recess 72a one main surface 72b other main surface 74 second Functional block 76a, 76b, 176a, 176b Electronic component element 78, 178 Heat radiation member 80 Edge 80a Recess 82, 84 Ground electrode

Claims (6)

  1. 　所定の機能を実現するための電子部品素子を含む第１の機能ブロックが配置される第１の基板と、
    　前記第１の機能ブロックとは異なる所定の機能を実現するための電子部品素子を含む第２の機能ブロックが配置される第２の基板と、
    　前記第１の基板および前記第２の基板を収納するためのケースと、
    を含む、複合モジュール。     A first substrate on which a first functional block including an electronic component element for realizing a predetermined function is disposed;
    A second substrate on which a second functional block including an electronic component element for realizing a predetermined function different from the first functional block is disposed;
    A case for housing the first substrate and the second substrate;
    A composite module containing
  2. 　前記第１の基板の他方主面と前記第２の基板の一方主面とが対向するように配置されることを特徴とする、請求項１に記載の複合モジュール。 2. The composite module according to claim 1, wherein the other main surface of the first substrate and the one main surface of the second substrate are arranged to face each other.
  3. 　前記第１の機能ブロックを構成する電子部品素子と前記第２の機能ブロックを構成する電子部品素子とが前記第１の基板または前記第２の基板を介して対向して配置されることを特徴とする、請求項２に記載の複合モジュール。 The electronic component element constituting the first functional block and the electronic component element constituting the second functional block are arranged to face each other with the first substrate or the second substrate interposed therebetween. The composite module according to claim 2.
  4. 　前記第１の基板の一方主面または内部、および前記第２の基板の一方主面または内部に面状のグランド電極がそれぞれ設けられることを特徴とする、請求項１ないし請求項３のいずれかに記載の複合モジュール。 4. The planar ground electrode is provided on one main surface or inside of the first substrate and on one main surface or inside of the second substrate, respectively. 5. Compound module described in 1.
  5. 　前記第１の機能ブロックは電源機能ブロックであり、前記第１の基板におけるケースに対向する主面に電源機能ブロックを構成する電子部品素子が配置されることを特徴とする、請求項１ないし請求項４のいずれかに記載の複合モジュール。 The first functional block is a power function block, and an electronic component element constituting the power function block is disposed on a main surface of the first substrate facing the case. Item 5. The composite module according to Item 4.
  6. 　前記電源機能ブロックを構成する電子部品素子は、前記第１の基板におけるケースに対向する主面に実装され、前記電子部品素子が実装される領域とは異なる領域に外部接続用コネクタが配置されることを特徴とする、請求項５に記載の複合モジュール。 The electronic component elements constituting the power function block are mounted on the main surface of the first substrate facing the case, and an external connection connector is disposed in a region different from the region where the electronic component elements are mounted. The composite module according to claim 5, wherein:
PCT/JP2013/062521 2012-05-22 2013-04-30 Composite module WO2013175942A1 (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017034588A (en) * 2015-08-05 2017-02-09 重之 谷輪 Multimedia terminal unit
JP2018113239A (en) * 2017-01-13 2018-07-19 パナソニックＩｐマネジメント株式会社 Wiring accessory
WO2018131463A1 (en) * 2017-01-13 2018-07-19 パナソニックＩｐマネジメント株式会社 Wiring implement
JP2020161501A (en) * 2020-06-29 2020-10-01 パナソニックＩｐマネジメント株式会社 Wiring accessory

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JPH0997993A (en) * 1995-09-29 1997-04-08 Matsushita Electric Ind Co Ltd High-frequency apparatus
JP2002353842A (en) * 2001-05-29 2002-12-06 Matsushita Electric Works Ltd Wireless module for mobile terminal
JP2005065145A (en) * 2003-08-20 2005-03-10 Sharp Corp Radio communication unit
JP2009170843A (en) * 2008-01-21 2009-07-30 Mitsubishi Electric Corp High-frequency module

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Publication number Priority date Publication date Assignee Title
JPH0997993A (en) * 1995-09-29 1997-04-08 Matsushita Electric Ind Co Ltd High-frequency apparatus
JP2002353842A (en) * 2001-05-29 2002-12-06 Matsushita Electric Works Ltd Wireless module for mobile terminal
JP2005065145A (en) * 2003-08-20 2005-03-10 Sharp Corp Radio communication unit
JP2009170843A (en) * 2008-01-21 2009-07-30 Mitsubishi Electric Corp High-frequency module

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017034588A (en) * 2015-08-05 2017-02-09 重之 谷輪 Multimedia terminal unit
JP2018113239A (en) * 2017-01-13 2018-07-19 パナソニックＩｐマネジメント株式会社 Wiring accessory
WO2018131463A1 (en) * 2017-01-13 2018-07-19 パナソニックＩｐマネジメント株式会社 Wiring implement
WO2018131464A1 (en) * 2017-01-13 2018-07-19 パナソニックＩｐマネジメント株式会社 Wiring accessory
JP2020161501A (en) * 2020-06-29 2020-10-01 パナソニックＩｐマネジメント株式会社 Wiring accessory

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