WO2013153371A1 - Procédé de focalisation laser et appareil équipé d'un système de commande pour la correction de l'aberration optique - Google Patents

Procédé de focalisation laser et appareil équipé d'un système de commande pour la correction de l'aberration optique Download PDF

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Publication number
WO2013153371A1
WO2013153371A1 PCT/GB2013/050908 GB2013050908W WO2013153371A1 WO 2013153371 A1 WO2013153371 A1 WO 2013153371A1 GB 2013050908 W GB2013050908 W GB 2013050908W WO 2013153371 A1 WO2013153371 A1 WO 2013153371A1
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sample
laser
phase pattern
edge
fabrication
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PCT/GB2013/050908
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English (en)
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Patrick SALTER
Martin Booth
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Isis Innovation Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/355—Texturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/359—Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming

Definitions

  • This invention relates to laser focusing techniques.
  • Laser focusing is for example used in laser fabrication systems and also in analytical apparatus such as laser microscopes.
  • Ultrafast laser material processing permits three dimensional fabrication inside transparent substrates.
  • the non-linearity of any absorption coupled with the ultrashort nature of the pulse allows the generation of embedded features confined to the focal volume, without any damage to surrounding regions or the surface.
  • the technique is of increasing interest in the fabrication of a range of devices, such as artificial bandgap materials, microfluidic devices, metallic nanostructures and photonic waveguide circuits.
  • the fidelity of fabrication depends strongly on the quality of the focal spot. In many cases, the quality of the focus is impaired by aberrations.
  • a common problem is a mismatch between the refractive indices of the processed material and the objective immersion medium, generating a spherical aberration to the focal spot. It has been shown that it is possible to compensate such aberrations and restore diffraction limited performance using adaptive optical elements, both in microscopy and more recently in laser microfabrication.
  • the substrate is often translated perpendicular to the optical axis to create the guiding structure. Near the edge of the substrate, the fabrication efficiency decreases and the effect eventually disappears since a portion of the focussed light passes through the side facet of the substrate.
  • Figure 1 shows Ray trace diagrams showing the refraction of rays focussed through the top and side surfaces of a substrate with differing refractive index to that of the lens immersion medium.
  • the sequence of ray trace diagrams in Figure 1 illustrates the effect for a nominal point of focus moving nearer to the edge of the substrate.
  • the diagrams provide a view of a plane containing the optical axis of the lens and perpendicular to the focal plane. It can be seen that the focal splitting between the different rays increases as the edge is approached. Refraction of rays from just a single surface causes focal distortion, but refraction from both the side and top surfaces leads to an additional focal splitting. Thus any fabrication close to the side surface is severely impaired.
  • the structure needs to be constructed all the way to the side surface in order to achieve efficient coupling of light in and out of the waveguide chip by external optical fibre.
  • Laser fabrication and laser imaging systems each comprise "laser focusing" systems, and this invention applies generally to such systems.
  • the invention provides a system and method as defined in the independent claims.
  • a laser focusing system comprising:
  • a spatial light modulator for controlling a phase pattern of the laser output
  • an optical system for providing the phase pattern controlled laser output to a sample in which a structure is to be fabricated
  • a translation stage for controlling the position of the sample relative to the phase pattern controlled laser output
  • a control system for controlling the phase pattern applied by the spatial light modulator in dependence on the position of the sample relative to the phase pattern controlled laser output, thereby to provide correction for optical aberration resulting from a refractive index boundary at an edge of the sample, which edge has a lateral distance to the laser output which varies as the relative position of the sample is varied.
  • This system enables focusing right up to a lateral edge of a sample - i.e. an edge which extends in a plane aligned with the optical axis of the incident laser fabrication beam.
  • the edge need not be perfectly parallel to the optical axis, and any shape can be modelled.
  • the sample does not have to have perpendicular sides and top surface as in the examples below.
  • phase pattern By controlling the phase pattern, a desired focal intensity distribution is determined for light focused into the sample (which is a transparent medium) near the edge of the sample.
  • the phase pattern can split the pupil function with a phase discontinuity, and this enables the aberrations introduced for rays focused both through the top and side facets of the sample to be compensated.
  • the laser focusing system can be a laser fabrication system.
  • the system can for example be used within a femtosecond microfabrication system, for example for fused silica. This system allows controlled sub-surface fabrication of a transparent sample right to the edge of the substrate, which, for example, is of particular interest for the manufacture of waveguides and photonic crystals.
  • the spatial light modulator functions to change the propagation direction of light, and functions in a similar manner to a blazed grating, in that there is constructive interference of all light in a particular direction from the surface normal, which has a transverse component in the same direction as the periodicity.
  • the control system can further provide correction for optical aberration resulting from a refractive index boundary at a top surface of the sample perpendicular to the laser illumination direction. This type of aberration correction is already known.
  • the translation stage preferably provides a position feedback signal to the control system to provide the information concerning the position of the sample relative to the phase pattern controlled laser output.
  • the degree of overlap of the laser fabrication beam with the sample edge varies as the relative position is changed, and a feedback control ensures correct adaptation of the phase pattern.
  • the spatial light modulator can comprise a phase only reflective liquid crystal spatial light modulator.
  • a high resolution deformable mirror device is a possible alternative, and an amplitude only LC spatial light modulator may also be used.
  • a detection system can also be used for detecting plasma emission intensity, and derive a quality feedback control signal indicative of a fabrication quality. This quality feedback signal can also be provided to the control system. This provides a second feedback control approach, based on the quality of fabrication at the intended fabrication site within the sample.
  • the system can be a waveguide writing system, and the structure is to be fabricated comprises a waveguide to be fabricated fully to the lateral edge of the sample. It can be used for other structures such as gratings and photonic crystals.
  • the invention also provides a laser focusing method comprising:
  • phase pattern controlled laser output to a sample in which a structure is to be fabricated
  • phase pattern controlled laser output controlling the phase pattern applied by the spatial light modulator during fabrication in dependence on the position of the sample relative to the phase pattern controlled laser output, thereby to provide correction for optical aberration resulting from a refractive index boundary at an edge of the sample, which edge has a lateral distance to the laser output which varies as the relative position of the sample is varied.
  • Figure 1 shows ray diagrams showing how a laser fabrication signal overlaps a side edge of a sample when fabrication is near the sample edge, and shows how defocusing arises;
  • Figure 2 shows parameters used in a mathematical analysis
  • Figure 3 shows example phase patterns
  • Figure 4 shows an example of a fabrication system of the invention
  • Figure 5 shows measurements of plasma emission from the focal volume for use as a feedback parameter
  • Figure 6 is a first diagram to show how the aberration correction of the invention improves the quality of fabricated structures
  • Figure 7 is a second diagram to show how the aberration correction of the invention improves the quality of fabricated tracks up to an edge of a sample; and Figure 8 shows three common examples of sample edge to which the invention can be applied.
  • the invention provides a laser fabrication system in which a phase pattern of a laser fabrication signal is controlled to provide correction for optical aberration resulting from a refractive index boundary at a lateral edge of the sample.
  • the lateral edge has distance to the laser signal which varies as the structure is fabricated, giving different degrees of overlap of the laser fabrication signal over the edge of the sample. This aberration correction enables focusing of a laser output right up to the edge of a sample.
  • Figure 2 shows how light is focused to a point F at a depth d beneath the upper surface T of a substrate, and a distance g from the side facet ⁇ .
  • the CC divides the focusing cone into rays which pass through and are refracted by the top surface T and the side facet ⁇ .
  • the line OPF is the optical axis for the focusing lens, while the perpendicular line O'QF represents the optical axis for a virtual pupil to describe rays passing through the side facet.
  • Light is shown as focussed into a substrate of refractive index (Rl) n 2 from an immersion medium of Rl n-i .
  • the substrate is bounded by two planes: T (the top surface) with normal parallel to the z axis and ⁇ (the side surface) normal to the x axis.
  • T the top surface
  • ⁇ the side surface
  • the line of intersection of the two planes is parallel to the y axis.
  • the optic axis OPF is parallel to the z axis.
  • F is the geometric, aberration free point of focus within the substrate
  • P is the intersection of the optic axis with the top surface T.
  • the line O'QF is along the x axis and the point Q designates the intersection of this line with the side surface ⁇ .
  • the focussing depth PF is d, and the distance from the edge of the substrate QF is g.
  • the intersection of the focussing cone with the top surface T is a circular segment bounded by the chord CC, while the intersection with the side surface ⁇ is a hyperbolic segment likewise terminated by the chord CC.
  • phase aberrations Such aberrations will arise due to refraction at the substrate surfaces, caused by the mismatch in Rl between the sample and immersion media.
  • the spherical aberration is the same as for the corresponding ray focussing through an Rl mismatch without the edge.
  • the appropriate phase function ⁇ ( ⁇ , ⁇ ) which should be applied to the pupil in order to cancel such an aberration is given by:
  • ⁇ ( , ⁇ ) ⁇ - ⁇ dNA i cosec1 ⁇ 42 ⁇ p 2 ⁇ cosec1 ⁇ 4j ⁇ p 2 ) (4)
  • Equation (3) gives the boundary CC in the pupil
  • Equations (4) and (1 1 ) give the respective corrective phase distributions.
  • SLM liquid crystal phase-only spatial light modulator
  • a background phase is added to the calculated phase distributions, which takes into account any system aberrations including the initial flatness correction for the SLM. It should be noted that often when an adaptive optics correction for spherical aberration is used, either in microscopy or microfabrication, it is common to remove the defocus element of Equation (4). In doing so, the focal distortion due to the Rl mismatch is removed, but the focal depth is not restored to the geometric focus. However, in this situation, it is important to retain the full form of Equation (4), such that rays intercepting T and ⁇ overlap at the geometric focus.
  • Figure 4 shows a schematic of an experimental layout. This is one example of a possible setup to demonstrate the practical benefits of the invention. Other experimental setups are of course possible, and the invention can be implemented in many different ways in a fabrication environment.
  • Figure 4 shows not only an experimental layout but also an example of the components of a laser fabrication system in accordance with the invention.
  • the pulses are emitted from a regeneratively amplified titanium sapphire laser 10 (Solstice, Newport/Spectra Physics, pulse length 150 fs, repetition rate 1 kHz, central wavelength 790 nm) and they are attenuated using a rotatable half- wave plate 12 and a Glan-Laser polariser 14.
  • the expanded beam is directed onto a reflective liquid crystal phase-only SLM 16 (X10468-02, Hamamatsu Photonics).
  • the output from the SLM is reflected by mirror 17 to a path directed to the sample.
  • the SLM and the pupil plane of the objective 22 are imaged onto one another by a 4f system, composed of two achromatic doublet lenses 18.
  • a dichroic reflector 19 reflects the fabrication laser light to the sample but allows other wavelengths to pass, such as LED light for sample analysis as well as emitted plasma as discussed below.
  • a 500pm diameter pinhole 20 on an adjustable mount is inserted into the Fourier plane of the SLM and initially positioned to transmit all light incident on the SLM.
  • the beam fully illuminates the back aperture of a Leitz NPI 50x objective 22 with a 0.85 numerical aperture.
  • the substrate is mounted on a three axis air- bearing translation stage 24.
  • an LED illuminated transmission brightfield microscope can be used to illuminate the specimen during fabrication.
  • the LED is shown as 25.
  • Plasma emission measurements can be used as part of a feedback mechanism. When an ultrafast laser is focused into a transparent material, a plasma is generated within the focal volume where there is structural modification. The plasma is generated by multiphoton absorption and avalanche effects and does not necessarily indicate the destruction of the surrounding material matrix.
  • the plasma emission is mostly isotropic and unpolarized.
  • the plasma emission intensity is an appropriate feedback metric for performing aberration correction using adaptive optical elements during fabrication.
  • the plasma emission intensity is greatest when any aberrations are minimised producing the smallest fabricated features for a given input pulse energy.
  • Measurements of the focal plasma emission intensity can be used to modify the phase pattern displayed on the SLM and minimise aberrations generated when focusing near the edge of a transparent substrate.
  • a CCD 26 is used for this purpose.
  • the same CCD is used to analyse the plasma emissions and the LED light.
  • the plasma is a supercontinuum (containing all wavelengths over a broad spectrum).
  • the samples employed in the test procedure were high purity fused silica
  • the sample was then translated to a nominal depth d n0 m and distance from the edge facet g n0 m- Using the values of g n0 m and d n0 m as a starting point, various phase patterns were applied to the SLM and the sample was irradiated with a continuous train of pulses with energy below that for void formation. To measure the plasma emission intensity, the LED illumination was switched off and the focal volume imaged onto the CCD. A typical image is shown in the inset of Figure 5(b) described below.
  • Figure 5 shows measurements of the net intensity of plasma emission from the focal volume when focussing at a nominal depth of 50pm in fused silica, at nominal distances of 5 m, 10 m and 15 m from the edge of the substrate.
  • the sample was kept stationary and the SLM phase pattern altered while the plasma intensity was monitored.
  • Figure 5(a) shows that there is a sharp peak in the plasma emission intensity, for values of g close to g n0 m- This point corresponds to rays passing through both the top surface and side facet focussing to a common point, and hence generating the maximum plasma at the focus. This should also lead to fabrication of the tightest features at the lowest pulse energies. High repeatability in the peak position and relatively low error across the measurements sets ( ⁇ 2%) indicate the reliability of the technique.
  • the plasma emission measurements exhibit the success of the edge correction technique. The same results are obtained by observing results of the improvement in fabrication.
  • Figure 6 shows images of voids fabricated at a depth of 50pm in fused silica at a distance of 10pm from the edge of the substrate.
  • Voids were generated firstly with aberration correction for rays passing through both the top and side surfaces ("Edge corrected”), and subsequently with aberration correction purely for the Rl mismatch at the top surface neglecting the edge of the substrate ("No edge correction").
  • the translation speed was 0.5pm/s perpendicular to the edge at a depth of 50pm.
  • Feedback from the stages was used to automatically update the amount of edge correction applied to phase patterns displayed on the SLM.
  • the emission from the laser was a continuous pulse train (repetition rate 1 kHz) and the power kept constant.
  • the results are shown in Figure 7(a). Tracks (i) and (iii) were written with automatically updated edge correction while the SLM phase pattern was kept constant during fabrication of track (ii). It can be seen that the edge correction has a beneficial effect in maintaining fabrication up to the side surface for (i) and (iii) in contrast to track (ii). However, it is clear that the degree of fabrication is reduced as the focus nears the side surface.
  • the laser power is generally controlled in the current experimental layout using a combination of a half waveplate and polariser immediately following the laser output.
  • a blazed grating was overlaid onto the SLM phase pattern directing the proportion of light needed for fabrication into the first order. The zero order was blocked by adjusting the pinhole position in the Fourier plane of the SLM (see Figure 4).
  • a modulation depth of the blazed grating equal to 2 ⁇ provides maximum power in the fabrication beam, and subsequent variation in the modulation depth enabled simple power adjustment.
  • the power variation required was firstly ascertained by monitoring the plasma emission intensity as a function of distance from the edge of the substrate.
  • the blazed grating modulation depth was then adjusted to maintain a constant plasma emission intensity at all points. This was done both when the SLM phase pattern was updated to give edge correction and for a static phase pattern on the SLM providing only depth correction.
  • One is feedback based on the position of the sample relative to the laser, so that the edge correction is adapted to take account of the boundary between the light cone part reaching the top surface and the light cone part reaching the side face.
  • the second is based on plasma emission intensity and can be used to control the system to control the focal point quality. This can be implemented by controlling a blazed grating modulation depth
  • Waveguides made by the fabrication method of the invention can have a typical length of 50 to 200mm, so they generally have to be fabricated by translating along a direction oblique to the optic axis of the focussing lens.
  • the sample may not have perpendicular ends. For example, it may have chamfered or bevel edges.
  • Figure 8(a) shows a square edge as modelled above.
  • Figure 8(b) shows a 45 degree chamfered edge and
  • Figure 8(c) shows a curved fillet radius edge.
  • Different phase patterns will be appropriate for the different edge types but the principles remain the same.
  • the invention avoids thermal effects previously encountered resulting from the use of increased power at the edge of a sample, as well as avoiding the need for edge polishing to remove significant parts of the sample edge (removing 200 pm at each end of a waveguide is typical in the prior art).
  • a manufacturing setup may not need the CCD or LED illumination explained above for the test environment.
  • the invention is of interest for the fabrication of waveguides, but it can be applied to the fabrication of any structure right to the edge of a sample, including gratings and photonic crystal structures.
  • the invention is of particular interest for laser fabrication systems and methods.
  • the invention has possible uses in laser microscopes, which are optically almost identical to the fabrication system described above.
  • the structuring of the laser focus for a multiphoton microscope that needs to image near the edge of a block/interface can be controlled in the same way as described above.
  • laser focusing systems may also benefit from the approach of the invention, such as optical tweezers, optical data storage etc.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Microscoopes, Condenser (AREA)
  • Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)

Abstract

La présente invention concerne un système de focalisation laser dans lequel un motif de phase d'un signal de fabrication laser est commandé pour fournir une correction pour une aberration optique résultant d'une limite d'indice de réfraction sur un bord latéral de l'échantillon. Le bord latéral possède une distance avec le foyer laser qui varie au fur et à mesure de la fabrication de la structure, ce qui donne des degrés différents de chevauchement du faisceau de fabrication laser sur le bord de l'échantillon. Cette correction d'aberration permet la focalisation d'un laser émis directement sur le bord de l'échantillon.
PCT/GB2013/050908 2012-04-13 2013-04-09 Procédé de focalisation laser et appareil équipé d'un système de commande pour la correction de l'aberration optique WO2013153371A1 (fr)

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GB1206542.1A GB2501117A (en) 2012-04-13 2012-04-13 Laser focusing method and apparatus

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US10065184B2 (en) 2014-12-30 2018-09-04 Bacterioscan Ltd. Pipette having integrated filtration assembly
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CN109940280A (zh) * 2019-04-25 2019-06-28 巢湖学院 一种多自由度激光打标机
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WO2022085385A1 (fr) * 2020-10-23 2022-04-28 浜松ホトニクス株式会社 Dispositif laser
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